Cutting device and method for processing multi-layer thermoelectric separation copper substrate
By designing a copper substrate cutting device including a cleaning brush, a sponge cooling device and an automatic grinding plate, the problems of inaccurate cutting of copper substrates, excessive saw blade temperature and needing external grinding after cutting are solved in the prior art, and efficient and accurate copper substrate cutting and automatic grinding are achieved.
Patent Information
- Application Number
- CN202510717764.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-30
- Publication Date
- 2025-07-01
- Estimated Expiration
- 2045-05-30
AI Technical Summary
The existing copper substrate cutting devices lack a cleaning mechanism, which causes impurities on the surface of the copper substrate to be embedded in the saw blade, affecting the cutting accuracy; at the same time, there is a lack of a cooling mechanism, which leads to an increase in the saw blade temperature and thermal deformation of the copper substrate; an external polishing device is also required after cutting, which affects efficiency.
A cutting device for processing multi-layer thermoelectric separation copper substrate is designed, including a base plate, a base box and a cutting mechanism. There are moving parts and cleaning brushes in the bottom box to clean impurities on the surface of the copper substrate; at the same time, the sponge comes into contact with the cutting saw blade and cools down through cooling water; after cutting, the grinding plate is automatically polished to ensure smooth cuts.
The cleaning brush cleans the impurities on the surface of the copper substrate, which improves the cutting accuracy; the sponge cooling device prevents the saw blade temperature from rising and avoids thermal deformation of the copper substrate; the automatic grinding function of the grinding plate improves the cutting efficiency and reduces the demand for external equipment.
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Figure CN120228331A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of copper substrate cutting, and specifically to a cutting device and method for processing multi-layer thermoelectric separation copper substrates. Background Art
[0002] A multi-layer thermoelectric separation copper substrate is a circuit board applied to electronic devices, which realizes efficient heat dissipation and stable electrical conduction through special structures and processes to meet the requirements of high-power electronic devices.
[0003] In order to meet the usage requirements of multi-layer thermoelectric separation copper substrates, after the copper substrates are produced, it is usually necessary to cut the copper substrates. However, the existing copper substrate cutting devices lack a cleaning mechanism for the copper substrates before cutting. When the copper substrates are produced, processed, and transported, dust and metal debris may remain on their surfaces. If these impurities are not cleaned before cutting and cutting is directly carried out, the debris and impurities may be embedded between the saw blade teeth, changing the cutting trajectory of the saw blade, causing the cutting path to deviate, resulting in inaccurate cutting dimensions of the copper substrates. At the same time, the existing cutting devices also lack a cooling mechanism for the cutting saw blades. When the saw blades cut the copper substrates at high speed, the saw blades are in close contact with the copper substrates and generate intense friction, causing the temperature of the saw blades to rise sharply. If the saw blades are not cooled, a large amount of heat will be transferred to the copper substrates, causing the local temperature of the copper substrates to be too high, resulting in deformation of the copper substrates. At the same time, after the existing cutting devices cut the copper substrates, it is usually necessary to polish the cut edges. However, the existing cutting devices generally do not have a polishing mechanism. Therefore, after the existing cutting devices finish cutting the copper substrates, it is also necessary to polish them with an external polishing device, which is time-consuming and affects the cutting efficiency. Summary of the Invention
[0004] The purpose of the present invention is to provide a cutting device and method for processing multi-layer thermoelectric separation copper substrates, so as to solve the problems raised in the above background art.
[0005] To achieve the above purpose, the present invention provides the following technical solution: A cutting device and method for processing multi-layer thermoelectric separation copper substrates, including a bottom plate and a bottom box. It is characterized in that a placement table is fixedly connected to the outer side wall of the upper end of the bottom plate, a cutting mechanism is arranged on the placement table, a slot is opened at the bottom of the bottom box, limiting slots are opened on both sides of the bottom of the bottom box, a moving part is slidably connected inside the two limiting slots, a plurality of cleaning brushes are fixedly connected to the outer side wall of the moving part, a reset spring is arranged inside the limiting slot, the other end of the reset spring is fixedly connected to the outer side wall of the moving part, a pushing rod is fixedly connected to the outer side wall of the moving part, the pushing rod slidably penetrates through the slot to the inside of the bottom box, a driving plate is fixedly connected to the outer side wall of the pushing rod, the driving plate is located directly beside a cam, and a cooling and polishing mechanism is arranged inside the bottom box; The temperature-reducing and grinding mechanism includes two fixing members fixedly connected inside the bottom box. Trigger boxes are fixedly connected to the outer side walls of the two fixing members. The two trigger boxes are respectively located on both sides of the cutting saw blade. A moving plate is slidably connected through the interior of each of the two trigger boxes. One end of the moving plate located inside the trigger box is fixedly connected to a trigger magnet, and the end of the moving plate away from the trigger box is fixedly connected to the outer side wall of the push rod.
[0006] Preferably, a driving motor is fixedly connected to the outer side wall of the bottom box. A transmission rod is provided at the output end of the driving motor. The transmission rod rotates through to the inside of the bottom box. A cam is fixedly sleeved on the outer side wall of the transmission rod. The end of the transmission rod away from the cam is fixedly connected to a cutting saw blade, and the cutting saw blade rotates through a notch to the outside of the bottom box.
[0007] Preferably, a sponge is slidably connected through the interior of the trigger box. One end of the sponge located inside the trigger box is fixedly connected to a side plate. A plurality of pressing springs are fixedly connected to the outer side wall of the side plate. One end of each of the plurality of pressing springs away from the side plate is fixedly connected to the inner side wall of the trigger box. A contact magnet is fixedly connected to the outer side wall of the side plate, and the magnetic pole of the contact magnet is the same as that of the trigger magnet.
[0008] Preferably, a plurality of top plates are fixedly connected to the outer side wall of the trigger box. Control members are fixedly connected to the plurality of top plates. A baffle is slidably connected inside the control member. A flow hole is formed in the baffle. One end of the baffle close to the moving plate is fixedly connected to the side plate. A telescopic tube is communicated with the bottom of the control member, and the end of the telescopic tube away from the control member is communicated to the inside of the sponge.
[0009] Preferably, water delivery pipes are communicated with one ends of the plurality of control members away from the telescopic tubes.
[0010] Preferably, two limiting rods are fixedly connected inside the bottom box. Pressure springs are sleeved on the two limiting rods. An inner plate is slidably sleeved on the two limiting rods together. A grinding plate is fixedly connected to the outer side wall of the inner plate. The grinding plate passes through a notch to the outside of the bottom box. A moving plate is fixedly connected to the outer side wall of the inner plate, and the moving plate is located directly to the side of the cam.
[0011] Preferably, the cutting mechanism includes a cutting opening formed in the placement table. A vacuum cleaner is arranged inside the cutting opening. Two electric rods are fixedly connected to both sides of the placement table. A pressing plate is jointly connected to the ends of the two electric rods. Brackets are fixedly connected to both sides of the bottom plate. Slide rails are formed on the brackets. A starting motor is fixedly connected to the outer side wall of the bracket. A reciprocating lead screw is arranged at the output end of the starting motor. The reciprocating lead screw rotates through the inside of the slide rail. A transverse moving member is threadedly sleeved on the outer side wall of the reciprocating lead screw. The bottom box is fixedly connected to the bottom of the transverse moving member. A water tank is fixedly connected to the outer side wall of the bottom box. One end of the water delivery pipe away from the control member communicates with the inside of the water tank. An adding opening is formed in the side wall of the water tank.
[0012] A usage method of a cutting device for processing a multi-layer thermoelectric separation copper substrate, the method comprising the following steps; S1: During use, first, the operator places the copper substrate to be cut on the placement table. After the copper substrate is placed on the placement table, the cutting mechanism presses and fixes the copper substrate placed on the placement table. S2: After the copper substrate is pressed and fixed by the pressing plate, the cutting mechanism moves and cuts the copper substrate. S3: When cutting the copper substrate, the mechanism inside the bottom box also cleans the area to be cut of the copper substrate. S4: While cleaning the copper substrate, the mechanism inside the bottom box also cools the cutting mechanism and polishes the cut of the copper substrate.
[0013] Compared with the prior art, the beneficial effects of the present invention are: Through the arrangement of mechanisms such as the moving member, when the cutting saw blade cuts the copper substrate, multiple cleaning brushes on the moving member clean the area to be cut of the copper substrate, preventing dust and metal debris from remaining on the surface of the copper substrate and affecting the cutting accuracy of the cutting saw blade. While the moving member cleans the surface of the copper substrate, under the action of transmission mechanisms such as the moving plate, the sponge contacts the surface of the cutting saw blade and continuously wipes cooling water on the surface of the cutting saw blade, preventing the cutting saw blade from generating a high temperature when cutting the copper substrate and causing thermal deformation of the copper substrate.
[0014] Through the arrangement of mechanisms such as the grinding plate, when the cutting saw blade finishes cutting the copper substrate, the grinding plate located behind the cutting saw blade grinds the cut copper substrate, avoiding burrs remaining at the cut of the copper substrate. The cutting and grinding are implemented integrally, ensuring the cutting effect while also improving the cutting efficiency of the entire device. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 is a structural schematic diagram of the present invention Figure 1 ; Figure 2 Schematic diagram of the overall side structure of the present invention; Figure 3 Schematic plan view of the present invention; Figure 4 Schematic diagram of the partial structure of the present invention Figure 1 ; Figure 5 Schematic diagram of the partial structure of the present invention Figure 2 ; Figure 6 Schematic diagram of the bottom box structure of the present invention Figure 1 ; Figure 7 Schematic diagram of the bottom box structure of the present invention Figure 2 ; Figure 8 Schematic diagram of the internal structure of the trigger box of the present invention; Figure 9 Schematic diagram of the partial structure of the present invention Figure 3 ; Figure 10 Schematic diagram of the partial structure of the present invention Figure 4 。
[0016] In the drawings, the list of components represented by each reference numeral is as follows: 1. bottom plate; 2. bracket; 3. placement table; 4. cutting opening; 5. starting motor; 6. reciprocating lead screw; 7. transverse moving member; 8. electric rod; 9. pressing plate; 10. bottom box; 11. water tank; 12. cutting saw blade; 13. notch; 14. grinding plate; 15. limiting groove; 16. return spring; 17. moving member; 18. cleaning brush; 19. pushing rod; 20. fixing member; 21. water delivery pipe; 22. trigger box; 23. moving plate; 24. transmission rod; 25. cam; 26. driving plate; 27. trigger magnet; 28. contact magnet; 29. side plate; 30. pressing spring; 31. sponge; 32. top plate; 33. control member; 34. telescopic pipe; 35. baffle; 36. through hole; 37. inner plate; 38. pressure spring; 39. limiting rod; 40. moving plate; 41. driving motor. Detailed implementation manners
[0017] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.
[0018] Example 1: Refer to Figures 1-10, A cutting device for processing a multi-layer thermoelectric separation copper substrate, including a bottom plate 1 and a bottom box 10. A placement table 3 is fixedly connected to the outer side wall of the upper end of the bottom plate 1. A cutting mechanism is arranged on the placement table 3. The cutting mechanism includes a cutting opening 4 opened on the placement table 3. A dust collector is arranged inside the cutting opening 4. Two electric rods 8 are fixedly connected to both sides of the placement table 3. A pressing plate 9 is jointly connected to the ends of the two electric rods 8. Brackets 2 are fixedly connected to both sides of the bottom plate 1. Slide rails are opened on the brackets 2. A starting motor 5 is fixedly connected to the outer side wall of the bracket 2. The output end of the starting motor 5 is provided with a reciprocating lead screw 6. The reciprocating lead screw 6 rotates through to the inside of the slide rail. A transverse moving member 7 is threadedly sleeved on the outer side wall of the reciprocating lead screw 6. The bottom box 10 is fixedly connected to the bottom of the transverse moving member 7. A water tank 11 is fixedly connected to the outer side wall of the bottom box 10. One end of the water delivery pipe 21 far from the control member 33 communicates with the inside of the water tank 11. An adding port is opened on the side wall of the water tank 11.
[0019] A notch 13 is opened at the bottom of the bottom box 10. Limiting grooves 15 are opened on both sides of the bottom of the bottom box 10. A moving member 17 is jointly slidably connected inside the two limiting grooves 15. A plurality of cleaning brushes 18 are fixedly connected to the outer side wall of the moving member 17. A return spring 16 is arranged inside the limiting groove 15. The other end of the return spring 16 is fixedly connected to the outer side wall of the moving member 17. A pushing rod 19 is fixedly connected to the outer side wall of the moving member 17. The pushing rod 19 slidably penetrates through the notch 13 to the inside of the bottom box 10. A driving plate 26 is fixedly connected to the outer side wall of the pushing rod 19. The driving plate 26 is located directly beside the cam 25. A temperature reduction and grinding mechanism is arranged inside the bottom box 10; The temperature reduction and grinding mechanism includes two fixing members 20 fixedly connected inside the bottom box 10. Trigger boxes 22 are fixedly connected to the outer side walls of the two fixing members 20. The two trigger boxes 22 are respectively located on both sides of the cutting saw blade 12. A moving plate 23 penetrates and is slidably connected inside each of the two trigger boxes 22. A trigger magnet 27 is fixedly connected to one end of the moving plate 23 located inside the trigger box 22. The end of the moving plate 23 far from the trigger box 22 is fixedly connected to the outer side wall of the pushing rod 19.
[0020] A driving motor 41 is fixedly connected to the outer side wall of the bottom box 10. The output end of the driving motor 41 is provided with a transmission rod 24. The transmission rod 24 rotates through to the inside of the bottom box 10. A cam 25 is fixedly sleeved on the outer side wall of the transmission rod 24. The end of the transmission rod 24 far from the cam 25 is fixedly connected to a cutting saw blade 12. The cutting saw blade 12 rotates through the notch 13 to the outside of the bottom box 10.
[0021] A sponge 31 is slidably connected through the interior of the trigger box 22. One end of the sponge 31 located inside the trigger box 22 is fixedly connected to a side plate 29. A plurality of pressing springs 30 are fixedly connected to the outer side wall of the side plate 29. One end of each of the plurality of pressing springs 30 away from the side plate 29 is fixedly connected to the inner side wall of the trigger box 22. A contact magnet 28 is fixedly connected to the outer side wall of the side plate 29, and the magnetic pole of the contact magnet 28 is the same as that of the trigger magnet 27.
[0022] In this embodiment, during use, first, the operator can place the copper substrate to be cut on the placement table 3. After the copper substrate is placed on the placement table 3, the electric rod 8 can be controlled to contract, thereby driving the pressing plate 9 to move downward to press and fix the copper substrate on the placement table 3. After the copper substrate is pressed and fixed by the pressing plate 9, at this time, the operator can turn on the starting motor 5 to drive the reciprocating lead screw 6 to rotate. When the reciprocating lead screw 6 rotates, it will drive the bottom box 10 to move from left to right through the transverse moving member 7 for reference Figure 2 When the bottom box 10 is driven by the transverse moving member 7 and the cutting saw blade 12 at its bottom is about to contact the copper substrate, at this time, the operator can turn on the driving motor 41 to drive the transmission rod 24 to rotate. When the transmission rod 24 rotates, it will drive the cam 25 to strike the driving plate 26. When the driving plate 26 is struck, it will drive the moving member 17 to move in the limiting groove 15 through the push rod 19. Under the action of the elastic force of the return spring 16 and the intermittent strike of the cam 25, the moving member 17 will drive the cleaning brush 18 to perform a reciprocating motion. When the cleaning brush 18 performs a reciprocating motion, it will scrape and clean the surface of the contacted copper substrate to prevent dust and metal debris from remaining on the surface of the copper substrate, which may affect the cutting accuracy of the subsequent cutting saw blade 12.
[0023] Embodiment Two: Refer to Figures 1-10 A plurality of top plates 32 are fixedly connected to the outer side wall of the trigger box 22. A control member 33 is fixedly connected to each of the plurality of top plates 32. A baffle 35 is slidably connected inside the control member 33. A circulation hole 36 is formed in the baffle 35. One end of the baffle 35 close to the moving plate 23 is fixedly connected to the side plate 29. A telescopic tube 34 is communicated and arranged at the bottom of the control member 33, and one end of the telescopic tube 34 away from the control member 33 is communicated to the inside of the sponge 31.
[0024] A water delivery pipe 21 is communicated with one end of each of the plurality of control members 33 away from the telescopic tube 34.
[0025] Two limiting rods 39 are fixedly connected to the inside of the bottom box 10. Pressure springs 38 are sleeved on both of the two limiting rods 39. An inner plate 37 is slidably sleeved on the two limiting rods 39 together. A grinding plate 14 is fixedly connected to the outer side wall of the inner plate 37. The grinding plate 14 penetrates through the notch 13 to the outside of the bottom box 10. A moving plate 40 is fixedly connected to the outer side wall of the inner plate 37, and the moving plate 40 is located directly to the side of the cam 25.
[0026] In this embodiment, when the moving member 17 reciprocates, while cleaning the surface of the copper substrate through the cleaning brush 18, it will also drive the moving plate 23 to move synchronously through the push rod 19. When the moving plate 23 reciprocates inside the trigger box 22, the trigger magnet 27 will come to the front side of the contact magnet 28. When the trigger magnet 27 comes to the front side of the contact magnet 28, the distance between the two becomes closer at this time. Under the repulsive magnetic force, the side plate 29 will push the sponge 31 to move away from the fixing member 20 against the elastic force of the plurality of pressing springs 30 and contact the surface of the cutting saw blade 12. When the side plate 29 pushes the sponge 31 to move away from the fixing member 20, it will also push the baffle 35 to move synchronously, so that the flow hole 36 originally located outside the control member 33 enters the control member 33. When the flow hole 36 enters the control member 33, the water in the water tank 11 conveyed by the water delivery pipe 21 will first pass through the flow hole 36 and then be conveyed to the sponge 31 through the telescopic pipe 34 for adsorption by the sponge 31. When the sponge 31 adsorbs water inside, when it contacts the surface of the cutting saw blade 12, it will wipe the adsorbed water inside the sponge 31 onto the surface of the cutting saw blade 12 to cool the cutting saw blade 12 and prevent the cutting saw blade 12 from generating high temperature when cutting the surface of the copper substrate.
[0027] Driven by the transmission rod 24, in addition to knocking the driving plate 26, the cam 25 will also knock the moving plate 40. Under the intermittent knocking of the cam 25 and the elastic force of the pressure spring 38, the inner plate 37 will drive the grinding plate 14 to reciprocate. Since the grinding plate 14 is located behind the cutting saw blade 12, after the cutting saw blade 12 finishes cutting the copper substrate, the grinding plate 14 will enter the cut made by the cutting saw blade 12 and reciprocate to grind the cut to prevent burrs from remaining on the cutting surface of the copper substrate, ensuring the cutting effect and improving the cutting efficiency of the entire device at the same time.
[0028] A method for using a cutting device for processing a multi-layer thermoelectric separation copper substrate, the method comprising the following steps; S1: During use, first, the operator places the copper substrate to be cut on the placement table 3. After the copper substrate is placed on the placement table 3, the cutting mechanism will press and fix the copper substrate placed on the placement table 3; S2: After the copper substrate is pressed and fixed by the pressing plate 9, the cutting mechanism will move and cut the copper substrate; S3: When cutting the copper substrate, the mechanism inside the bottom box 10 will also clean the area to be cut of the copper substrate; S4: While cleaning the copper substrate, the mechanism inside the bottom box 10 will also cool the cutting mechanism and grind the cut of the copper substrate.
[0029] It should be noted that since the pressing spring 30 is a damping spring, its contraction speed is normal while its rebound speed is slow. Due to the relatively fast rotation speed of the transmission rod 24, the frequency at which the cam 25 knocks on the driving plate 26 is relatively high. When the driving plate 26 causes the moving plate 23 to reciprocate at a high frequency inside the trigger box 22 through the push rod 19, the trigger magnet 27 will also intermittently be located directly beside the contact magnet 28 at an extremely high frequency. When the trigger magnet 27 moves away from directly beside the contact magnet 28 along with the moving plate 23, the pressing spring 30 with a slow rebound speed is not fast enough to spring the side plate 29 and the baffle 35 back to their original positions. And then, driven by the moving plate 23 at a high frequency, the trigger magnet 27 will come back to the side of the contact magnet 28 again. Therefore, as long as the moving plate 23 reciprocates at a high frequency inside the trigger box 22, it will continuously push the side plate 29 to move away from the fixing member 20 through the repulsive magnetic force, and correspondingly, the flow hole 36 will also always be inside the control member 33.
[0030] It should be noted that when the sponge 31 wipes the water adsorbed inside it onto the surface of the cutting saw blade 12, no obvious droplets will be left on the surface of the cutting saw blade 12. Therefore, when the cutting saw blade 12 rotates, the water will not be thrown onto the copper substrate. Moreover, when the sponge 31 contacts the cutting saw blade 12, it can also wipe the copper substrate cutting debris adhering to the surface of the cutting saw blade 12.
[0031] It should be noted that when the cutting saw blade 12 cuts the copper substrate, most of the debris will be adsorbed and collected by the vacuum cleaner at its bottom through the cutting opening 4.
[0032] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.
[0033] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A cutting device for processing a multi-layer thermoelectric separation copper substrate, comprising a bottom plate (1) and a bottom box (10), characterized in that, A placement table (3) is fixedly connected to the outer side wall of the upper end of the bottom plate (1). A cutting mechanism is arranged on the placement table (3). A notch (13) is formed in the bottom of the bottom box (10). Limiting grooves (15) are formed in both sides of the bottom of the bottom box (10). A moving member (17) is slidably connected in the two limiting grooves (15) together. A plurality of cleaning brushes (18) are fixedly connected to the outer side wall of the moving member (17). A return spring (16) is arranged in the limiting groove (15). The other end of the return spring (16) is fixedly connected to the outer side wall of the moving member (17). A push rod (19) is fixedly connected to the outer side wall of the moving member (17). The push rod (19) slidably penetrates through the notch (13) and into the interior of the bottom box (10). A driving plate (26) is fixedly connected to the outer side wall of the push rod (19). The driving plate (26) is located directly to the side of the cam (25). A temperature reduction and grinding mechanism is arranged in the bottom box (10). The temperature reduction and grinding mechanism includes two fixing members (20) fixedly connected to the interior of the bottom box (10). Trigger boxes (22) are fixedly connected to the outer side walls of the two fixing members (20). The two trigger boxes (22) are respectively located on both sides of the cutting saw blade (12). A moving plate (23) is slidably penetrated through the interior of each of the two trigger boxes (22). A trigger magnet (27) is fixedly connected to one end of the moving plate (23) located inside the trigger box (22). The end of the moving plate (23) far away from the trigger box (22) is fixedly connected to the outer side wall of the push rod (19).
2. The cutting device for processing a multi-layer thermoelectric separation copper substrate according to claim 1, wherein: A driving motor (41) is fixedly connected to the outer side wall of the bottom box (10). A transmission rod (24) is arranged at the output end of the driving motor (41). The transmission rod (24) rotatably penetrates into the interior of the bottom box (10). A cam (25) is fixedly sleeved on the outer side wall of the transmission rod (24). A cutting saw blade (12) is fixedly connected to the end of the transmission rod (24) far away from the cam (25). The cutting saw blade (12) rotatably penetrates through the notch (13) and out of the exterior of the bottom box (10).
3. A cutting device for processing a multi-layer thermoelectric separation copper substrate according to claim 1, characterized in that: A sponge (31) is slidably penetrated through the interior of the trigger box (22). A side plate (29) is fixedly connected to one end of the sponge (31) located inside the trigger box (22). A plurality of pressing springs (30) are fixedly connected to the outer side wall of the side plate (29). The ends of the plurality of pressing springs (30) far away from the side plate (29) are all fixedly connected to the inner side wall of the trigger box (22). A contact magnet (28) is fixedly connected to the outer side wall of the side plate (29). The magnetic pole of the contact magnet (28) is the same as the magnetic pole of the trigger magnet (27).
4. A cutting device for processing a multi-layer thermoelectric separation copper substrate according to claim 1, characterized in that: A plurality of top plates (32) are fixedly connected to the outer side wall of the trigger box (22). A control member (33) is fixedly connected to each of the plurality of top plates (32). A baffle (35) is slidably connected inside the control member (33). A circulation hole (36) is formed in the baffle (35). One end of the baffle (35) close to the moving plate (23) is fixedly connected to the side plate (29). A telescopic pipe (34) is communicatively connected to the bottom of the control member (33). One end of the telescopic pipe (34) away from the control member (33) is communicatively connected to the inside of the sponge (31).
5. A cutting device for processing a multi-layer thermoelectric separation copper substrate according to claim 4, characterized in that: A water delivery pipe (21) is communicatively connected to one end of each of the plurality of control members (33) away from the telescopic pipe (34).
6. The cutting device for processing a multi-layer thermoelectric separation copper substrate according to claim 1, characterized in that: Two limiting rods (39) are fixedly connected to the inside of the bottom box (10). A compression spring (38) is sleeved on each of the two limiting rods (39). An inner plate (37) is slidably sleeved on the two limiting rods (39) together. A grinding plate (14) is fixedly connected to the outer side wall of the inner plate (37). The grinding plate (14) penetrates through the notch (13) to the outside of the bottom box (10). A moving plate (40) is fixedly connected to the outer side wall of the inner plate (37). The moving plate (40) is located directly beside the cam (25).
7. A cutting device for processing a multi-layer thermoelectric separation copper substrate according to claim 5, characterized in that: The cutting mechanism includes a cutting opening (4) formed in the placing table (3). A dust collector is arranged inside the cutting opening (4). Two electric rods (8) are fixedly connected to both sides of the placing table (3). A pressing plate (9) is jointly connected to the ends of the two electric rods (8). Brackets (2) are fixedly connected to both sides of the bottom plate (1). Slide rails are formed in the brackets (2). A starting motor (5) is fixedly connected to the outer side wall of the brackets (2). A reciprocating lead screw (6) is arranged at the output end of the starting motor (5). The reciprocating lead screw (6) rotatably penetrates into the inside of the slide rail. A transverse moving member (7) is threadedly sleeved on the outer side wall of the reciprocating lead screw (6). The bottom box (10) is fixedly connected to the bottom of the transverse moving member (7). A water tank (11) is fixedly connected to the outer side wall of the bottom box (10). One end of the water delivery pipe (21) away from the control member (33) is communicatively connected to the inside of the water tank (11). An adding port is formed in the side wall of the water tank (11).
8. A method for using a cutting device for processing a multi-layer thermoelectric separation copper substrate, using the device according to any one of claims 1-7, characterized in that: The method includes the following steps; S1: During use, first, the operator places the copper substrate to be cut on the placing table (3). After the copper substrate is placed on the placing table (3), the cutting mechanism presses and fixes the copper substrate placed on the placing table (3). S2: After the copper substrate is pressed and fixed by the pressing plate (9), the cutting mechanism moves and cuts the copper substrate. S3: When cutting the copper substrate, the mechanism inside the bottom box (10) also cleans the area to be cut of the copper substrate. S4: While cleaning the copper substrate, the mechanism inside the bottom box (10) also cools the cutting mechanism and grinds the cut of the copper substrate.
Citation Information
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