Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component including: a main body including a capacitance forming portion including dielectric layers and internal electrodes alternately stacked with the dielectric layers, and a cover portion covering the internal electrodes, the cover portion is provided on both surfaces of the capacitance forming portion in a stacking direction of the dielectric layer and the inner electrode. And an external electrode disposed on the main body. When a region introduced inward from a surface of the main body and including glass is defined as an introduction portion, the introduction portion is disposed between the capacitance forming portion and the cover portion.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2023-0196825, filed with the Korean Intellectual Property Office on December 29, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a multi-layer electronic component. Background Art

[0003] A multi-layer ceramic capacitor (MLCC), which is a multi-layer electronic component, is a chip capacitor that is mounted on a printed circuit board of various electronic products (such as imaging devices (e.g., liquid crystal displays (LCDs) and plasma display panels (PDPs)), computers, smart phones, mobile phones, etc.) and is used for charging or discharging.

[0004] Such a multi-layer ceramic capacitor can be used as a component in various electronic devices due to its small size, high capacitance, and easy installation. As various electronic devices such as computers and mobile devices are miniaturized and have higher outputs, the requirements for miniaturization and higher capacitance of multi-layer ceramic capacitors are increasing day by day.

[0005] In addition, in order to protect the inner electrodes forming the capacitance, covering portions are provided on the upper and lower portions of the capacitance forming portion to protect the inner electrodes. However, since external moisture may easily penetrate into the interface between the capacitance forming portion and the covering portion, the interface between the capacitance forming portion and the covering portion is a portion with weak moisture resistance reliability, and various attempts have been made to solve this problem. Summary of the Invention

[0006] One aspect of the present disclosure is to improve the interfacial bonding strength between the capacitance forming portion and the covering portion.

[0007] One aspect of the present disclosure is to provide a multi-layer electronic component having improved moisture resistance reliability.

[0008] According to one aspect of the present disclosure, a multi-layer electronic component includes: a main body including a capacitance forming portion and a covering portion, the capacitance forming portion including dielectric layers and inner electrodes alternately stacked, the covering portion being provided on two surfaces of the capacitance forming portion in the stacking direction of the dielectric layers and the inner electrodes; and external electrodes provided on the main body. When a region including glass introduced from the surface of the main body inward is defined as an introduction portion, the introduction portion is provided between the capacitance forming portion and the covering portion.

[0009] According to one aspect of the present disclosure, a multi-layer electronic component includes: a main body including a capacitance forming portion and a covering portion, the capacitance forming portion including a dielectric layer and inner electrodes stacked alternately with the dielectric layer, the covering portion being provided on two surfaces of the capacitance forming portion in a stacking direction of the dielectric layer and the inner electrodes; and an outer electrode provided on the main body. The introducing portion includes glass and extends from an end of the inner electrode into the interior of the main body along the inner electrode. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The above and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following detailed description in conjunction with the accompanying drawings, in which: Figure 1 is a schematic perspective view of a multi-layer electronic component according to an embodiment; Figure 2 is a schematic exploded perspective view showing a stacked structure of the main body; Figure 3 is along Figure 1 a schematic cross-sectional view taken along line I-I'; Figure 4 is Figure 3 a schematic enlarged view of area P1 of Figure 5 is a schematic cross-sectional view taken along line I-I' of a multi-layer electronic component according to another embodiment; and Figure 6 is Figure 5 a schematic enlarged view of area P2 of DETAILED DESCRIPTION

[0011] Hereinafter, embodiments of the present disclosure will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present disclosure can be modified in many different forms, and the scope of the present disclosure is not limited to the embodiments described below. In addition, the embodiments of the present disclosure are provided to more completely describe the present disclosure to those skilled in the art. Therefore, for clearer illustration, the shapes and dimensions of the elements in the drawings may be exaggerated, and the elements denoted by the same reference numerals in the drawings are the same elements.

[0012] In addition, in order to clearly describe the present disclosure in the drawings, parts irrelevant to the description are omitted, and the dimensions (e.g., thickness) of each component are arbitrarily shown in the drawings for convenience of description. Therefore, the present disclosure is not necessarily limited to the drawings. In addition, components having the same functions within the scope of the same concept are described using the same reference numerals. Furthermore, throughout the specification, when a certain component is referred to as "including" another component, unless otherwise specified, this means that the component may also include other components without excluding other components.

[0013] In the drawings, a first direction may be defined as a stacking direction or a thickness direction, a second direction may be defined as a length direction, and a third direction may be defined as a width direction.

[0014] Multi-layer electronic component Figure 1 A perspective view of a multilayer electronic component according to an embodiment is schematically shown.

[0015] Figure 2 It is an exploded perspective view showing the stacking structure of the main body.

[0016] Figure 3 It is along Figure 1 A cross-sectional view taken along line II'.

[0017] Figure 4 yes Figure 3 Magnified view of area P1.

[0018] Figure 5 is a cross-sectional view taken along line II′ of a multilayer electronic component according to another embodiment.

[0019] Figure 6 yes Figure 5 Magnified view of area P2.

[0020] In the following, reference will be made to Figures 1 to 6 The multilayer electronic component 100 according to the embodiment is described in detail. However, a multilayer ceramic capacitor will be described as an example of a multilayer electronic component, but the multilayer electronic component according to the present disclosure may also be various electronic components using a dielectric composition, such as an inductor, a piezoelectric element, a varistor, or a thermistor. In addition, unless there is a contradictory description, the description of the multilayer electronic component 100 according to the embodiment may also be applied to the multilayer electronic component 200 according to another embodiment.

[0021] According to an embodiment, a multilayer electronic component 100 includes a body 110 including a capacitance forming part Ac and cover parts 112 and 113, the capacitance forming part Ac including a dielectric layer 111 and internal electrodes 121 and 122 alternately stacked with the dielectric layer 111 in a stacking direction, the cover parts 112 and 113 being disposed on both surfaces of the capacitance forming part Ac in the stacking direction, and external electrodes 131 and 132 disposed on the body 110. When a region introduced inward from a surface of the body 110 and including the glass 150 is referred to as an introduction part 141, 142, 143, and 144, the introduction parts 141, 142, 143, and 144 may be disposed between the capacitance forming part Ac and the cover parts 112 and 113.

[0022] The body 110 may have dielectric layers 111 and internal electrodes 121 and 122 that are alternately stacked.

[0023] More specifically, the main body 110 may include a capacitance forming portion Ac, which forms a capacitance by including a first inner electrode 121 and a second inner electrode 122 that are alternately arranged to face each other with a dielectric layer 111 interposed therebetween.

[0024] Although the specific shape of the main body 110 is not particularly limited, as Figure 1 shown, the main body 110 may have a hexahedral shape or a shape similar to a hexahedral shape. Since the ceramic particles included in the main body 110 shrink during sintering, although the main body 110 does not have a perfect straight hexahedral shape, it may have a substantially hexahedral shape.

[0025] The main body 110 may have a first surface 1 and a second surface 2 that face each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and face each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and face each other in a third direction.

[0026] The plurality of dielectric layers 111 forming the main body 110 are in a sintered state, and adjacent dielectric layers 111 may be integrated to an extent that it is difficult to identify the boundary between them without using a scanning electron microscope (SEM).

[0027] There is no limitation on the raw material for forming the dielectric layer 111 as long as sufficient capacitance can be obtained. Generally, perovskite (ABO3)-based materials can be used. For example, barium titanate-based materials, lead composite perovskite-based materials, strontium titanate-based materials, etc. can be used. The barium titanate-based materials may include BaTiO3-based ceramic particles. Examples of BaTiO3-based ceramic particles may include BaTiO3 or (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1- x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3 (0 < y < 1).

[0028] In addition, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to powders such as barium titanate (BaTiO3) as raw materials for forming the dielectric layer 111 according to the uses of the present disclosure.

[0029] The thickness of the dielectric layer 111 does not need to be particularly limited.

[0030] In order to ensure the reliability of the multilayer electronic component 100 in a high-voltage environment, the thickness of the dielectric layer 111 may be less than or equal to 10.0 μm. In addition, in order to achieve miniaturization and high capacitance of the multilayer electronic component 100, the thickness of the dielectric layer 111 may be less than or equal to 3.0 μm, and in order to more easily achieve ultra-miniaturization and high capacitance, the thickness of the dielectric layer 111 may be less than or equal to 1.0 μm, preferably less than or equal to 0.6 μm, and more preferably less than or equal to 0.4 μm.

[0031] In this case, the thickness of the dielectric layer 111 may refer to the thickness of the dielectric layer 111 provided between the first internal electrode 121 and the second internal electrode 122.

[0032] In addition, the thickness of the dielectric layer 111 may refer to the dimension of the dielectric layer 111 in the first direction. In addition, the thickness of the dielectric layer 111 may refer to the average thickness of the dielectric layer 111, and may refer to the average dimension of the dielectric layer 111 in the first direction.

[0033] The average dimension of the dielectric layer 111 in the first direction can be measured by scanning an image of a cross-section of the main body 110 in the first and second directions at a magnification of 10,000 times using a scanning electron microscope (SEM). More specifically, the average dimension of a dielectric layer 111 in the first direction may refer to the average value calculated by measuring the dimension of a dielectric layer 111 in the first direction at 10 equally spaced points in the second direction in the scanned image. The 10 equally spaced points can be specified in the capacitance forming portion Ac. Additionally, if the average value measurement is extended to 10 dielectric layers 111 and the average value is calculated, the average dimension of the dielectric layer 111 in the first direction can be more generalized.

[0034] The internal electrodes 121 and 122 may be stacked alternately with the dielectric layer 111.

[0035] The internal electrodes 121 and 122 may include a first internal electrode 121 and a second internal electrode 122, the first internal electrode 121 and the second internal electrode 122 are alternately arranged to face each other with the dielectric layer 111 therebetween, and the first internal electrode 121 and the second internal electrode 122 may be respectively exposed to the third surface 3 and the fourth surface 4 of the main body 110.

[0036] More specifically, the first inner electrode 121 may be spaced apart from the fourth surface 4 and exposed through the third surface 3, and the second inner electrode 122 may be spaced apart from the third surface 3 and exposed through the fourth surface 4. The first outer electrode 131 is disposed on the third surface 3 of the main body 110 and connected to the first inner electrode 121, and the second outer electrode 132 is disposed on the fourth surface 4 of the main body 110 and connected to the second inner electrode 122.

[0037] For example, the first inner electrode 121 is connected to the first outer electrode 131 but not to the second outer electrode 132, and the second inner electrode 122 is connected to the second outer electrode 132 but not to the first outer electrode 131. In this case, the first inner electrode 121 and the second inner electrode 122 may be electrically separated from each other by the dielectric layer 111 disposed therebetween.

[0038] In addition, the main body 110 may be formed by alternately stacking a first green ceramic sheet on which a conductive paste for forming the first inner electrode 121 is printed and a second green ceramic sheet on which a conductive paste for forming the second inner electrode 122 is printed and then sintering them.

[0039] The materials for forming the inner electrodes 121 and 122 are not particularly limited, and materials having excellent conductivity may be used. For example, the inner electrodes 121 and 122 may include at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and their alloys.

[0040] Alternatively, the inner electrodes 121 and 122 may be formed by printing a conductive paste for forming the inner electrodes (including at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and their alloys) on the green ceramic sheet. The printing method of the conductive paste for the inner electrodes may be a screen printing method or a gravure printing method, and the present disclosure is not limited thereto.

[0041] In addition, the thicknesses of the inner electrodes 121 and 122 do not need to be particularly limited.

[0042] To ensure the reliability of the multilayer electronic component 100 in a high-voltage environment, the thicknesses of the inner electrodes 121 and 122 may be less than or equal to 3.0 μm. In addition, to achieve miniaturization and high capacitance of the multilayer electronic component 100, the thicknesses of the inner electrodes 121 and 122 may be less than or equal to 1.0 μm, and to more easily achieve ultra-miniaturization and high capacitance, the thicknesses of the inner electrodes 121 and 122 may be less than or equal to 0.6 μm, and more preferably less than or equal to 0.4 μm.

[0043] In this case, the thicknesses of the inner electrodes 121 and 122 may refer to the dimensions of the inner electrodes 121 and 122 in the first direction. Additionally, the thicknesses of the inner electrodes 121 and 122 may refer to the average thicknesses of the inner electrodes 121 and 122, and may refer to the average dimensions of the inner electrodes 121 and 122 in the first direction.

[0044] The average dimensions of the inner electrodes 121 and 122 in the first direction can be measured by scanning images of the cross-sections of the main body 110 in the first and second directions at a magnification of 10,000 times using a scanning electron microscope (SEM). More specifically, the average dimension of one inner electrode in the first direction can be the average value calculated by measuring the dimensions of one inner electrode in the first direction at 10 equally spaced points in the second direction in the scanned image. The 10 equally spaced points can be specified in the capacitance forming portion Ac. Additionally, if the measurement of the average value is extended to 10 inner electrodes and the average value is calculated, the average dimension of the inner electrodes in the first direction can be more generalized.

[0045] Furthermore, in an embodiment, when the average thickness of at least one of the plurality of dielectric layers 111 is td and the average thickness of at least one of the plurality of inner electrodes 121 and 122 is te, td and te may satisfy 2×te < td.

[0046] Specifically, the average thickness of one dielectric layer 111 may be greater than twice the average thickness of one of the inner electrodes 121 and 122. Specifically, the average thickness of the plurality of dielectric layers 111 may be greater than twice the average thickness of the plurality of inner electrodes 121 and 122.

[0047] Generally, reliability problems caused by a reduction in the breakdown voltage (BDV) in a high-voltage environment are the main problems of high-voltage electrical and electronic components.

[0048] Therefore, in order to prevent a reduction in the breakdown voltage in a high-voltage environment, the average thickness of the dielectric layer 111 may be made greater than twice the average thickness of the inner electrodes 121 and 122, thereby increasing the thickness of the dielectric layer (the distance between the inner electrodes) and improving the breakdown voltage characteristics.

[0049] If the average thickness of the dielectric layer 111 is less than or equal to twice the average thickness of the inner electrodes 121 and 122, the breakdown voltage may decrease due to the thin average thickness of the dielectric layer (the distance between the inner electrodes), and a short circuit may occur between the inner electrodes.

[0050] In addition, the main body 110 may include covering portions 112 and 113 provided on two surfaces of the capacitance forming portion Ac in the first direction.

[0051] Specifically, the main body 110 may include a first covering portion 112 disposed on one surface of the capacitor forming portion Ac in the first direction and a second covering portion 113 disposed on the other surface of the capacitor forming portion Ac in the first direction. More specifically, the main body 110 may include a first covering portion 112 disposed on the upper portion of the capacitor forming portion Ac in the first direction and a second covering portion 113 disposed on the lower portion of the capacitor forming portion Ac in the first direction.

[0052] The first covering portion 112 and the second covering portion 113 may be formed by stacking a single dielectric layer or two or more dielectric layers on the upper surface and the lower surface of the capacitor forming portion Ac in the first direction, respectively, and may mainly serve to prevent damage to the inner electrodes 121 and 122 due to physical stress or chemical stress.

[0053] The first covering portion 112 and the second covering portion 113 do not include the inner electrodes 121 and 122 and may include the same material as the dielectric layer 111. For example, the first covering portion 112 and the second covering portion 113 may include a ceramic material, such as a barium titanate (BaTiO3)-based ceramic material.

[0054] In addition, the thicknesses of the covering portions 112 and 113 do not need to be particularly limited.

[0055] However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the thicknesses of the covering portions 112 and 113 may be less than or equal to 100 μm, preferably less than or equal to 30 μm, and more preferably less than or equal to 20 μm in ultra-small products.

[0056] In this case, the thicknesses of the covering portions 112 and 113 may refer to the dimensions of the covering portions 112 and 113 in the first direction. In addition, the thicknesses of the covering portions 112 and 113 may refer to the average thicknesses of the covering portions 112 and 113 and may refer to the average dimensions of the covering portions 112 and 113 in the first direction.

[0057] The average dimensions of the covering portions 112 and 113 in the first direction may be measured by scanning an image of a cross-section of the main body 110 in the first and second directions at a magnification of 10,000 times using a scanning electron microscope (SEM). More specifically, the average dimensions of the covering portions 112 and 113 in the first direction may refer to the average value calculated by measuring the first direction dimensions of one covering portion at 10 equally spaced points in the second direction in the scanned image.

[0058] In addition, the average dimensions of the covering portions in the first direction measured by the above method may have substantially the same dimensions as the average dimensions of the covering portions in the first direction in the cross-sections of the main body 110 in the first and third directions.

[0059] In addition, the multilayer electronic component 100 may include side edge portions provided on two surfaces of the capacitance forming portion Ac in the third direction.

[0060] More specifically, the side edge portions may include a first side edge portion provided on one surface of the capacitance forming portion Ac in the third direction and a second side edge portion provided on the other surface of the capacitance forming portion Ac in the third direction.

[0061] The side edge portion may refer to a region between the third-direction surfaces of the first inner electrode 121 and the second inner electrode 122 and the outer surface of the main body 110 in a cross-section along the first direction and the third direction of the main body 110.

[0062] The side edge portion may be formed by not applying the conductive paste to portions of the green sheet for forming the capacitance forming portion Ac other than the portions where the inner electrodes 121 and 122 are to be formed. And in order to suppress the step difference caused by the inner electrodes 121 and 122, the side edge portion may be formed by the following method: after stacking the green sheets coated with the conductive paste to form a stack including the capacitance forming portion Ac, performing cutting on the stack such that the inner electrodes 121 and 122 are exposed on two surfaces of the capacitance forming portion Ac in the third direction, and then stacking a single dielectric layer or two or more dielectric layers along the third direction on the two surfaces of the capacitance forming portion Ac in the third direction.

[0063] The side edge portion may mainly function to prevent damage to the inner electrodes 121 and 122 due to physical stress or chemical stress.

[0064] The first side edge portion and the second side edge portion do not include the inner electrodes 121 and 122 and may include the same material as the dielectric layer 111. For example, the first side edge portion and the second side edge portion may include a ceramic material, such as a barium titanate (BaTiO3)-based ceramic material.

[0065] In addition, the widths of the first side edge portion and the second side edge portion do not need to be particularly limited.

[0066] However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component 100, the width of the side edge portion may be less than or equal to 100 μm, preferably less than or equal to 30 μm, and more preferably less than or equal to 20 μm in ultra-small products.

[0067] In this case, the width of the side edge portion may refer to the dimension of the side edge portion in the third direction. Additionally, the width of the side edge portion may refer to the average width of the side edge portion and may refer to the average dimension of the side edge portion in the third direction.

[0068] The average dimension of the side edge portion in the third direction can be measured by scanning an image of a cross-section of the main body 110 in the first and third directions at a magnification of 10,000 times using a scanning electron microscope (SEM). More specifically, the average dimension of the side edge portion in the third direction can refer to the average value calculated by measuring the third-direction dimension of one side edge portion at 10 equally spaced points in the first direction in the scanned image.

[0069] In the embodiment, a structure in which the multilayer electronic component 100 has two outer electrodes 131 and 132 is described, but the number or shape of the outer electrodes can be changed according to the shape of the inner electrodes 121 and 122 or other uses.

[0070] The outer electrodes 131 and 132 can be provided on the main body 110 and connected to the inner electrodes 121 and 122.

[0071] More specifically, the outer electrodes 131 and 132 can be respectively provided on the third surface 3 and the fourth surface 4 of the main body 110, and can include a first outer electrode 131 connected to the first inner electrode 121 and a second outer electrode 132 connected to the second inner electrode 122. For example, the first outer electrode 131 can be provided on the third surface 3 of the main body and connected to the first inner electrode 121, and the second outer electrode 132 can be provided on the fourth surface 4 of the main body and connected to the second inner electrode 122.

[0072] In addition, the outer electrodes 131 and 132 can be provided to extend to a part of the first surface 1 and the second surface 2 of the main body 110, or can be provided to extend to a part of the fifth surface 5 and the sixth surface 6 of the main body 110. For example, the first outer electrode 131 can be provided on a part of the first surface 1, a part of the second surface 2, a part of the fifth surface 5, and a part of the sixth surface 6 of the main body 110 and on the third surface 3 of the main body 110, and the second outer electrode 132 can be provided on a part of the first surface 1, a part of the second surface 2, a part of the fifth surface 5, and a part of the sixth surface 6 of the main body 110 and on the fourth surface 4 of the main body 110.

[0073] In addition, a part of the outer electrodes 131 and 132 can be provided in the introduction portions 141, 142, 143, and 144.

[0074] More specifically, the outer electrodes 131 and 132 can correspond to a structure in which the glass 150 fills at least a part of the introduction portions 141, 142, 143, and 144. However, the present disclosure is not particularly limited thereto, and as described later, in the structure in which the glass 250 fills the introduction portions 241 and 242, the outer electrodes 231 and 232 can have a structure in which the outer electrodes 231 and 232 are provided on the glass 250 and not inside the introduction portions 241 and 242.

[0075] In addition, the outer electrodes 131 and 132 may be formed of any conductive material (such as a metal), and the specific materials of the outer electrodes 131 and 132 may be determined by considering electrical characteristics, structural stability, etc., and the outer electrodes 131 and 132 may also have a multilayer structure.

[0076] For example, the outer electrodes 131 and 132 may include an electrode layer provided on the main body 110 and a plating layer provided on the electrode layer.

[0077] For a more specific example of the electrode layer, the electrode layer may include first electrode layers 131a and 132a and / or second electrode layers 131b and 132b. The first electrode layers 131a and 132a are sintered electrodes including a conductive metal and glass, and the second electrode layers 131b and 132b are resin-based electrodes including a conductive metal and a resin.

[0078] In this case, the conductive metal included in the first electrode layers 131a and 132a may be referred to as a first conductive metal, and the conductive metal included in the second electrode layers 131b and 132b may be referred to as a second conductive metal. In this case, the first conductive metal and the second conductive metal may be the same or different from each other, and in the case of including a plurality of conductive metals, the first conductive metal and the second conductive metal may only partially include the same conductive metal, but the present disclosure is not particularly limited.

[0079] In addition, the electrode layers 131a, 132a, 131b, and 132b may be in the form of sintered electrodes and resin-based electrodes sequentially formed on the main body 110.

[0080] In addition, the first electrode layers 131a and 132a may be formed by transferring a sheet including a conductive metal onto the main body, and the second electrode layers 131b and 132b may be formed by transferring a sheet including a conductive metal onto the sintered electrodes.

[0081] Materials having excellent electrical conductivity may be used as the conductive metal included in the electrode layers 131a, 132a, 131b, and 132b, and for example, the conductive metal may include at least one selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, but is not particularly limited thereto.

[0082] In an embodiment, the electrode layers 131a, 132a, 131b, and 132b may have a bilayer structure including a first electrode layer 131a and 132a and a second electrode layer 131b and 132b. Thus, the outer electrodes 131 and 132 may include the first electrode layer 131a and 132a having a first conductive metal and glass, and the second electrode layer 131b and 132b disposed on the first electrode layer 131a and 132a and including a second conductive metal and resin.

[0083] The first electrode layer 131a and 132a may function to improve the bonding with the main body 110 by including glass, and the second electrode layer 131b and 132b may function to improve the bending strength by including resin.

[0084] In this case, the glass included in the first electrode layer 131a and 132a and the glass 150 disposed in the introduction portions 141, 142, 143, and 144 may be different types of glass, but are not particularly limited thereto, and the glass included in the first electrode layer 131a and 132a and the glass 150 disposed in the introduction portions 141, 142, 143, and 144 may be the same type of glass.

[0085] The first conductive metal included in the first electrode layer 131a and 132a is not particularly limited as long as it is a material that can be electrically connected to the inner electrodes 121 and 122 for forming an electrostatic capacitance, and may include, for example, at least one selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0086] The first electrode layer 131a and 132a may be formed by coating a conductive paste (prepared by adding a frit to the first conductive metal particles) and then sintering it.

[0087] The second conductive metal included in the second electrode layer 131b and 132b may function to electrically connect to the first electrode layer 131a and 132a.

[0088] The conductive metal included in the second electrode layer 131b and 132b is not particularly limited as long as it is a material that can be electrically connected to the first electrode layer 131a and 132a, and may include at least one selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0089] The second conductive metal included in the second electrode layers 131b and 132b may include at least one of spherical particles and flaky particles. For example, the second conductive metal may be composed only of flaky particles, or only of spherical particles, or may be a mixed form of flaky particles and spherical particles. In this case, the spherical particles may also include shapes that are not perfect spheres, and for example, may include shapes having a ratio of the length of the major axis to the length of the minor axis (major axis length / minor axis length) less than or equal to 1.45. The flaky particles refer to particles having a flat and elongated shape, and although not particularly limited, for example, may be particles having a ratio of the length of the major axis to the length of the minor axis (major axis length / minor axis length) greater than or equal to 1.95. The lengths of the major axis and the minor axis of the above-mentioned spherical particles and flaky particles can be measured from images obtained by scanning cross-sections in the first direction and the second direction cut from the central portion of the multilayer electronic component in the third direction using a scanning electron microscope (SEM).

[0090] The resin included in the second electrode layers 131b and 132b can ensure bonding characteristics and perform a shock absorption function. The resin included in the second electrode layers 131b and 132b is not particularly limited as long as it has bonding characteristics and shock absorption characteristics and can be mixed with the second conductive metal particles to form a paste, and may include, for example, an epoxy resin.

[0091] In addition, the second electrode layers 131b and 132b may include a plurality of second conductive metal particles, intermetallic compounds, and resin. By including intermetallic compounds, the electrical connectivity with the first electrode layers 131a and 132a can be further improved. The intermetallic compounds are used to improve electrical connectivity by connecting a plurality of metal particles, and can act to surround the plurality of metal particles and connect the particles to each other.

[0092] In this case, the intermetallic compound may include a metal having a melting point lower than the curing temperature of the resin. For example, since the intermetallic compound includes a metal having a melting point lower than the curing temperature of the resin, the metal having a melting point lower than the curing temperature of the resin melts during the drying and curing process and forms an intermetallic compound surrounding the metal particles with some of the metal particles. In this case, the intermetallic compound may preferably include a metal with a low melting point (less than or equal to 300 °C).

[0093] For example, Sn having a melting point of 213 °C to 220 °C may be included. During the drying and curing process, Sn is melted, and the melted Sn wets high melting point metal particles such as Ag, Ni, or Cu by capillary action and reacts with some of the Ag, Ni, or Cu metal particles to form intermetallic compounds such as Ag3Sn, Ni3Sn4, Cu6Sn5, Cu3Sn, etc. The Ag, Ni, or Cu that did not participate in the reaction remains in the form of metal particles.

[0094] Therefore, the plurality of second conductive metal particles may include at least one of Ag, Ni, and Cu, and the intermetallic compound may include at least one of Ag3Sn, Ni3Sn4, Cu6Sn5, and Cu3Sn.

[0095] The plating layers 131c and 132c can function to improve the mounting characteristics.

[0096] The types of the plating layers 131c and 132c are not particularly limited and may include at least one of nickel (Ni), tin (Sn), silver (Ag), palladium (Pd), and their alloys. Additionally, the plating layers 131c and 132c can be formed using a single layer or multiple layers.

[0097] For more specific examples of the plating layers 131c and 132c, the plating layers 131c and 132c can be Ni plating layers or Sn plating layers, and can be formed in a form where the Ni plating layer and the Sn plating layer are sequentially formed on the electrode layer, or can be formed in a form where the Sn plating layer, the Ni plating layer, and the Sn plating layer are sequentially formed on the electrode layer. In addition, the plating layers 131c and 132c can include multiple Ni plating layers and / or multiple Sn plating layers.

[0098] The size of the multilayer electronic component 100 does not need to be particularly defined.

[0099] However, in order to achieve miniaturization and high capacitance simultaneously, the thicknesses of the dielectric layer and the internal electrodes should be reduced to increase the number of layers. Therefore, the effects according to the present disclosure can be more significant in the multilayer electronic component 100 having a size of 3216 (length × width: 3.2 mm × 1.6 mm), a size of 2012 (length × width: 2.0 mm × 1.2 mm), a size of 1005 (length × width: 1.0 mm × 0.5 mm), or a size of 0603 (length × width: 0.6 mm × 0.5 mm) or smaller.

[0100] Hereinafter, the multilayer electronic component 100 according to the embodiment will be described in more detail.

[0101] In the multilayer electronic component 100 according to the embodiment, when the regions including the glass 150 introduced from the surface of the main body 110 inward are referred to as the introduction portions 141, 142, 143, and 144, the introduction portions 141, 142, 143, and 144 can be provided between the capacitance forming portion Ac and the covering portions 112 and 113.

[0102] In the region between the capacitor forming portion Ac and the covering portions 112 and 113 (more specifically, at the interface between the capacitor forming portion Ac and the covering portions 112 and 113), external moisture may easily penetrate. However, since the introducing portions 141, 142, 143, and 144 are provided between the covering portions 112 and 113 and the capacitor forming portion Ac and the introducing portions 141, 142, 143, and 144 include glass 150, the external moisture penetration path is blocked, and the moisture resistance reliability of the multilayer electronic component 100 can be improved.

[0103] The introducing portions 141, 142, 143, and 144 may refer to the regions that enter from the surface of the main body 110 toward the inside of the main body 110, and may refer to a part of the shape of the main body 110.

[0104] Referring to Figure 3 , the main body 110 includes a region introduced inward from the surface of the main body 110 at the interface between the capacitor forming portion Ac and the covering portions 112 and 113, and this region may be referred to as the introducing portions 141, 142, 143, and 144.

[0105] More specifically, the introducing portions 141, 142, 143, and 144 may include a first introducing portion 141 and a second introducing portion 142 provided between the capacitor forming portion Ac and the first covering portion 112, and a third introducing portion 143 and a fourth introducing portion 144 provided between the capacitor forming portion Ac and the second covering portion 113. The first introducing portion 141 and the third introducing portion 143 may be provided at positions adjacent to the third surface 3, and the second introducing portion 142 and the fourth introducing portion 144 may be provided at positions adjacent to the fourth surface 4.

[0106] In Figure 3 , the introducing portions 141, 142, 143, and 144 are shown as being formed in all four regions of the interface between the capacitor forming portion Ac and the covering portions 112 and 113, but they are not particularly limited thereto, and even if they are formed in at least one of the four regions, the moisture resistance reliability of the multilayer electronic component 100 can be improved. For example, in Figure 5 schematically showing a multilayer electronic component 200 according to another embodiment, it can be confirmed that the introducing portions 241 and 242 are formed in two regions between the capacitor forming portion Ac and the first covering portion 212. In addition to this, Figure 5 and Figure 6 the main body 210, the dielectric layer 211, the internal electrodes 221 and 222, and the external electrodes 231 and 232 (including the first electrode layers 231a and 232a and / or the second electrode layers 231b and 232b and the plating layers 231c and 232c) shown in Figures 1 to 4The main body 110, dielectric layer 111, inner electrodes 121 and 122, and outer electrodes 131 and 132 (including the first electrode layers 131a and 132a and / or the second electrode layers 131b and 132b and plating layers 131c and 132c) shown are the same, and thus their detailed descriptions will be omitted.

[0107] The introduction portions 141, 142, 143, and 144 may be provided only between the capacitor forming portion Ac and the covering portions 112 and 113.

[0108] Although Figure 3 A structure is shown in which the introduction portions 141, 142, 143, and 144 are formed on the surface of the main body 110 between the extended surfaces of the two surfaces of the capacitor forming portion Ac in the first direction, but the present application is not limited thereto. For example, the introduction portions 141, 142, 143, and 144 may not be formed on the surface of the main body 110 between the extended surfaces of the two surfaces of the capacitor forming portion Ac in the first direction, and for example, the introduction portions may not be formed between the inner electrodes 121 and 122 which are arranged on the outermost layer in two directions (i.e., the upward direction and the downward direction) in the first direction among the inner electrodes 121 and 122. This can prevent the unnecessary formation of the introduction portions for improving the moisture resistance reliability, thereby preventing the occurrence of cracks that may occur due to external impact, and thus protecting the capacitor forming portion Ac.

[0109] At least a part of the glass 150 included in the introduction portions 141, 142, 143, and 144 may be arranged to be in contact with at least one of the covering portions 112 and 113 and the capacitor forming portion Ac.

[0110] Among the introduction portions 141, 142, 143, and 144 introduced into the inside of the main body 110, the glass 150 may be arranged to be in contact with at least a part of the covering portions 112 and 113 (corresponding to a part of the surface of the main body 110) and at least a part of the capacitor forming portion Ac.

[0111] In this case, the thickness of the glass 150 arranged to be in contact with at least one of the covering portions 112 and 113 and the capacitor forming portion Ac may be greater than or equal to 0.1 μm.

[0112] When the thickness of the glass 150 is greater than or equal to 0.1 μm, it can effectively suppress the penetration of external moisture and improve the moisture resistance reliability of the multilayer electronic component 100, and there is no particular limitation on the upper limit of the thickness, and as described below, the glass can fill the introduction portion.

[0113] In the multilayer electronic component 200 according to the embodiment, the introduction portions 241 and 242 may be filled with the glass 250.

[0114] By using the glass 250 to fill the introduction parts 241 and 242, the penetration of external moisture can be more effectively suppressed, thereby further improving the moisture resistance reliability of the multilayer electronic component 200. As described above, Figure 5 It is shown that the introduction parts (i.e., the first introduction part 241 and the second introduction part 242) are only formed between the capacitor formation part Ac and the first covering part 212, and the glass 250 fills the first introduction part 241 and the second introduction part 242. However, the present disclosure is not particularly limited thereto, and the introduction part can also be formed between the capacitor formation part Ac and the second covering part 213 and filled with glass. In this case, the glass 250 formed adjacent to the third surface 3 is formed to start from the extension line EL2 of the second surface 2, extend along the edge of the first covering part 212, fill the first introduction part 241, and extend to the lower region GET1 (e.g., as Figure 6 shown, the region corresponding to the upper surface of the second internal electrode 222 arranged on the uppermost layer in the first direction), and is not provided on the region of the first internal electrode 221 arranged on the uppermost layer in the first direction and exposed to the third surface.

[0115] In addition, the glass 150 can be further provided on the surface of the main body 110 in the form of a layer.

[0116] In this case, the layered glass 150 is arranged along the surface of the main body 110, and can be arranged between the extension lines EL1 and EL2 of the two surfaces of the main body 110 in the stacking direction.

[0117] In this case, the meaning that the layered glass 150 is arranged along the surface of the main body 110 can mean that on the part of the main body 110 including the introduction parts 141, 142, 143, and 144 (such as the covering parts 112 and 113 and the dielectric layer 111), the glass 150 with a constant thickness is arranged on the main body 110. In this case, when the layered glass 150 has a constant thickness, the thickness of the layered glass 150 can be greater than or equal to 0.1 μm, and the thickness in this case can refer to the average thickness.

[0118] More specifically, the layered glass 150 can be arranged between the extension line EL1 of the first surface and the extension line EL2 of the second surface, and can be not arranged on the first surface 1 and the second surface 2 based on the first direction. Specifically, the layered glass 150 can be not arranged below the extension line EL1 of the first surface but can be arranged above the extension line EL1 of the first surface, and can be not arranged above the extension line EL2 of the second surface but can be arranged below the extension line EL2 of the second surface.

[0119] In this case, the laminated glass 150 may be disposed within a region that is offset from the extension lines EL1 and EL2 of the two surfaces of the main body 110 in the stacking direction by 50% of the dimension in the first direction of the extension lines EL1 and EL2 of the two surfaces of the main body 110 in the stacking direction.

[0120] Referring Figure 4 , it can be seen that the laminated glass 150 formed adjacent to the second surface 2 is formed to start from the extension line EL2 of the second surface, along the edge of the first covering portion 112, and along the surface in the region of the main body in the second introducing portion 142 (formed adjacent to the fourth surface 4 between the capacitor forming portion Ac and the first covering portion 112), and extends to the region GET2 (i.e., the region corresponding to the upper surface of the second internal electrode 122 disposed on the uppermost layer in the first direction) that contacts the second internal electrode 122 disposed on the uppermost layer in the first direction. In this case, when the dimension in the first direction of the laminated glass 150 disposed from the extension line EL2 of the second surface to the region GET2 that contacts the second internal electrode 122 disposed on the uppermost layer (top layer) in the first direction is t2, t2 may be less than or equal to 50% of the dimension in the first direction of the extension line EL1 of the first surface and the extension line EL2 of the second surface. In this case, the dimension in the first direction of the extension line EL1 of the first surface and the extension line EL2 of the second surface may refer to the dimension in the first direction between the first surface 1 and the second surface 2, and may also refer to the dimension in the first direction of the main body 110.

[0121] Similarly, it can be seen that the laminated glass 150 formed adjacent to the first surface 1 is formed to start from the extension line EL1 of the first surface, along the edge of the second covering portion 113, and along the surface in the region of the main body 110 in the fourth introducing portion 144 (formed adjacent to the fourth surface 4 between the capacitor forming portion Ac and the second covering portion 113), and extends to the upper region GET4 of the second internal electrode 122 disposed on the lowermost layer (bottom layer) in the first direction (for example, as Figure 4 shown, the region corresponding to the lower surface of the first internal electrode 121 disposed on the lowermost layer in the first direction). In addition, as Figure 4 shown, the laminated glass 150 is not disposed on the region of the second internal electrode 122 disposed on the lowermost layer in the first direction that is exposed to the fourth surface. In this case, when the dimension in the first direction of the laminated glass 150 disposed from the extension line EL1 of the first surface to the upper region GET4 of the second internal electrode 122 disposed on the lowermost layer (bottom layer) in the first direction is t4, t4 may be less than or equal to 50% of the dimension in the first direction of the extension line EL1 of the first surface and the extension line EL2 of the second surface.

[0122] In this specification, only the glass 150 provided in the adjacent regions of the second introduction part 142 and the fourth introduction part 144 is described, but it is obvious to those skilled in the art that the same description can be applied to the glass 150 provided in the adjacent regions of the first introduction part 141 and the third introduction part 143.

[0123] In this case, the situation where t2 and t4 are respectively 50% of the dimension in the first direction of the extension line EL1 of the first surface and the extension line EL2 of the second surface can indicate that the laminated glass 150 is formed as one laminated glass 150 between the first surface 1 and the second surface 2.

[0124] In addition, in this disclosure, the laminated glass 150 can be in a single-layer form, but is not particularly limited thereto, and is not limited to a structure without a disconnection region in the microstructure. And if the sum of t2 and t4 exceeds 50% of the dimension in the first direction of the main body 110, it can mean that the laminated glass 150 is sufficiently formed.

[0125] In addition, the laminated glass 150 may not be provided on the regions of the exposed inner electrodes 121 and 122 on the third surface 3 and the fourth surface 4. More specifically, the laminated glass 150 can be provided on the surfaces of dielectric materials (such as the covering parts 112 and 113 or the dielectric layer 111).

[0126] This may be due to the fact that the glass material has excellent wettability with the dielectric material due to its properties. Therefore, the bonding performance between the glass material and the surface of the dielectric material is better than that with the surfaces of the inner electrodes 121 and 122 (which are metal materials), but is not particularly limited thereto. The glass can be provided on some surfaces of the inner electrodes 121 and 122, but it may be preferred not to provide the glass to cover the entire surfaces of the inner electrodes 121 and 122 considering the connectivity with the outer electrodes 131 and 132.

[0127] The glass 150 included in the introduction parts 141, 142, 143 and 144 or the laminated glass 150 provided on the surface of the main body 110 can be the same glass.

[0128] In addition, in this disclosure, before coating the outer electrodes 131 and 132, the glass 150 can be formed on the surface of the main body 110 by coating a separate glass paste onto the introduction parts 141, 142, 143 and 144 between the capacitor forming part Ac and the covering parts 112 and 113, and the outer electrodes 131 and 132 can be formed on the glass 150 by coating an outer electrode paste on the glass 150, but is not particularly limited thereto, and the glass 150 can also be formed by the main body 110's surface absorbing the glass included in the first electrode layers 131a and 132a.

[0129] In addition, in the case where the glass 150 is formed by coating a separate glass paste, or in the case where the glass 150 is formed without coating a separate glass paste, the glass 150 may be disposed on the surface of the main body 110, and the first electrode layers 131a and 132a may be disposed on the glass 150.

[0130] In addition, in the multi-layer electronic component 100 according to the embodiment, one end of the first internal electrode 121 is connected to the third surface 3 of the main body 110 in the longitudinal direction, one end of the second internal electrode 122 is connected to the fourth surface 4 of the main body 110 in the longitudinal direction, and the other end IEL1 of the first internal electrode 121 is disposed to be spaced apart from the fourth surface 4 of the main body 110 in the longitudinal direction, and the other end IEL2 of the second internal electrode 122 is disposed to be spaced apart from the third surface 3 of the main body 110 in the longitudinal direction. When the length from the other end IEL1 of the first internal electrode 121 to the fourth surface 4 of the main body 110 and the length from the other end IEL2 of the second internal electrode 122 to the third surface 3 of the main body 110 in the longitudinal direction are referred to as length edges, and when the average length of the length edges is referred to as LM and the maximum length of the introducing portions 141, 142, 143, and 144 is referred to as GL, 10% ≤ GL / LM ≤ 100% can be satisfied.

[0131] By satisfying 10% ≤ GL / LM ≤ 100%, it is difficult for external moisture to penetrate, and thus the moisture resistance reliability of the multi-layer electronic component 100 can be improved.

[0132] More specifically, one end of the first internal electrode 121 is connected to the third surface 3 and the other end IEL1 of the first internal electrode 121 is disposed to be spaced apart from the fourth surface 4. When the length of the extension line EL4 from the other end IEL1 of the first internal electrode 121 to the fourth surface 4 is referred to as the first edge in the longitudinal direction, the average length of the first edge in the longitudinal direction can be referred to as LM2. When the maximum length of the second introducing portion 142 is referred to as GL2 and the maximum length of the fourth introducing portion 144 is referred to as GL4, 10% ≤ GL2 / LM2 ≤ 100% can be satisfied, and 10% ≤ GL4 / LM2 ≤ 100% can be satisfied. Similarly, one end of the second internal electrode 122 is connected to the fourth surface 4 and the other end IEL2 of the second internal electrode 122 is disposed to be spaced apart from the third surface 3. When the length of the extension line EL3 from the other end IEL2 of the second internal electrode 122 to the third surface 3 is referred to as the second edge in the longitudinal direction, the average length of the second edge in the longitudinal direction can be referred to as LM1. When the maximum length of the first introducing portion 141 is referred to as GL1 and the maximum length of the third introducing portion 143 is referred to as GL3, 10% ≤ GL1 / LM1 ≤ 100% can be satisfied, and 10% ≤ GL3 / LM1 ≤ 100% can be satisfied.

[0133] In this case, the average length of the first edge in the length direction may refer to a value obtained by measuring and averaging the lengths from the other end IEL1 of each of the plurality of first inner electrodes 121 to the adjacent fourth surface 4, and the average length of the second edge in the length direction may also be obtained in the same manner.

[0134] In addition, in the multilayer electronic component 100 according to the embodiment, when the average thickness of the main body 110 is T and the maximum thickness of the introduction parts 141, 142, 143, and 144 is GT, 10% ≤ GT / T ≤ 30% may be satisfied.

[0135] In this case, the maximum thickness of the introduction parts 141, 142, 143, and 144 may refer to the maximum thickness of the shapes of the introduction parts 141, 142, 143, and 144, and the thickness at the point where the introduction parts start in the inward direction of the main body 110 (for example, at the entrances of the introduction parts 141, 142, 143, and 144) may correspond to the maximum thickness of the introduction parts 141, 142, 143, and 144, but is not particularly limited thereto.

[0136] More specifically, when the maximum thickness of the first introduction part 141 is GT1, 10% ≤ GT1 / T ≤ 30% may be satisfied, when the maximum thickness of the second introduction part 142 is GT2, 10% ≤ GT2 / T ≤ 30% may be satisfied, when the maximum thickness of the third introduction part 143 is GT3, 10% ≤ GT3 / T ≤ 30% may be satisfied, and when the maximum thickness of the fourth introduction part 144 is GT4, 10% ≤ GT4 / T ≤ 30% may be satisfied.

[0137] By satisfying 10% ≤ GT / T ≤ 30%, external moisture penetration can be effectively prevented, thereby improving the moisture resistance reliability of the multilayer electronic component 100.

[0138] If GT / T < 10%, there is a concern that the target moisture resistance reliability may not be obtained because the glass 150 may not be sufficiently provided in the introduction parts 141, 142, 143, and 144, and if 30% < GT / T, there is a concern that the target moisture resistance reliability may not be obtained because the sizes of the introduction parts 141, 142, 143, and 144 are too large and there may not be enough glass 150 provided, and thus there is a concern that cracks may easily occur inside the main body 110 due to external shock, which may deteriorate the mechanical properties.

[0139] Although the embodiments of the present disclosure have been described in detail above, the present disclosure is not limited by the above embodiments and the accompanying drawings, and is intended to be limited by the appended claims. Therefore, within the scope of the technical spirit of the present disclosure described in the claims, those skilled in the art will be able to make various forms of substitution, variation, and modification, and these substitutions, variations, and modifications also fall within the scope of the present disclosure.

[0140] The expression "embodiment" used in the present disclosure does not mean the same embodiment, and is provided to emphasize and describe different unique features. However, the combination of the features of the above-presented embodiment with those of another embodiment is not excluded. For example, unless there is a description contradictory or contrary to the content in another embodiment, even if the content described in a specific embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment.

[0141] The terms used in the present disclosure are only for describing the embodiments and are not intended to limit the present disclosure. In this case, unless the context clearly indicates otherwise, the singular expression includes the plural expression.

[0142] As described above, according to the embodiment, the interfacial bonding strength between the capacitor forming portion and the covering portion is improved.

[0143] The moisture resistance reliability of the multilayer electronic component is improved.

[0144] Although the exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations can be made without departing from the scope of the present disclosure defined by the appended claims.

Claims

1. A multilayer electronic component comprising: a main body including a capacitance forming portion and a covering portion, the capacitance forming portion including a dielectric layer and internal electrodes alternately stacked with the dielectric layer, the covering portion being provided on both surfaces of the capacitance forming portion in a stacking direction of the dielectric layer and the internal electrodes; as well as an outer electrode, disposed on the body, When a region introduced inward from the surface of the main body and including glass is defined as an introduction portion, the introduction portion is provided between the capacitance forming portion and the covering portion.

2. The multilayer electronic component of claim 1, wherein: The introduction portion is provided only between the capacitance forming portion and the covering portion.

3. The multilayer electronic component of claim 1, wherein: At least a portion of the glass included in the introduction portion is in contact with at least one of the cover portion and the capacitance forming portion.

4. The multilayer electronic component of claim 3, wherein: The glass in contact with the at least one of the cover portion and the capacitance forming portion has an average thickness of 0.1 μm or more.

5. The multilayer electronic component of claim 1, wherein: The introduction portion is filled with the glass.

6. The multilayer electronic component of claim 1, wherein: The glass is also disposed in a layered shape on the surface of the body, and The glass in the layered shape is disposed between two extension lines of two surfaces of the body in the stacking direction.

7. The multilayer electronic component of claim 6, wherein: The glass of the layered shape is disposed in a region offset from the two extension lines toward each other by 50% of a dimension of the two extension lines in the stacking direction.

8. The multilayer electronic component of claim 6, wherein: The glass in the layered shape is disposed on a surface of the dielectric layer.

9. The multilayer electronic component of claim 1, wherein: One end of the inner electrode extends to one surface of the body in the length direction, and the other end of the inner electrode is disposed spaced apart from the other surface of the body in the length direction, When the length from the other end of the inner electrode to the other surface of the body in the length direction is defined as a length edge, and When the average length of the length edges is LM and the maximum length of the introduction portion is GL, 10%≤GL / LM≤100% is satisfied.

10. The multilayer electronic component of claim 1, wherein: When the average thickness of the main body is T, and the maximum thickness of the introduction portion is GT, 10%≤GT / T≤30% is satisfied.

11. The multilayer electronic component of claim 1, wherein: A portion of the external electrode is disposed within the lead-in portion.

12. The multilayer electronic component of claim 1, wherein: The multilayer electronic component has a length of less than or equal to 0.6 mm and a width of less than or equal to 0.3 mm.

13. The multilayer electronic component of claim 1, wherein: The glass in the introduction part extends from an end portion of the internal electrode along the internal electrode.

14. The multilayer electronic component of claim 1, wherein: The introduction portion is provided outside a region between two outermost internal electrodes in the stacking direction among the internal electrodes.

15. A multilayer electronic component comprising: a main body including a capacitance forming portion and a covering portion, the capacitance forming portion including a dielectric layer and internal electrodes alternately stacked with the dielectric layer, the covering portion being provided on both surfaces of the capacitance forming portion in a stacking direction of the dielectric layer and the internal electrodes; as well as an outer electrode, disposed on the body, The introduction portion includes glass and extends from an end of the internal electrode along the internal electrode to an interior of the body.

16. The multilayer electronic component of claim 15, wherein: The introduction portion is provided only between the capacitance forming portion and the covering portion.

17. The multilayer electronic component of claim 16, wherein: At least a portion of the glass included in the introduction portion is in contact with at least one of the cover portion and the capacitance forming portion, and an average thickness of the glass in contact with the at least one of the cover portion and the capacitance forming portion is greater than or equal to 0.1 μm.

18. The multilayer electronic component of claim 15, wherein: One end of the inner electrode extends to one surface of the body in the length direction, and the other end of the inner electrode is disposed spaced apart from the other surface of the body in the length direction, When the length from the other end of the inner electrode to the other surface of the body in the length direction is defined as a length edge, and When the average length of the length edge is LM, and the maximum length of the introduction portion is GL, 10%≤GL / LM≤100% is satisfied.

19. The multilayer electronic component of claim 15, wherein: When the average thickness of the main body is T, and the maximum thickness of the introduction portion is GT, 10%≤GT / T≤30% is satisfied.

20. The multilayer electronic assembly of claim 15, wherein: A portion of the external electrode is disposed within the lead-in portion.

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