Etching device for circuit board processing

Abstract

The invention belongs to the technical field of circuit board etching, and provides an etching device for circuit board processing, which comprises an etching box, the bottom of the etching box is communicated with a filter cavity, the inside of the etching box is divided into a plurality of diversion trenches, one side of each diversion trench is provided with a hydraulic pump, the hydraulic pumps are communicated between the diversion trenches and the filter cavity, and the filter cavity is communicated with the filter cavity. A liquid outlet pipe, in the flow guide groove, of the hydraulic pump is connected with a flow distribution plate, a rotating sleeve is arranged on the other side of the flow guide groove, the outer end face of the etching box is fixedly connected with a motor, the rotating sleeve is fixedly connected with an output shaft of the motor, and the rotating sleeve is rotationally connected with a plurality of rotating pipes; and a driving mechanism capable of driving all the rotating pipes to rotate in a reciprocating manner is arranged on the rotating sleeve. According to the invention, the regulation and control system can regulate and control the etching rate and the etching degree of the same batch of circuit boards by controlling the motor, the driving mechanism, the adjusting mechanism, the resistance assembly and the flow guide mechanism.

Description

Technical Field

[0001] The present invention belongs to the technical field of circuit board etching, and particularly relates to an etching device for circuit board processing. Background Art

[0002] Etching is a technique that removes some materials by using chemical reactions or physical impacts. Etching techniques can be divided into two categories: wet etching and dry etching. Etching was first used to manufacture printing relief plates such as copper plates and zinc plates, and was also widely used in lightening the panels of weight instruments; with continuous improvement and development of process equipment, etching can also be used for the processing of precision etched products of electronic thin sheet parts in the aviation, machinery, and chemical industries. Especially in the semiconductor manufacturing process, etching is an indispensable technique.

[0003] In the existing circuit board processing technology, in order to improve the etching efficiency, multiple circuit boards are generally placed in the etching solution for flushing. However, due to the different placement positions and current-carrying areas of each circuit board, there are significant differences in the etching rates and etching degrees of each circuit board. And after etching, there is still residual metal on some circuit boards that is difficult to remove, and these circuit boards need to be reworked, which affects the production rate. Summary of the Invention

[0004] The purpose of the present invention is to provide an etching device for circuit board processing, aiming to solve the technical problem in the prior art that due to the different placement positions and current-carrying areas of each circuit board, there are significant differences in the etching rates and etching degrees of each circuit board.

[0005] The present invention is implemented as follows. An etching device for circuit board processing includes an etching tank. A filter chamber is communicated with the bottom of the etching tank. The interior of the etching tank is partitioned into a plurality of diversion channels. A hydraulic pump is arranged on one side of each diversion channel. The hydraulic pump is communicated between the diversion channel and the filter chamber. The liquid outlet pipe of the hydraulic pump in the diversion channel is connected with a flow distribution plate. A rotating sleeve is arranged on the other side of the diversion channel. A motor is fixedly connected to the outer end face of the etching tank. The rotating sleeve is fixedly connected to the output shaft of the motor. The rotating sleeve is rotatably connected with a plurality of rotating pipes. A driving mechanism capable of driving all the rotating pipes to rotate reciprocally is arranged on the rotating sleeve. A resistance component is arranged between the rotating pipe and the rotating sleeve. The resistance component can control the rotation speed of the rotating pipe. Each rotating pipe is aligned with a diversion channel;

[0006] One end of each rotating pipe is rotatably connected with a placement disk. A limiting groove is opened on the placement disk. A plurality of elastic limiting blocks are distributed around the limiting groove on the limiting groove; An adjusting mechanism capable of driving the placement disk to rotate is arranged on the rotating pipe;

[0007] A flow guiding mechanism is provided in each of the flow guiding grooves, and the flow guiding mechanism can control the liquid pressure and hydraulic stability of the etching liquid on the circuit board when passing through the placement tray; a video monitor is provided on the upper side of the etching tank, and the video monitor can monitor the metal residues on all circuit boards.

[0008] A regulation system, which can regulate the etching rate and etching degree of the circuit boards in the same batch by controlling the motor, driving mechanism, adjusting mechanism, resistance component and flow guiding mechanism.

[0009] Further technical solution: The driving mechanism includes an electric telescopic rod, a first gear and an elastic torsion spring.

[0010] The rotating sleeve is fixedly connected with an electric telescopic rod through a connecting plate. A first gear is fixedly arranged on each rotating pipe. The telescopic end of the electric telescopic rod is provided with multiple sections of meshing teeth, and each section of meshing teeth can be meshed with a first gear. An elastic torsion spring is arranged between each rotating pipe and the rotating sleeve.

[0011] Further technical solution: The adjusting mechanism includes a limiting frame, a connecting seat and an electric pull rod.

[0012] The limiting frame is fixedly connected with the rotating pipe. The placement tray is fixedly connected with a connecting seat, and an electric pull rod is rotatably connected between the connecting seat and the limiting frame.

[0013] Further technical solution: The resistance component includes a sliding rod, an iron block and an electromagnet.

[0014] The bottom of the rotating pipe is vertically slidably connected with a sliding rod. The end of the sliding rod is fixedly connected with an iron block. Electromagnets are arranged on the inner wall of the rotating sleeve at positions opposite to the iron blocks, and friction pads are attached to the end faces of the electromagnets opposite to the iron blocks.

[0015] Further technical solution: The flow guiding mechanism includes a frame, a flow guiding plate, a flow dividing orifice plate, a second gear, a first electric rod and a second electric rod.

[0016] The inner end face of the flow guiding groove is fixedly connected with a frame. A plurality of flow guiding plates and a plurality of flow dividing orifice plates are rotatably connected along the vertical direction inside the frame. One end of the rotating shafts of all the flow guiding plates and the flow dividing orifice plates is fixedly connected with a second gear. The outer wall of the frame is fixedly connected with a first electric rod and a second electric rod. The telescopic end of the first electric rod is meshed with the second gears at one ends of all the flow guiding plates, and the telescopic end of the second electric rod is meshed with the second gears at one ends of all the flow dividing orifice plates.

[0017] Further technical solution: The rotating pipes are all fixedly connected with spiral fan blades, and a plurality of drainage holes are arranged around the inner side of the limiting groove.

[0018] Further technical solution: The regulation system includes:

[0019] A monitoring module, which includes a pressure sensor and a vibration frequency sensor. A pressure sensor is provided in each limit slot, and a vibration sensor is provided at the connection between the telescopic end of the electric pull rod and the connecting seat;

[0020] A processing module, which records the maximum pressure difference between multiple pressure sensors and the maximum vibration frequency difference between multiple vibration sensors. The data processor in the processing module compares the maximum pressure difference and the maximum vibration frequency difference with a preset pressure difference threshold and a preset vibration frequency difference threshold respectively, and forms corresponding judgment information;

[0021] A control module, which can regulate the motor, the driving mechanism, the adjustment mechanism, the resistance component and the diversion mechanism.

[0022] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0023] 1. The regulation system can regulate the etching rate and etching degree of the same batch of circuit boards by controlling the motor, the driving mechanism, the adjustment mechanism, the resistance component and the diversion mechanism.

[0024] 2. The motor drives the rotating sleeve to rotate, and the rotating sleeve drives the circuit boards on all the placement trays to deflect. By driving all the circuit boards through the rotating sleeve to maintain the same inclination degree, the current-carrying areas of multiple circuit boards are ensured to be the same; etching liquid is added to the etching tank, and the hydraulic pump is started to drive the etching liquid to circulate in the etching tank and the filtration chamber, so as to wash the surface of the circuit board;

[0025] 3. When the maximum pressure difference between each circuit board exceeds the preset pressure difference threshold, at this time, the corresponding first electric rod is started to extend, so that the circuit board with the minimum pressure value receives an increased scouring force of the etching liquid, thereby adjusting the etching degree between each circuit board to be approximately the same; when the maximum vibration frequency difference between each circuit board exceeds the preset vibration frequency difference threshold, at this time, the corresponding second electric rod is started to extend, so that the circuit board with the maximum vibration frequency value receives a uniform scouring force, thereby increasing the etching uniformity on the surface of each circuit board.

[0026] 4. When the video monitor detects that the residual metal on some circuit boards is difficult to remove, the telescopic end of the electric telescopic rod is started to extend. The telescopic end of the electric telescopic rod drives all the first gears to rotate, and all the first gears drive the rotating pipes connected to them to rotate respectively. At this time, all the elastic torsion springs contract. When the telescopic end of the electric telescopic rod is released from fixing with each first gear, at this time, all the elastic torsion springs drive the rotating pipes connected to them to rotate quickly in reverse, so that the rotating pipes drive the circuit boards in the placement trays to rotate reciprocally in the etching liquid, so that the etching liquid can scour the surface of the circuit board from multiple angles, increasing the scouring effect on the surface of the circuit board;

[0027] 5. Adjust the magnetic force of each electromagnet, thereby changing the frictional resistance between each iron block and the electromagnet. Adjusting the frictional resistance between the iron block and the electromagnet can adjust the reverse rotation speed of the rotating tube to decrease, thereby adjusting the rotation speed of the circuit board in the etching solution, and adjusting the flushing speed of the circuit board in the etching solution according to the area of the residual metal on the surface of each circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0029] Figure 2 It is a schematic diagram of the internal structure of the etching tank in the present invention.

[0030] Figure 3 It is a schematic diagram of the structure of the driving mechanism in the present invention.

[0031] Figure 4 It is a schematic diagram of the structure of the adjustment mechanism in the present invention.

[0032] Figure 5 It is a schematic diagram of the structure of the resistance component in the present invention.

[0033] Figure 6 It is a schematic diagram of the structure of the diversion mechanism in the present invention.

[0034] Figure 7 It is a schematic diagram of the structure of the diversion plate and the diversion holes in the present invention.

[0035] In the drawings: 1. Etching tank; 2. Diversion groove; 3. Motor; 4. Rotating sleeve; 5. Driving mechanism; 51. Electric telescopic rod; 52. First gear; 53. Elastic torsion spring; 6. Adjustment mechanism; 61. Limiting frame; 62. Connecting seat; 63. Electric pull rod; 7. Resistance component; 71. Slide bar; 72. Iron block; 73. Electromagnet; 8. Diversion mechanism; 81. Frame; 82. Diversion plate; 83. Diversion hole plate; 84. Second gear; 85. First electric rod; 86. Second electric rod; 9. Spiral fan blade; 10. Hydraulic pump; 11. Flow distribution plate; 12. Filter chamber; 13. Rotating tube; 14. Placing tray; 15. Limiting groove; 16. Elastic limiting block; 17. Drainage hole. DETAILED DESCRIPTION OF THE INVENTION

[0036] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0037] The following describes the specific implementation of the present invention in detail with reference to specific embodiments.

[0038] As shown in Figures 1 - 7 , an etching device for circuit board processing provided by the present invention includes an etching tank 1. A filter chamber 12 is communicated with the bottom of the etching tank 1. The interior of the etching tank 1 is partitioned into a plurality of diversion grooves 2. A hydraulic pump 10 is arranged on one side of each diversion groove 2. The hydraulic pump 10 is communicated between the diversion groove 2 and the filter chamber 12. The liquid outlet pipe of the hydraulic pump 10 in the diversion groove 2 is connected with a flow distribution plate 11. A rotating sleeve 4 is arranged on the other side of the diversion groove 2. A motor 3 is fixedly connected to the outer end face of the etching tank 1. The rotating sleeve 4 is fixedly connected to the output shaft of the motor 3. The rotating sleeve 4 is rotatably connected with a plurality of rotating pipes 13. A driving mechanism 5 capable of driving all the rotating pipes 13 to rotate reciprocally is arranged on the rotating sleeve 4. A resistance component 7 is arranged between the rotating pipe 13 and the rotating sleeve 4. The resistance component 7 can control the rotation speed of the rotating pipe 13. Each rotating pipe 13 is aligned with a diversion groove 2;

[0039] One end of each rotating pipe 13 is rotatably connected with a placement disk 14. A limiting groove 15 is formed in the placement disk 14. A plurality of elastic limiting blocks 16 are distributed around the limiting groove 15 on the limiting groove 15; An adjusting mechanism 6 capable of driving the placement disk 14 to rotate is arranged on the rotating pipe 13;

[0040] A diversion mechanism 8 is arranged in each of the diversion grooves 2. The diversion mechanism 8 can control the liquid pressure and hydraulic stability of the etching liquid on the circuit board when passing through the placement disk 14; A video monitor is arranged on the upper side of the etching tank 1. The video monitor can monitor the metal residues on all the circuit boards;

[0041] A regulation system, which can regulate the etching rate and etching degree of the circuit boards in the same batch by controlling the motor 3, the driving mechanism 5, the adjusting mechanism 6, the resistance component 7 and the diversion mechanism 8.

[0042] In this embodiment, a plurality of circuit boards are respectively placed in each of the limiting grooves 15, and the circuit boards are fixed by the respective elastic limiting blocks 16 in the limiting grooves 15. The motor 3 is started. The motor 3 drives the rotating sleeve 4 to rotate. The rotating sleeve 4 drives the circuit boards on all the placement disks 14 to deflect. When all the circuit boards rotate to an appropriate angle, the motor 3 is stopped;

[0043] Etching liquid is added into the etching tank 1. The hydraulic pump 10 is started to drive the etching liquid to circulate in the etching tank 1 and the filter chamber 12, so as to wash the surface of the circuit board;

[0044] When the video monitor detects that the residual metal on some circuit boards is difficult to remove, the driving mechanism 5 is started at this time. The driving mechanism 5 can drive all the rotating pipes 13 to reciprocate simultaneously, so that the rotating pipes 13 drive the circuit boards in the placement tray 14 to reciprocate in the etching solution, so that the etching solution can wash the surface of the circuit board from multiple angles, increasing the washing effect on the surface of the circuit board; further, the resistance component 7 can control the rotation speed of the rotating pipe 13, so as to control the rotation speed of each circuit board according to the area of the residual metal on the surface of the circuit board;

[0045] The diversion mechanism 8 can control the hydraulic pressure and hydraulic stability of the etching solution on the circuit board when passing through the placement tray 14, and the control system can adjust the etching rate and etching degree of the same batch of circuit boards by controlling the motor 3, the driving mechanism 5, the adjustment mechanism 6, the resistance component 7 and the diversion mechanism 8.

[0046] As Figure 3 shown, an etching device for circuit board processing provided by the present invention, the driving mechanism 5 includes an electric telescopic rod 51, a first gear 52 and a torsion spring 53;

[0047] The rotating sleeve 4 is fixedly connected with an electric telescopic rod 51 through a connecting plate. Each rotating pipe 13 is fixedly provided with a first gear 52. The telescopic end of the electric telescopic rod 51 is provided with multiple meshing teeth, and each meshing tooth can be meshed with a first gear 52. A torsion spring 53 is arranged between each rotating pipe 13 and the rotating sleeve 4.

[0048] In this embodiment, when the video monitor detects that the residual metal on some circuit boards is difficult to remove, the telescopic end of the electric telescopic rod 51 is started to extend. The telescopic end of the electric telescopic rod 51 drives all the first gears 52 to rotate, and all the first gears 52 drive the rotating pipes 13 connected thereto to rotate respectively. At this time, all the torsion springs 53 contract. When the telescopic end of the electric telescopic rod 51 is disengaged from each first gear 52, at this time, all the torsion springs 53 drive the rotating pipes 13 connected thereto to quickly reverse. Therefore, under the telescopic movement of the electric telescopic rod 51, each circuit board reciprocates in the etching solution, thereby increasing the washing effect of the etching solution on the surface of the circuit board.

[0049] As Figure 4 shown, an etching device for circuit board processing provided by the present invention, the adjustment mechanism 6 includes a limit frame 61, a connecting seat 62 and an electric pull rod 63;

[0050] The limit frame 61 is fixedly connected with the rotating pipe 13, the placement tray 14 is fixedly connected with a connecting seat 62, and an electric pull rod 63 is rotatably connected between the connecting seat 62 and the limit frame 61.

[0051] In this embodiment, when the video monitor detects that the surface metal corrosion degrees of each metal circuit board are different, the electric pull rod 63 on one side of the corresponding circuit board is started to expand and contract. The electric pull rod 63 drives the placement disk 14 to rotate through the connecting seat 62, so as to adjust the intercepted area of the etching solution by each placement disk 14, and thus adjust the etching rate of each circuit board.

[0052] As Figure 5 shown, an etching device for circuit board processing provided by the present invention, the resistance assembly 7 includes a slide rod 71, an iron block 72 and an electromagnet 73;

[0053] The bottom of the rotating tube 13 is vertically slidably connected with a slide rod 71, the end of the slide rod 71 is fixedly connected with an iron block 72, and electromagnets 73 are arranged at positions on the inner wall of the rotating sleeve 4 opposite to the iron block 72, and friction pads are attached to the end faces of the electromagnets 73 opposite to the iron block 72.

[0054] In this embodiment, the magnetic force of each electromagnet 73 is adjusted, so as to change the frictional resistance between each iron block 72 and the electromagnet 73;

[0055] When the telescopic end of the electric telescopic rod 51 is released from being fixed to each first gear 52, at this time, all the elastic torsion springs 53 drive the rotating tubes 13 connected thereto to quickly reverse. Adjusting the frictional resistance between the iron block 72 and the electromagnet 73 can adjust the reverse rotation speed of the rotating tube 13 to decrease, so as to adjust the rotation speed of the circuit board in the etching solution, and adjust the flushing speed of the circuit board in the etching solution according to the area of the residual metal on the surface of each circuit board.

[0056] As Figure 6 shown, an etching device for circuit board processing provided by the present invention, the diversion mechanism 8 includes a frame 81, a diversion plate 82, a shunt orifice plate 83, a second gear 84, a first electric rod 85 and a second electric rod 86;

[0057] The inner end face of the diversion groove 2 is fixedly connected with a frame 81. A plurality of diversion plates 82 and a plurality of shunt orifice plates 83 are rotatably connected in the vertical direction inside the frame 81. One ends of the rotating shafts of all the diversion plates 82 and the shunt orifice plates 83 are fixedly connected with second gears 84. The outer wall of the frame 81 is fixedly connected with a first electric rod 85 and a second electric rod 86. The telescopic end of the first electric rod 85 meshes with the second gears 84 at one ends of all the diversion plates 82, and the telescopic end of the second electric rod 86 meshes with the second gears 84 at one ends of all the shunt orifice plates 83.

[0058] In this embodiment, the first electric rod 85 is activated to expand and contract, and the first electric rod 85 drives all the flow guiding plates 82 to rotate. When the angle between the flow guiding plate 82 and the vertical direction decreases, the flow guiding effect of the flow guiding plate 82 on the etching solution increases. Under the guiding action of all the flow guiding plates 82, the scouring force of the etching solution on the circuit board increases, thereby improving the scouring effect of the circuit board.

[0059] The second electric rod 86 is activated to expand and contract, and the second electric rod 86 drives all the flow dividing orifice plates 83 to rotate. The etching solution passes through each flow guiding orifice on the flow dividing orifice plate 83. When the cut-off area of the flow dividing orifice plate 83 increases, the uniform distribution effect of the etching solution in the flow guiding groove 2 increases at this time.

[0060] As Figure 4 shown, an etching device for circuit board processing provided by the present invention, the rotating pipes 13 are all fixedly connected with spiral fan blades 9, and a plurality of drainage holes 17 are arranged around the inner side of the limiting groove 15.

[0061] In this embodiment, when the driving mechanism 5 drives all the rotating pipes 13 to reciprocate and rotate, at this time the drainage holes 17 rotate synchronously with the rotating pipes 13. Under the guiding action of the drainage holes 17, the etching solution flushes downward from the upper side of the circuit board through the drainage holes 17, thereby improving the scouring effect of the etching solution on the metal residues on the surface of the circuit board.

[0062] An etching device for circuit board processing provided by the present invention, the regulation system includes:

[0063] A monitoring module, which includes a pressure sensor and a vibration frequency sensor. A pressure sensor is arranged in each limiting groove 15, and a vibration sensor is arranged at the connection between the telescopic end of the electric pull rod 63 and the connection seat 62;

[0064] A processing module, records the maximum pressure difference between multiple pressure sensors and the maximum vibration frequency difference between multiple vibration sensors, and compares the maximum pressure difference and the maximum vibration frequency difference with a preset pressure difference threshold and a preset vibration frequency difference threshold respectively through a data processor in the processing module, and forms corresponding judgment information;

[0065] A control module, which can regulate the motor 3, the driving mechanism 5, the adjustment mechanism 6, the resistance component 7 and the flow guiding mechanism 8.

[0066] In this embodiment, in order to ensure that the etching degrees of multiple circuit boards are the same, the multiple circuit boards are respectively placed in each limiting groove 15, and all the circuit boards are driven by the rotating sleeve 4 to maintain the same inclination degree, so as to ensure that the cut-off areas of the multiple circuit boards are the same;

[0067] When the maximum pressure difference between the circuit boards exceeds the preset pressure difference threshold, the corresponding first electric rod 85 is activated to extend, increasing the scouring force of the etching solution on the circuit board with the minimum pressure value, thereby adjusting the etching degree between the circuit boards to be approximately the same;

[0068] When the maximum vibration frequency difference between the circuit boards exceeds the preset vibration frequency difference threshold, the corresponding second electric rod 86 is activated to extend, enabling the circuit board with the maximum vibration frequency value to receive a uniform scouring force, thereby increasing the etching uniformity on the surfaces of the circuit boards.

[0069] Working principle:

[0070] Place multiple circuit boards in the respective limiting slots 15, and fix the circuit boards through the respective elastic limiting blocks 16 in the limiting slots 15. Start the motor 3, and the motor 3 drives the rotating sleeve 4 to rotate. The rotating sleeve 4 drives the circuit boards on all the placement disks 14 to deflect, and through the rotating sleeve 4, all the circuit boards are kept at the same inclination degree, thereby ensuring that the current-carrying areas of the multiple circuit boards are the same; Add the etching solution to the etching tank 1, and start the hydraulic pump 10 to drive the etching solution to circulate in the etching tank 1 and the filtration chamber 12, thereby scouring the surfaces of the circuit boards;

[0071] When the maximum pressure difference between the circuit boards exceeds the preset pressure difference threshold, the corresponding first electric rod 85 is activated to extend, increasing the scouring force of the etching solution on the circuit board with the minimum pressure value, thereby adjusting the etching degree between the circuit boards to be approximately the same;

[0072] When the maximum vibration frequency difference between the circuit boards exceeds the preset vibration frequency difference threshold, the corresponding second electric rod 86 is activated to extend, enabling the circuit board with the maximum vibration frequency value to receive a uniform scouring force, thereby increasing the etching uniformity on the surfaces of the circuit boards.

[0073] When the video monitor detects that the residual metal on some circuit boards is difficult to remove, the telescopic end of the electric telescopic rod 51 is activated to extend. The telescopic end of the electric telescopic rod 51 drives all the first gears 52 to rotate. All the first gears 52 respectively drive the rotating pipes 13 connected to them to rotate. At this time, all the elastic torsion springs 53 contract. When the telescopic end of the electric telescopic rod 51 is disengaged from the respective first gears 52, all the elastic torsion springs 53 respectively drive the rotating pipes 13 connected to them to quickly reverse, so that the rotating pipes 13 drive the circuit boards in the placement disks 14 to rotate reciprocally in the etching solution, thereby enabling the etching solution to scour the surfaces of the circuit boards from multiple angles and increasing the scouring effect on the surfaces of the circuit boards;

[0074] Further, adjust the magnetic force of each electromagnet 73, so as to change the frictional resistance between each iron block 72 and the electromagnet 73. Adjusting the frictional resistance between the iron block 72 and the electromagnet 73 can adjust the reduction of the reverse rotation rate of the rotating tube 13, thereby adjusting the rotation rate of the circuit board in the etching solution, and adjusting the flushing speed of the circuit board in the etching solution according to the area of the residual metal on the surface of each circuit board.

[0075] When the video monitor detects that the metal corrosion degrees on the surfaces of the metal circuit boards are different, at this time, the electric pull rod 63 on one side of the corresponding circuit board is activated to expand and contract. The electric pull rod 63 drives the placement disk 14 to rotate through the connecting seat 62, thereby adjusting the intercepted area of the etching solution by each placement disk 14, and thus adjusting the etching rate of each circuit board.

[0076] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

[0077] In addition, it should be understood that although this specification is described according to the embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An etching device for processing a circuit board, comprising an etching box (1), wherein the bottom of the etching box (1) is connected to a filter chamber (12), characterized in that: The etching box (1) is internally divided into a plurality of guide grooves (2), each guide groove (2) is provided with a hydraulic pump (10) on one side, the hydraulic pump (10) is connected between the guide groove (2) and the filter chamber (12), the other side of the guide groove (2) is provided with a rotating sleeve (4), the outer end surface of the etching box (1) is fixedly connected with a motor (3), the rotating sleeve (4) is fixedly connected with an output shaft of the motor (3), the rotating sleeve (4) is rotatably connected with a plurality of rotating tubes (13), the rotating sleeve (4) is provided with a driving mechanism (5) capable of driving all the rotating tubes (13) to reciprocate, a resistance component (7) is provided between the rotating tube (13) and the rotating sleeve (4), the resistance component (7) is capable of controlling the rotation rate of the rotating tube (13); One end of the rotating tube (13) is rotatably connected to a placement plate (14), a limiting groove (15) is provided on the placement plate (14), and a plurality of elastic limiting blocks (16) are distributed around the limiting groove (15); an adjustment mechanism (6) capable of driving the placement plate (14) to rotate is provided on the rotating tube (13); The guide grooves (2) are all provided with guide mechanisms (8), and the guide mechanisms (8) can control the hydraulic pressure and hydraulic stability of the etching liquid on the circuit board when the etching liquid passes through the placement plate (14); the upper side of the etching box (1) is provided with a video monitor capable of monitoring the metal residue on all circuit boards; A control system can control the etching rate and etching degree of the same batch of circuit boards by controlling a motor (3), a driving mechanism (5), an adjustment mechanism (6), a resistance component (7) and a flow guide mechanism (8).

2. The etching device for circuit board processing according to claim 1, characterized in that: The driving mechanism (5) comprises an electric telescopic rod (51), a first gear (52) and an elastic torsion spring (53); The rotating sleeve (4) is fixedly connected to an electric telescopic rod (51) via a connecting plate, each rotating tube (13) is fixedly provided with a first gear (52), a telescopic end of the electric telescopic rod (51) is provided with a plurality of meshing teeth, each meshing tooth can mesh with a first gear (52), and an elastic torsion spring (53) is provided between each rotating tube (13) and the rotating sleeve (4).

3. The etching device for circuit board processing according to claim 1, characterized in that: The adjustment mechanism (6) comprises a limiting frame (61), a connecting seat (62) and an electric pull rod (63); The limiting frame (61) is fixedly connected to the rotating tube (13), the placing plate (14) is fixedly connected to a connecting seat (62), and an electric pull rod (63) is rotatably connected between the connecting seat (62) and the limiting frame (61).

4. The etching device for circuit board processing according to claim 1, characterized in that: The resistance assembly (7) comprises a sliding rod (71), an iron block (72) and an electromagnet (73); The bottom of the rotating tube (13) is vertically slidably connected to a slide bar (71), the end of the slide bar (71) is fixedly connected to an iron block (72), and an electromagnet (73) is arranged at a position of the inner wall of the rotating sleeve (4) facing the iron block (72), and friction pads are attached to the end faces of the electromagnet (73) and the iron block (72) opposite to each other.

5. The etching device for circuit board processing according to claim 1, characterized in that: The flow guide mechanism (8) comprises a frame (81), a flow guide plate (82), a flow splitter plate (83), a second gear (84), a first electric rod (85) and a second electric rod (86); The inner end surface of the guide groove (2) is fixedly connected to a frame (81), and a plurality of guide plates (82) and a plurality of flow diversion orifice plates (83) are vertically rotatably connected inside the frame (81), and one end of the rotation shaft of all the guide plates (82) and the flow diversion orifice plates (83) is fixedly connected to a second gear (84), and the outer wall of the frame (81) is fixedly connected to a first electric rod (85) and a second electric rod (86), and the telescopic end of the first electric rod (85) is meshed with the second gear (84) at one end of all the guide plates (82), and the telescopic end of the second electric rod (86) is meshed with the second gear (84) at one end of all the flow diversion orifice plates (83).

6. The etching device for circuit board processing according to claim 1, characterized in that: The rotating tubes (13) are all fixedly connected with spiral blades (9), and a plurality of drainage holes (17) are arranged around the inner side of the limiting groove (15).

7. The etching device for circuit board processing according to claim 3, characterized in that: The control system comprises: A monitoring module, comprising a pressure sensor and a vibration frequency sensor, wherein each limit groove (15) is provided with a pressure sensor, and a vibration sensor is provided at the connection between the telescopic end of the electric pull rod (63) and the connecting seat (62); A processing module, recording the maximum pressure difference between the multiple pressure sensors and the maximum frequency difference between the multiple vibration sensors, and comparing the maximum pressure difference and the maximum frequency difference with a preset pressure difference threshold and a preset frequency difference threshold through a data processor in the processing module, and forming corresponding judgment information; A control module is capable of regulating the motor (3), the driving mechanism (5), the adjusting mechanism (6), the resistance component (7) and the flow guiding mechanism (8).

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