Graphite ring surface sediment polishing equipment

Abstract

The invention discloses graphite ring surface sediment grinding equipment which comprises a grinding head device and a positioning device which are matched to achieve grinding of a graphite ring, the grinding head device is arranged on an X-axis moving device, the positioning device is arranged on a Y-axis moving device, the grinding head device comprises an alignment assembly and a grinding head assembly, and the grinding head assembly is provided with a grinding piece. The positioning device comprises a Z-axis rotating driver and an adsorption module, the adsorption module adsorbs a graphite circular ring, and the polishing piece is in alignment contact with the inner side chamfering inclined face, the inner side chamfering flat edge, the top face or the outer side chamfering inclined face of the graphite circular ring under driving of the X-axis moving device and the alignment assembly. The positioning device is driven by the Z-axis rotating driver or the Y-axis moving device to do reciprocating motion or reciprocating rotation so that the grinding piece can grind the graphite ring, then the purpose of rapidly removing loose sediments on the surface of the graphite ring accessory and stubborn sediments below a loose layer of the graphite ring is achieved, and the grinding efficiency and grinding quality of the graphite ring accessory are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of polishing surface deposits of graphite rings, and particularly to a device for polishing surface deposits of graphite rings. Background Art

[0002] Integrated circuit thin film growth technology includes various thin film growth technologies with different functions and positions, such as thermal oxidation, chemical vapor deposition, and physical vapor deposition. By this method, several layers of film layers with different materials and thicknesses are grown on the surface of a wafer, which can provide a rich variety of combined requirements for the conductivity, heat conduction, bandwidth control, etc. of integrated circuits to meet various application scenarios of integrated circuits.

[0003] In the SiC thin film epitaxial growth technology of integrated circuit chemical vapor deposition thin film growth method, the silicon carbide substrate is the base material of the wafer. During the growth and processing, it will inevitably generate defects on the surface or near the surface, resulting in a decline in the crystal material quality and surface quality of the substrate, directly affecting the performance of the fabricated device. By using the silicon carbide epitaxial growth technology, by growing one or several layers of thin film layers with neatly arranged crystal lattices on the surface of the silicon carbide substrate, the surface topography of the substrate wafer can be improved, and the newly grown semiconductor crystal layer can improve the basic performance of the semiconductor device.

[0004] Specifically, silicon carbide epitaxial growth is carried out under specific process conditions (such as high temperature and low pressure in the furnace). The silicon carbide substrate wafer is exposed to a variety of different precursors. The gaseous substances undergo chemical decomposition and chemical reactions at extremely high temperatures on the surface of the substrate and recombine to produce the solid thin film required for epitaxial growth. During the epitaxial growth process, the reactants in the gas phase are fully mixed through a high-precision gas path device and then transported to the surface of the substrate wafer and adsorbed on its surface under the condition of low pressure in the furnace to undergo chemical reactions. On the one hand, it forms the silicon carbide solid thin film required for the epitaxial growth of the substrate wafer. On the other hand, the gaseous products will also be deposited on the surface of the graphite fittings around the substrate wafer to form a silicon carbide deposition layer. The remaining gaseous substances desorb from the substrate surface and are discharged from the reaction chamber through the exhaust gas vacuum system.

[0005] Among them, silicon carbide has a very high hardness, with a Mohs hardness of 9.5, second only to the hardest diamond in the world (10). The specific gravity of silicon carbide is 3.1 g / cm3, and its sublimation temperature is relatively high (about 2700 °C). Under any achievable pressure, it will not melt and has a relatively low chemical activity.

[0006] During the epitaxial growth of silicon carbide, the graphite component provides a stable thermal field and gas flow field for the SiC growth environment. The graphite ring therein plays a role in fixing the wafer. However, while the epitaxial growth of the silicon carbide substrate wafer is taking place, a silicon carbide epitaxial layer will also be synchronously deposited on the surface of the graphite ring fitting. With the batch epitaxial growth of the wafer, the deposited material on the surface of the graphite ring fitting will gradually deposit and thicken. Due to the influence of factors such as the gas flow field, temperature field, and pressure, the deposited material on the surface of the graphite ring fitting will present an irregular curved surface effect, resulting in poor roughness and flatness of the surface of the graphite ring fitting. The adhesion of the deposited material on the surface of the graphite ring fitting will also deteriorate synchronously, easily causing quality abnormalities such as downfall, carding, and poor concentration.

[0007] The existing solution is as follows: After the batch epitaxial growth of the wafer reaches the set deposition thickness, the graphite ring fitting is periodically cleaned and maintained by manual grinding. A grinding tool made of silicon carbide material is used to remove the loose layer of deposited material on the surface of the graphite fitting to solve the hidden danger of downfall and slow down the speed at which the deposited material on the graphite ring fitting gradually thickens.

[0008] However, the existing solution is affected by the physical properties of SiC in terms of processing efficiency, quality stability, and operation standardization and does not achieve good results. By means of manual grinding operation, only the loose layer of deposited material on the surface of the graphite ring fitting can be removed, and the stubborn deposited material under the loose layer of the graphite ring cannot be removed at all. With the batch epitaxial growth of the wafer, the non-removable stubborn layer becomes uneven under the combined action of the gas flow field and the temperature distribution characteristics of the thermal field, hindering the stability of the gas flow on the wafer surface, thereby resulting in poor quality (such as concentration uniformity) of the epitaxial growth. Summary of the Invention

[0009] The object of the present invention is to provide a grinding device for the deposited material on the surface of a graphite ring, which can achieve the purpose of quickly removing the loose deposited material on the surface of the graphite ring fitting and the stubborn deposited material under the loose layer of the graphite ring, so as to improve the grinding efficiency and quality of the graphite ring fitting, realize the automated and standardized maintenance operation of the graphite ring fitting, and thus improve the quality of the epitaxial wafer growth.

[0010] To achieve the above object, the present invention discloses a grinding device for the deposited material on the surface of a graphite ring, which is used to grind the inner chamfer bevel, inner chamfer flat edge, top surface, and / or outer chamfer bevel of the graphite ring, and is characterized by comprising:

[0011] An X-axis moving device, a grinding head device arranged on the X-axis moving device, a Y-axis moving device, and a positioning device arranged on the Y-axis moving device;

[0012] The grinding head device includes an alignment component and a grinding head component disposed on the alignment component. The grinding head component is provided with a grinding member. The positioning device includes a Z-axis rotation driver and an adsorption module disposed on the Z-axis rotation driver. The adsorption module adsorbs the graphite ring;

[0013] Driven by the X-axis moving device and the alignment component, the grinding member is in alignment contact with the inner chamfered inclined surface. The Z-axis rotation driver drives the adsorption module to perform an arc-shaped reciprocating rotation, so that the grinding member grinds the inner chamfered inclined surface; and / or,

[0014] The Z-axis rotation driver drives the adsorption module to rotate, so that the grinding member is in alignment contact with the inner chamfered flat edge under the drive of the X-axis moving device and the alignment component. The Y-axis moving device drives the positioning device to reciprocate along the Y-axis, so that the grinding member grinds the inner chamfered flat edge; and / or,

[0015] Driven by the X-axis moving device and the alignment component, the grinding member is in alignment contact with the top surface. The Z-axis rotation driver drives the adsorption module to perform a circular reciprocating rotation, so that the grinding member grinds the top surface; and / or,

[0016] Driven by the X-axis moving device and the alignment component, the grinding member is in alignment contact with the outer chamfered inclined surface. The Z-axis rotation driver drives the adsorption module to perform a circular reciprocating rotation, so that the grinding member grinds the outer chamfered inclined surface.

[0017] Optionally, the alignment component includes a Y-axis rotation component and a Z-axis lifting component disposed on the Y-axis rotation component. The X-axis moving device, the Y-axis rotation component, and the Z-axis lifting component are respectively used to drive the grinding head component to move horizontally, swing, and descend, so that the grinding member is correspondingly in alignment contact with the inner chamfered inclined surface, the inner chamfered flat edge, or the outer chamfered inclined surface; and the X-axis moving device and the Z-axis lifting component are also respectively used to drive the grinding head component to move horizontally and descend, so that the grinding member is correspondingly in alignment contact with the top surface.

[0018] Optionally, the grinding head component includes an R-axis rotation component, a support frame provided with a rotary bearing, a support cylinder connected to the driving end of the R-axis rotation component, and a grinding shaft provided with the grinding member. The support cylinder is connected to the rotary bearing and is rotatably disposed on the support frame. The grinding shaft passes through the support cylinder. When the grinding member grinds the top surface, the R-axis rotation component drives the support cylinder to drive the grinding shaft to rotate, so that the grinding member rotates to grind the top surface.

[0019] Optionally, the grinding head assembly includes a support frame, a support cylinder, and a grinding shaft provided with the grinding member. The support cylinder is arranged on the support frame along the R-axis and is provided with a through activity channel. At least one first channel is provided on the inner side wall of the activity channel. At least one second channel corresponding to the first channel is provided on the outer side wall of the grinding shaft. A plurality of balls are movably arranged in the first channel and the second channel, so that the grinding shaft can be arranged to move up and down along the R-axis in the activity channel, and the support cylinder drives the grinding shaft to rotate when rotating.

[0020] Optionally, the grinding head assembly includes a support frame, a support cylinder, and a grinding shaft provided with the grinding member. The support cylinder is arranged on the support frame along the R-axis and is provided with an activity channel. The grinding shaft includes a grinding head end, a middle section shaft, and a limiting tail end arranged in sequence along the R-axis. The middle section shaft is movably arranged to pass through the activity channel along the R-axis and is sleeved with an elastic support.

[0021] When no external force acts on the grinding member, both ends of the elastic support respectively abut against the grinding head end and the front end face of the support cylinder, and the limiting tail end abuts against the rear end face of the support cylinder.

[0022] When an external force acts on the grinding member to move the grinding shaft upward along the R-axis, the grinding head end compresses the elastic support, and the limiting tail end is separated from the support cylinder.

[0023] When the external force on the grinding member no longer exists, the elastic support elastically expands to push the grinding head end to drive the grinding shaft to move downward along the R-axis until the limiting tail end abuts against the rear end face of the support cylinder.

[0024] Optionally, the grinding head assembly includes a distance detector, a support frame, a support cylinder, and a grinding shaft. The support cylinder is arranged on the support frame along the R-axis and is provided with a through activity channel. The grinding shaft is movably arranged to pass through the activity channel up and down along the R-axis. The detection end of the distance detector is provided with an elastic detection member. One end of the grinding shaft is provided with the grinding member, and the other end abuts against the elastic detection member. When the deposit on the surface of the graphite ring pushes the grinding shaft to move upward along the R-axis through the grinding member, the grinding shaft compresses the elastic detection member, and the distance detector detects the thickness of the deposit on the surface of the graphite ring according to the compression amount of the elastic detection member.

[0025] Optionally, the positioning device further includes a clamping lifting assembly. The adsorption module includes an adsorption disc and a clamping disc. The clamping disc is connected to the Z-axis rotation driver. The adsorption disc is disposed on the clamping disc in a liftable manner. The graphite ring is adsorbed on the adsorption disc. A plurality of inwardly movable clamping members are circumferentially arranged along the inner side of the clamping disc. The clamping lifting assembly is connected to the adsorption disc. When the clamping lifting assembly drives the adsorption disc to descend, the plurality of clamping members clamp the graphite ring inwardly.

[0026] Optionally, the positioning device further includes a vacuum interface connected to an external vacuum generator. The Z-axis rotation driver is provided with a driving channel and a first vacuum channel communicating with the vacuum interface. The clamping disc includes a disc body portion, a connecting portion and a shaft body portion respectively connected to both axial sides of the disc body portion. The shaft body portion is inserted into the driving channel and is provided with a second vacuum channel communicating with the first vacuum channel. The connecting portion is provided with a plurality of third vacuum channels communicating with the second vacuum channel along the circumference. The adsorption disc is provided with a plurality of suction cups and a plurality of fourth vacuum channels respectively communicating with the corresponding suction cups along the circumference. The plurality of fourth vacuum channels are respectively connected to the plurality of third vacuum channels in one-to-one correspondence through connecting pipes, so that the plurality of suction cups communicate with the vacuum interface through each vacuum channel and adsorb the graphite ring under the drive of the external vacuum generator.

[0027] Optionally, the clamping disc is provided with a mutually communicating activity groove and an activity through hole corresponding to each clamping member. The clamping member is pivotally connected to the activity groove. The clamping member is provided with a clamping portion corresponding to the activity through hole. A clamping elastic member is arranged in the activity groove. The clamping elastic member is arranged in contact with the clamping member. The clamping elastic member is used to push the clamping member to swing in a direction close to the graphite ring, so that the clamping portion extends out of the activity through hole. When the clamping lifting assembly drives the adsorption disc to descend, the outer side wall of the graphite ring abuts against the clamping portion.

[0028] Optionally, the clamping lifting assembly includes a slide rail, a lifting cylinder and a lifting support frame. The slide rail and the lifting cylinder are disposed on different sides of the Z-axis rotation driver. The lifting support frame is slidably connected to the slide rail and is connected to the driving end of the lifting cylinder. The lifting cylinder is used to drive the lifting support frame to move up and down along the slide rail;

[0029] The adsorption module further includes a lifting connecting member. The lifting connecting member includes a ring portion and a plurality of column portions disposed on the ring portion. The column portions pass through the clamping disc and are fixedly connected to the bottom surface of the adsorption disc. Support rollers are correspondingly arranged on both sides of the lifting support frame for the lifting connecting member. When the lifting support frame rises, the lifting connecting member is pushed to rise through the support rollers, so that the column portions push the adsorption disc to rise;

[0030] Each of the column parts is sleeved with a connecting sleeve and a return spring. One end of the connecting sleeve is fixedly connected to the bottom surface of the clamping disc, and the other end abuts against the upper surface of the ring part through the return spring. When the lifting support frame descends, the return spring pushes the ring part to tightly press against the supporting roller, so that the column part drives the suction disc to descend.

[0031] In the present invention, the inner chamfered inclined surface, inner chamfered flat edge, top surface and / or outer chamfered inclined surface of the graphite ring are polished by the cooperation of the grinding head device and the positioning device. The grinding head device is arranged on the X-axis moving device, and the positioning device is arranged on the Y-axis moving device. The grinding head device includes an alignment component and a grinding head component. The grinding head component is provided with a grinding piece. The positioning device includes a Z-axis rotation driver and an adsorption module. The adsorption module adsorbs the graphite ring. The grinding piece is driven by the X-axis moving device and the alignment component to be in alignment contact with the inner chamfered inclined surface, inner chamfered flat edge, top surface or outer chamfered inclined surface of the graphite ring respectively. The positioning device makes reciprocating movements or reciprocating rotations under the drive of the Z-axis rotation driver or the Y-axis moving device, so that the grinding piece polishes the inner chamfered inclined surface, inner chamfered flat edge, top surface or outer chamfered inclined surface, thereby achieving the purpose of quickly removing the loose deposits on the surface of the graphite ring fitting and the stubborn deposits under the loose layer of the graphite ring, improving the grinding efficiency and grinding quality of the graphite ring fitting, realizing the automated and standardized maintenance operation of the graphite ring fitting, and thus improving the quality of epitaxial wafer growth. Description of the Drawings

[0032] Figure 1 It is a three-dimensional structure diagram of the graphite ring surface deposit grinding equipment according to the embodiment of the present invention.

[0033] Figure 2 It is a three-dimensional structure diagram of the graphite ring in the graphite ring surface deposit grinding equipment according to the embodiment of the present invention.

[0034] Figure 3 It is a three-dimensional structure diagram of the graphite ring surface deposit grinding equipment according to the embodiment of the present invention when grinding the inner chamfered inclined surface.

[0035] Figure 4 It is a three-dimensional structure diagram of the graphite ring surface deposit grinding equipment according to the embodiment of the present invention when grinding the inner chamfered flat edge.

[0036] Figure 5 It is a three-dimensional structure diagram of the graphite ring surface deposit grinding equipment according to the embodiment of the present invention when grinding the top surface.

[0037] Figure 6 It is a three-dimensional structure diagram of the graphite ring surface deposit grinding equipment according to the embodiment of the present invention when grinding the outer chamfered inclined surface.

[0038] Figure 7 This is a three-dimensional structure diagram of the positioning device in the graphite ring surface sediment grinding equipment according to an embodiment of the present invention.

[0039] Figure 8 This is a cross-sectional structure diagram of the positioning device in the graphite ring surface sediment grinding equipment according to an embodiment of the present invention.

[0040] Figure 9 This is a three-dimensional structure diagram of the grinding head device in the graphite ring surface sediment grinding equipment according to an embodiment of the present invention.

[0041] Figure 10 This is a cross-sectional structure diagram of the grinding head device in the graphite ring surface sediment grinding equipment according to an embodiment of the present invention. Detailed implementation manners

[0042] In order to explain in detail the technical content, structural features, achieved purposes and effects of the present invention, the following will be described in detail in conjunction with the implementation manners and with reference to the accompanying drawings.

[0043] Please refer to Figures 1 to 10 , the present invention discloses a graphite ring surface sediment grinding equipment for grinding the inner chamfered bevel surface 101, inner chamfered flat edge 102, top surface 103 and / or outer chamfered bevel surface 104 of the graphite ring 100, which includes:

[0044] An X-axis moving device 1, a grinding head device 2 arranged on the X-axis moving device 1, a Y-axis moving device 3, and a positioning device 4 arranged on the Y-axis moving device 3;

[0045] The grinding head device 2 includes an alignment component 201 and a grinding head component 202 arranged on the alignment component 201. The grinding head component 202 is provided with a grinding member 21. The positioning device 4 includes a Z-axis rotation driver 41 and an adsorption module 401 arranged on the Z-axis rotation driver 41. The adsorption module 401 adsorbs the graphite ring 100;

[0046] Refer to Figures 1 to 10 , the alignment component 201 includes a Y-axis rotation component 22 and a Z-axis lifting component 23 arranged on the Y-axis rotation component 22. The X-axis moving device 1, the Y-axis rotation component 22 and the Z-axis lifting component 23 are respectively used to drive the grinding head component 202 to move horizontally, swing and descend, so that the grinding member 21 is correspondingly in contact with the inner chamfered bevel surface 101, inner chamfered flat edge 102 or outer chamfered bevel surface 104 for alignment; and the X-axis moving device 1 and the Z-axis lifting component 23 are also respectively used to drive the grinding head component 202 to move horizontally and descend, so that the grinding member 21 is correspondingly in contact with the top surface 103 for alignment.

[0047] Specifically, in this embodiment, the X-axis moving device 1 includes a conventional servo motor and an X-axis linear module 11, the Y-axis rotating assembly 22 includes a conventional servo motor and a rotating module 221, and the Z-axis lifting assembly 23 includes a conventional servo motor and a lead screw module 231. Therefore, they will not be elaborated here. When switching from a certain grinding position of the graphite ring 100 to another grinding position, the X-axis moving device 1 is used to drive the grinding head assembly 202 to move horizontally, so that the grinding member 21 of the grinding head assembly 202 corresponds to the side of the graphite ring 100 along the X-axis; the Y-axis rotating assembly 22 is used to drive the grinding head assembly 202 to perform an offset movement, so that the grinding member 21 is aligned with the inner chamfered inclined surface 101, the inner chamfered flat edge 102 or the outer chamfered inclined surface 104 of the graphite ring 100; after the Z-axis lifting assembly 23 aligns the grinding member 21 with the grinding position of the graphite ring 100, it drives the grinding member 21 to move closer to the grinding position of the graphite ring 100, so that the grinding member 21 is in corresponding contact with the grinding position of the graphite ring 100. Through the multi-dimensional combined structure of the above mechanical devices, cooperating with the positioning device 4, the purpose of automatically grinding and removing the SiC deposits on the inner chamfered inclined surface 101, the inner chamfered flat edge 102, the top surface 103 and / or the outer chamfered inclined surface 104 of the graphite ring 100 can be achieved.

[0048] Refer to Figures 1 to 10 , the grinding head assembly 202 includes an R-axis rotating assembly 24, a support frame 25 provided with a rotating bearing 251, a support cylinder 26 connected to the driving end of the R-axis rotating assembly 24, and a grinding shaft 27 provided with a grinding member 21. The support cylinder 26 is connected to the rotating bearing 251 and is rotatably arranged on the support frame 25. The grinding shaft 27 passes through the support cylinder 26. When the grinding member 21 grinds the top surface 103, the R-axis rotating assembly 24 drives the support cylinder 26 to drive the grinding shaft 27 to rotate, so that the grinding member 21 rotates to grind the top surface 103.

[0049] Specifically, in this embodiment, the grinding member 21 is a grinding cutter head. The R-axis rotating assembly 24 includes a conventional rotating drive motor 241, a drive wheel 242 arranged on the drive shaft of the rotating drive motor 241, and a drive belt 243 wound around the drive wheel 242 and the support cylinder 26. Therefore, they will not be elaborated here. The R-axis rotating assembly 24 is used to drive the grinding shaft 27 to rotate by a set alignment angle, so that the grinding cutter head is perpendicularly arranged with respect to the inner chamfered inclined surface 101, the inner chamfered flat edge 102 or the outer chamfered inclined surface 104 corresponding to the graphite ring 100 fittings. And when grinding the top surface 103, the R-axis rotating assembly 24 is used to drive the grinding shaft 27 to rotate at high speed by itself, so as to improve the effect of the grinding member 21 grinding the top surface 103.

[0050] Further, the grinding head assembly 202 includes a support frame 25, a support cylinder 26, and a grinding shaft 27 provided with a grinding member 21. The support cylinder 26 is arranged on the support frame 25 along the R axis and is provided with a through activity channel 261. At least one first channel 2611 is provided on the inner side wall of the activity channel 261. At least one second channel 271 is provided on the outer side wall of the grinding shaft 27 corresponding to the first channel 2611. A plurality of balls 262 are movably arranged in the first channel 2611 and the second channel 271, so that the grinding shaft 27 can be arranged to move up and down along the R axis in the activity channel 261, and the grinding shaft 27 is driven to rotate when the support cylinder 26 rotates. The cooperation of the above-mentioned balls 262 with the first channel 2611 and the second channel 271 can achieve the effect that the grinding shaft 27 can move up and down along the R axis and can rotate self-along the R axis.

[0051] Refer to Figures 1 to 10 , the grinding head assembly 202 includes a support frame 25, a support cylinder 26, and a grinding shaft 27 provided with a grinding member 21. The support cylinder 26 is arranged on the support frame 25 along the R axis and is provided with an activity channel 261. The grinding shaft 27 includes a grinding head end 272, a middle shaft 273, and a limiting tail end 274 arranged in sequence along the R axis. The middle shaft 273 is movably arranged along the R axis through the activity channel 261 and is sleeved with an elastic support 275;

[0052] When no external force acts on the grinding member 21, both ends of the elastic support 275 are respectively abutted against the grinding head end 272 and the front end face of the support cylinder 26, and the limiting tail end 274 is abutted against the rear end face of the support cylinder 26;

[0053] When an external force acts on the grinding member 21 to move the grinding shaft 27 upward along the R axis, the grinding head end 272 compresses the elastic support 275, and the limiting tail end 274 is separated from the support cylinder 26;

[0054] When no external force acts on the grinding member 21, the elastic support 275 elastically expands to push the grinding head end 272 to drive the grinding shaft 27 to move downward along the R axis until the limiting tail end 274 abuts against the rear end face of the support cylinder 26.

[0055] The above-mentioned cooperative setting of the support cylinder 26, the grinding shaft 27, and the elastic support 275 enables the grinding shaft 27 to have a certain floating degree of freedom, which can effectively protect the grinding member 21 during the grinding movement of the grinding member 21, avoid the impact force of the convex part with a large height difference on the surface of the graphite ring 100 on the grinding member 21, and further damage the grinding member 21 or the graphite ring 100 fittings. At the same time, with the cooperation of the distance detector 28 and the Z-axis lifting assembly 23, it can uniformly grind the uneven irregular surface topography of the SiC deposit on the surface of the graphite ring 100 fittings without leaving dead corners.

[0056] Refer to Figures 1 to 10, the grinding head assembly 202 includes a distance detector 28, a support frame 25, a support cylinder 26 and a grinding shaft 27. The support cylinder 26 is arranged on the support frame 25 along the R axis and is provided with a through activity channel 261. The grinding shaft 27 is movably inserted into the activity channel 261 along the R axis. An elastic detection member 281 is provided at the detection end of the distance detector 28. One end of the grinding shaft 27 is provided with a grinding member 21, and the other end abuts against the elastic detection member 281. When the sediment on the surface of the graphite ring 100 pushes the grinding shaft 27 to move upward along the R axis through the grinding member 21, the grinding shaft 27 compresses the elastic detection member 281, and the distance detector 28 detects the thickness of the sediment on the surface of the graphite ring 100 according to the compression amount of the elastic detection member 281.

[0057] Specifically, in this embodiment, the distance detector 28 used is a Keyence distance sensor with an accuracy of 0.01 mm. Since the deposited material on the surface of the graphite ring 100 presents an irregular curved surface effect, the grinding effect of the graphite ring 100 cannot meet the product requirements. Therefore, a distance detector 28 is set to detect the highest point and the lowest point of each grinding position of the graphite ring 100.

[0058] For example, when grinding the top surface 103 of the graphite ring 100, the X-axis moving device 1 and the Y-axis rotating assembly 22 are used to drive the grinding shaft 27 of the grinding head assembly 202 to be positioned at the target position along the X axis and the Y axis, so that the grinding member 21 is aligned with the top surface 103 of the graphite ring 100 along the Z axis. Then, the Z-axis lifting assembly 23 is used to drive the grinding head assembly 202 to descend along the Z axis until the grinding member 21 of the grinding shaft 27 contacts the graphite ring 100, and the elastic detection member 281 of the distance detector 28 generates a telescopic amount of 0.01 mm due to the compression of the grinding shaft 27. Stop the Z-axis lifting assembly 23 from driving the grinding shaft 27 to descend and record the driving position corresponding to the Z-axis lifting assembly 23.

[0059] Next, while keeping the coordinate position of the grinding head assembly 202 unchanged, the Z-axis rotating driver 41 drives the adsorption module 401 to drive the graphite ring 100 to rotate 360 degrees, so that the grinding shaft 27 makes a telescopic movement along the Z-axis direction following the topography of the surface of the graphite ring 100, and thus compresses the elastic detection member 281 of the distance detector 28, so that the elastic detection member 281 generates different telescopic amount changes following the topography of the surface of the graphite ring 100. The distance sensor records the entire telescopic amount change process of the elastic detection member 281 to obtain the height position data of the highest point and the lowest point of the deposited material on the top surface 103 of the graphite ring 100.

[0060] Finally, according to the data of the distance sensor and the required polishing accuracy requirements of the graphite ring 100 (polishing target thickness value), set the compression threshold for the Z-axis lifting component 23 to drive the polishing head component 202 to descend along the Z-axis during the process of polishing the top surface 103 of the graphite ring 100, so as to realize the automatic control of the polishing accuracy of the graphite ring 100.

[0061] The above design of the movement trajectory, polishing speed, polishing pressure and movement mode of the polishing tool head of the polishing part 21 through the detection of the distance detector 28, combined with the multi-axis drive realized by the X-axis moving device 1, Y-axis rotating component 22, Z-axis lifting component 23 and R-axis rotating component 24, can achieve the purpose of comprehensively and efficiently polishing and removing the SiC deposits on the surface of the graphite ring 100, thereby effectively improving the growth quality of the silicon carbide epitaxial film, prolonging the service life of the graphite ring 100 and reducing the damage probability of the graphite ring 100.

[0062] Refer to Figures 1 to 10 , the positioning device 4 further includes a clamping lifting component 42, the adsorption module 401 includes an adsorption disc 43 and a clamping disc 44, the clamping disc 44 is connected to the Z-axis rotation driver 41, the adsorption disc 43 is arranged on the clamping disc 44 in a liftable manner, the adsorption disc 43 adsorbs the graphite ring 100, and a plurality of inwardly movable clamping members 441 are arranged circumferentially along the inner side of the clamping disc 44. When the clamping lifting component 42 drives the adsorption disc 43 to descend, the plurality of clamping members 441 clamp the graphite ring 100 inwardly.

[0063] Specifically, in this embodiment, the contour of the graphite ring 100 is circular. The Z-axis rotation driver 41 includes a conventional servo motor and a rotation support seat 411. The rotation support seat 411 is provided with an X-axis rotation bearing 412 connected to the shaft body portion 442 of the clamping disc 44. When polishing the inner chamfered inclined surface 101, outer chamfered inclined surface 104 and top surface 103 of the graphite ring 100, the servo motor, as the rotation driving component, drives the clamping disc 44 to rotate through the shaft body portion 442, so that the polishing part 21 can perform comprehensive polishing on the graphite ring 100 adsorbed on the adsorption disc 43. At the same time, combined with the surrounding clamping design realized by the plurality of clamping members 441 in the clamping disc 44, the center positioning of the graphite ring 100 during rotation can be achieved, and the tension inside the graphite ring 100 can be increased to prevent the graphite ring 100 from breaking and damaging due to the reverse force (tensile stress) generated by the inner chamfered inclined surface 101 or inner chamfered flat edge 102 during polishing.

[0064] Specifically, in this embodiment, the Y-axis moving device 3 includes a conventional servo motor and a Y-axis linear module 31. The Z-axis rotation driver 41 of the positioning device 4 is fixedly connected to the Y-axis linear module 31. The Y-axis moving device 3 is used to drive the positioning device 4 to move longitudinally, so that the suction cup 43 is aligned with the grinding part 21 of the grinding head assembly 202, and is also used to drive the positioning device 4 to make reciprocating longitudinal movement when grinding the inner chamfered flat edge 102, but is not limited thereto.

[0065] Specifically, in this embodiment, the positioning device 4 further includes at least one dust exhaust assembly 45. One end of the dust exhaust assembly is provided with an air outlet 451 corresponding to the graphite ring 100, and the other end is connected to an external gas compression device. Driven by the external gas compression device, the air outlet 451 is used to output compressed gas to the graphite ring 100. The particulate matter generated when grinding the graphite ring 100 fittings is exhausted under the action of the local air flow generated by the above dust exhaust assembly and the centrifugal force generated by the Z-axis rotation driver 41 driving the adsorption module 401 to rotate.

[0066] Refer to Figures 1 to 10 , the positioning device 4 further includes a vacuum interface 46 connected to an external vacuum generator. The Z-axis rotation driver 41 is provided with a driving channel 413 and a first vacuum channel 414 communicating with the vacuum interface 46. The clamping disc 44 includes a disc body portion 443, a connecting portion 444 and a shaft body portion 442 respectively connected to both axial sides of the disc body portion 443. The shaft body portion 442 is inserted into the driving channel 413 and is provided with a second vacuum channel 4421 communicating with the first vacuum channel 414. The connecting portion 444 is circumferentially provided with a plurality of third vacuum channels 4441 communicating with the second vacuum channel 4421. The suction disc 43 is circumferentially provided with a plurality of suction cups 431 and a plurality of fourth vacuum channels 432 respectively communicating with the corresponding suction cups 431. The plurality of fourth vacuum channels 432 are respectively connected to the plurality of third vacuum channels 4441 in one-to-one correspondence through connecting pipes 47, so that the plurality of suction cups 431 are communicated with the vacuum interface 46 through the respective vacuum channels, and under the drive of the external vacuum generator, the graphite ring 100 is adsorbed, so as to provide an adsorption force for the plurality of suction cups 431 on the suction disc 43 to adsorb and fix the graphite ring 100 during the whole process of grinding the graphite ring 100 fittings. At the same time, the third vacuum channel 4441 of the connecting portion 444 is connected to the fourth vacuum channel 432 of the suction disc 43 through the connecting pipe 47, so that the suction disc 43 can realize lifting movement relative to the clamping disc 44 under the drive of the clamping lifting assembly 42.

[0067] Refer to Figures 1 to 10, for each clamping member 441 of the clamping disc 44, there are a mutually communicating movable groove 445 and a movable through hole 446. The clamping member 441 is pivotally connected to the movable groove 445. The clamping member 441 is provided with a clamping portion 4411 corresponding to the movable through hole 446. A clamping elastic member 4451 is arranged in the movable groove 445. The clamping elastic member 4451 is arranged in contact with the clamping member 441. The clamping elastic member 4451 is used to push the clamping member 441 to swing towards the direction close to the graphite ring 100, so that the clamping portion 4411 extends out of the movable through hole 446. When the clamping lifting assembly 42 drives the suction disc 43 to descend, the outer side wall of the graphite ring 100 abuts against the clamping portion 4411.

[0068] The design of the above-mentioned surrounding clamping structure is beneficial to realizing the center positioning when the graphite ring 100 rotates, increasing the tension inside the graphite ring 100, and ensuring that the inner chamfer inclined surface 101 of the graphite ring 100 is polished without damaging the accessories.

[0069] Refer to Figures 1 to 10 , the clamping lifting assembly 42 includes a slide rail 421, a lifting cylinder 422 and a lifting support frame 423. The slide rail 421 and the lifting cylinder 422 are arranged on different sides of the Z-axis rotation driver 41. The lifting support frame 423 is slidably connected to the slide rail 421 and is connected to the driving end of the lifting cylinder 422. The lifting cylinder 422 is used to drive the lifting support frame 423 to make lifting movement along the slide rail 421;

[0070] The suction module 401 further includes a lifting connecting member 48. The lifting connecting member 48 includes a ring portion 481 and a plurality of column portions 482 arranged on the ring portion 481. The column portions 482 pass through the clamping disc 44 and are fixedly connected to the bottom surface of the suction disc 43. Support rollers 424 are arranged on both sides of the lifting support frame 423 corresponding to the lifting connecting member 48. When the lifting support frame 423 rises, the lifting connecting member 48 is pushed to rise through the support rollers 424, so that the column portions 482 push the suction disc 43 to rise;

[0071] A connecting sleeve 483 and a return spring 484 are sleeved on each column portion 482. One end of the connecting sleeve 483 is fixedly connected to the bottom surface of the clamping disc 44, and the other end abuts against the upper surface of the ring portion 481 through the return spring 484. When the lifting support frame 423 descends, the return spring 484 pushes the ring portion 481 to be tightly pressed against the support rollers 424, so that the column portions 482 drive the suction disc 43 to descend.

[0072] Specifically, in this embodiment, the lifting cylinder 422 of the PLC is controlled by I / O signals to drive the lifting support frame 423 to move up and down along the Z-axis, so as to realize the combined actions of the suction cup 43 rising and falling relative to the clamping disc 44 under the cooperation of the lifting connecting piece 48 and the return spring 484, and to realize the surrounding clamping and fixing of the graphite ring 100 by multiple clamping pieces 441 under the action of the clamping elastic piece 4451 in the clamping disc 44; when grinding the inner chamfered inclined surface 101 and the inner chamfered flat edge 102 of the graphite ring 100, the clamping and lifting assembly 42 drives the suction cup 43 to descend, and multiple clamping pieces 441 surround and clamp the graphite ring 100 inward to increase the inner tension of the graphite ring 100 and protect the graphite ring 100 from being damaged by the acting force of the grinding piece 21 during the grinding process; when grinding the outer chamfered inclined surface 104 and the top surface 103 of the graphite ring 100, the clamping and lifting assembly 42 drives the suction cup 43 to descend, and multiple clamping pieces 441 are misaligned and separated from the graphite ring 100, and no longer perform the action of surrounding and clamping the graphite ring 100, thereby effectively leaving a movement space margin for the grinding piece 21 to avoid.

[0073] Through the cooperation of the specific structures of the above-mentioned grinding head device 2 and the positioning device 4, the rapid and safe grinding and removal of the SiC deposits on the surface of the graphite ring 100 can be effectively realized, so as to improve the grinding efficiency and quality of the graphite ring 100, thereby providing a more stable thermal field environment for wafer epitaxial growth and improving the quality of the wafer epitaxial thin film layer, realizing the efficient and stable quality maintenance of the graphite ring 100, and at the same time, the service life of the accessories of the graphite ring 100 will also be improved to a certain extent, so as to reduce the material cost in the field of epitaxial growth technology.

[0074] It can be understood that, in this embodiment, the grinding of each grinding position of the graphite ring 100 is carried out in sequence according to the inner chamfered inclined surface 101, the inner chamfered flat edge 102, the top surface 103 and the outer chamfered inclined surface 104, but not limited to this. The grinding sequence can also be adjusted according to actual needs, or a certain grinding position can be ground alone. Therefore, the specific operation of grinding needs to be set according to specific situations and is not limited by the following description.

[0075] Refer to Figure 3 , the grinding piece 21 is driven by the X-axis moving device 1 and the alignment component 201 to be in alignment contact with the inner chamfered inclined surface 101, and the Z-axis rotary driver 41 drives the suction module 401 to perform an arc-shaped reciprocating rotation, so that the grinding piece 21 grinds the inner chamfered inclined surface 101; and / or

[0076] Specifically, in this embodiment, when grinding the inner chamfered bevel 101 of the graphite ring 100, the X-axis moving device 1 drives the grinding head assembly 202 to traverse to correspond to the right side of the graphite ring 100, the Y-axis rotating assembly 22 drives the grinding head assembly 202 to swing to the right by a set angle, the Z-axis lifting assembly 23 drives the grinding head assembly 202 to descend until the grinding member 21 contacts the inner chamfered bevel 101, and maintains the inclination angle of the current grinding member 21. The clamping lifting assembly 42 drives the suction disc 43 to move downward relative to the clamping disc 44, so that the multiple clamping members 441 of the clamping disc 44 clamp the graphite ring 100 inward. The Z-axis rotation driver 41 drives the clamping disc 44 and the suction disc 43 to rotate to drive the graphite ring 100 to perform a high-speed reciprocating rotation motion of 0 degrees to 300 degrees, so as to realize the grinding of the inner chamfered bevel 101 by the grinding member 21 through the active rotation of the graphite ring 100.

[0077] Refer to Figure 4 , the Z-axis rotation driver 41 drives the suction module 401 to rotate, so that the grinding member 21 is driven by the X-axis moving device 1 and the alignment component 201 to be in alignment contact with the inner chamfered flat edge 102. The Y-axis moving device 3 drives the positioning device 4 to reciprocate along the Y-axis, so that the grinding member 21 grinds the inner chamfered flat edge 102; and / or,

[0078] Specifically, in this embodiment, when grinding the inner chamfered flat edge 102 of the graphite ring 100, the X-axis moving device 1 maintains the position when grinding the inner chamfered bevel 101 of the graphite ring 100. The Z-axis rotation driver 41 drives the clamping disc 44 and the suction disc 43 to rotate to drive the inner chamfered flat edge 102 of the graphite ring 100 to rotate to the right side of the graphite ring 100, so that the inner chamfered flat edge 102 is horizontally aligned with the grinding head assembly 202. The Y-axis rotating assembly 22 drives the grinding head assembly 202 to swing to the right by a set angle. The Z-axis lifting assembly 23 drives the grinding head assembly 202 to descend until the grinding member 21 contacts the inner chamfered flat edge 102, and maintains the inclination angle of the grinding member 21. The clamping lifting assembly 42 maintains the descending position of the suction disc 43 relative to the clamping disc 44, so that the multiple clamping members 441 of the clamping disc 44 clamp the graphite ring 100 inward. And the Z-axis rotation driver 41 maintains the current rotation angle of the suction disc 43 and the clamping disc 44 in the suction module 401. The Y-axis moving device 3 drives the positioning device 4 to longitudinally move to drive the graphite ring 100 to perform a reciprocating motion back and forth along the Y-axis, so as to realize the grinding of the inner chamfered flat edge 102 by the grinding member 21 through the active reciprocating longitudinal movement of the graphite ring 100.

[0079] Refer to Figure 5 , the grinding member 21 is driven by the X-axis moving device 1 and the alignment component 201 to be in alignment contact with the top surface 103. The Z-axis rotation driver 41 drives the suction module 401 to perform a circular reciprocating rotation, so that the grinding member 21 grinds the top surface 103; and / or,

[0080] Specifically, in this embodiment, when grinding the top surface 103 of the graphite ring 100, the X-axis moving device 1 drives the grinding head assembly 202 to traverse to correspond to the right side of the graphite ring 100, the Z-axis lifting assembly 23 drives the grinding head assembly 202 to descend until the grinding member 21 contacts the top surface 103, and maintains the vertical angle of the grinding member 21. The clamping lifting assembly 42 drives the suction cup 43 to move upward relative to the clamping disc 44. The Z-axis rotation driver 41 drives the clamping disc 44 and the suction cup 43 to rotate to drive the graphite ring 100 to perform a high-speed reciprocating rotation of 0 degrees to 360 degrees. At the same time, the R-axis rotation assembly 24 drives the support cylinder 26 and the grinding shaft 27 to rotate to drive the grinding member 21 to perform a high-speed self-rotation movement, so as to realize the all-round multi-dimensional grinding of the top surface 103 of the graphite ring 100 through the active rotation of the graphite ring 100 and the grinding member 21, and realize the self-repair of the grinding member 21.

[0081] Refer to Figure 6 , the grinding member 21 is driven by the X-axis moving device 1 and the alignment assembly 201 to be in alignment contact with the outer chamfered inclined surface 104, and the Z-axis rotation driver 41 drives the suction module 401 to perform a circular reciprocating rotation, so that the grinding member 21 grinds the outer chamfered inclined surface 104.

[0082] Specifically, in this embodiment, when grinding the outer chamfered inclined surface 104 of the graphite ring 100, the X-axis moving device 1 drives the grinding head assembly 202 to traverse to correspond to the left side of the graphite ring 100, the Y-axis rotation assembly 22 drives the grinding head assembly 202 to swing to the right by a set angle, the Z-axis lifting assembly 23 drives the grinding head assembly 202 to descend until the grinding member 21 contacts the outer chamfered inclined surface 104, and maintains the inclination angle of the current grinding member 21. The clamping lifting assembly 42 maintains the upward position of the suction cup 43 relative to the clamping disc 44. The Z-axis rotation driver 41 drives the clamping disc 44 and the suction cup 43 to rotate to drive the graphite ring 100 to perform a high-speed reciprocating rotation of 0 degrees to 360 degrees, so as to realize the grinding of the outer chamfered inclined surface 104 by the grinding member 21 through the active rotation of the graphite ring 100.

[0083] The present invention realizes the grinding of the inner chamfered inclined surface 101, inner chamfered flat edge 102, top surface 103 and / or outer chamfered inclined surface 104 of the graphite ring 100 through the cooperation of the grinding head device 2 and the positioning device 4. The grinding head device 2 is arranged on the X-axis moving device 1, and the positioning device 4 is arranged on the Y-axis moving device 3. The grinding head device 2 includes an alignment component 201 and a grinding head component 202. The grinding head component 202 is provided with a grinding piece 21. The positioning device 4 includes a Z-axis rotation driver 41 and an adsorption module 401. The adsorption module 401 adsorbs the graphite ring 100. The grinding piece 21 is driven by the X-axis moving device 1 and the alignment component 201 to be in alignment contact with the inner chamfered inclined surface 101, inner chamfered flat edge 102, top surface 103 or outer chamfered inclined surface 104 of the graphite ring 100 respectively. The positioning device 4 makes reciprocating movements or reciprocating rotations under the drive of the Z-axis rotation driver 41 or the Y-axis moving device 3, so that the grinding piece 21 grinds the inner chamfered inclined surface 101, inner chamfered flat edge 102, top surface 103 or outer chamfered inclined surface 104, thereby realizing the purpose of quickly removing the loose deposits on the surface of the graphite ring 100 fittings and the stubborn deposits under the loose layer of the graphite ring 100, improving the grinding efficiency and grinding quality of the graphite ring 100 fittings, realizing the automated and standardized maintenance operation of the graphite ring 100 fittings, and thus improving the quality of epitaxial wafer growth.

[0084] The above-disclosed are only the preferred embodiments of the present invention. Of course, the scope of the rights of the present invention cannot be limited thereby. Therefore, equivalent changes made according to the scope of the patent application of the present invention still fall within the scope covered by the present invention.

Claims

1. A graphite ring surface sediment grinding device, which is used to grind the inner chamfered bevel surface, inner chamfered flat edge, top surface and / or outer chamfered bevel surface of a graphite ring, and is characterized in that, Comprising: an X-axis moving device, a grinding head device disposed on the X-axis moving device, a Y-axis moving device, and a positioning device disposed on the Y-axis moving device; the grinding head device includes an alignment component and a grinding head component disposed on the alignment component, the grinding head component is provided with a grinding member, the positioning device includes a Z-axis rotation driver and an adsorption module disposed on the Z-axis rotation driver, and the adsorption module adsorbs the graphite ring; the grinding member is driven by the X-axis moving device and the alignment component to be in alignment contact with the inner chamfer inclined surface, and the Z-axis rotation driver drives the adsorption module to perform an arc-shaped reciprocating rotation so that the grinding member grinds the inner chamfer inclined surface; and / or, the Z-axis rotation driver drives the adsorption module to rotate so that the grinding member is driven by the X-axis moving device and the alignment component to be in alignment contact with the inner chamfer flat edge, and the Y-axis moving device drives the positioning device to reciprocate along the Y-axis so that the grinding member grinds the inner chamfer flat edge; and / or, the grinding member is driven by the X-axis moving device and the alignment component to be in alignment contact with the top surface, and the Z-axis rotation driver drives the adsorption module to perform a circular reciprocating rotation so that the grinding member grinds the top surface; and / or, the grinding member is driven by the X-axis moving device and the alignment component to be in alignment contact with the outer chamfer inclined surface, and the Z-axis rotation driver drives the adsorption module to perform a circular reciprocating rotation so that the grinding member grinds the outer chamfer inclined surface.

2. The graphite ring surface deposit grinding device according to claim 1, wherein the alignment component includes a Y-axis rotation component and a Z-axis lifting component disposed on the Y-axis rotation component, and the X-axis moving device, the Y-axis rotation component, and the Z-axis lifting component are respectively used to drive the grinding head component to move horizontally, swing, and descend so that the grinding member is correspondingly in alignment contact with the inner chamfer inclined surface, the inner chamfer flat edge, or the outer chamfer inclined surface; and the X-axis moving device and the Z-axis lifting component are also respectively used to drive the grinding head component to move horizontally and descend so that the grinding member is correspondingly in alignment contact with the top surface.

3. The graphite ring surface deposit grinding device according to claim 1, wherein the grinding head component includes an R-axis rotation component, a support frame provided with a rotary bearing, a support cylinder connected to the driving end of the R-axis rotation component, and a grinding shaft provided with the grinding member, the support cylinder is connected to the rotary bearing and is rotatably disposed on the support frame, the grinding shaft passes through the support cylinder, when the grinding member grinds the top surface, the R-axis rotation component drives the support cylinder to drive the grinding shaft to rotate so that the grinding member rotates to grind the top surface.

4. The graphite ring surface deposit grinding device according to claim 3, wherein The grinding head assembly includes a support frame, a support cylinder, and a grinding shaft provided with the grinding member. The support cylinder is arranged on the support frame along the R-axis and is provided with a through activity channel. At least one first channel is provided on the inner side wall of the activity channel. At least one second channel corresponding to the first channel is provided on the outer side wall of the grinding shaft. A plurality of balls are movably arranged in the first channel and the second channel, so that the grinding shaft can be arranged to move up and down along the R-axis in the activity channel, and the support cylinder drives the grinding shaft to rotate when rotating.

5. The graphite ring surface sediment grinding device according to claim 1, wherein the grinding head assembly includes a support frame, a support cylinder, and a grinding shaft provided with the grinding member. The support cylinder is arranged on the support frame along the R-axis and is provided with an activity channel. The grinding shaft includes a grinding head end, a middle shaft, and a limit tail end arranged in sequence along the R-axis. The middle shaft is movably arranged along the R-axis through the activity channel and is sleeved with an elastic support; when no external force acts on the grinding member, both ends of the elastic support are respectively abutted against the grinding head end and the front end face of the support cylinder, and the limit tail end is abutted against the rear end face of the support cylinder; when an external force acts on the grinding member to move the grinding shaft upward along the R-axis, the grinding head end compresses the elastic support, and the limit tail end is separated from the support cylinder; when the external force on the grinding member is no longer present, the elastic support elastically expands to push the grinding head end to drive the grinding shaft to move downward along the R-axis until the limit tail end abuts against the rear end face of the support cylinder.

6. The graphite ring surface sediment grinding device according to claim 1, wherein the grinding head assembly includes a distance detector, a support frame, a support cylinder, and a grinding shaft. The support cylinder is arranged on the support frame along the R-axis and is provided with a through activity channel. The grinding shaft is movably arranged up and down along the R-axis through the activity channel. The detection end of the distance detector is provided with an elastic detection member. One end of the grinding shaft is provided with the grinding member, and the other end abuts against the elastic detection member. When the sediment on the surface of the graphite ring pushes the grinding shaft to move upward along the R-axis through the grinding member, the grinding shaft compresses the elastic detection member, and the distance detector detects the thickness of the sediment on the surface of the graphite ring according to the compression amount of the elastic detection member.

7. The graphite ring surface sediment grinding device according to claim 1, wherein the positioning device further includes a clamping lifting assembly. The adsorption module includes an adsorption disc and a clamping disc. The clamping disc is connected to the Z-axis rotation driver. The adsorption disc is liftably arranged on the clamping disc. The adsorption disc adsorbs the graphite ring. A plurality of clamping members that can move inward are arranged circumferentially along the inner side of the clamping disc. The clamping lifting assembly is connected to the adsorption disc. When the clamping lifting assembly drives the adsorption disc to descend, the plurality of clamping members clamp the graphite ring inward.

8. The graphite ring surface sediment grinding device according to claim 7, wherein The positioning device further includes a vacuum interface connected to an external vacuum generator. The Z-axis rotation driver is provided with a driving channel and a first vacuum channel communicating with the vacuum interface. The clamping disc includes a disc body portion, a connecting portion and a shaft body portion respectively connected to both axial sides of the disc body portion. The shaft body portion is inserted into the driving channel and is provided with a second vacuum channel communicating with the first vacuum channel. The connecting portion is circumferentially provided with a plurality of third vacuum channels communicating with the second vacuum channel. The suction disc is circumferentially provided with a plurality of suction cups and a plurality of fourth vacuum channels respectively communicating with the corresponding suction cups. The plurality of fourth vacuum channels are respectively and correspondingly communicated with the plurality of third vacuum channels through connecting pipes, so that the plurality of suction cups are communicated with the vacuum interface through the respective vacuum channels and adsorb the graphite ring under the drive of the external vacuum generator.

9. The graphite ring surface deposit grinding device according to claim 7, wherein The clamping disc is provided with a mutually communicating movable groove and a movable through hole corresponding to each clamping member. The clamping member is pivotally connected to the movable groove. The clamping member is provided with a clamping portion corresponding to the movable through hole. A clamping elastic member is arranged in the movable groove. The clamping elastic member is arranged in abutment with the clamping member. The clamping elastic member is used for pushing the clamping member to swing towards the direction close to the graphite ring, so that the clamping portion extends out of the movable through hole. When the clamping and lifting assembly drives the suction disc to descend, the outer side wall of the graphite ring abuts against the clamping portion.

10. The graphite ring surface deposit grinding device according to claim 7, wherein The clamping and lifting assembly includes a slide rail, a lifting cylinder and a lifting support frame. The slide rail and the lifting cylinder are arranged on different sides of the Z-axis rotation driver. The lifting support frame is slidably connected to the slide rail and is connected to the driving end of the lifting cylinder. The lifting cylinder is used for driving the lifting support frame to make a lifting movement along the slide rail; The adsorption module further includes a lifting connecting member. The lifting connecting member includes a ring portion and a plurality of column portions arranged on the ring portion. The column portions pass through the clamping disc and are fixedly connected to the bottom surface of the suction disc. Support rollers are correspondingly arranged on both sides of the lifting support frame for the lifting connecting member. When the lifting support frame ascends, the lifting connecting member is pushed to ascend through the support rollers, so that the column portions push the suction disc to ascend; A connecting sleeve and a return spring are sleeved on each column portion. One end of the connecting sleeve is fixedly connected to the bottom surface of the clamping disc, and the other end abuts against the upper surface of the ring portion through the return spring. When the lifting support frame descends, the return spring pushes the ring portion to be tightly pressed against the support rollers, so that the column portions drive the suction disc to descend.

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