Dry ice cleaning machine for semiconductor materials

Abstract

The invention discloses a dry ice cleaning machine for semiconductor materials, which relates to the technical field of dry ice cleaning, and comprises a support structure, the power structure comprises a mounting bottom plate and a positioning plate which are fixed on the surface of the supporting rod, a servo motor fixed on the surface of the positioning plate, and a rotating shaft rotating at the top of the servo motor; the clamping structure comprises a supporting base fixed to the top of the rotating shaft, a positioning groove formed in the surface of the supporting base, an electric push rod fixed to the side edge of the positioning groove, a clamping assembly fixed to the top end of the electric push rod, an induction assembly fixed to the clamping assembly and a suspension assembly fixed to the side edge of the induction assembly. The problem that the clamping covering area is too large is solved, the possibility that dry ice spraying distribution is not uniform is reduced, uniform distribution of dry ice spraying is promoted, the cleaning effect is improved, and the problems that local dissolution is not uniform and water vapor adheres are effectively solved.

Description

Technical Field

[0001] The present invention relates to the technical field of dry ice cleaning, and specifically to a dry ice cleaning machine for semiconductor materials. Background Art

[0002] A dry ice cleaning machine is a non-abrasive and environmentally friendly cleaning device that uses dry ice particles to remove dirt through jetting.

[0003] A dry ice cleaning machine for cleaning semiconductor materials is a device that uses dry ice as a cleaning medium. By spraying dry ice particles at high speed onto the surface of semiconductor material devices or related equipment, the low temperature and volume expansion effects generated by the sublimation of dry ice upon contact are utilized to rapidly freeze and embrittle dirt, impurities, etc. At the same time, the impact force of the dry ice particles strips them from the surface.

[0004] However, during the cleaning process of semiconductor materials, some semiconductor materials need to be clamped. The existing clamping has a malfunction in controlling the covering area of the semiconductor materials, resulting in an overly large covering area, weakening the comprehensive coverage ability of dry ice spraying on the material surface, generating a large cleaning blind area, causing the cleaning dry ice to be unable to fully cover the surface of the semiconductor material, resulting in unclean cleaning, reducing the cleaning effect on the surface of the semiconductor material, and affecting the full contact and uniform distribution of dry ice with the surface of the semiconductor material, leading to uneven dissolution of dry ice in local areas, causing water vapor formed by the dissolution of dry ice to easily adhere to the surface of the semiconductor material, seriously affecting the use performance of the semiconductor material. Summary of the Invention

[0005] The purpose of the present invention is to provide a dry ice cleaning machine for semiconductor materials to solve the problems raised in the above background art.

[0006] To solve the above technical problems, the present invention provides the following technical solution: A dry ice cleaning machine for semiconductor materials, including,

[0007] A support structure, including a support rod;

[0008] A power structure, including a mounting base plate and a positioning plate fixed on the surface of the support rod, a servo motor fixed on the surface of the positioning plate, and a rotating shaft rotating on the top of the servo motor;

[0009] A clamping structure, including a support base fixed on the top of the rotating shaft, a positioning groove opened on the surface of the support base, an electric push rod fixed on the side of the positioning groove, a clamping assembly fixed on the top of the electric push rod, an induction component fixed on the clamping assembly, and a suspension component fixed on the side of the induction component; and,

[0010] An auxiliary structure, including a push rod fixed on the clamping assembly, an air delivery cylinder sliding on the surface of the push rod, and an auxiliary component fixed on the top of the push rod.

[0011] As a preferred solution of the dry ice cleaning machine for semiconductor materials according to the present invention, wherein: the clamping assembly includes a load-bearing block fixed to the top end of the electric push rod, a vertical push rod slidably connected to the load-bearing block, a first spring disposed on the surface of the vertical push rod, a sector plate fixed to the top of the vertical push rod, a first groove opened on the sector plate, a fixing plate fixedly connected to the surface of the first groove, and a mounting groove opened on the surface of the sector plate.

[0012] As a preferred solution of the dry ice cleaning machine for semiconductor materials according to the present invention, wherein: chutes are respectively opened on the surface of the support base and on the side of the positioning groove. A telescopic slider is fixed to the surface of the sector plate. One end of the telescopic slider is fixedly connected with an anti-detachment plate. A second groove is opened on the surface of the sector plate, and a third groove is opened on the surface of the load-bearing block.

[0013] As a preferred solution of the dry ice cleaning machine for semiconductor materials according to the present invention, wherein: the induction assembly includes a plurality of pressing rods slidably connected to the fixing plate, a pressing cylinder fixedly connected to the pressing rods and installed in the mounting groove, a lever fixed to the pressing cylinder, and a second spring disposed on the pressing cylinder;

[0014] A contact sphere is fixed to one end of the pressing cylinder, a pressure sensor is fixed to the surface of the first groove, and a protective shell is fixed inside the support base.

[0015] As a preferred solution of the dry ice cleaning machine for semiconductor materials according to the present invention, wherein: the suspension assembly includes a first airbag fixed inside the protective shell, a protective cylinder fixed to the surface of the protective shell, a convex groove opened on the surface of the protective cylinder, a convex block slidably connected to the surface of the convex groove, and a pressing column fixedly connected to the convex block. The pressing column is slidably connected to the inside of the protective cylinder.

[0016] As a preferred solution of the dry ice cleaning machine for semiconductor materials according to the present invention, wherein: a pressing plate is fixed to one end of the pressing column, a top block is fixed to the other end of the pressing column, and a third spring is disposed on the surface of the pressing column;

[0017] A diversion pipe is fixed to the surface of the first airbag, a throat pipe is fixed inside the diversion pipe, and a jet head is fixed to one end of the diversion pipe.

[0018] As a preferred embodiment of the dry ice cleaning machine for semiconductor materials according to the present invention, wherein: the auxiliary component includes a soft pad fixed to the top end of the pushing rod, a gas delivery base fixed to the top end of the gas delivery cylinder, the gas delivery base is fixed to the surface of the positioning groove, and a first gas delivery pipe fixed to the surface of the gas delivery base, and one end of the first gas delivery pipe is fixed to the first airbag.

[0019] As a preferred embodiment of the dry ice cleaning machine for semiconductor materials according to the present invention, wherein: a second gas delivery pipe is fixed to the surface of the gas delivery base, a gas valve is fixed to the surface of the second gas delivery pipe, a valve rod is rotated at the top of the gas valve, a second airbag is fixed to the top of the second gas delivery pipe, and the second airbag is fixed in the third groove.

[0020] As a preferred embodiment of the dry ice cleaning machine for semiconductor materials according to the present invention, wherein: it further includes

[0021] a scanning structure, including two fixed bases fixed to the mounting base plate, a laser distance sensor fixed to the fixed base, and a camera fixed to the fixed base and located below the laser distance sensor; and

[0022] a cabinet structure, including an upper chassis fixed to the support rod, a lower chassis fixed below the upper chassis, and a data server fixed to the upper chassis.

[0023] As a preferred embodiment of the dry ice cleaning machine for semiconductor materials according to the present invention, wherein: a longitudinal track is fixed to the surface of the support rod, a transverse track slides on the longitudinal track, a controller is installed on the transverse track, a fixing member is fixed to the controller, and a dry ice nozzle is installed on the fixing member.

[0024] The beneficial effects of the present invention: Through the cooperation between the power structure and the clamping structure, the problem of excessive clamping coverage area is avoided, and the possibility of uneven distribution of dry ice spraying is reduced. Through the synergistic effect of the suspension component and the air flow auxiliary component, the uniform distribution of dry ice spraying is promoted, the cleaning effect is improved, and the problems of uneven local dissolution and water vapor attachment are effectively avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0026] Figure 1 It is a schematic diagram of the support structure of the dry ice cleaning machine for semiconductor materials of the present invention.

[0027] Figure 2 This is a schematic structural diagram of the installation base plate of the dry ice cleaning machine for semiconductor materials of the present invention.

[0028] Figure 3 This is a schematic plan view of the power structure of the dry ice cleaning machine for semiconductor materials of the present invention.

[0029] Figure 4 This is a schematic structural diagram of the support base of the dry ice cleaning machine for semiconductor materials of the present invention.

[0030] Figure 5 It is Figure 4 The enlarged schematic diagram at position A in

[0031] Figure 6 This is a schematic diagram of the auxiliary structure of the dry ice cleaning machine for semiconductor materials of the present invention.

[0032] Figure 7 This is a schematic cross-sectional view of the soft pad of the dry ice cleaning machine for semiconductor materials of the present invention.

[0033] Figure 8 This is a schematic cross-sectional view of the load-bearing block of the dry ice cleaning machine for semiconductor materials of the present invention.

[0034] Figure 9 This is a schematic cross-sectional view of the sector plate of the dry ice cleaning machine for semiconductor materials of the present invention.

[0035] Figure 10 This is a schematic structural diagram of the suspension assembly of the dry ice cleaning machine for semiconductor materials of the present invention.

[0036] Figure 11 This is a schematic structural diagram of the upper chassis of the dry ice cleaning machine for semiconductor materials of the present invention.

[0037] Figure 12 This is a schematic overall structure diagram of the dry ice cleaning machine for semiconductor materials of the present invention. Specific embodiments

[0038] To make the above objects, features, and advantages of the present invention more obvious and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings of the specification.

[0039] In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention can also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0040] Second, the so-called "one embodiment" or "embodiment" herein refers to specific features, structures or characteristics that may be included in at least one implementation manner of the present invention. The appearances of "in one embodiment" in different places in this specification do not all refer to the same embodiment, nor are they embodiments that are mutually exclusive of other embodiments individually or selectively.

[0041] Thirdly, the present invention is described in detail in conjunction with schematic diagrams. When detailing the embodiments of the present invention, for the convenience of explanation, the cross-sectional views showing the device structure will be locally enlarged out of the general scale, and the schematic diagrams are only examples and should not limit the scope of protection of the present invention herein. In addition, in actual production, three-dimensional spatial dimensions including length, width and depth should be included.

[0042] Embodiment 1, referring to Figure 1 - Figure 7 , which is the first embodiment of the present invention, provides a dry ice cleaning machine for semiconductor materials. This device includes:

[0043] A support structure 100, including a support rod 101; the support rod 101 provides stable support for the power structure 200 and the clamping structure 300, ensuring that the power structure 200 and the clamping structure 300 will not shift due to vibration during operation.

[0044] A power structure 200, including a mounting base plate 201 and a positioning plate 202 fixed on the surface of the support rod 101, a servo motor 203 fixed on the surface of the positioning plate 202, and a rotating shaft 204 rotating on the top of the servo motor 203; the positioning plate 202 is used to fix the servo motor 203, and the servo motor 203 drives the rotation of the entire clamping structure 300 through the rotating shaft 204 to ensure the stable transmission of power. The movement of the clamping structure 300 realizes dynamic rotary cleaning, enabling the dry ice jet of the dry ice nozzle 106 to cover all corners of the semiconductor material surface, reducing the cleaning blind spots caused by fixed clamping, thereby improving the comprehensiveness of cleaning. And,

[0045] A clamping structure 300, including a support base 301 fixed on the top of the rotating shaft 204, a positioning groove 302 opened on the surface of the support base 301, an electric push rod 304 fixed on the side of the positioning groove 302, a clamping assembly 305 fixed on the top of the electric push rod 304, an induction assembly 306 fixed on the clamping assembly 305, and a suspension assembly 308 fixed on the side of the induction assembly 306. The clamping assembly 305 and the induction assembly 306 are used to control the clamping force on the edge of the semiconductor material, which can reduce the covering area of the clamping structure 300 on the material edge, ensure that the dry ice jet can fully cover the material surface, and improve the comprehensiveness and uniformity of cleaning.

[0046] The suspension component 308 contacts the material surface and blows air onto the semiconductor surface, reducing the direct contact and covering area of the clamping component 305 with the cleaned surface of the material, ensuring that the dry ice jet can fully cover the material surface, and improving the comprehensiveness and uniformity of cleaning. The residue of dry ice on the semiconductor material surface is reduced.

[0047] The auxiliary structure 400 includes a push rod 401 fixed to the clamping component 305, an air delivery cylinder 402 sliding on the surface of the push rod 401, and an auxiliary component 403 fixed to the top of the push rod 401. The push rod 401 sliding in the air delivery cylinder 402 can transmit the generated gas to the clamping component 305 and the suspension component 308, lift the clamping component 305 upward, and fill the suspension component 308 with gas, enabling the suspension component 308 to more fully remove the residue of dry ice on the semiconductor material surface.

[0048] Among them, the clamping component 305 includes a load-bearing block 305k fixed to the top end of the electric push rod 304, a vertical push rod 305i slidably connected to the load-bearing block 305k, a first spring 305j disposed on the surface of the vertical push rod 305i, a sector plate 305a fixed to the top of the vertical push rod 305i, a first groove 305b opened on the sector plate 305a, a fixing plate 305d fixedly connected to the surface of the first groove 305b, and a mounting groove 305c opened on the surface of the sector plate 305a. The load-bearing block connects the electric push rod 304 and the sector plate 305a. The first groove 305b and the mounting groove 305c are used to provide a working space for the sensing component 306, and the fixing plate 305d is used to limit the sliding of the extrusion rod 306a.

[0049] Among them, chutes 303 are respectively opened on the surface of the support base 301 and on the side of the positioning groove 302. A telescopic slider 305e is fixed to the surface of the sector plate 305a. One end of the telescopic slider 305e is fixedly connected with an anti-displacement plate 305f. A second groove 305g is opened on the surface of the sector plate 305a, and a third groove 305l is opened on the surface of the load-bearing block 305k. The slider cooperates with the anti-displacement plate 305f to slide in the chute 303, preventing the sector plate 305a from being displaced when the electric push rod 304 pushes the sector plate 305a to slide on the surface of the support base 301. The third groove 305l is used to provide a working space for the airbag two 403g.

[0050] Among them, the sensing component 306 includes several extrusion rods 306a slidably connected to the fixed plate 305d, an extrusion cylinder 306b fixedly connected to the extrusion rods 306a and installed in the installation groove 305c, a lever 305h fixed to the extrusion cylinder 306b, and a second spring 306c arranged on the extrusion cylinder 306b. A contact sphere 306d is fixed at one end of the extrusion cylinder 306b, a pressure sensor 306e is fixed on the surface of the first groove 305b, and a protective shell 307 is fixed inside the support base 301. It can monitor and adjust the clamping force on the edge of the semiconductor material in real time, ensure that the clamping force is uniform and appropriate, reduce the surface damage of the material, and at the same time absorb the vibration generated during the cleaning process to ensure the smoothness of the cleaning process. The edge of the sector plate 305a is designed in a spherical shape, so that the contact spheres 306d are evenly distributed with pressure when contacting the material surface, avoiding material deformation or damage caused by excessive local pressure, reducing the direct contact area of the clamping structure 300 with the material surface, and ensuring that the dry ice jet can fully cover the material surface, thereby improving the cleaning effect and quality.

[0051] During the use process, when the servo motor 203 is started, it is transmitted to the clamping structure 300 through the rotating shaft 204 to realize the dynamic rotary cleaning mode. This dynamic rotary cleaning mode can make the dry ice jet fully cover every corner of the semiconductor material surface, effectively reducing the cleaning blind area and improving the comprehensiveness and uniformity of cleaning. When the data server 603 controls the electric push rod 304 to push the sector plate 305a to move, the contact sphere 306d on the surface of the sector plate 305a touches the edge of the semiconductor material. At this time, the edge of the semiconductor material will generate an extrusion force on the contact sphere 306d. Under the action of the extrusion force, the contact sphere 306d displaces in the installation groove 305c, and then drives the extrusion rod 306a and the extrusion cylinder 306b to move accordingly. As the extrusion rod 306a moves, it forms an extrusion on the pressure sensor 306e, and the pressure sensor 306e transmits the sensed pressure data to the data server 603 in a wireless transmission manner. After receiving these data, the data server 603 will make a judgment according to the preset clamping force threshold. This technology belongs to the prior art, and those skilled in the art can clearly understand it, so no more details will be described here. When the appropriate clamping force is reached, the data server 603 controls the electric push rod 304 to stop running, thereby realizing the clamping of the edge of the semiconductor material, avoiding damage to the semiconductor material caused by excessive or too small clamping force, and at the same time improving the stability and reliability of clamping, ensuring the fixing effect of the material during the cleaning process.

[0052] Example 2, refer to Figure 1 - Figure 9, which is the second embodiment of the present invention. The difference between this embodiment and the first embodiment is that the auxiliary component 403 includes a soft pad 403a fixed to the top end of the push rod 401, a gas delivery base 403b fixed to the top end of the gas cylinder 402, the gas delivery base 403b is fixed to the surface of the positioning groove 302, and a first gas delivery pipe 403c fixed to the surface of the gas delivery base 403b. One end of the first gas delivery pipe 403c is fixed to the first airbag 308a. The length design of the gas cylinder 402 will not affect the clamping of the semiconductor material by the sector plate 305a. Moreover, the first gas delivery pipe 403c and the second gas delivery pipe 403d are made of soft materials and will not affect the movement of the electric push rod 304.

[0053] The edge of the soft pad 403a is made of a soft material, and the middle part of the soft pad 403a is made of a relatively hard material. When the push rod 401 drives the soft pad 403a to slide in the gas cylinder 402, when the soft pad 403a moves towards the gas delivery base 403b, with the direction close to the gas delivery base 403b as the inner and the direction away from the gas delivery base 403b as the outer, the inner opening angle of the edge of the soft pad 403a is greater than the outer opening angle. The edge of the soft pad 403a tightly adheres to the edge of the gas cylinder 402, which will make the pressure inside the gas cylinder 402 greater than the external pressure, generating gas. The generated gas will be transmitted along the first gas delivery pipe 403c and the second gas delivery pipe 403d. When the soft pad 403a moves away from the gas delivery base 403b, the inner opening angle of the edge of the soft pad 403a is less than the outer opening angle, and the edge of the soft pad 403a disengages from the edge of the gas cylinder 402, which will make the pressure inside the gas cylinder 402 less than the external pressure, and gas is delivered into the gas cylinder 402 from the outside.

[0054] Compared with the embodiment, further, a second gas delivery pipe 403d is fixed to the surface of the gas delivery base 403b, a gas valve 403e is fixed to the surface of the second gas delivery pipe 403d, a valve rod 403f is rotated at the top of the gas valve 403e, a second airbag 403g is fixed to the top of the second gas delivery pipe 403d, and the second airbag 403g is fixed in the groove three 305l. The gas in the first gas delivery pipe 403c will enter the first airbag 308a, and the gas in the second gas delivery pipe 403d will enter the second airbag 403g.

[0055] During use, after the electric push rod 304 drives the sector plate 305a to move, the contact sphere 306d touches the edge of the semiconductor material. At this time, the edge of the semiconductor material will exert a squeezing force on the contact sphere 306d, indicating that the sector plate 305a has completed the clamping of the edge of the semiconductor material. Under the action of the squeezing force, the contact sphere 306d displaces in the installation groove 305c, thereby driving the extrusion rod 306a and the extrusion cylinder 306b to move accordingly. Since the lever 305h and the valve rod 403f are fixed together, as the extrusion rod 306a moves, it drives the lever 305h to toggle the valve rod 403f, causing the gas in the second gas delivery pipe 403d to enter the second airbag 403g. The second airbag 403g expands, causing the vertical ejector rod 305i to rise, and the sector plate 305a will drive the semiconductor material to rise, enabling the gas in the first airbag 308a to be secondary pressurized in the diversion pipe 309a, blowing air on the surface of the semiconductor material, reducing the residue of water vapor on the surface of the semiconductor material after dry ice cleaning, and enhancing the stability of the semiconductor material during use.

[0056] The rest of the structure is the same as that of Embodiment 1.

[0057] Embodiment 3, referring to Figure 1 - Figure 12 , is the third embodiment of the present invention. The difference between this embodiment and the second embodiment is that the suspension assembly 308 includes an airbag one 308a fixed inside the protective shell 307, a protective cylinder 308b fixed on the surface of the protective shell 307, a convex groove 308c opened on the surface of the protective cylinder 308b, a convex block 308d slidably connected to the surface of the convex groove 308c, and a pressing column 308f fixedly connected to the convex block 308d. The pressing column 308f is slidably connected to the inside of the protective cylinder 308b. The convex block 308d slides in the convex groove 308c, mainly to limit the position of the pressing column 308f. Both the pressing column 308f and the diversion pipe 309a are installed on the surface of the support base 301.

[0058] Compared with the embodiment, further, one end of the pressing column 308f is fixed with a pressing plate 308e, the other end of the pressing column 308f is fixed with a top block 308h, and a third spring 308g is arranged on the surface of the pressing column 308f; the surface of the top block 308h has friction. On the one hand, when the semiconductor material is placed on the suspension assembly 308, it can pre-position the semiconductor material. On the other hand, when the sector plate 305a clamps the semiconductor material and rises a certain distance, the pressing column 308f rises under the action of the third spring 308g and acts on the surface of the semiconductor material again, preventing the semiconductor material from tilting and falling after the sector plate 305a is released.

[0059] A flow guide tube 309a is fixed on the surface of the first airbag 308a. A throat tube 309b is fixed inside the flow guide tube 309a. A jet head 309c is fixed at one end of the flow guide tube 309a. The throat tube 309b is designed with a narrow middle and wide ends, which can pressurize the gas in the first airbag 308a in the flow guide tube 309a and then release it.

[0060] The first pressurization occurs when the sector plate 305a and the edge of the semiconductor material are not in contact. The gas generated by the auxiliary component 403 travels along the first gas pipeline 403c into the first airbag 308a. The pressing of the pressing plate 308e causes the gas in the first airbag 308a to enter the flow guide tube 309a and the throat tube 309b for pressurization, and then be released along the jet head 309c to remove impurities on the surface of the semiconductor material. The second pressurization occurs when the sector plate 305a and the edge of the semiconductor material are in contact. The second airbag 403g expands, causing the vertical ejector rod 305i to rise. The sector plate 305a drives the semiconductor material to rise. The dry ice nozzle 106 cleans the surface of the semiconductor material. The pressing column 308f rises under the action of the third spring 308g. The gas generated by the auxiliary component 403 travels along the first gas pipeline 403c into the first airbag 308a, and the first airbag 308a is filled. After the dry ice cleaning is completed, the sector plate 305a is released. The semiconductor drives the pressing of the pressing plate 308e, causing the gas in the first airbag 308a to enter the flow guide tube 309a and the throat tube 309b for secondary pressurization, and then be released along the jet head 309c to remove the dry ice residue on the surface of the semiconductor material.

[0061] During the first pressurization, when the sector plate 305a does not contact the semiconductor material, the air flow is released through the jet head 309c, which can effectively remove dust and impurities on the material surface, creating a cleaner initial environment for subsequent dry ice cleaning.

[0062] During the second pressurization, after the dry ice cleaning is completed, the air flow is released through the jet head 309c again to remove the dry ice residue, ensuring that there is no residue on the material surface and further improving the cleaning effect.

[0063] After the first airbag 308a is squeezed by the pressing plate 308e, it will pressurize the gas along the flow guide tube 309a and the throat tube 309b and transport it to the jet head 309c for air flow assisted cleaning of the surface of the semiconductor material. Before the dry ice nozzle 106 works, the jet head 309c blows away the dry ice residue and dust, ensuring that the material surface is clean and residue-free after cleaning, improving the cleaning effect. When the dry ice nozzle 106 works, the gas ejected by the jet head 309c can remove the dry ice residue on the semiconductor surface, avoiding damage or corrosion to the material surface caused by the dry ice residue.

[0064] Furthermore, it also includes

[0065] The scanning structure 500 includes two fixed bases 501 fixed on the mounting base plate 201, a laser distance sensor 502 fixed on the fixed base 501, and a camera 503 fixed on the fixed base 501 and located below the laser distance sensor 502; and,

[0066] The cabinet structure 600 includes an upper cabinet 601 fixed on the support rod 101, a lower cabinet 602 fixed below the upper cabinet 601, and a data server 603 fixed on the upper cabinet 601.

[0067] The data collected by the laser distance sensor 502 and the camera 503 is transmitted to the data server 603 through a data line for processing and analysis. The server controls the spraying area of the dry ice nozzle 106 according to the size and shape data. The data server 603 controls the entire cleaning process according to the preset cleaning program and the real-time monitored data, including the rotation speed of the servo motor 203, the telescoping of the electric push rod 304, the spraying of the dry ice nozzle 106, etc. This technology belongs to the prior art, and those skilled in the art can clearly understand it, so no more details will be given here.

[0068] Furthermore, a longitudinal track 102 is fixed on the surface of the support rod 101. A transverse track 103 slides on the longitudinal track 102. A controller 104 is installed on the transverse track 103. A fixing member 105 is fixed on the controller 104. A dry ice nozzle 106 is installed on the fixing member 105. The dry ice nozzle 106 is positioned by the fixing member 105 of the controller 104. The transverse track 103 and the longitudinal track 102 cooperate to realize the positioning of the controller 104. The controller 104 regulates the force and direction of the dry ice nozzle 106 according to the instructions of the data server 603. This technology belongs to the prior art, and those skilled in the art can clearly understand it, so no more details will be given here.

[0069] The remaining structure is the same as that of Embodiment 2.

[0070] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not restrictive. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention, and they should all be covered by the scope of the claims of the present invention.

Claims

1. A dry ice cleaning machine for semiconductor materials, characterized in that: including, a support structure (100) including a support rod (101); a power structure (200) including a mounting base plate (201) and a positioning plate (202) fixed to the surface of the support rod (101), a servo motor (203) fixed to the surface of the positioning plate (202), and a rotating shaft (204) rotating on the top of the servo motor (203); a clamping structure (300) including a support base (301) fixed to the top of the rotating shaft (204), a positioning groove (302) opened on the surface of the support base (301), an electric push rod (304) fixed to the side of the positioning groove (302), a clamping assembly (305) fixed to the top of the electric push rod (304), an induction assembly (306) fixed to the clamping assembly (305), and a suspension assembly (308) fixed to the side of the induction assembly (306); and, an auxiliary structure (400) including a push rod (401) fixed to the clamping assembly (305), an air delivery cylinder (402) sliding on the surface of the push rod (401), and an auxiliary assembly (403) fixed to the top of the push rod (401).

2. The dry ice cleaning machine for semiconductor materials according to claim 1, characterized in that: The clamping assembly (305) includes a load-bearing block (305k) fixed to the top of the electric push rod (304), a vertical push rod (305i) slidably connected to the load-bearing block (305k), a first spring (305j) disposed on the surface of the vertical push rod (305i), a sector plate (305a) fixed to the top of the vertical push rod (305i), a first groove (305b) opened on the sector plate (305a), a fixing plate (305d) fixedly connected to the surface of the first groove (305b), and a mounting groove (305c) opened on the surface of the sector plate (305a).

3. The dry ice cleaning machine for semiconductor materials according to claim 2, characterized in that: Chutes (303) are respectively opened on the surface of the support base (301) and on the side of the positioning groove (302). A telescopic slider (305e) is fixed to the surface of the sector plate (305a). One end of the telescopic slider (305e) is fixedly connected to an anti-disengagement plate (305f). A second groove (305g) is opened on the surface of the sector plate (305a). A third groove (305l) is opened on the surface of the load-bearing block (305k).

4. The dry ice cleaning machine for semiconductor materials according to claim 3, characterized in that: The induction assembly (306) includes a plurality of extrusion rods (306a) slidably connected to the fixing plate (305d), an extrusion cylinder (306b) fixedly connected to the extrusion rods (306a) and installed in the mounting groove (305c), a lever (305h) fixed to the extrusion cylinder (306b), and a second spring (306c) disposed on the extrusion cylinder (306b); A contact sphere (306d) is fixed to one end of the extrusion cylinder (306b). A pressure sensor (306e) is fixed to the surface of the first groove (305b). A protective shell (307) is fixed inside the support base (301).

5. The dry ice cleaning machine for semiconductor materials according to claim 4, characterized in that: The suspension assembly (308) includes an airbag 1 (308a) fixed inside the protective shell (307), a protective cylinder (308b) fixed on the surface of the protective shell (307), a convex groove (308c) opened on the surface of the protective cylinder (308b), a convex block (308d) slidably connected to the surface of the convex groove (308c), and a pressing column (308f) fixedly connected to the convex block (308d). The pressing column (308f) is slidably connected to the inside of the protective cylinder (308b).

6. The dry ice cleaning machine for semiconductor materials according to claim 5, characterized in that: One end of the pressing column (308f) is fixed with a pressing plate (308e), the other end of the pressing column (308f) is fixed with a top block (308h), and a spring 3 (308g) is arranged on the surface of the pressing column (308f); The surface of the airbag 1 (308a) is fixed with a diversion pipe (309a), a throat pipe (309b) is fixed inside the diversion pipe (309a), and a jet head (309c) is fixed at one end of the diversion pipe (309a).

7. The dry ice cleaning machine for semiconductor materials according to claim 6, characterized in that: The auxiliary assembly (403) includes a soft pad (403a) fixed at the top end of the push rod (401), an air supply base (403b) fixed at the top end of the air supply cylinder (402), the air supply base (403b) is fixed on the surface of the positioning groove (302), and an air supply pipe 1 (403c) fixed on the surface of the air supply base (403b). One end of the air supply pipe 1 (403c) is fixed on the airbag 1 (308a).

8. The dry ice cleaning machine for semiconductor materials according to claim 7, wherein: The surface of the air supply base (403b) is fixed with an air supply pipe 2 (403d), a gas valve (403e) is fixed on the surface of the air supply pipe 2 (403d), a valve rod (403f) is rotated at the top of the gas valve (403e), an airbag 2 (403g) is fixed at the top of the air supply pipe 2 (403d), and the airbag 2 (403g) is fixed in the groove 3 (305l).

9. The dry ice cleaning machine for semiconductor materials according to claim 8, wherein: Also included is A scanning structure (500), including two fixed bases (501) fixed on the mounting base plate (201), a laser range finder (502) fixed on the fixed bases (501), and a camera (503) fixed on the fixed bases (501) and located below the laser range finder (502); and A cabinet structure (600), including an upper cabinet (601) fixed on the support rod (101), a lower cabinet (602) fixed below the upper cabinet (601), and a data server (603) fixed on the upper cabinet (601).

10. The dry ice cleaning machine for semiconductor materials according to claim 9, characterized in that: The surface of the support rod (101) is fixed with a longitudinal track (102), a transverse track (103) slides on the longitudinal track (102), a controller (104) is installed on the transverse track (103), a fixing member (105) is fixed on the controller (104), and a dry ice spray head (106) is installed on the fixing member (105).

Images