Control device and drive device

Abstract

The invention provides a control device and a drive device. A driving device according to one embodiment is a control device which is positioned on the upper side of a motor and controls the motor, and comprises: a power module; a first electronic component having any function of voltage regulation, current distribution, or capacitor; and a housing that houses the power module and the first electronic component. The housing includes: a housing portion having an opening portion opened at an upper side; and a cover part which covers the opening part. The housing part is provided with a flow path. The flow path has a cooling flow path portion that overlaps at least one of the power module and the first electronic component in the vertical direction.

Description

Technical Field

[0001] The present invention relates to a control device and a drive device. Background Art

[0002] In a control device for controlling a motor, a plurality of electronic components are provided as heat generating elements. A flow path for cooling the electronic components is provided in the control device (for example, Patent Document 1).

[0003] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2013-031330

[0004] The heat generation amounts of the plurality of electronic components are different from each other. Therefore, in the control device, if the electronic components are simply arranged along the flow path, not only does the control device become large-sized, but also the cooling efficiency for each electronic component cannot be sufficiently improved. Summary of the Invention

[0005] In view of the above circumstances, one object of the present invention is to provide a control device and a drive device that can suppress the increase in size while efficiently cooling electronic components.

[0006] A drive device according to one aspect of the present invention is a control device that is located above a motor and controls the motor, and includes: a power module; a first electronic component having any one of functions of voltage adjustment, current distribution, or capacitance; and a housing that houses the power module and the first electronic component. The housing has: a housing portion having an opening portion that opens upward; and a lid portion that covers the opening portion. A flow path is provided in the housing portion. The flow path has a cooling flow path portion that overlaps at least one of the power module or the first electronic component in the vertical direction.

[0007] A drive device according to one aspect of the present invention includes: the above-described control device; the motor; and a motor housing that houses the motor. The housing and the motor housing are interconnected.

[0008] According to one aspect of the present invention, one object is to provide a control device and a drive device that can suppress the increase in size while efficiently cooling electronic components. Brief Description of the Drawings

[0009] Figure 1 is a perspective view of the drive device according to the embodiment.

[0010] Figure 2 is a schematic cross-sectional view of the drive device according to the embodiment.

[0011] Figure 3 is a schematic cross-sectional view of the drive device according to Modification 1.

[0012] Figure 4It is a schematic cross-sectional view of the drive device of Modification 2.

[0013] Figure 5 It is a schematic cross-sectional view of the drive device of Modification 3.

[0014] Figure 6 It is a schematic cross-sectional view of the drive device of Modification 4.

[0015] Figure 7 It is a schematic cross-sectional view of the drive device of Modification 5.

[0016] Figure 8 It is a schematic cross-sectional view of the drive device of Modification 6.

[0017] Figure 9 It is a schematic cross-sectional view of the drive device of Modification 7.

[0018] Figure 10 It is a schematic cross-sectional view of the drive device of Modification 8.

[0019] Figure 11 It is a schematic cross-sectional view of the drive device of Modification 9.

[0020] Reference Numeral Explanation

[0021] 1, 101, 201, 301, 401, 501, 601, 701, 801, 901: Drive device; 2: Motor; 6A: Motor housing; 6C, 206C, 706C, 906C: Electronic component housing (housing); 7, 107, 207, 307, 407, 507, 607, 707, 807, 907: Control device; 11: Power module; 12: Power integration system (first electronic component); 13: Current distribution section (second electronic component); 14: Capacitor (second electronic component); 15, 115: Heating device; 15a, 115a: Heater section; 15b, 115b: Heater control section (control section); 61b, 761b: First bottom wall section (bottom); 61A, 261A, 761A, 961A: Housing section; 64: Third cover component (cover section); 65, 265, 965: Flow path component (wall section); 90, 190, 290, 490, 590, 690, 790, 990: Flow path; 90A, 90B, 190A, 190B, 290A, 490A, 490B, 590A, 590B, 690A, 690B, 790A, 790B, 990A, 990B: Cooling flow path section; 94: Third flow path section; D1: First direction; Z: Up and down direction. Detailed Implementation Manner

[0022] Hereinafter, the drive device of the embodiment will be described with reference to the drawings. In the following description, the direction of gravity is defined based on the positional relationship when the drive device is mounted on a vehicle located on a horizontal road surface. In addition, the XYZ coordinates are appropriately shown in each figure. The Z-axis is the vertical direction, the +Z side is the upper side, and the -Z side is the lower side. The Y-axis is the left-right direction of the vehicle on which the drive device is mounted. The X-axis is the front-rear direction of the vehicle on which the drive device is mounted.

[0023] In the following description, unless otherwise specified, the direction parallel to the first axis J1 of the motor 2 (Y-axis direction) is simply referred to as "axial direction Y", the radial direction centered on the first axis J1 is simply referred to as "radial direction", and the circumferential direction centered on the first axis J1, that is, the direction around the first axis J1 is simply referred to as "circumferential direction". And, in the following description, the direction parallel to the Z-axis is called the up-down direction Z.

[0024] In addition, in the following description, the direction parallel to the Z-axis is called the "up-down direction Z", and one direction perpendicular to the up-down direction Z is set as the first direction D1. In this specification, the first direction D1 is not only perpendicular to the up-down direction Z but also perpendicular to the axial direction Y, and is a direction parallel to the X-axis direction. However, the first direction D1 may also be a direction intersecting the X-axis direction, and may also be a direction parallel to the axial direction Y.

[0025] In the following description, one side of the first direction D1 refers to the direction (+D1) toward which the arrow of the first direction D1 in the figure points, and the other side of the first direction D1 refers to the direction opposite to the direction toward which the arrow of the first direction D1 in the figure points (-D1).

[0026] <Drive Device>

[0027] Figure 1 is a perspective view of the drive device 1 of the present embodiment. The drive device 1 of the present embodiment is mounted on a vehicle using a motor 2 as a power source, such as a hybrid electric vehicle (HEV), a plug-in hybrid electric vehicle (PHV), or an electric vehicle (EV), and is used as their power source.

[0028] The drive device 1 includes a motor 2, a transmission mechanism 3, and a control device 7. In addition, as described later, the motor 2 has a motor housing 6A, the transmission mechanism 3 has a gear housing 6B, and the control device 7 has an electronic component housing (housing) 6C. The motor housing 6A, the gear housing 6B, and the electronic component housing 6C are connected to each other to form a housing connection body 6. That is, the housing connection body 6 houses the motor 2, the transmission mechanism 3, and the control device 7.

[0029] The housing connection body 6 is formed by combining a plurality of components. The housing connection body 6 includes a housing main body 61, a first cover member 63, a second cover member 62, and a third cover member (cover portion) 64. A part of the housing main body 61 and the first cover member 63 form a motor housing 6A. A part of the housing main body 61 and the second cover member 62 form a gear housing 6B. A part of the housing main body 61 and the third cover member 64 form an electronic component housing 6C.

[0030] <Motor>

[0031] Figure 2 is a cross-sectional schematic view of the drive device 1 of the present embodiment.

[0032] The motor 2 of the present embodiment is, for example, an inner rotor type three-phase AC motor. The motor 2 has both a function of outputting power as a motor and a function of generating electricity as a generator. The motor 2 can also be used as either an engine or a generator. In addition, the structure of the motor 2 is not limited to the present embodiment, and for example, it can also be an AC motor with four or more phases.

[0033] The motor 2 includes a rotor 20, a stator 25, and a motor housing 6A. The rotor 20 can rotate about a first axis J1. The rotor 20 is rotatably supported by the motor housing 6A via a bearing (not shown). The stator 25 is located radially outside the rotor 20 and surrounds the rotor 20 from the radial outside. The stator 25 is fixed to the inner side surface of the motor housing 6A.

[0034] The motor housing 6A houses the rotor 20 and the stator 25. The motor housing 6A has: a cylindrical portion 6d, which is cylindrical with the first axis J1 as the center; and a first cover member 63, which covers the opening on the other axial side (-Y) of the cylindrical portion 6d. The cylindrical portion 6d surrounds the stator 25 from the radial outside. The cylindrical portion 6d is a part of the housing main body 61. Figure 1 The shown first cover member 63 is fastened to the cylindrical portion 6d.

[0035] <Transmission mechanism>

[0036] As Figure 1 shown, the transmission mechanism 3 is located on one axial side (+Y) of the motor 2. The transmission mechanism 3 is connected to the rotor 20. The transmission mechanism 3 includes a plurality of gears (not shown) that transmit the power of the rotor 20, a plurality of shafts, a differential device, a gear housing 6B that houses them, and an output shaft 55 that outputs the power of the rotor 20. The differential device transmits the same torque to a pair of output shafts 55 while absorbing the speed difference between the left and right wheels when the vehicle turns. The output shaft 55 can rotate about a second axis J3 parallel to the first axis J1. Wheels (not shown) are respectively provided on the pair of output shafts 55. In the present embodiment, the output shaft 55 is located on the other side (-D1) of the first direction with respect to the first axis J1.

[0037] <Control device>

[0038] The control device 7 controls the motor 2. The control device 7 has at least the function of an inverter. That is, the control device 7 is connected to the battery and converts the DC current supplied from the battery into an AC current. In addition, the control device 7 is connected to the stator 25 and supplies an AC current to the stator 25. The control device 7 is located above the motor 2 and at a position on the other side (-Y) in the axial direction than the transmission mechanism 3.

[0039] As Figure 2 shown, the control device 7 of the present embodiment has a power module 11, a power integration system (first electronic component) 12, a current distribution unit (second electronic component) 13, a capacitor (second electronic component) 14, a heating device 15, and an electronic component housing 6C. In addition, the electronic components provided in the control device 7 are not limited to the above. In addition, the control device 7 may also have electronic components other than the above electronic components.

[0040] The power module 11 has, for example, a switching element and a circuit board on which the switching element is mounted. The switching element is, for example, an insulated gate bipolar transistor (IGBT: Insulated Gate Bipolar Transistor). In addition, the switching element may also be a field effect transistor such as a metal oxide semiconductor field effect transistor (MOSFET; Metal-Oxide-Semiconductor Field-Effect Transistor).

[0041] The power integration system 12 has a function of voltage adjustment. The power integration system 12 of the present embodiment has, for example, an on-board charger (OBC; On Board Charger) 12a and a DC / DC converter 12b. The on-board charger 12a is a system for converting the AC voltage supplied via a plug into a DC voltage and charging the battery. The DC / DC converter 12b is a part for converting the voltage supplied from the battery and charging other batteries with a low voltage. In addition, the power integration system 12 only needs to have at least one of the DC / DC converter 12b or the on-board charger 12a. In addition, the DC / DC converter 12b may also boost the voltage supplied from the battery and supply it to other electronic components, etc.

[0042] The current distribution unit 13 is a power distribution unit (PDU: Power Distribution Unit) having a function of current distribution. The current distribution unit 13 is a part for distributing the current supplied from the battery to various electrical installations in the vehicle including the power module 11.

[0043] The capacitor 14 is, for example, a film capacitor. The capacitor 14 is connected between a battery (not shown) and the power module 11. The capacitor 14 is provided to smooth the DC current supplied to the power module 11.

[0044] The heating device 15 includes a heater unit 15a and a heater control unit (control unit) 15b. A pipe P is connected to the heater unit 15a. The pipe P is a circulation path through which a fluid such as water supply, refrigerant, or air circulates. An external device that is the heating target of the heater unit 15a is connected in the path of the pipe P. The external device that is the heating target of the heating device 15 is, for example, a battery. The heating device 15 heats the fluid in the pipe P in the heater unit 15a and heats the battery via the fluid. The heater control unit 15b is connected to a temperature sensor (not shown) that measures the temperature of the battery. The heater control unit 15b controls the heater unit 15a based on the temperature of the battery detected by the temperature sensor. Additionally, the heating device 15 can also be used as a heater in a heating equipment.

[0045] The electronic component housing 6C houses the power module 11, the power integration system 12, the current distribution unit 13, the capacitor 14, and the heater control unit 15b. The electronic component housing 6C includes a housing portion 61A and a third lid member 64.

[0046] The housing portion 61A has a first opening 61h that opens upward (+Z). The housing portion 61A includes a housing portion main body 66 and a flow path component (wall portion) 65. The housing portion main body 66 is a part of the housing main body 61. The housing portion main body 66 and the cylindrical portion 6d are parts of one component. Additionally, the housing portion main body 66 is located above the cylindrical portion 6d and is connected to the cylindrical portion 6d. That is, the housing portion 61A is connected to the motor housing 6A.

[0047] The main body 66 of the housing part has a first bottom wall part (bottom part) 61b, a first side wall part 61c, a first flange part 61f, and a plurality of support column parts 61u. That is, the housing part 61A has a first bottom wall part 61b, a first side wall part 61c, a first flange part 61f, and a plurality of support column parts 61u. The first bottom wall part 61b extends along a plane perpendicular to the vertical direction Z. The first bottom wall part 61b is located on the lower side (-Z) of the first opening 61h. The first bottom wall part 61b is integrally connected to the cylindrical part 6d. The first bottom wall part 61b has a common wall part 61n that also functions as a part of the cylindrical part 6d. In the present embodiment, the common wall part 61n is bent in a substantially arc shape centered on the first axis J1. The first bottom wall part 61b has a first inner side surface 61k facing upward (+Z). The first side wall part 61c extends upward (+Z) from the outer edge of the first bottom wall part 61b. The first flange part 61f is provided at the upper end of the first side wall part 61c. The first flange part 61f surrounds the first opening 61h in a frame shape. The first flange part 61f projects in a direction away from the first opening 61h along a plane perpendicular to the vertical direction Z. The support column part 61u extends upward (+Z) from the first inner side surface 61k of the first bottom wall part 61b. A flow path component 65 is mounted at the upper end of the support column part 61u. That is, the flow path component 65 is fixed to the first bottom wall part 61b.

[0048] The flow path component 65 is in a plate shape extending along a plane perpendicular to the vertical direction Z. The flow path component 65 is a so-called water jacket. The flow path component 65 is located between the first bottom wall part 61b and the second bottom wall part 64b in the vertical direction Z. That is, the flow path component 65 is located on the upper side of the first bottom wall part 61b. The flow path component 65 is opposed to the first inner side surface 61k with a gap in the vertical direction Z. In addition, the flow path component 65 is opposed to the second inner side surface 64k with a gap in the vertical direction Z. The flow path component 65 is located on the lower side of the third cover component 64 and on the upper side of the housing part main body 66.

[0049] The third cover component 64 is located on the upper side of the housing part 61A. The third cover component 64 is connected to the upper side (+Z) of the housing part 61A. The third cover component 64 has a second opening 64h opening downward (-Z). The third cover component 64 has a second bottom wall part 64b, a second side wall part 64c, and a second flange part 64f. The second bottom wall part 64b extends along a plane perpendicular to the vertical direction Z. The second bottom wall part 64b has a second inner side surface 64k facing downward (-Z) and an outer side surface 64g facing upward (+Z). The second side wall part 64c extends downward (-Z) from the outer edge of the second bottom wall part 64b. The second flange part 64f is provided at the lower end of the second side wall part 64c. The second flange part 64f surrounds the second opening 64h in a frame shape. The second flange part 64f projects in a direction away from the second opening 64h along a plane perpendicular to the vertical direction Z.

[0050] The first flange portion 61f and the second flange portion 64f are opposed to each other in the vertical direction Z. The first flange portion 61f and the second flange portion 64f are fastened to each other. Thereby, the housing portion 61A and the third cover member 64 are interconnected. In addition, the third cover member 64 covers the first opening portion 61h, and the housing portion 61A covers the second opening portion 64h. Thereby, the internal space of the housing portion 61A and the internal space of the third cover member 64 are connected to form the internal space A of the electronic component housing 6C. A sealing member may also be sandwiched between the first flange portion 61f and the second flange portion 64f.

[0051] The internal space A of the electronic component housing 6C is surrounded by the first bottom wall portion 61b, the second bottom wall portion 64b, the first side wall portion 61c, and the second side wall portion 64c. The first inner side surface 61k of the first bottom wall portion 61b and the second inner side surface 64k of the second bottom wall portion 64b are opposed to each other in the vertical direction Z. The power integration system 12, the current distribution portion 13, and the heater control portion 15b of the present embodiment are fixed to the second inner side surface 64k. In addition, the power module 11 and the capacitor 14 of the present embodiment are fixed to the upper surface 65a of the flow path member 65.

[0052] A flow path 90 is provided in the housing connector 6. The flow path 90 is a path through which a fluid flows. A part of the flow path 90 is constituted by a hole portion provided in the housing connector 6. In addition, another part of the flow path 90 is constituted by the inner side surface of a recess provided in the housing connector 6 and a member covering the recess. In the present specification, the flow path 90 does not necessarily represent a single circulation path and may include a plurality of circulation paths. When the flow path 90 has a plurality of circulation paths, the fluids flowing in the respective circulation paths may be the same type of fluid or different types of fluid. The fluid flowing in the flow path 90 is, for example, water, oil, or an ethylene glycol aqueous solution.

[0053] The flow path 90 of the present embodiment has a first flow path portion 91 and a third flow path portion 94. The first flow path portion 91 is provided in the electronic component housing 6C. The third flow path portion 94 is provided in the motor housing 6A. In the present embodiment, the first flow path portion 91 and the third flow path portion 94 constitute a single circulation path. Therefore, the same fluid flows in the first flow path portion 91 and the third flow path portion 94 of the present embodiment. In the present embodiment, the fluid flows through the respective portions of the flow path 90 in the order of the first flow path portion 91 and the third flow path portion 94. In addition, the downstream end portion of the third flow path portion 94 and the upstream end portion of the first flow path portion 91 are connected to each other via a flow path portion not shown in the figure. A pump for pumping the fluid, a radiator for cooling the fluid, etc. are provided in this flow path portion.

[0054] The first flow path portion 91 extends meanderingly inside the flow path component 65. That is, the first flow path portion 91 is provided in the housing portion 61A. The power integration system 12 and the capacitor 14 are in contact with the upper surface 65a of the flow path component 65. The first flow path portion 91 cools the power integration system 12 and the capacitor 14. According to the present embodiment, the power integration system 12 and the capacitor 14 can be effectively cooled using the plate-shaped flow path component 65.

[0055] In the present embodiment, the first flow path portion 91 provided in the housing portion 61A has a cooling flow path portion 90A. The cooling flow path portion 90A is a region in the first flow path portion 91 that overlaps at least one of the power module 11 or the power integration system 12 in the vertical direction Z. According to the present embodiment, since the cooling flow path portion 90A overlaps the power module 11 or the power integration system 12 in the vertical direction Z, the power module 11 or the power integration system 12 can be cooled. In the present embodiment, the cooling flow path portion 90A overlaps both the power module 11 and the power integration system 12. The cooling flow path portion 90A of the present embodiment is provided in the flow path component 65 to which the power module 11 is fixed. Therefore, the cooling flow path portion 90A can effectively cool the power module 11. The cooling flow path portion 90A of the present embodiment does not directly cool the power integration system 12. However, since the cooling flow path portion 90A overlaps the power integration system 12 in the vertical direction Z, by adopting a structure that easily transfers heat between the second bottom wall portion 64b and the power integration system 12, the power integration system 12 can be cooled. That is, since the cooling flow path portion 90A overlaps the power integration system 12 in the vertical direction Z, it is easy to cool the power integration system 12. As a structure that easily transfers heat, for example, a heat transfer material can be arranged in the gap in the vertical direction Z between the second bottom wall portion 64b and the power integration system 12.

[0056] The cooling flow path portion 90A is preferably located below at least one of the power module 11 or the power integration system 12. The cooling flow path portion 90A of the present embodiment is located below both the power module 11 and the power integration system 12. As described above, the cooling flow path portion 90A is provided in the housing portion 61A that covers the internal space A of the electronic component housing 6C from below. Therefore, by arranging the cooling flow path portion 90A below the power module 11 and the power integration system 12, the structure of the cooling flow path portion 90A can be simplified.

[0057] The third flow path portion 94 is provided in the cylindrical portion 6d. That is, the third flow path portion 94 is provided in the motor housing 6A. The third flow path portion 94 of the present embodiment extends helically along the axial direction Y with the first axis J1 as the center. The fluid flowing in the third flow path portion 94 is heated by the motor 2. That is, the third flow path portion 94 cools the motor 2.

[0058] The third flow path portion 94 only needs to cool the motor 2 and is not limited to this embodiment. The motor 2 may also extend in a meandering manner along the axial direction or the circumferential direction inside the wall of the cylindrical portion 6d. In addition, the third flow path portion 94 may also cool the motor 2 by directly applying a fluid to the motor 2. In this case, the third flow path portion 94 may also be a structure in which ejection holes for ejecting a fluid toward the motor 2 are provided on the inner wall of the motor housing 6A, a pipe or a groove-shaped member disposed in the internal space of the motor housing 6A and having ejection holes for ejecting a fluid toward the motor 2, and the like.

[0059] The third flow path portion 94 of the present embodiment overlaps with the portion of the flow path 90 provided in the housing portion 61A (the first flow path portion 91 in the present embodiment) in the vertical direction Z. According to the present embodiment, by providing the first flow path portion 91 directly above the third flow path portion 94, the first flow path portion 91 and the third flow path portion 94 can be arranged close to each other. Thereby, the flow path 90 is locally densely arranged, and heat transfer from components other than the cooling object to the fluid in the flow path 90 can be suppressed. In addition, by locally densely arranging the flow path 90, heat generated separately between the power module 11 as the cooling object and the motor is less likely to be transferred to each other. And, by overlapping the first flow path portion 91 and the third flow path portion 94 in the vertical direction Z, when the first flow path portion 91 and the third flow path portion 94 are connected, the overall length of the flow path 90 can be shortened.

[0060] The cylindrical portion 6d of the present embodiment has a common wall portion 61n that also functions as a part of the first bottom wall portion 61b. The third flow path portion 94 passes through the common wall portion 61n. Therefore, a part of the third flow path portion 94 is provided in the first bottom wall portion 61b. Thereby, the third flow path portion 94 cools the internal space of the housing portion 61A.

[0061] According to the present embodiment, the power module 11 and the power integration system 12 are arranged in the vertical direction Z. Therefore, compared with the case where the power module 11 and the power integration system 12 are arranged in a direction perpendicular to the vertical direction Z, the control device 7 can be miniaturized in a direction perpendicular to the vertical direction.

[0062] In the present embodiment, the power module 11 and the power integration system 12 are arranged on the upper side (+Z) with respect to the motor 2. Further, the power module 11 is arranged on the lower side (-Z) with respect to the power integration system 12. The power module 11 is connected to the motor 2 and supplies power to the motor 2. Therefore, if the distance between the power module 11 and the motor 2 increases, the resistance of the connection path (for example, a bus bar) connecting the power module 11 and the motor 2 increases, and the loss during the driving of the drive device 1 may increase. According to the present embodiment, the power module 11 can be arranged closer to the motor 2 than the power integration system 12, so that the resistance of the connection path between the power module 11 and the motor 2 can be reduced, and the loss generated in the drive device 1 can be reduced.

[0063] According to the present embodiment, the power module 11 is fixed to the housing portion 61A, and the power integration system 12 is fixed to the third cover member 64. That is, the power module 11 and the power integration system 12 can be brought into contact with different components (the housing portion 61A and the third cover member 64) of the electronic component housing 6C, respectively. Thereby, the heat of the power module 11 and the power integration system 12 can be dissipated by transferring to different components, and the power module 11 and the power integration system 12 can be efficiently cooled. Further, the heat transfer from any one of the power module 11 and the power integration system 12 to the other can be suppressed.

[0064] According to the present embodiment, since the power module 11 and the cooling flow path portion 90A are provided in the flow path member 65, the power module 11 can be effectively cooled. Further, the power integration system 12 may be provided in the flow path member 65. That is, it is sufficient that at least one of the power module 11 and the power integration system 12 and the cooling flow path portion 90A are provided in the flow path member 65. Further, here, with respect to electronic components such as the power module 11 and the power integration system 12, "being provided in the flow path member 65" means that these electronic components are mounted on the flow path member 65.

[0065] In the present embodiment, the motor 2 and the control device 7 overlap in the vertical direction. Further, the flow path component 65 is located between the motor 2, the power module 11, and the power integration system 12 in the vertical direction Z. Therefore, the cooling flow path portion 90A of the present embodiment is located between the motor 2, the power module 11, and the power integration system 12 in the vertical direction Z. According to the present embodiment, the cooling flow path portion 90A divides the internal space A of the electronic component housing 6C into an upper region and a lower region of the cooling flow path portion 90A. Further, the cooling flow path portion 90A blocks the heat transfer between these upper and lower regions. Thereby, the heat transfer from the motor 2 to the power module 11 and the power integration system 12 can be suppressed. Similarly, the heat transfer from the power module 11 and the power integration system 12 to the motor 2 can be suppressed. In the present embodiment, the case where both the power module 11 and the power integration system 12 are located above the cooling flow path portion 90A has been described. However, as long as at least one of the power module 11 and the power integration system 12 is located above the cooling flow path portion 90A, the heat transfer between the one located above the cooling flow path portion 90A and the motor 2 can be suppressed. That is, as long as the cooling flow path portion 90A is located between the motor 2 and the power module 11 or the power integration system 12 in the vertical direction Z, at least a part of the above effects can be obtained.

[0066] According to the present embodiment, the heater control unit 15b, which is a part of the heating device 15, is housed in the electronic component housing 6C. Thereby, the heater control unit 15b can be protected by the electronic component housing 6C. Further, by arranging the heater control unit 15b inside the electronic component housing 6C, it is easy to cool the heater control unit 15b through the flow path 90, and the reliability of the heating device 15 can be improved. In the present embodiment, the case where only the heater control unit 15b is housed in the electronic component housing 6C has been described. However, even if both the heater unit 15a and the heater control unit 15b are housed in the electronic component housing 6C, the same effect can be obtained.

[0067] In the present embodiment, the heater unit 15a of the heating device 15 is fixed to the outer side surface 64g of the electronic component housing 6C and is not arranged inside the electronic component housing 6C. According to the present embodiment, the heat of the heater unit 15a can be prevented from affecting the electronic components arranged inside the electronic component housing 6C. Further, the heater unit 15a of the heating device 15 may be provided not only on the outer side surface of the electronic component housing 6C but also on the outer side surface of the motor housing 6A or the gear housing 6B.

[0068] In the present embodiment, the case where the cooling flow path portion 90A overlaps with both the power module 11 and the power integration system 12 in the vertical direction Z so that they can be cooled has been described. However, the cooling flow path portion 90A may be able to cool other electronic components instead of the power integration system 12. Here, the electronic components other than the power module 11 cooled by the cooling flow path portion 90A are referred to as the first electronic component 12. The first electronic component 12 of the present embodiment is the power integration system 12, but it may also be the current distribution portion 13 or the capacitor 14. That is, the first electronic component 12 only needs to have any one of the functions of voltage adjustment, current distribution, or capacitance. In addition, the cooling flow path portion 90A is provided in the housing portion 61A, and it only needs to be a part of the flow path 90 that overlaps with any one of the power integration system 12, the current distribution portion 13, the capacitor 14, or the power module 11 in the vertical direction Z. In addition, in the present embodiment, the capacitor 14 may be replaced with the first electronic component, and the portion of the first flow path portion 91 that overlaps with the capacitor 14 may be replaced with the cooling flow path portion 90B. In this case, the cooling flow path portion 90B cools the capacitor 14. Also, the current distribution portion 13 may be replaced with the first electronic component, and the portion of the first flow path portion 91 that overlaps with the current distribution portion 13 may be replaced with the cooling flow path portion 90B.

[0069] In the present embodiment, the capacitor 14 overlaps with the power module 11 in the first direction D1. In addition, the current distribution portion 13 overlaps with the first electronic component 12 in the first direction D1. Here, the electronic components other than the power module 11 and the first electronic component 12 that have any one of the functions of voltage adjustment, current distribution, or capacitance are referred to as the second electronic components 13, 14. The second electronic components 13, 14 only need to have any one of the functions of voltage adjustment, current distribution, or capacitance. That is, the second electronic components 13, 14 only need to be any one of the power integration system 12, the current distribution portion 13, and the capacitor 14. According to the present embodiment, the second electronic components 13, 14 overlap with at least one of the power module 11 or the first electronic component 12 in the first direction D1. According to the present embodiment, the second electronic components 13, 14 are arranged and configured along the first direction D1 with the power module 11 or the first electronic component 12, thereby being able to suppress the enlargement of the control device 7 in the vertical direction Z.

[0070] In the present embodiment, the control device 7 has a plurality of second electronic components 13, 14 (current distribution portion 13 and capacitor 14). The plurality of second electronic components 13, 14 overlap with each other in the vertical direction Z. According to the present embodiment, the plurality of second electronic components 13, 14 are arranged and configured in the vertical direction Z with each other, thereby being able to suppress the enlargement of the control device 7 in the direction perpendicular to the vertical direction Z.

[0071] In the present embodiment, the power module 11 and the power integration system 12 are preferably arranged in such a manner that they extend along a plane perpendicular to the vertical direction Z with the vertical direction Z as the thickness direction. Further, the cooling flow path portion 90A is preferably extended along a plane perpendicular to the vertical direction Z. According to the present embodiment, the power module 11 and the power integration system 12 can be overlapped and arranged within a wide range in the vertical direction Z on the cooling flow path portion 90A, and the cooling efficiency of the power module 11 and the power integration system 12 can be improved. Further, for the same reason, the current distribution portion 13 and the capacitor 14 are also preferably arranged in such a manner that they extend along a plane perpendicular to the vertical direction Z with the vertical direction Z as the thickness direction.

[0072] <Modification Example>

[0073] Hereinafter, a modification example of the drive device will be described. In the description of each modification example described below, the same reference numerals are given to the constituent elements that are the same as those in the embodiment or modification example already described, and the description thereof is omitted.

[0074] Further, in the following modification examples, as in the above-described embodiment, the case where the power integration system 12 is the first electronic component 12, and the current distribution portion 13 and the capacitor 14 are the second electronic components 13 and 14 is described. However, the first electronic component only needs to have any one of the functions of voltage adjustment, current distribution, or capacitor, and may be any one of the power integration system 12, the current distribution portion 13, or the capacitor 14. Similarly, the second electronic component only needs to be a component having any one of the functions of voltage adjustment, current distribution, or capacitor among the electronic components other than the first electronic component, and may be any one of the power integration system 12, the current distribution portion 13, or the capacitor 14.

[0075] (Modification Example 1)

[0076] Figure 3 is a cross-sectional schematic view of the drive device 101 of Modification Example 1. Similar to the above-described embodiment, the drive device 101 of the present modification example includes a motor 2, a transmission mechanism 3 (see Figure 1 ) and a control device 107. Further, the drive device 101 includes a housing connection body 6. The housing connection body 6 includes a motor housing 6A, a gear housing 6B (see Figure 1 ) and an electronic component housing 6C. The electronic component housing 6C includes: a housing portion 61A having a housing portion main body 66 and a flow path component 65; and a third cover member 64. Further, a flow path 190 is provided in the housing connection body 6.

[0077] In the electronic component housing 6C of this modification example, a power module 11, a power integration system 12, a current distribution unit 13, a capacitor 14, and a heating device 115 are accommodated. The power module 11 and the power integration system 12 are fixed to the upper surface 65a of the flow path component 65. The current distribution unit 13, the capacitor 14, and the heating device 115 are fixed to the second inner side surface 64k of the second bottom wall portion 64b.

[0078] Similar to the above-described embodiment, the flow path 190 has a first flow path portion 91 provided in the flow path component 65 and a third flow path portion 94 provided in the motor housing 6A. According to this modification example, by bringing the power module 11 and the power integration system 12 into contact with the upper surface 65a of the flow path component 65 provided with the first flow path portion 91, the power module 11 and the power integration system 12 can be effectively cooled.

[0079] The first flow path portion 91 of this modification example has a cooling flow path portion 190A that overlaps with the power module 11 in the vertical direction Z and a cooling flow path portion 190B that overlaps with the power integration system 12 in the vertical direction Z. The cooling flow path portions 190A and 190B of this modification example overlap with the power module 11 or the power integration system 12 in the vertical direction Z, whereby the power module 11 or the power integration system 12 can be easily cooled.

[0080] In this modification example, the current distribution unit 13 overlaps with the cooling flow path portion 190A in the vertical direction Z, and the capacitor 14 overlaps with the cooling flow path portion 190B in the vertical direction Z. According to this modification example, the control device 107 can be suppressed from being enlarged in the direction perpendicular to the vertical direction Z.

[0081] In this modification example, the power module 11 and the power integration system 12 are arranged and configured in the first direction D1. According to this modification example, the power module 11 and the power integration system 12 overlap in the first direction D1. The power module 11 and the power integration system 12 are relatively large components among the electronic components of the control device 107. Therefore, by arranging and configuring the power module 11 and the power integration system 12 along the first direction D1, the control device 107 can be suppressed from being enlarged in the vertical direction Z.

[0082] In this modification example, the current distribution unit 13 overlaps with the power module 11 in the vertical direction Z. In addition, the capacitor 14 overlaps with the power integration system 12 in the vertical direction Z. That is, according to the modification example, the second electronic components 13 and 14 (the current distribution unit 13 and the capacitor 14) overlap with at least one of the power module 11 or the first electronic component 12 in the vertical direction Z, so that the control device 107 can be suppressed from being enlarged in the direction perpendicular to the vertical direction Z. In addition, in this modification example, the plurality of second electronic components 13 and 14 overlap with each other in the first direction D1, so that the control device 107 can be suppressed from being enlarged in the vertical direction Z.

[0083] In this modification example, both the power module 11 and the power integration system 12 are fixed to the flow path component 65. That is, according to this modification example, the power module 11 and the power integration system 12 are fixed to the housing portion 61A. The calorific value of the power module 11 and the power integration system 12 is relatively large among the electronic components of the control device 107. According to this modification example, the power module 11 with a large calorific value and the first electronic component 12 can be cooled by the first flow path portion 91 provided in the housing portion 61A.

[0084] In this modification example, the electronic component housing 6C houses the heater portion 115a and the heater control portion 115b of the heating device 115. That is, according to this modification example, the whole of the heating device 115 is arranged in the internal space of the electronic component housing 6C. If a part of the heating device 115 is fixed to the outer side surface of the housing connector 6, it will protrude from the outer shape of the driving device, and the driving device may be enlarged. According to this modification example, by arranging the whole of the heating device 115 (that is, the heater portion 115a and the heater control portion 115b) in the electronic component housing 6C, miniaturization of the driving device 101 can be achieved.

[0085] (Modification Example 2)

[0086] Figure 4 It is a cross-sectional schematic view of the driving device 201 of Modification Example 2. Similar to the above-described embodiment, the driving device 201 of this modification example has a motor 2, a transmission mechanism 3 (refer to Figure 1 ) and a control device 207. In addition, the driving device 201 has a housing connector 206. The housing connector 206 has a motor housing 6A, a gear housing 6B (refer to Figure 1 ) and an electronic component housing (housing) 206C. The electronic component housing 206C has: a housing portion 261A, which has a housing portion main body 266 and a flow path component (wall portion) 265; and a third cover member 64. A flow path 290 is provided in the housing connector 206.

[0087] The housing portion main body 266 has a first bottom wall portion 61b, a first side wall portion 61c, a first flange portion 61f and a plurality of support column portions 261u in the same manner as the above-described embodiment. The support column portions 261u extend upward (+Z) from the first inner side surface 61k of the first bottom wall portion 61b. The flow path component 265 is mounted on the upper end portion of the support column portions 261u. Compared with the above-described embodiment, the support column portions 261u of this modification example are arranged on one side (+D1) in the first direction. In addition, compared with the above-described embodiment, the flow path component 265 of this modification example has a smaller dimension in the first direction D1.

[0088] In the electronic component housing 206C of this modification example, a power module 11, a power integration system 12, a current distribution unit 13, and a capacitor 14 are housed. The power integration system 12 is fixed to the upper surface 265a of the flow path component 265. The power module 11 is disposed on the other side (-D1) in the first direction of the flow path component 265 and is fixed to the first inner side surface 61k of the first bottom wall portion 61b. The current distribution unit 13 and the capacitor 14 are fixed to the second inner side surface 64k of the second bottom wall portion 64b.

[0089] Similar to the above-described embodiment, the flow path 290 has a first flow path portion 291 provided in the flow path component 265 and a third flow path portion 94 provided in the motor housing 6A. According to this modification example, by bringing the power integration system 12 into contact with the upper surface 265a of the flow path component 265 provided with the first flow path portion 291, the power integration system 12 can be effectively cooled.

[0090] The first flow path portion 291 of this modification example has a cooling flow path portion 290A that overlaps the power integration system 12 in the vertical direction Z. The cooling flow path portion 290A of this modification example overlaps the power integration system 12 in the vertical direction Z, whereby it is easy to cool the power integration system 12.

[0091] The cooling flow path portion 290A of this modification example overlaps the power module 11 in the first direction D1. That is, the cooling flow path portion 290A of this modification example overlaps the one of the power module 11 and the power integration system 12 that does not overlap the cooling flow path portion 290A in the vertical direction Z in the first direction D1. According to this modification example, it is possible to suppress the enlargement of the control device 207 in the vertical direction Z. In addition, this effect can be obtained as long as the cooling flow path portion 290A overlaps at least one of the power module 11 and the power integration system 12 in the first direction.

[0092] In this modified example, the power module 11 and the power integration system 12 are arranged and configured in the first direction D1, so that the control device 207 can be prevented from being enlarged in the vertical direction Z. In addition, in this modified example, the current distribution unit 13 overlaps the power integration system 12 in the vertical direction Z, and the capacitor 14 overlaps the power module 11 in the vertical direction Z. That is, according to the modified example, the second electronic components 13 and 14 (the current distribution unit 13 and the capacitor 14) overlap at least one of the power module 11 and the first electronic component 12 in the vertical direction Z, so that the control device 207 can be prevented from being enlarged in the direction perpendicular to the vertical direction Z. And, in this modified example, the current distribution unit 13 overlaps the cooling flow path unit 290A in the vertical direction Z, so that the control device 207 can be prevented from being enlarged in the direction perpendicular to the vertical direction Z. In this modified example, the plurality of second electronic components 13 and 14 overlap each other in the first direction D1, so that the control device 207 can be prevented from being enlarged in the direction perpendicular to the vertical direction Z.

[0093] (Modified Example 3)

[0094] Figure 5 is a cross-sectional schematic view of the drive device 301 of Modified Example 3. Similar to the above-described embodiment, the drive device 301 of this modified example includes a motor 2 and a transmission mechanism 3 (refer to Figure 1 ).) and a control device 307. In addition, the drive device 301 includes a housing connection body 206. The housing connection body 206 includes a motor housing 6A, a gear housing 6B (refer to Figure 1 ).) and an electronic component housing 206C. The electronic component housing 206C includes: a housing portion 261A having a housing portion main body 266 and a flow path component 265; and a third cover member 64. A flow path 290 is provided in the housing connection body 206.

[0095] The control device 307 of this modified example is different from the above-described Modified Example 2 (refer to Figure 4 ) in that the configurations of the power module 11 and the power integration system 12 are interchanged. In this modified example, the power module 11 is fixed to the upper surface 265a of the flow path component 265. In addition, in this modified example, the power integration system 12 is disposed on the other side (-D1) in the first direction of the flow path component 265 and is fixed to the first inner side surface 61k of the first bottom wall portion 61b.

[0096] According to this modification example, by bringing the power module 11 into contact with the upper surface 265a of the flow path component 265 provided with the first flow path portion 291, the power module 11 can be effectively cooled. The first flow path portion 291 of this modification example has a cooling flow path portion 290A that overlaps the power module 11 in the vertical direction Z. The cooling flow path portion 290A of this modification example overlaps the power module 11 in the vertical direction Z, thereby facilitating the cooling of the power module 11.

[0097] The cooling flow path portion 290A of this modification example overlaps the power integration system 12 in the first direction D1. According to this modification example, the control device 307 can be prevented from becoming large in the vertical direction Z. In this modification example, the power integration system 12 and the power module 11 are arranged and configured in the first direction D1, so the control device 307 can be prevented from becoming large in the vertical direction Z. In addition, in this modification example, the current distribution portion 13 overlaps the power module 11 in the vertical direction Z, and the capacitor 14 overlaps the power integration system 12 in the vertical direction Z. That is, according to the modification example, the second electronic components 13, 14 (the current distribution portion 13 and the capacitor 14) overlap at least one of the power integration system 12 or the first electronic component 12 in the vertical direction Z, so the control device 307 can be prevented from becoming large in the direction perpendicular to the vertical direction Z. Also, in this modification example, the current distribution portion 13 overlaps the cooling flow path portion 290A in the vertical direction Z, so the control device 307 can be prevented from becoming large in the direction perpendicular to the vertical direction Z. In addition, in this modification example, the plurality of second electronic components 13, 14 overlap each other in the first direction D1, so the control device 307 can be prevented from becoming large in the vertical direction Z.

[0098] (Modification Example 4)

[0099] Figure 6 is a cross-sectional schematic view of the drive device 401 of Modification Example 4. Similar to the above-described embodiment, the drive device 401 of this modification example has a motor 2, a transmission mechanism 3 (refer to Figure 1 ) and a control device 407. In addition, the drive device 401 has a housing connection body 206. The housing connection body 206 has a motor housing 6A, a gear housing 6B (refer to Figure 1 ) and an electronic component housing 206C. The electronic component housing 206C has: a housing portion 261A, which has a housing portion main body 266 and a flow path component 265; and a third cover member 64. A flow path 490 is provided in the housing connection body 206.

[0100] The control device 407 of this modification example is the same as that of the above-described Modification Example 2 (refer to Figure 4)Compared with [the above], the configurations of the power module 11, the power integration system 12, the current distribution unit 13, and the capacitor 14 inside the electronic component housing 206C are different. In this modification example, the power module 11 and the power integration system 12 are fixed to the upper surface 265a of the flow path component 265. Additionally, in this modification example, the current distribution unit 13 and the capacitor 14 are arranged on the other side (-D1) in the first direction of the flow path component 265 and are fixed to the first inner side surface 61k of the first bottom wall portion 61b.

[0101] According to this modification example, by bringing the power module 11 and the power integration system 12 into contact with the upper surface 265a of the flow path component 265 provided with the first flow path portion 291, the power module 11 and the power integration system 12 can be effectively cooled. The first flow path portion 291 of this modification example has a cooling flow path portion 490A that overlaps with the power module 11 in the vertical direction Z and a cooling flow path portion 490B that overlaps with the power integration system 12 in the vertical direction Z. The cooling flow path portions 490A and 490B of this modification example overlap with the power module 11 or the power integration system 12 in the vertical direction Z, thereby facilitating the cooling of the power module 11 or the power integration system 12.

[0102] In this modification example, since the power module 11 and the power integration system 12 are arranged and configured in the first direction D1, the control device 407 can be prevented from becoming large-sized in the vertical direction Z. Additionally, in this modification example, since the second electronic components 13 and 14 (the current distribution unit 13 and the capacitor 14) overlap with the power module 11 and the power integration system 12 in the first direction D1, the control device 407 can be prevented from becoming large-sized in the vertical direction Z. And, in this modification example, since the second electronic components 13 and 14 overlap with the cooling flow path portions 490A and 490B in the first direction D1, the control device 407 can be prevented from becoming large-sized in the vertical direction Z. Additionally, in this modification example, since the plurality of second electronic components 13 and 14 overlap with each other in the first direction D1, the control device 407 can be prevented from becoming large-sized in the vertical direction Z.

[0103] (Modification Example 5)

[0104] Figure 7 is a cross-sectional schematic view of the drive device 501 of Modification Example 5. Similar to the above-described embodiment, the drive device 501 of this modification example has a motor 2, a transmission mechanism 3 (refer to Figure 1 ) and a control device 507. Additionally, the drive device 501 has a housing connection body 6. The housing connection body 6 has a motor housing 6A, a gear housing 6B (refer to Figure 1 ) and an electronic component housing 6C. The electronic component housing 6C has: a housing portion 61A, which has a housing portion main body 66 and a flow path component 65; and a third cover member 64. A flow path 590 is provided in the housing connection body 6.

[0105] The control device 507 of this modification is different from the above-described embodiment (refer to Figure 2 ) and Modification 1 (refer to Figure 3 ) in the arrangement of the power module 11, the power integration system 12, the current distribution section 13, and the capacitor 14 inside the electronic component housing 6C. In this modification, the power module 11 and the power integration system 12 are fixed to the upper surface 65a of the flow path component 65. In addition, the current distribution section 13 is fixed to the second inner side surface 64k of the second bottom wall section 64b. And the capacitor 14 is fixed to the first inner side surface 61k of the first bottom wall section 61b.

[0106] According to this modification, by bringing the power module 11 and the power integration system 12 into contact with the upper surface 65a of the flow path component 65 provided with the first flow path section 91, the power module 11 and the power integration system 12 can be effectively cooled. The first flow path section 91 of this modification has a cooling flow path section 590A that overlaps with the power module 11 in the vertical direction Z and a cooling flow path section 590B that overlaps with the power integration system 12 in the vertical direction Z. The cooling flow path sections 590A and 590B of this modification overlap with the power module 11 or the power integration system 12 in the vertical direction Z, whereby it is easy to cool the power module 11 or the power integration system 12.

[0107] In this modification, the flow path component 65 is fixed to the front end of the support column portion 61u that protrudes upward from the first bottom wall portion 61b. Therefore, a gap is provided between the first bottom wall portion 61b and the flow path component 65. In this modification, the capacitor 14 is located below the flow path component 65. Therefore, the capacitor 14 is disposed between the first bottom wall portion 61b and the flow path component 65 in the vertical direction Z. According to this modification, the space between the first bottom wall portion 61b and the flow path component 65 can be effectively used as a storage space for the capacitor 14. In addition, according to this modification, the heat of the capacitor 14 can be transferred from the lower surface of the capacitor 14 to the housing body 66 and from the upper surface of the capacitor 14 to the flow path component 65. That is, according to this modification, the capacitor 14 can be cooled from above and below, and the temperature of the capacitor 14 can be prevented from becoming too high. In addition, in Figure 7 , a gap is provided between the capacitor 14 and the flow path component 65. However, the capacitor 14 and the flow path component 65 may be in direct contact or in contact via a heat transfer material. In addition, in this modification, the arrangements of the current distribution section 13 and the capacitor 14 may be swapped with each other. That is, as long as at least one of the current distribution section 13 and the capacitor 14 (the second electronic component) is disposed between the first bottom wall portion 61b and the flow path component 65 in the vertical direction Z.

[0108] In this modification example, the power module 11 and the power integration system 12 are arranged and configured in the first direction D1, so that the control device 507 can be prevented from being enlarged in the up-and-down direction Z. In addition, in this modification example, the second electronic components 13 and 14 (the current distribution unit 13 and the capacitor 14) overlap the power module 11 and the power integration system 12 in the up-and-down direction Z, so that the control device 507 can be prevented from being enlarged in the direction perpendicular to the up-and-down direction Z. Further, in this modification example, the second electronic components 13 and 14 overlap the cooling flow path portion 590A in the up-and-down direction Z, so that the control device 507 can be prevented from being enlarged in the direction perpendicular to the up-and-down direction Z. In addition, in this modification example, the plurality of second electronic components 13 and 14 overlap each other in the up-and-down direction Z, so that the control device 507 can be prevented from being enlarged in the direction perpendicular to the up-and-down direction Z.

[0109] (Modification Example 6)

[0110] Figure 8 is a cross-sectional schematic view of the drive device 601 of Modification Example 6. Similar to the above-described embodiment, the drive device 601 of this modification example includes a motor 2, a transmission mechanism 3 (see Figure 1 ) and a control device 607. In addition, the drive device 601 includes a housing connecting body 6. The housing connecting body 6 includes a motor housing 6A, a gear housing 6B (see Figure 1 ) and an electronic component housing 6C. The electronic component housing 6C includes: a housing portion 61A having a housing portion main body 66 and a flow path component 65; and a third cover member 64. A flow path 690 is provided in the housing connecting body 6.

[0111] The control device 607 of this modification example has a different configuration of the power module 11 and the power integration system 12 compared to the above-described Modification Example 5 (see Figure 7 ). The power module 11 and the power integration system 12 of this modification example are fixed to the lower surface 65b of the flow path component 65.

[0112] According to this modification example, by bringing the power module 11 and the power integration system 12 into contact with the lower surface 65b of the flow path component 65 provided with the first flow path portion 91, the power module 11 and the power integration system 12 can be effectively cooled. The first flow path portion 91 of this modification example includes a cooling flow path portion 690A that overlaps the power module 11 in the up-and-down direction Z and a cooling flow path portion 690B that overlaps the power integration system 12 in the up-and-down direction Z. The cooling flow path portions 690A and 690B of this modification example overlap the power module 11 or the power integration system 12 in the up-and-down direction Z, whereby the power module 11 or the power integration system 12 can be easily cooled.

[0113] In this modified example, the power module 11 and the power integration system 12 are located below the flow path component 65. Therefore, the power module 11 and the power integration system 12 are disposed between the first bottom wall portion 61b and the flow path component 65 in the vertical direction Z. According to this modified example, the space between the first bottom wall portion 61b and the flow path component 65 can be effectively used as a storage space for the power module 11 and the power integration system 12.

[0114] In this modified example, the lower surfaces of the power module 11 and the power integration system 12 are respectively opposed to the first inner side surface 61k of the first bottom wall portion 61b with a gap therebetween. The lower surfaces of the power module 11 and the power integration system 12 may also be in contact with the first inner side surface 61k directly or via a heat transfer material 667. In this case, while cooling the power module 11 and the power integration system 12 by the flow path component 65, the heat generated from the power module 11 and the power integration system 12 can be transferred to the first bottom wall portion 61b, and the power module 11 and the power integration system 12 can be cooled from the vertical direction. In addition, as long as at least one of the power module 11 or the power integration system 12 is disposed between the first bottom wall portion 61b and the flow path component 65 in the vertical direction Z, the power module 11 and the power integration system 12 can also be cooled from the vertical direction.

[0115] In this modified example, the power module 11 and the power integration system 12 are arranged and configured in the first direction D1, so that the control device 607 can be prevented from being enlarged in the vertical direction Z. In addition, in this modified example, the second electronic components 13, 14 (the current distribution portion 13 and the capacitor 14) overlap the power module 11 and the power integration system 12 in the vertical direction Z, so that the control device 607 can be prevented from being enlarged in the direction perpendicular to the vertical direction Z. And, in this modified example, the second electronic components 13, 14 overlap the cooling flow path portion 690A in the vertical direction Z, so that the control device 607 can be prevented from being enlarged in the direction perpendicular to the vertical direction Z. In addition, in this modified example, the plurality of second electronic components 13, 14 overlap each other in the vertical direction Z, so that the control device 607 can be prevented from being enlarged in the direction perpendicular to the vertical direction Z.

[0116] (Modified Example 7)

[0117] Figure 9 is a cross-sectional schematic view of the drive device 701 of Modified Example 7. Similar to the above-described embodiment, the drive device 701 of this modified example includes a motor 2, a transmission mechanism 3 (refer to Figure 1 ), and a control device 707. In addition, the drive device 701 includes a housing connecting body 706. The housing connecting body 706 includes a motor housing 6A, a gear housing 6B (refer to Figure 1 ), and an electronic component housing (housing) 706C.

[0118] In this modified example, the electronic component housing 706C includes: a housing portion 761A having a housing portion main body 766 and a flow path component 265; and a third cover component 64. The housing portion main body 766 has a first bottom wall portion (bottom) 761b, a first side wall portion 61c, a first flange portion 61f, and a plurality of support pillar portions 261u. A flow path component 265 is fixed to the upper end portions of the plurality of support pillar portions 261u.

[0119] In the electronic component housing 706C of this modified example, a power module 11, a power integration system 12, a current distribution portion 13, and a capacitor 14 are accommodated. The power integration system 12 is fixed to the upper surface 265a of the flow path component 265. The power module 11 is disposed on the other side (-D1) in the first direction of the flow path component 265 and is fixed to the first inner side surface 761k of the first bottom wall portion 761b. The current distribution portion 13 and the capacitor 14 are fixed to the second inner side surface 64k of the second bottom wall portion 64b.

[0120] A flow path 790 is provided in the housing connector 706. Compared with the above-described modified example 2 (refer to Figure 4 ), the structure of the flow path 790 is mainly different. The flow path 790 of this modified example has a first flow path portion 291, a second flow path portion 792, and a third flow path portion 94. The second flow path portion 792 of this modified example is provided on the first bottom wall portion 761b. The second flow path portion 792 extends along the axial direction Y. However, the second flow path portion 792 may extend along a plane perpendicular to the vertical direction Z and may extend in any direction. The second flow path portion 792 is connected to the third flow path portion 94 at one end portion. This one end portion is located at the common wall portion 61n.

[0121] The third flow path portion 94 is provided in the motor housing 6A to cool the motor 2. The third flow path portion 94 of this modified example overlaps with the portion of the flow path 790 provided in the housing portion 761A (in this modified example, the first flow path portion 291 and the second flow path portion 792) in the vertical direction. According to this modified example, by providing the first flow path portion 291 and the second flow path portion 792 directly above the third flow path portion 94, the third flow path portion 94 can be arranged close to the first flow path portion 291 and the second flow path portion 792. Thereby, the flow path 790 is locally densely arranged, and it is possible to suppress the fluid in the flow path 790 from absorbing heat from components other than the cooling object. In addition, by locally densely arranging the flow path 790, it is possible to make the heat generated separately between the power module 11 as the cooling object and the motor less likely to be transferred to each other. And, by overlapping the third flow path portion 94 and the second flow path portion 792 in the vertical direction Z, it is possible to connect the third flow path portion 94 and the second flow path portion 792 with a shorter path, and it is possible to shorten the overall length of the flow path 790.

[0122] In this modified example, the third flow path portion 94 is connected to a portion of the flow path 790 provided in the housing portion 761A (the second flow path portion 792 in this modified example). According to this modified example, it is possible to make the second flow path portion 792 and the third flow path portion 94 into respective portions of a single circulation path, thus easily simplifying the structure of the flow path 790.

[0123] According to this modified example, by bringing the power integration system 12 into contact with the upper surface 265a of the flow path component 265 provided with the first flow path portion 291, the power integration system 12 can be effectively cooled. The first flow path portion 291 of this modified example has a cooling flow path portion 790A that overlaps the power integration system 12 in the vertical direction Z. The cooling flow path portion 790A of this modified example can easily cool the power integration system 12 by overlapping the power integration system 12 in the vertical direction Z.

[0124] The second flow path portion 792 has an opening portion 792a that opens on the first inner side surface 761k of the first bottom wall portion 761b. The opening portion 792a opens on the upper side (+Z). In this modified example, the power module 11 covers the opening portion 792a. The fluid flowing in the second flow path portion 792 comes into contact with the power module 11 and absorbs heat from the power module 11. That is, the second flow path portion 792 cools the power module 11. The second flow path portion 792 of this modified example has a cooling flow path portion 790B that overlaps the power module 11 in the vertical direction Z. The cooling flow path portion 790B of this modified example can easily cool the power integration system 12 by overlapping the power module 11 in the vertical direction Z. Further, in this modified example, the positions of the power module 11 and the power integration system 12 may be mutually swapped. That is, as long as at least one of the power module 11 and the power integration system 12 and the cooling flow path portion 790B are provided in the first bottom wall portion 761b.

[0125] The first flow path portion 291 of this modified example is provided in the flow path component 265. The first flow path portion 291 has a cooling flow path portion 790A that overlaps the power integration system 12 in the vertical direction Z. According to this modified example, the power integration system 12 can be cooled in the cooling flow path portion 790A.

[0126] In this modification example, the power module 11 and the power integration system 12 are arranged and configured in the first direction D1, so that the control device 707 can be prevented from being enlarged in the vertical direction Z. In addition, in this modification example, the current distribution unit 13 overlaps with the power integration system 12 in the vertical direction Z, and the capacitor 14 overlaps with the power module 11 in the vertical direction Z. That is, according to the modification example, the second electronic components 13, 14 (the current distribution unit 13 and the capacitor 14) overlap with at least one of the power module 11 or the first electronic component 12 in the vertical direction Z, so that the control device 707 can be prevented from being enlarged in the direction perpendicular to the vertical direction Z. And, in this modification example, the second electronic components 13, 14 overlap with the cooling flow path portions 790A, 790B in the vertical direction Z respectively, so that the control device 707 can be prevented from being enlarged in the direction perpendicular to the vertical direction Z. In addition, in this modification example, the plurality of second electronic components 13, 14 overlap with each other in the first direction D1, so that the control device 707 can be prevented from being enlarged in the vertical direction Z.

[0127] (Modification Example 8)

[0128] Figure 10 is a schematic cross-sectional view of the drive device 801 of Modification Example 8. Similar to the above-described embodiment, the drive device 801 of this modification example includes a motor 2 and a transmission mechanism 3 (see Figure 1 ).) and a control device 807. In addition, the drive device 801 includes a housing connection body 6. The housing connection body 6 includes a motor housing 6A, a gear housing 6B (see Figure 1 ).) and an electronic component housing 6C. The electronic component housing 6C includes: a housing portion 61A having a housing portion main body 66 and a flow path component 65; and a third cover member 64. A flow path 90 is provided in the housing connection body 6.

[0129] The control device 807 of this modification example is different from the above-described embodiment (see Figure 2 ) in that the configurations of the power module 11 and the power integration system 12 are swapped with each other. In this modification example, the power module 11 is fixed to the second inner side surface 64k of the second bottom wall portion 64b, and the power integration system 12 is fixed to the upper surface 65a of the flow path component 65.

[0130] In this modified example, the power module 11 is fixed to the third cover member 64, and the power integration system 12 is fixed to the housing portion 61A. That is, according to this modified example, the power module 11 and the power integration system 12 can be brought into contact with different components (the housing portion 61A and the third cover member 64) of the electronic component housing 6C, respectively. Thereby, the heat of the power module 11 and the power integration system 12 can be transferred to different components for heat dissipation, and the power module 11 and the power integration system 12 can be efficiently cooled. In addition, heat transfer from either the power module 11 or the power integration system 12 to the other can be suppressed.

[0131] In this modified example, the power module 11 and the power integration system 12 are located on the upper side (+Z) with respect to the motor 2. In addition, the power integration system 12 is located on the lower side (-Z) with respect to the power module 11. Among the electronic components included in the control device 807, the power module 11 generates the most heat and its temperature is likely to rise. According to this modified example, the power module 11 can be arranged at a position farther from the motor 2 than the power integration system 12, so that the heat of the power module 11 can also be prevented from affecting the operation of the motor 2. Conversely, the heat of the motor 2 can be prevented from affecting the operation of the power module 11.

[0132] (Modified Example 9)

[0133] Figure 11 is a cross-sectional schematic view of the drive device 901 of Modified Example 9. Similar to the above-described embodiment, the drive device 901 of this modified example has a motor 2, a transmission mechanism 3 (see Figure 1 ), and a control device 907. In addition, the drive device 901 has a housing connection body 906. The housing connection body 906 has a motor housing 6A, a gear housing 6B (see Figure 1 ), and an electronic component housing (housing) 906C.

[0134] In this modified example, the electronic component housing 906C has: a housing portion 961A, which has a housing portion main body 966, a first flow path member (wall portion) 265, and a second flow path member (wall portion) 965; and a third cover member 64. The housing portion main body 966 has a first bottom wall portion 61b, a first side wall portion 61c, a first flange portion 61f, a plurality of first support pillar portions 261u, and a plurality of second support pillar portions 961u. The first flow path member 265 is fixed to the upper end portions of the plurality of first support pillar portions 261u. The second flow path member 965 is fixed to the upper end portions of the plurality of second support pillar portions 961u. Both the first flow path member 265 and the second flow path member 965 are plate-shaped water jackets extending along a plane perpendicular to the vertical direction Z.

[0135] In the electronic component housing 906C of this modification example, a power module 11, a power integration system 12, a current distribution section 13, and a capacitor 14 are housed. The power module 11 is fixed to the upper surface 265a of the first flow path component 265. The power integration system 12 is fixed to the upper surface 965a of the second flow path component 965. The current distribution section 13 and the capacitor 14 are fixed to the second inner side surface 64k of the second bottom wall section 64b.

[0136] A flow path 990 is provided in the housing connector 906. Compared with the above-described modification example 2 (refer to Figure 4 ), the main difference is the structure of the flow path 990. The flow path 990 of this modification example has a first flow path section 291, a second flow path section 991, and a third flow path section 94. The first flow path section 291 extends meanderingly inside the first flow path component 265. Similarly, the second flow path section 991 extends meanderingly inside the second flow path component 965.

[0137] According to this modification example, by bringing the power module 11 into contact with the upper surface 265a of the first flow path component 265 provided with the first flow path section 291, the power module 11 can be effectively cooled. In addition, according to this modification example, by bringing the power integration system 12 into contact with the upper surface 965a of the second flow path component 965 provided with the second flow path section 991, the power integration system 12 can be effectively cooled. The first flow path section 291 of this modification example has a cooling flow path section 990A that overlaps with the power module 11 in the vertical direction Z. The second flow path section 991 of this modification example has a cooling flow path section 990B that overlaps with the power integration system 12 in the vertical direction Z. The cooling flow path sections 990A and 990B of this modification example overlap with the power module 11 or the power integration system 12 in the vertical direction Z, thereby facilitating the cooling of the power module 11 or the power integration system 12.

[0138] According to this modification example, the housing section 961A has a plurality of flow path components 265 and 965, and the power module 11 and the power integration system 12 are respectively fixed to the upper surfaces 265a and 965a of the respective flow path components 265 and 965. Therefore, the configurations of the respective flow path components 265 and 965 can be appropriately determined according to the dimensions of the power module 11 and the power integration system 12 in the vertical direction Z, and it is easy to effectively utilize the internal space A of the electronic component housing 906C without gaps. According to this modification example, miniaturization of the control device 907 can be achieved.

[0139] In this modified example, the power module 11 and the power integration system 12 are arranged in the first direction D1, so that the control device 907 can be prevented from being enlarged in the vertical direction Z. In addition, in this modified example, the current distribution unit 13 overlaps the power module 11 in the vertical direction Z, and the capacitor 14 overlaps the power integration system 12 in the vertical direction Z. That is, according to the modified example, the second electronic components 13 and 14 (the current distribution unit 13 and the capacitor 14) overlap at least one of the power module 11 or the first electronic component 12 in the vertical direction Z, so that the control device 907 can be prevented from being enlarged in the direction perpendicular to the vertical direction Z. And, in this modified example, the current distribution unit 13 overlaps the cooling flow path parts 990A and 990B in the vertical direction Z, so that the control device 907 can be prevented from being enlarged in the direction perpendicular to the vertical direction Z.

[0140] The embodiments of the present invention and their modified examples have been described above. However, each structure and their combinations in the embodiments and their modified examples are examples, and additional, omission, replacement, and other changes of the structure can be made without departing from the gist of the present invention. In addition, the present invention is not limited by the embodiments.

[0141] In particular, the structure of the control device shown in the above embodiments and their modified examples is only an example. The control device only needs to be a device having at least a power module, and may have any other electronic components.

[0142] In addition, the present technology can adopt the following structure.

[0143] (1) A control device located above a motor for controlling the motor, the control device having: a power module; a first electronic component having any function of voltage regulation, current distribution, or a capacitor; and a housing for housing the power module and the first electronic component, the housing having: a housing part having an opening opened upward; and a cover part covering the opening, and a flow path is provided in the housing part, and the flow path has a cooling flow path part overlapping at least one of the power module or the first electronic component in the vertical direction.

[0144] (2) The control device according to (1), wherein the cooling flow path part is located below at least one of the power module or the first electronic component.

[0145] (3) The control device according to (1) or (2), wherein a direction perpendicular to the vertical direction is set as the first direction, and the power module and the first electronic component are arranged in the first direction.

[0146] (4) The control device according to any one of (1) to (3), wherein the power module and the first electronic component are arranged in the vertical direction.

[0147] (5) The control device according to (4), wherein the power module is arranged below the first electronic component.

[0148] (6) The control device according to any one of (1) to (5), wherein a direction perpendicular to the vertical direction is set as the first direction, and the cooling flow path portion overlaps at least one of the power module or the first electronic component in the first direction.

[0149] (7) The control device according to any one of (1) to (6), wherein the control device has a second electronic component housed in the housing, the second electronic component has any function of voltage regulation, current distribution or capacitor, a direction perpendicular to the vertical direction is set as the first direction, and the second electronic component overlaps the cooling flow path portion in the vertical direction or the first direction.

[0150] (8) The control device according to any one of (1) to (7), wherein the control device has a second electronic component housed in the housing, the second electronic component has any function of voltage regulation, current distribution or capacitor, a direction perpendicular to the vertical direction is set as the first direction, and the second electronic component overlaps the power module or the first electronic component in the vertical direction or the first direction.

[0151] (9) The control device according to (7) or (8), wherein the control device has a plurality of the second electronic components.

[0152] (10) The control device according to (9), wherein the plurality of second electronic components overlap each other in the vertical direction or the first direction.

[0153] (11) The control device according to any one of (1) to (10), wherein the housing portion has: a bottom portion located below the opening portion; and a wall portion fixed to the bottom portion and located above the bottom portion, and at least one of the power module and the first electronic component and the cooling flow path portion are provided on the wall portion.

[0154] (12) The control device according to (11), wherein at least one of the power module or the first electronic component is arranged between the bottom portion and the wall portion in the vertical direction.

[0155] (13) The control device according to (12), wherein at least one of the power module and the first electronic component and the cooling flow path portion are provided at the bottom.

[0156] (14) The control device according to any one of (1) to (13), wherein the power module is fixed to the housing portion, and the first electronic component is fixed to the cover portion.

[0157] (15) The control device according to any one of (1) to (13), wherein the power module is fixed to the cover portion, and the first electronic component is fixed to the housing portion.

[0158] (16) The control device according to any one of (1) to (13), wherein the power module and the first electronic component are fixed to the housing portion.

[0159] (17) The control device according to any one of (1) to (16), wherein the control device has a heating device, the heating device has a heater portion and a control portion for controlling the heater portion, and the control portion is housed in the outer shell.

[0160] (18) A drive device, comprising: (1) the control device; the motor; and a motor housing that houses the motor, and the outer shell is connected to the motor housing.

[0161] (19) The drive device according to (18), wherein the motor and the control device overlap in the vertical direction, and the cooling flow path portion is located between the motor and the power module or the first electronic component in the vertical direction.

[0162] (20) The drive device according to (18) or (19), wherein the flow path has a third flow path portion provided in the motor housing, the third flow path portion cools the motor, and the third flow path portion overlaps with a portion of the flow path provided in the housing portion in the vertical direction.

[0163] (21) The drive device according to (20), wherein the third flow path portion is connected to a portion of the flow path provided in the housing portion.

Claims

1. A control device, located on the upper side of a motor, controls the motor, wherein: The control device has: Power module; A first electronic component having any function among voltage regulation, current distribution or capacitor; and a housing that accommodates the power module and the first electronic component, The housing has: a housing portion having an opening portion opened at an upper side; as well as a cover portion covering the opening portion, The housing portion is provided with a flow path. The flow path includes a cooling flow path portion that overlaps at least one of the power module or the first electronic component in a vertical direction.

2. The control device according to claim 1, wherein: The cooling flow path portion is located below at least one of the power module or the first electronic component.

3. The control device according to claim 1, wherein: The direction perpendicular to the up-down direction is set as the first direction. The power module and the first electronic component are arranged side by side in the first direction.

4. The control device according to claim 1, wherein: The power module and the first electronic component are arranged side by side in a vertical direction.

5. The control device according to claim 4, wherein: The power module is arranged on a lower side relative to the first electronic component.

6. The control device according to claim 1, wherein: The direction perpendicular to the up-down direction is set as the first direction. The cooling flow path portion overlaps with at least one of the power module or the first electronic component in the first direction.

7. The control device according to claim 1, wherein: The control device has a second electronic component housed in the housing. The second electronic component has any function of voltage regulation, current distribution or capacitor, The direction perpendicular to the up-down direction is set as the first direction. The second electronic component overlaps the cooling flow path portion in the up-down direction or the first direction.

8. The control device according to claim 1, wherein: The control device has a second electronic component housed in the housing. The second electronic component has any function of voltage regulation, current distribution or capacitor, The direction perpendicular to the up-down direction is set as the first direction. The second electronic component overlaps the power module or the first electronic component in the up-down direction or the first direction.

9. The control device according to claim 7 or 8, wherein: The control device has a plurality of the second electronic components.

10. The control device according to claim 9, wherein: The plurality of second electronic components overlap each other in the vertical direction or in the first direction.

11. The control device according to claim 1, wherein: The housing portion has: a bottom portion located at a lower side of the opening; and a wall portion, which is fixed to the bottom and is located on the upper side of the bottom, The wall portion is provided with at least one of the power module and the first electronic component and the cooling flow path portion.

12. The control device according to claim 11, wherein: At least one of the power module and the first electronic component is arranged between the bottom portion and the wall portion in the up-down direction.

13. The control device according to claim 12, wherein: The bottom portion is provided with at least one of the power module and the first electronic component and the cooling flow path portion.

14. The control device according to claim 1, wherein: The power module is fixed to the housing portion. The first electronic component is fixed to the cover.

15. The control device according to claim 1, wherein: The power module is fixed to the cover. The first electronic component is fixed to the housing portion.

16. The control device according to claim 1, wherein: The power module and the first electronic component are fixed to the housing portion.

17. The control device according to claim 1, wherein: The control device includes a heating device including a heater portion and a control portion that controls the heater portion. The control unit is accommodated in the housing.

18. A driving device, comprising: A control device as claimed in any one of claims 1 to 17; the motor; and a motor housing that accommodates the motor, The housing and the motor housing are connected to each other.

19. The driving device according to claim 18, wherein: The motor and the control device overlap in the vertical direction, The cooling flow path portion is located between the motor and the power module or the first electronic component in the up-down direction.

20. The driving device according to claim 18, wherein: The flow path includes a third flow path portion provided in the motor housing, and the third flow path portion cools the motor. The third flow path portion overlaps with a portion of the flow path provided in the casing portion in a vertical direction.

21. The driving device according to claim 20, wherein: The third flow path portion is connected to a portion of the flow path provided in the casing portion.

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