Vibration device, method of manufacturing same, and vibration driving device including same

Abstract

A vibration device may include: a vibration generating portion including a plurality of vibration portions; and a connection layer welded between the plurality of vibration portions. The connection layer includes a conductive material.

Description

[0001] Cross - reference to related applications

[0002] This application claims the benefit of Korean Patent Application No. 10 - 2023 - 0195758, filed on Dec. 28, 2024, which is incorporated herein by reference in its entirety as if fully set forth herein. Technical field

[0003] The present disclosure relates to a vibration device, a method of manufacturing the same, and a vibration driving device including the vibration device. Background art

[0004] In recent years, there has been an increasing demand for thinner electronic devices. In speakers applied to electronic devices, based on the requirement for thinner devices, piezoelectric devices that can be implemented with a thin thickness have received wide attention in place of voice coils.

[0005] A speaker or a vibration device applying a piezoelectric device can be driven or vibrated by driving power or a driving signal provided via a signal line. Summary of the invention

[0006] The inventors have conducted extensive research and experiments to implement a vibration device with a simplified manufacturing process and structure. Based on extensive research and experiments, the inventors have invented a vibration device with a new structure, a method of manufacturing the same, and a vibration driving device including the vibration device, in which the manufacturing process and structure of the vibration device are simplified.

[0007] One or more embodiments of the present disclosure aim to provide a vibration device, a method of manufacturing the same, and a vibration driving device including the vibration device, in which the structure and manufacturing process are simplified.

[0008] One or more embodiments of the present disclosure aim to provide a vibration device, a method of manufacturing the same, and a vibration driving device including the vibration device, which can reduce weight and thickness.

[0009] One or more embodiments of the present disclosure aim to provide a vibration device, a method of manufacturing the same, and a vibration driving device including the vibration device, which can improve the sound pressure level characteristics of sound.

[0010] Other features and advantages of the present disclosure will be set forth in the following description, and some of them will be apparent from the description, or can be learned by practicing the present disclosure. Other advantages of the present disclosure will be realized and obtained by the structures specifically pointed out in the written description, claims, and drawings.

[0011] To achieve these and other advantages of the present disclosure, as embodied and broadly described herein, in one or more embodiments, a vibration device may include: a vibration generating unit including a plurality of vibration parts; and a connection layer welded between the plurality of vibration parts. The connection layer may contain a conductive material.

[0012] A method of manufacturing a vibration device may include: a step of configuring a vibration generating unit including a plurality of vibration parts; a step of configuring a connection layer welded between the plurality of vibration parts; a step of configuring a signal cable electrically connected to the plurality of vibration parts; and a step of respectively configuring a first cover member and a second cover member on a first surface and a second surface of the vibration generating unit. The connection layer may contain a conductive material.

[0013] A vibration driving device may include: a passive vibration member; a vibration generating device connected to the passive vibration member to vibrate the passive vibration member. The vibration generating device may include a vibration device. The vibration device may include a vibration generating unit having a plurality of vibration parts and a connection layer welded between the plurality of vibration parts. The connection layer may contain a conductive material.

[0014] According to an embodiment of the present disclosure, a vibration device, a method of manufacturing the same, and a vibration driving device including the vibration device, which can simplify the structure and manufacturing process, may be provided.

[0015] According to an embodiment of the present disclosure, since the thickness of the vibration device can be reduced to reduce the weight, a lightweight vibration device can be achieved.

[0016] According to an embodiment of the present disclosure, process optimization achieved through energy-saving production can be obtained by simplifying the manufacturing process.

[0017] It should be understood that the foregoing general description and subsequent detailed description of the present disclosure are both exemplary and explanatory, and are intended to provide further explanation of the claimed subject matter of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present disclosure includes drawings to provide a further understanding of the present disclosure, and the drawings are incorporated into this application and constitute a part of the present disclosure. The drawings illustrate embodiments of the present disclosure and, together with the description, are used to explain the principles and examples of the present disclosure. In the drawings:

[0019] Figure 1 is a diagram showing a vibration device according to an embodiment of the present disclosure;

[0020] Figure 2 is a diagram showing a Figure 1 exploded perspective view of a connection structure between the vibration generating unit and the signal cable shown in;

[0021] Figure 3 is a cross-sectional view taken along line A-A' as shown in an embodiment of the present disclosure; Figure 1 shown in the figure;

[0022] Figure 4 is a cross-sectional view taken along line B-B' as shown in an embodiment of the present disclosure; Figure 1 shown in the figure;

[0023] Figure 5 is a cross-sectional view taken along line C-C' as shown in an embodiment of the present disclosure; Figure 1 shown in the figure;

[0024] Figure 6 is a cross-sectional view taken along line D-D' as shown in an embodiment of the present disclosure; Figure 1 shown in the figure;

[0025] Figures 7A to 7C is a diagram showing the manufacturing method of a vibration device according to an embodiment of the present disclosure; Figure 1 shown in the figure;

[0026] Figure 8 is a diagram showing the manufacturing method of a vibration device according to another embodiment of the present disclosure; Figure 1 shown in the figure;

[0027] Figure 9 is a diagram showing a vibration device according to another embodiment of the present disclosure;

[0028] Figure 10 is a diagram showing the connection structure between a vibration generating unit and a signal cable according to another embodiment of the present disclosure; Figure 9 shown in the figure;

[0029] Figure 11 is a cross-sectional view taken along line E-E' as shown in an embodiment of the present disclosure; Figure 9 shown in the figure;

[0030] Figure 12 is a cross-sectional view taken along line F-F' as shown in an embodiment of the present disclosure; Figure 9 shown in the figure;

[0031] Figure 13 is a cross-sectional view taken along line G-G' as shown in an embodiment of the present disclosure; Figure 9 shown in the figure;

[0032] Figure 14 is a cross-sectional view taken along line H-H' as shown in an embodiment of the present disclosure; Figure 9 shown in the figure;

[0033] Figures 15A to 15Cis a diagram showing a manufacturing method of a vibration device according to an embodiment of the present disclosure; Figure 9 shown;

[0034] Figure 16 is a cross-sectional view taken along line E-E' shown according to another embodiment of the present disclosure; Figure 9 shown;

[0035] Figures 17A to 17D is a diagram showing a manufacturing method of a vibration device according to another embodiment of the present disclosure; Figure 16 shown;

[0036] Figure 18 is a diagram showing a vibration driving device according to an embodiment of the present disclosure; and

[0037] Figure 19 is a cross-sectional view taken along line I-I' shown according to an embodiment of the present disclosure. Figure 18 shown; DETAILED DESCRIPTION

[0038] Reference is now made in detail to embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings. In the following description, when a detailed description of a known method, function, or configuration may unnecessarily obscure the embodiments of the present disclosure, the detailed description of these known functions or configurations may be omitted for the sake of brevity. The processes of the described processing steps and / or operations are examples. However, the order of the steps and / or operations is not limited to the order set forth herein and may be changed, except in cases where the steps and / or operations must occur in a specific order.

[0039] Unless otherwise specified, the same reference numerals may all refer to the same elements, even if these reference numerals are shown in different drawings. Unless otherwise specified, the same reference numerals are used throughout the specification and drawings to refer to the same or substantially the same elements. In one or more embodiments, unless otherwise specified, the same elements (or elements having the same name) in different drawings may have the same or substantially the same functions and characteristics. The names of the elements used in the following description are chosen for convenience only and may therefore be different from the names used in actual products.

[0040] Advantages and features of the present disclosure and its implementation methods are clarified by the embodiments described with reference to the accompanying drawings. However, the present disclosure may be implemented in different forms and should not be construed as limited to the embodiments set forth herein. On the contrary, these embodiments are examples, and providing these embodiments enables the present disclosure to be full and complete, to help those skilled in the art understand the inventive concept, without limiting the scope of protection of the present disclosure.

[0041] The shapes, dimensions, areas, widths, heights, thicknesses, ratios, angles, numbers, quantities of elements, etc. disclosed in the accompanying drawings for describing the embodiments of the present disclosure are only examples, and thus the present disclosure is not limited to the details shown. When using terms such as "comprising", "having", "including", "containing", "constituting", "made of", "formed by", "composed of", etc., one or more elements (e.g., layers, films, regions, components, sections, members, parts, areas, portions, steps, operations, etc.) may be added unless terms such as "only" are used. The terms used in the present disclosure are only for describing specific embodiments and are not intended to limit the scope of the present disclosure. The terms used herein are only for describing exemplary embodiments and are not intended to limit the scope of the present disclosure. Unless otherwise clearly specified in the context, singular terms may include plural forms. The word "exemplary" is used to mean as an example or illustration. An embodiment may be one or more exemplary embodiments. An embodiment is an exemplary embodiment. Any implementation described herein as an "example" or an "embodiment" is not necessarily to be construed as being superior or advantageous to other implementations.

[0042] In one or more embodiments, an element, feature, or corresponding information (e.g., level, range, dimension, size, etc.) is interpreted to include a range of error or tolerance, even if no explicit description of such error or tolerance range is provided. The range of error or tolerance may be caused by various factors (e.g., process factors, internal or external influences, noise, etc.). In addition, the term "may" encompasses all meanings of the term "can".

[0043] When describing positional relationships, for example, when using descriptions such as "on", "above", "below", "over", "under", "beneath", "near", "close to", "adjacent to", "next to", etc. to describe the positional relationship between two components, unless more restrictive terms such as "immediately", "directly", or "proximate" are used, one or more other components may be located between the two components. For example, when a structure is described as being "on", "above", "below", "over", "under", "beneath", "near", "close to", "adjacent to", "next to", or "proximate" to another structure, such description should be interpreted to include the case where the structures are in contact with each other and the case where one or more additional structures are disposed or interposed therebetween. In addition, terms such as "front", "rear", "behind", "left", "right", "top", "bottom", "down", "up", "upper", "lower", "upward", "downward", "column", "row", "vertical", "horizontal", etc. refer to any reference system.

[0044] When describing temporal relationships, when a temporal order is described as, for example, "after", "subsequently", "next", "before", "prior", "preceding", etc., it may include non - consecutive or non - sequential cases unless more restrictive terms such as "exactly", "immediately", or "directly" are used.

[0045] It should be understood that although terms such as "first", "second", etc. may be used herein to describe various elements (e.g., layers, films, regions, components, sections, members, parts, areas, portions, steps, operations, and / or the like), these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of the present disclosure, the first element may be the second element, and similarly, the second element may be the first element. In addition, without departing from the scope of the present disclosure, the first element, the second element, etc. can be named arbitrarily according to the convenience of those skilled in the art. The terms "first", "second", etc. can be used to distinguish components from each other, but the function or structure of the components is not limited by the ordinal number or the name of the component in front of the component.

[0046] When describing the elements of the present disclosure, terms such as "first", "second", "A", "B", "(a)", "(b)", etc. can be used. These terms are intended to distinguish the corresponding elements from other elements, and these terms are not used to define the nature, basis, order, or quantity of the elements.

[0047] For the description of an element (e.g., a layer, a film, a region, a component, a section, etc.) being "connected", "bonded", "attached", "adhered", etc. to another element, unless otherwise specified, the element can not only be directly connected, bonded, attached, adhered, etc. to the other element, but also be indirectly connected, bonded, attached, adhered, etc. to the other element when one or more intermediate elements are provided or interposed between the elements.

[0048] For the description of an element (e.g., a layer, a film, a region, a component, a section, etc.) being "in contact with", "overlapping", etc. with another element, unless otherwise specified, the element can not only be directly in contact with, overlapping, etc. the other element, but also be indirectly in contact with, overlapping, etc. the other element when one or more intermediate elements are provided or interposed between the elements.

[0049] Terms such as "row" or "direction" should not be interpreted only based on the geometric relationship that the rows or directions are parallel or perpendicular to each other, but can represent a direction with a broader directivity within the range where the components of the present disclosure can operate functionally.

[0050] The term "at least one" shall be understood to include any and all combinations of one or more of the associated listed items. For example, each of the phrases "at least one of the first item, the second item, or the third item" and "at least one of the first item, the second item, and the third item" can represent (i) a combination of items provided by one or more of the first item, the second item, and the third item, and (ii) only one of the first item, the second item, and the third item.

[0051] The expression of the first element, the second element, "and / or" the third element shall be understood to include one of the first element, the second element, and the third element, as well as any or all combinations of the first element, the second element, and the third element. For example, A, B, and / or C includes: only A; only B; only C; any one of A, B, and C (e.g., A, B, or C); certain combinations of A, B, and C (e.g., A and B; A and C; or B and C); and all of A, B, and C. In addition, the expression "A / B" can be understood as A and / or B. For example, the expression "A / B" can refer to only A; only B; A or B; or A and B.

[0052] In one or more embodiments, unless otherwise specified, for convenience only, the terms "between" and "among" may be used interchangeably. For example, the expression "between a plurality of elements" can be understood as among a plurality of elements. In another example, the expression "among a plurality of elements" can be understood as between a plurality of elements. In one or more examples, the number of elements can be two. In one or more examples, the number of elements can be more than two. In addition, when an element (e.g., a layer, a film, a region, a component, a section, etc.) is referred to as being "between" at least two elements, the element can be the only element between the at least two elements, or there can also be one or more intermediate elements.

[0053] In one or more embodiments, unless otherwise specified, for convenience only, the phrases "each other" and "one another" may be used interchangeably. For example, the expression "different from each other" can be understood as different from one another. In another example, the expression "different from one another" can be understood as different from each other. In one or more examples, the number of elements involved in the foregoing expression can be two. In one or more examples, the number of elements involved in the foregoing expression can be more than two.

[0054] In one or more embodiments, unless otherwise specified, for convenience only, the phrases "one or more of which" and "one or more of..." may be used interchangeably.

[0055] The term "or" means "including or" rather than "exclusive or". For example, unless otherwise specified or clearly stipulated by the context, the statement "x uses a or b" means any one of the permutations naturally included. For example, "a or b" may mean "a", "b", or "a and b". For example, "a, b, or c" may mean "a", "b", "c", "a and b", "b and c", "a and c", or "a, b, and c".

[0056] The features of the various embodiments of the present disclosure may be combined or combined partially or wholly with each other, may be technically interrelated, or may be operatively combined, linked, or driven in various ways. The various embodiments of the present disclosure may be implemented or executed independently of each other, or may be implemented or executed together in a mutually dependent or related relationship. In one or more embodiments, the components of the various devices according to the various embodiments of the present disclosure are operatively combined and configured.

[0057] Unless otherwise defined, the terms (including technical terms and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the exemplary embodiments belong. It is also understood that unless otherwise clearly defined herein, the terms (such as those defined in a common dictionary) should be interpreted as having a meaning consistent with the context of the relevant field, rather than being interpreted in an idealized or overly formal sense.

[0058] The terms used herein are selected as general terms in the relevant technical field. However, due to the development and / or changes of technology, conventions, preferences of those skilled in the art, etc., there may be other terms. Therefore, the terms used herein should not be understood as limiting the technical concept, but should be understood as examples of the terms used to illustrate the embodiments.

[0059] In addition, in specific cases, the applicant may arbitrarily select terms, and in this case, their specific meanings are described herein. Therefore, the terms used herein should not be understood only based on the name of the terms, but also based on the meaning of the terms and the content herein.

[0060] The "X-axis direction", "Y-axis direction", and "Z-axis direction" should not be understood as having only a geometric relationship of being perpendicular to each other, but may have a broader directivity within the range where the elements of the present disclosure can function.

[0061] In the following description, various exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Regarding the reference numerals of the elements in each drawing, unless otherwise specified, the same elements may be shown in other drawings, and the same reference numerals may refer to the same elements. In addition, for ease of description, the ratios, dimensions, sizes, and thicknesses of each element shown in the drawings may be different from the actual ratios, dimensions, sizes, and thicknesses. Therefore, the embodiments of the present disclosure are not limited to the ratios, dimensions, sizes, and thicknesses shown in the drawings.

[0062] Figure 1 FIG. is a view showing a vibration device according to an embodiment of the present disclosure. Figure 2 is a view showing an embodiment of the present disclosure Figure 1 exploded perspective view of the connection structure between the vibration generating unit and the signal cable shown in. Figure 3 is a cross-sectional view taken along line A-A' shown in according to an embodiment of the present disclosure. Figure 1 is a cross-sectional view taken along line A-A' shown in according to an embodiment of the present disclosure. Figure 4 is a cross-sectional view taken along line B-B' shown in according to an embodiment of the present disclosure. Figure 1 is a cross-sectional view taken along line B-B' shown in according to an embodiment of the present disclosure. Figure 5 is a cross-sectional view taken along line C-C' shown in according to an embodiment of the present disclosure. Figure 1 is a cross-sectional view taken along line C-C' shown in according to an embodiment of the present disclosure. Figure 6 is a cross-sectional view taken along line D-D' shown in according to an embodiment of the present disclosure. Figure 1 is a cross-sectional view taken along line D-D' shown in according to an embodiment of the present disclosure.

[0063] Referring to Figures 1 to 6 , a vibration device according to an embodiment of the present disclosure may include a vibration generating unit 10 and a connection layer 20.

[0064] The vibration generating unit 10 may include a plurality of vibration units 10A and 10B. For example, the vibration generating unit 10 may include a plurality of vibration units 10A and 10B that overlap or are stacked on each other. For example, the vibration generating unit 10 may include a plurality of vibration units 10A and 10B that are laminated or stacked on each other. For example, the vibration generating unit 10 may include a first vibration unit 10A and a second vibration unit 10B laminated on the first vibration unit 10A.

[0065] According to an embodiment of the present disclosure, each of the first vibration unit 10A and the second vibration unit 10B may include a piezoelectric material (or electroactive material) having a piezoelectric effect, or a piezoelectric device. For example, the piezoelectric material (or piezoelectric device) may have the characteristics of generating a potential difference due to the application of pressure or distortion to the crystal structure by an external force, the relative position change of positive (+) ions and negative (-) ions causing dielectric polarization, and generating vibration based on an electric field generated by an applied voltage.

[0066] Each of the first vibration unit 10A and the second vibration unit 10B may include a vibration layer 11, a first electrode layer 13, and a second electrode layer 15.

[0067] The vibration layer 11 may include a piezoelectric material (or electroactive material) having a piezoelectric effect. The vibration layer 11 may include a ceramic-like material for achieving strong vibration, or may include a piezoelectric ceramic having a perovskite-based crystal structure.

[0068] The piezoelectric ceramic may include a single crystal ceramic having a single crystal structure, or may include a ceramic material or polycrystalline ceramic having a polycrystalline structure. The piezoelectric material including the single crystal ceramic may include one or more of aluminum phosphate (e.g., α-AlPO4), silicon dioxide (e.g., α-SiO2), lithium niobate (LiNbO3), terbium molybdate (Tb2(MoO4)3), lithium tetraborate (Li2B4O7), or ZnO. The piezoelectric material including the single crystal ceramic may include a lead zirconate titanate (PZT)-based material including lead (Pb), zirconium (Zr), and titanium (Ti), or may include a lead zirconium nickel niobate (PZNN)-based material including lead (Pb), zirconium (Zr), nickel (Ni), and niobium (Nb), but the embodiments of the present disclosure are not limited thereto. As another example, the vibration layer 11 may include at least one of CaTiO3, BaTiO3, and SrTiO3 that does not contain lead (Pb), but the embodiments of the present disclosure are not limited thereto.

[0069] According to an embodiment of the present disclosure, the vibration layer 11 of each of the first vibration unit 10A and the second vibration unit 10B may have the same ceramic crystal structure, or may have different ceramic crystal structures. For example, the vibration layer 11 of the first vibration unit 10A and the vibration layer 11 of the second vibration unit 10B may include single crystal ceramics or polycrystalline ceramics. For example, one of the vibration layer 11 of the first vibration unit 10A and the vibration layer 11 of the second vibration unit 10B may include single crystal ceramics, and the other may include polycrystalline ceramics.

[0070] According to an embodiment of the present disclosure, in each of the first vibration unit 10A and the second vibration unit 10B, the vibration layer 11 may be disposed (or provided) between the first electrode layer 13 and the second electrode layer 15.

[0071] In the first vibration part 10A, the first electrode layer 13 may be disposed on the first surface (or the lower surface) of the vibration layer 11. The size of the first electrode layer 13 may be the same as the size of the vibration layer 11, or may be smaller than the size of the vibration layer 11, but the embodiments of the present disclosure are not limited thereto. For example, the first electrode layer 13 may be a single electrode. For example, the first electrode layer 13 may include a quadrilateral shape. For example, the end (or side surface) of the first electrode layer 13 may be spaced apart from the end (or side surface) of the vibration layer 11, so as to prevent an electrical connection (or short circuit) between the first electrode layer 13 and the second electrode layer 15. For example, the first electrode layer 13 of the first vibration part 10A may be the first electrode layer, the lower electrode layer, or the lowermost electrode layer of the vibration generating part 10, but the embodiments of the present disclosure are not limited thereto.

[0072] In the first vibration part 10A, the second electrode layer 15 may be disposed on the second surface (or the upper surface) of the vibration layer 11 that is different from or opposite to the first surface. The size of the second electrode layer 15 may be smaller than the size of the vibration layer 11, but the embodiments of the present disclosure are not limited thereto. For example, the second electrode layer 15 of the first vibration part 10A may be the second electrode layer of the vibration generating part 10, but the embodiments of the present disclosure are not limited thereto.

[0073] In the second vibration part 10B, the first electrode layer 13 may be disposed on the first surface (or the lower surface). The size of the first electrode layer 13 may be smaller than the size of the vibration layer 11, but the embodiments of the present disclosure are not limited thereto. For example, the first electrode layer 13 of the second vibration part 10B may be the third electrode layer of the vibration generating part 10, but the embodiments of the present disclosure are not limited thereto.

[0074] In the second vibration part 10B, the second electrode layer 15 may be disposed on the second surface (or the upper surface) of the vibration layer 11 that is different from or opposite to the first surface. The size of the second electrode layer 15 may be smaller than the size of the vibration layer 11, but the embodiments of the present disclosure are not limited thereto. For example, the second electrode layer 15 of the second vibration part 10B may be the fourth electrode layer, the upper electrode layer, or the uppermost electrode layer of the vibration generating part 10, but the embodiments of the present disclosure are not limited thereto.

[0075] According to an embodiment of the present disclosure, the second electrode layer 15 of the first vibration unit 10A and the first electrode layer 13 of the second vibration unit 10B may be disposed adjacent to each other. According to an embodiment of the present disclosure, since the second electrode layer 15 of the first vibration unit 10A and the first electrode layer 13 of the second vibration unit 10B are disposed adjacent to each other, the polarization direction (or polarization direction) formed in the vibration layer 11 of the first vibration unit 10A and the polarization direction (or polarization direction) formed in the vibration layer 11 of the second vibration unit 10B may be configured in different directions or opposite directions. For example, the polarization direction formed in the vibration layer 11 of the first vibration unit 10A may be configured to be from the first electrode layer 13 toward the second electrode layer 15, and the polarization direction formed in the vibration layer 11 of the second vibration unit 10B may be configured to be from the second electrode layer 15 toward the first electrode layer 13. However, the embodiments of the present disclosure are not limited thereto.

[0076] In the stacked structure of the first vibration unit 10A and the second vibration unit 10B, in order to prevent electrical short circuits between electrode layers vertically adjacent to each other, each of the first electrode layer 13 and the second electrode layer 15 may be formed in a portion other than the edge portion of the vibration layer 11. For example, the distance between the side surface of each of the first electrode layer 13 and the second electrode layer 15 and the side surface of the vibration layer 11 may be at least 0.5 mm or more, but the embodiments of the present disclosure are not limited thereto. For example, the distance between the side surface of each of the first electrode layer 13 and the second electrode layer 15 and the side surface of the vibration layer 11 may be at least 1 mm or more, but the embodiments of the present disclosure are not limited thereto.

[0077] According to an embodiment of the present disclosure, one or more of the first electrode layer 13 and the second electrode layer 15 may include a material fired at a high temperature. For example, one or more of the first electrode layer 13 and the second electrode layer 15 may include a transparent conductive material, a translucent conductive material, or an opaque conductive material, but the embodiments of the present disclosure are not limited thereto. For example, the transparent conductive material or the translucent conductive material may include one or more of indium tin oxide (ITO) or indium zinc oxide (IZO), but the embodiments of the present disclosure are not limited thereto. The opaque conductive material may include gold (Au), silver (Ag), platinum (Pt), palladium (Pd), molybdenum (Mo), magnesium (Mg), carbon, or silver (Ag) containing frit, or an alloy thereof, but the embodiments of the present disclosure are not limited thereto. For example, carbon may be a carbon material including carbon black, Ketjen black, carbon nanotubes, and graphite, but the embodiments of the present disclosure are not limited thereto. According to an embodiment of the present disclosure, each of the first electrode layer 13 and the second electrode layer 15 may include silver (Ag) having a low resistivity to enhance the electrical characteristics and / or vibration characteristics of the vibration layer 11.

[0078] In the first electrode layer 13 and the second electrode layer 15 including a frit containing silver (Ag), the content of the frit may be about 1 wt% or more to about 12 wt% or less, but embodiments of the present disclosure are not limited thereto. The frit may include a material based on PbO or Bi2O3, but embodiments of the present disclosure are not limited thereto. For example, it may include oxides of bismuth (Bi), zinc (Zn), aluminum (Al), boron (B), and / or silicon (Si), but embodiments of the present disclosure are not limited thereto.

[0079] According to an embodiment of the present disclosure, the plurality of vibration units 10A and 10B or the first vibration unit 10A and the second vibration unit 10B may be connected to or in contact with each other. The plurality of vibration units 10A and 10B may be connected to each other through a connection layer 20 disposed between the plurality of vibration units 10A and 10B. For example, the plurality of vibration units 10A and 10B or the first vibration unit 10A and the second vibration unit 10B may be in contact with each other through the connection layer 20.

[0080] According to an embodiment of the present disclosure, the connection layer 20 may be welded between the plurality of vibration units 10A and 10B. The connection layer 20 may be welded between the second electrode layer 15 of the first vibration unit 10A and the first electrode layer 13 of the second vibration unit 10B. Through welding, the connection layer 20 may electrically connect the second electrode layer 15 of the first vibration unit 10A and the first electrode layer 13 of the second vibration unit 10B.

[0081] According to an embodiment of the present disclosure, the connection layer 20 may include a conductive material. For example, the connection layer 20 may include a conductive material having a melting point of 400 °C or lower. For example, the conductive material may be a welding foil or a welding foil including silver (Ag), but embodiments of the present disclosure are not limited thereto. According to an embodiment of the present disclosure, the connection layer 20 may be an internal connection layer or an electrode connection layer, but embodiments of the present disclosure are not limited thereto.

[0082] According to an embodiment of the present disclosure, the vibration layers 11 of the first vibration unit 10A and the vibration layers 11 of the second vibration unit 10B may be polarized (or polarized) in the same direction, or may be polarized (or polarized) in opposite (or different) directions. For example, the polarization direction (or polarization direction) formed in the vibration layer 11 of the first vibration unit 10A may be a direction different from or opposite to the polarization direction (or polarization direction) formed in the vibration layer 11 of the second vibration unit 10B.

[0083] According to an embodiment of the present disclosure, the second electrode layer 15 of the first vibration unit 10A and the second electrode layer 15 of the second vibration unit 10B may be connected to each other. Therefore, when the polarization direction (or polarization direction) formed in the vibration layer 11 of the first vibration unit 10A is different from or opposite to the polarization direction (or polarization direction) formed in the vibration layer 11 of the second vibration unit 10B, the first vibration unit 10A and the second vibration unit 10B may be displaced (or vibrated or driven) in the same direction. Therefore, the vibration width (or displacement width or drive width) of the vibration generating unit 10 can be maximized, thereby enhancing the sound pressure level characteristics of the vibration generating unit 10.

[0084] The vibration generating unit 10 according to an embodiment of the present disclosure may further include a first cover member 30.

[0085] The first cover member 30 may be configured to protect one surface of the vibration generating unit 10. For example, one surface of the vibration generating unit 10 may be a lower surface, a rear surface, a last surface, a back surface, or a back portion. The first cover member 30 may be configured to protect the first surface of the vibration generating unit 10. For example, the first surface of the vibration generating unit 10 may be a lower surface, a rear surface, a last surface, a back surface, or a back portion.

[0086] The first cover member 30 may be configured to cover the first vibration unit 10A of the vibration generating unit 10. For example, the first cover member 30 may be configured to cover the first electrode layer 13 of the first vibration unit 10A. Therefore, the first cover member 30 may protect the first surface of the vibration generating unit 10 and the first electrode layer 13 of the first vibration unit 10A.

[0087] The first cover member 30 according to an embodiment of the present disclosure may include an adhesive member. For example, the first cover member 30 may include a base cover member and an adhesive member, and the adhesive member is located in the base cover member and is connected or bonded to the first surface of the vibration generating unit 10 and the first electrode layer 13 of the first vibration unit 10A. For example, the adhesive member may include an electrically insulating material having adhesive properties and capable of compression and decompression.

[0088] According to another embodiment of the present disclosure, the first cover member 30 may be connected or bonded to the first surface of the vibration generating unit 10 through an adhesive layer 40. For example, the first cover member 30 may be connected or bonded to at least a part of the first electrode layer 13 of the first vibration unit 10A or the first surface of the vibration generating unit 10 by using a first adhesive layer 41. For example, the first cover member 30 may be connected or bonded to at least a part of the first electrode layer 13 of the first vibration unit 10A or the first surface of the vibration generating unit 10 by using a first adhesive layer 41 through a film lamination process.

[0089] The vibration generating unit 10 according to an embodiment of the present disclosure may further include a second cover member 50.

[0090] The second cover member 50 may be configured to cover the other surface of the vibration generating unit 10. For example, the other surface of the vibration generating unit 10 may be an upper surface, a topmost surface, a front surface, or a front portion. The second cover member 50 may be configured to cover the second surface of the vibration generating unit 10. For example, the second surface of the vibration generating unit 10 may be an upper surface, a topmost surface, a front surface, or a front portion. The second cover member 50 may be configured to cover the second vibration unit 10B of the vibration generating unit 10. For example, the second cover member 50 may be configured to cover the second electrode layer 15 of the second vibration unit 10B. Accordingly, the second cover member 50 may protect the second surface of the vibration generating unit 10 and the second electrode layer 15 of the second vibration unit 10B.

[0091] The second cover member 50 according to an embodiment of the present disclosure may include an adhesive member. For example, the second cover member 50 may include a base cover member and an adhesive member that is located in the base cover member and connected or bonded to the second surface of the vibration generating unit 10 and the second electrode layer 15 of the second vibration unit 10B. For example, the adhesive member may include an electrically insulating material having adhesive properties and capable of compression and decompression.

[0092] According to another embodiment of the present disclosure, the second cover member 50 may be connected or bonded to the second surface of the vibration generating unit 10 by using an adhesive layer 40. For example, the second cover member 50 may be connected or bonded to at least a part of the second electrode layer 15 of the second vibration unit 10B or the second surface of the vibration generating unit 10 by using a second adhesive layer 42. For example, the second cover member 50 may be connected or bonded to at least a part of the second electrode layer 15 of the second vibration unit 10B or the second surface of the vibration generating unit 10 by using the second adhesive layer 42 through a film lamination process.

[0093] Each of the first cover member 30 and the second cover member 50 according to an exemplary embodiment of the present disclosure may include one or more materials among plastic, fiber, cloth, paper, leather, rubber, and wood, but the embodiments of the present disclosure are not limited thereto. For example, the first cover member 30 and the second cover member 50 may include the same material or different materials. For example, each of the first cover member 30 and the second cover member 50 may be a polyimide film or a polyethylene terephthalate film, but the embodiments of the present disclosure are not limited thereto.

[0094] According to an embodiment of the present disclosure, the first adhesive layer 41 and the second adhesive layer 42 (or the adhesive layer 40) may include an electrically insulating material having adhesive properties and capable of compression and decompression. For example, the first adhesive layer 41 and the second adhesive layer 42 (or the adhesive layer 40) may include epoxy resin, acrylic resin, silicone resin, polyurethane resin, pressure-sensitive adhesive (PSA), optically clear adhesive (OCA), or optically clear resin (OCR), but the embodiments of the present disclosure are not limited thereto. For example, the first adhesive layer 41 and the second adhesive layer 42 (or the adhesive layer 40) may be configured to surround or completely surround the vibration generating unit 10. The first adhesive layer 41 and the second adhesive layer 42 (or the adhesive layer 40) may be configured to cover or surround all surfaces of the vibration generating unit 10. For example, the vibration generating unit 10 may be inserted (or received) into the adhesive layer 40, or may be embedded in the adhesive layer 40.

[0095] According to an embodiment of the present disclosure, one of the first cover member 30 and the second cover member 50 may be omitted. For example, the first cover member 30 of the first cover member 30 and the second cover member 50 may be omitted. When the first cover member 30 is omitted, the first surface of the vibration generating unit 10 may be covered or surrounded by the adhesive layer 40 or the first adhesive layer 41. Therefore, the first surface of the vibration generating unit 10 may be covered or protected by the adhesive layer 40 or the first adhesive layer 41. When the first cover member 30 is omitted, the second cover member 50 may be a cover member, a covering film, a protection member, or a protective film.

[0096] The vibration device according to an embodiment of the present disclosure may further include a signal cable 90.

[0097] The signal cable 90 may be implemented to be connected to the first vibration unit 10A and the second vibration unit 10B of the vibration generating unit 10 on one side of the vibration generating unit 10, respectively. The signal cable 90 may be inserted (or received) between the first cover member 30 and the second cover member 50. The signal cable 90 may be connected to the first vibration unit 10A and the second vibration unit 10B between the first cover member 30 and the second cover member 50, respectively.

[0098] The end portion (or distal end portion) of the signal cable 90 may be disposed or inserted (or received) in a portion between a peripheral portion of the first cover member 30 and a peripheral portion of the second cover member 50. A peripheral portion of the first cover member 30 and a peripheral portion of the second cover member 50 may receive or vertically cover a part of the signal cable 90. Accordingly, the signal cable 90 may be integrally provided with the vibration generating unit 10. For example, the vibration device according to an exemplary embodiment of the present disclosure may be a vibration device integrally provided with the signal cable 90. For example, the signal cable 90 may be configured as a flexible cable, a flexible printed circuit cable, a flexible flat cable, a single-sided flexible printed circuit, a single-sided flexible printed circuit board (PCB), a flexible multi-layer printed circuit, or a flexible multi-layer PCB, but the embodiments of the present disclosure are not limited thereto.

[0099] According to another embodiment of the present disclosure, the signal cable 90 may include a base member 91 and a plurality of signal lines 92a, 92b, and 92c. For example, the plurality of signal lines 92a, 92b, and 92c may include a first signal line 92a, a second signal line 92b, and a third signal line 92c.

[0100] The base member 91 may include a transparent or opaque plastic material. For example, the base member 91 may include one or more synthetic resins such as fluororesin, polyimide-based resin, polyurethane-based resin, polyester-based resin, polyethylene-based resin, and polypropylene-based resin, but the embodiments of the present disclosure are not limited thereto. The base member 91 may be a base film or a base insulating film, but the embodiments of the present disclosure are not limited thereto.

[0101] Referring to Figure 1 , the base member 91 may have a predetermined width in the first direction X and may longitudinally extend in a second direction Y intersecting the first direction X.

[0102] The first signal line 92a to the third signal line 92c may be disposed on the first surface of the base member 91 in parallel with the second direction Y and may be spaced apart or separated from each other in the first direction X. The first signal line 92a to the third signal line 92c may be disposed parallel to the first surface of the base member 91. For example, each of the first signal line 92a to the third signal line 92c may be formed as a linear shape by patterning a metal layer (or conductive layer) formed or deposited on the first surface of the base member 91.

[0103] The end portions (or distal end portions) of the first signal line 92a to the third signal line 92c may be separated from each other, and thus, may be individually bent or folded.

[0104] According to an embodiment of the present disclosure, referring to Figure 3 and Figure 4, the first signal line 92a can be between the second vibration part 10B and the second cover member 50 and connected to the second electrode layer 15 of the first vibration part 10A. For example, the end of the first signal line 92a can be disposed between the second cover member 50 and the second surface of the vibration generating part 10. For example, the end of the first signal line 92a can be configured to be electrically connected to the uppermost electrode layer (or the second electrode layer) 15 of the vibration generating part 10. For example, the end of the first signal line 92a electrically connected to the uppermost electrode layer (or the second electrode layer) 15 of the vibration generating part 10 can be covered by the adhesive layer 40 or the second adhesive layer 42, but the embodiments of the present disclosure are not limited thereto. For example, the end of the first signal line 92a electrically connected to the uppermost electrode layer (or the second electrode layer) 15 of the vibration generating part 10 may not be covered by the adhesive layer 40 or the second adhesive layer 42, but may be in contact with the second cover member 50 or directly in contact. The end of the first signal line 92a can be electrically connected to at least a part of the second electrode layer 15 (which is the uppermost electrode layer 15) of the second vibration part 10B. The signal applied to the first signal line 92a can be provided to the second electrode layer 15 of the second vibration part 10B. Therefore, the first signal line 92a can provide the driving signal provided from the vibration driving circuit to the second electrode layer 15 of the second vibration part 10B.

[0105] According to an embodiment of the present disclosure, the second signal line 92b can be connected to the connection layer 20 between the first vibration part 10A and the second vibration part 10B. The second signal line 92b can be connected to the second electrode layer 15 of the first vibration part 10A, the first electrode layer 13 of the second vibration part 10B, and the connection layer 20 between the first vibration part 10A and the second vibration part 10B. The end of the second signal line 92b can be disposed between the first vibration part 10A and the second vibration part 10B. For example, the end of the second signal line 92b can be disposed between the second electrode layer 15 of the first vibration part 10A and the connection layer 20, or between the first electrode layer 13 of the second vibration part 10B and the connection layer 20. The signal applied to the second signal line 92b can be provided to the second electrode layer 15 of the first vibration part 10A and the first electrode layer 13 of the second vibration part 10B through the connection layer 20. Therefore, the second signal line 92b can commonly provide the driving signal provided from the vibration driving circuit to the second electrode layer 15 of the first vibration part 10A and the first electrode layer 13 of the second vibration part 10B. Therefore, in an embodiment of the present disclosure, two separate signal lines respectively connected to the second electrode layer 15 of the first vibration part 10A and the first electrode layer 13 of the second vibration part 10B may not be configured, and the same signal can be applied to the second electrode layer 15 of the first vibration part 10A and the first electrode layer 13 of the second vibration part 10B by using only one second signal line 92b.

[0106] According to an embodiment of the present disclosure, the third signal line 92c may be connected to the first electrode layer 13 of the first vibration unit 10A between the first vibration unit 10A and the first cover member 30. For example, an end portion of the third signal line 92c may be disposed between the first cover member 30 and the first surface of the vibration generating unit 10. For example, the end portion of the third signal line 92c may be configured to be electrically connected to the lowermost electrode layer (or the first electrode layer) 13 of the vibration generating unit 10. For example, the end portion of the third signal line 92c electrically connected to the lowermost electrode layer (or the first electrode layer) 13 of the vibration generating unit 10 may be covered by the adhesive layer 40 or the first adhesive layer 41, but the embodiments of the present disclosure are not limited thereto. For example, the end portion of the third signal line 92c electrically connected to the lowermost electrode layer (or the first electrode layer) 13 of the vibration generating unit 10 may not be covered by the adhesive layer 40 or the second adhesive layer 42, but may be in contact with or directly contact the first cover member 30. The end portion of the third signal line 92c may be electrically connected to at least a part of the first electrode layer 13 (i.e., the lowermost electrode layer 13) of the first vibration unit 10A.

[0107] In the first vibration unit 10A, the first electrode layer 13 may receive a driving signal through the third signal line 92c, and the second electrode layer 15 may receive a driving signal through the second signal line 92b. Therefore, the first vibration unit 10A may alternately and repeatedly contract and / or expand based on the inverse piezoelectric effect generated in the vibration layer 11 according to the driving signal, so as to be capable of vibrating (or shifting or driving).

[0108] In the second vibration unit 10B, the first electrode layer 13 may receive a driving signal through the second signal line 92b, and the second electrode layer 15 may receive a driving signal through the first signal line 92a. Therefore, the second vibration unit 10B may alternately and repeatedly contract and / or expand based on the inverse piezoelectric effect generated in the vibration layer 11 according to the driving signal, so as to be capable of vibrating (or shifting or driving).

[0109] Each of the first vibration unit 10A and the second vibration unit 10B may be bent (or shifted or driven) in the same shape. Therefore, in the vibration generating unit 10 or the vibration device, the vibration width (or displacement width or driving width) of the first vibration unit 10A and the vibration width (or displacement width or driving width) of the second vibration unit 10B may be accumulated and maximized. For example, in the vibration generating unit 10 or the vibration device, the vibration of the first vibration unit 10A and the vibration of the second vibration unit 10B may be enhanced, so that the vibration efficiency or vibration characteristics may be improved, and the vibration width (or displacement width or driving width) may be maximized, so that the sound characteristics and / or sound pressure level characteristics of the bass band may be enhanced.

[0110] The signal cable 90 may include a first extension portion 91a, a second extension portion 91b, and a third extension portion 91c, and the first extension portion 91a, the second extension portion 91b, and the third extension portion 91c respectively support the ends (or distal ends or one sides) of the first signal line 92a to the third signal line 92c that are separated from each other. For example, each of the first extension portion 91a to the third extension portion 91c may be separated from each other between one edge portion of the first cover member 30 and one edge portion of the second cover member 50. Therefore, the ends (or distal ends) of the first signal line 92a to the third signal line 92c may be separated from each other, so that they can be bent or folded individually.

[0111] According to another embodiment of the present disclosure, each of the first extension portion 91a to the third extension portion 91c of the signal cable 90 may be omitted. For example, each of the first extension portion 91a to the third extension portion 91c may protrude from the base member 91 or extend in a finger shape, and may be electrically connected or in contact with the corresponding electrode layers 13 and 15 between one edge portion of the first cover member 30 and one edge portion of the second cover member 50. For example, the ends (or distal ends or one sides) of the first extension portion 91a to the third extension portion 91c may be electrically connected or in contact with the corresponding electrode layers 13 and 15 through a conductive double-sided tape, so as to ensure the adhesion force with the corresponding electrode layers 13 and 15.

[0112] The signal cable 90 according to an exemplary embodiment of the present disclosure may further include an insulating member 93.

[0113] The insulating member 93 may be provided on the first surface of the base member 91 to cover each of the first extension portion 91a to the third extension portion 91c except for the end of the signal cable 90. The insulating member 93 may be a protective layer, a stacked layer, a covering layer, a covering film, an insulating film, or a solder resist layer, but the embodiments of the present disclosure are not limited thereto.

[0114] The end (or distal end or one side) of the signal cable 90 inserted (or received) between the first cover member 30 and the second cover member 50 may be inserted (or received) and fixed between the first cover member 30 and the second cover member 50 through a film lamination process using a first adhesive layer 41 formed in the first cover member 30 and a second adhesive layer 42 formed in the second cover member 50. Therefore, the first signal line 92a can remain electrically connected to the first electrode layer 13 of the second vibration portion 10B. Therefore, the second signal line 92b can remain electrically connected to the first electrode layer 13 of the second vibration portion 10B and the second electrode layer 15 of the first vibration portion 10A.

[0115] In addition, an end portion (or a distal end portion or one side) of the signal cable 90 may be inserted (or received) and fixed between the first cover member 30 and the second cover member 50, so that a connection defect between the vibration generating unit 10 and the signal cable 90 due to the movement of the signal cable 90 can be prevented.

[0116] In a vibration device according to an embodiment of the present disclosure, the first signal line 92a to the third signal line 92c of the signal cable 90 may be connected to an electrode layer of the vibration generating unit 10 between the first cover member 30 and the second cover member 50. Therefore, a soldering process for the electrical connection between the vibration generating unit 10 and the signal cable 90 may not be required, thereby simplifying the structure and manufacturing process of the vibration device. In addition, a vibration device according to another embodiment of the present disclosure may include a plurality of vibration units 10A and 10B that overlap or are stacked with each other to vibrate (or shift or drive) in the same direction. Therefore, the vibration efficiency or vibration characteristics can be enhanced, and the vibration width (or shift width or drive width) can be maximized, thereby enhancing the sound characteristics and / or sound pressure level characteristics of a sound band including a bass band.

[0117] In a vibration device according to an embodiment of the present disclosure, the connection layer 20 may be disposed between the first vibration unit 10A and the second vibration unit 10B, and the connection layer 20 may be formed of a soldering foil. For example, in the case where the vibration generating unit 10 is configured by simultaneously sintering the electrode layers 13 and 15 and the vibration layer 11, the electrode layers 13 and 15 that can be applied at a high temperature (e.g., 900 °C or higher) as the sintering temperature should be configured. Therefore, in an embodiment of the present disclosure, since the connection layer 20 is configured by soldering, the adhesion between the first vibration unit 10A and the second vibration unit 10B can be enhanced, and the thickness of the vibration device 10 can be reduced.

[0118] In addition, in a vibration device according to an embodiment of the present disclosure, since the connection layer 20 is formed of a soldering foil having a melting point of 400 °C or lower, the process temperature can be reduced, the process can be simplified, the process time can be reduced, and the productivity of the vibration device can be improved.

[0119] Figures 7A to 7C is a view showing a Figure 1 manufacturing method of a vibration device according to an embodiment of the present disclosure. Figures 7A to 7C is a view showing a Figures 1 to 6 manufacturing method of a vibration device according to an embodiment of the present disclosure described above with reference to

[0120] Referring to Figures 7A to 7C, a method of manufacturing a vibration device according to an embodiment of the present disclosure may include steps of arranging a plurality of vibration units 10A and 10B, arranging a connection layer 20 between the plurality of vibration units 10A and 10B, arranging a signal cable 90 electrically connected to the plurality of vibration units 10A and 10B, and arranging a first cover member 30 and a second cover member 50.

[0121] Referring to Figure 7A , the step of arranging a plurality of vibration units (e.g., a first vibration unit and a second vibration unit) 10A and 10B may include arranging a vibration layer 11. For example, the vibration layer 11 may include a piezoelectric material (or electroactive material) having a piezoelectric effect. For example, the vibration layer 11 may be arranged to have a width of 6 cm, a height of 12 cm, and a thickness of 165 μm, but the embodiments of the present disclosure are not limited thereto.

[0122] Subsequently, a first electrode 13 may be arranged at a first surface (or lower surface) of the vibration layer 11 of each of the first vibration unit 10A and the second vibration unit 10B, and a second electrode layer 15 may be arranged at a second surface (or upper surface).

[0123] According to an embodiment of the present disclosure, a metal paste containing silver (Ag) may be coated on regions of the first surface and the second surface where the electrode layers are to be arranged, and then the first electrode layer 13 and the second electrode layer 15 may be respectively formed by firing the coated metal paste. For example, the firing may be performed at a temperature of 650 °C to 700 °C for about 15 minutes, but the embodiments of the present disclosure are not limited thereto. For example, the firing may include a process of maintaining at a temperature of 650 °C to 700 °C for about 15 minutes and then performing natural cooling, but the embodiments of the present disclosure are not limited thereto. The process time may include a heat treatment time and a natural cooling time, and may be performed for about 1 hour, but the embodiments of the present disclosure are not limited thereto. For example, the metal paste containing silver (Ag) may be formed to have a thickness of 5 μm or less, but the embodiments of the present disclosure are not limited thereto.

[0124] Referring to Figure 7B , in an embodiment of the present disclosure, the step of arranging the connection layer 20 between the plurality of vibration units 10A and 10B and the step of arranging the signal cable 90 electrically connected to the plurality of vibration units 10A and 10B may be performed simultaneously.

[0125] First, the connection layer 20 can be disposed between the plurality of vibrating portions 10A and 10B, and the signal cable 90 can be connected to the plurality of vibrating portions 10A. For example, the connection layer 20 can be disposed between the second electrode layer 15 of the first vibrating portion 10A and the first electrode layer 13 of the second vibrating portion 10B. For example, the first signal line 92a can be connected to the second electrode layer 15 of the second vibrating portion 10B, the second signal line 92b can be connected between the connection layer 20 and the second electrode layer 15 of the first vibrating portion 10A, and the third signal line 92c can be connected to the first electrode layer 13 of the first vibrating portion 10A.

[0126] Subsequently, in an embodiment of the present disclosure, a pressure device 70 can be disposed on the second vibrating portion 10B, a load of about 0.2 kg or more can be applied in the arrow direction, and the connection layer 20 can be heat-treated at a temperature of 400 °C or less. For example, the process of heat-treating the connection layer 20 at a temperature of 400 °C or less can be a firing step. For example, the firing step can be a heat treatment process. For example, the firing step can be a step of melting the welding foil disposed between the electrode layers 13 and 15 to weld the melted welding foil between the first vibrating portion 10A and the second vibrating portion 10B. For example, the melting point of the welding foil used as the connection layer 20 can be in the range of about 100 °C to about 400 °C. For example, the time for welding the welding foil can be less than 1 hour, but the embodiments of the present disclosure are not limited thereto. For example, the welding foil can be welded at about 150 °C for 5 minutes. However, the embodiments of the present disclosure are not limited thereto. According to an embodiment of the present disclosure, the melted welding foil can include a uniform surface, and as the melted welding foil cools at room temperature, the melted welding foil can be welded to configure the connection layer 20. For example, the connection layer 20 can have a thickness of several μm to several tens of μm, but the embodiments of the present disclosure are not limited thereto. According to an embodiment of the present disclosure, the welded connection layer 20 can be configured, so that the first vibrating portion 10A and the second vibrating portion 10B can be easily connected to each other at a relatively low temperature.

[0127] Referring to Figure 7C , the step of configuring the first cover member 30 and the second cover member 50 can be a step of disposing the first cover member 30 on the first surface of the vibration generating portion 10 and disposing the second cover member 50 on the second surface of the vibration generating portion 10.

[0128] First, a first adhesive layer 41 can be formed (or coated) on the first cover member 30, the vibration generating portion 10 can be disposed on the first adhesive layer 41, and a second adhesive layer 42 can be formed (or coated) on the second surface of the vibration generating portion 10. Thus, the vibration generating portion 10 can be surrounded by the first adhesive layer 41 and the second adhesive layer 42, or can be buried (or accommodated) in the adhesive layer 40 including the first adhesive layer 41 and the second adhesive layer 42.

[0129] Subsequently, the second cover member 50 may be attached to the second surface of the vibration generating unit 10. The second cover member 50 may be connected or bonded to the second surface of the vibration generating unit 10 by a lamination process using the second adhesive layer 42. Accordingly, the vibration generating unit 10 may be disposed between the first cover member 30 and the second cover member 50 and may be protected by the first cover member 30 and the second cover member 50.

[0130] According to an embodiment of the present disclosure, the welded connection layer 20 may be disposed between the first vibration unit 10A and the second vibration unit 10B, and the connection layer 20 may be a welding foil having a melting point of 400 °C or less. Accordingly, compared with the process of separately manufacturing and laminating each of the first vibration unit 10A and the second vibration unit 10B, the thickness and weight of the vibration device 10 may be reduced.

[0131] According to an embodiment of the present disclosure, compared with the process of separately manufacturing and laminating each of the first vibration unit 10A and the second vibration unit 10B, the damping phenomenon between the first vibration unit 10A and the second vibration unit 10B may be reduced, and thus the sound pressure level of the vibration device 10 may be enhanced.

[0132] In addition, according to an embodiment of the present disclosure, compared with the process of laminating and sintering the electrode layer and the vibration layer at the same time, the manufacturing method of the vibration device may be simple in process, may laminate the first vibration unit 10A and the second vibration unit 10B at a low temperature, may reduce the process time, and may improve the yield.

[0133] Figure 8 is a view showing another embodiment according to the present disclosure Figure 1 of the manufacturing method of the vibration device shown. Figure 8 is a view showing the manufacturing method of the vibration device according to another embodiment of the present disclosure described above with reference to Figures 1 to 6 In addition to simultaneously disposing the connection layer 20, the signal cable 90, and the first cover member 30 and the second cover member 50, the manufacturing method of the vibration device according to another embodiment of the present disclosure may be substantially the same as the embodiment of the present disclosure described above with reference to Figures 7A to 7C Accordingly, in the following, the same reference numerals refer to the same elements, and repeated descriptions will be briefly given or omitted.

[0134] Referring to Figure 8 , the manufacturing method of the vibration device according to another embodiment of the present disclosure may simultaneously perform the steps of disposing the connection layer 20 between the plurality of vibration units 10A and 10B, disposing the signal cable 90 electrically connected to the plurality of vibration units 10A and 10B, and disposing the first cover member 30 and the second cover member 50.

[0135] First, the connection layer 20 can be disposed between the plurality of vibration units 10A and 10B, and the signal cable 90 can be connected to the plurality of vibration units 10A. In addition, the first adhesive layer 41 and the first cover member 30 can be disposed on the first surface of the vibration generating unit 10, and the second adhesive layer 42 and the second cover member 50 can be disposed on the second surface of the vibration generating unit 10.

[0136] Subsequently, in another embodiment of the present disclosure, the vibration generating unit 10, the connection layer 20, the signal cable 90, and the first cover member 30 and the second cover member 50 can be joined to each other at a temperature of 200 °C or lower. For example, joining can be performed by applying pressure in the arrow direction at the first surface and the second surface of the vibration generating unit 10. For example, joining can be performed at a relatively low temperature. For example, low-temperature joining can be performed at about 120 °C. For example, the low-temperature joining can be single joining.

[0137] Subsequently, polarization (or polarization) can be performed by applying a high voltage to the first vibration unit 10A and the second vibration unit 10B. For example, polarization (or polarization) can be performed by applying a high voltage of about 3 kV / μm to the first vibration unit 10A and the second vibration unit 10B.

[0138] Subsequently, an ultrasonic signal can be applied to the first vibration unit 10A and the second vibration unit 10B. For example, since heat and / or an ultrasonic signal is applied to the first vibration unit 10A and the second vibration unit 10B, heat is generated in the first vibration unit 10A and the second vibration unit 10B. At this time, heat and / or an ultrasonic signal can be applied to the connection layer 20 including the welding foil, and ultrasonic welding (or ultrasonic bonding) can be performed. For example, the ultrasonic welding can be secondary joining. Therefore, the welded connection layer 20 can be disposed between the first vibration unit 10A and the second vibration unit 10B. Therefore, the first vibration unit 10A and the second vibration unit 10B can be easily connected to each other.

[0139] The manufacturing method according to another embodiment of the present disclosure can weld the welding foil using heat and ultrasonic waves, and thus can be processed at a low temperature. Therefore, the manufacturing method according to another embodiment of the present disclosure can improve process efficiency.

[0140] Another embodiment of the present disclosure may have substantially the same effects as one embodiment of the present disclosure described above with reference to Figure 7A and Figure 7C described. In addition, the manufacturing method according to another embodiment of the present disclosure can be simpler in process, can additionally reduce the process time, and can further improve the yield.

[0141] Figure 9 is a diagram showing a vibration device according to another embodiment of the present disclosure. Figure 10which shows another embodiment according to the present disclosure Figure 9 An exploded perspective view of the connection structure between the shown vibration generating unit and the signal cable. Figure 11 is a cross-sectional view taken along line E-E' shown according to an embodiment of the present disclosure Figure 9 as shown. Figure 12 is a cross-sectional view taken along line F-F' shown according to an embodiment of the present disclosure Figure 9 as shown. Figure 13 is a cross-sectional view taken along line G-G' shown according to an embodiment of the present disclosure Figure 9 as shown. Figure 14 is a cross-sectional view taken along line H-H' shown according to an embodiment of the present disclosure Figure 9 as shown. Another embodiment of the present disclosure described above with reference to Figures 9 to 14 may be an embodiment in which one or more contact holes are arranged in the vibration layer 11, and due to the arrangement of the contact holes, the connection structure of the signal cable changes, and an auxiliary electrode layer, a connection portion, and an auxiliary connection layer are additionally arranged. Other elements except the above elements may be substantially the same as the embodiments of the present disclosure described above with reference to Figures 1 to 6 Therefore, in the following, the same reference numerals refer to the same elements, and the repeated descriptions will be briefly given or omitted.

[0142] Referring to Figures 9 to 14 , each of the first vibration unit 10A and the second vibration unit 10B according to another embodiment of the present disclosure may include a vibration layer 11, a first electrode layer 13, and a second electrode layer 15.

[0143] In the first vibration unit 10A, the vibration layer 11 may include contact holes arranged at one end (or one side) of the vibration layer 11. For example, the contact holes arranged at one end (or one side) of the vibration layer 11 may be the third contact holes CNT3. For example, the third contact holes CNT3 may be arranged near the signal line described below.

[0144] The first electrode layer 13 may be arranged on the first surface (or the lower surface) of the vibration layer 11. The second electrode layer 15 may be arranged on the second surface (or the upper surface) of the vibration layer 11. The second electrode layer 15 may include a plurality of protrusions (or a pair of protrusions) 15a and 15b protruding from one end (or one side) thereof. The plurality of protrusions 15a and 15b may be arranged parallel to each other and spaced apart. Therefore, the second electrode layer 15 cannot be arranged in the region where the plurality of protrusions 15a and 15b are spaced apart, and the second surface (or the upper surface) of the vibration layer 11 may be exposed.

[0145] In another embodiment of the present disclosure, in the first vibration unit 10A, the second electrode layer 15 may include a recess recessed from a part of one end (or one side) thereof. The recess may be formed to be recessed from the central portion of one end (or one side) of the second electrode layer 15 in the second direction Y. For example, the recess may be recessed to have a certain length in the second direction Y from the central portion of one end (or one side) of the second electrode layer 15. For example, the recess may be disposed between a plurality of protrusions (or a pair of protrusions) 15a and 15b, but the embodiments of the present disclosure are not limited thereto. For example, the recess may be a portion where a part of the second electrode layer 15 is removed or a portion where the second electrode layer 15 is not formed. For example, the recess may be a patterned portion, an electrode non-formed portion, an electrode non-set portion, or an opening portion, but the embodiments of the present disclosure are not limited thereto.

[0146] In the second vibration unit 10B, the vibration layer 11 may include a plurality of contact holes disposed at one end of the vibration layer 11. Each of the plurality of contact holes may be disposed adjacent to the signal cable 90. For example, the plurality of contact holes disposed at one end of the vibration layer 11 may include a first contact hole CNT1 and a second contact hole CNT2. The first contact hole CNT1 and the second contact hole CNT2 may be set to be spaced apart from each other by a certain distance. For example, the first contact hole CNT1 may not overlap with the third contact hole CNT3 disposed in the vibration layer 11 of the first vibration unit 10A. For example, the second contact hole CNT2 may overlap with the third contact hole CNT3 disposed in the vibration layer 11 of the first vibration unit 10A.

[0147] In the second vibration unit 10B, the first electrode layer 13 may be disposed on the first surface (or the lower surface) of the vibration layer 11. For example, the first electrode layer 13 may include a plurality of protrusions (or a pair of protrusions) 13a and 13b protruding from one end (or one side) thereof. The plurality of protrusions 13a and 13b may be disposed parallel to each other and spaced apart from each other. Accordingly, the first electrode layer 13 may not be disposed in the region where the plurality of protrusions 13a and 13b are spaced apart from each other, and the first surface (or the lower surface) of the vibration layer 11 may be exposed.

[0148] In another embodiment of the present disclosure, in the second vibration unit 10B, the first electrode layer 13 may include a recess recessed from a part of one end (or one side) thereof. The recess may be formed to be recessed from the central portion of one end (or one side) of the first electrode layer 13 in the second direction Y. For example, the recess may be recessed to have a certain length in the second direction Y from the central portion of one end (or one side) of the first electrode layer 13. For example, the recess may be disposed between a plurality of protrusions (or a pair of protrusions) 13a and 13b, but the embodiments of the present disclosure are not limited thereto. For example, the recess may be a part of the first electrode layer 13 that is removed or a part where the first electrode layer 13 is not formed. For example, the recess may be a patterned portion, an electrode non-formation portion, an electrode non-setting portion, or an opening portion, but the embodiments of the present disclosure are not limited thereto.

[0149] In the second vibration unit 10B, the second electrode layer 15 may be disposed on the second surface (or upper surface) of the vibration layer 11. For example, the second electrode layer 15 may include a plurality of protrusions (or a pair of protrusions) 15a and 15b protruding from one end (or one side) thereof. The plurality of protrusions 15a and 15b may be arranged parallel to each other with a space therebetween. Therefore, the second electrode layer 15 cannot be disposed in the region where the plurality of protrusions 15a and 15b are spaced apart from each other, and the second surface (or upper surface) of the vibration layer 11 may be exposed.

[0150] In another embodiment of the present disclosure, in the second vibration unit 10B, the second electrode layer 15 may include a recess recessed from a part of one end (or one side) thereof. The recess may be formed to be recessed from the central portion of one end (or one side) of the second electrode layer 15 in the second direction Y. For example, the recess may be recessed to have a certain length in the second direction Y from the central portion of one end (or one side) of the second electrode layer 15. For example, the recess may be disposed between a plurality of protrusions (or a pair of protrusions) 15a and 15b, but the embodiments of the present disclosure are not limited thereto. For example, the recess may be a part of the second electrode layer 15 that is removed or a part where the second electrode layer 15 is not formed. For example, the recess may be a patterned portion, an electrode non-formation portion, an electrode non-setting portion, or an opening portion, but the embodiments of the present disclosure are not limited thereto.

[0151] According to an embodiment of the present disclosure, the first electrode layer 13 of the first vibration unit 10A does not include a plurality of protrusions, and the second electrode layer 15 of the first vibration unit 10A may include a plurality of protrusions 15a and 15b. Therefore, the first electrode layer 13 and the second electrode layer 15 of the first vibration unit 10A may have different shapes.

[0152] According to an embodiment of the present disclosure, the first electrode layer 13 and the second electrode layer 15 of the second vibration part 10B may have different shapes. For example, the plurality of protruding parts 13a and 13b arranged in the first electrode layer 13 of the second vibration part 10B and the plurality of protruding parts 15a and 15b arranged in the second electrode layer 15 of the second vibration part 10B may have non-overlapping regions where the elements do not overlap each other. For example, partial regions of the plurality of protruding parts 13a and 13b arranged in the first electrode layer 13 of the second vibration part 10B and partial regions of the plurality of protruding parts 15a and 15b arranged in the second electrode layer 15 of the second vibration part 10B cannot overlap each other. For example, the recessed part arranged in the first electrode layer 13 of the second vibration part 10B and the recessed part arranged in the second electrode layer 15 of the second vibration part 10B may have non-overlapping regions where the elements do not overlap each other. For example, partial regions of the recessed part arranged in the first electrode layer 13 of the second vibration part 10B and partial regions of the recessed part arranged in the second electrode layer 15 of the second vibration part 10B cannot overlap each other.

[0153] According to an embodiment of the present disclosure, the second electrode layer 15 of the first vibration part 10A and the first electrode layer 13 of the second vibration part 10B may have the same shape. For example, the plurality of protruding parts 15a and 15b arranged in the second electrode layer 15 of the first vibration part 10A and the plurality of protruding parts 13a and 13b arranged in the first electrode layer 13 of the second vibration part 10B may overlap each other. For example, the recessed part arranged in the second electrode layer 15 of the first vibration part 10A and the recessed part arranged in the first electrode layer 13 of the second vibration part 10B may overlap each other.

[0154] According to an embodiment of the present disclosure, the vibration generating part 10 may further include a first auxiliary electrode layer 17a, a second auxiliary electrode layer 17b, a third auxiliary electrode layer 17c, and a fourth auxiliary electrode layer 17d. The first auxiliary electrode layer 17a to the third auxiliary electrode layer 17c may be arranged in the vibration generating part 10 or the second vibration part 10B. The fourth auxiliary electrode layer 17d may be arranged in the vibration generating part 10 or the first vibration part 10A.

[0155] In the second vibration part 10B, the first auxiliary electrode layer 17a may be arranged (or formed) on the vibration layer 11 to be electrically disconnected from the second electrode layer 15. The first auxiliary electrode layer 17a may be arranged (or formed) on the second surface (or upper surface) of the vibration layer 11 to be electrically disconnected from the second electrode layer 15. For example, the first auxiliary electrode layer 17a may be arranged (or formed) on the vibration layer 11 between the plurality of protruding parts 15a and 15b of the second electrode layer 15. The first auxiliary electrode layer 17a may overlap with the first electrode layer 13 of the second vibration part 10B.

[0156] In the second vibration unit 10B, the first auxiliary electrode layer 17a may be electrically connected to the first electrode layer 13 through the vibration layer 11. For example, the first auxiliary electrode layer 17a may be electrically connected to the first electrode layer 13 through a first connection portion 19a disposed (or formed) in the vibration layer 11. For example, the first connection portion 19a may be filled in a first contact hole CNT1 disposed (or formed) in the vibration layer 11. According to an embodiment of the present disclosure, the first connection portion 19a may be formed by filling a material used as an electrode layer in the first contact hole CNT1 during the processes of forming the first auxiliary electrode layer 17a and the first electrode layer 13. Therefore, the first auxiliary electrode layer 17a may be electrically connected to the first electrode layer 13. For example, the first auxiliary electrode layer 17a may include the same material as the second electrode layer 15 of the second vibration unit 10B, and may be configured using the same process, but the embodiments of the present disclosure are not limited thereto.

[0157] In the second vibration unit 10B, the second auxiliary electrode layer 17b may be disposed (or formed) on the vibration layer 11 to be electrically disconnected from the second electrode layer 15. The second auxiliary electrode layer 17b may be disposed (or formed) on the second surface (or upper surface) of the vibration layer 11 to be electrically disconnected from the second electrode layer 15. For example, the second auxiliary electrode layer 17b may be disposed (or formed) on the vibration layer 11 between multiple protruding portions 15a and 15b of the second electrode layer 15. The second auxiliary electrode layer 17b may be disposed (or formed) on the second surface (or upper surface) of the vibration layer 11 to be electrically disconnected from the first auxiliary electrode layer 17a. The second auxiliary electrode layer 17b cannot overlap with the first electrode layer 13 of the second vibration unit 10B.

[0158] In the second vibration unit 10B, the second auxiliary electrode layer 17b may be electrically connected to a third auxiliary electrode layer 17c disposed on the first surface (or lower surface) of the vibration layer 11 through the vibration layer 11. For example, the second auxiliary electrode layer 17b may be electrically connected to the third auxiliary electrode layer 17c through a second connection portion 19b disposed (or formed) in the vibration layer 11. For example, the second connection portion 19b may be filled in a second contact hole CNT2 disposed (or formed) in the vibration layer 11. The second contact hole CNT2 may overlap with the second auxiliary electrode layer 17b and the third auxiliary electrode layer 17c. According to an embodiment of the present disclosure, the second connection portion 19b may be formed by filling a material used as an electrode layer in the second contact hole CNT2 during the processes of forming the second auxiliary electrode layer 17b and the third auxiliary electrode layer 17c. Therefore, the second auxiliary electrode layer 17b may be electrically connected to the third auxiliary electrode layer 17c. For example, the second auxiliary electrode layer 17b may contain the same material as the second electrode layer 15 of the second vibration unit 10B, and may be configured using the same processes, but the embodiments of the present disclosure are not limited thereto.

[0159] In the second vibrating part 10B, the third auxiliary electrode layer 17c can be disposed (or formed) on the vibrating layer 11 so as to be electrically disconnected from the first electrode layer 13. The third auxiliary electrode layer 17c can be disposed (or formed) on the first surface (or lower surface) of the vibrating layer 11 so as to be electrically disconnected from the first electrode layer 13. For example, the third auxiliary electrode layer 17c can be disposed (or formed) on the vibrating layer 11 between the plurality of protrusions 13a and 13b of the first electrode layer 13.

[0160] In the second vibrating part 10B, the third auxiliary electrode layer 17c can be electrically connected to the second auxiliary electrode layer 17b disposed on the second surface (or upper surface) of the vibrating layer 11 through the vibrating layer 11. For example, the third auxiliary electrode layer 17c can be electrically connected to the second auxiliary electrode layer 17b through the second connection part 19b disposed (or formed) in the vibrating layer 11. For example, the third auxiliary electrode layer 17c can include the same material as the first electrode layer 13 of the second vibrating part 10B, and can be disposed using the same process, but the embodiments of the present disclosure are not limited thereto.

[0161] In the first vibrating part 10A, the fourth auxiliary electrode layer 17d can be disposed (or formed) on the vibrating layer 11 so as to be electrically disconnected from the second electrode layer 15. The fourth auxiliary electrode layer 17d can be disposed (or formed) on the second surface (or upper surface) of the vibrating layer 11 so as to be electrically disconnected from the second electrode layer 15. For example, the fourth auxiliary electrode layer 17d can be disposed (or formed) on the vibrating layer 11 between the plurality of protrusions 15a and 15b of the second electrode layer 15.

[0162] In the first vibrating part 10A, the fourth auxiliary electrode layer 17d can be electrically connected to the first electrode layer 13 disposed on the first surface (or lower surface) of the vibrating layer 11 through the vibrating layer 11. For example, the fourth auxiliary electrode layer 17d can be electrically connected to the first electrode layer 13 through the third connection part 19c disposed (or formed) in the vibrating layer 11. For example, the third connection part 19c can be filled in the third contact hole CNT3 disposed (or formed) in the vibrating layer 11. The third contact hole CNT3 can overlap with the second auxiliary electrode layer 17b, the second contact hole CNT2 of the second vibrating part 10B, the second connection part 19b, the third auxiliary electrode layer 17c, and the first electrode layer 13. According to an embodiment of the present disclosure, the third connection part 19c can be formed by filling the material used as the electrode layer in the third contact hole CNT3 during the processes of forming the fourth auxiliary electrode layer 17d and the first electrode layer 13. Therefore, the fourth auxiliary electrode layer 17d can be electrically connected to the first electrode layer 13. For example, the fourth auxiliary electrode layer 17d can include the same material as the first electrode layer 13 of the first vibrating part 10A, and can be disposed using the same process, but the embodiments of the present disclosure are not limited thereto.

[0163] According to an embodiment of the present disclosure, the connection layer 20 may be disposed between the first vibration part 10A and the second vibration part 10B. The connection layer 20 may include a plurality of protrusions (or a pair of protrusions) 20a and 20b protruding from one end (or one side) thereof. The plurality of protrusions 20a and 20b may be arranged parallel to each other and spaced apart from each other. Therefore, the connection layer 20 cannot be disposed in the region where the plurality of protrusions 20a and 20b are spaced apart from each other.

[0164] In another embodiment of the present disclosure, the connection layer 20 may include a recess recessed from a part of one end (or one side) of the connection layer 20. The recess may be formed to be recessed in the second direction Y from the central portion of one end (or one side) of the connection layer 20. For example, the recess may be recessed in the second direction Y from the central portion of one end (or one side) of the connection layer 20 to form a certain length. For example, the recess may be disposed between the plurality of protrusions (or a pair of protrusions) 20a and 20b, but the embodiments of the present disclosure are not limited thereto. For example, the recess may be a portion where the connection layer 20 is not formed, and thus, may be a patterned portion or an opening portion, but the embodiments of the present disclosure are not limited thereto.

[0165] According to an embodiment of the present disclosure, the connection layer 20 may connect the second electrode layer 15 of the first vibration part 10A and the first electrode layer 13 of the second vibration part 10B. The first electrode layer 13 of the second vibration part 10B may be connected to the first auxiliary electrode layer 17a using the first connection part 19a. Therefore, the first auxiliary electrode layer 17a, the first connection part 19a, the first electrode layer 13 of the second vibration part 10B, the connection layer 20, and the second electrode layer 15 of the first vibration part 10A may be connected to each other.

[0166] According to an embodiment of the present disclosure, the auxiliary connection layer 23 may be disposed between the plurality of protrusions (or a pair of protrusions) 20a and 20b protruding (or extending) from one end (or one side) of the connection layer 20. For example, the auxiliary connection layer 23 may be spaced apart from the connection layer 20 in the same layer as the connection layer 20. For example, the auxiliary connection layer 23 may be disposed at the recess disposed between the plurality of protrusions (or a pair of protrusions) 20a and 20b.

[0167] According to an embodiment of the present disclosure, the auxiliary connection layer 23 may be disposed between the third auxiliary electrode layer 17c and the fourth auxiliary electrode layer 17d, and may connect the third auxiliary electrode layer 17c to the fourth auxiliary electrode layer 17d. The auxiliary connection layer 23 may overlap with the third auxiliary electrode layer 17c and the fourth auxiliary electrode layer 17d. According to an embodiment of the present disclosure, since the auxiliary connection layer 23 connects the third auxiliary electrode layer 17c to the fourth auxiliary electrode layer 17d, the second auxiliary electrode layer 17b, the second connection portion 19b, the third auxiliary electrode layer 17c, the auxiliary connection layer 23, the fourth auxiliary electrode layer 17d, the third connection portion 19c, and the first electrode layer 13 of the first vibration unit 10A may be electrically connected to each other. For example, the auxiliary connection layer 23 may include the same material as the connection layer 20 and may be disposed using the same process, but the embodiments of the present disclosure are not limited thereto. For example, the auxiliary connection layer 23 may include the same welding foil as the connection layer 20.

[0168] According to an embodiment of the present disclosure, the first auxiliary electrode layer 17a may be connected to the first electrode layer 13 of the second vibration unit 10B through the first connection portion 19a. The first electrode layer 13 of the second vibration unit 10B may be connected to the second electrode layer 15 of the first vibration unit 10A through the connection layer 20. Accordingly, the first auxiliary electrode layer 17a, the first connection portion 19a, the first electrode layer 13 of the second vibration unit 10B, the connection layer 20, and the first electrode layer 13 of the second vibration unit 10B may be sequentially connected to each other. For example, the second electrode layer 15 of the first vibration unit 10A and the first electrode layer 13 of the second vibration unit 10B may be an intermediate electrode layer, an internal electrode layer, and a common electrode layer of the vibration generating unit 10, but the embodiments of the present disclosure are not limited thereto.

[0169] According to an embodiment of the present disclosure, the second auxiliary electrode layer 17b may be connected to the third auxiliary electrode layer 17c through the second connection portion 19b, the third auxiliary electrode layer 17c may be connected to the fourth auxiliary electrode layer 17d through the auxiliary connection layer 23, and the fourth auxiliary electrode layer 17d may be connected to the first electrode layer 13 of the first vibration unit 10A through the third connection portion 19c. Accordingly, the second auxiliary electrode layer 17b, the second connection portion 19b, the third auxiliary electrode layer 17c, the auxiliary connection layer 23, the fourth auxiliary electrode layer 17d, the third connection portion 19c, and the first electrode layer 13 of the first vibration unit 10A may be sequentially connected to each other.

[0170] According to an embodiment of the present disclosure, the signal cable 90 may be received between the first cover member 30 and the second cover member 50. The signal cable 90 may be received between the second vibration unit 10B and the second cover member 50. The signal cable 90 may include first to third signal lines 92a to 92c electrically connected to the vibration generating unit 10. The first to third signal lines 92a to 92c may be received between the second vibration unit 10B and the second cover member 50.

[0171] According to an embodiment of the present disclosure, the first signal line 92a may be electrically connected to the second electrode layer 15 of the second vibration unit 10B between the second vibration unit 10B and the second cover member 50. The signal applied to the first signal line 92a may be provided to the second electrode layer 15 of the second vibration unit 10B. Accordingly, the first signal line 92a may provide the drive signal provided from the vibration drive circuit to the second electrode layer 15 of the second vibration unit 10B.

[0172] According to an embodiment of the present disclosure, the second signal line 92b may be connected to the first auxiliary electrode layer 17a between the second vibration unit 10B and the second cover member 50. The signal applied to the second signal line 92b may be provided to the first electrode layer 13 of the second vibration unit 10B and the second electrode layer 15 of the first vibration unit 10A using the first auxiliary electrode layer 17a, the first connection portion 19a, and the connection layer 20. Accordingly, the second signal line 92b may commonly provide the drive signal provided from the vibration drive circuit to the first electrode layer 13 of the second vibration unit 10B and the second electrode layer 15 of the first vibration unit 10A. Accordingly, in the embodiment of the present disclosure, two separate signal lines respectively connected to the second electrode layer 15 of the first vibration unit 10A and the first electrode layer 13 of the second vibration unit 10B cannot be configured, and the same signal may be applied to the second electrode layer 15 of the first vibration unit 10A and the first electrode layer 13 of the second vibration unit 10B only by using one second signal line 92b.

[0173] According to an embodiment of the present disclosure, the third signal line 92c may be connected to the second auxiliary electrode layer 17b between the second vibration unit 10B and the second cover member 50. The signal applied to the third signal line 92c may be provided to the first electrode layer 13 of the first vibration unit 10A using the second auxiliary electrode layer 17b, the second connection portion 19b, the third auxiliary electrode layer 17c, the auxiliary connection layer 23, the fourth auxiliary electrode layer 17d, and the third connection portion 19c. Accordingly, the third signal line 92c may commonly provide the drive signal provided from the vibration drive circuit to the first electrode layer 13 of the first vibration unit 10A. Accordingly, in the embodiment of the present disclosure, a separate signal line cannot be disposed on the lower surface (or lower side) of the first electrode layer 13 of the first vibration unit 10A, and the signal lines 92a to 92c may be disposed between the vibration generating unit 10 and the second cover member 50.

[0174] In the first vibration unit 10A, the first electrode layer 13 can receive a driving signal through the third signal line 92c, and the second electrode layer 15 can receive a driving signal through the second signal line 92b. Therefore, the first vibration unit 10A can alternately and repeatedly contract and / or expand based on the inverse piezoelectric effect generated in the vibration layer 11 according to the driving signal, and thus can vibrate (or shift or drive).

[0175] In the second vibration unit 10B, the first electrode layer 13 can receive a driving signal through the second signal line 92b, and the second electrode layer 15 can receive a driving signal through the first signal line 92a. Therefore, the second vibration unit 10B can alternately and repeatedly contract and / or expand based on the inverse piezoelectric effect generated in the vibration layer 11 according to the driving signal, and thus can vibrate (or shift or drive).

[0176] Each of the first vibration unit 10A and the second vibration unit 10B can be bent (or shifted or driven) in the same shape. Therefore, the vibration generating unit 10 or the vibration device can accumulate and maximize the vibration width (or displacement width or driving width) of the first vibration unit 10A and the vibration width (or displacement width or driving width) of the second vibration unit 10B. For example, the vibration generating unit 10 or the vibration device can enhance the vibration of the first vibration unit 10A and the vibration of the second vibration unit 10B, thereby improving the vibration characteristics and / or vibration efficiency, and can maximize the vibration width (or displacement width or driving width), thereby enhancing the sound characteristics and / or sound pressure level characteristics of the sound including the bass band.

[0177] In addition, in the vibration device according to an embodiment of the present disclosure, all of the first signal line 92a to the third signal line 92c of the signal cable 90 can be disposed between the second cover member 50 and the vibration generating unit 10. Therefore, in the vibration device according to an embodiment of the present disclosure, the signal lines cannot be disposed between the plurality of vibration units 10A and 10B. Therefore, the step height caused by the signal lines and the thickness of the vibration device can be reduced. In addition, in the vibration device according to an embodiment of the present disclosure, cracks generated when the first cover member 30 is attached to the second cover member 50 can be prevented by the step height generated when connecting the signal lines. For example, in the vibration device according to an embodiment of the present disclosure, all of the first signal line 92a to the third signal line 92c can be disposed on the upper surface of the vibration generating unit 10. Therefore, in the case where the signal lines are disposed between the first vibration generating unit 10A and the second vibration generating unit 10B, problems such as breakage of the vibration layers constituting the first vibration generating unit 10A and the second vibration generating unit 10B or defects such as cracks can be solved due to the attachment of the first vibration generating unit 10A and the second vibration generating unit 10B.

[0178] In addition, in the vibration device according to an embodiment of the present disclosure, a welding connection layer 20 and an auxiliary connection layer 23 may be disposed between the first vibration unit 10A and the second vibration unit 10B, so that the thickness between the first vibration unit 10A and the second vibration unit 10B can be reduced, and the vibration driving device can enhance the adhesion between the first vibration unit 10A and the second vibration unit 10B.

[0179] Figures 15A to 15C is a diagram showing a Figure 9 manufacturing method of the vibration device shown in an embodiment of the present disclosure. Figures 15A to 15C is a diagram showing a Figures 9 to 14 manufacturing method of the vibration device according to an embodiment of the present disclosure described above. Therefore, hereinafter, the same reference numerals refer to the same elements, and repeated descriptions will be briefly given or omitted.

[0180] Referring to Figures 15A to 15C , the manufacturing method of the vibration device according to an embodiment of the present disclosure may include steps of disposing a plurality of vibration units 10A and 10B, disposing a connection layer 20 between the plurality of vibration units 10A and 10B, disposing a signal cable 90 electrically connected to the plurality of vibration units 10A and 10B, and disposing a first cover member 30 and a second cover member 50.

[0181] Referring to Figure 15A , the step of disposing a plurality of vibration units (for example, a first vibration unit and a second vibration unit) 10A and 10B may include a step of disposing a vibration layer 11. For example, the vibration layer 11 may include a piezoelectric material (or electroactive material) having a piezoelectric effect. For example, the vibration layer 11 may be configured to have a width of 6 cm, a height of 12 cm, and a thickness of 165 μm, but the embodiments of the present disclosure are not limited thereto.

[0182] Subsequently, a first contact hole CNT1 and a second contact hole CNT2 may be formed in the vibration layer 11 of the second vibration unit 10B, and a third contact hole CNT3 may be formed in the vibration layer 11 of the first vibration unit 10A. For example, the second contact hole CNT2 may be formed at one end (or one side) of each vibration layer 11 to face the third contact hole CNT3. For example, the first contact hole CNT1 and the second contact hole CNT2 may be spaced apart from each other by a certain distance.

[0183] Subsequently, a second electrode layer 14, a first auxiliary electrode layer 17a, and a second auxiliary electrode layer 17b can be formed on the second surface (or upper surface) of the vibration layer 11 of the second vibration unit 10B, and a first electrode layer 13 and a third auxiliary electrode layer 17c can be formed on the first surface (or lower surface) of the vibration layer 11. For example, in the process of forming the first auxiliary electrode layer 17a and the first electrode layer 13, when a material used as an electrode layer and / or an auxiliary electrode layer is filled in the first contact hole CNT1, the first auxiliary electrode layer 17a and the first electrode layer 13 can be electrically connected to each other. For example, in the process of forming the second auxiliary electrode layer 17b and the third auxiliary electrode layer 17c, when a material used as an auxiliary electrode layer is filled in the second contact hole CNT2, the second auxiliary electrode layer 17b and the third auxiliary electrode layer 17c can be electrically connected to each other.

[0184] Subsequently, the first electrode layer 13 can be disposed on the first surface (or lower surface) of the vibration layer 11 of the first vibration unit 10A, and the second electrode layer 15 and the fourth auxiliary electrode layer 17d can be disposed on the second surface (or upper surface). For example, in the process of forming the fourth auxiliary electrode layer 17d and the first electrode layer 13, when a material used as an electrode layer and / or an auxiliary electrode layer is filled in the third contact hole CNT3, the fourth auxiliary electrode layer 17d and the first electrode layer 13 can be electrically connected to each other.

[0185] According to an embodiment of the present disclosure, a metal paste including silver (Ag) can be coated on the regions of the first surface and the second surface of the vibration layer 11 where the electrode layers are to be provided, and then, by firing the coated metal paste, the first electrode layer 13, the second electrode layer 15, the first auxiliary electrode layer 17a, the second auxiliary electrode layer 17b, the third auxiliary electrode layer 17c, and the fourth auxiliary electrode layer 17d can be formed respectively. For example, the firing can be performed at a temperature of 650°C to 700°C for about 15 minutes, but the embodiments of the present disclosure are not limited thereto. For example, the firing can include a process of maintaining at a temperature of 650°C to 700°C for about 15 minutes and then performing natural cooling, but the embodiments of the present disclosure are not limited thereto. The process time can include the heat treatment time and the natural cooling time, and can be about 1 hour, but the embodiments of the present disclosure are not limited thereto. For example, the metal paste including silver (Ag) can be formed to have a thickness of 5 μm or less, but the embodiments of the present disclosure are not limited thereto.

[0186] Refer to Figure 15B, the step of disposing the connection layer 20 between the plurality of vibration units 10A and 10B may be the step of forming the connection layer 20 and the auxiliary connection layer 23 on the first surface (or lower surface) of the second vibration unit 10B. First, in the connection layer 20 and the auxiliary connection layer 23, a welding foil serving as the connection layer 20 and the auxiliary connection layer 23 may be disposed on the first surface (or lower surface) of the second electrode layer 15 of the second vibration unit 10B. Subsequently, a pressure device 70 may be disposed on the second vibration unit 10B, a load of about 0.2 kg or more may be applied in the arrow direction, and heat treatment may be performed on the connection layer 20 and the auxiliary connection layer 23 at a temperature of 400 °C or lower. For example, the process of performing heat treatment on the connection layer 20 and the auxiliary connection layer 23 at a temperature of 400 °C or lower may be a firing step. For example, the firing step may be a step of melting the welding foil disposed between the electrode layers 13 and 15 to weld the melted welding foil. For example, the melting point of the welding foil serving as the connection layer 20 and the auxiliary connection layer 23 may be in the range of about 100 °C to about 400 °C, but the embodiments of the present disclosure are not limited thereto. For example, the time for welding the welding foil may be less than 1 hour. For example, the welding foil may be welded at about 150 °C for 5 minutes. However, the embodiments of the present disclosure are not limited thereto. According to an embodiment of the present disclosure, the molten welding foil may include a uniform surface, and since the molten welding foil cools at room temperature, the molten welding foil may be welded to configure the connection layer 20 and the auxiliary connection layer 23. Therefore, the first vibration unit 10A and the second vibration unit 10B may be easily connected to each other. Therefore, the first vibration unit 10A and the second vibration unit 10B may be easily adhered to each other.

[0187] Referring to Figure 15C , the method of manufacturing a vibration device according to an embodiment of the present disclosure may include the step of disposing a signal cable 90 electrically connected to the plurality of vibration units 10A and 10B and the step of disposing a first cover member 30 and a second cover member 50.

[0188] First, the method may include the step of placing the signal line in the vibration generating unit 10 and attaching the second cover member (or protective member) 50. For example, the step of placing the signal line in the vibration generating unit 10 and attaching the second cover member 50 may place the first signal line 92a on the second electrode layer 15 of the second vibration unit 10B, place the second signal line 92b on the first auxiliary electrode layer 17a, place the third signal line 92c on the second auxiliary electrode layer 17b, and attach the second cover member 50 to the first surface of the vibration generating unit 10 using a lamination process using the second adhesive layer 42. Therefore, the first signal line 92a may be electrically connected (or in contact) with the second electrode layer 15 of the second vibration unit 10B, the second signal line 92b may be electrically connected (or in contact) with the first auxiliary electrode layer 17a, and the third signal line 92c may be electrically connected (or in contact) with the second auxiliary electrode layer 17b.

[0189] In addition, the method may further include a step of forming (or coating) a first adhesive layer 41 on a first surface of the vibration generating unit 10. Accordingly, the vibration generating unit 10 may be surrounded by the second cover member 50 and the first adhesive layer 41. For example, the vibration generating unit 10 may be surrounded by the first adhesive layer 41 and the second adhesive layer 42, or may be buried (or accommodated) in the adhesive layer 40 including the first adhesive layer 41 and the second adhesive layer 42.

[0190] Subsequently, the method may further include a step of attaching the first cover member 30 to the first surface of the vibration generating unit 10. The first cover member 30 may be connected or bonded to the first surface of the vibration generating unit 10 using a lamination process of the first adhesive layer 41. Accordingly, the vibration generating unit 10 may be disposed between the first cover member 30 and the second cover member 50, and may be protected by the first cover member 30 and the second cover member 50. For example, the vibration generating unit 10 may be surrounded by the first adhesive layer 41 and the second adhesive layer 42, or may be buried (or accommodated) in the adhesive layer 40 including the first adhesive layer 41 and the second adhesive layer 42.

[0191] Figure 16 is a cross-sectional view taken along line E-E' shown in Figure 9 In addition to omitting the second electrode layer of the first vibration unit, omitting the first electrode layer of the second vibration unit, and performing surface treatment on one surface of each of the vibration layers facing each other, another embodiment of the present disclosure may be substantially the same as the embodiment of the present disclosure described above with reference to Figure 11 Therefore, in the following, the same reference numerals refer to the same elements, and repeated descriptions will be briefly given or omitted.

[0192] Referring to Figure 16 , each of the first vibration unit 10A and the second vibration unit 10B according to another embodiment of the present disclosure may include a vibration layer 11 and one of the electrode layers 13 or 15. The first vibration unit 10A according to another embodiment of the present disclosure may include a vibration layer 11 and a first electrode layer 13, and the second vibration unit 10B according to another embodiment of the present disclosure may include a vibration layer 11 and a second electrode layer 15.

[0193] According to another embodiment of the present disclosure, the vibration layer 11 of the first vibration unit 10A may include a first surface treatment portion 18a disposed on a second surface (or upper surface) thereof facing the second vibration unit 10B. The first surface treatment portion 18a may be disposed on the entire second surface (or upper surface) of the vibration layer 11, but the embodiment of the present disclosure is not limited thereto. In the first surface treatment portion 18a, a separate electrode layer cannot be disposed on the second surface (or upper surface) of the vibration layer 11.

[0194] According to another embodiment of the present disclosure, the vibration layer 11 of the second vibration unit 10B may include a second surface treatment unit 18b disposed on a first surface (or lower surface) thereof facing the first vibration unit 10A. The second surface treatment unit 18b may be disposed on the entire first surface (or lower surface) of the vibration layer 11, but the embodiments of the present disclosure are not limited thereto. In the second surface treatment unit 18b, a separate electrode layer cannot be disposed on the first surface (or lower surface) of the vibration layer 11.

[0195] According to another embodiment of the present disclosure, the first surface treatment unit 18a and the second surface treatment unit 18b may be disposed to face each other. The first surface treatment unit 18a and the second surface treatment unit 18b may be respectively disposed on a second surface (or upper surface) of the first vibration unit 10A and a first surface (or lower surface) of the second vibration unit 10B facing each other. For example, the first surface treatment unit 18a and the second surface treatment unit 18b may be surface treatment regions (or surfaces) based on plasma treatment, corona discharge, mechanical polishing, or chemical bonding using a silane coupling agent, but the embodiments of the present disclosure are not limited thereto.

[0196] According to another embodiment of the present disclosure, in the vibration generating unit 10, the first surface treatment unit 18a and the second surface treatment unit 18b may be respectively disposed on a second surface (or upper surface) of the first vibration unit 10A and a first surface (or lower surface) of the second vibration unit 10B, so that the surface roughness of the vibration layer 111 can be enhanced. Therefore, the adhesion between the vibration layer 11 disposed in each of the plurality of vibration units 10A and 10B and the connection layer 20 can be enhanced. Therefore, the adhesion between the vibration layer 11 disposed in each of the plurality of vibration units 10A and 10B and the auxiliary connection layer 23 can be enhanced.

[0197] According to another embodiment of the present disclosure, in the vibration device, since no electrode layer is disposed on each of a second surface (or upper surface) of the first vibration unit 10A and a first surface (or lower surface) of the second vibration unit 10B, and the connection layer 20 is disposed, the thickness of the vibration device can be further reduced.

[0198] Figures 17A to 17D is a diagram showing Figure 16 a manufacturing method of the vibration device shown in another embodiment of the present disclosure. Except for the step of disposing an electrode layer in the step of disposing a plurality of vibration units and the process of disposing a surface treatment unit on the vibration layers facing each other, the manufacturing method of the vibration device according to another embodiment of the present disclosure may be substantially the same as the embodiments of the present disclosure described above with reference to Figures 15A to 15C Therefore, hereinafter, the same reference numerals refer to the same elements, and repeated descriptions will be briefly given or omitted.

[0199] Refer to Figures 17A to 17D, a method of manufacturing a vibration device according to an embodiment of the present disclosure may include steps of configuring a plurality of vibration units 10A and 10B, configuring a connection layer 20 between the plurality of vibration units 10A and 10B, configuring a signal cable 90 electrically connected to the plurality of vibration units 10A and 10B, and configuring a first cover member 30 and a second cover member 50. The step of configuring the plurality of vibration units 10A and 10B may include steps of configuring a vibration layer 11, a first electrode layer 13, and a second electrode layer 15, and steps of configuring surface treatment portions 18a and 18b.

[0200] Referring to Figure 17A , a method of manufacturing a vibration device according to an embodiment of the present disclosure may form a first electrode layer 13 on a first surface (or lower surface) of the vibration layer 11 of the first vibration unit 10A, and may form a second electrode layer 15, a first auxiliary electrode layer 17a, and a second auxiliary electrode layer 17b on a second surface (or upper surface) of the vibration layer 11 of the second vibration unit 10B. For example, in the process of forming the first electrode layer 13, a part of the material used as the electrode layer may be filled in a third contact hole CNT3 disposed in the vibration layer 11 of the first vibration unit 10A, but the embodiments of the present disclosure are not limited thereto. For example, in the process of forming the first auxiliary electrode layer 17a and the second auxiliary electrode layer 17b, a part of the material used as the auxiliary electrode layer may be filled in each of the first contact hole CNT1 and the second contact hole CNT2, but the embodiments of the present disclosure are not limited thereto.

[0201] Referring to Figure 17B , a method of manufacturing a vibration device may include steps of respectively configuring a first surface treatment portion 18a and a second surface treatment portion 18b on a second surface (or upper surface) of the vibration layer 11 of the first vibration unit 10A and a first surface (or lower surface) of the vibration layer 11 of the second vibration unit 10B. For example, each of the first surface treatment portion 18a and the second surface treatment portion 18b may be configured by plasma treatment, corona discharge, mechanical polishing, or chemical bonding using a silane coupling agent, but the embodiments of the present disclosure are not limited thereto. In Figure 17B , plasma-based surface treatment is shown.

[0202] Referring to Figure 17C , the step of configuring a connection layer 20 between the plurality of vibration units 10A and 10B may be a step of forming a connection layer 20 and an auxiliary connection layer 23 between the plurality of vibration units 10A and 10B.

[0203] First, in the connection layer 20 and the auxiliary connection layer 23, a welding foil serving as the connection layer 20 and the auxiliary connection layer 23 can be disposed between the second surface (or upper surface) of the vibration layer 11 of the first vibration part 10A where the electrode layers 13 and 15 are not configured and the first surface (or lower surface) of the vibration layer 11 of the second vibration part 10B. Subsequently, a pressure device 70 can be disposed on the second vibration part 10B, a load of about 0.2 kg or more can be applied in the arrow direction, and heat treatment can be performed on the connection layer 20 and the auxiliary connection layer 23 at a temperature of 400 °C or lower. According to an embodiment of the present disclosure, the molten welding foil can include a uniform surface, and when the molten welding foil cools at room temperature, the molten welding foil can solidify to form the connection layer 20 and the auxiliary connection layer 23. For example, the welding foil can form the connection layer 20 and the auxiliary connection layer 23 in the welding process. For example, in the process of forming the connection layer 20, the molten welding foil can be inserted into the first contact hole CNT1 and welded, so that the first connection part 19a can be formed. Therefore, the connection layer 20 can be electrically connected to the first auxiliary electrode layer 17a. For example, in the process of forming the auxiliary connection layer 23, the molten welding foil can be inserted into the second contact hole CNT2 and the third contact hole CNT3 and welded, so that the second connection part 19b and the third connection part 19c can be formed. Thus, the auxiliary connection layer 23 can be electrically connected to the second connection part 19b and the third connection part 19c.

[0204] Referring to Figure 17D , in another embodiment of the present disclosure, the steps of configuring the signal cable 90 and the steps of configuring the first cover member 30 and the second cover member 50 can be performed Figure 15C in the same manner.

[0205] According to another embodiment of the present disclosure, in the vibration generating part 10, a first surface treatment part 18a and a second surface treatment part 18b can be respectively disposed on the second surface (or upper surface) of the first vibration part 10A and the first surface (or lower surface) of the second vibration part 10B facing each other, so that the surface roughness of the vibration layer 111 can be enhanced, and further the adhesion between the vibration layer 111 and the connection layer 20 and the auxiliary connection layer 23 can be enhanced.

[0206] According to another embodiment of the present disclosure, in the vibration device, since no electrode layer is disposed on each of the second surface (or upper surface) of the first vibration part 10A and the first surface (or lower surface) of the second vibration part 10B facing each other, and the connection layer 20 and the auxiliary connection layer are configured, the thickness of the vibration device can be further reduced.

[0207] Figure 18 is a schematic diagram of a vibration driving device according to an embodiment of the present disclosure. Figure 19 is according to an embodiment of the present disclosure along Figure 18A cross-sectional view taken along the line I-I' shown.

[0208] Referring to Figure 18 and Figure 19 According to an exemplary embodiment of the present disclosure, a vibration driving device may include a passive vibration member 100 and one or more vibration generating devices 200.

[0209] The "device" according to an exemplary embodiment of the present disclosure may be a display device, a sound device, a sound generating device, a speaker, an analog sign, or a digital sign, etc., but the embodiments of the present disclosure are not limited thereto.

[0210] The display device may include a display panel and a driver configured to drive the display panel. The display panel includes a plurality of pixels for realizing black and white or color images. The image according to an exemplary embodiment of the present disclosure may include an electronic image, a digital image, a static image, or a video image, etc., but the embodiments of the present disclosure are not limited thereto. For example, the display panel may be a liquid crystal display panel, an organic light emitting display panel, a light emitting diode display panel, an electrophoretic display panel, an electro-wetting display panel, a micro light emitting diode display panel, or a quantum dot light emitting display panel, etc., but the embodiments of the present disclosure are not limited thereto. For example, in an organic light emitting display panel, a pixel may include an organic light emitting device, such as an organic light emitting layer, etc., and the pixel may be a sub-pixel for realizing any one of a plurality of colors constituting a color image. Therefore, the "device" according to an exemplary embodiment of the present disclosure may include a set of devices (or a set of equipment) or a set of electronic devices, such as a laptop computer, a television (TV), a computer monitor, a device including automotive equipment or other types of vehicle equipment, or a mobile electronic device (such as a smart phone, an electronic tablet, etc.), etc., which is a complete product (or a final product) including a display panel (such as an organic light emitting display panel, a liquid crystal display panel, etc.).

[0211] The analog sign may be an advertising sign, a poster, a bulletin board, etc. The analog sign may include contents such as characters, pictures, and signs. The contents may be provided on the passive vibration member 100 of the vibration driving device to be visible. For example, the contents may be directly attached to the passive vibration member 100, and the contents may be printed on a medium such as paper and the medium may be attached to the passive vibration member 100.

[0212] The passive vibration member 100 according to an exemplary embodiment of the present disclosure may vibrate based on the driving (or vibration) of one or more vibration generating devices 200. For example, the passive vibration member 100 may generate one or more of vibration and sound based on the driving of one or more vibration generating devices 200.

[0213] According to an exemplary embodiment of the present disclosure, the passive vibration member 100 may be a display panel including a display area (or screen) having a plurality of pixels for implementing black-and-white or color images. Accordingly, the passive vibration member 100 may generate one or more of vibration and sound based on the driving of one or more vibration generating devices 200. For example, when an image is displayed on the display area, the passive vibration member 100 may vibrate based on the vibration of the vibration generating device 200, and thus may generate or output sound synchronized with the image displayed on the display area. For example, the passive vibration member 100 according to an exemplary embodiment of the present disclosure may be a vibrating object, a display member, a display panel, a sign panel, a passive vibration plate, a front cover, a front member, a vibration panel, a sound panel, a passive vibration panel, a sound output plate, a sound vibration plate, or a video screen, but the embodiments of the present disclosure are not limited thereto.

[0214] According to another exemplary embodiment of the present disclosure, the passive vibration member 100 may be a vibration plate including a metallic material or a non-metallic material (or a composite non-metallic material) having material characteristics suitable for outputting sound based on the vibration of each of one or more vibration generating devices 200. For example, the passive vibration member 100 may be a vibration plate including one or more of metals, plastics, papers, fibers, cloths, woods, leathers, rubbers, glasses, carbons, and mirrors. For example, the paper may be a cone paper of a speaker. For example, the cone paper may be pulp or foam plastic, but the embodiments of the present disclosure are not limited thereto.

[0215] The passive vibration member 100 according to another exemplary embodiment of the present disclosure may include a display panel or may include a non-display panel including pixels for displaying an image. For example, the passive vibration member 100 may include one or more display panels including pixels configured to display an image, a screen panel for projecting an image from a display device, a lighting panel, a light emitting diode lighting panel, an organic light emitting lighting panel, an inorganic light emitting lighting panel, a sign panel, an interior material of a vehicle, an exterior material of a vehicle, a vehicle window glass, an interior material of a vehicle seat, a ceiling material of a building, an interior material of a building, a building window glass, an interior material of an airplane, an airplane window glass, and a mirror, but the embodiments of the present disclosure are not limited thereto. For example, the non-display panel may be a light emitting diode lighting panel (or device), an organic light emitting diode lighting panel (or device), or an inorganic light emitting diode lighting panel (or device), but the embodiments of the present disclosure are not limited thereto.

[0216] One or more vibration generating devices 200 may be configured to vibrate the passive vibration member 100. One or more vibration generating devices 200 may be configured to be connected to the rear surface 100a of the passive vibration member 100 through the connecting member 150. Accordingly, one or more vibration generating devices 200 may vibrate the passive vibration member 100, so that one or more of vibration and sound may be generated or output based on the vibration of the passive vibration member 100.

[0217] One or more vibration generating devices 200 may include one or more of the vibration devices described above with reference to Figures 1 to 1 7. Accordingly, the description of the vibration devices provided with reference to Figures 1 to 1 7 may be applicable to the vibration devices referred to with reference to Figure 18 and Figure 19 shown. Accordingly, the same reference numerals may refer to the same elements, and their repeated description may be omitted.

[0218] The connecting member 150 may be disposed between at least a part of the vibration generating device 200 and the passive vibration member 100. The connecting member 150 may be connected between at least a part of the vibration generating device 200 and the passive vibration member 100. According to an exemplary embodiment of the present disclosure, the connecting member 150 may be connected between the central portion of the vibration generating device 200 other than the peripheral portion (or edge portion) and the passive vibration member 100. For example, the connecting member 150 may be connected between the central portion of the vibration generating device 200 and the passive vibration member 100 based on a partial attachment method. The central portion (or intermediate portion) of the vibration generating device 200 may be the center of vibration. Accordingly, the vibration of the vibration generating device 200 may be effectively transmitted to the passive vibration member 100 through the connecting member 150. The peripheral portion (or edge portion) of the vibration generating device 200 may be in a state where the peripheral portion (or edge portion) of the vibration generating device 200 rises from each of the connecting member 150 and the passive vibration member 100 without being connected to the connecting member 150 and / or the passive vibration member 100. Accordingly, when the vibration generating device 200 performs bending vibration (or bending vibration), the vibration of the edge portion of the vibration generating device 200 cannot be reduced (prevented) by the connecting member 150 and / or the passive vibration member 100. Accordingly, the vibration width (or displacement width or driving width) of the vibration generating device 200 may be increased. Accordingly, the vibration width (or displacement width or driving width) of the passive vibration member 100 based on the vibration of the vibration generating device 200 may be increased, so that the sound characteristics and sound pressure level characteristics of the bass band generated based on the vibration of the passive vibration member 100 may be further enhanced.

[0219] According to another exemplary embodiment of the present disclosure, the connecting member 150 may be connected or attached to the entire front surface of one or more vibration generating devices 200 and the rear surface 100a of the passive vibration member 100 based on a front attachment method.

[0220] The connecting member 150 according to an exemplary embodiment of the present disclosure may include a material including an adhesive layer that has good adhesion or bonding force with respect to the rear surface of the passive vibration member 100 or the display panel and each of the one or more vibration generating devices 200. For example, the connecting member 150 may include a foam pad, a double-sided tape, an adhesive, etc., but the embodiments of the present disclosure are not limited thereto. For example, the adhesive layer of the connecting member 150 may include an epoxy resin, an acrylic resin, a silicone resin, or a polyurethane, but the embodiments of the present disclosure are not limited thereto. For example, the adhesive layer of the connecting member 150 may include an acrylic resin-based material having relatively better adhesion and high hardness compared to a polyurethane-based material. Accordingly, the vibration of each of the one or more vibration generating devices 200 may be well transmitted to the passive vibration member 100.

[0221] The vibration driving device according to an exemplary embodiment of the present disclosure may further include a support member 300 and a coupling member 350.

[0222] The support member 300 may be disposed on the rear surface 100a of the passive vibration member 100. The support member 300 may be disposed on the rear surface 100a of the passive vibration member 100 to cover the vibration generating device 200. The support member 300 may be disposed on the rear surface 100a of the passive vibration member 100 to cover the entire rear surface 100a of the passive vibration member 100 and the vibration generating device 200. For example, the support member 300 may have the same size as the passive vibration member 100. For example, the support member 300 may cover the rear surface 100a of the passive vibration member 100 with the vibration generating device 200 and a gap space GS therebetween. For example, the support member 300 may cover the entire rear surface 100a of the passive vibration member 100 with the vibration generating device 200 and a gap space GS therebetween. The gap space GS may be provided by the coupling member 350 disposed between the passive vibration member 100 and the support member 300. The gap space GS may be referred to as an air gap, a receiving space, a vibration space, and a speaker box, but the embodiments of the present disclosure are not limited thereto.

[0223] The support member 300 may include one or more of a glass material, a metal material, and a plastic material. The support member 300 may have a laminated structure in which one or more of a glass material, a metal material, and a plastic material are laminated.

[0224] Each of the passive vibration member 100 and the support member 300 may have a square or rectangular shape, but embodiments of the present disclosure are not limited thereto. For example, each of the passive vibration member 100 and the support member 300 may have a polygonal shape, a non-polygonal shape, a circular shape, or an elliptical shape. For example, in the case where the vibration driving device according to an exemplary embodiment of the present disclosure is applied to a sound device or a speaker, each of the passive vibration member 100 and the support member 300 may have a rectangular shape in which the length of the long side is more than twice the length of the short side, but embodiments of the present disclosure are not limited thereto.

[0225] The coupling member 350 may be configured to be connected between the rear edge portion (or rear peripheral portion) of the passive vibration member 100 and the front edge portion (or front peripheral portion) of the support member 300, and thus, a clearance space GS may be provided between the passive vibration member 100 and the support member 300 facing each other.

[0226] The coupling member 350 according to an embodiment of the present disclosure may include an elastic material having an adhesive property and capable of compression and decompression. For example, the coupling member 350 may include a double-sided tape, a single-sided tape, or a double-sided adhesive foam pad, but embodiments of the present disclosure are not limited thereto. For example, the coupling member 350 may include an elastic pad having an adhesive property and capable of compression and decompression, such as a rubber pad or a silicone pad. For example, the coupling member 350 may be formed of an elastomer.

[0227] As another example, the support member 300 may further include a side wall portion that supports the rear edge portion (or rear peripheral portion) of the passive vibration member 100. The side wall portion of the support member 300 may protrude or bend from the front edge portion (or front peripheral portion) of the support member 300 toward the rear edge portion (or rear peripheral portion) of the passive vibration member 100, and thus, a clearance space GS may be provided between the passive vibration member 100 and the support member 300. In this case, the coupling member 350 may be configured to be connected between the side wall portion of the support member 300 and the rear edge portion (or rear peripheral portion) of the passive vibration member 100. Accordingly, the support member 300 may cover one or more vibration generating devices 200, and may support the rear surface 100a of the passive vibration member 100. For example, the support member 300 may cover one or more vibration generating devices 200, and may support the rear edge portion (or rear peripheral portion) of the passive vibration member 100.

[0228] As another example, the passive vibration member 100 may further include a side wall portion that is connected to the front edge portion (or front peripheral portion) of the support member 300. The side wall portion of the passive vibration member 100 may protrude or bend from the rear edge portion (or rear peripheral portion) of the passive vibration member 100 toward the front edge portion (or front peripheral portion) of the support member 300. Thus, a clearance space GS may be provided between the passive vibration member 100 and the support member 300. The passive vibration member 100 may increase its stiffness through its side wall portion. In this case, the coupling member 350 may be configured to be connected between the side wall portion of the passive vibration member 100 and the rear edge portion (or rear peripheral portion) of the support member 300. Thus, the support member 300 may cover one or more vibration generating devices 200 and may support the rear surface 100a of the passive vibration member 100. For example, the support member 300 may cover one or more vibration generating devices 200 and may support the rear edge portion (or rear peripheral portion) of the passive vibration member 100.

[0229] The vibration driving device according to an exemplary embodiment of the present disclosure may further include one or more housings 250.

[0230] The housing 250 may be connected or coupled to the rear edge portion (or rear peripheral portion) of the passive vibration member 100 to separately cover one or more vibration generating devices 200. For example, the housing 250 may be connected or coupled to the rear surface 100a of the passive vibration member 100 through the coupling member 251. The housing 250 may form a sealed space that covers or surrounds one or more vibration generating devices 200 on the rear surface 100a of the passive vibration member 100. For example, the housing 250 may be a sealing member, a sealing cap, a sealing box, or a speaker box, but the embodiments of the present disclosure are not limited thereto. The sealed space may be an air gap, a vibration space, a sound space, or a speaker box, but the embodiments of the present disclosure are not limited thereto.

[0231] The housing 250 may include one or more materials of a metal material and a non-metal material (or a composite non-metal material). For example, the housing 250 may include one or more materials of metal, plastic, and wood, but the embodiments of the present disclosure are not limited thereto.

[0232] According to an exemplary embodiment of the present disclosure, the housing 250 may maintain a constant impedance component based on the air acting on the passive vibration member 100 when the passive vibration member 100 or the vibration generating device 200 vibrates. For example, the air around the passive vibration member 100 may resist the vibration of the passive vibration member 100 and may act as an impedance component having resistance and reactance components that vary based on frequency. Accordingly, the housing 250 may configure (or form) a sealed space around one or more vibration generating devices 200 on the rear surface 100a of the passive vibration member 100, and thus, may utilize the air to maintain a constant impedance component (or air impedance or elastic impedance) acting on the passive vibration member 100, thereby enhancing the sound characteristics and / or sound pressure level characteristics of the bass band and the sound quality of the treble band.

[0233] A vibration device according to an exemplary embodiment of the present disclosure and a vibration driving device including the vibration device will be described below.

[0234] A vibration device according to one or more embodiments of the present disclosure may include: a vibration generating unit including a plurality of vibration units; and a connection layer welded between the plurality of vibration units. The connection layer contains a conductive material.

[0235] According to one or more embodiments of the present disclosure, the connection layer may include a welding foil welded by one or more of heat and ultrasonic waves.

[0236] According to one or more embodiments of the present disclosure, the plurality of vibration units may include a first vibration unit and a second vibration unit stacked vertically, and the connection layer may be located between the first vibration unit and the second vibration unit.

[0237] According to one or more embodiments of the present disclosure, each of the first vibration unit and the second vibration unit may include: a first electrode layer; a second electrode layer; and a vibration layer located between the first electrode layer and the second electrode layer, the vibration layer containing a piezoelectric material. The connection layer may be located between the second electrode layer of the first vibration unit and the first electrode layer of the second vibration unit.

[0238] According to one or more embodiments of the present disclosure, the vibration layers of the first vibration unit and the second vibration unit may have different polarization directions.

[0239] According to one or more embodiments of the present disclosure, the vibration device may further include: a first cover member connected to the first surface of the vibration generating unit; a second cover member connected to the second surface of the vibration generating unit; a first adhesive layer located between the vibration generating unit and the first cover member; and a second adhesive layer located between the vibration generating unit and the second cover member.

[0240] According to one or more embodiments of the present disclosure, the vibration device may further include signal lines received between the first cover member and the second cover member and including a first signal line, a second signal line, and a third signal line electrically connected to the vibration generating unit. The first signal line may be connected to the second electrode layer of the second vibration unit between the second vibration unit and the second cover member, the second signal line may be connected to the connection layer between the first vibration unit and the second vibration unit, and the third signal line may be connected to the first electrode layer of the first vibration unit between the first vibration unit and the first cover member.

[0241] According to one or more embodiments of the present disclosure, the second vibration unit may further include a first auxiliary electrode layer and a second auxiliary electrode layer, which are disposed on the second surface of the vibration layer in a manner electrically disconnected from each other and electrically disconnected from the second electrode layer. The first auxiliary electrode layer may be electrically connected to the connection layer, and the second auxiliary electrode layer may be electrically connected to the first electrode layer of the first vibration unit.

[0242] According to one or more embodiments of the present disclosure, the vibration device may further include signal lines received between the first cover member and the second cover member and including a first signal line, a second signal line, and a third signal line electrically connected to the vibration generating unit. The first signal line may be connected to the second electrode layer of the second vibration unit between the second vibration unit and the second cover member, the second signal line may be connected to the first auxiliary electrode layer between the second vibration unit and the second cover member, and the third signal line may be connected to the second auxiliary electrode layer between the second vibration unit and the second cover member.

[0243] According to one or more embodiments of the present disclosure, the vibration device may further include: a first connection portion disposed in the vibration layer of the second vibration unit; a second connection portion disposed in the vibration layer of the second vibration unit and spaced apart from the first connection portion; and a third connection portion disposed in the vibration layer of the first vibration unit. The first connection portion may connect the first auxiliary electrode layer to the connection layer, and the second connection portion and the third connection portion may connect the second auxiliary electrode layer to the first electrode layer of the first vibration unit.

[0244] According to one or more embodiments of the present disclosure, each of the first vibration unit and the second vibration unit may include an electrode layer and a vibration layer located between the first vibration unit and the second vibration unit, and the vibration layer includes a piezoelectric material. The connection layer may be located between the vibration layer of the first vibration unit and the vibration layer of the second vibration unit.

[0245] According to one or more embodiments of the present disclosure, the opposing surfaces of the vibration layer of the first vibration unit and the vibration layer of the second vibration unit may be surface-treated by one of plasma treatment, corona discharge, mechanical polishing, or chemical bonding using a silane coupling agent.

[0246] According to one or more embodiments of the present disclosure, the vibration device may further include: a first cover member connected to a first surface of the vibration generating portion; a second cover member connected to a second surface of the vibration generating portion; a first adhesive layer located between the vibration generating portion and the first cover member; and a second adhesive layer located between the vibration generating portion and the second cover member.

[0247] According to one or more embodiments of the present disclosure, the second vibration portion may further include a first auxiliary electrode layer and a second auxiliary electrode layer, which are disposed on the second surface of the vibration layer in a manner electrically disconnected from each other and are electrically disconnected from the electrode layer of the second vibration portion. The first auxiliary electrode layer may be electrically connected to the connection layer, and the second auxiliary electrode layer may be electrically connected to the electrode layer on the first surface of the first vibration portion.

[0248] According to one or more embodiments of the present disclosure, the vibration device may further include a signal cable, which is housed between the first cover member and the second cover member and includes a first signal line, a second signal line, and a third signal line electrically connected to the vibration generating portion. The first signal line may be connected to the electrode layer of the second vibration portion between the second vibration portion and the second cover member, the second signal line may be connected to the first auxiliary electrode layer between the second vibration portion and the second cover member, and the third signal line may be connected to the second auxiliary electrode layer between the second vibration portion and the second cover member.

[0249] According to one or more embodiments of the present disclosure, the vibration device may further include: a first connection portion disposed in the vibration layer of the second vibration portion; a second connection portion disposed in the vibration layer of the second vibration portion and spaced apart from the first connection portion; and a third connection portion disposed in the vibration layer of the first vibration portion. The first connection portion may connect the first auxiliary electrode layer to the connection layer, and the second connection portion and the third connection portion may connect the second auxiliary electrode layer to the electrode layer of the first vibration portion.

[0250] A method of manufacturing a vibration device according to one or more embodiments of the present disclosure may include: a step of disposing a vibration generating portion including a plurality of vibration portions; a step of disposing a connection layer welded between the plurality of vibration portions; a step of disposing signal lines electrically connected to the plurality of vibration portions; and a step of disposing a first cover member and a second cover member on a first surface and a second surface of the vibration generating portion, respectively. The connection layer may contain a conductive material.

[0251] According to one or more embodiments of the present disclosure, the connection layer may include a welding foil welded by one or more of heat and ultrasonic waves.

[0252] According to one or more embodiments of the present disclosure, the plurality of vibration portions may include a first vibration portion and a second vibration portion stacked vertically, and the connection layer may be located between the first vibration portion and the second vibration portion.

[0253] According to one or more embodiments of the present disclosure, each of the first vibration part and the second vibration part may include: a first electrode layer; a second electrode layer; and a vibration layer located between the first electrode layer and the second electrode layer, the vibration layer containing a piezoelectric material. A connection layer may be located between the second electrode layer of the first vibration part and the first electrode layer of the second vibration part.

[0254] According to one or more embodiments of the present disclosure, the steps of configuring the connection layer and the steps of configuring the signal cable may be simultaneously performed at a temperature below 400°C by using a pressure lamination process.

[0255] According to one or more embodiments of the present disclosure, the steps of configuring the connection layer, the steps of configuring the signal cable, and the steps of configuring the first cover member and the second cover member may be simultaneously performed at a temperature below 200°C by using a low-temperature bonding process.

[0256] According to one or more embodiments of the present disclosure, the method may further include: after the low-temperature bonding process, a step of polarizing the plurality of vibration parts; and a step of applying an ultrasonic signal to the plurality of vibration parts. The connection layer may be welded by heat and / or ultrasonic waves generated when an ultrasonic signal is applied to the plurality of vibration parts.

[0257] According to one or more embodiments of the present disclosure, the signal cable may be housed between the first cover member and the second cover member and include a first signal line, a second signal line, and a third signal line. The first signal line may be connected to the second electrode layer of the second vibration part between the second vibration part and the second cover member, the second signal line may be connected to the connection layer between the first vibration part and the second vibration part, and the third signal line may be connected to the first electrode layer of the first vibration part between the first vibration part and the first cover member.

[0258] According to one or more embodiments of the present disclosure, the method may further include a step of forming a first auxiliary electrode layer and a second auxiliary electrode layer of the second vibration part, the first auxiliary electrode layer and the second auxiliary electrode layer being disposed on the second surface of the vibration layer in an electrically disconnected manner from each other and being electrically disconnected from the second electrode layer. The first auxiliary electrode layer may be electrically connected to the connection layer, and the second auxiliary electrode layer may be electrically connected to the first electrode layer of the first vibration part.

[0259] According to one or more embodiments of the present disclosure, the steps of configuring the connection layer may be performed at a temperature below 400°C by using a pressure lamination process.

[0260] According to one or more embodiments of the present disclosure, a signal cable may include a first signal line, a second signal line, and a third signal line received between a second surface of a vibration generating unit and a second cover member. The first signal line may be connected to a second electrode layer of the second vibration unit between the second vibration unit and the second cover member, the second signal line may be connected to a first auxiliary electrode layer between the second vibration unit and the second cover member, and the third signal line may be connected to a second auxiliary electrode layer between the second vibration unit and the second cover member.

[0261] According to one or more embodiments of the present disclosure, each of the first vibration unit and the second vibration unit may include: an electrode layer; and a vibration layer located between the first vibration unit and the second vibration unit, the vibration layer including a piezoelectric material. A connection layer may be located between the vibration layer of the first vibration unit and the vibration layer of the second vibration unit.

[0262] According to one or more embodiments of the present disclosure, before the step of disposing a connection layer between a plurality of vibration units, the method may further include a step of surface-treating respective surfaces of the vibration layer of the first vibration unit and the vibration layer of the second vibration unit facing each other by one of plasma treatment, corona discharge, mechanical polishing, or chemical bonding using a silane coupling agent.

[0263] According to one or more embodiments of the present disclosure, the method may further include a step of forming a first auxiliary electrode layer and a second auxiliary electrode layer of the second vibration unit, the first auxiliary electrode layer and the second auxiliary electrode layer being disposed on a second surface of the vibration layer in a manner electrically disconnected from each other and electrically disconnected from the electrode layer of the second vibration unit. The first auxiliary electrode layer may be electrically connected to the connection layer, and the second auxiliary electrode layer may be electrically connected to the first electrode layer on a first surface of the first vibration unit.

[0264] According to one or more embodiments of the present disclosure, the step of disposing the connection layer may be performed at a temperature of 400 °C or lower by using a pressure lamination process.

[0265] According to one or more embodiments of the present disclosure, a signal cable may include a first signal line, a second signal line, and a third signal line received between a second surface of a vibration generating unit and a second cover member. The first signal line may be connected to an electrode layer of the second vibration unit between the second vibration unit and the second cover member, the second signal line may be connected to a first auxiliary electrode layer between the second vibration unit and the second cover member, and the third signal line may be connected to a second auxiliary electrode layer between the second vibration unit and the second cover member.

[0266] A vibration driving device according to one or more embodiments of the present disclosure may include: a passive vibration member; a vibration generating device connected to the passive vibration member to vibrate the passive vibration member. The vibration generating device includes a vibration device. The vibration device may include a vibration generating portion having a plurality of vibration portions and a connection layer welded between the plurality of vibration portions. The connection layer may contain a conductive material.

[0267] According to one or more embodiments of the present disclosure, the vibration driving device further includes a housing provided on the rear surface of the passive vibration member.

[0268] According to one or more embodiments of the present disclosure, the passive vibration member may include one or more of a vibration plate, a display panel including pixels for displaying an image, a screen panel on which an image is projected from a display device, a light emitting diode lighting panel, an organic light emitting lighting panel, an inorganic light emitting lighting panel, a sign panel, an interior material of a vehicle, an exterior material of a vehicle, a glass window of a vehicle, an interior material of a seat of a vehicle, a ceiling material of a vehicle, a ceiling material of a building, an interior material of a building, a glass window of a building, an interior material of an aircraft, a glass window of an aircraft, and a mirror. The vibration plate may contain one or more materials of metal, plastic, paper, fiber, cloth, leather, wood, rubber, glass, and carbon.

[0269] The vibration device according to one or more exemplary embodiments of the present disclosure may be applied to or included in a vibration generating device and / or a sound generating device provided in a vibration driving device. The vibration device according to one or more exemplary embodiments of the present disclosure and the vibration driving device including the vibration device may be applied to or included in a mobile device, a video phone, a smart watch, a watch phone, a wearable device, a foldable device, a rollable device, a bendable device, a flexible device, a curved surface device, a sliding device, a variable device, an electronic notebook, an e-book, a portable multimedia player (PMP), a personal digital assistant (PDA), an MP3 player, a mobile medical device, a desktop personal computer (PC), a laptop computer, a netbook computer, a workstation, a navigation device, an in-vehicle navigation device, an in-vehicle display device, an in-vehicle device, a theater device, a theater display device, a TV, a wallpaper display device, a sign device, a game console, a laptop computer, a display, a camera, a video camera, and household appliances, etc. In addition, the vibration device according to some exemplary embodiments of the present disclosure may be applied to or included in an organic light emitting lighting device or an inorganic light emitting lighting device. When the vibration device according to one or more exemplary embodiments of the present disclosure is applied to or included in a lighting device, the vibration device may function as a lighting device and a speaker. In addition, when the vibration device according to some exemplary embodiments of the present disclosure is applied to or included in a mobile device or the like, the vibration device may be one or more of a speaker, a receiver, and a haptic device, but the embodiments of the present disclosure are not limited thereto.

[0270] It will be apparent to those skilled in the art that various modifications and variations can be made to the present disclosure without departing from the scope of the present disclosure. Accordingly, the present disclosure is intended to cover modifications and variations of the present disclosure provided they fall within the scope of the appended claims and their equivalents.

Claims

1. A vibration device, comprising: a vibration generating unit, the vibration generating unit comprising a plurality of vibration units; as well as a connection layer, the connection layer being welded between the plurality of vibration parts, Wherein, the connecting layer comprises a conductive material.

2. The vibration device according to claim 1, wherein The connecting layer comprises a welding foil welded by one or more of heat and ultrasound.

3. The vibration device according to claim 1, wherein The plurality of vibration parts include a first vibration part and a second vibration part which are vertically stacked, and Wherein, the connection layer is located between the first vibration part and the second vibration part.

4. The vibration device according to claim 3, wherein Each of the first vibration part and the second vibration part includes: a first electrode layer; a second electrode layer; and a vibration layer, the vibration layer being located between the first electrode layer and the second electrode layer, the vibration layer comprising a piezoelectric material, and The connecting layer is located between the second electrode layer of the first vibration part and the first electrode layer of the second vibration part.

5. The vibration device according to claim 4, further comprising: a first cover member connected to a first surface of the vibration generating portion; a second cover member connected to the second surface of the vibration generating portion; a first adhesive layer located between the vibration generating portion and the first cover member; as well as A second adhesive layer is located between the vibration generating portion and the second cover member.

6. The vibration device according to claim 5, further comprising a signal cable, the signal cable being housed between the first cover member and the second cover member and comprising a first signal line, a second signal line, and a third signal line electrically connected to the vibration generating portion, in, The first signal line is connected to the second electrode layer of the second vibrating portion between the second vibrating portion and the second cover member. wherein the second signal line is connected to the connection layer between the first vibration part and the second vibration part, and The third signal line is connected to the first electrode layer of the first vibration part between the first vibration part and the first cover member.

7. The vibration device according to claim 5, wherein The second vibration part further includes a first auxiliary electrode layer and a second auxiliary electrode layer, wherein the first auxiliary electrode layer and the second auxiliary electrode layer are arranged on the second surface of the vibration layer in a manner electrically disconnected from each other and are electrically disconnected from the second electrode layer respectively. Wherein, the first auxiliary electrode layer is electrically connected to the connection layer, and The second auxiliary electrode layer is electrically connected to the first electrode layer of the first vibration part.

8. The vibration device according to claim 7, further comprising a signal cable, the signal cable being housed between the first cover member and the second cover member and comprising a first signal line, a second signal line, and a third signal line electrically connected to the vibration generating portion, in, The first signal line is connected to the second electrode layer of the second vibrating portion between the second vibrating portion and the second cover member. wherein the second signal line is connected to the first auxiliary electrode layer between the second vibration portion and the second cover member, and The third signal line is connected to the second auxiliary electrode layer between the second vibration part and the second cover member.

9. The vibration device according to claim 3, wherein: Each of the first vibration part and the second vibration part includes: an electrode layer; and a vibration layer, the vibration layer being located between the first vibration part and the second vibration part, the vibration layer comprising a piezoelectric material, and The connection layer is located between the vibration layer of the first vibration part and the vibration layer of the second vibration part.

10. The vibration device according to claim 9, further comprising: a first cover member connected to a first surface of the vibration generating portion; a second cover member connected to the second surface of the vibration generating portion; a first adhesive layer located between the vibration generating portion and the first cover member; as well as A second adhesive layer is located between the vibration generating portion and the second cover member.

11. The vibration device according to claim 10, wherein The second vibration part further includes a first auxiliary electrode layer and a second auxiliary electrode layer, wherein the first auxiliary electrode layer and the second auxiliary electrode layer are arranged on the second surface of the vibration layer in a manner electrically disconnected from each other and are electrically disconnected from the electrode layer of the second vibration part, respectively. Wherein, the first auxiliary electrode layer is electrically connected to the connection layer, and The second auxiliary electrode layer is electrically connected to the electrode layer on the first surface of the first vibration part.

12. The vibration device according to claim 11, further comprising a signal cable, the signal cable being housed between the first cover member and the second cover member and comprising a first signal line, a second signal line, and a third signal line electrically connected to the vibration generating portion, in, The first signal line is connected to the electrode layer of the second vibrating portion between the second vibrating portion and the second cover member. wherein the second signal line is connected to the first auxiliary electrode layer between the second vibration portion and the second cover member, and The third signal line is connected to the second auxiliary electrode layer between the second vibration part and the second cover member.

13. A method for manufacturing a vibration device, the method comprising: a step of configuring a vibration generating unit including a plurality of vibration units; a step of configuring a connection layer welded between the plurality of vibration parts; a step of configuring a signal cable electrically connected to the plurality of vibration parts; as well as The step of respectively disposing a first cover member and a second cover member on the first surface and the second surface of the vibration generating portion, Wherein, the connecting layer comprises a conductive material.

14. The method for manufacturing a vibration device according to claim 13, wherein: The connecting layer comprises a welding foil welded by one or more of heat and ultrasound.

15. The method for manufacturing a vibration device according to claim 13, wherein: The plurality of vibration parts include a first vibration part and a second vibration part which are vertically stacked, and the connection layer is located between the first vibration part and the second vibration part.

16. The method for manufacturing a vibration device according to claim 15, wherein: Each of the first vibration part and the second vibration part includes: a first electrode layer; a second electrode layer; and a vibration layer, the vibration layer being located between the first electrode layer and the second electrode layer, the vibration layer comprising a piezoelectric material, and The connecting layer is located between the second electrode layer of the first vibration part and the first electrode layer of the second vibration part.

17. The method for manufacturing a vibration device according to claim 13, wherein: The step of configuring the connection layer and the step of configuring the signal cable are simultaneously performed at a temperature of 400° C. or less by using a pressure lamination process.

18. The method for manufacturing a vibration device according to claim 16, wherein: The step of configuring the connection layer, the step of configuring the signal cable, and the step of configuring the first cover member and the second cover member are simultaneously performed at a temperature of 200° C. or less by using a low temperature bonding process.

19. A vibration drive device, comprising: Passive vibrating components; a vibration generating device connected to the passive vibration member to vibrate the passive vibration member, Wherein, the vibration generating device comprises the vibration device according to any one of claims 1 to 12.

20. The vibration driven device according to claim 19, wherein: The passive vibration member includes one or more of a vibration plate, a display panel including pixels displaying an image, a screen panel from which an image is projected, a light emitting diode lighting panel, an organic light emitting lighting panel, an inorganic light emitting lighting panel, a signage panel, an interior material of a vehicle, an exterior material of a vehicle, a glass window of a vehicle, an interior material of a seat of a vehicle, a ceiling material of a vehicle, a ceiling material of a building, an interior material of a building, a glass window of a building, an interior material of an aircraft, a glass window of an aircraft, and a mirror, and Wherein, the vibration plate comprises one or more materials selected from the group consisting of metal, plastic, paper, fiber, cloth, leather, wood, rubber, glass and carbon.

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