Grinding element, grinding device and method for producing grinding element and / or grinding device

Abstract

The invention relates to a grinding element for a grinding device (15), in particular a flexible grinding device (15), preferably a grinding disc, for grinding a workpiece, comprising a base grinding element (13). According to the invention, the grinding element has an adhesive element (17) arranged on the base grinding element (13), said adhesive element being in particular in the form of an adhesion promoter (17).

Description

Field of the Invention

[0001] The present invention relates to a grinding element, a grinding device and / or a method for manufacturing a grinding element or a grinding device according to the preamble of claim 1. Background Art

[0002] Grinding elements, grinding devices and corresponding manufacturing methods are known from the prior art. Summary of the Invention

[0003] The task underlying the present invention is to improve the grinding element, the grinding device and / or the method for manufacturing them by simple structural design measures.

[0004] This task is solved by a grinding element for a grinding device, in particular a flexible grinding device, preferably a grinding disc, which is used for grinding a workpiece, and the grinding element has a basic grinding element.

[0005] It is proposed that the grinding element has an adhesive element arranged on the basic grinding element, and the adhesive element is particularly configured as an adhesion promoter.

[0006] Adhesive element:

[0007] The adhesive element can be configured as an adhesion promoter. An adhesion promoter can, for example, enhance the adhesion between two elements with poor adhesion to each other. The adhesion promoter can be arranged between these two elements. In this example, the adhesion promoter can improve the adhesion of the basic grinding element relative to the binder element, such as the basic binder element and / or the covering binder element. Therefore, the adhesive element can constitute an adhesion promoter for better connecting the basic grinding element with the binder of the grinding device, in particular the basic binder element and / or the covering binder element. The adhesion promoter can in particular be an element that provides physical and / or chemical bonding in the adjacent area of elements that are poorly connectable or non-connectable to improve the adhesion of these elements.

[0008] The adhesive element can be configured as a coating. The adhesive element can surround, in particular completely surround, the basic grinding element. The adhesive element can be arranged sectionally on the basic grinding element.

[0009] Basic grinding element:

[0010] The basic grinding element can be provided for grinding a workpiece. The basic grinding element can act on the workpiece to be processed to cause deformation and / or removal. The basic grinding element can be configured as a grinding body. The basic grinding element is also known to those skilled in the art as abrasive grains. In the context, the "basic grinding element" should be particularly understood as an element that, in the processing state, particularly directly contacts the workpiece to be processed and causes abrasive material removal of the workpiece to be processed in the processing state.

[0011] The basic grinding element can be configured as a broken or shaped basic grinding element. These differences are known to those skilled in the art. In particular, when using a broken basic grinding element, it is usually not possible to ensure that the basic grinding elements have approximately the same dimensions, especially the longitudinal extension dimension. As a result, the basic grinding elements can protrude to different degrees on the grinding device and cause an uneven grinding image or removal. Due to the uneven longitudinal extension dimension and / or shape of the basic grinding element, the basic grinding element can tend to particle detachment, where the basic grinding element detaches from the joint on the grinding device. Thus, a grinding element having, for example, one or more flat surfaces and / or a generally blocky shape can cause detachment from the grinding device especially due to a weak chemical bond.

[0012] The basic grinding element is not limited to a specific basic grinding element. The basic grinding element can be, for example, corundum (in various variants, especially white corundum, semi-precious corundum, blue corundum, zirconium corundum, ceramic corundum, and / or brown corundum), silicon carbide, cubic boron nitride, diamond, or a mixture thereof.

[0013] Thereby, a particularly firm connection of the grinding element on the grinding device can be achieved.

[0014] Desirably, the grinding element has a support element arranged on the basic grinding element for supporting the basic grinding element. The support element can be configured as a filling element. The support element can be configured to support particles. It is understood that one or more support elements can be arranged on the basic grinding element. In particular, the support elements can be distributed especially evenly over the entire outer side, especially the outer lateral surface or surface of the basic grinding element. The support element can be arranged directly or indirectly on the basic grinding element and especially contact the basic grinding element. The support element can be composed of, for example, white corundum, zirconium corundum, or a similar material. The support element can be composed of the same material or material composition as the grinding element. The support element can be configured to be smaller than the grinding element. The support element can be composed of broken particles. The support element can be composed of the remaining part of the grinding element. Here, the remaining part of the grinding element can be used, which, for example, due to its size, shape, etc., is not suitable for use as a grinding element, such as waste from the production of broken grinding elements. Thereby, a particularly reliable support effect can be achieved.

[0015] Desirably, the bonding element is configured as a coating surrounding the basic grinding element. The bonding element can surround, especially completely surround, the basic grinding element. The bonding element can surround, especially completely surround, the support element. The bonding element can be configured as a connecting element between the basic grinding element of the grinding device and the binder element, especially the basic binder element and / or the covering binder element.

[0016] It can conform to the destination, and the bonding element can surround, especially completely surround, the basic grinding element and / or the support element. The bonding element can be arranged between the basic grinding element and the support element. The bonding element can wrap the basic grinding element and the support element. Thereby, a particularly firm connection can be provided.

[0017] It can conform to the destination, and the bonding element holds a large number of support elements on the basic grinding element. The support elements can be arranged on the outer region of the basic grinding element. The support elements can be distributedly arranged over the entire outer region of the basic grinding element. Alternatively, the support elements can be arranged sectionally on the basic grinding element, for example, in sections not provided for machining the workpiece. The support elements can be arranged substantially spaced apart from each other. The support elements can be wrapped by the bonding element. The support elements can be arranged on the basic grinding element and / or especially surrounded by the bonding element in such a way that a large number of uneven surfaces of the grinding element are produced. Thereby, the anchoring of the grinding element on the grinding device can be improved.

[0018] It can conform to the destination, and the basic grinding element can be composed of natural and / or artificial diamond. The basic grinding element can also be composed of other carbon-modified materials suitable for the purpose of the basic grinding element that seem meaningful to those skilled in the art. It can be understood that the basic grinding element can also be composed of other materials that seem meaningful to those skilled in the art. In principle, the basic grinding element can be composed of mineral and / or ceramic materials, such as corundum, silicon carbide, boron nitride or similar materials. For example, the basic grinding element can be realized by alumina particles with a particle size between 7 μm and 300 μm. The basic grinding element can have any geometric configuration that seems meaningful to those skilled in the art. The basic grinding element can be a so-called formed basic grinding element or a crushed basic grinding element. The basic grinding element causes friction and temperature rise on the object to be machined, which has an effect of deforming and / or removing the object to be machined.

[0019] The basic grinding element especially composed of diamond can have a weak chemical bond with the phenolic resin due to its generally massive shape or surface and a large number of flat surfaces (unstructured surfaces), and this chemical bond may cause cracks in the grinding device or between the basic grinding element and the phenolic resin during the machining process. The small gap between the basic grinding element and the bonding element can quickly cause the grinding element to fall off from the grinding device due to the lack of structured surfaces.

[0020] It can conform to the destination, and the bonding element can be made of polyurethane, especially two-component polyurethane. Thereby, good adhesion can be achieved on the surface of, for example, diamond, especially better adhesion than on a grinding element coated with phenolic resin. In particular, the poor chemical bonding between the base grinding element and the binder element (base binder element, covering binder element) of the grinding device can be compensated or improved by the bonding element. The bonding element can be used as an adhesion promoter between the base grinding element made of diamond and the binder element made of phenolic resin in the grinding device. In particular, due to its viscoelastic properties, the bonding element can absorb impacts, thereby preventing or reducing the detachment of the grinding element. Thereby, the base grinding element can be better held on the grinding device.

[0021] Furthermore, it can conform to the destination that each extension dimension of the base grinding element, especially, is at least 100%, especially at least 200%, preferably at least 250%, more preferably at least 300%, and particularly preferably at least 350% larger than each extension dimension of the support element. Each volume of the base grinding element, especially, is at least 100%, especially at least 200%, preferably at least 250%, more preferably at least 300%, and particularly preferably at least 350% larger than each volume of the support element.

[0022] Since it cannot be ensured due to a large number of especially broken base grinding elements and / or support elements that each base grinding element or each support element conforms to the described limitations, the extension dimension should especially be understood as the average extension dimension of multiple elements, and the volume should be understood as the average volume of multiple elements. Thereby, a particularly reliable support effect can be achieved.

[0023] It can conform to the destination that the average size of the support element is smaller than that of the grinding element or the base grinding element. Thereby, the support element can uniformly cover the surface of the base grinding element and the intermediate space between them. The ratio of the average diameter of the base grinding element to the average diameter of the support element can be smaller, especially less than 10, especially less than 5, preferably less than 3, and further preferably less than 2.

[0024] The support element can be arranged directly or indirectly on the basic grinding element. The support element can be arranged adjacent to the basic grinding element. The support element can be configured to support the basic grinding element in the use state. The support element can be configured to improve the strength, heat resistance and toughness of the grinding device. The support element can be configured to mix with the basic grinding element. The support element can be arranged between two basic grinding elements. The support element can be configured to increase the surface or outer side of the basic grinding element to prevent the basic grinding element from falling off. The support element can be configured to reduce or prevent the deflection of the basic grinding element, especially in the use state, to achieve a better grinding effect. The support element can have high mechanical strength. The support element can be configured as a mixture with the basic grinding element.

[0025] The invention further relates to a grinding means, in particular a flexible grinding means, preferably a grinding disk, for grinding a workpiece, which has grinding elements.

[0026] The grinding means may have a longitudinal extension or, in the case of a disk, a diameter of at most 500 mm, in particular at most 400 mm, preferably at most 300 mm, more preferably at most 200 mm, particularly preferably at most 170 mm, for example 150 mm. The grinding means may have a thickness of at most 5 mm, in particular at most 3 mm, preferably at most 2 mm, more preferably at most 1 mm, particularly preferably at most 0.5 mm, for example 0.4 mm or less.

[0027] In order to compensate for local unevenness and provide an optimized grinding pattern, the grinding means can be designed to be flexible. “Flexible” is understood in particular to mean consisting of or containing a bendable material.

[0028] It may be expedient for the grinding means to have an especially flexible carrier element for arranging the grinding element, in particular by means of an adhesive element.

[0029] The grinding device can be particularly suitable for hard and wear-resistant workpieces, such as concrete floors. Here, the grinding element can be basically engaged or embedded in the adhesive element, especially the covering adhesive element, when manufacturing the grinding device. The adhesive element may wear during the processing process so that the basic grinding element is exposed. The exposed basic grinding element can prevent further wear of the adhesive element, especially the covering adhesive element. In this "running-in process", the support element on the exposed surface of the basic grinding element can also be worn, while other support elements on the side facing away from the workpiece are not affected.

[0030] The grinding means can have a plurality of grinding elements on one side, in particular on a surface, of the carrier element. The grinding elements can protrude relative to the carrier element and / or delimit the grinding means.

[0031] A grinding device is used for grinding or abrading a workpiece, during which the material of the workpiece is mechanically removed from the surface of the workpiece in the form of chips. The grinding device can be a coated grinding device or a composite grinding device including a foam material and an upper layer material, or a foam grinding device. In addition, alternative grinding devices can also be considered in principle, such as connected grinding devices, especially usually synthetic resin-connected cutting and grinding discs. The grinding device can be configured as sandpaper. The grinding device can be coated ("coated abrasive") or uncoated.

[0032] The grinding device can exist in different finished forms, such as a grinding disc or a grinding belt, as an arc, a roll, a strip or also as a grinding product belt (e.g., during manufacturing). In particular, the grinding product can be manufactured by using a grinding machine such as an eccentric grinding machine or by hand grinding. For example, the grinding product can be realized as a hand grinding arc, a grinding belt or a grinding disc laminated with flannel.

[0033] The binder element can have a base binder element and / or a covering binder element. The base binder element can be arranged to cover the carrier element and / or the grinding element. The covering binder element can be arranged to cover the carrier element, the base binder element and / or the grinding element. The base binder element and / or the covering binder element can be constructed as a layer on the carrier element.

[0034] In the context, the "base and / or covering binder element" should be particularly understood as a material or a mixture of materials arranged especially in a planar extended manner, which is arranged in the normal direction of the main extension plane of the carrier element of the grinding device, especially directly between the surface of the carrier element of the grinding device and the grinding element. The base and / or covering binder element can be arranged for a material-locking connection between the grinding element and the carrier element of the grinding device. Thereby, a preferably good and reliable attachment and material-locking connection of the base and / or covering binder element can be achieved on at least one surface of at least one base body of the grinding unit.

[0035] The load-bearing element of the grinding device can have any substrate common in the grinding device industry, in particular a flexible substrate. The load-bearing element can be made, for example, of textiles, knitted fabrics, woven fabrics, braids, mesh fabrics, paper, cardboard, films, vulcanized fiber, etc. or combinations thereof. The load-bearing element can consist of one or more layers. The load-bearing element can preferably consist at least of paper material and / or fabric material and / or film material. In the context, "paper" should be understood in particular as a material that is at least partially made of fibers, in particular plant fibers, preferably at least partially by beating and gluing and at least partially pressed into a particularly thin and smooth layer. In the context, "fabric material" should be understood in particular as a material that is at least partially woven and consists of crossed fibers, in particular threads. In the context, "film material" should be understood in particular as a material that is at least partially made of at least one metal, at least one metal alloy and / or at least one plastic and at least partially made into a particularly thin strip.

[0036] The load-bearing element can be used as a load-bearing layer and impart special properties to the grinding device in terms of adhesion, elongation, crack and tensile strength, flexibility and stability. The grinding element can be applied and fixed to the load-bearing layer. The grinding element can be arranged and / or connected to the load-bearing element by means of a known basic binder element. For example, in a coated grinding device, the grinding element adheres to the load-bearing element due to the basic binder element. With the help of the basic binder element, the abrasive grains can be pre-fixed on the load-bearing element in a desired position and distribution. Persons skilled in the art are fully aware from the prior art of suitable basic binder elements for applying the grinding element to the load-bearing element.

[0037] The grinding device can comprise one or more covering binder elements, in particular layers of covering binder elements. In the case of two layers of covering binder elements, the lower covering binder element is usually called "covering binder 1" or "size coating", and the upper covering binder element is called "covering binder 2" or "supersize coating". The topmost covering binder element can be uncured, i.e. the covering binder element that forms the outermost layer and faces away from the load-bearing element of the grinding device. The covering binder element can be applied, in particular in layers, on the basic binder element and the grinding element. Here, the covering binder element firmly connects the grinding elements to each other and firmly to the load-bearing element. The grinding device can have a first side, in particular a holding side, and a second side facing away from the first side, in particular a grinding side. The grinding device can be bounded on the holding side by a holding surface. The grinding device can be bounded on the grinding side by a grinding surface.

[0038] The holding side can have fastening means. The fastening means can be arranged for arranging the grinding means on a machine tool, in particular on a grinding disk of a machine tool. The fastening means can have mechanical connecting elements, such as hook-and-loop locking elements, threaded connecting elements or clamping connecting elements. The fastening means can have adhesive connecting elements, such as adhesive locking elements.

[0039] As appropriate, the base binder element and / or the covering binder element can consist of a synthetic resin, in particular a phenolic resin. As the base binder element and / or the covering binder element, in particular, synthetic resins such as phenolic resins, epoxy resins, urea resins, melamine resins, polyester resins or similar materials can be considered. The base binder element and the covering binder element can also contain other common active agents and / or fillers.

[0040] The invention also relates to a method for manufacturing a grinding element for a grinding means, in particular a flexible grinding means, comprising the following steps:

[0041] - providing a base grinding element;

[0042] - providing a support element;

[0043] - connecting the support element to the base grinding element in a material-locking manner, in particular by means of an adhesive element.

[0044] The base grinding element and the support element can be provided in a suitable quantity and amount. The base grinding element and the support element can be present as bulk material. In particular, the adhesive element that produces a material-locking connection can be present in liquid, viscous liquid, paste or similar form.

[0045] In order to produce a material-locking connection between the support element and the base grinding element, a mixing device can be used. Suitable mixing devices are known to those skilled in the art.

[0046] The mixing device can have a receiving unit for receiving the mixing material, in particular the base grinding element, the support element and the adhesive element. The receiving unit can be in a receiving state in which the receiving unit is opened to receive the mixing material. The receiving unit can be in a closed state in which the receiving unit encloses the mixing material, in particular preventing or avoiding the accidental escape of the mixing material from the receiving unit. The receiving unit can be configured as a receiving drum.

[0047] The mixing device can have a mixing unit for mixing the mixing material. The mixing unit can have mixing elements. The mixing elements can be configured as screw mixers, impeller mixers or similar devices. The mixing elements can in particular be completely arranged in the receiving unit. The mixing elements can be supported movably or immovably relative to the receiving unit. The mixing elements can contact the mixing material directly or indirectly.

[0048] The mixing device may have a drive unit. The drive unit may drive the receiving unit and / or the mixing unit, in particular the mixing element, and cause relative movement between them.

[0049] The mixing unit may transfer a suitable mixing motion of the receiving unit and / or the mixing unit to the mixing material in order to mix the mixing material. It is understood that other mixing principles that are meaningful to those skilled in the art may also be used.

[0050] Here, the grinding element can be coated with a support element by mixing the grinding element with the support element and the adhesive element to be used at room temperature. Here, the adhesive element, in particular together with the support element, is distributed relatively homogeneously on the grinding element due to surface tension.

[0051] For example, the grinding element can consist of, in particular, 30 g of diamond, in particular 6 g of white fused alumina, in particular 1.5 g of adhesive element (Huntsman ABR8910). For example, the grinding element can consist of, in particular, 30 g of diamond, in particular 4 g of white fused alumina, in particular 1 g of adhesive element (Huntsman ABR8910).

[0052] In another step, the mixing material can be cured by means of a curing unit. Suitable curing principles and curing units are known to those skilled in the art. The mixing material can be cured during or after the mixing process.

[0053] After the mixing process of the mixing material, the mixing material can be cured in a heating unit, in particular in a furnace unit, at a temperature above 50 °C, in particular above 100 °C, preferably above 130 °C, for example 140 °C. Usually, the mixing material can be cured by means of the heating unit for more than 5 min, in particular more than 8 min, for example 10 min. Here, the base grinding elements coated with the adhesive element can be bonded together with other base grinding elements.

[0054] In another step, in particular during or after curing, an electrically conductive material can be applied to the coated base grinding element or the grinding element. The electrically conductive material can be configured as an organic compound. In particular, the organic compound can be configured as at least one ionic liquid and / or a conductive polymer. It is conceivable that the organic compound is applied to the abrasive grains in pure form and / or as a solution dissolved in a solvent, such as water, to the abrasive grains. Such an organic compound for the grinding element (hereinafter referred to as abrasive grains) is disclosed in patent application DE 10 2017 204 605 A1. Reference is made in this regard to application DE10 2017 204 605A1, the content of which is incorporated herein into the present application. Thereby, the crack resistance of the coated base grinding element or the grinding element can be improved.

[0055] During or after curing, the grinding elements may adhere individually, especially due to the bonding elements. In a further step, the adhered grinding elements can be broken or separated with the aid of a separating unit, especially with a relatively small force. The separating unit can have separating elements for separating the bonded mixture. The separating elements can be configured as separating spheres. The separating spheres can exert a particularly slight mechanical force on the mixture in order to separate or detach the bonded basic grinding elements or grinding elements from one another.

[0056] For example, after the curing step, the separating elements can be added to a receiving unit so that the separation process can be carried out.

[0057] To simplify the separation process of the coated basic grinding elements or grinding elements, the mixture can be rotated in a heating unit, especially a furnace unit, during the curing process, for example in the receiving unit or in another receiving unit especially configured as a receiving drum. Thereby, the adhesion of the mixture or the coated basic grinding elements or grinding elements can be reduced or prevented.

[0058] In a further step, the unseparated grinding elements can be separated from the separated grinding elements with the aid of a sieve unit. The unseparated grinding elements (screening residue) can be supplied to the separating unit.

[0059] The invention also relates to a grinding device for grinding workpieces, especially a flexible grinding device, preferably a grinding disc, having a particularly flexible carrier element for arranging the grinding elements.

[0060] It is proposed that the grinding device has through notches for receiving the grinding elements.

[0061] The through notches can extend through the entire carrier element. The through notches can extend from one side of the carrier element to the other side of the carrier element opposite to that side.

[0062] The through notches can be provided for receiving the grinding elements. The through notches can be configured as receiving openings for receiving the grinding elements. The through notches can delimit the arrangement of the grinding elements on the grinding device. The through notches can be aligned with the grinding elements. The through notches can support the grinding elements from the side. The through notches can be configured such that the grinding elements are held in the through notches indirectly or directly.

[0063] Thereby, the grinding elements can be more firmly connected to the separating elements, whereby the detachment of the grinding elements (abrasive grain detachment) can be reduced or prevented. In particular, the grinding elements can be arranged "deeper" in the binder element, especially surrounded by the binder element. In particular, a thinner layer of the binder element can be achieved thereby. Thereby, the grinding device can be more flexible.

[0064] It is understood that one or more through notches can be provided. The through notches can be arranged at least 1 mm, in particular at least 2 mm, apart from each other. In particular, each through notch can have a pore diameter of at least 0.1 mm, in particular at least 0.3 mm, preferably at least 0.5 mm.

[0065] The bearing element can have a material thickness of at least 1 mm, in particular at least 2 mm, preferably at least 5 mm.

[0066] The pore diameter of the through notch and the material thickness of the bearing element can be adapted to the size (grain size) of the grinding element, in particular the grinding element. Thereby, a desired amount of grinding elements (amount of abrasive grains) can be applied. Thus, the amount of the grinding elements can be very constant and independent of the duration of the spreading process of the grinding elements.

[0067] The through notches can be introduced into the bearing element by means of a stamping method, a laser method, a piercing method (such as a needle roller) or a similar method.

[0068] When piercing, in particular by means of a piercing method, a raised portion can be formed in the bearing element. The raised portion can surround the through notch. The raised portion can be arranged on the back side or the holding side of the grinding device or the bearing element 31. The raised portion can be configured as a raised portion arranged around and / or bounding the through notch. The raised portion can form a recess, in particular assigned to the raised portion, on the grinding side. The raised portion, in particular the recess of the raised portion, can be optimally aligned with the grinding element. By means of the raised portion, the grinding elements arranged in the through notches can be particularly advantageously aligned.

[0069] Desirably, the grinding device has a base binder element for arranging the grinding elements on the bearing element, in particular in the through notches of the bearing element. The base binder element can be provided for holding the grinding elements in the through notches. The base binder element can fix the grinding elements in the through notches. Thereby, the shedding (abrasive grain shedding) of the grinding elements can be prevented.

[0070] Desirably, the base binder element is arranged in the through notches. The base binder element can in particular completely fill the through notches. The base binder element can bound the through notches. The base binder element can limit the extension scale of the through notches passing through the bearing element. The base binder element can be arranged in the region on the side of the bearing element facing away from the grinding side. Thereby, the grinding elements can be particularly advantageously held in the through notches.

[0071] It is possible to conform to the destination, and the base binder element is arranged on the through-notch. The base binder element can be arranged on the side facing away from the grinding side. The base binder element can delimit the through-notch, especially on the side facing away from the grinding side. The through-element can completely cover the through-notch, especially. The base binder element can be configured as a film element, especially an adhesive film element, which is arranged on the side of the carrier element facing away from the grinding side. The base binder element can be connected to the carrier element comprehensively.

[0072] Thereby, the mechanical toughness can be improved. In particular, more grinding elements can participate in the grinding process. By arranging the grinding elements in the through-notch, the support elements can be omitted. Especially because the grinding elements can be supported by the carrier element delimiting the through-notch. In particular, the chip space for receiving grinding dust can be increased, thereby avoiding the sensitivity to clogging. In addition, the grinding elements can be better aligned.

[0073] It is possible to conform to the destination, and the carrier element has a coating that can conduct electricity especially, for aligning the grinding elements especially in an electrostatic field. The coating can be arranged on the side of the carrier element facing away from the grinding side. Such a coated carrier element is purchased from Ahlstrom- company, for example. Thereby, the electrostatic force in the through-notch can act more strongly than in the adjacent areas, and thus, the grinding elements are preferably attracted into the through-notch.

[0074] It is possible to conform to the destination, and the base binder element is arranged on the side of the carrier element facing away from the grinding side in a solid state and / or in the form of a film.

[0075] The present invention also relates to a method for manufacturing a grinding device that is especially flexible, especially a grinding device according to one of the foregoing claims, including the following steps:

[0076] - Providing a carrier element for arranging the grinding elements on the carrier element;

[0077] - Providing a through-notch that extends especially through the entire carrier element for receiving the grinding elements.

[0078] It is possible to conform to the destination, and in one step, the base binder element is arranged on the side of the carrier element facing away from the grinding side and / or on the through-notch.

[0079] Here, the base binder element should not be applied to the grinding side of the carrier element as usual, but is applied to the side of the carrier element facing away from the grinding side or arranged on the holding side of the carrier element.

[0080] The base binder element can be applied to the carrier element and / or the through-notch by means of a doctor blade method. The base binder element can be applied to the carrier element in a liquid state, in particular a viscous liquid state, preferably a paste state. Due to its state and surface tension, the base binder element can remain in the through-notch.

[0081] In one step, the base binder element can be applied to the carrier element comprehensively. The base binder element can coat the carrier element comprehensively. Here, a layer or film of the base binder element can remain on the carrier element. In another step, another layer, such as a flocked cloth, a covering paper, an anti-slip coating, can be applied or laminated onto the base binder element.

[0082] Alternatively to applying the liquid base binder element by doctor blade method, the base binder element can be configured as a film element, in particular an adhesive film element. The film element can be arranged or pasted on one side of the carrier element facing away from the grinding side. Thereby, the carrier element can be implemented substantially "sealed", so that residues of the adhesive element on the side facing away from the grinding side can be avoided. These residues may contaminate the manufacturing roller and make the manufacturing process difficult. Thereby, the curing / drying / deactivation of the base binder element arranged on the side facing away from the grinding side can be omitted. In addition, the use of a liquid base binder element can be avoided.

[0083] In the case of using an adhesive element configured as a film element, the manufactured grinding device can be rolled up and stored without a protective film element, such as wax paper, because the base binder element, such as self-adhesive, can remain in the through-notch.

[0084] In another alternative embodiment, a hot melt adhesive layer can be applied to the back side of the perforated paper. The hot melt adhesive layer can be immediately sown in a hot state from the opposite side or heated again, for example, by means of an infrared radiator before the sowing process. This layer can also be used to apply the flocked cloth simultaneously.

[0085] Alternatively to the perforated film, an open-pored fabric (e.g., 50 g / m 2 ) can be used, on the back side of which an adhesive film is applied. Then, during the sowing process, the abrasive grains remain in the fabric. The advantage of this method is that a "mesh" is processed and the grinding device can thus be sold as a "mesh grinding device". Here, an adhesive film, a hot melt adhesive coating or a liquid coating can also be used as the adhesive layer (Note: However, the advantage of the high final toughness of the grinding device is lost with this variant).

[0086] It can be expediently sown a large number of grinding elements onto the carrier element in one step, in particular by means of static electricity or compressed air.

[0087] In one embodiment of the method, the grinding elements can be electrostatically spread onto the carrier element. Here, the grinding elements are electrostatically charged and accelerated onto the carrier element by means of an electrostatic interaction with the external electric field in the external electric field.

[0088] During the electrostatic spreading process, the grinding elements oriented substantially perpendicular to the grinding device, in particular perpendicular to the grinding surface, can remain in the through slots. If the grinding elements reach the through slots substantially perpendicular to the grinding device, the grinding elements are "sucked" into the through slots by the surface tension of the base binder, whereby the grinding elements are further erected in the vertical direction.

[0089] The grinding elements oriented substantially parallel to the grinding device, in particular parallel to the grinding surface, can be repelled in such a way that the grinding elements discharge on the carrier element and fall back. Thereby, a particularly advantageous bundle of grinding elements can be formed, which are bonded by means of binder elements arranged in or behind the through slots. The curing of the base binder element and the application of the covering binder element can be carried out in a conventional manner, i.e., by thermal curing, two-component curing, ultraviolet curing, etc., and are known to those skilled in the art.

[0090] The amount of the grinding elements can be determined by the aperture of the through slots and the amount of the base binder elements arranged on the carrier element.

[0091] In another embodiment of the method, the grinding elements can be pneumatically spread onto the carrier element, in particular by means of compressed air. Here, the grinding elements are entrained and deflected by the compressed air and accelerated onto the carrier element. Thereby, the grinding elements can be blown into the through slots by the compressed air. Alternatively, the base binder element can be dispensed with, and the grinding elements can be sucked into the through slots from the holding side of the carrier element. If necessary, the accumulation of the grinding elements on the grinding side of the carrier element can be prevented by means of compressed air pulses, similar to a filter known to be clogged with abrasive grains.

[0092] Alternatively or additionally, the grinding elements can be spread onto the carrier element mechanically or by gravity. "Mechanical spreading" can in particular be understood as the grinding elements being spread onto the carrier element by mechanical acceleration. This can be done, for example, by using a rotating centrifugal accelerator, i.e., similar to a rotating disk, on which the grinding elements are accelerated radially outwards. Alternatively or additionally, gravity spreading can be achieved by using a "chute". "Gravity spreading" can be understood as the grinding elements being spread onto the carrier element under the action of gravity.

[0093] In one embodiment of the method, the sieve is made of metal and operates as a high-voltage electrode during electrostatic spreading. The counter electrode for electrostatically spreading the grinding elements can be arranged, for example, behind the carrier element, in particular behind the carrier element - conveying path (Warenbahn), or, if the carrier element, in particular the carrier element - conveying path, is conductive or has a conductive (e.g., water-containing or carbon black-filled) binder element, is realized by the carrier element, in particular by the carrier element - conveying path itself. In this way, a particularly effective electrostatic spreading of the grinding elements can be carried out, during which the risk of agglomeration of, for example, previously depolymerized grinding elements can be largely avoided.

[0094] Optionally, in one step, the grinding elements not arranged in the through notches and / or held on the carrier element by means of the base binder can be removed.

[0095] The invention also relates to a grinding device for grinding workpieces, in particular a flexible grinding device, preferably a grinding disc, which has a particularly flexible carrier element for arranging grinding elements by means of a base binder element.

[0096] It is proposed that the grinding device has an adhesion-limiting element arranged on the carrier element for limiting the arrangement of the base binder element on the carrier element.

[0097] The adhesion-limiting element can reduce or prevent the arrangement of the base binder element on the carrier element. The adhesion-limiting element can reduce or prevent the arrangement of the grinding elements on the carrier element. The adhesion-limiting element can be arranged to displace or repel the base binder element arranged on the carrier element, in particular such that the adhesion-limiting element does not get wetted (Benetzung) with the base binder element. The adhesion-limiting element can be configured as an "anti-adhesion element" or "anti-sticking element". The adhesion-limiting element can be partially arranged on the carrier element and cover a part of the carrier element. The adhesion-limiting element can be arranged indirectly or directly on the carrier element. The adhesion-limiting element can extend along the entire longitudinal extension scale of the grinding device, in particular.

[0098] It can conform to the destination. The grinding device has a grinding area and a blank area adjacent to the grinding area. The grinding area can be formed by or bounded by the blank area. The grinding area can be formed by a base binder element that bounds the grinding area. In particular, each base binder element can form or bound the grinding area. The grinding area can be formed by a large number of base binder elements, especially arranged at intervals from each other. The base binder element can be configured as a base binder element - point. The base binder element can be configured in the form of islands, especially base binder islands. The base binder element can have an extension scale or diameter of less than 3 mm, especially less than 2 mm, preferably less than 1 mm, for example 0.7 mm. The base binder element can be composed of phenolic resin, melamine resin, polyurethane resin, polyester resin, and can be formed or composed of these materials optionally by ultraviolet curing, etc. The base binder element can be cured according to the material properties or according to the base binder element used. The grinding area can be formed by one base binder element and / or by a plurality of base binder elements. The grinding area can be formed by a large number of base binder elements spaced apart from each other. The base binder elements in the grinding area can be arranged close to each other or in groups. The base binder element can receive a large number of grinding elements and hold them, especially in bundles, on the carrier element. Thus, areas or channels without base binder elements or grinding elements can be provided between the base binder elements in the grinding area. These areas or channels can be provided for optimized dust transport.

[0099] In addition, it can conform to the destination that the grinding area is surrounded by the blank area. In addition, it can conform to the destination that the grinding area surrounds the blank area. In addition, it can conform to the destination that the blank area is bounded substantially by a large number of base binder elements, especially the base binder elements of the grinding area. The grinding area and the blank area can have different visual characteristics. The blank area can be configured without base binder elements, especially without any base binder elements. The grinding area and the blank area, especially their boundary with each other, can form a contrast. This contrast can form an information pattern. Thus, information can be provided to the user in a particularly simple way.

[0100] Attachment limiting elements can be arranged on especially all the blank areas of the carrier element. The attachment limiting element can form the blank area. The attachment limiting element can be printed on the carrier element. The base binder element can be applied to the carrier element especially in a surface - type manner, preferably comprehensively, especially by roll coating with a roller. In particular, the areas of the carrier element that should not receive the base binder element, especially the blank areas, can be printed by means of the attachment limiting element. The base binder element arranged on the attachment limiting element (blank area) can retract to the area of the carrier element that is not coated by the attachment limiting element, especially the grinding area.

[0101] During the sowing process of sowing the grinding elements onto the carrier element, the grinding elements adhere to the area of the carrier element where the basic binder elements are arranged.

[0102] The covering binder elements can also be applied to the carrier element, in particular in a surface-like manner, preferably comprehensively, in particular by means of roller coating. In particular, the areas of the carrier element that should not receive the covering binder elements, in particular the blank areas, can be printed by means of the adhesion limiting elements. The covering binder elements arranged on the adhesion limiting elements (blank areas) can hereby retract onto the areas of the carrier element that are not coated by the adhesion limiting elements, in particular the grinding areas. The covering binder elements can retract onto the grinding areas (with the grinding elements), where the covering binder elements are additionally sucked in by the capillary forces between the grinding elements.

[0103] In order to prove the use of the adhesion limiting elements, small droplets (invisible to the naked eye) of the binder elements, in particular the basic binder elements, can be detected by microscopy on the adhesion limiting elements, in particular on the adhesion limiting elements where no grinding elements are arranged. Alternatively or additionally, the surface tension in the area of the adhesion limiting elements can be measured.

[0104] The adhesion limiting elements can expediently have a viscosity adapted to the basic binder elements.

[0105] Furthermore, it is possible to meet the requirements of the destination. The grinding device has openings, in particular suction openings, for sucking up grinding dust, wherein the suction notches are delimited by attachment limiting elements. The opening can be arranged in a blank area. The opening can be spaced apart from the grinding area. The opening can extend through the carrier element, in particular through the entire grinding device. The opening can be configured as a notch. In the context, the "opening" should be particularly understood as a continuous hole, in particular a hole extending through the entire material thickness of the grinding device. The opening can be configured as a round hole. However, other hole shapes that are meaningful to those skilled in the art can also be considered, such as triangular, rectangular, square, polygonal, star-shaped or combinations of these hole shapes. The opening can have a diameter of at most 10 mm, in particular at most 7 mm, preferably at most 5 mm, more preferably at most 4 mm, particularly preferably at most 3 mm, for example 2.4 mm or less. The opening and the grinding area can delimit a blank area. The opening can be surrounded by the blank area, in particular completely surrounded, preferably surrounded 360° in a plane. The opening can be delimited by the blank area. This can prevent hitting the grinding element when manufacturing the opening, for example by stamping or laser cutting methods, or stamping or laser cutting out the grinding element, thereby minimizing wear during manufacturing. The opening can have an extension dimension, and the blank area also has an extension dimension, wherein each extension dimension of the opening is less than each extension dimension of the blank area. Thus, if the extension dimension of the blank area is greater than the extension dimension of the opening to be provided, the opening can be particularly advantageously stamped out in the blank area.

[0106] It is possible to meet the requirements of the destination. The base binder element consists of more than 40% by weight, in particular more than 50% by weight, preferably more than 55% by weight and / or less than 80% by weight, in particular less than 70% by weight, preferably less than 65% by weight.

[0107] Another embodiment of the present invention includes a method for manufacturing a particularly flexible grinding device, the method comprising the following steps:

[0108] - Providing a carrier element for arranging the grinding element on the carrier element;

[0109] - Providing an attachment limiting element for limiting the arrangement of the base binder element on the carrier element.

[0110] It is possible to meet the requirements of the destination. In one step, the base binder element is particularly applied to the carrier element comprehensively, in particular by means of a roll coating method.

[0111] It is possible to meet the requirements of the destination. In one step, the carrier element is sown with a large number of grinding elements, in particular by means of static electricity or compressed air.

[0112] It is possible to meet the requirements of the destination. In one step, the covering binder element is particularly applied to the carrier element comprehensively, in particular by means of a roll coating method.

[0113] The present invention also relates to a method for manufacturing a particularly flexible grinding device, the method comprising the following steps:

[0114] - providing a carrier element for arranging a grinding element on the carrier element; and

[0115] - providing a pad printing element and / or a silicone roller element for arranging a base binder element on the carrier element.

[0116] The pad printing element and / or the silicone roller element can be arranged to receive the base binder element. The pad printing element and / or the silicone roller element can be arranged to hold the base binder element. The pad printing element and / or the silicone roller element can be arranged to arrange or release the base binder element on the carrier element.

[0117] The pad printing element and / or the silicone roller element can be made of a particularly elastic material, particularly a silicone material, preferably silicone rubber.

[0118] The base binder element can be arranged on the carrier element by means of a pad printing head element using a pad printing method or by means of a silicone roller element using a silicone roller coating method. The pad printing method can be implemented as an indirect deep drawing method.

[0119] Transferring the base binder element onto the carrier element can be achieved by pressing with different pressing forces.

[0120] The base binder element can be transferred onto the carrier element by means of a pressing pad printing element and / or a silicone roller element, particularly by means of a pressing force.

[0121] The base binder element applied particularly by means of a pad printing method and / or a pad printing roller coating method to the carrier element can have an edge region on which the base binder element descends smoothly, which typically indicates the use of such a method.

[0122] Due to the flexibility and adaptability of the pad printing element and / or the silicone roller element, the base binder element can also be used for non-planar, particularly complexly shaped surfaces of the carrier element. In particular, various materials to be printed can be used, such that the carrier element can be applied, for example, from plastics, rubber, glass, ceramics, paper, wood, metal, and many other materials.

[0123] A common alternative in a silicone pad printing element can be a silicone roller.

[0124] In an electrical variant, the roller drive is realized by means of a screw drive motor. The operation is realized in jogging operation by means of a two-pedal button for forward and backward movement. In order to safeguard dangerous parts, a pull cord switch is used directly in front of the entrainment area, the triggering of which causes the drive to immediately stop the drive and pneumatically open the roll gap (> 120 mm).

[0125] It is possible to provide, in a single step and as desired, a printing plate element for presenting an embossing die, in particular an intaglio die.

[0126] The printing plate element may have printing grooves for receiving a base binder element. For example, the printing plate element may be made of metal, in particular steel, or of plastic. The printing plate element may be referred to as a template. The printing plate element may be delimited by the printing grooves. The printing grooves may be delimited 360° by the printing plate element in a plane. The printing plate element may be adapted to a carrier element, in particular to the shape of the carrier element, preferably to the surface of the carrier element. The printing grooves may be constructed, for example, by means of a milling method on the printing plate element.

[0127] The printing plate element, in particular the printing grooves, may form a printed image, in particular an intaglio image. This printed image may be transferred to the carrier element by means of a pad printing punch element.

[0128] It is possible to provide, in a single step and as desired, a doctor blade element, in particular a cassette doctor blade element, for arranging the base binder element on the printing plate element, in particular on the printing grooves of the printing plate element.

[0129] The doctor blade element may be arranged to arrange the base binder element on the printing plate element, in particular in the printing grooves. The doctor blade element may be arranged to receive the base binder element. The doctor blade element may be arranged to scrape off a viscous element, in particular the base binder element.

[0130] It is possible to provide, as desired, a carrier element which is sprinkled with a large number of grinding elements, in particular by means of static electricity or compressed air. A supply voltage of 3 × 400 V / 50 Hz and compressed air (6 bar) is required for the energy supply.

[0131] It is possible to provide, as desired, a covering binder element, which is arranged, in particular by means of a roller coating method, in particular completely, on the carrier element.

[0132] The invention also relates to a grinding device for grinding workpieces, in particular a flexible grinding device, preferably a grinding disc, which has a particularly flexible carrier element for arranging grinding elements by means of a base binder element and a covering binder element for covering the grinding elements and / or the base binder element.

[0133] It is possible to conform to the destination, and the grinding device has a first groove, in particular a first slit groove, which is arranged in the base binder element and / or the covering binder element.

[0134] The groove can be configured as a rated fracture site. The groove can delimit the covering binder element. The groove can delimit the base binder element. The groove can separate the base binder element and / or the covering binder element from each other. The groove can define the bending edge of the grinding device. The groove can be delimited by a load-bearing element. The groove can extend at least 20%, in particular at least 30%, preferably at least 40%, more preferably at least 50%, particularly preferably at least 60% and / or at most 90%, in particular at most 80%, preferably at most 70%, more preferably at most 60% relative to the thickness of the grinding device.

[0135] The groove can in particular be arranged in particular in each area without a grinding element, in particular in an area without any grinding element. In particular, the groove can be arranged at a distance from each grinding element in particular.

[0136] In order to improve the flexibility of the grinding device, the grinding device is usually turned. Here, for example, it is turned by a radius with a roller, in particular a rubber roller. As a result, at least the covering binder element is turned in such a way that cracks are formed in the covering binder element, thereby achieving increased flexibility of the entire grinding device. These cracks are usually called flexible cracks. However, such flexible cracks are disadvantageous because they preferably occur at the weakest parts of the grinding device and thus directly on the grinding elements, which may facilitate the detachment of the grinding elements (abrasive grain detachment).

[0137] Here, the flexibility can be increased by means of the groove and the detachment of the grinding elements can be reduced.

[0138] The thickness of the grinding device can be reduced by means of the groove. In particular, the thickness of the grinding device can be reduced to the thickness of the load-bearing element.

[0139] Thereby, in particular inflexible grinding devices can be configured more flexibly. For the purpose of flexibilizing in particular thicker grinding devices.

[0140] Thereby, in particular thicker grinding devices can be constructed more flexibly, which are composed of, for example, fabric, composite material, fiber material, etc.

[0141] Thereby, the removal efficiency of the grinding device can also be increased in the case of using a "hard" binder element preparation. Thus, the grinding elements can grind more effectively and fewer grinding elements can also be used. In addition, the chip space for receiving abrasive grains is increased, whereby the grinding device is less clogged. Although the entire structure is "heavier", having at least 1000 g / m 2 、in particular at least 1200 g / m 2, preferably less than 2000 g / m 2 of the areal weight, but the grinding device is very flexible.

[0142] The base binder element can consist of in particular 60 g of an aqueous phenolic resin (75% concentration), in particular 40 g of chalk and in particular 30 g of water. The viscosity of the preparation can be low enough. The preparation can in particular be highly filled with fillers despite the low viscosity. Thereby, the grinding element can not tip over after sowing.

[0143] Thereby, the viscosity is reduced in a short time and some water evaporates.

[0144] Alternatively or additionally, a two-component system without water (e.g. polyurethane) can also be used.

[0145] It can be expedient that the first groove extends in particular straight from the first end of the grinding device to the second end of the grinding device facing away from the first end.

[0146] Advantageously for the subsequent flexibilization, the structure of the base binder application and the resulting grain formation should be selected such that straight lines can be drawn through the grinding device from multiple directions without hitting the abrasive grains.

[0147] It can be expedient that the grinding device has a second groove, in particular a second slot groove, which is arranged in the base binder element and / or the covering binder element.

[0148] It can be expedient that the grinding device has a third groove, in particular a third slot groove, which is arranged in the base binder element and / or the covering binder element.

[0149] It can be expedient that the first groove is arranged transversely, in particular orthogonally, with respect to the second groove.

[0150] It can be expedient that the grinding device has a first group of grinding elements and a second group of grinding elements and / or a third group of grinding elements, wherein the groove is arranged between two groups, in particular separating them.

[0151] It can be expedient that the first group of grinding elements is delimited by the first groove, the second groove and the third groove.

[0152] The invention also relates to a method for manufacturing a particularly flexible grinding device, in particular a grinding device according to any one of the preceding claims, the method comprising the following steps:

[0153] - providing a carrier element for arranging the grinding elements on the carrier element;

[0154] - providing a base binder element for holding the grinding elements on the carrier element;

[0155] - Provide a covering binder element for covering the grinding element and / or the base binder element;

[0156] - Form grooves in the grinding device, in particular in the base binder element and / or the covering binder element, by means of a laser cutting method.

[0157] Separate the base binder element and / or the covering binder element by means of a laser.

[0158] Alternatively or additionally, the entire grinding device, in particular the base binder element, the covering binder element and / or the carrier element, can be completely cut through by means of a laser. Here, the groove can extend from one side of the grinding device to the other side of the grinding device opposite to this side.

[0159] The grinding device can expediently be turned in one step by means of an especially flexible roller element. The roller element can be arranged on the grinding area of the grinding device. The roller element can turn the grinding device along the grinding area of the grinding device. Alternatively or additionally, the roller element can be arranged on the area of the grinding device opposite to the grinding area, the holding area, and / or turn the grinding device along this area. The grinding device can hereby be pulled on an edge or pressed into the roller element with a small radius by means of a rod-shaped element, in particular a metallic rod-shaped element. Thereby, the binder element can be broken into small pieces of a few square centimeters, while the carrier element ideally remains undamaged due to its flexibility.

[0160] To assist the turning method, the binder element (base binder element and / or covering binder element) can be flexibilized, for example, by means of a polymer dispersion.

[0161] Thereby, the grinding device can be flexibilized additionally by providing flexible cracks in a pre-given area or at the grooves. In particular, the flexible cracks should be introduced into the base binder element or the covering binder element at the "rated fracture sites" formed by the grooves.

[0162] The carrier element can expediently be sown with a large number of grinding elements in one step, in particular by means of static electricity or compressed air.

[0163] The base binder element can expediently be heated, in particular heated for a short time, preferably by means of an infrared radiator, in one step, in particular after arranging the base binder element.

[0164] The invention also relates to a method for manufacturing an especially flexible grinding device, in particular a grinding device according to any one of the preceding claims, the method comprising the following steps:

[0165] - Provide a carrier element for arranging a large number of grinding elements on the carrier element;

[0166] - Provide a basic bonding agent element for holding the grinding element on the carrier element;

[0167] - Arrange the grinding elements such that, in particular, all the grinding elements protrude relative to the basic bonding agent element.

[0168] By means of this method, it should be possible to place the grinding elements in a targeted manner. In particular, the number of grinding elements to be placed per unit area can be defined. In particular, all the grinding elements can be placed such that, in particular, all the grinding elements protrude relative to the basic bonding agent element. By placing the grinding elements in a targeted manner, it can be prevented that the grinding elements, in particular the longitudinal extension dimension of the grinding elements, are arranged, for example, transversely, in particular parallel to the carrier element.

[0169] Thereby, conditions caused by the method can be compensated, such as different sizes of the grinding elements or different layer thicknesses of the basic bonding agent elements. Different sizes of the grinding elements can occur here in broken and / or growing grinding elements, for example in diamonds. Due to the spreading process, for example electrostatic spreading, the grinding elements may be oriented in different directions and thus may protrude at different heights. Therefore, only accidentally the most protruding or projecting abrasive grains come into contact with the workpiece during grinding.

[0170] Material costs can be saved by means of this method.

[0171] The grinding elements can be oriented according to the grinding plane of the grinding device as desired. The grinding elements can be oriented at a pre-given distance from the carrier element.

[0172] The grinding elements can be arranged as desired with a first end facing the carrier element and a second end facing away from the carrier element. The second end can be arranged at a pre-given distance from the carrier element, in particular from the side or surface of the carrier element facing away from the grinding elements.

[0173] In particular, the grinding elements, in particular all the grinding elements, can form a grinding plane that has a pre-given distance from the carrier element, in particular from the side or surface of the carrier element facing away from the grinding elements. Thereby, thickness deviations of the carrier element and the basic bonding agent element, in particular local thickness deviations, can be compensated. Thereby, a uniform grinding image and a longer service life (through a larger number of simultaneously grinding grinding elements) can be achieved.

[0174] A receiving unit for receiving the grinding elements, in particular in an electrostatic manner, can be provided as desired.

[0175] The receiving unit can have a plurality of receiving grooves. The receiving grooves can be provided for receiving the grinding elements. In particular, a single receiving groove can be provided for a single grinding element. The receiving grooves can be spaced apart from each other.

[0176] The receiving groove can be configured as a through-notch or a blind hole. In order to better receive and stabilize the grinding elements, the receiving groove can be configured in a funnel shape.

[0177] The receiving unit can be seeded with a large number of grinding elements by means of static electricity or compressed air. The receiving unit can receive the grinding elements on the outside. The grinding elements can be vertically oriented on the receiving unit by means of electrostatic seeding. If the grinding elements do not reach the receiving groove, the grinding elements can be actively repelled by charging commutation (discharging, Entladung) when they come into contact with the receiving unit.

[0178] The receiving unit can hold the grinding elements on the receiving unit by means of negative pressure. If the grinding elements are in the correct "position" above the receiving groove, the grinding elements can be fixed by the receiving unit. More grinding elements above a single receiving groove (competition for the receiving groove) result in leakage and thus a loss of negative pressure. Thereby, the holding force for holding the grinding elements may be too small to hold the grinding elements on the receiving unit. Thereby, the grinding elements can be discharged electrostatically and especially actively repelled.

[0179] A release unit can be provided as desired for releasing the grinding elements, especially in a placement manner, onto a grinding device, especially a base binder element. The grinding elements can be placed or pressed into the base binder element to different depths according to the size or extension scale of the grinding elements. Thereby, the grinding tips of the grinding elements, especially, can be arranged at one height or in a grinding plane.

[0180] If released onto the area of the carrier element without the base binder element, the grinding elements are not released by the release unit.

[0181] Optimally, the base binder element can have a pre-given flow limit, which is especially formed by a paste state. This can be achieved by fillers, such as brown corundum.

[0182] The adhesive force of the base binder element can be greater than the holding force generated especially by negative pressure on the receiving unit. In order to finely adjust the holding force, the negative pressure of the receiving unit can be adjusted.

[0183] As desired, the release unit can have a distance greater than the thickness of the base binder element from the carrier element, especially from the side or surface of the carrier element facing the grinding elements. Thereby, it can be ensured that the base binder element does not come into contact with the release unit.

[0184] As desired, the receiving unit and / or the release unit can be configured as a roller unit, especially a perforated roller unit. The receiving unit and the release unit can be configured to be conductive.

[0185] In an alternative embodiment, the receiving unit and / or the releasing unit can be configured as a plate unit, in particular an orifice plate unit.

[0186] To match the destination, the receiving unit has an anti-adhesion coating. Thereby, contamination and adhesion of the base binder element in the area not occupied by the grinding element can be prevented. Optimally, the anti-adhesion coating has an electrical conductivity that is particularly low so as to discharge mis-placed grinding elements and enable them to fall back. This can be particularly advantageously applied to particularly fine grinding elements. Description of the Drawings

[0187] Further advantages result from the following description of the drawings. Embodiments of the invention are shown in the drawings. The drawings, the description and the claims contain multiple combined features. A person skilled in the art can also consider the features separately in a suitable manner and summarize them into other meaningful combinations. The drawings show:

[0188] Figures 1a to 1e : Different views of the grinding element;

[0189] Figure 2 : Cross-section of the grinding device;

[0190] Figures 3a to 3d : Different views for manufacturing the grinding device;

[0191] Figures 4a to 4l : Different views for manufacturing the grinding device;

[0192] Figures 5a to 5h : Different views for manufacturing the grinding device;

[0193] Figures 6a to 6c : Different views for manufacturing the grinding device; and

[0194] Figures 7a to 7e : Different views for manufacturing the grinding device.

[0195] In the following drawings, the same components are provided with the same reference numerals. Detailed Description

[0196] Figure 1b 、 Figures 1d to 1e Shows a grinding element 11 for a flexible grinding device 15 ( Figure 2 ) configured as a grinding disk, which is used for grinding a workpiece and has a base grinding element 13.

[0197] The grinding element 11 has an adhesive element 17 arranged on a base grinding element 13, and the adhesive element is configured as an adhesion promoter 17. The adhesive element 17 is arranged between the binder element and the base grinding element so as to improve the attachment of the base grinding element 13 relative to the binder elements 21, 23, 25. Accordingly, the adhesive element 17 forms an adhesion promoter 17 for the binder elements 21, 23, 25. The binder elements 21, 23, 25 have a base binder element 23 and a covering binder element 25. The base binder element 23 is provided for covering the carrier element 31 and the grinding element 11. The covering binder element 25 is provided for covering the carrier element 31, the base binder element 23, and the grinding element 11. The base binder element 23 and the covering binder element 25 are configured as layers on the carrier element 31.

[0198] The adhesive element 17 is configured as a coating. The adhesive element 17 completely surrounds the base grinding element 13, but can also be arranged sectionally on the base grinding element 13.

[0199] The grinding element 11 has a plurality of support elements 29 arranged on the base grinding element 13 for supporting the base grinding element 13 ( Figure 1d ). The support elements 29 are evenly distributed on the entire outer side surface of the base grinding element 13. The support elements 29 are directly arranged on and in contact with the base grinding element 13.

[0200] The adhesive element 17 completely surrounds the base grinding element 13 and the support elements 29. The adhesive element 17 is arranged between the base grinding element 13 and the support elements 29 and completely wraps the base grinding element 13 and the support elements 29.

[0201] The adhesive element 17 holds the plurality of support elements 29 on the base grinding element 13. The support elements 29 are arranged on the outer region of the base grinding element 13 and are distributed over the entire outer region of the base grinding element 13. The support elements 29 are wrapped by the adhesive element 17 and are arranged on the base grinding element 13 and surrounded by the adhesive element 17 in such a way that a plurality of uneven surface sections of the grinding element 11 are produced ( Figure 1d ). The base grinding element 13 is provided for grinding a workpiece and has a deforming and / or wearing effect on the workpiece to be machined. The base grinding element 13 is configured as abrasive grains and is known as such in addition.

[0202] The base grinding element 13 can be configured as a broken or shaped base grinding element 13. Especially when using a broken base grinding element 13, it is usually not ensured that the base grinding element 13 has approximately the same longitudinal extension scale ( Figure 2 ), whereby the base grinding element 13 can protrude to different extents on the grinding device 15 and result in an uneven grinding image or wear.

[0203] The basic grinding element 13 is not limited to a specific basic grinding element 13. The basic grinding element 13 can be, for example, corundum (in various variants, especially white corundum, semi-precious corundum, blue corundum, zirconium corundum, ceramic corundum, and / or brown corundum), silicon carbide, cubic boron nitride, diamond, or a mixture thereof. The basic grinding element 13 ( Figures 1a to 1e ) is composed of diamond and thus has a weak chemical bond with the phenolic resin due to its typical massive shape or surface and a large number of flat surfaces (unstructured surfaces), and this chemical bond may cause cracks in the grinding device 15 or between the basic grinding element 13 and the phenolic resin during the processing. The small gap between the basic grinding element 13 and the binder elements 21, 23, 25 can quickly cause the grinding element 11 to fall off the grinding device 15 due to the lack of structured surfaces. Due to cost reasons, the support element is made of a material different from that of the basic grinding element. The bonding element 17 is composed of a two-component polyurethane, thereby achieving good adhesion on, for example, the diamond surface. The bonding element 17 serves as an adhesion promoter 17 between the basic grinding element 13 made of diamond in the grinding device 15 and the binder elements 21, 23, 25 made of phenolic resin.

[0204] Unless otherwise, each extension dimension of the basic grinding element 13 is at least 100% larger than each extension dimension of the support element 29. Unless otherwise, each volume of the basic grinding element 13 is at least 100% larger than each volume of the support element 29.

[0205] Because it is not possible to ensure that each individual basic grinding element 13 or each individual support element 29 meets the above limitations due to the presence of a large number of basic grinding elements 13 and / or support elements 29, the extension dimension should be understood in particular as the average extension dimension of multiple elements, and the volume should be understood as the average volume of multiple elements.

[0206] The support element 29 is directly arranged on the basic grinding element 13. The support element 29 is arranged to support the basic grinding element 13 in the use state. The support element 29 is arranged to improve the strength, heat resistance, and toughness of the grinding device 15. The support element 29 is arranged to be mixed with the basic grinding element 13. The support element 29 is arranged between two basic grinding elements 13 and is arranged to space the two basic grinding elements apart from each other. The support element 29 is arranged to improve the surface or the outer side surface of the basic grinding element 13 to prevent the basic grinding element 13 from falling off. The support element 29 is arranged to reduce or prevent the offset of the basic grinding element 13, especially in the use state, in order to achieve a better grinding effect. The support element 29 has high mechanical strength and is arranged to be mixed with the basic grinding element 13.

[0207] The grinding device 15 has a longitudinal extension dimension of at most 500 mm or, in the case of a disk, a diameter.

[0208] The grinding device 15 has a thickness of at most 5 mm.

[0209] The grinding device 15 has a flexible carrier element 31 for arranging the grinding elements 11 by means of binder elements.

[0210] During the manufacture of the grinding device 15, the grinding elements 11 engage or embed to a large extent in the base binder elements 21, 23. During the grinding process, the covering binder element may wear during machining and expose the base grinding element 13. Further wear of the covering binder element 25 can be prevented by the exposed base grinding element 13. During this "running-in process", the support elements 29 located on the exposed surface of the base grinding element 13 can also be removed, while other support elements 29 located on the side facing away from the workpiece remain unaffected.

[0211] The grinding device 15 has a large number of grinding elements 11 on the surface of the carrier element 31, which protrude relative to the carrier element 31 and delimit the grinding device 15.

[0212] The grinding device 15 is configured as a circular grinding disk and is used for grinding or abrading a workpiece, during which the material of the workpiece is mechanically removed from the workpiece surface in the form of chips. The grinding device 15 is a coated grinding device 15( Figure 2 ). The base and / or covering binder elements 23, 25 are provided for connecting the grinding elements 11 of the grinding device 15 to the carrier element 31 in a material-locking manner.

[0213] The carrier element 31 of the grinding device 15 can have any flexible substrate common in the grinding device industry. The carrier element 31 is preferably composed of a fabric, paper or film material. The carrier element 31 consists of multiple layers.

[0214] The grinding elements 11 can be applied to the carrier layer and fixed by means of the base binder element 23. By means of the base binder element 23, the abrasive grains can be pre-fixed on the carrier element 31 in a desired position and distribution.

[0215] The grinding device 15 can include one or more overcoating binder elements 25, in particular layers of the overcoating binder element 25. In the case of two layers of the overcoating binder element 25, the lower overcoating binder element 25 is usually referred to as "overcoating binder 1" or "size coating", and the upper overcoating binder element 25 is referred to as "overcoating binder 2" or "supersize coating". The uppermost overcoating binder element 25 can be uncured, i.e., the overcoating binder element 25 that forms the outermost layer and faces away from the carrier element 31 of the grinding device 15. One or more overcoating binder elements 25 can be applied, in particular in layers, to the base binder element 23 and the grinding element 11. Here, one or more overcoating binder elements 25 firmly connect the grinding elements 11 to each other and firmly connect them to the carrier element 31. The grinding device 15 can have a holding side 35 and a grinding side 33 facing away from the holding side. The grinding device 15 is bounded by a holding surface on the holding side 35 and by a grinding side on the grinding side 33.

[0216] The holding side 35 has fastening means (not shown in detail) which are arranged for arranging the grinding device 15 on the grinding disk of a machine tool. The fastening means can have mechanical connecting elements, such as hook-and-loop locking elements, threaded connecting elements or clamping connecting elements, or adhesive connecting elements, such as adhesive locking elements.

[0217] The base binder element 23 and the overcoating binder element 25 are made of phenolic resin. The base binder element 23 and the overcoating binder element 25 can also contain other common active agents and / or fillers.

[0218] The manufacturing method for manufacturing the grinding element 11 includes the steps of providing a base grinding element 13 and a support element 29. In another step, a material-locking connection between the support element 29 and the base grinding element 13 is produced by means of an adhesive element 17.

[0219] Thereby, the base grinding element 13 and the support element 29 can be provided as bulk materials in suitable quantities and amounts. The adhesive element 17 for producing the material-locking connection can be in a liquid, viscous liquid or paste form. In order to produce a material-locking connection between the support element 29 and the base grinding element 13, a mixing device can be used, by means of which the adhesive element 17 can be distributed around the support element and the base grinding element.

[0220] In order to receive the mixed material, i.e., the base grinding element 13, the support element 29 and the adhesive element 17, the mixing device can have a receiving unit. In the receiving state, the receiving unit is opened to receive the mixed material, and in the closed state, the receiving unit is closed to avoid or prevent the accidental escape of the mixed material. The receiving unit is configured as a receiving drum.

[0221] In order to mix the mixed material, the mixing device has a mixing unit with mixing elements, which are configured as screw mixers, impeller mixers or similar devices. The mixing elements are completely arranged in the receiving unit and are supported movably or immovably relative to the receiving unit.

[0222] The mixing unit transfers a suitable mixing motion of the receiving unit and / or the mixing unit to the mixed material in order to mix the mixed material. The mixing elements contact the mixed material directly or indirectly.

[0223] The mixing device has a drive unit that drives the receiving unit and / or the mixing elements and moves them relative to each other.

[0224] The grinding element 11 is coated with the support element 29, for example, by mixing the grinding element 11 with the support element 29 and the adhesive element 17 to be used at room temperature. Here, due to surface tension, the adhesive element 17, especially together with the support element 29, can be distributed relatively uniformly on the grinding element 11.

[0225] In another step, the mixed material is cured by means of a curing unit. The mixed material can be cured during or after the mixing process.

[0226] After the mixing process of the mixed material, the mixed material can be cured at a temperature above 50 °C in a heating unit configured as a furnace unit. Generally, the mixed material can be cured by means of the heating unit for more than 5 min. Here, the base grinding element 13 coated with the adhesive element 17 can be bonded to other base grinding elements 13 ( Figure 1d ).

[0227] Optionally, in another step, during or after curing, a conductive material can be applied to the coated base grinding element 13 or the grinding element 11. The conductive material is configured as an organic compound, which is configured as at least one ionic liquid and / or a conductive polymer. The organic compound can be applied to the abrasive grains in pure form or as a solution dissolved in a solvent, such as water, to the abrasive grains. Such an organic compound for the grinding element 11 (hereinafter referred to as abrasive grains) is disclosed in patent application DE 10 2017 204 605 A1. In this regard, reference is made to application DE 10 2017 204 605 A1, the content of which is incorporated herein by reference.

[0228] During or after curing, the grinding elements 11 may adhere individually due to the adhesive element 17. Thus, in a further step, the adhered grinding elements 11 can be broken and separated by means of a separating unit. The separating unit has separating elements for separating the adhered mixture, which are configured as separating spheres and exert a mechanical force on the mixture in order to separate the adhered basic grinding elements 13 or grinding elements 11 from one another.

[0229] To simplify the separation process, the mixture can be rotated, for example in a receiving unit, in a heating unit during the curing process.

[0230] The non-separated grinding elements 11 can be separated from the separated grinding elements 11 in a further step by means of a sieve unit and fed to the separating unit.

[0231] The carrier element 31 has a through-notch 37 for receiving the grinding elements 11 ( Figures 3a to 3d ), which extends through the entire carrier element 31. It is understood that a plurality of through-notches are provided in the carrier element. The through-notch 37 extends from the grinding side of the carrier element 31 to the holding side of the carrier element 31 facing away from the grinding side. The through-notch 37 is configured as a receiving opening for receiving the grinding elements 11. The through-notch 37 delimits the arrangement of the grinding elements 11 on the grinding device 15. The through-notch 37 orients the grinding elements 11. The through-notch 37 supports the grinding elements 11 laterally. The through-notch 37 is configured such that the grinding elements 11 are held in the through-notch 37 either indirectly or directly.

[0232] The grinding elements 11 arranged in the through-notch 37 can be surrounded by the carrier element.

[0233] The through-notches 37 can be arranged at least 1 mm apart from one another. Each through-notch 37 can have a pore diameter of at least 0.1 mm. The carrier element 31 can have a material thickness of at least 1 mm. The pore diameter of the through-notch 37 and the material thickness of the carrier element 31 can be adapted to the size (grain size) of the grinding elements 11, in particular the grinding elements 11. Thereby, a desired amount of grinding elements 11 (abrasive grain amount) can be applied.

[0234] The through-notch 37 can be introduced into the carrier element 31 by means of a stamping method, a laser method, a piercing method (such as a needle roller) or a similar method.

[0235] During puncturing, especially when puncturing by means of a puncturing method, a (not shown) raised portion can be formed in the carrier element 31. The raised portion can surround the through-notch. The raised portion can be arranged on the back side or the holding side of the grinding device or the carrier element 31. The raised portion can be configured as a raised portion that is arranged around the through-notch and delimits the through-notch. The raised portion can form a groove that is especially assigned to the raised portion on the grinding side. The raised portion, especially the groove of the raised portion, can optimize the orientation of the grinding element.

[0236] The base binder element 23 is arranged in the through-notch 37 and completely fills the through-notch 37. The base binder element 23 delimits the through-notch 37, thereby restricting the extension dimension of the through-notch 37 through the carrier element 31. The base binder element 23 is arranged on a side of the carrier element 31 that faces away from the grinding side 33 ( Figures 3a to 3d ). The base binder element 23 delimits the through-notch 37 on a side that faces away from the grinding side 33. The through element completely covers the through-notch 37.

[0237] The base binder element 23 can be configured as a film element (not shown), especially an adhesive film element, which is arranged on a side of the carrier element 31 that faces away from the grinding side 33. The base binder element 23 can be connected to the carrier element 31 in an all-round manner. The base binder element 23 can be arranged on a side of the carrier element 31 that faces away from the grinding side 33 in a solid state and / or in the form of a film.

[0238] The carrier element 31 can have an electrically conductive coating for orienting the grinding element 11 by means of an electrostatic field. The coating is arranged on a side of the carrier element 31 that faces away from the grinding side 33. Thereby, the electrostatic force acts more strongly in the through-notch than in the adjacent regions, whereby the grinding element 11 is preferably attracted into the through-notch.

[0239] The manufacturing method for manufacturing the flexible grinding device 15 includes the steps of providing a carrier element 31 for arranging the grinding element 11 on the carrier element 31 and providing a through-notch 37 that extends through the entire carrier element 31 for receiving the grinding element 11.

[0240] In one step, the base binder element 23 is arranged on a side of the carrier element 31 and / or the through-notch 37 that faces away from the grinding side 33. The base binder element 23 is not applied to the grinding side 33 of the carrier element 31 as usual, but is applied to a side of the carrier element 31 that faces away from the grinding side 33 or on the holding side 35 of the carrier element 31.

[0241] The basic binder element 23 can be applied comprehensively to the carrier element 31 by means of a doctor blade method and applied into or covering the through-notch 37. The basic binder element 23 is applied to the carrier element 31 in a liquid state, in particular a viscous liquid state, preferably a paste state. The basic binder element 23 remains in the through-notch 37 due to its state and surface tension.

[0242] In one step, the basic binder element 23 can be applied comprehensively to the carrier element 31 in order to comprehensively coat the carrier element 31. Here, a layer or film of the basic binder element 23 can remain on the carrier element 31. In another step, another layer, such as a fleece, a covering paper, an anti-slip coating, can be applied or laminated onto the basic binder element 23.

[0243] Alternatively to applying the liquid basic binder element 23 by doctor blade method, the basic binder element 23 can also be configured as a film element, in particular an adhesive film element. The film element can be arranged or adhered to the carrier element 31 on the side of the carrier element 31 facing away from the grinding side 33. Thereby, the carrier element 31 can be implemented substantially "sealed", so that residues of the binder element on the side facing away from the grinding side 33 can be avoided. These residues can contaminate the manufacturing roller and make the manufacturing process difficult. Thereby, the curing / drying / deactivation of the basic binder element 23 arranged on the side facing away from the grinding side 33 can be omitted. In addition, the use of a liquid basic binder element 23 can be avoided.

[0244] When using a binder element configured as a film element, the manufactured grinding device 15 can be rolled up and stored without a protective film element (such as wax paper), because the basic binder element 23, such as self-adhesive, can remain in the through-notch 37.

[0245] In another alternative embodiment, a hot melt adhesive layer can be applied to the back side of the perforated paper. The hot melt adhesive layer can be immediately sown from the opposite side in a hot state or heated again, for example, by means of an infrared radiator, before the sowing process. This layer can also be used simultaneously for applying a fleece.

[0246] Alternatively to the perforated film, an open-pored fabric, in particular a textile fabric (such as 50 g / m 2 ) can be used, on the back side of which an adhesive film is applied. Then, during the sowing process, the abrasive grains remain in the fabric. The advantage of this method is that a "mesh" is processed and the grinding device 15 can thus be sold as a "mesh grinding device". Here, an adhesive film, a hot melt adhesive application layer or a liquid coating layer can also be used as the adhesive layer.

[0247] In one step, a large number of grinding elements 11 are sown onto the grinding side of the carrier element 31 by means of static electricity or compressed air.

[0248] In one embodiment of the method, the grinding elements 11 can be electrostatically sown onto the carrier element 31. Here, the grinding elements 11 are electrostatically charged and accelerated onto the carrier element 31 by means of an electrostatic interaction with an external electric field in the external electric field.

[0249] During the electrostatic sowing process, the grinding elements 11 that are oriented substantially perpendicular to the grinding device 15 towards the grinding surface during the sowing process remain in the through-notch 47. If the grinding elements 11 reach the through-notch substantially perpendicular to the grinding device 15, the grinding elements are "sucked" into the through-notch by the surface tension of the base binder, whereby the grinding elements 11 are further erected in the vertical direction.

[0250] The grinding elements 11 that are oriented substantially parallel to the grinding device 15, in particular parallel to the grinding surface, can be repelled in such a way that the grinding elements 11 discharge on the carrier element 31 and fall back. In this way, a particularly advantageous bundle of grinding elements 11 can be formed, which is bonded by means of a binder element arranged in or behind the through-notch. The curing of the base binder element 23 and the application of the covering binder element 25 can be carried out in a conventional manner, for example by thermal curing, two-component (2K) curing, ultraviolet (UV) curing, etc. and are known to the person skilled in the art.

[0251] The amount of the grinding elements 11 can be determined by the aperture of the through-notch and the amount of the base binder element 23 arranged on the carrier element 31.

[0252] In one embodiment of the method, the sieve is made of metal and operates as a high-voltage electrode during the electrostatic sowing. The counter electrode for the electrostatic sowing of the grinding elements 11 can be arranged, for example, behind the carrier element 31, in particular behind the carrier element - conveying path, or, if the carrier element, in particular the carrier element - conveying path, is conductive or has conductive (for example water-containing or carbon black-filled) binder elements 21, 23, 25, is realized by means of the carrier element 31, in particular by means of the carrier element 31 - conveying path itself. In this way, a particularly effective electrostatic sowing of the grinding elements can be carried out, during which the risk of agglomeration of, for example, previously depolymerized grinding elements 11 can be largely avoided.

[0253] In one step, the grinding elements 11 that are not arranged in the through-notch 37 and / or held on the carrier element 31 by means of the base binder element 23 are removed.

[0254] In Figure 4aAn extended embodiment of the grinding device 15 is shown in FIGS. 4I. The grinding device has an attachment limiting element 41 arranged on a carrier element 31 for limiting the arrangement of the base binder element 23 on the carrier element 31. It is understood that the carrier element 31 according to Figure 4a to 4I may also have a through notch 37 according to Figures 3a to 3d . For example, the attachment limiting element 41 may be arranged around the through notch 37, in particular completely surrounding the through notch. Here, the attachment limiting element 41 may be arranged on the grinding side to ensure that the binder element, in particular the base binder element, is arranged in the through notch 37. The attachment limiting element 41 reduces or prevents the arrangement of the base binder element 23 and the grinding element 11 on the carrier element 31. The attachment limiting element 41 is provided for displacing or repelling the base binder element 23 arranged on the carrier element 31, in particular such that no wetting (Benetzung) of the base binder element by the attachment limiting element 41 occurs. The attachment limiting element 41 is configured as an "anti-attachment element" or "anti-sticking element" and is partially arranged on the carrier element 31 to cover a part of the carrier element 31. The attachment limiting element 41 is directly arranged on the carrier element 31 and extends along the entire extension scale of the grinding device 15.

[0255] The grinding device 15 has a grinding area 43 and a blank area 45 adjacent to the grinding area 43. The grinding area 43 is formed by and bounded by the blank area 45. The grinding area 43 is formed by the base binder elements 23 that bound the grinding area 43. In particular, each base binder element 23 may form or bound the grinding area 43. The grinding area 43 is formed by a large number of base binder elements 23 arranged at intervals from each other. The base binder elements 23 are configured as base binder element - points 23. The base binder elements 23 are configured in the form of islands or base binder islands. The base binder elements 23 have an extension scale or diameter of less than 3 mm, in particular less than 2 mm, preferably less than 1 mm, for example 0.7 mm. The base binder elements 23 are composed of phenolic resin, urea resin, polyurethane resin, polyester resin, and may optionally also be formed by ultraviolet curing or the like. The base binder elements 23 may be cured according to the material properties or according to the base binder elements 23 used. The grinding area 43 is formed by a large number of base binder elements 23 arranged close to each other or in groups and spaced apart from each other. The base binder elements 23 receive a large number of grinding elements 11 and hold them in a bundle on the carrier element 31.

[0256] The grinding area 43 is surrounded by the blank area 45, and the grinding area 43 surrounds the blank area 45. The blank area 45 is substantially bounded by the large number of base binder elements 23 of the grinding area 43. The blank area 45 may be configured without base binder elements, in particular without any base binder elements 23.

[0257] The adhesion-limiting element 41 is arranged on or forms the blank areas 45, in particular all blank areas 45, of the carrier element 31. The adhesion-limiting element 41 can be printed on the carrier element 31. The base adhesive element 23 can be applied to the carrier element 31 over its entire surface by means of a roller coating process.

[0258] Additionally, the covering adhesive element 25 can be roller-coated over its entire surface onto the carrier element 31.

[0259] The grinding device 15 can have an opening 47 configured as a suction opening for sucking up grinding dust, wherein the suction notch is at least sectionally delimited by the adhesion-limiting element 41 (Figure 4I). The opening 47 is arranged in the blank area 45 and is spaced apart from the grinding area 43. The opening 47 extends through the carrier element 31 and through the entire grinding device 15. The opening 47 is configured as a notch extending through the entire material thickness of the grinding device 15. The opening 47 is configured as a circular hole. The opening 47 and the grinding area 43 sectionally delimit the blank area 45. The opening 47 is completely surrounded by the blank area 45 by 360° in a plane. The opening 47 is delimited by the blank area 45.

[0260] The base adhesive element 23 consists of more than 40% by weight, in particular more than 50% by weight, preferably more than 55% by weight and / or less than 80% by weight, in particular less than 70% by weight, preferably less than 65% by weight.

[0261] A manufacturing method for manufacturing the flexible grinding device 15 includes the following steps: providing a carrier element 31 for arranging the grinding element 11 on the carrier element 31; providing an adhesion-limiting element for limiting the arrangement of the base adhesive element 23 on the carrier element 31.

[0262] In one step, the base adhesive element 23 is applied to the carrier element 31 over its entire surface by means of a roller coating method.

[0263] In one step, a large number of grinding elements 11 are sprinkled onto the carrier element 31 by means of electrostatic means or compressed air.

[0264] In one step, the covering adhesive element 25 is applied to the carrier element 31 over its entire surface by means of a roller coating method.

[0265] A manufacturing method for manufacturing the flexible grinding device 15 includes the following steps: providing a carrier element 31 for arranging the grinding element 11 on the carrier element 31; providing a pad printing element 51 and / or a silicone roller element for arranging the base adhesive element 23 on the carrier element 31 ( Figures 5a to 5h ).

[0266] The tampon element 51 is arranged to receive and hold the base adhesive element 23. The tampon element 51 is arranged to arrange or release the base adhesive element 23 on the carrier element 31. The tampon element 51 is made of an elastic material, in particular a silicone material, preferably silicone rubber.

[0267] The base adhesive element 23 is arranged on the carrier element 31 by means of the tampon element 51 using a tampon printing method. The tampon element 51 is configured as a tampon punch element. The tampon printing method is implemented as an indirect deep drawing method. The base adhesive element 23 is transferred to the carrier element 31 by pressing with different pressing forces. The base adhesive element 23 is transferred to the carrier element 31 by pressing the tampon element 51 with a pressing force.

[0268] In one step, a printing plate element 53 is provided for presenting an intaglio printing die. The printing plate element 53 has a printing groove 55 for receiving the base adhesive element 23. For example, the printing plate element 53 can be made of metal, in particular steel, or of plastic. The printing plate element 53 is bounded by the printing groove 55, which is bounded by the printing plate element 53 by 360° in a plane. The printing plate element is adapted to the shape or surface of the carrier element 31. The printing groove 55 is constructed on the printing plate element 53, for example, by means of a milling method. The printing groove 55 forms an intaglio printing image, which can be transferred to the carrier element 31 by means of the tampon element 55.

[0269] In one step, a doctor blade element 57 configured as a cassette doctor blade element is provided for arranging the base adhesive element 23 on the printing groove 55 of the printing plate element.

[0270] The doctor blade element is arranged to arrange the base adhesive element 23 in the printing groove 55. The doctor blade element is arranged to receive the base adhesive element 23 and to scrape off the base adhesive element 23.

[0271] A covering adhesive element 25 is provided, wherein the covering adhesive element 25 is completely arranged on the carrier element 31 by means of a roll coating method.

[0272] Figures 6a to 6c A grinding device 15 is shown, which has a first groove 61, which is arranged in the base adhesive element 23 and the covering adhesive element 25. The groove 61 is configured as a slit groove 61. The groove 61 is configured as a rated fracture site. The groove 61 bounds the covering adhesive element 25 and the base adhesive element 23 and separates these two elements substantially from each other. The groove 61 defines the bending edge of the grinding device 15 and is bounded by the carrier element 31. The groove 61 extends at least 20% and at most 90% relative to the thickness of the grinding device 15.

[0273] The groove 61 is arranged in the region of each non-grinding element 11. The groove 61 is arranged spaced apart from each grinding element 11 in particular.

[0274] The basic binder element 23 consists of, in particular, 60 g of an aqueous phenolic resin (75% concentration), in particular 40 g of chalk and in particular 30 g of water.

[0275] The first groove 61 extends linearly from the first end of the grinding device 15 to the second end of the grinding device 15 facing away from the first end.

[0276] The grinding device 15 has second and third grooves 61 configured as slot grooves, which are arranged in the basic binder element 23 and the covering binder element 25. Here, the first groove 61 is arranged transversely to the second and third grooves 61.

[0277] The grinding device 15 has a first group of grinding elements 11 and a second group of grinding elements 11, wherein a groove is arranged between the two groups and separates them. The first group of grinding elements 11 is delimited substantially by the first groove 61, the second groove 61 and the third groove 61.

[0278] The manufacturing method for manufacturing the flexible grinding device 15 includes the following steps: providing a carrier element 31 for arranging the grinding elements 11 on the carrier element 31; providing a basic binder element 23 for holding the grinding elements 11 on the carrier element 31; and providing a covering binder element 25 for covering the grinding elements 11 and / or the basic binder element 23; and forming grooves 61 in the basic binder element 23 and the covering binder element 25 by means of a laser cutting method. The basic binder element 23, the covering binder element 25 and the carrier element 31 are completely cut through by the laser. Here, the groove 61 can extend from the grinding side of the grinding device 15 to the holding side of the grinding device 15 facing away from the grinding side.

[0279] In one step, the grinding device 15 is turned by means of a flexible roller element. The roller element is arranged on the grinding area 43 of the grinding device 15 and turns the grinding device 15 along the grinding area 43 of the grinding device 15. Alternatively or additionally, the roller element can be arranged in the region of the grinding device 15 facing away from the grinding area 43, i.e., the holding area, and / or turn the grinding device 15 along this region. Here, the grinding device 15 is pulled at an edge or pressed into the roller element with a small radius by means of a rod-shaped element, in particular a metal rod-shaped element.

[0280] To assist the turning process, the binder elements 21, 23, 25 (basic binder element 23 and / or covering binder element 25) can be flexibilized, for example, by means of a polymer dispersion.

[0281] In one step, a large number of grinding elements 11 are sown onto the carrier element 31 by means of static electricity or compressed air. In one step, after arranging the base binder element 23, the base binder element 23 is heated briefly by means of an infrared radiator.

[0282] A manufacturing method for manufacturing a flexible grinding device 15 includes the following steps: providing a carrier element 31 for arranging a large number of grinding elements 11 on the carrier element 31; providing a base binder element 23 for holding the grinding elements 11 on the carrier element 31; and arranging the grinding elements 11 such that all the grinding elements 11 protrude relative to the base binder element 23 ( Figures 7a to 7e ).

[0283] The grinding elements 11 are oriented according to the grinding plane of the grinding device 15 and at a pre-given distance from the carrier element 31. The grinding elements 11 are arranged such that they each have a first end facing the carrier element 31 and a second end facing away from the carrier element 31. The second end is arranged at a predetermined distance from the carrier element 31 on the side or surface of the carrier element 31 facing away from the grinding elements 11. The grinding tips of the grinding elements 11 form a grinding plane that has a pre-given distance from the side or surface of the carrier element 31 facing away from the grinding elements 11.

[0284] Provide a receiving unit for electrostatically receiving the grinding elements 11. The receiving unit has a plurality of receiving slots that are provided for receiving the grinding elements 11. In particular, a single receiving slot can be provided for a single grinding element 11. The receiving slots are spaced apart from each other. The receiving slots are configured as through openings 47 or blind holes. In order to better receive and stabilize the grinding elements 11, the receiving slots can be configured in a funnel shape.

[0285] The receiving unit is sown with a large number of grinding elements 11 by means of static electricity or compressed air and receives the grinding elements 11 on the outside. The grinding elements 11 are oriented upright on the receiving unit by means of electrostatic sowing, and if the grinding elements 11 do not reach the receiving slots, they can be actively repelled by charge reversal (discharge) when they come into contact with the receiving unit.

[0286] The receiving unit can hold the grinding elements 11 on the receiving unit by means of negative pressure. When the grinding elements 11 are in the receiving slots, the grinding elements 11 can be fixed by the receiving unit. More grinding elements 11 above a single receiving slot (competition for the receiving slot) can lead to leakage and thus to a loss of negative pressure.

[0287] Provide a release unit for releasing the grinding elements 11 onto the base binder element 23 in a placed manner. Depending on the size or extension scale of the grinding elements 11, the grinding elements 11 can be placed or pressed into the base binder element 23 at different depths.

[0288] If released onto the area of the base - binder - free binder element 23 of the carrier element 31, the grinding element 11 is not released onto the carrier element 31 by the release unit.

[0289] The adhesive force of the base - binder element 23 is greater than the holding force generated by the negative pressure on the receiving unit. To finely adjust the holding force, the negative pressure of the receiving unit is adjusted.

[0290] The release unit has a distance greater than the thickness of the base - binder element 23 from the side or face of the carrier element 31 facing the grinding element 11. The receiving unit and the release unit are configured as perforated roller units and are configured to be conductive.

[0291] The receiving unit has an anti - adhesion coating. Thereby, contamination and adhesion of the base - binder element 23 in the areas not occupied by the grinding element 11 can be prevented. Optimally, the anti - adhesion coating has such a low conductivity that a mis - placed grinding element 11 is discharged and can fall back. This can be applied particularly advantageously to particularly fine grinding elements 11.

Claims

1. A grinding element for a grinding device (15), in particular a flexible grinding device (15), preferably a grinding disc, for grinding workpieces, the grinding element having a basic grinding element (13), characterized in that An adhesive element (17) is arranged on the base grinding element (13), the adhesive element being in particular designed as an adhesion promoter (17).

2. The grinding element according to claim 1, characterized in that, The adhesive element (17) is designed as a coating surrounding the base grinding element.

3. The grinding element according to any one of the preceding claims, characterized in that A support element (29) is arranged on the base grinding element (13) and is used to support the base grinding element (13).

4. The grinding element according to any one of the preceding claims, characterized in that, The adhesive element (17) surrounds, in particular completely surrounds, the base grinding element (13) and / or the support element (29).

5. The grinding element according to any one of the preceding claims, characterized in that, The adhesive element (17) holds a plurality of support elements (29) on the base grinding element (13).

6. The grinding element according to any one of the preceding claims, characterized in that, The base grinding element (13) consists of diamond, in particular natural diamond and / or synthetic diamond.

7. The grinding element according to any one of the preceding claims, characterized in that, The adhesive element (17) consists of polyurethane, in particular two-component polyurethane.

8. The grinding element according to any one of the preceding claims, characterized in that, The extension dimension of the base grinding element (13), in particular each extension dimension, is at least 100%, in particular at least 200%, preferably at least 250%, more preferably at least 300%, particularly preferably at least 350% greater than the extension dimension of the support element (29), in particular each extension dimension.

9. A grinding device, in particular a flexible grinding device (15), preferably a grinding disk, for grinding workpieces, the grinding device having a grinding element (11), in particular a grinding element according to any of the preceding claims, and a supporting element (31), in particular a flexible supporting element (31), for arranging the grinding element (11), in particular arranging the grinding element by means of a base adhesive element (23) and / or a covering adhesive element (25).

10. The grinding device according to any one of the preceding claims, characterized in that, The base adhesive element (23) and / or the cover adhesive element (25) consists of a synthetic resin, in particular a phenolic resin.

11. The grinding device according to any one of claims 9 to 10, characterized in that An adhesion limiting element (41) arranged on the carrier element (31) is used to limit the arrangement of the base adhesive element (23) on the carrier element (31).

12. The grinding device according to any one of claims 9 to 11, characterized in that A through slot (37), in particular a through slot extending through the entire carrier element (31), for receiving a grinding element (11) and a basic adhesive element (23) so as to arrange the grinding element (11) on the carrier element (31), in particular in the through slot (37) of the carrier element (31), wherein the basic adhesive element (23) is arranged on the through slot (37), wherein the basic adhesive element (23) is arranged on the side of the carrier element (31) facing away from the grinding side (33).

13. A method for producing a grinding element (11) according to any one of the preceding claims, the grinding element being used for a grinding device (15), in particular a flexible grinding device, the method comprising the following steps: - providing a basic grinding element (13); - providing a support element (29); The support element (29) and the base grinding element (13) are connected in a materially bonded manner, in particular by means of an adhesive element (17).

Images