Micropore forming equipment and method for high-aspect-ratio blind hole multilayer PCB (printed circuit board)

Abstract

The invention belongs to the technical field of circuit board processing, and discloses micropore forming equipment for a high-aspect-ratio blind hole multilayer PCB and a forming method thereof.The micropore forming equipment comprises an operation table, a top plate is fixedly installed at the top end of the operation table, a hydraulic cylinder is installed at the top end of the top plate, and the bottom end of the hydraulic cylinder is connected with an installation base; a mounting base is arranged on the upper portion of the operating table, an injection assembly and a dust collection assembly are arranged in the mounting base, a laser drilling head is mounted at the bottom end of the mounting base and arranged above the operating table, and when a circuit board is machined, the circuit board is mounted below the laser drilling head firstly, then the mounting base is driven by a hydraulic cylinder to move downwards, the laser drilling head moves downwards to the top of the circuit board, and then the circuit board is machined. When the drilling machine is used for drilling, the air pump and the dust collection fan are started, inert gas is sprayed from the first spray head to the drilling area when the air pump is started, slag and smoke are sucked away from the drilling area through the dust collection pipe when the dust collection fan is started, and the drilling quality can be remarkably improved, the working environment is improved, and equipment is protected through combination of the two.

Description

Technical Field

[0001] The present invention belongs to the technical field of circuit board processing, and specifically relates to a micro-hole forming device and a forming method for a high aspect ratio blind via multi-layer PCB circuit board. Background Art

[0002] A high aspect ratio blind via multi-layer PCB circuit board is a complex printed circuit board (PCB) with a high aspect ratio blind via structure. Due to its high density, high performance, and complex interconnection characteristics, it is widely used in fields such as communication, computer, consumer electronics, automotive electronics, and aerospace; The micro-hole forming device is a precision device specifically used for processing high aspect ratio blind vias, mainly including laser drilling devices (CO2 laser, UV laser, ultrafast laser), mechanical drilling devices, plasma etching devices, and chemical etching devices. Among them, laser drilling devices (especially UV laser and ultrafast laser) have significant advantages in processing high-precision and high aspect ratio blind vias and are the preferred devices for high-end PCB manufacturing; After retrieval, such as the patent: CN119589166A, a laser drilling device for an HDI circuit board, includes an operating table. The right side of the middle part of the upper end of the operating table is rotatably connected with a rotating mechanism, the front side of the upper end of the operating table is rotatably connected with a transmission mechanism, the middle part of the upper end of the operating table is fixedly connected with a drilling mechanism, and a blowing mechanism is arranged on the left side of the lower part of the drilling mechanism. The laser drilling device for an HDI circuit board described in this invention can automatically and accurately position the HDI circuit board by driving a baffle to cooperate with a rectangular block during the downward movement of the laser drilling head, improving the drilling accuracy and efficiency. During the drilling process, through the nozzle cooperating with the limiting pipe and slider one, it helps to remove the debris and dust generated during the drilling process. At the same time, during the reset process of the laser drilling head, the surface of the HDI circuit board after drilling is cleaned by a soft brush, which can remove the residual debris and dust and ensure the cleanliness of the HDI circuit board; At present, when the current laser drilling device processes a circuit board, it blows out the small particles generated during the drilling process by blowing air. Although it helps to remove the debris and dust generated during the drilling process, during the blowing process, the molten slag and soot will fly and scatter, polluting the working environment and affecting the health of the staff. Summary of the Invention

[0003] The purpose of the present invention is to provide a micro-hole forming device and a forming method for a high aspect ratio blind via multi-layer PCB circuit board to solve the problems raised in the above background art.

[0004] To achieve the above object, the present invention provides the following technical solutions: A micro-hole forming device for a high aspect ratio blind via multi-layer PCB circuit board, including an operating table, a top plate is fixedly installed at the top of the operating table, a hydraulic cylinder is installed at the top of the top plate, the bottom end of the hydraulic cylinder is connected with a mounting seat, a blowing component and a dust suction component are arranged inside the mounting seat, a laser drilling head is installed at the bottom end of the mounting seat, and the laser drilling head is arranged above the operating table; The blowing component includes a first nozzle arranged inside the mounting seat, the first nozzles are evenly distributed, and each of the first nozzles is fixedly connected by a first connecting pipe, the top end of the first connecting pipe is fixedly connected with a second connecting pipe, and an air pump is installed at the top end of the second connecting pipe, and the air pump is arranged at the top of the top plate; The dust suction component includes a first dust suction pipe arranged inside the mounting seat, the first dust suction pipes are evenly distributed, and each of the first dust suction pipes is fixedly connected by a third connecting pipe, one end of the third connecting pipe away from the first dust suction pipe is provided with a fourth connecting pipe, the fourth connecting pipe is fixedly installed at the top of the mounting seat, and a dust suction fan is installed at the top end of the fourth connecting pipe, and the dust suction fan is arranged at the top of the top plate.

[0005] As a further technical solution of the present invention, the first nozzles and the first dust suction pipes are symmetrically arranged on both sides of the laser drilling head.

[0006] As a further technical solution of the present invention, the middle parts of the second connecting pipe and the fourth connecting pipe are both arranged as corrugated pipes.

[0007] As a further technical solution of the present invention, one end of the third connecting pipe away from the first dust suction pipe is provided with a first filter screen, and the first filter screen is installed inside the mounting seat.

[0008] As a further technical solution of the present invention, a second filter screen is arranged below the fourth connecting pipe, and the second filter screen is installed inside the mounting seat.

[0009] As a further technical solution of the present invention, the bottom end of the third connecting pipe is fixedly connected with a second dust suction pipe, and the second dust suction pipes are evenly arranged.

[0010] As a further technical solution of the present invention, the bottom end of the first connecting pipe is fixedly connected with a second nozzle, the second nozzles are evenly arranged, and the second nozzles are installed at the bottom of the mounting seat through a rotating component.

[0011] As a further technical solution of the present invention, the rotating component includes a fan blade arranged inside the mounting seat, a first rotating shaft is fixedly installed on the inner wall of the fan blade, one end of the first rotating shaft is meshed with a rack plate, and the top end of the rack plate is meshed with a gear; Each of the second nozzles is fixedly connected by a connecting shaft. Swing plates are fixedly installed at both ends of the connecting shaft. Both of the swing plates are rotatably installed inside the mounting base through a second rotating shaft. One of the second rotating shafts is fixedly connected to a gear.

[0012] As a further technical solution of the present invention, a scraper is fixedly installed at one end of the first rotating shaft away from the rack plate. The scraper is arranged on one side of the first filter screen.

[0013] A forming method for a micro-hole forming device of a high aspect ratio blind via multi-layer PCB circuit board includes the following steps: S1: When processing the circuit board, first install the circuit board below the laser drilling head, and then drive the mounting base to move downward through a hydraulic cylinder. The movement of the mounting base drives the movement of the laser drilling head, so that the laser drilling head moves downward to the top of the circuit board and drills it. S2: During processing, start the air pump and the dust suction fan simultaneously. When the air pump starts, it is connected to the first nozzle through the second connecting pipe, the first connecting pipe, and the first nozzle, and inert gas is sprayed from the first nozzle to the drilling area. When the dust suction fan starts, it is connected through the fourth connecting pipe, the third connecting pipe, and the first dust suction pipe, and the slag and dust are sucked away from the drilling area. S3: At the same time, suck the area at the bottom of the mounting base through the second dust suction pipe to clean the unprocessed area of the circuit board, and blow the drilled area through the second nozzle. S4: When the dust is sucked into the filter chamber, it drives the fan blades to rotate. The rotation of the fan blades drives the rotation of the first rotating shaft. The rotation of the first rotating shaft drives the rack plate to reciprocate. The movement of the rack plate drives the gear to rotate reciprocally. The rotation of the gear drives the swing plate to swing reciprocally. The swing of the swing plate drives the second nozzle to swing reciprocally through the connection of the connecting shaft, increasing the area of the blowing area and improving the processing quality.

[0014] The beneficial effects of the present invention are as follows: In the present invention, through the combined setting of the blowing component and the dust suction component, when processing the circuit board, first install the circuit board below the laser drilling head, and then drive the mounting base to move downward through a hydraulic cylinder. The movement of the mounting base drives the movement of the laser drilling head, so that the laser drilling head moves downward to the top of the circuit board and drills it. At the same time, start the air pump and the dust suction fan. When the air pump starts, it is connected to the first nozzle through the second connecting pipe, the first connecting pipe, and the first nozzle, and inert gas is sprayed from the first nozzle to the drilling area. When the dust suction fan starts, it is connected through the fourth connecting pipe, the third connecting pipe, and the first dust suction pipe, and the slag and dust are sucked away from the drilling area. The combination of the two can significantly improve the drilling quality, improve the working environment and protect the equipment.

[0015] Through the arrangement of the second nozzle, during processing, the area after drilling is blown by the second nozzle, which can not only prevent the oxidation of the drilling area, but also cool the drilling area, reduce the heat affected zone, and thus improve the product quality.

[0016] Through the arrangement of the rotating assembly, during processing, after the soot and dust are sucked into the filtering chamber, the flowing drives the fan blades to rotate. The rotation of the fan blades drives the rotation of the first rotating shaft. The rotation of the first rotating shaft drives the rack plate to reciprocate. The movement of the rack plate drives the gear to rotate reciprocally. The rotation of the gear drives the swing plate to swing reciprocally. The swing of the swing plate drives the second nozzle to swing reciprocally through the connection shaft, increasing the area of the blowing region, helping the inert gas to better penetrate deep into the hole, ensuring that the hole wall is completely protected, and improving the quality and efficiency of the printed circuit board manufacturing. Description of the Drawings

[0017] Figure 1 is a schematic diagram of the overall structure of the present invention; Figure 2 is a schematic cross-sectional view of the overall structure of the present invention; Figure 3 is a schematic cross-sectional view of the structure at the mounting seat of the present invention; Figure 4 is a schematic cross-sectional view of the structure at the mounting seat of the present invention from another perspective; Figure 5 For the present invention Figure 4 is an enlarged schematic view of the structure at A in; Figure 6 is a schematic diagram of the structure at the first nozzle and the second nozzle of the present invention; Figure 7 For the present invention Figure 6 is an enlarged schematic view of the structure at B in.

[0018] In the figure: 1, operating table; 2, top plate; 3, hydraulic cylinder; 4, mounting seat; 5, laser drilling head; 6, first nozzle; 7, first connecting pipe; 8, second connecting pipe; 9, air pump; 10, first dust suction pipe; 11, third connecting pipe; 12, dust suction fan; 13, second nozzle; 14, second dust suction pipe; 15, first filter screen; 16, second filter screen; 17, fan blades; 18, first rotating shaft; 19, scraper; 20, rack plate; 21, gear; 22, swing plate; 23, connecting shaft; 24, fourth connecting pipe; 25, second rotating shaft. Detailed Embodiments

[0019] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without making creative efforts shall fall within the protection scope of the present invention.

[0020] As Figures 1 to 7 shown, in the embodiment of the present invention, a micro-hole forming device for a high aspect ratio blind via multi-layer PCB circuit board includes an operating table 1. A top plate 2 is fixedly installed at the top of the operating table 1. A hydraulic cylinder 3 is installed at the top of the top plate 2. The bottom end of the hydraulic cylinder 3 is connected with a mounting seat 4. A blowing component and a dust suction component are arranged inside the mounting seat 4. The bottom end of the mounting seat 4 is installed with a laser drilling head 5. The laser drilling head 5 is arranged above the operating table 1; The blowing component includes a first spray head 6 arranged inside the mounting seat 4. The first spray heads 6 are evenly distributed. Each first spray head 6 is fixedly connected through a first connecting pipe 7. The top end of the first connecting pipe 7 is fixedly connected with a second connecting pipe 8. An air pump 9 is installed at the top end of the second connecting pipe 8. The air pump 9 is arranged at the top of the top plate 2; The dust suction component includes a first dust suction pipe 10 arranged inside the mounting seat 4. The first dust suction pipes 10 are evenly distributed. Each first dust suction pipe 10 is fixedly connected through a third connecting pipe 11. One end of the third connecting pipe 11 away from the first dust suction pipe 10 is provided with a fourth connecting pipe 24. The fourth connecting pipe 24 is fixedly installed at the top of the mounting seat 4. A dust suction fan 12 is installed at the top end of the fourth connecting pipe 24. The dust suction fan 12 is arranged at the top of the top plate 2.

[0021] Existing: CN119589166A discloses a laser drilling device for an HDI circuit board. The operating table 1, the laser drilling head 5 and the limiting method of the circuit board proposed in this application document are disclosed in this patent. These technical means will not be elaborated one by one here; Both the first spray head 6 and the first dust suction pipe 10 are inclined towards one side of the laser drilling head 5; The output end of the air pump 9 is connected with the second connecting pipe 8, and the input end of the air pump 9 is connected with an external air source. This air source is preferably an inert gas, which can prevent material oxidation; The input end of the dust suction fan 12 is connected with the fourth connecting pipe 24; When processing the circuit board, first install the circuit board below the laser drilling head 5, and then drive the mounting seat 4 to move downward through the hydraulic cylinder 3. The movement of the mounting seat 4 drives the movement of the laser drilling head 5, so that the laser drilling head 5 moves downward to the top of the circuit board to drill it; During processing, the air pump 9 and the dust suction fan 12 are started simultaneously. When the air pump 9 is started, it is connected through the second connecting pipe 8, the first connecting pipe 7 and the first nozzle 6, and inert gas is ejected from the first nozzle 6 to the drilling area. When the dust suction fan 12 is started, it is connected through the fourth connecting pipe 24, the third connecting pipe 11 and the first dust suction pipe 10, and the slag and dust are sucked away from the drilling area. The combination of the two can significantly improve the drilling quality, improve the working environment and protect the equipment.

[0022] Such as Figure 3 , Figure 4 and Figure 6 shown, the first nozzle 6 and the first dust suction pipe 10 are symmetrically arranged on both sides of the laser drilling head 5.

[0023] Such as Figures 3 to 6 shown, the middle parts of the second connecting pipe 8 and the fourth connecting pipe 24 are both arranged as corrugated pipes.

[0024] The corrugated pipe has a certain telescopic property, so that during the up and down movement of the mounting seat 4, the stability of the connection between the second connecting pipe 8 and the air pump 9, the fourth connecting pipe 24 and the dust suction fan 12 is ensured.

[0025] Such as Figure 4 and Figure 5 shown, one end of the third connecting pipe 11 away from the first dust suction pipe 10 is provided with a first filter screen 15, and the first filter screen 15 is installed inside the mounting seat 4.

[0026] A filter chamber is opened inside the mounting seat 4. The first filter screen 15 is located inside the filter chamber, and this chamber is communicated with the fourth connecting pipe 24 and the third connecting pipe 11; By blocking the inhaled slag through the first filter screen 15, the slag is separated from the gas, preventing large particle slag from entering the dust suction fan 12 and reducing equipment wear and failures.

[0027] Such as Figure 4 and Figure 5 shown, a second filter screen 16 is arranged below the fourth connecting pipe 24, and the second filter screen 16 is installed inside the mounting seat 4.

[0028] The second filter screen 16 is preferably a fiberglass HEPA filter screen, which has the characteristic of high temperature resistance and is suitable for the high temperature dust generated by laser drilling; By filtering the inhaled dust through the second filter screen 16, preventing it from being directly discharged and polluting the air quality, filtering the dust can purify the air and improve the working environment.

[0029] Such as Figures 3 to 6 shown, the bottom end of the third connecting pipe 11 is fixedly connected with a second dust suction pipe 14, and the second dust suction pipe 14 is evenly arranged.

[0030] During processing, the area at the bottom of the mounting base 4 is vacuumed through the second suction pipe 14, which facilitates the cleaning of the unprocessed area of the circuit board. This not only keeps the surface of the circuit board smooth and improves the appearance quality of the product, but also prevents the soot from scattering into the unprocessed area, contributing to the improvement of processing quality.

[0031] As Figures 3 to 6 shown, the bottom end of the first connecting pipe 7 is fixedly connected with a second spray head 13. The second spray heads 13 are evenly arranged and are installed at the bottom of the mounting base 4 through a rotating assembly.

[0032] The opening of the second spray head 13 is arranged downward; During processing, the drilled area is blown through the second spray head 13, which can not only prevent the drilled area from oxidizing, but also cool the drilled area, reduce the heat affected zone, and thus improve the product quality.

[0033] As Figures 1 to 7 shown, the rotating assembly includes a fan blade 17 arranged inside the mounting base 4. A first rotating shaft 18 is fixedly installed on the inner wall of the fan blade 17. One end of the first rotating shaft 18 is meshed and connected with a rack plate 20, and the top end of the rack plate 20 is meshed and connected with a gear 21; Each second spray head 13 is fixedly connected through a connecting shaft 23. Both ends of the connecting shaft 23 are fixedly installed with swing plates 22. The two swing plates 22 are rotatably installed inside the mounting base 4 through a second rotating shaft 25. One of the second rotating shafts 25 is fixedly connected with the gear 21.

[0034] A reciprocating thread is arranged on the outer wall of the fan blade 17 to move the rack plate 20 reciprocally; During processing, after the soot is sucked into the filtering chamber, the flowing drives the fan blade 17 to rotate. The rotation of the fan blade 17 drives the rotation of the first rotating shaft 18. The rotation of the first rotating shaft 18 drives the rack plate 20 to move reciprocally. The movement of the rack plate 20 drives the gear 21 to rotate reciprocally. The rotation of the gear 21 drives the swing plate 22 to swing reciprocally. The swing of the swing plate 22 is connected through the connecting shaft 23 to drive the second spray head 13 to swing reciprocally, increasing the area of the blown area, helping the inert gas to better penetrate deep into the holes, ensuring that the hole walls are completely protected, and improving the quality and efficiency of circuit board manufacturing.

[0035] As Figure 4 、 Figure 5 and Figure 6 shown, a scraper 19 is fixedly installed at one end of the first rotating shaft 18 away from the rack plate 20. The scraper 19 is arranged on one side of the first filter screen 15.

[0036] During processing, the rotation of the first rotating shaft 18 drives the rotation of the scraper 19, so that the scraper 19 rotates on one side of the first filter screen 15, preventing the slag from blocking the first filter screen 15 and affecting the dust suction effect.

[0037] A forming method of a micro-hole forming device for a high aspect ratio blind via multi-layer PCB circuit board, comprising the following steps: S1: When processing the circuit board, first install the circuit board below the laser drilling head 5, and then drive the mounting seat 4 to move downward through the hydraulic cylinder 3. The movement of the mounting seat 4 drives the movement of the laser drilling head 5, so that the laser drilling head 5 moves downward to the top of the circuit board and drills it; S2: During processing, start the air pump 9 and the dust suction fan 12 at the same time. When the air pump 9 is started, it is connected through the second connecting pipe 8, the first connecting pipe 7 and the first nozzle 6, and inert gas is sprayed from the first nozzle 6 to the drilling area. When the dust suction fan 12 is started, it is connected through the fourth connecting pipe 24, the third connecting pipe 11 and the first dust suction pipe 10, and the slag and dust are sucked away from the drilling area; S3: At the same time, suck the area at the bottom of the mounting seat 4 through the second dust suction pipe 14 to clean the unprocessed area of the circuit board, and blow the drilled area through the second nozzle 13; S4: When the dust is sucked into the filter chamber, it drives the fan blade 17 to rotate. The rotation of the fan blade 17 drives the rotation of the first rotating shaft 18. The rotation of the first rotating shaft 18 drives the rack plate 20 to reciprocate. The movement of the rack plate 20 drives the gear 21 to rotate reciprocally. The rotation of the gear 21 drives the swing plate 22 to swing reciprocally. The swing of the swing plate 22 is connected through the connecting shaft 23 to drive the second nozzle 13 to swing reciprocally, increasing the area of the blowing area and improving the processing quality.

[0038] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A micro-hole forming device for a high aspect ratio blind hole multi-layer PCB circuit board, comprising an operating table (1), characterized in that: A top plate (2) is fixedly mounted on the top of the operating table (1), a hydraulic cylinder (3) is mounted on the top of the top plate (2), a mounting seat (4) is connected to the bottom of the hydraulic cylinder (3), a spray assembly and a dust suction assembly are arranged inside the mounting seat (4), a laser drilling head (5) is mounted on the bottom of the mounting seat (4), and the laser drilling head (5) is arranged above the operating table (1); The spray assembly comprises a first spray head (6) arranged inside the mounting seat (4), the first spray heads (6) are evenly distributed, each of the first spray heads (6) is fixedly connected via a first connecting pipe (7), the top end of the first connecting pipe (7) is fixedly connected to a second connecting pipe (8), the top end of the second connecting pipe (8) is equipped with an air pump (9), and the air pump (9) is arranged at the top end of the top plate (2); The dust suction assembly comprises a first dust suction pipe (10) arranged inside the mounting seat (4), the first dust suction pipes (10) being evenly distributed, each of the first dust suction pipes (10) being fixedly connected via a third connecting pipe (11), a fourth connecting pipe (24) being arranged at one end of the third connecting pipe (11) away from the first dust suction pipe (10), the fourth connecting pipe (24) being fixedly mounted on the top of the mounting seat (4), a dust suction fan (12) being installed on the top of the fourth connecting pipe (24), and the dust suction fan (12) being arranged on the top of the top plate (2).

2. The micro-hole forming device for a high aspect ratio blind via multi-layer PCB circuit board according to claim 1, characterized in that: The first nozzle (6) and the first dust suction pipe (10) are symmetrically arranged on both sides of the laser drilling head (5).

3. The micro-hole forming device for a high aspect ratio blind via multi-layer PCB circuit board according to claim 1, characterized in that: The middle parts of the second connecting pipe (8) and the fourth connecting pipe (24) are both configured as bellows.

4. The micro-hole forming device for a high aspect ratio blind via multi-layer PCB circuit board according to claim 1, characterized in that: A first filter screen (15) is provided at one end of the third connecting pipe (11) away from the first dust suction pipe (10), and the first filter screen (15) is installed inside the mounting seat (4).

5. The micro-hole forming device for a high aspect ratio blind via multi-layer PCB circuit board according to claim 1, characterized in that: A second filter screen (16) is provided below the fourth connecting pipe (24), and the second filter screen (16) is installed inside the mounting seat (4).

6. The micro-hole forming device for a high aspect ratio blind via multi-layer PCB circuit board according to claim 1, characterized in that: The bottom end of the third connecting pipe (11) is fixedly connected to a second dust suction pipe (14), and the second dust suction pipes (14) are evenly arranged.

7. The micro-hole forming device for a high aspect ratio blind via multi-layer PCB circuit board according to claim 1, characterized in that: The bottom end of the first connecting pipe (7) is fixedly connected to a second nozzle (13), the second nozzles (13) are evenly arranged, and the second nozzles (13) are mounted on the bottom of the mounting seat (4) via a rotating assembly.

8. The micro-hole forming device for a high aspect ratio blind via multi-layer PCB circuit board according to claim 7, characterized in that: The rotating assembly comprises a fan blade (17) arranged inside the mounting seat (4); a first rotating shaft (18) is fixedly mounted on the inner wall of the fan blade (17); one end of the first rotating shaft (18) is meshingly connected to a rack plate (20); and a top end of the rack plate (20) is meshingly connected to a gear (21); Each of the second nozzles (13) is fixedly connected via a connecting shaft (23), and swing plates (22) are fixedly mounted on both ends of the connecting shaft (23). Both swing plates (22) are rotatably mounted inside the mounting seat (4) via second rotating shafts (25), and one of the second rotating shafts (25) is fixedly connected to a gear (21).

9. The micro-hole forming device for a high aspect ratio blind via multi-layer PCB circuit board according to claim 8, characterized in that: A scraper (19) is fixedly mounted on one end of the first rotating shaft (18) away from the rack plate (20), and the scraper (19) is arranged on one side of the first filter screen (15).

10. A forming method of a micro-hole forming device for a multi-layer PCB circuit board with a high aspect ratio blind via, the method being applicable to the micro-hole forming device for a multi-layer PCB circuit board with a high aspect ratio blind via as described in claims 1-9, characterized in that: The following steps are involved: S1: When processing a circuit board, the circuit board is first mounted below the laser drilling head (5), and then the mounting base (4) is driven downward by the hydraulic cylinder (3). The movement of the mounting base (4) drives the movement of the laser drilling head (5), so that the laser drilling head (5) moves downward to the top of the circuit board to drill a hole therein; S2: During processing, the air pump (9) and the dust suction fan (12) are started simultaneously. When the air pump (9) is started, it is connected to the first nozzle (6) through the second connecting pipe (8), the first connecting pipe (7), and the first nozzle (6), and inert gas is sprayed from the first nozzle (6) to the drilling area. When the dust suction fan (12) is started, it is connected to the first dust suction pipe (10) through the fourth connecting pipe (24), the third connecting pipe (11), and the first dust suction pipe (10), so as to suck away slag and smoke from the drilling area. S3: At the same time, vacuuming the area at the bottom of the mounting seat (4) through the second vacuum pipe (14), cleaning the unprocessed area of ​​the circuit board, and spraying the area after drilling through the second nozzle (13); S4: When smoke is sucked into the filter chamber, the smoke flows and drives the fan blade (17) to rotate. The rotation of the fan blade (17) drives the first rotating shaft (18) to rotate. The rotation of the first rotating shaft (18) drives the rack plate (20) to move back and forth. The movement of the rack plate (20) drives the gear (21) to rotate back and forth. The rotation of the gear (21) drives the swing plate (22) to swing back and forth. The swing of the swing plate (22) drives the second nozzle (13) to swing back and forth through the connecting shaft (23), thereby increasing the area of ​​the spraying area and improving the processing quality.

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