Server

Abstract

The invention provides a server which comprises a server body, an inner shell and an outer shell arranged outside the inner shell in a sleeving mode are arranged in the server body, and the inner shell comprises a mounting cavity; and the heat dissipation assembly is arranged in the mounting cavity, is connected with the bottom of the inner shell, and is used for arranging electronic components and carrying out heat dissipation on the electronic components. The problems that in the prior art, a server is poor in fireproof and heat insulation effect, heat at the bottom of an inner cavity is concentrated and not prone to being dissipated quickly, and the service life of the server is affected are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of servers, and more particularly, to a server. Background Art

[0002] A multi-functional network information security server, also known as a server, is usually used in cooperation with a computer. Inside the server, there are installed a processor, a hard disk, a memory, a system bus, etc. By using the server in cooperation with the computer, the running speed and information security can be greatly increased. However, there are still some defects in the structure of the existing multi-functional network information security servers, and the specific defects are as follows:

[0003] First of all, the outer shell of the server in the prior art often uses a single layer of metal shell, which does not have the effect of fire prevention and heat insulation. When an accident occurs, such as a fire, the single metal shell cannot protect the internal structure of the server.

[0004] Secondly, structures such as the processor and the hard disk are also mostly directly installed at the bottom of the inner cavity of the server, which will cause a large amount of heat to accumulate at the bottom of the inner cavity of the server during operation and cannot be quickly dissipated. In the long run, it will affect the running speed and service life of the server. Summary of the Invention

[0005] The main object of the present invention is to provide a server to solve the problems in the prior art that the server has poor fire prevention and heat insulation effects, and the heat at the bottom of the inner cavity is relatively concentrated and not easily dissipated quickly, which affects the service life of the server.

[0006] To achieve the above object, according to one aspect of the present invention, there is provided a server, including: a server body, an inner shell is arranged in the server body and an outer shell sleeved outside the inner shell, the inner shell includes an installation cavity; a heat dissipation component, the heat dissipation component is arranged in the installation cavity and is connected to the bottom of the inner shell for arranging electronic components and dissipating heat from the electronic components.

[0007] Further, the heat dissipation component further includes: a mounting member, the mounting member is connected to the bottom of the inner shell, and a mounting groove is arranged in the mounting member, and the electronic components are arranged on the mounting member; a heat dissipation member, at least a part of the heat dissipation member is arranged in the mounting groove to dissipate heat from the electronic components located on the heat dissipation component.

[0008] Further, the heat dissipation member includes: a heat conducting plate, the heat conducting plate is clamped in the mounting groove; a heat dissipation groove, the heat dissipation groove penetrates through the heat conducting plate, and the number of the heat dissipation grooves is multiple, and the multiple heat dissipation grooves are arranged at intervals and parallel to each other in the width direction of the heat conducting plate.

[0009] Further, the heat dissipation component further includes: a heat sink, which is disposed on one side of the heat conduction plate close to the bottom of the inner housing. The number of heat sinks is multiple, and the multiple heat sinks are arranged at intervals corresponding to the multiple heat dissipation grooves one by one. A plurality of heat dissipation holes are arranged on each heat sink at intervals along the length direction of the heat sink to transfer the heat of the heat conduction plate into the heat dissipation holes of the heat sink.

[0010] Further, a plurality of cushion blocks and a plurality of fasteners are further arranged on the mounting component. The plurality of cushion blocks are arranged at intervals below the mounting component. Among them, the plurality of cushion blocks and the plurality of fasteners are arranged corresponding to each other one by one. One end of each fastener passes through the mounting component and the corresponding cushion block and is fixed to the bottom of the inner housing to connect the mounting component and the inner housing.

[0011] Further, the inner housing includes a ventilation opening, which is arranged on the bottom of the inner housing. The heat dissipation assembly further includes: a first heat dissipation fan, at least part of which is arranged below the ventilation opening and faces the ventilation opening; and / or a liquid cooling component, which is located in the installation cavity.

[0012] Further, a plurality of fixing components are arranged at intervals between the first heat dissipation fan and the ventilation opening to fix the first heat dissipation fan in the ventilation opening; and / or the liquid cooling component is a liquid cooling pipe; and / or the liquid cooling component is provided with a liquid inlet and a liquid outlet. Among them, both the liquid inlet and the liquid outlet extend into the installation cavity, and sealing covers are arranged at both the liquid inlet and the liquid outlet; and / or a plurality of support rods are inserted into the ventilation opening. The plurality of support rods are arranged above the first heat dissipation fan, and the liquid cooling component is arranged at one end of the support rod far from the first heat dissipation fan to support the liquid cooling component; and / or a clamping groove is further arranged on the support rod to be in clamping fit with the liquid cooling component.

[0013] Further, the server further includes: a plurality of second heat dissipation fans, the number of the second heat dissipation fans is multiple, and the plurality of second heat dissipation fans are arranged on the inner wall surface of the inner housing and are arranged side by side; ventilation holes, the number of the ventilation holes is multiple, and the plurality of ventilation holes all penetrate through the server body and are located on the inner wall surface corresponding to the second heat dissipation fans to communicate the second heat dissipation fans with the outside of the server.

[0014] Further, a main heat insulation layer is further arranged between the inner housing and the outer housing; and / or a maintenance opening is arranged at the top of the server, and a maintenance cover is arranged at the maintenance opening. An auxiliary heat insulation layer is arranged at the bottom of the maintenance cover; and / or a sealing gasket is arranged around the bottom of the maintenance cover.

[0015] Further, protective corners are arranged at the four corners of the server; and / or support components are arranged around the bottom of the server, and support gaskets are arranged at the bottoms of the support components, and anti-slip layers are arranged at the bottoms of the support gaskets.

[0016] Applying the technical solution of the present invention, the sleeve design between the inner housing and the outer housing in the server body of the present invention, together with the setting of the heat dissipation component, provides fire and heat insulation protection. Moreover, the heat dissipation component is located in the installation cavity and is connected to the bottom of the inner housing 110, which can be in direct contact with or close to the electronic components, and can quickly absorb and guide the heat generated during the operation of the electronic components, forming a strong heat barrier, avoiding performance degradation or failures caused by overheating of the internal components, improving the operation stability and service life of the server, and also preventing the spread of flames and high temperatures to the internal electronic components in case of emergencies such as fires, ensuring the safety of data and hardware, and effectively solving the problems in the prior art that the fire and heat insulation effect of the server is poor, and the heat at the bottom of the inner cavity is relatively concentrated and not easily dissipated quickly, affecting the service life of the server. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings forming a part of this application are used to provide a further understanding of the present invention. The schematic embodiments and descriptions thereof of the present invention are used to explain the present invention and do not constitute an improper limitation to the present invention. In the drawings:

[0018] Figure 1 Shows a schematic internal structure diagram of a server according to an embodiment of the present invention;

[0019] Figure 2 Shows Figure 1 A schematic structural diagram of the heat conduction plate, heat sink and spacer of the server shown;

[0020] Figure 3 Shows a schematic internal structure diagram of another embodiment of a server according to the present invention;

[0021] Figure 4 Shows a schematic external structure diagram of a server according to the present invention.

[0022] Among them, the above-mentioned accompanying drawings include the following reference numerals:

[0023] 10. Server body; 110. Inner housing; 120. Outer housing; 130. Main heat insulation layer;

[0024] 20. Installation cavity; 30. Heat dissipation component; 40. Ventilation opening; 50. Support rod; 60. Card slot; 70. Second cooling fan; 80. Ventilation hole; 90. Maintenance cover;

[0025] 100. Protective angle; 200. Support member; 300. Support gasket; 400. Anti-slip layer;

[0026] 330. Heat dissipation part; 331. Heat conduction plate; 332. Heat dissipation groove; 333. Heat sink; 334. Heat dissipation hole;

[0027] 310. Installation component; 311. Spacer; 312. Fastener;

[0028] 320. Installation groove;

[0029] 301. First cooling fan; 303. Fixing component;

[0030] 302. Liquid cooling component; 3021. Liquid inlet; 3022. Liquid outlet; 3023. Sealing cover. Detailed implementation mode

[0031] It should be noted that, without conflict, the embodiments in this application and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the drawings and in combination with the embodiments.

[0032] As Figures 1 to 4 shown, the server of the present invention includes: a server body 10, an inner housing 110 is arranged inside the server body 10, and an outer housing 120 is sleeved outside the inner housing 110. The inner housing 110 includes an installation cavity 20; a heat dissipation component 30 is arranged in the installation cavity 20 and is connected to the bottom of the inner housing 110 for arranging electronic components and dissipating heat from the electronic components.

[0033] In this way, the sleeved design between the inner housing 110 and the outer housing 120 in the server body 10 of the present invention, and the setting of the heat dissipation component 30 together provide fireproof and heat insulation protection, forming a strong heat barrier. Moreover, the heat dissipation component 30 is located in the installation cavity 20 and is connected to the bottom of the inner housing 110, which can directly contact or be close to the electronic components, can quickly absorb and guide the heat generated when the electronic components operate, avoid the performance degradation or failure caused by overheating of the internal components, improve the operation stability and service life of the server, and also avoid the spread of flames and high temperatures to the internal electronic components in case of emergencies such as fires, ensure the safety of data and hardware, and effectively solve the problems in the prior art that the fireproof and heat insulation effect of the server is poor, and the heat at the bottom of the inner cavity is relatively concentrated and not easy to dissipate quickly, affecting the service life of the server.

[0034] As Figures 1 to 2As shown, in an embodiment of the present invention, the heat dissipation component 30 further includes: a mounting component 310, the mounting component 310 is connected to the bottom of the inner housing 110, and a mounting groove 320 is provided in the mounting component 310, and the electronic component is arranged on the mounting component 310; a heat dissipation component 330, at least part of the heat dissipation component 330 is arranged in the mounting groove 320 to dissipate heat from the electronic component located on the heat dissipation component 30. At least part of the heat dissipation component 330 is directly arranged in the mounting groove 320, and its close contact with the electronic component can quickly absorb the heat generated by the electronic component during operation and effectively dissipate it through its own heat conduction and heat dissipation mechanism, avoiding the accumulation of heat around the electronic component, significantly improving the heat dissipation efficiency, and thus ensuring the stable operation of the server and extending the service life of the electronic component.

[0035] Specifically, the heat dissipation component 330 includes: a heat conduction plate 331, the heat conduction plate 331 is clamped in the mounting groove 320, and the heat conduction plate 331 is directly in contact with the electronic component, and its excellent heat conduction performance quickly absorbs the heat generated by the electronic component; the heat dissipation component 330 further includes heat dissipation grooves 332, the heat dissipation grooves 332 penetrate through the heat conduction plate 331, and the number of the heat dissipation grooves 332 is multiple. The multiple heat dissipation grooves 332 are arranged at intervals and in parallel along the width direction of the heat conduction plate 331 within the heat conduction plate 331. The arrangement of the multiple heat dissipation grooves 332 not only increases the contact area between the heat conduction plate 331 and the air, but also promotes the flow of air in the heat conduction plate, improves the efficiency of heat conduction and heat convection, enables the heat to be transferred from the electronic component to the heat dissipation system inside the server faster, and then dissipated to the external environment.

[0036] Preferably, the internal structure of the electronic component includes structures such as a processor and a hard disk.

[0037] As Figure 2 shown, the heat dissipation component 330 further includes: heat dissipation fins 333, the heat dissipation fins 333 are arranged on one side of the heat conduction plate 331 close to the bottom of the inner housing 110. The close contact between the heat dissipation fins 333 and the heat conduction plate 331 can quickly absorb and dissipate the heat on the heat conduction plate 331; the number of the heat dissipation fins 333 is multiple, and the multiple heat dissipation fins 333 are arranged at intervals corresponding to the multiple heat dissipation grooves 332 one by one, increasing the area of heat exchange and accelerating the heat transfer. A plurality of heat dissipation holes 334 are arranged at intervals along the length direction of each heat dissipation fin 333 to transfer the heat of the heat conduction plate 331 into the heat dissipation holes 334 of the heat dissipation fins 333. The plurality of heat dissipation holes 334 arranged on each heat dissipation fin 333 further improves the air circulation and promotes heat convection, enabling the heat dissipation fins to more effectively dissipate the heat into the cooling air flow inside the server, and greatly improving the efficiency of the entire heat dissipation system.

[0038] Preferably, a plurality of cushion blocks 311 and a plurality of fasteners 312 are further provided on the mounting member 310. The plurality of cushion blocks 311 are arranged at intervals below the mounting member 310. The arrangement of the cushion blocks 311 can increase the contact area between the mounting member 310 and the bottom of the inner housing 110, thereby providing a more stable support, effectively reducing displacement and damage caused by vibration of internal components of the server or external impact, and ensuring the stability of the server operation. Among them, the plurality of cushion blocks 311 and the plurality of fasteners 312 are arranged in one-to-one correspondence. One end of each fastener 312 passes through the mounting member 310 and the corresponding cushion block 311 and is fixed to the bottom of the inner housing 110 to connect the mounting member 310 and the inner housing 110. The combined use of the cushion blocks 311 and the fasteners 312 makes the installation and disassembly of the mounting member 310 very convenient. The fastener 312 passes through the mounting member 310 and the cushion block 311 to connect the inner housing 110. This fixing method is not only stable but also facilitates the maintenance personnel to quickly disassemble and assemble without complex tools, reducing the maintenance difficulty and cost.

[0039] Preferably, in the present invention, by providing the mounting member 310 and the cushion block 311, structures such as the processor and the hard disk can be lifted, avoiding the heat generated during their operation from being stored at the bottom of the inner cavity of the server, and further avoiding the spread of flames and high temperatures to the internal electronic components in case of emergencies such as fires.

[0040] As Figure 4 shown, in another embodiment of the present invention, the inner housing 110 includes a ventilation opening 40. The ventilation opening 40 is provided on the bottom of the inner housing 110. The arrangement of the ventilation opening 40 provides a channel for air flow, and the use of the first heat dissipation fan 301 can significantly increase the air flow through the ventilation opening, accelerating the heat exchange process, thereby improving the heat dissipation efficiency of the server; the heat dissipation assembly 30 further includes: a first heat dissipation fan 301, at least a part of the first heat dissipation fan 301 is arranged below the ventilation opening 40 and is arranged facing the ventilation opening 40; and / or a liquid cooling component 302, the liquid cooling component 302 is located in the installation cavity 20. The introduction of the liquid cooling component 302 provides a more effective heat dissipation method for high-power or high-heat-density electronic components. Compared with the air cooling of the prior art, the liquid cooling has higher heat transfer efficiency and lower noise, can significantly reduce the operating temperature of the server, and improve the overall stability and efficiency of the server.

[0041] Preferably, a filter screen is further provided at the bottom of the ventilation opening 40, which can specifically be a wire protection net, and can play a role in dust protection.

[0042] Specifically, a plurality of fixing components 303 are arranged at intervals between the first cooling fan 301 and the ventilation opening 40 to fix the first cooling fan 301 within the ventilation opening 40. The arrangement of the plurality of fixing components 303 ensures the stable fixation of the first cooling fan 301 within the ventilation opening 40, avoids vibrations and displacements during operation, and improves the reliability and efficiency of the cooling system.

[0043] Preferably, the liquid cooling component 302 is a liquid cooling pipe, and the liquid cooling component 302 adopts an S-shaped liquid cooling pipe, which effectively increases the heat exchange area between the coolant and the heat sources inside the server, and improves the heat dissipation efficiency of liquid cooling.

[0044] Preferably, the cooperation between the liquid cooling component 302 and the first cooling fan 301 can achieve the effect of cooling and heat dissipation, thereby quickly dissipating heat from the inner cavity of the server.

[0045] Preferably, the liquid cooling component 302 is provided with a liquid inlet 3021 and a liquid outlet 3022. Among them, both the liquid inlet 3021 and the liquid outlet 3022 extend into the installation cavity 20, and sealing covers 3023 are provided at both the liquid inlet 3021 and the liquid outlet 3022. When the sealing covers 3023 are in a closed state, it effectively prevents the leakage of the coolant and protects the internal electronic components of the server from damage; at the same time, the sealing covers 3023 can be easily opened when needed to add or replace the coolant, realizing the maintenance and management of the liquid cooling system.

[0046] Preferably, the sealing covers 3023 are threadedly connected to the liquid inlet 3021 and the liquid outlet 3022. The inner wall surface of the liquid cooling component 302 at the liquid inlet 3021 and the liquid outlet 3022 is provided with internal threads, and the sealing covers 3023 are provided with external threads for connecting with the liquid cooling component 302 at the liquid inlet 3021 and the liquid outlet 3022. This threaded connection method effectively avoids the phenomenon of water leakage.

[0047] A plurality of support rods 50 are inserted into the ventilation opening 40. The plurality of support rods 50 are arranged above the first cooling fan 301, and the liquid cooling component 302 is arranged at one end of the support rods 50 away from the first cooling fan 301, that is, the support rods 50 are arranged between the first cooling fan 301 and the liquid cooling component 302 to support the liquid cooling component 302.

[0048] Preferably, the support rods 50 are further provided with clamping grooves 60 for clamping and cooperating with the liquid cooling component 302. The plurality of support rods 50 are arranged in the ventilation opening 40, which can not only stably support the liquid cooling component 302 and avoid the sagging or displacement of the liquid cooling component 302 under the action of gravity, but also the clamping and cooperating of the clamping grooves 60 and the liquid cooling component 302 realizes the quick positioning and installation of the liquid cooling component, ensuring the precise layout and efficient operation of the liquid cooling system.

[0049] In two embodiments of the present invention, the server includes: a second cooling fan 70, and the number of the second cooling fans 70 is multiple. The multiple second cooling fans 70 are arranged on the inner wall surface of the inner housing 110, and the multiple second cooling fans 70 are arranged in parallel. The multiple second cooling fans 70 arranged in parallel on the inner wall surface of the inner housing 110 can generate stronger airflows, accelerating the heat convection process inside the server, effectively carrying the heat generated by electronic components to the outside of the server through air flow, thereby significantly improving the heat dissipation efficiency. This design with multiple fans can also ensure the uniformity of heat dissipation, avoid local overheating, and protect the internal components of the server from high-temperature damage. The server also includes: ventilation holes 80, and the number of the ventilation holes 80 is multiple. The multiple ventilation holes 80 all penetrate through the server body 10 and are located on the inner wall surface corresponding to the second cooling fans 70 to connect the second cooling fans 70 with the outside of the server. The arrangement of the multiple ventilation holes 80 not only provides a direct connection channel between the second cooling fans 70 and the external environment but also allows external cooling air to enter the server interior to form an effective air circulation. This ventilation hole design helps introduce fresh cold air and accelerate the discharge of hot air, thereby maintaining the temperature inside the server at a relatively low and stable level, which is beneficial to improving the operating efficiency and long-term stability of the server.

[0050] Preferably, a main heat insulation layer 130 is further arranged between the inner housing 110 and the outer housing 120. The arrangement of the main heat insulation layer 130 further enhances the fire and heat insulation capabilities of the server housing. Even in case of a fire or a high-temperature environment, it can effectively delay the conduction of heat to the interior of the server, protect the electronic components inside the server from being damaged by high temperature, and ensure the security of data and the stable operation of the server.

[0051] Preferably, a maintenance opening is arranged at the top of the server, and a maintenance cover 90 is arranged at the maintenance opening. An auxiliary heat insulation layer is arranged at the bottom of the maintenance cover 90, providing additional heat insulation protection for the maintenance opening at the top of the server. After closing the maintenance opening, the auxiliary heat insulation layer helps restore the heat insulation performance of the server and maintain a stable internal temperature.

[0052] Optionally, a sealing gasket is arranged around the bottom of the maintenance cover 90. The sealing gasket is used to be clamped between the maintenance cover 90 and the maintenance opening, significantly improving the sealing performance at the maintenance opening and effectively preventing external impurities such as dust and moisture from entering the server interior.

[0053] Optionally, protective corners 100 are arranged at the four corners of the server. Bonding layers are arranged on the fitting surfaces of the protective corners 100 with the outer four corners of the server body 10. The arrangement of the protective corners 100 can protect the server, avoiding collisions and depressions and damages at the outer four corners of the server body 10 during handling.

[0054] Optionally, support components 200 are provided around the bottom of the server. A support gasket 300 is provided at the bottom of the support component 200, and an anti-slip layer 400 is provided at the bottom of each support gasket 300. The support component 200 and the support gasket 300 can lift the server body 10 by a certain height, preventing the bottom of the server body 10 from contacting the desktop or the placement table, which may cause heat to accumulate at the bottom of the server. The anti-slip layer 400 is made of a material with a high coefficient of friction, which can effectively prevent the server from sliding on a smooth or inclined surface.

[0055] From the above description, it can be seen that the above embodiments of the present invention achieve the following technical effects:

[0056] The present invention provides a server, including: a server body 10, an inner housing 110 is provided inside the server body 10, and an outer housing 120 is sleeved outside the inner housing 110. The inner housing 110 includes an installation cavity 20; a heat dissipation component 30, the heat dissipation component 30 is disposed in the installation cavity 20 and is connected to the bottom of the inner housing 110 for arranging electronic components and dissipating heat from the electronic components. It can be seen that the sleeved design between the inner housing 110 and the outer housing 120 in the server body 10 of the present invention, together with the setting of the heat dissipation component 30, provides fire and heat insulation protection. Moreover, the heat dissipation component 30 is located in the installation cavity 20 and is connected to the bottom of the inner housing 110, which can directly contact or be close to the electronic components, quickly absorb and guide the heat generated when the electronic components operate, forming a solid heat barrier, avoiding performance degradation or failures caused by overheating of internal components, improving the operation stability and lifespan of the server, and also preventing the spread of flames and high temperatures to internal electronic components in case of emergencies such as fires, ensuring the safety of data and hardware, and effectively solving the problems in the prior art that the server has poor fire and heat insulation effects, and the heat at the bottom of the inner cavity is relatively concentrated and not easily dissipated quickly, affecting the service life of the server.

[0057] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0058] Unless otherwise specifically stated, the relative arrangements, numerical expressions, and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present application. At the same time, it should be understood that, for the sake of convenience of description, the dimensions of the various parts shown in the drawings are not drawn in actual proportional relationships. Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the said technologies, methods, and devices should be regarded as part of the authorization specification. In all the examples shown and discussed here, any specific value should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0059] In the description of the present application, it should be understood that the orientation or positional relationships indicated by orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, perpendicular, horizontal", and "top, bottom" are generally based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description. Without contrary statements, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and thus should not be construed as limiting the protection scope of the present application; the orientation words "inside, outside" refer to the inside and outside relative to the contour of each component itself.

[0060] For the convenience of description, spatial relative terms such as "above...", "over...", "on the upper surface of...", "above" can be used here to describe the spatial positional relationship between a device or feature shown in the drawings and other devices or features. It should be understood that the spatial relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the drawings of the device. For example, if the device in the drawing is inverted, the device described as "above other devices or structures" or "over other devices or structures" will then be positioned "below other devices or structures" or "under other devices or structures". Thus, the exemplary term "above" can include both the orientations of "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and corresponding interpretations should be made for the spatial relative descriptions used here.

[0061] In addition, it should be noted that the use of words such as "first", "second" to limit components is only for the convenience of differentiating the corresponding components. Without additional statements, the above words have no special meanings, and thus should not be construed as limiting the protection scope of the present application.

[0062] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A server, characterized in that: include: A server body (10), wherein an inner shell (110) and an outer shell (120) sleeved outside the inner shell (110) are arranged inside the server body (10), and the inner shell (110) includes a mounting cavity (20); A heat dissipation component (30) is arranged in the installation cavity (20) and connected to the bottom of the inner shell (110) to be used for arranging electronic components and dissipating heat from the electronic components.

2. The server according to claim 1, characterized in that: The heat dissipation component (30) further comprises: A mounting component (310), the mounting component (310) being connected to the bottom of the inner housing (110), a mounting groove (320) being provided in the mounting component (310), and the electronic component being arranged on the mounting component (310); A heat dissipation component (330), at least a portion of which is disposed in the mounting groove (320) to dissipate heat for the electronic components located on the heat dissipation assembly (30).

3. The server according to claim 2, characterized in that: The heat dissipation component (330) comprises: A heat conducting plate (331), wherein the heat conducting plate (331) is clamped in the mounting groove (320); A heat dissipation groove (332), the heat dissipation groove (332) is arranged through the heat conducting plate (331), and there are a plurality of heat dissipation grooves (332), and the plurality of heat dissipation grooves (332) are arranged in parallel and at intervals along the width direction of the heat conducting plate (331) inside the heat conducting plate (331).

4. The server according to claim 3, characterized in that: The heat dissipation component (330) further includes: A heat sink (333), wherein the heat sink (333) is arranged on one side of the heat conducting plate (331) close to the bottom of the inner shell (110), and there are a plurality of heat sinks (333), and the plurality of heat sinks (333) are arranged in a one-to-one correspondence with the plurality of heat dissipation slots (332), and each of the heat sinks (333) is provided with a plurality of heat dissipation holes (334) arranged in a length direction of the heat sink (333) so as to transfer the heat of the heat conducting plate (331) to the heat dissipation holes (334) of the heat sink (333).

5. The server according to claim 2, characterized in that: The mounting component (310) is also provided with a plurality of pads (311) and a plurality of fasteners (312), and the plurality of pads (311) are arranged at intervals below the mounting component (310), wherein the plurality of pads (311) and the plurality of fasteners (312) are arranged in a one-to-one correspondence, and one end of each fastener (312) passes through the mounting component (310) and the corresponding pad (311) and is then fixed to the bottom of the inner shell (110) to connect the mounting component (310) and the inner shell (110).

6. The server according to claim 1, wherein: The inner shell (110) comprises a vent (40), wherein the vent (40) is arranged on the bottom of the inner shell (110), and the heat dissipation assembly (30) further comprises: a first cooling fan (301), at least a portion of the first cooling fan (301) being arranged below the ventilation opening (40) and facing the ventilation opening (40); and / or A liquid cooling component (302), wherein the liquid cooling component (302) is located in the installation cavity (20).

7. The server according to claim 6, characterized in that: A plurality of fixing components (303) are arranged at intervals between the first cooling fan (301) and the ventilation opening (40) so as to fix the first cooling fan (301) in the ventilation opening (40); and / or The liquid cooling component (302) is a liquid cooling pipe; and / or The liquid cooling component (302) is provided with a liquid inlet (3021) and a liquid outlet (3022), wherein the liquid inlet (3021) and the liquid outlet (3022) both extend into the installation cavity (20), and the liquid inlet (3021) and the liquid outlet (3022) are both provided with sealing covers (3023); and / or A plurality of support rods (50) are inserted into the vent (40), the plurality of support rods (50) are arranged above the first cooling fan (301), and the liquid cooling component (302) is arranged at an end of the support rods (50) away from the first cooling fan (301) to support the liquid cooling component (302); and / or The support rod (50) is also provided with a slot (60) for engaging with the liquid cooling component (302).

8. The server according to claim 1, wherein: The server also includes: A second cooling fan (70), wherein the number of the second cooling fans (70) is plural, the plurality of the second cooling fans (70) are arranged on the inner wall surface of the inner shell (110), and the plurality of the second cooling fans (70) are arranged in parallel; Ventilation holes (80), the number of the ventilation holes (80) is multiple, and the multiple ventilation holes (80) all penetrate the server body (10) and are located on the inner wall surface corresponding to the second cooling fan (70) to connect the second cooling fan (70) with the outside of the server.

9. The server according to claim 1, wherein: A main heat insulation layer (130) is further provided between the inner shell (110) and the outer shell (120); and / or The top of the server is also provided with an inspection port, the inspection port is provided with an inspection cover (90), and the bottom of the inspection cover (90) is provided with an auxiliary heat insulation layer; and / or A sealing gasket is arranged around the bottom of the inspection cover (90).

10. The server according to claim 1, wherein: The four corners of the server are all provided with protective corners (100); and / or Support components (200) are arranged around the bottom of the server, a support pad (300) is arranged at the bottom of the support component (200), and an anti-slip layer (400) is arranged at the bottom of the support pad (300).

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