Diamond wire surface modification liquid, diamond wire surface modification method and diamond wire saw

Abstract

The invention discloses diamond wire surface modification liquid, a diamond wire surface modification method and a diamond wire saw, and belongs to the technical field of photovoltaic materials. The diamond wire surface modification liquid comprises the following components in percentage by weight: 0.1-5% of an emulsifier, 5-30% of an oil-phase compound, 0.1-0.5% of a surfactant and the balance of water, wherein the total percentage is 100%. The diamond wire surface modification method comprises the steps that a nickel-plated diamond wire is immersed in the modification liquid for infiltration modification, and an infiltrated diamond wire is obtained; drying the infiltrated diamond wire to obtain a surface modified diamond wire; the modified diamond wire is higher in hydrophilicity, cutting liquid components can be effectively brought into cutting slits, generation of wire marks in the cutting process is reduced, and the quality of produced silicon wafers is improved; the use of wetting agent components with higher cost can be reduced or avoided, the use of wetting agents with low surface tension can be reduced or avoided, and the generation of foams can be reduced.

Description

Technical Field

[0001] The present application relates to the technical field of photovoltaic materials, and in particular, to a surface modification liquid for a diamond wire, a method for surface modification of a diamond wire, and a diamond wire saw. Background Art

[0002] In the process of preparing photovoltaic silicon wafers, the silicon wafers are cut from silicon rods, and the main tool used for cutting is a diamond wire saw. The outer layer of the diamond wire saw is a nickel metal layer, so the diamond wire saw is hydrophobic. With the development of the photovoltaic industry, cost reduction and efficiency improvement need to be achieved through thinning of wafers and reduction of wire diameter; however, the thinning of wafers and reduction of wire diameter have led to a sharp increase in the wire breakage rate during the cutting process of the diamond wire saw, resulting in an increase in production costs. In order to reduce the wire breakage rate, cutting fluids are often used. By using low surface tension wetting agents or increasing the concentration of wetting agents, the cutting fluid can improve the liquid carrying effect of the diamond wire saw; however, the thinning of wafers and reduction of wire diameter have also made the width of the cutting slit narrower and narrower, and the resistance of the cutting fluid entering the cutting slit has become greater and greater, which poses higher requirements for the liquid carrying ability of the diamond wire saw.

[0003] The main component of the cutting fluid is a surfactant, which includes wetting, lubricating, defoaming, cleaning and other surfactant components. Through reasonable formulation and combination, the cutting fluid can be effectively carried by the diamond wire saw into the cutting slit, thereby improving the quality of the produced silicon wafers. However, in order to ensure the liquid carrying effect, when using low surface tension wetting agents or increasing the concentration of wetting agents, the following problems exist: (1) The wetting agent has the characteristic of low surface tension, but the low surface tension will accelerate the generation speed of foam, and the rich foam will affect the diamond wire saw's ability to carry the liquid into the cutting slit; (2) The purchase cost of the wetting surfactant component in the cutting fluid is the highest among all surfactants. Therefore, using wetting agents or increasing the concentration of wetting agents will greatly hinder the control of the production cost of silicon wafers; (3) Generally speaking, the solubility of a substance in a certain solvent is limited. Therefore, blindly increasing the concentration of the wetting agent does not necessarily play a role in reducing the surface tension. After exceeding a certain concentration, increasing the concentration of the wetting agent will no longer significantly reduce the surface tension. Summary of the Invention

[0004] The main purpose of the present application is to provide a surface modification liquid for a diamond wire, a method for surface modification of a diamond wire, and a diamond wire saw to solve the problem of poor liquid carrying ability of the diamond wire saw in the prior art.

[0005] To achieve the above object, according to one aspect of the present application, a surface modification liquid for a diamond wire is provided. In terms of weight percentage, the modification liquid includes the following components:

[0006] Emulsifier 0.1% - 5%, oil phase compound 5% - 30%, surfactant 0.1% - 0.5%, and the balance is water, with a total of 100%.

[0007] Furthermore, the weight percentage of the emulsifier is 1% - 5%, the weight percentage of the oil-phase compound is 10% - 30%, the weight percentage of the surfactant is 0.2% - 0.5%, and the balance is water, with a total of 100%.

[0008] Furthermore, the weight percentage of the emulsifier is 2% - 5%, the weight percentage of the oil-phase compound is 10% - 20%, the weight percentage of the surfactant is 0.3% - 0.5%, and the balance is water, with a total of 100%.

[0009] Furthermore, the emulsifier is selected from at least one of fatty alcohol polyoxyethylene ether, polyphenolic compounds, and glycerol fatty acid ester.

[0010] Furthermore, the oil-phase compound is a butyl ether compound and / or a fatty alcohol compound.

[0011] Furthermore, the surfactant is selected from at least one of polyvinyl alcohol, polyethylene glycol, carboxymethyl cellulose, and cellulose.

[0012] Furthermore, the emulsifier is a compound mixture of fatty alcohol polyoxyethylene ether and polyphenolic compounds.

[0013] Furthermore, the emulsifier is a compound mixture of glycerol fatty acid ester and polyphenolic compounds.

[0014] Furthermore, the fatty alcohol polyoxyethylene ether is polyethylene glycol maltamide alcohol or polysorbate.

[0015] Furthermore, the polyphenolic compounds are tannic acid, epigallocatechin gallate, or epigallocatechin.

[0016] Furthermore, the glycerol fatty acid ester is sorbitan triglyceryl or lauric acid.

[0017] Furthermore, the butyl ether compound is diethylene glycol monobutyl ether or dipropylene glycol monobutyl ether.

[0018] Furthermore, the fatty alcohol compound is n-decanol or n-nonanol.

[0019] Furthermore, the emulsifier is a mixture of polysorbate and tannic acid.

[0020] Furthermore, the emulsifier is a mixture of lauric acid and tannic acid.

[0021] Furthermore, the oil-phase compound is a mixture of diethylene glycol monobutyl ether and n-nonanol.

[0022] Furthermore, the surfactant is a mixture of polyvinyl alcohol and cellulose.

[0023] Further, the weight ratio of polysorbate to tannic acid is (0.5 - 2):1.

[0024] Further, the weight ratio of lauric acid to tannic acid is 1:(1 - 3).

[0025] Further, the weight ratio of diethylene glycol butyl ether to n-nonyl alcohol is 1:(0.5 - 3).

[0026] Further, the weight ratio of polyvinyl alcohol to cellulose is (0.5 - 2):1.

[0027] According to the second aspect of the present application, there is provided a method for surface modification of a diamond wire, comprising the following steps:

[0028] Step S1: Immerse the nickel-plated diamond wire in the modification liquid for infiltration modification to obtain an infiltrated diamond wire;

[0029] Step S2: Dry the infiltrated diamond wire to obtain a surface-modified diamond wire;

[0030] Wherein, the modification liquid is the above-mentioned diamond wire surface modification liquid.

[0031] Further, in step S1, the linear velocity of the nickel-plated diamond wire during moving infiltration in the modification liquid tank is 10 - 30 m / s.

[0032] Further, in step S2, the linear velocity of the infiltrated diamond wire during moving drying in the drying tank is 2 - 5 m / s, and the drying temperature is 180 - 200 °C.

[0033] According to the third aspect of the present application, there is provided a diamond wire saw, comprising a diamond wire; the diamond wire is the diamond wire obtained by the above-mentioned diamond wire surface modification method; wherein, a hydrophilic film is attached to the surface of the diamond wire.

[0034] Applying the technical solution of the present application, there is provided a diamond wire surface modification liquid, a diamond wire surface modification method and a diamond wire saw; the modified diamond wire saw of the present application has stronger hydrophilicity, can effectively bring the cutting fluid components into the cutting slit, is beneficial to reducing the generation of wire marks during the cutting process, and improving the quality of silicon wafers; by hydrophilically modifying the surface of the diamond wire saw, it is possible to reduce or avoid using wetting agent components with higher costs, which is beneficial to the control of the cutting fluid cost, and can reduce or avoid using wetting agents with low surface tension, which is beneficial to reducing the generation of foam. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The accompanying drawings forming a part of this application are used to provide a further understanding of the application. The schematic embodiments and descriptions thereof of the application are used to explain the application and do not constitute an improper limitation to the application. In the drawings:

[0036] Figure 1The schematic diagram of the modification process of the diamond wire in the embodiment of the present application is shown.

[0037] Reference numerals:

[0038] 1. Electroplating area; 2. Cleaning tank; 3. Empty tank area; 4. Modifying liquid tank; 5. Drying tank. Specific implementation manners

[0039] It should be noted that, without conflict, the embodiments in the present application and the features in the embodiments may be combined with each other. The present application will be described in detail below with reference to the drawings and in combination with the embodiments.

[0040] As mentioned in the background art, the liquid carrying effect of the diamond wire is ensured by using a low surface tension wetting agent or increasing the concentration of the wetting agent; however, the low surface tension wetting agent in the cutting fluid will accelerate the generation of foam during use, and the rich foam will affect the diamond wire saw to bring the liquid into the cutting slit and the effect is limited; the wetting surfactant component in the cutting fluid has a high cost, which will increase the production cost.

[0041] Therefore, in order to improve the liquid carrying ability of the diamond wire, the present application provides a surface modification liquid for the diamond wire. Calculated by weight percentage, the modification liquid includes the following components:

[0042] Emulsifier 0.1% - 5%, oil phase compound 5% - 30%, surfactant 0.1% - 0.5%, the balance is water, and the total is 100%.

[0043] In the modification liquid formula of the present application, the weight percentage content of the emulsifier is any value among 0.1%, 0.5%, 1%, 1.5%, 2%, 2.5%, 3%, 3.5%, 4%, 4.5%, 5% or the range value between any two of them; if the content of the emulsifier is too low, the water-in-oil emulsion structure cannot be effectively stabilized, resulting in demulsification, so that the hydrophilic active ingredients cannot be effectively brought in, and if the content exceeds 5%, it will affect the synergy with other components and increase the cost; the weight percentage content of the oil phase compound is any value among 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%, 18%, 19%, 20%, 21%, 22%, 23%, 24%, 25%, 26%, 27%, 28%, 29%, 30% or the range value between any two of them; if the content of the oil phase compound is too low, the water-in-oil structure cannot be formed well, and if the content exceeds 30%, the water-in-oil emulsion structure will become poor, which is not conducive to subsequent drying and demulsification to form a film; the weight percentage content of the surfactant is any value among 0.1%, 0.2%, 0.3%, 0.4%, 0.5% or the range value between any two of them; if the content of the surfactant is too low, the hydrophilic modification effect cannot be achieved, and if the content exceeds 0.5%, it will affect the synergy effect with other components and cause waste of raw materials.

[0044] The diamond wire modification liquid developed in this application contains an emulsifier, an oil phase, a surfactant, and water. Since the outer layer of the diamond wire saw is a hydrophobic nickel metal layer, the design concept of this application is to utilize the water-in-oil emulsion structure to bring hydrophilic components to the diamond wire saw through emulsion particles, and then heat and dry to break the emulsion, so that the hydrophilic components form a hydrophilic film structure on the diamond wire saw, and finally obtain a diamond wire saw with a hydrophilic surface. The emulsifier added to the modification liquid in this application is selected from water-in-oil type materials, and its function is to stabilize the interface of the water-in-oil emulsion particles; the added oil phase compound can not only form a water-in-oil emulsion structure, but also reduce the influence of the residual oil phase on the hydrophilicity of the film layer after the emulsion particles are dried; the added surfactant has a low surface tension, can enhance hydrophilicity, and the usage amount is relatively low. The emulsifier, oil phase substance, and surfactant are dissolved in water. Due to the action of the water-in-oil emulsifier, the hydrophilic surfactant will be wrapped in the water-in-oil structure formed by the oil phase substance, and the emulsifier further stabilizes this water-in-oil emulsion structure. After the three work together synergistically, a stable water-in-oil emulsion with hydrophilic components is formed. The surface of the diamond wire is hydrophobic. Therefore, the water-in-oil emulsion can be adsorbed on the surface of the diamond wire by the action of "like attracts like", and then form a surfactant coating with a low surface tension after high-temperature drying and demulsification, making the surface of the diamond wire hydrophilic.

[0045] The preparation method of the modification liquid in this application: First, add water, emulsifier, oil phase and surfactant components to the container in sequence, and stir until each component is completely dissolved to form a stable emulsion, that is, the above-mentioned surface modification liquid.

[0046] The diamond wire saw modified with the diamond wire surface modification liquid provided in this application has stronger hydrophilicity, can effectively bring the cutting fluid components into the cutting slit, is beneficial to reducing the generation of wire marks during cutting, and improving the quality of the produced silicon wafers; by hydrophilically modifying the surface of the diamond wire saw, it is possible to reduce or avoid using the relatively expensive wetting agent component in the cutting fluid, which is beneficial to cost control, and it is possible to reduce or avoid using a wetting agent with a low surface tension, which is beneficial to reducing the generation of foam.

[0047] In some embodiments, the modification liquid formula includes: the weight percentage content of the emulsifier is 1% - 5%, the weight percentage content of the oil phase compound is 10% - 30%, the weight percentage content of the surfactant is 0.2% - 0.5%, and the balance is water, totaling 100%. Further, the modification liquid formula includes: the weight percentage content of the emulsifier is 2% - 5%, the weight percentage content of the oil phase compound is 10% - 20%, the weight percentage content of the surfactant is 0.3% - 0.5%, and the balance is water, totaling 100%. By optimizing the proportion of the emulsifier, oil phase, and surface active component, giving full play to their respective roles and enhancing the synergistic effect among the three, a hydrophilic modification emulsion with a stable structure can be obtained.

[0048] In some embodiments, the emulsifier is selected from at least one of fatty alcohol polyoxyethylene ether, polyphenolic compounds, sorbitan monooleate, and glycerol fatty acid ester. The above types of emulsifiers selected can form a material with a water-in-oil structure after formulation, and its function is to stabilize the interface of water-in-oil emulsion particles. Specifically, the fatty alcohol polyoxyethylene ether can be polyethylene glycol maltamide alcohol or polysorbate; the polyphenolic compounds can be tannic acid, epigallocatechin gallate, or epigallocatechin; the glycerol fatty acid ester can be sorbitol triglyceride or lauric acid; more preferably, the emulsifier is a compound mixture of fatty alcohol polyoxyethylene ether and polyphenolic compounds, or the emulsifier is a compound mixture of glycerol fatty acid ester and polyphenolic compounds; when the emulsifier is polysorbate and tannic acid, the weight ratio of the two is (0.5 - 2):1, such as 1:1; when the emulsifier is lauric acid and tannic acid, the weight ratio of the two is 1:(1 - 3), such as 1:1. Using the above compound emulsifier is more conducive to forming a more stable water-in-oil structure modified liquid.

[0049] In some embodiments, the oil-phase compound is a butyl ether compound and / or a fatty alcohol compound. Specifically, the butyl ether compound is diethylene glycol butyl ether or dipropylene glycol monobutyl ether; the fatty alcohol compound is n-decanol or n-nonanol; preferably, when the oil-phase compound is a compound mixture of diethylene glycol butyl ether and n-nonanol, the weight ratio of the two is 1:(0.5 - 3), such as 1:1. Using the above compound oil-phase compound can not only better form a water-in-oil emulsion structure, but also reduce the influence of the residual oil phase after drying of the emulsion particles on the hydrophilicity of the film layer.

[0050] In some embodiments, the surfactant is a water-soluble polymer containing hydrophilic groups such as ether bonds, hydroxyl groups, and amino groups; specifically, at least one of polyvinyl alcohol, polyethylene glycol, carboxymethyl cellulose, and cellulose can be selected. More specifically, the surfactant is a mixture of polyvinyl alcohol and cellulose with a weight ratio of (0.5 - 2):1, such as 1:1. Using the above type of surfactant has strong hydrophilicity and low surface tension, and the usage amount is reduced; the liquid-carrying amount of the surface-modified hydrophilic diamond wire is significantly increased.

[0051] In some embodiments, the modified liquid formulation includes: the weight percentage of the emulsifier is 2% - 5%, the weight percentage of the oil-phase compound is 10% - 20%, the weight percentage of the surfactant is 0.3 - 0.5%, and the balance is water, totaling 100%; wherein, the emulsifier is a mixture of lauric acid and tannic acid with a weight ratio of 1:(1 - 3), or the emulsifier is a mixture of polysorbate and tannic acid with a weight ratio of (0.5 - 2):1; the oil-phase compound is a mixture of diethylene glycol butyl ether and n-nonanol with a weight ratio of 1:(0.5 - 3); the surfactant is at least one of polyvinyl alcohol, polyethylene glycol, carboxymethyl cellulose, and cellulose.

[0052] In some embodiments, the formulation of the modification liquid is further optimized as follows: the weight percentage of the emulsifier is 2% - 4%, the weight percentage of the oil-phase compound is 15% - 25%, the weight percentage of the surfactant is 0.3 - 0.5%, and the balance is water, with a total of 100%; wherein, the emulsifier is a mixture of polysorbate and tannic acid in a weight ratio of (0.5 - 2):1; the oil-phase compound is diethylene glycol butyl ether; the surfactant is a compound of polyvinyl alcohol and cellulose in a weight ratio of 1:1. By further using a compound emulsifier with better effect, an oil-phase substance, and a surfactant with better effect, and further optimizing the ratio of each component, a better synergistic effect can be achieved among the emulsifier, the oil-phase compound, and the surfactant, and a hydrophilic modified emulsion with stable structure can be obtained, enhancing the hydrophilic surface modification effect of the diamond wire.

[0053] For another example, the formulation of the modification liquid includes: 2% of the emulsifier, 15% of the oil-phase compound, and the weight percentage of the surfactant is 0.3%, with the balance being water, totaling 100%. Or, it includes: 3% of the emulsifier, 20% of the oil-phase compound, and the weight percentage of the surfactant is 0.4%, with the balance being water, totaling 100%. Or, it includes: 4% of the emulsifier, 25% of the oil-phase compound, and the weight percentage of the surfactant is 0.5%, with the balance being water, totaling 100%. More specifically, for the formulation of the diamond wire surface modification liquid: by weight percentage, 3% of the emulsifier which is a compound of polysorbate and tannic acid in a weight ratio of 1:1, 20% of the oil-phase compound diethylene glycol butyl ether, 0.4% of the surfactant which is a compound of polyvinyl alcohol and cellulose in a weight ratio of 1:1, and the balance is water, totaling 100%. First, add water, the emulsifier, the oil phase, and the surfactant components into the container in sequence, and stir until all components are completely dissolved to form a stable emulsion. By precisely controlling the mass ratio of the emulsifier, the oil phase, and the surfactant components, the synergistic effect among the three can be further enhanced, and a hydrophilic modified emulsion with stable structure can be obtained, enhancing the hydrophilic surface modification effect of the diamond wire.

[0054] According to the second aspect of the present application, there is provided the above-mentioned diamond wire surface modification method, including the following steps:

[0055] Step S1: Immerse the nickel-plated diamond wire into the above-mentioned diamond wire surface modification liquid for infiltration modification to obtain an infiltrated diamond wire;

[0056] Step S2: Dry the infiltrated diamond wire to obtain a surface-modified diamond wire;

[0057] In some embodiments, in step S1, when the nickel-plated diamond wire moves and soaks in the modification liquid tank, the linear velocity is 10 to 30 m / s. This linear velocity is any value among 10 m / s, 15 m / s, 20 m / s, 25 m / s, 30 m / s or the range value between any two of them. If the moving speed is too slow, it will affect the production efficiency. If it is too fast, the soaking amount on the surface of the diamond wire will be too small, which is not conducive to the later drying and film formation. By controlling the above linear velocity of the diamond wire in the modification liquid tank, the soaking amount of the modification liquid on the surface of the diamond wire can be adjusted to ensure the soaking amount and the drying and film formation effect.

[0058] In some embodiments, in step S2, when the soaked diamond wire moves and dries in the drying tank, the linear velocity is 2 to 5 m / s, and the drying temperature is 180 to 200 °C. This linear velocity is any value among 2 m / s, 3 m / s, 4 m / s, 5 m / s or the range value between any two of them. If the moving speed of the diamond wire is too fast during drying, it is not conducive to film formation. If it is too slow, it will affect the production efficiency. Only by adopting the above appropriate drying speed can the film layer on the surface of the diamond wire have better quality.

[0059] According to the third aspect of the present application, a diamond wire saw is provided, including a diamond wire; the diamond wire is the diamond wire obtained by the above diamond wire surface modification method; wherein, a hydrophilic film is attached to the surface of the diamond wire.

[0060] By introducing a hydrophilic film layer on the surface of the diamond wire in the present application, the hydrophilicity of the diamond wire is enhanced, the wettability between the surface of the diamond wire saw and the cutting fluid is improved, and further the liquid-carrying effect of the diamond wire is improved. In particular, the ability of the cutting fluid to enter the cutting slit is improved, and at the same time, the use cost of the wetting agent in the cutting fluid and the problem that the wetting agent is prone to generate foam are reduced; at the same time, the generation of wire marks during the cutting process is also reduced, and the quality of the silicon wafer is improved.

[0061] The following further describes the present application in detail with specific embodiments, and these embodiments should not be construed as limiting the scope claimed by the present application.

[0062] The raw materials used in the embodiments of the present application are prior art and can all be purchased commercially.

[0063] Example 1

[0064] The formula of the diamond wire surface modification liquid: calculated by weight percentage, an emulsifier obtained by compounding polysorbate and tannic acid in a weight ratio of 1:1 is 0.1%, the oil-phase compound diethylene glycol butyl ether is 5%, a surfactant obtained by compounding polyvinyl alcohol and cellulose in a weight ratio of 1:1 is 0.1%, and the balance is water, with a total of 100%; in the container, water, emulsifier, oil-phase compound and surfactant are added in sequence, and stirred until all components are completely dissolved to form a stable emulsion.

[0065] As Figure 1As shown in the figure, the method for surface modification of diamond wire includes: nickel-plating the diamond wire in the electroplating area 1 and then entering the warm water tank 2 for cleaning with warm water and pure water to clean the electroplating solution components completely. Then, it passes through the empty tank 3 and enters the modification liquid tank 4. The moving linear speed of the diamond wire in the modification liquid tank 4 is 10 m / s. At room temperature, the modification liquid is taken away and enters the drying tank 5 (tank temperature 180 °C) for drying. The moving linear speed of the diamond wire in the drying tank 5 is 2 m / s.

[0066] Example 2

[0067] The formula of the surface modification liquid for diamond wire: By weight percentage, the emulsifier composed of polysorbate and tannic acid compounded at a weight ratio of 1:1 is 1%, the oil-phase compound diethylene glycol monobutyl ether is 10%, the surfactant composed of polyvinyl alcohol and cellulose compounded at a weight ratio of 1:1 is 0.2%, and the balance is water, with a total of 100%. First, water, emulsifier, oil phase and surfactant components are added to the container in sequence and stirred until all components are completely dissolved to form a stable emulsion.

[0068] As Figure 1 shown in the figure, the method for surface modification of diamond wire includes: nickel-plating the diamond wire in the electroplating area 1 and then entering the warm water tank 2 for cleaning with warm water and pure water to clean the electroplating solution components completely. Then, it passes through the empty tank 3 and enters the modification liquid tank 4. The moving linear speed of the diamond wire in the modification liquid tank 4 is 15 m / s. At room temperature, the modification liquid is taken away and enters the drying tank 5 (tank temperature 185 °C) for drying. The moving linear speed of the diamond wire in the drying tank 5 is 3 m / s.

[0069] Example 3

[0070] The formula of the surface modification liquid for diamond wire: By weight percentage, the emulsifier composed of polysorbate and tannic acid compounded at a weight ratio of 1:1 is 2%, the oil-phase compound diethylene glycol monobutyl ether is 15%, the surfactant composed of polyvinyl alcohol and cellulose compounded at a weight ratio of 1:1 is 0.3%, and the balance is water, with a total of 100%. First, water, emulsifier, oil phase and surfactant components are added to the container in sequence and stirred until all components are completely dissolved to form a stable emulsion.

[0071] As Figure 1 shown in the figure, the method for surface modification of diamond wire includes: nickel-plating the diamond wire in the electroplating area 1 and then entering the warm water tank 2 for cleaning with warm water and pure water to clean the electroplating solution components completely. Then, it passes through the empty tank 3 and enters the modification liquid tank 4. The moving linear speed of the diamond wire in the modification liquid tank 4 is 20 m / s. At room temperature, the modification liquid is taken away and enters the drying tank 5 (tank temperature 190 °C) for drying. The moving linear speed of the diamond wire in the drying tank 5 is 4 m / s.

[0072] Example 4

[0073] Formulation of the surface modification liquid for diamond wire: By weight percentage, 3% of an emulsifier which is a compound of polysorbate and tannic acid blended at a weight ratio of 1:1, 20% of the oil-phase compound diethylene glycol butyl ether, 0.4% of a surfactant which is a compound of polyvinyl alcohol and cellulose blended at a weight ratio of 1:1, and the balance is water, with a total of 100%; First, add water, emulsifier, oil phase and surfactant components into a container in sequence, and stir until all components are completely dissolved to form a stable emulsion.

[0074] As Figure 1 shown, the surface modification method for diamond wire includes: After nickel plating the diamond wire in the electroplating area 1, it enters the warm water tank 2 for cleaning with warm pure water to clean the electroplating solution components, and then passes through the empty tank 3 and enters the modification liquid tank 4. The moving linear speed of the diamond wire in the modification liquid tank 4 is 25 m / s; At room temperature, the modification liquid is carried away and enters the drying tank 5 (tank temperature 195 °C) for drying. The moving linear speed of the diamond wire in the drying tank 5 is 5 m / s.

[0075] Example 5

[0076] Formulation of the surface modification liquid for diamond wire: By weight percentage, 4% of an emulsifier which is a compound of polysorbate and tannic acid blended at a weight ratio of 1:1, 25% of the oil-phase compound diethylene glycol butyl ether, 0.5% of a surfactant which is a compound of polyvinyl alcohol and cellulose blended at a weight ratio of 1:1, and the balance is water, with a total of 100%; First, add water, emulsifier, oil phase and surfactant components into a container in sequence, and stir until all components are completely dissolved to form a stable emulsion.

[0077] As Figure 1 shown, the surface modification method for diamond wire includes: After nickel plating the diamond wire in the electroplating area 1, it enters the warm water tank 2 for cleaning with warm pure water to clean the electroplating solution components, and then passes through the empty tank 3 and enters the modification liquid tank 4. The moving linear speed of the diamond wire in the modification liquid tank 4 is 30 m / s; At room temperature, the modification liquid is carried away and enters the drying tank 5 (tank temperature 200 °C) for drying. The moving linear speed of the diamond wire in the drying tank 5 is 3.5 m / s.

[0078] Example 6

[0079] Formulation of the surface modification liquid for diamond wire: By weight percentage, 5% of an emulsifier which is a compound of polysorbate and tannic acid blended at a weight ratio of 1:1, 30% of the oil-phase compound diethylene glycol butyl ether, 0.5% of a surfactant which is a compound of polyvinyl alcohol and cellulose blended at a weight ratio of 1:1, and the balance is water, with a total of 100%; First, add water, emulsifier, oil phase and surfactant components into a container in sequence, and stir until all components are completely dissolved to form a stable emulsion.

[0080] As Figure 1As shown in the figure, the method for surface modification of the diamond wire includes: plating nickel on the diamond wire in the electroplating area 1 and then entering the warm water tank 2 for cleaning with warm water and pure water to clean the components of the electroplating solution, and then passing through the empty tank 3 and entering the modification liquid tank 4. The moving linear speed of the diamond wire in the modification liquid tank 4 is 30 m / s; taking away the modification liquid at room temperature and entering the drying tank 5 (tank temperature 200 °C) for drying. The moving linear speed of the diamond wire in the drying tank 5 is 5 m / s.

[0081] Example 7

[0082] The difference between Example 7 and Example 4 is that the emulsifier is replaced with an emulsifier prepared by compounding sorbitol triglyceride and epigallocatechin gallate in a weight ratio of 1:1.

[0083] Example 8

[0084] The difference between Example 8 and Example 4 is that the emulsifier is replaced with an emulsifier prepared by compounding lauric acid and tannic acid ester in a weight ratio of 1:1.

[0085] Example 9

[0086] The difference between Example 9 and Example 4 is that the oil-phase compound is replaced with 1-nonanol.

[0087] Example 10

[0088] The difference between Example 10 and Example 4 is that the oil-phase compound is replaced with an oil-phase substance prepared by compounding diethylene glycol butyl ether and 1-nonanol in a weight ratio of 1:1.

[0089] Example 11

[0090] The difference between Example 11 and Example 4 is that the surfactant is replaced with a surfactant prepared by compounding polyethylene glycol and carboxymethyl cellulose in a weight ratio of 1:1.

[0091] Comparative Example 1

[0092] The difference between Comparative Example 1 and Example 4 is that the weight percentage content of the emulsifier in the modification liquid formulation is 0.05%, and the balance is water, totaling 100%.

[0093] Comparative Example 2

[0094] The difference between Comparative Example 2 and Example 4 is that the weight percentage content of the emulsifier in the modification liquid formulation is 6%, and the balance is water, totaling 100%.

[0095] Comparative Example 3

[0096] The difference between Comparative Example 3 and Example 4 is that the weight percentage content of the oil-phase compound in the modification liquid formulation is 2%, and the balance is water, totaling 100%.

[0097] Comparative Example 4

[0098] The difference between Comparative Example 4 and Example 4 is that the weight percentage of the oil-phase compound in the modification liquid formula is 35%, and the balance is water, totaling 100%.

[0099] Comparative Example 5

[0100] The difference between Comparative Example 5 and Example 4 is that the weight percentage of the surfactant in the modification liquid formula is 0.05%, and the balance is water, totaling 100%.

[0101] Comparative Example 6

[0102] The difference between Comparative Example 6 and Example 4 is that the weight percentage of the surfactant in the modification liquid formula is 0.8%, and the balance is water, totaling 100%.

[0103] Comparative Example 7

[0104] The difference between Comparative Example 7 and Example 4 is that the modification liquid formula is different;

[0105] By weight percentage, fatty acid methyl ester ethoxylate is 0.5% - 1%, Brij is 0.1% - 0.3%, and the balance is water, totaling 100%; the preparation temperature is 60°C - 70°C.

[0106] Modification method: Pass the diamond wire through an immersion tank filled with the immersion liquid, and a hydrophilic layer is formed on the wire surface; the temperature of the drying process is set at 250°C.

[0107] Comparative Example 8

[0108] The difference between Comparative Example 8 and Example 4 is that the modification liquid formula is different;

[0109] By weight percentage, ethylene glycol 200 is 0.5% - 1%, malonic acid is 0.1% - 0.3%, and the balance is water, totaling 100%; the preparation temperature is 50°C - 60°C.

[0110] Modification method: Pass the diamond wire through an immersion tank filled with the immersion liquid, and a hydrophilic layer is formed on the wire surface; the temperature of the drying process is set at 300°C.

[0111] Comparative Example 9

[0112] The difference between Comparative Example 9 and Example 4 is that the modification liquid formula is different;

[0113] By weight percentage, propylene glycol is 0.5% - 1%, polyethylene glycol 200 is 0.5% - 1%, and the balance is water, totaling 100%; the preparation temperature is 60°C - 70°C.

[0114] Modification method: Pass the diamond wire through an infiltration tank filled with an infiltration liquid, and a hydrophilic layer is formed on the surface of the wire; the temperature of the drying process is set at 350 °C.

[0115] Comparative Example 10

[0116] The difference between Comparative Example 10 and Example 4 is that the nickel-plated diamond wire is not modified with the modification liquid.

[0117] The properties of the modified diamond wires in Examples 1 to 11 and Comparative Examples 1 to 10 were tested, and the results are shown in Table 1.

[0118] Table 1

[0119]

[0120] It can be seen from the test results in Table 1 that compared with the unmodified diamond wires in Examples 1 to 11 of the present application, the modified diamond wires have stronger hydrophilicity, the contact angle is 8° to 26°, which is reduced by about 3 to 6 times; when the diamond wire saw cuts the silicon wafer, the wire breakage rate is reduced from 12.47% to 7.71%, and the wire marks are reduced from 0.84% to 0.35%; the above shows that after the surface modification with the modification liquid of the present application, the hydrophilicity of the diamond wire surface is significantly improved, the liquid-carrying effect of the diamond wire saw is improved, and the quality of the cut silicon wafer is improved.

[0121] In Comparative Examples 1 to 6, the emulsifier or oil-phase substance or surfactant affected the surface modification effect of the diamond wire due to inappropriate usage amounts; it shows that only when the component ratios of the diamond wire surface modification liquid are controlled within an appropriate range can the modification effect be significantly improved.

[0122] The modification liquid formulations of Comparative Examples 7 to 9 do not contain emulsifier, oil phase and surfactant at the same time, and the proportions of each component are different, and the surface modification effect on the diamond wire is not as good as that of the modification liquid of the present application.

[0123] It should be noted that the terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects, and do not necessarily need to describe a specific order or sequence. It should be understood that such terms can be interchanged under appropriate circumstances so that the embodiments of the present application described herein can be implemented in an order other than those described herein.

[0124] The above are only the preferred embodiments of the present application and are not used to limit the present application. For those skilled in the art, the present application can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. A surface modification liquid for diamond wire, characterized in that, The modified liquid comprises the following components by weight percentage: Emulsifier 0.1% - 5%, oil-phase compound 5% - 30%, surfactant 0.1% - 0.5%, the balance being water, with a total of 100%.

2. The surface modification liquid for diamond wire according to claim 1, wherein The weight percentage of the emulsifier is 1% - 5%, the weight percentage of the oil-phase compound is 10% - 30%, the weight percentage of the surfactant is 0.2% - 0.5%, the balance being the water, with a total of 100%.

3. The surface modification liquid for diamond wire according to claim 1 or 2, characterized in that, The weight percentage of the emulsifier is 2% - 5%, the weight percentage of the oil-phase compound is 10% - 20%, the weight percentage of the surfactant is 0.3% - 0.5%, the balance being the water, with a total of 100%.

4. The surface modification liquid for diamond wire according to any one of claims 1 to 3, characterized in that, The emulsifier is selected from at least one of fatty alcohol polyoxyethylene ether, polyphenolic compounds, and glycerol fatty acid ester; and / or, the oil-phase compound is a butyl ether compound and / or a fatty alcohol compound; and / or, the surfactant is selected from at least one of polyvinyl alcohol, polyethylene glycol, carboxymethyl cellulose, and cellulose.

5. The surface modification liquid for diamond wire according to claim 4, characterized in that, The emulsifier is a compound mixture of the fatty alcohol polyoxyethylene ether and the polyphenolic compound; and / or, the emulsifier is a compound mixture of the glycerol fatty acid ester and the polyphenolic compound; and / or, the fatty alcohol polyoxyethylene ether is polyethylene glycol maltamide alcohol or polysorbate; and / or, the polyphenolic compound is tannic acid, epigallocatechin gallate, or epigallocatechin; and / or, the glycerol fatty acid ester is sorbitol triglyceride or lauric acid; and / or, the butyl ether compound is diethylene glycol monobutyl ether or dipropylene glycol monobutyl ether; and / or, the fatty alcohol compound is n-decanol or n-nonanol.

6. The surface modification liquid for diamond wire according to claim 5, wherein The emulsifier is a mixture of the polysorbate and the tannic acid; and / or, the emulsifier is a mixture of the lauric acid and the tannic acid; and / or, the oil-phase compound is a mixture of the diethylene glycol monobutyl ether and the n-nonanol; and / or, the surfactant is a mixture of the polyvinyl alcohol and the cellulose.

7. The surface modification liquid for diamond wire according to claim 6, wherein, The weight ratio of the polysorbate to the tannic acid is (0.5 - 2):1; and / or, the weight ratio of the lauric acid to the tannic acid is 1:(1 - 3); and / or, the weight ratio of the diethylene glycol monobutyl ether to the n-nonanol is 1:(0.5 - 3); and / or, the weight ratio of the polyvinyl alcohol to the cellulose is (0.5 - 2):

1.

8. A method for surface modification of diamond wire, characterized in that, The modification method comprises the following steps: Step S1: Immerse the nickel-plated diamond wire in the modified liquid for infiltration modification to obtain an infiltrated diamond wire; Step S2: Dry the infiltrated diamond wire to obtain a surface-modified diamond wire; wherein, the modified liquid is the diamond wire surface-modified liquid according to any one of claims 1 to 7.

9. The surface modification method of the diamond wire according to claim 8, wherein, In step S1, the linear velocity of the nickel-plated diamond wire during moving infiltration in the modified liquid tank is 10 - 30 m / s; and / or, in step 2, the linear velocity of the infiltrated diamond wire during moving drying in the drying tank is 2 - 5 m / s, and the drying temperature is 180 - 200 °C.

10. A diamond wire saw, comprising a diamond wire; characterized in that, The diamond wire is the diamond wire obtained by the diamond wire surface modification method described in claim 8 or 9; wherein, a hydrophilic film is adhered to the surface of the diamond wire.

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