Automatic alignment crimping detection equipment and detection method thereof

Abstract

The invention relates to automatic alignment crimping detection equipment and a detection method thereof. The automatic alignment crimping detection equipment comprises a signal generation detection module, a crimping mechanism, a carrying table mechanism and a visual alignment mechanism which are arranged on a rack, the signal generation and detection module is used for providing a test signal for a tested product and testing the tested product; the platform deck mechanism is used for bearing a tested product; the visual alignment mechanism is used for assisting the alignment correction of the crimping mechanism and the crimping point of the tested product; the crimping mechanism comprises a crimping driving module and a crimping PCB, one end of the crimping PCB is provided with a bonding pad which is in alignment crimping with a crimping point position of a tested product, the other end of the crimping PCB is connected to the signal generation detection module through a connector, and the crimping driving module is used for performing crimping conduction on the crimping PCB and the tested product. According to the invention, the crimping PCB is directly connected with the tested product in a crimping manner, so that the transmission path for the signal generation detection module to send the test signal to the tested product can be remarkably shortened, the signal transmission reliability is improved, and the detection efficiency is improved.

Description

Technical Field

[0001] This application relates to the technical field of testing products to be measured, and particularly relates to an automatic alignment and crimping detection device and its detection method. Background Art

[0002] Liquid crystal displays are widely used in various electronic devices, such as mobile phones, tablet computers, personal digital assistants, etc., due to their advantages of light weight, thinness, and low power consumption. A liquid crystal display mainly includes a liquid crystal panel and a backlight module. The product to be measured for liquid crystal includes two parallel glass substrates and a liquid crystal layer disposed between the two glass substrates.

[0003] The backlight module is used to provide backlight for the product to be measured for liquid crystal. The driving circuit of the liquid crystal display drives the liquid crystal molecules of the liquid crystal layer to deflect, and adjusts the light by controlling the deflection angle of the liquid crystal molecules to achieve the purpose of display.

[0004] After the product to be measured for liquid crystal of the liquid crystal display is assembled, it usually needs to be powered on for testing, that is, various test image signals are provided to the product to be measured for liquid crystal through a test device to determine whether the product to be measured for liquid crystal can display the picture normally, whether there are visual defects in each pixel, and whether there are defects in the circuit, etc.

[0005] During the testing process of the liquid crystal display, the printed circuit board (PCB: Printed Circuit Board) on the liquid crystal display needs to be connected to the flexible printed circuit (FPC: Flexible Printed Circuit) for information transmission to light up the liquid crystal display. Since there are many signal lines, the connector pins are numerous and dense, and generally a flexible flat cable (FFC: Flexible Flat Cable) is used as an intermediate connecting piece for transitional connection.

[0006] However, because the FFC itself is relatively soft, and the heights on both sides of the pressing head cannot be guaranteed to be on the same horizontal line during the pressing process, resulting in poor contact, and it is easy to have unstable connection signal transmission between the FFC and the FPC, and there is a signal attenuation phenomenon, resulting in the failure of the liquid crystal display detection. Summary of the Invention

[0007] Embodiments of this application provide an automatic alignment and crimping detection device and its detection method to solve the problem in the related art that the connection signal transmission between the FFC and the FPC is unstable and there is a signal attenuation phenomenon, resulting in the failure of the liquid crystal display detection.

[0008] The first aspect of the embodiments of this application provides an automatic alignment and crimping detection device, including:

[0009] A frame, on which a signal generation and detection module, a crimping mechanism, a stage mechanism, and a vision alignment mechanism are arranged;

[0010] The signal generation and detection module is used to provide a test signal to the product under test and test the product under test;

[0011] The stage mechanism is used to carry the product under test;

[0012] The vision alignment mechanism is used to assist in the alignment and correction of the crimping point between the crimping mechanism and the product under test;

[0013] The crimping mechanism includes a crimping drive module and a crimping PCB. One end of the crimping PCB is provided with pads for aligning and crimping with the crimping points of the product under test. The other end of the crimping PCB is connected to the signal generation and detection module through a connector. The crimping drive module is used to crimp and conduct the crimping PCB and the product under test.

[0014] In some embodiments: The crimping points of the product under test include a first crimping area facing the stage mechanism. The crimping PCB includes a first sub-crimping PCB fixed on the frame and crimped with the first crimping area;

[0015] The crimping drive module includes a first sub-crimping drive module located on the side of the product under test away from the stage mechanism. The vision alignment mechanism includes a first vision sub-alignment module located on the side of the product under test away from the stage mechanism.

[0016] In some embodiments: The first sub-crimping drive module includes an intermediate punch, and a downward pressing mechanism and a translation mechanism for driving the intermediate punch to move in the vertical direction and the horizontal direction respectively;

[0017] The first vision sub-alignment module includes an upper positioning camera for acquiring image information of the first crimping area and the first sub-crimping PCB. The upper positioning camera is equipped with an upper light source.

[0018] In some embodiments: The crimping points of the product under test include a second crimping area facing away from the stage mechanism. The crimping drive module includes a second sub-crimping drive module provided on the side of the product under test away from the stage mechanism;

[0019] The crimping PCB includes a second sub-crimping PCB fixed on the second sub-crimping drive module and crimped with the second crimping area;

[0020] The vision alignment mechanism includes a second vision sub-alignment module provided on the side of the product under test facing the stage mechanism.

[0021] In some embodiments: The crimping points of the product under test further include a third crimping area and a fourth crimping area facing away from the stage mechanism. The third crimping area and the fourth crimping area are respectively located on both sides of the first crimping area;

[0022] The crimping drive module further includes a third sub-crimping drive module and a fourth sub-crimping drive module located on both sides of the first sub-crimping drive module, and the third sub-crimping drive module and the fourth sub-crimping drive module are arranged on the side of the product under test away from the stage mechanism;

[0023] The crimping PCB board further includes a third sub-crimping PCB board fixed to the output end of the third sub-crimping drive module, and a fourth sub-crimping PCB board fixed to the output end of the fourth sub-crimping drive module;

[0024] The vision alignment mechanism further includes a third vision sub-alignment module on the side of the product under test facing the stage mechanism and reciprocating between the third sub-crimping drive module and the fourth sub-crimping drive module.

[0025] In some embodiments: an X-axis drive mechanism for driving the third sub-crimping drive module and the fourth sub-crimping drive module to reciprocate synchronously in the X-axis direction is provided on the frame;

[0026] Both the third sub-crimping drive module and the fourth sub-crimping drive module include a first cylinder connected to the X-axis drive mechanism for realizing pre-crimping, a telescopic arm of the first cylinder is connected to a second cylinder for realizing precise crimping, and a telescopic arm of the second cylinder is connected to a connecting seat for fixing the third sub-crimping PCB board or the fourth sub-crimping PCB board;

[0027] The third vision sub-alignment module includes a lower positioning camera for acquiring image information of the third crimping area and the third sub-crimping PCB board, and image information of the fourth crimping area and the fourth sub-crimping PCB board. The lower positioning camera is equipped with a lower light source, and the lower positioning camera is connected to a multi-axis fine adjustment module for driving it to reciprocate in the X-axis direction.

[0028] In some embodiments: the connecting seat includes an upper mounting seat connected to the second cylinder, and a lower mounting seat connected to the third sub-crimping PCB board or the fourth sub-crimping PCB board;

[0029] A Y-axis fine adjustment module is connected between the upper mounting seat and the lower mounting seat of the third sub-crimping drive module;

[0030] An X-axis fine adjustment module and a Y-axis fine adjustment module are connected between the upper mounting seat and the lower mounting seat of the fourth sub-crimping drive module.

[0031] In some embodiments: the stage mechanism includes a vacuum stage for placing the product under test, and an attitude correction module connected to the vacuum stage for correcting the position and angle of the product under test;

[0032] The posture correction module includes a Z-axis drive mechanism for adjusting the vertical height of the product to be measured, a vision alignment platform fixed on the Z-axis drive mechanism for driving the product to be measured to perform precise adjustment in the X-Y plane and at an angle of θ, and a Y-axis drive mechanism provided on the vision alignment platform for driving the product to be measured to reciprocate between the loading and unloading stations and the crimping station.

[0033] In the second aspect of the embodiments of the present application, a detection method for an automatic alignment and crimping detection device is provided. The method uses the automatic alignment and crimping detection device described in any of the above embodiments. The method includes:

[0034] Place and position the product to be measured on the carrier mechanism, and the carrier mechanism transfers the product to be measured to the station where the crimping mechanism is located;

[0035] The vision alignment mechanism collects image information on the relative positions of the pads of the crimping PCB board and the crimping points of the product to be measured, and assists in the alignment and correction of the crimping points between the crimping mechanism and the product to be measured;

[0036] After the crimping drive module conducts the crimping between the crimping PCB board and the product to be measured, the signal generation and detection module provides a test signal to the product to be measured to test the product to be measured.

[0037] In some embodiments, the crimping points of the product to be measured include a first crimping area facing the carrier mechanism, and the crimping PCB board includes a first sub-crimping PCB board fixed on the frame and crimped with the first crimping area;

[0038] The vision alignment mechanism includes a first vision sub-alignment module located on the side of the product to be measured away from the carrier mechanism;

[0039] The crimping points of the product to be measured further include a third crimping area and a fourth crimping area facing away from the carrier mechanism, and the third crimping area and the fourth crimping area are respectively located on both sides of the first crimping area;

[0040] The crimping drive module further includes a third sub-crimping drive module and a fourth sub-crimping drive module located on both sides of the first sub-crimping drive module, and the third sub-crimping drive module and the fourth sub-crimping drive module are arranged on the side of the product to be measured away from the carrier mechanism;

[0041] The fourth sub-crimping drive module includes an X-axis fine adjustment module;

[0042] The crimping PCB board further includes a third sub-crimping PCB board fixed at the output end of the third sub-crimping drive module, and a fourth sub-crimping PCB board fixed at the output end of the fourth sub-crimping drive module;

[0043] The visual alignment mechanism further includes a third visual sub-alignment module located on the side of the product to be measured facing the stage mechanism and reciprocating between the third sub-crimping drive module and the fourth sub-crimping drive module;

[0044] An X-axis drive mechanism for driving the third sub-crimping drive module and the fourth sub-crimping drive module to reciprocate synchronously in the X-axis direction is provided on the frame;

[0045] The visual alignment mechanism acquires image information on the relative positions of the pads of the crimped PCB and the crimping points of the product to be measured, and assists in the alignment and correction of the crimping points of the crimping mechanism and the product to be measured. Specifically, it includes:

[0046] Use the first visual sub-alignment module to obtain the image information and deviation value of the first crimping area of the product to be measured and the first sub-crimping PCB;

[0047] The stage mechanism adjusts the position or posture of the product to be measured according to the image information and deviation value obtained by the first visual sub-alignment module;

[0048] Move the third visual sub-alignment module to the third sub-crimping PCB and obtain the image information and deviation value of the third crimping area of the product to be measured and the third sub-crimping PCB;

[0049] The X-axis drive mechanism synchronously aligns and corrects the positions of the third sub-crimping PCB and the fourth sub-crimping PCB according to the image information and deviation value obtained by the third visual sub-alignment module;

[0050] Move the third visual sub-alignment module to the fourth sub-crimping PCB and obtain the image information and deviation value of the fourth crimping area of the product to be measured and the fourth sub-crimping PCB;

[0051] Use the X-axis fine-tuning module and further align and correct the position of the fourth sub-crimping PCB according to the image information and deviation value obtained by the third visual sub-alignment module.

[0052] The beneficial effects brought by the technical solution provided in this application include:

[0053] The embodiment of the present application provides an automatic alignment and crimping detection device and its detection method. Since the automatic alignment and crimping detection device of the present application is provided with a frame, a signal generation and detection module, a crimping mechanism, a carrier stage mechanism, and a vision alignment mechanism are arranged on the frame; the signal generation and detection module is used to provide a test signal to the product under test and test the product under test; the carrier stage mechanism is used to carry the product under test; the vision alignment mechanism is used to assist in the alignment and correction of the crimping point between the crimping mechanism and the product under test; the crimping mechanism includes a crimping drive module and a crimping PCB board. One end of the crimping PCB board is provided with a pad for aligning and crimping with the crimping point of the product under test, and the other end of the crimping PCB board is connected to the signal generation and detection module through a connector. The crimping drive module is used to crimp and conduct the crimping PCB board with the product under test.

[0054] Therefore, the automatic alignment and crimping detection device of the present application is provided with a vision alignment mechanism for obtaining the position information of the product under test. The vision alignment mechanism assists in the alignment and correction of the crimping point between the crimping mechanism and the product under test. After the alignment and correction between the product under test and the crimping mechanism is completed, the crimping mechanism crimps and conducts the crimping PCB board with the product under test, and then the signal generation and detection module provides a test signal to the product under test to test the product under test. The crimping mechanism is provided with a crimping drive module and a crimping PCB board. The crimping PCB board is provided with a pad for aligning and crimping with the crimping point of the product under test. The crimping drive module crimps and conducts the crimping PCB board with the product under test. By directly connecting the crimping PCB board with the product under test through crimping, the transmission path for the signal generation and detection module to send a test signal to the product under test can be significantly shortened, the signal transmission reliability can be improved, and the detection efficiency can be improved.

[0055] The crimping point of the product under test of the present application is provided with a first crimping area facing the carrier stage mechanism. The first sub-crimping PCB board fixed on the frame is crimped with the first crimping area. The first crimping area is a transparent structure, which is convenient for the first vision sub-alignment module to obtain the image information and deviation value between the first sub-crimping PCB board and the first crimping area. After the carrier stage mechanism corrects the position of the first sub-crimping PCB board and the first crimping area, the first sub-crimping drive module then crimps the first crimping area and the first sub-crimping PCB board with each other to complete the automatic alignment and crimping of the first sub-crimping PCB board and the first crimping area.

[0056] The translation mechanism of the present application is used to drive the middle punch to move horizontally closer to or away from the product under test. When crimping is required, the middle punch is moved into the first crimping area, and after crimping is completed, the middle punch is moved out of the first crimping area, so as to switch the middle punch back and forth between the crimping station and the waiting station. The upper positioning camera and the upper light source are used to obtain the image information and deviation value between the first sub-crimping PCB board and the first crimping area, so that the carrier stage mechanism automatically corrects the position or angle of the first sub-crimping PCB board and the first crimping area.

[0057] The pressure contact point of the product under test in this application is provided with a second pressure contact area facing away from the stage mechanism. The second sub-pressure contact PCB board fixed on the second sub-pressure contact driving module is pressure-connected to the second pressure contact area. The second pressure contact area is a transparent structure, which is convenient for the second vision sub-alignment module to obtain the image information and deviation value of the second sub-pressure contact PCB board and the second pressure contact area. After the stage mechanism corrects the positions of the second sub-pressure contact PCB board and the second pressure contact area, the second sub-pressure contact driving module drives the second sub-pressure contact PCB board and the second pressure contact area to be pressure-connected to each other, completing the automatic alignment and pressure connection of the second sub-pressure contact PCB board and the second pressure contact area.

[0058] The pressure contact point of the product under test in this application is also provided with a third pressure contact area and a fourth pressure contact area that face away from the stage mechanism and are respectively located on both sides of the first pressure contact area. The third sub-pressure contact PCB board fixed on the output end of the third sub-pressure contact driving module is pressure-connected to the third pressure contact area, and the fourth sub-pressure contact PCB board fixed on the output end of the fourth sub-pressure contact driving module is pressure-connected to the fourth pressure contact area. Both the third pressure contact area and the fourth pressure contact area are transparent structures, which are convenient for the third vision sub-alignment module to respectively detect the image information and deviation value of the third sub-pressure contact PCB board and the third pressure contact area, and the image information and deviation value of the fourth sub-pressure contact PCB board and the fourth pressure contact area. After correcting the positions of the third sub-pressure contact PCB board and the third pressure contact area, and the fourth sub-pressure contact PCB board and the fourth pressure contact area, the third sub-pressure contact driving module completes the mutual pressure connection of the third sub-pressure contact PCB board and the third pressure contact area, and the fourth sub-pressure contact driving module completes the mutual pressure connection of the fourth sub-pressure contact PCB board and the fourth pressure contact area.

[0059] The X-axis driving mechanism on the frame of this application is used to drive the third sub-pressure contact driving module and the fourth sub-pressure contact driving module to reciprocate synchronously along the X-axis direction, thereby realizing the mutual alignment of the third sub-pressure contact PCB board and the third pressure contact area, and the mutual alignment of the fourth sub-pressure contact PCB board and the fourth pressure contact area. The first cylinder makes the third sub-pressure contact PCB board or the fourth sub-pressure contact PCB board quickly approach the third pressure contact area or the fourth pressure contact area, improving the pressure connection efficiency. The second cylinder is used to make the third sub-pressure contact PCB board or the fourth sub-pressure contact PCB board be precisely and slowly pressure-connected to the third pressure contact area or the fourth pressure contact area, improving the pressure connection accuracy. The lower positioning camera is used to obtain the image information of the third pressure contact area and the third sub-pressure contact PCB board, as well as the image information of the fourth pressure contact area and the fourth sub-pressure contact PCB board, which is convenient for the X-axis driving mechanism to correct the mutual alignment of the third sub-pressure contact PCB board and the third pressure contact area, and the mutual alignment of the fourth sub-pressure contact PCB board and the fourth pressure contact area.

[0060] The connection base of the present application includes an upper mounting base connected to the second cylinder and a lower mounting base connected to the third sub-crimping PCB or the fourth sub-crimping PCB; a Y-axis fine adjustment module is connected between the upper and lower mounting bases of the third sub-crimping driving module; an X-axis fine adjustment module and a Y-axis fine adjustment module are connected between the upper and lower mounting bases of the fourth sub-crimping driving module. The Y-axis fine adjustment module is used to move the third sub-crimping PCB or the fourth sub-crimping PCB along the Y-axis direction to make it flush with the end of the first sub-crimping PCB, and the X-axis fine adjustment module is used to separately adjust the movement of the fourth sub-crimping PCB along the X-axis direction to accurately align the fourth sub-crimping PCB with the fourth crimping area.

[0061] The stage mechanism of the present application is not only provided with a vacuum stage for placing the product to be measured, but also provided with an attitude correction module for correcting the position and angle of the product to be measured; the attitude correction module includes a Z-axis driving mechanism for adjusting the vertical height of the product to be measured, a vision alignment platform fixed on the Z-axis driving mechanism for driving the product to be measured to perform precise adjustment in the X-Y plane and at an angle θ, and a Y-axis driving mechanism for driving the product to be measured to reciprocate between the loading and unloading stations and the crimping station is provided on the vision alignment platform. The attitude correction module can realize multi-degree-of-freedom adjustment of the position and attitude of the product to be measured located on the vacuum stage, and then accurately crimp and conduct the product to be measured with the crimping PCB. Brief Description of the Drawings

[0062] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0063] Figure 1 It is a schematic structural diagram of an embodiment of the present application;

[0064] Figure 2 It is a schematic structural diagram of an embodiment of the present application without a control terminal;

[0065] Figure 3 For Figure 2 It is a three-dimensional structural diagram of the one without a crimping mechanism and a housing in

[0066] Figure 4 For Figure 2 It is a right view of the one without a crimping mechanism and a housing in

[0067] Figure 5 It is a schematic structural diagram of the stage mechanism of an embodiment of the present application;

[0068] Figure 6Schematic diagram of the posture correction module according to an embodiment of the present application;

[0069] Figure 7 Schematic diagram of the vacuum stage according to an embodiment of the present application;

[0070] Figure 8 Schematic diagram of the crimping mechanism according to an embodiment of the present application;

[0071] Figure 9 Schematic diagram of the first sub-crimping drive module according to an embodiment of the present application;

[0072] Figure 10 Schematic diagram of the third sub-crimping drive module and the fourth sub-crimping drive module according to an embodiment of the present application;

[0073] Figure 11 Schematic diagram of the lower positioning camera and the lower light source according to an embodiment of the present application;

[0074] Figure 12 Schematic diagram of the code scanning mechanism according to an embodiment of the present application.

[0075] Reference numerals:

[0076] 1. Product to be measured; 10. Frame; 11. Upper workbench; 12. Lower base plate; 13. Outer housing; 14. Grating pair sensor; 15. Ion fan; 16. Signal generation and detection module; 20. Stage mechanism; 21. Vacuum stage; 22. Posture correction module; 23. Z-axis drive mechanism; 24. Visual alignment platform; 25. Y-axis drive mechanism; 26. Lower stage; 27. Upper stage; 28. Positioning block; 29. Vacuum pipeline;

[0077] 30. Crimping mechanism; 31. Gantry frame; 32. First sub-crimping drive module; 33. Third sub-crimping drive module; 34. Fourth sub-crimping drive module; 35. First sub-crimping PCB board; 36. Third sub-crimping PCB board; 37. Fourth sub-crimping PCB board; 38. Electromagnetic pressure reducing valve; 39. X-axis drive mechanism; 40. Visual alignment mechanism; 41. Upper positioning camera; 42. Upper light source; 43. Lower positioning camera; 44. Lower light source; 45. Multi-axis fine adjustment module; 50. Code scanning mechanism; 51. Code scanner; 52. Flipping mechanism; 60. Control terminal;

[0078] 321. Translation mechanism; 322. Lower pressing mechanism; 323. Intermediate pressing head; 331. First cylinder; 332. Second cylinder; 333. First slider; 334. Second slider; 335. Upper mounting seat; 336. Lower mounting seat; 337. X-axis fine adjustment module; 338. Y-axis fine adjustment module. Detailed implementation manners

[0079] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of this application. Apparently, the described embodiments are only a part rather than all of the embodiments of this application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of this application without creative efforts shall fall within the scope of protection of this application.

[0080] The embodiments of this application provide an automatic alignment and crimping detection device and its detection method, which can solve the problems in the related art that the connection signal transmission between the FFC and the FPC is unstable and there is a signal attenuation phenomenon, resulting in the failure of the liquid crystal display detection.

[0081] See Figures 1 to 4 As shown, the embodiments of this application provide an automatic alignment and crimping detection device, including:

[0082] A frame 10, which includes a horizontally arranged upper workbench 11, a horizontally arranged lower base plate 12. The lower base plate 12 is located at the bottom of the upper workbench 11, parallel and spaced apart from each other, and a housing 13 connected between the upper workbench 11 and the lower base plate 12. The upper workbench 11, the lower base plate 12, and the housing 13 together form a cavity with a hollow interior. A signal generation and detection module 16, a crimping mechanism 30, a carrier mechanism 20, and a vision alignment mechanism 40 are provided on the frame 10. The signal generation and detection module 16 and the crimping mechanism 30 are located on the upper workbench 11, and the carrier mechanism 20 is located in the cavity with a hollow interior formed by the upper workbench 11, the lower base plate 12, and the housing 13 together.

[0083] The signal generation and detection module 16 is used to provide a test signal to the product under test 1 and test the product under test 1; the signal generation and detection module 16 is preferably but not limited to an LCR parameter tester, which is used to measure the inductance, capacitance, and resistance parameters of the product under test 1. The signal generation and detection module 16 is connected to a control terminal 60. The control terminal 60 is preferably a desktop computer or a laptop computer. The signal generation and detection module 16 is fixed on the upper workbench 11, and the control terminal 60 is located on one side of the frame 10.

[0084] The carrier mechanism 20 is used to carry the product under test 1 and adjust the position and posture of the product under test 1. The vision alignment mechanism 40 is used to assist in the alignment and correction of the crimping points of the crimping mechanism 30 and the product under test 1; the crimping mechanism 30 includes a crimping drive module and a crimping PCB board. One end of the crimping PCB board is provided with a pad for aligning and crimping with the crimping points of the product under test 1. The other end of the crimping PCB board is connected to the signal generation and detection module 16 through a connector. The crimping drive module is used to crimp and conduct the crimping PCB board and the product under test 1.

[0085] The automatic alignment and crimping detection device according to the embodiment of the present application is provided with a vision alignment mechanism 40 for obtaining the position information of the product under test 1. The vision alignment mechanism 40 assists in the alignment and correction of the crimping point between the crimping mechanism 30 and the product under test. After the alignment and correction between the product under test 1 and the crimping mechanism 30 are completed, the crimping mechanism 30 crimps and conducts the crimping PCB board and the product under test 1, and then the signal generation and detection module 16 provides a test signal to the product under test 1 to test the product under test 1.

[0086] The crimping mechanism 30 is provided with a crimping drive module and a crimping PCB board. The crimping PCB board is provided with pads for aligning and crimping with the crimping points of the product under test 1. The crimping drive module crimps and conducts the crimping PCB board and the product under test 1. By directly connecting the crimping PCB board and the product under test 1 through crimping, the transmission path for the signal generation and detection module 16 to send a test signal to the product under test can be significantly shortened, the signal transmission reliability can be improved, and the detection efficiency can be improved.

[0087] In some alternative embodiments, referring to Figure 3 、 Figures 7 to 9 as shown, the embodiment of the present application provides an automatic alignment and crimping detection device. The crimping points of the product under test 1 of the automatic alignment and crimping detection device include a first crimping area facing the stage mechanism 20 (the first crimping area is located on the back of the product under test 1). The crimping PCB board includes a first sub-crimping PCB board 35 fixed on the upper workbench 11 of the frame 10 and crimping with the first crimping area. The crimping drive module includes a first sub-crimping drive module 32 located on the side of the product under test 1 away from the stage mechanism 20. The vision alignment mechanism includes a first vision sub-alignment module located on the side of the product under test 1 away from the stage mechanism 20.

[0088] The crimping mechanism 30 further includes a gantry frame 31 fixed on the upper workbench 11. A first sub-crimping drive module 32 for crimping the first crimping area of the product under test 1 onto the first sub-crimping PCB board 35 is provided on the gantry frame 31. The first sub-crimping drive module 32 moves up and down vertically on the gantry frame 31, and then presses the first sub-crimping PCB board 35 onto the first crimping area of the product under test 1, realizing the power supply from the first sub-crimping PCB board 35 to the first crimping area of the product under test 1, and then testing it.

[0089] In the embodiment of the present application, a first crimping area facing the stage mechanism 20 is provided at the crimping point of the product under test. The first sub-crimping PCB board 35 fixed on the frame 10 is crimped with the first crimping area. The first crimping area is a transparent structure, which is convenient for the first vision sub-alignment module to obtain the image information and deviation value between the first sub-crimping PCB board 35 and the first crimping area. After the stage mechanism 20 corrects the positions of the first sub-crimping PCB board 35 and the first crimping area, the first sub-crimping driving module 32 then crimps the first crimping area and the first sub-crimping PCB board 35 with each other, completing the automatic alignment and crimping of the first sub-crimping PCB board 35 and the first crimping area.

[0090] In some alternative embodiments, referring to Figure 8 and Figure 9 As shown, the embodiment of the present application provides an automatic alignment and crimping detection device. The first sub-crimping driving module 32 of the automatic alignment and crimping detection device includes an intermediate punch 323. A silica gel strip contacting the first crimping area is provided on the intermediate punch 323, and a downward pressing mechanism 322 for driving the intermediate punch 323 to move in the vertical direction and a translation mechanism 321 for driving the intermediate punch 323 to move in the horizontal direction. The first vision sub-alignment module includes an upper positioning camera 41 for obtaining the image information of the first crimping area and the first sub-crimping PCB board 35, and the upper positioning camera 41 is equipped with an upper light source 42.

[0091] The translation mechanism 321 in the embodiment of the present application is used to drive the intermediate punch 323 to approach or move away from the product under test 1 in the horizontal direction. When crimping is required, the intermediate punch 323 is moved into the first crimping area, and after crimping is completed, the intermediate punch 323 is moved out of the first crimping area, thereby switching the intermediate punch 323 back and forth between the crimping station and the waiting station. When the intermediate punch 323 is moved into the first crimping area, the intermediate punch 323 is located at the crimping station, and at this time, the intermediate punch 323 is directly above the first crimping area for pressing the product under test 1. When the intermediate punch 323 is moved out of the first crimping area, the intermediate punch 323 is located at the waiting station, which is convenient for the upper positioning camera 41 to obtain the image information of the first crimping area and the first sub-crimping PCB board 35.

[0092] The downward pressing mechanism 322 is used to drive the intermediate punch 323 to approach or move away from the product under test 1 in the vertical direction, thereby crimping the first crimping area of the product under test 1 onto the first sub-crimping PCB board 35. The upper positioning camera 41 and the upper light source 42 are used to obtain the image information and deviation value between the first sub-crimping PCB board 35 and the first crimping area, so that the stage mechanism 20 automatically corrects the position or angle of the first sub-crimping PCB board 35 and the first crimping area according to the image information and deviation value of the first sub-crimping PCB board 35 and the first crimping area obtained by the upper positioning camera 41, thereby completing the automatic alignment before the first sub-crimping PCB board 35 and the first crimping area are crimped.

[0093] In some alternative embodiments, the embodiments of the present application provide an automatic alignment and crimping detection device. The crimping point of the product 1 to be measured by the automatic alignment and crimping detection device includes a second crimping area facing away from the stage mechanism 20. The crimping drive module includes a second sub-crimping drive module disposed on the side of the product 1 away from the stage mechanism 20. The crimping PCB board includes a second sub-crimping PCB board fixed on the second sub-crimping drive module and crimped with the second crimping area. The vision alignment mechanism 40 includes a second vision sub-alignment module disposed on the side of the product 1 facing the stage mechanism 20.

[0094] When the crimping point of the product 1 to be measured in the embodiments of the present application is provided with a second crimping area facing away from the stage mechanism 20 (the second crimping area is located on the front side of the product 1), the second sub-crimping PCB board fixed on the second sub-crimping drive module is crimped with the second crimping area. The second crimping area is a transparent structure, facilitating the second vision sub-alignment module to obtain the image information and deviation value of the second sub-crimping PCB board and the second crimping area. After the stage mechanism 20 corrects the positions of the second sub-crimping PCB board and the second crimping area, the second sub-crimping drive module drives the second sub-crimping PCB board and the second crimping area to be crimped with each other, completing the automatic alignment and crimping of the second sub-crimping PCB board and the second crimping area.

[0095] In some alternative embodiments, refer to Figure 2 、 Figure 7 、 Figure 8 and Figure 10 As shown in, the embodiments of the present application provide an automatic alignment and crimping detection device. The crimping points of the product 1 to be measured by the automatic alignment and crimping detection device further include a third crimping area and a fourth crimping area facing away from the stage mechanism 20 (both the third crimping area and the fourth crimping area are located on the front side of the product 1). The third crimping area and the fourth crimping area are respectively located on both sides of the first crimping area. The crimping drive module further includes a third sub-crimping drive module 33 and a fourth sub-crimping drive module 34 located on both sides of the first sub-crimping drive module 32, and the third sub-crimping drive module 33 and the fourth sub-crimping drive module 34 are disposed on the side of the product 1 away from the stage mechanism 20.

[0096] The crimping PCB board further includes a third sub-crimping PCB board 36 fixed to the output end of the third sub-crimping drive module 33, and a fourth sub-crimping PCB board 37 fixed to the output end of the fourth sub-crimping drive module 34. The third sub-crimping PCB board 36 is used for alignment and crimping with the third crimping area of the product 1, and the fourth sub-crimping PCB board 37 is used for alignment and crimping with the fourth crimping area of the product 1. The vision alignment mechanism 40 further includes a third vision sub-alignment module on the side of the product 1 facing the stage mechanism 20 and reciprocating between the third sub-crimping drive module 33 and the fourth sub-crimping drive module 34.

[0097] The crimping point of the tested product 1 in the embodiment of the present application is also provided with a third crimping area and a fourth crimping area facing away from the stage mechanism 20 and located on both sides of the first crimping area, respectively. The third sub-crimping PCB board 36 fixed at the output end of the third sub-crimping driving module 33 is crimped with the third crimping area, and the fourth sub-crimping PCB board 37 fixed at the output end of the fourth sub-crimping driving module 34 is crimped with the fourth crimping area. Both the third crimping area and the fourth crimping area are transparent structures, which facilitates the third visual sub-alignment module to respectively detect the image information and deviation value of the third sub-crimping PCB board 36 and the third crimping area, and the image information and deviation value of the fourth sub-crimping PCB board 37 and the fourth crimping area.

[0098] According to the image information and deviation value of the third sub-crimping PCB board 36 and the third crimping area detected by the third visual sub-alignment module, the position of the third sub-crimping PCB board 36 and the third crimping area is corrected; after the image information and deviation value of the fourth sub-crimping PCB board 37 and the fourth crimping area are detected by the third visual sub-alignment module, the position of the fourth sub-crimping PCB board 37 and the fourth crimping area is corrected, the third sub-crimping driving module 33 is used to complete the crimping of the third sub-crimping PCB board 36 and the third crimping area, and the fourth sub-crimping driving module 34 is used to complete the crimping of the fourth sub-crimping PCB board 37 and the fourth crimping area.

[0099] In some alternative embodiments, see Figure 8 , Figure 10 and Figure 11 As shown, the embodiment of the present application provides an automatic alignment crimping detection device, and the frame 10 of the automatic alignment crimping detection device is provided with an X-axis driving mechanism 39 that drives the third sub-crimping driving module 33 and the fourth sub-crimping driving module 34 to reciprocate synchronously along the X-axis direction, and the X-axis driving mechanism 39 is installed on the gantry frame 31. The third sub-crimping driving module 33 and the fourth sub-crimping driving module 34 follow the X-axis driving mechanism 39 to reciprocate in the X-axis direction, and then position the third sub-crimping PCB board 36 and the fourth sub-crimping PCB board 37 in the X-axis direction.

[0100] The third sub-crimping driving module 33 and the fourth sub-crimping driving module 34 both include a first cylinder 331 connected to the X-axis driving mechanism 39 for pre-crimping, a first slider 333 sliding in the vertical direction is slidably connected to the cylinder body of the first cylinder 331, a second cylinder 332 for precision crimping is connected to the first slider 333, and a second slider 334 is slidably connected to the X-axis driving mechanism 39. The second slider 334 is connected to the telescopic arm of the second cylinder 332, and a connecting seat for fixing the third sub-crimping PCB board 36 or the fourth sub-crimping PCB board 37 is fixedly connected to the second slider 334.

[0101] The third vision sub-alignment module includes a lower positioning camera 43 for obtaining the image information of the third crimping area and the third sub-crimping PCB board 36, as well as the image information of the fourth crimping area and the fourth sub-crimping PCB board 37. The lower positioning camera 43 is equipped with a lower light source 44, and the lower positioning camera 43 is connected to a multi-axis fine adjustment module 45 that drives it to reciprocate along the X-axis.

[0102] An electromagnetic pressure reducing valve 38 for finely adjusting the intake pressure of each cylinder for respectively finely adjusting the first sub-crimping drive module 32, the third sub-crimping drive module 33, and the fourth sub-crimping drive module 34 is provided on the gantry frame 31. The electromagnetic pressure reducing valve 38 precisely adjusts the downward pressing speed of the first sub-crimping drive module 32, the third sub-crimping drive module 33, and the fourth sub-crimping drive module 34, thereby precisely controlling the pressure during crimping and protecting the product under test from being damaged.

[0103] The X-axis drive mechanism 39 on the gantry frame 31 in the embodiment of the present application is used to drive the third sub-crimping drive module 33 and the fourth sub-crimping drive module 34 to reciprocate synchronously along the X-axis direction, thereby realizing the alignment between the third sub-crimping PCB board 36 and the third crimping area, and the alignment between the fourth sub-crimping PCB board 37 and the fourth crimping area. The first cylinder 331 makes the third sub-crimping PCB board 36 or the fourth sub-crimping PCB board 37 quickly approach the third crimping area or the fourth crimping area, improving the crimping efficiency.

[0104] The second cylinder 332 is used to make the third sub-crimping PCB board 36 or the fourth sub-crimping PCB board 37 be precisely and slowly crimped on the third crimping area or the fourth crimping area, improving the crimping accuracy. The lower positioning camera 43 is used to obtain the image information of the third crimping area and the third sub-crimping PCB board 36, as well as the image information of the fourth crimping area and the fourth sub-crimping PCB board 37, facilitating the X-axis drive mechanism 39 to correct the alignment between the third sub-crimping PCB board 36 and the third crimping area, and the alignment between the fourth sub-crimping PCB board 37 and the fourth crimping area.

[0105] In some alternative embodiments, referring to Figure 8 、 Figure 10 and Figure 11 as shown, the embodiment of the present application provides an automatic alignment crimping detection device. The connecting seat of the automatic alignment crimping detection device includes an upper mounting seat 335 connected to the second cylinder 332 or the second slider 334, and a lower mounting seat 336 connected to the third sub-crimping PCB board 36 or the fourth sub-crimping PCB board 37. A mutually connected Y-axis fine adjustment module 338 is connected between the upper mounting seat 335 and the lower mounting seat 336 of the third sub-crimping drive module 33. A mutually connected X-axis fine adjustment module 337 and Y-axis fine adjustment module 338 are connected between the upper mounting seat 335 and the lower mounting seat 336 of the fourth sub-crimping drive module 34.

[0106] The connecting base in the embodiment of the present application includes an upper mounting base 335 connected to the second cylinder 332 or the second slider 334, and a lower mounting base 336 connected to the third sub-crimping PCB board 36 or the fourth sub-crimping PCB board 37; a Y-axis fine adjustment module 338 is connected between the upper mounting base 335 and the lower mounting base 336 of the third sub-crimping driving module 33. An X-axis fine adjustment module 337 and a Y-axis fine adjustment module 338 are connected between the upper mounting base 335 and the lower mounting base 336 of the fourth sub-crimping driving module 34. The Y-axis fine adjustment module 338 is used to move the third sub-crimping PCB board 36 or the fourth sub-crimping PCB board 37 along the Y-axis direction to make its end flush with the end of the first sub-crimping PCB board 35, and the X-axis fine adjustment module 337 is used to individually adjust the fourth sub-crimping PCB board 37 to move along the X-axis direction to accurately align the fourth sub-crimping PCB board 37 with the fourth crimping area.

[0107] In some alternative embodiments, as shown in Figures 5 to 7 the automatic alignment and crimping detection device provided by the embodiment of the present application includes a vacuum stage 21 for placing the product under test 1 and an attitude correction module 22 connected to the vacuum stage 21 for correcting the position and angle of the product under test 1. The attitude correction module 22 includes a Z-axis driving mechanism 23 for adjusting the vertical height of the product under test 1, a vision alignment platform 24 fixed on the Z-axis driving mechanism 23 for driving the product under test 1 to perform precise adjustment in the X-Y plane and θ angle, and a Y-axis driving mechanism 25 provided on the vision alignment platform 24 for driving the product under test 1 to reciprocate between the loading / unloading station and the crimping station.

[0108] The stage mechanism 20 in the embodiment of the present application not only has a vacuum stage 21 for placing the product under test 1, but also has an attitude correction module 22 for correcting the position and angle of the product under test 1; the attitude correction module 22 includes a Z-axis driving mechanism 23 for adjusting the vertical height of the product under test 1, a vision alignment platform 24 fixed on the Z-axis driving mechanism 23 for driving the product under test 1 to perform precise adjustment in the X-Y plane and θ angle, and a Y-axis driving mechanism 25 provided on the vision alignment platform 24 for driving the product under test 1 to reciprocate between the loading / unloading station and the crimping station. The attitude correction module 22 can realize multi-degree-of-freedom adjustment of the position and attitude of the product under test 1 located on the vacuum stage 21, and then accurately crimp and conduct the product under test 1 with the crimping PCB board.

[0109] The Z-axis driving mechanism 23 moves up and down along the Z-axis direction, thereby driving the product 1 to be measured located on the vacuum stage 21 to move closer to or away from the direction of the crimped PCB board, so that the product 1 to be measured and the crimped PCB board are maintained at a set distance, or disconnecting the product 1 to be measured that is mutually crimped and conducted from the crimped PCB board. The vision alignment platform 24 is preferably but not limited to a UVW vision positioning platform. The UVW vision positioning platform is also called an XXY alignment platform and belongs to a three-axis parallel motion mechanism. Through the coordinated control of three linear lifting axes, it can achieve the center rotation of any point on the plane and translation in any direction, so that the position and posture of the product 1 to be measured located on the vacuum stage 21 are adjusted to match the pads of the crimped PCB board after adjustment.

[0110] The Y-axis driving mechanism 25 can drive the product 1 to be measured to reciprocate between the loading and unloading stations and the crimping station, improving the loading and unloading efficiency. After the Y-axis driving mechanism 25 moves along the Y-axis to the loading and unloading station, it is convenient to place the product 1 to be measured on the vacuum stage 21, or remove the product 1 to be measured that has been detected from the vacuum stage 21. After the Y-axis driving mechanism 25 moves along the Y-axis to the crimping station, the product 1 to be measured is moved to the crimping station where the crimping mechanism 30 is located.

[0111] In some alternative embodiments, refer to Figures 5 to 7 As shown, the embodiment of the present application provides an automatic alignment and crimping detection device and its detection method. The vacuum stage 21 of the automatic alignment and crimping detection device includes an upper stage 27 and a lower stage 26 connected to each other. A plurality of vacuum adsorption holes penetrating the upper stage 27 are provided on the upper stage 27, and a cavity communicating with the vacuum adsorption holes is provided at the top of the lower stage 26. A vacuum pipeline 29 communicating with the cavity is provided at the bottom of the lower stage 26, and a plurality of positioning blocks 28 for positioning the product 1 to be measured are provided around the top of the upper stage 27. Long holes extending in the X-axis or Y-axis direction are provided on the positioning blocks 28.

[0112] The vacuum adsorption holes on the upper stage 27 of the embodiment of the present application are used to fix the product 1 to be measured by vacuum adsorption. The cavity of the lower stage 26 communicates with the vacuum pipeline 29 and a plurality of vacuum adsorption holes penetrating the upper stage, so that the plurality of vacuum adsorption holes synchronously adsorb the product 1 to be measured. The positioning blocks 28 around the top of the upper stage 27 are used to position the product 1 to be measured on the top surface of the upper stage 27, and long holes are provided on the positioning blocks 28, which is convenient to position the product 1 to be measured with different size specifications by adjusting the position of the positioning blocks 28, thereby improving the versatility of the vacuum stage 21.

[0113] In some alternative embodiments, refer to Figures 1 to 4 and Figure 12As shown in the figure, an automatic alignment crimping detection device and its detection method are provided in an embodiment of the present application. A loading and unloading window is provided on the front surface of the outer housing 13 of the automatic alignment crimping detection device, and light curtain sensors 14 fixed on the upper workbench 11 are provided on both sides of the loading and unloading window. A barcode scanning mechanism 50 for obtaining barcode information of the product to be measured is further provided on the top of the upper workbench 11. The barcode scanning mechanism 50 includes a barcode scanner 51 and a flipping mechanism 52 for driving the barcode scanner 51 to flip.

[0114] An ion fan 15 is also provided on the top of the upper workbench 11. The light curtain sensors 14 are used to detect whether there are obstacles (such as arms or robotic arms) in the loading and unloading window after loading and unloading are completed, improving the safety of detection. The barcode scanning mechanism 50 is used to obtain barcode information of the product to be measured 1, thereby facilitating the traceability of the production process of the product to be measured 1. The flipping mechanism 52 is used to flip the barcode scanner 51 up and down, facilitating the loading and unloading of the product to be measured 1. The ion fan 15 is used to remove static electricity to prevent static electricity from affecting the detection results.

[0115] See Figures 1 to 5 As shown in the figure, in a second aspect of an embodiment of the present application, a detection method for an automatic alignment crimping detection device is provided. The method uses the automatic alignment crimping detection device described in any of the above embodiments. The method includes:

[0116] S101. Place and position the product to be measured 1 on the carrier mechanism 20, and the carrier mechanism 20 transfers the product to be measured 1 to the station where the crimping mechanism 30 is located.

[0117] S102. The vision alignment mechanism 40 collects image information on the relative positions of the pads of the crimped PCB board and the crimping points of the product to be measured 1, and assists in the alignment correction of the crimping points of the crimping mechanism 30 and the product to be measured.

[0118] S103. After the crimping drive module crimps and conducts the crimped PCB board and the product to be measured 1, the signal generation detection module 16 provides a test signal to the product to be measured 1 to test the product to be measured 1.

[0119] In some alternative embodiments, see Figures 5 to 8 As shown in the figure, an embodiment of the present application provides a detection method for an automatic alignment crimping detection device. In the method, the crimping points of the product to be measured 1 include a first crimping area facing the carrier mechanism 20, and the crimped PCB board includes a first sub-crimped PCB board 35 fixed on the frame 10 and crimped with the first crimping area.

[0120] The vision alignment mechanism 40 includes a first vision sub-alignment module located on the side of the product to be measured 1 away from the carrier mechanism 20. The crimping points of the product to be measured 1 further include a third crimping area and a fourth crimping area facing away from the carrier mechanism 20, and the third crimping area and the fourth crimping area are respectively located on both sides of the first crimping area.

[0121] The crimping drive module further includes a third sub-crimping drive module 33 and a fourth sub-crimping drive module 34 located on both sides of the first sub-crimping drive module 32, and the third sub-crimping drive module 33 and the fourth sub-crimping drive module 34 are arranged on the side of the product under test 1 away from the carrier mechanism 20. The fourth sub-crimping drive module 34 includes an X-axis fine-tuning module 337;

[0122] The crimping PCB board further includes a third sub-crimping PCB board 36 fixed to the output end of the third sub-crimping drive module 33, and a fourth sub-crimping PCB board 37 fixed to the output end of the fourth sub-crimping drive module 34. The vision alignment mechanism further includes a third vision sub-alignment module located on the side of the product under test 1 facing the carrier mechanism 20 and reciprocating between the third sub-crimping drive module 33 and the fourth sub-crimping drive module 34.

[0123] An X-axis drive mechanism 39 for driving the third sub-crimping drive module 33 and the fourth sub-crimping drive module 34 to reciprocate synchronously in the X-axis direction is provided on the frame 10.

[0124] In the above step S102: The vision alignment mechanism collects the image information of the relative positions of the pads of the crimping PCB board and the crimping points of the product under test, and assists in the alignment correction of the crimping mechanism and the crimping points of the product under test, specifically including the following steps:

[0125] S201. Use the first vision sub-alignment module to obtain the image information and deviation value of the first crimping area of the product under test 1 and the first sub-crimping PCB board 35.

[0126] S202. The carrier mechanism 20 adjusts the position or posture of the product under test 1 according to the image information and deviation value obtained by the first vision sub-alignment module.

[0127] S203. Move the third vision sub-alignment module to the third sub-crimping PCB board 36 and obtain the image information and deviation value of the third crimping area of the product under test 1 and the third sub-crimping PCB board 36.

[0128] S204. The X-axis drive mechanism 39 synchronously corrects the positions of the third sub-crimping PCB board 36 and the fourth sub-crimping PCB board 37 according to the image information and deviation value obtained by the third vision sub-alignment module.

[0129] S205. Move the third vision sub-alignment module to the fourth sub-crimping PCB board 37 and obtain the image information and deviation value of the fourth crimping area of the product under test 1 and the fourth sub-crimping PCB board 37.

[0130] S206. Use the X-axis fine-tuning module 337 to further correct the position of the fourth sub-crimping PCB board 37 according to the image information and deviation value obtained by the third vision sub-alignment module.

[0131] In the description of the present application, it should be noted that the orientation or positional relationship indicated by terms such as "upper" and "lower" is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application. Unless otherwise clearly specified and defined, the terms "mounted", "connected" and "coupled" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0132] It should be noted that in the present application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the said element.

[0133] The above are only specific embodiments of the present application, enabling those skilled in the art to understand or implement the present application. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. An automatic alignment crimping detection device, characterized in that Comprising: A frame (10), on which a signal generation and detection module (16), a crimping mechanism (30), a carrier stage mechanism (20), and a vision alignment mechanism (40) are provided; The signal generation and detection module (16) is used to provide a test signal to the product under test (1) and test the product under test (1); The carrier stage mechanism (20) is used to carry the product under test (1); The vision alignment mechanism (40) is used to assist in the alignment and correction of the crimping points between the crimping mechanism (30) and the product under test (1); The crimping mechanism (30) includes a crimping drive module and a crimping PCB board. One end of the crimping PCB board is provided with pads for aligning and crimping with the crimping points of the product under test (1). The other end of the crimping PCB board is connected to the signal generation and detection module (16) through a connector. The crimping drive module is used to crimp and conduct the crimping PCB board with the product under test (1).

2. An automatic alignment and crimping detection device according to claim 1, wherein: The crimping points of the product under test (1) include a first crimping area facing the carrier stage mechanism (20). The crimping PCB board includes a first sub-crimping PCB board (35) fixed on the frame (10) and crimped with the first crimping area; The crimping drive module includes a first sub-crimping drive module (32) located on the side of the product under test (1) away from the carrier stage mechanism (20). The vision alignment mechanism (40) includes a first vision sub-alignment module located on the side of the product under test (1) away from the carrier stage mechanism (20).

3. An automatic alignment and crimping detection device according to claim 2, wherein: The first sub-crimping drive module (32) includes an intermediate punch (323), a downward pressing mechanism (322) for driving the intermediate punch (323) to move in the vertical direction, and a translation mechanism (321) for driving the intermediate punch (323) to move in the horizontal direction; The first vision sub-alignment module includes an upper positioning camera (41) for acquiring image information of the first crimping area and the first sub-crimping PCB board (35). The upper positioning camera (41) is equipped with an upper light source (42).

4. An automatic alignment and crimping detection device according to claim 1, wherein: The crimping points of the product under test (1) include a second crimping area facing away from the carrier stage mechanism (20). The crimping drive module includes a second sub-crimping drive module provided on the side of the product under test (1) away from the carrier stage mechanism (20); The crimping PCB board includes a second sub-crimping PCB board fixed on the second sub-crimping drive module and crimped with the second crimping area; The vision alignment mechanism (40) includes a second vision sub-alignment module provided on the side of the product under test (1) facing the carrier stage mechanism (20).

5. An automatic alignment and crimping detection device according to claim 2 or 3, wherein: The crimping points of the product under test (1) further include a third crimping area and a fourth crimping area facing away from the carrier stage mechanism (20). The third crimping area and the fourth crimping area are respectively located on both sides of the first crimping area; The crimping drive module further includes a third sub-crimping drive module (33) and a fourth sub-crimping drive module (34) located on both sides of the first sub-crimping drive module (32), and the third sub-crimping drive module (33) and the fourth sub-crimping drive module (34) are arranged on the side of the product under test (1) away from the stage mechanism (20); The crimping PCB board further includes a third sub-crimping PCB board (36) fixed to the output end of the third sub-crimping drive module (33), and a fourth sub-crimping PCB board (37) fixed to the output end of the fourth sub-crimping drive module (34); The vision alignment mechanism (40) further includes a third vision sub-alignment module on the side of the product under test (1) facing the stage mechanism (20) and reciprocating between the third sub-crimping drive module (33) and the fourth sub-crimping drive module (34).

6. An automatic alignment crimping detection device according to claim 5, wherein: An X-axis drive mechanism (39) for driving the third sub-crimping drive module (33) and the fourth sub-crimping drive module (34) to reciprocate synchronously in the X-axis direction is provided on the frame (10); Both the third sub-crimping drive module (33) and the fourth sub-crimping drive module (34) include a first cylinder (331) connected to the X-axis drive mechanism (39) for realizing pre-crimping. The telescopic arm of the first cylinder (331) is connected to a second cylinder (332) for realizing precise crimping. The telescopic arm of the second cylinder (332) is connected to a connecting seat for fixing the third sub-crimping PCB board (36) or the fourth sub-crimping PCB board (37); The third vision sub-alignment module includes a lower positioning camera (43) for acquiring image information of the third crimping area and the third sub-crimping PCB board (36), and image information of the fourth crimping area and the fourth sub-crimping PCB board (37). The lower positioning camera (43) is equipped with a lower light source (44), and the lower positioning camera (43) is connected to a multi-axis fine adjustment module (45) for driving it to reciprocate in the X-axis direction.

7. An automatic alignment crimping detection device according to claim 6, wherein: The connecting seat includes an upper mounting seat (335) connected to the second cylinder (332), and a lower mounting seat (336) connected to the third sub-crimping PCB board (36) or the fourth sub-crimping PCB board (37); A Y-axis fine adjustment module (338) is connected between the upper mounting seat (335) and the lower mounting seat (336) of the third sub-crimping drive module (33); An X-axis fine adjustment module (337) and a Y-axis fine adjustment module (338) are connected between the upper mounting seat (335) and the lower mounting seat (336) of the fourth sub-crimping drive module (34).

8. An automatic alignment crimping detection device according to claim 1, wherein: The stage mechanism (20) includes a vacuum stage (21) for placing the product under test (1), and an attitude correction module (22) connected to the vacuum stage (21) for correcting the position and angle of the product under test (1); The posture correction module (22) includes a Z-axis drive mechanism (23) for adjusting the vertical height of the product under test (1), and a vision alignment platform (24) fixed on the Z-axis drive mechanism (23) for driving the product under test (1) to perform precise adjustment in the X-Y plane and at an angle of θ. A Y-axis drive mechanism (25) for driving the product under test (1) to reciprocate between the loading / unloading station and the crimping station is provided on the vision alignment platform (24).

9. A detection method for an automatic alignment and crimping detection device, characterized in that, The method uses the automatic alignment and crimping detection device according to any one of claims 1 to 8, and the method includes: Placing and positioning the product under test (1) on the stage mechanism (20), and the stage mechanism (20) transfers the product under test (1) to the station where the crimping mechanism (30) is located; The vision alignment mechanism (40) collects image information on the relative positions of the pads of the crimped PCB board and the crimping points of the product under test (1), and assists in the alignment correction of the crimping points between the crimping mechanism (30) and the product under test (1); After the crimping drive module crimps and conducts the crimped PCB board and the product under test (1), the signal generation and detection module (16) provides a test signal to the product under test (1) to test the product under test (1).

10. The detection method of an automatic alignment and crimping detection device as described in claim 9, characterized in that, The crimping points of the product under test (1) include a first crimping area facing the stage mechanism (20), and the crimped PCB board includes a first sub-crimped PCB board (35) fixed on the frame (10) and crimped with the first crimping area; The vision alignment mechanism (40) includes a first vision sub-alignment module located on the side of the product under test (1) away from the stage mechanism (20); The crimping points of the product under test (1) further include a third crimping area and a fourth crimping area facing away from the stage mechanism (20), and the third crimping area and the fourth crimping area are respectively located on both sides of the first crimping area; The crimping drive module further includes a third sub-crimping drive module (33) and a fourth sub-crimping drive module (34) located on both sides of the first sub-crimping drive module (32), and the third sub-crimping drive module (33) and the fourth sub-crimping drive module (34) are arranged on the side of the product under test (1) away from the stage mechanism (20); The fourth sub-crimping drive module (34) includes an X-axis fine adjustment module (337); The crimped PCB board further includes a third sub-crimped PCB board (36) fixed to the output end of the third sub-crimping drive module (33), and a fourth sub-crimped PCB board (37) fixed to the output end of the fourth sub-crimping drive module (34); The vision alignment mechanism (40) further includes a third vision sub-alignment module located on the side of the product under test (1) facing the stage mechanism (20) and reciprocating between the third sub-crimping drive module (33) and the fourth sub-crimping drive module (34); An X-axis drive mechanism (39) for driving the third sub-crimping drive module (33) and the fourth sub-crimping drive module (34) to reciprocate synchronously in the X-axis direction is provided on the frame (10); The visual alignment mechanism collects the image information of the relative positions between the pads of the pressed PCB board and the pressing points of the product to be measured (1), and assists in the alignment and correction of the pressing points of the pressing mechanism (30) and the product to be measured (1). Specifically, it includes: Using the first visual sub-alignment module to obtain the image information and deviation values of the first pressing area of the product to be measured (1) and the first sub-pressed PCB board (35); The stage mechanism (20) adjusts the position or posture of the product to be measured (1) according to the image information and deviation values obtained by the first visual sub-alignment module; Moving the third visual sub-alignment module to the third sub-pressed PCB board (36) and obtaining the image information and deviation values of the third pressing area of the product to be measured (1) and the third sub-pressed PCB board (36); The X-axis driving mechanism (39) synchronously aligns and corrects the positions of the third sub-pressed PCB board (36) and the fourth sub-pressed PCB board (37) according to the image information and deviation values obtained by the third visual sub-alignment module; Moving the third visual sub-alignment module to the fourth sub-pressed PCB board (37) and obtaining the image information and deviation values of the fourth pressing area of the product to be measured (1) and the fourth sub-pressed PCB board (37); Using the X-axis fine-tuning module (337) to further align and correct the position of the fourth sub-pressed PCB board (37) according to the image information and deviation values obtained by the third visual sub-alignment module.

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