Coaxial structure glue filling and hole forming process for high-frequency signal transmission testing

Abstract

The present application relates to the technical field of high-frequency signal transmission testing, and in particular to a coaxial structure glue filling and hole forming process for high-frequency signal transmission testing, comprising machining a glue filling hole on a test seat component, selecting silicone and filling it into the hole; placing the test seat component after glue filling in a heating device and heating it to the temperature of the glue's optimal fluidity; when the silicone in the test seat component reaches the temperature of the optimal fluidity, repeatedly performing a vacuuming operation; after the vacuuming operation, continuing to heat the test seat component to 120 degrees by the heating device, and then allowing it to stand to room temperature after heating; and punching holes in the cured glue layer by mechanical processing methods to form a coaxial structure for high-frequency signal transmission testing. The process can discharge bubbles generated during the glue filling process to the maximum extent, thereby making the high-frequency signal transmission test less susceptible to influence.

Description

Technical Field

[0001] The present application relates to the technical field of high-frequency signal transmission testing, and in particular to a coaxial structure glue filling and hole forming process for high-frequency signal transmission testing. Background Art

[0002] As modern electronic devices and communication systems evolve toward higher speeds and higher frequencies, high-frequency signal transmission testing has become crucial for ensuring device performance. In actual testing, creating a coaxial structure by punching holes after potting not only allows for precise alignment between the probe and the medium, but also ensures impedance matching and low signal loss during transmission, effectively suppressing signal reflections and interference. This coaxial hole structure, formed using the potting process, directly impacts the accuracy of test results and the overall performance of the device.

[0003] At present, the traditional glue filling and hole forming process mainly adopts the following steps: first, glue is poured on the test seat component. When the temperature reaches the predetermined value, the vacuum process is started, and the bubbles in the glue are discharged using a low-pressure environment. The workpiece is then heated and dried. After cooling to room temperature, the glue layer is completely cured, and then holes are directly punched in the glue layer using mechanical processing methods to form the required test hole structure.

[0004] However, the existing process usually heats the glue to a predetermined temperature before starting the vacuuming process, and immediately cools it to room temperature to solidify after the vacuuming is completed. Since the glue may not reach its optimal fluidity when heated to this temperature, the bubbles in the glue cannot be eliminated to the greatest extent during vacuuming, and the cooling and solidification process further locks the remaining tiny bubbles. As a result, local bubbles still exist in the glue layer after solidification, which destroys the uniformity of the coaxial structure and affects the precise docking and impedance matching between the probe and the medium in the high-frequency signal transmission test. In summary, how to expel the bubbles generated in the glue filling process to the greatest extent possible so that the high-frequency signal transmission test is not easily affected is a current problem. Summary of the Invention

[0005] This application provides a coaxial structure glue filling and hole forming process for high-frequency signal transmission testing, which can maximize the removal of bubbles generated during the glue filling process, thereby making the high-frequency signal transmission test less susceptible to impact. This application provides the following technical solutions:

[0006] In a first aspect, the present application provides a coaxial structure glue filling and hole forming process for high-frequency signal transmission testing, comprising:

[0007] Process glue injection holes on the seat component to be tested, select silicone and inject it into the holes;

[0008] Place the test seat component after glue injection in a heating device and heat it to the temperature where the glue has the best fluidity;

[0009] When the test seat components reach the optimal fluidity temperature, the vacuum operation is repeated;

[0010] After the vacuum operation, continue to heat the test seat components to 120 degrees through the heating equipment, and then let it stand to room temperature;

[0011] Holes are punched into the cured adhesive by mechanical processing to form a coaxial structure for high-frequency signal transmission testing.

[0012] In a specific embodiment, after the vacuuming operation, the test seat component is further heated to 120 degrees by a heating device, and after being allowed to stand to room temperature after heating, the following steps are further included:

[0013] After the adhesive layer is completely cured and cooled to room temperature, the surface of the adhesive layer is leveled.

[0014] In a specific embodiment, placing the test seat component after glue injection in a heating device and heating it to the optimal fluidity temperature of the glue includes:

[0015] During the heating process, a uniform temperature rise method is adopted. After heating to the temperature at which the glue has the best fluidity, it is left to stand for a certain period of time.

[0016] In a specific embodiment, when the test seat component reaches the optimal fluidity temperature, repeatedly performing the vacuum operation includes:

[0017] For batch glue filling operations, a corresponding formula between the number of glue filling holes and the vacuum strength is derived based on experimental data, and the optimal vacuum strength is directly calculated according to the specific number of glue filling holes.

[0018] In a specific embodiment, the corresponding formula between the number of the glue filling holes and the vacuum strength is as follows:

[0019]

[0020] After calculating the corresponding vacuum strength according to the specific number of glue filling holes using the above formula, the integer closest to the result is taken as the optimal vacuum strength.

[0021] In a specific embodiment, the corresponding formula between the number of the glue filling holes and the vacuum strength is as follows:

[0022]

[0023] After calculating the corresponding vacuum strength according to the specific number of glue filling holes using the above formula, the integer closest to the result is taken as the optimal vacuum strength.

[0024] In a specific embodiment, after the vacuuming intensities are calculated by the above two methods, they are added together to obtain an average, and finally the nearest integer to the average is taken as the optimal vacuuming intensity.

[0025] In summary, the beneficial effects of this application include at least:

[0026] (1) By heating the glue to its optimal fluidity temperature before vacuuming, the glue can be kept in its optimal fluidity state and bubbles can be better removed, thereby reducing the residual bubbles during the curing process. This effect significantly improves the uniformity of the glue layer and provides a stable foundation for the subsequent coaxial hole structure.

[0027] (2) Through an innovative vacuuming process, combined with experimental data on different numbers of glue holes, a corresponding vacuuming strength formula is derived, which allows precise control of the vacuuming strength of each batch, thereby maximizing the removal of bubbles from the glue. Especially for batch production, it can ensure consistent bubble removal in each glue hole, preventing bubbles from remaining in the glue layer, further ensuring the uniformity and stability of the glue layer. It effectively eliminates the unevenness of the coaxial structure caused by residual bubbles, thereby avoiding interference with the high-frequency signal transmission test results.

[0028] (3) By effectively eliminating bubbles and ensuring a uniform adhesive layer, the resulting coaxial structure can achieve precise docking and impedance matching between the probe and the medium. This effectively suppresses reflections and interference during high-frequency signal transmission, ensuring the accuracy of high-frequency signal testing and the stability of equipment performance.

[0029] By designing glue filling holes and selecting glue with suitable fluidity and low dielectric constant, it is ensured that the glue is filled evenly and meets the requirements of subsequent testing. Then, after heating to the optimal fluidity temperature of the glue, the bubbles in the glue are expelled as much as possible through repeated vacuuming operations. The corresponding formula is derived based on the experimental data of different numbers of glue filling holes and vacuuming strengths, and the optimal vacuuming strength is quickly calculated and applied to ensure that the bubbles in the glue are eliminated to the maximum extent. Finally, after the glue layer is cured, it is leveled and a precise coaxial hole structure is formed through mechanical processing to ensure impedance matching and low loss of high-frequency signal transmission, thereby effectively improving test accuracy and equipment performance. This solution ensures the uniformity of the glue layer and the exclusion of bubbles by precisely controlling and optimizing the vacuuming strength, effectively solving the signal interference problem caused by residual bubbles and uneven glue layer in the existing technology, and improving the stability and accuracy of high-frequency signal transmission testing.

[0030] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application and to implement it in accordance with the contents of the specification, the following is a detailed description of the preferred embodiments of the present application in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a flow chart of the coaxial structure glue filling and hole forming process for high-frequency signal transmission testing in an embodiment of the present application. DETAILED DESCRIPTION

[0032] The following embodiments are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0033] Reference Figure 1 , is a flow chart of a coaxial structure glue filling and hole forming process for high-frequency signal transmission testing provided by an embodiment of the present application, including the following steps:

[0034] Step S1: Process a glue injection hole on the test seat component, select glue and inject it into the glue injection hole.

[0035] In step S1, glue injection holes are processed on the test seat component to ensure that the glue can be stably filled and form a uniform solidified layer. The size, shape and position of the injection hole should be precisely designed according to the subsequent high-frequency signal transmission test requirements so that it can meet the requirements of coaxial structure molding and signal transmission. Secondly, select glue suitable for high-frequency signal transmission environment. The glue should have the characteristic of a dielectric constant lower than a predetermined threshold to ensure that it will not cause additional attenuation or interference to signal transmission after curing. In addition, the glue should have good fluidity to facilitate the subsequent bubble removal process, and have appropriate viscosity to avoid uneven filling or sagging during the injection process. After selecting the glue, it is evenly injected into the processed glue injection hole. Large bubbles should be avoided during the injection process, and at the same time, it is ensured that the glue fully fills the entire injection hole to avoid gaps or uneven thickness of the local glue layer.

[0036] Step S2: Place the glue-injected test seat component in a heating device and heat it to the glue's optimal fluidity temperature.

[0037] In step S2, the test seat component after glue injection is placed in a heating device and gradually heated to the optimal fluidity temperature of the glue to ensure that the glue can reach the optimal flow state during the subsequent bubble removal process. The glue used in this application has an optimal fluidity temperature of 75 degrees, but in actual application, the temperature can be adjusted according to the specific characteristics of the glue. During the heating process, a uniform heating method must be adopted to avoid local overheating or excessive heating that causes uneven glue fluidity. At the same time, after heating to the target temperature, it is necessary to maintain a certain time so that the temperature of the entire glue-filling area is uniform and consistent, providing the best conditions for subsequent vacuum bubble removal.

[0038] It should be noted that when selecting glue, its optimal fluidity temperature should be obtained simultaneously. The methods of obtaining it include but are not limited to referring to the technical parameters provided by the glue supplier to directly obtain the optimal fluidity temperature, or, in an experimental environment, testing the fluidity of the glue under different temperature conditions to determine the temperature range for the best defoaming effect.

[0039] Step S3: When the test seat component reaches the optimal fluidity temperature, the vacuum operation is repeatedly performed.

[0040] In step S3, once the test socket component has been heated to the glue's optimal flowability temperature and the temperature is uniform, vacuuming is immediately performed. This is repeated, typically three times. By heating the glue to its optimal flowability temperature before vacuuming, bubbles are effectively removed from the glue at optimal flowability, thereby reducing residual bubbles during the curing process. This significantly improves the uniformity of the adhesive layer and provides a stable foundation for the subsequent coaxial hole structure.

[0041] Furthermore, in actual production processes, glue filling operations are typically performed in batches, rather than individually on individual glue filling holes. When vacuuming a cavity with different numbers of glue filling holes, different vacuum intensities are required due to differences in overall gas diffusion and glue degassing efficiency. Therefore, this application systematically tested different numbers of glue filling holes and obtained the experimental data shown in Table 1.

[0042] Table 1 Correspondence between number of holes and air pressure

[0043]

[0044]

[0045] At the same time, in order to quickly calculate the vacuum strength required for different batches of glue filling, a corresponding formula between the number of glue filling holes and the vacuum strength was derived based on experimental data, so that the optimal vacuum strength can be directly calculated according to the specific number of glue filling holes, thereby improving production efficiency and ensuring maximum air bubble exhaust.

[0046] Specifically, the corresponding formula between the number of glue holes N and the vacuum strength P(N) is as follows:

[0047]

[0048] After using the above formula to calculate the corresponding vacuum strength for a specific number of glue holes, the nearest integer is taken as the optimal vacuum strength. The above formula was designed based on experimental data and uses piecewise logarithmic + linear growth to balance accuracy and computability, maximizing the matching of experimental data growth trends while avoiding overly complex mathematical derivations. This allows for rapid calculation of vacuum strengths corresponding to different numbers of glue holes, improving production efficiency, maximizing bubble elimination, and enhancing test accuracy.

[0049] In another feasible embodiment, by observing the data, it is found that the growth is faster in the initial stage, slower in the middle stage, and faster in the latter stage. A nonlinear growth function can be selected to describe the trend of fast growth in the early stage, slow growth in the middle stage, and accelerated growth in the latter stage. The corresponding formula between the number of glue holes N and the vacuum strength P(N) is as follows:

[0050]

[0051] After using the above formula to calculate the corresponding vacuum strength based on the specific number of glue holes, the nearest integer is taken as the optimal vacuum strength. By combining logarithmic and exponential functions, this method cleverly simulates the nonlinear relationship between the number of glue holes and vacuum strength, achieving rapid growth in the early stages, stability in the middle stages, and acceleration in the later stages, accurately matching the vacuum requirements of different production batches. This formula automatically calculates the optimal vacuum strength during the production process, while rounding the results to avoid subjective operator error. This not only improves bubble removal and ensures glue layer uniformity, but also reduces the complexity of test adjustments, improves the stability and accuracy of high-frequency signal transmission testing, and ultimately ensures an efficient and stable production process.

[0052] In another feasible embodiment, the vacuuming intensities may be calculated by the above two methods, and then added to obtain an average, and finally the nearest integer to the average is taken as the optimal vacuuming intensity.

[0053] Step S4: After the vacuum operation, the test seat component is further heated to 120 degrees by the heating device, and then allowed to stand until it reaches room temperature.

[0054] In step S4, after the vacuuming operation is complete, the test socket component is heated to 120°C and maintained at this temperature for a period of time to ensure that the glue is fully cured and achieves optimal physical properties. The heated component is then allowed to cool to room temperature, typically for about two hours, until the glue layer has completely cooled and solidified. This step helps ensure a stable and strong glue layer, preventing deformation or unevenness during subsequent operations.

[0055] Step S5: After the adhesive layer is completely cured and cooled to room temperature, the surface of the adhesive layer is leveled.

[0056] In step S5, the main purpose of the leveling process is to eliminate the undulations that may occur during the glue pouring process, ensuring a smooth and flat surface. This process can eliminate surface unevenness, thereby ensuring the accuracy of subsequent machining and the stability of the coaxial structure.

[0057] Step S6: drilling holes in the cured adhesive by mechanical processing to form a coaxial structure for high-frequency signal transmission testing.

[0058] Finally, in step S6, a hole is punched into the leveled cured adhesive using mechanical processing to form a coaxial structure for high-frequency signal transmission testing. This hole structure ensures precise docking between the probe and the medium, and achieves good impedance matching during high-frequency signal transmission testing, thereby ensuring signal accuracy during testing, suppressing signal reflections and interference, and improving the measurement accuracy of device performance.

[0059] In summary, this innovative glue potting and hole-forming process addresses the issues of traditional glue potting processes, such as the inability to minimize bubble removal and uneven glue layers, which can lead to unstable coaxial structures. Specifically, during the glue potting phase, the glue filling holes are designed and glue with suitable fluidity and a low dielectric constant is selected to ensure uniform glue filling and meet subsequent testing requirements. Next, after heating the glue to its optimal fluidity temperature, bubbles are removed from the glue through repeated vacuuming. Based on experimental data on the number of glue potting holes and vacuuming intensity, a formula is derived to quickly calculate and apply the optimal vacuuming intensity to ensure maximum bubble removal. Finally, after the glue layer cures, it is leveled and machined to form a precise coaxial hole structure, ensuring impedance matching and low loss for high-frequency signal transmission, thereby effectively improving test accuracy and equipment performance. This solution ensures uniform glue layer and bubble removal by precisely controlling and optimizing the vacuuming intensity, effectively addressing signal interference issues caused by residual bubbles and uneven glue layers in existing technologies and improving the stability and accuracy of high-frequency signal transmission testing.

[0060] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0061] The above embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art could make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A coaxial structure glue filling and hole forming method for high-frequency signal transmission testing, characterized in that: include: Process glue injection holes on the seat component to be tested, select silicone and inject it into the holes; Place the test seat component after glue injection in a heating device and heat it to the temperature where the glue has the best fluidity; When the test seat components reach the optimal fluidity temperature, the vacuum operation is repeated, including: for batch glue filling operations, the corresponding formula between the number of glue filling holes and the vacuum strength is derived based on experimental data, and the optimal vacuum strength is directly calculated according to the specific number of glue filling holes; The corresponding formula between the number of glue filling holes and the vacuum strength is as follows: ； After using the above formula to calculate the corresponding vacuum strength according to the specific number of glue holes, take the integer closest to the result as the optimal vacuum strength; Alternatively, the corresponding formula between the number of glue filling holes and the vacuum strength is as follows: ； After using the above formula to calculate the corresponding vacuum strength according to the specific number of glue holes, take the integer closest to the result as the optimal vacuum strength; Alternatively, after the vacuuming strength is calculated by the above two methods, the sum is added to obtain the average, and finally the nearest integer of the average is taken as the optimal vacuuming strength; After the vacuum operation, continue to heat the test seat components to 120 degrees through the heating equipment, and then let it stand to room temperature; Holes are punched into the cured adhesive by mechanical processing to form a coaxial structure for high-frequency signal transmission testing.

2. The coaxial structure glue filling and hole forming method for high-frequency signal transmission testing according to claim 1 is characterized in that: After the vacuuming operation, the test seat component is further heated to 120 degrees by a heating device, and after being allowed to stand to room temperature after heating, the following steps are further included: After the adhesive layer is completely cured and cooled to room temperature, the surface of the adhesive layer is leveled.

3. The coaxial structure glue filling and hole forming method for high-frequency signal transmission testing according to claim 1 is characterized in that: Placing the test seat component after the injection of glue in a heating device and heating it to the temperature at which the glue has the best fluidity comprises: During the heating process, a uniform temperature rise method is adopted. After heating to the temperature at which the glue has the best fluidity, it is left to stand for a certain period of time.

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