Display panel and display terminal

Abstract

The invention relates to a display panel and a display terminal. The display panel comprises a substrate, a light emitting layer, a color conversion layer and a light blocking structure. The light-emitting layer comprises a plurality of light-emitting units with the same light emitting color; the color conversion layer comprises a plurality of color conversion parts, and one color conversion part corresponds to one light-emitting unit; the light blocking structure is arranged on the side, close to the substrate, of the color conversion layer, the light blocking structure is located between the light emitting faces of every two adjacent light emitting units, the light emitting layer comprises a filling part located between every two adjacent light emitting units, a groove is formed in the surface of the side, close to the color conversion layer, of the filling part, and at least part of the light blocking structure is arranged in the groove. The filling parts are arranged between the light-emitting units, the light blocking structures are arranged in the grooves in the surfaces of the sides, close to the color conversion layers, of the filling parts, the light blocking structures can block the light emitted by the light-emitting units, and light crosstalk caused by the fact that the light emitted by one light-emitting unit enters the adjacent color conversion parts is avoided.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display terminal. Background Art

[0002] With the development and maturity of wearable consumer electronic technologies such as AR (Augmented Reality) / VR (Virtual Reality), consumers have put forward higher requirements for the life, resolution and brightness of display panels. Micro semiconductor light emitting diodes have excellent performance in terms of brightness and life, and can basically meet the requirements of AR / VR and other products.

[0003] The current mainstream approach is to transfer three colors of micro semiconductor light emitting diodes to the substrate separately through mass transfer to form a full-color display. However, bonding millions or even tens of millions of micro semiconductor light emitting diodes to the substrate is very challenging. In related technologies, instead of using mass transfer, a monochrome micro semiconductor light emitting diode epitaxial wafer is bonded to the substrate, and then patterned to form multiple light emitting units, and the monochrome light emitting units are converted into color through a color conversion layer, thereby achieving a full-color display.

[0004] However, as the resolution is further improved, the spacing between micro semiconductor light emitting diodes is reduced, and the light emitted by the micro semiconductor light emitting diodes is easily incident on a non-preset color conversion layer, resulting in light color crosstalk. Summary of the invention

[0005] The embodiments of the present application provide a display panel and a display terminal, which improve the technical problem that as the resolution is further improved, the spacing between micro semiconductor light emitting diodes is reduced, and the light emitted by the micro semiconductor light emitting diodes is easily incident on the color conversion layer of the adjacent area, resulting in crosstalk of the light color.

[0006] In order to achieve the above object, according to a first aspect of the present application, a display panel is provided, comprising:

[0007] substrate;

[0008] A light-emitting layer is disposed on one side of the substrate, and the light-emitting layer includes a plurality of light-emitting units with the same light-emitting color;

[0009] A color conversion layer is disposed on a side of the light-emitting layer away from the substrate, the color conversion layer includes a plurality of color conversion parts, and one color conversion part corresponds to one light-emitting unit;

[0010] A light-blocking structure is disposed on a side of the color conversion layer close to the substrate, and the light-blocking structure is located between light-emitting surfaces of two adjacent light-emitting units. Wherein, the light-emitting layer includes a filling portion located between two adjacent light-emitting units, and a groove is provided on a surface of the filling portion close to the color conversion layer, and at least a part of the light-blocking structure is disposed in the groove.

[0011] Optionally, the light-blocking structure is disposed around the light-emitting unit, and the light-blocking structures between two adjacent light-emitting units are connected or spaced apart.

[0012] Optionally, the depth of the groove is greater than or equal to half of the thickness of the light-emitting layer and less than or equal to the thickness of the light-emitting layer.

[0013] Optionally, the color conversion layer includes a barrier layer, and a plurality of grooves are provided in the barrier layer, and the color conversion portion is disposed in the grooves.

[0014] Optionally, the thermal conductivity of the barrier layer is greater than the thermal conductivity of the color conversion portion, the thermal conductivity of the light-blocking structure is greater than the thermal conductivity of the filling portion, and the barrier layer is in direct contact with the light-blocking structure.

[0015] Optionally, the display panel further includes a thermal conductive layer, the thermal conductive layer is disposed between the light-emitting layer and the color conversion layer, the thermal conductive layer is disposed opposite to the light-emitting unit, and the light transmittance of the thermal conductive layer is greater than the light transmittance of the light-blocking structure.

[0016] Optionally, the thermal conductive layer is located between two adjacent light-blocking structures, and the thermal conductive layer is connected to the light-blocking structure.

[0017] Optionally, the cross-sectional shape of the groove includes an inverted trapezoid.

[0018] Optionally, the included angle between the side wall and the bottom wall of the groove is greater than or equal to 105 degrees and less than 180 degrees.

[0019] According to a second aspect of the present application, there is provided a display terminal including the above-mentioned display panel.

[0020] In the display panel according to the embodiment of the present application, by providing a filling portion between the light-emitting units and disposing a light-blocking structure in the groove on the surface of the filling portion close to the color conversion layer, the light-blocking structure can block the light emitted by the light-emitting unit, avoiding the light emitted from one light-emitting unit from entering the adjacent color conversion portion and causing light crosstalk.

[0021] Other features and advantages of the present application will be described in detail in the subsequent specific implementation section. Description of the Drawings

[0022] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the accompanying drawings required for the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those skilled in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0023] To more comprehensively understand the present application and its beneficial effects, the following will be described in conjunction with the accompanying drawings, where the same reference numerals in the following description represent the same parts.

[0024] Figure 1 is a top view structural schematic diagram of a display panel provided in an exemplary embodiment of the present disclosure;

[0025] Figure 2A is Figure 1 a partial enlarged structural schematic diagram of part A in

[0026] Figure 2B is Figure 1 another partial enlarged structural schematic diagram of part A in

[0027] Figure 3A is Figure 1 a sectional structural schematic diagram of the C-C section in

[0028] Figure 3B is Figure 1 another sectional structural schematic diagram of the C-C section in

[0029] Figures 4A to 4G is a process flow diagram of a display panel provided in an exemplary embodiment of the present disclosure;

[0030] Figure 5 is a structural schematic diagram of a display terminal provided in an exemplary embodiment of the present disclosure.

[0031] Description of reference numerals:

[0032] display panel 1, display area AA, non-display area NA, sub-pixel 11;

[0033] substrate 10;

[0034] light-emitting layer 20, light-emitting unit 21, filling part 22, epitaxial layer 20A;

[0035] color conversion layer 30, color conversion part 31, first conversion part 311, second conversion part 312, transparent part 313, light-blocking layer 32, protective layer 33;

[0036] light-blocking structure 40;

[0037] heat-conducting layer 50;

[0038] The depth h1 of the groove, the thickness h2 of the light-emitting layer 20, the width w1 of the groove near the substrate 10, the width w2 of the groove away from the substrate 10, and the angle B between the side wall and the bottom wall of the groove;

[0039] The display terminal 2 and the terminal body 3. Specific embodiments

[0040] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present application.

[0041] To achieve the above object, according to the first aspect of the present application, as Figures 1 to 3B shown, a display panel 1 is provided, including a substrate 10, a light-emitting layer 20, a color conversion layer 30, and a light-blocking structure 40; the light-emitting layer 20 is disposed on one side of the substrate 10, and the light-emitting layer 20 includes a plurality of light-emitting units 21 with the same light-emitting color; the color conversion layer 30 is disposed on the side of the light-emitting layer 20 away from the substrate 10, and the color conversion layer 30 includes a plurality of color conversion portions 31, and one color conversion portion 31 corresponds to one light-emitting unit 21; the light-blocking structure 40 is disposed on the side of the color conversion layer 30 close to the substrate 10, and the light-blocking structure 40 is located between the light-emitting surfaces of two adjacent light-emitting units 21; wherein, the light-emitting layer 20 includes a filling portion 22 located between two adjacent light-emitting units 21, and a groove is provided on the surface of the filling portion 22 close to the color conversion layer 30, and at least a part of the light-blocking structure 40 is disposed in the groove.

[0042] The display panel 1 is a Mini-Led panel, a Micro-LED panel, etc. The resolution of the Micro-LED panel can be greater than 3000PPI, and the brightness can be greater than 5000nits, which can meet the display requirements of wearable consumer electronic products such as AR / VR.

[0043] As Figures 1 to 2B shown, the display panel 1 includes a display area AA and a non-display area NA disposed outside the display area AA. The display area AA can be provided with a plurality of sub-pixels 11, and the sub-pixels 11 can include red sub-pixels, green sub-pixels, and blue sub-pixels to achieve color display. The non-display area NA can be provided with a driving circuit, such as a gate driving circuit, etc., and the driving circuit can provide driving signals for the sub-pixels 11.

[0044] The material of the substrate 10 can be a rigid substrate or a flexible substrate. The material of the rigid substrate can be a glass substrate, a quartz substrate, or a silicon wafer. The material of the flexible substrate can be one of colorless polyimide (PI), polycarbonate (PC), polynorbornene (PNB), and polyethylene terephthalate (PET), etc.

[0045] A driving circuit can be provided on the substrate 10, and the driving circuit is used to control the light-emitting unit 21 to emit light or not emit light.

[0046] As Figure 3A and Figure 3B shown, the light-emitting layer 20 includes a plurality of light-emitting units 21 with the same light-emitting color. The surface of the light-emitting unit 21 facing away from the substrate 10 is the light-emitting surface, and light rays are emitted from the light-emitting surface. For example, the light-emitting color of the light-emitting unit 21 can be one of the three primary colors of light, and the three primary colors of light refer to red light, green light, and blue light. For example, the light-emitting color of the light-emitting unit 21 is all red, or the light-emitting color of the light-emitting unit 21 is all green, or the light-emitting color of the light-emitting unit 21 is all blue.

[0047] In some embodiments, the light-emitting color of the light-emitting unit 21 can be a mixed color light of two of the three primary colors of light.

[0048] In some embodiments, the light-emitting color of the light-emitting unit 21 can all be white.

[0049] The light-emitting unit 21 is a Mini-Led chip, a Micro-LED chip, etc. The size of the Mini-Led chip is usually between 50μm and 200μm, and 50μm, 100μm, 150μm, 200μm can be selected. The size of the Micro-LED chip is usually less than 50μm. The small size of the light-emitting unit 21 can achieve a higher resolution.

[0050] In this embodiment, by configuring the light-emitting layer 20 as light-emitting units 21 with the same light-emitting color, a monochromatic LED epitaxial wafer can be directly bonded to the substrate 10, and then the monochromatic LED epitaxial wafer is patterned to form a plurality of independent light-emitting units 21. Compared with the solution of transferring a plurality of light-emitting units 21 with different colors to the substrate 10 by using a mass transfer process, the manufacturing process of the display panel 1 of the present application is simpler.

[0051] The color conversion layer 30 is used to convert the light rays of the monochromatic light-emitting unit 21 into colored light to achieve full-color display of the display panel 1.

[0052] In some embodiments, the material of the color conversion layer 30 includes quantum dot (QD) material. When a quantum dot is excited by external energy (light, electricity), it emits light of a specific frequency, and the frequency of the emitted light changes with the change in the size of such a quantum dot. Therefore, by adjusting the size of the quantum dot, the color of the light it emits can be controlled.

[0053] The quantum dot material may include at least one of CdSe (cadmium selenide), CdS (cadmium sulfide), ZnSe (zinc selenide), ZnS (zinc sulfide), InP (indium phosphide), CdTe (cadmium telluride), ZnTe (zinc telluride), and AgInGaS (silver indium gallium sulfur) to form a core-shell structure or an alloy structure.

[0054] The color conversion unit 31 is used to adjust the emitted light color of the light-emitting unit 21 to full-color light. Specifically, a part of the color conversion unit 31 is used to adjust the emitted light color of the light-emitting unit 21 to red, another part of the color conversion unit 31 is used to adjust the emitted light color of the light-emitting unit 21 to green, and the remaining color conversion unit 31 is used to adjust the emitted light color of the light-emitting unit 21 to blue.

[0055] It should be noted that when the emitted light color of the light-emitting unit 21 is one of the primary colors of light, a part of the color conversion unit 31 can be set as a transparent material, so as not to change the emitted light color of the light-emitting unit 21; the other part of the color conversion is used to adjust the emitted light colors of the remaining light-emitting units 21 to the other two colors among the primary colors respectively.

[0056] Specifically, when the emitted light color of the light-emitting unit 21 is blue, a part of the color conversion unit 31 can be a transparent material, and the light emitted from the transparent material is still blue. Another part of the color conversion unit 31 is used to adjust the blue light to red light, and the remaining color conversion unit 31 is used to adjust the blue light to green light, so as to achieve full-color display.

[0057] In some embodiments, the light-blocking structure 40 can block light. The material of the light-blocking structure 40 includes metal materials such as aluminum, silver, gold, copper, etc. The material of the light-blocking structure 40 can also be an organic material, such as black ink, etc.

[0058] Such as Figures 2A to 3BAs shown, the light-blocking structure 40 is located on the side of the color conversion layer 30 close to the substrate 10 and between the light-emitting surfaces of two adjacent light-emitting units 21. That is to say, the light-blocking structure 40 is located on the optical path between the light-emitting surface of the light-emitting unit 21 and the adjacent color conversion part 31, so as to prevent the light emitted from the light-emitting surface of the light-emitting unit 21 from entering the adjacent color conversion part 31. It should be understood that one light-emitting unit 21 corresponds to one color conversion part 31, and the light emitted from the light-emitting surface of the light-emitting unit 21 can enter the color conversion part 31 corresponding to the light-emitting unit 21. The light-blocking structure 40 blocks the light emitted from the light-emitting surface of the light-emitting unit 21 from entering the non-corresponding color conversion part 31, thereby avoiding light crosstalk. Among them, light crosstalk refers to the color conversion part 31 of the sub-pixel 11 that should not be lit being excited or penetrated by the light emitted from the adjacent light-emitting unit 21 and showing a lit state.

[0059] After patterning the light-emitting layer 20 to form a plurality of independent light-emitting units 21, a depression is formed between two adjacent light-emitting units 21. In order to prevent the depression from affecting the formation of the color conversion layer 30, the depression can be filled with an insulating material, that is, a filling part 22 is formed at the depression.

[0060] In some embodiments, the material of the filling part 22 can be an inorganic insulating material, such as silicon nitride, silicon oxide, silicon oxynitride, etc.

[0061] In some embodiments, as Figures 2A to 3B shown, the filling part 22 fills between two adjacent light-emitting units 21, and the surface of the filling part 22 facing away from the substrate 10 can be flush with the light-emitting surface of the light-emitting unit 21, so as to form a flat surface on the surface of the light-emitting layer 20.

[0062] As Figure 3A and Figure 3B shown, the surface of the filling part 22 close to the color conversion layer 30 is provided with a groove, and the light-blocking structure 40 is at least partially disposed in the groove. That is to say, the surface of the light-blocking structure 40 facing away from the substrate 10 can be flush with the surface of the filling part 22 facing away from the substrate 10, or the surface of the light-blocking structure 40 facing away from the substrate 10 can protrude from the surface of the filling part 22 facing away from the substrate 10.

[0063] In some embodiments, as Figure 2B shown, the light-blocking structures 40 disposed around the same light-emitting unit 21 can be spaced apart. That is to say, two adjacent light-blocking structures 40 can be not connected to each other.

[0064] In other embodiments, as Figure 2AAs shown, the light-blocking structures 40 disposed around the same light-emitting unit 21 can be connected to form an annular structure, thereby blocking the light emitted from the light-emitting surface of the light-emitting unit 21 in all viewing angles. That is to say, when viewing the display panel 1 from the side of the light-emitting surface of the light-emitting unit 21, the filling portion 22 forms a network structure.

[0065] Optionally, as Figures 2A to 3B shown, the light-blocking structure 40 is disposed around the light-emitting unit 21, and the light-blocking structures 40 between two adjacent light-emitting units 21 are connected or spaced apart.

[0066] As Figure 2A and Figure 2B shown, the light-blocking structure 40 is disposed around the light-emitting unit 21. That is to say, the light-blocking structure 40 is disposed on the periphery of the light-emitting unit 21.

[0067] In some embodiments, as Figure 2A shown, the light-blocking structures 40 between two adjacent light-emitting units 21 are connected to form a network structure, and the light-emitting unit 21 is disposed within the mesh of the network structure, so that the light-blocking structure 40 can block the light emitted from the light-emitting unit 21 in all directions.

[0068] In some embodiments, as Figure 2B shown, the light-blocking structures 40 between two adjacent light-emitting units 21 are spaced apart. That is to say, the light-blocking structures 40 around the same light-emitting unit 21 are disconnected, thereby saving the material of the light-blocking structure 40. When the light-blocking structures 40 are spaced apart, the light-blocking structures 40 can extend along the contour line of the light-emitting unit 21. Optionally, when the light-emitting unit 21 is polygonal, the light-blocking structures 40 can be disconnected at the corners of the contour line of the light-emitting unit 21. A corner refers to the included angle formed between two adjacent sides of the light-emitting unit 21.

[0069] Optionally, as Figure 3A and Figure 3B shown, the depth h1 of the groove is greater than or equal to half of the thickness h2 of the light-emitting layer 20 and less than or equal to the thickness h2 of the light-emitting layer 20. That is to say, (h2) / 2 ≤ h1 ≤ h2.

[0070] The depth h1 of the groove refers to the dimension of the groove in the direction perpendicular to the bearing surface of the substrate 10, and the thickness h2 of the light-emitting layer 20 refers to the dimension of the light-emitting layer 20 in the direction perpendicular to the bearing surface of the substrate 10. Among them, the bearing surface of the substrate 10 refers to the surface on the side of the substrate 10 close to the light-emitting layer 20. By setting the depth h1 of the groove to be greater than or equal to half of the thickness h2 of the light-emitting layer 20, the area of the light-blocking structure 40 in the groove can be increased, thereby improving the light-blocking effect; by setting the depth h1 of the groove to be less than or equal to the thickness h2 of the light-emitting layer 20, it is possible to prevent the groove from penetrating the light-emitting layer 20 and affecting structures such as the circuit on the substrate 10.

[0071] In some embodiments, as Figure 3A and Figure 3B shown, the light-blocking structure 40 can protrude from the groove, that is, the light-blocking structure 40 not only fills the groove but also protrudes from the surface of the filling portion 22 facing away from the substrate 10 in the depth direction of the groove. Through the above setting, the light-blocking area of the light-blocking structure 40 can be increased.

[0072] Optionally, as Figure 3A and Figure 3B shown, the color conversion layer 30 includes a barrier layer 32, and the barrier layer 32 is provided with a plurality of grooves, and the color conversion portion 31 is disposed in the grooves.

[0073] The material of the barrier layer 32 can be a non-light-transmitting material, such as a metal material, etc. The material of the barrier layer 32 includes aluminum, silver, aluminum nitride, etc. The material of the barrier layer 32 being a non-light-transmitting material can prevent light crosstalk between two adjacent color conversion portions 31. Metal materials are easy to pattern and can form grooves with smaller sizes. At the same time, metal materials have good thermal conductivity and are convenient for heat dissipation.

[0074] The barrier layer 32 can be formed by physical vapor deposition (PVD). The grooves can be formed by a patterning process. The patterning process includes steps such as coating photoresist, exposure and development, etching, and removing photoresist.

[0075] In some embodiments, the thickness of the barrier layer 32 is greater than or equal to 2 microns. The grooves completely penetrate the barrier layer 32, which means that the depth of the grooves is equal to the thickness of the barrier layer 32. The thickness of the barrier layer 32 refers to the dimension of the barrier layer 32 on the bearing surface perpendicular to the substrate 10.

[0076] A groove is correspondingly arranged with a light-emitting unit 21, and the color conversion part 31 is arranged in the groove. In order to prevent the light-blocking layer 32 from blocking the emitted light of the light-emitting unit 21, the size of the groove can be larger than that of the light-emitting unit 21. That is to say, the area of the positive projection of the side wall of the groove on the light-emitting layer 20 is larger than the area of the light-emitting unit 21. The light emitted from the light-emitting unit 21 can be incident on the color conversion part 31 in the groove and then exit from the surface of the color conversion part 31 facing away from the substrate 10 after passing through the color conversion part 31.

[0077] In some embodiments, the size of the groove is less than 5 micrometers. The size of the groove refers to the size of the outer shape of the groove on the plane where the display surface is located. It should be noted that grooves with smaller sizes can be formed by using a patterning process on the metal film layer. The grooves can assist in patterning the color conversion layer 30 to form a color conversion part 31 with the same size as the groove, overcoming the problem that the material of the color conversion part 31 is difficult to miniaturize, and a display panel 1 with a higher resolution (above 5000 PPI) can be fabricated.

[0078] Specifically, the color conversion layer 30 is formed on the light-blocking layer 32. By means of an exposure and development process, the material of the color conversion layer 30 in the groove is retained, and the material of the color conversion layer 30 in other areas is removed, thereby forming the color conversion part 31.

[0079] Optionally, the thermal conductivity of the light-blocking layer 32 is greater than that of the color conversion part 31, and the thermal conductivity of the light-blocking structure 40 is greater than that of the filling part 22. The light-blocking layer 32 is directly in contact with the light-blocking structure 40. Since heat is more likely to be conducted to materials with higher thermal conductivity, through the above settings, the heat of the light-emitting unit 21 can be transferred to the light-blocking structure 40 and the light-blocking layer 32, increasing the heat dissipation area, achieving uniform temperature, and avoiding excessive local temperature.

[0080] In some embodiments, the material of the light-blocking layer 32 is aluminum, silver, aluminum nitride, etc. The thermal conductivity of aluminum is 228 watts per meter kelvin (W / (m·K)), the thermal conductivity of silver is about 359 watts per meter kelvin (W / (m·K)), and the thermal conductivity of aluminum nitride is about 150 to 275 watts per meter kelvin (W / (m·K)). The material of the color conversion part 31 is cadmium sulfide, cadmium selenide, etc. The thermal conductivity of cadmium sulfide is about 2 to 5 watts per meter kelvin (W / (m·K)), and the thermal conductivity of cadmium selenide is about 3 to 6 watts per meter kelvin (W / (m·K)).

[0081] In some embodiments, the material of the light-blocking structure 40 includes metal materials such as aluminum, silver, gold, copper, etc. The thermal conductivity of aluminum is 228 watts per meter kelvin (W / (m·K)), the thermal conductivity of silver is about 359 watts per meter kelvin (W / (m·K)), the thermal conductivity of gold is 317 watts per meter kelvin (W / (m·K)), and the thermal conductivity of copper is 401 W / (m·K).

[0082] The material of the filling part 22 can be silicon nitride, silicon oxide, silicon oxynitride, etc. The thermal conductivity of silicon nitride is about 20 to 80 watts per meter Kelvin (W / (m·K)), the thermal conductivity of silicon oxide is about 1 to 1.8 watts per meter Kelvin (W / (m·K)), and the thermal conductivity of silicon oxynitride is about 1 to 6 watts per meter Kelvin (W / (m·K)).

[0083] The direct contact setting of the light-blocking wall layer 32 and the light-blocking structure 40 means that there is no other structure separating the light-blocking wall layer 32 and the light-blocking structure 40. By directly contacting the light-blocking wall layer 32 and the light-blocking structure 40, the heat transfer efficiency between the light-blocking wall layer 32 and the light-blocking structure 40 can be improved.

[0084] Optionally, as Figure 3A and Figure 3B shown, the display panel 1 further includes a heat conduction layer 50. The heat conduction layer 50 is disposed between the light-emitting layer 20 and the color conversion layer 30. The heat conduction layer 50 is disposed in alignment with the light-emitting unit 21, and the light transmittance of the heat conduction layer 50 is greater than that of the light-blocking structure 40.

[0085] In some embodiments, the material of the heat conduction layer 50 can be a transparent organic material or an inorganic material. The organic materials include polyimide, transparent heat-conducting silica gel, etc., and the inorganic materials include graphite, diamond, aluminum nitride, silicon carbide, etc. The material of the heat conduction layer 50 can also be a phase change material.

[0086] The heat conduction layer 50 is disposed between the light-emitting layer 20 and the color conversion layer 30. When the light-emitting unit 21 emits light, heat is generated, and the accumulation of heat will affect the service life of the light-emitting unit 21 and the color conversion part 31. By disposing the heat conduction layer 50 between the light-emitting layer 20 and the color conversion layer 30, the heat conduction layer 50 can disperse the heat generated by the light-emitting unit 21 to the light-blocking structure 40 and the light-blocking wall layer 32, avoiding heat accumulation, and thus avoiding the influence of heat on the service life of the light-emitting unit 21 and the color conversion part 31.

[0087] Optionally, 3A and Figure 3B the heat conduction layer 50 is located between two adjacent light-blocking structures 40, and the heat conduction layer 50 is connected to the light-blocking structure 40. Through the above setting, the heat transfer efficiency between the heat conduction layer 50 and the light-blocking structure 40 can be improved.

[0088] Optionally, as Figure 3A and Figure 3BAs shown, the width w1 of the groove near the substrate 10 is smaller than the width w2 of the groove far from the substrate 10. That is to say, in the direction perpendicular to the bearing surface of the substrate 10, the width of the groove has at least two different dimensions, and the width w1 of the groove near the substrate 10 is smaller, while the width w2 of the groove far from the substrate 10 is larger. Through the above settings, the area of the lower surface of the color conversion part 31 in the groove can be made smaller, and the area of the upper surface can be made larger, which can effectively improve the secondary absorption of the light emitted by the light-emitting unit 21 in the color conversion part 31, reduce the leakage of the light emitted by the light-emitting unit 21, and improve the brightness and color gamut of the display panel 1. For example, when the light-emitting color of the light-emitting unit 21 is blue, the blue light can be secondarily absorbed in the color conversion part 31, and more is converted into red light or green light, reducing the leakage of blue light and improving the brightness and color gamut of the display panel 1.

[0089] In some embodiments, as Figure 3A and Figure 3B shown, the cross-sectional shape of the groove includes an inverted trapezoid.

[0090] In some embodiments, as Figure 3A and Figure 3B shown, the angle B between the side wall and the bottom wall of the groove is greater than or equal to 105 degrees and less than 180 degrees, and 105 degrees, 120 degrees, 140 degrees, 160 degrees, 180 degrees are optional.

[0091] Optionally, as Figure 3A and Figure 3B shown, at least a protective layer 33 is provided on the inner wall of the groove, the protective layer 33 is located between the color conversion part 31 and the barrier layer 32, and the protective layer 33 is located between the color conversion part 31 and the light-shielding structure 40.

[0092] The protective layer 33 can protect the barrier layer 32 from being corroded by the material of the color conversion part 31. The protective layer 33 can cover the side wall and the bottom of the groove to prevent the color conversion part 31 from directly contacting the barrier layer 32.

[0093] In some embodiments, the material of the protective layer 33 can be silicon oxide, aluminum oxide, etc.

[0094] In some embodiments, the thickness of the protective layer 33 is greater than or equal to 500 angstroms.

[0095] The protective layer 33 can be formed into a film by processes such as physical vapor deposition (PVD), atomic layer deposition (ALD), etc., but is not limited thereto.

[0096] In some embodiments, the protective layer 33 can be provided as a whole layer, thereby simplifying the manufacturing process of the display panel 1.

[0097] In some embodiments, the protective layer 33 may be formed only within the grooves, i.e., the protective layer 33 may be patterned.

[0098] Optionally, as Figure 3A and Figure 3B shown, the color conversion part includes a first conversion part 311, a second conversion part 312, and a transparent part 313; the thermal conductivity of the protective layer 33 corresponding to the first conversion part 311 and the second conversion part 312 is less than the thermal conductivity of the protective layer 33 corresponding to the transparent part 313.

[0099] Since the first conversion part 311 and the second conversion part 312 are quantum dot materials, the heat resistance of the first conversion part 311 and the second conversion part 312 is worse than that of the transparent part 313. Therefore, in order to reduce the influence of the heat of the light-emitting unit 21 on the first conversion part 311 and the second conversion part 312, the thermal conductivity of the material of the protective layer 33 corresponding to the first conversion part 311 and the second conversion part 312 can be set to be lower than the thermal conductivity of the material of the protective layer 33 corresponding to the transparent part 313, so that heat is not easily conducted to the first conversion part 311 and the second conversion part 312, and the overall lifespan of the color conversion layer 30 is improved.

[0100] Optionally, the material of the first conversion part 311 and the material of the second conversion part 312 are respectively one of a red quantum dot material and a green quantum dot material. Since the heat resistance of the red quantum dot material is better than that of the green quantum dot material, the thermal conductivity of the protective layer 33 corresponding to the green quantum dot material can be made less than the thermal conductivity of the protective layer 33 corresponding to the red quantum dot material, so that the heat of the light-emitting unit 21 is not easily conducted to the green quantum dot material, thereby improving the overall lifespan of the color conversion layer 30.

[0101] Next, in conjunction with Figures 4A to 4G , a process flow chart of a display panel 1 provided in an exemplary embodiment of the present disclosure will be described.

[0102] As Figure 4A shown, a substrate 10 is provided, and an LED epitaxial layer 20A is formed on the substrate 10.

[0103] In some embodiments, the substrate 10 may be a silicon-based driving backplane. The silicon-based driving backplane technology is relatively mature, with good process stability, high yield, and can achieve higher pixel density and lower power consumption.

[0104] Before forming the LED epitaxial layer 20A on the substrate 10, a bonding metal layer may be deposited on the surface of the substrate 10, a transparent conductive layer and a bonding metal layer may be deposited on the LED epitaxial layer 20A, and the bonding metal layer on the LED epitaxial layer 20A is bonded to the bonding metal layer on the substrate 10 by means of full-surface bonding.

[0105] After forming the LED epitaxial layer 20A on the substrate 10, the steps further include removing the substrate of the LED epitaxial layer 20A to expose the surface of the LED epitaxial layer 20A facing away from the substrate 10.

[0106] As Figure 4B shown, the LED epitaxial layer 20A is patterned to form a plurality of independent light-emitting units 21. A filling portion 22 is formed by depositing a material in the recessed area between the light-emitting units 21, and a trench is formed on the filling portion 22.

[0107] As Figure 4C shown, a heat-conducting layer 50 is formed on the light-emitting units 21, and a trench is formed on the heat-conducting layer 50. The trench on the heat-conducting layer 50 corresponds to the trench on the filling portion 22, and a light-blocking structure 40 is formed in the trench.

[0108] As Figure 4D shown, a metal film is formed on the heat-conducting layer 50, and a plurality of grooves are formed on the metal layer. At least a protective layer 33 is formed in the grooves.

[0109] One groove corresponds to one light-emitting unit 21, and the size of the groove is greater than or equal to the size of the light-emitting unit 21. By making grooves in the metal film, the surface of the metal film can reflect light, avoiding light crosstalk between sub-pixels 11 of different colors and effectively improving the display brightness.

[0110] As Figure 4E shown, a first color conversion layer material is formed on the heat-conducting layer 50, and the first color conversion layer is patterned by exposure and development. A part of the first color conversion layer material in the grooves is retained to form a first conversion portion 311, and the first color conversion layer material in other areas is removed.

[0111] It should be noted that by filling the material of the first color conversion layer in the grooves, the patterning difficulty of the material of the first color conversion layer can be effectively reduced, and an undercut structure can be avoided when the material of the first color conversion layer is patterned. The undercut structure will cause the first conversion portion 311 to fail to stand and be retained. Therefore, by forming the first conversion portion 311 in the grooves, the performance and manufacturing yield of the display panel 1 can be improved.

[0112] As Figure 4F shown, a material of a second color conversion layer is formed on the heat-conducting layer 50, and the second color conversion layer is patterned by exposure and development. A part of the material of the second color conversion layer in the other grooves is retained to form a second conversion portion 312, and the material of the second color conversion layer in other areas is removed.

[0113] Similarly, by filling the material of the second color conversion layer in the grooves, the patterning difficulty of the material of the second color conversion layer can be effectively reduced.

[0114] AsFigure 4G As shown, a transparent material is formed on the heat-conducting layer 50, and the transparent material is patterned through exposure and development. The transparent material in the grooves is retained to form the transparent part 313, and the transparent material in other areas is removed.

[0115] Similarly, filling the grooves with a transparent material can effectively reduce the patterning difficulty of the transparent material.

[0116] By forming the color conversion part 31 in the grooves, the size of the sub-pixels 11 can be effectively reduced, and the manufacturing of the display panel 1 with a high resolution (above 5000 PPI) can be realized.

[0117] The steps after forming the transparent material may further include forming a dielectric layer on the color conversion layer 30, and the dielectric layer can provide protection for the color conversion layer 30. The dielectric layer can be an inorganic insulating material or the like.

[0118] According to the second aspect of the present application, as Figure 5 shown, a display terminal 2 is provided, including the above-mentioned display panel 1.

[0119] In this embodiment, as Figure 5 shown, the display terminal 2 includes a display panel 1 and a terminal body 3, and the display panel 1 and the terminal body 3 are combined into one.

[0120] In this embodiment, the display terminal 2 can be: a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, or any other product or component with a display function.

[0121] In the description of the present application, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of the present application, "a plurality" means two or more, unless otherwise specifically defined.

[0122] In the above embodiments, the descriptions of the respective embodiments have their own emphases. For the parts not detailed in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0123] The embodiments, implementation manners and related technical features of the present application can be combined and replaced with each other without conflict.

[0124] The above is only a preferred embodiment of the present application, and does not impose any form of limitation on the present application. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application still fall within the scope of the technical solution of the present application.

Claims

1. A display panel, characterized in that: include: substrate; A light-emitting layer is disposed on one side of the substrate, and the light-emitting layer includes a plurality of light-emitting units with the same light-emitting color; A color conversion layer is disposed on a side of the light-emitting layer away from the substrate, the color conversion layer includes a plurality of color conversion parts, and one color conversion part corresponds to one light-emitting unit; A light blocking structure is arranged on a side of the color conversion layer close to the substrate, and the light blocking structure is located between the light emitting surfaces of two adjacent light emitting units; The light-emitting layer includes a filling portion between two adjacent light-emitting units, a surface of the filling portion close to the color conversion layer is provided with a groove, and the light-blocking structure is at least partially disposed in the groove.

2. The display panel according to claim 1, characterized in that: The light-blocking structure is disposed around the light-emitting unit, and the light-blocking structures between two adjacent light-emitting units are connected or spaced apart.

3. The display panel according to claim 1, characterized in that: The depth of the groove is greater than or equal to half of the thickness of the light-emitting layer and less than or equal to the thickness of the light-emitting layer.

4. The display panel according to claim 1, characterized in that: The color conversion layer includes a retaining wall layer, the retaining wall layer is provided with a plurality of grooves, and the color conversion part is arranged in the grooves.

5. The display panel according to claim 4, characterized in that: The thermal conductivity of the blocking wall layer is greater than the thermal conductivity of the color conversion part, the thermal conductivity of the light blocking structure is greater than the thermal conductivity of the filling part, and the blocking wall layer is directly in contact with the light blocking structure.

6. The display panel according to claim 4, characterized in that: The display panel further includes a heat-conducting layer, which is disposed between the light-emitting layer and the color conversion layer. The heat-conducting layer is aligned with the light-emitting unit, and the light transmittance of the heat-conducting layer is greater than the light transmittance of the light-blocking structure.

7. The display panel according to claim 6, characterized in that: The heat-conducting layer is located between two adjacent light-blocking structures, and the heat-conducting layer is connected to the light-blocking structure.

8. The display panel according to claim 4, characterized in that: The cross-sectional shape of the groove includes an inverted trapezoid.

9. The display panel according to claim 8, characterized in that: An included angle between the side wall of the groove and the bottom wall of the groove is greater than or equal to 105 degrees and less than 180 degrees.

10. A display terminal, characterized in that: A display panel comprising any one of claims 1 to 9.

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