Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component including: a main body including a capacitance forming portion including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction, and cover portions disposed on both surfaces of the capacitance forming portion in the first direction, the main body comprises a first surface and a second surface which are opposite to each other in the first direction; a third surface and a fourth surface connected to the first surface and the second surface and opposed to each other in a second direction; and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposed to each other in a third direction; a connection electrode disposed on the third surface and the fourth surface and connected to the inner electrode; a side edge portion disposed on the fifth surface and the sixth surface and including a resin; and an external electrode disposed on the connection electrode and including a conductive metal and a resin.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2023-0195367, filed with the Korean Intellectual Property Office on December 28, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a multi-layer electronic component. Background Art

[0003] A multi-layer ceramic capacitor (MLCC), a type of multi-layer electronic component, may be a chip capacitor that is mounted on a printed circuit board of various electronic products, including image display devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, mobile phones, etc., and charges or discharges electricity therefrom.

[0004] Since multi-layer ceramic capacitors can have a small size and a high capacitance and can be easily mounted, such multi-layer ceramic capacitors can be used as components of various electronic devices. As electronic devices such as computers and mobile devices have been designed to have a reduced size and a high output, the demand for multi-layer ceramic capacitors with a reduced size and a high capacitance has also increased.

[0005] In addition, with the recent increase in attention to automotive electrical components, there may be a need for multi-layer ceramic capacitors to have high reliability and high strength characteristics for use in vehicles (e.g., infotainment systems).

[0006] In the process of printing and laminating internal electrodes on a ceramic green sheet, a minute height difference between a portion of the ceramic green sheet where no internal electrode is printed and a portion of the ceramic green sheet where an internal electrode is printed may accumulate, such that a step difference may be formed. In particular, in the case of a general cutting method having an edge in the width direction, the step difference of the edge portion in the width direction may be more severe than the step difference of the edge portion in the length direction. The step difference of the edge portion in the width direction is a step difference formed by the continuous accumulation of the portion of the ceramic green sheet where no internal electrode is printed, and the step difference of the edge portion in the length direction is a step difference formed by the alternating lamination of the portion of the ceramic green sheet where an internal electrode is printed and the portion of the ceramic green sheet where no internal electrode is printed. Due to the step difference, the end portion of each ceramic green sheet may be bent, such that stress may be generated, and thus defects such as delamination in which layers (e.g., ceramic green sheets) are separated from each other may occur.

[0007] Therefore, in order to suppress the step difference in the edges in the width direction of the multilayer ceramic capacitor, by exposing the inner electrode to the surface in the width direction of the main body, the size of the inner electrode in the width direction can be increased and the step difference can be eliminated by a design without edges in the width direction, and after manufacturing the main body and before firing, one or more green ceramic sheets can be laminated on the surface in the width direction of the main body in the width direction.

[0008] However, in the case of forming the side edge portion using a ceramic material, cracks may be easily generated, resulting in a possible reduction in reliability. SUMMARY OF THE INVENTION

[0009] Embodiments of the present disclosure are directed to providing a multilayer electronic component with improved reliability.

[0010] Embodiments of the present disclosure are directed to preventing cracks from occurring in the side edge portions of the multilayer electronic component.

[0011] According to an embodiment of the present disclosure, a multilayer electronic component includes: a main body including a capacitance forming portion and a covering portion, the capacitance forming portion including a dielectric layer and inner electrodes alternately disposed with the dielectric layer in a first direction, the covering portion being disposed on two surfaces of the capacitance forming portion in the first direction, and the main body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface opposite to each other in a second direction and connected to the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connected to the first surface to the fourth surface; connecting electrodes disposed on the third surface and the fourth surface and connected to the inner electrodes; side edge portions disposed on the fifth surface and the sixth surface and including a first resin; and outer electrodes disposed on the connecting electrodes and including a first conductive metal and a second resin, wherein the side edge portions are disposed to cover both ends of the connecting electrodes in the third direction, and wherein the outer electrodes cover both ends of the side edge portions in the second direction.

[0012] According to an embodiment of the present disclosure, a multilayer electronic component includes: a main body including a capacitance forming portion and a covering portion, the capacitance forming portion including a dielectric layer and inner electrodes alternately arranged with the dielectric layer in a first direction, the covering portion being provided on two surfaces of the capacitance forming portion in the first direction, and the main body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface opposite to each other in a second direction and connected to the first surface and the second surface, and a fifth surface and a sixth surface opposite to each other in a third direction and connected to the first surface to the fourth surface; connection electrodes provided on the third surface and the fourth surface and connected to the inner electrodes; side edge portions provided on the fifth surface and the sixth surface and including a first resin; and outer electrodes provided on the connection electrodes and including a first conductive metal and a second resin, wherein the side edge portions are provided to cover both ends of the connection electrodes in the third direction, and wherein the side edge portions are provided to be spaced apart from the third surface and the fourth surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The above and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following detailed description in conjunction with the accompanying drawings, in which: Figure 1 is a perspective view showing a multilayer electronic component according to an embodiment of the present disclosure; Figure 2 is a perspective view showing a multilayer electronic component without outer electrodes according to an embodiment of the present disclosure; Figure 3 is a perspective view showing the main body of a multilayer electronic component according to an embodiment of the present disclosure; Figure 4 is along Figure 1 sectional view taken along line I-I' in; Figure 5 is along Figure 1 sectional view taken along line II-II' in; Figure 6 is a perspective view observed from a sectional view taken along line III-III' in Figure 1 ; Figure 7 is a view showing a method of manufacturing a multilayer electronic component according to an embodiment of the present disclosure; Figure 8 is a perspective view corresponding to Figure 6 of a multilayer electronic component according to another embodiment of the present disclosure; and Figure 9 is a perspective view corresponding to Figure 6 of a multilayer electronic component according to another embodiment of the present disclosure. Detailed Implementation Modes

[0014] In the following, embodiments of the present disclosure will be described with reference to the accompanying drawings as follows.

[0015] These embodiments will be described in sufficient detail to enable those skilled in the art to practice the present invention. It will be understood that although the various embodiments of the present invention are different, they are not necessarily mutually exclusive. For example, without departing from the spirit and scope of the present disclosure, the structures, shapes, and dimensions described as examples in the embodiments in the present disclosure can be implemented in another embodiment. In addition, without departing from the spirit and scope of the present disclosure, the position or arrangement of the elements in the embodiments can be modified. Therefore, the following detailed description should not be considered limiting, and the scope of the present invention is only defined by the appended claims properly construed and the full scope of equivalents given by the claims.

[0016] In the drawings, the same elements will be denoted by the same reference numerals. In addition, redundant descriptions and detailed descriptions of known functions and elements that may unnecessarily obscure the gist of the present disclosure will be omitted. In the drawings, some elements may be exaggerated, omitted, or shown briefly, and the dimensions of the elements do not necessarily reflect the actual dimensions of these elements. Descriptions such as "comprising", "including", "configured to", etc. are used to indicate the presence of one or more features, quantities, steps, operations, elements, parts, or combinations thereof, and do not exclude the possibility of combining or adding other features, quantities, steps, operations, elements, parts, or combinations thereof.

[0017] In the drawings, the first direction may be defined as the thickness direction, the second direction may be defined as the length direction, and the third direction may be defined as the width direction.

[0018] Multi-layer electronic component Figure 1 is a perspective view showing a multi-layer electronic component according to an embodiment.

[0019] Figure 2 is a perspective view showing a multi-layer electronic component without external electrodes according to an embodiment.

[0020] Figure 3 is a perspective view showing the body of a multi-layer electronic component according to an embodiment.

[0021] Figure 4 is along Figure 1 a cross-sectional view taken along line I-I' in

[0022] Figure 5 is along Figure 1 a cross-sectional view taken along line II-II' in

[0023] Figure 6 is taken from alongFigure 1 A perspective view observed from a cross-section taken along line III-III' in

[0024] Hereinafter, with reference to Figures 1 to 6 The multi-layer electronic component 100 according to the embodiment will be described in more detail.

[0025] The multi-layer electronic component 100 may include: a main body 110 including a capacitance forming portion Ac and covering portions 112 and 113, the capacitance forming portion Ac including a dielectric layer 111 and internal electrodes 121 and 122 alternately arranged with the dielectric layer in a first direction, the covering portions 112 and 113 being provided on two surfaces of the capacitance forming portion in the first direction, and the main body 110 including a first surface 1 and a second surface 2 opposite to each other in the first direction, a third surface 3 and a fourth surface 4 connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface to the fourth surface and opposite to each other in a third direction; connection electrodes 141 and 142 provided on the third surface and the fourth surface and connected to the internal electrodes; side edge portions 114 and 115 provided on the fifth surface and the sixth surface and including resin; and external electrodes 131 and 132 provided on the connection electrodes and including a conductive metal and resin.

[0026] In the process of printing and laminating internal electrodes on a green ceramic sheet, step differences may occur due to the accumulation of minute height differences between the portion of the green ceramic sheet where no internal electrode is printed and the portion of the green ceramic sheet where an internal electrode is printed. In particular, in the case of a general cutting method having an edge in the width direction, the step difference in the edge portion in the width direction may be more severe than the step difference in the edge portion in the length direction. The step difference in the edge portion in the width direction is the step difference formed by the continuous accumulation of the portion of the green ceramic sheet where no internal electrode is printed, and the step difference in the edge portion in the length direction is the step difference formed by the alternating lamination of the portion of the green ceramic sheet where an internal electrode is printed and the portion of the green ceramic sheet where no internal electrode is printed. Due to the step difference, the end portion of each green ceramic sheet may be bent, so that stress may be generated, and thus defects such as delamination in which layers (e.g., green ceramic sheets) are separated from each other may occur.

[0027] Therefore, in order to suppress the step difference in the edge in the width direction of the multi-layer ceramic capacitor, the internal electrode may be exposed to the surface in the width direction of the main body, so that the size of the internal electrode in the width direction is increased and the step difference is eliminated by a design without an edge in the width direction, and a method of laminating one or more green ceramic sheets on the surface in the width direction of the main body in the width direction may be applied in the process after manufacturing the main body and before firing.

[0028] However, in the case of forming the side edge portions using a ceramic material, cracks may be likely to occur, so the reliability may be reduced.

[0029] The dielectric layer may have piezoelectricity and may expand in the stacking direction when a voltage is applied. In addition, as the voltage applied to the multilayer electronic component increases, the expansion in the stacking direction may be prominent. Cracks may be generated due to mechanical stress caused by the expansion of the dielectric layer, and the cracks may be referred to as electrostrictive cracks. In the case of forming the side edge portions using a ceramic material, relatively strong stress may be applied to the side edge portions, and the starting points of electrostrictive cracks may be generated. In particular, in a high-voltage multilayer ceramic capacitor that requires high voltage reliability, the dielectric layer may have an increased thickness to ensure reliability. Due to the increased thickness of the dielectric layer, failure due to electrostrictive cracks may occur first at a voltage lower than the expected voltage.

[0030] According to an embodiment, by providing side edge portions 114 and 115 including resin on the fifth surface and the sixth surface of the main body 110, cracks can be prevented from occurring in the side edge portions 114 and 115.

[0031] In an embodiment, the side edge portions 114 and 115 may be provided to cover both ends of the connection electrodes 141 and 142 in the third direction, and the outer electrodes 131 and 132 may be provided to cover both ends of the side edge portions 114 and 115 in the second direction.

[0032] In an embodiment, as will be described later by referring to Figure 9 as described, the side edge portions 114'' and 115'' may be spaced apart from the third surface and the fourth surface.

[0033] Hereinafter, each component included in the multilayer electronic component 100 according to the embodiment will be described.

[0034] In the main body 110, the dielectric layer 111 and the inner electrodes 121 and 122 may be alternately stacked.

[0035] The shape of the main body 110 may not be limited to any specific shape, but as Figure 1 shown, the main body 110 may have a hexahedral shape or a shape similar to a hexahedral shape. Due to the shrinkage of the ceramic powder included in the main body 110 during the firing process or the polishing of the corners, the main body 110 may not have an exact hexahedral shape formed by straight lines, but may substantially have a hexahedral shape.

[0036] The main body 110 may have a first surface 1 and a second surface 2 that face each other in a first direction, a third surface 3 and a fourth surface 4 that are connected to the first surface 1 and the second surface 2 and face each other in a second direction, and a fifth surface 5 and a sixth surface 6 that are connected to the first surface 1 and the second surface 2 and the third surface 3 and the fourth surface 4 and face each other in a third direction.

[0037] The plurality of dielectric layers 111 forming the main body 110 may be in a fired state, and adjacent dielectric layers 111 may be integrated with each other such that the boundary between adjacent dielectric layers 111 cannot be distinguished without using a scanning electron microscope (SEM). The number of stacked dielectric layers is not particularly limited, and can be determined by considering the size of the multilayer electronic component. For example, the main body may be formed by stacking 400 or more layers of dielectric layers.

[0038] The dielectric layer 111 may be formed by preparing a ceramic slurry including ceramic powder, an organic solvent, an additive, and a binder, preparing a green sheet by coating the ceramic slurry on a carrier film and drying the ceramic slurry, and firing the green sheet. The ceramic powder is not limited to any specific example as long as sufficient electrostatic capacitance can be obtained. For example, barium titanate (BaTiO3)-based ceramic powder and calcium zirconate (CaZrO3)-based paraelectric powder can be used as the ceramic powder. The barium titanate (BaTiO3)-based ceramic powder may be one or more of BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1- x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3 (0 < y < 1). The calcium zirconate (CaZrO3)-based paraelectric powder may be (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1).

[0039] Therefore, the dielectric layer 111 may include BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1) and (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1) or more than one of them.

[0040] The main body 110 may include a capacitor forming portion Ac that forms a capacitor, and covering portions 112 and 113. The capacitor forming portion Ac includes a dielectric layer 111, and first and second internal electrodes 121 and 122. The first and second internal electrodes 121 and 122 are alternately arranged opposite to each other, and the dielectric layer 111 is interposed between the first and second internal electrodes 121 and 122. The covering portions 112 and 113 are formed on the upper and lower portions of the capacitor forming portion Ac in a first direction.

[0041] In addition, the capacitor forming portion Ac contributes to forming the capacitance of the capacitor, and may be formed by repeatedly laminating a plurality of first internal electrodes 121 and a plurality of second internal electrodes 122, with the dielectric layer 111 interposed between the plurality of first internal electrodes 121 and the plurality of second internal electrodes 122.

[0042] The internal electrodes 121 and 122 may be alternately arranged with the dielectric layer 111.

[0043] The internal electrodes 121 and 122 may include a first internal electrode 121 and a second internal electrode 122. The first and second internal electrodes 121 and 122 may be alternately arranged opposite to each other, with the dielectric layer 111 interposed between the first and second internal electrodes 121 and 122, and the first and second internal electrodes 121 and 122 may be respectively exposed on the third surface 3 and the fourth surface 4 of the main body 110.

[0044] Referring to Figure 3 , the first internal electrode 121 is spaced apart from the fourth surface 4 and may be exposed through the third surface 3, and the second internal electrode 122 is spaced apart from the third surface 3 and may be exposed through the fourth surface 4. In addition, the first internal electrode 121 may be exposed through the third surface 3, the fifth surface 5, and the sixth surface 6, and the second internal electrode 122 may be exposed through the fourth surface 4, the fifth surface 5, and the sixth surface 6.

[0045] In this case, the first internal electrode 121 and the second internal electrode 122 may be electrically separated from each other by the dielectric layer 111 provided therebetween.

[0046] The inner electrodes 121 and 122 may include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0047] The average thickness td of the dielectric layer 111 and the average thickness te of the inner electrodes 121 and 122 are not limited to any specific example.

[0048] However, since the effect of suppressing cracks in the side edge portions according to the embodiment may be more significant in high-voltage multilayer ceramic capacitors, the average thickness td of the dielectric layer 111 of the high-voltage device may be 4 μm to 20 μm.

[0049] The average thickness te of the inner electrodes 121 and 122 is not limited to any specific example, but may be, for example, 0.4 μm to 2 μm.

[0050] In addition, the average thickness td of the dielectric layer 111 and the average thickness te of the inner electrodes 121 and 122 can be arbitrarily determined according to desired characteristics or purposes. For example, for small IT (information technology) electronic components for miniaturization and high capacitance, the average thickness td of the dielectric layer 111 may be less than or equal to 0.4 μm, and the average thickness te of the inner electrodes 121 and 122 may be less than or equal to 0.4 μm.

[0051] The average thickness td of the dielectric layer 111 and the average thickness te of the inner electrodes 121 and 122 may respectively indicate the dimensions of the dielectric layer 111 and the inner electrodes 121 and 122 in the first direction. The average thickness td of the dielectric layer 111 and the average thickness te of the inner electrodes 121 and 122 can be measured by scanning the cross-sections of the main body 110 in the first and second directions at a magnification of 10,000 using a scanning electron microscope (SEM). More specifically, the average thickness td of the dielectric layer 111 can be measured by measuring the thicknesses at multiple points of the dielectric layer 111 (for example, 30 points equidistantly spaced in the second direction). In addition, the average thickness te of the inner electrodes 121 and 122 can be measured by measuring the thicknesses at multiple points of one of the inner electrodes 121 and 122 (for example, 30 points equidistantly spaced in the second direction). The 30 points equidistantly spaced can be specified in the capacitance forming portion. In addition, the average values can be measured for 10 dielectric layers 111 and 10 inner electrodes 121 and 122, and the average thickness td of the dielectric layer 111 and the average thickness te of the inner electrodes 121 and 122 can be further generalized.

[0052] The covering portions 112 and 113 may be provided on two surfaces of the capacitance forming portion Ac in the first direction.

[0053] The covering parts 112 and 113 may include a first covering part 112 and a second covering part 113. The first covering part 112 is disposed on the upper part in the first direction of the capacitor forming part Ac, and the second covering part 113 is disposed on the lower part in the first direction of the capacitor forming part Ac. The first covering part 112 may be referred to as an upper covering part, and the second covering part 113 may be referred to as a lower covering part.

[0054] The first covering part 112 and the second covering part 113 may be formed by laminating a single dielectric layer or two or more dielectric layers on the upper surface and the lower surface of the capacitor forming part Ac in the thickness direction, respectively, and may prevent damage to the inner electrode due to physical stress and / or chemical stress.

[0055] The first covering part 112 and the second covering part 113 do not include an inner electrode and may include the same material as that of the dielectric layer 111.

[0056] That is, the first covering part 112 and the second covering part 113 may include a ceramic material, for example, a barium titanate (BaTiO3)-based ceramic material.

[0057] The thicknesses of the covering parts 112 and 113 may not be limited to any specific example. However, since the effect of suppressing cracks in the side edge parts may be more significant in a high-voltage multilayer ceramic capacitor according to an embodiment, the thickness tc of the covering parts 112 and 113 may be 20 μm to 200 μm.

[0058] The average thickness tc of the covering parts 112 and 113 may refer to the dimension in the first direction and may be the average value of the dimensions in the first direction of the covering parts 112 and 113 measured at five points equidistantly located on the upper part or the lower part of the capacitor forming part Ac in the first direction.

[0059] The side edge parts 114 and 115 may be respectively disposed on the fifth surface and the sixth surface of the main body 110 and may include a resin. Accordingly, cracks may be prevented from being generated in the side edge parts 114 and 115.

[0060] In an embodiment, the side edge parts 114 and 115 may be disposed to cover two surfaces of the capacitor forming part Ac in the third direction and two surfaces of the covering parts 112 and 113 in the third direction. The side edge parts 114 and 115 may include a first side edge part 114 and a second side edge part 115. The first side edge part 114 is disposed on one surface of the capacitor forming part Ac in the third direction and one surface of the covering parts 112 and 113 in the third direction, and the second side edge part 115 is disposed on the other surface of the capacitor forming part Ac in the third direction and the other surface of the covering parts 112 and 113 in the third direction.

[0061] The side edge portions 114 and 115 can prevent damage to the internal electrodes due to physical stress and / or chemical stress. In addition, since the side edge portions 114 and 115 are formed of resin, cracks generated in the side edge portions 114 and 115 can be prevented.

[0062] The method of forming the side edge portions 114 and 115 is not limited to any specific example. For example, the main body 110 can be formed by laminating green ceramic sheets printed with internal electrode patterns, pressing these green ceramic sheets, and performing a firing process. The connection electrodes 141 and 142 can be formed on two surfaces of the main body 110 in the second direction, and a liquid resin or a solid resin can be coated on two surfaces of the main body 110 in the third direction to form the side edge portions 114 and 115. Thereafter, a paste for an external electrode including a conductive metal and a resin can be coated to form the external electrodes 131 and 132.

[0063] Referring to Figure 7 , an example of forming the side edge portion using a solid resin will be described in more detail. A sheet 115a formed of a solid resin can be prepared on a support 300. The sixth surface 6 of the main body 110 on which the connection electrodes 141 and 142 are formed can be pressed against the sheet 115a formed of the solid resin so that the sheet 115a can adhere to the sixth surface 6 of the main body 110, and the main body 110 can be lifted again to form the second side edge portion 115 on the sixth surface 6 of the main body 110. Thereafter, the same process can be repeatedly performed on the fifth surface 5 of the main body 110 to form the first side edge portion 114.

[0064] According to an embodiment, since the side edge portions 114 and 115 include resin, the side edge portions 114 and 115 can be formed after performing a firing process on the main body 110 and a firing process on the connection electrodes 141 and 142. In addition, the external electrodes 131 and 132 can be formed by a curing heat treatment for the resin without a firing process, and the external electrodes 131 and 132 include a conductive metal and a resin.

[0065] In an embodiment, the resin included in the side edge portions 114 and 115 can be one or more of an epoxy resin, a silicone resin, a fluororesin, an acrylic resin, and ethyl cellulose.

[0066] In an embodiment, the type of the resin included in the side edge portions 114 and 115 can be the same as the type of the resin included in the external electrodes. "Type" means the kind of material. For example, both the first resin included in the side edge portion and the second resin included in the external electrode include an epoxy resin. Therefore, the bonding strength between the external electrodes 131 and 132 and the side edge portions 114 and 115 can be improved.

[0067] In addition, the side edge portions 114 and 115 can be formed substantially using resin.

[0068] In an embodiment, the side edge portions 114 and 115 can be arranged to contact portions of the inner electrodes 121 and 122 that are exposed on the fifth surface 5 and the sixth surface 6.

[0069] Referring to Figure 6 , the average width Wm of the side edge portions 114 and 115 in the third direction may not be limited to any specific example. For example, Wm can be less than or equal to 50 μm, and for miniaturization and high capacitance, Wm can be less than or equal to 20 μm. Here, the width of the side edge portions 114 and 115 in the third direction can refer to the dimension of the side edge portions 114 and 115 in the third direction.

[0070] The average width Wm of the side edge portions 114 and 115 in the third direction can be measured from a cross-section in the second direction and the third direction cut from the center in the first direction of the main body. The dimension of the first side edge portion 114 in the third direction can be measured at five points equidistant in the second direction, and the average value of the measured values can be the average width Wm of the first side edge portion 114 in the third direction. Additionally, the same measurement method can also be applied to the second side edge portion 115.

[0071] The widths of the side edge portions 114 and 115 in the first direction can be substantially the same, and the deviation of the widths can be within 5%. This may be because the side edge portions 114 and 115 are formed by attaching a sheet 115a formed using solid resin to the side surface of the main body 110.

[0072] The connection electrodes 141 and 142 can be respectively arranged on the third surface 3 and the fourth surface 4 of the main body 110.

[0073] The connection electrodes 141 and 142 can include a first connection electrode 141 arranged on the third surface of the main body 110 and a second connection electrode 142 arranged on the fourth surface of the main body 110, and the inner electrodes 121 and 122 can include a first inner electrode 121 in contact with the first connection electrode 141 and a second inner electrode 122 in contact with the second connection electrode 142, and both ends of the first inner electrode 121 in the third direction and both ends of the second inner electrode 122 in the third direction can be in contact with the side edge portions 114 and 115.

[0074] The connection electrodes 141 and 142 can be formed using any material having conductivity (such as metal), and the specific material can be determined considering electrical characteristics and structural stability.

[0075] In an embodiment, the connection electrodes 141 and 142 may include a conductive metal and glass. That is, the connection electrodes 141 and 142 may be fired electrodes including a conductive metal and glass. Accordingly, the bonding strength between the connection electrodes 141 and 142 and the main body 110 may be improved, and the electrical connectivity between the connection electrodes 141 and 142 and the external electrodes 131 and 132 may be improved.

[0076] For example, the connection electrodes 141 and 142 may be formed by dipping the main body into a paste including a conductive metal and glass and performing a firing process. Alternatively, the connection electrodes 141 and 142 may be formed by pressing a sheet including a conductive metal and glass onto the main body and performing a firing process.

[0077] The conductive metal included in the connection electrodes 141 and 142 may be a material having excellent electrical conductivity and is not limited to any specific example. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and their alloys.

[0078] However, the connection electrodes 141 and 142 may not be fired electrodes, and in an embodiment, the connection electrodes 141 and 142 may be coatings.

[0079] In addition, the connection electrodes 141 and 142 may be formed by a sputtering method and an atomic layer deposition process.

[0080] Referring to Figure 6 , the average thickness ta of the connection electrodes 141 and 142 is not limited to any specific example. For example, the average thickness ta of the connection electrodes 141 and 142 may be 5 μm to 100 μm. The average thickness ta of the connection electrodes 141 and 142 may refer to the dimension in the second direction of the connection electrodes 141 and 142.

[0081] The average thickness ta of the connection electrodes 141 and 142 may be measured through cross-sections in the second direction and the third direction cut from the center in the first direction of the main body. The dimension in the second direction of the first connection electrode 141 may be measured at five points equidistant in the third direction, and the average value of the measured values may be the average thickness of the first connection electrode 141. Additionally, the same measurement method may also be applied to the second connection electrode 142.

[0082] The external electrodes 131 and 132 may be respectively disposed on the connection electrodes 141 and 142 and may include a conductive metal and a resin.

[0083] The conductive metal included in the external electrodes 131 and 132 is not limited to any specific example and may include, for example, Cu, Ni, Sn, Pd, Pt, Au, Ag, Pb, and / or their alloys, and more preferably, the conductive metal may include at least one of Cu, Ag, Sn, and their alloys.

[0084] The outer electrodes 131 and 132 can absorb the tensile stress generated in a mechanical environment or a thermal environment when the electronic component is mounted on the substrate, thereby preventing cracks, and can protect the multilayer ceramic capacitor from the warpage impact of the substrate.

[0085] The resin included in the outer electrodes 131 and 132 may include a thermosetting resin having electrical insulation properties.

[0086] In this case, the thermosetting resin may be, for example, an epoxy resin, but embodiments thereof are not limited thereto, and the thermosetting resin may be, for example, a resin having a small molecular weight and being liquid at room temperature, such as bisphenol A resin, ethylene glycol epoxy resin, phenolic epoxy resin, or derivatives thereof.

[0087] In addition, the resin included in the outer electrodes 131 and 132 may be at least one of a silicone resin, a fluororesin, an acrylic resin, and ethyl cellulose.

[0088] The outer electrodes 131 and 132 may have a multilayer structure.

[0089] For example, the outer electrodes 131 and 132 may be respectively disposed on the connection electrodes 141 and 142, and may include a conductive resin layer and a plating layer formed on the conductive resin layer, the conductive resin layer including a conductive metal and a resin.

[0090] The plating layer can improve the mounting performance. The type of the plating layer is not limited to any specific example, and may be a plating layer including at least one of Ni, Sn, Pd, and their alloys, and may be formed into multiple layers.

[0091] For a more specific example of the plating layer, the plating layer may be a Ni plating layer or a Sn plating layer, or a Ni plating layer and a Sn plating layer may be sequentially formed on the conductive resin layer, or a Sn plating layer, a Ni plating layer, and a Sn plating layer may be sequentially formed. In addition, the plating layer may include multiple Ni plating layers and / or multiple Sn plating layers.

[0092] Refer to Figure 6 The average thickness tb of the outer electrodes 131 and 132 is not limited to any specific example. For example, the average thickness tb of the outer electrodes 131 and 132 may be 20 μm to 150 μm. The average thickness tb of the outer electrodes 131 and 132 may refer to the dimension in the second direction of the outer electrodes 131 and 132.

[0093] The average thickness tb of the outer electrodes 131 and 132 can be measured through cross-sections in the second direction and the third direction cut from the center in the first direction of the main body. The dimension of the first outer electrode 131 in the second direction can be measured at five points equidistantly spaced in the third direction, and the average value of the measured values can be the average thickness of the first outer electrode 131. Additionally, the same measurement method can also be applied to the second outer electrode 132.

[0094] Referring to Figure 2 and Figure 6 , in an embodiment, the side edge portions 114 and 115 can be provided to cover two end portions of the connection electrodes 141 and 142 in the third direction, and the outer electrodes 131 and 132 can be respectively provided to cover one end portion of the first connection electrode 141 in the second direction and one end portion of the second connection electrode 142 in the second direction.

[0095] In an embodiment, the first outer electrode 131 can be provided to cover one end portion of the first connection electrode 141 in the second direction and the second outer electrode 132 can be provided to cover one end portion of the second connection electrode 142 in the second direction, and the first outer electrode 131 and the second outer electrode 132 can both extend to a part of the portion of the side edge portion 114 located on the fifth surface, a part of the portion of the side edge portion 115 located on the sixth surface, a part of the first surface 1, and a part of the second surface 2.

[0096] In an embodiment, the side edge portions 114 and 115 can extend to a part of the first surface 1 and a part of the second surface 2. According to an embodiment, after forming the connection electrodes 141 and 142, the side edge portions 114 and 115 can be formed, and thereafter, the outer electrodes 131 and 132 can be formed such that the outer electrodes 131 and 132 can be provided on a part of the portion of the side edge portions 114 and 115 located on the first surface and a part of the portion located on the second surface.

[0097] In an embodiment, referring to Figure 8 , the connection electrodes 141' and 142' can extend to a part of the fifth surface and a part of the sixth surface of the main body. However, the first connection electrode 141' can extend to be spaced apart from the part of the second inner electrode 122 exposed on the fifth surface of the main body and the part exposed on the sixth surface of the main body, and the second connection electrode 142' can extend to be spaced apart from the part of the first inner electrode 121 exposed on the fifth surface of the main body and the part exposed on the sixth surface of the main body.

[0098] According to an embodiment, the side edge portions 114' and 115' can be formed after forming the connection electrodes 141' and 142' such that the side edge portions 114' and 115' can be provided on the part of the connection electrodes 141' and 142' located on the fifth surface and the part located on the sixth surface.

[0099] In an embodiment, the inner electrodes 121 and 122 may include a first inner electrode and a second inner electrode. The first inner electrode 121 may be exposed to the third surface, spaced apart from the fourth surface, and may be exposed to a part of the fifth surface and a part of the sixth surface. The second inner electrode 122 may be exposed to the fourth surface, spaced apart from the third surface, and may be exposed to a part of the fifth surface and a part of the sixth surface. The connection electrodes 141' and 142' may include a first connection electrode and a second connection electrode. The first connection electrode 141' may be disposed on the third surface and may extend to a part of the areas of the fifth surface and the sixth surface where the second inner electrode 122 is not exposed, and the second connection electrode 142' may be disposed on the fourth surface and may extend to a part of the areas of the fifth surface and the sixth surface where the first inner electrode 121 is not exposed.

[0100] As Figure 9 shown, the side edge portions 114'' and 115'' may be spaced apart from both the third surface and the fourth surface. For example, the side edge portions 114'' and 115'' may be spaced apart from the third surface and the fourth surface, and may be arranged to cover the area where both the first inner electrode and the second inner electrode are exposed on the fifth surface and the sixth surface. In this case, the connection electrodes 141'' and 142'' may extend to a part on the fifth surface and the sixth surface of the main body. The first connection electrode 141'' may extend to be spaced apart from the part of the second inner electrode 122 exposed on the fifth surface of the main body and the part exposed on the sixth surface of the main body, and the second connection electrode 142'' may extend to be spaced apart from the part of the first inner electrode 121 exposed on the fifth surface of the main body and the part exposed on the sixth surface of the main body.

[0101] In addition, a part of the outer electrodes 131 and 132 may be arranged to contact a part of the fifth surface and a part of the sixth surface, and may cover both ends of the side edge portions 114'' and 115'' in the second direction. However, the first connection electrode 141'' may extend to be spaced apart from the part of the second inner electrode 122 exposed on the fifth surface of the main body and the part exposed on the sixth surface of the main body, and the second connection electrode 142'' may extend to be spaced apart from the part of the first inner electrode 121 exposed on the fifth surface of the main body and the part exposed on the sixth surface of the main body.

[0102] In an embodiment, the inner electrodes 121 and 122 may include a first inner electrode and a second inner electrode. The first inner electrode 121 may be exposed on a third surface, spaced apart from a fourth surface, and may be exposed on a part of a fifth surface and a part of a sixth surface. The second inner electrode 122 may be exposed on the fourth surface, spaced apart from the third surface, and may be exposed on a part of the fifth surface and a part of the sixth surface. The connection electrodes 141'' and 142'' may include a first connection electrode and a second connection electrode. The first connection electrode 141'' may be disposed on the third surface and may be disposed on a part of an area of the fifth surface and the sixth surface where the second inner electrode 122 is not exposed (i.e., a part of the fifth surface and the sixth surface that does not contact the second inner electrode 122), and the second connection electrode 142'' may be disposed on the fourth surface and may be disposed on a part of an area of the fifth surface and the sixth surface where the first inner electrode 121 is not exposed (i.e., a part of the fifth surface and the sixth surface that does not contact the first inner electrode 121).

[0103] In an embodiment, the side edge portions 114'' and 115'' may both be spaced apart from the first connection electrode 141'' and the second connection electrode 142''.

[0104] In an embodiment, the outer electrodes 131 and 132 may be disposed to cover a space located outside the fifth surface and the sixth surface such that the side edge portions 114'' and 115'' are spaced apart from the first connection electrode 141'' and the second connection electrode 142''.

[0105] In an embodiment, the side edge portions 114'' and 115'' may be disposed to cover an end portion of the first connection electrode 141'' on the fifth surface and an end portion on the sixth surface, and an end portion of the second connection electrode 142'' on the fifth surface and an end portion on the sixth surface.

[0106] According to the foregoing embodiments, the reliability of the multilayer electronic component can be improved.

[0107] In addition, by including resin in the side edge portion, cracks can be prevented from forming in the side edge portion.

[0108] The embodiments are not intended to limit the scope of the embodiments to the form of the specific embodiments. In contrast, modifications, equivalents, and substitutions included in the spirit and technical scope of the present disclosure may be employed. Throughout the specification, like reference numerals are used to refer to like elements.

[0109] In an embodiment, the term "embodiment" may not refer to the same embodiment and may be provided to describe and emphasize different unique features of each embodiment. The above embodiments can be implemented, but the possibility of combining features with other embodiments is not excluded. For example, even if a feature described in one embodiment is not described in another embodiment, the description can be understood as being related to another embodiment unless otherwise stated.

[0110] Expressions used in the singular cover plural expressions unless having a significantly different meaning in the context.

[0111] Although the embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations can be made without departing from the scope of the present disclosure defined by the appended claims.

Claims

1. A multilayer electronic component comprising: a body including a capacitance forming portion and a covering portion, the capacitance forming portion including a dielectric layer and inner electrodes alternately arranged with the dielectric layer in a first direction, the covering portion being arranged on two surfaces of the capacitance forming portion in the first direction, and the body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface opposite to each other and connected to the first surface and the second surface in the second direction, and a fifth surface and a sixth surface opposite to each other in the third direction and connected to the first surface to the fourth surface; connecting electrodes, disposed on the third surface and the fourth surface and connected to the inner electrode; a side edge portion provided on the fifth surface and the sixth surface and including a first resin; and an external electrode disposed on the connection electrode and comprising a first conductive metal and a second resin, Wherein, the side edge portion is configured to cover both ends of the connecting electrode in the third direction, and Wherein, the outer electrode covers both ends of the side edge portion in the second direction.

2. The multilayer electronic component of claim 1, wherein: The connection electrode includes a second conductive metal and glass.

3. The multilayer electronic component of claim 1, wherein: The connecting electrode is a plated layer.

4. The multilayer electronic component of claim 1, wherein: The first resin includes at least one selected from epoxy resin, silicone resin, fluororesin, acrylic resin, and ethyl cellulose.

5. The multilayer electronic component of claim 1, wherein: The type of the first resin is the same as the type of the second resin.

6. The multilayer electronic component of claim 1, wherein: The external electrode extends to a portion of the side edge portion located on the fifth surface and a portion of the side edge portion located on the sixth surface, as well as a portion of the first surface and a portion of the second surface.

7. The multilayer electronic component according to claim 6, in, The side edge portion extends to a portion of the first surface and a portion of the second surface, and The external electrode is disposed on a portion of the side edge portion located on the first surface and a portion of the side edge portion located on the second surface.

8. The multilayer electronic component of claim 1, wherein: The side edge portion contacts portions of the internal electrode exposed to the fifth surface and the sixth surface.

9. The multilayer electronic component of claim 1, wherein: The side edge portion covers both surfaces of the capacitance forming portion in the third direction and both surfaces of the covering portion in the third direction.

10. The multilayer electronic component according to claim 1, in, The connection electrode extends to a portion of the fifth surface and a portion of the sixth surface, and The side edge portion is provided on a portion of the connection electrode located on the fifth surface and a portion of the connection electrode located on the sixth surface.

11. The multilayer electronic component of claim 1, wherein: The connection electrodes are disposed only on the third surface and the fourth surface.

12. The multilayer electronic component of claim 1, wherein: The side edge portion is made of the first resin.

13. A multilayer electronic component comprising: a body including a capacitance forming portion and a covering portion, the capacitance forming portion including a dielectric layer and inner electrodes alternately arranged with the dielectric layer in a first direction, the covering portion being arranged on two surfaces of the capacitance forming portion in the first direction, and the body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface opposite to each other and connected to the first surface and the second surface in the second direction, and a fifth surface and a sixth surface opposite to each other in the third direction and connected to the first surface to the fourth surface; connecting electrodes, disposed on the third surface and the fourth surface and connected to the inner electrode; a side edge portion provided on the fifth surface and the sixth surface and including a first resin; and an external electrode disposed on the connection electrode and comprising a first conductive metal and a second resin, Wherein, the outer electrode is configured to cover both ends of the connecting electrode in the third direction, and Wherein, the side edge portion is arranged to be spaced apart from the third surface and the fourth surface.

14. The multilayer electronic component according to claim 13, in, The inner electrode comprises a first inner electrode and a second inner electrode, wherein the first inner electrode is exposed to the third surface, is spaced apart from the fourth surface, and is exposed to a first portion of the fifth surface and a first portion of the sixth surface, wherein the second inner electrode is exposed to the fourth surface, is spaced apart from the third surface, and is exposed to a second portion of the fifth surface and a second portion of the sixth surface, Wherein, the connecting electrode comprises a first connecting electrode and a second connecting electrode, wherein the first connecting electrode is disposed on the third surface and extends to a portion of the third portion of the fifth surface and the sixth surface that is not in contact with the second internal electrode, and The second connecting electrode is disposed on the fourth surface and extends to a portion of the fourth portion of the fifth surface and the sixth surface that is not in contact with the first internal electrode.

15. The multilayer electronic component of claim 14, wherein: The side edge portion is spaced apart from the first connection electrode and the second connection electrode.

16. The multilayer electronic component of claim 15, wherein: The external electrode covers a space, and the side edge portion and the first and second connection electrodes are spaced apart from each other by the space.

17. The multilayer electronic component of claim 13, wherein: The connection electrode includes a second conductive metal and glass.

18. A multilayer electronic component comprising: a body including a capacitance forming portion and a covering portion, the capacitance forming portion including a dielectric layer and inner electrodes alternately arranged with the dielectric layer in a first direction, the covering portion being arranged on two surfaces of the capacitance forming portion in the first direction, and the body including a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface opposite to each other and connected to the first surface and the second surface in the second direction, and a fifth surface and a sixth surface opposite to each other in the third direction and connected to the first surface to the fourth surface; connecting electrodes, disposed on the third surface and the fourth surface and connected to the inner electrode; a side edge portion provided on the fifth surface and the sixth surface and including a first resin; and an external electrode disposed on the connection electrode and comprising a first conductive metal and a second resin, Wherein, the side edge portion is configured to cover both ends of the connecting electrode in the third direction, and Wherein, the side edge portion is arranged to be spaced apart from the third surface and the fourth surface.

19. The multilayer electronic component according to claim 18, in, The inner electrode comprises a first inner electrode and a second inner electrode, wherein the first inner electrode is exposed to the third surface, is spaced apart from the fourth surface, and is exposed to a first portion of the fifth surface and a first portion of the sixth surface, wherein the second inner electrode is exposed to the fourth surface, is spaced apart from the third surface, and is exposed to a second portion of the fifth surface and a second portion of the sixth surface, Wherein, the connecting electrode comprises a first connecting electrode and a second connecting electrode, wherein the first connecting electrode is disposed on the third surface and extends to a portion of the third portion of the fifth surface and the sixth surface that is not in contact with the second internal electrode, and The second connecting electrode is disposed on the fourth surface and extends to a portion of the fourth portion of the fifth surface and the sixth surface that is not in contact with the first internal electrode.

20. The multilayer electronic assembly of claim 19, wherein: The side edge portion covers an end portion of the first connection electrode on the fifth surface and an end portion of the first connection electrode on the sixth surface and an end portion of the second connection electrode on the fifth surface and an end portion of the second connection electrode on the sixth surface.

21. The multilayer electronic assembly of claim 18, wherein: The connection electrode includes a second conductive metal and glass.

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