Environmental test box

Abstract

The invention provides an environmental test box which comprises a box body assembly, a semiconductor refrigeration assembly, a test clamp assembly and an operation control assembly, the semiconductor refrigeration assembly is arranged at the top of the box body assembly, the test clamp assembly is arranged above the semiconductor refrigeration assembly, and the operation control assembly is arranged above the test clamp assembly. The device has the beneficial effects that the operation control display screen on the operation control assembly is electrically connected with the test fixture, so that the channel operation state of the test fixture is displayed in real time through the operation control display screen, and a worker can conveniently observe and analyze the channel operation state; networking of a network port of the environment test box and external battery detection equipment is realized, so that test fixtures of multiple channels can be simultaneously connected with control battery detection equipment, uniformity of temperature change in the test box can be realized, accuracy of sample test results is guaranteed, and the environment test box is small in size, high in temperature control precision, low in energy consumption and high in compatibility.

Description

Technical Field

[0001] The present invention relates to the technical field of testing equipment, and particularly to an environmental test chamber. Background Art

[0002] With the continuous progress of science and technology, many products are applied in high-temperature and high-humidity conditions. Therefore, whether the performance of the products can still remain normal in the high-temperature and high-humidity environment has become a very important research direction. The environmental test chamber uses scientific and technological means to simulate the natural environmental climate and the damage caused to modern industrial products. Representative tests of the environmental test chamber include: low-pressure (high-altitude) test, high-temperature test, low-temperature test, thermal shock test, solar radiation (sunshine) test, rain test, moisture-proof test, mold-proof test, salt spray test, sand and dust test, etc. The test samples of the environmental test chamber include various electronic devices, such as servers, monitors, etc. The existing environmental test chamber cannot display the state of the test samples during the test process. For the relevant states or parameters of the test samples, generally after the test is completed, the test samples are taken out and analyzed separately to obtain the relevant parameters of the test samples after the test, but the operating state of the test samples during the test process cannot be obtained.

[0003] The high and low temperature test is a common climate environmental test method, which is mainly used to simulate and evaluate the use performance of electrical components under complex climate conditions. The high and low temperature environmental test chamber is a commonly used environmental test equipment for high and low temperature tests. Its main feature is that it can continuously conduct high-temperature and low-temperature working condition tests without transferring the samples to other equipment, improving the test efficiency. To achieve the above effects, the high and low temperature test chamber is usually equipped with a refrigeration system and an electric heating system for cooling and heating respectively.

[0004] As shown in a high and low temperature test chamber disclosed in Chinese Patent CN115779991A, it includes a box body, the box body includes a test chamber and a control chamber, a control system, a refrigeration system and a heating system are arranged in the control chamber, a test bench and a regional temperature changer are arranged inside the test chamber; wherein, the refrigeration system includes an evaporator, a compressor and a condenser, the heating system includes an electric heating sheet and a heating fan, a heating air duct is arranged at one end of the heating fan close to the test chamber, an air outlet duct and an exhaust fan are arranged in the test bench, the regional temperature changer includes a temperature-changing cover, a heat conduction pipe, a heat conduction channel and a cooling hose, and part of the evaporator is located inside the cooling hose. When conducting a low-temperature test, the control system starts the heat conduction fan, and the heat conduction fan quickly extracts the cold air cooled by the evaporator in the cooling hose to the heat conduction pipe through the heat conduction channel, and conducts the cold air to the test material through the temperature-changing cover, so that the temperature of the test material drops rapidly; when conducting a high-temperature test, the control system starts the heating fan to send the heat generated by the electric heating sheet to the test chamber through the heating air duct, so as to raise the temperature of the test chamber. Summary of the Invention

[0005] The object of the present invention is to provide a new type of environmental test chamber to solve the above technical problems. By electrically connecting the operation control display screen on the operation control component to the test fixture, the channel operation status of the test fixture can be displayed in real time through the operation control display screen for easy observation and analysis by the staff. The network port on the outer side wall of the left side of the lower housing enables the network port of the environmental test chamber to be connected to an external battery detection device, so that the test fixtures of multiple channels can be connected to the control battery detection device at the same time, the uniformity of temperature change in the test chamber can be realized, the accuracy of the sample test result can be guaranteed, the volume is small, the temperature control accuracy is high, the energy consumption is small, and the compatibility is strong.

[0006] The present invention is realized through the following technical solutions: An environmental test chamber includes a box body component, a semiconductor refrigeration component, a test fixture component, and an operation control component. The semiconductor refrigeration component is provided at the top of the box body component, the test fixture component is provided above the semiconductor refrigeration component, the operation control component is provided above the test fixture component, and the operation control component is electrically connected to the semiconductor refrigeration component and the test fixture component; the box body component includes a lower housing, an upper housing, a refrigeration power supply, a refrigeration controller, an air duct diversion groove, and a fan. A cavity is provided inside the lower housing, a refrigeration power supply is provided in the cavity, a refrigeration controller bracket is provided on the refrigeration power supply, a refrigeration controller is provided on the refrigeration controller bracket, the air duct diversion groove seamlessly docks and fastens the refrigeration power supply and the refrigeration controller inside the lower housing, a fan installation position is provided on the right side of the air duct diversion groove, and the fan is embedded in the fan installation position on the right side of the air duct diversion groove. The upper housing seamlessly docks and fastens the refrigeration power supply, the refrigeration controller, the air duct diversion groove, and the fan on the lower housing. The refrigeration power supply is electrically connected to the refrigeration controller, the refrigeration power supply is electrically connected to the fan, the refrigeration power supply and the refrigeration controller are respectively electrically connected to the operation control component, and the operation control component is electrically connected to the fan.

[0007] Furthermore, the lower housing is movably connected to the upper housing through a hinge. A power plug is provided on the outer side wall of the left side of the lower housing, a network port is provided on one side of the power plug, and a heat dissipation ventilation port is provided on the outer side wall of the right side of the lower housing.

[0008] Further, the semiconductor refrigeration component includes a semiconductor refrigeration frame, a semiconductor refrigeration plate, a semiconductor refrigeration bracket, a temperature probe, a radiator bracket, and a semiconductor refrigeration protective layer. The semiconductor refrigeration frame is installed on the top of the lower housing. There is a cavity in the middle of the semiconductor refrigeration frame. A semiconductor refrigeration bracket is arranged inside the semiconductor refrigeration frame. A temperature probe is arranged on the left side of the semiconductor refrigeration bracket. A radiator bracket is arranged on the right side of the semiconductor refrigeration bracket. A radiator is arranged on the radiator bracket. The semiconductor refrigeration protective layer is installed on the semiconductor refrigeration bracket. A semiconductor refrigeration plate is arranged at the bottom of the semiconductor refrigeration protective layer. The semiconductor refrigeration frame seamlessly docks and fastens the semiconductor refrigeration bracket, the temperature probe, the radiator bracket, and the semiconductor refrigeration protective layer on the semiconductor refrigeration bracket. The semiconductor refrigeration plate is electrically connected to the refrigeration power supply and the refrigeration controller. The temperature probe is electrically connected to the refrigeration power supply and the refrigeration controller. A test fixture installation groove is arranged in the middle of the semiconductor refrigeration protective layer.

[0009] Further, the test fixture component includes a test fixture bottom plate, a test fixture mounting plate, a test fixture device, and a test fixture upper cover plate. The test fixture bottom plate is installed on the semiconductor refrigeration bracket. A test fixture mounting plate is arranged on the test fixture bottom plate. The test fixture device is installed in the test fixture installation groove in the middle of the semiconductor refrigeration protective layer. A test fixture upper cover plate is arranged above the test fixture mounting plate. The test fixture upper cover plate seamlessly docks and fastens the test fixture device on the test fixture mounting plate. The test fixture device is electrically connected to the refrigeration power supply and the refrigeration controller. The test fixture device is electrically connected to the operation control component.

[0010] Further, a first cavity is arranged inside the upper housing. The test fixture upper cover plate is embedded in the first cavity inside the upper housing. An operation control panel installation position is arranged at the top of the upper housing. An operation control display screen installation groove is arranged on the right side at the top of the upper housing.

[0011] As a further aspect, the operation control component includes an operation control panel, an operation control display base, an operation control main circuit board, an operation control display screen, and operation control indicator lights. The operation control panel is installed at the operation control panel installation position on the top of the upper housing. In the middle of the left side of the operation control panel, there is an indicator light installation groove. The operation control indicator lights are embedded in the indicator light installation groove in the middle of the left side of the operation control panel. The operation control display base is installed in the operation control display installation groove on the right side of the top of the upper housing. The operation control main circuit board is provided on the operation control display base. The operation control display screen is provided on the operation control main circuit board. The operation control panel seamlessly docks and fastens the operation control display base, the operation control main circuit board, the operation control display screen, and the operation control indicator lights on the top of the upper housing. The operation control main circuit board is electrically connected to the operation control display screen and the operation control indicator lights. The operation control main circuit board is electrically connected to the test fixture device. The operation control main circuit board is electrically connected to the refrigeration power supply and the refrigeration controller.

[0012] As a further aspect, the test fixture device includes a fixture base plate, positioning blocks, partition plates, and fixtures. The fixture base plate is installed in the test fixture installation groove in the middle of the semiconductor refrigeration protection layer. A plurality of fixtures are provided on the fixture base plate. Positioning blocks are provided on both sides of the fixtures and are fixed on the fixture base plate. A partition plate is provided between the two groups of fixtures to prevent short circuits between the fixtures. The fixtures are electrically connected to the refrigeration power supply and the refrigeration controller through terminals respectively. The fixtures are electrically connected to the operation control display screen through terminals.

[0013] As a further aspect, the operation control display screen is a liquid crystal touch display screen.

[0014] As a further aspect, the radiator bracket is made of aluminum alloy.

[0015] The beneficial effects of the present invention are as follows: By electrically connecting the operation control display screen on the operation control component to the test fixture, the channel operation status of the test fixture can be real-time displayed through the operation control display screen for easy observation and analysis by the staff. The network port on the outer side wall of the left side of the lower housing enables the network port of the environmental test chamber to be connected to an external battery detection device, so that the test fixtures of multiple channels can be simultaneously connected to the control battery detection device, which can achieve the uniformity of temperature change in the test chamber, ensure the accuracy of the sample test results, have a small volume, high temperature control precision, low energy consumption, and strong compatibility. Description of the Drawings

[0016] Figure 1 It is a schematic structural diagram of the environmental test chamber of the present invention; Figure 2Schematic diagram of the explosion structure of the environmental test chamber of the present invention; Figure 3 Schematic diagram of the combined structure of the box body assembly and the semiconductor refrigeration assembly of the present invention; Figure 4 Schematic diagram of the explosion structure of the combined box body assembly and semiconductor refrigeration assembly of the present invention; Figure 5 Schematic diagram of the structure of the semiconductor refrigeration assembly of the present invention; Figure 6 Schematic diagram of the explosion structure of the semiconductor refrigeration assembly of the present invention; Figure 7 Schematic diagram of the structure of the test fixture assembly of the present invention; Figure 8 Schematic diagram of the explosion structure of the test fixture assembly of the present invention; Figure 9 Schematic diagram of the combined structure of the upper shell and the operation control component of the present invention; Figure 10 Schematic diagram of the explosion structure of the combined upper shell and operation control component of the present invention; Figure 11 Schematic diagram of the structure of the lower shell of the present invention; Figure 12 Schematic diagram of the bottom view structure of the upper shell of the present invention; Figure 13 Schematic diagram of the structure of the test fixture device of the present invention; Figure 14 Schematic diagram of the explosion structure of the test fixture device of the present invention; Reference numerals: 1. Box body assembly; 11. Lower shell; 110. Power plug; 111. Network port; 112. Heat dissipation ventilation opening; 113. Cavity; 12. Upper shell; 120. Installation position of the operation control panel; 121. Installation groove of the operation control display screen; 122. First cavity; 13. Refrigeration power supply; 14. Refrigeration controller; 15. Air duct diversion groove; 16. Fan; 17. Hinge; 18. Refrigeration controller bracket; 2. Semiconductor refrigeration assembly; 21. Semiconductor refrigeration frame; 22. Semiconductor refrigeration plate; 23. Semiconductor refrigeration bracket; 24. Temperature probe; 25. Radiator bracket; 26. Semiconductor refrigeration protective layer; 3. Test fixture assembly; 31. Test fixture bottom plate; 32. Test fixture mounting plate; 33. Test fixture device; 330. Fixture bottom plate; 331. Positioning block; 332. Partition; 333. Fixture; 334. Terminal; 34. Test fixture upper cover plate; 4. Operation control component; 41. Operation control panel; 42. Base of the operation control display screen; 43. Main control circuit board of the operation control; 44. Operation control display screen; 45. Operation control indicator lamp. Detailed implementation manners

[0017] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments: Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs; the terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above drawings are intended to cover non-exclusive inclusion. The terms "first", "second", etc. in the specification and claims of this application or the above drawings are used to distinguish different objects and not to describe a specific order.

[0018] Reference to "embodiment" herein means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of this application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0019] Refer to as Figures 1-14 As shown, an environmental test chamber includes a box body assembly 1, a semiconductor refrigeration assembly 2, a test fixture assembly 3, and an operation control assembly 4. The semiconductor refrigeration assembly 2 is provided at the top of the box body assembly 1, the test fixture assembly 3 is provided above the semiconductor refrigeration assembly 2, the operation control assembly 4 is provided above the test fixture assembly 3, and the operation control assembly 4 is electrically connected to the semiconductor refrigeration assembly 2 and the test fixture assembly 3; the box body assembly 1 includes a lower housing 11, an upper housing 12, a refrigeration power supply 13, a refrigeration controller 14, an air duct diversion groove 15, and a fan 16. A cavity 113 is provided inside the lower housing 11, a refrigeration power supply is provided in the cavity 113, a refrigeration controller bracket 18 is provided on the refrigeration power supply 13, and the refrigeration controller 13 is provided on the refrigeration controller bracket 18. The air duct diversion groove 15 seamlessly docks and fastens the refrigeration power supply 13 and the refrigeration controller 14 inside the lower housing 11. A fan installation position is provided on the right side of the air duct diversion groove 15, and the fan 16 is embedded in the fan installation position on the right side of the air duct diversion groove 15. The upper housing 12 seamlessly docks and fastens the refrigeration power supply 13, the refrigeration controller 14, the air duct diversion groove 15, and the fan 16 on the lower housing 11. The refrigeration power supply 13 is electrically connected to the refrigeration controller 14, the refrigeration power supply 13 is electrically connected to the fan 16, the refrigeration power supply 13 and the refrigeration controller 14 are respectively electrically connected to the operation control assembly 4, and the operation control assembly 4 is electrically connected to the fan 16.

[0020] Preferably, the lower housing 11 is movably connected to the upper housing 12 through a hinge 17. A power plug 110 is provided on the outer side wall of the left side of the lower housing 11. A network port 111 is provided on one side of the power plug 110. A heat dissipation vent 112 is provided on the outer side wall of the right side of the lower housing 11.

[0021] Preferably, the semiconductor refrigeration component 2 includes a semiconductor refrigeration frame 21, a semiconductor refrigeration plate 22, a semiconductor refrigeration bracket 23, a temperature probe 24, a radiator bracket 25, and a semiconductor refrigeration protective layer 26. The semiconductor refrigeration frame 21 is installed on the top of the lower housing 11. A cavity is provided in the middle of the semiconductor refrigeration frame 21. A semiconductor refrigeration bracket 23 is provided inside the semiconductor refrigeration frame 21. A temperature probe 24 is provided on the left side of the semiconductor refrigeration bracket 23. A radiator bracket 25 is provided on the right side of the semiconductor refrigeration bracket 23. A radiator is provided on the radiator bracket 25. The semiconductor refrigeration protective layer 26 is installed on the semiconductor refrigeration bracket 23. A semiconductor refrigeration plate 22 is provided at the bottom of the semiconductor refrigeration protective layer 23. The semiconductor refrigeration frame 21 seamlessly docks and fastens the semiconductor refrigeration bracket 23, the temperature probe 24, the radiator bracket 25, and the semiconductor refrigeration protective layer 26 on the semiconductor refrigeration bracket 23. The semiconductor refrigeration plate 22 is electrically connected to the refrigeration power supply 13 and the refrigeration controller 14. The temperature probe 24 is electrically connected to the refrigeration power supply 13 and the refrigeration controller 14. A test fixture installation groove is provided in the middle of the semiconductor refrigeration protective layer 26.

[0022] Preferably, the test fixture assembly 3 includes a test fixture bottom plate 31, a test fixture mounting plate 32, a test fixture device 33, and a test fixture upper cover plate 34. The test fixture bottom plate 31 is installed on the semiconductor refrigeration bracket 23. A test fixture mounting plate 32 is provided on the test fixture bottom plate 31. The test fixture device 33 is installed in the test fixture installation groove in the middle of the semiconductor refrigeration protective layer 26. A test fixture upper cover plate 34 is provided above the test fixture mounting plate 32. The test fixture upper cover plate 34 seamlessly docks and fastens the test fixture device 33 on the test fixture mounting plate 32. The test fixture device 33 is electrically connected to the refrigeration power supply 13 and the refrigeration controller 14. The test fixture device 33 is electrically connected to the operation control component 4.

[0023] Preferably, a first cavity 122 is provided inside the upper housing 12. The test fixture upper cover plate 34 is embedded in the first cavity 122 inside the upper housing 12. An operation control panel installation position 120 is provided on the top of the upper housing 12. An operation control display screen installation groove 121 is provided on the right side of the top of the upper housing 12.

[0024] Preferably, the operation control component 4 includes an operation control panel 41, an operation control display screen base 42, an operation control main circuit board 43, an operation control display screen 44, and an operation control indicator light 45. The operation control panel 41 is installed on the operation control panel installation position 120 at the top of the upper housing 12. In the middle of the left side of the operation control panel 41, there is an indicator light installation groove. The operation control indicator light 45 is embedded in the indicator light installation groove in the middle of the left side of the operation control panel 41. The operation control display screen base 42 is installed in the operation control display screen installation groove 121 on the right side at the top of the upper housing 41. On the operation control display screen base 42, there is an operation control main circuit board 43. On the operation control main circuit board 43, there is an operation control display screen 44. The operation control panel 41 seamlessly docks and fastens the operation control display screen base 42, the operation control main circuit board 43, the operation control display screen 44, and the operation control indicator light 45 to the top of the upper housing 12. The operation control main circuit board 43 is electrically connected to the operation control display screen 44 and the operation control indicator light 45. The operation control main circuit board 43 is electrically connected to the test fixture device 33. The operation control main circuit board 43 is electrically connected to the refrigeration power supply 13 and the refrigeration controller 14.

[0025] Preferably, the test fixture device 33 includes a fixture bottom plate 330, positioning blocks 331, partition plates 332, and fixtures 333. The fixture bottom plate 330 is installed in the test fixture installation groove in the middle of the semiconductor refrigeration protective layer 26. On the fixture bottom plate 330, there are several fixtures 333. On both sides of the fixtures 333, there are positioning blocks 331, and the positioning blocks 331 are fixed on the fixture bottom plate 330. Between two groups of the fixtures 333, there are partition plates 332, and the partition plates 332 prevent short circuits between the fixtures 333. The fixtures 333 are respectively electrically connected to the refrigeration power supply 13 and the refrigeration controller 14 through terminals 334. The fixtures 333 are electrically connected to the operation control display screen 44 through terminals 334.

[0026] Preferably, the operation control display screen 44 is a liquid crystal touch display screen.

[0027] Preferably, the radiator bracket 25 is made of aluminum alloy.

[0028] According to the disclosure and teachings of the above specification, those skilled in the art to which the present invention pertains can also make appropriate changes and modifications to the above embodiments. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and some modifications and changes to the present invention should also fall within the protection scope of the claims of the present invention. In addition, although some specific terms are used in this specification, these terms are only for convenience of description and do not constitute any limitation to the present invention.

Claims

1. An environmental test chamber, characterized in that: It includes a box body component, a semiconductor refrigeration component, a test fixture component, and an operation control component. A semiconductor refrigeration component is provided at the top of the box body component. A test fixture component is provided above the semiconductor refrigeration component. An operation control component is provided above the test fixture component. The operation control component is electrically connected to the semiconductor refrigeration component and the test fixture component. The box body component includes a lower housing, an upper housing, a refrigeration power supply, a refrigeration controller, an air duct diversion groove, and a fan. A cavity is provided inside the lower housing. A refrigeration power supply is provided in the cavity. A refrigeration controller bracket is provided on the refrigeration power supply. A refrigeration controller is provided on the refrigeration controller bracket. The air duct diversion groove seamlessly docks and fastens the refrigeration power supply and the refrigeration controller inside the lower housing. A fan mounting position is provided on the right side of the air duct diversion groove. The fan is embedded in the fan mounting position on the right side of the air duct diversion groove. The upper housing seamlessly docks and fastens the refrigeration power supply, the refrigeration controller, the air duct diversion groove, and the fan on the lower housing. The refrigeration power supply is electrically connected to the refrigeration controller. The refrigeration power supply is electrically connected to the fan. The refrigeration power supply and the refrigeration controller are respectively electrically connected to the operation control component. The operation control component is electrically connected to the fan.

2. The environmental test chamber according to claim 1, wherein: The lower housing is movably connected to the upper housing through a hinge. A power plug is provided on the outer side wall of the left side of the lower housing. A network port is provided on one side of the power plug. A heat dissipation ventilation port is provided on the outer side wall of the right side of the lower housing.

3. The environmental test chamber according to claim 1, wherein: The semiconductor refrigeration component includes a semiconductor refrigeration frame, a semiconductor refrigeration plate, a semiconductor refrigeration bracket, a temperature probe, a radiator bracket, and a semiconductor refrigeration protective layer. The semiconductor refrigeration frame is installed on the top of the lower housing. A cavity is provided in the middle of the semiconductor refrigeration frame. A semiconductor refrigeration bracket is provided inside the semiconductor refrigeration frame. A temperature probe is provided on the left side of the semiconductor refrigeration bracket. A radiator bracket is provided on the right side of the semiconductor refrigeration bracket. A radiator is provided on the radiator bracket. The semiconductor refrigeration protective layer is installed on the semiconductor refrigeration bracket. A semiconductor refrigeration plate is provided at the bottom of the semiconductor refrigeration protective layer. The semiconductor refrigeration frame seamlessly docks and fastens the semiconductor refrigeration bracket, the temperature probe, the radiator bracket, and the semiconductor refrigeration protective layer on the semiconductor refrigeration bracket. The semiconductor refrigeration plate is electrically connected to the refrigeration power supply and the refrigeration controller. The temperature probe is electrically connected to the refrigeration power supply and the refrigeration controller. A test fixture installation groove is provided in the middle of the semiconductor refrigeration protective layer.

4. The environmental test chamber according to claim 3, characterized in that: The test fixture assembly includes a test fixture bottom plate, a test fixture mounting plate, a test fixture device, and a test fixture upper cover plate. The test fixture bottom plate is mounted on the semiconductor refrigeration bracket. A test fixture mounting plate is provided on the test fixture bottom plate. The test fixture device is mounted in the test fixture mounting groove in the middle of the semiconductor refrigeration protective layer. A test fixture upper cover plate is provided above the test fixture mounting plate. The test fixture upper cover plate seamlessly docks and fastens the test fixture device on the test fixture mounting plate. The test fixture device is electrically connected to the refrigeration power supply and the refrigeration controller, and the test fixture device is electrically connected to the operation control component.

5. The environmental test chamber according to claim 4, wherein: A first cavity is provided inside the upper housing. The test fixture upper cover plate is embedded in the first cavity inside the upper housing. An operation control panel mounting position is provided at the top of the upper housing, and an operation control display screen mounting groove is provided on the right side at the top of the upper housing.

6. The environmental test chamber according to claim 5, characterized in that: The operation control component includes an operation control panel, an operation control display screen base, an operation control main control circuit board, an operation control display screen, and operation control indicator lights. The operation control panel is mounted on the operation control panel mounting position at the top of the upper housing. An indicator light mounting groove is provided in the middle on the left side of the operation control panel. The operation control indicator lights are embedded in the indicator light mounting groove in the middle on the left side of the operation control panel. The operation control display screen base is mounted in the operation control display screen mounting groove on the right side at the top of the upper housing. An operation control main control circuit board is provided on the operation control display screen base. An operation control display screen is provided on the operation control main control circuit board. The operation control panel seamlessly docks and fastens the operation control display screen base, the operation control main control circuit board, the operation control display screen, and the operation control indicator lights on the top of the upper housing. The operation control main control circuit board is electrically connected to the operation control display screen and the operation control indicator lights, the operation control main control circuit board is electrically connected to the test fixture device, and the operation control main control circuit board is electrically connected to the refrigeration power supply and the refrigeration controller.

7. The environmental test chamber according to claim 4, characterized in that: The test fixture device includes a fixture bottom plate, positioning blocks, a partition, and fixtures. The fixture bottom plate is mounted in the test fixture mounting groove in the middle of the semiconductor refrigeration protective layer. A number of fixtures are provided on the fixture bottom plate. Positioning blocks are provided on both sides of the fixtures and are fixed on the fixture bottom plate. A partition is provided between two groups of the fixtures to prevent short circuits between the fixtures. The fixtures are electrically connected to the refrigeration power supply and the refrigeration controller through terminals respectively, and the fixtures are electrically connected to the operation control display screen through terminals.

8. The environmental test chamber according to claim 6, wherein: The operation control display screen is a liquid crystal touch display screen.

9. The environmental test chamber according to claim 3, characterized in that: The radiator bracket is made of aluminum alloy.

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