Flat-plate thyristor performance testing method and equipment

Abstract

The present invention relates to the field of thyristor performance testing, and in particular to a method and device for testing the performance of a flat-plate thyristor, comprising a testing machine, the testing machine comprising a base frame, a workbench mounted on the top of the base frame, a hood mounted on the top of the workbench, a limit test assembly mounted inside the hood, and a test rewarming assembly disposed inside the base frame; the limit test assembly is used to perform a temperature limit test on the thyristor to be tested; the test rewarming assembly is used to rewarm the thyristor to be tested after the temperature limit test; the limit test assembly comprises a sealing cover, the sealing cover is slidably connected to the upper inner portion of the hood, a long material guide channel of the present invention forms a temperature gradient interval, so that the element is gradually cooled from the limit temperature in the sealing cover to room temperature through air convection and rubber wire thermal insulation at a rate of 5-10°C per minute, thereby preventing thermal stress generated by sudden temperature changes from causing cracking of the internal structure and improving the integrity of the element after testing.

Description

Technical Field

[0001] The present invention relates to the field of thyristor performance detection, and in particular to a method and equipment for detecting the performance of a flat-plate thyristor. Background Art

[0002] In the field of power electronics, extreme temperature testing of flat-plate thyristors (SCRs) is crucial for verifying their reliability, but existing technologies have significant shortcomings. In traditional testing, when the SCR under test is transferred directly from a high temperature (e.g., 125°C) or low temperature (e.g., -40°C) environment to room temperature, the sudden temperature change (which can reach over 100°C) can easily induce internal thermal stress, leading to chip cracks, pin breakage, or performance degradation. For example, when a component was removed from a low-temperature test and retested directly, the forward leakage current exceeded the specified limit by 20% due to cracked solder joints. Furthermore, traditional rewarming relies on natural convection, and the solid tray hinders heat exchange, taking up to 3-4 hours to rewarm. Manual monitoring of the rewarming status is prone to errors due to lack of experience. For example, if a test is performed prematurely at room temperature, the forward anode voltage measurement may be 15% higher. Existing technologies lack integrated solutions for temperature buffering, efficient rewarming, and intelligent monitoring, making it difficult to balance test efficiency, accuracy, and component protection requirements. Therefore, we propose a method and equipment for testing the performance of flat-plate thyristors to address these issues. Summary of the Invention

[0003] The purpose of the present invention is to solve the shortcomings of the background technology and to propose a method and device for detecting the performance of a flat-plate thyristor.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: a flat-plate thyristor performance testing device, comprising a testing machine, the testing machine comprising a base frame, a workbench mounted on top of the base frame, a hood mounted on top of the workbench, a limit test assembly mounted inside the hood, and a test rewarming assembly disposed inside the base frame;

[0005] The limit test assembly is used to perform a temperature limit test on the thyristor to be tested;

[0006] The test reheating component is used to reheat the thyristor to be tested after the temperature limit test;

[0007] The limit test assembly includes a sealing cover, which is slidably connected to the upper inner part of the machine cover, and sliders are fixedly connected on both sides of the sealing cover, and threaded rods are passed through and threadedly connected to the middle of the sliders, and servo motors are fixedly connected to the tops of the threaded rods. Multiple sliding grooves are opened on both sides of the inner wall of the machine cover, and the sliders are slidably connected to the inner sides of the sliding grooves. A sealing groove is opened on the outer middle part of the top of the workbench, and the sealing groove corresponds to the bottom of the sealing cover. An insulating plate is fixedly connected to the middle of the top of the workbench.

[0008] Preferably, the rear middle part of the insulating plate is rotatably connected to a turntable, a stepper motor is installed at the bottom of the turntable, the stepper motor is installed inside the base frame, a terminal block 2 is installed at the top of the turntable, the middle part of the top of the terminal block 2 is connected to a pressure frame through a rotating frame, the pressure frame is rotatably connected to a vacuum pump away from the rotating frame, and a pressure suction head is installed at the bottom of the vacuum pump.

[0009] Preferably, air pump groups are provided on both sides of the insulating plate, the air pump groups are connected to an electric heater and a semiconductor cooler, and the electric heater and the semiconductor cooler are both installed inside the base frame.

[0010] Preferably, a terminal block 1 is installed on the front side of the middle of the top of the insulating plate, and electric terminal clamps are installed on the top corners of the terminal block 1 and the terminal block 2, and the electric terminal clamps are used to fix and connect the test circuit.

[0011] Preferably, a feed port is provided on the rear side of the insulating plate, an electric closed door is installed on the inside of the feed port, the feed port is connected to a material guide channel, and a uniformly distributed buffer rubber wire layer is fixedly connected to the inner wall of the material guide channel, and the buffer rubber wire layer is used to provide buffering for the thyristor to be tested.

[0012] Preferably, the test rewarming component includes a bottom bin, which is opened at the lower front part of the base frame, and a discharge port is opened in the middle of the rear side wall of the bottom bin, and the discharge port is connected with the inside of the material guide channel. An electric closed door is installed on the front side of the bottom bin, and a cross frame is installed in the middle and lower part of the inner side of the bottom bin. Temperature control modules are installed on the upper parts of both side walls of the bottom bin, and the temperature control modules are connected with the electric heater and the semiconductor refrigerator.

[0013] Preferably, a guide groove is opened in the middle of the horizontal frame, a slide is slidably connected to the inside of the guide groove, screws are passed through the front and rear parts of the slide, the screws are installed on the front and rear sides of the slide, and evenly distributed temperature sensors are installed in the middle of the top of the slide.

[0014] Preferably, a controller is installed on one side of the upper front end of the chassis, and the controller is used to control the extreme test component and the test retemperature component.

[0015] Preferably, an electric push rod is installed on the front side of the middle part of the top of the turntable, and the top of the electric push rod is rotatably connected to the bottom of the pressure frame.

[0016] Preferably, the flat-plate thyristor performance detection method includes the following detection methods:

[0017] S1. Initial placement and circuit connection of the thyristor to be tested

[0018] S1.1. Positioning: Place the thyristor to be tested steadily in the middle of the top of the terminal block, ensuring that the electrode is aligned with the contact of the terminal block;

[0019] S1.2. Circuit connection: Use dedicated connecting wires to reliably connect the anode, cathode, and gate of the thyristor to be tested to the test power supply, multimeter, and oscilloscope equipment to avoid false connections or short circuits.

[0020] S2. Initial performance test

[0021] S2.1. Electrical parameter measurement: Use a multimeter to measure the basic electrical parameters of the thyristor under test, including forward anode voltage, forward leakage current, and reverse breakdown voltage, according to the conventional test process, and record the data;

[0022] S2.2 Functional test: To perform a functional test on the thyristor to be tested, first build a simple test circuit, apply a suitable trigger signal to the thyristor to be tested, and observe its on and off conditions to ensure that the thyristor to be tested functions normally;

[0023] S3. Sealing and environment construction before extreme temperature testing

[0024] S3.1. Closing the sealing cover: Start the motor to drive the threaded rod to rotate, and the slider drives the sealing cover to descend vertically, so that its bottom is stuck in the sealing groove, forming a closed test space;

[0025] S3.2. Start the air circulation system: Turn on the air pump assembly to allow the air to pass through the electric heater / semiconductor cooler in sequence, and then enter the sealed cover after heating or cooling to establish a temperature gradient;

[0026] S4. High temperature limit test

[0027] S4.1. Temperature control: Set the high temperature limit to 125°C according to the specification, and slowly increase the temperature at a rate of 1-5°C / minute to avoid thermal shock;

[0028] S4.2, thermal balance maintenance: After reaching the set temperature, keep the temperature constant for 1-2 hours, and monitor the uniformity through the temperature sensor in the sealed cover to ensure that the thyristor to be tested is fully thermally balanced;

[0029] S4.3. High-temperature parameter retest: Maintain the high-temperature environment and use a multimeter or oscilloscope to remeasure the forward anode voltage, leakage current, and breakdown voltage parameters. Compare the data with the initial data and record the changes.

[0030] S4.4, High temperature function verification: Repeat the trigger test to observe whether the thyristor's on / off response is normal at high temperature, and whether there is abnormal heating or failure;

[0031] S5. Low temperature limit test

[0032] S5.1, cooling control: switch to cooling mode, set the low temperature limit to -40℃, and slowly cool down at a rate of 1-5℃ / min to avoid condensation;

[0033] S5.2, low temperature balance maintenance: after reaching the set low temperature, keep the temperature constant for 1-2 hours to ensure that the internal temperature of the thyristor to be tested is uniform and stable;

[0034] S5.3, Low temperature parameter retest: Repeat the electrical parameter measurements in the high temperature test and record the performance data at low temperature;

[0035] S5.4 Low-temperature functional verification: Trigger the thyristor again to check its functional reliability at low temperatures and observe whether there is mechanical embrittlement or electrical failure;

[0036] S6. Temperature recovery and retest

[0037] S6.1. Natural rewarming treatment:

[0038] ① Turn off the heating / cooling module, open the feed port of the sealing cover, and use the buffer rubber layer of the material guide channel to make the thyristor to be tested transition from the extreme temperature to room temperature 23±2℃ at a controllable rate to avoid sudden temperature changes;

[0039] ② If the environment is bad, the temperature control module of the bottom bin can be activated to force the temperature to the standard room temperature;

[0040] S6.2, Room temperature performance retest: After the temperature of the thyristor to be tested stabilizes, leave it for 1-2 hours, and then measure the initial electrical parameters and functions again to confirm that the performance has returned to the pre-test level;

[0041] S7. Transfer of the thyristor to be tested and result determination

[0042] S7.1 Mechanical transfer: Start the vacuum pump to suck the thyristor to be tested through the suction head, rotate it to the feed port via the turntable, release it to the material guide channel via the electric push rod, and finally drop it into the horizontal rack;

[0043] S7.2. Result determination:

[0044] Compare the test data of each stage: if the parameter changes are within the allowable range of the specification, the forward voltage fluctuation is ≤5%, and the function is normal, it is judged to be qualified;

[0045] If the parameters exceed the standard, permanent failure or structural damage occurs, it will be judged as unqualified;

[0046] S8. Equipment reset and record archiving

[0047] S8.1. Reset the equipment; raise the sealing cover, clean the terminal block and test fixture, and turn off the air pump and power supply.

[0048] S8.2, Data Archiving: Organize test records, generate test reports, and archive them for future reference;

[0049] S8.2 Critical Control Points

[0050] ① Temperature gradient control: Achieve a smooth transition from extreme temperature to room temperature through the material guide channel to avoid thermal stress damage;

[0051] ②. Environmental consistency: The temperature control module in the bottom chamber ensures that the room temperature is strictly controlled at 23±2℃ during retesting;

[0052] ③. Automatic monitoring: The temperature sensor of the carriage tracks the temperature of the thyristor to be tested in real time to ensure sufficient reheating.

[0053] Compared with the prior art, the present invention has the following beneficial effects:

[0054] 1. The densely packed rubber buffer layer inside the material guide channel of the present invention provides both mechanical buffering and temperature transition functions. On the one hand, the elastic rubber wire mitigates the impact force of the thyristor under test when it falls, preventing lead breakage or chip damage. On the other hand, the long material guide channel forms a temperature gradient zone, allowing the component to gradually cool from the extreme temperature within the sealed cover (such as 125°C or -40°C) to room temperature at a rate of 5-10°C per minute through air convection and thermal insulation from the rubber wire. This prevents internal structural cracking caused by thermal stress due to sudden temperature changes and improves the integrity of the component after testing.

[0055] 2. The hollow grid-like cross-frame of this invention increases the air contact area, improving the reheating efficiency of the thyristor under test by over 30%. Combined with the pre-cooling / heating action of the material guide channel, thermal equilibrium can be achieved within 1-2 hours. For harsh working conditions such as high-temperature workshops or low-temperature environments, after sealing the bottom chamber, the temperature control module is linked to the electric heater / semiconductor cooler to forcibly control the space temperature at 23±2°C, preventing external environmental interference with retest accuracy and ensuring the accuracy and consistency of electrical parameter measurements. This is particularly suitable for rapid testing needs in industrial sites.

[0056] 3. The screw-driven slide of the present invention is equipped with a non-contact temperature sensor, which can collect the temperature data of the thyristor to be tested every second and generate a retemperature curve, tracking the thermal equilibrium process from the extreme temperature to room temperature (such as the slope from -40°C to 25°C) in real time. When the temperature is stable for 30 consecutive minutes with a fluctuation of ≤0.5°C, the system automatically triggers the retest process, reducing manual duty time; if the temperature rises abnormally or stagnates, an alarm is immediately issued to indicate equipment failure, realizing automated closed-loop control from reheating to retesting, improving test efficiency and reducing the risk of human misjudgment. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] Figure 1 Schematic diagram of the front view of the three-dimensional structure of the flat-plate thyristor performance detection method and device of the present invention;

[0058] Figure 2 A schematic diagram of the partial structure of a terminal block of a flat-plate thyristor performance detection method and device of the present invention;

[0059] Figure 3 A schematic diagram of the partial structure of the top of a workbench of the flat-plate thyristor performance testing method and device of the present invention;

[0060] Figure 4 This is a schematic diagram of the local structure inside the bottom bin of the flat-plate thyristor performance testing method and device of the present invention;

[0061] Figure 5 It is a schematic diagram of the local structure of the material guide channel of the flat-plate thyristor performance detection method and device of the present invention;

[0062] Figure 6 It is a schematic diagram of the partial structure of the horizontal frame of the flat-plate thyristor performance detection method and device of the present invention;

[0063] Figure 7 for Figure 5 Enlarged view of point A in the middle.

[0064] 1. Testing machine; 101. Machine cover; 102. Base frame; 103. Sealing cover; 104. Controller; 105. Electric sealing door; 106. Temperature control module; 107. Horizontal frame; 108. Discharge port; 109. Slide; 110. Suction head; 111. Feed port; 112. Turntable; 113. Press frame; 114. Terminal block 1; 115. Thyristor to be tested; 116. Rotating frame; 117. Electric push rod; 118. Insulation plate; 119. Air pump assembly; 120. Sealing groove; 121. Workbench; 122. Terminal block 2; 123. Slider; 124. Threaded rod; 125. Bottom bin; 126. Material guide channel; 127. Slide; 128. Guide groove; 129. Lead screw; 130. Temperature sensor; 131. Vacuum pump. DETAILED DESCRIPTION

[0065] The following description is intended to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are merely examples, and those skilled in the art may conceive of other obvious variations.

[0066] like Figure 1-Figure 7 The flat-plate thyristor performance testing equipment shown includes a tester 1, which includes a base frame 102, a workbench 121 mounted on top of the base frame 102, a hood 101 mounted on top of the workbench 121, a limit test assembly mounted inside the hood 101, a test rewarming assembly mounted inside the base frame 102, and a controller 104 mounted on one side of the upper front end of the base frame 102. The controller 104 is used to control the limit test assembly and the test rewarming assembly.

[0067] People can use the test machine 1 to perform a forward anode voltage test on the thyristor 115 to be tested. During the test, the thyristor 115 to be tested is first placed in the middle of the top of the terminal board 114, and then the thyristor 115 to be tested and the other test devices are connected through connecting wires. Then, an initial performance test is performed first. When measuring electrical parameters, the basic electrical parameters of the thyristor 115 to be tested, such as the forward anode voltage, forward leakage current, and reverse breakdown voltage, are measured using a multimeter according to the conventional test process, and the data is recorded. Then, a functional test is performed on the thyristor 115 to be tested. First, a simple test circuit is built, and a suitable trigger signal is applied to the thyristor 115 to be tested, and its conduction and shutdown conditions are observed to ensure that the thyristor 115 to be tested functions normally. When the thyristor 115 to be tested is tested to be a normal good product, a temperature limit test is performed on the thyristor 115 to be tested.

[0068] The limit test assembly is used to perform a temperature limit test on the thyristor 115 to be tested;

[0069] The test re-temperature component is used to re-temperature the thyristor 115 to be tested after the temperature limit test;

[0070] The limit test assembly includes a sealing cover 103, which is slidably connected to the upper inner part of the machine cover 101. Sliders 123 are fixedly connected to both sides of the sealing cover 103. A threaded rod 124 is passed through and threadedly connected to the middle of the slider 123. The top of the threaded rod 124 is fixedly connected to a servo motor. A plurality of slide grooves 109 are opened on both sides of the inner wall of the machine cover 101. The slide 123 is slidably connected to the inner side of the slide groove 109. A sealing groove 120 is opened on the outer middle part of the top of the workbench 121. The sealing groove 120 corresponds to the bottom of the sealing cover 103. An insulating plate 118 is fixedly connected to the middle of the top of the workbench 121.

[0071] Furthermore, in a specific implementation, people can first start the motor to drive the threaded rod 124 to rotate, and use the slider 123 to drive the sealing cover 103 to descend through the rotation of the threaded rod 124, so that the bottom of the sealing cover 103 is stuck into the inside of the sealing groove 120, so as to achieve the sealing of the top of the workbench 121, and then start the electric heater or semiconductor refrigerator, and then start the air pump group 119, and extract air through the air pump group 119. The air flow will be heated or cooled when passing through the electric heater or semiconductor refrigerator, and the processed gas will be introduced into the interior of the sealing cover 103 to achieve the regulation of the temperature of the internal space of the sealing cover 103. Thus, it is possible to perform an extreme temperature test on the thyristor 115 to be tested. When performing a high temperature extreme test, first connect the test circuit as required, then set the temperature in the sealing cover 103 to the high temperature limit value according to the specification of the thyristor 115 to be tested. The heating rate should not be too fast, and is generally controlled at 1°C-5°C per minute. After reaching the set temperature, keep the temperature stable for a period of time, usually 1-2 hours, so that the thyristor 115 to be tested can fully reach thermal equilibrium. Then, under the high temperature stable state, use the test circuit to measure the thyristor 115 to be tested again using a multimeter and an oscilloscope. 15, observe its performance changes and compare them with the initial values. After the parameter test is completed, perform a functional test on the thyristor 115 to be tested again to check whether it can be normally turned on and off at high temperature. After the high temperature test is completed, perform a low temperature limit test. First, set the temperature inside the sealing cover 103 to the low temperature limit value. The cooling rate should not be too fast. Generally, it is controlled at 1℃-5℃ per minute. After reaching the set low temperature, keep the temperature stable for 1-2 hours to keep the thyristor 115 to be tested in a stable low temperature state. Then, repeat the parameter measurement during the high temperature test under the low temperature stable state. and functional verification steps, and record relevant data. After the high temperature and low temperature extreme tests are completed, the thyristor 115 to be tested is restored and retested. After that, when the temperature of the thyristor 115 to be tested returns to room temperature, the thyristor 115 to be tested is left at room temperature for a period of time, generally 1-2 hours, to allow it to return to normal temperature. When the thyristor 115 to be tested returns to normal temperature, the electrical parameters of the thyristor 115 to be tested are measured again, and a functional test is performed to check whether its performance has returned to the initial state, so as to evaluate the performance stability of the thyristor 115 to be tested after the extreme temperature test, thereby completing the entire testing process.

[0072] Among them, the middle rear side of the insulating plate 118 is rotatably connected to the turntable 112, a stepper motor is installed at the bottom of the turntable 112, and the stepper motor is installed inside the base frame 102. A terminal block 122 is installed on the top of the turntable 112, and the middle of the top of the terminal block 122 is connected to the pressure frame 113 through the rotating frame 116. The pressure frame 113 is rotatably connected to the vacuum pump 131 away from the rotating frame 116. A pressure suction head 110 is installed at the bottom of the vacuum pump 131. An electric push rod 117 is installed on the front side of the middle of the top of the turntable 112. The top of the electric push rod 117 is rotatably connected to the bottom of the pressure frame 113. Air pump groups 119 are provided on both sides of the insulating plate 118. The air pump group 119 is connected to an electric heater and a semiconductor cooler, both of which are installed inside the base frame 102. A terminal block 114 is installed on the front side of the middle of the top of the insulating plate 118. Electric terminal clamps are installed at the corners of the top of the terminal block 114 and the second terminal block 122. The electric terminal clamps are used to fix and connect the test circuit. A feed port 111 is provided on the rear side of the insulating plate 118. An electric closed door is installed inside the feed port 111. The feed port 111 is connected to a material guide channel 126. The inner wall of the material guide channel 126 is fixedly connected to a uniformly distributed buffer rubber wire layer. The buffer rubber wire layer is used to provide a buffer for the thyristor 115 to be tested.

[0073] Furthermore, in specific implementation, after the temperature limit test is completed, the feed port 111 is opened, and the high-temperature or low-temperature gas inside the sealing cover 103 is unloaded into the feed port 111, and then the operation of the vacuum pump 131 can create a negative pressure environment inside the pressure suction head 110, and the pressure suction head 110 can suck up the thyristor 115 to be tested, and then the operation of the stepper motor at the bottom of the turntable 112 can drive the turntable 112, the pressure frame 113 and the thyristor 115 to be tested to deflect, so that the thyristor 115 to be tested can be driven to the upper part of the feed port 111, and then the electric push rod 117 contracts, pressing the pressure frame 113 downward, and closing the vacuum pump 131, and placing the thyristor 115 to be tested into the material guide channel 126 through the feed port 111, and the dense buffer rubber wire layer arranged inside the material guide channel 126 can buffer the feed port 111. Next, the thyristor 115 to be tested can be guided through the material guide channel 126, and the temperature inside the sealing cover 103 can be vented through the material guide channel 126, so that a longer adaptation channel can be formed inside the material guide channel 126, so that the thyristor 115 to be tested can gradually transition from the extreme temperature inside the sealing cover 103 to room temperature through the material guide channel 126, thereby avoiding excessive temperature difference when the thyristor 115 to be tested directly transitions from the extreme temperature to room temperature, which may easily lead to temperature imbalance inside and outside the thyristor 115 to be tested and damage, which is beneficial to practical use. When the thyristor 115 to be tested enters the cross frame 107 through the material guide channel 126, the cross frame 107 can support the thyristor 115 to be tested, and the hollow design of the cross frame 107 allows the thyristor 115 to be tested to be better reheated inside the bottom bin 125, which is beneficial to practical use.

[0074] Among them, the test rewarming component includes a bottom bin 125, which is opened at the lower front part of the base frame 102, and a discharge port 108 is opened in the middle of the rear side wall of the bottom bin 125, and the discharge port 108 is connected to the inside of the guide channel 126. An electric closed door 105 is installed on the front side of the bottom bin 125, and a cross frame 107 is installed at the middle and lower part of the inside of the bottom bin 125. Temperature control modules 106 are installed on the upper parts of the two side walls of the bottom bin 125, and the temperature control modules 106 are connected to the electric heater and the semiconductor refrigerator. A guide groove 128 is opened in the middle of the cross frame 107, and a slide 127 is slidably connected to the inside of the guide groove 128. Screws 129 are passed through the front and rear parts of the slide 127, and the screws 129 are installed on the front and rear sides of the slide 127. Evenly distributed temperature sensors 130 are installed in the middle of the top of the slide 127;

[0075] Furthermore, in specific implementation, in some relatively harsh usage scenarios, people can lower the electric closing door 105, and the bottom bin 125 can be closed by the electric closing door 105. Then, the temperature control module 106 can cooperate with the electric heater and the semiconductor refrigerator to regulate the temperature inside the bottom bin 125, so that the inside of the bottom bin 125 can reach the normal room temperature [23±2℃], thereby making it suitable for relatively harsh usage scenarios and being beneficial to actual use. During this process, people can start the screw 129, and the screw 129 can drive the slide 127 to move, so that the slide 127 can move to the lower part of the thyristor to be tested 115. The temperature sensor 130 on the slide 127 can monitor the temperature of the thyristor to be tested 115, thereby enabling continuous monitoring of the thyristor to be tested 115, which is beneficial to actual use.

[0076] Among them, the performance testing method of flat-plate thyristor includes the following testing methods:

[0077] S1. Initial placement and circuit connection of the thyristor to be tested

[0078] S1.1. Positioning: Place the thyristor 115 to be tested steadily on the middle of the top of the terminal block 114, ensuring that the electrodes are aligned with the contacts of the terminal block;

[0079] S1.2. Circuit connection: Use dedicated connecting wires to reliably connect the anode, cathode, and gate of the thyristor 115 to be tested to the test power supply, multimeter, and oscilloscope equipment, avoiding any loose connections or short circuits.

[0080] S2. Initial performance test

[0081] S2.1. Electrical parameter measurement: Use a multimeter to measure the basic electrical parameters of the thyristor 115 to be tested, including forward anode voltage, forward leakage current, and reverse breakdown voltage, according to the conventional test process, and record the data;

[0082] S2.2 Functional test: Perform a functional test on the thyristor 115 to be tested. First, build a simple test circuit, apply a suitable trigger signal to the thyristor 115 to be tested, and observe its on and off conditions to ensure that the thyristor 115 to be tested functions normally.

[0083] S3. Sealing and environment construction before extreme temperature testing

[0084] S3.1. Closing the sealing cover: Start the motor to drive the threaded rod 124 to rotate, which drives the sealing cover 103 vertically downward through the slider 123, so that its bottom is stuck in the sealing groove 120, forming a closed test space;

[0085] S3.2. Start the air circulation system: Turn on the air pump assembly 119 to allow the air to pass through the electric heater / semiconductor refrigerator temperature control module in sequence, and then enter the sealed cover 103 after heating or cooling to establish a temperature gradient;

[0086] S4. High temperature limit test

[0087] S4.1. Temperature control: Set the high temperature limit value according to the specification, such as 125℃, and slowly increase the temperature at a rate of 1-5℃ / min to avoid thermal shock;

[0088] S4.2. Maintaining thermal balance: After reaching the set temperature, maintain the temperature for 1-2 hours, and monitor the uniformity through the temperature sensor in the sealed cover to ensure that the thyristor 115 to be tested is fully thermally balanced;

[0089] S4.3. High-temperature parameter retest: Maintain the high-temperature environment and use a multimeter or oscilloscope to remeasure the forward anode voltage, leakage current, and breakdown voltage parameters. Compare the data with the initial data and record the changes.

[0090] S4.4, High temperature function verification: Repeat the trigger test to observe whether the thyristor's on / off response is normal at high temperature, and whether there is abnormal heating or failure;

[0091] S5. Low temperature limit test

[0092] S5.1, cooling control: switch to cooling mode, set the low temperature limit value, such as -40℃, and slowly cool down at a rate of 1-5℃ / min to avoid condensation;

[0093] S5.2, low temperature balance maintenance: after reaching the set low temperature, keep the temperature constant for 1-2 hours to ensure that the internal temperature of the thyristor to be tested is uniform and stable;

[0094] S5.3, Low temperature parameter retest: Repeat the electrical parameter measurements in the high temperature test and record the performance data at low temperature;

[0095] S5.4 Low-temperature functional verification: Trigger the thyristor again to check its functional reliability at low temperatures and observe whether there is mechanical embrittlement or electrical failure;

[0096] S6. Temperature recovery and retest

[0097] S6.1. Natural rewarming treatment:

[0098] ① Turn off the heating / cooling module, open the feed port 111 of the sealing cover 103, and allow the thyristor 115 to transition from the extreme temperature to room temperature (23±2°C) at a controlled rate through the buffer rubber layer of the material guide channel 126 to avoid sudden temperature changes;

[0099] ② If the environment is bad, the temperature control module 106 of the bottom bin 125 can be activated to force the temperature to the standard room temperature;

[0100] S6.2, Room temperature performance retest: After the temperature of the thyristor to be tested stabilizes, usually leave it for 1-2 hours, and then measure the initial electrical parameters such as forward voltage and leakage current again to confirm that the performance has returned to the level before the test;

[0101] S7. Transfer of the thyristor to be tested and result determination

[0102] S7.1 Mechanical Transfer: Start the vacuum pump 131 to suck the thyristor to be tested through the pressure suction head 110. The thyristor is rotated to the feed port 111 via the turntable 112. The electric push rod 117 releases the thyristor into the guide channel 126 and finally falls into the horizontal frame 107.

[0103] S7.2. Result determination:

[0104] Compare the test data of each stage: if the parameter changes are within the allowable range of the specification, such as the forward voltage fluctuation ≤5%, and the function is normal, it is judged to be qualified;

[0105] If there are any parameters exceeding the standard, permanent failure or structural damage such as shell cracks, it will be judged as unqualified;

[0106] S8. Equipment reset and record archiving

[0107] S8.1. Reset the equipment; raise the sealing cover 103, clean the terminal block and test fixture, and turn off the air pump and power supply.

[0108] S8.2, Data Archiving: Organize test records including temperature curves, parameter tables, waveforms, generate test reports, and archive them for future reference;

[0109] S8.2 Critical Control Points

[0110] ① Temperature gradient control: A smooth transition from the extreme temperature to room temperature is achieved through the material guide channel 126 to avoid thermal stress damage;

[0111] ② Environmental consistency: The temperature control module 106 of the bottom chamber 125 ensures that the room temperature is strictly controlled at 23±2℃ during retesting;

[0112] ③. Automatic monitoring: The temperature sensor 130 of the carriage 127 tracks the temperature of the thyristor to be measured in real time to ensure sufficient rewarming.

[0113] Working principle:

[0114] In actual use, people can use the test machine 1 to perform a forward anode voltage test on the thyristor 115 to be tested. During the test, first place the thyristor 115 to be tested in the middle of the top of the terminal board 114, and then connect the thyristor 115 to be tested and other test devices through connecting wires. Then, perform an initial performance test. When measuring electrical parameters, use a multimeter to measure the basic electrical parameters of the thyristor 115 to be tested, such as the forward anode voltage, forward leakage current, and reverse breakdown voltage, according to the conventional test process, and record the data. Then, perform a functional test on the thyristor 115 to be tested. First, build a simple test circuit, apply a suitable trigger signal to the thyristor 115 to be tested, and observe its on and off conditions to ensure that the thyristor 115 to be tested functions normally. When the thyristor 115 to be tested is tested to be a normal good product, the temperature limit test of the thyristor 115 to be tested is performed. In the actual test process, people can first start the motor to drive the threaded rod 124 to rotate, and use the slider 123 to drive the sealing cover 103 to descend through the rotation of the threaded rod 124, and insert the bottom of the sealing cover 103 into the inside of the sealing groove 120 to achieve the closure of the top of the workbench 121. Then, the electric heater or semiconductor refrigerator is started, and then the air pump group 119 is started. Air is extracted through the air pump group 119, and the air flow will be heated or cooled when passing through the electric heater or semiconductor refrigerator. The treated gas will be introduced into the inside of the sealing cover 103 to adjust the temperature of the internal space of the sealing cover 103, so that the thyristor to be tested can be achieved. 115 is subjected to an extreme temperature test. When conducting a high temperature extreme test, the test circuit is first connected as required. Then, according to the specification of the thyristor 115 to be tested, the temperature in the sealing cover 103 is set to the high temperature limit value. The heating rate should not be too fast, and is generally controlled at 1°C-5°C per minute. After reaching the set temperature, the temperature is kept stable for a period of time, usually 1-2 hours, so that the thyristor 115 to be tested can fully reach thermal equilibrium. Then, under a high temperature stable state, the various electrical parameters of the thyristor 115 to be tested are measured again using a multimeter and an oscilloscope through the test circuit to observe the performance changes and compare them with the initial values. After the parameter test is completed, the thyristor 115 to be tested is functionally tested again to check its Whether it can be turned on and off normally under high temperature, when the high temperature test is completed, the low temperature limit test is carried out, first the temperature in the sealing cover 103 is set to the low temperature limit value, and the cooling rate should not be too fast, generally controlled at 1°C-5°C per minute, when the set low temperature is reached, the temperature is kept stable for 1-2 hours, so that the thyristor 115 to be tested is in a stable low temperature state, and then in the low temperature stable state, the parameter measurement and function verification steps during the high temperature test are repeated, and the relevant data are recorded. After the high temperature and low temperature limit tests are completed, the thyristor 115 to be tested is restored and retested, and then when the temperature of the thyristor 115 to be tested returns to room temperature, the thyristor 115 to be tested is left at room temperature for a period of time, generally 1-2 hours, so that it returns to normal temperature.When the thyristor 115 to be tested returns to the normal temperature state, the electrical parameters of the thyristor 115 to be tested are measured again, and a functional test is performed to check whether its performance has returned to the initial state, so as to evaluate the performance stability of the thyristor 115 to be tested after the extreme temperature test, thereby completing the entire test process. After the temperature extreme test is completed, the feed port 111 is opened, and the high-temperature or low-temperature gas inside the sealing cover 103 is unloaded into the feed port 111. Then, a negative pressure environment can be created inside the pressure suction head 110 through the operation of the vacuum pump 131. The thyristor 115 to be tested can be sucked up by the pressure suction head 110. Then, the turntable 112 and the pressure frame 113 can be driven by the operation of the stepping motor at the bottom of the turntable 112. The thyristor 115 to be tested is deflected, so that the thyristor 115 to be tested can be driven to the upper part of the feed port 111, and then the electric push rod 117 is contracted, the pressure frame 113 is pressed down, and the vacuum pump 131 is turned off, and the thyristor 115 to be tested is placed into the inside of the guide channel 126 through the feed port 111. The dense buffer rubber wire layer provided inside the guide channel 126 can buffer the feed port 111, and the thyristor 115 to be tested can be guided through the guide channel 126. The temperature inside the sealing cover 103 can be vented through the guide channel 126, so that a longer adaptation channel can be formed inside the guide channel 126, so that the thyristor 115 to be tested can be The limit temperature inside the sealing cover 103 can be gradually transferred to the room temperature through the material guide channel 126, thereby preventing the thyristor 115 to be tested from directly changing from the limit temperature to the room temperature from being too large a temperature difference, which may easily lead to the temperature imbalance between the inside and outside of the thyristor 115 to be tested and damage, which is beneficial to practical use. When the thyristor 115 to be tested enters the cross frame 107 through the material guide channel 126, the cross frame 107 can support the thyristor 115 to be tested. The hollow design of the cross frame 107 allows the thyristor 115 to be tested to be better reheated inside the bottom bin 125, which is beneficial to practical use. In some relatively harsh usage scenarios, people can lower the electric closed door 105, and the electric closed door 105 can The bottom chamber 125 can be sealed, and then the temperature control module 106 can cooperate with the electric heater and the semiconductor cooler to control the temperature inside the bottom chamber 125, so that the inside of the bottom chamber 125 can reach the normal room temperature [23±2°C], making it suitable for relatively harsh usage scenarios and facilitating practical use. During this process, people can start the screw 129, which can drive the slide 127 to move, so that the slide 127 can move to the lower part of the thyristor 115 to be tested. The temperature sensor 130 on the slide 127 can monitor the temperature of the thyristor 115 to be tested, thereby achieving continuous monitoring of the thyristor 115 to be tested, which is facilitating practical use.

[0115] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and description merely illustrate the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention. Such changes and modifications are intended to fall within the scope of the claimed invention. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A flat-plate thyristor performance testing device, comprising a testing machine (1), characterized in that: The testing machine (1) comprises a base frame (102), a workbench (121) is mounted on the top of the base frame (102), a hood (101) is mounted on the top of the workbench (121), a limit test assembly is mounted inside the hood (101), and a test rewarming assembly is arranged inside the base frame (102); The limit test assembly is used to perform a temperature limit test on the thyristor (115) to be tested; The test reheating component is used to reheat the thyristor (115) to be tested after the temperature limit test; The limit test assembly includes a sealing cover (103), the sealing cover (103) is slidably connected to the upper inner portion of the hood (101), sliders (123) are fixedly connected to both sides of the sealing cover (103), the middle of the sliders (123) are penetrated and threadedly connected to a threaded rod (124), the top of the threaded rod (124) is fixedly connected to a servo motor, a plurality of slide grooves (109) are provided on both sides of the inner wall of the hood (101), the sliders (123) are slidably connected to the inner side of the slide grooves (109), a sealing groove (120) is provided on the outer middle of the top of the workbench (121), the sealing groove (120) corresponds to the bottom of the sealing cover (103), the middle of the top of the workbench (121) is fixedly connected to an insulating plate (118), the test reheating assembly includes a bottom bin (125), the bottom bin (125) is provided on the bottom frame (102 ) at the lower front part, a discharge port (108) is provided in the middle of the inner rear side wall of the bottom bin (125), and the discharge port (108) is communicated with the inside of the guide channel (126); an electric closed door (105) is installed at the front side of the bottom bin (125); a cross frame (107) is installed at the middle and lower inner side of the bottom bin (125); temperature control modules (106) are installed at the upper parts of the inner side walls of the bottom bin (125), and the temperature control modules (106) are communicated with the electric heater and the semiconductor refrigerator; a guide groove (128) is provided in the middle of the cross frame (107), and a slide (127) is slidably connected to the inner side of the guide groove (128); screws (129) are passed through the front and rear parts of the slide (127), and the screws (129) are installed at the front and rear sides of the slide (127); and evenly distributed temperature sensors (130) are installed at the middle of the top of the slide (127).

2. The flat-plate thyristor performance testing device according to claim 1, characterized in that: The middle rear side of the insulating plate (118) is rotatably connected to a turntable (112), a stepper motor is installed at the bottom of the turntable (112), and the stepper motor is installed inside the base frame (102). A second terminal block (122) is installed at the top of the turntable (112), and a pressure frame (113) is connected to the middle of the top of the terminal block (122) through a rotating frame (116). The pressure frame (113) is rotatably connected to a vacuum pump (131) away from the rotating frame (116), and a pressure suction head (110) is installed at the bottom of the vacuum pump (131).

3. The flat-plate thyristor performance testing device according to claim 2, characterized in that: Air pump groups (119) are provided on both sides of the insulating plate (118), and the air pump groups (119) are connected to an electric heater and a semiconductor cooler, and the electric heater and the semiconductor cooler are both installed inside the base frame (102).

4. The flat-plate thyristor performance testing device according to claim 3, characterized in that: A terminal block 1 (114) is installed on the front side of the middle portion of the top end of the insulating plate (118), and electric terminal clamps are installed at the top corners of both the terminal block 1 (114) and the terminal block 2 (122), and the electric terminal clamps are used to fix and connect the test circuit.

5. The flat-plate thyristor performance testing device according to claim 4, characterized in that: A feed port (111) is provided on the rear side of the insulating plate (118), an electric closed door is installed inside the feed port (111), the feed port (111) is connected to a material guide channel (126), and a uniformly distributed buffer rubber wire layer is fixedly connected to the inner side wall of the material guide channel (126), and the buffer rubber wire layer is used to provide a buffer for the thyristor (115) to be tested.

6. The flat-plate thyristor performance testing device according to claim 5, characterized in that: A controller (104) is installed on one side of the upper front end of the base frame (102), and the controller (104) is used to control the limit test component and the test rewarming component.

7. The flat-plate thyristor performance testing device according to claim 6, characterized in that: An electric push rod (117) is installed on the front side of the middle portion of the top of the turntable (112), and the top of the electric push rod (117) is rotatably connected to the bottom of the pressing frame (113).

8. A method for testing the performance of a flat-plate thyristor, applied to the device for testing the performance of a flat-plate thyristor according to claim 7, characterized in that: The following detection methods are included: S1. Initial placement and circuit connection of the thyristor to be tested S1.

1. Positioning: Place the thyristor (115) to be tested steadily on the middle of the top of the terminal board (114), ensuring that the electrode is aligned with the terminal board contact; S1.2, circuit connection: through dedicated connecting wires, reliably connect the anode, cathode, and gate of the thyristor (115) to be tested with the test power supply, multimeter, and oscilloscope equipment to avoid false connection or short circuit; S2. Initial performance test S2.

1. Electrical parameter measurement: Use a multimeter to measure the basic electrical parameters of the thyristor (115) to be tested, including forward anode voltage, forward leakage current, and reverse breakdown voltage, according to the conventional test process, and record the data; S2.2, functional test: perform a functional test on the thyristor (115) to be tested, first build a simple test circuit, apply a suitable trigger signal to the thyristor (115) to be tested, observe its on and off conditions, and ensure that the thyristor (115) to be tested functions normally; S3. Sealing and environment construction before extreme temperature testing S3.

1. Closing the sealing cover: starting the motor to drive the threaded rod (124) to rotate, and driving the sealing cover (103) to descend vertically through the slider (123), so that the bottom of the sealing cover is stuck in the sealing groove (120), forming a closed test space; S3.2, start the air circulation system: turn on the air pump group (119), so that the air flow passes through the electric heater / semiconductor refrigerator in sequence, and then enters the sealed cover (103) after being heated or cooled, to establish a temperature gradient; S4, high temperature limit test S4.

1. Temperature control: Set the high temperature limit to 125°C according to the specification, and slowly increase the temperature at a rate of 1-5°C / minute to avoid thermal shock; S4.2, thermal balance maintenance: after reaching the set temperature, keep the temperature constant for 1-2 hours, and monitor the uniformity through the temperature sensor in the sealed cover to ensure that the thyristor (115) to be tested is fully thermally balanced; S4.

3. High-temperature parameter retest: Maintain the high-temperature environment and use a multimeter or oscilloscope to remeasure the forward anode voltage, leakage current, and breakdown voltage parameters. Compare the data with the initial data and record the changes. S4.4, High temperature function verification: Repeat the trigger test to observe whether the thyristor's on / off response at high temperature is normal, and whether there is abnormal heating or failure; S5. Low temperature limit test S5.1, cooling control: switch to cooling mode, set the low temperature limit to -40℃, and slowly cool down at a rate of 1-5℃ / min to avoid condensation; S5.2, low temperature balance maintenance: after reaching the set low temperature, keep the temperature constant for 1-2 hours to ensure that the internal temperature of the thyristor to be tested is uniform and stable; S5.3, Low temperature parameter retest: Repeat the electrical parameter measurements in the high temperature test and record the performance data at low temperature; S5.4 Low-temperature functional verification: Trigger the thyristor again to check its functional reliability at low temperatures and observe whether there is mechanical embrittlement or electrical failure; S6. Temperature recovery and retest S6.

1. Natural rewarming treatment: ① Turn off the heating / cooling module, open the feed port (111) of the sealing cover (103), and make the thyristor (115) to be tested transition from the extreme temperature to the room temperature of 23±2°C at a controllable rate through the buffer rubber wire layer of the material guide channel (126), so as to avoid sudden temperature changes; ② If the environment is bad, the temperature control module (106) of the bottom bin (125) can be activated to force the temperature to the standard room temperature; S6.2, Room temperature performance retest: After the temperature of the thyristor to be tested stabilizes, leave it for 1-2 hours, and then measure the initial electrical parameters and functions again to confirm that the performance has returned to the pre-test level; S7. Transfer of the thyristor to be tested and result determination S7.1, Mechanical transfer: Start the vacuum pump (131) to suck the thyristor to be tested through the pressure suction head (110), rotate it to the feed port (111) via the turntable (112), release it to the material guide channel (126) by the electric push rod (117), and finally fall into the horizontal frame (107); S7.

2. Result determination: Compare the test data of each stage: if the parameter changes are within the allowable range of the specification, the forward voltage fluctuation is ≤5%, and the function is normal, it is judged to be qualified; If the parameters exceed the standard, permanent failure or structural damage occurs, it will be judged as unqualified; S8. Equipment reset and record archiving S8.

1. Reset the equipment; raise the sealing cover (103), clean the terminal board and the test fixture, and turn off the air pump and power supply equipment; S8.2, Data Archiving: Organize test records, generate test reports, and archive them for future reference; S8.2 Critical Control Points ① Temperature gradient control: A smooth transition from the extreme temperature to the room temperature is achieved through the material guide channel (126) to avoid thermal stress damage; ② Environmental consistency: The temperature control module (106) of the bottom chamber (125) ensures that the room temperature is strictly controlled at 23±2°C during retesting; ③. Automatic monitoring: The temperature sensor (130) of the carriage (127) tracks the temperature of the thyristor to be measured in real time to ensure that the temperature is fully recovered.

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