Grounding protection device

Abstract

The embodiment of the invention provides a grounding protection device, which is used for a superconducting electric maglev train stator motor module, and comprises a socket flange insert located at the bottom of a module shell and connected with a grounding device; and the semiconductor shielding coating coats the outer surface of the module shell and extends to the surface of the socket flange insert so as to be grounded through the socket flange insert. The semiconductor shielding coating of the motor module is grounded through the socket flange insert, so that grounding of the surface of the motor module is realized; the semiconductor layer and the conductor layer are arranged to form an internal grounding structure of the motor module, and the semiconductor layer is arranged on the side close to the high-voltage propulsion coil assembly, so that an electric field is better homogenized, electric field distortion on the high-voltage side is reduced, and the overall partial discharge capacity is reduced; the interior of the motor and the surface of the motor module are grounded through the grounding protection device.

Description

Technical Field

[0001] This application relates to the technical field of high-speed maglev transportation, and specifically, to a grounding protection device. Background Art

[0002] The superconducting electro-magnetic suspension maglev train adopts a hollow stator motor structure. Different from the long stator maglev train of the conventional electromagnetic system, it is impossible to connect the modular cable for the long stator to the stator iron core for grounding. Instead, each independent stator motor needs to be grounded separately.

[0003] The currently adopted topological structure of the stator motor modules is independent of each other. At the same time, the modules between the same phases are electrically connected through series-connected cables. Therefore, it is necessary to consider the grounding of each module and the integrity of grounding, that is, the common grounding of each module and the corresponding series-connected cables. There is currently no grounding method for this kind of stator module. Summary of the Invention

[0004] An embodiment of this application provides a grounding protection device to solve the problem that the existing stator motor modules cannot use the modular cable of the long stator to be connected to the stator iron core for grounding, and each module needs to be grounded separately.

[0005] To achieve the above purpose, this application provides the following technical solutions:

[0006] A grounding protection device for a stator motor module of a superconducting electro-magnetic suspension maglev train, comprising:

[0007] A socket flange insert, located at the bottom of the module housing and connected to the grounding device;

[0008] A semiconductor shielding coating, covering the outer surface of the module housing and extending to the surface of the socket flange insert for grounding through the socket flange insert.

[0009] Optionally, it further includes an inner shielding plate, located between the high-voltage propulsion coil assembly and the low-voltage suspension coil assembly of the stator motor module;

[0010] The inner shielding plate includes an insulating layer, a conductor layer, and a semiconductor layer arranged in sequence. The semiconductor layer is arranged on the side facing the high-voltage propulsion coil assembly, and the conductor layer is connected to the socket flange insert.

[0011] Optionally, it further includes:

[0012] A grounding connection wire, one end of which is electrically connected to the conductor layer, and the other end is electrically connected to the socket flange insert.

[0013] Optionally, the socket flange insert has a grounding interface;

[0014] The grounding device includes a grounding wire and a grounding stake. One end of the grounding wire is connected to the grounding interface, and the other end is connected to the grounding stake.

[0015] Optionally, the semiconductor layer and the conductor layer are bonded by resin.

[0016] Optionally, the insulating layer is a mica insulating layer or a resin insulating layer.

[0017] This application provides a superconducting electro-magnetic levitation stator motor module, including:

[0018] The grounding protection device according to any one of the above embodiments;

[0019] A module housing, the outer surface of which is coated with a semiconductor shielding coating of the grounding protection device, and the socket flange insert of the grounding protection device is located at the bottom of the module housing.

[0020] Optionally, it further includes:

[0021] A high-voltage propulsion coil assembly and a low-voltage suspension coil assembly, which are respectively located inside the module housing, and the inner shielding plate of the grounding protection device is located between the high-voltage propulsion coil assembly and the low-voltage suspension coil assembly.

[0022] Optionally, the module housing is a resin housing.

[0023] Optionally, it further includes:

[0024] A weather-resistant paint layer, which is located outside the semiconductor shielding coating and is used to insulate the semiconductor shielding coating.

[0025] A grounding protection device provided by an embodiment of this application, which is used for a superconducting electro-magnetic levitation train stator motor module, including: a socket flange insert, which is located at the bottom of the module housing and is connected to the grounding device; a semiconductor shielding coating, which is coated on the outer surface of the module housing and extends to the surface of the socket flange insert to be grounded through the socket flange insert.

[0026] Adopting a grounding protection device provided by an embodiment of this application, compared with the prior art, has the following technical effects:

[0027] A socket flange insert is provided at the bottom of the module housing, which is connected to the grounding device; at the same time, a semiconductor shielding coating is coated on the outer surface of the module housing, which extends to the surface of the socket flange insert, so that the semiconductor shielding coating of the motor module is grounded through the socket flange insert, realizing the grounding of the surface of the motor module;

[0028] Secondly, the integrated stator motor module is grounded by setting an inner shielding plate. An internal grounding structure of the motor module is formed by setting a semiconductor layer and a conductor layer, and the semiconductor layer is set on the side close to the high-voltage propulsion coil assembly to better uniform the electric field, reduce the electric field distortion on the high-voltage side, and thus reduce the overall partial discharge amount. In summary, the internal part of the electrode and the surface of the motor module are respectively grounded through the above-mentioned grounding protection device. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The drawings described herein are used to provide a further understanding of the present application and form a part of the present application. The schematic embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation to the present application. In the drawings:

[0030] Figure 1 is a schematic installation structure diagram of a grounding protection device provided by an embodiment of the present application applied to a superconducting electromagnetic levitation stator motor module;

[0031] Figure 2 is a schematic structure diagram of the inner shielding plate provided by an embodiment of the present application.

[0032] The reference numerals in the drawings are as follows:

[0033] 1, low-voltage levitation coil assembly; 2, high-voltage propulsion coil assembly; 3, module housing; 4, socket flange insert; 5, inner shielding plate; 6, grounding connection wire; 7, ground wire. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0034] The embodiment of the present invention discloses a grounding protection device to solve the problem that the existing stator motor module cannot be grounded by connecting the module cable of the long stator to the stator core, and each module needs to be grounded separately.

[0035] In order to make the technical solutions and advantages in the embodiments of the present application clearer, the following further describes the exemplary embodiments of the present application in detail with reference to the drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than an exhaustive list of all embodiments. It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.

[0036] Please refer to Figure 1-2 , Figure 1 is a schematic installation structure diagram of a grounding protection device provided by an embodiment of the present application applied to a superconducting electromagnetic levitation stator motor module; Figure 2 is a schematic structure diagram of the inner shielding plate provided by an embodiment of the present application.

[0037] In a specific embodiment, the grounding protection device provided by the present application can be used for the stator motor module of a superconducting electromagnetic levitation train. Generally, the stator motor module includes structures such as propulsion coils and a module housing 3. The propulsion coils are connected to external cables. The socket flange insert 4 is integrally cast with the propulsion coils on the module housing 3, and the module housing 3 is set as a resin housing. The grounding protection device includes the socket flange insert 4 and a semiconductor shielding coating. The socket flange insert 4 is located at the bottom of the module housing 3 and is connected to the grounding device, specifically arranged towards the rotor side. The semiconductor shielding coating covers the outer surface of the module housing 3 and extends to the surface of the socket flange insert 4, so that the electrons of the module housing 3 flow into the grounding device through the semiconductor shielding coating and the socket flange insert 4, completing the grounding of the outer surface of the module housing 3. The above grounding protection device can be used as the grounding protection device for a split module, that is, the high-voltage propulsion coil assembly 2 and the low-voltage suspension coil assembly 1 of the stator module are respectively made into two independent high-voltage propulsion modules and low-voltage suspension modules for use.

[0038] Spray semiconductive paint on the outer surface of the resin housing to form a semiconductor shielding coating. The surface resistivity of the sprayed semiconductor shielding coating should be less than 1000 Ω·m, and the spraying area should cover the entire surface. Pay special attention to covering the surface of the socket flange insert 4 with the semiconductive paint. With this setting, the internal grounding structure of the motor module is connected to the semiconductor shielding coating on the motor surface, and finally connected to the grounding stake through the grounding interface of the socket flange insert 4.

[0039] In some other embodiments, when the stator motor module is an integrated module, that is, when the high-voltage propulsion coil and the low-voltage zero-flux coil are cast and solidified into one module, since there are high- and low-voltage suspension coil components 1 inside the stator module, grounding is required between the high- and low-voltage suspension coil components 1. Specifically, an inner shielding plate 5 is provided between the high-voltage propulsion coil component 2 and the low-voltage suspension coil component 1. The inner shielding plate 5 includes an insulating layer, a conductor layer, and a semiconductor layer arranged in sequence. The conductor layer is connected to the socket flange insert 4, and the semiconductor layer is close to the high-voltage propulsion coil side to uniform the electric field, reduce the electric field distortion on the high-voltage side, and thus reduce the overall partial discharge amount. The conductor layer is electrically connected to the socket flange insert 4 to realize the internal shielding structure of the propulsion coil, ensuring that the potential from the outside of the conductor layer to the surface of the rotor module is 0. Specifically, a grounding connection wire 6 is provided between the conductor layer and the socket flange insert 4. One end of it is electrically connected to the conductor layer, and the other end is electrically connected to the socket flange insert 4. The grounding connection wire 6 is welded to the conductor layer, and the other end is connected to the socket flange insert 4 and grounded through the grounding interface of the socket flange insert 4.

[0040] Adopting a grounding protection device provided in the embodiments of the present application has the following technical effects compared with the prior art:

[0041] A socket flange insert is provided at the bottom of the module housing and is connected to the grounding device. At the same time, a semiconductor shielding coating is wrapped on the outer surface of the module housing and extends to the surface of the socket flange insert, so that the semiconductor shielding coating of the motor module is grounded through the socket flange insert to achieve grounding of the surface of the motor module.

[0042] Secondly, the integrated stator motor module is grounded by setting an inner shielding plate. An internal grounding structure of the motor module is formed by setting a semiconductor layer and a conductor layer, and the semiconductor layer is set on the side close to the high-voltage propulsion coil assembly to better uniform the electric field, reduce the electric field distortion on the high-voltage side, and thus reduce the overall partial discharge amount. In summary, the above grounding protection device realizes grounding for the inside of the electrode and the surface of the motor module respectively.

[0043] Specifically, a grounding interface is provided on the socket flange insert 4. The grounding device includes a grounding wire 7 and a grounding stake. One end of the grounding wire 7 is connected to the grounding interface, and the other end is connected to the grounding stake to complete the grounding setting of the socket flange insert 4.

[0044] Optionally, for the connection between the semiconductor layer and the conductor layer, bonding can be achieved by setting conductive resin. In other embodiments, the connection and fixation between the semiconductor layer and the conductor layer can be set as required, which will not be elaborated here. For the setting of the insulating layer, the conductor layer and the semiconductor layer, the insulating layer can be set as a resin insulating layer, and heating curing or vacuum pressure impregnation curing methods can be used to achieve it.

[0045] Based on the grounding protection device provided in the above embodiments, the present application also provides a superconducting electro-magnetic levitation stator motor module, including a module housing 3, with a semiconductor shielding coating of the grounding protection device wrapped on the outer surface, and the socket flange insert 4 of the grounding protection device is located at the bottom of the module housing 3. Since the superconducting electro-magnetic levitation stator motor module adopts the grounding protection device in the above embodiments, the beneficial effects of the superconducting electro-magnetic levitation stator motor module can refer to the above embodiments.

[0046] Specifically, the above superconducting electro-magnetic levitation stator motor module further includes a high-voltage propulsion coil assembly 2 and a low-voltage suspension coil assembly 1, which are respectively located inside the module housing 3. The high-voltage propulsion coil assembly 2 and the low-voltage suspension coil assembly 1 are cast and cured into a module. The high- and low-voltage systems are separated by an inner shielding plate 5 to achieve decoupling and protect the low-voltage system, and the grounding protection of the high-voltage side is completed.

[0047] An insulating weather-resistant paint layer is sprayed on the outside of the semiconductor shielding coating to insulate it and at the same time protect the shielding coating from the influence of the climate.

[0048] In one embodiment, the above stator motor module is a split motor module, specifically a high-voltage propulsion module and a low-voltage suspension module; when the split motor module is a high-voltage propulsion module, only a high-voltage propulsion coil assembly 2 is provided inside the stator module, and a semiconductor shielding coating is provided outside the module housing 3 for grounding. The specific method is to spray the semiconductor shielding coating on the outer surface of the epoxy resin module after casting and molding. The spraying method is to cover the entire surface and extend to the surface of the socket flange insert 4, so that the semiconductor shielding coating on the surface of the motor module is connected to the grounding pile through the grounding interface of the socket flange insert 4, and a weather-resistant paint layer is sprayed on the outer surface of the semiconductor shielding coating.

[0049] Since the low-voltage suspension module is internally cast and cured with a zero-flux coil, its maximum voltage is 1500 volts, and since the hinge cable connecting the zero-flux coil has no grounding setting, this module is not grounded.

[0050] In summary, when a split-structured stator module is selected, only the outer surface of the high-voltage propulsion module needs to be sprayed with semiconductive paint for grounding.

[0051] In another embodiment, when the stator motor module is an integrated module, the high-voltage propulsion coil and the low-voltage zero-flux coil are cast and cured to form a module. An inner shielding plate 5 is placed between the high- and low-voltage suspension coil assemblies 1. The structure of the inner shielding plate 5 is a sandwich structure of "semiconductor + conductor + insulation", where the conductor and the semiconductor are grounded. The conductor layer is connected to the socket flange insert 4 through a grounding connection wire 6, and the semiconductor layer faces the high-voltage propulsion coil assembly 2; an internal grounding structure is formed by the semiconductor layer and the conductor layer. Similarly, a semiconductor shielding paint is sprayed outside the module housing 3, and it also covers to the surface of the socket flange insert 4, connecting the surface of the motor module to the grounding pile through the grounding interface of the socket flange insert 4; at the same time, the internal grounding structure of the motor module is connected to the socket flange insert 4 through the conductor layer and the grounding connection wire 6 to complete the grounding setting of the inside of the motor and the surface of the motor module. The grounding device is made of semiconductor material to effectively suppress the generation of surface circulating current and induced voltage.

[0052] The above integrated module realizes the electrical isolation of the high- and low-voltage systems and ensures the safety of the low-voltage system; at the same time, the entire module is grounded to ensure the safety of equipment and personnel; it reduces the partial discharge of the whole module and extends the service life of the motor module; in the service in a low-vacuum environment, it reduces the probability of surface discharge, protects the safety of other equipment, reduces the partial discharge amount, and extends the service life. The grounding structure integrating the inner shielding plate 5 and the outer surface simplifies the grounding of the entire motor module, and modularizes and independentizes the grounding of each motor.

[0053] Although the preferred embodiments of the present application have been described, additional changes and modifications can be made to these embodiments by those skilled in the art once they learn the basic creative concept. Therefore, the appended claims are intended to be construed to include the preferred embodiments as well as all changes and modifications falling within the scope of the present application.

[0054] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application is also intended to include these modifications and variations.

Claims

1. A ground protection device for a stator motor module of a superconducting electromagnetic levitation train, characterized in that Comprising: A socket flange insert, located at the bottom of the module housing and connected to the grounding device; A semiconductor shielding coating, covering the outer surface of the module housing and extending to the surface of the socket flange insert for grounding through the socket flange insert.

2. The grounding protection device according to claim 1, wherein It further includes an inner shielding plate, located between the high-voltage propulsion coil assembly and the low-voltage suspension coil assembly of the stator motor module; The inner shielding plate includes an insulating layer, a conductor layer, and a semiconductor layer arranged in sequence. The semiconductor layer is arranged on the side facing the high-voltage propulsion coil assembly, and the conductor layer is connected to the socket flange insert.

3. The grounding protection device according to claim 2, wherein It further includes: A grounding connection line, one end of which is electrically connected to the conductor layer and the other end is electrically connected to the socket flange insert.

4. The grounding protection device according to claim 1, wherein, The socket flange insert has a grounding interface; The grounding device includes a grounding wire and a grounding stake. One end of the grounding wire is connected to the grounding interface and the other end is connected to the grounding stake.

5. The grounding protection device according to claim 2, wherein The semiconductor layer and the conductor layer are adhesively bonded with resin.

6. The grounding protection device according to claim 2, wherein, The insulating layer is a mica insulating layer or a resin insulating layer.

7. A superconducting electric magnetic levitation stator motor module, characterized in that, Comprising: The grounding protection device according to any one of claims 1-6; A module housing, the outer surface of which is covered with the semiconductor shielding coating of the grounding protection device, and the socket flange insert of the grounding protection device is located at the bottom of the module housing.

8. The superconducting electro-magnetic levitation stator motor module according to claim 7, characterized in that, It further includes: A high-voltage propulsion coil assembly and a low-voltage suspension coil assembly, respectively located inside the module housing, and the inner shielding plate of the grounding protection device is located between the high-voltage propulsion coil assembly and the low-voltage suspension coil assembly.

9. The superconducting motor stator module according to claim 8, characterized in that, The module housing is a resin housing.

10. The superconducting electric magnetic levitation stator motor module according to claim 7, characterized in that, It further includes: A weather-resistant paint layer, located outside the semiconductor shielding coating for insulating the semiconductor shielding coating.

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