Anti-interference bending-resistant multi-layer PCB (Printed Circuit Board) forming processing equipment and processing method thereof

Abstract

The invention discloses an anti-interference bending-resistant multi-layer PCB forming processing device and a processing method thereof, and relates to the technical field of PCB processing, the anti-interference bending-resistant multi-layer PCB forming processing device comprises a first working platform and a second working platform, the first working platform is located on the left side of the second working platform, and the second working platform is located on the right side of the second working platform. A conveying assembly is installed on the left side of the top of the first working platform, a transferring assembly is installed on the right side of the top of the first working platform, a moving assembly is installed on the top of the second working platform, a positioning assembly is installed on the top of the moving assembly, and a first buffering assembly is installed in the positioning assembly. According to the scheme, the problems that in the using process, most of existing multilayer circuit board pressing devices are fixed in an individual shape, moving machining cannot be carried out, impact is large in the downward pressing process of an upper pressing plate, and circuit boards are likely to be dislocated and damaged are solved.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB circuit board processing, and specifically relates to an anti-interference and bend-resistant multi-layer PCB circuit board forming and processing device and a processing method thereof. Background Technique

[0002] PCB, whose Chinese name is printed circuit board, also known as printed wiring board, is an important electronic component, a support for electronic components, and a carrier for the electrical interconnection of electronic components. Since it is made by electronic printing technology, it is called a "printed" circuit board.

[0003] At present, for the multi-layer circuit board lamination device, such as a multi-layer circuit board lamination device mentioned in the publication number CN211580343U, this device includes a processing box. A lamination table is fixed at the bottom inside the processing box. The circuit board is placed above the lamination table. A hydraulic cylinder is fixed on the outer side plate at the top of the processing box. Support sleeves are fixed on the left and right side plates inside the processing box. A stable sleeve is fixedly sleeved in the middle of the support sleeve. The bottom movable rods of the hydraulic cylinder respectively penetrate through the top of the processing box and are slidably inserted into the stable sleeve. A pressing block is fixed at the bottom of the movable rod. The left and right sides of the bottom of the support sleeve are both slidably connected with clamping plates. Connecting rods are hinged on the left and right clamping plates. The other end of the connecting rod is hinged with the pressing block. Contact blocks are fixed at the relative ends of the left and right clamping plates.

[0004] During the use of the existing multi-layer circuit board lamination device, it is often fixed in shape and cannot be moved for processing. The impact during the downward pressing of the upper lamination plate is relatively large, which is likely to cause misalignment and damage of the circuit board. Therefore, we provide an anti-interference and bend-resistant multi-layer PCB circuit board forming and processing device and a processing method thereof. Summary of the Invention

[0005] The purpose of the present invention is to provide an anti-interference and bend-resistant multi-layer PCB circuit board forming and processing device and a processing method thereof, so as to solve the problems in the above background technique that the existing multi-layer circuit board lamination device is often fixed in shape during use, cannot be moved for processing, and the impact during the downward pressing of the upper lamination plate is relatively large, which is likely to cause misalignment and damage of the circuit board.

[0006] To achieve the above object, the present invention provides the following technical solutions: An anti-interference and bend-resistant multi-layer PCB circuit board forming and processing device, including a first working platform and a second working platform. The first working platform is located on the left side of the second working platform. A conveying component is installed on the left side of the top of the first working platform. A transfer component is installed on the right side of the top of the first working platform. A moving component is installed on the top of the second working platform. A positioning component is installed on the top of the moving component. A first buffer component is installed inside the positioning component. A lamination and shaping component is installed on the right side of the top of the second working platform. Second buffer components are installed at both ends inside the lamination and shaping component. Support legs are installed around the bottom of the first working platform and around the bottom of the second working platform.

[0007] Preferably, the conveying component includes two side plates located at both ends of the top of the first working platform. A plurality of groups of conveying rollers are installed between the two side plates. One end of the conveying rollers on one side is installed with a first driving motor. The surfaces of the plurality of groups of conveying rollers are connected by a conveying belt. A reinforcing plate is installed on the left side between the two side plates and is located inside the conveying belt.

[0008] Preferably, a photoelectric emitter and a photoelectric receiver are respectively installed at one end of the opposite surfaces on the left side of the two side plates. A PLC controller is installed at one end of the side plate. The output end of the photoelectric emitter is electrically connected to the input end of the photoelectric receiver. The output end of the photoelectric receiver is electrically connected to the input end of the PLC controller. The output end of the PLC controller is electrically connected to the input end of the first driving motor.

[0009] Preferably, the transfer component includes a second driving motor located at the bottom on the left side of the first working platform. A turntable is installed on the output shaft at the top of the second driving motor. A support frame is installed on the top of the turntable. A hydraulic cylinder is installed on the inner top of the support frame. A fixed block is installed at the bottom of the hydraulic cylinder. A suction cup is installed at the bottom of the fixed block. An internal groove is provided inside the fixed block. The suction cup communicates with the internal groove. A negative pressure pump is installed on the top of the support frame. An air delivery pipe is installed on one side of the negative pressure pump. The other end of the air delivery pipe communicates with the internal groove.

[0010] Preferably, the moving component includes two grooves located at both ends of the top of the second working platform. A threaded rod is installed inside the groove. A third driving motor is installed on one side of the threaded rod. A first slider is threadedly connected to the outer wall of the threaded rod.

[0011] Preferably, the positioning component includes a fixing plate located at the top of the first slider. A cross-shaped groove is provided at the top of the fixing plate. Two bidirectional threaded rods are installed inside the cross-shaped groove. The two bidirectional threaded rods are perpendicular to each other and located on different horizontal planes. One end of each bidirectional threaded rod is equipped with a fourth driving motor. Second sliders are symmetrically installed at both ends of the outer wall of each bidirectional threaded rod. A first L-shaped plate is installed at the top of each second slider. A positioning plate is installed at the other end of the first L-shaped plate. A placing plate is installed on the upper part of the fixing plate.

[0012] Preferably, the first buffer component includes four fixed sleeves located around the top of the fixing plate. A first buffer spring is installed inside each fixed sleeve. A buffer plate is installed at the top of the first buffer spring. A buffer column is installed at the top of the buffer plate. The top of the buffer column is fixedly connected to the bottom of the placing plate. A limiting ring is installed at the top of the fixed sleeve.

[0013] Preferably, the lamination and shaping component includes a fixing frame located on the left side of the top of the second working platform. A cylinder is installed on the outer top of the fixing frame. The bottom of the cylinder penetrates through the upper plate of the fixing frame and is equipped with a lower pressing plate.

[0014] Preferably, the second buffer component includes two vertical grooves located at both ends inside the fixing frame. A sliding rod is installed inside each vertical groove. A second L-shaped plate is slidably connected to the outer wall of the sliding rod. The bottom of the other end of the second L-shaped plate is fixedly connected to the top of the lower pressing plate. A second buffer spring is installed between the second L-shaped plate and the inner bottom of the vertical groove.

[0015] Preferably, a processing method for an anti-interference and bend-resistant multi-layer PCB circuit board forming and processing device includes the following steps: Step 1: Place the circuit boards on the top of the conveyor belt in the installation order. The conveyor component conveys the circuit boards to the lower part of the transfer component. The circuit boards are adsorbed by the suction cups, and the transfer component transfers the circuit boards to the top of the placing plate. Step 2: Start the fourth driving motor. The fourth driving motor drives the bidirectional threaded rods to rotate, making the two groups of second sliders approach each other, thereby driving the positioning plate to move towards the center of the placing plate, and the multi-layer circuit boards can be aligned. Step 3: After the multi-layer circuit boards are aligned, start the third driving motor. The third driving motor drives the threaded rod to rotate, thereby driving the fixing plate to move through the first slider, and moving the multi-layer circuit boards to directly below the lower pressing plate. Step 4: Drive the lower pressing plate to move downward through the cylinder to laminate and shape the multi-layer circuit board; Step 5: The combined action of the first buffer spring, the buffer plate and the buffer column can provide a buffer force to the placement plate, and the combined action of the sliding rod, the second L-shaped plate and the second buffer spring can provide a buffer force to the lower pressing plate, so that the multi-layer circuit board is evenly stressed and damage to the circuit board caused by excessive local pressure is avoided.

[0016] Compared with the prior art, the beneficial effects of the present invention are: (1) The present invention drives the lower pressing plate to move downward through the cylinder to laminate and shape the multi-layer circuit board. When the lower pressing plate presses the multi-layer circuit board, it will cause a downward impact force on the placement plate. The combined action of the first buffer spring, the buffer plate and the buffer column can absorb the impact force received by the placement plate, thereby protecting the circuit board from damage. When the lower pressing plate moves downward, the combined action of the sliding rod, the second L-shaped plate and the second buffer spring can provide an upward buffer force to the lower pressing plate, which can reduce the damage to the circuit board caused by mechanical impact, ensure the stability and accuracy of the lamination process, and also make the multi-layer circuit board evenly stressed and avoid damage to the circuit board caused by excessive local pressure, solving the problem that the upper pressing plate of the existing multi-layer circuit board pressing device has a large impact during the downward pressing process, which is easy to cause misalignment and damage of the circuit board.

[0017] (2) The combined action of the conveying roller, the first driving motor and the conveying belt drives the circuit board to be automatically loaded. When the photoelectric receiver cannot receive the signal emitted by the photoelectric emitter, the photoelectric receiver sends an electrical signal to the PLC controller, so that the PLC controller controls the first driving motor to stop working. At the same time, the suction cup is attached to the surface of the circuit board through the hydraulic cylinder, and the negative pressure pump is started. The combined action of the air delivery pipe and the built-in groove can make the suction cup generate an adsorption force, thereby fixing the circuit board on the suction cup. The second driving motor drives the turntable to rotate, and then drives the circuit board to rotate and place the circuit board on the positioning component. After the multi-layer circuit boards are aligned, the third driving motor is started, and the third driving motor drives the threaded rod to rotate, so as to drive the fixed plate to move through the first slider, and move the multi-layer circuit board to directly below the lower pressing plate, solving the problem that the existing multi-layer circuit board pressing device is often individual-shaped and fixed during use and cannot perform mobile processing.

[0018] (3) Start the fourth driving motor, drive the bidirectional threaded rod to rotate through the fourth driving motor, make the two second sliders approach each other, and thus drive the positioning plate to move towards the center of the placement plate, and the multi-layer circuit boards can be aligned. Brief Description of the Drawings

[0019] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 is a schematic upper view cross-sectional structure of the present invention; Figure 3 is a schematic front view cross-sectional structure of the first working platform in the present invention; Figure 4 is a schematic front view cross-sectional structure of the second working platform in the present invention; Figure 5 is a schematic left view cross-sectional structure of the second working platform in the present invention Figure 1 ; Figure 6 is a schematic left view cross-sectional structure of the second working platform in the present invention Figure 2 ; Figure 7 is a schematic left view cross-sectional structure of the second working platform in the present invention Figure 3 ; In the figure: 1. First working platform; 2. Second working platform; 3. Conveying component; 31. Side plate; 32. Conveying roller; 33. First driving motor; 34. Conveying belt; 35. Reinforcing plate; 36. Photoelectric emitter; 37. Photoelectric receiver; 38. PLC controller; 4. Transferring component; 41. Second driving motor; 42. Turntable; 43. Support frame; 44. Hydraulic cylinder; 45. Fixed block; 46. Suction cup; 47. Built-in groove; 48. Negative pressure pump; 49. Air pipe; 5. Moving component; 51. Groove; 52. Threaded rod; 53. Third driving motor; 54. First slider; 6. Positioning component; 61. Fixed plate; 62. Cross-shaped groove; 63. Bidirectional threaded rod; 64. Fourth driving motor; 65. Second slider; 66. First L-shaped plate; 67. Positioning plate; 68. Placing plate; 7. First buffer component; 71. Fixed sleeve; 72. First buffer spring; 73. Buffer plate; 74. Buffer column; 75. Limit ring; 8. Laminating and shaping component; 81. Fixed frame; 82. Cylinder; 83. Lower pressing plate; 9. Second buffer component; 91. Vertical groove; 92. Slide rod; 93. Second L-shaped plate; 94. Second buffer spring; 10. Support leg. Specific embodiments

[0020] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0021] Please refer to Figure 1-7, an embodiment provided by the present invention: an anti-interference and bend-resistant multi-layer PCB circuit board forming and processing device, including a first working platform 1 and a second working platform 2. The first working platform 1 is located on the left side of the second working platform 2. On the left side of the top of the first working platform 1, a conveying component 3 is installed. On the right side of the top of the first working platform 1, a transfer component 4 is installed. On the top of the second working platform 2, a moving component 5 is installed. On the top of the moving component 5, a positioning component 6 is installed. Inside the positioning component 6, a first buffer component 7 is installed. On the right side of the top of the second working platform 2, a lamination and shaping component 8 is installed. At both ends inside the lamination and shaping component 8, a second buffer component 9 is installed. Around the bottom of the first working platform 1 and around the bottom of the second working platform 2, support legs 10 are installed.

[0022] Please refer to Figure 3 , the conveying component 3 includes two side plates 31. The side plates 31 are located at both ends of the top of the first working platform 1. Between the two side plates 31, multiple groups of conveying rollers 32 are installed. At one end of the conveying rollers 32 on one side, a first driving motor 33 is installed. The surfaces of the multiple groups of conveying rollers 32 are connected by a conveying belt 34. On the left side between the two side plates 31, a reinforcing plate 35 is installed. The reinforcing plate 35 is located inside the conveying belt 34.

[0023] Please refer to Figure 2 , at one end of the opposite surfaces on the left side of the two side plates 31, a photoelectric emitter 36 and a photoelectric receiver 37 are respectively installed. At one end of the side plate 31, a PLC controller 38 is installed. The output end of the photoelectric emitter 36 is electrically connected to the input end of the photoelectric receiver 37. The output end of the photoelectric receiver 37 is electrically connected to the input end of the PLC controller 38. The output end of the PLC controller 38 is electrically connected to the input end of the first driving motor 33.

[0024] Please refer to Figure 3 , the transfer component 4 includes a second driving motor 41. The second driving motor 41 is located at the bottom on the left side of the first working platform 1. On the output shaft at the top of the second driving motor 41, a turntable 42 is installed. On the top of the turntable 42, a support frame 43 is installed. Inside the top of the support frame 43, a hydraulic cylinder 44 is installed. At the bottom of the hydraulic cylinder 44, a fixing block 45 is installed. At the bottom of the fixing block 45, a suction cup 46 is installed. Inside the fixing block 45, an internal groove 47 is provided. The suction cup 46 communicates with the internal groove 47. On the top of the support frame 43, a negative pressure pump 48 is installed. On one side of the negative pressure pump 48, an air delivery pipe 49 is installed. The other end of the air delivery pipe 49 communicates with the internal groove 47.

[0025] Place the circuit boards on the top of the conveyor belt 34 in the installation order respectively. The circuit boards are driven for automatic feeding through the combined action of the conveyor rollers 32, the first drive motor 33 and the conveyor belt 34. When the photoelectric receiver 37 fails to receive the signal emitted by the photoelectric emitter 36, an electrical signal is sent to the PLC controller 38 through the photoelectric receiver 37, causing the PLC controller 38 to control the first drive motor 33 to stop working. At the same time, the suction cup 46 is brought into contact with the surface of the circuit board through the hydraulic cylinder 44. The support plate 35 can provide support for the circuit board to prevent the circuit board from being overly bent. Start the negative pressure pump 48. Through the combined action of the air delivery pipe 49 and the built-in groove 47, the suction cup 46 can generate an adsorption force, thereby fixing the circuit board on the suction cup 46. The turntable 42 is driven to rotate by the second drive motor 41, and then the circuit board is driven to rotate and the circuit board is placed on the positioning assembly 6.

[0026] Start the fourth drive motor 64. The fourth drive motor 64 drives the bidirectional threaded rod 63 to rotate, causing the two second sliders 65 to approach each other, thereby driving the positioning plate 67 to move towards the center of the placement plate 68, and the multi-layer circuit boards can be aligned.

[0027] Please refer to Figure 2 , the moving assembly 5 includes two grooves 51. The grooves 51 are located at both ends of the top of the second working platform 2. A threaded rod 52 is installed inside the groove 51. A third drive motor 53 is installed on one side of the threaded rod 52. A first slider 54 is threadedly connected to the outer wall of the threaded rod 52.

[0028] After the multi-layer circuit boards are aligned, start the third drive motor 53. The third drive motor 53 drives the threaded rod 52 to rotate, thereby driving the fixed plate 61 to move through the first slider 54, and moving the multi-layer circuit boards to directly below the lower pressing plate 83.

[0029] Please refer to Figure 4 and Figure 5 , the positioning assembly 6 includes a fixed plate 61. The fixed plate 61 is located on the top of the first slider 54. A cross-shaped groove 62 is provided on the top of the fixed plate 61. Two bidirectional threaded rods 63 are installed inside the cross-shaped groove 62. The two bidirectional threaded rods 63 are perpendicular to each other and located on different horizontal planes. A fourth drive motor 64 is installed at one end of the bidirectional threaded rod 63. Second sliders 65 are symmetrically installed at both ends of the outer wall of the bidirectional threaded rod 63. A first L-shaped plate 66 is installed on the top of the second slider 65. The other end of the first L-shaped plate 66 is installed with a positioning plate 67. A placement plate 68 is installed on the upper part of the fixed plate 61.

[0030] Please refer to Figure 6The first buffer assembly 7 includes four fixed sleeves 71, and the fixed sleeves 71 are located around the top of the fixed plate 61. A first buffer spring 72 is installed inside the fixed sleeve 71, and a buffer plate 73 is installed on the top of the first buffer spring 72. A buffer column 74 is installed on the top of the buffer plate 73. The top of the buffer column 74 is fixedly connected to the bottom of the placement plate 68, and a limiting ring 75 is installed on the top of the fixed sleeve 71.

[0031] See also Figure 7 The lamination shaping assembly 8 includes a fixing frame 81, which is located on the left side of the top of the second working platform 2. A cylinder 82 is installed on the outer top of the fixing frame 81, and a lower pressing plate 83 is installed on the bottom of the cylinder 82 through the upper plate of the fixing frame 81.

[0032] See also Figure 7 The second buffer assembly 9 includes two vertical grooves 91, which are located at both ends of the fixed frame 81. A sliding rod 92 is installed inside the vertical groove 91. The outer wall of the sliding rod 92 is slidably connected with a second L-shaped plate 93. The bottom of the other end of the second L-shaped plate 93 is fixedly connected to the top of the lower pressure plate 83, and a second buffer spring 94 is installed between the second L-shaped plate 93 and the bottom of the vertical groove 91.

[0033] The cylinder 82 drives the lower pressure plate 83 to move downward to laminate and shape the multi-layer circuit board. When the lower pressure plate 83 presses the multi-layer circuit board, the placement plate 68 will generate a downward impact force. The first buffer spring 72, the buffer plate 73 and the buffer column 74 can absorb the impact force on the placement plate 68, thereby protecting the circuit board from damage. When the lower pressure plate 83 moves downward, the sliding rod 92, the second L-shaped plate 93 and the second buffer spring 94 can provide an upward buffering force to the lower pressure plate 83, which can reduce the damage to the circuit board caused by mechanical impact, ensure the stability and accuracy of the lamination process, and make the multi-layer circuit board evenly stressed to avoid damage to the circuit board caused by excessive local pressure.

[0034] See also Figure 1-7 , a processing method of an anti-interference and bending-resistant multi-layer PCB circuit board forming processing equipment, comprising the following steps: Step 1: Place the circuit boards on the top of the conveyor belt 34 in the order of installation, convey the circuit boards to the bottom of the transfer assembly 4 through the conveyor assembly 3, adsorb the circuit boards through the suction cup 46, and transfer the circuit boards to the top of the placement plate 68 through the transfer assembly 4; Step 2: Start the fourth drive motor 64, and drive the bidirectional threaded rod 63 to rotate through the fourth drive motor 64, so that the two sets of second sliders 65 are close to each other, thereby driving the positioning plate 67 to move toward the center of the placement plate 68, so that the multi-layer circuit board can be aligned; Step 3: After the multi-layer circuit board is aligned, start the third driving motor 53. Drive the threaded rod 52 to rotate through the third driving motor 53, so as to drive the fixing plate 61 to move through the first slider 54, and move the multi-layer circuit board to directly below the lower pressing plate 83; Step 4: Drive the lower pressing plate 83 to move downward through the cylinder 82 to laminate and shape the multi-layer circuit board; Step 5: The combined action of the first buffer spring 72, the buffer plate 73 and the buffer column 74 can provide a buffer force for the placement plate 68, and the combined action of the sliding rod 92, the second L-shaped plate 93 and the second buffer spring 94 can provide a buffer force for the lower pressing plate 83, so that the multi-layer circuit board is uniformly stressed and damage to the circuit board caused by excessive local pressure is avoided.

[0035] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present invention. Any reference signs in the claims should not be regarded as limiting the claimed rights.

Claims

1. An anti-interference and anti-bending multi-layer PCB circuit board forming and processing equipment, comprising a first working platform (1) and a second working platform (2), characterized in that: The first working platform (1) is located on the left side of the second working platform (2); a conveying component (3) is installed on the left side of the top of the first working platform (1); a transfer component (4) is installed on the right side of the top of the first working platform (1); a moving component (5) is installed on the top of the second working platform (2); a positioning component (6) is installed on the top of the moving component (5); a first buffer component (7) is installed inside the positioning component (6); a laminating and shaping component (8) is installed on the right side of the top of the second working platform (2); second buffer components (9) are installed at both ends of the laminating and shaping component (8); and supporting legs (10) are installed around the bottom of the first working platform (1) and around the bottom of the second working platform (2).

2. The anti-interference and bending-resistant multi-layer PCB circuit board forming and processing equipment according to claim 1 is characterized in that: The conveying assembly (3) comprises two side plates (31), wherein the side plates (31) are located at two ends of the top of the first working platform (1), and a plurality of groups of conveying rollers (32) are installed between the two side plates (31), wherein a first driving motor (33) is installed at one end of the conveying rollers (32) on one side, and the surfaces of the plurality of groups of conveying rollers (32) are connected by a conveying belt (34). A reinforcing plate (35) is installed on the left side between the two side plates (31), and the reinforcing plate (35) is located inside the conveying belt (34).

3. The anti-interference and bending-resistant multi-layer PCB circuit board forming and processing equipment according to claim 2 is characterized in that: A photoelectric transmitter (36) and a photoelectric receiver (37) are respectively installed at one end of the left side opposite surfaces of the two side panels (31); a PLC controller (38) is installed at one end of the side panel (31); the output end of the photoelectric transmitter (36) is electrically connected to the input end of the photoelectric receiver (37); the output end of the photoelectric receiver (37) is electrically connected to the input end of the PLC controller (38); and the output end of the PLC controller (38) is electrically connected to the input end of the first drive motor (33).

4. The anti-interference and bending-resistant multi-layer PCB circuit board forming and processing equipment according to claim 3 is characterized in that: The transfer assembly (4) comprises a second drive motor (41), the second drive motor (41) being located at the bottom of the left side of the first working platform (1), a turntable (42) being mounted on the output shaft at the top of the second drive motor (41), a support frame (43) being mounted on the top of the turntable (42), a hydraulic cylinder (44) being mounted on the inner top of the support frame (43), a fixing block (45) being mounted on the bottom of the hydraulic cylinder (44), a suction cup (46) being mounted on the bottom of the fixing block (45), a built-in groove (47) being arranged inside the fixing block (45), the suction cup (46) being in communication with the built-in groove (47), a negative pressure pump (48) being mounted on the top of the support frame (43), an air supply pipe (49) being mounted on one side of the negative pressure pump (48), the other end of the air supply pipe (49) being in communication with the built-in groove (47).

5. The anti-interference and bending-resistant multi-layer PCB circuit board forming and processing equipment according to claim 4 is characterized in that: The moving assembly (5) comprises two grooves (51), the grooves (51) being located at two ends of the top of the second working platform (2), a threaded rod (52) being installed inside the groove (51), a third driving motor (53) being installed on one side of the threaded rod (52), and a first sliding block (54) being threadedly connected to an outer wall of the threaded rod (52).

6. The anti-interference and bending-resistant multi-layer PCB circuit board forming and processing equipment according to claim 5 is characterized in that: The positioning assembly (6) comprises a fixing plate (61), the fixing plate (61) being located on the top of the first sliding block (54), the fixing plate (61) being provided with a cross-shaped groove (62) on the top, two bidirectional threaded rods (63) being installed inside the cross-shaped groove (62), the two bidirectional threaded rods (63) being perpendicular to each other and located on different horizontal planes, a fourth driving motor (64) being installed at one end of the bidirectional threaded rod (63), second sliding blocks (65) being symmetrically installed at both ends of the outer wall of the bidirectional threaded rod (63), a first L-shaped plate (66) being installed on the top of the second sliding block (65), a positioning plate (67) being installed on the other end of the first L-shaped plate (66), and a placement plate (68) being installed on the upper part of the fixing plate (61).

7. The anti-interference and bending-resistant multi-layer PCB circuit board forming and processing equipment according to claim 6 is characterized in that: The first buffer assembly (7) comprises four fixed sleeves (71), the fixed sleeves (71) being located around the top of the fixed plate (61), a first buffer spring (72) being installed inside the fixed sleeve (71), a buffer plate (73) being installed on the top of the first buffer spring (72), a buffer column (74) being installed on the top of the buffer plate (73), the top of the buffer column (74) being fixedly connected to the bottom of the placement plate (68), and a limiting ring (75) being installed on the top of the fixed sleeve (71).

8. The anti-interference and bending-resistant multi-layer PCB circuit board forming and processing equipment according to claim 7 is characterized in that: The lamination shaping assembly (8) comprises a fixing frame (81), the fixing frame (81) being located on the left side of the top of the second working platform (2), a cylinder (82) being installed on the outer top of the fixing frame (81), and a lower pressing plate (83) being installed on the bottom of the cylinder (82) penetrating through the upper plate of the fixing frame (81).

9. The anti-interference and bending-resistant multi-layer PCB circuit board forming and processing equipment according to claim 8, characterized in that: The second buffer assembly (9) comprises two vertical grooves (91), wherein the vertical grooves (91) are located at two ends inside the fixing frame (81), a sliding rod (92) is installed inside the vertical groove (91), and a second L-shaped plate (93) is slidably connected to the outer wall of the sliding rod (92), the bottom of the other end of the second L-shaped plate (93) is fixedly connected to the top of the lower pressure plate (83), and a second buffer spring (94) is installed between the second L-shaped plate (93) and the bottom inside the vertical groove (91).

10. A processing method for an anti-interference and anti-bending multi-layer PCB circuit board forming and processing equipment, which is implemented based on the anti-interference and anti-bending multi-layer PCB circuit board forming and processing equipment according to claim 9, characterized in that: The following steps are involved: Step 1: placing the circuit boards on the top of the conveyor belt (34) in the order of installation, conveying the circuit boards to the bottom of the transfer component (4) through the conveyor component (3), adsorbing the circuit boards through the suction cups (46), and transferring the circuit boards to the top of the placement plate (68) through the transfer component (4); Step 2: starting the fourth drive motor (64), and driving the bidirectional threaded rod (63) to rotate via the fourth drive motor (64), so that the two groups of the second sliding blocks (65) approach each other, thereby driving the positioning plate (67) to move toward the center of the placement plate (68), so that the multi-layer circuit board can be aligned; Step 3: After the multi-layer circuit board is aligned, the third drive motor (53) is started, and the threaded rod (52) is driven to rotate by the third drive motor (53), thereby driving the fixing plate (61) to move by the first sliding block (54), and the multi-layer circuit board is moved to the position directly below the lower pressing plate (83); Step 4: The cylinder (82) drives the lower pressing plate (83) to move downward to laminate and shape the multi-layer circuit board; Step 5: The first buffer spring (72), the buffer plate (73) and the buffer column (74) work together to provide a buffer force for the placement plate (68), and the slide bar (92), the second L-shaped plate (93) and the second buffer spring (94) work together to provide a buffer force for the lower pressure plate (83), thereby making the multi-layer circuit board evenly stressed and avoiding damage to the circuit board caused by excessive local pressure.

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