Transmission line de-embedding method and system based on PoP packaging structure
Through S parameter testing of short-circuit, open-circuit and straight-through standard parts, an initial equivalent circuit model was established and combined with ADS deembedding modules, the problem of obtaining transmission line S parameters in the PoP packaging structure was solved, and high-precision transmission performance evaluation and simulation were achieved.
Patent Information
- Application Number
- CN202510396124.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-31
- Publication Date
- 2025-07-04
AI Technical Summary
The prior art cannot accurately obtain the S parameters of the side interconnect transmission lines in the PoP package structure, resulting in inaccurate transmission performance evaluation.
Short-circuit, open-circuit and straight-through standard parts and PoP package test structure samples are used for S parameter testing. The initial equivalent circuit model is established by obtaining L parameters and C parameters, and circuit simulation is carried out in combination with ADS deembedding modules to obtain the actual S parameters of the side interconnect transmission line.
It realizes accurate evaluation of transmission lines in PoP packaging structure, can describe parasitic effects at high frequencies, is suitable for complex interconnect structures, and improves simulation bandwidth and deembedding technology accuracy.
Smart Images
Figure CN120254546A_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the technical field of S-parameter measurement, and particularly relates to a transmission line de-embedding method and system based on a PoP package structure. Background Art
[0002] The demand for high-density and large-capacity products has promoted the development of semiconductor products from two-dimensional to three-dimensional, and new packaging methods such as system-in-package (SIP) and package-on-package (PoP) have emerged. PoP packaging is a three-dimensional stacking technology based on side interconnection technology, which stacks and assembles two or more substrates of the same size, and realizes signal transmission between substrates through side interconnection. The three-dimensional solid interconnection technology can greatly reduce the length of signal lines, and is mainly used to realize signal interconnection between three-dimensional packaging circuits, which is the key technology to achieve high performance and light weight. While adapting to the development of advanced packaging technology, PoP packaging technology will inevitably bring some signal integrity problems. By testing and de-embedding to obtain the S-parameters of the transmission line, the true transmission characteristics of the side interconnection line can be characterized, and how to de-embed the DUT to obtain accurate S-parameters is the key to correctly evaluating the transmission performance. Commonly used de-embedding techniques include short-open-load-through (SOLT), through-reflect-line (TRL), automatic fixture removal (AFR), and line-reflect-match (LRM). These de-embedding techniques have been widely used in the industry after being proposed. However, due to problems such as severe dependence on the accuracy of calibration components or difficulty in obtaining the impedance of matching resistors, these methods are not applicable to the de-embedding of PoP package structures. Summary of the Invention
[0003] The purpose of the present invention is to provide a transmission line de-embedding method based on a PoP package structure, which is used to solve the problem that the prior art cannot accurately obtain the S-parameters of the side interconnection transmission line in the PoP package structure, and thus cannot accurately evaluate the transmission performance of the transmission line.
[0004] To achieve the above purpose, the present invention adopts the following technical solutions: In the first aspect, the present application discloses a transmission line de-embedding method based on a PoP package structure, including: S1: Obtain a short circuit standard component, an open circuit standard component, a through-type standard component, and a PoP package test structure sample; S2: Perform S-parameter tests on the short circuit standard component, the open circuit standard component, the through-type standard component, and the PoP package test structure sample, and output the corresponding S-parameters; S3: Obtain the L parameter through the S-parameter of the short circuit standard component, and obtain the C parameter through the S-parameter of the open circuit standard component; S4: Establish an initial equivalent circuit model of the PoP package test structure sample based on the L parameter and the C parameter; adjust the initial equivalent circuit model according to the S parameters obtained in S2 to obtain the final RLC values, and obtain the S parameters of the coaxial connector structure based on the final RLC values; S5: Combine the S parameters of the coaxial connector structure with the de-embedding module of ADS, and then cascade the S parameters of the PoP test structure for circuit simulation to complete the de-embedding of the test structure and obtain the actual S parameters of the side interconnect transmission line DUT.
[0005] Preferably, the S1 specifically includes: S101: Obtain the upper-layer PCB board, the lower-layer PCB board, the short-circuit standard part PCB board, the open-circuit standard part PCB board, the through-type standard part PCB board, and the coaxial connector according to the product requirements and the process capabilities; S102: Assemble the upper-layer PCB board, the lower-layer PCB board, and the coaxial connector to obtain a PoP package test structure sample, and assemble the short-circuit standard part PCB board, the open-circuit standard part PCB board, and the through-type standard part PCB board with the coaxial connector respectively to obtain the short-circuit standard part, the open-circuit standard part, and the through-type standard part.
[0006] Preferably, the S2 specifically includes: S201: Calibrate the short-circuit standard part, the open-circuit standard part, the through-type standard part, and the PoP package test structure sample respectively using an electronic calibration component; S202: Measure the S parameters of the calibrated short-circuit standard part, the open-circuit standard part, the through-type standard part, and the PoP package test structure sample using a vector network analyzer and a high-frequency probe to obtain the corresponding S parameters.
[0007] Preferably, in the S3, the calculation method for obtaining the L parameter through the S parameters of the short-circuit standard part is:
[0008] In the formula, represents the port impedance; represents the frequency.
[0009] Preferably, in the S3, the calculation method for obtaining the C parameter through the S parameters of the open-circuit standard part is:
[0010] In the formula, represents the port impedance; represents the frequency.
[0011] Preferably, the S4 specifically includes: S401: Establish an initial equivalent circuit model of the PoP package test structure sample according to the L parameter and the C parameter; fit through the S parameters of the short-circuit standard component or the open-circuit standard component to correct the RLC parameter values to obtain the corrected initial equivalent circuit model; S402: Based on the measured S parameters of the through-type standard component PCB, finely tune the RLC parameters of the corrected initial equivalent circuit model to obtain the final RLC values, and obtain the S parameters of the coaxial connector structure according to the final RLC values.
[0012] Preferably, after the S5 obtains the actual S parameters of the side-interconnected transmission line DUT, perform time-domain eye diagram simulation on the actual S parameters to obtain the simulation results, and evaluate the signal transmission performance through the simulation results.
[0013] In a second aspect, the present application discloses a transmission line de-embedding system based on a PoP package structure, including: An acquisition unit for acquiring a short-circuit standard component, an open-circuit standard component, a through-type standard component, and a PoP package test structure sample; A test unit for performing S parameter tests on the short-circuit standard component, the open-circuit standard component, the through-type standard component, and the PoP package test structure sample, and outputting the corresponding S parameters; A calculation unit for obtaining the L parameter through the S parameters of the short-circuit standard component and obtaining the C parameter through the S parameters of the open-circuit standard component; An equivalent circuit model construction unit for establishing an initial equivalent circuit model of the PoP package test structure sample according to the L parameter and the C parameter; adjusting the initial equivalent circuit model according to the S parameters obtained in S2 to obtain the final RLC values, and obtaining the S parameters of the coaxial connector structure according to the final RLC values; A de-embedding unit for combining the S parameters of the coaxial connector structure with the de-embedding module of ADS, and then cascading the S parameters of the PoP test structure for circuit simulation to complete the de-embedding of the test structure and obtain the actual S parameters of the side-interconnected transmission line DUT.
[0014] Preferably, in the calculation unit, the calculation method for obtaining the L parameter through the S parameters of the short-circuit standard component is:
[0015] In the formula, represents the port impedance; represents the frequency.
[0016] Preferably, in the calculation unit, the calculation method for obtaining the C parameter through the S parameters of the open-circuit standard component is:
[0017] In the formula, represents the port impedance; represents the frequency.
[0018] Compared with the prior art, the present invention has the following beneficial effects: The present invention can accurately describe the parasitic effects generated by the test structure involved at high frequencies, and the DUT can be applied to higher frequency bands. It is more suitable for complex interconnect structures, can solve the problems of wide simulation frequency band, completely relying on full-wave simulation requires a large amount of computing power, long simulation time, and non-convergence of simulation. The established equivalent circuit model can be reused for the same type of test structures. In the de-embedding technology, it solves the problems that the existing de-embedding technology has more and stricter requirements for the test structure and the de-embedding result is not ideal. The method for obtaining S-parameters involved is convenient and fast, and the de-embedding technology has high precision, which is very meaningful for engineering applications. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required in the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.
[0020] Figure 1 is the flowchart of transmission line de-embedding; Figure 2 is the schematic diagram of the 3D model of the PoP package structure; Figure 3 is the schematic diagram of short-circuit, open-circuit, and through-standard parts; Figure 4 is the initial equivalent circuit model established by the LC parameters of the standard parts; Figure 5 is the ADS de-embedding circuit schematic diagram.
[0021] Wherein: 1 - upper-layer PCB board; 2 - lower-layer PCB board; 3 - coaxial connector; 4 - side-interconnect transmission line DUT. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0022] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Usually, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.
[0023] Accordingly, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention.
[0024] It should be noted that like reference numerals and letters denote like items in the following figures, and thus, once an item is defined in one figure, it is not necessary to further define and explain it in subsequent figures.
[0025] In the description of the embodiments of the present invention, it should be noted that if terms such as "upper", "lower", "horizontal", "inner", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the invention product is usually placed during use, it is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation of the present invention. In addition, terms such as "first", "second", etc. are only used for distinguishing descriptions and cannot be construed as indicating or implying relative importance.
[0026] In addition, if the term "horizontal" appears, it does not mean that the component is required to be absolutely horizontal, but it can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but it can be slightly inclined.
[0027] In the description of the embodiments of the present invention, it should also be noted that unless otherwise clearly specified and limited, if terms such as "set", "installed", "connected", "connected to" are understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.
[0028] The present invention will be further described in detail below with reference to the accompanying drawings: See Figure 1 , this application discloses a transmission line de-embedding method based on a PoP package structure, including: S1: Obtain a short-circuit standard component, an open-circuit standard component, a through-type standard component, and a PoP package test structure sample; S2: Perform S-parameter tests on the short-circuit standard component, the open-circuit standard component, the through-type standard component, and the PoP package test structure sample, and output the corresponding S-parameters; S3: Obtain the L parameters through the S parameters of the short-circuit standard component, and obtain the C parameters through the S parameters of the open-circuit standard component; S4: Establish an initial equivalent circuit model of the PoP package test structure sample according to the L parameters and C parameters; adjust the initial equivalent circuit model according to the S parameters obtained in S2 to obtain the final RLC values, and obtain the S parameters of the coaxial connector structure according to the final RLC values; S5: Combine the S parameters of the coaxial connector structure with the de-embedding module of ADS, and then cascade the S parameters of the PoP test structure for circuit simulation to complete the de-embedding of the test structure and obtain the actual S parameters of the side-interconnect transmission line DUT.
[0029] In some embodiments, S1 specifically includes: S101: Obtain the upper-layer PCB board, lower-layer PCB board, short-circuit standard component PCB board, open-circuit standard component PCB board, through-type standard component PCB board, and coaxial connector according to product requirements and process capabilities; S102: Refer to Figure 2 、 Figure 3 , assemble the upper-layer PCB board, lower-layer PCB board, and coaxial connector to obtain a PoP package test structure sample, and assemble the short-circuit standard component PCB board, open-circuit standard component PCB board, and through-type standard component PCB board with the coaxial connector respectively to obtain a short-circuit standard component, an open-circuit standard component, and a through-type standard component.
[0030] In some embodiments, S2 specifically includes: S201: Calibrate the short-circuit standard component, open-circuit standard component, through-type standard component, and PoP package test structure sample respectively using an electronic calibration component; S202: Measure the S parameters of the calibrated short-circuit standard component, open-circuit standard component, through-type standard component, and PoP package test structure sample using a vector network analyzer and high-frequency probes to obtain the corresponding S parameters.
[0031] In some embodiments, in S3, the calculation method for obtaining the L parameters through the S parameters of the short-circuit standard component is:
[0032] The calculation method for obtaining the C parameters through the S parameters of the open-circuit standard component is:
[0033] In the formula, represents the port impedance; represents the frequency.
[0034] In some embodiments, S4 specifically includes: S401: Establish an initial equivalent circuit model of the PoP package test structure sample based on the L parameter and the C parameter; fit through the S parameters of the short standard component or the open standard component to correct the RLC parameter values to obtain the corrected initial equivalent circuit model (see Figure 4 ); S402: Based on the measured S parameters of the through-type standard component PCB, finely tune the RLC parameters of the corrected initial equivalent circuit model to obtain the final RLC values, and obtain the S parameters of the coaxial connector structure according to the final RLC values.
[0035] In some embodiments, after obtaining the actual S parameters of the side interconnect transmission line DUT by the S5, perform time-domain eye diagram simulation on the actual S parameters to obtain a simulation result, and evaluate the signal transmission performance through the simulation result.
[0036] In some embodiments, the present invention proposes a transmission line de-embedding method based on a PoP package structure, and the method at least includes the following steps: S1. Design a PoP package test structure, a short standard component, an open standard component, and a through-type standard component for measuring the S parameters of the side interconnect transmission line according to requirements; Obtain the line width, line pitch, and layout method that meet the characteristic impedance requirements of the internal transmission line and the side interconnect transmission line of the PCB board involved in the to-be-tested structure through simulation, and select a coaxial connector that meets the test requirements; According to the transmission line simulation results, design the upper and lower PCB boards, the short standard component PCB, the open standard component PCB, and the through-type standard component PCB in the PoP package test structure through an EDA tool, and separately produce the designed PCB boards by casting. After processing, assemble coaxial connectors on the upper and lower PCB boards, the short, open, and through-type standard component PCBs respectively, and assemble the upper and lower PCBs and perform side scribing to obtain the PoP package test structure; S2. Use a vector network analyzer and high-frequency probes to perform S parameter tests on the above-mentioned short, open, and through-type standard component PCBs and the PoP package test structure, and output corresponding S parameter files, namely short.s2p file, open.s2p file, thru.s2p file, and pop.s2p file; S3. Obtain the initial L (parasitic inductance) parameter through the test short.s2p file of the short standard component; obtain the C (parasitic capacitance) parameter through the test open.s2p file of the open standard component; S4. Establish an initial equivalent circuit model of the test structure according to the LC parameters obtained in S3; based on the test S parameters of any one of the short or open standard components, correct the RLC values in the initial equivalent circuit model.
[0037] Based on the S-parameters of the through-type standard component, finely tune the RLC parameters of the initial equivalent circuit model to obtain the final RLC values. Establish a schematic diagram in the circuit simulation software with the final RLC values and add ports, and the output is the SMA.s2p file for testing the coaxial connector structure; S5, embed the S-parameters of the established test coaxial connector structure into the de-embedding module of ADS, perform de-embedding through De-embedding, and then cascade the test S-parameters of the PoP package test structure for circuit simulation, so as to complete the de-embedding of the test structure and obtain the actual S-parameter curve of the side transmission line of the PoP package test structure, that is, the DUT, and perform time-domain eye diagram simulation, and evaluate the signal transmission performance through this result.
[0038] ADS (Advanced Design System) is a powerful electronic design automation (EDA) software, widely used in the design and simulation of the microwave and radio frequency fields. The de-embedding module of ADS is one of its important functions, used to remove the influence of the test fixture on the test results, so as to obtain the true performance parameters of the device under test (DUT).
[0039] In some embodiments, the PoP package test structure for measuring the S-parameters of the transmission line includes n PCB boards, n≥2; the three-dimensional model of the PoP package test structure is as Figure 2 , and the short-circuit, open-circuit, and through-type standard components are as Figure 3 ; In some embodiments, before measuring the S-parameters of the standard component and the test structure using a vector network analyzer and high-frequency probes, it is necessary to use an electronic calibration component for calibration, and the calibration plane is at the end face of the coaxial connector after calibration; In some embodiments, the specific method for correcting the parameter values of the initial equivalent circuit model based on the S-parameters of the through-type standard component is to finely adjust each RLC value in the initial equivalent circuit model in the circuit simulation software ADS. When the S-parameters of the equivalent circuit model are consistent with the test S-parameters of the through-type standard component, it indicates that the equivalent circuit model of the test structure has been successfully established.
[0040] In some embodiments, the actual S-parameters of the transmission line and the time-domain simulation eye diagram are evaluated according to the standard protocol of the corresponding signal.
[0041] Embodiment A method for de-embedding a transmission line based on a PoP package test structure includes the following steps: Step 1, estimate the impedance of the side interconnecting line of the measured PoP product according to the product requirements and process capabilities and design a test PCB. At the same time, design a short-circuit standard component, an open-circuit standard component, and a through-type standard component; Step 2: Design the upper and lower PCB boards, short-circuit standard PCB, open-circuit standard PCB, and through-type standard PCB of the PoP package test structure and submit them for board production. Through three-dimensional PoP stacking and assembly, obtain the PoP test structure sample by scribing on the side; Step 3: Use a vector network analyzer and high-frequency probes to measure the S-parameters of the test structure. Before testing, an electronic calibration kit is required to calibrate the vector network analyzer and coaxial cable. After calibration, the calibration plane is at the end face of the coaxial connector; after calibration, connect the test structure through the coaxial cable, and obtain the S-parameter files (.snp) of the short-circuit, open-circuit, through, and PoP test structure samples respectively.
[0042] Step 4: Perform de-embedding of the side transmission line through simulation software and adjust the various parameters of the equivalent circuit model. First, import the S-parameters of the open-circuit standard into the circuit simulation software ADS. One end of the S-parameters is left floating, and the other end is connected to the ground port. Add S-parameter simulation, and set the start frequency and step to be the same as those set during the vector network analyzer test to obtain the parasitic capacitance parameter C. Similarly, import the S-parameters of the short-circuit standard into the circuit simulation software ADS. One end of the S-parameters is grounded, and the other end is connected to the ground port. Add S-parameter simulation to obtain the parasitic inductance parameter L.
[0043] Step 5: Use the LC obtained in Step 4 to establish an initial equivalent circuit model, and fit the test S-parameters of any one of the short-circuit or open-circuit structures to correct the RLC parameter values. The initial equivalent circuit model of the open-circuit standard is as Figure 4 .
[0044] Step 6: Import the S-parameters of the through test structure and finely adjust the RLC parameter values obtained in Step 5. When the S-parameter curves obtained by the two methods are the same, it indicates that the equivalent circuit model of the coaxial connector structure is successfully established, and output the SMA.s2p file, that is, obtain the S-parameters of the coaxial connector structure.
[0045] Step 7: Complete de-embedding by combining the De-embedding function provided by ADS. The specific method is to embed the SMA.s2p file output in Step 6 into the de-embedding module of ADS, and then cascade the S-parameter module of the PoP test structure for circuit simulation, so as to complete the de-embedding of the test structure, and further obtain the actual S-parameters of the side interconnect transmission line DUT. The de-embedding circuit settings are as Figure 5 .
[0046] The above is only the preferred embodiment of the present invention and is not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.
Claims
1. A transmission line de-embedding method based on a PoP package structure, characterized in that Including: S1: Obtain short - circuit standard parts, open - circuit standard parts, through - type standard parts and PoP package test structure samples; S2: Conduct S - parameter tests on the short - circuit standard parts, open - circuit standard parts, through - type standard parts and PoP package test structure samples, and output the corresponding S - parameters; S3: Obtain L parameters through the S - parameters of the short - circuit standard parts, and obtain C parameters through the S - parameters of the open - circuit standard parts; S4: Establish an initial equivalent circuit model of the PoP package test structure sample according to the L parameters and C parameters; Adjust the initial equivalent circuit model according to the S - parameters obtained in S2 to obtain the final RLC values, and obtain the S - parameters of the coaxial connector structure according to the final RLC values; S5: Combine the S - parameters of the coaxial connector structure with the de - embedding module of ADS, and then cascade the S - parameters of the PoP test structure for circuit simulation to complete the de - embedding of the test structure and obtain the actual S - parameters of the side - interconnected transmission line DUT.
2. The transmission line de-embedding method based on the PoP package structure according to claim 1, wherein, The specific content of S1 includes: S101: According to product requirements and process capabilities, obtain the upper - layer PCB board, lower - layer PCB board, short - circuit standard part PCB board, open - circuit standard part PCB board, through - type standard part PCB board and coaxial connector; S102: Assemble the upper - layer PCB board, lower - layer PCB board and coaxial connector to obtain a PoP package test structure sample, and assemble the short - circuit standard part PCB board, open - circuit standard part PCB board and through - type standard part PCB board with the coaxial connector respectively to obtain short - circuit standard parts, open - circuit standard parts and through - type standard parts.
3. A transmission line de-embedding method based on a PoP package structure according to claim 1, characterized in that, The specific content of S2 includes: S201: Use an electronic calibration part to calibrate the short - circuit standard parts, open - circuit standard parts, through - type standard parts and PoP package test structure samples respectively; S202: Use a vector network analyzer and high - frequency probes to measure the S - parameters of the calibrated short - circuit standard parts, open - circuit standard parts, through - type standard parts and PoP package test structure samples to obtain the corresponding S - parameters.
4. A transmission line de-embedding method based on a PoP package structure according to claim 1, wherein In S3, the calculation method for obtaining L parameters through the S - parameters of the short - circuit standard parts is: Wherein, represents the port impedance; represents the frequency.
5. A transmission line de-embedding method based on a PoP package structure according to claim 1, characterized in that In S3, the calculation method for obtaining C parameters through the S - parameters of the open - circuit standard parts is: Wherein, represents the port impedance; represents the frequency.
6. A transmission line de-embedding method based on a PoP package structure according to claim 1, characterized in that The specific content of S4 includes: S401: Establish an initial equivalent circuit model of the PoP package test structure sample according to the L parameters and C parameters; Fit through the S - parameters of the short - circuit standard part or open - circuit standard part to correct the RLC parameter values to obtain a corrected initial equivalent circuit model; S402: Based on the measured S - parameters of the through - type standard part PCB, finely adjust the RLC parameters of the corrected initial equivalent circuit model to obtain the final RLC values, and obtain the S - parameters of the coaxial connector structure according to the final RLC values.
7. A transmission line de-embedding method based on the PoP package structure according to claim 6, characterized in that After obtaining the actual S - parameters of the side - interconnected transmission line DUT in S5, conduct time - domain eye diagram simulation on the actual S - parameters to obtain a simulation result, and evaluate the signal transmission performance through the simulation result.
8. A transmission line de-embedding system based on a PoP package structure, characterized in that Including: An acquisition unit for obtaining short - circuit standard parts, open - circuit standard parts, through - type standard parts and PoP package test structure samples; A test unit for performing S-parameter tests on short-circuit standard parts, open-circuit standard parts, through-type standard parts, and PoP package test structure samples, and outputting corresponding S-parameters; A calculation unit for obtaining L parameters through the S-parameters of short-circuit standard parts and obtaining C parameters through the S-parameters of open-circuit standard parts; An equivalent circuit model construction unit for establishing an initial equivalent circuit model of the PoP package test structure sample according to the L parameters and C parameters; adjusting the initial equivalent circuit model according to the S-parameters obtained by S2 to obtain the final RLC values, and obtaining the S-parameters of the coaxial connector structure according to the final RLC values; A de-embedding unit for combining the S-parameters of the coaxial connector structure with the de-embedding module of ADS, and then cascading the S-parameters of the PoP test structure for circuit simulation to complete the de-embedding of the test structure and obtain the actual S-parameters of the side interconnect transmission line DUT.
9. The transmission line de-embedding system based on the PoP package structure according to claim 8, characterized in that, In the calculation unit, the calculation method for obtaining the L parameter through the S-parameter of the short-circuit standard part is: Wherein, represents the port impedance; represents the frequency.
10. The transmission line de-embedding system based on the PoP package structure according to claim 8, wherein, In the calculation unit, the calculation method for obtaining the C parameter through the S-parameter of the open-circuit standard part is: Wherein, represents the port impedance; represents the frequency.