Circuit board layout structure and communication equipment

Abstract

The invention discloses a circuit board layout structure. The circuit board layout structure comprises a first heat dissipation plate, a heat dissipation assembly and a plurality of circuit boards stacked on the first heat dissipation plate. The heat dissipation assembly is arranged between two adjacent circuit boards. The heat dissipation assembly comprises a first heat dissipation module, a second heat dissipation module and a heat conduction module. The plurality of circuit boards, the first heat dissipation plate and the heat dissipation assembly are stacked, so that the space occupation of the circuit board layout structure is effectively reduced, the space utilization rate is improved, and the miniaturization design of a signal circuit is facilitated. Meanwhile, the first heat dissipation module and the second heat dissipation module are used for heat dissipation of two adjacent circuit boards respectively, the first heat dissipation module and the second heat dissipation module are in butt joint through the heat dissipation teeth and the heat dissipation grooves, the contact area of the first heat dissipation module and the second heat dissipation module is effectively increased, and therefore heat distribution is more uniform; the overall temperature is effectively reduced, and the application reliability of the circuit board layout structure is improved. The invention further discloses communication equipment.

Description

Technical Field

[0001] This application belongs to the technical field of circuit board structures, and particularly relates to a circuit board layout structure and a communication device. Background Art

[0002] As an important module in a communication device, the signal circuit is mainly used for signal transceiver processing. The signal circuit is usually divided into several modules according to functions, such as an interface module and a processing module. In existing signal circuits, each module is usually laid flat on a heat sink, and the side with higher power consumption is attached to the heat sink to ensure the heat dissipation effect. However, the flat layout method will result in a larger area of the signal circuit and lower space utilization rate, which is not conducive to the miniaturization design of the signal circuit. Summary of the Invention

[0003] The technical problem to be solved by this application is that the space utilization rate of the existing signal circuit with several modules laid flat is relatively low. To solve this technical problem, a circuit board layout structure and a communication device with higher space utilization rate are provided.

[0004] The technical solution proposed by this application is as follows: A circuit board layout structure, comprising: A first heat sink; Multiple circuit boards stacked on the first heat sink; A heat dissipation component, arranged between two adjacent circuit boards. The heat dissipation component includes a first heat dissipation module, a second heat dissipation module, and a heat conduction module. The first heat dissipation module and the second heat dissipation module are respectively arranged on two opposite sides of the two circuit boards, and a plurality of heat dissipation teeth are provided on the opposite sides of the first heat dissipation module and the second heat dissipation module. A heat dissipation groove is formed between two adjacent heat dissipation teeth, and any one of the heat dissipation teeth on the first heat dissipation module can be inserted into a corresponding heat dissipation groove on the second heat dissipation module; one end of the heat conduction module is connected to the first heat dissipation module and / or the second heat dissipation module, and the other end is connected to the first heat sink.

[0005] With the above circuit board layout structure, multiple circuit boards are divided according to the functions of the signal circuit, and multiple circuit boards, the first heat sink, and the heat dissipation component are all stacked, effectively reducing the space occupied by the circuit board layout structure, improving the space utilization rate, and being conducive to the miniaturization design of the signal circuit. At the same time, the first heat dissipation module and the second heat dissipation module are respectively used for heat dissipation of two adjacent circuit boards. The first heat dissipation module and the second heat dissipation module are docked through heat dissipation teeth and heat dissipation grooves, effectively increasing the contact area between the two, so that the heat distribution is more uniform. Combining with the heat conduction module to transfer heat to the first heat sink, the overall temperature is effectively reduced, and the reliability of the application of this circuit board layout structure is improved.

[0006] Further, at least one positioning tooth is provided among the plurality of heat dissipation teeth on one of the first heat dissipation module and the second heat dissipation module, and the width of the positioning tooth is different from the widths of the other heat dissipation teeth; at least one positioning groove is provided among the plurality of heat dissipation grooves on the other one, and the width of the positioning groove is different from the widths of the other heat dissipation grooves, and the positioning tooth matches the positioning groove. Further, the heat conduction module includes a first heat conduction section and a second heat conduction section connected to each other. The first heat conduction section is disposed between the first heat dissipation module and the second heat dissipation module, and a plurality of openings for the heat dissipation teeth to pass through are formed in the first heat conduction section. The second heat conduction section is connected to the first heat dissipation plate.

[0007] Further, a plurality of heat conduction protrusions are formed on both opposite sides of the first heat conduction section, and each heat conduction protrusion can be inserted between the corresponding heat dissipation tooth and the heat dissipation groove.

[0008] Further, a heat dissipation gap is formed between some of the heat dissipation teeth and the inner walls of the corresponding heat dissipation grooves, and at least part of the heat dissipation gap is filled with a heat conduction medium.

[0009] Further, components and a first shielding layer are provided on one side of the circuit board facing the first heat dissipation module. The first shielding layer is disposed around the components. A first accommodation groove for accommodating the components is formed on one side of the first heat dissipation module facing the circuit board, and the first heat dissipation module is attached to the first shielding layer.

[0010] Further, an accommodation protrusion corresponding to the first accommodation groove is formed on one side of the first heat dissipation module facing the second heat dissipation module, and the accommodation protrusion is flush with the heat dissipation teeth. A second accommodation groove is formed on one side of the second heat dissipation module facing the first heat dissipation module, and the accommodation protrusion can be inserted into the second accommodation groove.

[0011] Further, a first connecting member and a second shielding layer are provided on one side of one of the adjacent two circuit boards facing the first heat dissipation module, and a second connecting member and a third shielding layer are provided on one side of the other one facing the second heat dissipation module. The second shielding layer is disposed around the first connecting member, and the third shielding layer is disposed around the second connecting member; Through holes are formed through the first heat dissipation module and the second heat dissipation module. One of the first connecting member and the second connecting member can pass through the through hole and be connected to the other one. The first heat dissipation module is attached to the second shielding layer, and the second heat dissipation module is attached to the third shielding layer.

[0012] Further, the circuit board layout structure further includes a second heat dissipation plate; The multiple circuit boards include a radio frequency board, a baseband board and an interface board which are stacked in sequence. The radio frequency board is arranged on the first heat sink, and the second heat sink is arranged on a side of the interface board away from the baseband board.

[0013] A communication device comprises a chassis and the circuit board layout structure as described above, wherein a docking track and an inserting structure are arranged inside the chassis, and the circuit board layout structure can be slidably arranged on the docking track and inserted into the inserting structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The accompanying drawings are used to provide further understanding of the present application and constitute a part of the specification. They are used to explain the present application together with the embodiments of the present application and do not constitute a limitation of the present application.

[0015] Figure 1 A schematic diagram of a circuit board layout structure provided by an embodiment of the present application; Figure 2 A schematic diagram of some components of a circuit board layout structure provided by another embodiment of the present application; Figure 3 A schematic diagram of a circuit board layout structure provided in yet another embodiment of the present application.

[0016] Description of labels: 111. first heat sink; 112. second heat sink; 120. circuit board; 121. radio frequency board; 122. baseband board; 123. interface board; 124. components; 125. first shielding layer; 126. first connector; 127. second shielding layer; 130. heat dissipation assembly; 131. first heat dissipation module; 1311. first receiving groove; 1312. receiving protrusion; 132. second heat dissipation module; 1321. second receiving groove; 133. heat conduction module; 1331. first heat conduction section; 1332. second heat conduction section; 1333. heat conduction protrusion; 134. heat dissipation teeth; 135. heat dissipation groove; 136. through hole; 210. bottom heat dissipation structure; 220. top heat dissipation structure. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0018] In the description of the present application, it should be understood that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0019] The present application provides a circuit board layout structure, which can arrange signal circuits and be applied to communication devices, and has a high space utilization rate, which is conducive to realizing the miniaturized design of signal circuits.

[0020] As Figure 1 shown, the circuit board layout structure includes a first heat dissipation plate 111 and multiple circuit boards 120 stacked thereon. The multiple stacked circuit boards 120 are arranged on the first heat dissipation plate 111. It can be understood that the multiple circuit boards 120 are divided according to the functions of the signal circuits. Preferably, as Figure 3 shown, the multiple circuit boards 120 include a radio frequency board 121, a baseband board 122, and an interface board 123 stacked in sequence, and the radio frequency board 121 is arranged on the first heat dissipation plate 111. Among them, the baseband board 122 is used to generate baseband signals and perform signal processing, the radio frequency board 121 is used for frequency conversion, amplification, filtering, etc. of the baseband signals, and the interface board 123 is used for external connection, such as external power supply, control instruction issuance, and status information and data transmission, etc. At the same time, it should be noted that in order to facilitate the connection between the circuit boards 120, the length dimension and width dimension of the circuit boards 120 can be set to be the same.

[0021] Furthermore, the circuit board layout structure further includes a heat dissipation component 130, which is arranged between two adjacent circuit boards 120 and is used to dissipate heat from the circuit boards 120. It can be determined that if the circuit boards 120 include three as described above, the corresponding heat dissipation components 130 also include two groups, and each group of heat dissipation components 130 is arranged between two adjacent circuit boards 120.

[0022] Further, the heat dissipation component 130 includes a first heat dissipation module 131, a second heat dissipation module 132, and a heat conduction module 133. The first heat dissipation module 131 and the second heat dissipation module 132 are respectively disposed on two opposite sides of the two circuit boards 120, and a plurality of heat dissipation teeth 134 are provided on the two opposite sides of the first heat dissipation module 131 and the second heat dissipation module 132. A heat dissipation groove 135 is formed between two adjacent heat dissipation teeth 134, and any one of the heat dissipation teeth 134 on the first heat dissipation module 131 can be inserted into a corresponding heat dissipation groove 135 on the second heat dissipation module 132 to increase the direct contact area between the first heat dissipation module 131 and the second heat dissipation module 132; one end of the heat conduction module 133 is connected to the first heat dissipation module 131 and / or the second heat dissipation module 132, and the other end is connected to the first heat dissipation plate 111 to transfer heat to the first heat dissipation plate 111.

[0023] With the above circuit board layout structure, multiple circuit boards 120 are divided according to the functions of the signal circuits, and the multiple circuit boards 120, the first heat dissipation plate 111, and the heat dissipation component 130 are all stacked, effectively reducing the space occupied by the circuit board layout structure, improving the space utilization rate, and facilitating the miniaturization design of the signal circuits. At the same time, the first heat dissipation module 131 and the second heat dissipation module 132 are respectively used for dissipating heat of two adjacent circuit boards 120. The first heat dissipation module 131 and the second heat dissipation module 132 are docked through the heat dissipation teeth 134 and the heat dissipation grooves 135, effectively increasing the contact area between the two, so that the heat distribution is more uniform. Combined with the heat conduction module 133 transferring heat to the first heat dissipation plate 111, the overall temperature is effectively reduced, and the reliability of the application of the circuit board layout structure is improved.

[0024] It should be noted that compared with the existing flat structure, assuming that the flat structure is laid flat on a horizontal plane, the circuit board layout structure provided by the present application effectively reduces the space occupied in the horizontal direction and improves the space utilization rate by utilizing the space in the vertical direction.

[0025] In one embodiment, the heat conduction module 133 includes a first heat conduction section 1331 and a second heat conduction section 1332 connected to each other. The first heat conduction section 1331 is disposed between the first heat dissipation module 131 and the second heat dissipation module 132, and a plurality of openings for the heat dissipation teeth 134 to pass through are formed in the first heat conduction section 1331 to be connected to the first heat dissipation module 131 and the second heat dissipation module 132 while the first heat dissipation module 131 and the second heat dissipation module 132 are inserted into each other; the second heat conduction section 1332 is connected to the first heat dissipation plate 111 to transfer the heat on the first heat dissipation module 131 and the second heat dissipation module 132 to the first heat dissipation plate 111.

[0026] In other embodiments, if the heat dissipation pressure of the first heat dissipation module 131 or the second heat dissipation module 132 is relatively high, one end of the heat conduction module 133 can also be connected to the first heat dissipation module 131 or the second heat dissipation module 132, and the other end can be connected to the first heat dissipation plate 111 to ensure uniform heat distribution.

[0027] Further, a plurality of heat conduction protrusions 1333 are formed on both opposite sides of the first heat conduction section 1331, and each heat conduction protrusion 1333 can be inserted between the corresponding heat dissipation teeth 134 and heat dissipation grooves 135 to increase the contact area with the heat dissipation teeth 134, that is, increase the heat conduction area, improve the heat conduction effect, and reduce the temperature of the circuit board 120.

[0028] In one embodiment, a heat dissipation gap is formed between some of the heat dissipation teeth 134 and the inner wall of the corresponding heat dissipation grooves 135. The heat dissipation gap can allow heat dissipation air flow to pass through, thereby improving the heat dissipation effect of the circuit board layout structure, and further improving the reliability of its operation. It can be understood that the heat dissipation air flow can be provided by a heat dissipation fan. Just set the circuit board layout structure on the heat dissipation air flow path, or a heat dissipation fan can be provided specifically for the circuit board layout structure.

[0029] Further, at least part of the heat dissipation gap is filled with a heat conduction medium to enhance the heat conduction ability between the first heat dissipation module 131 and the second heat dissipation module 132. It should be noted that when the circuit board layout structure cannot be set on the heat dissipation air flow path and a heat dissipation fan cannot be set specifically, there is no need to set a heat dissipation gap at this time; if there is a heat dissipation gap, a heat conduction medium can be selected to fill the heat dissipation gap. At the same time, it can be understood that when there is a gap between the inner walls of the heat dissipation teeth 134 and the heat dissipation grooves 135 due to manufacturing errors, a heat conduction medium, such as heat-conducting glue, can also be set between the two to improve the heat conduction ability.

[0030] In one embodiment, at least one positioning tooth is provided among the plurality of heat dissipation teeth 134 on one of the first heat dissipation module 131 and the second heat dissipation module 132, and the width of the positioning tooth is different from that of the other heat dissipation teeth 134; at least one positioning groove is provided among the plurality of heat dissipation grooves 135 on the other one, and the width of the positioning groove is different from that of the other heat dissipation grooves 135, and the positioning tooth and the positioning groove are matched to position the first heat dissipation module 131 and the second heat dissipation module 132 when they are inserted into each other.

[0031] Preferably, the positioning tooth is conical, and the corresponding positioning groove is also conical to guide the first heat dissipation module 131 and the second heat dissipation module 132 when they are inserted into each other, effectively avoiding deviation during the insertion process and improving the accuracy of the insertion.

[0032] In one embodiment, components 124 are provided on one side of the circuit board 120 facing the first heat dissipation module 131, and the components 124 are heat-generating components in this layout structure; a first accommodation groove 1311 for accommodating the components 124 is formed on one side of the first heat dissipation module 131 facing the circuit board 120. It can be seen that after the first heat dissipation module 131 is connected to the circuit board 120, the components 124 are located in the first accommodation groove 1311; in order to improve the heat dissipation effect of the components 124, a thermal conductive adhesive can be provided between the components 124 and the inner wall of the first accommodation groove 1311.

[0033] Furthermore, a accommodation protrusion 1312 corresponding to the first accommodation groove 1311 is formed on one side of the first heat dissipation module 131 facing the second heat dissipation module 132, and the accommodation protrusion 1312 is flush with the heat dissipation teeth 134, that is, the ends of both facing the second heat dissipation module 132 are flush. It can be seen that the above-mentioned heat dissipation teeth 134 and heat dissipation grooves 135 can be regarded as hollowing out one side of the first heat dissipation module 131 facing the second heat dissipation module 132, thereby effectively reducing the weight of the heat dissipation module. At the same time, a second accommodation groove 1321 is formed on one side of the second heat dissipation module 132 facing the first heat dissipation module 131, and the accommodation protrusion 1312 can be inserted into the second accommodation groove 1321. It can be understood that by adopting the above structure, the overall weight of the circuit board layout structure can be effectively reduced.

[0034] Please refer to Figure 2 , in one embodiment, a first shielding layer 125 is further provided on one side of the circuit board 120 facing the first heat dissipation module 131, and the first shielding layer 125 is disposed around the components 124; the first heat dissipation module 131 is attached to the first shielding layer 125. In this way, the first heat dissipation module 131 and the first shielding layer 125 can seal the first accommodation groove 1311, thereby effectively shielding the components 124 and preventing the signals of the components 124 from leaking or external signals from interfering with the components 124.

[0035] It should be noted that the first heat dissipation module 131 and the second heat dissipation module 132 are usually made of metal for heat dissipation; the first shielding layer 125 can be the ground copper on the circuit board 120, and the first shielding layer 125 surrounds the components 124 in a circle. In order to achieve a tight fit between the first heat dissipation module 131 and the first shielding layer 125, a conductive adhesive can be provided between the two.

[0036] Please also participate in Figure 3 , in one embodiment, a first connecting member 126 and a second shielding layer 127 are provided on one side of one of the two adjacent circuit boards 120 facing the first heat dissipation module 131, and a second connecting member and a third shielding layer are provided on one side of the other facing the second heat dissipation module 132. The second shielding layer 127 is disposed around the first connecting member 126, and the third shielding layer is disposed around the second connecting member.

[0037] Further, through holes 136 are formed through the first heat dissipation module 131 and the second heat dissipation module 132. One of the first connecting member 126 and the second connecting member can pass through the through hole 136 and be connected to the other, so as to realize the electrical connection between two adjacent circuit boards 120; the first heat dissipation module 131 is attached to the second shielding layer 127, and the second heat dissipation module 132 is attached to the third shielding layer.

[0038] Wherein, the second shielding layer 127 and the third shielding layer are the same as the first shielding layer 125, so as to further shield each component in the layout structure and improve the anti-interference performance.

[0039] Specifically Figure 2 and Figure 3 In the case of the radio frequency board 121 and the baseband board 122, the components 124 and the first connecting member 126 are arranged on the side of the radio frequency board 121 facing the baseband board 122. The first shielding layer 125 and the second shielding layer 127 are also formed on this side, and the first heat dissipation module 131 is connected to the radio frequency board 121; the second connecting member and the third shielding layer are arranged on the side of the baseband board 122 facing the radio frequency board 121, and the second heat dissipation module 132 is connected to the baseband board 122. The baseband board 122 and the interface board 123 can also adopt this structure, which will not be elaborated here. It should be noted that the connection between the heat dissipation module and the circuit board 120 can be realized by bolt connection, and a fourth shielding layer is provided on the circuit board 120 for the bolt connection position. For example, threaded holes are formed on the circuit board 120, and the bolts pass through the heat dissipation module and are threadedly connected to the threaded holes. The fourth shielding layer is arranged around the threaded holes and is attached to the heat dissipation module, so as to further ensure the anti-interference performance of the circuit board layout structure.

[0040] In addition, as Figure 2 shown, the first shielding layer 125, the second shielding layer 127 and the fourth shielding layer can also be integrally arranged, that is, ground copper is laid on the circuit board 120, and the ground copper is staggered from the components 124, the traces and the threaded holes.

[0041] In one embodiment, the circuit board layout structure further includes a second heat dissipation plate 112, and multiple circuit boards 120 are stacked between the first heat dissipation plate 111 and the second heat dissipation plate 112. Specifically Figure 3 in the shown embodiment, when the multiple circuit boards 120 are the radio frequency board 121, the baseband board 122 and the interface board 123 stacked in sequence, the radio frequency board 121 is arranged on the first heat dissipation plate 111, and the second heat dissipation plate 112 is arranged on the side of the interface board 123 away from the baseband board 122.

[0042] The above is the related description of the circuit board layout structure. On the other hand, the present application also provides a communication device, which includes a chassis and the circuit board layout structure in the above embodiments.

[0043] In one embodiment, a bottom heat dissipation structure 210 and a top heat dissipation structure 220 are provided inside the chassis. The first heat dissipation plate 111 in the circuit board layout structure is used to contact the bottom heat dissipation structure 210, and the second heat dissipation plate 112 is used to contact the top heat dissipation structure 220, so as to realize the heat dissipation of the circuit board layout structure.

[0044] At the same time, it can be understood that as Figure 1 shown, the second heat dissipation plate 112 located at the top can also adopt a structure similar to that of the first heat dissipation module 131, that is, holes are dug to reduce the overall weight. The top heat dissipation structure 220 above the second heat dissipation plate 112 can adopt a structure similar to that of the second heat dissipation module 132, and the combination method is the same as that of the first heat dissipation module 131 and the second heat dissipation module 132, which will not be elaborated here.

[0045] In one embodiment, a docking track and a docking structure are further provided inside the chassis. The circuit board layout structure can slide on the docking track, and can be docked with the docking structure during the process of sliding along the docking track. Specifically, the connecting components on the interface board 123 are docked with the docking structure to realize the connection between the circuit board layout structure and the outside.

[0046] To sum up, the circuit board layout structure and the communication device provided by the present application have at least the following advantages: 1. By laminating the circuit board 120 and the heat dissipation module, the space utilization rate is improved, which is beneficial to miniaturized design; 2. Shielding layers are arranged around the components 124 and connecting parts on the circuit board 120, and the shielding layers are attached to the heat dissipation module, effectively improving the anti-interference ability; 3. The heat dissipation module is set as heat dissipation teeth 134, and the heat dissipation teeth 134 and the heat dissipation grooves 135 are inserted into each other, reducing the mass of the heat dissipation module, while increasing the contact area between the heat dissipation modules, improving the heat conduction ability, and making the heat distribution more uniform; 4. A heat conduction module 133 is arranged to connect the heat dissipation module and the heat dissipation plate, which can improve the heat dissipation ability of the circuit board 120; 5. A heat dissipation gap can be formed between the inner walls of the heat dissipation teeth 134 and the heat dissipation grooves 135, further improving the heat dissipation ability; 6. While machining the heat dissipation teeth 134, the positioning teeth can be machined at the same time. The heat dissipation teeth 134 can form heat dissipation grooves 135, and a heat dissipation gap can be formed between the inner walls of the heat dissipation teeth 134 and the heat dissipation grooves 135. That is, the above effects can be achieved through one-time machining, which simplifies the machining steps and facilitates the production of the heat dissipation module.

[0047] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present application. The scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A circuit board layout structure, characterized in that: include: a first heat sink; A plurality of circuit boards stacked on the first heat sink; A heat dissipation component is arranged between two adjacent circuit boards, and the heat dissipation component includes a first heat dissipation module, a second heat dissipation module and a heat conductive module. The first heat dissipation module and the second heat dissipation module are respectively arranged on the two sides facing each other of the two circuit boards, and the first heat dissipation module and the second heat dissipation module are provided with a plurality of heat dissipation teeth on the two sides facing each other, a heat dissipation groove is formed between two adjacent heat dissipation teeth, and any heat dissipation tooth on the first heat dissipation module can be inserted into a corresponding heat dissipation groove on the second heat dissipation module; one end of the heat conductive module is connected to the first heat dissipation module and / or the second heat dissipation module, and the other end is connected to the first heat dissipation plate.

2. The circuit board layout structure according to claim 1, characterized in that: At least one positioning tooth is provided among the multiple heat dissipation teeth on one of the first heat dissipation module and the second heat dissipation module, and the width of the positioning tooth is different from the width of the other heat dissipation teeth; at least one positioning groove is provided among the multiple heat dissipation grooves on the other one, and the width of the positioning groove is different from the width of the other heat dissipation grooves, and the positioning tooth matches the positioning groove.

3. The circuit board layout structure according to claim 1, characterized in that: The heat conduction module includes a first heat conduction section and a second heat conduction section connected to each other, the first heat conduction section is arranged between the first heat dissipation module and the second heat dissipation module, and the first heat conduction section is provided with a plurality of openings for the heat dissipation teeth to pass through, and the second heat conduction section is connected to the first heat dissipation plate.

4. The circuit board layout structure according to claim 3, characterized in that: A plurality of heat-conducting protrusions are formed on opposite sides of the first heat-conducting section, and each heat-conducting protrusion can be inserted between the corresponding heat-dissipating tooth and the heat-dissipating groove.

5. The circuit board layout structure according to claim 1, characterized in that: A heat dissipation gap is formed between a portion of the heat dissipation teeth and the inner wall of the corresponding heat dissipation groove, and at least a portion of the heat dissipation gap is filled with a heat conducting medium.

6. The circuit board layout structure according to claim 1, characterized in that: The side of the circuit board facing the first heat dissipation module is provided with components and a first shielding layer, the first shielding layer is arranged around the components, the side of the first heat dissipation module facing the circuit board is provided with a first accommodating groove for accommodating the components, and the first heat dissipation module is in contact with the first shielding layer.

7. The circuit board layout structure according to claim 6, characterized in that: A receiving protrusion is formed on the side of the first heat dissipation module facing the second heat dissipation module corresponding to the first receiving groove, and the receiving protrusion is flush with the heat dissipation tooth. A second receiving groove is formed on the side of the second heat dissipation module facing the first heat dissipation module, and the receiving protrusion can be inserted into the second receiving groove.

8. The circuit board layout structure according to claim 1, characterized in that: One of the two adjacent circuit boards is provided with a first connector and a second shielding layer on a side facing the first heat dissipation module, and the other circuit board is provided with a second connector and a third shielding layer on a side facing the second heat dissipation module, the second shielding layer is provided around the first connector, and the third shielding layer is provided around the second connector; The first heat dissipation module and the second heat dissipation module are penetrated by through holes, one of the first connector and the second connector can pass through the through hole and be connected to the other, the first heat dissipation module is in contact with the second shielding layer, and the second heat dissipation module is in contact with the third shielding layer.

9. The circuit board layout structure according to claim 1, characterized in that: The circuit board layout structure also includes a second heat sink; The multiple circuit boards include a radio frequency board, a baseband board and an interface board which are stacked in sequence. The radio frequency board is arranged on the first heat sink, and the second heat sink is arranged on a side of the interface board away from the baseband board.

10. A communication device, characterized in that: It comprises a chassis and a circuit board layout structure as described in any one of claims 1 to 9, wherein a docking track and an inserting structure are provided inside the chassis, and the circuit board layout structure can be slidably arranged on the docking track and inserted into the inserting structure.

Images