Laser cutting device for semiconductor material
Through the cooperation of multiple suction cup mechanisms and clamping components, the problem of chip adhesion and removal is solved, and efficient and orderly chip material collection and neat stacking are achieved, which is suitable for laser cutting devices of semiconductor materials.
Patent Information
- Application Number
- CN202510386075.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-30
- Publication Date
- 2025-07-04
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
In the prior art, when cutting semiconductor wafers, the cut chips are prone to stick to the wafers, and removing the chips one by one is complicated, resulting in inconvenient subsequent sorting and packaging.
Multiple suction cup mechanisms are used to adsorb the chip and adjust the spacing, combining the clamping assembly and anti-offset material removal auxiliary assembly to achieve orderly removal and neat stacking of the chips.
Improves chip material collection efficiency, ensures orderly placement of chips, and facilitates subsequent sorting, testing and packaging.
Smart Images
Figure CN120244276A_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the technical field of laser cutting, and specifically relates to a laser cutting device for semiconductor materials. Background Art
[0002] A wafer is a basic material in the semiconductor manufacturing process. It is usually a circular thin slice made of high-purity silicon or other semiconductor materials. A chip is the core component of a semiconductor product, which contains circuits and components for realizing specific functions. On a wafer, multiple chips are manufactured simultaneously, but they are interconnected. Therefore, a cutting process is required to separate them to obtain independent chips with specific functions.
[0003] The patent with the publication number CN218638835U discloses a laser cutting machine for semiconductor wafer processing, including a support mechanism: including a base; a laser cutting mechanism for laser cutting the semiconductor wafer, and the laser cutting mechanism is installed at the top of the base; a clamping mechanism: including a motor, a cross block, and a fixture. The motor is installed on one side of the base. A transmission rod is rotatably connected inside the cross block, and the output shaft of the motor is in transmission connection with the transmission rod. When in use, when obliquely cutting the semiconductor wafer, the motor drives the transmission rod to rotate at this time. The transmission rod drives the second gear to rotate through the first gear, and the second gear drives the fixture to rotate through the connecting rod, so as to adjust the inclination angle of the fixture, and then facilitate the oblique angle cutting of the semiconductor wafer, and uniformly adjust the inclination angle of the fixture, which is convenient to use and has higher cutting accuracy.
[0004] However, the above technical solution still has the following deficiencies in the actual application process: Although the chips can be cut and separated from the wafer, during the wafer manufacturing process, the chips on the wafer are directly fabricated on the wafer through a series of process steps and form a tight connection with the wafer substrate. Therefore, the cut and separated chips may still adhere to the wafer, and external force is required to completely separate the chips from the wafer. Since there are a large number of chips on the wafer, it is rather troublesome to remove them one by one. When the chips on the wafer are uniformly dropped by external force, it will cause the chips to be randomly piled up. Usually, the chips cut from the wafer need to be sorted, tested, and packaged subsequently, and the randomly piled up chips are not conducive to the subsequent progress of these processes. Summary of the Invention
[0005] In order to make up for the deficiencies of the prior art and solve at least one technical problem proposed in the background art, the present invention proposes a laser cutting device for semiconductor materials.
[0006] The technical solution adopted by the present invention to solve its technical problems is: a laser cutting device for semiconductor materials, including a cutting table, on one side of the upper end surface of the cutting table, a guide rail mechanism is provided, a laser cutting head is arranged on the guide rail mechanism, and a chip picking mechanism is also arranged on the cutting table; The chip picking mechanism includes a groove plate slidably connected to one side of the upper end surface of the cutting table, a transverse moving plate is slidably connected to the chute of the groove plate, two first sliding rods are slidably connected to one side of the transverse moving plate, a picking plate is fixedly connected to the lower ends of the first sliding rods, two limiting rods are fixedly connected to both ends of the lower side of the picking plate, a second slider and a plurality of first sliders are slidably connected to the limiting rods, a fixed block is fixedly connected to one side of the lower end of the picking plate, the first sliders, the second slider and the fixed block are arranged horizontally, and hard tubes are fixedly connected to the lower end surfaces of the first sliders, the second slider and the fixed block, and suction cups are arranged at the lower ends of the hard tubes.
[0007] Preferably, a clamping component for positioning the wafer is also arranged on the cutting table; The clamping component includes a plurality of third cylinders fixedly connected to the upper end surface of the cutting table, and a positioning block is fixedly connected to the piston end of the third cylinder.
[0008] Preferably, a first threaded rod is threadedly connected to one side of the lower end of the groove plate, both ends of the first threaded rod are rotatably arranged on the cutting table, a second motor is fixedly connected to one side of the upper end surface of the cutting table, and the output end of the second motor is fixedly connected to one end of the first threaded rod.
[0009] Preferably, a fifth threaded rod is threadedly connected to one end of the transverse moving plate, both ends of the fifth threaded rod are rotatably arranged on the groove plate, a first motor is fixedly connected to one end of the groove plate, the output end of the first motor is fixedly connected to one end of the fifth threaded rod, a first cylinder is fixedly connected to one side of the upper end surface of the transverse moving plate, and the piston end of the first cylinder is fixedly connected to one side of the upper end surface of the picking plate.
[0010] Preferably, a vacuum pump is fixedly connected to one side of the upper end surface of the picking plate, an intake end of the vacuum pump is communicated with a connecting pipe, the connecting pipe is communicated with a plurality of hard tubes, and the connecting pipe is a flexible tube.
[0011] Preferably, a second connecting rod is rotatably arranged on the upper end surfaces of the fixed block and the second slider, a third connecting rod is rotatably arranged on the upper end surface of the first slider, one end of the second connecting rod is rotatably connected to one end of the third connecting rod, and the end parts of adjacent third connecting rods are rotatably connected.
[0012] Preferably, a sixth threaded rod is threadedly connected to one end of the second slider, one end of the sixth threaded rod is rotatably arranged on the picking plate, a third motor is fixedly connected to one side of the lower end of the picking plate, and the output end of the third motor is fixedly connected to one end of the sixth threaded rod.
[0013] Preferably, an anti-offset picking auxiliary component is also arranged on the picking plate; The anti-offset material taking auxiliary component includes two threaded blocks slidably connected to the upper end surface of the material taking plate. One side of the upper end of each threaded block is fixedly connected to a second cylinder, and the piston end of the second cylinder is fixedly connected to a pressing rod.
[0014] Preferably, two ends of one side of the upper end surface of the material taking plate are rotatably provided with a bidirectional threaded rod. Both sides of the bidirectional threaded rod are threadedly connected to the lower ends of the threaded blocks. One side of the upper end surface of the material taking plate is fixedly connected to a fourth motor, and the output end of the fourth motor is fixedly connected to one end of the bidirectional threaded rod.
[0015] Preferably, a material taking and receiving component is further arranged on the cutting table; The material taking and receiving component includes a receiving box fixedly connected to one side of the upper end surface of the cutting table. A sliding plate is slidably connected to one side of the upper end surface of the cutting table. Two ends of one side of the sliding plate are fixedly connected to second sliding rods. The second sliding rods are slidably connected to adjusting blocks. Two auxiliary plates are slidably connected to one side of each adjusting block. The auxiliary plates can extend into the receiving box, and both sides of the auxiliary plates are in contact with both sides of the inner cavity of the receiving box. One side of the lower end of the sliding plate is threadedly connected to a third threaded rod. Both ends of the third threaded rod are rotatably arranged on the cutting table. One side of the upper end surface of the cutting table is fixedly connected to a fifth motor, and the output end of the fifth motor is fixedly connected to one end of the third threaded rod. One side of the adjusting block is threadedly connected to a second threaded rod. Both ends of the second threaded rod are rotatably arranged on the sliding plate. One side of the upper end surface of the sliding plate is fixedly connected to a seventh motor, and the output end of the seventh motor is fixedly connected to one end of the second threaded rod. One side of the upper end of each auxiliary plate is rotatably provided with a first connecting rod. One end of the first connecting rod is rotatably provided with a connecting block. One side of the connecting block is threadedly connected to a fourth threaded rod. Both ends of the fourth threaded rod are rotatably arranged on the adjusting block. One side of the adjusting block is fixedly connected to a sixth motor, and the output end of the sixth motor is fixedly connected to one end of the fourth threaded rod.
[0016] The beneficial effects of the present invention are as follows: 1. For the laser cutting device for semiconductor materials of the present invention, the wafer to be laser cut is placed between multiple positioning blocks. Multiple third cylinders simultaneously drive the positioning blocks to approach the wafer and contact the edge of the wafer, so that the wafer can be clamped, thereby ensuring the stability of the wafer during the laser cutting process.
[0017] 2. The laser cutting device for semiconductor materials described in the present invention utilizes a chip picking mechanism, which can separate the chip from the wafer by suction after the laser cutting head cuts the chip on the wafer into multiple independent chips with the same specifications. Moreover, since the number of suction cups is set to multiple, and the spacing between adjacent suction cups can be adjusted to match the chip specifications, a row of chips can be removed from the wafer at one time, thereby improving the chip picking efficiency. Moreover, compared with a method of causing the chips on the wafer to fall uniformly through external force, this method can remove each row of chips in order and place them in a designated position or container in order, which is beneficial to the subsequent sorting, testing, packaging and other processes of the cut chips.
[0018] 3. The laser cutting device for semiconductor materials described in the present invention utilizes an anti-deviated material picking auxiliary component. When the suction cup contacts a row of chips, the pressure rod is driven to align with the two adjacent rows of chips that are in contact with the suction cup, and then the pressure rod is driven down to press the other two rows of chips. When the suction cup drives the chips to rise, the two piston ends of the cylinder continue to extend and always press the chips until the sucked chips are no longer in contact with the two adjacent rows of chips, thereby avoiding the situation where the two adjacent rows of chips are offset due to friction when the suction cup drives a row of chips to rise, causing the two adjacent rows of chips to move out of their original positions and affecting subsequent material picking work.
[0019] 4. The laser cutting device for semiconductor materials described in the present invention utilizes a material taking and receiving assembly to place chips in order at various positions in a storage box. In addition, during the chip placement process, the chips will be blocked by an auxiliary plate, the inner wall of the storage box, and adjacent chips, and will not tip over until the chips fill the entire storage box. At this time, the chips in the storage box are neatly arranged, which is conducive to the subsequent retrieval of the chips. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] The present invention will be further described below in conjunction with the accompanying drawings.
[0021] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention; Figure 2 It is a schematic diagram of the three-dimensional structure of the cylinder; Figure 3 It is a schematic diagram of the three-dimensional structure of the guide rail mechanism; Figure 4 It is a schematic diagram of the three-dimensional structure at the slot plate; Figure 5 It is a schematic diagram of the three-dimensional structure at the feeding plate; Figure 6 It is a schematic diagram of the three-dimensional structure at the auxiliary plate; Figure 7 yes Figure 6 A partial enlarged view of the middle part; Figure 8 It is a three-dimensional structure schematic diagram of the second cylinder; Figure 9 It is a three-dimensional structure schematic diagram of the fifth threaded rod; Figure 10 It is a three-dimensional structure schematic diagram of the connecting pipe; Figure 11 It is Figure 10 The partial enlarged view of part B in Figure 12 It is Figure 10 The partial enlarged view of part C in Figure 13 It is a three-dimensional structure schematic diagram of the storage box.
[0022] In the figure: 1. Cutting table; 2. Guide rail mechanism; 3. Laser cutting head; 4. Grooved plate; 5. Slide plate; 6. Accommodating box; 7. First motor; 8. First threaded rod; 9. Second motor; 10. Transverse moving plate; 11. First cylinder; 12. First slide rod; 13. Material taking plate; 14. Vacuum pump; 15. Connecting pipe; 16. Suction cup; 17. Second cylinder; 18. Pressure rod; 19. Third motor; 20. Limit rod; 21. Rigid pipe; 22. Fourth motor; 23. Bidirectional threaded rod; 24. Threaded block; 25. Auxiliary plate; 26. Second threaded rod; 27. Fifth motor; 28. Third threaded rod; 29. Second slide rod; 30. Adjusting block; 31. Sixth motor; 32. Fourth threaded rod; 33. Connecting block; 34. First connecting rod; 35. Fifth threaded rod; 36. Second connecting rod; 37. Third connecting rod; 38. First slider; 39. Sixth threaded rod; 40. Second slider; 41. Fixed block; 42. Positioning block; 43. Third cylinder; 44. Seventh motor. Specific embodiments
[0023] Next, the technical solutions of the present invention will be clearly and completely described in conjunction with the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0024] Please refer to Figures 1-13 , the present invention provides a technical solution: a laser cutting device for semiconductor materials, including a cutting table 1, a guide rail mechanism 2 is arranged on one side of the upper end surface of the cutting table 1, a laser cutting head 3 is arranged on the guide rail mechanism 2, and a chip material taking mechanism is also arranged on the cutting table 1; The chip picking mechanism includes a groove plate 4 slidably connected to one side of the upper end surface of the cutting table 1. A cross-moving plate 10 is slidably connected to the chute of the groove plate 4. Two first slide bars 12 are slidably connected to one side of the cross-moving plate 10. The lower ends of the first slide bars 12 are fixedly connected to a picking plate 13. Two limit bars 20 are fixedly connected to both ends of the lower side of the picking plate 13. A second slider 40 and multiple first sliders 38 are slidably connected to the limit bars 20. A fixed block 41 is fixedly connected to one side of the lower end of the picking plate 13. The first sliders 38, the second slider 40, and the fixed block 41 are arranged horizontally. Hard tubes 21 are fixedly connected to the lower end surfaces of the first sliders 38, the second slider 40, and the fixed block 41. Suction cups 16 are arranged at the lower ends of the hard tubes 21.
[0025] In this embodiment, as Figure 2 shown, a clamping assembly for positioning the wafer is further arranged on the cutting table 1; The clamping assembly includes multiple third cylinders 43 fixedly connected to the upper end surface of the cutting table 1. The piston ends of the third cylinders 43 are fixedly connected to positioning blocks 42.
[0026] Specifically, the wafer to be laser cut is placed between multiple positioning blocks 42. The multiple third cylinders 43 drive the positioning blocks 42 to approach the wafer and contact the edge of the wafer at the same time, so as to clamp the wafer, thereby ensuring the stability of the wafer during the laser cutting process.
[0027] In this embodiment, as Figure 4 、 Figure 5 、 Figures 9-12 shown, a first threaded rod 8 is threadedly connected to one side of the lower end of the groove plate 4. Both ends of the first threaded rod 8 are rotatably arranged on the cutting table 1. A second motor 9 is fixedly connected to one side of the upper end surface of the cutting table 1. The output end of the second motor 9 is fixedly connected to one end of the first threaded rod 8.
[0028] A fifth threaded rod 35 is threadedly connected to one end of the cross-moving plate 10. Both ends of the fifth threaded rod 35 are rotatably arranged on the groove plate 4. A first motor 7 is fixedly connected to one end of the groove plate 4. The output end of the first motor 7 is fixedly connected to one end of the fifth threaded rod 35. A first cylinder 11 is fixedly connected to one side of the upper end surface of the cross-moving plate 10. The piston end of the first cylinder 11 is fixedly connected to one side of the upper end surface of the picking plate 13.
[0029] A vacuum pump 14 is fixedly connected to one side of the upper end surface of the picking plate 13. The intake end of the vacuum pump 14 is communicated with a connecting pipe 15. The connecting pipe 15 is communicated with multiple hard tubes 21. The connecting pipe 15 is a flexible tube.
[0030] Link rods two 36 are rotatably arranged on the upper end surfaces of the fixed block 41 and the second slider 40. Link rods three 37 are rotatably arranged on the upper end surfaces of the first sliders 38. One end of the link rod two 36 is rotatably connected to one end of the link rod three 37, and the ends of adjacent link rods three 37 are rotatably connected.
[0031] One end of the second slider 40 is threadedly connected to a sixth threaded rod 39. One end of the sixth threaded rod 39 is rotatably arranged on the material taking plate 13. One side of the lower end of the material taking plate 13 is fixedly connected to a third motor 19. The output end of the third motor 19 is fixedly connected to one end of the sixth threaded rod 39.
[0032] Specifically, when the existing laser cutting machine for semiconductor wafer processing is in use, although the chips can be cut and separated from the wafer, however, during the wafer manufacturing process, the chips on the wafer are directly fabricated on the wafer through a series of technological steps and form a tight connection with the wafer substrate. Therefore, the cut and separated chips may still adhere to the wafer, and external force is required to completely separate the chips from the wafer. Since there are a large number of chips on the wafer, it is rather troublesome to remove them one by one. When the chips on the wafer are uniformly dropped by external force, the chips will be randomly stacked. Usually, the chips cut from the wafer need to be sorted, tested, and packaged subsequently. The randomly stacked chips are not conducive to the subsequent progress of these processes. Therefore, to solve the above problems, during the use of this embodiment, after the wafer is fixed, the guide rail mechanism 2 is used to drive the laser cutting head 3 to move, and the chips on the wafer are cut by adjusting the position of the laser cutting head 3 in the X, Y, and Z axis directions to obtain multiple independent and identically sized chips. The guide rail mechanism 2 and the laser cutting head 3 are both prior arts and will not be elaborated here. Then, according to the specifications of the independent chips, the third motor 19 is used to drive the sixth threaded rod 39 to rotate, so that the second slider 40 moves on the limiting rod 20. At the same time, the first slider 38 will also move under the action of the second connecting rod 36 and the third connecting rod 37, and the distances between multiple first sliders 38 change equally until the adjacent two suction cups 16 can be aligned with two adjacent independent chips. Then, the second motor 9 is used to drive the first threaded rod 8 to rotate, the first motor 7 is used to drive the fifth threaded rod 35 to rotate, and the first cylinder 11 is used to drive the material taking plate 13 to move up and down to adjust the position of the suction cup 16 in the X, Y, and Z axis directions, so that the suction cup 16 fits with a row of chips. Then, the air at the suction cup 16 is pumped away by the vacuum pump 14, and the suction cup 16 can be used to adsorb a row of chips. Then, the suction cup 16 is driven to rise, and the chips can be separated from the wafer. Then, by adjusting the orientation of the suction cup 16, the removed chips are placed at a specified position or in a collection container. The above operation is repeated until all the chips on the wafer are removed. Since the number of suction cups 16 is set to be multiple, and the distance between adjacent suction cups 16 can be adjusted to match the chip specifications, a row of chips can be uniformly removed from the wafer at one time, thus improving the material taking efficiency of the chips. Moreover, compared with the method of uniformly dropping the chips on the wafer by external force, this method can sequentially and orderly remove each row of chips and place them orderly at a specified position or in a container, which is conducive to the subsequent processes such as sorting, testing, and packaging of the cut chips.
[0033] In this embodiment, as Figure 5 and Figure 8 shown, an anti-offset material taking auxiliary component is further arranged on the material taking plate 13; The anti-offset material taking auxiliary component includes two threaded blocks 24 slidably connected to the upper end surface of the material taking plate 13. One side of the upper end of the threaded block 24 is fixedly connected with a second cylinder 17, and the piston end of the second cylinder 17 is fixedly connected with a pressure rod 18.
[0034] On both ends of one side of the upper end surface of the material taking plate 13, a bidirectional threaded rod 23 is rotatably arranged. Both sides of the bidirectional threaded rod 23 are threadedly connected to the lower ends of the threaded blocks 24. On one side of the upper end surface of the material taking plate 13, a fourth motor 22 is fixedly connected, and the output end of the fourth motor 22 is fixedly connected to one end of the bidirectional threaded rod 23.
[0035] Specifically, in the above embodiment, although the chips can be removed row by row by the suction cup 16, when the suction cup 16 drives a row of chips to rise, the chips in adjacent two rows may be offset due to friction, resulting in the chips in adjacent two rows deviating from their original positions and affecting the subsequent material taking work. Therefore, to solve the above problems, the working principle of this embodiment is as follows: After the suction cup 16 contacts a row of chips, the distance between the two threaded blocks 24 is adjusted by driving the bidirectional threaded rod 23 to rotate through the fourth motor 22, so that the pressure rod 18 is aligned with the chips in adjacent two rows of the chips attached to the suction cup 16. Then, the second cylinder 17 drives the pressure rod 18 to descend to press the other two rows of chips. When the suction cup 16 drives the chips to rise, the piston end of the second cylinder 17 continuously extends to always press the chips tightly until the sucked chips no longer contact the chips in adjacent two rows, thereby avoiding the situation that when the suction cup 16 drives a row of chips to rise, the chips in adjacent two rows are offset due to friction, resulting in the chips in adjacent two rows deviating from their original positions and affecting the subsequent material taking work.
[0036] In this embodiment, as Figure 6 , Figure 7 , Figure 13 shown, a material taking and receiving component is further arranged on the cutting table 1; The material taking and receiving assembly includes a storage box 6 fixedly connected to one side of the upper end surface of the cutting table 1, a slide plate 5 is slidably connected to one side of the upper end surface of the cutting table 1, two ends of one side of the slide plate 5 are fixedly connected to a slide rod 29, the slide rod 29 is slidably connected to an adjusting block 30, and one side of the adjusting block 30 is slidably connected to two auxiliary plates 25, the auxiliary plates 25 can be extended into the storage box 6, and the two sides of the auxiliary plates 25 are in contact with the two sides of the inner cavity of the storage box 6, one side of the lower end of the slide plate 5 is threadedly connected to a threaded rod 3 28, both ends of the threaded rod 3 28 are rotatably arranged on the cutting table 1, one side of the upper end surface of the cutting table 1 is fixedly connected to a motor 5 27, and the output end of the motor 5 27 is connected to the threaded rod One end of the third plate 28 is fixedly connected, one side of the adjusting block 30 is threadedly connected with the threaded rod 26, both ends of the threaded rod 26 are rotatably set on the slide plate 5, one side of the upper end surface of the slide plate 5 is fixedly connected with a motor 7 44, and the output end of the motor 7 44 is fixedly connected to one end of the threaded rod 26, one side of the upper end of the auxiliary plate 25 is rotatably set with a connecting rod 1 34, one end of the connecting rod 1 34 is rotatably set with a connecting block 33, one side of the connecting block 33 is threadedly connected with a threaded rod 4 32, both ends of the threaded rod 4 32 are rotatably set on the adjusting block 30, one side of the adjusting block 30 is fixedly connected with a motor 6 31, and the output end of the motor 6 31 is fixedly connected to one end of the threaded rod 4 32.
[0037] Specifically, in the above embodiment, although the chip can be placed in a designated position or container by the chip taking mechanism, in order to facilitate the taking of the taken chips, the chips need to be stacked regularly. When the chips are placed in the container, the chips are easily overturned due to stacking, resulting in the chips being scattered, which is not conducive to the subsequent taking of the chips. Therefore, in order to avoid the above problem, the working principle of this embodiment is as follows: The storage box 6 is used to place the chips taken out by the chip taking mechanism, and according to the chip specifications, the motor 6 31 drives the threaded rod 4 32 to rotate so that the connecting block 33 moves horizontally, and the two auxiliary plates 25 are moved in different directions at the same time under the action of the two connecting rods 1 34, that is, the spacing between the two auxiliary plates 25 is adjusted so that when the chip is placed between the two auxiliary plates 25, the two sides of the chip can fit with the end surfaces of the two auxiliary plates 25 that are close to each other. When the chip is placed in the storage box 6 by the suction cup 16, the chip is arranged between the two auxiliary plates 25. Since a row of chips is resisted by the auxiliary plates 25 and the inner wall of the storage box 6, the chips will not deviate. Then the auxiliary plates 2 The chips between the two auxiliary plates 25 are continuously stacked until the gap between the two auxiliary plates 25 is filled, and then the two auxiliary plates 25 are driven to rise by the motor 7 44 driving the threaded rod 26 to rotate. At the same time, the auxiliary plate 25 is moved horizontally under the action of the motor 5 27 driving the threaded rod 3 28 to rotate, so as to adjust the positions of the two auxiliary plates 25. The above operation is repeated to place the chips in various positions in the receiving box 6 in an orderly manner. In addition, during the chip placement process, the chips will be resisted by the auxiliary plate 25, the inner wall of the receiving box 6, and the adjacent chips, and will not fall over until the chips fill the entire receiving box 6. At this time, the chips in the receiving box 6 are neat and orderly, which is conducive to the subsequent use of the chips.
[0038] Working principle: Place the wafer to be laser cut between multiple positioning blocks 42. Multiple cylinders three 43 drive the positioning blocks 42 to approach the wafer and contact the wafer edge simultaneously, clamping the wafer, thus ensuring the stability of the wafer during laser cutting. After the wafer is fixed, use the guide rail mechanism 2 to drive the laser cutting head 3 to move. By adjusting the position of the laser cutting head 3 in the X, Y, and Z axis directions, cut the chips on the wafer to obtain multiple independent and identically sized chips. The guide rail mechanism 2 and the laser cutting head 3 are both existing technologies and will not be elaborated here. Then, according to the specifications of the independent chips, use the motor three 19 to drive the screw rod six 39 to rotate, causing the slider two 40 to move on the limit rod 20. At the same time, the slider one 38 will also move under the action of the connecting rod two 36 and the connecting rod three 37, and the distance between multiple sliders one 38 changes equally until the adjacent two suction cups 16 can align with the adjacent two independent chips. Then, by driving the screw rod one 8 to rotate with the motor two 9, driving the screw rod five 35 to rotate with the motor one 7, and driving the material taking plate 13 to lift with the cylinder one 11, adjust the position of the suction cup 16 in the X, Y, and Z axis directions to make the suction cup 16 fit with a row of chips. Then, use the vacuum pump 14 to pump out the air at the suction cup 16, and the suction cup 16 can adsorb a row of chips. Then, drive the suction cup 16 to rise, and the chips can be separated from the wafer. Then, by adjusting the orientation of the suction cup 16, place the removed chips at the designated position or in the collection container. Repeat the above operations until all the chips on the wafer are removed. Since the number of suction cups 16 is set to multiple, and the spacing between adjacent suction cups 16 can be adjusted to match the chip specifications, a row of chips can be uniformly removed from the wafer at one time, thus improving the chip material taking efficiency. Moreover, compared with the method of making the chips on the wafer fall uniformly by external force, this method can remove each row of chips in sequence and place them in the designated position or container in an orderly manner, which is conducive to subsequent sorting, testing, packaging and other processes of the cut chips. When the suction cup 16 contacts a row of chips, drive the bidirectional screw rod 23 to rotate with the motor four 22 to adjust the spacing between the two threaded blocks 24, so that the pressure rod 18 aligns with the adjacent two rows of chips of the chips that fit with the suction cup 16. Then, drive the pressure rod 18 to descend with the cylinder two 17 to press the other two rows of chips. When the suction cup 16 drives the chips to rise, the piston end of the cylinder two 17 continuously extends to always press the chips tightly until the sucked chips no longer contact the adjacent two rows of chips, thus avoiding the situation that when the suction cup 16 drives a row of chips to rise, the adjacent two rows of chips are offset due to friction, resulting in the adjacent two rows of chips deviating from their original positions and affecting the subsequent material taking work. The accommodation box 6 is used to place the chips removed by the chip material taking mechanism. Moreover, according to the specifications of the chips, drive the screw rod four 32 to rotate with the motor six 31 to make the connecting block 33 move horizontally. Under the action of the two connecting rods one 34, make the two auxiliary plates 25 move simultaneously in different directions, that is, adjust the spacing between the two auxiliary plates 25.When the chip is placed between the two auxiliary plates 25, the two sides of the chip can be attached to the end faces of the two auxiliary plates 25 that are close to each other. When the chip is placed in the receiving box 6 by the suction cup 16, the chips are arranged between the two auxiliary plates 25. Since the chips in a row are resisted by the auxiliary plates 25 and the inner cavity wall of the receiving box 6, the chips will not shift. Then, the chips between the auxiliary plates 25 are continuously stacked until the gap between the two auxiliary plates 25 is filled. Then, the motor seven 44 drives the rotation of the threaded rod two 26 to drive the two auxiliary plates 25 to rise. At the same time, under the action of the motor five 27 driving the rotation of the threaded rod three 28, the auxiliary plates 25 are translated, so as to adjust the positions of the two auxiliary plates 25. By repeating the above operations, the chips can be orderly placed at various positions in the receiving box 6. Moreover, during the chip placement process, the chips are resisted by the auxiliary plates 25, the inner wall of the receiving box 6, and the adjacent chips, and will not fall over until the receiving box 6 is filled with chips. At this time, the chips in the receiving box 6 are neat and orderly, which is conducive to the subsequent access to the chips.
[0039] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and the descriptions in the specification only illustrate the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.
Claims
1. A laser cutting device for semiconductor materials, comprising a cutting table (1), characterized in that: On one side of the upper end surface of the cutting table (1), a guide rail mechanism (2) is provided, and a laser cutting head (3) is arranged on the guide rail mechanism (2). A chip picking mechanism is also arranged on the cutting table (1). The chip picking mechanism includes a groove plate (4) slidably connected to one side of the upper end surface of the cutting table (1). A transverse moving plate (10) is slidably connected to the chute of the groove plate (4). Two first slide rods (12) are slidably connected to one side of the transverse moving plate (10). A picking plate (13) is fixedly connected to the lower ends of the first slide rods (12). Two limit rods (20) are fixedly connected to both ends of the lower side of the picking plate (13). A second slider (40) and a plurality of first sliders (38) are slidably connected to the limit rods (20). A fixed block (41) is fixedly connected to one side of the lower end of the picking plate (13). The first sliders (38), the second slider (40), and the fixed block (41) are arranged horizontally. Hard tubes (21) are fixedly connected to the lower end surfaces of the first sliders (38), the second slider (40), and the fixed block (41). Suction cups (16) are arranged at the lower ends of the hard tubes (21).
2. The laser cutting device for semiconductor materials according to claim 1, characterized in that: A clamping assembly for positioning the wafer is also arranged on the cutting table (1). The clamping assembly includes a plurality of third cylinders (43) fixedly connected to the upper end surface of the cutting table (1). A positioning block (42) is fixedly connected to the piston ends of the third cylinders (43).
3. The laser cutting device for semiconductor materials according to claim 1, characterized in that: One side of the lower end of the groove plate (4) is threadedly connected with a first threaded rod (8). Both ends of the first threaded rod (8) are rotatably arranged on the cutting table (1). A second motor (9) is fixedly connected to one side of the upper end surface of the cutting table (1). The output end of the second motor (9) is fixedly connected to one end of the first threaded rod (8).
4. A laser cutting device for semiconductor materials according to claim 1, characterized in that: One end of the transverse moving plate (10) is threadedly connected with a fifth threaded rod (35). Both ends of the fifth threaded rod (35) are rotatably arranged on the groove plate (4). A first motor (7) is fixedly connected to one end of the groove plate (4). The output end of the first motor (7) is fixedly connected to one end of the fifth threaded rod (35). A first cylinder (11) is fixedly connected to one side of the upper end surface of the transverse moving plate (10). The piston end of the first cylinder (11) is fixedly connected to one side of the upper end surface of the picking plate (13).
5. A laser cutting device for semiconductor materials according to claim 1, characterized in that: A vacuum pump (14) is fixedly connected to one side of the upper end surface of the picking plate (13). The air inlet end of the vacuum pump (14) is communicated with a connecting pipe (15). The connecting pipe (15) is communicated with a plurality of hard tubes (21). The connecting pipe (15) is a flexible tube.
6. A laser cutting device for semiconductor materials according to claim 1, characterized in that: Second connecting rods (36) are rotatably arranged on the upper end surfaces of the fixed block (41) and the second slider (40). A third connecting rod (37) is rotatably arranged on the upper end surface of the first slider (38). One end of the second connecting rod (36) is rotatably connected to one end of the third connecting rod (37), and the ends of adjacent third connecting rods (37) are rotatably connected.
7. A laser cutting device for semiconductor materials according to claim 6, characterized in that: One end of the second slider (40) is threadedly connected with a sixth threaded rod (39). One end of the sixth threaded rod (39) is rotatably arranged on the picking plate (13). A third motor (19) is fixedly connected to one side of the lower end of the picking plate (13). The output end of the third motor (19) is fixedly connected to one end of the sixth threaded rod (39).
8. A laser cutting device for semiconductor materials according to claim 1, characterized in that: An anti-offset material taking auxiliary component is further arranged on the material taking plate (13); The anti-offset material taking auxiliary component includes two threaded blocks (24) slidably connected to the upper end surface of the material taking plate (13). One side of the upper end of the threaded block (24) is fixedly connected with a second cylinder (17), and the piston end of the second cylinder (17) is fixedly connected with a pressing rod (18).
9. A laser cutting device for semiconductor materials according to claim 8, characterized in that: On both ends of one side of the upper end surface of the material taking plate (13), a bidirectional threaded rod (23) is rotatably arranged. Both sides of the bidirectional threaded rod (23) are threadedly connected to the lower ends of the threaded blocks (24). On one side of the upper end surface of the material taking plate (13), a fourth motor (22) is fixedly connected. The output end of the fourth motor (22) is fixedly connected to one end of the bidirectional threaded rod (23).
10. A laser cutting device for semiconductor materials according to claim 1, characterized in that: A material taking and receiving component is further arranged on the cutting table (1); The material taking and receiving component includes a receiving box (6) fixedly connected to one side of the upper end surface of the cutting table (1). A sliding plate (5) is slidably connected to one side of the upper end surface of the cutting table (1). Both ends of one side of the sliding plate (5) are fixedly connected with second sliding rods (29). The second sliding rods (29) are slidably connected with adjusting blocks (30). Two auxiliary plates (25) are slidably connected to one side of the adjusting block (30). The auxiliary plates (25) can extend into the receiving box (6), and both sides of the auxiliary plates (25) are in contact with both sides of the inner cavity of the receiving box (6). One side of the lower end of the sliding plate (5) is threadedly connected with a third threaded rod (28). Both ends of the third threaded rod (28) are rotatably arranged on the cutting table (1). On one side of the upper end surface of the cutting table (1), a fifth motor (27) is fixedly connected. The output end of the fifth motor (27) is fixedly connected to one end of the third threaded rod (28). One side of the adjusting block (30) is threadedly connected with a second threaded rod (26). Both ends of the second threaded rod (26) are rotatably arranged on the sliding plate (5). On one side of the upper end surface of the sliding plate (5), a seventh motor (44) is fixedly connected. The output end of the seventh motor (44) is fixedly connected to one end of the second threaded rod (26). One side of the upper end of the auxiliary plate (25) is rotatably arranged with a first connecting rod (34). One end of the first connecting rod (34) is rotatably arranged with a connecting block (33). One side of the connecting block (33) is threadedly connected with a fourth threaded rod (32). Both ends of the fourth threaded rod (32) are rotatably arranged on the adjusting block (30). One side of the adjusting block (30) is fixedly connected with a sixth motor (31). The output end of the sixth motor (31) is fixedly connected to one end of the fourth threaded rod (32).