Loop heat pipe and electronic equipment
Through the modular design of the combination of hard thermal conductivity shell and flexible shell, the efficient heat dissipation problem of loop heat pipes in bent scenarios is solved, and efficient heat transfer and miniaturization in bent scenarios is achieved.
Patent Information
- Application Number
- CN202311873793.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-29
- Publication Date
- 2025-07-01
AI Technical Summary
Loop heat pipes are difficult to provide efficient heat dissipation in bendable scenarios, and the existing flexible designs are prone to wrinkles and gaps, affecting heat transfer efficiency.
The design of a combination of a hard thermal conductivity shell and a flexible shell is used for the evaporator and a flexible shell is used for the return pipeline, combining a modular design and corrugated structure to ensure effective heat transfer in bending scenarios.
It achieves efficient heat dissipation in bending scenarios, avoids wrinkles and gaps, improves heat transfer efficiency, and helps to miniaturize the loop heat pipe.
Smart Images
Figure CN120232293A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of heat dissipation, and more specifically, to a loop heat pipe and an electronic device. Background Art
[0002] A loop heat pipe is a loop-closed loop heat pipe. Generally, it includes an evaporator, a condenser, a vapor pipeline, and a liquid pipeline. The evaporator absorbs the heat of the heating element, causing the working fluid to evaporate on the outer surface of the capillary wick of the evaporator. The generated vapor enters the vapor pipeline and then enters the condenser to condense into a liquid. The reflux liquid enters the evaporator through the liquid pipeline, and so on in a cycle. Compared with the heat pipes and vapor chambers widely used in laptop computers, tablets, mobile phones, and electronic wearable devices, the loop heat pipe has the advantages of high heat transfer power and long heat transfer distance. However, the dimensions such as the length, width, and thickness of the conventional loop heat pipe are relatively large and cannot be applied in small electronic products (such as mobile phones, tablets, head-mounted display devices, etc.). In addition, most loop heat pipes are made of materials such as hard metals, and the overall structure does not have flexibility and cannot be applied in some application scenarios with moving characteristics (such as the bending scenario of the temple of a head-mounted display device, the bending scenario of a folding screen mobile phone, etc.). There are also some studies that propose to make the whole loop heat pipe with flexible materials. However, wrinkles, gaps, etc. are likely to occur during the contact process between the flexible evaporation area of the loop heat pipe and the heat source surface, which is not conducive to heat transfer from the heat source surface to the evaporation area.
[0003] In summary, how to effectively solve the problems such as the difficulty of the loop heat pipe to provide efficient heat dissipation in the bendable scenario is an issue that needs to be solved by those skilled in the art currently. Summary of the Invention
[0004] In view of this, the purpose of the present invention is to provide a loop heat pipe and an electronic device, and the structural design of the loop heat pipe and the electronic device can effectively solve the problem that the loop heat pipe is difficult to provide efficient heat dissipation in the bendable scenario.
[0005] To achieve the above purpose, the present invention provides the following technical solutions:
[0006] A loop heat pipe, comprising:
[0007] An evaporator, the evaporator includes a hard heat-conducting shell and a capillary wick. An evaporation chamber is formed inside the hard heat-conducting shell. The capillary wick is arranged in the evaporation chamber, and a first liquid flow port and a first gas flow port communicating with the evaporation chamber are formed on one side of the hard heat-conducting shell;
[0008] A return pipeline, the return pipeline includes a flexible housing, a return channel is formed inside the flexible housing, a flexible support is provided inside the return channel, and both ends of the return channel extend to one side edge of the flexible housing and form a second gas flow port and a second liquid flow port. The second gas flow port is hermetically connected to the first gas flow port, and the second liquid flow port is hermetically connected to the second gas flow port.
[0009] Optionally, in the above loop heat pipe, the flexible housing includes a composite layer of a heat-conducting metal material and a polymer material.
[0010] Optionally, in the above loop heat pipe, at least a part of the flexible housing is provided with a corrugated structure.
[0011] Optionally, in the above loop heat pipe, the corrugated structure includes at least one of an outwardly convex corrugated groove with a wave crest height higher than the surface of the flexible housing and an inwardly concave corrugated groove with a wave crest height lower than the surface of the flexible housing.
[0012] Optionally, in the above loop heat pipe, the capillary wick includes a main capillary wick and a secondary capillary wick. The main capillary wick is arranged in the evaporation chamber. One end of the secondary capillary wick is connected to the main capillary wick, and the other end extends into the return channel, and the secondary capillary wick has flexibility.
[0013] Optionally, in the above loop heat pipe, the secondary capillary wick passes through the flexible support.
[0014] Optionally, in the above loop heat pipe, the main capillary wick is a porous medium formed by pressing, weaving or sintering powder or fiber materials; the secondary capillary wick is a porous medium formed by pressing, weaving or sintering fiber materials.
[0015] Optionally, in the above loop heat pipe, the rigid heat-conducting housing includes a rigid upper shell and a rigid lower shell. The rigid upper shell is welded to the rigid lower shell, and both ends of the capillary wick are welded to the rigid upper shell and the rigid lower shell respectively.
[0016] Optionally, in the above loop heat pipe, the flexible housing includes a flexible upper shell and a flexible lower shell. The flexible upper shell is welded to the flexible lower shell, and a groove is provided on the flexible upper shell and / or the flexible lower shell to form the return channel.
[0017] The loop heat pipe provided by the present invention includes an evaporator and a return pipeline. Among them, the evaporator includes a rigid heat-conducting housing and a capillary wick. An evaporation chamber is formed inside the rigid heat-conducting housing, and the capillary wick is arranged inside the evaporation chamber. The rigid heat-conducting housing is formed with a first liquid flow port and a first gas flow port that communicate with the evaporation chamber; the return pipeline includes a flexible housing. A return channel is formed inside the flexible housing, and a flexible support is arranged inside the return channel. The two ends of the return channel extend to the edge of the flexible housing and form a second gas flow port and a second liquid flow port. The second gas flow port is hermetically connected to the first gas flow port, and the second liquid flow port is hermetically connected to the second gas flow port.
[0018] When applying the loop heat pipe provided by the present invention, the return pipeline adopts a flexible housing and a flexible support, which can deform accordingly as needed, so as to meet the use in the bending scenario. Moreover, the setting of the flexible support can play a role in supporting the return channel to prevent the return channel from sagging. The evaporator adopts a rigid housing, which is not prone to wrinkles, gaps, etc., so it can better fit with the heat source, ensuring efficient heat transfer from the heat source to the evaporation chamber, and further ensuring the heat dissipation efficiency of the loop heat pipe. And the modular design of the evaporator and the return pipeline makes the structure of the loop heat pipe more compact, which is beneficial to its miniaturization. In summary, the loop heat pipe provided by this application can not only be applied to the heat dissipation of the bending scenario of electronic products, but also provide high heat dissipation efficiency.
[0019] In a preferred embodiment, the flexible housing includes a composite layer of a heat-conducting metal material and a polymer material, which has the characteristics of light weight, thin thickness, and flexibility, so it is beneficial to the miniaturization, thinness, and flexibility of the loop heat pipe.
[0020] In order to achieve the above object, the present invention also provides an electronic device, which includes any one of the above loop heat pipes. Since the above loop heat pipe has the above technical effects, the electronic device with this loop heat pipe should also have corresponding technical effects. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0022] Figure 1 It is a schematic structural diagram of the loop heat pipe in a specific embodiment of the present invention;
[0023] Figure 2 is Figure 1 partial explosion schematic diagram of;
[0024] Figure 3 Schematic structural diagram of an outwardly convex corrugated groove;
[0025] Figure 4 Schematic structural diagram of an inwardly concave corrugated groove;
[0026] Figure 5 is Figure 2 Schematic structural diagram of the evaporator in
[0027] Figure 6 is Figure 2 Explosion schematic diagram of the evaporator in
[0028] Figure 7 is Figure 2 Cross-sectional schematic diagram of the evaporator in
[0029] Figure 8 is Figure 1 Explosion schematic diagram of the reflux pipeline in
[0030] Figure 9 Schematic structural diagram of an electronic device according to a specific embodiment of the present invention.
[0031] The markings in the drawings are as follows:
[0032] Evaporator 1, first gas flow port 11, first liquid flow port 12, liquid injection flow port 13;
[0033] Hard upper shell 14, hard upper shell substrate skirt 141, hard upper shell groove 142, upper shell liquid injection port 143, upper shell first liquid flow port 144, upper shell first gas flow port 145;
[0034] Main capillary core 15, installation groove 151, main capillary core branch 152, main capillary core body 153;
[0035] Secondary capillary core 16;
[0036] Hard lower shell 17, lower shell liquid injection port 171, lower shell first liquid flow port 172, lower shell first gas flow port 173, support column 174;
[0037] Reflux pipeline 2, second gas flow port 201, second liquid flow port 202;
[0038] Flexible upper shell 21, flexible upper shell substrate skirt 211, flexible upper shell groove 212, upper shell corrugated groove 213, upper shell second liquid flow port 214, upper shell second gas flow port 215;
[0039] Flexible support 22;
[0040] Flexible lower shell 23, flexible lower shell substrate skirt 231, flexible lower shell groove 232, lower shell corrugated groove 233, second liquid flow port 234 of the lower shell, second gas flow port 235 of the lower shell;
[0041] Main shell 100, heat source chip 200, temple 300. Specific embodiments
[0042] An embodiment of the present invention discloses a loop heat pipe and an electronic device to provide efficient heat dissipation in a bendable scenario.
[0043] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0044] In a specific embodiment, please refer to Figures 1 - 2The loop heat pipe provided by the present invention includes an evaporator 1 and a return line 2. Among them, the evaporator 1 is one end of the loop heat pipe used for heat exchange with the heat source, and it uses the phase change of the working fluid in the evaporation chamber to take away the heat of the heat source. The evaporator 1 includes a hard heat-conducting shell and a capillary wick. An evaporation chamber is formed in the hard heat-conducting shell, and a capillary wick is arranged in the evaporation chamber. A first liquid flow channel opening 12 and a first gas flow channel opening 11 connected to the evaporation chamber are formed on one side of the hard heat-conducting shell. On the one hand, the hard heat-conducting shell utilizes its thermal conductivity to transfer heat with the heat source, such as contact heat transfer. On the other hand, the hard material has a certain anti-deformation ability, so that it fits more closely with the heat source surface, ensures the effective contact area with the heat source, and improves the heat dissipation efficiency. A capillary wick is arranged in the evaporation chamber, and the capillary wick provides a capillary driving force for the entire loop heat pipe. The reflux pipeline 2 cooperates with the evaporator 1, and integrates the gas pipeline, liquid pipeline and condenser of the loop heat pipe, and specifically includes a flexible shell, a reflux channel is formed in the flexible shell, a flexible support body 22 is provided in the reflux channel, and the two ends of the reflux channel extend to one side edge of the flexible shell and form a second gas flow channel opening 201 and a second liquid flow channel opening 202. The second gas flow channel opening 201 is sealed and connected to the first gas flow channel opening 11, and the second liquid flow channel opening 202 is sealed and connected to the second gas flow channel opening 201, thereby forming a circulation loop, which is used to fill the working medium. The evaporator 1 and the reflux pipeline 2 are connected to each other through the flow channel openings, and specifically the first gas flow channel opening 11 and the second gas flow channel opening 201 are connected by a welding process; the first liquid flow channel opening 12 and the second liquid flow channel opening 202 are connected by a welding process. The above-mentioned welding process includes but is not limited to diffusion welding, brazing, laser welding and other processes. When the working medium flows through the evaporation chamber, it absorbs the heat of the heat source and undergoes a phase change, and then enters the reflux channel through the first gas flow channel opening 11 and the second gas flow channel opening 201. The working medium dissipates heat and condenses through the reflux channel, and flows back to the evaporation chamber through the second liquid flow channel opening 202 and the first liquid flow channel opening 12 to achieve circulation. It can be understood that the shell materials of the evaporator 1 and the reflux pipeline 2 are different, and they can be set as split components, and the two are sealed and connected by welding or other methods.
[0045] Using the loop heat pipe provided by the present invention, the return line 2 adopts a flexible shell and a flexible support body 22, which can be deformed accordingly as needed, so as to meet the use in bending scenarios, and the setting of the flexible support body 22 can play a supporting role in the return channel to prevent the return channel from being sunken. The evaporator 1 adopts a hard shell, which is not prone to wrinkles, gaps, etc., so it can better fit with the heat source, ensuring efficient heat transfer from the heat source to the evaporation chamber, and then ensuring the heat dissipation efficiency of the loop heat pipe. And the modular design of the evaporator 1 and the return line 2 makes the structure of the loop heat pipe more compact, which is conducive to its miniaturization. In summary, the loop heat pipe provided by the present application can not only be used for heat dissipation in bending scenarios of electronic products, but also can provide efficient heat dissipation efficiency.
[0046] In some embodiments, the reflux channel is U-shaped, that is, it includes a condenser channel, a gas channel, and a liquid channel. The condenser channel is located at one end of the flexible housing. One ends of the gas channel and the liquid channel are respectively communicated with the condenser channel, and the other ends extend to one side edge of the flexible housing and form a second gas flow port 201 and a second liquid flow port 202. With the reflux channel arranged as above, the full utilization of space is achieved, enabling the working medium to dissipate heat sufficiently and further improving the heat dissipation efficiency.
[0047] In some embodiments, the flexible housing includes a composite layer composed of a heat-conducting metal material and a polymer material. Specifically, the composite layer is composed of metal materials such as copper and aluminum and polymer materials such as polyimide, polytetrafluoroethylene, and polyphenylene ether fiberglass. Specifically, composite materials such as a copper layer covering the surface of polyimide and an aluminum layer covering the surface of polytetrafluoroethylene have the characteristics of light weight, thin thickness, and flexibility, thus being beneficial to the miniaturization, thinning, and flexibility of the loop heat pipe.
[0048] In some embodiments, the rigid heat-conducting housing of the evaporator 1 is made of rigid high heat-conductivity metal plates such as copper plates, aluminum plates, and stainless steel plates.
[0049] In some embodiments, please refer to Figure 3 and Figure 4 , at least a part of the flexible housing is provided with a corrugated structure. The corrugated structure can provide a certain deformation ability. Therefore, by arranging at least a part of the flexible housing with a corrugated structure, it can better adapt to the bending scenarios on electronic devices, such as the leg connection part of a head-mounted display device and the folding part of a folding mobile phone, improving the flexibility of the loop heat pipe and making its application range more extensive. The total length L and the peak height H of the corrugated structure can be set as required. For example, the total length L of the corrugated structure is ≥ 10 mm, and the peak height H of the corrugation is ≤ 0.6 mm. In order to further improve the flexibility of the reflux pipeline 2, two or more corrugated structures can be arranged on the reflux pipeline 2.
[0050] In some embodiments, the corrugated structure includes at least one of an outward convex corrugated groove with a peak height higher than the surface of the flexible housing and an inward concave corrugated groove with a peak height lower than the surface of the flexible housing. The outward convex corrugated groove is as shown in Figure 3 , and the inward concave corrugated groove is as shown in Figure 4 . Both can provide good deformation ability. In addition, the inward concave corrugated groove occupies less space.
[0051] In some embodiments, please refer to Figures 5 - 7, the capillary wick includes a main capillary wick 15 and a secondary capillary wick 16. The main capillary wick 15 is disposed in the evaporation chamber. One end of the secondary capillary wick 16 is connected to the main capillary wick 15, and the other end extends into the reflux channel, and the secondary capillary wick 16 has flexibility. The main capillary wick 15 is disposed in the evaporation chamber to provide a capillary driving force. Specifically, the secondary capillary wick 16 enters the reflux channel through the first liquid flow port 12 and the second liquid flow port 202. The secondary capillary wick 16 has water absorption characteristics and flexibility at the same time. Therefore, through the arrangement of the secondary capillary wick 16, the liquid working medium can be transported by means of the capillary action of the secondary capillary wick 16, so that the working medium flows better in the circulation loop, further improving the heat dissipation efficiency. At the same time, the secondary capillary wick 16 can deform with the flexible shell to adapt to the bending scenario. Specifically, an installation groove 151 is provided on the main capillary wick 15. The secondary capillary wick 16 includes a main body and a head end connected to one end of the main body. The head end includes a docking portion inserted into the installation groove 151 and a transition portion connected between the docking portion and the main body. The transition portion has a limiting surface that abuts against the end surface of the main capillary wick 15. With the above arrangement, the secondary capillary wick 16 can be reliably connected to the main capillary wick 15, and the installation and positioning of the secondary capillary wick 16 are facilitated.
[0052] In some embodiments, the main capillary wick 15 includes a main capillary wick body 153 and a plurality of main capillary wick branches 152. The plurality of main capillary wick branches 152 are arranged at intervals and are respectively connected to the main capillary wick body 153. Specifically, the number of main capillary wick branches 152 is not less than three. The plurality of main capillary wick branches 152 are arranged at intervals, so that the interval positions can provide a layout space for the support structure. Specifically, a plurality of support columns 174 protruding at intervals are provided on the inner wall surface of the rigid heat-conducting shell, and each support column 174 is disposed within the interval of the main capillary wick branch 152 to support the rigid heat-conducting shell.
[0053] In some embodiments, the secondary capillary wick 16 passes through the flexible support 22. Then, the effective support of the flexible support 22 for the flexible shell can be ensured. The secondary capillary wick 16 passes through the middle of the flexible support 22, making full use of the space to facilitate the miniaturization of the loop heat pipe.
[0054] In some embodiments, the main capillary wick 15 is a porous medium formed by pressing, weaving or sintering powder or fiber materials; the secondary capillary wick 16 is a porous medium formed by pressing, weaving or sintering fiber materials. The powder includes, but is not limited to, copper powder, nickel powder, stainless steel powder, etc., and the fiber materials include, but are not limited to, copper fiber, nickel fiber, stainless steel fiber, etc. The porous medium can provide good capillary action to transport the liquid working medium. And the secondary capillary wick 16 is made of fiber material, which can provide a certain degree of flexibility.
[0055] In some embodiments, the flexible support 22 is a spring made by machining or a wire mesh woven with fibers. The material of the spring or wire mesh can be a metal material or a polymer material.
[0056] In some embodiments, the rigid heat-conducting housing is further formed with a liquid injection flow port 13, and the liquid injection flow port 13 is arranged close to the first liquid flow port 12. By providing the liquid injection flow port 13, it is convenient to evacuate the inside of the loop heat pipe and fill it with the working fluid.
[0057] In some embodiments, the rigid heat-conducting housing includes a rigid upper shell 14 and a rigid lower shell 17. The rigid upper shell 14 is welded to the rigid lower shell 17, and both ends of the capillary wick are respectively welded to the rigid upper shell 14 and the rigid lower shell 17. The split design of the rigid upper shell 14 and the rigid lower shell 17 is adopted to facilitate the fixation of the capillary wick in the evaporation chamber. And the rigid upper shell 14 is welded to the rigid lower shell 17, which can achieve reliable connection and effective sealing at the same time.
[0058] Furthermore, the rigid upper shell 14 is processed from a rigid metal plate such as a copper plate, an aluminum plate, a stainless steel plate, etc. Specifically, the rigid upper shell 14 includes a rigid upper shell substrate skirt 141, a rigid upper shell groove 142, an upper shell liquid injection port 143, an upper shell first liquid flow port 144, and an upper shell first gas flow port 145. The rigid lower shell 17 is processed from a rigid metal plate such as a copper plate, an aluminum plate, a stainless steel plate, etc. Specifically, the rigid lower shell 17 includes a lower shell liquid injection port 171, a lower shell first liquid flow port 172, a lower shell first gas flow port 173, and a support column 174. To reduce the thickness of the evaporator 1, the rigid lower shell 17, the main capillary wick 15, the secondary capillary wick 16, and the rigid upper shell 14 are stacked into a whole in sequence, as Figure 5 shown.
[0059] Specifically, the main capillary wick 15 is tightly connected to the rigid upper shell 14 and the rigid lower shell 17 through a welding process. The secondary capillary wick 16 is tightly connected to the main capillary wick 15 and the rigid upper shell 14 through a welding process. The upper shell substrate skirt 141 is tightly connected to the rigid lower shell 17 through a welding process. The upper shell liquid injection port 143 and the lower shell liquid injection port 171 form the liquid injection flow port 13; the upper shell liquid flow port 144 and the lower shell liquid flow port 172 form the first liquid flow port 12; the upper shell gas flow port 145 and the lower shell gas flow port 173 form the first gas flow port 11.
[0060] In some embodiments, please refer to Figure 8, the flexible housing includes a flexible upper housing 21 and a flexible lower housing 23. The flexible upper housing 21 is welded to the flexible lower housing 23, and grooves are provided on the flexible upper housing 21 and / or the flexible lower housing 23 to form a reflux channel. The split design of the flexible upper housing 21 and the flexible lower housing 23 facilitates the fixation of the flexible support 22 in the reflux channel. And the flexible upper housing 21 is welded to the flexible lower housing 23, which can achieve reliable connection and effective sealing at the same time. By providing grooves on the flexible upper housing 21 and / or the flexible lower housing 23 to form a reflux channel, the structure is simple and there is no need to set other structures such as pipe fittings in the flexible housing.
[0061] Further, the flexible upper housing 21 includes a flexible upper housing substrate skirt 211, a flexible upper housing groove 212, a second liquid flow port 214 of the upper housing, and a second gas flow port 215 of the upper housing. The flexible lower housing 23 includes a flexible lower housing substrate skirt 231, a flexible lower housing groove 232, a second liquid flow port 234 of the lower housing, and a second gas flow port 235 of the lower housing. The flexible support 22 is disposed between the flexible upper housing groove 212 and the flexible lower housing groove 232 to support the flow channel formed by the flexible upper housing groove 212 and the flexible lower housing groove 232 from sagging. To reduce the thickness of the reflux pipeline 2, the flexible upper housing 21, the flexible support 22, and the flexible lower housing 23 are sequentially laminated into an integral body, and the exploded view of the laminated structure is as Figure 8 shown.
[0062] Specifically, between the flexible upper housing 21 and the flexible lower housing 23, through the welding process, the flexible upper housing substrate skirt 211 is tightly connected to the flexible lower housing substrate skirt 231. The second gas flow port 215 of the upper housing and the second gas flow port 235 of the lower housing are tightly connected through the welding process and form the second gas flow port 201 of the reflux pipeline 2. The first gas flow port 11 is disposed between the second gas flow port 215 of the upper housing and the second gas flow port 235 of the lower housing and is tightly connected through the welding process. The second liquid flow port 214 of the upper housing and the second liquid flow port 234 of the lower housing are tightly connected through the welding process and form the second liquid flow port 202 of the reflux pipeline 2. The first liquid flow port 12 is disposed between the second liquid flow port 214 of the upper housing and the second liquid flow port 234 of the lower housing and is tightly connected through the welding process. The secondary wick 16 is specifically disposed in the flow channel formed by the flexible upper housing groove 212 and the flexible lower housing groove 232.
[0063] In the embodiment where the flexible housing is provided with a corrugated structure, specifically, the flexible upper housing 21 further includes an upper housing corrugated groove 213, and the flexible lower housing 23 further includes a lower housing corrugated groove 233, as Figure 3 , Figure 4 shown. As Figure 3The convex corrugated groove structure is set as shown. The peak heights H of the upper shell corrugated groove 213 and the lower shell corrugated groove 233 are respectively higher than the horizontal planes of the flexible upper shell groove 212 and the flexible lower shell groove 232. As Figure 4 The concave corrugated groove structure is set as shown. The peak heights H of the upper shell corrugated groove 213 and the lower shell corrugated groove 233 are respectively lower than the horizontal planes of the flexible upper shell groove 212 and the flexible lower shell groove 232.
[0064] Based on the loop heat pipe provided in the above embodiments, the present invention also provides an electronic device, which includes any one of the loop heat pipes in the above embodiments. Since the loop heat pipe in the above embodiments is adopted in this electronic device, the beneficial effects of this electronic device can be referred to the above embodiments.
[0065] In some embodiments, the electronic device is a head-mounted display device, such as Figure 9 As shown, the loop heat pipe is arranged in the head-mounted display device, and the evaporator 1 of the loop heat pipe is located in a set of temple arms 300 of the head-mounted display device and is closely attached to the heat source chip 200 or the gas heat source. The proximal end of the return pipeline 2 is connected to the evaporator 1, and the distal end extends into the main housing 100 of the head-mounted display device or another set of temple arms 300.
[0066] Specifically, with the gravity direction as down, in the head-mounted display device, the first liquid flow port 12 and the second liquid flow port 202 are located below the first gas flow port 11 and the second gas flow port 201. That is, the liquid flow channel of the return pipeline 2 is located below the gas flow channel, so as to facilitate the better circulation of the working medium. When the corrugated structure is provided on the flexible housing, the corrugated structure is arranged at the bending position where the temple arm 300 of the head-mounted display device is connected to the main housing 100. Then, when the temple arm 300 of the head-mounted display device bends, the corrugated structure will bend accordingly.
[0067] In this specification, the various embodiments are described in a progressive manner. The key point of each embodiment is to illustrate the differences from other embodiments. The same or similar parts among the various embodiments can be referred to each other.
[0068] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be obvious to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to these embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A loop heat pipe, characterized in that, Comprising: An evaporator (1), the evaporator (1) comprising a rigid heat-conducting housing and a capillary wick. An evaporation chamber is formed within the rigid heat-conducting housing, the capillary wick is disposed within the evaporation chamber, and a first liquid flow port (12) and a first gas flow port (11) that communicate with the evaporation chamber are formed on one side of the rigid heat-conducting housing. A reflux pipeline (2), the reflux pipeline (2) comprising a flexible housing. A reflux channel is formed within the flexible housing, a flexible support (22) is disposed within the reflux channel, and both ends of the reflux channel extend to one side edge of the flexible housing and form a second gas flow port (201) and a second liquid flow port (202). The second gas flow port (201) is sealingly connected to the first gas flow port (11), and the second liquid flow port (202) is sealingly connected to the second gas flow port (201).
2. The loop heat pipe according to claim 1, wherein The flexible housing comprises a composite layer of a heat-conducting metal material and a polymer material.
3. The loop heat pipe according to claim 1, wherein At least a part of the flexible housing is provided with a corrugated structure.
4. The loop heat pipe according to claim 3, characterized in that The corrugated structure comprises at least one of an outwardly convex corrugated groove with a peak height higher than the surface of the flexible housing and an inwardly concave corrugated groove with a peak height lower than the surface of the flexible housing.
5. The loop heat pipe according to any one of claims 1-4, characterized in that, The capillary wick comprises a main capillary wick (15) and a secondary capillary wick (16). The main capillary wick (15) is disposed within the evaporation chamber. One end of the secondary capillary wick (16) is connected to the main capillary wick (15), and the other end extends into the reflux channel. The secondary capillary wick (16) is flexible.
6. The loop heat pipe according to claim 5, wherein The secondary capillary wick (16) passes through the flexible support (22).
7. The loop heat pipe according to claim 5, characterized in that, The main capillary wick (15) is a porous medium formed by pressing, weaving, or sintering powder or fiber materials; the secondary capillary wick (16) is a porous medium formed by pressing, weaving, or sintering fiber materials.
8. The loop heat pipe according to any one of claims 1-4, characterized in that, The rigid heat-conducting housing comprises a rigid upper shell (14) and a rigid lower shell (17). The rigid upper shell (14) is welded to the rigid lower shell (17), and both ends of the capillary wick are respectively welded to the rigid upper shell (14) and the rigid lower shell (17).
9. The loop heat pipe according to any one of claims 1-4, characterized in that, The flexible housing comprises a flexible upper shell (21) and a flexible lower shell (23). The flexible upper shell (21) is welded to the flexible lower shell (23), and grooves are provided on the flexible upper shell (21) and / or the flexible lower shell (23) to form the reflux channel.
10. An electronic device, characterized in that, Comprising a loop heat pipe according to any one of claims 1-9.