Diamond wire surface modification liquid, diamond wire surface modification method, and diamond wire saw

Abstract

The application discloses a diamond wire surface modification liquid, a diamond wire surface modification method and a diamond wire saw, and belongs to the technical field of photovoltaic materials. The diamond wire surface modification liquid comprises the following components: 0.1-5% of an emulsifier, 5-30% of an oil phase compound, 0.1-0.5% of a surfactant, and the balance of water, and the total amount is 100%. The diamond wire surface modification method comprises the following steps: immersing nickel-plated diamond wire into the above-mentioned modification liquid to perform infiltration modification, thereby obtaining infiltrated diamond wire; and drying the infiltrated diamond wire, thereby obtaining surface-modified diamond wire. The modified diamond wire has stronger hydrophilicity, can effectively bring cutting liquid components into a cutting slit, is favorable for reducing the generation of wire marks in the cutting process, and improves the quality of produced silicon wafers; the use of high-cost wetting agent components can be reduced or avoided, the use of wetting agents with low surface tension can be reduced or avoided, and the generation of foam can be reduced.

Description

Technical Field

[0001] This application relates to the field of photovoltaic materials technology, and more specifically, to a diamond wire surface modification liquid, a diamond wire surface modification method, and a diamond wire saw. Background Technology

[0002] In the manufacturing process of photovoltaic silicon wafers, the wafers are cut from silicon rods, and the primary tool used for cutting is the diamond wire saw. The outer layer of the diamond wire saw is a nickel metal layer, making it hydrophobic. With the development of the photovoltaic industry, cost reduction and efficiency improvement are achieved through thinner wafers and finer wires; however, this thinning process drastically increases the wire breakage rate during cutting, leading to increased production costs. To reduce the breakage rate, cutting fluids are often used. By using low-surface-tension wetting agents or increasing the wetting agent concentration, the fluid carrying capacity of the diamond wire saw can be improved. However, thinner wafers and finer wires also result in narrower kerf widths, increasing the resistance to fluid entry into the kerf. This places higher demands on the fluid carrying capacity of the diamond wire saw.

[0003] The main component of cutting fluid is surfactant, which includes wetting, lubrication, defoaming, and cleaning surfactants. By properly combining and blending them, the cutting fluid can be effectively carried into the cutting slit by the diamond wire saw, thereby improving the quality of the produced silicon wafers. However, in order to ensure the liquid carrying effect, the following problems exist when using low surface tension wetting agents or increasing the concentration of wetting agents: (1) Wetting agents have low surface tension characteristics, but low surface tension will accelerate the speed of foam generation, and abundant foam will affect the diamond wire saw's ability to carry the liquid into the cutting slit; (2) The purchase cost of the wetting surfactants in the cutting fluid is the highest among all surfactants. Therefore, using wetting agents or increasing the concentration of wetting agents will greatly hinder the control of silicon wafer production costs; (3) Generally speaking, the solubility of a substance in a certain solvent is limited. Therefore, blindly increasing the concentration of wetting agents will not reduce the surface tension. After a certain concentration, increasing the concentration of wetting agents will no longer significantly reduce the surface tension. Summary of the Invention

[0004] The main objective of this application is to provide a diamond wire surface modification liquid, a diamond wire surface modification method, and a diamond wire saw to solve the problem of poor liquid-carrying capacity of diamond wire saws in the prior art.

[0005] To achieve the above objectives, according to one aspect of this application, a diamond wire surface modification liquid is provided, comprising the following components by weight percentage:

[0006] Emulsifier 0.1%–5%, oil phase compound 5%–30%, surfactant 0.1%–0.5%, balance water, total 100%.

[0007] Furthermore, the emulsifier has a weight percentage of 1% to 5%, the oil phase compound has a weight percentage of 10% to 30%, the surfactant has a weight percentage of 0.2% to 0.5%, and the balance is water, totaling 100%.

[0008] Furthermore, the emulsifier comprises 2% to 5% by weight, the oil phase compound comprises 10% to 20% by weight, the surfactant comprises 0.3% to 0.5% by weight, and the balance is water, totaling 100%.

[0009] Furthermore, the emulsifier is selected from at least one of fatty alcohol polyoxyethylene ethers, polyphenolic compounds, and glycerol fatty acid esters.

[0010] Furthermore, the oil phase compounds are butyl ether compounds and / or fatty alcohol compounds.

[0011] Furthermore, the surfactant is selected from at least one of polyvinyl alcohol, polyethylene glycol, carboxymethyl cellulose, and cellulose.

[0012] Furthermore, the emulsifier is a compound of fatty alcohol polyoxyethylene ether and polyphenolic compounds.

[0013] Furthermore, the emulsifier is a compound of glycerol fatty acid esters and polyphenolic compounds.

[0014] Furthermore, the fatty alcohol polyoxyethylene ether is polyethylene glycol maltamide alcohol or polysorbate.

[0015] Furthermore, the polyphenolic compounds are tannic acid, epigallocatechin gallate, or epigallocatechin.

[0016] Furthermore, the glycerol fatty acid ester is sorbitol triglyceride or lauric acid.

[0017] Furthermore, the butyl ether compound is diethylene glycol butyl ether or dipropylene glycol monobutyl ether.

[0018] Furthermore, the fatty alcohol compound is n-decyl alcohol or n-nonyl alcohol.

[0019] Furthermore, the emulsifier is a mixture of polysorbate and tannic acid.

[0020] Furthermore, the emulsifier is a mixture of lauric acid and tannic acid.

[0021] Furthermore, the oil phase compound is a mixture of diethylene glycol butyl ether and n-nonyl alcohol.

[0022] Furthermore, the surfactant is a mixture of polyvinyl alcohol and cellulose.

[0023] Furthermore, the weight ratio of polysorbate to tannic acid is (0.5–2):1.

[0024] Furthermore, the weight ratio of lauric acid to tannic acid is 1:(1-3).

[0025] Furthermore, the weight ratio of diethylene glycol butyl ether to n-nonanol is 1:(0.5-3).

[0026] Furthermore, the weight ratio of polyvinyl alcohol to cellulose is (0.5–2):1.

[0027] According to a second aspect of this application, a method for modifying the surface of diamond wire is provided, comprising the following steps:

[0028] Step S1: Immerse the nickel-plated diamond wire in the modification solution for wetting modification to obtain wetted diamond wire;

[0029] Step S2: Dry the impregnated diamond wire to obtain surface-modified diamond wire;

[0030] The modifying liquid is the diamond wire surface modifying liquid mentioned above.

[0031] Furthermore, in step S1, the linear velocity of the nickel-plated diamond wire during its movement and immersion in the modified liquid bath is 10–30 m / s.

[0032] Furthermore, in step S2, the linear velocity of the impregnated diamond wire during drying in the drying tank is 2-5 m / s, and the drying temperature is 180-200℃.

[0033] According to a third aspect of this application, a diamond wire saw is provided, comprising a diamond wire; the diamond wire is a diamond wire obtained by the above-described diamond wire surface modification method; wherein a hydrophilic film is attached to the surface of the diamond wire.

[0034] The present application provides a diamond wire surface modification liquid, a diamond wire surface modification method, and a diamond wire saw. The modified diamond wire saw has stronger hydrophilicity, which can effectively carry the cutting fluid components into the cutting slit, thereby reducing the generation of wire marks during the cutting process and improving the quality of silicon wafers. By modifying the surface of the diamond wire saw with hydrophilicity, the use of expensive wetting agent components can be reduced or avoided, which is beneficial for controlling the cost of the cutting fluid. It can also reduce or avoid the use of wetting agents with low surface tension, which is beneficial for reducing the generation of foam. Attached Figure Description

[0035] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments and descriptions of this application are used to explain this application and do not constitute an undue limitation of this application. In the drawings:

[0036] Figure 1A schematic diagram of the diamond wire modification process according to an embodiment of this application is shown.

[0037] Figure label:

[0038] 1. Electroplating area; 2. Cleaning tank; 3. Empty tank area; 4. Modified liquid tank; 5. Drying tank. Detailed Implementation

[0039] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0040] As mentioned in the background technology, the diamond wire saw can be made effective in carrying liquid by using a low surface tension wetting agent or increasing the concentration of the wetting agent. However, the low surface tension wetting agent in the cutting fluid will accelerate the generation of foam during use. Excessive foam will affect the diamond wire saw's ability to carry liquid into the cutting kerf and will have limited effect. The wetting surfactant in the cutting fluid is expensive and will increase production costs.

[0041] Therefore, in order to improve the liquid-carrying capacity of diamond wire, this application provides a diamond wire surface modification liquid, which comprises the following components by weight percentage:

[0042] Emulsifier 0.1%–5%, oil phase compound 5%–30%, surfactant 0.1%–0.5%, balance water, total 100%.

[0043] The weight percentage of emulsifier in the modified liquid formulation of this application is any value or a range between 0.1%, 0.5%, 1%, 1.5%, 2%, 2.5%, 3%, 3.5%, 4%, 4.5%, and 5%. If the emulsifier content is too low, the water-in-oil emulsion structure cannot be effectively stabilized, leading to demulsification and preventing the effective delivery of hydrophilic active ingredients. A content exceeding 5% will affect the synergy with other components and increase costs. The weight percentage of the oil phase compound is 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14%, 15%, 16%, 17%, 18%, and 19%. The content of oil phase compounds can be any value or a range between any two of the following: 20%, 21%, 22%, 23%, 24%, 25%, 26%, 27%, 28%, 29%, and 30%. If the content of oil phase compounds is too low, a water-in-oil structure cannot be formed well; if the content exceeds 30%, the water-in-oil emulsion structure will deteriorate, which is not conducive to subsequent drying, demulsification, and film formation. The weight percentage of surfactant can be any value or a range between any two of the following: 0.1%, 0.2%, 0.3%, 0.4%, and 0.5%. If the surfactant content is too low, it cannot achieve the hydrophilic modification effect; if the content exceeds 0.5%, it will affect the synergistic effect with other components and cause raw material waste.

[0044] The diamond wire modification fluid developed in this application comprises an emulsifier, an oil phase, a surfactant, and water. Since the outer layer of the diamond wire saw is a hydrophobic nickel metal layer, the design concept of this application is to utilize a water-in-oil emulsion structure to deliver the hydrophilic components to the diamond wire saw through emulsion particles. Heating and drying then breaks the emulsion, allowing the hydrophilic components to form a hydrophilic film structure on the diamond wire saw, ultimately resulting in a diamond wire saw with a hydrophilic surface. The emulsifier added to the modification fluid in this application is a water-in-oil type material, whose function is to stabilize the interface of the water-in-oil emulsion particles. The added oil phase compound can both form a water-in-oil emulsion structure and reduce the influence of residual oil on the hydrophilicity of the film layer after the emulsion particles are dried. The added surfactant has low surface tension, which can enhance hydrophilicity, and the amount used is relatively low. Emulsifiers, oil-phase substances, and surfactants are dissolved in water. Due to the action of the water-in-oil emulsifier, the hydrophilic surfactant is encapsulated in the water-in-oil structure formed by the oil-phase substance. The emulsifier further stabilizes the water-in-oil emulsion structure. The three components work synergistically to form a stable water-in-oil emulsion with hydrophilic components. The surface of diamond wire is hydrophobic; therefore, the water-in-oil emulsion can be adsorbed onto the surface of the diamond wire by means of "like charges attract." After high-temperature drying and demulsification, a surfactant coating with low surface tension is formed, making the surface of the diamond wire hydrophilic.

[0045] The preparation method of the modified liquid in this application is as follows: water, emulsifier, oil phase and surfactant are added sequentially to a container and stirred until all components are completely dissolved to form a stable emulsion, namely the above-mentioned surface modified liquid.

[0046] The diamond wire saw modified with the diamond wire surface modification liquid provided in this application has stronger hydrophilicity, which can effectively carry the cutting fluid components into the cutting slit, which helps to reduce the generation of wire marks during the cutting process and improve the quality of the produced silicon wafers. By modifying the surface of the diamond wire saw with hydrophilicity, the use of high-cost wetting agent components in the cutting fluid can be reduced or avoided, which is beneficial to cost control. The use of wetting agents with low surface tension can also be reduced or avoided, which helps to reduce the generation of foam.

[0047] In some embodiments, the modified liquid formulation comprises: an emulsifier with a weight percentage of 1% to 5%, an oil phase compound with a weight percentage of 10% to 30%, a surfactant with a weight percentage of 0.2% to 0.5%, and the balance being water, totaling 100%. Further, the modified liquid formulation comprises: an emulsifier with a weight percentage of 2% to 5%, an oil phase compound with a weight percentage of 10% to 20%, a surfactant with a weight percentage of 0.3% to 0.5%, and the balance being water, totaling 100%. By optimizing the proportions of the emulsifier, oil phase, and surfactant, fully utilizing their respective functions and enhancing the synergistic effect among them, a structurally stable hydrophilic modified emulsion can be obtained.

[0048] In some embodiments, the emulsifier is selected from at least one of fatty alcohol polyoxyethylene ethers, polyphenolic compounds, sorbitan monooleate, and glycerol fatty acid esters. The selected emulsifiers, after formulation, have an HLB value sufficient to form a water-in-oil structure, and their function is to stabilize the interface of the water-in-oil emulsion particles. Specifically, the fatty alcohol polyoxyethylene ether can be polyethylene glycol maltamide alcohol or polysorbate; the polyphenolic compound can be tannic acid, epigallocatechin gallate, or epigallocatechin; the glycerol fatty acid ester can be sorbitol triglyceride or lauric acid; more preferably, the emulsifier is a compound of fatty alcohol polyoxyethylene ether and polyphenolic compound, or a compound of glycerol fatty acid ester and polyphenolic compound; when the emulsifier is polysorbate and tannic acid, the weight ratio of the two is (0.5-2):1, for example 1:1; when the emulsifier is lauric acid and tannic acid, the weight ratio of the two is 1:(1-3), for example 1:1. Using the above-mentioned compounded emulsifier is more conducive to forming a more stable water-in-oil modified liquid.

[0049] In some embodiments, the oil phase compound is a butyl ether compound and / or a fatty alcohol compound. Specifically, the butyl ether compound is diethylene glycol butyl ether or dipropylene glycol monobutyl ether; the fatty alcohol compound is n-decyl alcohol or n-nonyl alcohol; preferably, when the oil phase compound is a mixture of diethylene glycol butyl ether and n-nonyl alcohol, the weight ratio of the two is 1:(0.5-3), for example, 1:1. Using the above-mentioned compounded oil phase compound can better form a water-in-oil emulsion structure and reduce the influence of the residual oil phase on the hydrophilicity of the film layer after the emulsion particles are dried.

[0050] In some embodiments, the surfactant is a water-soluble polymer containing hydrophilic groups such as ether bonds, hydroxyl groups, and amino groups; specifically, at least one of polyvinyl alcohol, polyethylene glycol, carboxymethyl cellulose, and cellulose can be selected. More specifically, the surfactant is a mixture of polyvinyl alcohol and cellulose in a weight ratio of (0.5–2):1, for example, 1:1. Surfactants of the above type have strong hydrophilicity and low surface tension, and the amount used is reduced; the liquid carrying capacity of the surface-modified hydrophilic diamond wire is significantly increased.

[0051] In some embodiments, the modified liquid formulation comprises: an emulsifier comprising 2% to 5% by weight, an oil phase compound comprising 10% to 20% by weight, a surfactant comprising 0.3% to 0.5% by weight, and the balance being water, totaling 100%; wherein the emulsifier is a mixture of lauric acid and tannic acid in a weight ratio of 1:(1 to 3), or the emulsifier is a mixture of polysorbate and tannic acid in a weight ratio of (0.5 to 2):1; the oil phase compound is a mixture of diethylene glycol butyl ether and n-nonanol in a weight ratio of 1:(0.5 to 3); and the surfactant is at least one selected from polyvinyl alcohol, polyethylene glycol, carboxymethyl cellulose, and cellulose.

[0052] In some embodiments, the modified liquid formulation is further optimized as follows: the emulsifier comprises 2%–4% by weight, the oil phase compound comprises 15%–25% by weight, the surfactant comprises 0.3%–0.5% by weight, and the balance is water, totaling 100%; wherein the emulsifier is a mixture of polysorbate and tannic acid in a weight ratio of (0.5–2):1; the oil phase compound is diethylene glycol butyl ether; and the surfactant is a compound of polyvinyl alcohol and cellulose in a weight ratio of 1:1. By further using a more effective compounded emulsifier, oil phase compound, and surfactant, and by further optimizing the proportions of each component, a better synergistic effect is achieved among the emulsifier, oil phase compound, and surfactant, resulting in a structurally stable hydrophilic modified emulsion that enhances the hydrophilic surface modification effect of diamond wire.

[0053] For example, a modified liquid formulation might include: 2% emulsifier, 15% oil phase compound, 0.3% surfactant by weight, and the remainder being water, totaling 100%. Alternatively, it could include: 3% emulsifier, 20% oil phase compound, 0.4% surfactant by weight, and the remainder being water, totaling 100%. Or, it could include: 4% emulsifier, 25% oil phase compound, 0.5% surfactant by weight, and the remainder being water, totaling 100%. More specifically, a diamond wire surface modified liquid formulation might include: 3% emulsifier (a 1:1 weight ratio of polysorbate and tannic acid), 20% diethylene glycol butyl ether (an oil phase compound), 0.4% surfactant (a 1:1 weight ratio of polyvinyl alcohol and cellulose), and the remainder being water, totaling 100%. Water, emulsifier, oil phase, and surfactant are added sequentially to a container, and the mixture is stirred until all components are completely dissolved, forming a stable emulsion. By precisely controlling the mass ratio of emulsifier, oil phase, and surfactant, the synergistic effect among the three can be further enhanced, resulting in a structurally stable hydrophilic modified emulsion that enhances the hydrophilic surface modification effect of diamond wire.

[0054] According to a second aspect of this application, the above-mentioned method for modifying the surface of diamond wire is provided, comprising the following steps:

[0055] Step S1: Immerse the nickel-plated diamond wire in the above-mentioned diamond wire surface modification solution for wetting modification to obtain wetted diamond wire;

[0056] Step S2: Dry the impregnated diamond wire to obtain surface-modified diamond wire;

[0057] In some embodiments, in step S1, the linear velocity of the nickel-plated diamond wire during its movement and wetting in the modified liquid bath is 10–30 m / s. This linear velocity is any value among 10 m / s, 15 m / s, 20 m / s, 25 m / s, and 30 m / s, or any value between two of these. A moving speed that is too slow will affect production efficiency, while a speed that is too fast will result in insufficient wetting of the diamond wire surface, which is detrimental to subsequent drying and film formation. By controlling the aforementioned linear velocity of the diamond wire in the modified liquid bath, the wetting amount of the modified liquid on the diamond wire surface can be adjusted, ensuring both the wetting amount and the drying and film formation effect.

[0058] In some embodiments, in step S2, the linear velocity of the impregnated diamond wire during drying in the drying tank is 2–5 m / s, and the drying temperature is 180–200°C. This linear velocity can be any value from 2 m / s, 3 m / s, 4 m / s, and 5 m / s, or any value within a range of two. Excessive speed during drying is detrimental to film formation, while excessively slow speed will affect production efficiency. Only by adopting the aforementioned suitable drying speed can the surface film of the diamond wire achieve good quality.

[0059] According to a third aspect of this application, a diamond wire saw is provided, comprising a diamond wire; the diamond wire is a diamond wire obtained by the above-described diamond wire surface modification method; wherein a hydrophilic film is attached to the surface of the diamond wire.

[0060] This application enhances the hydrophilicity of diamond wire by introducing a hydrophilic film layer on the surface of the diamond wire, thereby improving the wettability of the diamond wire saw surface and the cutting fluid, and thus improving the fluid carrying effect of the diamond wire. In particular, it improves the ability of the cutting fluid to enter the cutting slit, and also reduces the cost of using wetting agents in the cutting fluid and the problem of wetting agents easily generating foam. At the same time, it also reduces the generation of wire marks during the cutting process and improves the quality of silicon wafers.

[0061] The present application will be further described in detail below with reference to specific embodiments, which should not be construed as limiting the scope of protection claimed in the present application.

[0062] The raw materials used in the embodiments of this application are existing technologies and are all commercially available.

[0063] Example 1

[0064] The formulation of the diamond wire surface modification solution is as follows: by weight percentage, 0.1% emulsifier (a mixture of polysorbate and tannic acid in a 1:1 weight ratio), 5% oil phase compound diethylene glycol butyl ether, 0.1% surfactant (a mixture of polyvinyl alcohol and cellulose in a 1:1 weight ratio), and the balance is water, totaling 100%. Water, emulsifier, oil phase compound, and surfactant are added sequentially to the container and stirred until all components are completely dissolved to form a stable emulsion.

[0065] like Figure 1As shown, the diamond wire surface modification method includes: after nickel plating in electroplating zone 1, the diamond wire is cleaned in warm water bath 2 with warm and pure water to remove the components of the electroplating solution, and then enters modification liquid bath 4 through empty bath 3. The linear velocity of the diamond wire in modification liquid bath 4 is 10m / s; the modification solution is carried away at room temperature and then entered into drying bath 5 (battery temperature 180℃) for drying. The linear velocity of the diamond wire in drying bath 5 is 2m / s.

[0066] Example 2

[0067] The formulation of the diamond wire surface modification solution is as follows: by weight percentage, 1% of the emulsifier is a compound of polysorbate and tannic acid in a 1:1 weight ratio, 10% of the oil phase compound is diethylene glycol butyl ether, 0.2% of the surfactant is a compound of polyvinyl alcohol and cellulose in a 1:1 weight ratio, and the balance is water, totaling 100%. Water, emulsifier, oil phase and surfactant are added sequentially to the container and stirred until all components are completely dissolved to form a stable emulsion.

[0068] like Figure 1 As shown, the diamond wire surface modification method includes: after nickel plating in electroplating zone 1, the diamond wire is cleaned in warm water bath 2 with warm and pure water to remove the components of the electroplating solution, and then enters modification liquid bath 4 through empty bath 3. The linear velocity of the diamond wire in modification liquid bath 4 is 15m / s; the modification solution is carried away at room temperature and then entered into drying bath 5 (battery temperature 185℃) for drying. The linear velocity of the diamond wire in drying bath 5 is 3m / s.

[0069] Example 3

[0070] The formulation of the diamond wire surface modification solution is as follows: by weight percentage, 2% of the emulsifier is a compound of polysorbate and tannic acid in a 1:1 weight ratio, 15% of the oil phase compound is diethylene glycol butyl ether, 0.3% of the surfactant is a compound of polyvinyl alcohol and cellulose in a 1:1 weight ratio, and the balance is water, totaling 100%. Water, emulsifier, oil phase and surfactant are added sequentially to the container and stirred until all components are completely dissolved to form a stable emulsion.

[0071] like Figure 1 As shown, the surface modification method for diamond wire includes: after nickel plating in electroplating zone 1, the diamond wire is cleaned in warm water bath 2 with warm and pure water to remove the components of the electroplating solution, and then enters modification liquid bath 4 through empty bath 3. The linear velocity of the diamond wire in modification liquid bath 4 is 20m / s; the modification solution is carried away at room temperature and then entered into drying bath 5 (battery temperature 190℃) for drying. The linear velocity of the diamond wire in drying bath 5 is 4m / s.

[0072] Example 4

[0073] The formulation of the diamond wire surface modification solution is as follows: by weight percentage, 3% of the emulsifier is a compound of polysorbate and tannic acid in a 1:1 weight ratio, 20% of the oil phase compound diethylene glycol butyl ether, 0.4% of the surfactant is a compound of polyvinyl alcohol and cellulose in a 1:1 weight ratio, and the balance is water, totaling 100%. Water, emulsifier, oil phase and surfactant are added sequentially to the container and stirred until all components are completely dissolved to form a stable emulsion.

[0074] like Figure 1 As shown, the surface modification method for diamond wire includes: after nickel plating in electroplating zone 1, the diamond wire is cleaned in warm water bath 2 with warm and pure water to remove the components of the electroplating solution, and then enters modification liquid bath 4 through empty bath 3. The linear velocity of the diamond wire in modification liquid bath 4 is 25 m / s; the modification solution is carried away at room temperature and then entered into drying bath 5 (battery temperature 195℃) for drying. The linear velocity of the diamond wire in drying bath 5 is 5 m / s.

[0075] Example 5

[0076] The formulation of the diamond wire surface modification solution is as follows: by weight percentage, 4% emulsifier (a mixture of polysorbate and tannic acid in a 1:1 weight ratio), 25% oil phase compound diethylene glycol butyl ether, 0.5% surfactant (a mixture of polyvinyl alcohol and cellulose in a 1:1 weight ratio), and the balance is water, totaling 100%. Water, emulsifier, oil phase and surfactant are added sequentially to the container and stirred until all components are completely dissolved to form a stable emulsion.

[0077] like Figure 1 As shown, the diamond wire surface modification method includes: after nickel plating in electroplating zone 1, the diamond wire is cleaned in warm water bath 2 with warm and pure water to remove the components of the electroplating solution, and then enters modification liquid bath 4 through empty bath 3. The linear velocity of the diamond wire in modification liquid bath 4 is 30m / s; the modification solution is carried away at room temperature and then entered into drying bath 5 (battery temperature 200℃) for drying. The linear velocity of the diamond wire in drying bath 5 is 3.5m / s.

[0078] Example 6

[0079] The formulation of the diamond wire surface modification solution is as follows: by weight percentage, 5% of the emulsifier is a compound of polysorbate and tannic acid in a 1:1 weight ratio, 30% of the oil phase compound diethylene glycol butyl ether, 0.5% of the surfactant is a compound of polyvinyl alcohol and cellulose in a 1:1 weight ratio, and the balance is water, totaling 100%. Water, emulsifier, oil phase and surfactant are added sequentially to the container and stirred until all components are completely dissolved to form a stable emulsion.

[0080] like Figure 1As shown, the surface modification method for diamond wire includes: after nickel plating in electroplating zone 1, the diamond wire is cleaned in warm water bath 2 with warm and pure water to remove the components of the electroplating solution, and then enters modification liquid bath 4 through empty bath 3. The linear velocity of the diamond wire in modification liquid bath 4 is 30m / s; the modification solution is carried away at room temperature and then entered into drying bath 5 (battery temperature 200℃) for drying. The linear velocity of the diamond wire in drying bath 5 is 5m / s.

[0081] Example 7

[0082] The difference between Example 7 and Example 4 is that the emulsifier is replaced with an emulsifier composed of sorbitol triglyceride and epigallocatechin gallate in a weight ratio of 1:1.

[0083] Example 8

[0084] The difference between Example 8 and Example 4 is that the emulsifier is replaced with an emulsifier composed of lauric acid and tannic acid in a weight ratio of 1:1.

[0085] Example 9

[0086] The difference between Example 9 and Example 4 is that the oil phase compound is replaced with n-nonyl alcohol.

[0087] Example 10

[0088] The difference between Example 10 and Example 4 is that the oil phase compound is replaced with an oil phase compound of diethylene glycol butyl ether and n-nonanol in a weight ratio of 1:1.

[0089] Example 11

[0090] The difference between Example 11 and Example 4 is that the surfactant is replaced with a surfactant compounded from polyethylene glycol and carboxymethyl cellulose in a weight ratio of 1:1.

[0091] Comparative Example 1

[0092] The difference between Comparative Example 1 and Example 4 is that the emulsifier in the modified liquid formulation is 0.05% by weight, with the remainder being water, totaling 100%.

[0093] Comparative Example 2

[0094] The difference between Comparative Example 2 and Example 4 is that the emulsifier in the modified liquid formulation is 6% by weight, with the remainder being water, totaling 100%.

[0095] Comparative Example 3

[0096] The difference between Comparative Example 3 and Example 4 is that the oil phase compound in the modified liquid formulation is 2% by weight, with the remainder being water, totaling 100%.

[0097] Comparative Example 4

[0098] The difference between Comparative Example 4 and Example 4 is that the oil phase compound in the modified liquid formulation is 35% by weight, with the remainder being water, totaling 100%.

[0099] Comparative Example 5

[0100] The difference between Comparative Example 5 and Example 4 is that the surfactant in the modified liquid formulation is 0.05% by weight, with the remainder being water, totaling 100%.

[0101] Comparative Example 6

[0102] The difference between Comparative Example 6 and Example 4 is that the surfactant in the modified liquid formulation is 0.8% by weight, with the remainder being water, totaling 100%.

[0103] Comparative Example 7

[0104] The difference between Comparative Example 7 and Example 4 is that the modified liquid formulation is different;

[0105] The composition by weight percentage is 0.5%–1% fatty acid methyl ester ethoxylate, 0.1%–0.3% Briggs, and the balance is water, totaling 100%; the preparation temperature is 60℃–70℃.

[0106] Modification method: The diamond wire is passed through an impregnation tank containing an impregnation solution, and a hydrophilic layer is formed on the surface of the wire; the temperature of the drying process is set to 250℃.

[0107] Comparative Example 8

[0108] The difference between Comparative Example 8 and Example 4 is that the modified liquid formulation is different;

[0109] By weight percentage, ethylene glycol 200 0.5%–1%, malonic acid 0.1%–0.3%, and the balance is water, totaling 100%; preparation temperature 50℃–60℃.

[0110] Modification method: The diamond wire is passed through an impregnation tank containing an impregnation solution, and a hydrophilic layer is formed on the surface of the wire; the temperature of the drying process is set to 300℃.

[0111] Comparative Example 9

[0112] The difference between Comparative Example 9 and Example 4 is that the modified liquid formulation is different;

[0113] By weight percentage, propylene glycol 0.5%–1%, polyethylene glycol 200 0.5%–1%, and the balance is water, totaling 100%; preparation temperature 60℃–70℃.

[0114] Modification method: The diamond wire is passed through an impregnation tank containing an impregnation solution, and a hydrophilic layer is formed on the surface of the wire; the temperature of the drying process is set to 350℃.

[0115] Comparative Example 10

[0116] The difference between Comparative Example 10 and Example 4 is that the nickel-plated diamond wire was not modified with a modifying solution.

[0117] The properties of the modified diamond wires in Examples 1-11 and Comparative Examples 1-10 were tested, and the results are shown in Table 1.

[0118] Table 1

[0119]

[0120] As shown in Table 1, the modified diamond wires in Examples 1-11 of this application exhibit stronger hydrophilicity compared to the unmodified wires, with a contact angle of 8°–26°, representing a reduction of approximately 3–6 times. The wire breakage rate during silicon wafer cutting by the diamond wire saw decreased from 12.47% to 7.71%, and the wire mark rate decreased from 0.84% ​​to 0.35%. These findings demonstrate that surface modification with the modified liquid of this application significantly improves the hydrophilicity of the diamond wire surface, enhances the liquid-carrying effect of the diamond wire saw, and improves the quality of silicon wafer cutting.

[0121] In Comparative Examples 1 to 6, the improper use of emulsifiers, oil phase substances, or surfactants affected the surface modification effect of diamond wires. This indicates that the surface modification solution for diamond wires can only significantly improve the modification effect when the proportions of each component are controlled within an appropriate range.

[0122] The modified liquid formulations of Comparative Examples 7 to 9 did not simultaneously contain emulsifiers, oil phases, and surfactants, and the proportions of each component were different. Therefore, their surface modification effect on diamond wire was not as good as that of the modified liquid in this application.

[0123] It should be noted that the terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms can be used interchangeably where appropriate so that the embodiments of this application described herein can be implemented, for example, in a sequence other than those described herein.

[0124] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A method for surface modification of diamond wire, characterized in that, The modification method includes the following steps: Step S1: Immerse the nickel-plated diamond wire in the modification solution for wetting modification to obtain wetted diamond wire; Step S2: Dry the impregnated diamond wire to obtain surface-modified diamond wire; the drying temperature is 180~200 ℃; The modified liquid comprises the following components, by weight percentage: Emulsifier 0.1%~5%, oil phase compound 5%~30%, surfactant 0.1%~0.5%, balance water, total 100%; The emulsifier is selected from at least one of fatty alcohol polyoxyethylene ethers, polyphenolic compounds, and glycerol fatty acid esters; The oil phase compounds are butyl ether compounds and / or fatty alcohol compounds; The surfactant is selected from at least one of polyvinyl alcohol, polyethylene glycol, carboxymethyl cellulose, and cellulose.

2. The method for surface modification of diamond wire according to claim 1, characterized in that, The emulsifier has a weight percentage of 1% to 5%, the oil phase compound has a weight percentage of 10% to 30%, the surfactant has a weight percentage of 0.2% to 0.5%, and the balance is water, totaling 100%.

3. The method for surface modification of diamond wire according to claim 1 or 2, characterized in that, The emulsifier has a weight percentage of 2% to 5%, the oil phase compound has a weight percentage of 10% to 20%, the surfactant has a weight percentage of 0.3% to 0.5%, and the balance is water, totaling 100%.

4. The method for surface modification of diamond wire according to claim 1, characterized in that, The emulsifier is selected from one of the following types: a compound of the fatty alcohol polyoxyethylene ether and the polyphenolic compound, or a compound of the glycerol fatty acid ester and the polyphenolic compound; The fatty alcohol polyoxyethylene ether is polyethylene glycol maltamide alcohol or polysorbate; The polyphenolic compounds are tannic acid, epigallocatechin gallate, or epigallocatechin; The glycerol fatty acid ester is sorbitol triglyceride or lauric acid; The butyl ether compound is diethylene glycol butyl ether or dipropylene glycol monobutyl ether; The fatty alcohol compound is n-decyl alcohol or n-nonyl alcohol.

5. The method for surface modification of diamond wire according to claim 4, characterized in that, The emulsifier is a mixture of the polysorbate and the tannic acid; Alternatively, the emulsifier may be a mixture of the lauric acid and the tannic acid; The oil phase compound is a mixture of the diethylene glycol butyl ether and the n-nonyl alcohol; The surfactant is a mixture of the polyvinyl alcohol and the cellulose.

6. The method for surface modification of diamond wire according to claim 5, characterized in that, The weight ratio of the polysorbate to the tannic acid is (0.5~2):1; Alternatively, the weight ratio of the lauric acid to the tannic acid is 1:(1~3). The weight ratio of the diethylene glycol butyl ether to the n-nonanol is 1:(0.5~3). The weight ratio of the polyvinyl alcohol to the cellulose is (0.5~2):

1.

7. The method for surface modification of diamond wire according to claim 1, characterized in that, In step S1, the linear velocity of the nickel-plated diamond wire during its movement and immersion in the modified liquid bath is 10~30 m / s. And / or, in step S2, the linear velocity of the impregnated diamond wire during its movement and drying in the drying tank is 2~5 m / s.

8. A diamond wire saw, comprising diamond wire; characterized in that, The diamond wire is the diamond wire obtained by the diamond wire surface modification method according to any one of claims 1 to 7; wherein, the surface of the diamond wire is coated with a hydrophilic film.

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