Control module for magnetic suspension molecular pump and magnetic suspension molecular pump

Abstract

The invention provides a control module for a magnetic suspension molecular pump and the magnetic suspension molecular pump, the control module comprises a power board, a control board and a plurality of connecting columns which are arranged between the power board and the control board and connect the power board and the control board, the at least one stress release hole independently and partially surrounds the corresponding selected object, and the selected object is any one of the two connecting columns whose distance is less than a set threshold. According to the control module, the stress influence on the control panel caused by the height error of the connecting column can be reduced, the control panel or an internal circuit is prevented from being broken, and the use performance and the service life of the control module can be effectively improved.

Description

Technical Field

[0001] Embodiments of the present invention relate to the field of magnetic levitation molecular pumps. More specifically, the present invention relates to a control module for a magnetic levitation molecular pump and a magnetic levitation molecular pump. Background Art

[0002] Magnetic levitation molecular pumps are widely used in high-vacuum and ultra-high-vacuum environments, such as in the fields of integrated circuit manufacturing, surface analysis, and automotive testing. As a key component of a magnetic levitation molecular pump, the performance of the control module directly affects the product performance and user experience. The related control module mainly consists of a power board, a control board, and connecting columns connecting the power board and the control board. However, due to machining errors, it is difficult to ensure that the heights of the connecting columns are exactly the same. When the height error of the connecting columns is too large, it is easy to cause stress concentration and deformation of the control board, and in severe cases, fractures of the control board or internal circuits may occur, affecting the service performance and lifespan of the control module.

[0003] This section aims to provide background or context for the embodiments of the present invention stated in the claims. The descriptions herein may include concepts that can be explored, but not necessarily concepts that have been previously thought of or explored. Therefore, unless otherwise indicated herein, the content described in this section is not prior art for the specification and claims of this application, and is not admitted to be prior art merely by virtue of being included in this section. Summary of the Invention

[0004] To solve one or more of the above-mentioned technical problems, the present invention provides a control module for a magnetic levitation molecular pump and a magnetic levitation molecular pump, which can reduce the stress impact on the control board caused by the height error of the connecting columns, prevent fractures of the control board or internal circuits, and effectively improve the service performance and lifespan of the control module.

[0005] According to a first aspect of the present invention, there is provided a control module for a magnetic levitation molecular pump, which includes a power board, a control board, and a plurality of connecting columns provided between the power board and the control board and connecting the two. Among them, at least one stress relief hole is provided on the control board, and at least one of the stress relief holes independently and partially surrounds a corresponding selected object, and the selected object is any one of two connecting columns with a distance less than a set threshold.

[0006] In an optional solution, the control board includes a resin substrate with a thickness of 1.5 mm - 1.7 mm, and the set threshold is 8 mm - 12 mm.

[0007] In an optional solution, the shape of the stress relief hole is arc-shaped or U-shaped, and the geometric center of the arc-shaped or U-shaped is located on the central axis of the corresponding selected object.

[0008] In an alternative embodiment, the stress relief hole is arc-shaped, with a central angle of 160° - 200° and a width of 1.8 mm - 2.2 mm.

[0009] In an alternative embodiment, one end of the connecting column is fixed to the metal substrate of the power board by welding or a first bolt, and the other end is fixed to the control board by a second bolt that passes through the control board and can be screwed into the connecting column.

[0010] In an alternative embodiment, the connecting column is a copper column, an iron column, or an aluminum column.

[0011] In an alternative embodiment, the stress relief hole is a through hole cut by a milling machine or a laser cutting machine.

[0012] In an alternative embodiment, the control module further includes a conductive member that electrically connects the power board and the control board, enabling the power board to supply the received electrical energy to the power-consuming devices of the magnetic levitation molecular pump under the control of the control board.

[0013] In an alternative embodiment, the conductive member includes a conductive pin base and a conductive pin body inserted into the conductive pin base. One of the conductive pin body and the conductive pin base is fixed to the control board and electrically connected to the control board, and the other is fixed to the power board and electrically connected to the power board.

[0014] According to a second aspect of the present invention, there is provided a magnetic levitation molecular pump, which includes the control module as described in the first aspect of the present invention.

[0015] In the control module for the magnetic levitation molecular pump and the magnetic levitation molecular pump provided as above, the applicant of the present invention innovatively provides at least one stress relief hole on the control board, and uses the stress relief hole to reduce the stress concentration of the corresponding connecting column height error on the control board, which can prevent the control board or the internal circuit from breaking, and can effectively improve the service performance and life of the control module. At the same time, since the control board can deform safely within a certain range, the applicant only selects one of the two connecting columns that are too close and sets a stress relief hole on the control board. This method can effectively avoid excessive weakening of the strength of the control board and can also avoid excessive cost increase of the control module due to too many openings. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] By reading the following detailed description with reference to the accompanying drawings, the above and other objects, features, and advantages of the exemplary embodiments of the present invention will become readily understood. In the drawings, several embodiments of the present invention are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0017] Figure 1 Schematically shows the control module for a magnetic levitation molecular pump according to an embodiment of the present invention; and

[0018] Figure 2 is Figure 1 A schematic structural diagram of the conductive member of the shown control module.

[0019] Explanation of reference numerals: 1, power board; 2, control board; 21, stress relief hole; 3, connecting column; 4, conductive member; 41, conductive pin base; 42, conductive pin body; 5, second bolt; 10, control module. Detailed implementation manners

[0020] Next, the technical solutions in the embodiments of the present disclosure will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present disclosure.

[0021] An embodiment of the present invention provides a control module 10 for a magnetic levitation molecular pump. The control module 10 is one of the key components of the magnetic levitation molecular pump. Its function is to provide stable power for power-consuming devices such as motors and magnetic bearings in the magnetic levitation molecular pump and control their operating states to ensure that the power-consuming devices can operate continuously and efficiently.

[0022] As Figure 1 shown, the control module 10 includes a power board 1, a control board 2, and a plurality of connecting columns 3 provided between the power board 1 and the control board 2 and connecting the two. One end of the connecting column 3 can be fixed to the power board 1 by welding or a first bolt, etc., and the other end can be fixed to the control board 2 by a second bolt 5 that passes through the control board 2 and can be screwed into the connecting column 3, thereby ensuring that the power board 1 and the control board 2 are connected as a whole by the connecting column 3. Among them, the connecting column 3 is a copper column, an iron column or an aluminum column, but it is preferably a copper column with good welding performance.

[0023] Meanwhile, the control module 10 includes a conductive member 4 that electrically connects the power board 1 and the control board 2, enabling the power board 1 to supply the received electrical energy to the power-consuming devices of the magnetic levitation molecular pump under the control of the control board 2 and realizing the power supply and control of the power-consuming devices. Specifically, the control board 2 at least includes a resin substrate and a control chip soldered on the resin substrate. The power board 1 at least includes a metal substrate and a switching power device provided on the metal substrate. The switching power device includes a triode, a MOS transistor, or an IGBT. The conductive member 4 is connected to the resin substrate and the metal substrate, enabling the control chip to be electrically connected to the switching power device through the conductive traces in the resin substrate, the conductive member 7, and the conductive traces in the metal substrate, ensuring that the control chip can at least be used to control the conduction and cutoff of the switching power device. Thus, the switching power device can quickly switch between on and off states under the control of the control chip and supply the required electrical energy to the power-consuming devices when conducting. It is easy to understand that, in order to ensure that the switching power device can receive electrical energy and supply it to the power-consuming devices, the switching power device not only needs to be connected to a power source (such as a power supply socket) through the metal substrate and the power line connecting the metal substrate, but also needs to be connected to the power-consuming devices through the metal substrate and the power supply line connecting the metal substrate. The power-consuming devices include, but are not limited to, motors and / or magnetic bearings.

[0024] In fact, the conductive member 4 can be optionally a wire or other member capable of transmitting electrical energy. However, to improve the convenience of assembly operations, the conductive member 4 includes a conductive pin socket 41 and a conductive pin body 42 inserted into the conductive pin socket 41. One of the conductive pin body 42 and the conductive pin socket 41 is fixed on the control board 2 and electrically connected to the control board 2, and the other of the conductive pin body 42 and the conductive pin socket 41 is fixed on the power board 1 and electrically connected to the power board 1. When using the conductive member 4 to connect the control board 2 and the power board 1, the plugging operation of the conductive pin socket 41 and the conductive pin body 42 is suitable for being directly implemented during this operation process without the need to deliberately and additionally implement this operation, thereby achieving the purpose of simplifying assembly. The pluggable conductive pin socket 41 and conductive pin body 42 can stably transmit signals and / or electrical energy. As a preferred example, the conductive member 4 is a crown spring pin with mature technology and high cost performance.

[0025] In order to eliminate the influence caused by machining errors and assembly errors, the applicant of the present invention innovatively provides at least one stress relief hole 21 on the control board 2, especially on the resin substrate. At least one stress relief hole 21 is independent and partially surrounds the corresponding selected object, and the selected object is any one of two connecting posts 3 whose distance from each other is less than the set threshold. Based on this, the embodiments of the present invention can utilize the stress relief hole 21 to reduce the stress concentration on the control board 2 caused by the height error of the corresponding connecting post 3, prevent the control board 2 or the internal circuit from breaking, and effectively improve the service performance and life of the control module 10. At the same time, since the control board 2 can deform safely within a certain range, the applicant only selects one from the two connecting posts 3 with too close distance and sets the stress relief hole 21 on the control board 2. This way can effectively avoid excessive weakening of the strength of the control board 2 and avoid excessive cost increase of the control module 10 due to too many openings.

[0026] Research shows that the selection of the set threshold is related to the material and thickness of the control board 2. When the control board 2 includes a resin substrate with a thickness of 1.5 mm - 1.7 mm and the set threshold is 8 mm - 12 mm, the stress relief hole 21 can better improve the stress concentration phenomenon of the resin substrate and avoid cracks at the opening of the resin substrate due to the vibration of the magnetic levitation molecular pump.

[0027] The shape and size of the stress relief hole 21 can be selected according to actual needs. However, in order to take into account both performance and processing convenience, it is more recommended to select an arc shape or a C shape, and the geometric center of the arc shape or the C shape is located on the central axis of the corresponding selected object. Through experimental verification, when the control board 2 includes a resin substrate with a thickness of 1.5 mm - 1.7 mm and the spacing threshold of the connecting post 3 is set to 8 mm - 12 mm, adding an arc-shaped stress relief hole 21 with a central angle of 160° - 200° and a width of 1.8 mm - 2.2 mm can reduce the maximum stress caused by the connecting post 3 on the control board 2 by more than 85%, effectively preventing the control board 2 or the internal circuit from breaking, and ensuring the safe use of the magnetic levitation molecular pump in the fields of integrated circuit manufacturing, surface analysis, and automotive testing. In addition, the stress relief hole 21 is not likely to seriously affect the internal wiring and heat dissipation performance of the control board 2 due to too large a central angle, which is beneficial to maintaining the safety and effectiveness of the control board 2.

[0028] In this embodiment, the stress relief hole 21 is a through hole cut by a milling machine or a laser cutting machine. Using a milling machine or a laser cutting machine to manufacture the stress relief hole 21 not only has high production precision, is fast and efficient, but also can achieve batch production, greatly reducing the processing cost and being conducive to popularization and application. This production method also ensures the consistency of the stress relief holes 21 between different control boards 2 and improves the stability of the batch-to-batch quality of the products.

[0029] In an embodiment (not shown), a magnetic levitation molecular pump is provided, which includes the control module 10 mentioned above. Since the magnetic levitation molecular pump includes the control module 10 mentioned above, it has the advantages of the control module 10, that is, reducing the stress influence on the control board 2 caused by the height error of the connecting column 3 and preventing the fracture of the control board 2 or the internal circuit, which can effectively improve the service performance and life of the control module 10.

[0030] In the above description of the present application, unless otherwise clearly defined and limited, terms such as "fixed", "installed", "connected" or "coupled" should be understood in a broad sense. For example, for the term "connected", it can be a fixed connection, a detachable connection, or an integral body; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, or it can be the communication inside two components or the interaction relationship between two components. Therefore, unless otherwise clearly defined in the present application, those skilled in the art can understand the specific meanings of the above terms in the present invention according to specific situations.

[0031] In addition, the terms "first" or "second" etc. used in the present application to refer to numbers or ordinals are only for descriptive purposes and cannot be understood as explicitly or implicitly indicating relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" or "second" may explicitly or implicitly include at least one of such features. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three or more, etc., unless otherwise clearly and specifically defined.

[0032] Although multiple embodiments of the present invention have been shown and described herein, it will be apparent to those skilled in the art that such embodiments are provided by way of example only. Many variations, changes and alternative ways can be thought of by those skilled in the art without departing from the spirit and scope of the present invention. It should be understood that various alternative solutions to the embodiments of the present invention described herein can be adopted in the practice of the present invention. The appended claims are intended to define the scope of protection of the present invention and thus cover equivalents or alternative solutions within the scope of these claims.

Claims

1. A control module for a magnetic levitation molecular pump, characterized in that, It includes a power board, a control board, and a plurality of connecting posts provided between the power board and the control board to connect the two. Among them, at least one stress relief hole is provided on the control board. At least one of the stress relief holes independently and partially surrounds a corresponding selected object, and the selected object is any one of two connecting posts whose distance from each other is less than a set threshold value.

2. The control module according to claim 1, characterized in that The control board includes a resin substrate with a thickness of 1.5 mm - 1.7 mm, and the set threshold value is 8 mm - 12 mm.

3. The control module according to claim 2, characterized in that: The shape of the stress relief hole is arc-shaped or U-shaped, and the geometric center of the arc-shaped or U-shaped is located on the central axis of the corresponding selected object.

4. The control module according to claim 2, characterized in that: The stress relief hole is arc-shaped, its central angle is 160° - 200°, and its width is 1.8 mm - 2.2 mm.

5. The control module according to any one of claims 1 to 4, characterized in that: One end of the connecting post is fixed on the metal substrate of the power board by welding or a first bolt, and the other end is fixed on the control board by a second bolt that passes through the control board and can be screwed into the connecting post.

6. The control module according to claim 5, characterized in that: The connecting post is a copper post, an iron post, or an aluminum post.

7. The control module according to any one of claims 1 to 4, characterized in that: The stress relief hole is a through hole cut by a milling machine or a laser cutting machine.

8. The control module according to any one of claims 1 to 4, characterized in that: It further includes a conductive member that electrically connects the power board and the control board, so that the power board can supply the received electric energy to the power-consuming devices of the magnetic levitation molecular pump under the control of the control board.

9. The control module according to claim 8, characterized in that: The conductive member includes a conductive pin base and a conductive pin body inserted into the conductive pin base. One of the conductive pin body and the conductive pin base is fixed on the control board and electrically connected to the control board, and the other of the conductive pin body and the conductive pin base is fixed on the power board and electrically connected to the power board.

10. A magnetic levitation molecular pump, characterized in that, It includes the control module according to any one of claims 1 to 9.

Images