Laser coding equipment for pcb (printed circuit board)

Abstract

The invention discloses pcb laser coding equipment, and relates to the technical field of laser coding equipment. The pcb laser coding equipment comprises an equipment shell, a bottom fixing table, a first supporting table and a second supporting table are arranged in the equipment shell, a supporting seat is arranged on the upper surface of the first supporting table, a first base plate is arranged on the upper surface of the supporting seat, and a vacuum adsorption platform, a first fixing guide rail and a motor are arranged on the upper surface of the first base plate; an adsorption hole and a through hole are formed in the upper surface of the vacuum adsorption platform, a driving belt wheel is arranged at the output end of the motor, a driven belt wheel is rotationally connected to the inner surface of the first base plate, a transmission belt is arranged on the outer surfaces of the driving belt wheel and the driven belt wheel, and a first sliding seat is arranged on the upper surface of the transmission belt; according to the automatic code printing equipment, the code printing precision of the equipment is improved, the code printing efficiency is also improved, and the cleanliness and the maintenance efficiency of the equipment are further optimized.

Description

Technical Field

[0001] The present invention relates to the technical field of laser coding equipment, and specifically to a laser coding device for PCB boards. Background Art

[0002] Laser coding is a coding method using laser as the engraving tool. It utilizes the high energy density and high frequency of the laser for marking. Currently, when circuit board companies produce PCB boards on the production line, they need to conduct process management and quality control on them for traceability. The laser coding technology has the advantages of non-contact non-destructive marking, permanent marking, and not being easily erased. Therefore, generally, the laser coding method is adopted to mark two-dimensional codes on the surface of PCB boards for traceability of each PCB board.

[0003] The existing laser coding devices for PCB boards often face the following problems during the processing: First, the PCB board is prone to warping due to processing stress, resulting in offset or insufficient accuracy of the laser coding position; Second, the single-laser design cannot meet the requirements of high-efficiency production, and there is a lack of an effective dust collection mechanism during the coding process, affecting the cleanliness of the working environment; Third, most of the existing devices do not integrate the thickness detection function, and additional processes are required to detect the copper layer parameters, increasing the process complexity and time cost. Summary of the Invention

[0004] In view of the deficiencies of the existing problems, the present invention provides a laser coding device for PCB boards to solve the problems raised in the above background art.

[0005] To solve the above problems, the present invention is realized through the following technical solutions: A PCB board laser coding device includes a device housing. Inside the device housing, there is a bottom fixing table, a first support table, and a second support table. On the upper surface of the first support table, there is a support seat. On the upper surface of the support seat, there is a first substrate. On the upper surface of the first substrate, there are a vacuum adsorption platform, a first fixing guide rail, and a motor. On the upper surface of the vacuum adsorption platform, there are adsorption holes and through holes. The output end of the motor is provided with a driving pulley. The inner surface of the first substrate is rotatably connected with a driven pulley. The outer surfaces of the driving pulley and the driven pulley are provided with a transmission belt. On the upper surface of the transmission belt, there is a first sliding seat. On one side of the first sliding seat, there is a first cylinder. The output end of the first cylinder is provided with a connecting frame. On the outer surface of the connecting frame, there is a fixing member. At the bottom of the fixing member, there is a pressing plate. On the upper surface of the second support table, there is a second substrate. On the upper surface of the second substrate, there are an X-axis guide rail and a second fixing guide rail. At the end of the X-axis guide rail, there is a fourth cylinder. The output end of the fourth cylinder is provided with a third sliding seat. On the outer surface of the third sliding seat, there is a Y-axis guide rail. At the end of the Y-axis guide rail, there is a fifth cylinder. The output end of the fifth cylinder is provided with a fourth sliding seat. On the outer surface of the fourth sliding seat, there is a Z-axis guide rail. At the end of the Z-axis guide rail, there is a sixth cylinder. The output end of the sixth cylinder is provided with a laser.

[0006] Preferably, the bottom fixing table is arranged below the first support table and the second support table. On the upper surface of the bottom fixing table, there are a software industrial control computer and a throttle valve.

[0007] Preferably, the bottom of the vacuum adsorption platform is fixedly connected with a first conduit. The inside of the first conduit is communicated with the inner cavity of the vacuum adsorption platform. On the outside of the device housing, there is a blower. One end of the first conduit away from the vacuum adsorption platform is connected with the blower.

[0008] Preferably, at the bottom of the through hole, there is a collection groove. The bottom of the collection groove is fixedly connected with a second conduit.

[0009] Preferably, the bottom of the first sliding seat is slidably connected with the first fixing guide rail. The motor, the driving pulley, the driven pulley, the transmission belt, and the first sliding seat are arranged on both sides of the vacuum adsorption platform.

[0010] Preferably, the upper surface of the support seat is fixedly connected with a base. On the upper surface of the base, there is a second cylinder. The output end of the second cylinder is provided with a second sliding seat.

[0011] Preferably, a third cylinder is provided on the outer surface of the second sliding seat, and a copper thickness measuring instrument is provided at the output end of the third cylinder. The copper thickness measuring instrument is arranged on one side of the vacuum adsorption platform.

[0012] Preferably, the third sliding seat is slidably connected to the X-axis guide rail and the second fixed guide rail, the fourth sliding seat is slidably connected to the Y-axis guide rail, and the laser is slidably connected to the Z-axis guide rail.

[0013] Preferably, a camera is provided at the front end of the laser. There are two sets of the X-axis guide rail, the second fixed guide rail, the fourth cylinder, the third sliding seat, the Y-axis guide rail, the fifth cylinder, the fourth sliding seat, the Z-axis guide rail, the sixth cylinder, the laser and the camera, and there are two through holes.

[0014] The present invention provides a pcb board laser coding device. It has the following beneficial effects: 1. For this pcb board laser coding device, through the coordinated action of the vacuum adsorption platform and the pressing plate, the vacuum adsorption platform adsorbs and fixes the pcb board through the negative pressure generated by the blower. At the same time, the pressing plate mechanism driven by the transmission belt can automatically move to the warped part at the edge of the pcb board and press it down by the first cylinder to make it completely flat. This design effectively solves the problem that the laser coding position of the pcb board is offset or the accuracy is insufficient due to warping caused by processing stress, and improves the coding accuracy of the device.

[0015] 2. For this pcb board laser coding device, through the three-axis linkage laser positioning system and visual auxiliary calibration, the laser can move freely in three-dimensional space, cooperate with a high-resolution camera for visual positioning, accurately identify the coordinates of the coding area on the pcb board. The system supports preset path programming, and the laser beam automatically switches between the through-hole mode and the blind-hole mode according to the thickness of the board to ensure that the perforation depth is accurately controllable. In addition, the dual-laser parallel design can simultaneously code both sides of the pvb board. Combined with the dynamic path optimization algorithm, the efficiency is greatly improved compared with a single machine.

[0016] 3. For this pcb board laser coding device, through the integrated dust collection system, the debris generated during the coding process falls into the bottom collection tank through the through holes on the vacuum adsorption platform and is centrally discharged into the external dust collection device through the second conduit, effectively avoiding the pollution of optical components and transmission mechanisms caused by dust accumulation, and optimizing the cleanliness and maintenance efficiency of the device.

[0017] 4. For this pcb board laser coding device, by equipping a copper thickness measuring instrument, the copper thickness measuring instrument can be accurately positioned on the surface of the pcb board and the copper layer thickness can be detected in real time by driving with the second cylinder and the third cylinder. If the thickness exceeds the preset threshold, the system automatically pauses the process to avoid insufficient coding depth or over-etching caused by abnormal material parameters, further improving the processing quality. Description of the Drawings

[0018] Figure 1 This is the structural schematic diagram of the whole invention; Figure 2 This is the structural schematic diagram of the second perspective of the whole invention; Figure 3 This is the internal structural schematic diagram of the device housing of the invention; Figure 4 This is the structural schematic diagram of the vacuum adsorption platform module and the laser module of the invention; Figure 5 This is the structural schematic diagram of the vacuum adsorption platform module of the invention; Figure 6 This is the structural schematic diagram of the second perspective of the vacuum adsorption platform module of the invention; Figure 7 This is the structural schematic diagram of the laser module of the invention; Figure 8 This is the structural schematic diagram of the second perspective of the laser module of the invention.

[0019] In the figure: 1, device housing; 2, bottom fixing table; 3, first support table; 4, second support table; 5, support seat; 6, first substrate; 7, vacuum adsorption platform; 8, first fixed guide rail; 9, first cylinder; 10, adsorption hole; 11, through hole; 12, first conduit; 13, collection tank; 14, second conduit; 15, motor; 16, driving pulley; 17, driven pulley; 18, transmission belt; 19, first sliding seat; 20, connecting frame; 21, fixing member; 22, pressing plate; 23, base; 24, second cylinder; 25, second sliding seat; 26, third cylinder; 27, copper thickness measuring instrument; 28, second substrate; 29, X-axis guide rail; 30, second fixed guide rail; 31, fourth cylinder; 32, third sliding seat; 33, Y-axis guide rail; 34, fifth cylinder; 35, fourth sliding seat; 36, Z-axis guide rail; 37, sixth cylinder; 38, laser; 39, blower; 40, software industrial control computer; 41, throttle valve; 42, camera. Detailed implementation manners

[0020] The present invention will be further described in detail below with reference to the accompanying drawings and specific implementation manners. The embodiments of the present invention are given for the purpose of illustration and description, and are not exhaustive or limit the present invention to the disclosed form. Many modifications and variations are obvious to those of ordinary skill in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention, and enable those of ordinary skill in the art to understand the present invention and design various embodiments with various modifications suitable for specific purposes.

[0021] As Figures 1 - 8As shown in the figure, the present invention provides a technical solution: a laser coding device for a pcb board, including a device housing 1. Inside the device housing 1, there are a bottom fixing table 2, a first support table 3 and a second support table 4. On the upper surface of the first support table 3, there is a support seat 5. On the upper surface of the support seat 5, there is a first substrate 6. On the upper surface of the first substrate 6, there are a vacuum adsorption platform 7, a first fixed guide rail 8 and a motor 15. On the upper surface of the vacuum adsorption platform 7, there are adsorption holes 10 and through holes 11. At the output end of the motor 15, there is a driving pulley 16. The inner surface of the first substrate 6 is rotatably connected with a driven pulley 17. On the outer surfaces of the driving pulley 16 and the driven pulley 17, there is a transmission belt 18. On the upper surface of the transmission belt 18, there is a first sliding seat 19. On one side of the first sliding seat 19, there is a first cylinder 9. At the output end of the first cylinder 9, there is a connecting frame 20. On the outer surface of the connecting frame 20, there is a fixing member 21. At the bottom of the fixing member 21, there is a pressing plate 22. On the upper surface of the second support table 4, there is a second substrate 28. On the upper surface of the second substrate 28, there are an X-axis guide rail 29 and a second fixed guide rail 30. At the end of the X-axis guide rail 29, there is a fourth cylinder 31. At the output end of the fourth cylinder 31, there is a third sliding seat 32. On the outer surface of the third sliding seat 32, there is a Y-axis guide rail 33. At the end of the Y-axis guide rail 33, there is a fifth cylinder 34. At the output end of the fifth cylinder 34, there is a fourth sliding seat 35. On the outer surface of the fourth sliding seat 35, there is a Z-axis guide rail 36. At the end of the Z-axis guide rail 36, there is a sixth cylinder 37. At the output end of the sixth cylinder 37, there is a laser 38.

[0022] The bottom fixing table 2 is arranged below the first support table 3 and the second support table 4. On the upper surface of the bottom fixing table 2, there are a software industrial control computer 40 and a throttle valve 41. The first support table 3 is dedicated to fixing the vacuum adsorption platform 7 module, and its height design ensures that the pcb board adapts to the movement path of the laser 38. The second support table 4 bears the three-dimensional motion system of the laser 38, and the vibration interference between modules is avoided through the layered structure.

[0023] At the bottom of the vacuum adsorption platform 7, there is a first conduit 12 fixedly connected. The inside of the first conduit 12 is communicated with the inner cavity of the vacuum adsorption platform 7. On the outside of the device housing 1, there is a blower 39. One end of the first conduit 12 away from the vacuum adsorption platform 7 is connected to the blower 39. The vacuum adsorption platform 7 adsorbs and fixes the pcb board on its surface through the negative pressure generated by the blower 39. The adsorption holes 10 are evenly distributed to ensure that the adsorption force evenly covers the pcb board and prevent local deformation.

[0024] At the bottom of the through hole 11, there is a collection groove 13. At the bottom of the collection groove 13, there is a second conduit 14 fixedly connected. The through hole 11 is communicated with the collection groove 13, and the debris generated by coding is discharged through the cooperation of the second conduit 14.

[0025] The bottom of the first sliding seat 19 is slidably connected to the first fixed guide rail 8. The motor 15, the driving pulley 16, the driven pulley 17, the transmission belt 18 and the first sliding seat 19 are arranged on both sides of the vacuum adsorption platform 7.

[0026] A base 23 is fixedly connected to the upper surface of the support seat 5. A second air cylinder 24 is arranged on the upper surface of the base 23. The output end of the second air cylinder 24 is provided with a second sliding seat 25. The motor 15 drives the driving pulley 16, and drives the first sliding seat 19 to move along the first fixed guide rail 8 through the transmission belt 18, so that the pressing plate 22 is accurately positioned at the warped area of the edge of the pcb board. The first air cylinder 9 drives the pressing plate 22 to press down, forcibly flattening the pcb board and eliminating the coding deviation caused by the warping of the board.

[0027] A third air cylinder 26 is arranged on the outer surface of the second sliding seat 25. The output end of the third air cylinder 26 is provided with a copper thickness measuring instrument 27. The copper thickness measuring instrument 27 is arranged on one side of the vacuum adsorption platform 7. The second air cylinder 24 pushes the second sliding seat 25 to move horizontally, and the third air cylinder 26 vertically drives the copper thickness measuring instrument 27 to contact the surface of the pcb board, so as to detect the copper layer thickness before processing.

[0028] The third sliding seat 32 is slidably connected to the X-axis guide rail 29 and the second fixed guide rail 30. The fourth sliding seat 35 is slidably connected to the Y-axis guide rail 33. The laser 38 is slidably connected to the Z-axis guide rail 36. The X-axis guide rail 29 and the fourth air cylinder 31 control the laser 38 to move along the X-axis direction. The Y-axis guide rail 33 and the fifth air cylinder 34 control the laser 38 to move along the Y-axis direction. The Z-axis guide rail 36 and the sixth air cylinder 37 control the laser 38 to move along the Z-axis direction. The three-axis linkage realizes the accurate positioning of the laser beam in three-dimensional space.

[0029] A camera 42 is arranged at the front end of the laser 38. There are two sets of the X-axis guide rail 29, the second fixed guide rail 30, the fourth air cylinder 31, the third sliding seat 32, the Y-axis guide rail 33, the fifth air cylinder 34, the fourth sliding seat 35, the Z-axis guide rail 36, the sixth air cylinder 37, the laser 38 and the camera 42. There are two through holes 11. The two sets of lasers 38 are respectively configured with independent three-axis motion modules, and can simultaneously code the front and back sides of the pcb board, greatly improving the efficiency.

[0030] During operation, place the PCB board centered on the vacuum adsorption platform 7. The area of the PCB board that needs to be coded is above the through hole 11. Start the blower 39. Under the conduction of the first conduit 12, air flow is generated inside the vacuum adsorption platform 7. According to Bernoulli's principle, where the flow rate is large, the pressure is small, causing a negative pressure to be generated inside the vacuum adsorption platform 7. Thus, the vacuum adsorption platform 7 adsorbs and fixes the PCB board through a number of adsorption holes 10 provided on its upper surface. Since the two sides of the PCB board will slightly warp during the processing, start two groups of motors 15 to drive the corresponding driving pulleys 16 to rotate. With the cooperation of the corresponding driven pulleys 17, the two groups of transmission belts 18 are driven. Under the guiding and supporting action of the first fixed guide rail 8, the two groups of first sliding seats 19 move towards each other along with the corresponding transmission belts 18 until the pressing plate 22 moves above the warped parts on both sides of the PCB board. Then start the first cylinder 9 to drive the connecting frame 20 to move downward, and the fixing member 21 and the pressing plate 22 move downward accordingly until the pressing plate 22 flattens the PCB board, preventing the warping from affecting the coding accuracy. Subsequently, start the second cylinder 24 to drive the second sliding seat 25 to move, and the third cylinder 26 and the copper thickness measuring instrument 27 move accordingly until the copper thickness measuring instrument 27 moves above the PCB board. Then drive the third cylinder 26 to drive the copper thickness measuring instrument 27 to move downward until the bottom detection end of the copper thickness measuring instrument 27 touches the PCB board to detect the copper layer thickness on the surface of the PCB board and ensure that it meets the preset parameters. If the detection result is abnormal, the system pauses the process. If the detection result meets the requirements, start the fourth cylinder 31, the fifth cylinder 34, and the sixth cylinder 37 to drive the laser 38 to move along the directions of the X-axis guide rail 29, the Y-axis guide rail 33, and the Z-axis guide rail 36 respectively, and at the same time cooperate with the camera 42 to perform visual positioning on the PCB board. The laser 38 moves under the guidance of the guide rail system in the X, Y, and Z-axis directions according to the preset path, and forms perforations on the surface of the PCB board by ablating with a high-energy laser beam. The two-dimensional code pattern is composed of a dense dot matrix of perforations, and the perforation depth is automatically adjusted according to the thickness of the PCB board. Through-hole punching is used for thin boards, and blind hole technology is used for thick boards. During the coding process, dust and debris fall into the collection tank 13 through the through hole 11 and are discharged to the external dust collection system through the second conduit 14 to keep the working environment clean. The equipment is equipped with two groups of lasers 38, which can simultaneously process the two-dimensional code coding tasks on the left and right sides of the PCB board, significantly improving the efficiency.

[0031] Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art and related fields without creative work shall fall within the scope of protection of the present invention. The structures, devices, and operation methods not specifically described and explained in the present invention, unless otherwise specified and limited, are implemented according to the conventional means in the art.

Claims

1. A PCB board laser coding device, comprising a device housing (1), characterized in that: Inside the device housing (1), there are a bottom fixing platform (2), a first support platform (3) and a second support platform (4). On the upper surface of the first support platform (3), there is a support seat (5). On the upper surface of the support seat (5), there is a first substrate (6). On the upper surface of the first substrate (6), there are a vacuum adsorption platform (7), a first fixing guide rail (8) and a motor (15). On the upper surface of the vacuum adsorption platform (7), there are adsorption holes (10) and through holes (11). At the output end of the motor (15), there is a driving pulley (16). The inner surface of the first substrate (6) is rotatably connected to a driven pulley (17). The outer surfaces of the driving pulley (16) and the driven pulley (17) are provided with a transmission belt (18). On the upper surface of the transmission belt (18), there is a first sliding seat (19). On one side of the first sliding seat (19), there is a first cylinder (9). At the output end of the first cylinder (9), there is a connecting frame (20). On the outer surface of the connecting frame (20), there is a fixing member (21). At the bottom of the fixing member (21), there is a pressing plate (22). On the upper surface of the second support platform (4), there is a second substrate (28). On the upper surface of the second substrate (28), there are an X-axis guide rail (29) and a second fixing guide rail (30). At the end of the X-axis guide rail (29), there is a fourth cylinder (31). At the output end of the fourth cylinder (31), there is a third sliding seat (32). On the outer surface of the third sliding seat (32), there is a Y-axis guide rail (33). At the end of the Y-axis guide rail (33), there is a fifth cylinder (34). At the output end of the fifth cylinder (34), there is a fourth sliding seat (35). On the outer surface of the fourth sliding seat (35), there is a Z-axis guide rail (36). At the end of the Z-axis guide rail (36), there is a sixth cylinder (37). At the output end of the sixth cylinder (37), there is a laser (38).

2. The PCB board laser coding device according to claim 1, wherein: The bottom fixing platform (2) is arranged below the first support platform (3) and the second support platform (4). On the upper surface of the bottom fixing platform (2), there are a software industrial control computer (40) and a throttle valve (41).

3. A PCB board laser marking device according to claim 1, characterized in that: The bottom of the vacuum adsorption platform (7) is fixedly connected to a first conduit (12). The inside of the first conduit (12) is communicated with the inner cavity of the vacuum adsorption platform (7). Outside the device housing (1), there is a blower (39). One end of the first conduit (12) far from the vacuum adsorption platform (7) is connected to the blower (39).

4. A PCB board laser coding device according to claim 1, characterized in that: At the bottom of the through hole (11), there is a collection tank (13). The bottom of the collection tank (13) is fixedly connected to a second conduit (14).

5. A PCB board laser marking device according to claim 1, characterized in that: The bottom of the first sliding seat (19) is slidably connected to the first fixing guide rail (8). The motor (15), the driving pulley (16), the driven pulley (17), the transmission belt (18) and the first sliding seat (19) are arranged on both sides of the vacuum adsorption platform (7).

6. A PCB board laser coding device according to claim 1, characterized in that: The upper surface of the support base (5) is fixedly connected with a base (23). A second air cylinder (24) is arranged on the upper surface of the base (23), and a second sliding seat (25) is arranged at the output end of the second air cylinder (24).

7. The PCB board laser coding device according to claim 6, wherein: A third air cylinder (26) is arranged on the outer surface of the second sliding seat (25). A copper thickness measuring instrument (27) is arranged at the output end of the third air cylinder (26), and the copper thickness measuring instrument (27) is arranged on one side of the vacuum adsorption platform (7).

8. A PCB board laser coding device according to claim 1, characterized in that: The third sliding seat (32) is slidably connected with the X-axis guide rail (29) and the second fixed guide rail (30). The fourth sliding seat (35) is slidably connected with the Y-axis guide rail (33), and the laser (38) is slidably connected with the Z-axis guide rail (36).

9. The PCB board laser coding device according to claim 1, characterized in that: A camera (42) is arranged at the front end of the laser (38). There are two sets of the X-axis guide rail (29), the second fixed guide rail (30), the fourth air cylinder (31), the third sliding seat (32), the Y-axis guide rail (33), the fifth air cylinder (34), the fourth sliding seat (35), the Z-axis guide rail (36), the sixth air cylinder (37), the laser (38) and the camera (42), and there are two through holes (11).

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