Display module, preparation method thereof and display device
By using a thin film-covered crystal packaging structure in the flexible display module to electrically connect it to the back trace of the printed circuit board, the problem of frame width limit and process risks is solved, and a higher screen-to-body ratio and higher process yield is achieved.
Patent Information
- Application Number
- CN202311866580.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-29
- Publication Date
- 2025-07-01
AI Technical Summary
The existing flexible display modules have limits on the frame width, and the risk of sealant structure falling off and metal trace breakage in the reverse folding process is high, which affects the process yield and trust.
The thin film covered crystal packaging structure is adopted, and the back traces of the printed circuit board are electrically connected to the signal transmission site to reduce the frame width, and the exposure and bonding of the signal transmission layer is achieved by removing the parts of the support plate layer and the insulating film layer.
It effectively reduces the frame width of the display module, increases the screen-to-body ratio, improves the process yield, and reduces the preparation cost.
Smart Images
Figure CN120237112A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of display technologies, and more particularly, to a display module, a preparation method thereof, and a display device. Background Art
[0002] In recent years, AMOLED panels have received increasing attention and favor due to their advantages of a wider color gamut, higher contrast ratio, better color purity, and flexibility and foldability, and have been widely used in various application scenarios. How to further optimize the user experience has also become the focus of attention in the development of flexible display modules.
[0003] In the prior art, in the design and preparation of flexible display modules, the method of folding the flexible display panel backward is mostly used to achieve the effect of a narrow border. Specifically, Figure 1 shows a schematic cross-sectional structure diagram of a display module in the folding area, as Figure 1 shown, it can be seen that through the folding design, the printed circuit board structure for signal control transmission can be arranged on the back of the display module, realizing the reduction of the border width of the display module.
[0004] However, since there must be a certain folding radius during the folding process of the display panel, there is an insurmountable limit border width when further reducing the border of the display module. At the same time, in the specific implementation process of the folding process, there are risks of the glue-sealing structure (such as Figure 1 shown as 101 in [reference]) falling off and the metal traces cracking due to stress, which will affect the manufacturing yield of the display module, and further increase the reliability risk of the display module and the display device. Summary of the Invention
[0005] Aiming at the problems in the prior art, the purpose of the present disclosure is to provide a display module, a preparation method thereof, and a display device, which can minimize the border width as much as possible while ensuring the manufacturing yield and use stability of the display module, overcoming the problems proposed in the prior art.
[0006] Specifically, a first aspect of the present disclosure provides a display module, which includes a printed circuit board, a support layer, and a display panel stacked in sequence, wherein:
[0007] The first end of the display panel extends beyond the edge area of the support layer; and
[0008] A signal transmission site is arranged on the surface of the first end of the display panel close to the printed circuit board, and the signal transmission site is electrically connected to the printed circuit board through a film flip chip packaging structure.
[0009] In a possible implementation of the above first aspect, the film flip-chip packaging structure includes a support plate layer, an insulating film layer, a buffer layer, a via layer, and a signal transmission layer stacked in sequence, where:
[0010] The film flip-chip packaging structure includes a plurality of via groove structures penetrating through the buffer layer and the via layer, and the signal transmission layer completely fills the via groove structures.
[0011] In a possible implementation of the above first aspect, a side of the signal transmission layer away from the via layer is sequentially covered with an inorganic film layer and an organic film layer.
[0012] In a possible implementation of the above first aspect, the insulating film layer at the corresponding positions of the support plate layer and the via groove structures is removed so that the signal transmission layer filling the via groove structures is exposed;
[0013] The exposed portions of the signal transmission layer are respectively bonded to the signal transmission sites and the printed circuit board to achieve electrical connection between the display panel and the printed circuit board.
[0014] In a possible implementation of the above first aspect, a polarizer layer and a glass cover plate layer are sequentially stacked on a side of the display panel away from the printed circuit board;
[0015] An optical adhesive layer is provided between the polarizer layer and the glass cover plate layer.
[0016] The second aspect of the present disclosure provides a method for manufacturing a display module, specifically including the following steps:
[0017] A printed circuit board, a support layer, and a display panel are sequentially stacked, wherein a first end of the display panel extends beyond an edge area of the support layer, and a signal transmission site is provided on a side of the first end of the display panel close to the printed circuit board;
[0018] The signal transmission site and the printed circuit board are electrically connected through the film flip-chip packaging structure.
[0019] In a possible implementation of the above second aspect, the film flip-chip packaging structure is prepared by the following steps:
[0020] Provide a stacked structure, which includes a support plate layer and an insulating film layer stacked in sequence;
[0021] Slot the preset positions of the stacked structure to form a plurality of slotting structures;
[0022] Cover a buffer layer and a via layer on the slotted stacked structure in sequence;
[0023] Clear the buffer layer and the via layer at the corresponding positions of the slotting structure to generate a plurality of via groove structures;
[0024] Use a signal transmission layer to completely fill the hole and groove structure.
[0025] In a possible implementation of the second aspect described above, the preparation of the film flip-chip package structure further includes the following steps:
[0026] An inorganic film layer and an organic film layer are sequentially covered on the side of the signal transmission layer away from the connection hole layer.
[0027] In a possible implementation of the second aspect described above, in the process of electrically connecting the signal transmission site and the printed circuit board through the film flip-chip package structure, the following steps are included:
[0028] Separate the support board layer and the insulating film layer through a laser lift-off process;
[0029] Remove the insulating film layer at the corresponding position of the hole and groove structure so that the signal transmission layer filling the hole and groove structure is exposed;
[0030] Bond the exposed parts of the signal transmission layer to the signal transmission site and the printed circuit board respectively to achieve electrical connection between the display panel and the printed circuit board.
[0031] The third aspect of the present disclosure provides a display device, including the display module provided in the first aspect described above.
[0032] Compared with the prior art, the present disclosure has the following beneficial effects:
[0033] Through the technical solution provided by the present disclosure, a film flip-chip package structure is provided. This film flip-chip package structure is bonded to the back of the part of the display panel that exceeds the support layer to achieve back-wiring electrical connection between the display panel and the printed circuit board. On the one hand, it can effectively reduce the border width of the display device corresponding to the display module and achieve a higher screen-to-body ratio. On the other hand, since there is no need to perform a folding operation, it can further improve the process yield of the display module and at the same time reduce the manufacturing cost of the display module, having promotional value. Description of the Drawings
[0034] By reading the detailed description of the non-limiting embodiments with reference to the following drawings, other features, purposes, and advantages of the present disclosure will become more obvious.
[0035] Figure 1 According to the prior art, a schematic cross-sectional structure diagram of a display module is provided.
[0036] Figure 2 According to an embodiment of the present disclosure, a schematic cross-sectional structure diagram of a display module is provided.
[0037] Figure 3 According to an embodiment of the present disclosure, a schematic cross-sectional structure diagram of a film flip-chip package structure is provided.
[0038] Figure 4 According to an embodiment of the present disclosure, there is provided a schematic flow chart of a method for manufacturing a display module.
[0039] Figure 5 According to an embodiment of the present disclosure, there is provided a schematic flow chart of a method for manufacturing a film flip chip package structure.
[0040] Figure 6 According to an embodiment of the present disclosure, there is provided a schematic flow chart of electrically connecting a signal transmission site and a printed circuit board through a film flip chip package structure. Detailed implementation manners
[0041] The following uses specific specific examples to illustrate the implementation manners of the present application. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in the present application. The present application can also be implemented or applied through other different specific implementation manners. Various details in the present application can also be modified or changed according to different viewpoints and application systems without departing from the spirit of the present application. It should be noted that, without conflict, the embodiments and features in the embodiments of the present application can be combined with each other.
[0042] The following takes the accompanying drawings as a reference and details the embodiments of the present application so that those skilled in the technical field to which the present application belongs can easily implement it. The present application can be embodied in many different forms and is not limited to the embodiments described herein.
[0043] In the description of the present application, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. mean that the specific features, structures, materials, or characteristics represented in connection with the embodiment or example are included in at least one embodiment or example of the present application. Moreover, the specific features, structures, materials, or characteristics represented can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples represented in the present application and the features of the different embodiments or examples.
[0044] In addition, the terms "first" and "second" are only used for the purpose of indication and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" can explicitly or implicitly include at least one of the features. In the description of the present application, "a plurality" means two or more unless otherwise specifically defined.
[0045] In order to clearly illustrate the present application, devices irrelevant to the description are omitted, and the same or similar constituent elements throughout the specification are given the same reference signs.
[0046] Throughout the specification, when it is said that a device is "connected" to another device, this includes not only the case of "direct connection", but also the case of "indirect connection" with other elements interposed therebetween. In addition, when it is said that a certain device "includes" a certain constituent element, unless there is a particularly contrary record, it does not exclude other constituent elements, but means that other constituent elements may also be included.
[0047] When it is said that a device is "above" another device, this may be directly above the other device, but there may also be other devices therebetween. When it is said contrastively that a device is "directly" "above" another device, there are no other devices therebetween.
[0048] Although in some instances the terms first, second, etc. are used herein to denote various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, the first interface and the second interface, etc. are indicated. Furthermore, as used herein, the singular forms "a", "an", and "the" are intended to also include the plural forms unless the context clearly dictates otherwise. It should be further understood that the terms "comprising", "including" indicate the presence of the features, steps, operations, elements, components, items, kinds, and / or groups, but do not preclude the presence, occurrence, or addition of one or more other features, steps, operations, elements, components, items, kinds, and / or groups. The terms "or" and "and / or" used herein are to be construed as inclusive, or meaning any one or any combination. Thus, "A, B, or C" or "A, B, and / or C" means "any of the following: A; B; C; A and B; A and C; B and C; A, B, and C". An exception to this definition only occurs when the combination of elements, functions, steps, or operations are mutually exclusive in some way.
[0049] The technical terms used herein are only for referring to specific embodiments and are not intended to limit the present application. The singular forms used herein also include the plural forms as long as the statements do not clearly indicate the contrary meaning. The meaning of "including" used in the specification is to embody specific characteristics, regions, integers, steps, operations, elements, and / or components, and does not exclude the existence or addition of other characteristics, regions, integers, steps, operations, elements, and / or components.
[0050] Although not defined differently, including technical terms and scientific terms used herein, all terms have the same meaning as generally understood by those skilled in the technical field to which this application belongs. Terms defined in commonly used dictionaries are additionally interpreted as having meanings consistent with relevant technical literature and the content presented herein. As long as they are not defined, they should not be over-interpreted as ideal or overly formulaic meanings.
[0051] It can be understood that, as described in the aforementioned prior art, although the use of the folding-back setting structure can reduce the frame width of the display module, however, in Figure 1 the shown display module structure, the length a of the part exceeding the visible area after folding back, that is, the frame width, is about 1800um to 1900um and cannot be further reduced; and during the folding-back process, the display panel 100 and the encapsulation structure 101 need to be bent, and there is a risk of the encapsulation structure falling off and the metal traces cracking due to stress, which affects the manufacturing yield of the display module. To overcome the above defects, the present disclosure provides a display module, a manufacturing method thereof, and a display device, which can further reduce the frame width of the display device corresponding to the display module, achieve a higher screen-to-body ratio, and at the same time optimize the manufacturing process of the display module. The technical solutions involved in the present disclosure will be specifically explained and described below:
[0052] Specifically, in some embodiments of the present disclosure, Figure 2 shows a schematic cross-sectional structure diagram of a display module. As Figure 2 shown, this display module includes a printed circuit board 201, a support layer 202, and a display panel 203 stacked in sequence, where:
[0053] The first end 203a of the display panel 203 extends beyond the edge area of the support layer 202; and on the side of the first end 203a of the display panel 203 close to the printed circuit board 201, there is a signal transmission site 203b, and the signal transmission site 203b is electrically connected to the printed circuit board 201 through a film flip-chip encapsulation structure 204.
[0054] In the above embodiment, specifically, the support layer 202 may include a stacked adhesive layer 202a and a support film 202b, where the adhesive layer 202a is used to fixedly connect the printed circuit board 201, and the support film 202b is used to support the display panel 203 and other film layers disposed thereon. The lengths of the adhesive layer 202a and the support film 202b in the illustration are only for illustration, and during the actual installation process, adjustments need to be made according to the middle frame structure of the entire display device, which has little impact on the avoidance design of the flip-chip thin film encapsulation structure 204.
[0055] In the above embodiments, specifically, a polarizer layer 205 and a glass cover plate layer 206 are sequentially stacked on the side of the display panel 203 away from the printed circuit board 201. An optical adhesive layer 207 is provided between the polarizer layer 205 and the glass cover plate layer 206. The setting of the above structure module can realize the function of the display module. Those skilled in the art can select the required film layer structure according to actual needs, and no limitation is made here.
[0056] Control Figure 1 As can be seen from the shown display module structure and the display module structure described in the present disclosure ( Figure 2 ), in the prior art, the length a of the portion exceeding the visible area after folding back is about 1800um to 1900um, while in the technical solution provided by the present disclosure, the total length b of the portion of the display panel 203 exceeding the visible area is about 1700um to 1800um, and the border width is reduced compared with the display module prepared by the prior art.
[0057] In the above embodiments, specifically, Figure 3 shows a schematic cross-sectional structure diagram of a flip-chip thin film encapsulation structure 204. As Figure 3 shown, the flip-chip thin film encapsulation structure 204 includes a support plate layer 204a, an insulating thin film layer 204b, a buffer layer 204c, a via hole layer 204d, and a signal transmission layer 204e stacked in sequence. The support plate layer 204a can be selected as a glass support plate structure, and the insulating film layer 204b can be selected as a polyimide thin film, and no limitation is made here.
[0058] In the above embodiments, as Figure 3 shown, the flip-chip thin film encapsulation structure 204 includes a plurality of hole groove structures penetrating through the buffer layer 204c and the via hole layer 204d, and the signal transmission layer 204e completely fills the hole groove structures.
[0059] In the above embodiments, as Figure 3 shown, a inorganic film layer 204f and an organic film layer 204g are sequentially covered on the side of the signal transmission layer 204e away from the via hole layer 204d. Through the combined coverage of the inorganic film layer 204f and the organic film layer 204g, it is possible to prevent water oxygen from contacting the signal transmission layer 204e.
[0060] In the above embodiment, further, in the process of bonding the chip-on-film packaging structure 204 to the display panel 203 and the printed circuit board 201, it is necessary to expose the signal transmission layer 204e and bond the exposed portion to the signal transmission site 203b and the printed circuit board 201 respectively. Specifically, the signal transmission layer 204e filling the hole structure can be exposed by removing the supporting plate layer 204a and the insulating film layer 204b at the corresponding position of the hole structure; and then the exposed portion of the signal transmission layer 204e is bonded to the signal transmission site 203b and the exposed copper portion of the printed circuit board 201 respectively to achieve electrical connection between the display panel and the printed circuit board. Figure 3 In the cross-sectional view shown, the width of the exposed portion is in the range of 10um to 25um, and the width of the unexposed portion between the two exposed portions is in the range of 8um to 15um. This is set according to the corresponding design specifications. The exposed portion is the bonding area of the flip chip film packaging structure, and its contact area is converted according to the minimum contact area specified by different manufacturers.
[0061] In some embodiments of the present disclosure, Figure 4 A schematic diagram of a method for preparing a display module is shown to achieve the following Figure 2 The display module structure shown is prepared. Figure 5 As shown, the method for preparing the display module may specifically include the following steps:
[0062] Step 401: A printed circuit board, a support layer and a display panel are stacked in sequence, wherein a first end of the display panel extends beyond an edge region of the support layer, and a signal transmission site is disposed on a side of the first end of the display panel close to the printed circuit board.
[0063] Step 402: electrically connecting the signal transmission station and the printed circuit board through a chip-on-film packaging structure.
[0064] In the above embodiment, further, Figure 5 A schematic diagram of a method for preparing a thin film chip packaging structure is shown to achieve the following Figure 3 The preparation of the flip chip film structure shown in FIG. Figure 5 As shown, the following steps may be included:
[0065] Step 501: providing a stacked structure, wherein the stacked structure comprises a support plate layer and an insulating film layer stacked in sequence.
[0066] Step 502: groove the preset positions of the stacked structure to form a plurality of grooved structures, wherein the thickness of the insulating film layer before grooved can be set to 20 um, and the distance from the bottom of the grooved structure to the bottom of the insulating film layer after grooved can be in the range of 0.1 um to 3 um.
[0067] Step 503: Sequentially cover a buffer layer and a via layer on the slotted stacked structure.
[0068] Step 504: Clear the buffer layer and the via layer at corresponding positions of the slotted structure to generate a plurality of via slot structures. Among them, clearing the buffer layer and the via layer is to fill the signal transmission layer, thereby realizing the backtrace of the signal transmission layer.
[0069] Step 505: Completely fill the via slot structures with a signal transmission layer.
[0070] In the above embodiments, further, as Figure 5 shown, the following steps may further be included in the preparation process of the film flip chip package structure:
[0071] Step 506: Sequentially cover an inorganic film layer and an organic film layer on the side of the signal transmission layer away from the via layer. The inorganic film layer and the organic film layer are used to block the contact between water oxygen and the signal transmission layer.
[0072] In the above embodiments, further, in the foregoing step 402, Figure 6 shows a schematic flow chart of electrically connecting a signal transmission site and a printed circuit board through a film flip chip package structure. As Figure 6 shown, the following steps may specifically be included:
[0073] Step 601: Separate the support plate layer and the insulating film layer through a laser lift-off process. Specifically, in the laser lift-off process (LLO), the chemical bonds of the insulating film layer are broken by the thermal energy released at high temperature to achieve the separation effect; the delamination process (De-lami) further separates the support plate layer from the insulating film layer.
[0074] Step 602: Remove the insulating film layer at the corresponding position of the via slot structure so that the signal transmission layer filling the via slot structure is exposed. It can be understood that, referring to the film flip chip package structure as Figure 3 shown, the bottom of the signal transmission layer 204e is only 0.1 um to 3 um away from the bottom of the insulating film layer 204b. Removing the above part of the insulating film layer 204b can expose the signal transmission layer 204e.
[0075] Step 603: Bond the exposed parts of the signal transmission layer to the signal transmission site and the printed circuit board respectively to realize the electrical connection between the display panel and the printed circuit board.
[0076] It can be understood that through the above steps 601 to 603, the electrical connection between the film flip chip package structure, the display panel, and the printed circuit board can be achieved, thereby realizing the electrical connection and signal transmission between the printed circuit board and the display panel. From the explanation of the above preparation method, it can be understood that the preparation of the display module by the technical solution provided by the present disclosure does not require a folding operation. On the one hand, it can improve the process yield, and on the other hand, it can reduce the cost of the module manufacturing process, which has the value of being popularized.
[0077] In some embodiments of the present disclosure, a display device is further provided. The display device is equipped with the display module provided in the foregoing embodiments, which will not be elaborated here.
[0078] In summary, through the technical solution provided by the present disclosure, a film flip chip package structure is provided. This film flip chip package structure is bonded to the back of the display panel beyond the support layer to achieve back-wiring electrical connection between the display panel and the printed circuit board. On the one hand, it can effectively reduce the border width of the display device corresponding to the display module and achieve a higher screen-to-body ratio. On the other hand, since there is no need to perform a folding operation, it can further improve the process yield of the display module and at the same time reduce the manufacturing cost of the display module, which has the value of being popularized.
[0079] The above content is a further detailed description of the present disclosure in combination with specific preferred embodiments. It cannot be determined that the specific implementation of the present disclosure is only limited to these descriptions. For those of ordinary skill in the technical field to which the present disclosure belongs, without departing from the concept of the present disclosure, several simple deductions or substitutions can still be made, which should all be regarded as belonging to the protection scope of the present disclosure.
Claims
1. A display module, characterized in that, It includes a printed circuit board, a support layer, and a display panel stacked in sequence, where: The first end of the display panel extends beyond the edge area of the support layer; and A signal transmission site is provided on the side of the first end of the display panel close to the printed circuit board, and the signal transmission site is electrically connected to the printed circuit board through a film flip chip packaging structure.
2. The display module according to claim 1, wherein, The film flip chip packaging structure includes a support plate layer, an insulating film layer, a buffer layer, a via layer, and a signal transmission layer stacked in sequence, where: The film flip chip packaging structure includes a plurality of via structures penetrating through the buffer layer and the via layer, and the signal transmission layer completely fills the via structures.
3. The display module according to claim 2, wherein A inorganic film layer and an organic film layer are sequentially covered on the side of the signal transmission layer away from the via layer.
4. The display module according to claim 2, wherein By removing the insulating film layer at the corresponding positions of the support plate layer and the via structures, the signal transmission layer filling the via structures is exposed; The exposed portions of the signal transmission layer are respectively bonded to the signal transmission site and the printed circuit board to achieve electrical connection between the display panel and the printed circuit board.
5. The display module according to claim 1, characterized in that, A polarizer layer and a glass cover plate layer are sequentially stacked on the side of the display panel away from the printed circuit board; An optical adhesive layer is provided between the polarizer layer and the glass cover plate layer.
6. A method for preparing a display module, characterized in that, It includes the following steps: Stack a printed circuit board, a support layer, and a display panel in sequence, where the first end of the display panel extends beyond the edge area of the support layer, and a signal transmission site is provided on the side of the first end of the display panel close to the printed circuit board; Electrically connect the signal transmission site and the printed circuit board through a film flip chip packaging structure.
7. The manufacturing method of the display module according to claim 6, characterized in that, The film flip chip packaging structure is prepared by the following steps: Provide a stacked structure, which includes a support plate layer and an insulating film layer stacked in sequence; Perform grooving on the preset positions of the stacked structure to form a plurality of grooving structures; Cover a buffer layer and a via layer on the grooved stacked structure in sequence; Clear the buffer layer and the via layer at the corresponding positions of the grooving structures to generate a plurality of via structures; Use a signal transmission layer to completely fill the via structures.
8. The manufacturing method of the display module according to claim 7, wherein, The preparation of the film flip chip packaging structure further includes the following steps: Cover an inorganic film layer and an organic film layer on the side of the signal transmission layer away from the via layer in sequence.
9. The manufacturing method of the display module according to claim 7, wherein, During the process of electrically connecting the signal transmission site and the printed circuit board through a film flip chip packaging structure, it includes the following steps: Separate the support plate layer and the insulating film layer through a laser lift-off process; Remove the insulating film layer at the corresponding positions of the via structures to expose the signal transmission layer filling the via structures; Bond the exposed portions of the signal transmission layer to the signal transmission site and the printed circuit board respectively to achieve electrical connection between the display panel and the printed circuit board.
10. A display device, characterized in that, It includes the display module according to any one of claims 1 to 5.