Machining System for Special-shaped Hole and Machining Method for Special-shaped Hole

Abstract

The present invention discloses a processing system for special-shaped holes and a processing method for special-shaped holes. The processing method for special-shaped holes includes: using a quasi-continuous laser to process a prefabricated hole on a processing target; using an ultrafast laser to scan and process the prefabricated hole in a layer-by-layer scanning and removing manner to process the prefabricated hole into a special-shaped hole; using any one of ultrasonic-assisted mechanical tool cutting, ultrasonic-assisted electric discharge machining, and electro-hydraulic beam machining to perform precision finishing on the straight circular section of the special-shaped hole to eliminate the taper. The processing system for special-shaped holes and the processing method for special-shaped holes provided by the embodiments of the present invention can realize the processing of complex special-shaped holes, and at the same time avoid the problems of taper generation and wall damage.

Description

Technical Field

[0001] The present invention particularly relates to a processing system and a processing method for special-shaped holes, belonging to the technical field of intelligent manufacturing industry. Background Art

[0002] Film cooling technology has been widely applied to hot-end components such as aero-engine combustion chambers and turbine blades. It is necessary to process a group of hole arrays of straight round holes or special-shaped holes with a large number, a large depth-diameter ratio, and a large inclination angle on the wall surfaces of material components such as single-crystal superalloys with high generations, high-temperature alloys with thermal barrier coatings, and ceramic matrix composites.

[0003] With the development of laser technology, the emergence of high-power, high-beam-quality short-pulse lasers and ultrafast lasers, due to their extremely short action time and extremely high light intensity density, can greatly reduce the thermal damage and mechanical damage during the material processing process, and greatly improve the laser processing quality. They have been widely used in the precision micro-hole processing of various materials. However, limited by conditions such as small single-pulse energy (0.1 - 2 mJ) and low average power (40 - 100 W), there are still problems of low efficiency when short-pulse lasers and ultrafast lasers are used to process large-depth holes, and it is difficult to meet the requirements of high-speed hole making in engineering applications.

[0004] With the rise of high-power fiber lasers, the application of long-pulse laser drilling technology in high-speed drilling has gradually increased. The continuous laser or quasi-continuous laser is modulated to be used with a pulse width in the millisecond and microsecond levels. Its average power is as high as 500 - 15000 W, and the single-pulse energy can reach dozens of joules. Therefore, it can remove materials at high speed to complete drilling. However, long-pulse laser processing has obvious thermal effects. During the rapid cooling process of the molten material, a remelting layer or even microcracks will inevitably be formed, making it difficult to meet the high surface integrity processing requirements of deep holes. At the same time, due to the low processing resolution, long-pulse lasers are difficult to meet the processing requirements of three-dimensional fine structures such as complex special-shaped holes.

[0005] In addition, since the energy of the laser spot is not evenly distributed but shows a Gaussian distribution with high in the middle and low at the edges, combined with the characteristic that the laser beam is processed from large to small at the focus, there is generally a taper in the laser machining of straight round holes; when the laser processes a hole in the upper wall of a multi-layer wall structure, due to the high overlap rate of the laser beam spot at the center of the hole, the heat accumulates quickly, resulting in a much higher material removal rate at the center than at the edge, causing the hole to be drilled through from the center first and the taper of the hole to be large. To reduce the taper, it is also necessary to extend the laser machining time to trim the hole. During this period of hole trimming, the laser beam will pass through the cavity and directly irradiate the inner surface of the opposite wall, thereby continuing to machine the opposite wall or causing thermal damage to its material. Therefore, the laser machining technology needs to solve the contradiction between machining efficiency and machining quality, and also needs to solve the following three problems: the laser spiral scanning cannot machine complex shaped holes; there is a taper in the laser machining of straight round holes with a large depth-to-diameter ratio by combining the laser with a scanning galvanometer; there is also damage to the opposite wall in the laser machining of multi-layer wall structures. As follows Figure 1 shown

[0006] For example, CN101332559A discloses a laser composite machining and shaping method for micro-deep holes without recast layer. First, a high-power laser or electric discharge machining is used to rough machine the micro-deep cooling holes of the turbine blade, and then the femtosecond laser spiral drilling machining method is used to perform secondary finishing and shaping on the micro-deep cooling holes. However, it is difficult to machine complex shaped holes by the femtosecond laser in a spiral feed manner for secondary finishing and shaping of the micro-deep cooling holes, and it is also difficult to avoid the problem of damage to the opposite wall in femtosecond laser machining. CN112171184A discloses a composite machining method and device for blade film holes. This method uses laser heating-assisted drilling to quickly drill the required size film holes on the substrate; secondly, the high-speed rotating drill bit is used as the cathode and the blade is used as the anode, and the drill bit moves up and down to perform on-line electrolytic post-treatment on some of the film holes of the metal substrate to eliminate defects such as residual stress and heat-affected zone during the drilling process and produce a grinding and polishing effect, but this method is also difficult to machine complex shaped holes. The above problems greatly limit the practical application of lasers in the machining of film holes in aero-engines. Summary of the Invention

[0007] The main object of the present invention is to provide a machining system and a machining method for shaped holes, so as to overcome the deficiencies in the prior art.

[0008] To achieve the foregoing invention object, the technical solutions adopted by the present invention include:

[0009] A first aspect of an embodiment of the present invention provides a machining system for shaped holes, which includes:

[0010] A first machining module, at least used to provide quasi-continuous laser and machine a pre-hole on a machining target with the quasi-continuous laser;

[0011] A second processing module, at least for providing an ultrafast laser and forming a required special-shaped hole by machining the pre-hole with the ultrafast laser;

[0012] A third processing module, at least for finishing and processing the straight circular section of the special-shaped hole and eliminating the taper by any one of ultrasonic-assisted mechanical tool cutting, ultrasonic-assisted electric discharge ablation, and electro-hydraulic beam erosion;

[0013] A control module, connected to the first processing module, the second processing module, and the third processing module, and used for regulating the working states and working parameters of the first processing module, the second processing module, and the third processing module.

[0014] In a more specific implementation, the first processing module includes a quasi-continuous laser and a first laser processing head. The quasi-continuous laser is connected to the first laser processing head via an optical fiber, and the quasi-continuous laser provided by the quasi-continuous laser is irradiated onto the processing target through the first laser processing head;

[0015] The second processing module includes an ultrafast laser, a light guiding component, and a second laser processing head. The ultrafast laser provided by the ultrafast laser is guided into the second laser processing head through the light guiding component and irradiated onto the processing target through the second laser processing head;

[0016] The third processing module includes a third processing head, and the third processing head includes at least one of an ultrasonic-assisted mechanical tool processing head, an ultrasonic-assisted electric discharge processing head, and an electro-hydraulic beam processing head.

[0017] Furthermore, the first laser processing head includes a fiber optic coupling component, a beam adjustment component, a convex lens focusing component, and a focusing adjustment component. The fiber optic coupling component, the beam adjustment component, and the convex lens focusing component are sequentially arranged on the same optical path. The focusing adjustment component is connected to the convex lens focusing component and is used for adjusting the position and / or attitude of the convex lens focusing component on the optical path.

[0018] Furthermore, the second laser processing head includes a scanning galvanometer and a field lens. The scanning galvanometer and the field lens are sequentially arranged on the same optical path. The scanning galvanometer is used for controlling the beam path of the laser beam entering the second laser processing head through the light guiding component, and the field lens is used for focusing the laser beam passing through the scanning galvanometer.

[0019] Furthermore, the scanning galvanometer includes a two-axis scanning galvanometer, a three-axis scanning galvanometer, or a five-axis scanning galvanometer.

[0020] In a more specific embodiment, the processing system for the special-shaped hole further includes: a purging module, the purging module includes a gas source, a first blowing nozzle and / or a second blowing nozzle, the gas source is controllably communicated with the first blowing nozzle and the second blowing nozzle, the first blowing nozzle is fixedly arranged on the first laser processing head, the second blowing nozzle is fixedly arranged on the second laser processing head, the purging module is at least used for purging the processing area with gas during the processing of the processing target by the first processing module and / or the second processing module, and, the control module is further connected to the purging module, and the control module is further used for regulating the working state and working parameters of the purging module.

[0021] Further, the central axis of the first blowing nozzle is coaxially arranged with the optical axis of the first laser processing head.

[0022] Further, the central axis of the second blowing nozzle is coaxially arranged with the optical axis of the second laser processing head.

[0023] In a more specific embodiment, the processing system for the special-shaped hole further includes: a cutting fluid spraying module, the cutting fluid spraying module includes a cutting fluid supply mechanism and a cutting fluid nozzle, the cutting fluid supply mechanism is controllably communicated with the cutting fluid nozzle, the cutting fluid nozzle is fixedly arranged on the third processing head, the cutting fluid spraying module is at least used for spraying cutting fluid onto the processing area during the processing of the processing target by the third processing module, and, the control module is further connected to the cutting fluid spraying module, and the control module is further used for regulating the working state and working parameters of the cutting fluid spraying module.

[0024] In a more specific embodiment, the processing system for the special-shaped hole further includes: a motion module, the first laser processing head, the second laser processing head, and the third processing head are assembled on the motion module, the motion module is used for carrying the processing target and making the processing target move relative to the first laser processing head, the second laser processing head, and the third processing head, the relative motion includes linear motion along at least one of the x-axis, y-axis, and z-axis of a three-dimensional coordinate system and / or rotational motion around at least one of the a-axis and c-axis, and, the control module is further connected to the motion module, and the control module is further used for regulating the working state and working parameters of the motion module.

[0025] Further, the motion module includes an x-axis linear motion module, a y-axis linear motion module, a first z-axis linear motion module, a second z-axis linear motion module, a third z-axis linear motion module, an a-axis rotational motion module, and a c-axis rotational motion module.

[0026] The linear guide rails of the first z-axis linear motion module, the second z-axis linear motion module, and the third z-axis linear motion module are fixedly arranged on the slider of the x-axis linear motion module. The first laser processing head is fixedly arranged on the slider of the first z-axis linear motion module. The second laser processing head is fixedly arranged on the slider of the second z-axis linear motion module. The third processing head is fixedly arranged on the slider of the third z-axis linear motion module;

[0027] The c-axis rotational motion module is arranged on the a-axis rotational motion module. The a-axis rotational motion module is arranged on the slider of the y-axis linear motion module. The carrier table for carrying the processing target is arranged on the c-axis rotational motion module.

[0028] Further, the linear guide rails of the first z-axis linear motion module, the second z-axis linear motion module, and the third z-axis linear motion module are fixedly arranged on an adapter block, and the adapter block is fixedly arranged on the slider of the x-axis linear motion module.

[0029] In a more specific implementation, the processing system for the special-shaped hole further includes: an on-line detection module. The on-line detection module includes a first CCD camera, a second CCD camera, and a third CCD camera. The first CCD camera, the second CCD camera, and the third CCD camera are respectively arranged on the sliders of the first z-axis linear motion module, the second z-axis linear motion module, and the third z-axis linear motion module. And, the control module is further connected to the on-line detection module, and the control module is further used to regulate the working state and working parameters of the on-line detection module.

[0030] The second aspect of the embodiments of the present invention provides a method for processing a special-shaped hole, which includes:

[0031] A prefabricated hole with a diameter slightly smaller than the diameter of the target hole is formed on the processing target by pulse overlap impact or scanning processing using a quasi-continuous laser. The frequency of the quasi-continuous laser is 1 - 5000 Hz, and the pulse width is 5 microseconds - 50 milliseconds. The prefabricated hole is scanned and processed by an ultrafast laser in a layer-by-layer scanning and removing manner to process the prefabricated hole into a special-shaped hole. The spot overlap rate of the ultrafast laser scanning processing is 20% - 95%. The straight circular section of the special-shaped hole is finely processed by any one of ultrasonic-assisted mechanical tool cutting processing, ultrasonic-assisted electric discharge machining, and electro-hydraulic beam machining to eliminate the taper. Further, the prefabricated hole is a through hole or a blind hole.

[0032] Further, the method for processing the special-shaped hole is implemented based on the processing system for the special-shaped hole.

[0033] Further, the diameter of the ultrasonic-assisted mechanical tool is at least 0.3 mm, and the diameter of the electrode used in the ultrasonic-assisted electrical discharge machining and electro-hydraulic beam machining is at least 0.3 mm.

[0034] Compared with the prior art, the advantages of the present invention include: A processing system and method for special-shaped holes provided by the embodiments of the present invention can realize the processing of complex special-shaped holes, avoid the problems of taper and wall damage, and the present invention also overcomes the problems of low processing efficiency, insufficient depth ability, difficulty in processing special-shaped holes, and the existence of taper in holes in the prior art laser processing technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0036] Figure 1 is a schematic diagram of the principle of processing complex special-shaped holes in the prior art;

[0037] Figure 2 is a schematic structural diagram of a composite processing device for punching special-shaped holes provided in a typical embodiment of the present invention;

[0038] Figure 3 is a schematic top view of the arrangement of three processing heads of a composite processing device for punching special-shaped holes provided in a typical embodiment of the present invention;

[0039] Figure 4 Another schematic top view of the arrangement of three processing heads of a composite processing device for punching special-shaped holes provided in a typical embodiment of the present invention;

[0040] Figure 5 is a flowchart of a composite processing method for punching special-shaped holes provided in a typical embodiment of the present invention;

[0041] Figure 6 、 Figure 7 are respectively the cross-sectional view and three-dimensional morphology diagram of the complex special-shaped hole obtained in Embodiment 1 of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0042] In view of the deficiencies in the prior art, the inventors of this case have proposed the technical solution of the present invention through long-term research and a large number of practices. The following will further explain the technical solution, its implementation process, principle, etc.

[0043] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0044] In the present invention, unless otherwise clearly defined and limited, terms such as "installation", "connection", "connection", "fixation" and the like shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0045] Embodiment 1

[0046] Please refer to FIG. 2. A composite machining system for machining special-shaped holes (i.e., a machining system for special-shaped holes) includes a control module 1, a first machining module, a second machining module, a third machining module, a motion module, an on-line detection module and an equipment frame. The motion module is assembled on the equipment frame.

[0047] The first machining module includes a quasi-continuous (fiber) laser 2 and a first laser machining head 31. The quasi-continuous (fiber) laser 2 is connected to the first laser machining head 31 through an optical fiber 23. The quasi-continuous laser emitted / provided by the quasi-continuous (fiber) laser 2 is input into the first laser machining head 31 through the optical fiber 23. The second machining module includes an ultrafast laser 3 and a second laser machining head 41. The ultrafast laser emitted / provided by the ultrafast laser 3 is input into the second laser machining head 41 through a light guiding component. The third machining module includes a third machining head 51. The first laser machining head 31, the second laser machining head 41, and the third machining head 51 are assembled on the motion module.

[0048] The on-line detection module includes a No. 1 CCD camera (i.e., the aforementioned first CCD camera) 34, a No. 2 CCD camera (i.e., the aforementioned second CCD camera) 44, and a No. 3 CCD camera (i.e., the aforementioned third CCD camera) 54. The No. 1 CCD camera 34, the No. 2 CCD camera 44, and the No. 3 CCD camera 54 are assembled on the motion module. The No. 1 CCD camera 34, the No. 2 CCD camera 44, and the No. 3 CCD camera 54 respectively correspond to the first laser machining head 31, the second laser machining head 41, and the third machining head 51 one by one and move synchronously.

[0049] The control module 1 is respectively connected to the quasi-continuous laser 2, the ultrafast laser 3, the first laser processing head 31, the second laser processing head 41, the third processing head 51, the motion module, the 1st CCD camera 34, the 2nd CCD camera 44, and the 3rd CCD camera 54, and regulates the working states and working parameters of the quasi-continuous laser 2, the ultrafast laser 3, the first laser processing head 31, the second laser processing head 41, the third processing head 51, the motion module, the 1st CCD camera 34, the 2nd CCD camera 44, and the 3rd CCD camera 54, etc.

[0050] In this embodiment, please refer to Figure 2 、 Figure 3 and Figure 4 simultaneously. The motion module includes an x-axis linear motion module 14, a y-axis linear motion module 15, a z1-axis linear motion module (i.e., the aforementioned first z-axis linear motion module, the same below) 11, a z2-axis linear motion module (i.e., the aforementioned second z-axis linear motion module, the same below) 12, a z3-axis linear motion module (i.e., the aforementioned third z-axis linear motion module, the same below) 13, an a-axis rotational motion module 16, and a c-axis rotational motion module 17. Among them, the a-axis rotational motion module 16 and the c-axis rotational motion module 17 form a swing table and are fixed on the slider of the y-axis linear motion module 15. The guide rails of the z1-axis linear motion module 11, the z2-axis linear motion module 12, and the z3-axis linear motion module 13 are spaced apart and fixed in parallel on the slider of the x-axis linear motion module 14. The first laser processing head 31, the second laser processing head 41, and the third processing head 51 are respectively fixed on the z1 slider 33 of the z1-axis linear motion module 11, the z2 slider 43 of the z2-axis linear motion module 12, and the z3 slider 53 of the z3-axis linear motion module 13. The processing target is set on the swing table formed by the a-axis rotational motion module 16 and the c-axis rotational motion module 17. The processing target can rotate around the a-axis, rotate around the c-axis, and move along the y-axis, so that the first laser processing head 31, the second laser processing head 41, and the third processing head 51 respectively move up and down along the z1-axis, z2-axis, and z3-axis, and synchronously translate along the x-axis.

[0051] In this embodiment, the guide rails of the z1-axis linear motion module 11, the z2-axis linear motion module 12, and the z3-axis linear motion module 13 are fixedly assembled on the adapter block 61 at intervals along the x-axis direction. The adapter block 61 is fixed on the slider of the x-axis linear motion module 14. Among them, the adapter block 61 can be a cuboid structure or a special-shaped structure, etc. The adapter block 61 in this embodiment is preferably as Figure 2The special-shaped structure shown is such that the centers of the first laser processing head 31, the second laser processing head 41, and the third processing head 51 are close to each other, occupying less travel of the x-axis. Specifically, the first laser processing head 31 is fixedly assembled on the first adapter plate 32, and the first adapter plate 32 is fixedly assembled on the z1 slider 33 of the z1-axis linear motion module 11. The second laser processing head 41 is fixedly assembled on the second adapter plate 42, and the second adapter plate 42 is fixedly assembled on the z2 slider 43 of the z2-axis linear motion module 12. The third processing head 51 is fixedly assembled on the third adapter plate 52, and the third adapter plate 52 is fixedly assembled on the z3 slider 53 of the z3-axis linear motion module 13. Specifically, the No. 1 CCD camera 34 is fixedly assembled on the first adapter plate 32, the No. 2 CCD camera 44 is fixedly assembled on the second adapter plate 42, and the No. 3 CCD camera 54 is fixedly assembled on the third adapter plate 52.

[0052] In this embodiment, the control module 1 is connected to the x-axis linear motion module 14, the y-axis linear motion module 15, the z1-axis linear motion module 11, the z2-axis linear motion module 12, the z3-axis linear motion module 13, the a-axis rotational motion module 16, and the c-axis rotational motion module 17, and can respectively regulate the working states and working parameters of the x-axis linear motion module 14, the y-axis linear motion module 15, the z1-axis linear motion module 11, the z2-axis linear motion module 12, the z3-axis linear motion module 13, the a-axis rotational motion module 16, and the c-axis rotational motion module 17.

[0053] In this embodiment, the first laser processing head 31 includes a fiber optic coupling component, a beam adjustment component, a convex lens focusing component, and a focusing adjustment component. The fiber optic coupling component, the beam adjustment component, and the convex lens focusing component are sequentially arranged on the same optical path. The focusing adjustment component is connected to the convex lens focusing component and is used to adjust the position and / or attitude of the convex lens focusing component on the optical path. Specifically, the second laser processing head includes a scanning galvanometer and a field lens. The scanning galvanometer and the field lens are sequentially arranged on the same optical path. The scanning galvanometer is used to control the beam path of the second laser processing head entering through the light guiding component, and the field lens is used to focus the laser beam passing through the scanning galvanometer. Among them, the scanning galvanometer includes a two-axis scanning galvanometer, a three-axis scanning galvanometer, or a five-axis scanning galvanometer. Specifically, the light guiding component includes a first reflector 21 and a second reflector 22 arranged in sequence. It should be noted that both the first laser processing head and the second laser processing head can be known in the art and can be obtained through commercial purchase. In this embodiment, the third processing head is an ultrasonic-assisted mechanical tool processing head. It should be noted that this ultrasonic-assisted mechanical tool processing head can be known in the art and can be obtained through commercial purchase, and its specific structure, etc. are not limited herein.

[0054] In this embodiment, the composite machining system for machining special-shaped holes further includes a purging module and a cutting fluid spraying module. The purging module is at least used to purge the machining area with gas during the machining of the machining target by the first machining module and / or the second machining module. The cutting fluid spraying module is at least used to spray cutting fluid onto the machining area during the machining of the machining target by the third machining module. Moreover, the control module is also connected to the purging module and the cutting fluid spraying module, and the control module is further used to regulate the working states and working parameters of the purging module and the cutting fluid spraying module.

[0055] Specifically, the purging module includes a gas source, a first blowing nozzle, and a second blowing nozzle. The gas source is controllably connected to the first blowing nozzle and the second blowing nozzle. The first blowing nozzle is fixedly arranged on the first laser machining head, and the second blowing nozzle is fixedly arranged on the second laser machining head. More specifically, the central axis of the first blowing nozzle is coaxially arranged with the optical axis of the first laser machining head, and the central axis of the second blowing nozzle is coaxially arranged with the optical axis of the second laser machining head. The coaxially arranged blowing nozzles can effectively remove the tiny particles of the material generated by machining. Specifically, the cutting fluid spraying module includes a cutting fluid supply mechanism and a cutting fluid nozzle. The cutting fluid supply mechanism is controllably connected to the cutting fluid nozzle. The cutting fluid nozzle is fixedly arranged on the third machining head, and the cutting fluid nozzle can spray cutting fluid or coolant.

[0056] In this embodiment, the equipment frame includes a base 4, a column 5, a cross beam 6, etc. The column 5 is vertically fixed on the base 4, the cross beam 6 is fixedly arranged on the top of the column 5, the y-axis linear motion module 15 is fixedly assembled on the base 4, and the guide rail of the x-axis linear motion module 14 is fixedly assembled on the cross beam 6. It can be understood that the length of the cross beam 6 extends along the x-axis as a whole.

[0057] In this embodiment, please refer to Figure 5 , a machining method of a composite machining device for machining special-shaped holes, specifically including the following steps:

[0058] S11: Fix the workpiece on the c-axis rotary motion module 17 and control the No. 1 CCD camera 34 to determine the starting machining position of the workpiece;

[0059] S12: Control the workpiece to move from the visual field position of the No. 1 CCD camera 34 to the working position of the first laser machining head 31;

[0060] S13: Set the frequency of the quasi-continuous laser to 100 Hz, the average power to 1500 W, and the duty cycle to 10%. Use the first laser machining head 31 to quickly punch holes on the workpiece as pre-holes. The diameter of the pre-holes is about 0.4 mm, and all the pre-holes are machined according to the machining requirements;

[0061] S21: Control the No. 2 CCD camera 44 to find the starting machining position of the workpiece;

[0062] S22: Control the workpiece to move from the visual field position of the No. 2 CCD camera 44 to the working position of the second laser processing head 41;

[0063] S23: Set the frequency of the ultrafast laser to 100 kHz, the average power to 100 W, and the scanning speed to 500 mm / s. Use the second laser processing head 41 to process the pre-drilled holes on the workpiece into special-shaped holes in a layer-by-layer removal processing manner, and process all the special-shaped holes according to the processing requirements;

[0064] S31: Control the No. 3 CCD camera 54 to find the starting processing position of the workpiece;

[0065] S32: Control the workpiece to move from the visual field position of the No. 3 CCD camera 54 to the working position of the ultrasonic-assisted mechanical tool processing head;

[0066] S33: Set the ultrasonic vibration frequency to 20 kHz, the amplitude to 10 microns, and the tool diameter to 0.5 mm. Use the ultrasonic-assisted mechanical tool processing head to finish machining the straight circular section of the special-shaped hole on the workpiece to eliminate the taper, and finally obtain a straight circular section hole diameter of 0.52 mm. Eliminate the taper of all holes according to the processing requirements.

[0067] The sectional view and three-dimensional topography of the complex special-shaped hole finally machined by using the composite processing device and processing method of the present invention are as Figure 6 、 Figure 7 shown.

[0068] Embodiment 2

[0069] Please refer to FIG. 2. A composite processing system for punching special-shaped holes (i.e., a processing system for special-shaped holes) includes a control module 1, a first processing module, a second processing module, a third processing module, a motion module, an on-line detection module, and an equipment frame. The motion module is assembled on the equipment frame,

[0070] The first processing module includes a quasi-continuous (fiber) laser 2 and a first laser processing head 31. The quasi-continuous (fiber) laser 2 is connected to the first laser processing head 31 through an optical fiber 23. The quasi-continuous laser emitted / provided by the quasi-continuous (fiber) laser 2 is input into the first laser processing head 31 through the optical fiber 23. The second processing module includes an ultrafast laser 3 and a second laser processing head 41. The ultrafast laser emitted / provided by the ultrafast laser 3 is input into the second laser processing head 41 through a light guiding component. The third processing module includes a third processing head 51. The first laser processing head 31, the second laser processing head 41, and the third processing head 51 are assembled on the motion module,

[0071] The on-line detection module includes a No. 1 CCD camera (i.e., the aforementioned first CCD camera) 34, a No. 2 CCD camera (i.e., the aforementioned second CCD camera) 44, and a No. 3 CCD camera (i.e., the aforementioned third CCD camera) 54. The No. 1 CCD camera 34, the No. 2 CCD camera 44, and the No. 3 CCD camera 54 are assembled on the motion module. The No. 1 CCD camera 34, the No. 2 CCD camera 44, and the No. 3 CCD camera 54 respectively correspond to and move synchronously with the first laser processing head 31, the second laser processing head 41, and the third processing head 51.

[0072] The control module 1 is respectively connected to the quasi-continuous laser 2, the ultrafast laser 3, the first laser processing head 31, the second laser processing head 41, the third processing head 51, the motion module, the No. 1 CCD camera 34, the No. 2 CCD camera 44, and the No. 3 CCD camera 54, and regulates the working states and working parameters of the quasi-continuous laser 2, the ultrafast laser 3, the first laser processing head 31, the second laser processing head 41, the third processing head 51, the motion module, the No. 1 CCD camera 34, the No. 2 CCD camera 44, and the No. 3 CCD camera 54.

[0073] In this embodiment, please refer to Figure 2 、 Figure 3 and Figure 4 [[ID=l2]]The motion module includes an x-axis linear motion module 14, a y-axis linear motion module 15, a z1-axis linear motion module (i.e., the aforementioned first z-axis linear motion module, the same below) 11, a z2-axis linear motion module (i.e., the aforementioned second z-axis linear motion module, the same below) 12, a z3-axis linear motion module (i.e., the aforementioned third z-axis linear motion module, the same below) 13, an a-axis rotational motion module 16, and a c-axis rotational motion module 17. Among them, the a-axis rotational motion module 16 and the c-axis rotational motion module 17 form a turntable and are fixed on the slider of the y-axis linear motion module 15. The guide rails of the z1-axis linear motion module 11, the z2-axis linear motion module 12, and the z3-axis linear motion module 13 are spaced apart and fixedly arranged in parallel on the slider of the x-axis linear motion module 14. The first laser processing head 31, the second laser processing head 41, and the third processing head 51 are respectively fixedly arranged on the zl slider 33 of the z1-axis linear motion module 11, the z2 slider 43 of the z2-axis linear motion module 12, and the z3 slider 53 of the z3-axis linear motion module 13. The processing target is arranged on the turntable formed by the a-axis rotational motion module 16 and the c-axis rotational motion module 17. The processing target can rotate around the a-axis, rotate around the c-axis, and move along the y-axis, so that the first laser processing head 31, the second laser processing head 41, and the third processing head 51 respectively move up and down along the z1-axis, z2-axis, and z3-axis, and synchronously translate along the x-axis.

[0074] In this embodiment, the guide rails of the z1-axis linear motion module 11, z2-axis linear motion module 12, and z3-axis linear motion module 13 are fixedly assembled on the adapter block 61 at intervals along the x-axis direction. The adapter block 61 is fixed on the slider of the x-axis linear motion module 14. Among them, the adapter block 61 can be a cuboid structure, a special-shaped structure, etc. The adapter block 61 in this embodiment is preferably a special-shaped structure as Figure 2 shown, so that the centers of the first laser processing head 31, the second laser processing head 41, and the third processing head 51 are close to each other, occupying less travel of the x-axis. Specifically, the first laser processing head 31 is fixedly assembled on the first adapter plate 32, and the first adapter plate 32 is fixedly assembled on the z1 slider 33 of the z1-axis linear motion module 11. The second laser processing head 41 is fixedly assembled on the second adapter plate 42, and the second adapter plate 42 is fixedly assembled on the z2 slider 43 of the z2-axis linear motion module 12. The third processing head 51 is fixedly assembled on the third adapter plate 52, and the third adapter plate 52 is fixedly assembled on the z3 slider 53 of the z3-axis linear motion module 13. Specifically, the No. 1 CCD camera 34 is fixedly assembled on the first adapter plate 32, the No. 2 CCD camera 44 is fixedly assembled on the second adapter plate 42, and the No. 3 CCD camera 54 is fixedly assembled on the third adapter plate 52.

[0075] In this embodiment, the control module 1 is connected to the x-axis linear motion module 14, y-axis linear motion module 15, z1-axis linear motion module 11, z2-axis linear motion module 12, z3-axis linear motion module 13, a-axis rotational motion module 16, and c-axis rotational motion module 17, and can respectively regulate the working states and working parameters of the x-axis linear motion module 14, y-axis linear motion module 15, z1-axis linear motion module 11, z2-axis linear motion module 12, z3-axis linear motion module 13, a-axis rotational motion module 16, and c-axis rotational motion module 17.

[0076] In this embodiment, the first laser processing head 31 includes a fiber optic coupling component, a beam adjustment component, a convex lens focusing component, and a focusing adjustment component. The fiber optic coupling component, the beam adjustment component, and the convex lens focusing component are sequentially arranged on the same optical path. The focusing adjustment component is connected to the convex lens focusing component and is used to adjust the position and / or attitude of the convex lens focusing component on the optical path. Specifically, the second laser processing head includes a scanning galvanometer and a field lens. The scanning galvanometer and the field lens are sequentially arranged on the same optical path. The scanning galvanometer is used to control the beam path of the second laser processing head entering through the light guiding component, and the field lens is used to focus the laser beam passing through the scanning galvanometer. Among them, the scanning galvanometer includes a two-axis scanning galvanometer, a three-axis scanning galvanometer, or a five-axis scanning galvanometer. Specifically, the light guiding component includes a first reflector 21 and a second reflector 22 arranged in sequence. It should be noted that both the first laser processing head and the second laser processing head can be known in the art and can be obtained through commercial purchase. In this embodiment, the third processing head is an ultrasonic-assisted electro-discharge machining head. It should be noted that this ultrasonic-assisted electro-discharge machining head can be known in the art and can be obtained through commercial purchase, and its specific structure, etc. will not be limited herein.

[0077] In this embodiment, the composite machining system for machining of special-shaped holes further includes a purging module and a cutting fluid spraying module. The purging module is at least used to purge the machining area with gas during the machining process of the machining target by the first machining module and / or the second machining module. The cutting fluid spraying module is at least used to spray cutting fluid onto the machining area during the machining process of the machining target by the third machining module. In addition, the control module is also connected to the purging module and the cutting fluid spraying module, and the control module is also used to regulate the working states and working parameters of the purging module and the cutting fluid spraying module.

[0078] Specifically, the purging module includes a gas source, a first blowing nozzle, and a second blowing nozzle. The gas source is controllably communicated with the first blowing nozzle and the second blowing nozzle. The first blowing nozzle is fixedly arranged on the first laser processing head, and the second blowing nozzle is fixedly arranged on the second laser processing head. More specifically, the central axis of the first blowing nozzle is coaxially arranged with the optical axis of the first laser processing head, and the central axis of the second blowing nozzle is coaxially arranged with the optical axis of the second laser processing head. The coaxially arranged blowing nozzles can effectively remove the tiny particles of the material generated during machining. Specifically, the cutting fluid spraying module includes a cutting fluid supply mechanism and a cutting fluid nozzle. The cutting fluid supply mechanism is controllably communicated with the cutting fluid nozzle. The cutting fluid nozzle is fixedly arranged on the third processing head, and the cutting fluid nozzle can spray cutting fluid or coolant.

[0079] In this embodiment, the equipment framework includes a base 4, columns 5, crossbeams 6, etc. The columns 5 are vertically fixed on the base 4, the crossbeams 6 are fixedly arranged on the tops of the columns 5, the y-axis linear motion module 15 is fixedly assembled on the base 4, and the guide rails of the x-axis linear motion module 14 are fixedly assembled on the crossbeams 6. It can be understood that the length of the crossbeam 6 extends along the x-axis as a whole.

[0080] In this embodiment, please refer to Figure 5 , a processing method of a composite processing device for punching special-shaped holes, specifically including the following steps:

[0081] S11: Fix the workpiece on the c-axis rotary motion module 17 and control the No. 1 CCD camera 34 to determine the starting processing position of the workpiece;

[0082] S12: Control the workpiece to move from the visual field position of the No. 1 CCD camera 34 to the working position of the first laser processing head 31;

[0083] S13: Use the first laser processing head 31 to quickly punch through holes or process blind holes on the workpiece as pre-holes, and process all the pre-holes according to the processing requirements;

[0084] S21: Control the No. 2 CCD camera 44 to find the starting processing position of the workpiece;

[0085] S22: Control the workpiece to move from the visual field position of the No. 2 CCD camera 44 to the working position of the second laser processing head 41;

[0086] S23: Use the second laser processing head 41 to process the pre-holes on the workpiece into special-shaped holes in a layer-by-layer removal processing manner, and process all the special-shaped holes according to the processing requirements;

[0087] S31: Control the No. 3 CCD camera 54 to find the starting processing position of the workpiece;

[0088] S32: Control the workpiece to move from the visual field position of the No. 3 CCD camera 54 to the working position of the ultrasonic-assisted electric discharge machining head;

[0089] S33: Use the ultrasonic-assisted electric discharge machining head to finish machining the straight circular section of the special-shaped hole of the workpiece to eliminate the taper, and eliminate the taper of all the holes according to the processing requirements.

[0090] It should be noted that in the present invention, the processing with the second laser processing head is carried out by layering the special-shaped hole model, and the laser removes the processing layer by layer according to the model of each layer, so the processing of complex special-shaped holes can be realized. Since laser processing is a non-contact processing, and the position far from the laser focus still has the ability to cause damage, it is difficult to control the damage to the wall. However, when the third processing head in the present invention adopts an ultrasonic-assisted mechanical tool processing head, it is a contact processing, and when it adopts an ultrasonic-assisted electric discharge machining head and an electro-hydraulic beam machining head, it is a controllable non-contact processing. Because the position far from the processing head basically has no processing ability, the third processing head used for processing straight round holes basically has no taper, and in addition, the problem of wall damage can be prevented.

[0091] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A processing system for special-shaped holes, characterized in that, Comprising: A first processing module, at least for providing quasi - continuous laser, and processing a pre - hole on a processing target with the quasi - continuous laser. The first processing module includes a quasi - continuous laser and a first laser processing head. The quasi - continuous laser is connected to the first laser processing head via an optical fiber. The quasi - continuous laser provided by the quasi - continuous laser is irradiated onto the processing target through the first laser processing head. The first laser processing head includes a fiber optic coupling component, a beam adjustment component, a convex lens focusing component, and a focusing adjustment component. The fiber optic coupling component, the beam adjustment component, and the convex lens focusing component are sequentially arranged on the same optical path. The focusing adjustment component is connected to the convex lens focusing component and is used to adjust the position and / or attitude of the convex lens focusing component on the optical path. A second processing module, at least for providing an ultrafast laser, and processing the pre - hole into a required special - shaped hole with the ultrafast laser. A third processing module, at least for performing precision repair processing on the straight - circular section of the special - shaped hole and eliminating the taper in any one of the ways of ultrasonic - assisted mechanical tool cutting, ultrasonic - assisted electric - discharge ablation, or electro - hydraulic beam erosion. A control module, connected to the first processing module, the second processing module, and the third processing module, and used to regulate the working states and working parameters of the first processing module, the second processing module, and the third processing module.

2. The processing system for a special - shaped hole according to claim 1, wherein: The second processing module includes an ultrafast laser, a light - guiding component, and a second laser processing head. The ultrafast laser provided by the ultrafast laser is guided into the second laser processing head through the light - guiding component and is irradiated onto the processing target through the second laser processing head. The third processing module includes a third processing head, and the third processing head includes at least one of an ultrasonic - assisted mechanical tool processing head, an ultrasonic - assisted electric - discharge processing head, and an electro - hydraulic beam processing head.

3. The machining system for the special-shaped hole according to claim 2, characterized in that: The second laser processing head includes a scanning galvanometer and a field lens. The scanning galvanometer and the field lens are sequentially arranged on the same optical path. The scanning galvanometer is used to control the beam path of the laser beam entering the second laser processing head through the light - guiding component, and the field lens is used to focus the laser beam passing through the scanning galvanometer.

4. The machining system for the special-shaped hole according to claim 3, characterized in that: The scanning galvanometer includes a two - axis scanning galvanometer, a three - axis scanning galvanometer, or a five - axis scanning galvanometer.

5. The machining system for the special-shaped hole according to claim 2, characterized in that, Further comprising: A purging module, the purging module includes a gas source, a first blowing nozzle and / or a second blowing nozzle. The gas source is controllably connected to the first blowing nozzle and the second blowing nozzle. The first blowing nozzle is fixedly arranged on the first laser processing head, and the second blowing nozzle is fixedly arranged on the second laser processing head. The purging module is at least used for purging the processing area with gas during the processing of the processing target by the first processing module and / or the second processing module. Moreover, the control module is also connected to the purging module, and the control module is also used to regulate the working state and working parameters of the purging module.

6. The machining system for the special-shaped hole according to claim 5, wherein: The central axis of the first blowing nozzle is coaxially arranged with the optical axis of the first laser processing head.

7. The machining system for the special-shaped hole according to claim 5, wherein: The central axis of the second air-blowing nozzle is coaxially arranged with the optical axis of the second laser processing head.

8. The machining system for the special-shaped hole according to claim 2, characterized in that, It further includes: A cutting fluid spraying module, which includes a cutting fluid supply mechanism and a cutting fluid nozzle. The cutting fluid supply mechanism is controllably connected to the cutting fluid nozzle. The cutting fluid nozzle is fixedly arranged on the third processing head. The cutting fluid spraying module is at least used to spray cutting fluid on the processing area during the processing of the processing target by the third processing module. Moreover, the control module is also connected to the cutting fluid spraying module, and the control module is also used to regulate the working state and working parameters of the cutting fluid spraying module.

9. The machining system for the special-shaped hole according to claim 2, characterized in that, It further includes: A motion module. The first laser processing head, the second laser processing head, and the third processing head are assembled on the motion module. The motion module is used to carry the processing target and make the processing target move relative to the first laser processing head, the second laser processing head, and the third processing head. The relative motion includes linear motion along at least one of the x-axis, y-axis, and z-axis of a three-dimensional coordinate system and / or rotational motion around at least one of the a-axis and c-axis. Moreover, the control module is also connected to the motion module, and the control module is also used to regulate the working state and working parameters of the motion module.

10. The machining system for the special-shaped hole according to claim 9, wherein: The motion module includes an x-axis linear motion module, a y-axis linear motion module, a first z-axis linear motion module, a second z-axis linear motion module, a third z-axis linear motion module, an a-axis rotational motion module, and a c-axis rotational motion module. The linear guide rails of the first z-axis linear motion module, the second z-axis linear motion module, and the third z-axis linear motion module are fixedly arranged on the slider of the x-axis linear motion module. The first laser processing head is fixedly arranged on the slider of the first z-axis linear motion module. The second laser processing head is fixedly arranged on the slider of the second z-axis linear motion module. The third processing head is fixedly arranged on the slider of the third z-axis linear motion module. The c-axis rotational motion module is arranged on the a-axis rotational motion module. The a-axis rotational motion module is arranged on the slider of the y-axis linear motion module. The carrier for carrying the processing target is arranged on the c-axis rotational motion module.

11. The machining system for the special-shaped hole according to claim 10, characterized in that: The linear guide rails of the first z-axis linear motion module, the second z-axis linear motion module, and the third z-axis linear motion module are fixedly arranged on an adapter block, and the adapter block is fixedly arranged on the slider of the x-axis linear motion module.

12. The processing system for the special-shaped hole according to claim 10, characterized in that, It further includes: An on-line detection module, which includes a first CCD camera, a second CCD camera, and a third CCD camera. The first CCD camera, the second CCD camera, and the third CCD camera are respectively arranged on the sliders of the first z-axis linear motion module, the second z-axis linear motion module, and the third z-axis linear motion module. Moreover, the control module is also connected to the on-line detection module, and the control module is also used to regulate the working state and working parameters of the on-line detection module.

13. A processing method for a special-shaped hole, characterized in that The processing method of the special-shaped hole is implemented based on the processing system of the special-shaped hole described in any one of claims 1-12, and the processing method of the special-shaped hole includes: A prefabricated hole with a diameter slightly smaller than the diameter of the target hole is formed on the processing target by pulse overlap impact or scanning processing using a quasi-continuous laser, the frequency of the quasi-continuous laser is 1-5000 Hz, and the pulse width is 5 microseconds - 50 milliseconds; The prefabricated hole is scanned and processed by an ultrafast laser in a layer-by-layer scanning and removing manner to process the prefabricated hole into a special-shaped hole, and the spot overlap rate of the ultrafast laser scanning processing is 20% - 95%; The straight circular section of the special-shaped hole is finely processed by any one of ultrasonic-assisted mechanical tool cutting, ultrasonic-assisted electrical discharge machining, and electro-hydraulic beam machining to eliminate the taper.

14. The machining method of the special-shaped hole according to claim 13, characterized in that: The prefabricated hole is a through hole or a blind hole.

15. The machining method of the special-shaped hole according to claim 13, characterized in that: The diameter of the ultrasonic-assisted mechanical tool is at least 0.3 mm, and the diameter of the electrode used in the ultrasonic-assisted electrical discharge machining and electro-hydraulic beam machining is at least 0.3 mm.

Images