Radio frequency mainboard, mobile terminal and radio frequency test socket

Abstract

The invention belongs to the field of mainboard testing, and discloses a radio frequency mainboard, a mobile terminal and a radio frequency testing seat. The radio frequency main board comprises a main board body, a grounding bonding pad and a signal bonding pad. The grounding bonding pad is arranged on the mainboard body, a first hollow part is formed in the grounding bonding pad, and a magnetic attraction part is arranged on the grounding bonding pad; the signal bonding pad is arranged on the mainboard body and located in the first hollow part, and the signal bonding pad and the grounding bonding pad are arranged in a spaced mode. In the radio frequency main board provided by the invention, the connecting seat can be fixed on the radio frequency main board only by correspondingly electrically connecting the signal bonding pads without welding and the like, so that the insertion loss is effectively reduced, the connecting structure is simple when the test seat is arranged on the main board, the test seat is convenient to mount and remove, and the test efficiency of the main board is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of motherboard testing, and in particular to a radio frequency motherboard, a mobile terminal and a radio frequency test socket. Background Art

[0002] From the beginning of the 20th century to today, RF communication technology (radio frequency communication technology) has developed rapidly. With the growth of the semiconductor, electronic communications and microelectronics industries, RF technology has made great progress and development in the field of communications. As mobile communication technology has developed from 2G to 5G, RF systems have become increasingly complex, and the requirements for RF performance have become increasingly higher. Therefore, it is necessary to use an RF test system to test RF performance. At present, the conventional RF connectors mounted on the motherboard are mainly divided into the following categories: one is the conventional pin pins of the RF radio frequency test socket still use the corresponding pogo pin probe, which is embedded in the test socket; the other is mainly coaxial cable connectors and board connectors.

[0003] However, the main problems of existing connectors are: additional loss will deteriorate the performance index, poor pad contact is likely to occur during testing, additional pads occupy area, which is not conducive to the product's high ID design, high damage rate and difficult to operate; at the same time, the existing test socket can only adapt to the cable test two-in-one or one of the test sockets, but not to facilitate testing of both. In summary, the existing RF test sockets are complex to connect and inconvenient to use. Summary of the invention

[0004] The main purpose of the present invention is to provide a radio frequency mainboard, a mobile terminal and a radio frequency test socket, aiming to solve the problem that the existing radio frequency test socket has complex connection and is inconvenient to use.

[0005] To achieve the above object, an embodiment of the present invention provides a radio frequency mainboard, comprising:

[0006] Main board body;

[0007] A ground pad is disposed on the main board body, a first hollow portion is formed in the ground pad, and a magnetic attraction portion is disposed on the ground pad; and,

[0008] The signal pad is arranged on the main board body and is located in the first hollow portion and is spaced apart from the ground pad.

[0009] Optionally, the ground pad includes a pad body and a magnetic suction cup disposed on the pad body.

[0010] Optionally, a plurality of the magnetic attraction portions are provided, and the plurality of the magnetic attraction portions are arranged at intervals along the circumference of the ground pad.

[0011] Optionally, a plurality of grounding pads are provided, and the plurality of grounding pads are arranged at intervals in an inner and outer ring sequence.

[0012] Optionally, a metal material is provided between two adjacent grounding pads.

[0013] Optionally, the signal pad and the grounding pad are coaxially arranged.

[0014] Optionally, the material of the signal pad includes a non-magnetic material.

[0015] Optionally, a wiring opening communicating with the first hollow portion is further formed on the grounding pad;

[0016] The RF main board further includes a signal wiring, which is arranged on the main board body and extends from the wiring opening into the first hollow portion.

[0017] An embodiment of the present invention further provides a mobile terminal, including the RF main board according to any one of the above.

[0018] An embodiment of the present invention further provides an RF test socket for testing the RF main board according to any one of the above, including:

[0019] A grounding test pad, with a second hollow portion formed therein, a magnetic matching portion is provided on the grounding test pad, the grounding test pad is used for electrical connection with the grounding pad on the RF main board, and the magnetic matching portion is used for magnetic matching with the magnetic attraction portion on the RF main board; and,

[0020] A signal test pad, located within the second hollow portion, the signal test pad is insulated from the grounding test pad, and the signal test pad is used for electrical connection with the signal pad on the RF main board.

[0021] Optionally, a plurality of grounding test pads are provided, and the plurality of grounding test pads are arranged at intervals in an inner and outer ring sequence;

[0022] The magnetic matching portion is provided between two adjacent grounding test pads.

[0023] Optionally, a plurality of magnetic matching portions are provided, and the plurality of magnetic matching portions are arranged at intervals along the circumference of the grounding test pad.

[0024] Optionally, the signal test pad and the grounding test pad are coaxially arranged.

[0025] Optionally, the material of the signal test pad includes a non-magnetic material.

[0026] Optionally, an insulating material is provided between the signal test pad and the grounding test pad.

[0027] Optionally, the RF test socket includes a connection end and a test end that are oppositely arranged;

[0028] An avoidance opening communicating with the second hollow portion is provided at the connection end of the ground test pad.

[0029] An embodiment of the present invention provides an RF main board. The ground pad and the signal pad are provided on the main board body. Among them, the signal pad is located within the hollow portion of the ground pad, improving the reliability of grounding. At the same time, a magnetic attraction portion is provided on the ground pad, and an external test socket is magnetically fixed on the ground pad by magnetic attraction to achieve a fixed connection. As long as the signal pads are correspondingly electrically connected, a connection seat can be fixed on the RF main board without using welding or other methods, effectively reducing insertion loss, making the connection structure of the test socket on the main board simple, facilitating the installation and removal of the test socket, and improving the test efficiency of the main board. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 is a schematic structural diagram of the RF main board provided by the embodiment of the present invention;

[0031] Figure 2 is a schematic structural diagram of the RF test socket provided by the embodiment of the present invention;

[0032] Figure 3 is a schematic structural diagram of the docking of the RF main board and the RF test socket provided by the embodiment of the present invention.

[0033] Description of the reference numerals in the drawings:

[0034] Label Name Label Name 100 RF main board 4 Signal connection wire 1 Main board body 200 RF test socket 2 Grounding pad 5 Grounding test pad 21 Magnetic attraction part 51 Magnetic mating part 22 Pad body 6 Signal test pad 3 Signal pad

[0035] The implementation, functional features, and advantages of the present invention will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0036] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0037] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present invention, the directional indications are only used to explain the relative positional relationship, movement conditions, etc. between components in a certain specific posture (as shown in the drawings). If the specific posture changes, the directional indications will also change accordingly.

[0038] In addition, if there are descriptions such as "first", "second", etc. involved in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first", "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and / or" appearing throughout the text includes three parallel scenarios. Taking "A and / or B" as an example, it includes scenario A, or scenario B, or the scenario where A and B are satisfied simultaneously. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the fact that those skilled in the art can implement it. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present invention.

[0039] Please refer to Figure 1 , the present invention provides a radio frequency main board 100, which includes a main board body 1, a ground pad 2, and a signal pad 3; the ground pad 2 is arranged on the main board body 1, a first hollow part is formed in the ground pad 2, and a magnetic attraction part 21 is arranged on the ground pad 2; the signal pad 3 is arranged on the main board body 1 and is located within the first hollow part, and is arranged at an interval from the ground pad 2.

[0040] In the radio frequency main board 100 provided by the present invention, the ground pad 2 and the signal pad 3 are arranged on the main board body 1. Among them, the signal pad 3 is located within the hollow part of the ground pad 2. By increasing the contact area of the ground pad 2, the reliability of grounding is improved. At the same time, a magnetic attraction part 21 is arranged on the ground pad 2, and the external test socket is magnetically attracted and fixed on the ground pad 2 through magnetic attraction to achieve a fixed connection. As long as the signal pad 1 is correspondingly electrically connected, a connection socket can be fixedly connected on the radio frequency main board 100 without using welding or other methods, effectively reducing the insertion loss, making the connection structure simple when the test socket is arranged on the main board, facilitating the installation and removal of the test socket, and improving the test efficiency of the main board.

[0041] It should be noted that the magnetic attraction part 21 can be formed in various ways. For example, during the formation of the grounding pad 2, a magnetic attraction section is directly reserved on the grounding pad 2. Corresponding to the reserved magnetic attraction section, the magnetic attraction part 21 is formed by adding a magnetic attraction material to the pad material of the grounding pad 2, so that the reserved magnetic attraction section on the grounding pad 2 has its own magnetism to form the magnetic attraction part 21.

[0042] Specifically, in this embodiment, the grounding pad 2 includes a pad body 22 and a magnetic suction cup arranged on the pad body 22. In this embodiment, the grounding pad 2 is divided into two parts, and the magnetic suction cup is fixedly arranged on the pad body 22, so that the magnetic attraction part 21 is formed on the grounding pad 2. By means of the externally provided magnetic suction cup, it can be arranged at different positions of the pad body 22 according to actual needs, improving the applicability of the grounding pad 2. At the same time, after the test is completed, the magnetic attraction part on the grounding pad 2 can be quickly removed to avoid the magnetic interference of the magnetic material on the RF main board 100 and ensure the smooth operation of the RF main board 100.

[0043] It should be noted that the material of the pad body 22 includes iron-aluminum-nickel; the material of the magnetic suction cup includes NiFe-SiOx.

[0044] In one embodiment, a plurality of magnetic attraction parts 21 are provided, and the plurality of magnetic attraction parts 21 are arranged at intervals along the circumferential direction of the grounding pad 2. In this embodiment, a plurality of magnetic attraction parts 21 are arranged on the grounding pad 2. Through the plurality of magnetic attraction parts 21, multi-point positioning of the test socket can be realized, avoiding position deviation caused by single magnetic attraction.

[0045] In the specific embodiment provided by the present invention, an even number of magnetic attraction parts 21 are provided, and every two of the magnetic attraction parts 21 are symmetrically arranged along the central axis of the grounding pad 2, so as to stably magnetically attract an external test socket on the grounding pad 2.

[0046] In order to ensure the reliability of grounding, in one embodiment, a plurality of grounding pads 2 are provided, and the plurality of grounding pads 2 are arranged at intervals in an inner and outer ring sequence. In this embodiment, since the grounding pad 2 needs to simultaneously realize the functions of grounding and magnetic attraction fixation, when connecting the test socket to the ground, the grounding signal may be unstable due to the blockage of the magnetic attraction part 21. By arranging multiple layers of grounding pads, the grounding contact area is increased, and when there are small-range position deviations and vibrations, the multi-layer grounding can still maintain electrical contact, increasing the reliability of the ground contact.

[0047] Further, in one embodiment, a metal material is provided between two adjacent grounding pads 2. This facilitates the electrical contact between the two layers of grounding pads 2 and can effectively improve the reliability of ground contact.

[0048] In one embodiment, to facilitate the positional docking with the test socket, the signal pad 3 and the grounding pad 2 are coaxially arranged. This positions the signal pad 3 at the center of the grounding pad 2. During docking, there is no need to deliberately align the position of the signal pad 3 when placing the test socket. As long as the axis corresponds to that of the grounding pad 2, the correct correspondence of the signal pad 3 can be achieved.

[0049] In one embodiment, the material of the signal pad 3 includes a diamagnetic material. In this embodiment, to avoid the magnetic interference of the magnetic attraction part 21 on the grounding pad 2 to the signal pad 3, the signal pad 3 is made of a diamagnetic metal to ensure the effective electrical connection of the signal pad 3.

[0050] In the specific embodiment provided by the present invention, the material of the signal pad 3 is copper or gold.

[0051] In one embodiment, a wiring opening communicating with the first hollow part is further provided on the grounding pad 2; the radio frequency main board 100 further includes a signal wiring 4, which is arranged on the main board body 1 and extends into the first hollow part from the wiring opening. In this embodiment, the input or output of radio frequency signals is realized through the signal wiring 4.

[0052] When testing the test socket for the two-in-one test cable, a wiring opening is further provided on the grounding pad 2; alternatively, two wiring openings can be provided, respectively for routing the input line and the output line.

[0053] It should be noted that the material of the signal wiring 4 includes copper.

[0054] Based on the above radio frequency main board 100, the present invention further provides a mobile terminal, including the above radio frequency main board 100, that is, having all the technical features of the above radio frequency main board 100. Therefore, it also has the technical effects brought by the above all technical features, which will not be elaborated here one by one.

[0055] It should be noted that there are various specific embodiments of the mobile terminal, such as mobile communication devices such as mobile phones and computer devices, or smart home devices such as mobile speakers, as long as radio frequency signals need to be generated. The type of the mobile terminal is not specifically limited here.

[0056] Based on the above radio frequency main board 100, the present invention further provides a radio frequency test socket 200 for testing the above radio frequency main board 100.

[0057] Please refer to Figure 2 , the radio frequency test socket 200 includes a ground test pad 5 and a signal test pad 6; a second hollow portion is formed in the ground test pad 5, a magnetic mating portion 51 is provided on the ground test pad 5, the ground test pad 5 is used for electrical docking with the ground pad 2 on the radio frequency main board 100, and the magnetic mating portion 51 is used for magnetic mating with the magnetic attraction portion 21 on the radio frequency main board; the signal test pad 6 is located within the second hollow portion, the signal test pad 6 is insulated from the ground test pad 5, and the signal test pad 6 is used for electrical docking with the signal pad 3 on the radio frequency main board 100.

[0058] In the radio frequency test socket 200 provided by the present invention, a ground test pad 5 and a signal test pad 6 are provided corresponding to the ground pad 2 and the signal pad 3 on the radio frequency main board 100; wherein, a magnetic mating portion 51 is provided on the ground test pad 5 to facilitate magnetic attraction connection with the magnetic attraction portion 21 in correspondence, magnetically adsorbing the radio frequency test socket 200 on the radio frequency main board 100. There is no need for connection methods such as soldering that may damage the pads, facilitating the installation and removal of the test socket, reducing the test cost, improving the test efficiency, and facilitating the user to quickly conduct tests.

[0059] Similarly, it should be noted that in this embodiment, there are various ways to arrange the magnetic mating portion 51. For example, directly making the ground test pad 5 made of a magnetic material so that the magnetic attraction portion 21 can directly adsorb the entire ground test pad 5 as a whole, or by means of an external magnetic mating disc to form the magnetic mating portion 51 on the ground test pad 5.

[0060] In addition, it should be noted that the signal test pad 6 is insulated from the ground test pad 5 to avoid signal crosstalk interference problems between the signal test pad 6 and the ground test pad 5, ensuring the independent and complete transmission of test signals between the two pads during testing.

[0061] In one embodiment, a plurality of the ground test pads 5 are provided, and the plurality of ground test pads 5 are arranged at intervals in an inner and outer ring sequence; the magnetic mating portion 51 is provided between two adjacent ground test pads 5. In this embodiment, the radio frequency test socket 200 also includes a plurality of the ground test pads 5, so that even if there are some deviations, normal grounding can be ensured through the plurality of ground test pads 5, improving the reliability of grounding.

[0062] It should be noted that in this embodiment, by connecting a plurality of the grounding test pads 5 through the magnetic attraction matching part 51, the structure is simpler and lighter.

[0063] In one embodiment, a plurality of the magnetic matching parts 51 are provided, and the plurality of the magnetic matching parts 51 are arranged at intervals along the circumferential direction of the grounding test pad 5. In this embodiment, through the plurality of the magnetic attraction matching parts 51, multi-point positioning of the grounding test pad 5 can be realized, ensuring that the grounding test pad 5 is correctly placed on the RF main board 100 and avoiding position deviation.

[0064] It should be noted that in this embodiment, the magnetic matching part 51 is made of a metal magnetic attraction material, including ferrite, to form the magnetic attraction matching part 51.

[0065] In one embodiment, the signal test pad 6 and the grounding test pad 5 are coaxially arranged. In this embodiment, by making the two pads coaxially arranged, the docking of the signal test pad 6 can be carried out quickly. Only after ensuring that the grounding test pad 5 and the grounding pad 5 on the RF main board 100 are coaxially corresponding, the signal test pad 6 and the signal pad 3 therein are automatically aligned without the need for manual attitude adjustment.

[0066] Similarly, in order to avoid the interference of magnetism on the connection between the signal pads, the material of the signal test pad 6 includes a diamagnetic material.

[0067] Specifically, the material of the signal test pad 6 includes copper or gold.

[0068] There are various ways to insulate the signal test pad 6 and the grounding test pad 5. For example, the signal test pad 6 and the grounding test pad 5 are installed on a bracket so that there is no electrical contact between them to achieve insulation.

[0069] In one embodiment, an insulating material is provided between the signal test pad 6 and the grounding test pad 5. In this embodiment, by filling the insulating material, the problem of signal crosstalk interference between the signal test pad 6 and the grounding test pad 5 is avoided, and the insulation effect can be effectively improved by filling the insulating material.

[0070] When using the RF test socket 200, only need to place the RF test socket 200 corresponding to the RF main board 100, and the magnetic matching part 51 therein is magnetically matched with the magnetic attraction part 21 to fix the RF test socket 200 on the RF main board 100.

[0071] Among them, a signal wiring 4 is provided on the RF main board 100. In order to avoid interference between the end face of the RF test socket 200 and the signal wiring 4, in this embodiment, the RF test socket 200 includes a connection end and a test end that are oppositely arranged; an avoidance opening communicating with the second hollow portion is formed at the connection end of the ground test pad 6. In this embodiment, through the avoidance opening, a routing path is provided for the signal wiring 4 to avoid the solder height affecting the ground contact reliability.

[0072] It should be noted that during actual use, the connection end of the RF test socket 200 is butt-jointed and attached to the RF main board 100, and the signal wiring 4 on the RF main board is avoided through the avoidance opening. Then, an external test instrument is connected to the test end of the RF test socket 200, and the test signal is transmitted between the connection end and the test end to complete the test of the RF main board 100.

[0073] Please refer to Figure 3 , based on the RF main board 100 and the RF test socket 200, the present invention provides a specific embodiment.

[0074] In this embodiment, the RF main board 100 is tested through the RF test socket 200, where:

[0075] The avoidance opening is aligned with the routing opening;

[0076] The ground test pad 5 is attached to the ground pad 2 so that the magnetic matching portion 51 therein is magnetically matched with the magnetic attracting portion 21;

[0077] Check the electrical connection between the signal pad 3 and the signal test pad 6;

[0078] After the ground and signal connections are both good, start the main board test.

[0079] The above are only the preferred embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. Any equivalent structure or equivalent process transformation made using the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present invention.

Claims

1. A radio frequency main board, characterized in that, Comprising: The main board body; A ground pad provided on the main board body, a first hollow portion is formed in the ground pad, and a magnetic attraction portion is provided on the ground pad; And, A signal pad provided on the main board body and within the first hollow portion, and is spaced apart from the ground pad.

2. The RF main board according to claim 1, wherein The ground pad includes a pad body and a magnetic suction cup provided on the pad body.

3. The RF main board according to claim 1, characterized in that, A plurality of the magnetic attraction portions are provided, and the plurality of magnetic attraction portions are spaced apart along the circumference of the ground pad.

4. The RF main board according to claim 1, characterized in that, A plurality of the ground pads are provided, and the plurality of ground pads are sequentially spaced apart in an inner and outer ring.

5. The RF main board according to claim 4, wherein A metal material is provided between two adjacent ground pads.

6. The RF main board according to claim 1, characterized in that, The signal pad and the ground pad are coaxially arranged.

7. The RF main board according to claim 1, wherein The material of the signal pad includes a diamagnetic material.

8. The RF main board according to claim 1, wherein A wiring opening communicating with the first hollow portion is further formed in the ground pad; The RF main board further includes a signal wiring provided on the main board body and extending from the wiring opening into the first hollow portion.

9. A mobile terminal, characterized in that, Including the RF main board according to any one of claims 1 to 8.

10. A radio frequency test socket for testing the radio frequency main board according to any one of claims 1 to 8, characterized in that, Comprising: A ground test pad with a second hollow portion formed therein, a magnetic matching portion is provided on the ground test pad, the ground test pad is used for electrically docking with the ground pad on the RF main board, and the magnetic matching portion is used for magnetically matching with the magnetic attraction portion on the RF main board; and, A signal test pad within the second hollow portion, the signal test pad is insulated from the ground test pad, and the signal test pad is used for electrically docking with the signal pad on the RF main board.

11. The RF test socket according to claim 10, wherein, A plurality of the ground test pads are provided, and the plurality of ground test pads are sequentially spaced apart in an inner and outer ring; The magnetic matching portion is provided between two adjacent ground test pads.

12. The RF test socket according to claim 10, characterized in that, A plurality of the magnetic matching portions are provided, and the plurality of magnetic matching portions are spaced apart along the circumference of the ground test pad.

13. The RF test socket according to claim 10, wherein The signal test pad and the ground test pad are coaxially arranged.

14. The radio frequency test socket according to claim 10, wherein, The material of the signal test pad includes a diamagnetic material.

15. The RF test socket according to claim 10, characterized in that, An insulating material is provided between the signal test pad and the ground test pad.

16. The RF test socket according to claim 10, wherein The RF test socket includes a connection end and a test end arranged opposite to each other; An avoidance opening communicating with the second hollow portion is formed in the connection end of the ground test pad.

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