Flexible circuit board bending equipment for electronic product processing and use method thereof

Abstract

The invention discloses a flexible circuit board bending device for electronic product processing and a using method thereof, and relates to the technical field of flexible circuit board processing, the flexible circuit board bending device comprises an operation table, the upper portion of the operation table is fixedly connected with a feeding mechanism and a material conveyor, and the feeding mechanism comprises a three-axis moving assembly; the device is characterized in that the end part of the three-axis moving assembly is fixedly connected with an adjusting mechanism, and the adjusting mechanism is positioned above the material conveyor. According to the feeding suction cup assembly, the distance between the two sets of suction cups is flexibly adjusted through the driving assembly according to the size of a mold, so that the feeding suction cup assembly can rapidly and accurately adapt to the molds of different specifications, the molds and flexible circuit boards placed in the molds are efficiently carried to the surface of a material conveyor, frequent manual intervention is not needed in the whole process, and the production efficiency is improved. The feeding time is greatly shortened, and the production efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of flexible circuit board processing, and specifically to a flexible circuit board bending device for electronic product processing and its usage method. Background Art

[0002] With the continuous evolution of electronic devices towards miniaturization and integration, the flexible circuit board, as the core carrier for connecting precision components, its three-dimensional spatial layout ability has become the key to breaking through the limitations of traditional planar design. The technological development of bending devices was born to meet this demand. Its core goal is to solve the problems of reliable connection and efficient production of flexible circuit boards in complex environments through the deep integration of materials science, precision machinery, and intelligent control. Bending operation is the key process for flexible circuit boards to adapt to complex environments and optimize spatial layout. Its role is not limited to the change in physical form, but more importantly, through the combination of materials and processes, it improves the reliability, environmental adaptability, and production efficiency of products, and promotes the development of electronic devices towards miniaturization and high reliability.

[0003] For example, the patent with publication number CN211792289U discloses a flexible circuit board automatic bending device, which includes a frame. On the frame, there are a product positioning mechanism, a bending mechanism, an anti-breakage mechanism, and a shaping and pressure-holding mechanism. The bending mechanism and the anti-breakage mechanism are arranged on one side of the product positioning mechanism. The anti-breakage mechanism presses the area to be bent of the flexible circuit board, and the shaping and pressure-holding mechanism is arranged above the bending mechanism.

[0004] However, in the prior art, during the operation of flexible circuit board bending devices, the automated loading process should be an accurate and efficient starting step. However, in reality, manual intervention is frequently required to check and adjust the position of the circuit board. This not only consumes manpower, but also due to the inevitable errors in manual operations, it is difficult to ensure the consistency of each adjustment. Especially for small flexible circuit boards commonly used in consumer electronics products, whose dimensional accuracy requirements are in the millimeter or even sub-millimeter level, even a slight deviation in manual adjustment can easily lead to deviations in subsequent bending processes, ultimately resulting in a decrease in product qualification rate. Summary of the Invention

[0005] The purpose of the present invention is to provide a flexible circuit board bending device for electronic product processing and its usage method, so as to solve the problem in the prior art described in the above background art that during the operation of flexible circuit board bending devices, the automated loading process should be an accurate and efficient starting step. However, in reality, manual intervention is frequently required to check and adjust the position of the circuit board. This not only consumes manpower, but also due to the inevitable errors in manual operations, it is difficult to ensure the consistency of each adjustment.

[0006] To achieve the above object, the present invention provides the following technical solution: A flexible circuit board bending device for electronic product processing, including an operating table, on which a feeding mechanism, a material conveyor, a first bending mechanism and a second bending mechanism are respectively fixedly connected. The feeding mechanism, the first bending mechanism and the second bending mechanism are located on the same side of the material conveyor, and the feeding mechanism, the first bending mechanism and the second bending mechanism are arranged in sequence. The feeding mechanism includes a three-axis moving component, and the end of the three-axis moving component is fixedly connected with an adjusting mechanism. The adjusting mechanism is located above the material conveyor. The adjusting mechanism includes a first fixing frame. The upper part of the first fixing frame is fixedly connected with a driving component, and the lower part of the first fixing frame is provided with a feeding suction cup component. The feeding suction cup component is composed of an external control unit and two suction cup units. The driving component is used to adjust the distance between the two suction cups according to the size of the flexible circuit board to be bent. The material conveyor is used to feed the mold on which the flexible circuit board to be bent is placed;

[0007] Positioning mechanisms are arranged on the sides of the first bending mechanism and the second bending mechanism. The positioning mechanisms are used to position and fix the mold and the flexible circuit board inside it. The first bending mechanism is used to initially bend the flexible circuit board, and the second bending mechanism is used to finally bend the flexible circuit board.

[0008] Preferably, the driving component includes a servo motor, a gear and a wedge-shaped push block. The servo motor is fixedly connected with the first fixing frame, and the output end of the servo motor is fixedly connected with a first lead screw. The first lead screw is rotatably connected with the first fixing frame, and a screw block is threadedly connected to the surface of the first lead screw. A rack is fixedly connected to the side of the screw block. The gear meshes with the rack and is rotatably connected with the first fixing frame. A second lead screw is fixedly connected to the bottom of the gear. The second lead screw is threadedly connected with the wedge-shaped push block.

[0009] Preferably, a reset component is fixedly connected to the inner wall of the first fixing frame. The end of the reset component is fixedly connected with a moving frame. The side of the moving frame is attached to the side of the wedge-shaped push block. A first limiting rod is fixedly connected to the side of the wedge-shaped push block. The first limiting rod is slidably connected with the moving frame.

[0010] Preferably, the reset component includes a telescopic rod and a second limiting rod. One end of the telescopic rod is fixedly connected with the inner wall of the first fixing frame, and the other end of the telescopic rod is fixedly connected with the moving frame. A spring is arranged on the surface of the telescopic rod. One end of the spring is fixedly connected with the inner wall of the first fixing frame, and the other end of the spring is fixedly connected with the moving frame. The second limiting rod is inserted into the first fixing frame, and the end of the second limiting rod is fixedly connected with the moving frame.

[0011] Preferably, a third sliding and guiding assembly is fixedly connected to the lower part of the rack, the third sliding and guiding assembly is fixedly connected to the first fixing frame, a second sliding and guiding assembly is fixedly connected to the side surface of the wire block, and the second sliding and guiding assembly is fixedly connected to the first fixing frame.

[0012] Preferably, a first connecting frame is fixedly connected to the bottom of the first fixing frame, a first sliding and guiding assembly is fixedly connected to the bottom of the first connecting frame, a connecting plate is fixedly connected to the bottom of the first sliding and guiding assembly, and a set of sucker units are installed on the side surface of the connecting plate.

[0013] Preferably, the first bending mechanism includes a second fixing frame, the second fixing frame is fixedly connected to the operating table, and a first bending machine assembly is installed on the side surface of the second fixing frame. The second bending mechanism includes a third fixing frame, the third fixing frame is fixedly connected to the operating table, and a second bending machine assembly is installed on the side surface of the third fixing frame.

[0014] Preferably, the positioning mechanism includes a first cylinder, a second cylinder and a third cylinder. The first cylinder is fixedly connected to the operating table, and a first limiting frame is fixedly connected to the output end of the first cylinder. The second cylinder is fixedly connected to the second fixing frame, and a second limiting frame is fixedly connected to the output end of the second cylinder. The third cylinder is fixedly connected to the second fixing frame, and a third limiting frame is fixedly connected to the output end of the third cylinder. Both the first limiting frame and the second limiting frame are right-angle brackets, and the first limiting frame and the second limiting frame are arranged at the diagonal positions of the mold. The four corners of the mold are all right angles. The third limiting frame is located above the mold. The mold is provided with limiting rods, and the surface of the third limiting frame is provided with limiting holes adapted to the limiting rods.

[0015] Preferably, displacement detectors are arranged on the sides of both the first bending mechanism and the second bending mechanism. The displacement detectors are fixedly connected to the upper part of the operating table. The displacement detectors are used to monitor the precision of the bending operations of the first bending mechanism and the second bending mechanism. Auxiliary mechanisms are fixedly connected to the bottoms of both the first bending mechanism and the second bending mechanism. The auxiliary mechanisms are used to adjust the positions of the first bending mechanism and the second bending mechanism according to the detection results of the displacement detectors. The auxiliary mechanism includes a driving mechanism and a fourth sliding and guiding assembly. The output end of the driving mechanism is fixedly connected to an eccentric shaft. A bushing is sleeved on the surface of the eccentric shaft. The fourth sliding and guiding assembly is fixedly connected to the upper part of the operating table, and a second connecting frame is fixedly connected to the upper part of the fourth sliding and guiding assembly. The bushing is fixedly connected to the side surface of the second connecting frame.

[0016] A using method of a flexible circuit board bending device for electronic product processing includes the following steps:

[0017] S1. Place the flexible circuit board in the bending mold. Stack the molds on the upper part of the operating table. Adjust the position of the adjusting mechanism through the three-axis moving component. According to the size of the mold, adjust the distance between the two groups of suction cups through the driving component, so that the loading suction cup component can load the mold and the flexible circuit board placed inside it onto the surface of the material conveyor;

[0018] S2. Move the mold to the inside of the first limit frame through the material conveyor. At the same time, the third limit frame limits the upper part of the flexible circuit board, and the second limit frame and the first limit frame clamp and limit the mold to ensure the accurate position of the flexible circuit board;

[0019] S3. Then, the first bending machine component bends the flexible circuit board for the first time, and the angle of the first bend is one-third to one-half of the final bending angle;

[0020] S4. Finally, move the flexible circuit board that has been bent for the first time to the lower part of the second bending machine component through the material conveyor, and bend the flexible circuit board according to the set bending angle through the second bending machine component.

[0021] Compared with the prior art, the beneficial effects of the present invention are:

[0022] 1. In the present invention, through the driving component, according to the size of the mold, the distance between the two groups of suction cups is flexibly adjusted, which enables the loading suction cup component to quickly and accurately adapt to molds of different specifications, and efficiently transport the mold and the flexible circuit board placed inside it to the surface of the material conveyor. The entire process does not require frequent manual intervention, greatly shortening the loading time and improving production efficiency. Then, the first limit frame, the second limit frame, and the third limit frame jointly form a stable limiting system for the mold and the flexible circuit board. The first limit frame and the second limit frame clamp and limit from both sides of the mold to effectively fix the position of the mold and prevent it from shifting during the processing. The third limit frame limits the upper part of the flexible circuit board to ensure that the flexible circuit board always maintains an accurate position during the bending process, significantly reducing the bending deviation caused by inaccurate position, thereby improving product quality;

[0023] 2. In the present invention, by precisely controlling the rotation amount of the second lead screw, the vertical displacement of the wedge-shaped push block can be accurately controlled, and then the horizontal position of the moving frame can be precisely adjusted, and finally the high-precision fine adjustment of the position of the loading suction cup component can be realized. This design enables the system to accurately adjust the position of the loading suction cup component even when facing small position adjustment requirements by precisely controlling the movement of each component, ensuring that it can accurately adsorb the edge of the mold, avoiding interference with the flexible circuit board inside the mold, ensuring the accurate position of the flexible circuit board inside the mold, and improving the processing quality of the product;

[0024] 3. In the present invention, during the bending process of the flexible circuit board, once a deviation occurs in the position of the bending processing end, the displacement detector can quickly capture the distance change. When the displacement detector detects a distance change, that is, when the bending accuracy deviates, the system quickly starts feedback adjustment. After receiving the signal, the driving mechanism drives the eccentric shaft to rotate. Due to the unique eccentric structure of the eccentric shaft, when rotating, it can accurately apply a pushing or pulling force to the bushing. The time interval from detecting the deviation to starting the adjustment is extremely short, usually within hundreds of milliseconds, ensuring that the positions of the first bending machine assembly and the second bending machine assembly can be adjusted in a timely manner and always remain at the precise bending position, greatly improving the bending accuracy of the flexible circuit board, ensuring that the product meets strict dimensional accuracy requirements, and improving product quality and the yield rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 FIG. 6 is a first three-dimensional structure diagram of a flexible circuit board bending device for processing electronic products according to the present invention;

[0026] Figure 2 FIG. 7 is a second three-dimensional structure diagram of a flexible circuit board bending device for processing electronic products according to the present invention;

[0027] Figure 3 FIG. 8 is a three-dimensional structure diagram of a positioning mechanism in a flexible circuit board bending device for processing electronic products according to the present invention;

[0028] Figure 4 FIG. 9 is a three-dimensional structure diagram of a loading mechanism in a flexible circuit board bending device for processing electronic products according to the present invention;

[0029] Figure 5 FIG. 10 is a three-dimensional structure diagram of a first sliding guide assembly in a flexible circuit board bending device for processing electronic products according to the present invention;

[0030] Figure 6 FIG. 11 is a three-dimensional structure diagram of a rack in a flexible circuit board bending device for processing electronic products according to the present invention;

[0031] Figure 7 FIG. 12 is a three-dimensional structure diagram of a wedge-shaped push block in a flexible circuit board bending device for processing electronic products according to the present invention;

[0032] Figure 8 FIG. 13 is a schematic diagram of the moving process of a moving frame in a flexible circuit board bending device for processing electronic products according to the present invention;

[0033] Figure 9 FIG. 14 is a three-dimensional structure diagram of a positioning mechanism in a flexible circuit board bending device for processing electronic products according to the present invention;

[0034] Figure 10This is a three-dimensional structural schematic diagram of the shaft sleeve of a flexible circuit board bending device for electronic product processing according to the present invention.

[0035] In the figure: 1, operating table; 2, loading mechanism; 21, three-axis moving assembly; 22, adjusting mechanism; 23, loading suction cup assembly; 24, first fixing frame; 25, driving assembly; 26, wedge-shaped push block; 27, moving frame; 28, reset assembly; 29, first connecting frame; 210, first sliding guide assembly; 211, connecting plate; 212, servo motor; 213, first lead screw; 214, lead screw block; 215, rack; 216, second sliding guide assembly; 217, third sliding guide assembly; 218, gear; 219, second lead screw; 220, first limit rod; 221, telescopic rod; 222, spring; 223, second limit rod; 3, material conveyor; 4, first bending mechanism; 41, second fixing frame; 42, first bending machine assembly; 5, second bending mechanism; 51, third fixing frame; 52, second bending machine assembly; 6, positioning mechanism; 61, first cylinder; 62, first limit frame; 63, second cylinder; 64, second limit frame; 65, third cylinder; 66, third limit frame; 7, auxiliary mechanism; 71, driving mechanism; 72, eccentric shaft; 73, shaft sleeve; 74, second connecting frame; 75, fourth sliding guide assembly; 8, displacement detector. Detailed implementation mode

[0036] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0037] Example 1: Refer to Figures 1 - 8As shown: A flexible circuit board bending device for electronic product processing, including an operating table 1. On the upper part of the operating table 1, a feeding mechanism 2, a material conveyor 3, a first bending mechanism 4 and a second bending mechanism 5 are respectively fixedly connected. The feeding mechanism 2, the first bending mechanism 4 and the second bending mechanism 5 are located on the same side of the material conveyor 3, and the feeding mechanism 2, the first bending mechanism 4 and the second bending mechanism 5 are arranged in sequence. The feeding mechanism 2 includes a three-axis moving assembly 21. The end of the three-axis moving assembly 21 is fixedly connected with an adjusting mechanism 22. The adjusting mechanism 22 is located above the material conveyor 3. The adjusting mechanism 22 includes a first fixing frame 24. The upper part of the first fixing frame 24 is fixedly connected with a driving assembly 25, and the lower part of the first fixing frame 24 is equipped with a feeding suction cup assembly 23. The feeding suction cup assembly 23 consists of an external control unit and two groups of suction cup units. The driving assembly 25 is used to adjust the distance between the two groups of suction cups according to the size of the flexible circuit board to be bent. The material conveyor 3 is used to feed the mold on which the flexible circuit board to be bent is placed. Positioning mechanisms 6 are arranged on the sides of the first bending mechanism 4 and the second bending mechanism 5. The positioning mechanisms 6 are used to position and fix the mold and the flexible circuit board inside it. The first bending mechanism 4 is used to preliminarily bend the flexible circuit board, and the second bending mechanism 5 is used to finally bend the flexible circuit board;

[0038] The positioning mechanism 6 includes a first cylinder 61, a second cylinder 63 and a third cylinder 65. The first cylinder 61 is fixedly connected with the operating table 1, and the output end of the first cylinder 61 is fixedly connected with a first limiting frame 62. The second cylinder 63 is fixedly connected with a second fixing frame 41, and the output end of the second cylinder 63 is fixedly connected with a second limiting frame 64. The third cylinder 65 is fixedly connected with the second fixing frame 41, and the output end of the third cylinder 65 is fixedly connected with a third limiting frame 66. Both the first limiting frame 62 and the second limiting frame 64 are right-angle brackets, and the first limiting frame 62 and the second limiting frame 64 are arranged at the diagonal positions of the mold. The four corners of the mold are all right angles. The third limiting frame 66 is located above the mold. The mold is provided with limiting rods, and the surface of the third limiting frame 66 is provided with limiting holes adapted to the limiting rods.

[0039] In this embodiment, the flexible circuit board is placed in the bending die, and the dies are stacked on the upper part of the operating table 1. The position of the adjusting mechanism 22 is adjusted by the three-axis moving component 21. According to the size of the die, the distance between the two groups of suction cups is adjusted by the driving component 25, so that the loading suction cup component 23 can load the die and the flexible circuit board placed inside it onto the surface of the material conveyor 3. The die is moved to the inside of the first limiting frame 62 by the material conveyor 3. At the same time, the third limiting frame 66 limits the upper part of the flexible circuit board, and the second limiting frame 64 and the first limiting frame 62 clamp and limit the die to ensure the accurate position of the flexible circuit board. Subsequently, the flexible circuit board is first bent by the first bending machine component 42, and the angle of the first bend is one-third to one-half of the final bending angle. Finally, the flexible circuit board after the first bending is moved to the lower part of the second bending machine component 52 by the material conveyor 3, and the flexible circuit board is bent according to the set bending angle by the second bending machine component 52;

[0040] A ccd camera can be installed on the upper part of the first fixing frame 24 to collect pictures of the die placed on the upper part of the operating table 1, and the collected picture information is transmitted to the industrial control computer. By analyzing and processing the pictures, the shape and size of the die are identified. By identifying its shape and size, the operator can be reminded and assisted in selecting the positioning mechanism 6 adapted to the die, so that the operator can quickly replace and allocate the positioning mechanism 6;

[0041] At the same time, the industrial control computer calculates the position information of the die, transmits the data to the control system, and then the control system analyzes and calculates the control instruction of the three-axis moving component 21, and accurately moves the position of the adjusting mechanism 22 through the three-axis moving component 21, so that the loading mechanism 2 can accurately adsorb and fix the die and the flexible circuit board inside it, and accurately move and load the two;

[0042] When the above technical solution is running, the driving component 25 flexibly adjusts the distance between the two groups of suction cups according to the size of the die, which enables the loading suction cup component 23 to quickly and accurately adapt to different specifications of dies, and efficiently transports the die and the flexible circuit board placed inside it to the surface of the material conveyor 3. The whole process does not require frequent manual intervention, greatly shortening the loading time and improving the production efficiency;

[0043] The first limiting frame 62, the second limiting frame 64 and the third limiting frame 66 work together to form a stable limiting system for the mold and the flexible circuit board. The first limiting frame 62 and the second limiting frame 64 clamp and limit the mold from both sides to effectively fix the position of the mold to prevent it from moving during the processing. The third limiting frame 66 limits the upper part of the flexible circuit board to ensure that the flexible circuit board always maintains an accurate position during the bending process, meeting the dimensional accuracy requirements of the millimeter or even sub-millimeter level, greatly reducing the bending deviation caused by inaccurate position, thereby improving product quality.

[0044] During the bending process of the flexible circuit board, the material of the flexible circuit board has its specific shaping law during the bending process. The staged bending conforms to the progressive deformation characteristics of the material, so that the material can gradually adapt to the bending deformation. During the first bending, the material is initially shaped and the internal microstructure begins to adjust. During the second bending, the material is further accurately shaped on the basis of the existing deformation, reducing the material distortion, wrinkles and other undesirable phenomena caused by sudden large-angle bending. At the same time, the No. 1 bending machine component 42 first bends the flexible circuit board to one-third to one-half of the final angle. This process distributes the stress over a larger range. For example, when the final bending angle is 90° and the first bend is to 30°-45°, the stress concentration area expands from the right-angle vertex to a certain length of the bending section, avoiding cracks or fractures due to excessive stress concentration at the final bending point. Compared with one-time bending, this method effectively reduces the stress peak inside the material, protects the copper foil, insulation layer and other structures of the flexible circuit board, and improves the reliability and service life of the product.

[0045] Embodiment 2: Figures 1 - 8As shown, the driving assembly 25 includes a servo motor 212, a gear 218 and a wedge-shaped push block 26. The servo motor 212 is fixedly connected to the first fixing frame 24, and the output end of the servo motor 212 is fixedly connected to a first lead screw 213. The first lead screw 213 is rotatably connected to the first fixing frame 24, and a nut block 214 is threadedly connected to the surface of the first lead screw 213. A rack 215 is fixedly connected to the side of the nut block 214. The gear 218 meshes with the rack 215, and the gear 218 is rotatably connected to the first fixing frame 24. A second lead screw 219 is fixedly connected to the bottom of the gear 218. The second lead screw 219 is threadedly connected to the wedge-shaped push block 26. A reset assembly 28 is fixedly connected to the inner wall of the first fixing frame 24. The end of the reset assembly 28 is fixedly connected to a moving frame 27. The side of the moving frame 27 is in contact with the side of the wedge-shaped push block 26. A first limiting rod 220 is fixedly connected to the side of the wedge-shaped push block 26. The first limiting rod 220 is slidably connected to the moving frame 27. The reset assembly 28 includes a telescopic rod 221 and a second limiting rod 223. One end of the telescopic rod 221 is fixedly connected to the inner wall of the first fixing frame 24, and the other end of the telescopic rod 221 is fixedly connected to the moving frame 27. A spring 222 is arranged on the surface of the telescopic rod 221. One end of the spring 222 is fixedly connected to the inner wall of the first fixing frame 24, and the other end of the spring 222 is fixedly connected to the moving frame 27. The second limiting rod 223 is inserted into the first fixing frame 24, and the end of the second limiting rod 223 is fixedly connected to the moving frame 27. A third sliding guide assembly 217 is fixedly connected to the lower part of the rack 215. The third sliding guide assembly 217 is fixedly connected to the first fixing frame 24. A second sliding guide assembly 216 is fixedly connected to the side of the nut block 214. The second sliding guide assembly 216 is fixedly connected to the first fixing frame 24. A first connecting frame 29 is fixedly connected to the bottom of the first fixing frame 24. A first sliding guide assembly 210 is fixedly connected to the bottom of the first connecting frame 29. A connecting plate 211 is fixedly connected to the bottom of the first sliding guide assembly 210. A group of sucker units are installed on the side of the connecting plate 211.

[0046] In this embodiment, by identifying and determining the shape and size of the mold, a control instruction for the servo motor 212 is generated. The rotation of the servo motor 212 drives the wire block 214 on the surface of the first lead screw 213 to move, thereby driving the rack 215 to slide along the surface of the third sliding guide assembly 217. The rack 215 drives the gear 218 to rotate, and then drives the second lead screw 219 to rotate, so that the wedge-shaped push block 26 moves up or down according to requirements. Through the vertical movement of the wedge-shaped push block 26, the moving frame 27 is driven to move horizontally, and finally the position of the loading suction cup assembly 23 is adjusted, so that the position of the loading suction cup assembly 23 can adsorb and fix the edge part of the mold, avoiding interference of the loading suction cup assembly 23 with the flexible circuit board placed inside the mold. When adjusting the position of the loading suction cup assembly 23, the rotation of the second lead screw 219 drives the wedge-shaped push block 26 to move up and down. The inclined surface design of the wedge-shaped push block 26 plays a key role in displacement amplification and fine adjustment. Assuming that the inclined surface angle of the wedge-shaped push block 26 is 10°, when it moves up and down 1 mm in the vertical direction, according to the trigonometric function relationship, its displacement in the horizontal direction to push the moving frame 27 is about 0.176 mm (tan10°×1 mm). By precisely controlling the rotation amount of the second lead screw 219, the vertical displacement of the wedge-shaped push block 26 can be accurately controlled, and then the horizontal position of the moving frame 27 can be precisely adjusted, and finally the high-precision fine adjustment of the position of the loading suction cup assembly 23 is realized. This design enables the system to accurately adjust the position of the loading suction cup assembly 23 by precisely controlling the movement of each component even when facing small position adjustment requirements, ensuring that it can accurately adsorb the edge of the mold and avoid interference with the flexible circuit board inside the mold.

[0047] Embodiment 3: Figures 1 - 10As shown in the figure, the first bending mechanism 4 includes a second fixing frame 41. The second fixing frame 41 is fixedly connected to the operation table 1, and a first bending machine assembly 42 is installed on the side of the second fixing frame 41. The second bending mechanism 5 includes a third fixing frame 51. The third fixing frame 51 is fixedly connected to the operation table 1, and a second bending machine assembly 52 is installed on the side of the third fixing frame 51. Displacement detectors 8 are arranged on the sides of the first bending mechanism 4 and the second bending mechanism 5. The displacement detectors 8 are fixedly connected to the upper part of the operation table 1. The displacement detectors 8 are used to monitor the precision of the bending operations of the first bending mechanism 4 and the second bending mechanism 5. Auxiliary mechanisms 7 are fixedly connected to the bottoms of the first bending mechanism 4 and the second bending mechanism 5. The auxiliary mechanisms 7 are used to adjust the positions of the first bending mechanism 4 and the second bending mechanism 5 according to the detection results of the displacement detectors 8. The auxiliary mechanism 7 includes a driving mechanism 71 and a fourth sliding and guiding assembly 75. The output end of the driving mechanism 71 is fixedly connected to an eccentric shaft 72. A bushing 73 is sleeved on the surface of the eccentric shaft 72. The fourth sliding and guiding assembly 75 is fixedly connected to the upper part of the operation table 1, and a second connecting frame 74 is fixedly connected to the upper part of the fourth sliding and guiding assembly 75. The bushing 73 is fixedly connected to the side of the second connecting frame 74.

[0048] In this embodiment, when the first bending machine assembly 42 and the second bending machine assembly 52 perform bending processing on the flexible circuit board, the two displacement detectors 8 are respectively installed on the reference surface of the operation table 1. After the first bending machine assembly 42 and the second bending machine assembly 52 are debugged, the distance between the bending processing ends of the first bending machine assembly 42 and the second bending machine assembly 52 and the displacement detectors 8 when the moving precision during the bending processing operation is qualified is measured by the displacement detectors 8. During subsequent continuous processing operations, when the distance between the bending processing ends of the first bending machine assembly 42 and the second bending machine assembly 52 and the displacement detectors 8 changes and exceeds the set range, it indicates that the processing precision of the bending becomes poor. At this time, according to the measurement results of the displacement detectors 8, the driving mechanism 71 drives the eccentric shaft 72 to rotate. Under the action of the eccentric rotation of the eccentric shaft 72, the bushing 73 exerts a pushing or pulling effect on the second connecting frame 74, thereby driving the second connecting frame 74 to slide in the horizontal direction, and further adjusting the positions of the first bending mechanism 4 and the second bending mechanism 5, so that the positions of the bending processing ends of the first bending mechanism 4 and the second bending mechanism 5 are kept precise during bending processing, thereby performing precise bending processing on the flexible circuit board;

[0049] Through the above technical solution, two displacement detectors 8 are installed on the reference surface of the operation table 1, which can accurately measure the distance between the bending processing ends of the first bending machine assembly 42 and the second bending machine assembly 52 and the displacement detectors 8. The accuracy can reach the millimeter or even sub-millimeter level. During the bending process of the flexible circuit board, once the position of the bending processing end deviates, the displacement detector 8 can quickly capture the distance change. For example, when the bending processing end deviates by 0.1 mm, the displacement detector 8 can accurately sense and output a signal. This real-time and high-precision monitoring enables production personnel to discover abnormalities in bending accuracy in a timely manner, saving valuable time for subsequent adjustments and avoiding the production of a large number of unqualified products due to continuous processing. When the displacement detector 8 detects a distance change, that is, when the bending accuracy deviates, the industrial control computer quickly starts feedback adjustment. After receiving the signal, the driving mechanism 71 drives the eccentric shaft 72 to rotate. The unique eccentric structure of the eccentric shaft 72 can accurately apply a pushing or pulling force to the bushing 73 when rotating. For example, when the eccentric shaft 72 rotates a certain angle, its eccentric part will cause the bushing 73 to have a corresponding displacement, thereby driving the second connecting frame 74 to slide in the horizontal direction. This series of actions responds quickly, and the time interval from detecting the deviation to starting the adjustment is extremely short, usually within hundreds of milliseconds, ensuring that the positions of the first bending machine assembly 42 and the second bending machine assembly 52 can be adjusted in a timely manner and always maintained at the accurate bending position, greatly improving the bending accuracy of the flexible circuit board, ensuring that the product meets strict dimensional accuracy requirements, and improving product quality and yield rate.

[0050] The working principle and usage method of this device: Place the flexible circuit board in the bending mold, stack the molds on the upper part of the operation table 1, adjust the position of the adjusting mechanism 22 through the three-axis moving component 21, and adjust the distance between the two groups of suction cups through the driving component 25 according to the size of the mold, so that the loading suction cup assembly 23 can load the mold and the flexible circuit board placed inside it onto the surface of the material conveyor 3. Move the mold to the inside of the first limit frame 62 through the material conveyor 3. At the same time, the third limit frame 66 limits the upper part of the flexible circuit board, and the second limit frame 64 and the first limit frame 62 clamp and limit the mold to ensure the accurate position of the flexible circuit board. Subsequently, the first bending machine assembly 42 bends the flexible circuit board for the first time, and the angle of the first bending is one-third to one-half of the final bending angle. Finally, move the flexible circuit board completed the first bending to the lower part of the second bending machine assembly 52 through the material conveyor 3, and perform the bending operation on the flexible circuit board according to the set bending angle by the second bending machine assembly 52;

[0051] An image acquisition device can be installed on the upper part of the first fixing bracket 24 to acquire images of the mold placed on the upper part of the operating table 1, and the acquired image information is transmitted to the industrial control computer. By analyzing and processing the images, the shape and size of the mold are identified. Through the identification of its shape and size, the operator can be reminded and assisted in selecting the positioning mechanism 6 adapted to the mold, so that the operator can quickly replace and adjust the positioning mechanism 6.

[0052] When the first bending machine assembly 42 and the second bending machine assembly 52 perform bending processing on the flexible circuit board, two displacement detectors 8 are respectively installed on the reference surface of the operating table 1. When the distance between the bending processing ends of the first bending machine assembly 42 and the second bending machine assembly 52 and the displacement detectors 8 changes and exceeds the set range, it indicates that the bending processing accuracy deteriorates. At this time, according to the measurement results of the displacement detectors 8, the drive mechanism 71 drives the eccentric shaft 72 to rotate. Under the action of the eccentric rotation of the eccentric shaft 72, the bushing 73 exerts a pushing or pulling effect on the second connecting frame 74 to adjust the positions of the first bending mechanism 4 and the second bending mechanism 5.

[0053] Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A flexible circuit board bending device for electronic product processing, including an operating table (1), on which a feeding mechanism (2) and a material conveyor (3) are fixedly connected respectively. The feeding mechanism (2) includes a three-axis moving component (21), and it is characterized in that: The end of the three-axis moving assembly (21) is fixedly connected with an adjusting mechanism (22). The adjusting mechanism (22) is located above the material conveyor (3). The adjusting mechanism (22) includes a first fixing frame (24). The upper part of the first fixing frame (24) is fixedly connected with a driving assembly (25), and the lower part of the first fixing frame (24) is provided with a loading suction cup assembly (23). The loading suction cup assembly (23) is composed of an external control unit and two suction cup units. The driving assembly (25) is used to adjust the distance between the two suction cups according to the size of the flexible circuit board to be bent. The material conveyor (3) is used to feed the mold on which the flexible circuit board to be bent is placed. A first bending mechanism (4) and a second bending mechanism (5) are respectively fixedly connected to the upper part of the operating table (1). The loading mechanism (2), the first bending mechanism (4) and the second bending mechanism (5) are located on the same side of the material conveyor (3) and are arranged in sequence. Positioning mechanisms (6) are arranged on the sides of the first bending mechanism (4) and the second bending mechanism (5). The positioning mechanisms (6) are used to position and fix the mold and the flexible circuit board inside it. The first bending mechanism (4) is used to initially bend the flexible circuit board. The second bending mechanism (5) is used to finally bend the flexible circuit board.

2. The flexible circuit board bending device for electronic product processing according to claim 1, wherein: The driving assembly (25) includes a servo motor (212), a gear (218) and a wedge-shaped push block (26). The servo motor (212) is fixedly connected to the first fixing frame (24), and the output end of the servo motor (212) is fixedly connected with a first lead screw (213). The first lead screw (213) is rotatably connected to the first fixing frame (24), and a screw block (214) is threadedly connected to the surface of the first lead screw (213). A rack (215) is fixedly connected to the side of the screw block (214). The gear (218) meshes with the rack (215), and the gear (218) is rotatably connected to the first fixing frame (24). A second lead screw (219) is fixedly connected to the bottom of the gear (218). The second lead screw (219) is threadedly connected to the wedge-shaped push block (26).

3. The flexible circuit board bending device for electronic product processing according to claim 2, characterized in that: A reset assembly (28) is fixedly connected to the inner wall of the first fixing frame (24). The end of the reset assembly (28) is fixedly connected with a moving frame (27). The side of the moving frame (27) is attached to the side of the wedge-shaped push block (26). A first limiting rod (220) is fixedly connected to the side of the wedge-shaped push block (26). The first limiting rod (220) is slidably connected to the moving frame (27).

4. A flexible circuit board bending device for electronic product processing according to claim 3, characterized in that: The reset component (28) includes a telescopic rod (221) and a second limiting rod (223). One end of the telescopic rod (221) is fixedly connected to the inner wall of the first fixing frame (24), and the other end of the telescopic rod (221) is fixedly connected to the moving frame (27). A spring (222) is arranged on the surface of the telescopic rod (221). One end of the spring (222) is fixedly connected to the inner wall of the first fixing frame (24), and the other end of the spring (222) is fixedly connected to the moving frame (27). The second limiting rod (223) is inserted into the first fixing frame (24), and the end of the second limiting rod (223) is fixedly connected to the moving frame (27).

5. The flexible circuit board bending device for electronic product processing according to claim 4, characterized in that: A third sliding guide assembly (217) is fixedly connected to the lower part of the rack (215). The third sliding guide assembly (217) is fixedly connected to the first fixing frame (24). A second sliding guide assembly (216) is fixedly connected to the side of the wire block (214). The second sliding guide assembly (216) is fixedly connected to the first fixing frame (24).

6. The flexible circuit board bending device for electronic product processing according to claim 5, wherein: A first connecting frame (29) is fixedly connected to the bottom of the first fixing frame (24). A first sliding guide assembly (210) is fixedly connected to the bottom of the first connecting frame (29). A connecting plate (211) is fixedly connected to the bottom of the first sliding guide assembly (210). The suction cup unit is installed on the side of the connecting plate (211).

7. The flexible circuit board bending device for electronic product processing according to claim 6, wherein: The first bending mechanism (4) includes a second fixing frame (41). The second fixing frame (41) is fixedly connected to the operating table (1), and a first bending machine assembly (42) is installed on the side of the second fixing frame (41). The second bending mechanism (5) includes a third fixing frame (51). The third fixing frame (51) is fixedly connected to the operating table (1), and a second bending machine assembly (52) is installed on the side of the third fixing frame (51).

8. A flexible circuit board bending device for electronic product processing according to claim 7, characterized in that: The positioning mechanism (6) includes a first cylinder (61), a second cylinder (63) and a third cylinder (65). The first cylinder (61) is fixedly connected to the operating table (1), and the output end of the first cylinder (61) is fixedly connected to a first limiting frame (62). The second cylinder (63) is fixedly connected to the second fixing frame (41), and the output end of the second cylinder (63) is fixedly connected to a second limiting frame (64). The third cylinder (65) is fixedly connected to the second fixing frame (41), and the output end of the third cylinder (65) is fixedly connected to a third limiting frame (66). Both the first limiting frame (62) and the second limiting frame (64) are right-angle brackets, and the first limiting frame (62) and the second limiting frame (64) are arranged at the diagonal positions of the mold. The four corners of the mold are all right angles. The third limiting frame (66) is located above the mold. The mold is provided with limiting rods, and the surface of the third limiting frame (66) is provided with limiting holes adapted to the limiting rods.

9. A flexible circuit board bending device for electronic product processing according to claim 8, characterized in that: Displacement detectors (8) are provided on the sides of the first bending mechanism (4) and the second bending mechanism (5). The displacement detectors (8) are fixedly connected to the upper part of the operation table (1). The displacement detectors (8) are used to monitor the precision of the bending operations of the first bending mechanism (4) and the second bending mechanism (5). Auxiliary mechanisms (7) are fixedly connected to the bottoms of the first bending mechanism (4) and the second bending mechanism (5). The auxiliary mechanisms (7) are used to adjust the positions of the first bending mechanism (4) and the second bending mechanism (5) according to the detection results of the displacement detectors (8). The auxiliary mechanism (7) includes a driving mechanism (71) and a fourth sliding and guiding assembly (75). The output end of the driving mechanism (71) is fixedly connected with an eccentric shaft (72). A bushing (73) is sleeved on the surface of the eccentric shaft (72). The fourth sliding and guiding assembly (75) is fixedly connected to the upper part of the operation table (1), and a second connecting frame (74) is fixedly connected to the upper part of the fourth sliding and guiding assembly (75). The bushing (73) is fixedly connected to the side of the second connecting frame (74).

10. A method for using a flexible circuit board bending device for electronic product processing, characterized in that: Using a flexible circuit board bending device for electronic product processing according to any one of claims 1-9, the following steps are included: S1. Place the flexible circuit board in the bending mold, stack the molds on the upper part of the operation table (1), adjust the position of the adjusting mechanism (22) through the three-axis moving assembly (21), and adjust the distance between the two suction cups through the driving assembly (25) according to the size of the mold, so that the loading suction cup assembly (23) can load the mold and the flexible circuit board placed therein onto the surface of the material conveyor (3); S2. Move the mold to the inside of the first limiting frame (62) through the material conveyor (3). At the same time, the third limiting frame (66) limits the upper part of the flexible circuit board, and the second limiting frame (64) and the first limiting frame (62) clamp and limit the mold; S3. Subsequently, the first bending machine assembly (42) bends the flexible circuit board for the first time, and the angle of the first bend is one-third to one-half of the final bending angle; S4. Finally, move the flex circuit board that has been bent for the first time to below the second bending machine assembly (52) through the material conveyor (3), and perform a bending operation on the flex circuit board at a set bending angle through the second bending machine assembly (52).

Images