Control device and drive device

Abstract

The invention provides a control device and a drive device. A driving device according to one embodiment is a control device which is positioned on the upper side of a motor and controls the motor, and comprises: a power module; a first electronic component having any function of voltage regulation, current distribution, or capacitor; and a housing that houses the power module and the first electronic component. The housing includes: a housing portion having an opening portion opened at an upper side; and a cover part which covers the opening part. The cover portion is provided with a flow path. The flow path has a cooling flow path portion that overlaps at least one of the power module and the first electronic component in the vertical direction.

Description

Technical Field

[0001] The present invention relates to a control device and a drive device. Background Art

[0002] In a control device for controlling a motor, a plurality of electronic components are provided as heat generating elements. A flow path for cooling the electronic components is provided in the control device (for example, Patent Document 1).

[0003] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2013-031330

[0004] The calorific values of the plurality of electronic components are different from each other. Therefore, in the control device, if the electronic components are simply arranged along the flow path, not only the control device becomes large-sized, but also the cooling efficiency for each electronic component cannot be sufficiently improved. Summary of the Invention

[0005] In view of the above circumstances, one object of the present invention is to provide a control device and a drive device capable of suppressing the increase in size while efficiently cooling electronic components.

[0006] A drive device according to one aspect of the present invention is a control device that is located above a motor and controls the motor, and includes: a power module; a first electronic component having any one of functions of voltage adjustment, current distribution, or a capacitor; and a housing that houses the power module and the first electronic component. The housing has: a housing portion having an opening portion that opens upward; and a cover portion that covers the opening portion. A flow path is provided in the cover portion. The flow path has a cooling flow path portion that overlaps at least one of the power module or the first electronic component in the vertical direction.

[0007] A drive device according to one aspect of the present invention includes: the above-described control device; the motor; and a motor housing that houses the motor. The housing and the motor housing are connected to each other.

[0008] According to one aspect of the present invention, one object is to provide a control device and a drive device capable of suppressing the increase in size while efficiently cooling electronic components. Brief Description of the Drawings

[0009] Figure 1 is a perspective view of the drive device according to the embodiment.

[0010] Figure 2 is a schematic cross-sectional view of the drive device according to the embodiment.

[0011] Figure 3 is a schematic cross-sectional view of the drive device according to Modification 1.

[0012] Figure 4 is a schematic cross-sectional view of the drive device according to Modification 2.

[0013] Figure 5 It is a schematic cross-sectional view of the drive device of Variant 3.

[0014] Figure 6 It is a schematic cross-sectional view of the drive device of Variant 4.

[0015] Figure 7 It is a schematic cross-sectional view of the drive device of Variant 5.

[0016] Figure 8 It is a schematic cross-sectional view of the drive device of Variant 6.

[0017] Figure 9 It is a schematic cross-sectional view of the drive device of Variant 7.

[0018] Figure 10 It is a schematic cross-sectional view of the drive device of Variant 8.

[0019] Figure 11 It is a schematic cross-sectional view of the drive device of Variant 9.

[0020] Figure 12 It is a schematic cross-sectional view of the drive device of Variant 10.

[0021] Figure 13 It is a schematic cross-sectional view of the drive device of Variant 11.

[0022] Reference numeral description

[0023] 1, 101, 201, 301, 401, 501, 601, 701, 801, 901, 1001, 1101: Driving device; 2: Motor; 6A: Motor housing; 6C, 106C, 206C, 306C, 406C, 506C, 706C, 806C, 906C, 1006C, 1106C: Electronic component housing (housing); 7, 107, 207, 307, 407, 507, 607, 707, 807, 907, 1007, 1107: Control device; 11: Power module; 12: Power integration system (first electronic component); 13: Current distribution unit (second electronic component); 14: Capacitor (second electronic component); 15, 115: Heating device; 15a, 115a: Heater unit; 15b: Heater control unit (control unit); 61A: Housing part; 64, 1064: Third cover component (cover part); 90, 190, 390, 490, 590, 690, 790, 890, 990, 1090, 1190: Flow path; 90A, 90B, 190A, 190B, 390A, 490A, 490B, 490C, 590A, 690A, 790A, 790B, 890A, 990A, 1090A, 1190A: Cooling flow path part; 91, 191, 391, 1091, 1191: First flow path part; 91a, 391a: Opening; 94: Third flow path part; 192, 1092, 1192: Second flow path part; 464A, 564A, 664A, 764A, 864A: Cover body; 465: Flow path component (wall part); 491: Internal flow path part (first flow path part); D1: First direction. Detailed implementation mode

[0024] Hereinafter, the driving device of the embodiment will be described with reference to the drawings. In the following description, the direction of gravity is defined based on the positional relationship when the driving device is mounted on a vehicle located on a horizontal road surface. In addition, the XYZ coordinates are appropriately shown in each figure. The Z-axis is the vertical direction, the +Z side is the upper side, and the -Z side is the lower side. The Y-axis is the left-right direction of the vehicle on which the driving device is mounted. The X-axis is the front-rear direction of the vehicle on which the driving device is mounted.

[0025] In the following description, unless otherwise specified, the direction parallel to the first axis J1 of the motor 2 (Y-axis direction) is simply referred to as "axial direction Y", the radial direction centered on the first axis J1 is simply referred to as "radial direction", and the circumferential direction centered on the first axis J1, that is, the direction around the first axis J1 is simply referred to as "circumferential direction". And, in the following description, the direction parallel to the Z-axis is called the up-down direction Z.

[0026] In addition, in the following description, the direction parallel to the Z-axis is referred to as the "vertical direction Z", and one direction perpendicular to the vertical direction Z is set as the first direction D1. In this specification, the first direction D1 is not only perpendicular to the vertical direction Z but also perpendicular to the axial direction Y, and is a direction parallel to the X-axis direction. However, the first direction D1 can also be a direction intersecting the X-axis direction, and can also be a direction parallel to the axial direction Y.

[0027] In the following description, one side of the first direction D1 refers to the direction (+D1) towards which the arrow of the first direction D1 in the figure points, and the other side of the first direction D1 refers to the direction (-D1) opposite to the direction towards which the arrow of the first direction D1 in the figure points.

[0028] <Drive device>

[0029] Figure 1 is a perspective view of the drive device 1 of the present embodiment. The drive device 1 of the present embodiment is mounted on a vehicle using a motor 2 as a power source, such as a hybrid electric vehicle (HEV), a plug-in hybrid electric vehicle (PHV), or an electric vehicle (EV), and is used as their power source.

[0030] The drive device 1 includes a motor 2, a transmission mechanism 3, and a control device 7. In addition, as described later, the motor 2 has a motor housing 6A, the transmission mechanism 3 has a gear housing 6B, and the control device 7 has an electronic component housing (housing) 6C. The motor housing 6A, the gear housing 6B, and the electronic component housing 6C are connected to each other to form a housing connection body 6. That is, the housing connection body 6 houses the motor 2, the transmission mechanism 3, and the control device 7.

[0031] The housing connection body 6 is formed by combining a plurality of components. The housing connection body 6 includes a housing main body 61, a first cover member 63, a second cover member 62, and a third cover member (cover portion) 64. A part of the housing main body 61 and the first cover member 63 form the motor housing 6A. A part of the housing main body 61 and the second cover member 62 form the gear housing 6B. A part of the housing main body 61 and the third cover member 64 form the electronic component housing 6C.

[0032] <Motor>

[0033] Figure 2 is a schematic cross-sectional view of the drive device 1 of the present embodiment.

[0034] The motor 2 of the present embodiment is, for example, an inner rotor type three-phase AC motor. The motor 2 has both the function of outputting power as a motor and the function of generating electricity as a generator. The motor 2 can also be used as either an engine or a generator. In addition, the structure of the motor 2 is not limited to the present embodiment, and for example, it can also be an AC motor with four or more phases.

[0035] The motor 2 has a rotor 20, a stator 25, and a motor housing 6A. The rotor 20 is capable of rotating about a first axis J1. The rotor 20 is rotatably supported by the motor housing 6A via a bearing (not shown). The stator 25 is located radially outside the rotor 20 and surrounds the rotor 20 from the radially outer side. The stator 25 is fixed to the inner side surface of the motor housing 6A.

[0036] The motor housing 6A houses the rotor 20 and the stator 25. The motor housing 6A has: a cylindrical portion 6d that is cylindrical about the first axis J1; and a first cover member 63 that covers an opening on the other axial side (-Y) of the cylindrical portion 6d. The cylindrical portion 6d surrounds the stator 25 from the radially outer side. The cylindrical portion 6d is a part of the housing main body 61. Figure 1 The illustrated first cover member 63 is fastened to the cylindrical portion 6d.

[0037] <Transmission mechanism>

[0038] As Figure 1 shown, the transmission mechanism 3 is located on one axial side (+Y) of the motor 2. The transmission mechanism 3 is connected to the rotor 20. The transmission mechanism 3 has a plurality of gears (not shown) that transmit the power of the rotor 20, a plurality of shafts, a differential device, a gear housing 6B that houses them, and an output shaft 55 that outputs the power of the rotor 20. The differential device absorbs the speed difference between the left and right wheels while transmitting the same torque to a pair of output shafts 55 when the vehicle turns. The output shaft 55 is capable of rotating about a second axis J3 parallel to the first axis J1. Wheels (not shown) are respectively provided on the pair of output shafts 55. In the present embodiment, the output shaft 55 is located on the other side (-D1) in the first direction with respect to the first axis J1.

[0039] <Control device>

[0040] The control device 7 controls the motor 2. The control device 7 at least has the function of an inverter. That is, the control device 7 is connected to a battery and converts the direct current provided from the battery into an alternating current. In addition, the control device 7 is connected to the stator 25 and supplies an alternating current to the stator 25. The control device 7 is located above the motor 2 and at a position on the other axial side (-Y) than the transmission mechanism 3.

[0041] As Figure 2 shown, the control device 7 of the present embodiment has a power module 11, a power integration system (first electronic component) 12, a current distribution unit (second electronic component) 13, a capacitor (second electronic component) 14, a heating device 15, and an electronic component housing 6C. In addition, the electronic components provided in the control device 7 are not limited to the above. In addition, the control device 7 may also have electronic components other than the above electronic components.

[0042] The power module 11 has, for example, a switching element, a circuit board on which the switching element is mounted, and a radiator in contact with the switching element. The switching element is, for example, an insulated gate bipolar transistor (IGBT: Insulated Gate Bipolar Transistor). Alternatively, the switching element may be a field effect transistor such as a metal oxide semiconductor field effect transistor (MOSFET; Metal-Oxide-Semiconductor Field-Effect Transistor).

[0043] The power integration system 12 has a function of voltage regulation. The power integration system 12 of the present embodiment has, for example, an on-board charger (OBC; On Board Charger) 12a and a DC / DC converter 12b. The on-board charger 12a is a system for converting an AC voltage supplied via a plug into a DC voltage and charging a battery. The DC / DC converter 12b is a part that converts the voltage supplied from the battery and charges other batteries at a low voltage. Alternatively, the power integration system 12 may have at least one of the DC / DC converter 12b and the on-board charger 12a. Further, the DC / DC converter 12b may boost the voltage supplied from the battery and supply it to other electronic components or the like.

[0044] The current distribution unit 13 is a power distribution unit (PDU: Power Distribution Unit) having a function of current distribution. The current distribution unit 13 is a part that distributes the current supplied from the battery to various electrical installations in the vehicle including the power module 11.

[0045] The capacitor 14 is, for example, a film capacitor. The capacitor 14 is connected between a battery (not shown) and the power module 11. The capacitor 14 is provided to smooth the DC current supplied to the power module 11.

[0046] The heating device 15 has a heater unit 15a and a heater control unit (control unit) 15b. A pipe P is connected to the heater unit 15a. The pipe P is a circulation path through which a fluid such as water, refrigerant, or air circulates. An external device that is the heating object of the heater unit 15a is connected in the path of the pipe P. The external device that is the heating object of the heating device 15 is, for example, a battery. The heating device 15 heats the fluid in the pipe P in the heater unit 15a and heats the battery via the fluid. The heater control unit 15b is connected to a temperature sensor (not shown) that measures the temperature of the battery. The heater control unit 15b controls the heater unit 15a based on the temperature of the battery detected by the temperature sensor. Alternatively, the heating device 15 may be used as a heater in a heating equipment.

[0047] The electronic component housing 6C houses the power module 11, the power integration system 12, the current distribution section 13, the capacitor 14, and the heater control section 15b. The electronic component housing 6C has a housing section 61A and a third lid member 64.

[0048] In this embodiment, the housing section 61A is a part of the housing main body 61. The housing section 61A and the cylindrical section 6d are respective parts of a single component. Further, the housing section 61A is located above the cylindrical section 6d and is connected to the cylindrical section 6d. That is, the housing section 61A is connected to the motor housing 6A. The housing section 61A has a first opening 61h that opens upward (+Z).

[0049] The housing section 61A has a first bottom wall section 61b, a first side wall section 61c, and a first flange section 61f. The first bottom wall section 61b extends along a plane perpendicular to the vertical direction Z. The first bottom wall section 61b is integrally connected to the cylindrical section 6d. The first bottom wall section 61b has a common wall section 61n that also functions as a part of the cylindrical section 6d. In this embodiment, the common wall section 61n is curved in a substantially arc shape centered on the central axis J. The first bottom wall section 61b has an outer surface 61g facing downward (-Z) and a first inner surface 61k facing upward (+Z). The first side wall section 61c extends upward (+Z) from the outer edge of the first bottom wall section 61b. The first flange section 61f is provided at the upper end of the first side wall section 61c. The first flange section 61f surrounds the first opening 61h in a frame shape. The first flange section 61f projects in a direction away from the first opening 61h along a plane perpendicular to the vertical direction Z.

[0050] The third lid member 64 is located above the housing section 61A. The third lid member 64 is connected to the upper side (+Z) of the housing section 61A. The third lid member 64 has a second opening 64h that opens downward (-Z). The third lid member 64 has a second bottom wall section 64b, a second side wall section 64c, and a second flange section 64f. The second bottom wall section 64b extends along a plane perpendicular to the vertical direction Z. The second bottom wall section 64b has a second inner surface 64k facing downward (-Z). The second side wall section 64c extends downward (-Z) from the outer edge of the second bottom wall section 64b. The second flange section 64f is provided at the lower end of the second side wall section 64c. The fourth flange section 64f surrounds the second opening 64h in a frame shape. The second flange section 64f projects in a direction away from the second opening 64h along a plane perpendicular to the vertical direction Z.

[0051] The first flange portion 61f and the second flange portion 64f are opposed to each other in the vertical direction Z. The first flange portion 61f and the second flange portion 64f are fastened to each other. Thereby, the housing portion 61A and the third lid member 64 are connected to each other. In addition, the third lid member 64 covers the first opening portion 61h, and the housing portion 61A covers the second opening portion 64h. Thereby, the internal space of the housing portion 61A and the internal space of the third lid member 64 are connected to form the internal space A1 of the electronic component housing 6C. A sealing member may be sandwiched between the first flange portion 61f and the second flange portion 64f.

[0052] The internal space A1 of the electronic component housing 6C is surrounded by the first bottom wall portion 61b, the second bottom wall portion 64b, the first side wall portion 61c, and the second side wall portion 64c. The first inner side surface 61k of the first bottom wall portion 61b and the second inner side surface 64k of the second bottom wall portion 64b are opposed to each other in the vertical direction Z. The power integration system 12, the current distribution portion 13, and the heater control portion 15b of the present embodiment are fixed to the first inner side surface 61k. In particular, in the present embodiment, the power integration system 12 is fixed to the common wall portion 61n. Therefore, the power integration system 12 is fixed to the cylindrical portion 6d. In addition, the power module 11 and the capacitor 14 of the present embodiment are fixed to the second inner side surface 64k. And, in the present embodiment, the heater portion 15a is fixed to the outer side surface 61g of the housing portion 61A.

[0053] In addition, in the present embodiment, a plurality of support portions 61u protruding upward (+Z) are provided on the first inner side surface 61k. The plurality of support portions 61u support the power integration system 12, the current distribution portion 13, and the heater control portion 15b, respectively. The first inner side surface 61k contacts the power integration system 12, the current distribution portion 13, and the heater control portion 15b at the upper end surfaces of the plurality of support portions 61u. Alternatively, the support portions 61u may not be provided on the first inner side surface 61k. In this case, the first inner side surface 61k directly contacts the power integration system 12, the current distribution portion 13, and the heater control portion 15b.

[0054] A flow path 90 is provided in the housing connector 6. The flow path 90 is a path through which a fluid flows. A part of the flow path 90 is constituted by a hole portion provided in the housing connector 6. In addition, another part of the flow path 90 is constituted by the inner side surface of a recess provided in the housing connector 6 and a member covering the recess. In the present specification, the flow path 90 does not necessarily represent a single circulation path and may include a plurality of circulation paths. When the flow path 90 has a plurality of circulation paths, the fluids flowing in the respective circulation paths may be the same type of fluid or different types of fluid. The fluid flowing in the flow path 90 is, for example, water, oil, or an ethylene glycol aqueous solution.

[0055] The flow path 90 of the present embodiment includes a first flow path portion 91, a connecting flow path portion 95, and a third flow path portion 94. The first flow path portion 91 and the connecting flow path portion 95 are provided in the electronic component housing 6C. The third flow path portion 94 is provided in the motor housing 6A.

[0056] In the present embodiment, the first flow path portion 91, the connecting flow path portion 95, and the third flow path portion 94 form a circulation path. Therefore, the same fluid flows in the first flow path portion 91, the connecting flow path portion 95, and the third flow path portion 94 of the present embodiment. In the present embodiment, the fluid flows through each part of the flow path 90 in the order of the first flow path portion 91, the connecting flow path portion 95, and the third flow path portion 94. In addition, the downstream end of the third flow path portion 94 and the upstream end of the first flow path portion 91 are connected to each other via a flow path portion (not shown). In addition, a pump for pumping the fluid, a radiator for cooling the fluid, etc. may be provided in this flow path portion.

[0057] The first flow path portion 91 is provided on the second bottom wall portion 64b. That is, the first flow path portion 91 is provided in the third lid member 64. The first flow path portion 91 of the present embodiment extends along the axial direction Y. However, the first flow path portion 91 only needs to extend along a plane perpendicular to the up-down direction Z and can extend in any direction. One end portion of the first flow path portion 91 opens on the lower surface of the second flange portion 64f. The first flow path portion 91 is connected to the connecting flow path portion 95 at one end portion that opens on the lower surface of the second flange portion 64f.

[0058] The first flow path portion 91 has an opening portion 91a that opens on the second inner side surface 64k of the second bottom wall portion 64b. The opening portion 91a opens downward (-Z). The power module 11 has a radiator that covers the opening portion 91a. The radiator is in contact with the fluid flowing in the first flow path portion 91. The radiator preferably has a plurality of fins or pins disposed inside the first flow path portion 91. The fluid flowing in the first flow path portion 91 cools the power module 11 by contacting the radiator. That is, the first flow path portion 91 cools the power module 11. In addition, the structure for cooling the power module 11 using the fluid flowing in the first flow path portion 91 is not limited to the present embodiment.

[0059] In the present embodiment, the first flow path portion 91 provided in the third lid member 64 has a cooling flow path portion 90A. The cooling flow path portion 90A is a region in the first flow path portion 91 that overlaps at least one of the power module 11 and the power integration system 12 in the vertical direction Z. According to the present embodiment, since the cooling flow path portion 90A overlaps the power module 11 or the power integration system 12 in the vertical direction Z, the power module 11 or the power integration system 12 can be cooled. In the present embodiment, the cooling flow path portion 90A overlaps both the power module 11 and the power integration system 12. The cooling flow path portion 90A of the present embodiment is provided on the second bottom wall portion 64b to which the power module 11 is fixed. Therefore, the cooling flow path portion 90A can effectively cool the power module 11. The cooling flow path portion 90A of the present embodiment does not directly transfer heat from the power integration system 12. However, since the cooling flow path portion 90A overlaps the power integration system 12 in the vertical direction Z, for example, by adopting a structure in which heat is easily transferred between the second bottom wall portion 64b and the power integration system 12, the power integration system 12 can be cooled. That is, since the cooling flow path portion 90A overlaps the power integration system 12 in the vertical direction Z, heat is easily transferred from the power integration system 12. As a structure in which heat is easily transferred, a structure in which a heat transfer material is disposed in the gap in the vertical direction Z between the second bottom wall portion 64b and the power integration system 12 can be adopted.

[0060] The cooling flow path portion 90A is preferably located above at least one of the power module 11 and the power integration system 12. The cooling flow path portion 90A of the present embodiment is located above both the power module 11 and the power integration system 12. As described above, the cooling flow path portion 90A is provided in the third lid member 64 that covers the internal space A1 of the electronic component housing 6C from above. Therefore, by disposing the cooling flow path portion 90A in the internal space A1 of the electronic component housing 6C and above the power module 11 and the power integration system 12 that overlap the cooling flow path portion 90A in the vertical direction Z, the structure of the cooling flow path portion 90A can be simplified.

[0061] The connection flow path portion 95 is provided in the first side wall portion 61c. That is, the connection flow path portion 95 is provided in the housing portion 61A. The connection flow path portion 95 is constituted by a hole portion provided inside the wall of the first side wall portion 61c. The connection flow path portion 95 extends along the vertical direction Z. One end portion on the upper side (+Z) of the connection flow path portion 95 opens on the surface of the first flange portion 61f facing the upper side (+Z). By fastening the first flange portion 61f and the second flange portion 64f to each other, the connection flow path portion 95 is connected to the first flow path portion 91. That is, one end portion of the connection flow path portion 95 is connected to the first flow path portion 91. In addition, the other end portion of the connection flow path portion 95 located on the lower side (-Z) is connected to the third flow path portion 94.

[0062] The third flow path portion 94 is provided in the cylindrical portion 6d. That is, the third flow path portion 94 is provided in the motor housing 6A. The third flow path portion 94 of the present embodiment extends in a spiral shape along the axial direction Y with the first axis J1 as the center. The fluid flowing in the third flow path portion 94 transfers heat from the motor 2. That is, the third flow path portion 94 cools the motor 2.

[0063] The third flow path portion 94 only needs to cool the motor 2 and is not limited to the present embodiment. The motor 2 may also extend meanderingly in the axial direction or the circumferential direction inside the wall of the cylindrical portion 6d. In addition, the third flow path portion 94 may also cool the motor 2 by directly applying fluid to the motor 2. In this case, the third flow path portion 94 may also be a structure in which ejection holes for ejecting fluid toward the motor 2 are provided on the inner wall of the motor housing 6A, a pipe or groove-shaped member disposed in the internal space of the motor housing 6A and having ejection holes for ejecting fluid toward the motor 2, and the like.

[0064] The cylindrical portion 6d of the present embodiment has a common wall portion 61n that also functions as a part of the first bottom wall portion 61b. The third flow path portion 94 passes through the inside of the common wall portion 61n. Therefore, a part of the third flow path portion 94 is provided in the first bottom wall portion 61b. Thereby, the third flow path portion 94 cools the internal space of the housing portion 61A. In addition, the power integration system 12 is fixed to the common wall portion 61n. According to the present embodiment, the third flow path portion 94 can cool the power integration system 12.

[0065] In the present embodiment, the third flow path portion 94 is connected to the first flow path portion 91 via the connection flow path portion 95. Therefore, the third flow path portion 94 of the present embodiment constitutes the same circulation path as the first flow path portion 91. According to the present embodiment, compared with the case where the third flow path portion 94 constitutes a different circulation path from the first flow path portion 91, the flow path 90 can be simplified and the entire drive device 1 can be miniaturized.

[0066] According to the present embodiment, the power module 11 and the power integration system 12 are arranged in the vertical direction Z. Therefore, compared with the case where the power module 11 and the power integration system 12 are arranged in a direction perpendicular to the vertical direction Z, the control device 7 can be miniaturized in the first direction D1.

[0067] In the present embodiment, the power module 11 and the power integration system 12 are located on the upper side (+Z) with respect to the motor 2. In addition, the power integration system 12 is located on the lower side (-Z) with respect to the power module 11. According to the present embodiment, the power module 11 can be arranged at a position farther from the motor 2 than the power integration system 12, so that the influence of the heat of the motor 2 on the operation of the power module 11 can be suppressed. Conversely, the influence of the heat of the power module 11 on the operation of the motor 2 can also be suppressed.

[0068] According to the present embodiment, the power module 11 is fixed to the third cover member 64, and the power integration system 12 is fixed to the housing portion 61A. That is, the power module 11 and the power integration system 12 can be brought into contact with different components (the third cover member 64 and the housing portion 61A) of the electronic component housing 6C, respectively. Thereby, the heat of the power module 11 and the power integration system 12 can be transferred to different components for heat dissipation, and the power module 11 and the power integration system 12 can be efficiently cooled. In addition, heat transfer from either the power module 11 or the power integration system 12 to the other can be suppressed.

[0069] According to the present embodiment, the heater control unit 15b, which is part of the heating device 15, is housed in the electronic component housing 6C. Thereby, the heater control unit 15b can be protected by the electronic component housing 6C. Also, by disposing the heater control unit 15b inside the electronic component housing 6C, it is easy to cool the heater control unit 15b through the flow path 90, and the reliability of the heating device 15 can be improved. In addition, in the present embodiment, the case where only the heater control unit 15b is housed in the electronic component housing 6C has been described. However, the same effect can be obtained even if both the heater unit 15a and the heater control unit 15b are housed in the electronic component housing 6C.

[0070] In the present embodiment, the heater unit 15a of the heating device 15 is fixed to the outer side surface of the electronic component housing 6C, rather than being disposed inside the electronic component housing 6C. According to the present embodiment, the heat of the heater unit 15a can be prevented from affecting the electronic components disposed inside the electronic component housing 6C. In addition, the heater unit 15a of the heating device 15 may be provided not only on the outer side surface of the electronic component housing 6C but also on the outer side surface of the motor housing 6A or the gear housing 6B.

[0071] In the present embodiment, the case where the cooling flow path portion 90A overlaps with both the power module 11 and the power integration system 12 in the vertical direction Z so that they can be cooled has been described. However, the cooling flow path portion 90A can also cool other electronic components instead of the power integration system 12. Here, the electronic components other than the power module 11 cooled by the cooling flow path portion 90A are referred to as the first electronic component 12. The first electronic component 12 of the present embodiment is the power integration system 12, but it can also be the current distribution portion 13 or the capacitor 14. That is, the first electronic component 12 only needs to have any one of the functions of voltage adjustment, current distribution, or capacitance. In addition, the cooling flow path portion 90A is provided in the third cover member 64, and it only needs to be a part of the flow path 90 that overlaps with any one of the power integration system 12, the current distribution portion 13, the capacitor 14, or the power module 11 in the vertical direction Z. In addition, in the present embodiment, the capacitor 14 can be replaced with the first electronic component, and the portion of the first flow path portion 91 that overlaps with the capacitor 14 can be replaced with the cooling flow path portion 90B. In this case, the cooling flow path portion 90B cools the capacitor 14. Further, the current distribution portion 13 can be replaced with the first electronic component, and the portion of the first flow path portion 91 that overlaps with the current distribution portion 13 can be replaced with the cooling flow path portion 90B.

[0072] In the present embodiment, the capacitor 14 overlaps with the power module 11 in the first direction D1. In addition, the current distribution portion 13 overlaps with the first electronic component 12 in the first direction D1. Here, the electronic components other than the power module 11 and the first electronic component 12 that have any one of the functions of voltage adjustment, current distribution, or capacitance are referred to as the second electronic components 13 and 14. The second electronic components 13 and 14 only need to have any one of the functions of voltage adjustment, current distribution, or capacitance. That is, the second electronic components 13 and 14 only need to be any one of the power integration system 12, the current distribution portion 13, and the capacitor 14. According to the present embodiment, the second electronic components 13 and 14 overlap with at least one of the power module 11 or the first electronic component 12 in the first direction D1. According to the present embodiment, the second electronic components 13 and 14 are arranged along the first direction D1 with the power module 11 or the first electronic component 12, whereby the control device 7 can be prevented from becoming large in the vertical direction Z.

[0073] In the present embodiment, the control device 7 has a plurality of second electronic components 13 and 14. The plurality of second electronic components 13 and 14 overlap with each other in the vertical direction Z. According to the present embodiment, the plurality of second electronic components 13 and 14 are arranged in the vertical direction Z, whereby the control device 7 can be prevented from becoming large in the direction perpendicular to the vertical direction Z.

[0074] In the present embodiment, the power module 11 and the power integration system 12 are preferably arranged in such a manner that they extend along a plane perpendicular to the vertical direction Z with the vertical direction Z as the thickness direction. In addition, the cooling flow path portion 90A preferably extends along a plane perpendicular to the vertical direction Z. According to the present embodiment, the power module 11 and the power integration system 12 can be overlapped and arranged in a wide range in the vertical direction Z on the cooling flow path portion 90A, and the cooling efficiency of the power module 11 and the power integration system 12 can be improved. In addition, for the same reason, the current distribution portion 13 and the capacitor 14 are also preferably arranged in such a manner that they extend along a plane perpendicular to the vertical direction Z with the vertical direction Z as the thickness direction.

[0075] <Modification Example>

[0076] Hereinafter, a modification example of the drive device will be described. In the description of each modification example described below, the same reference numerals are given to the constituent elements that are the same as those in the already described embodiment or modification example, and the description thereof is omitted.

[0077] In addition, in the following modification examples, similarly to the above-described embodiment, the case where the power integration system 12 is the first electronic component 12, and the current distribution portion 13 and the capacitor 14 are the second electronic components 13 and 14 will be described. However, the first electronic component only needs to have any one of the functions of voltage adjustment, current distribution, or capacitor, and may be any one of the power integration system 12, the current distribution portion 13, or the capacitor 14. Similarly, the second electronic component only needs to be a component having any one of the functions of voltage adjustment, current distribution, or capacitor among the electronic components other than the first electronic component, and may be any one of the power integration system 12, the current distribution portion 13, or the capacitor 14.

[0078] (Modification Example 1)

[0079] Figure 3 is a cross-sectional schematic view of the drive device 101 of Modification Example 1. Similarly to the above-described embodiment, the drive device 101 of the present modification example includes a motor 2, a transmission mechanism 3 (see Figure 1 ) and a control device 107. In addition, the drive device 101 includes a housing connection body 106. The housing connection body 106 includes a motor housing 6A, a gear housing 6B (see Figure 1 ) and an electronic component housing 106C (housing). A flow path 190 is provided in the housing connection body 106.

[0080] In the electronic component housing 106C of this modified example, a power module 11, a power integration system 12, a current distribution unit 13, a capacitor 14, and a heating device 115 are accommodated. The power module 11 and the power integration system 12 are fixed to the second inner surface 64k of the second bottom wall portion 64b. On the other hand, the current distribution unit 13, the capacitor 14, and the heating device 115 are fixed to the first inner surface 61k of the first bottom wall portion 61b.

[0081] The flow path 190 has a first flow path portion 191, a second flow path portion 192, and a connecting flow path portion 95 provided in the electronic component housing 106C, and a third flow path portion 94 provided in the motor housing 6A. The first flow path portion 191 and the second flow path portion 192 are provided in the second bottom wall portion 64b. In this modified example, the first flow path portion 191 and the second flow path portion 192 are connected to each other to form the same circulation path. However, the first flow path portion 191 and the second flow path portion 192 may also form different circulation paths.

[0082] The first flow path portion 191 of this modified example has a cooling flow path portion 190A that overlaps the power module 11 in the vertical direction Z. In addition, the second flow path portion 192 of this modified example has a cooling flow path portion 190B that overlaps the power integration system 12 in the vertical direction Z. The first flow path portion 191 can cool the power module 11, and the second flow path portion 192 can cool the power integration system 12.

[0083] The first flow path portion 191 has a first opening portion 191a that opens on the second inner surface 64k of the second bottom wall portion 64b in the same manner as in the above-described embodiment. The first opening portion 191a is covered by the power module 11. The fluid flowing in the first flow path portion 191 contacts the power module 11 at the first opening portion 191a to cool the power module 11.

[0084] The second flow path portion 192 has a second opening portion 192a that opens on the second inner surface 64k of the second bottom wall portion 64b. The second opening portion 192a is covered by the power integration system 12. The fluid flowing in the second flow path portion 192 contacts the power integration system 12 at the second opening portion 192a to cool the power integration system 12. In addition, the power integration system 12 has a heating element and a housing portion that houses the heating element. The fluid flowing in the second flow path portion 192 contacts the housing portion of the power integration system 12 and cools the heating element via the housing portion.

[0085] In this modified example, the first flow path portion 191 and the second flow path portion 192 are arranged and disposed in the first direction D1. According to this modified example, compared with the case where the first flow path portion 191 and the second flow path portion 192 are arranged to overlap in the vertical direction Z, the second bottom wall portion 64b can be made thinner, and the control device 107 can be miniaturized in the vertical direction Z.

[0086] In this modified example, the power module 11 and the power integration system 12 are arranged and configured in the first direction D1. According to this modified example, the power module 11 and the power integration system 12 are arranged and configured along the first direction D1. In this modified example, the power module 11 and the power integration system 12 are relatively large components among the electronic components of the control device 107. Therefore, by arranging and configuring the power module 11 and the power integration system 12 along the first direction D1, the control device 107 can be prevented from becoming large in the up-down direction Z.

[0087] In this modified example, both the power module 11 and the power integration system 12 are fixed to the third cover member 64. In this modified example, the heat generation amounts of the power module 11 and the power integration system 12 are relatively large among the electronic components of the control device 107. According to this modified example, the power module 11 and the power integration system 12 with large heat generation amounts can be cooled by the flow paths (the first flow path portion 191 and the second flow path portion 192) provided in the third cover member 64.

[0088] In this modified example, the capacitor 14 is fixed to the common wall portion 61n. A part of the third flow path portion 94 is provided in the common wall portion 61n. Therefore, the third flow path portion 94 can cool the capacitor 14. Additionally, the current distribution portion 13 may be fixed to the common wall portion 61n. In this case, the third flow path portion 94 can cool the current distribution portion 13.

[0089] In this modified example, the heater portion 115a and the heater control portion 115b of the heating device 115 are housed in the housing portion 61A of the electronic component housing 106C. That is, according to this modified example, the entire heating device 115 is arranged in the internal space of the electronic component housing 106C. If a part of the heating device 115 is fixed to the outer side surface of the housing connector 106, it will protrude from the outer shape of the driving device, and the driving device may become large. According to this modified example, by arranging the entire heating device 115 (i.e., the heater portion 115a and the heater control portion 115b) inside the electronic component housing 106C, miniaturization of the driving device 101 can be achieved.

[0090] (Modified Example 2)

[0091] Figure 4 It is a cross-sectional schematic view of the driving device 201 of Modified Example 2. Similar to the above-described embodiment, the driving device 201 of this modified example has a motor 2, a transmission mechanism 3 (refer to Figure 1 ) and a control device 207. Additionally, the driving device 201 has a housing connector 206. The housing connector 206 has a motor housing 6A, a gear housing 6B (refer to Figure 1) and an electronic component housing 206C (housing). A flow path 190 is provided in the housing connector 206.

[0092] In the electronic component housing 206C of this modification example, a power module 11, a power integration system 12, a current distribution unit 13, and a capacitor 14 are housed. The power module 11 and the power integration system 12 are fixed to the second inner side surface 64k of the second bottom wall portion 64b. The current distribution unit 13 is fixed to the lower surface of the power module 11. The capacitor 14 is fixed to the lower surface of the power module 11. In this modification example, the arrangements of the power module 11 and the power integration system 12 may be interchanged with each other. In this modification example, the arrangements of the current distribution unit 13 and the capacitor 14 may be interchanged with each other.

[0093] The flow path 190 has a first flow path portion 191, a second flow path portion 192, and a connecting flow path portion 95 provided in the electronic component housing 206C, and a third flow path portion 94 provided in the motor housing 6A. The first flow path portion 191 has a cooling flow path portion 190A that overlaps the power module 11 in the vertical direction Z. In addition, the second flow path portion 192 of this modification example has a cooling flow path portion 190B that overlaps the power integration system 12 in the vertical direction Z.

[0094] The power module 11 of this modification example is cooled by the first flow path portion 191. In addition, the current distribution unit 13 of this modification example is mounted on the power module 11. According to this modification example, by bringing the current distribution unit 13 into contact with the heat sink of the power module 11, the current distribution unit 13 can be cooled by the first flow path portion 191 via the heat sink of the power module 11. And the capacitor 14 of this modification example is mounted on the current distribution unit 13. According to this modification example, the capacitor 14 can be cooled by the first flow path portion 191 via the current distribution unit 13 and the power module 11.

[0095] In this modification example, the second electronic components 13, 14 (current distribution unit 13 and capacitor 14) overlap the cooling flow path portion 190A in the vertical direction Z. According to this modification example, the second electronic components 13, 14 can be brought close to the cooling flow path portion 190A, and it is easy to cool the second electronic components 13, 14 by the cooling flow path portion 190A.

[0096] In this modification example, the second electronic components 13, 14 overlap the power module 11 in the vertical direction Z. According to this modification example, the control device 207 can be miniaturized in a direction perpendicular to the vertical direction Z. In this modification example, since the plurality of second electronic components 13, 14 overlap each other in the vertical direction Z, the control device 207 can be miniaturized in a direction perpendicular to the vertical direction Z.

[0097] According to this modification example, all the electronic components (power module 11, power integration system 12, current distribution unit 13, and capacitor 14) of the control device 207 are fixed to the third cover member 64. Therefore, before assembling the third cover member 64 to the housing main body 61, the connection process between the electronic components can be completed, and the assembly process can be simplified.

[0098] (Modification Example 3)

[0099] Figure 5 is a cross-sectional schematic view of the drive device 301 of Modification Example 3. Similar to the above-described embodiment, the drive device 301 of this modification example includes a motor 2, a transmission mechanism 3 (refer to Figure 1 ), and a control device 307. In addition, the drive device 301 includes a housing connector 306. The housing connector 306 includes a motor housing 6A, a gear housing 6B (refer to Figure 1 ), and an electronic component housing 306C (housing). A flow path 390 is provided in the housing connector 306.

[0100] In the electronic component housing 306C of this modification example, the power module 11, the power integration system 12, the current distribution unit 13, and the capacitor 14 are housed. The power integration system 12 and the current distribution unit 13 are fixed to the second inner surface 64k of the second bottom wall portion 64b. The power module 11 is fixed to the lower surface of the power integration system 12. That is, the power module 11 is disposed below the power integration system 12. The capacitor 14 is fixed to the lower surface of the current distribution unit 13. In this modification example, the arrangements of the power module 11 and the power integration system 12 may be swapped with each other. In this modification example, the arrangements of the current distribution unit 13 and the capacitor 14 may be swapped with each other.

[0101] The flow path 390 includes a first flow path portion 391 provided in the electronic component housing 306C, a connection flow path portion 95, and a third flow path portion 94 provided in the motor housing 6A. In this modification example, the first flow path portion 391 includes a cooling flow path portion 390A that overlaps the power module 11 and the power integration system 12 in the vertical direction Z.

[0102] Similar to the above-described embodiment, the first flow path portion 391 of this modification example has an opening portion 391a that opens on the second inner surface 64k. The opening portion 391a is covered by the power integration system 12. Thus, the power integration system 12 is cooled by the first flow path portion 391. In addition, the power module 11 is mounted on the power integration system 12. According to this modification example, the power module 11 can be cooled by the first flow path portion 391 via the housing portion of the power integration system 12.

[0103] In this modified example, a part of the first flow path portion 391 overlaps with the current distribution portion 13 in the vertical direction Z. The current distribution portion 13 is cooled by the first flow path portion 391. In addition, the capacitor 14 mounted on the current distribution portion 13 is cooled by the first flow path portion 391 via the current distribution portion 13.

[0104] In this modified example, the current distribution portion 13 among the plurality of second electronic components 13, 14 (the current distribution portion 13 and the capacitor 14) overlaps with the power integration system 12 in the first direction D1. In addition, the capacitor 14 among the plurality of second electronic components 13, 14 overlaps with the power module 11 in the first direction D1. Therefore, according to this modified example, the control device 307 can be miniaturized in the vertical direction Z. In this modified example, the plurality of second electronic components 13, 14 overlap with each other in the vertical direction Z, so the control device 307 can be miniaturized in the direction perpendicular to the vertical direction Z.

[0105] In this embodiment, the power module 11 and the power integration system 12 are arranged on the upper side (+Z) with respect to the motor 2. In addition, the power module 11 is arranged on the lower side (-Z) with respect to the power integration system 12. The power module 11 is connected to the motor 2 and supplies power to the motor 2. Therefore, if the distance between the power module 11 and the motor 2 increases, the resistance of the connection path (for example, the bus bar) connecting the power module 11 and the motor 2 increases, and the loss during driving of the drive device 1 may increase. According to this embodiment, the power module 11 can be arranged closer to the motor 2 than the power integration system 12, so the resistance of the connection path between the power module 11 and the motor 2 can be reduced, and the loss generated in the drive device 1 can be reduced.

[0106] (Modified Example 4)

[0107] Figure 6 is a cross-sectional schematic view of the drive device 401 of Modified Example 4. Similar to the above-described embodiment, the drive device 401 of this modified example includes a motor 2, a transmission mechanism 3 (refer to Figure 1 ), and a control device 407. In addition, the drive device 401 includes a housing connection body 406. The housing connection body 406 includes a motor housing 6A, a gear housing 6B (refer to Figure 1 ), and an electronic component housing 406C (housing). A flow path 490 is provided in the housing connection body 406.

[0108] The electronic component housing 406C of this modification example includes a housing portion 61A and a third cover member 464. In addition, the third cover member 464 includes a cover main body 464A and a flow path member (wall portion) 465. The cover main body 464A is located above the first opening 61h of the housing portion 61A and is fixed to the housing portion 61A. In addition to the second bottom wall portion 64b, the second side wall portion 64c, and the second flange portion 64f that are the same as those in the above-described embodiment, the cover main body 464A further includes a plurality of support pillar portions 464d. The support pillar portions 464d extend downward (-Z) from the second inner surface 64k of the second bottom wall portion 64b. The flow path member 465 is mounted at the lower end portion of the support pillar portions 464d. That is, the flow path member 465 is fixed to the cover main body 464A.

[0109] The flow path member 465 is in a plate shape extending along a plane perpendicular to the vertical direction Z. The flow path member 465 is a so-called water jacket. The flow path member 465 is located between the first bottom wall portion 61b and the second bottom wall portion 64b in the vertical direction Z. The flow path member 465 is opposed to the first inner surface 61k with a gap therebetween in the vertical direction Z. In addition, the flow path member 465 is opposed to the second inner surface 64k with a gap therebetween in the vertical direction Z. The flow path member 465 is located below the cover main body 464A and above the housing portion 61A.

[0110] The power module 11, the power integration system 12, the current distribution portion 13, and the capacitor 14 are housed in the electronic component housing 406C of this modification example. The power module 11 is fixed to the second inner surface 64k of the second bottom wall portion 64b. The power integration system 12 is fixed to the upper surface of the flow path member 465. The capacitor 14 is fixed to the upper surface of the power integration system 12. The current distribution portion 13 is fixed to the upper surface of the capacitor 14. And, the upper surface of the current distribution portion 13 is in contact with the second bottom wall portion 64b. The current distribution portion 13 and the second bottom wall portion 64b may also be in contact via a heat transfer material such as a heat transfer sheet. In this modification example, the arrangements of the current distribution portion 13 and the capacitor 14 may be swapped with each other.

[0111] The flow path 490 of this modification example further includes an internal flow path portion (first flow path portion) 491 in addition to the first flow path portion 391, the connection flow path portion 95, and the third flow path portion 94 that are the same as those in the above-described embodiment or modification example. The first flow path portion 391, the connection flow path portion 95, and the internal flow path portion 491 are provided in the electronic component housing 406C. The third flow path portion 94 is provided in the motor housing 6A.

[0112] In this modification example, the first flow path portion 391 includes a cooling flow path portion 490A that overlaps with the power module 11 in the vertical direction Z and a cooling flow path portion 490C that overlaps with the power integration system 12 in the vertical direction Z. The cooling flow path portion 490A has an opening portion 391a covered by the power module 11.

[0113] The internal flow path portion 491 extends meanderingly inside the flow path component 465. That is, the internal flow path portion 491 is provided in the third cover component 464. The fluid cooled by a radiator (not shown) flows in the internal flow path portion 491. The internal flow path portion 491 has a cooling flow path portion 490B that overlaps with the power integration system 12 in the vertical direction Z. The power integration system 12 contacts the upper surface of the flow path component 465. The internal flow path portion 491 cools the power integration system 12. According to this modification example, the power integration system 12 can be effectively cooled using the plate-shaped flow path component 465.

[0114] In this modification example, since the current distribution portion 13 contacts the second bottom wall portion 64b, it is cooled by the first flow path portion 391 passing through the inside of the second bottom wall portion 64b. In addition, the capacitor 14 contacts the current distribution portion 13 on the upper surface and contacts the power module 11 on the lower surface. Therefore, the capacitor 14 is cooled by the first flow path portion 391 via the current distribution portion 13 and is cooled by the internal flow path portion 491 via the power module 11.

[0115] In this modification example, the power integration system 12, the current distribution portion 13, and the capacitor 14 are arranged between the cover main body 464A and the flow path component 465 in the vertical direction Z. And, a cooling flow path portion 490B is provided in the flow path component 465. That is, the cooling flow path portion 490B is located below the power integration system 12. According to this modification example, the heat of the electronic components (the power integration system 12, the current distribution portion 13, and the capacitor 14) arranged between the cover main body 464A and the flow path component 465 can be transferred to the cover main body 464A and the flow path component 465, and the temperature of these electronic components can be prevented from becoming too high. In this modification example, the power module 11 is not arranged between the cover main body 464A and the flow path component 465, but the power module 11 may also be arranged between the cover main body 464A and the flow path component 465. That is, in the vertical direction Z, the power module 11 or the first electronic component 12 (the power integration system 12) is arranged between the cover main body 464A and the flow path component 465. If a cooling flow path portion 490B is provided in the flow path component 465, the power module 11 or the first electronic component 12 can be cooled.

[0116] In particular, in this modified example, the power integration system 12, the current distribution unit 13, and the capacitor 14 are arranged in the vertical direction Z between the cooling flow path portion 490C of the first flow path portion 391 and the cooling flow path portion 490B of the internal flow path portion 491. Therefore, the flow path 490 can cool the power integration system 12, the current distribution unit 13, and the capacitor 14 from the vertical direction Z. In addition, in this modified example, the power module 11 is not arranged between the first flow path portion 391 and the internal flow path portion 491, but the power module 11 may also be arranged between the first flow path portion 391 and the internal flow path portion 491. That is, as long as the power module 11 or the first electronic component 12 (power integration system 12) is arranged between the first flow path portion 391 and the internal flow path portion 491 in the vertical direction Z.

[0117] In this modified example, the cooling flow path portion 490B and the power module 11 overlap in the first direction D1. Therefore, the control device 407 can be prevented from becoming large in the vertical direction Z. In this modified example, the cooling flow path portion 490B of the flow path component 465 overlaps with the power integration system 12 in the vertical direction Z and overlaps with the power module 11 in the first direction D1. However, the cooling flow path portion 490B may also overlap with the power module 11 in the vertical direction Z and overlap with the power integration system 12 in the first direction D1. If the cooling flow path portion 490B overlaps with at least one of the power module 11 or the first electronic component 12 (power integration system 12) in the first direction D1, the control device 407 can be miniaturized in the vertical direction Z.

[0118] In this modified example, the plurality of second electronic components 13, 14 (current distribution unit 13 and capacitor 14) overlap with the power integration system 12 in the vertical direction Z. According to this modified example, the control device 407 can be miniaturized in the direction perpendicular to the vertical direction Z. In this modified example, the plurality of second electronic components 13, 14 overlap with the power module 11 in the first direction D1. According to this modified example, the control device 407 can be miniaturized in the vertical direction Z. In this modified example, the plurality of second electronic components 13, 14 overlap with each other in the vertical direction Z. According to this modified example, the control device 407 can be miniaturized in the direction perpendicular to the vertical direction Z.

[0119] (Modified Example 5)

[0120] Figure 7 It is a cross-sectional schematic view of the drive device 501 of Modified Example 5. Similar to the above-described embodiment, the drive device 501 of this modified example includes a motor 2, a transmission mechanism 3 (refer to Figure 1 ) and a control device 507. In addition, the drive device 501 includes a housing connecting body 506. The housing connecting body 506 includes a motor housing 6A, a gear housing 6B (refer to Figure 1) and an electronic component housing 506C (housing). A flow path 590 is provided in the housing connector 506.

[0121] The electronic component housing 506C of this modification has a housing portion 61A and a third cover member 564. Further, the third cover member 564 has a cover body 564A and a flow path member 465. The cover body 564A has, in addition to the second bottom wall portion 64b, the second side wall portion 64c, and the second flange portion 64f that are the same as those in the above-described embodiment, a plurality of support column portions 564d. The support column portions 564d extend downward (-Z) from the second inner side surface 64k of the second bottom wall portion 64b. The flow path member 465 is attached to the lower end portion of the support column portions 564d. The flow path member 465 is located between the first bottom wall portion 61b and the second bottom wall portion 64b in the vertical direction Z. The flow path member 465 faces the first inner side surface 61k with a gap therebetween in the vertical direction Z. Further, the flow path member 465 faces the second inner side surface 64k with a gap therebetween in the vertical direction Z.

[0122] In the electronic component housing 506C of this modification, a power module 11, a power integration system 12, a current distribution portion 13, and a capacitor 14 are housed. The power integration system 12 is fixed to the second inner side surface 64k of the second bottom wall portion 64b. The power module 11 is fixed to the upper surface of the flow path member 465. The capacitor 14 is fixed to the upper surface of the power module 11. The current distribution portion 13 is fixed to the upper surface of the capacitor 14. And, the upper surface of the current distribution portion 13 is in contact with the second bottom wall portion 64b. The current distribution portion 13 and the second bottom wall portion 64b may also be in contact via a heat transfer material such as a heat transfer sheet. According to this modification, heat of the current distribution portion 13 can be transferred to the third cover member 564 for heat dissipation. In this modification, the arrangements of the power module 11 and the power integration system 12 may be swapped with each other. In this modification, the arrangements of the current distribution portion 13 and the capacitor 14 may be swapped with each other.

[0123] The flow path 590 of this modification has an internal flow path portion 491 provided inside the electronic component housing 506C and a third flow path portion 94 provided in the motor housing 6A. The internal flow path portion 491 extends meanderingly inside the flow path member 465. The internal flow path portion 491 is provided in the third cover member 564. The internal flow path portion 491 has a cooling flow path portion 590A that overlaps the power module 11 in the vertical direction Z. The power module 11 is in contact with the upper surface of the flow path member 465. The cooling flow path portion 590A is located below the power module 11. The internal flow path portion 491 cools the power module 11. According to this modification, the power module 11 can be effectively cooled using the plate-shaped flow path member 465. Further, since the capacitor 14 is in contact with the power module 11 on the lower surface, the capacitor 14 is cooled by the internal flow path portion 491 via the power module 11.

[0124] In this modification example, a power module 11, a current distribution unit 13, and a capacitor 14 are disposed between the lid main body 564A and the flow path component 465 in the vertical direction Z. Further, a cooling flow path unit 590A is provided in the flow path component 465. According to this modification example, heat of the electronic components (the power module 11, the current distribution unit 13, and the capacitor 14) disposed between the lid main body 564A and the flow path component 465 can be transferred to the lid main body 564A and the flow path component 465, and it is possible to suppress the temperature of these electronic components from becoming excessively high.

[0125] In this modification example, a plurality of second electronic components 13, 14 (the current distribution unit 13 and the capacitor 14) overlap the power module 11 in the vertical direction Z. According to this modification example, the control device 507 can be miniaturized in a direction perpendicular to the vertical direction Z. In this modification example, the plurality of second electronic components 13, 14 overlap each other in the vertical direction Z. According to this modification example, the control device 507 can be miniaturized in a direction perpendicular to the vertical direction Z.

[0126] (Modification Example 6)

[0127] Figure 8 is a cross-sectional schematic view of the drive device 601 of Modification Example 6. Similarly to the above-described embodiment, the drive device 601 of this modification example includes a motor 2 and a transmission mechanism 3 (see Figure 1 ). Further, the drive device 601 includes a housing connection body 606. The housing connection body 606 includes a motor housing 6A, a gear housing 6B (see Figure 1 ) and an electronic component housing 606C (housing). A flow path 690 is provided in the housing connection body 606.

[0128] The electronic component housing 606C of this modification example includes a housing portion 61A and a third lid member 664. Further, the third lid member 664 includes a lid main body 664A and a flow path component 465. In addition to having the same second bottom wall portion 64b, second side wall portion 64c, and second flange portion 64f as those of the above-described embodiment, the lid main body 664A includes a plurality of support column portions 664d. The support column portions 664d extend downward (-Z) from the second inner side surface 64k of the second bottom wall portion 64b. The flow path component 465 is attached to the lower end portion of the support column portion 664d. The flow path component 465 is located between the first bottom wall portion 61b and the second bottom wall portion 64b in the vertical direction Z. The flow path component 465 faces the first inner side surface 61k with a gap therebetween in the vertical direction Z. Further, the flow path component 465 faces the second inner side surface 64k with a gap therebetween in the vertical direction Z.

[0129] In the electronic component housing 606C of this modification example, a power module 11, a power integration system 12, a current distribution unit 13, and a capacitor 14 are accommodated. The power integration system 12 and the current distribution unit 13 are fixed to the second inner side surface 64k of the second bottom wall portion 64b. The power integration system 12 and the current distribution unit 13 are arranged and disposed in the first direction D1. In addition, the current distribution unit 13 is located above the flow path component 465. The current distribution unit 13 and the flow path component 465 may be in direct contact with each other or in contact with each other via a heat transfer material. The power module 11 is fixed to the lower surface of the flow path component 465. The capacitor 14 is fixed to the lower surface of the power module 11. In this modification example, the arrangements of the power module 11 and the power integration system 12 may be swapped with each other. In this modification example, the arrangements of the current distribution unit 13 and the capacitor 14 may be swapped with each other.

[0130] The flow path 690 of this modification example has an internal flow path portion 491 provided in the electronic component housing 606C and a third flow path portion 94 provided in the motor housing 6A. The internal flow path portion 491 extends meanderingly inside the flow path component 465. The internal flow path portion 491 is provided in the third cover member 664. The internal flow path portion 491 has a cooling flow path portion 690A that overlaps the power module 11 in the vertical direction Z. The power module 11 is in contact with the lower surface of the flow path component 465. The cooling flow path portion 690A is located above the power module 11. The internal flow path portion 491 cools the power module 11. According to this modification example, the power module 11 can be effectively cooled by using the plate-shaped flow path component 465. In addition, since the capacitor 14 is in contact with the power module 11 on the lower surface, the capacitor 14 is cooled by the internal flow path portion 491 via the power module 11.

[0131] In this modification example, the current distribution unit 13 is disposed between the cover main body 664A and the flow path component 465 in the vertical direction Z. And a cooling flow path portion 690A is provided in the flow path component 465. According to this modification example, the heat of the current distribution unit 13 disposed between the cover main body 664A and the flow path component 465 can be transferred to the cover main body 664A and the flow path component 465, thereby suppressing the temperature of the current distribution unit 13 from becoming too high.

[0132] In this modified example, a plurality of second electronic components 13, 14 (current distribution unit 13 and capacitor 14) overlap the power module 11 in the vertical direction Z. According to this modified example, the control device 607 can be miniaturized in the direction perpendicular to the vertical direction Z. In this modified example, the current distribution unit 13 among the plurality of second electronic components 13, 14 overlaps the power integration system 12 in the first direction D1. According to this modified example, the control device 607 can be miniaturized in the vertical direction Z. In this modified example, the plurality of second electronic components 13, 14 overlap each other in the vertical direction Z. According to this modified example, the control device 607 can be miniaturized in the direction perpendicular to the vertical direction Z.

[0133] (Modified Example 7)

[0134] Figure 9 is a cross-sectional schematic view of the drive device 701 of Modified Example 7. Similar to the above-described embodiment, the drive device 701 of this modified example includes a motor 2 and a transmission mechanism 3 (refer to Figure 1 ).) and a control device 707. In addition, the drive device 701 includes a housing connector 706. The housing connector 706 includes a motor housing 6A, a gear housing 6B (refer to Figure 1 ).) and an electronic component housing 706C (housing). A flow path 790 is provided in the housing connector 706.

[0135] The electronic component housing 706C of this modified example includes a housing portion 61A and a third cover member 764. In addition, the third cover member 764 includes a cover main body 764A and a flow path member 465. The cover main body 764A includes a second bottom wall portion 764b, second side wall portions 64c, a second flange portion 64f, and a plurality of support pillar portions 764d.

[0136] The second bottom wall portion 764b of this modified example includes a first bottom plate portion 764g, a second bottom plate portion 764n, and a first step portion 764m. The first bottom plate portion 764g and the second bottom plate portion 764n are plate-shaped and extend along a plane perpendicular to the vertical direction Z. A first flow path portion 91 is provided in the first bottom plate portion 764g. The second bottom plate portion 764n is located below (-Z) the first bottom plate portion 764g and on the other side (-D1) in the first direction. The first step portion 764m connects the first bottom plate portion 764g and the second bottom plate portion 764n.

[0137] The support pillar portions 764d extend downward (-Z) from the first bottom plate portion 764g. The flow path member 465 is installed at the lower end portions of the support pillar portions 764d.

[0138] In the electronic component housing 706C of this modification example, a power module 11, a power integration system 12, a current distribution unit 13, and a capacitor 14 are housed. In this modification example, the power module 11 is fixed to the lower surface of the first bottom plate portion 764g. In addition, the power module 11 is in direct contact with the upper surface of the flow path component 465 or in contact via a heat transfer material. The power integration system 12 is fixed to the lower surface of the flow path component 465. The current distribution unit 13 and the capacitor 14 are fixed to the lower surface of the second bottom plate portion 764n. The current distribution unit 13 and the capacitor 14 are arranged and configured in the first direction D1. In this modification example, the arrangements of the power module 11 and the power integration system 12 may be swapped with each other. In this modification example, the arrangements of the current distribution unit 13 and the capacitor 14 may be swapped with each other.

[0139] The flow path 790 has a first flow path portion 91 provided in the electronic component housing 706C, a connecting flow path portion 95, and an internal flow path portion 491, and a third flow path portion 94 provided in the motor housing 6A. The first flow path portion 91 has a cooling flow path portion 790A that overlaps with the power module 11 and the power integration system 12 in the vertical direction Z. The cooling flow path portion 790A cools the power module 11 that is in contact with the second bottom wall portion 764b.

[0140] The internal flow path portion 491 extends meanderingly inside the flow path component 465. The internal flow path portion 491 has a cooling flow path portion 790B that overlaps with the power module 11 and the power integration system 12 in the vertical direction Z. The cooling flow path portion 790B cools the power module 11 and the power integration system 12 that are in contact with the flow path component 465.

[0141] In this modification example, the power module 11 is disposed between the cover main body 764A and the flow path component 465 in the vertical direction Z. And a cooling flow path portion 790B is provided in the flow path component 465. According to this modification example, the heat of the power module 11 disposed between the cover main body 764A and the flow path component 465 can be transferred to the cover main body 764A and the flow path component 465, and the temperature of the power module 11 can be prevented from becoming too high. Especially in this modification example, the power module 11 is disposed between the two cooling flow path portions 790A and 790B in the vertical direction Z. Thus, the power module 11 is effectively cooled from both sides in the vertical direction Z by the two cooling flow path portions 790A and 790B.

[0142] In this modification example, a plurality of second electronic components 13 and 14 overlap with the cooling flow path portion 790B in the first direction D1. According to this modification example, the control device 707 can be miniaturized in the vertical direction Z. In this modification example, a plurality of second electronic components 13 and 14 overlap with the power module 11 in the first direction D1. According to this modification example, the control device 707 can be miniaturized in the vertical direction Z. In this modification example, a plurality of second electronic components 13 and 14 overlap with each other in the first direction D1. According to this modification example, the control device 707 can be miniaturized in the vertical direction Z.

[0143] (Modification Example 8)

[0144] Figure 10 is a cross-sectional schematic view of the drive device 801 of Modification Example 8. Similar to the above-described embodiment, the drive device 801 of this modification example includes a motor 2 and a transmission mechanism 3 (see Figure 1 ), and a control device 807. In addition, the drive device 801 includes a housing connecting body 806. The housing connecting body 806 includes a motor housing 6A, a gear housing 6B (see Figure 1 ), and an electronic component housing 806C (housing). A flow path 890 is provided in the housing connecting body 806.

[0145] The electronic component housing 806C of this modification example includes a housing portion 61A and a third cover member 864. In addition, the third cover member 864 includes a cover main body 864A and a flow path member 465. The cover main body 864A includes a plurality of support column portions 864d in addition to the second side wall portion 64c and the second flange portion 64f. The support column portions 864d extend downward (-Z) from the second bottom wall portion 64b. The flow path member 465 is mounted at the lower end portion of the support column portions 864d.

[0146] In the electronic component housing 806C of this modification example, a power module 11, a power integration system 12, a current distribution portion 13, and a capacitor 14 are housed. In this modification example, the current distribution portion 13 is fixed to the lower surface of the second bottom wall portion 64b. The power integration system 12 is fixed to the upper surface of the flow path member 465. The power module 11 is fixed to the lower surface of the flow path member 465. The capacitor 14 is fixed to the upper surface of the first bottom wall portion 61b. In this modification example, the current distribution portion 13, the power integration system 12, the power module 11, and the capacitor 14 are arranged and configured in the vertical direction Z. In this modification example, the arrangements of the power module 11 and the power integration system 12 may be swapped with each other. In this modification example, the arrangements of the current distribution portion 13 and the capacitor 14 may be swapped with each other.

[0147] The flow path 890 has an internal flow path portion 491 and a third flow path portion 94. The internal flow path portion 491 extends meanderingly inside the flow path component 465. The internal flow path portion 491 has a cooling flow path portion 890A that overlaps the power module 11 and the power integration system 12 in the vertical direction Z. The cooling flow path portion 890A cools the power module 11 and the power integration system 12 that are in contact with the flow path component 465.

[0148] In this modification example, the power integration system 12 is disposed between the cover main body 864A and the flow path component 465 in the vertical direction Z. According to this modification example, it is easy for the heat of the power integration system 12 disposed between the cover main body 864A and the flow path component 465 to be transferred to the cover main body 864A and the flow path component 465, and it is possible to suppress the temperature of the power integration system 12 from becoming too high.

[0149] In this modification example, a plurality of second electronic components 13, 14 overlap the cooling flow path portion 890A in the vertical direction Z. According to this modification example, it is possible to miniaturize the control device 807 in a direction perpendicular to the vertical direction Z. In this modification example, a plurality of second electronic components 13, 14 overlap the power module 11 and the power integration system 12 in the vertical direction Z. According to this modification example, it is possible to miniaturize the control device 807 in a direction perpendicular to the vertical direction Z. In this modification example, a plurality of second electronic components 13, 14 overlap each other in the vertical direction Z. According to this modification example, it is possible to miniaturize the control device 807 in a direction perpendicular to the vertical direction Z.

[0150] The capacitor 14 of this modification example is fixed to the common wall portion 61n. A part of the third flow path portion 94 is provided in the common wall portion 61n. Therefore, the third flow path portion 94 can cool the capacitor 14.

[0151] (Modification Example 9)

[0152] Figure 11 is a cross-sectional schematic view of the drive device 901 of Modification Example 9. Similarly to the above-described embodiment, the drive device 901 of this modification example has a motor 2, a transmission mechanism 3 (refer to Figure 1 ) and a control device 907. In addition, the drive device 901 has a housing connection body 906. The housing connection body 906 has a motor housing 6A, a gear housing 6B (refer to Figure 1 ) and an electronic component housing 906C (housing). A flow path 990 is provided in the housing connection body 906.

[0153] In the electronic component housing 906C of this modification example, a power module 11, a power integration system 12, a current distribution unit 13, a capacitor 14, and a heating device 115 are housed. The power integration system 12 and the capacitor 14 are fixed to the second inner side surface 64k of the second bottom wall portion 64b. On the other hand, the power module 11, the current distribution unit 13, and the heating device 115 are fixed to the first inner side surface 61k of the first bottom wall portion 61b.

[0154] The flow path 990 has a first flow path portion 91, a connecting flow path portion 95, and a third flow path portion 94. The first flow path portion 91 is provided on the second bottom wall portion 64b. The first flow path portion 91 has a cooling flow path portion 990A that overlaps the power module 11 and the power integration system 12 in the vertical direction Z. Therefore, the first flow path portion 91 cools the power integration system 12. In addition, the first flow path portion 91 can cool the power module 11.

[0155] In this modification example, the power module 11 and the power integration system 12 overlap in the vertical direction Z. According to this modification example, the power module 11 and the power integration system 12 are arranged along the first direction D1, thereby suppressing the enlargement of the control device 907 in the direction perpendicular to the vertical direction Z.

[0156] According to this modification example, the power module 11 is fixed to the housing portion 61A, and the power integration system 12 is fixed to the third cover member 64. According to this modification example, the heat of the power module 11 can be dissipated through the housing portion 61A, and the heat of the power integration system 12 can be dissipated through the third cover member 64.

[0157] The power module 11 of this modification example is fixed to the common wall portion 61n. A part of the third flow path portion 94 is provided on the common wall portion 61n. Therefore, the third flow path portion 94 can cool the power module 11.

[0158] (Modification Example 10)

[0159] Figure 12 It is a cross-sectional schematic view of the drive device 1001 of Modification Example 10. Similar to the above-described embodiment, the drive device 1001 of this modification example has a motor 2, a transmission mechanism 3 (refer to Figure 1 ) and a control device 1007. In addition, the drive device 1001 has a housing connection body 1006. The housing connection body 1006 has a motor housing 6A, a gear housing 6B (refer to Figure 1 ) and an electronic component housing 1006C (housing). A flow path 1090 is provided in the housing connection body 1006.

[0160] The electronic component housing 1006C of this modification example includes a housing portion 61A, a third lid member (lid portion) 1064, and a fourth lid member 1065. The third lid member 1064 is located above the housing portion 61A and covers the first opening 61h. The third lid member 1064 has a second opening 1064h that opens upward (+Z).

[0161] The third lid member 1064 includes a second bottom wall portion 1064b, second side wall portions 1064c, a second flange portion 1064d, and a third flange portion 1064f. The second bottom wall portion 1064b extends along a plane perpendicular to the vertical direction Z. The second bottom wall portion 1064b covers the first opening 61h of the housing portion 61A. The second bottom wall portion 1064b divides the internal space of the housing portion 61A and the internal space of the third lid member 1064. The second bottom wall portion 1064b has a second inner surface 1064k facing downward (-Z) and a third inner surface 1064s facing upward (+Z). The second side wall portions 1064c extend upward (+Z) from the outer edge of the second bottom wall portion 1064b.

[0162] The second flange portion 1064d is disposed in the same plane as the second bottom wall portion 1064b. The second flange portion 1064d is provided at the lower end of the second side wall portions 1064c. The second flange portion 1064d faces the first flange portion 61f in the vertical direction Z. The second flange portion 1064d is fastened to the first flange portion 61f. A sealing member may also be sandwiched between the first flange portion 61f and the second flange portion 1064d.

[0163] The third flange portion 1064f is provided at the upper end of the second side wall portions 1064c. The third flange portion 1064f surrounds the second opening 1064h in a frame shape. The third flange portion 1064f projects in a direction away from the second opening 1064h along a plane perpendicular to the vertical direction Z. The fourth lid member 1065 is fastened to the third flange portion 1064f.

[0164] The fourth lid member 1065 is in the shape of a plate extending along a plane perpendicular to the first direction D1. The fourth lid member 1065 is fastened to the third flange portion 1064f. Thereby, the fourth lid member 1065 covers the second opening 1064h. A sealing member may also be sandwiched between the third flange portion 1064f and the fourth lid member 1065.

[0165] The electronic component housing 1006C houses the power module 11, the power integration system 12, the current distribution section 13, the capacitor 14, and the heating device 115. The internal space of the electronic component housing 1006C has a first housing space B1 and a second housing space B2. The first housing space B1 is surrounded by the housing section 61A and the third cover member 1064. The power module 11, the capacitor 14, and the heating device 115 are arranged in the first housing space B1. The power module 11, the capacitor 14, and the heating device 115 are fixed to the second inner side surface 1064k. The second housing space B2 is surrounded by the third cover member 1064 and the fourth cover member 1065. The power integration system 12 and the current distribution section 13 are arranged in the second housing space B2. The power integration system 12 and the current distribution section 13 are fixed to the third inner side surface 1064s. That is, all the electronic components (the power module 11, the capacitor 14, the heating device 115, the power integration system 12, and the current distribution section 13) of the control device 1007 are fixed to the second bottom wall section 1064b.

[0166] The flow path 1090 of this modification example has a cooling flow path section 1090A, a connection flow path section 95, and a third flow path section 94. In addition, the cooling flow path section 1090A has a first flow path section 1091 and a second flow path section 1092. The cooling flow path section 1090A overlaps with the power module 11 and the power integration system 12 in the vertical direction Z. In addition, the cooling flow path section 1090A is arranged between the power module 11 and the power integration system 12. The cooling flow path section 1090A can cool the power module 11 and the power integration system 12 simultaneously. In particular, the cooling flow path section 1090A of this modification example is provided on the second bottom wall section 1064b to which the power module 11 and the power integration system 12 are fixed. Therefore, the cooling flow path section 1090A can directly cool the power module 11 and the power integration system 12. In addition, other electronic components (the current distribution section 13, the capacitor 14, and the heating device 115) are fixed to the second bottom wall section 1064b. The fluid flowing in the cooling flow path section 1090A cools the second bottom wall section 1064b, whereby other electronic components (the current distribution section 13, the capacitor 14, and the heating device 115) can be indirectly cooled.

[0167] The first flow path section 1091 and the second flow path section 1092 of this modification example are arranged side by side in the vertical direction Z. The first flow path section 1091 is located on the lower side (-Z) with respect to the second flow path section 1092. The first flow path section 1091 cools the power module 11. The second flow path section 1092 cools the power integration system 12.

[0168] The first flow path section 1091 and the second flow path section 1092 are connected to each other. Therefore, the first flow path section 1091 and the second flow path section 1092 constitute a circulating flow path, and the same fluid flows through them. Therefore, the structure of the flow path 1090 including the first flow path section 1091 and the second flow path section 1092 can be simplified. In addition, the first flow path section 1091 and the second flow path section 1092 may also be parts of separate independent circulating flow paths. In this case, different fluids may flow through the first flow path section 1091 and the second flow path section 1092 respectively.

[0169] In this modification, the power module 11, the first flow path section 1091, the second flow path section 1092, and the power integration system 12 are arranged in the vertical direction Z. Therefore, it is possible to suppress the enlargement of the control device 1007 in the direction perpendicular to the vertical direction Z.

[0170] (Modification 11)

[0171] Figure 13 is a cross-sectional schematic view of the drive device 1101 of Modification 11. Similar to the above-described embodiment, the drive device 1101 of this modification has a motor 2, a transmission mechanism 3 (refer to Figure 1 ), and a control device 1107. In addition, the drive device 1101 has a housing connector 1106. The housing connector 1106 has a motor housing 6A, a gear housing 6B (refer to Figure 1 ), and an electronic component housing 1106C (housing). A flow path 1190 is provided in the housing connector 1106.

[0172] The electronic component housing 1106C houses the power module 11, the power integration system 12, the current distribution section 13, the capacitor 14, and the heating device 115. The power module 11, the capacitor 14, and the heating device 115 are fixed to the second inner side surface 1064k. The power integration system 12 and the current distribution section 13 are fixed to the third inner side surface 1064s. That is, all the electronic components (the power module 11, the capacitor 14, the heating device 115, the power integration system 12, and the current distribution section 13) of the control device 1107 are fixed to the second bottom wall portion 1064b.

[0173] The flow path 1190 of this modification example has a cooling flow path portion 1190A. Additionally, the cooling flow path portion 1190A has a first flow path portion 1191 and a second flow path portion 1192. The cooling flow path portion 1190A overlaps with the power module 11 and the power integration system 12 in the vertical direction Z. Additionally, the cooling flow path portion 1190A is disposed between the power module 11 and the power integration system 12. The cooling flow path portion 1190A can cool the power module 11 and the power integration system 12 simultaneously. In particular, the cooling flow path portion 1190A of this modification example is provided on the second bottom wall portion 1064b to which the power module 11 and the power integration system 12 are fixed. Additionally, other electronic components (current distribution portion 13, capacitor 14, and heating device 115) are fixed to the second bottom wall portion 1064b. The fluid flowing in the cooling flow path portion 1190A cools the second bottom wall portion 1064b, thereby indirectly cooling other electronic components (current distribution portion 13, capacitor 14, and heating device 115).

[0174] The first flow path portion 1191 and the second flow path portion 1192 of this modification example are arranged and configured in the first direction D1. The first flow path portion 1191 cools the power module 11. The second flow path portion 1192 cools the power integration system 12.

[0175] The first flow path portion 1191 and the second flow path portion 1192 are connected to each other. Therefore, the first flow path portion 1191 and the second flow path portion 1192 form a single circulation flow path, and the same fluid flows through them. Therefore, the structure of the flow path 1190 including the first flow path portion 1191 and the second flow path portion 1192 can be simplified.

[0176] In this modification example, the first flow path portion 1191 and the second flow path portion 1192 are arranged and configured in the first direction D1. As a result, compared with the case where the first flow path portion 1191 and the second flow path portion 1192 are overlapped and configured in the vertical direction Z, the second bottom wall portion 1064b can be made thinner, and thus the control device 1107 can be miniaturized in the vertical direction Z.

[0177] As described above, the embodiments of the present invention have been described. However, each structure and their combinations in the embodiments are examples, and additional, omission, replacement, and other changes to the structure can be made without departing from the gist of the present invention. Additionally, the present invention is not limited to the embodiments.

[0178] In particular, the structure of the control device shown in the above embodiments and their modification examples is merely an example. The control device only needs to be a device having at least a power module, and may have any other electronic components.

[0179] Additionally, the present technology can adopt the following structure.

[0180] (1) A control device is located above a motor and controls the motor. The control device includes: a power module; a first electronic component having any function of voltage regulation, current distribution, or capacitance; and a housing that houses the power module and the first electronic component. The housing includes: a housing portion having an opening that opens upward; and a cover portion that covers the opening. A flow path is provided in the cover portion, and the flow path has a cooling flow path portion that overlaps at least one of the power module or the first electronic component in the vertical direction.

[0181] (2) The control device according to (1), wherein the cooling flow path portion is located above at least one of the power module or the first electronic component.

[0182] (3) The control device according to (1) or (2), wherein the power module and the first electronic component are fixed to the cover portion, and the cooling flow path portion includes: a first flow path portion provided in the cover portion to cool the power module; and a second flow path portion provided in the cover portion to cool the first electronic component.

[0183] (4) The control device according to (3), wherein a direction perpendicular to the vertical direction is set as a first direction, and the first flow path portion and the second flow path portion are arranged and configured in the vertical direction or the first direction.

[0184] (5) The control device according to (3) or (4), wherein the first flow path portion and the second flow path portion are connected to each other.

[0185] (6) The control device according to any one of (1) to (5), wherein a direction perpendicular to the vertical direction is set as a first direction, and the power module and the first electronic component are arranged and configured in the first direction.

[0186] (7) The control device according to any one of (1) to (5), wherein the power module and the first electronic component are arranged and configured in the vertical direction.

[0187] (8) The control device according to (6) or (7), wherein the power module is arranged below the first electronic component.

[0188] (9) The control device according to (1), wherein the cooling flow path portion is located below at least one of the power module or the first electronic component.

[0189] (10). The control device according to any one of (1) to (9), wherein a direction perpendicular to the vertical direction is set as the first direction, and the cooling flow path portion overlaps at least one of the power module or the first electronic component in the first direction.

[0190] (11). The control device according to any one of (1) to (10), wherein the cover portion has: a cover main body located above the opening portion; and a wall portion fixed to the cover main body and located below the cover main body. The power module or the first electronic component is disposed between the cover main body and the wall portion in the vertical direction, and the cooling flow path portion is provided on the wall portion.

[0191] (12). The control device according to any one of (1) to (11), wherein the control device has a second electronic component housed in the housing, the second electronic component has any function of voltage regulation, current distribution, or capacitor, a direction perpendicular to the vertical direction is set as the first direction, and the second electronic component overlaps the cooling flow path portion in the vertical direction or the first direction.

[0192] (13). The control device according to any one of (1) to (12), wherein the control device has a second electronic component housed in the housing, the second electronic component has any function of voltage regulation, current distribution, or capacitor, a direction perpendicular to the vertical direction is set as the first direction, and the second electronic component overlaps the power module or the first electronic component in the vertical direction or the first direction.

[0193] (14). The control device according to (12) or (13), wherein the control device has a plurality of the second electronic components.

[0194] (15). The control device according to (14), wherein the plurality of second electronic components overlap each other in the vertical direction or the first direction.

[0195] (16). The control device according to any one of (1) to (15), wherein the power module is fixed to the housing portion, and the first electronic component is fixed to the cover portion.

[0196] (17). The control device according to any one of (1) to (15), wherein the power module is fixed to the cover portion, and the first electronic component is fixed to the housing portion.

[0197] (18). The control device according to any one of (1) to (15), wherein the power module and the first electronic component are fixed to the cover portion.

[0198] (19) The control device according to any one of (1) to (18), wherein the control device has a heating device, the heating device has a heater part and a control part for controlling the heater part, and the control part is housed in the housing.

[0199] (20) A drive device, comprising: the control device according to any one of (1) to (19); the motor; and a motor housing that houses the motor, and the housing is interconnected with the motor housing.

[0200] (21) The drive device according to (20), wherein the flow path has a third flow path part provided in the motor housing, the third flow path part cools the motor, and the third flow path part is connected to a part of the flow path provided in the lid part.

Claims

1. A control device, located on the upper side of a motor, controls the motor, wherein: The control device has: Power module; A first electronic component having any function among voltage regulation, current distribution or capacitor; and a housing that accommodates the power module and the first electronic component, The housing has: a housing portion having an opening portion opened at an upper side; as well as a cover portion covering the opening portion, The cover portion is provided with a flow path, The flow path includes a cooling flow path portion that overlaps at least one of the power module or the first electronic component in a vertical direction.

2. The control device according to claim 1, wherein: The cooling flow path portion is located above at least one of the power module or the first electronic component.

3. The control device according to claim 1, wherein: The power module and the first electronic component are fixed to the cover. The cooling flow path portion comprises: A first flow path portion, which is provided on the cover portion and cools the power module; and The second flow path portion is provided in the cover portion and cools the first electronic component.

4. The control device according to claim 3, wherein: The direction perpendicular to the up-down direction is set as the first direction. The first flow path portion and the second flow path portion are arranged side by side in the up-down direction or in the first direction.

5. The control device according to claim 3, wherein: The first flow path portion and the second flow path portion are connected to each other.

6. The control device according to claim 1, wherein: The direction perpendicular to the up-down direction is set as the first direction. The power module and the first electronic component are arranged side by side in the first direction.

7. The control device according to claim 1, wherein: The power module and the first electronic component are arranged side by side in a vertical direction.

8. The control device according to claim 6 or 7, wherein: The power module is arranged on a lower side relative to the first electronic component.

9. The control device according to claim 1, wherein: The cooling flow path portion is located below at least one of the power module or the first electronic component.

10. The control device according to claim 1, wherein: The direction perpendicular to the up-down direction is set as the first direction. The cooling flow path portion overlaps with at least one of the power module or the first electronic component in the first direction.

11. The control device according to claim 1, wherein: The cover has: a cover body located on an upper side of the opening; and a wall portion, which is fixed to the cover body and is located at the lower side of the cover body, The power module or the first electronic component is disposed between the cover body and the wall portion in the up-down direction. The cooling flow path portion is provided on the wall portion.

12. The control device according to claim 1, wherein: The control device has a second electronic component housed in the housing. The second electronic component has any function of voltage regulation, current distribution or capacitor, The direction perpendicular to the up-down direction is set as the first direction. The second electronic component overlaps the cooling flow path portion in the up-down direction or the first direction.

13. The control device according to claim 1, wherein: The control device has a second electronic component housed in the housing. The second electronic component has any function of voltage regulation, current distribution or capacitor, The direction perpendicular to the up-down direction is set as the first direction. The second electronic component overlaps the power module or the first electronic component in the up-down direction or the first direction.

14. The control device according to claim 12 or 13, wherein: The control device has a plurality of the second electronic components.

15. The control device according to claim 14, wherein: The plurality of second electronic components overlap each other in the vertical direction or in the first direction.

16. The control device according to claim 1, wherein: The power module is fixed to the housing portion. The first electronic component is fixed to the cover.

17. The control device according to claim 1, wherein: The power module is fixed to the cover. The first electronic component is fixed to the housing portion.

18. The control device according to claim 1, wherein: The power module and the first electronic component are fixed to the cover.

19. The control device according to claim 1, wherein: The control device includes a heating device including a heater portion and a control portion that controls the heater portion. The control unit is accommodated in the housing.

20. A driving device, comprising: A control device as claimed in any one of claims 1 to 19; the motor; and a motor housing that accommodates the motor, The housing and the motor housing are connected to each other.

21. The driving device according to claim 20, wherein: The flow path includes a third flow path portion provided in the motor housing, and the third flow path portion cools the motor. The third flow path portion is connected to a portion of the flow path provided at the cover portion.

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