Small communication module, non-contact smart card and dual-interface smart card

Abstract

The technical scheme of the invention discloses a small communication module, a non-contact smart card and a double-interface smart card, an antenna unit of the small communication module is made of a graphene material, and the graphene material is used as a high-conductivity and low-resistance material, so that the occupied space of an antenna can be reduced, and the high transmission efficiency of a signal can be maintained; meanwhile, the dielectric constant of the base material is not limited, the selectivity of the base material is expanded, and the high-frequency communication requirement is met; the non-contact intelligent card and the double-interface intelligent card adopt small communication modules, so that the thickness of the whole card is effectively reduced, and meanwhile, the bending strength is excellent.

Description

Technical Field

[0001] The present disclosure relates to the field of smart card communication, and particularly to a small communication module, a contactless smart card configured with the small communication module, and a dual-interface smart card. Background Art

[0002] Smart cards, as an intelligent identity recognition tool, are widely used in daily life and can be classified into contact smart cards and contactless smart cards according to the usage method. Traditional smart cards have the following technical defects:

[0003] (1) Traditional contact chips and contactless chips need to be independently manufactured and embedded in the card body respectively, resulting in complex processes, long card manufacturing cycles, and high card manufacturing costs;

[0004] (2) Chips with a single communication mode are easily replicated, and the contact and contactless functions are separated, making it impossible to achieve dual-channel encryption verification and resulting in a low security level;

[0005] (3) The contactless antenna needs to use a copper coil or an etched metal layer, requiring the substrate to have a specific dielectric constant, resulting in the card carrier being limited to a few materials such as PVC and PET, and the large antenna occupation area is easily oxidized, resulting in low signal transmission efficiency and difficulty in adapting to high-frequency communication requirements;

[0006] (4) The joint between the chip and the card body is easily cracked due to bending or high and low temperature cycling, resulting in a short service life. Summary of the Invention

[0007] To solve the above technical problems, the present disclosure provides a small communication module, which includes a chip and an antenna unit. The antenna unit is made of graphene material, and the chip includes non-contact front-end pins. The antenna unit is electrically connected to the non-contact front-end pins.

[0008] In one embodiment, the small communication module further includes a flexible printed circuit board, which integrates the antenna unit and the positioning and bonding area of the chip. The antenna unit is etched on the surface layer of the flexible printed circuit board and electrically connected to the non-contact front-end pins of the chip.

[0009] In one embodiment, the small communication module further includes a metal contact. The antenna unit is made of graphene material and is adaptively installed on the inner side of the metal contact through a conformal overlapping structure. The chip further includes contact communication pins, which are connected to the metal contact on the outer interface, and the contact communication pins are physically isolated from the non-contact front-end pins.

[0010] In one embodiment, a contact and non-contact communication protocol stack is integrated inside the chip. The contact communication pins and non-contact front-end pins of the chip are selectively conductively connected through a switching circuit, and the communication protocol stack includes a time-sharing control module and a scenario control module for switching between contact and non-contact communication modes.

[0011] In one embodiment, the small communication module further includes a flexible printed circuit board (FPCB). The FPCB integrates an antenna unit, a bonding area of the chip, and a bonding area of the metal contact pads. The antenna unit is etched on the surface layer of the FPCB and electrically connected to the non-contact front-end pins of the chip, and the metal contact pads are connected to the contact communication pins of the chip through the inner-layer conduction paths of the FPCB.

[0012] In one embodiment, the antenna unit is formed by a coil wound with graphene or consists of a graphene printed circuit.

[0013] In one embodiment, a dynamic impedance matching circuit composed of resistance elements and / or capacitance elements is integrated inside the chip or between the chip and the antenna unit for automatically adjusting the antenna resonance frequency.

[0014] In one embodiment, the metal contact pads and the antenna unit are integrally formed of graphene material.

[0015] The present disclosure provides a non-contact smart card configured with a small communication module, further including:

[0016] A substrate layer made of an insulating material, and the substrate layer is provided with a mounting groove for burying the chip;

[0017] A protective layer, including a resin encapsulation layer covering the chip, a wear-resistant coating covering the surface of the substrate layer, and a metal shielding net for suppressing electromagnetic interference disposed around the antenna unit.

[0018] The present disclosure provides a dual-interface smart card configured with a small communication module. The chip further includes a security processor for executing an encryption algorithm and independently managing contact and non-contact communication protocols, and further includes:

[0019] A substrate layer made of an insulating material, the substrate layer is provided with a mounting groove for burying the chip, and the contact interface module is disposed on the outer interface of the substrate layer;

[0020] A protective layer, including a resin encapsulation layer covering the chip, a wear-resistant coating covering the surface of the substrate layer, and a metal shielding net for suppressing electromagnetic interference disposed around the antenna unit.

[0021] The small communication module, non-contact smart card, and dual-interface smart card provided by the present application have the following beneficial effects:

[0022] (1) The antenna unit is made of graphene material. As a material with high conductivity and low resistance, graphene material can reduce the antenna footprint, maintain high signal transmission efficiency, and is not limited by the dielectric constant of the substrate, expanding the selectivity of the substrate material and matching the high-frequency communication requirements.

[0023] (2) The conformal lap joint structure of the graphene antenna and the metal contact further avoids the problem of resistance mutation in traditional point contact and effectively reduces the contact resistance.

[0024] (3) The non-contact smart card and the dual-interface smart card adopt a small communication module, which effectively reduces the overall card thickness and has excellent bending strength. Description of the Drawings

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art.

[0027] Figure 1 It is one of the structural schematic diagrams of the small communication module;

[0028] Figure 2 It is another structural schematic diagram of the small communication module;

[0029] Figure 3 It is one of the structural schematic diagrams of the dual-interface smart card;

[0030] Figure 4 It is another structural schematic diagram of the dual-interface smart card.

[0031] Main Element Symbol Description:

[0032] 1. Chip;

[0033] 2. Antenna unit;

[0034] 3. Metal contact;

[0035] 4. Smart card. Detailed Embodiments

[0036] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present invention, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0037] In the present invention, unless otherwise clearly specified and defined, the terms "mounted", "connected", "connected to", "fixedly connected", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be directly connected or indirectly connected through an intermediate medium, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] In the present invention, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0039] Smart cards, as an intelligent identity recognition tool, are widely used in daily life. According to the usage method, they can be classified into contact smart cards and non-contact smart cards. Traditional smart cards have the following technical defects: Traditional contact chips and non-contact chips need to be manufactured independently and embedded in the card body separately, resulting in complex processes, long card-making cycles, and high card-making costs; Chips with a single communication mode are easy to be replicated, and the contact and non-contact functions are separated, unable to achieve dual-channel encryption verification, with a low security level; The non-contact antenna needs to use copper coils or etched metal layers, requiring the substrate to have a specific dielectric constant, resulting in the card carrier being limited to a few materials such as PVC and PET, and the antenna occupying a large area, which is not conducive to miniaturized applications; The joint between the chip and the card body is prone to cracking due to bending or high and low temperature cycling, with a short service life.

[0040] To overcome the defects of the above-mentioned existing technologies, the present invention provides a small communication module, a non-contact smart card and a dual-interface smart card configured with the small communication module, solving the problems of large antenna volume, serious signal attenuation, slow response for dual-mode applications, and poor packaging reliability of traditional smart cards.

[0041] The following will be further elaborated and explained in conjunction with specific embodiments and the attached Figure 1 - attached Figure 4 scheme.

[0042] The technical solution of the present invention discloses a small communication module. The small communication module includes a chip 1 and an antenna unit 2. The antenna unit 2 is made of graphene material. The chip 1 includes non-contact front-end pins. The antenna unit 2 is electrically connected to the non-contact front-end pins. Among them, graphene material, as a material with high conductivity and low resistance, can reduce the antenna occupation area, maintain high signal transmission efficiency, and at the same time is not limited by the dielectric constant of the substrate, expanding the selectivity of the substrate material, so as to match the high-frequency communication requirements. Optionally, the thickness of the graphene antenna is 0.01 mm - 0.1 mm, which is suitable for ultra-thin smart cards, and effectively reduces the resistivity, improves the antenna signal transmission efficiency and the stable communication distance.

[0043] In one embodiment, the small communication module further includes a flexible printed circuit board. The surface of the flexible printed circuit board is etched with graphene antenna units 2. The bottom is provided with a chip 1 positioning and bonding area and the chip 1 is fixed by conductive adhesive. The graphene antenna units 2 are electrically connected to the non-contact front-end pins of the chip 1. The antenna and the chip 1 are integrally installed on the flexible printed circuit board. The antenna units 2 and the chip 1 pins are directly pressed by conductive adhesive or anisotropic conductive film. The chip 1 is directly pasted onto the chip 1 bonding area of the flexible printed circuit board. The chip 1 and the antenna units 2 are connected by wire bonding, thereby avoiding the introduction of parasitic parameters (such as parasitic resistance / capacitance / inductance) due to welding leads, reducing the resonance frequency deviation, and improving the communication efficiency. In addition, the flexible printed circuit board can use soft material films such as TPU, PET, PI, PDMS, etc., with a bending radius ≤ 5 mm, suitable for curved surface installation of wearable devices.

[0044] In one embodiment, to expand the contact communication function, the small communication module further includes a metal contact 3. The antenna unit 2 is made of graphene material and is adaptively installed on the inner side of the metal contact 3 through a conformal overlapping structure. The conformal overlapping structure of the graphene antenna and the metal contact 3 further avoids the problem of resistance mutation in traditional point contact, effectively reduces the contact resistance, and at the same time reduces the space occupation. Optionally, the contact area of the conformal overlapping structure covers more than 70% of the surface of the metal contact 3, further optimizing the reliability of antenna transmission.

[0045] In one embodiment, the chip 1 further includes contact communication pins. The contact communication pins are connected to the metal contact 3 on the outer interface, and the contact communication pins and the non-contact front-end pins are physically isolated. The contact communication pins can be connected to the metal contact 3 on the outer interface through a conductive path. The conductive path can be a copper pillar embedded in the substrate layer. Optionally, an insulating isolation groove is provided between the non-contact front-end pins and the contact pins, with a groove width of more than 0.3 mm and filled with epoxy resin, thereby increasing the isolation impedance between the two pins and reducing crosstalk.

[0046] In one embodiment, the chip 1 internally integrates contact and non-contact communication protocol stacks. The contact communication pins and the non-contact front-end pins of the chip 1 are selectively conducted through a switching circuit. The communication protocol stack includes a time-sharing control module and a scenario control module for switching between contact and non-contact communication modes. For example, the switching circuit selects a MOSFET array, and the switching time < 10 ns. The time-sharing control module polls the contact and non-contact interfaces at a 5 ms cycle, thereby ensuring the response speed of dual-mode switching and reducing power consumption.

[0047] In one embodiment, the small communication module further includes a flexible printed circuit board (FPCB), which integrates an antenna unit 2, a bonding area of a chip 1, and a bonding area of a metal contact 3. The antenna unit 2 is etched on the surface layer of the FPCB and electrically connected to the non-contact front-end pins of the chip 1. The metal contact 3 is connected to the contact communication pins of the chip 1 through the inner-layer conductive path of the FPCB. The inner-layer conductive path shields external interference, which is beneficial to improving the contact communication rate. The surface-layer antenna unit 2 and the inner-layer conductive path are isolated from each other, thereby reducing crosstalk.

[0048] In one embodiment, the antenna unit 2 is formed by a coil wound with graphene or a graphene printed circuit. For example, the graphene-wound coil can have a line width of 45 μm, a winding pitch of 55 μm, and a sheet resistance of 0.08 Ω / sq. The graphene printed circuit uses a screen printing process, and the slurry contains 80 wt% graphene powder. The line width / spacing ratio is 1:1.3. By selecting the line width / spacing parameters of the coil and the printed circuit, the inductance value of the wound coil and the dielectric loss of the printed circuit can be effectively controlled to adapt to the high-frequency communication requirements.

[0049] In one embodiment, a dynamic impedance matching circuit composed of a resistance element and / or a capacitance element is integrated inside the chip 1 or between the chip 1 and the antenna unit 2 for automatically adjusting the antenna resonance frequency. The dynamic impedance matching circuit includes an adjustable capacitor array and a microstrip line. The capacitance adjustment range is extended to 10 - 150 pF for automatically adjusting the antenna resonance frequency to adapt to the automatic resonance frequency deviation control under different temperature environments. Specifically, a capacitance element with a capacitance value of 50 - 100 pF is connected in parallel at both ends of the antenna unit 2 to increase the antenna Q value to more than 40. The capacitance element is connected across both ends of the antenna unit 2, and a multilayer ceramic capacitor can be selected to increase the antenna Q value to more than 40 and extend the effective communication distance. At the same time, a resistance series and / or parallel circuit is configured to cooperate with the capacitance to construct an LC resonance network, thereby optimizing the energy transmission and signal integrity.

[0050] In one embodiment, the metal contact 3 and the antenna unit 2 are integrally formed of graphene material. For example, the contact metal contact is extended or re-layout, and the contact shape is optimized (such as annular or spiral) to form a closed loop, acting as a radio frequency antenna for non-contact communication, thereby realizing electromagnetic coupling using the conductive path of the contact itself. This eliminates the need for antenna embedding, welding, and substrate raw materials, shortening the card-making process and cost.

[0051] The present disclosure also provides a contactless smart card configured with a small communication module, further comprising: a substrate layer made of an insulating material, the substrate layer being provided with a mounting groove for embedding chip 1; a protective layer including a resin encapsulation layer covering chip 1, a wear-resistant coating covering the surface of the substrate layer, and a metal shielding net for suppressing electromagnetic interference disposed around antenna unit 2. The overall thickness of the contactless smart card using the small communication module is extremely thin and has excellent bending strength. Optionally, the metal shielding net is a copper-nickel alloy with a mesh density of 200 meshes and a shielding effectiveness > 30 dB.

[0052] The present disclosure also provides a dual-interface smart card 4 configured with a small communication module. Chip 1 further includes a security processor for executing an encryption algorithm and independently managing contact and contactless communication protocols. The dual-interface smart card 4 further comprises: a substrate layer made of an insulating material, the substrate layer being provided with a mounting groove for embedding chip 1, and a contact interface module disposed on the outer interface of the substrate layer; a protective layer including a resin encapsulation layer covering chip 1, a wear-resistant coating covering the surface of the substrate layer, and a metal shielding net for suppressing electromagnetic interference disposed around antenna unit 2. The overall thickness of the dual-interface smart card using the small communication module is extremely thin and has excellent bending strength, and generates keys in real time through the security processor, which is suitable for bank cards, identity authentication cards, etc. with a high anti-counterfeiting level.

[0053] The above has introduced in detail the small communication module, the contactless smart card, and the dual-interface smart card provided by the technical solution of the present invention. Specific examples are used in this article to elaborate on the principle and implementation manner of the present invention. The description of the above embodiments is only used to help understand the core idea of the present invention; at the same time, for those of ordinary skill in the art, according to the idea and method of the present invention, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present invention.

Claims

1. A small communication module, characterized in that, The small communication module includes a chip and an antenna unit. The antenna unit is made of graphene material. The chip includes non-contact front-end pins, and the antenna unit is electrically connected to the non-contact front-end pins.

2. The small communication module according to claim 1, characterized in that It further includes a flexible printed circuit board which integrates the antenna unit and the positioning and bonding area of the chip. The antenna unit is etched on the surface layer of the flexible printed circuit board and electrically connected to the non-contact front-end pins of the chip.

3. The small communication module according to claim 1, characterized in that The small communication module further includes a metal contact. The antenna unit is made of graphene material and is adaptively installed inside the metal contact through a conformal overlapping structure. The chip further includes contact communication pins, and the contact communication pins are connected to the metal contact on the outer interface, and the contact communication pins are physically isolated from the non-contact front-end pins.

4. The small communication module according to claim 3, wherein The chip internally integrates contact and non-contact communication protocol stacks. The contact communication pins and the non-contact front-end pins of the chip are selectively conducted through a switching circuit, and the communication protocol stack includes a time-sharing control module and a scenario control module for switching between contact and non-contact communication modes.

5. The small communication module according to claim 3, characterized in that, The metal contact and the antenna unit are integrally formed of graphene material.

6. The small communication module according to any one of claims 3-5, characterized in that, It further includes a flexible printed circuit board which integrates the antenna unit, the bonding area of the chip, and the bonding area of the metal contact. The antenna unit is etched on the surface layer of the flexible printed circuit board and electrically connected to the non-contact front-end pins of the chip. The metal contact is connected to the contact communication pins of the chip through the inner-layer conduction path of the flexible printed circuit board.

7. The small communication module according to claim 1, wherein The antenna unit is formed by a coil wound with graphene or is composed of a graphene printed circuit.

8. The small communication module according to claim 1, characterized in that, A dynamic impedance matching circuit composed of resistance elements and / or capacitance elements is integrated inside the chip or between the chip and the antenna unit for automatically adjusting the antenna resonance frequency.

9. A contactless smart card, characterized in that, Configured with the small communication module according to any one of claims 1, 2, 7, or 8, further comprising: A substrate layer made of an insulating material, and the substrate layer is provided with an installation groove for burying the chip; A protective layer, including a resin encapsulation layer covering the chip, a wear-resistant coating covering the surface of the substrate layer, and a metal shielding net for suppressing electromagnetic interference arranged around the antenna unit.

10. A dual-interface smart card, characterized in that, Configured with the small communication module according to any one of claims 1, 3-8, the chip further includes a security processor for executing an encryption algorithm and independently managing contact and non-contact communication protocols, and further comprising: A substrate layer made of an insulating material, the substrate layer is provided with an installation groove for burying the chip, and the contact interface module is arranged on the outer interface of the substrate layer; A protective layer, including a resin encapsulation layer covering the chip, a wear-resistant coating covering the surface of the substrate layer, and a metal shielding net for suppressing electromagnetic interference arranged around the antenna unit.

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