Focusing module for laser micromachining and laser micromachining system and method

Abstract

The invention discloses a focusing module for laser micromachining, which comprises a component library, a decision component and an execution component, the component library comprises at least one component including a focus lens and a galvanometer, the focus lens comprises a field lens or an objective lens, the decision component is used for selecting the component from the component library and determining the type of the focus lens according to the machining requirement, and the execution component is used for executing the machining requirement. And the execution component is in communication connection with the decision component and sets the selected components according to a preset sequence. The focusing module can be mounted at the tail end of a light guide arm, is applied to laser micromachining, and can realize two focusing modes, namely a direct focusing mode and a galvanometer scanning mode by selecting different components, so as to cover three-dimensional and two-dimensional bidirectional scenes.

Description

Technical Field

[0001] The present invention relates to the technical field of laser processing, and particularly to a focusing module, a laser micromachining system and a method for laser micromachining. Background Art

[0002] Traditional industrial systems often rely on optical fiber transmission. However, when high-power transmission is carried out, the optical fiber is extremely prone to nonlinear effects, and the self-focusing phenomenon is particularly significant. This self-focusing will cause the optical energy to be locally over-concentrated in the optical fiber, thereby seriously interfering with the transmission process, and strictly limiting the peak power that the system can withstand to below 1 MW. At the same time, traditional industrial systems are difficult to adapt to the efficient processing of three-dimensional complex structures such as curved surfaces and cavities.

[0003] Laser processing means that the laser passes through a lens and is focused to reach a very high energy density at the focal point, and the processing is carried out by the photothermal effect. Lasers have the advantages of non-contact processing and high energy density, and are currently widely used in welding, cutting, engraving, surface modification, marking, drilling, micromachining, and the processing of traditional difficult-to-process materials.

[0004] Currently, laser processing usually adopts galvanometer scanning technology and fixed focusing lens technology. Among them, the galvanometer scanning technology mainly controls the rotation of the galvanometer to accurately control the scanning path and position of the laser beam, and it is mainly used in scenarios such as two-dimensional high-speed scanning and three-dimensional layer-by-layer processing. The fixed focusing lens technology has a fixed focal length. Therefore, once the focal length is set, it can only process materials at specific planar positions. In the actual application process of existing processing equipment, it is impossible to flexibly and conveniently switch between three-dimensional and two-dimensional processing scenarios according to different processing requirements. When it is necessary to switch from a two-dimensional planar processing scenario to a three-dimensional processing scenario, it is often necessary to replace the entire focusing system, and even may need to replace different types of processing equipment, which will lead to low equipment utilization rate and greatly waste time and labor costs. Summary of the Invention

[0005] In view of some or all of the problems in the prior art, a first aspect of the present invention provides a focusing module for laser micromachining, including:

[0006] A component library, which includes at least one component, and the at least one component includes: a focusing lens and a galvanometer, wherein the focusing lens includes a field lens or an objective lens;

[0007] A decision-making component, which is used to select components from the component library according to processing requirements and determine the type of the focusing lens; and

[0008] An execution component, which is communicably connected to the decision-making component and is used to set the selected components in a preset order.

[0009] Further, the preset order includes:

[0010] If the selected components include a field lens and a galvanometer scanner, the field lens is disposed on the light output side of the galvanometer scanner; and

[0011] If the selected components include a galvanometer scanner and an objective lens, the objective lens is disposed on the light output side of the galvanometer scanner.

[0012] Further, the focusing module further includes:

[0013] An adjustment component for adjusting the position and / or angle of the components.

[0014] Further, the adjustment component includes a multi-dimensional moving platform and / or a multi-degree-of-freedom robotic arm.

[0015] Based on the focusing module as described above, a second aspect of the present invention provides a laser micro-machining system, including:

[0016] A light guiding arm including at least one joint and a mirror, wherein the mirror is used to form a dynamic light path transmission path; and

[0017] The focusing module as described above, which is disposed at the first end of the light guiding arm and is used to focus the light reflected by the mirror to the processing area.

[0018] Further, the mirror is detachably disposed at the joint.

[0019] Further, the laser micro-machining system further includes:

[0020] A laser, which is disposed at the second end of the light guiding arm opposite to its first end and is used to generate an ultrashort pulse laser beam, and the light guiding arm is used to transmit the ultrashort pulse laser beam to the focusing module.

[0021] Further, the pulse width of the ultrashort pulse laser beam is 10 to 999 femtoseconds, or 1 to 999 picoseconds.

[0022] Further, the wavelength of the ultrashort pulse laser beam is 200 nm to 12000 nm.

[0023] Based on the laser micro-machining system as described above, a third aspect of the present invention provides a laser micro-machining method, which performs laser micro-machining through the laser micro-machining system as described above, and includes:

[0024] Determine the components of the focusing module according to the processing requirements:

[0025] If the processing task is three-dimensional complex structure processing or two-dimensional planar precision processing, the components include a focusing lens and a galvanometer scanner, wherein the focusing lens includes a field lens or an objective lens; and

[0026] If the processing task is two-dimensional high-speed scanning or three-dimensional layer-by-layer processing, the component includes a focusing lens and a galvanometer scanner, wherein the focusing lens includes a field lens or an objective lens;

[0027] Arrange the component at the end of the light guide arm in a preset order; and

[0028] Adjust the angles and / or positions of the light guide arm and the focusing module, start the laser, and perform the operation.

[0029] Further, the laser micromachining method further includes:

[0030] Select the structure of the light guide arm and / or the mirror used in the light guide arm according to the processing requirements.

[0031] Further, determine the coating standard of the mirror according to the wavelength of the laser used.

[0032] Further, the laser micromachining method further includes:

[0033] Determine the pulse mode of the laser according to the processing task:

[0034] If the processing task is non-thermal melting processing of hard and brittle materials or ultra-fine structure processing of metals and composite materials, the laser generates an ultrashort pulse laser beam with a pulse width of 10 to 999 femtoseconds; and

[0035] If the processing task is high-precision ablation of metals, polymers, and composite materials or large depth-to-diameter ratio micro-hole processing of hard and brittle materials, the laser generates an ultrashort pulse laser beam with a pulse width of 1 to 999 picoseconds.

[0036] A focusing module, a laser micromachining system, and a method for laser micromachining provided by the present invention can achieve different focusing modes through selectable components, thereby adapting to different processing scenario requirements, such as three-dimensional curved surface processing, two-dimensional plane cutting, three-dimensional stacking processing, or high-speed plane scanning, etc. The application range is wide and the assembly is flexible. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] To further clarify the above and other advantages and features of the embodiments of the present invention, more specific descriptions of the embodiments of the present invention will be presented with reference to the accompanying drawings. It can be understood that these drawings only depict typical embodiments of the present invention and thus will not be considered as limiting its scope. In the drawings, for clarity, the same or corresponding components will be denoted by the same or similar reference numerals.

[0038] Figure 1 A schematic structural diagram of a focusing module for laser micromachining showing an embodiment of the present invention;

[0039] Figure 2 Schematic structural diagram of a multi-dimensional mobile platform showing an embodiment of the present invention;

[0040] Figure 3 Schematic structural diagram of a laser micro-machining system showing an embodiment of the present invention; and

[0041] Figure 4 Schematic flow diagram of a laser micro-machining method showing an embodiment of the present invention. Detailed implementation manners

[0042] In the following description, the present invention is described with reference to the embodiments. However, those skilled in the art will recognize that the embodiments can be implemented without one or more specific details or in conjunction with other alternative and / or additional methods, materials, or components. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring the inventive points of the present invention. Similarly, for purposes of explanation, specific quantities, materials, and configurations are set forth to provide a thorough understanding of the embodiments of the present invention. However, the present invention is not limited to these specific details. In addition, it should be understood that the embodiments shown in the drawings are illustrative representations and not necessarily drawn to scale.

[0043] In this specification, the reference to "an embodiment" or "the embodiment" means that the specific features, structures, or characteristics described in conjunction with the embodiment are included in at least one embodiment of the present invention. The phrase "in an embodiment" appearing throughout this specification does not necessarily refer to the same embodiment.

[0044] It should be noted that the embodiments of the present invention describe the process steps in a specific order. However, this is only for the purpose of explaining the specific embodiment and does not limit the sequence of the steps. On the contrary, in different embodiments of the present invention, the sequence of the steps can be adjusted according to the process adjustment.

[0045] Aiming at the problem that the existing focusing technology has a single function and cannot flexibly switch between three-dimensional and two-dimensional processing scenarios, the present invention provides a focusing module, a laser micro-machining system, and a method for laser micro-machining, which can achieve different focusing modes through optional components to meet the requirements of different application scenarios.

[0046] The technical solutions of the present invention will be further described below with reference to the accompanying drawings of the embodiments.

[0047] Figure 1Schematic structural diagram of a focusing module for laser micromachining showing an embodiment of the present invention. As shown in the figure, a focusing module for laser micromachining includes a component library 101, a decision-making component 102, and an execution component 103. Among them, the component library 101 includes at least one component. In one embodiment of the present invention, the component library includes a focusing lens and a galvanometer 111, where the focusing lens includes a field lens 112 or an objective lens 113, etc. Based on this, before laser processing, different components can be selected and combined according to the processing scenario requirements to meet the needs of different scenarios. For example, when three-dimensional complex structure processing such as curved surface micro-holes and two-dimensional planar precision processing such as thin film cutting are required, the direct focusing mode can be selected, that is, a focusing lens is selected. Another example is that when two-dimensional high-speed scanning such as metal patterning or three-dimensional layered processing such as multi-layer material stacking process is required, a galvanometer can be selected and paired with a corresponding focusing lens.

[0048] In one embodiment of the present invention, the galvanometer 111 is a rotating lens made of a lightweight and high-strength material. In one embodiment of the present invention, the field lens 112 is a plano-convex or biconvex lens, and the field lens 112 is made of a low-dispersion and high-light transmittance material, and a high-precision optical coating is provided on the surface to reduce reflection loss. In one embodiment of the present invention, the focusing lens can also be a high-precision concave mirror, the surface of which is treated with a high-reflectivity coating, where the reflectivity of the high-reflectivity coating is greater than 99.8%, to ensure high optical quality can be maintained under a pulse width of 10 fs to 999 ps. The mirror curvature of the focusing lens is designed according to the required focal length.

[0049] In one embodiment of the present invention, the selection of components can be manually operated or autonomously implemented by the focusing module. Specifically, the decision-making component 102 selects components from the component library according to the processing requirements and determines the type of the focusing lens. Then, the selected components are set in a preset order by the execution component 103, such as connecting to the end of the light guiding arm, etc.

[0050] In an embodiment of the present invention, the preset order includes that when the selected component includes a galvanometer scanner, the galvanometer scanner is set at a relatively forward position in the optical path, and then the focusing lens is set behind the galvanometer scanner. The focusing lens can focus the laser beam from the light guide arm or transmitted through the galvanometer scanner onto the workpiece to be processed, forming a micron-level focal point and achieving high-precision processing. Specifically, if the selected components include a field lens and a galvanometer scanner, the field lens is set on the light-emitting side of the galvanometer scanner. Using the imaging principle, the field lens can accurately project the galvanometer plane or the scanning plane onto the front focal plane to maintain the beam quality and focusing stability. In addition, by finely adjusting the position of the field lens, the focal position error caused by the optical path deviation can also be compensated to ensure uniform irradiation of the laser beam on the workpiece surface. Similarly, if the selected components include a galvanometer scanner and an objective lens, the objective lens is set on the light-emitting side of the galvanometer scanner.

[0051] In an embodiment of the present invention, the focusing module further includes an adjustment component 104, which is used to adjust the position and / or angle of each component to meet the processing requirements. For example, by changing the mirror position and angle of the focusing lens, the focus movement and spot size adjustment can be achieved. In some embodiments of the present invention, the adjustment component and the execution component can be implemented by the same device, such as a multi-degree-of-freedom robotic arm. In some other embodiments of the present invention, the adjustment component 104 and the self-propelled component 103 are independent devices, which include, for example, motors, adjustable brackets, multi-dimensional moving platforms, multi-degree-of-freedom robotic arms, etc. In an embodiment of the present invention, the galvanometer scanner is connected to a high-speed electric servo motor or a stepper motor, and thus its tilt angle can be quickly changed through the high-speed electric servo motor or the stepper motor, so that the laser beam can scan along a predetermined trajectory. In an embodiment of the present invention, the scanning frequency of the galvanometer scanner is above 1 kHz. In an embodiment of the present invention, the galvanometer scanner is also internally provided with an angle encoder and a feedback sensor to ensure precise control of the rotation angle. The angle adjustment and the control signal are closely coordinated to achieve high-speed and high-precision two-dimensional scanning or layer-by-layer processing, meeting the requirements of large-format high-speed patterning. In an embodiment of the present invention, the focusing lens is mounted on an adjustable bracket or a multi-dimensional moving platform, and thus its position can be finely adjusted through the adjustable bracket or the multi-dimensional moving platform, and then its focal position, focusing spot size, etc. can be adjusted.

[0052] Figure 2 The structural schematic diagram of a multi-dimensional moving platform showing an embodiment of the present invention is shown. Through the multi-dimensional moving platform, components such as the galvanometer scanner can be driven to translate in three directions of the X, Y, and Z axes and rotate around the X, Y, and Z axes. As Figure 2As shown in the figure, the multi-dimensional moving platform includes a base 201, a rotating base 202, a rotating platform 203, a first-direction (Z-axis) moving component 204, a second-direction (X-axis) moving component 205, and a third-direction (Y-axis) moving component 206. Among them, the base 201 is fixed on a tabletop or the ground, the rotating base 202 is arranged above the base 201, the rotating base 202 includes a curved surface groove, the rotating platform 203 includes a first part 231 and a second part 232. The first part 231 is connected to the curved surface groove of the rotating base 202 and can rotate around the second direction (X-axis) and the third direction (Y-axis) along the groove. The second part 232 is arranged above the first part 231 and can rotate around its central axis (Z-axis) relative to the first part 231. The first-direction moving component 204 includes a first track 241 and a first slider 242. One end of the first track 241 is fixed on the rotating platform 203, and the first track 241 is parallel to the central axis of the rotating platform 203. The first slider 242 is installed on the first track 241 and can slide along the first track 241. The second-direction moving component 205 is connected to the first slider 242 and includes a second track 251 and a second slider 252. One end of the second track 251 is fixed on the first slider 242, and the second track 251 is perpendicular to the first track 241. The second slider 252 is installed on the second track 251 and can slide along the second track 251. The third-direction moving component 205 is connected to the second slider 252 and includes a third track and a third slider 262. One end of the third track is fixed on the second slider 252, and the third track is perpendicular to the first track 241 and the second track 251. The third slider 262 is installed on the third track and can slide along the third track. Components such as a galvanometer scanner and a focusing lens are connected to the third slider 262, and thus can be driven by it to translate in three directions of the X, Y, and Z axes and rotate around the X, Y, and Z axes.

[0053] Based on the focusing module as described above, Figure 3 The structural schematic diagram of a laser micro-machining system showing an embodiment of the present invention is as follows. Figure 3 As shown in the figure, a laser micro-machining system includes a light guide arm 301, a focusing module, and a laser 303. Among them, the focusing module includes a component 321 selected from a component library by the decision module as described above. The component 321 is arranged at the first end of the light guide arm 301, and at the same time, the position and angle of the component 321 can be adjusted by an adjusting component 322. As shown in the figure, in an embodiment of the present invention, the adjusting component 322 includes a multi-degree-of-freedom robotic arm. In some other embodiments of the present invention, the adjusting component 322 includes a multi-dimensional moving platform, etc. For example,Figure 2 A six - dimensional mobile platform as shown, etc. The laser 303 is disposed at the second end of the light - guiding arm 301 opposite to its first end. The laser light emitted by the laser 303 reaches the focusing module via the light - guiding arm 301 and then is focused to a specified area through the focusing module.

[0054] In an embodiment of the present invention, the light - guiding arm 301 includes at least one joint and a reflecting mirror, where the reflecting mirror is used to form a dynamic optical - path transmission path. In an embodiment of the present invention, each joint of the light - guiding arm includes a hollow tube and a high - precision bearing, and its overall repeat positioning accuracy is ±5 microns. In an embodiment of the present invention, each joint of the light - guiding arm includes a precision mechanical positioning device and an electric fine - tuning device, and thus the angles of each joint can be controlled through a preset program to achieve dynamic adjustment of the optical path. In an embodiment of the present invention, the light - guiding arm further includes a position sensor to ensure the repeat positioning accuracy of the overall reflection path after each switching.

[0055] The reflecting mirror is detachably disposed at the joint. For example, a slot can be provided at each joint connection, and the reflecting mirror is inserted into the slot and fixed by a detachable locking device. In an embodiment of the present invention, the reflecting mirror is a high - reflectivity coated lens, its reflectivity is not less than 99.8%, and the damage threshold is not less than 10 J / cm 2 , and thus can support the transmission of all - band ultrafast laser, covering the processing requirements of multiple materials. In an embodiment of the present invention, by using lenses with different coating standards, the requirements for laser transmission in different bands can be adapted. In addition, for some special laser bands such as ultraviolet laser or special - band requirements, the reflecting mirror can further be made of a low - absorption and high - reflectivity material and optimized for the coefficient of thermal expansion. Based on the structure described above, in an embodiment of the present invention, according to processing requirements, such as the control of thermal effects of different materials, etc., the overall layout of the reflecting - mirror group can be adjusted to achieve different beam qualities and processing precisions. The overall layout of the reflecting - mirror group includes the coating standards, installation positions, angles, etc. of each reflecting mirror.

[0056] In an embodiment of the present invention, an ultrashort - pulse laser beam is used, that is, the laser 203 is used to generate an ultrashort - pulse laser beam. In an embodiment of the present invention, the laser 203 can dynamically switch between the femtosecond or picosecond mode, that is, it can emit an ultrashort - pulse laser beam with a pulse width of 10 to 999 femtoseconds or 1 to 999 picoseconds according to requirements. In an embodiment of the present invention, the wavelength of the ultrashort - pulse laser beam is 200 nm to 12000 nm.

[0057] Based on the laser micro - processing system described above, Figure 4Schematic flow diagram of a laser micromachining method showing an embodiment of the present invention, which performs laser micromachining through the laser micromachining system as described above, and as Figure 4 described, a laser micromachining method includes:

[0058] First, in step 401, determine the focusing module assembly. Determine the components of the focusing module according to the processing requirements. In an embodiment of the present invention, if the processing task is three-dimensional complex structure machining or two-dimensional planar precision machining, the direct focusing mode is adopted, and the components include a focusing lens and a galvanometer, where the focusing lens includes a field lens or an objective lens. If the processing task is two-dimensional high-speed scanning or three-dimensional layer machining, the galvanometer scanning mode is adopted, and the components include a focusing lens and a galvanometer, where the focusing lens includes a field lens or an objective lens;

[0059] Next, in step 402, determine the light guide arm structure. Select the structure of the light guide arm and / or the mirrors used in the light guide arm according to the processing requirements. Specifically, it includes determining the number of joints of the light guide arm, the layout of the mirrors, the coating standard, etc. For example, for a processing scenario using ultraviolet laser, fewer joints can be used to reduce the optical path loss, and at the same time, a precision adjustment mechanism is built into each joint to ensure the stable transmission of the light beam in the ultraviolet band;

[0060] Next, in step 403, install the focusing module. Arrange the components determined in step 401 at the end of the light guide arm in a preset order. When the components only include a focusing lens, the focusing lens can be fixed on the light guide arm through high-precision mechanical positioning parts such as a screw adjuster, a positioning pin, or a three-dimensional fine adjustment bracket, ensuring that the repeat positioning accuracy reaches ±5μm. If the components include a galvanometer, the galvanometer can be connected to the light guide arm through an adjustable optical bracket. As described above, this step can be completed manually or automatically by the execution module;

[0061] Next, in step 404, adjust the focusing module. Adjust the angle and / or position of the focusing module, including real-time adjustment of the relative position and angle between the galvanometer and the focusing lens; and

[0062] Finally, at step 405, the laser is started. The laser is started, and the angles of the joints of the light guiding arm are adjusted to direct the laser to focus on the specified position for operation. In an embodiment of the present invention, the pulse mode of the laser can also be determined according to the processing task. Specifically, if the processing task is non-thermal melting processing of hard and brittle materials such as sapphire, ceramics, and glass, or ultra-fine structure processing of metals and composite materials, the laser generates an ultra-short pulse laser beam with a pulse width of 10 to 999 femtoseconds. If the processing task is high-precision ablation of metals, polymers, and composite materials, or micro-hole processing with a large depth-to-diameter ratio of hard and brittle materials, the laser generates an ultra-short pulse laser beam with a pulse width of 1 to 999 picoseconds.

[0063] As described above, the focusing module, the laser micro-machining system and method can be applied to various types of processing scenarios. To better illustrate the technical solutions of the present invention, the components and the selection of their parameters in some processing scenarios are described in detail below.

[0064] For three-dimensional micro-hole processing of sapphire, the direct focusing mode is adopted. The laser adopts the femtosecond mode, and the laser pulse width it emits is 50 fs, the single-pulse energy is 20 W, and the frequency is 1 MHz. The light guiding arm adopts a 7-joint mirror group structure, and the focusing module includes a focusing lens. The overall fixed-point processing method is adopted. It has been verified that the processed hole diameter is 5 microns, the error is 0.2 microns, the heat affected zone is 150 nanometers, and the efficiency is increased by 40%.

[0065] For three-dimensional cutting of carbon fiber composites, the direct focusing mode is adopted. The laser adopts the picosecond mode, and the laser pulse width it emits is 80 ps, the single-pulse energy is 25 W. The light guiding arm adopts a 5-joint coated lens structure, and its planar positioning accuracy is ±3 microns. The focusing module includes a focusing lens. The overall three-dimensional trajectory cutting processing method is adopted. It has been verified that the cutting width is 12 microns, there is no delamination defect, and the heat affected zone is 300 nanometers.

[0066] For two-dimensional patterning of metal thin films, the galvanometer scanning mode is adopted. The laser adopts the picosecond mode, and the laser pulse width it emits is 30 ps, the single-pulse energy is 30 W, and the frequency is 500 KHz. The light guiding arm adopts a coated lens articulated arm, and the focusing module includes a galvanometer and a field lens. The overall high-speed scanning processing method is adopted. It has been verified that the processed line width is 8 microns, the uniformity is 95%, and the surface roughness Ra is 0.1 μm.

[0067] For the three-dimensional layered processing of multi-layer PCBs, a galvanometer scanning mode is adopted, and the laser uses a femtosecond mode. The laser pulse width emitted is 200 fs, and the single-pulse energy is 15 W. The mirror group of the light guide arm is adapted to the ultraviolet band (343 nm). The focusing module includes a galvanometer, and the overall adopts a layer-by-layer scanning processing method, where the layer spacing is 20 microns. After verification, the processing accuracy of each layer is ±3 microns, and there is no material delamination or carbonization phenomenon.

[0068] The described focusing module, laser micro-machining system and method significantly expand the applicability of the laser processing system through two-way scenario coverage and dual-mode collaborative design, while retaining the core advantages of high precision and wide-pulse compatibility of the light guide arm.

[0069] Although the embodiments of the present invention have been described above, it should be understood that they are presented only as examples and not as limitations. It will be obvious to those skilled in the relevant art that various combinations, variations and changes can be made to them without departing from the spirit and scope of the present invention. Therefore, the width and scope of the present invention disclosed herein should not be limited by the exemplary embodiments disclosed above, but should be defined only by the appended claims and their equivalents.

Claims

1. A focusing module for laser micromachining, characterized in that Comprising: A component library, which includes at least one component, and the at least one component includes: a focusing lens and a galvanometer scanner, wherein the focusing lens includes a field lens or an objective lens; A decision-making component, which is configured to select components from the component library according to processing requirements and determine the type of the focusing lens; and An execution component, which is communicably connected to the decision-making component and is configured to set the selected components in a preset order.

2. The focusing module according to claim 1, wherein The preset order includes: If the selected components include a field lens and a galvanometer scanner, the field lens is arranged on the light output side of the galvanometer scanner; and If the selected components include a galvanometer scanner and an objective lens, the objective lens is arranged on the light output side of the galvanometer scanner.

3. The focusing module according to claim 1, wherein Further comprising: An adjustment component, which is configured to adjust the position and / or angle of the component.

4. The focusing module according to claim 3, characterized in that, The adjustment component includes a multi-dimensional moving platform and / or a multi-degree-of-freedom robotic arm.

5. A laser micro-machining system, characterized in that, Comprising: A light guiding arm, which includes at least one joint and a reflecting mirror, wherein the reflecting mirror is configured to form a dynamic optical path transmission path; And The focusing module according to any one of claims 1 to 4, which is arranged at the first end of the light guiding arm and is configured to focus the light reflected by the reflecting mirror to a processing area.

6. The laser micro-machining system according to claim 5, wherein The reflecting mirror is detachably arranged at the joint.

7. The laser micromachining system according to claim 5, characterized in that, Further comprising: A laser, which is arranged at the second end of the light guiding arm opposite to its first end and is configured to generate an ultrashort pulse laser beam, and the light guiding arm is configured to transmit the ultrashort pulse laser beam to the focusing module.

8. The laser micro-machining system according to claim 7, characterized in that, The pulse width of the ultrashort pulse laser beam is 10 to 999 femtoseconds, or 1 to 999 picoseconds.

9. The laser micro-machining system according to claim 7, characterized in that, The wavelength of the ultrashort pulse laser beam is 200 nm to 12000 nm.

10. A laser micro-machining method, characterized in that, Performing laser micromachining by the laser micromachining system according to any one of claims 5 to 9, and comprising the steps of: Determining the components of the focusing module according to processing requirements: If the processing task is three-dimensional complex structure machining or two-dimensional planar precision machining, the components include a focusing lens and a galvanometer scanner, wherein the focusing lens includes a field lens or an objective lens; and If the processing task is two-dimensional high-speed scanning or three-dimensional layer machining, the components include a focusing lens and a galvanometer scanner, wherein the focusing lens includes a field lens or an objective lens; Setting the components in a preset order at the end of the light guiding arm; And Adjusting the angles and / or positions of the light guiding arm and the focusing module, starting the laser, and performing operations.

11. The laser micromachining method according to claim 10, wherein, Further comprising the steps of: Selecting the structure of the light guiding arm and / or the reflecting mirror used by the light guiding arm according to processing requirements.

12. The laser micromachining method according to claim 11, wherein, Determining the reflecting mirror of the light guiding arm according to processing requirements includes: Determining the coating standard of the reflecting mirror according to the wavelength of the laser used.

13. The laser micromachining method according to claim 10, wherein, Further comprising: Determining the pulse mode of the laser according to the processing task: If the processing task is non-thermal melting machining of hard and brittle materials or ultra-fine structure machining of metals and composite materials, the laser generates an ultrashort pulse laser beam with a pulse width of 10 to 999 femtoseconds; And If the processing task is high-precision ablation of metals, polymers, and composite materials or large depth-to-diameter ratio micro-hole machining of hard and brittle materials, the laser generates an ultrashort pulse laser beam with a pulse width of 1 to 999 picoseconds.

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