Diamond semiconductor heat sink assembly

Abstract

The invention relates to the technical field of heat sink assemblies, in particular to a diamond semiconductor heat sink assembly which comprises a diamond semiconductor element, a heat sink frame is installed at the lower end of the diamond semiconductor element, and two sets of conveying holes are formed in the inner bottom wall of the heat sink frame. A second cooling pipe and a first cooling pipe are sequentially installed at the lower end of the heat sink frame from front to back, and the second cooling pipe and the first cooling pipe are installed with the two sets of conveying holes in a matched mode respectively. Heat dissipation is conducted again through the second diamond heat conduction frame, so that the overall heat dissipation and cooling effect is complete, heat can be rapidly conducted through the first diamond heat conduction block, the heat sink frame and the second diamond heat conduction frame, the overall heat conduction speed is high, and the heat dissipation efficiency is high. Meanwhile, through the design of the heat dissipation through holes and the heat dissipation net, the number of heat conduction channels can be increased, so that the conduction speed can be increased, and the overall heat sink effect is good.

Description

Technical Field

[0001] The present invention relates to the technical field of heat sink components, and particularly to a diamond semiconductor heat sink component. Background Art

[0002] Diamond has an ultra-high thermal conductivity, and its thermal conductivity can reach 2000 W / mK, which is the material with the highest thermal conductivity among the known materials in nature at present. It is more than 5 times that of good thermal conductive materials such as metal copper (400 W / mK) and silicon carbide (350 - 450 W / mK) at room temperature, and more than 3 times that of the diamond copper material (600 W / mK). These many excellent properties make diamond the first choice for high-power device heat dissipation materials.

[0003] In this regard, Chinese Patent Application No.: CN101365328B discloses a heat sink for carrying a UV-ray light-emitting diode. In this heat sink, there are openings for fluid flow channels through which fluid circulates to cool the UV-ray light-emitting diode. Supply ports and discharge ports are opened in the mounting surface of the head to supply and discharge the cooling fluid to and from the heat sink. In the contact surface that contacts the mounting surface of the heat sink, a pair of flow orifices corresponding to the supply port and the discharge port are opened. Depressions are formed around each flow orifice, and an annular seal showing rubber elasticity and being pressed between the heat sink and the head is arranged in each depression.

[0004] However, in actual use, when cooling the heating element of a diamond semiconductor element through a heat sink, the above-mentioned method cools the diamond semiconductor element through a coolant. However, when the coolant is cooling, it cannot flow out and flow in automatically, and after absorbing heat through the coolant, it cannot completely transfer and discharge the heat emitted by the diamond semiconductor element, and cannot discharge the heat in real time and quickly. The overall has limitations. Therefore, improving and modifying the above problems has become an urgent problem to be solved at present. Summary of the Invention

[0005] The purpose of the present invention is to provide a diamond semiconductor heat sink component to solve the problem that when cooling the heating element of a diamond semiconductor element through a heat sink, the above-mentioned method cools the diamond semiconductor element through a coolant. However, when the coolant is cooling, it cannot flow out and flow in automatically, and after absorbing heat through the coolant, it cannot completely transfer and discharge the heat emitted by the diamond semiconductor element, and cannot discharge the heat in real time and quickly. The overall has limitations as mentioned in the above background art.

[0006] To achieve the above object, the present invention provides the following technical solution: A diamond semiconductor heat sink assembly includes a diamond semiconductor element. A heat sink frame is installed at the lower end of the diamond semiconductor element. A conveying hole is provided on the inner bottom wall of the heat sink frame. There are two groups of the conveying holes. A second cooling pipe and a first cooling pipe are successively installed at the lower end of the heat sink frame from front to back. The second cooling pipe and the first cooling pipe are respectively installed in mutual adaptation with the two groups of conveying holes. A second diamond heat conducting block and a first diamond heat conducting block are successively installed on the inner bottom wall of the diamond semiconductor element from front to back. A magnet block is installed inside the first diamond heat conducting block. A support frame is installed inside the heat sink frame. A motor body is installed at the lower end of the support frame. An output end of the motor body is installed with a first gear. A first rack plate is installed on the right side surface of the first gear. A second rack plate is installed on the left side surface of the first gear. A fixed frame is provided on the outer surfaces of the first cooling pipe and the second cooling pipe. An installation iron block is magnetically attracted and installed on the upper surface of the magnet block. A diamond heat dissipation abutting block is installed on the front surface of the installation iron block. The front surface of the diamond heat dissipation abutting block abuts against the back surface of the diamond semiconductor element;

[0007] A connecting shaft is installed at the lower end of the first gear. The connecting shaft penetrates through the inside of the heat sink frame for installation. A second gear is installed at one end of the connecting shaft away from the first gear. A moving rack plate is installed on the left side surface of the second gear. A sliding block is installed on the back surface of the moving rack plate. A piston cylinder is installed at the lower end of the sliding block. A coolant cylinder is provided on the outer surface of the piston cylinder. The coolant cylinder is installed on the front surface of the first cooling pipe. The piston cylinder is movably connected inside the coolant cylinder. A second iron frame and a first iron frame are successively installed on the lower surface of the heat sink frame from front to back. A magnetic attraction installation is provided between the first iron frame and the first diamond heat conducting block.

[0008] Preferably, a first diamond heat conducting frame is installed on the back surface of the second iron frame. A second diamond heat conducting frame is installed on the front surface of the first iron frame.

[0009] Preferably, a heat dissipation net is provided at the lower end of the second diamond heat conducting frame. Heat dissipation through holes are provided on both the left and right sides of the second diamond heat conducting frame. A heat dissipation cavity is provided inside the second diamond heat conducting frame.

[0010] Preferably, a first conduction frame is installed on the front surface of the second diamond heat conducting frame. A guiding block is provided inside the first conduction frame.

[0011] Preferably, a movable shaft is installed on the left side surface of the guiding block. A rotating gear and a rotating fan blade are successively installed on the outer surface of the movable shaft from left to right. There are two groups of the rotating fan blades. The installation positions of the two groups of rotating fan blades are symmetric with each other.

[0012] Preferably, a side block is installed on the front surface of the first conduction frame, and a slot is provided inside the side block.

[0013] Preferably, a second conduction frame is installed on the back surface of the first diamond heat conduction frame, a convex rack plate is installed on the back surface of the second conduction frame, and the convex rack plate is adapted to the slot.

[0014] Preferably, a first installation heat conduction frame is installed on the lower surface of the first conduction frame, and a first heat dissipation opening is provided inside the first installation heat conduction frame.

[0015] Preferably, a second installation heat conduction frame is installed on the lower surface of the second conduction frame, and a second heat dissipation hole is provided inside the second installation heat conduction frame.

[0016] Preferably, a lower heat conduction network frame is installed on the front surface of the first installation heat conduction frame, an upper heat conduction network frame is installed on the back surface of the second installation heat conduction frame, and the lower surface of the upper heat conduction network frame abuts against the upper surface of the lower heat conduction network frame.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] 1. For this diamond semiconductor heat sink assembly, through the arranged delivery holes, first cooling pipe, second cooling pipe, magnet block, first diamond heat conduction block, support frame, motor body, first gear, first rack plate, second rack plate, second diamond heat conduction block, connecting shaft, second gear, moving rack plate, sliding block, piston cylinder, coolant cylinder, first iron frame, second iron frame, first diamond heat conduction frame and second diamond heat conduction frame, when the diamond semiconductor element emits heat for cooling, first start the motor body. The support frame can support the position of the motor body, and the overall support effect is good. Subsequently, drive the first gear to rotate through the motor body, and then drive the first rack plate and the second rack plate to move through the first gear. At this time, the second rack plate will move backward, and the first rack plate will move forward. Then the second rack plate will drive the second diamond heat conduction block to move, so that the first diamond heat conduction block will also move at this time. The second diamond heat conduction block and the first diamond heat conduction block will approach each other. The moving second diamond heat conduction block and first diamond heat conduction block will expose the two groups of delivery holes. At the same time, the first gear will drive the connecting shaft and the second gear to rotate. At this time, the moving rack plate and the sliding block will also move backward. Then the sliding block will drive the piston cylinder to move inside the coolant cylinder, so that the piston cylinder can squeeze the coolant inside the coolant cylinder and the first cooling pipe, and then squeeze the coolant into the delivery holes, so that it can enter the inside of the heat sink frame. At this time, there is coolant inside the heat sink frame. Through the heat conductivity of the heat sink frame and the design of the coolant, the heat dissipated by the heat sink frame can be absorbed and transferred. At the same time, the first diamond heat conduction block and the second diamond heat conduction block can also absorb and transfer heat. And when the first diamond heat conduction block moves, the magnet block will also move at this time. Since the magnet block and the first iron frame are magnetically attracted to each other, the magnet block will drive the first iron frame to move. When the first iron frame moves, the first iron frame will also drive the second diamond heat conduction frame to move. Then the second diamond heat conduction frame moves to the lower end of the first diamond heat conduction block. The heat is transferred from the first diamond heat conduction block and the heat sink frame to the second diamond heat conduction frame, and then the second diamond heat conduction frame dissipates heat again. Thus, the overall heat dissipation and cooling effect is relatively complete. It can quickly conduct heat through the first diamond heat conduction block, heat sink frame and second diamond heat conduction frame. The overall heat conduction speed is relatively fast. At the same time, through the design of the heat dissipation through holes and heat dissipation nets, the number of heat conduction channels can be increased, so that the conduction speed will become faster. The overall heat sink effect is good, reflecting the functionality of the design.

[0019] 2. For this diamond semiconductor heat sink assembly, through the provided first conduction frame, guiding block, movable shaft, rotating gear, rotating fan blade, side block, slot, second conduction frame, second conduction frame, convex rack plate, first mounting heat conduction frame, second mounting heat conduction frame, and upper heat conduction grid frame, when the first iron frame moves, at this time the second diamond heat conduction block will drive the second iron frame to move, so that the first iron frame and the second iron frame will move towards each other. At this time, the second conduction frame will drive the convex rack plate to move. Since the convex rack plate and the slot are mutually adapted, subsequently the convex rack plate will be inserted into the inside of the slot, and then the convex rack plate will move to the lower surface of the rotating gear. Then, the rotating gear and the convex rack plate will engage with each other, so that the convex rack plate will drive the rotating gear to rotate. Then, the rotating gear will drive the rotating fan blade to rotate, so that the rotating fan blade will blow air to the left and right sides inside the first conduction frame. Through the inclined design of the guiding block, the air can be guided. Subsequently, the air will enter the heat dissipation cavity through the guidance of the guiding block. When the air is blown into the inside of the heat dissipation cavity, it can make the heat conduction speed inside the second diamond heat conduction frame faster, and can also exchange heat with the heat inside the heat dissipation cavity, enabling the heat to decrease. At the same time, when the first iron frame and the second iron frame move, at this time the first mounting heat conduction frame and the second mounting heat conduction frame will also approach each other. When the first mounting heat conduction frame and the second mounting heat conduction frame approach each other, at this time the upper heat conduction grid frame will move to the surface of the lower heat conduction grid frame. Through the first mounting heat conduction frame and the second mounting heat conduction frame, heat can also be conducted. Subsequently, the upper heat conduction grid frame abuts against the upper surface of the lower heat conduction grid frame. Through the overlapping design of the upper heat conduction grid frame and the lower heat conduction grid frame, the heat conduction can be made faster, the heat conduction channels will increase, the overall cooling speed is faster, and the heat contact area with the outside is wider, reflecting the ingenuity of the design. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a three-dimensional schematic diagram of the structure of the present invention;

[0021] Figure 2 is a cross-sectional schematic diagram of the heat sink frame structure of the present invention;

[0022] Figure 3 is a split cross-sectional schematic diagram of the heat sink frame and the second cooling pipe structures of the present invention;

[0023] Figure 4 is a three-dimensional schematic diagram of the structures of the first gear and the second gear of the present invention;

[0024] Figure 5 is a three-dimensional schematic diagram of the structures of the first cooling pipe and the coolant cylinder of the present invention;

[0025] Figure 6 is a three-dimensional schematic diagram of the structures of the fixed frame and the movable rack plate of the present invention;

[0026] Figure 7 Schematic three-dimensional view of the structure of the first iron frame and the second iron frame of the present invention;

[0027] Figure 8 Schematic exploded front view of the flipped structure of the first iron frame and the first conduction frame of the present invention;

[0028] Figure 9 Schematic three-dimensional view of the flipped structure of the first iron frame and the second diamond heat conduction frame of the present invention;

[0029] Figure 10 Schematic three-dimensional view of the structure of the rotating gear and the guiding block of the present invention;

[0030] Figure 11 Schematic exploded view of the structure of the second heat conduction mounting frame and the first heat conduction mounting frame of the present invention.

[0031] In the figure: 1, diamond semiconductor element; 2, heat sink frame; 3, conveying hole; 4, first cooling pipe; 5, second cooling pipe; 6, magnet block; 7, first diamond heat conduction block; 8, support frame; 9, motor body; 10, first gear; 11, first rack plate; 12, second rack plate; 13, second diamond heat conduction block; 14, connecting shaft; 15, second gear; 16, moving rack plate; 17, sliding block; 18, piston cylinder; 19, coolant cylinder; 20, first iron frame; 21, second iron frame; 22, first diamond heat conduction frame; 23, second diamond heat conduction frame; 24, heat dissipation through hole; 25, heat dissipation net; 26, heat dissipation cavity; 27, first conduction frame; 28, guiding block; 29, movable shaft; 30, rotating gear; 31, rotating fan blade; 32, side block; 33, slot; 35, second conduction frame; 36, convex rack plate; 37, first heat conduction mounting frame; 38, second heat conduction mounting frame; 39, upper heat conduction grid frame; 40, lower heat conduction grid frame; 41, fixed frame; 42, mounting iron block; 43, diamond heat dissipation abutting block. Detailed implementation manners

[0032] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0033] Please refer to Figures 1 - 11 , an embodiment provided by the present invention:

[0034] A diamond semiconductor heat sink assembly. The diamond semiconductor element 1, heat sink frame 2, magnet block 6, first diamond heat conducting block 7, motor body 9, coolant cylinder 19, first diamond heat conducting frame 22, first mounting heat conducting frame 37, upper heat conducting wire frame 39, and heat exchange diamond heat dissipation abutting block 43 used in this application are all products that can be directly purchased on the market. Their principles and connection methods are all prior arts well-known to those skilled in the art, so they will not be elaborated here. It includes a diamond semiconductor element 1. A heat sink frame 2 is installed at the lower end of the diamond semiconductor element 1. A temperature sensor is arranged inside the heat sink frame 2. Through the temperature sensor, it can be sensed whether the heat dissipated by the diamond semiconductor element 1 needs to be cooled. Two groups of conveying holes 3 are opened on the inner bottom wall of the heat sink frame 2. A second cooling pipe 5 and a first cooling pipe 4 are successively installed at the lower end of the heat sink frame 2 from front to back. The second cooling pipe 5 and the first cooling pipe 4 are respectively installed in mutual adaptation with the two groups of conveying holes 3. A second diamond heat conducting block 13 and a first diamond heat conducting block 7 are successively installed on the inner bottom wall of the diamond semiconductor element 1 from front to back. A magnet block 6 is installed inside the first diamond heat conducting block 7. A support frame 8 is installed inside the heat sink frame 2. A motor body 9 is installed at the lower end of the support frame 8. An output end of the motor body 9 is installed with a first gear 10. A first rack plate 11 is installed on the right surface of the first gear 10. A second rack plate 12 is installed on the left surface of the first gear 10. Fixed frames 41 are arranged on the outer surfaces of the first cooling pipe 4 and the second cooling pipe 5. An installation iron block 42 is magnetically attracted and installed on the upper surface of the magnet block 6. A diamond heat dissipation abutting block 43 is installed on the front surface of the installation iron block 42. The front surface of the diamond heat dissipation abutting block 43 abuts against the back surface of the diamond semiconductor element 1. When the magnet block 6 moves, the magnet block 6 will also drive the installation iron blocks 42 to move by magnetic attraction with each other. Thus, the installation iron block 42 will drive the diamond heat dissipation abutting block 43 to move forward. By the front surface of the diamond heat dissipation abutting block 43 abutting against the back surface of the diamond semiconductor element 1, the heat dissipated by the diamond semiconductor element 1 can be conducted and dissipated through the diamond heat dissipation abutting block 43. At the same time, the position of the diamond semiconductor element 1 can also be fixed, and the overall fixing effect is good. When the first iron frame 20 moves, at this time, the second diamond heat conducting block 13 will drive the second iron frame 21 to move. Thus, the first iron frame 20 and the second iron frame 21 will move towards each other. At this time, the second conduction frame 35 will drive the convex rack plate 36 to move. Since the convex rack plate 36 and the slot 33 are mutually adapted, then the convex rack plate 36 will be inserted into the inside of the slot 33. Then the convex rack plate 36 will move to the lower surface of the rotating gear 30. Then the rotating gear 30 and the convex rack plate 36 will be engaged with each other. Thus, the convex rack plate 36 will drive the rotating gear 30 to rotate. Then the rotating gear 30 will drive the rotating fan blade 31 to rotate. Thus, the rotating fan blade 31 will blow air to the left and right sides inside the first conduction frame 27. Through the inclined design of the guiding block 28, the air can be guided.Subsequently, the wind will enter the heat dissipation cavity 26 through the guidance of the guiding block 28. When the wind blows into the interior of the heat dissipation cavity 26, it can accelerate the heat conduction speed inside the second diamond heat conduction frame 23 and also exchange heat with the heat inside the heat dissipation cavity 26, enabling the heat to decrease. At the same time, when the first iron frame 20 and the second iron frame 21 move, the first installation heat conduction frame 37 and the second installation heat conduction frame 38 will also approach each other. When the first installation heat conduction frame 37 and the second installation heat conduction frame 38 approach each other, the upper heat conduction network frame 39 will move onto the surface of the lower heat conduction network frame 40. The first installation heat conduction frame 37 and the second installation heat conduction frame 38 can also conduct heat. Subsequently, the upper heat conduction network frame 39 abuts against the upper surface of the lower heat conduction network frame 40. The overlapping design of the upper heat conduction network frame 39 and the lower heat conduction network frame 40 can make the heat conduction faster, increase the number of heat conduction channels, result in a faster overall cooling speed, and a wider contact area of the heat with the outside world;

[0035] Connecting shaft 14 is installed at the lower end of the first gear 10. The connecting shaft 14 passes through the inside of the heat sink frame 2 for installation. At one end of the connecting shaft 14 away from the first gear 10, a second gear 15 is installed. On the left side surface of the second gear 15, a moving rack plate 16 is installed. On the back surface of the moving rack plate 16, a sliding block 17 is installed. At the lower end of the sliding block 17, a piston cylinder 18 is installed. On the outer surface of the piston cylinder 18, a coolant cylinder 19 is arranged. The coolant cylinder 19 is installed on the front surface of the first cooling pipe 4. The piston cylinder 18 is movably connected inside the coolant cylinder 19. On the lower surface of the heat sink frame 2, a second iron frame 21 and a first iron frame 20 are installed in sequence from front to back. The first iron frame 20 and the first diamond heat conducting block 7 are magnetically installed. On the back surface of the second iron frame 21, a first diamond heat conducting frame 22 is installed. On the front surface of the first iron frame 20, a second diamond heat conducting frame 23 is installed. At the lower end of the second diamond heat conducting frame 23, a heat dissipation net 25 is arranged. Heat dissipation through holes 24 are opened on both the left and right sides of the second diamond heat conducting frame 23. A heat dissipation cavity 26 is opened inside the second diamond heat conducting frame 23. On the front surface of the second diamond heat conducting frame 23, a first conduction frame 27 is installed. Inside the first conduction frame 27, a guiding block 28 is arranged. On the left side surface of the guiding block 28, a movable shaft 29 is installed. On the outer surface of the movable shaft 29, a rotating gear 30 and a rotating fan blade 31 are installed in sequence from left to right. There are two groups of rotating fan blades 31, and the installation positions of the two groups of rotating fan blades 31 are symmetric to each other. On the front surface of the first conduction frame 27, a side block 32 is installed. Inside the side block 32, a slot 33 is opened. On the back surface of the first diamond heat conducting frame 22, a second conduction frame 35 is installed. On the back surface of the second conduction frame 35, a convex rack plate 36 is installed. The convex rack plate 36 and the slot 33 are mutually adapted. On the lower surface of the first conduction frame 27, a first installation heat conducting frame 37 is installed. Inside the first installation heat conducting frame 37, a first heat dissipation hole is opened. On the lower surface of the second conduction frame 35, a second installation heat conducting frame 38 is installed. Inside the second installation heat conducting frame 38, a second heat dissipation hole is opened. On the front surface of the first installation heat conducting frame 37, a lower heat conducting net frame 40 is installed. On the back surface of the second installation heat conducting frame 38, an upper heat conducting net frame 39 is installed. The lower surface of the upper heat conducting net frame 39 abuts against the upper surface of the lower heat conducting net frame 40. When the first diamond heat conducting block 7 and the second diamond heat conducting block 13 return to their original positions, at this time, the first diamond heat conducting block 7 and the second diamond heat conducting block 13 can push the coolant back into the inside of the conveying hole 3. Subsequently, the coolant will fall into the inside of the first cooling pipe 4 and the second cooling pipe 5. At the same time, when the first diamond heat conducting block 7 and the second diamond heat conducting block 13 return to their original positions, at this time, the piston cylinder 18 will also drive the inside of the coolant cylinder 19 to return to its original position, so as to stably store the coolant. And refrigerating sheets are arranged inside the first cooling pipe 4 and the coolant cylinder 19, so that these coolants can be recycled. And through the design of the fixed frame 41, heat preservation operation can be carried out on the coolant. The overall operation effect is good. And the sliding block 17 and the fixed frame 41 are slidably installed with each other.Moreover, the structure of the second cooling pipe 5 is the same as that of the first cooling pipe 4 and can play the same role. Two groups of first diamond heat conduction frames 22 are provided on the back surface of the second iron frame 21, and two groups of second diamond heat conduction frames 23 are provided on the front surface of the first iron frame 20. The first diamond heat conduction frame 22 and the second diamond heat conduction frame 23 are symmetrical to each other. Then, the positions of the other group of first diamond heat conduction frames 22 and second diamond heat conduction frames 23 on the surfaces of the second iron frame 21 and the first iron frame 20 are opposite. Thus, both groups of second diamond heat conduction frames 23 can play the role of conducting heat, and the overall heat sink effect is good. The holes on the surfaces of the upper heat conduction network frame 39 and the lower heat conduction network frame 40 overlap each other, and the overall conduction speed will be accelerated. When the diamond semiconductor element 1 emits heat for cooling, first, the motor body 9 is started. The support frame 8 can support the position of the motor body 9, and the overall support effect is good. Subsequently, the motor body 9 drives the first gear 10 to rotate, and then the first gear 10 drives the first rack plate 11 and the second rack plate 12 to move. At this time, the second rack plate 12 will move backward, and the first rack plate 11 will move forward. Then, the second rack plate 12 will drive the second diamond heat conduction block 13 to move. Thus, at this time, the first diamond heat conduction block 7 will also move. The second diamond heat conduction block 13 and the first diamond heat conduction block 7 will approach each other. The moving second diamond heat conduction block 13 and the first diamond heat conduction block 7 will expose the two conveying holes 3. At the same time, the first gear 10 will drive the connecting shaft 14 and the second gear 15 to rotate. At this time, the moving rack plate 16 and the sliding block 17 will also move backward. Then, the sliding block 17 will drive the piston cylinder 18 to move inside the coolant cylinder 19. Thus, the piston cylinder 18 can squeeze the coolant inside the coolant cylinder 19 and the first cooling pipe 4, and then squeeze the coolant into the inside of the conveying holes 3, so that it can enter the inside of the heat sink frame 2. At this time, there is coolant inside the heat sink frame 2. Through the heat conductivity of the heat sink frame 2 and the design of the coolant, the heat dissipated by the heat sink frame 2 can be absorbed and transferred. At the same time, the first diamond heat conduction block 7 and the second diamond heat conduction block 13 can also absorb and transfer heat. And when the first diamond heat conduction block 7 moves, at this time, the magnet block 6 will also move. Since the magnet block 6 and the first iron frame 20 are magnetically attracted to each other, the magnet block 6 will drive the first iron frame 20 to move. When the first iron frame 20 moves, the first iron frame 20 will also drive the second diamond heat conduction frame 23 to move. Then, the second diamond heat conduction frame 23 moves to the lower end of the first diamond heat conduction block 7. The first diamond heat conduction block 7 and the heat sink frame 2 transfer heat to the second diamond heat conduction frame 23, and the second diamond heat conduction frame 23 dissipates heat again. Thus, the overall heat dissipation and cooling effect is relatively complete, and heat can be quickly conducted through the first diamond heat conduction block 7, the heat sink frame 2 and the second diamond heat conduction frame 23, and the overall heat conduction speed is relatively fast.Meanwhile, the design of the heat dissipation through-holes 24 and the heat dissipation mesh 25 can increase the number of heat conduction channels, thereby speeding up the conduction speed and achieving a better overall heat sink effect.

[0036] Working principle: During use, when the diamond semiconductor element 1 emits heat for cooling, first start the motor body 9. The support frame 8 can support the position of the motor body 9 with a good overall support effect. Subsequently, the motor body 9 drives the first gear 10 to rotate, and then the first gear 10 drives the first rack plate 11 and the second rack plate 12 to move. At this time, the second rack plate 12 moves backward, and the first rack plate 11 moves forward. Then, the second rack plate 12 drives the second diamond heat conduction block 13 to move. Consequently, the first diamond heat conduction block 7 also moves. The second diamond heat conduction block 13 and the first diamond heat conduction block 7 approach each other. During the movement, the second diamond heat conduction block 13 and the first diamond heat conduction block 7 expose the two sets of delivery holes 3. At the same time, the first gear 10 drives the connecting shaft 14 and the second gear 15 to rotate. At this time, the moving rack plate 16 and the sliding block 17 also move backward. Then, the sliding block 17 drives the piston cylinder 18 to move inside the coolant cylinder 19. Thus, the piston cylinder 18 can squeeze the coolant inside the coolant cylinder 19 and the first cooling pipe 4, and then squeeze the coolant into the delivery holes 3, so that it can enter the inside of the heat sink frame 2. At this time, there is coolant inside the heat sink frame 2. Through the heat conductivity of the heat sink frame 2 and the design of the coolant, the heat dissipated by the heat sink frame 2 can be absorbed and transferred. At the same time, the first diamond heat conduction block 7 and the second diamond heat conduction block 13 can also absorb and transfer heat. And when the first diamond heat conduction block 7 moves, at this time, the magnet block 6 also moves. Since the magnet block 6 and the first iron frame 20 are magnetically attracted to each other, the magnet block 6 drives the first iron frame 20 to move. When the first iron frame 20 moves, the first iron frame 20 also drives the second diamond heat conduction frame 23 to move. Then, the second diamond heat conduction frame 23 moves to the lower end of the first diamond heat conduction block 7. The first diamond heat conduction block 7 and the heat sink frame 2 transfer heat to the second diamond heat conduction frame 23. Through the second diamond heat conduction frame 23 for further heat dissipation, heat can be quickly conducted through the first diamond heat conduction block 7, the heat sink frame 2, and the second diamond heat conduction frame 23. Meanwhile, the design of the heat dissipation through-holes 24 and the heat dissipation mesh 25 can increase the number of heat conduction channels;

[0037] When the first iron frame 20 moves, the second diamond heat conduction block 13 will drive the second iron frame 21 to move at this time. Thus, the first iron frame 20 and the second iron frame 21 will move towards each other. At this time, the second conduction frame 35 will drive the convex rack plate 36 to move. Since the convex rack plate 36 and the slot 33 are mutually adapted, subsequently, the convex rack plate 36 will be inserted into the inside of the slot 33. Then, the convex rack plate 36 will move to the lower surface of the rotating gear 30. Then, the rotating gear 30 and the convex rack plate 36 will engage with each other. Thus, the convex rack plate 36 will drive the rotating gear 30 to rotate. Then, the rotating gear 30 will drive the rotating fan blade 31 to rotate. Thus, the rotating fan blade 31 will blow air to the left and right sides inside the first conduction frame 27. Through the inclined design of the guiding block 28, the air can be guided. Subsequently, the air will enter the heat dissipation cavity 26 through the guidance of the guiding block 28. When the air is blown into the inside of the heat dissipation cavity 26, it can make the heat conduction speed inside the second diamond heat conduction frame 23 faster, and it can also exchange the heat inside the heat dissipation cavity 26. At the same time, when the first iron frame 20 and the second iron frame 21 move, at this time, the first installation heat conduction frame 37 and the second installation heat conduction frame 38 will also approach each other. When the first installation heat conduction frame 37 and the second installation heat conduction frame 38 approach each other, at this time, the upper heat conduction network frame 39 will move to the surface of the lower heat conduction network frame 40. Through the first installation heat conduction frame 37 and the second installation heat conduction frame 38, the heat can also be conducted. Subsequently, the upper heat conduction network frame 39 abuts against the upper surface of the lower heat conduction network frame 40. Through the overlapping design of the upper heat conduction network frame 39 and the lower heat conduction network frame 40, the heat conduction can be made faster, and the heat conduction channels will become more. The above is all the working principles of the present invention.

[0038] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, it is intended to embrace all changes within the meaning and scope of the equivalent elements of the claims in the present invention. Any reference signs in the claims should not be regarded as limiting the claims involved.

Claims

1. A diamond semiconductor heat sink assembly, comprising a diamond semiconductor element (1), a heat sink frame (2) being mounted at the lower end of the diamond semiconductor element (1), characterized in that: The inner bottom wall of the heat sink frame (2) is provided with a delivery hole (3), and the delivery hole (3) is provided with two groups. The lower end of the heat sink frame (2) is provided with a second cooling pipe (5) and a first cooling pipe (4) in sequence from front to back. The second cooling pipe (5) and the first cooling pipe (4) are respectively adapted to be installed with the two groups of delivery holes (3). The inner bottom wall of the diamond semiconductor element (1) is provided with a second diamond heat conductive block (13) and a first diamond heat conductive block (7) in sequence from front to back. A magnet block (6) is installed inside the first diamond heat conductive block (7). A support frame (8) is installed inside the heat sink frame (2). The support frame (8) A motor body (9) is installed at the lower end of the motor body (9), a first gear (10) is installed at the output end of the motor body (9), a first rack plate (11) is installed on the right surface of the first gear (10), a second rack plate (12) is installed on the left surface of the first gear (10), a fixing frame (41) is provided on the outer surface of the first cooling tube (4) and the second cooling tube (5), a mounting iron block (42) is magnetically mounted on the upper surface of the magnet block (6), a diamond heat dissipation block (43) is installed on the front surface of the mounting iron block (42), and the front surface of the diamond heat dissipation block (43) contacts the back surface of the diamond semiconductor element (1); A connecting shaft (14), wherein the connecting shaft (14) is installed at the lower end of the first gear (10), and the connecting shaft (14) is installed through the interior of the heat sink frame (2). A second gear (15) is installed at the end of the connecting shaft (14) away from the first gear (10). A movable rack plate (16) is installed on the left surface of the second gear (15), and a sliding block (17) is installed on the back of the movable rack plate (16). A piston cylinder (18) is installed at the lower end of the sliding block (17). A coolant cylinder (19) is provided on the outer surface of the piston cylinder (18), and the coolant cylinder (19) is installed on the front surface of the first cooling pipe (4). The piston cylinder (18) is movably connected inside the coolant cylinder (19). A second iron frame (21) and a first iron frame (20) are installed in sequence from front to back on the lower surface of the heat sink frame (2), and the first iron frame (20) is magnetically mounted to the first diamond heat conductive block (7).

2. A diamond semiconductor heat sink assembly according to claim 1, characterized in that: A first diamond heat-conducting frame (22) is installed on the back surface of the second iron frame (21), and a second diamond heat-conducting frame (23) is installed on the front surface of the first iron frame (20).

3. A diamond semiconductor heat sink assembly according to claim 2, characterized in that: A heat dissipation net (25) is provided at the lower end of the second diamond heat-conducting frame (23), heat dissipation through holes (24) are provided on both left and right sides of the second diamond heat-conducting frame (23), and a heat dissipation cavity (26) is provided inside the second diamond heat-conducting frame (23).

4. A diamond semiconductor heat sink assembly according to claim 2, characterized in that: A first conduction frame (27) is installed on the front surface of the second diamond heat conduction frame (23), and a guide block (28) is arranged inside the first conduction frame (27).

5. A diamond semiconductor heat sink assembly according to claim 4, characterized in that: A movable shaft (29) is installed on the left side surface of the guide block (28), and a rotating gear (30) and a rotating blade (31) are installed on the outer surface of the movable shaft (29) in sequence from left to right. The rotating blade (31) is provided in two groups, and the installation positions of the two groups of rotating blades (31) are symmetrical to each other.

6. A diamond semiconductor heat sink assembly according to claim 4, characterized in that: A side block (32) is installed on the front surface of the first conducting frame (27), and a slot (33) is provided inside the side block (32).

7. A diamond semiconductor heat sink assembly according to claim 2, characterized in that: A second conduction frame (35) is installed on the back of the first diamond heat conduction frame (22), and a convex rack plate (36) is installed on the back of the second conduction frame (35), and the convex rack plate (36) and the slot (33) are adapted to each other.

8. The diamond semiconductor heat sink assembly according to claim 4, characterized in that: A first heat-conducting mounting frame (37) is installed on the lower surface of the first conducting frame (27), and a first heat-dissipating hole is provided inside the first heat-conducting mounting frame (37).

9. The diamond semiconductor heat sink assembly according to claim 7, characterized in that: A second heat-conducting mounting frame (38) is installed on the lower surface of the second conduction frame (35), and a second heat-dissipating hole is provided inside the second heat-conducting mounting frame (38).

10. The diamond semiconductor heat sink assembly according to claim 8, characterized in that: A lower heat-conducting grid frame (40) is installed on the front surface of the first heat-conducting mounting frame (37), and an upper heat-conducting grid frame (39) is installed on the back surface of the second heat-conducting mounting frame (38), and the lower surface of the upper heat-conducting grid frame (39) abuts against the upper surface of the lower heat-conducting grid frame (40).

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