Capsule membranes, polishing heads, apparatuses, and methods for square substrate polishing

Abstract

The application discloses a kind of for square substrate polishing capsule membrane, polishing pressure head, equipment and method, comprising: at least two capsule membrane units of laminated arrangement, each the capsule membrane unit includes bottom wall and the lateral extension wall around the edge of bottom wall, the bottom wall of adjacent the capsule membrane unit is attached, and there is pressurized cavity between the lateral extension wall of adjacent the capsule membrane unit;At least one pressurized cavity is used to transmit pressure to the area outside the circle tangent to any pair of edges on the square substrate, to separately adjust the pressure of the area where the four corners of the square substrate are located.The application realizes the separate control of the pressure of the area where the four corners of the square substrate are located, can compensate the material removal rate difference generated by the speed difference between the area and the inner ring area, and improve the technical effect of material removal uniformity and surface flatness of square substrate.

Description

Technical Field

[0001] This invention relates to the field of polishing technology, and more specifically, to a diaphragm, polishing head, equipment, and method for polishing square substrates. Background Technology

[0002] TGV (Through Glass Via) is an advanced chip packaging technology that has attracted significant research and development investment worldwide. Its core material is a glass substrate, and the manufacturing process involves polishing the glass substrate. As packages become larger, there are increasing demands for larger and thinner glass substrates.

[0003] However, research and development on polishing ultra-large and ultra-thin glass substrates (e.g., glass substrates with dimensions of over 500mm in length and width, and a thickness between 0.5mm and 1mm) is still being conducted in the laboratory. Due to the ultra-large size, the polishing speed difference between the edge and center areas of the glass substrate is extremely large, and due to the ultra-thinness, the surface flatness of the glass substrate is required to be extremely high, typically at the micrometer level.

[0004] The polishing precision of existing technologies for ultra-large and ultra-thin glass substrates does not meet the requirements for large-scale production. Summary of the Invention

[0005] The main objective of this invention is to provide a membrane for polishing square substrates, in order to solve the problems of uneven material removal and low surface flatness of square substrates when polishing ultra-large and ultra-thin square substrates in related technologies.

[0006] To achieve the above objectives, the present invention provides a membrane for polishing square substrates, comprising:

[0007] At least two capsule units are stacked together, each capsule unit includes a bottom wall and a laterally extending wall surrounding the edge of the bottom wall, the bottom walls of adjacent capsule units are abutted, and a pressure cavity is provided between the laterally extending walls of adjacent capsule units;

[0008] At least one of the pressurizing chambers is provided for transmitting pressure to areas other than the circle tangent to any opposite side on the square substrate, so as to individually adjust the pressure in the areas where the four corners of the square substrate are located.

[0009] Optionally, a pressurization chamber is provided within the lateral extension wall of the uppermost capsule unit, the pressurization chamber being used to individually adjust the pressure in a region within a circle tangent to any opposite side on the square substrate.

[0010] Optionally, a circle on the square substrate that is tangent to any opposite side is located between two adjacent pressurizing cavities.

[0011] Optionally, a circle on the square substrate that is tangent to any opposite side is located near the boundary between two adjacent pressurized cavities.

[0012] Optionally, at least one of the pressurized chambers has an inner boundary diameter smaller than the diameter of the maximum circumcircle of the square substrate, and an outer boundary diameter larger than the diameter of the maximum circumcircle of the square substrate.

[0013] Optionally, at least two of the pressurized cavities are located within a circle on the square substrate that is tangent to any opposite side.

[0014] Optionally, at least two of the pressurizing chambers are provided for transmitting pressure to areas other than the circles tangent to any opposite side of the square substrate, so as to apply independent pressure to different areas at the four corners of the square substrate.

[0015] Optionally, at least one of the pressurized chambers is provided for transmitting pressure to a secondary wafer located outside the square substrate.

[0016] Optionally, the stiffness of the lateral extension wall located outside the pressurization chamber is greater than the composite stiffness of the bottom wall located below the pressurization chamber.

[0017] Optionally, the lower part of the lateral extension wall forms an acute angle at the junction with the bottom wall.

[0018] Optionally, the capsule unit further includes a folded portion located at the end of the lateral extension wall away from the bottom wall.

[0019] According to another aspect of the present invention, a polishing indenter is provided, comprising the aforementioned diaphragm and a first support member;

[0020] The first support member is sleeved and fixed inside each of the capsule units. The diameter of the outer side of the first support member is larger than the inner diameter of the lateral extension wall. The outer side of the first support member is in contact with the inner side of the lateral extension wall.

[0021] Optionally, it further includes a second support member, which is sleeved and fixed to the outside of each of the capsule units. The diameter of the inner side of the second support member is smaller than the outer diameter of the lateral extension wall after it is attached to the first support member, and the lateral extension wall is clamped by the first support member and the second support member.

[0022] Optionally, the first support member and the second support member are configured as rings.

[0023] Optionally, when the lower part of the lateral extension wall forms an acute angle with the connection of the bottom wall, the outer side of the first support member is an inclined surface, the maximum diameter and minimum diameter of the inclined surface are greater than the maximum inner diameter and minimum inner diameter of the connection, respectively, and the inclined surface fits against the inner side of the connection.

[0024] Optionally, the first support member has an arc-shaped chamfer at one end near the bottom wall, and the arc-shaped chamfer fits against the inner side of the connection and the bottom wall.

[0025] Optionally, it may also include a housing, a retaining ring, a retaining ring retainer, and a sealing ring;

[0026] The retaining ring is fixed to the lower end of the housing by the retaining ring fastener;

[0027] The capsule unit further includes a folded portion located at the end of the lateral extension wall away from the bottom wall. The folded portion of the outermost capsule unit among the plurality of capsule units is pressed and fixed between the retaining ring and the housing. The folded portions of the remaining capsule units are pressed and fixed to the lower end face of the housing by the sealing ring.

[0028] The housing is provided with multiple air passages, which are connected to the corresponding pressurization chambers.

[0029] Optionally, a sealing ring is provided at the end of the folded portion away from the lateral extension wall. The sealing ring is used to press against the housing of the polishing head to seal the corresponding pressure chamber.

[0030] Optionally, the lower end face of the shell is provided with a plurality of annular grooves distributed from the inside to the outside. The annular grooves correspond to the junctions between the folded portion and the lateral extension wall of the capsule unit, and provide movement space for the junctions through the annular grooves.

[0031] According to another aspect of the present invention, a polishing apparatus is provided, comprising the aforementioned membrane or the aforementioned polishing head.

[0032] According to another aspect of the present invention, a method for polishing a square substrate is provided, employing the above-described polishing head, the method comprising the following steps:

[0033] A circular pad with a square hole is arranged on the polishing pad.

[0034] The square substrate to be polished is placed in the square hole, and the lower surface of the square substrate is in contact with the polishing pad. The square hole restricts the horizontal movement of the square substrate.

[0035] Control the movement of the polishing head and adjust the position of the membrane so that each of the pressure chambers on the membrane corresponds to a set area on the square substrate and the supporting sheet;

[0036] The lower surface of the capsule is made to adhere to the upper surface of the square substrate;

[0037] The pressure in each of the pressurized chambers in the capsule is controlled to adjust the pressure transmitted to different areas on the square substrate and the diaphragm to a set value;

[0038] The polishing head and the polishing pad are rotated to polish the square substrate.

[0039] In this embodiment of the invention, at least two capsule units are stacked together. Each capsule unit includes a bottom wall and a lateral extension wall surrounding the edge of the bottom wall. The bottom walls of adjacent capsule units are attached together, and a pressure cavity is provided between the lateral extension walls of adjacent capsule units. At least one pressure cavity is provided to transmit pressure to the area outside the circle tangent to any opposite side on the square substrate, so as to individually adjust the pressure in the area where the four corners of the square substrate are located. On the one hand, at least one pressure chamber is formed by at least one layered membrane unit. Different pressure chambers transmit pressure to different areas of the square substrate. Some pressure chambers can transmit pressure to areas other than the circle tangent to any opposite side of the square substrate (i.e., corner areas), so that the pressure on the corner areas of the square substrate can be controlled individually. Some pressure chambers can transmit pressure to areas inside the circle tangent to any opposite side of the square substrate (i.e., inner circle areas), so that the pressure on the square substrate in this area can also be controlled individually. This achieves the technical effect of individually controlling the pressure on the corner areas and inner circle areas of the square substrate during the polishing process, compensating for the difference in material removal rate caused by the speed difference between the corner areas and other areas of the square substrate, and improving the material removal uniformity and surface flatness of the square substrate.

[0040] Especially when polishing large-size ultra-thin square substrates, by individually controlling the pressure in the pressure chamber corresponding to the corner area of ​​the square substrate, the deformation of the edge area of ​​the large-size polishing head caused by its own weight can be compensated. This adjusts the additional pressure applied to the corner area of ​​the square substrate due to the deformation of the edge area of ​​the polishing head during the polishing process, further improving the uniformity of material removal and surface flatness of the square substrate.

[0041] On the other hand, in this invention, by stacking multiple membrane units, the corresponding multi-layer bottom walls of some pressurizing chambers are made to improve the bottom wall stiffness of the pressurizing chamber, so that the pressure transmitted to the square substrate is more uniform. Furthermore, the manufacturing process is simpler and the manufacturing cost is lower by stacking multiple membrane units.

[0042] On the other hand, by using multi-layer membrane units stacked together, each membrane unit is independent, making each pressurizing chamber independent of each other, reducing the mutual influence between adjacent pressurizing chambers during pressure changes, and further improving the pressure control effect and polishing effect. Attached Figure Description

[0043] The accompanying drawings, which form part of this invention, are used to provide a further understanding of the invention, making other features, objects, and advantages of the invention more apparent. The illustrative embodiments of the invention illustrated in the drawings and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0044] Figure 1 This is a cross-sectional structural schematic diagram of a polishing indenter with a membrane according to an embodiment of the present invention;

[0045] Figure 2 This is a partial structural diagram of the capsule according to an embodiment of the present invention;

[0046] Figure 3 This is a schematic diagram of the structure of one of the membrane units according to an embodiment of the present invention;

[0047] Figure 4 yes Figure 3 A magnified schematic diagram of the central part of the structure;

[0048] Figure 5 yes Figure 3 A structural diagram omitting two supporting components;

[0049] Figure 6 This is a force diagram of the bottom wall of the capsule unit after the first support member is installed according to an embodiment of the present invention;

[0050] Figure 7 This is a force diagram of the laterally extending wall according to an embodiment of the present invention;

[0051] Figure 8 This is a schematic diagram of the polishing pressure head according to an embodiment of the present invention;

[0052] Figure 9 This is a bottom view of the polishing head according to an embodiment of the present invention;

[0053] Figure 10 This is a schematic diagram of the division of a pressurization chamber according to an embodiment of the present invention;

[0054] Figure 11 This is a schematic diagram of another pressurization chamber division according to an embodiment of the present invention;

[0055] Figure 12 This is a schematic diagram of the partitioning of a square substrate according to an embodiment of the present invention;

[0056] Among them, 1. Capsule; 10. Capsule unit; 101. First capsule unit; 102. Second capsule unit; 103. Third capsule unit; 104. Fourth capsule unit; 105. Fifth capsule unit; 106. Bottom wall; 107. Lateral extension wall; 108. Sealing ring; 109. Folded part; 110. Connection point; 2. Housing; 3. Retaining ring fixing member; 4. Retaining ring; 5. Accompanying piece; 6. Sealing ring; 7. Square base plate; 70. Inner ring area; 71. Corner area; 8. First support member; 9. Second support member; 11. Annular gap; 12. Pressure transmission interface; 13. Pressurization chamber. Detailed Implementation

[0057] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0058] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of the invention described herein.

[0059] In this invention, the terms "upper," "lower," "inner," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing the invention and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0060] Furthermore, in addition to indicating direction or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in certain situations to indicate a dependency or connection. Those skilled in the art can understand the specific meaning of these terms in this invention based on the specific circumstances.

[0061] Furthermore, the terms "set up," "equipped with," "connected," and "fixed" should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0062] In addition, the term "multiple" should mean two or more.

[0063] It should be noted that, unless otherwise specified, the embodiments and features described in the present invention can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0064] To solve related technical problems, such as Figure 1 and Figure 2 As shown, an embodiment of the present invention provides a membrane for polishing a square substrate, comprising:

[0065] At least two capsule units 10 are stacked together. Each capsule unit 10 includes a bottom wall 106 and a lateral extension wall 107 surrounding the edge of the bottom wall 106. The bottom walls 106 of adjacent capsule units 10 are attached together, and there is an annular gap 11 between the lateral extension walls 107 of adjacent capsule units 10, such that there is a pressure chamber 13 between the lateral extension walls 107 of adjacent capsule units 10. At least one pressure chamber 13 is used to transmit pressure to the area other than the circle tangent to any opposite side on the square substrate 7, so as to individually adjust the pressure in the area where the four corners of the square substrate 7 are located.

[0066] In this embodiment, as Figure 2 As shown, the capsule 1 includes at least capsule units 10 stacked together. Each capsule unit 10 includes a bottom wall 106 and a laterally extending wall 107 surrounding the edge of the bottom wall 106. The bottom wall 106 and the laterally extending wall 107 form an expandable chamber, the upper end of which is open. Figure 1 As shown, when the upper end of the capsule unit 10 is assembled with the housing 2 of the polishing head, the lower end face of the housing 2 or the upper pressure plate that presses the upper end of the capsule unit 10 against the housing 2 can seal the upper opening of the chamber, thereby changing the pressure inside the chamber by introducing gaseous or liquid medium into the chamber, and thus changing the degree of expansion of the chamber and the pressure transmitted outward.

[0067] like Figure 2 As shown, the multiple membrane units 10 have different diameters, including both the inner and outer diameters. The multiple membrane units 10 are stacked with the larger diameter on the outside and the smaller diameter on the inside. The bottom walls 106 of adjacent membrane units 10 are in contact with each other, and there is an annular gap 11 between the lateral extension walls 107, forming a pressure chamber 13 between adjacent lateral extension walls 107. This independent chamber can be annular. The pressure chamber 13 transmits pressure using the outer ring portion of the bottom wall 106 of the corresponding membrane unit 10. The outer ring portion refers to the part of the bottom wall 106 of the membrane unit 10 that is not in contact with the bottom wall 106 of the membrane unit 10 above it.

[0068] like Figure 12 As shown, in the polishing of the square substrate 7, pressure control of the four corners of the square substrate 7 is particularly important. Therefore, it is necessary to individually control the pressure of the four corner areas (corner areas 71) and the area on the square substrate 7 located inside the corners (inner circle area 70). To this end, in this embodiment, there is at least one pressure chamber 13 for transmitting pressure to the area on the square substrate 7 other than the circle tangent to any opposite side (corner areas 71) to individually adjust the pressure of the four corner areas of the square substrate 7.

[0069] It can be understood that on the square substrate 7, the area outside the circles where any opposite sides are tangent (corner area 71) is the area where the four corners of the square substrate 7 are located. For example... Figure 12 Taking a square substrate 7 as an example, the circle tangent to any opposite side of the square substrate 7 is the largest inscribed circle of the square substrate 7, and the area outside this circle (corner area 71) is the four arc-shaped corners of the square substrate 7. Taking a rectangle with unequal length and width as an example, such as... Figure 11 The circle can be a circle tangent to the short side of the square substrate 7, i.e., the largest inscribed circle of the square substrate 7. The area outside the circle (corner area 71) is two symmetrical arc-shaped areas including the long side of the square substrate 7. The circle can also be a circle tangent to the long side of the square substrate 7, and the area outside the circle is the four arc-shaped corners of the square substrate 7.

[0070] With this configuration, in this embodiment, pressure can be transmitted to the inner ring region 70 of the square substrate 7 through at least one pressure chamber 13, and pressure can be transmitted to the corner region 71 of the square substrate 7 through at least one pressure chamber 13, that is, pressure can be transmitted to the four corner regions of the square substrate 7 separately. This allows for individual control of the pressure borne by the four corner regions 71 of the square substrate 7, thereby enabling individual control of the material removal rate of the four corners during the polishing process. This compensates for the difference in material removal rate between the corner region 71 and other regions on the square substrate 7 due to speed differences, and improves the uniformity of material removal and surface flatness of the square substrate 7.

[0071] Especially when polishing large-size ultra-thin square substrates 7, by individually controlling the pressure in the pressure chamber 13 corresponding to the corner area 71 of the square substrate 7, the deformation of the edge area of ​​the large-size polishing head caused by its own weight can be compensated. This adjusts the pressure applied to the corner area 71 of the square substrate 7 due to the deformation of the edge area of ​​the polishing head during the polishing process, thereby further improving the uniformity of material removal and surface flatness of the square substrate 7.

[0072] In this invention, such as Figure 2As shown, due to the use of multiple capsule units 10 stacked together, the thickness of the bottom wall 106 of the multiple pressurization chambers 13 decreases from the inside to the outside. The thickness of the bottom wall 106 corresponding to the pressurization chamber 13 located in the center is the sum of the thicknesses of the bottom walls 106 of all capsule units 10, while the thickness of the bottom wall 106 corresponding to the outermost pressurization chamber 13 is equal to the thickness of the bottom wall 106 of the capsule unit 10.

[0073] According to Preston equation ( For material removal rate, It is Preston's constant. It is the polishing pressure. The instantaneous relative velocity of any point on the surface of the square substrate 7 with respect to the polishing pad is less than that near the edge region under the same polishing pressure. Therefore, to maintain a consistent material removal rate, it is necessary to increase the pressure near the center region of the square substrate 7, or decrease the pressure near the edge region of the square substrate 7, or both simultaneously. Overall, the capsule 1 needs to generate greater pressure in the central region. In this invention, multiple capsule units 10 are stacked to make the bottom wall 106 of the pressure chamber 13 near the center thicker, thereby maintaining sufficient rigidity and avoiding excessive deformation of the bottom wall 106 under greater pressure, thus better transmitting pressure to the central region of the square substrate 7. Furthermore, using multiple capsule units 10 to form multiple pressure chambers 13 is simpler in manufacturing process and lower in manufacturing cost. On the other hand, after using multiple capsule units 10, each capsule unit 10 is independent, making each pressure chamber 13 independent of each other, reducing the mutual influence between adjacent pressure chambers 13 during pressure changes, and further improving the pressure control and polishing effect.

[0074] For the uppermost capsule unit 10, a pressurizing chamber 13 is provided within the lateral extension wall 107 of the uppermost capsule unit 10. The pressurizing chamber 13 is used to individually adjust the pressure of the region within the circle tangent to any opposite side on the square substrate 7. Specifically, the chamber of the uppermost capsule unit 10 itself serves as a pressurizing chamber 13. The pressurizing chamber 13 is circular, and the pressure is transmitted through the bottom wall 106 of the capsule unit 10 to realize the individual adjustment of the pressure of the region (inner circle region 70) within the circle tangent to any opposite side on the square substrate 7.

[0075] In one specific embodiment, a single pressurizing cavity 13 can completely cover the inner ring area of ​​the square substrate. In this case, the pressurizing cavity 13 is located in the center of the entire capsule and is circular in shape. The diameter of the pressurizing cavity 13 is equal to the diameter of the inner ring area of ​​the square substrate 7. Alternatively, multiple pressurizing cavities 13 can be used to collectively cover the maximum inscribed circle of the square substrate 7. In this case, the multiple pressurizing cavities 13 will include at least one circular pressurizing cavity 13 and one annular pressurizing cavity 13, requiring two capsule units 10 to be stacked, such as... Figure 10 Regions 4 and 5 shown represent a pressurization chamber 13. The circular pressurization chamber 13 (i.e., region 5) is located in the middle of the entire capsule, and its diameter is smaller than the maximum inscribed circle diameter of the square substrate 7. The outer diameter of the annular pressurization chamber 13 (i.e., region 4) located on the outside is equal to the maximum inscribed circle diameter of the square substrate 7.

[0076] Since there is a lateral extension wall 107 between adjacent pressurizing chambers 13, and the lateral extension wall 107 has a certain wall thickness, there is a gap between adjacent pressurizing chambers 13. The width of the gap is approximately equal to or equal to the wall thickness at the lower end of the lateral extension wall 107.

[0077] In one embodiment, a circle tangent to any opposite side on the square substrate 7 is located between two adjacent pressure chambers 13, corresponding to the lower end of the lateral extension wall 107 between the two adjacent pressure chambers 13. This circle can be located at any position on the lower end of the lateral extension wall 107. Taking a square substrate 7 as an example, there is a pressure chamber 13 in the capsule 1 with an outer boundary diameter smaller than the length of the square substrate 7. This pressure chamber 13 is used to transmit pressure to the inner ring region 70 on the square substrate 7. There is a pressure chamber 13 with an inner boundary diameter larger than the length of the square substrate 7. This pressure chamber 13 is used to transmit pressure to the corner region 71 on the square substrate 7. The same applies to square substrates 7 with unequal lengths and widths, which will not be described in detail here.

[0078] In another embodiment, the circle tangent to any opposite side on the square substrate 7 is located near the boundary between two adjacent pressure cavities 13. Specifically, the circle tangent to any opposite side on the square substrate 7 can be located near the outer boundary of a pressure cavity 13, or the circle tangent to any opposite side on the square substrate 7 can be located near the inner boundary of a pressure cavity 13. When located near the outer boundary of a pressure cavity 13, the diameter of the outer boundary of the pressure cavity 13 can be equal to the maximum inscribed circle diameter of the square substrate 7, or equal to the maximum tangent circle diameter on the square substrate 7 tangent to the long side, or any value between the maximum inscribed circle diameter and the maximum tangent circle diameter, or slightly smaller than the maximum inscribed circle diameter of the square substrate, or slightly larger than the maximum tangent circle diameter.

[0079] Similarly, when located near the inner boundary of a pressurizing cavity 13, the inner boundary of the pressurizing cavity 13 can be equal to the maximum inscribed circle diameter of the square substrate 7, or equal to the maximum tangent circle diameter on the square substrate 7 that is tangent to the long side, or any value between the maximum inscribed circle diameter and the maximum tangent circle diameter, or slightly smaller than the maximum inscribed circle diameter of the square substrate, or slightly larger than the maximum tangent circle diameter.

[0080] However, in any case, there is at least one pressurizing chamber 13 that can transmit pressure to the area outside the circle tangent to any opposite side on the square substrate 7, so as to individually adjust the pressure in the area where the four corners of the square substrate 7 are located.

[0081] For example, when the length and width of the square substrate are 500 mm, the diameter of the outer boundary or the inner boundary of a pressure chamber fluctuates within ±10% of 500 mm. When the length and width are 1000 mm, the diameter of the outer boundary or the inner boundary of a pressure chamber fluctuates within ±5% of 1000 mm. That is, the larger the size of the square substrate, the smaller the percentage difference between the diameter of the corresponding pressure chamber boundary and the diameter of the largest inscribed circle of the square substrate, thus making the boundary of the pressure chamber as close as possible to the edge of the square substrate.

[0082] In a preferred embodiment, there is a pressure chamber 13 whose outer boundary diameter is equal to the maximum inscribed circle diameter of the square substrate 7, so that the pressure chamber 13 can transmit pressure to the central area of ​​the edge of the square substrate 7, thereby improving the polishing effect of the area.

[0083] In some embodiments, multiple pressure chambers 13 can be used to collectively cover the inner ring region 70 of the square substrate 7 (i.e., the area within the circle tangent to any opposite side on the square substrate). Obviously, the more pressure chambers 13 there are, the more refined the zoned pressure control of the inner ring region 70 of the square substrate 7 can be achieved, which can improve the polishing effect. However, the corresponding production cost and manufacturing requirements become higher, and the difficulty of pressure control also increases. Therefore, the corresponding structural form can be selected according to actual needs, and this embodiment does not impose any restrictions.

[0084] In addition, for the pressure chamber that transmits pressure to the corner area 71 of the square substrate 7 (the area on the square substrate other than the circle tangent to any opposite side), the diameter of its outer boundary can be equal to the maximum outer circle diameter of the square substrate 7, or it can be greater than the maximum outer circle diameter of the square substrate 7.

[0085] When equal, the edge of the bottom wall 106 of the pressurized cavity 13 just presses against the apex corner of the square substrate 7 (e.g., Figure 10As shown in region 2), pressure control at the apex becomes more difficult. Therefore, in this embodiment, at least one pressurizing chamber 13 has an inner boundary diameter smaller than the diameter of the largest circumscribed circle of the square substrate 7, and an outer boundary diameter larger than the diameter of the largest circumscribed circle of the square substrate 7.

[0086] Specifically, in this embodiment, the area covered by the pressurizing chamber 13 when transmitting pressure may slightly extend beyond the apex of the square substrate 7 (e.g., Figure 11 As shown in region 2), the bottom wall 106 of the pressurized cavity 13 corresponding to region 2 can better transmit pressure to the top corner of the square substrate.

[0087] In one embodiment, at least two of the pressure chambers 13 are located within a circle tangent to any opposite side of the square substrate 7. That is, at least two adjacent pressure chambers 13 are used to transmit pressure to both the inner and outer layers of the inner ring region 70, effectively dividing the inner ring region 70 into two inner and outer distributed regions. By using two pressure chambers 13 to individually control the pressure in the corresponding regions, more precise pressure control is achieved in the inner ring region 70, improving the polishing effect of the inner ring region 70 on the square substrate 7.

[0088] Similarly, in one embodiment, at least two of the pressure chambers 13 are used to transmit pressure to areas other than the circle tangent to any opposite side on the square substrate 7, so as to apply pressure individually to different areas of the corner area 71 of the square substrate 7. That is, at least two adjacent pressure chambers 13 among the plurality of pressure chambers are used to transmit pressure to the inner and outer layers of the corner area 71, that is, the corner area 71 is further divided into two layers of inner and outer distributed areas. By using two pressure chambers 13 to perform individual pressure control on the corresponding areas, more refined pressure control can be achieved in the corner area 71, thereby improving the polishing effect of the corner area 71 on the square substrate 7.

[0089] When polishing a square substrate 7 using a circular polishing head, a supporting plate 5 needs to be arranged on the outside of the square substrate 7 to restrict the horizontal position of the square substrate 7 on the polishing pad. Simultaneously, pressure needs to be applied to the supporting plate 5 to press it firmly onto the polishing pad. Therefore, in this embodiment, at least one of the multiple pressure chambers 13 (e.g., ...) is used to press the supporting plate 5 firmly onto the polishing pad. Figure 10 The pressure is transmitted to the square substrate 5 in area 1).

[0090] Specifically, such as Figure 9 As shown, the auxiliary plate 5 is a circular plate with a square hole in the center, which is used to accommodate the square substrate 7. Among the multiple pressure chambers 13, each pressure chamber 13 corresponds individually to the corner area of ​​the square substrate 7 (e.g., Figure 10The area 2 shown also corresponds to a part of the supporting piece 5. The pressure chamber 13 transmits pressure to the supporting piece 5 when it transmits pressure to the corner area of ​​the square substrate 7. However, the diameter of the pressure chamber 13 should not exceed the square substrate 7 too much. The pressure chamber 13 can only correspond to the inner ring area of ​​the supporting piece 5. For the edge area, an additional pressure chamber 13 is required.

[0091] In one implementation, such as Figure 2 , Figure 10 and Figure 11 As shown, the capsule 1 includes five capsule units 10, namely, a first capsule unit 101, a second capsule unit 102, a third capsule unit 103, a fourth capsule unit 104, and a fifth capsule unit 105, distributed sequentially from the outside to the inside. The pressure chamber 13 (region 1) formed between the first capsule unit 101 and the second capsule unit 102 is used to transmit pressure to the edge region of the substrate 5. The two pressure chambers 13 (regions 2 and 3) formed between the second capsule unit 102 and the third capsule unit 103, and between the third capsule unit 103 and the fourth capsule unit 104, together transmit pressure to the corner regions of the square substrate 7. The pressure chamber 13 (region 4) formed between the fourth capsule unit 104 and the fifth capsule unit 105, and the pressure chamber 13 (region 5) of the fifth capsule unit 105 itself, together transmit pressure to the maximum inscribed circle coverage area of ​​the square substrate 7. Of course, the above description is not restrictive and can be adjusted according to actual needs.

[0092] During the pressure transmission process, the pressure in the pressurizing cavity 13 is transmitted to the square substrate 7 through the corresponding bottom wall 106. In order to ensure a better pressure transmission effect, it is desirable that the bottom wall 106 of the pressurizing cavity 13 is more likely to generate stiffness changes than the lateral extension wall 107. Therefore, in this embodiment, the stiffness of the lateral extension wall located outside the pressurizing cavity is greater than the composite stiffness of the bottom wall located below the pressurizing cavity.

[0093] Specifically, since the thickness of the bottom wall 106 corresponding to the pressurization chamber 13 at different locations is different, the bottom wall 106 of the central pressurization chamber 13 is thicker overall, equal to the sum of the thicknesses of the bottom walls 106 of multiple capsule units 10, while the bottom wall 106 of the outermost pressurization chamber 13 is the thinnest, equal to the thickness of the bottom wall 106 of a single capsule unit 10. Therefore, the stiffness of the bottom wall 106 of different pressurization chambers 13 is different. In the design, the stiffness of the lateral extension wall 107 needs to be greater than the stiffness of the single-layer bottom wall 106 of each pressurization chamber 13 and the composite stiffness of the multiple bottom walls 106. In practical applications, the capsule units 10 at different locations can have lateral extension walls 107 with different stiffnesses. The lateral extension wall 107 of the capsule unit 10 located at the center has the greatest stiffness, and the lateral extension wall 107 of the capsule unit 10 located on the outermost side has the least stiffness.

[0094] When polishing a large-sized square substrate 7, the overall size of the membrane 1 is also larger, resulting in a relatively larger diameter for the bottom wall 106 of each membrane unit 10. This can easily cause bending and wrinkling of the bottom wall 106 of the membrane unit 10, leading to poor pressure transmission. Therefore, as... Figures 3 to 5 As shown, this embodiment provides a polishing indenter, including the aforementioned capsule and a first support member. The first support member 8 is sleeved and fixed inside each capsule unit 10. The diameter of the outer side of the first support member 8 is larger than the inner diameter of the lateral extension wall 107 of the corresponding capsule unit 10, and the outer side of the first support member 8 is in contact with the inner side of the lateral extension wall 107.

[0095] Specifically, in this embodiment, the first support member 8 is a rigid structure, and each capsule unit 10 is equipped with a first support member 8. The diameter of the outer surface of the first support member 8 is larger than the inner diameter of the lateral extension wall 107 of the corresponding capsule unit 10. Thus, after the first support member 8 is fitted into the capsule unit 10, the outer surface of the first support member 8 is in contact with the inner surface of the lateral extension wall 107 and applies an outward expansion force (e.g., ...) to the bottom wall 106 of the capsule unit 10. Figure 6 As shown in the figure, this tightens the bottom wall 106, ensuring its flatness. After multiple capsule units 10 are stacked, the tightened bottom wall 106 can also improve the fit of the bottom walls 106 of adjacent capsule units 10, preventing gas from entering the fit surface of adjacent bottom walls 106 and causing local bulging when pressurizing the pressurization chamber 13.

[0096] At the same time, by applying an outward expansion force to the bottom wall 106 of the capsule unit 10 through the first support member 8, the stiffness of the bottom wall 106 can be increased, thereby enabling better pressure transmission.

[0097] Based on the above embodiments, the capsule 1 further includes a second support member 9, which is sleeved and fixed on the outside of each capsule unit 10. The diameter of the inner side of the second support member 9 is smaller than the outer diameter of the lateral extension wall 107 after it is attached to the first support member 8. The lateral extension wall 107 is clamped by the first support member 8 and the second support member 9.

[0098] Specifically, in this embodiment, the second support member 9 is a rigid structure, and each capsule unit 10 is equipped with a second support member 9. The lateral extension wall 107 of the capsule unit 10 is clamped by the first support member 8 and the second support member 9, thereby further improving the rigidity of the lateral extension wall 107. In one embodiment, the first support member 8 and the second support member 9 are configured as rings.

[0099] The first support member 8 and the second support member 9 clamp the lower part of the lateral extension wall 107. The combined stiffness of the first support member 8, the lower part of the lateral extension wall 107, and the second support member 9 is greater than the combined stiffness of the bottom wall 106 of each pressurizing chamber 13.

[0100] Specifically, in this embodiment, the height of the first support member 8 and the second support member 9 is less than the height of the lateral extension wall 107, and the first support member 8 and the second support member 9 are clamped at the lower part of the lateral extension wall 107, so as to better tighten the bottom wall 106 of the capsule unit 10 and improve the rigidity of the part of the lateral extension wall 107 near the bottom wall 106.

[0101] Based on the above embodiments, the stiffness of the portion of the lateral extension wall 107 located above the first support member 8 and the second support member 9 can also be set to be greater than the composite stiffness of the bottom wall 106 of each pressurizing chamber 13.

[0102] To better tighten the bottom wall 106 of the capsule unit 10, such as Figure 4 As shown, in this embodiment, the lower part of the lateral extension wall 107 of the capsule unit 10 and the connection point 1050 with the bottom wall 106 form an acute angle. Specifically, in this embodiment, the connection point 1050 is a part of the lower part of the lateral extension wall 107, the connection point 1050 forms an acute angle with the bottom wall 106, and the outer surface of the first support member 8 is an inclined surface 80, which fits against the inner surface of the connection point 1050.

[0103] Specifically, with this configuration, the first support member 8 applies an upward force at the connection point 1050 (e.g., Figure 7 As shown in the figure, the direction of the force is at an obtuse angle to the bottom wall 106, thereby enabling better stretching of the bottom wall 106 to a flat surface. To improve the fit between the inclined surface 80 and the connection 1050, the maximum and minimum diameters of the inclined surface 80 are greater than the maximum and minimum inner diameters of the connection 1050, respectively.

[0104] To prevent the first support member 8 from damaging the capsule, in this embodiment, the end of the first support member 8 near the bottom wall 106 is provided with an arc-shaped chamfer, which fits against the inner side of the connection 1050 and the bottom wall 106.

[0105] The membrane needs to be installed onto the housing 2 of the polishing head, and each pressurizing chamber 13 needs to be sealed after installation. This is to facilitate the installation of the membrane unit 10. Figures 2 to 5As shown, in this embodiment, the capsule unit 10 further includes a folded portion 109, which is located at the end of the lateral extension wall 107 away from the bottom wall 106. Specifically, the folded portion 109 can be flipped inward or outward, and its upper surface can fit against the end face of the housing 2 of the polishing head to form a sealing surface, thereby sealing each pressurizing chamber 13 and ensuring sufficient sealing performance. Furthermore, after the folded portion 109 is provided, there is an angle between the folded portion 109 and the lateral extension wall 107. This angle gradually increases as the bottom wall 106 of the capsule unit 10 moves downward, thereby providing additional displacement and preventing the lateral extension wall 107 from generating tensile elastic force.

[0106] To further facilitate sealing, in this embodiment a sealing ring 108 is provided at the end of the folded portion 109 away from the lateral extension wall 107. The sealing ring 108 is used to press tightly against the housing 2 of the polishing head to seal the corresponding pressure chamber 13.

[0107] Optionally, the polishing indenter also includes a housing 2, a retaining ring 4, a retaining ring retainer 3, and a sealing ring 6;

[0108] The retaining ring 4 is fixed to the lower end of the housing 2 by the retaining ring fastener 3;

[0109] The capsule unit 10 also includes a folded portion 109, which is located at the end of the lateral extension wall 107 away from the bottom wall 106. The folded portion 109 of the outermost capsule unit 10 is pressed and fixed between the retaining ring fixing member 3 and the housing 2, and the folded portions 109 of the remaining capsule units 10 are pressed and fixed to the lower end face of the housing 2 by the sealing ring 6.

[0110] The housing 2 is provided with multiple air passages, which are connected to the corresponding pressurization chambers 13.

[0111] In this embodiment, the upper end of the housing 2 is used to connect with the machine tool, and the retaining ring fastener 3 is fixed to the lower end of the housing 2, and can be fixed to the housing 2 by screws. The retaining ring 4 is fixed to the lower end of the retaining ring fastener 3 and can be glued for fixation. The retaining ring 4 can be a circular ring, and the capsule 1 is installed in the retaining ring 4 and fixedly connected to the lower end face of the housing 2. During polishing, the auxiliary piece 5 is also installed in the retaining ring 4 to restrict the square substrate 7. In multiple capsule units 10, the folded portion 109 at the upper end of each capsule unit 10 needs to be fixed to the housing 2 to seal the corresponding pressure chamber 13. To save parts, in this embodiment, the folded portion 109 of the outermost capsule unit 10 can be pressed against the housing 2 by the retaining ring fastener 3, and the folded portions 109 of the remaining capsule units 10 can be pressed and fixed against the housing 2 by the corresponding sealing ring 6. When five capsule units 10 are included, three sealing rings 6 are required.

[0112] In one embodiment, the lower end face of the housing 2 is provided with a plurality of annular grooves 20 distributed from the inside to the outside. The annular grooves 20 correspond to the junction 110 of the folded portion 109 of the capsule unit 10 and the lateral extension wall 107, respectively, and provide movement space for the junction 110 through the annular grooves 20.

[0113] Specifically, since there is an angle between the folded part 109 and the lateral extension wall 107, the junction 110 where the angle is located will generate a certain movement during the movement of the bottom wall 106. The annular groove can provide movement space for the junction 110, and the width of the annular groove can be designed according to the requirements.

[0114] According to another aspect of the present invention, a polishing apparatus is provided, comprising the aforementioned membrane 1 or the aforementioned polishing head.

[0115] According to another aspect of the present invention, a method for polishing a square substrate is provided, employing the aforementioned membrane 1, or the aforementioned polishing head, or the aforementioned polishing equipment, the method comprising:

[0116] A supporting piece 5 is arranged on the polishing pad. The supporting piece 5 is circular and has a square hole. The length and width of the square hole match the length and width of the square substrate 7 to be polished. The thickness of the supporting piece 5 is slightly less than the thickness of the square substrate 7. The diameter of the supporting piece 5 matches the inner diameter of the retaining ring 4 on the polishing pressure head.

[0117] The square substrate 7 to be polished is placed inside the square hole, and the lower surface of the square substrate 7 is in contact with the polishing pad. The square hole restricts the horizontal movement of the square substrate 7. Specifically, the square substrate 7 can be picked up by a robotic arm and transferred into the square hole. During the polishing process, the auxiliary piece 5 is constrained within the retaining ring 4, and the square substrate 7 is constrained within the auxiliary piece 5, thereby constraining the horizontal position of the square substrate 7.

[0118] The polishing head is moved to adjust the position of the capsule 1 so that each of the pressure chambers 13 on the capsule 1 corresponds to a designated area on the square substrate 7 and the supporting sheet 5. That is, some of the pressure chambers 13 on the capsule 1 correspond to the inner ring area divided on the square substrate 7, and some of the pressure chambers 13 correspond to the corner areas divided.

[0119] The lower surface of the capsule 1 is attached to the upper surface of the square substrate 7;

[0120] The pressure within each of the pressurized chambers 13 in the capsule 1 is controlled to adjust the pressure transmitted to different areas on the square substrate 7 and the supporting sheet 5 to a set value. The specific pressure value can be determined according to parameters such as the size and rotation speed of the square substrate 7, and this embodiment does not impose any limitations on it.

[0121] The polishing head and the polishing pad are rotated to polish the square substrate 7.

[0122] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the invention by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the invention should be included within the scope of protection of the invention.

Claims

1. A membrane for polishing square substrates, characterized in that, include: At least two capsule units are stacked together. Each capsule unit includes a bottom wall and a lateral extension wall surrounding the edge of the bottom wall. The bottom walls of adjacent capsule units are in contact with each other. A pressurization cavity is provided between the lateral extension walls of adjacent capsule units. The stiffness of the lateral extension wall located outside the pressurization cavity is greater than the combined stiffness of the bottom wall located below the pressurization cavity. At least one of the pressurizing chambers is provided for transmitting pressure to areas other than the circle tangent to any opposite side on the square substrate, so as to individually adjust the pressure in the areas where the four corners of the square substrate are located.

2. The capsule according to claim 1, characterized in that, The uppermost capsule unit has a pressure chamber within its lateral extension wall, which is used to individually adjust the pressure in a region within a circle tangent to any opposite side of the square substrate.

3. The capsule according to claim 1, characterized in that, A circle on the square substrate that is tangent to any opposite side is located between two adjacent pressurized cavities.

4. The capsule according to claim 1, characterized in that, The circle on the square substrate that is tangent to any opposite side is located near the boundary between two adjacent pressurized cavities.

5. The membrane for polishing square substrates according to claim 1, characterized in that, At least one of the pressurized chambers has an inner boundary diameter smaller than the diameter of the largest circumscribed circle of the square substrate, and an outer boundary diameter larger than the diameter of the largest circumscribed circle of the square substrate.

6. The membrane for polishing square substrates according to claim 1, characterized in that, At least two of the pressurized cavities are located within a circle on the square substrate that is tangent to any opposite side.

7. The membrane for polishing square substrates according to claim 1, characterized in that, At least two of the pressurizing chambers are provided for transmitting pressure to areas other than the circles tangent to any opposite side of the square substrate, so as to apply independent pressure to different areas at the four corners of the square substrate.

8. The membrane for polishing square substrates according to claim 1, characterized in that, At least one of the pressurized chambers is present for transmitting pressure to the pad located outside the square substrate.

9. The membrane for polishing square substrates according to claim 1, characterized in that, The lower part of the lateral extension wall forms an acute angle with the bottom wall at its connection.

10. The membrane for polishing a square substrate according to claim 1, characterized in that, The capsule unit further includes a folded portion located at the end of the lateral extension wall away from the bottom wall.

11. A polishing head, characterized in that, Includes the capsule as described in any one of claims 1 to 10, and a first support member; The first support member is sleeved and fixed inside each of the capsule units. The diameter of the outer side of the first support member is larger than the inner diameter of the lateral extension wall. The outer side of the first support member is in contact with the inner side of the lateral extension wall.

12. The polishing head according to claim 11, characterized in that, It also includes a second support member, which is sleeved and fixed to the outside of each of the capsule units. The diameter of the inner side of the second support member is smaller than the outer diameter of the lateral extension wall after it is attached to the first support member. The lateral extension wall is clamped by the first support member and the second support member.

13. The polishing head according to claim 12, characterized in that, The first support member and the second support member are configured as rings.

14. The polishing head according to claim 12, characterized in that, When the lower part of the lateral extension wall forms an acute angle with the connection of the bottom wall, the outer side of the first support member is an inclined surface, and the inclined surface fits against the inner side of the connection.

15. The polishing head according to claim 14, characterized in that, The first support member has an arc-shaped chamfer at one end near the bottom wall, and the arc-shaped chamfer fits against the inner side of the connection and the bottom wall.

16. The polishing head according to claim 11, characterized in that, It also includes a housing, a retaining ring, a retaining ring retainer, and a sealing ring; The retaining ring is fixed to the lower end of the housing by the retaining ring fastener; The capsule unit further includes a folded portion located at the end of the lateral extension wall away from the bottom wall. The folded portion of the lowest capsule unit is pressed and fixed between the retaining ring and the housing. The folded portions of the remaining capsule units are pressed and fixed to the lower end face of the housing by the sealing ring. The housing is provided with multiple air passages, which are connected to the corresponding pressurization chambers.

17. The polishing head according to claim 16, characterized in that, The lower end face of the housing is provided with a plurality of annular grooves distributed from the inside to the outside. The annular grooves correspond to the junctions between the folded portion and the lateral extension wall of the capsule unit, and provide movement space for the junctions through the annular grooves.

18. A polishing device, characterized in that, Includes the capsule as described in any one of claims 1 to 10, or the polishing head as described in any one of claims 11 to 17.

19. A method for polishing a square substrate, characterized in that, Using the capsule as described in any one of claims 1 to 10, or the polishing indenter as described in any one of claims 11 to 17, the method comprises the following steps: A circular pad with a square hole is arranged on the polishing pad. The square substrate to be polished is placed in the square hole, and the lower surface of the square substrate is in contact with the polishing pad. The square hole restricts the horizontal movement of the square substrate. Control the movement of the polishing head and adjust the position of the membrane so that each of the pressure chambers on the membrane corresponds to a set area on the square substrate and the supporting sheet; The lower surface of the capsule is made to adhere to the upper surface of the square substrate; The pressure in each of the pressurized chambers in the capsule is controlled to adjust the pressure transmitted to different areas on the square substrate and the diaphragm to a set value; The polishing head and the polishing pad are rotated to polish the square substrate.

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