Chip capacitor dipping mechanism based on thick rubber plate

Abstract

The invention discloses a chip capacitor dip-coating mechanism based on a thick rubber plate. The chip capacitor dip-coating mechanism comprises a dip-coating device, a transfer conveying table, a transfer clamping jaw, a pre-drying device, a pre-cooling device, a discharging conveying table and a feeding clamping jaw. According to the scheme, at least two groups of dip-coating devices are introduced into the dip-coating mechanism, in the dip-coating process of the laminated capacitor, the end part of the chip capacitor can be subjected to dip-coating in advance through the first group of dip-coating devices, and the pre-coating layer is formed after drying and cooling through the pre-drying device and the pre-cooling device; and the chip capacitor is formally dipped by the second group of dipping devices, so that the dipping process of the chip capacitor is completed. According to the scheme, at least two dipping processes are realized in the dipping mechanism, and the existence of the pre-dipping layer is beneficial to improving the bonding property of the paste and the chip capacitor in the formal dipping process, and ensures that the surface of the sealing layer of the chip capacitor is flat and the end-capping line is flat, so that the end-capping quality of the chip capacitor is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of chip capacitor production equipment, and particularly relates to a chip capacitor dipping mechanism based on a thick glue board. Background Art

[0002] In the current technology, the full-automatic capping machine / production line for chip capacitors generally uses a stencil as the carrier for transporting chip capacitors. Specifically, refer to the Chinese utility model patent with the publication number CN218849426U. During the capping process, a glue film needs to be pasted on one side of the stencil first, so that one end of the mesh holes of the stencil is closed by the glue film. After the glue film is adhered smoothly, the chip capacitors are implanted into the mesh holes, and hundreds of miniature chip capacitors are adhered to the stencil through the glue film so that they will not fall off. Then, the other end of the chip capacitors that are not adhered to the glue film is dipped in slurry for capping. During the above implantation process, the ends of the pasting ends of the chip capacitors will be aligned under the action of the glue film. However, due to possible production tolerances of the chip capacitors themselves (such as different lengths, etc.), it is difficult for the ends to be capped on the same stencil to be flush with each other after implantation, resulting in poor dipping consistency of the chip capacitors, which greatly affects the capping quality of the chip capacitors.

[0003] Therefore, in order to ensure the capping quality of chip capacitors, some existing manufacturers have begun to use thick glue boards instead of stencils as the transport carriers for chip capacitors. The thick glue board is a carrier for fixing chip capacitors by means of silicone clamping. Therefore, to successfully implant the chip capacitors into the board holes of the thick glue board, an introduction board needs to be placed on the top of the thick glue board. First, the chip capacitors are implanted into the introduction holes of the introduction board by vibration, and then the chip capacitors located in the introduction board are pressed into the board holes of the thick glue board through a pin bed, thus completing the implantation process of the chip capacitors in the thick glue board.

[0004] In addition, when the existing capping machine dips the chip capacitors in slurry, it generally only drives the chip capacitors to press down on the slurry tray once to complete the capping of their ends. In addition, in order to enable the slurry in the slurry tray to effectively adhere to the ends of the chip capacitors during a single pressing process, the slurry used is generally relatively thick. Since the slurry for capping is relatively thick, it is easy to form an irregular capping layer shape at the ends of the dipped chip capacitors, resulting in air bubbles between the end surfaces of the chip capacitors and the capping layer, causing uneven thickness of the capping layer and poor bonding, thus affecting the capping quality of the chip capacitors. Further, the capping requirement for chip capacitors is generally to form a straight capping line on the surface of the capacitor. For the chip capacitors capped with slurry having a relatively high viscosity, the capping lines are generally not straight, and it is easy to have a sagging phenomenon outside the capping layer, which also affects the capping quality of the chip capacitors. Summary of the Invention

[0005] The object of the present invention is to provide a dipping mechanism for chip capacitors based on thick glue boards, which can realize the multiple dipping process of chip capacitors as required by multiple dipping devices, effectively improving the capping effect and quality of chip capacitors to overcome the deficiencies in the prior art.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] A dipping mechanism for chip capacitors based on thick glue boards includes a dipping device, a transfer conveyor, a transfer gripper, a pre-drying device, a pre-cooling device, a discharging conveyor, and a feeding gripper;

[0008] The transfer conveyor, the pre-drying device, the pre-cooling device, and the discharging conveyor are connected end to end in sequence, and the transfer conveyor moves up and down relative to the pre-drying device, and the discharging conveyor moves up and down relative to the pre-cooling device;

[0009] At least two groups of dipping devices are provided, and the loading ends of all the dipping devices and the discharging conveyor are within the moving range of the feeding gripper, and the feeding gripper is used to transfer the thick glue board between the loading end of the dipping device and the discharging conveyor; the discharging ends of all the dipping devices and the transfer conveyor are within the moving range of the transfer gripper, and the transfer gripper is used to transfer the thick glue board between the discharging end of the dipping device and the transfer conveyor.

[0010] Preferably, the dipping device includes a mounting frame, a slurry pan, a slurry spreading component, a dipping fixture, and a loading tray;

[0011] The mounting frame includes a support base and a conveying bracket;

[0012] The support base is erected above the slurry pan, and the slurry pan moves horizontally relative to the support base; the conveying bracket is horizontally extended and installed on the support base, and the extending direction of the conveying bracket is parallel to the moving direction of the slurry pan, and the conveying bracket is located above the slurry pan;

[0013] The slurry spreading component is installed on one side of the support base, and the slurry spreading component is located on the top of the slurry pan; the slurry spreading component moves up and down relative to the slurry pan, and the slurry spreading component is used to spread a slurry layer on the top of the slurry pan;

[0014] The loading tray is horizontally movably installed on the conveying bracket;

[0015] The dipping fixture is vertically movably installed on the support base, and the upper limit of the movement of the dipping fixture is above the conveying bracket, and the lower limit of the movement of the dipping fixture is above the slurry pan.

[0016] Preferably, the slurry dipping device further comprises a defoaming assembly, which includes a defoaming tray and a defoaming top cover, and a negative pressure pipeline is connected to the cover body of the defoaming top cover;

[0017] The defoaming tray is horizontally movably installed on the conveying bracket, and the feeding tray is located at the feeding end of the conveying bracket, and the defoaming tray is located at the discharging end of the conveying bracket;

[0018] The defoaming top cover is installed on the top of the conveying bracket and is located on one side of the support seat; the defoaming top cover moves up and down relative to the conveying bracket, and the defoaming top cover is used to cover the defoaming tray.

[0019] Preferably, a plurality of negative pressure holes are further provided on the inner top surface of the slurry dipping jig, and the negative pressure holes are communicated with the negative pressure pipeline.

[0020] Preferably, the slurry dipping device further comprises a mounting bracket, the mounting bracket is erected above the slurry pan, and the slurry spreading assembly is installed on the front side of the mounting bracket;

[0021] The slurry spreading assembly includes a slurry collecting knife, a slurry spreading knife and a cleaning knife which are arranged in sequence from front to back along the moving direction of the slurry pan. The slurry collecting knife and the slurry spreading knife can move up and down relative to the mounting bracket respectively, and the slurry collecting knife is used to collect and accumulate the slurry at one end of the slurry pan, and the slurry spreading knife is used to spread the accumulated slurry into a slurry layer;

[0022] The cleaning knife is used to clean the back of the slurry spreading knife.

[0023] Preferably, the cleaning knife is an air knife.

[0024] Preferably, the cleaning knife is a scraper;

[0025] The scraper moves up and down relative to the mounting bracket, and the end of the scraper abuts against the back of the slurry spreading knife.

[0026] Preferably, the slurry pan includes a slurry dipping tank and a recovery tank which are arranged in sequence from front to back.

[0027] Preferably, the horizontal cross-sectional shape of the slurry collecting knife is U-shaped, and the opening of the slurry collecting knife faces the slurry spreading knife.

[0028] Preferably, the slurry dipping device further comprises a laser detector, and the laser detector is arranged at the rear side of the cleaning knife, and the laser detector is used to detect the thickness of the slurry layer;

[0029] The mounting bracket includes two support frames and a back plate. The two support frames are respectively protrudingly arranged on both sides of the slurry pan. The rotating end of the back plate is rotatably connected to one of the support frames through a bearing seat, and the adjusting end of the back plate is detachably mounted on the other support frame through a screw. The laser detector is movably mounted on the back of the back plate along the length direction of the back plate.

[0030] The technical solution provided by the present invention may include the following beneficial effects:

[0031] In this solution, at least two groups of dipping devices are introduced into the dipping mechanism. During the dipping process of the chip capacitor with adhesive, the end of the chip capacitor can be pre-dipped by the first group of dipping devices first, and after drying and cooling through the pre-drying device and the pre-cooling device to form a pre-dipped layer, then the chip capacitor is formally dipped by the second group of dipping devices, thus completing the dipping process of the chip capacitor. At least two dipping processes are realized in the dipping mechanism of this solution, and the existence of the pre-dipped layer is beneficial to improving the bonding property between the slurry and the chip capacitor during the formal dipping process, ensuring that the sealing surface of the chip capacitor is flat and the sealing end wire is flat and true, so as to ensure the sealing quality of the chip capacitor. In addition, the two groups of dipping devices in this solution share the same group of pre-drying devices and pre-cooling devices, which is beneficial to reducing the occupied space of the equipment and saving the equipment cost. Description of the Drawings

[0032] Figure 1 is the top view of a chip capacitor dipping mechanism based on a thick glue board according to the present invention;

[0033] Figure 2 is a partial structural schematic diagram of a chip capacitor dipping mechanism based on a thick glue board according to the present invention from one perspective;

[0034] Figure 3 is a partial structural schematic diagram of a chip capacitor dipping mechanism based on a thick glue board according to the present invention from another perspective;

[0035] Figure 4 is a partial structural schematic diagram of a chip capacitor dipping mechanism based on a thick glue board according to the present invention;

[0036] Figure 5 is a partial structural schematic diagram of a chip capacitor dipping mechanism based on a thick glue board according to the present invention;

[0037] Figure 6 is a structural schematic diagram of a slurry spreading assembly, a mounting bracket and a laser detector in a chip capacitor dipping mechanism based on a thick glue board according to the present invention;

[0038] Figure 7 is a structural schematic diagram of a mounting bracket and a laser detector in a chip capacitor dipping mechanism based on a thick glue board according to the present invention.

[0039] Wherein: dipping slurry device 51, installation rack 511, support seat 5111, conveying bracket 5112, slurry pan 512, dipping slurry tank 5121, recovery tank 5122, spreading slurry assembly 513, slurry collecting knife 5131, spreading slurry knife 5132, scraping knife 5133, dipping slurry fixture 514, loading tray 515, defoaming tray 516, defoaming top cover 517, installation bracket 518, support frame 5181, back plate 5182, bearing seat 5183, screw 5184, adjusting micrometer head 5185, installation counterbore 5186, slide rail 5187, adjusting pressing block 5188, laser detector 519;

[0040] Transfer conveying table 52;

[0041] Transfer jaw 53;

[0042] Pre-drying device 54;

[0043] Pre-cooling device 55;

[0044] Unloading conveying table 56;

[0045] Feeding jaw 57;

[0046] Thick rubber sheet 93. Specific implementation manner

[0047] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described by referring to the drawings below are exemplary and are only used to explain the present invention and should not be construed as a limitation to the present invention.

[0048] The present technical solution provides a dipping slurry mechanism for chip capacitors based on a thick rubber sheet, including a dipping slurry device 51, a transfer conveying table 52, a transfer jaw 53, a pre-drying device 54, a pre-cooling device 55, an unloading conveying table 56 and a feeding jaw 57;

[0049] The transfer conveying table 52, the pre-drying device 54, the pre-cooling device 55 and the unloading conveying table 56 are connected end to end in sequence, and the transfer conveying table 52 moves up and down relative to the pre-drying device 54, and the unloading conveying table 56 moves up and down relative to the pre-cooling device 55;

[0050] The dipping slurry device 51 is provided with at least two groups, and the feeding ends of all the dipping slurry devices 51 and the blanking conveying table 56 are both within the moving range of the feeding gripper 57. The feeding gripper 57 is used to transfer the thick rubber plate 93 between the feeding end of the dipping slurry device 51 and the blanking conveying table 56; the discharging ends of all the dipping slurry devices 51 and the transfer conveying table 52 are both within the moving range of the transfer gripper 53. The transfer gripper 53 is used to transfer the thick rubber plate 93 between the discharging end of the dipping slurry device 51 and the transfer conveying table 52.

[0051] When the capping machine in the prior art dips the chip capacitor in the slurry, it generally only drives the chip capacitor to press down on the slurry tray once to complete the capping of its end. In addition, in order to enable the slurry in the slurry tray to effectively adhere to the end of the chip capacitor during a single pressing process, the slurry used is generally relatively thick.

[0052] Since the slurry for capping is relatively thick, it is easy to form an irregular capping layer shape at the end of the dipped chip capacitor, resulting in air bubbles between the end surface of the chip capacitor and the capping layer, causing uneven thickness of the capping layer and poor bonding, thus affecting the capping quality of the chip capacitor. Further, the capping requirement of the chip capacitor is generally to form a straight capping line on the surface of the capacitor. However, for the chip capacitor capped with a slurry having a relatively high viscosity, its capping line is generally not straight, and it is easy to produce a sagging phenomenon outside the capping layer, which also affects the capping quality of the chip capacitor.

[0053] In order to enable the slurry to effectively adhere to the end of the chip capacitor and ensure that its capping layer has the required thickness and a straight capping line, the present technical solution proposes a dipping slurry mechanism, as Figure 1 shown, including at least two groups of dipping slurry devices 51, a transfer conveying table 52, a transfer gripper 53, a pre-drying device 54, a pre-cooling device 55, a blanking conveying table 56, and a feeding gripper 57.

[0054] In this solution, at least two groups of dipping slurry devices 51 are introduced into the dipping slurry mechanism. During the dipping process of the chip capacitor, the end of the chip capacitor can be pre-dipped by the first group of dipping slurry devices 51 first, and after drying and cooling by the pre-drying device 54 and the pre-cooling device 55, a pre-dipping layer is formed. Then, the chip capacitor is formally dipped by the second group of dipping slurry devices 51, thus completing the dipping process of the chip capacitor. At least two dipping processes are realized in the dipping slurry mechanism of this solution. And the existence of the pre-dipping layer is beneficial to improving the bonding property between the slurry and the chip capacitor during the formal dipping process, ensuring that the capping layer surface of the chip capacitor is flat and the capping line is straight, so as to ensure the capping quality of the chip capacitor. In addition, the two groups of dipping slurry devices 51 in this solution share the same group of pre-drying device 54 and pre-cooling device 55, which is beneficial to reducing the occupied space of the equipment and saving the equipment cost.

[0055] It should be noted that, in a specific embodiment, the end of the chip capacitor can be pre-dipped one or more times with a relatively thin slurry in the dipping device 51 of the first group, and then the end of the chip capacitor can be formally dipped one or more times with a slurry of normal consistency in the dipping device 51 of the second group. In another specific embodiment, the chip capacitor can also be dipped multiple times with a slurry of the same thin viscosity using the same group or multiple groups of dipping devices 51. This is not limited herein and can be selected according to the capping quality as needed. In this solution, multiple dipping processes are realized by using multiple groups of dipping devices 51, which can better improve the capping effect and quality of the chip capacitor.

[0056] It should be further noted that the transfer conveyor 52, transfer gripper 53, pre-drying device 54, pre-cooling device 55, blanking conveyor 56 and feeding gripper 57 used in this solution are all conventional structures in the art, and their specific structures will not be elaborated herein. In some specific embodiments, the transfer conveyor 52 and blanking conveyor 56 of this solution can be liftable conveyor belts, the pre-drying device 54 can be a conventional infrared heating device, and the pre-cooling device 55 can be externally connected to a cold air blower to convey cold air into the interior of the pre-cooling device, thereby cooling the chip capacitor on the thick glue board 93.

[0057] Specifically, the dipping process of a specific embodiment of the dipping mechanism in this solution includes the following steps:

[0058] (1) Use the feeding gripper 57 to load the thick glue board 93 implanted with the chip capacitor onto the loading end of the dipping device 51 of the first group; at this time, the end of the chip capacitor to be dipped protrudes from the lower surface of the thick glue board 93.

[0059] (2) Use the dipping device 51 of the first group to dip the end of the chip capacitor.

[0060] (3) Make the transfer conveyor 52 move downward and align the transfer conveyor 52 with the dipping device 51 of the first group at the same height, and then use the transfer gripper 53 to move the thick glue board 93 at the unloading end of the first group dipping device 51 to the top of the transfer conveyor 52.

[0061] (4) Make the transfer conveyor 52 move upward and align the transfer conveyor 52 with the pre-drying device 54 at the same height, then use the transfer conveyor 52 to convey the dipped thick glue board 93 into the interior of the pre-drying device 54 for drying, and then enter the interior of the pre-cooling device 55 for cooling, and then be temporarily stored on the blanking conveyor 56 (at this time, the blanking conveyor 56 and the pre-cooling device 55 are at the same height).

[0062] (5) Lower the blanking conveyor table 56 downward so that the blanking conveyor table 56 and the dipping device 51 of the second group are at the same height, and use the dipping device 51 of the second group to dip the ends of the chip capacitors.

[0063] (6) Repeat steps (3) and (4). After the chip capacitors that have undergone the second dipping are dried and cooled again, they are temporarily stored on the blanking conveyor table 56 again, waiting to enter the next process.

[0064] Further, the dipping device 51 includes a mounting frame 511, a slurry pan 512, a slurry spreading assembly 513, a dipping fixture 514, and a loading tray 515.

[0065] The mounting frame 511 includes a support base 5111 and a conveying bracket 5112.

[0066] The support base 5111 is erected above the slurry pan 512, and the slurry pan 512 moves horizontally relative to the support base 5111; the conveying bracket 5112 is horizontally extended and installed on the support base 5111, and the extending direction of the conveying bracket 5112 is parallel to the moving direction of the slurry pan 512, and the conveying bracket 5112 is located above the slurry pan 512.

[0067] The slurry spreading assembly 513 is installed on one side of the support base 5111, and the slurry spreading assembly 513 is located on the top of the slurry pan 512; the slurry spreading assembly 513 moves up and down relative to the slurry pan 512, and the slurry spreading assembly 513 is used to spread a slurry layer on the top of the slurry pan 512.

[0068] The loading tray 515 is horizontally movably installed on the conveying bracket 5112.

[0069] The dipping fixture 514 is vertically movably installed on the support base 5111, and the upper limit of the movement of the dipping fixture 514 is located above the conveying bracket 5112, and the lower limit of the movement of the dipping fixture 514 is located above the slurry pan 512.

[0070] Furthermore, in order to ensure the continuous and smooth progress of the dipping process, the structure of the dipping device 51 is optimized in this technical solution, such as Figures 2 - 4 shown, including a mounting frame 511, a slurry pan 512, a slurry spreading assembly 513, a dipping fixture 514, and a loading tray 515.

[0071] Specifically, the dipping process of the dipping device 51 in this solution includes the following steps:

[0072] (1) Use the feeding gripper 57 to load the thick glue board 93 implanted with the chip capacitor onto the loading tray 515 at the loading end of the dipping device 51; at this time, the end of the chip capacitor to be dipped protrudes from the lower surface of the thick glue board 93;

[0073] (2) Use the loading tray 515 to move the thick glue board 93 below the dipping fixture 514; at the same time, use the slurry spreading component 513 to lay a slurry layer on the top of the slurry tray 512, and move the slurry tray 512 horizontally below the dipping fixture 514;

[0074] (3) After using the dipping fixture 514 to clamp the thick glue board 93 on the loading tray 515, the loading tray 515 resets; then, the dipping fixture 514 moves downward, and contacts the end of the chip capacitor in the thick glue board 93 with the slurry layer on the top of the slurry tray 512;

[0075] (4) The dipping fixture 514 moves upward, and the loading tray 515 moves below the dipping fixture 514; then, the dipping fixture 514 places the dipped thick glue board 93 back on the loading tray 515, and the loading tray 515 transports the dipped thick glue board 93 to the unloading end of the dipping device 51 to complete the dipping process.

[0076] Furthermore, the dipping device 51 further includes a defoaming component, the defoaming component includes a defoaming tray 516 and a defoaming top cover 517, and the cover body of the defoaming top cover 517 is connected with a negative pressure pipeline;

[0077] The defoaming tray 516 is horizontally movably installed on the conveying bracket 5112, and the loading tray 515 is located at the loading end of the conveying bracket 5112, and the defoaming tray 516 is located at the unloading end of the conveying bracket 5112;

[0078] The defoaming top cover 517 is installed on the top of the conveying bracket 5112, and the defoaming top cover 517 is located on one side of the support seat 5111; the defoaming top cover 517 moves up and down relative to the conveying bracket 5112, and the defoaming top cover 517 is used to cover the defoaming tray 516.

[0079] Most of the existing chip capacitors have small air bubbles inside the sealing ends, which is a shortcoming that is difficult to avoid in the existing sealing technology. The existence of the above small air bubbles directly affects the sealing quality of the chip capacitors, further affects the operation of the circuit, and further affects the quality of electronic products.

[0080] To ensure the encapsulation quality of the chip capacitor and avoid small air bubbles inside its encapsulation layer, this technical solution also adds a defoaming component in the slurry dipping device 51. Specifically, the defoaming component includes a defoaming tray 516 and a defoaming top cover 517. In this solution, the defoaming tray 516 can be used as the feeding carrier for the thick glue board 93 after slurry dipping. After slurry dipping, first move the thick glue board 93 to below the defoaming top cover 517 through the defoaming tray 516. After covering the defoaming tray 516 with the defoaming top cover 517, perform vacuum defoaming through the negative pressure pipeline (not shown in the figure) provided at its top, and then convey the thick glue board 93 to the discharging end of the slurry dipping device 51.

[0081] In addition, due to the addition of the defoaming tray 516, the slurry dipping process and the defoaming process of the thick glue board 93 in the slurry dipping device 51 are separated, which is more conducive to accelerating the production rhythm of the chip capacitor.

[0082] Furthermore, a plurality of negative pressure holes are also provided on the inner top surface of the slurry dipping fixture 514, and the negative pressure holes are communicated with the negative pressure pipeline.

[0083] Since the thick glue board 93 for fixing the chip capacitor is heavy, and the slurry dipping fixture 514 generally only clamps the edge of the thick glue board 93 to achieve its movement. Therefore, in order to avoid the deformation of the board (such as the middle of the board sinking downward) caused by the heavy weight of the thick glue board 93, resulting in uneven end faces of the chip capacitor and reducing the encapsulation consistency of the chip capacitor, this solution also provides a plurality of negative pressure holes on the inner top surface of the slurry dipping fixture 514. Through the adsorption effect of the negative pressure holes (not shown in the figure) communicated with the negative pressure pipeline on the thick glue board 93, auxiliary clamping is realized, so that the upper surface of the thick glue board 93 is attached to the inner top surface of the slurry dipping fixture 514, thereby effectively improving the deformation of the board caused by the heavy weight of the thick glue board 93 and further ensuring the encapsulation consistency of the chip capacitor.

[0084] Furthermore, the slurry dipping device 51 further includes a mounting bracket 518. The mounting bracket 518 is erected above the slurry pan 512, and the slurry spreading component 513 is installed on the front side of the mounting bracket 518;

[0085] The slurry spreading component 513 includes a slurry collecting knife 5131, a slurry spreading knife 5132 and a cleaning knife arranged in sequence from front to back along the moving direction of the slurry pan 512. The slurry collecting knife 5131 and the slurry spreading knife 5132 can move up and down relative to the mounting bracket 518 respectively, and the slurry collecting knife 5131 is used to collect and pile up the slurry at one end of the slurry pan 512, and the slurry spreading knife 5132 is used to spread the piled-up slurry into a slurry layer;

[0086] The cleaning knife is used to clean the back of the slurry spreading knife 5132.

[0087] As Figures 5 - 6As shown, the slurry spreading assembly 513 of this solution is installed above the slurry pan 512 through the mounting bracket 518, and the slurry collecting knife 5131 and the slurry spreading knife 5132 can move up and down relative to the mounting bracket 518 respectively. In this solution, the slurry collecting knife 5131 can be used to stack the slurry at the rear end of the slurry pan 512 first, and then the stacked slurry can be spread flat according to the thickness requirement by the slurry spreading knife 5132, so as to effectively accelerate the speed of slurry preparation in the dipping process. If only the slurry spreading knife 5132 is used to prepare the slurry layer, the slurry pan 512 and the slurry spreading knife 5132 need to move back and forth many times to form a slurry layer with the required thickness, which greatly reduces the dipping speed of the dipping device.

[0088] During the process of spreading slurry by the slurry spreading knife 5132, the slurry may adhere to the back of the slurry spreading knife 5132. Therefore, in order to prevent waste of slurry and avoid frequently adding slurry to the slurry pan 512, a cleaning knife is additionally provided at the rear side of the slurry spreading knife 5132. The cleaning knife can effectively clean the slurry adhering to the back of the slurry spreading knife 5132 and make it return to the inside of the slurry pan 512 to avoid waste of slurry.

[0089] Furthermore, the cleaning knife is an air knife.

[0090] In an embodiment of this technical solution, the cleaning knife can be an air knife (not shown in the figure). By blowing air on the back of the slurry spreading knife 5132, the slurry on the back of the slurry spreading knife 5132 can be effectively blown away and the above-mentioned slurry can fall back into the slurry pan 512.

[0091] Furthermore, the cleaning knife is a scraping knife 5133;

[0092] The scraping knife 5133 moves up and down relative to the mounting bracket 518, and the end of the scraping knife 5133 abuts against the back of the slurry spreading knife 5132.

[0093] In another embodiment of this technical solution, the cleaning knife is a scraping knife 5133, as Figure 6 shown. By scraping the slurry on the back of the slurry spreading knife 5132 with the scraping knife 5133, the waste of slurry can also be effectively avoided.

[0094] Furthermore, the slurry pan 512 includes a dipping tank 5121 and a recovery tank 5122 arranged in sequence from front to back.

[0095] As a preference of the above embodiments, during the slurry dipping process, the slurry may be contaminated by dust in the air or the dropping of the chip capacitors in the thick rubber plate 93. The above-mentioned dust or dropped chip capacitors can be first collected on the back of the blade by the slurry spreading blade 5132, and then cleaned by the cleaning blade and recycled into the inside of the recovery tank 5122. Finally, by screening, cleaning and reusing the chip capacitors in the recovery tank 5122, the waste of products can be effectively avoided.

[0096] Further illustration, the horizontal cross-sectional shape of the slurry collecting blade 5131 is U-shaped, and the opening of the slurry collecting blade 5131 faces the slurry spreading blade 5132.

[0097] In this way, the effective accumulation of the slurry can be achieved.

[0098] Further illustration, the dipping device 51 further includes a laser detector 519, and the laser detector 519 is arranged at the rear side of the cleaning blade. The laser detector 519 is used to detect the thickness of the slurry layer;

[0099] The mounting bracket 518 includes two support frames 5181 and a back plate 5182. The two support frames 5181 are respectively protrudingly arranged on both sides of the slurry pan 512. The rotating end of the back plate 5182 is rotatably connected to one of the support frames 5181 through a bearing seat 5183. The adjusting end of the back plate 5182 is detachably mounted on the other support frame 5181 through a screw 5184. The laser detector 519 is movably mounted on the back of the back plate 5182 along the length direction of the back plate 5182.

[0100] In order to improve the intelligent level of the dipping mechanism, a laser detector 519 for detecting the thickness of the slurry layer is also installed on the back of the mounting bracket 518 in this solution to improve the controllability of the dipping mechanism.

[0101] Further, in order to improve the detection accuracy of the laser detector 519 and ensure the horizontal movement of the laser detector 519 on the back plate 5182, the installation structure of the back plate 5182 is also optimized in this solution, such as Figures 6 - 7 shown, the back plate 5182 is installed by the cooperation of the bearing seat 5183 and the screw 5184, which is beneficial to adjust and realize the horizontal setting of the back plate 5182, and further ensure the horizontal movement of the laser detector 519 on the back plate 5182.

[0102] Preferably, the mounting bracket 518 further includes an adjusting micrometer head 5185 and a compression spring;

[0103] The adjusting micrometer head 5185 and the compression spring are oppositely installed on the support frame 5181 connected to the adjusting end of the back plate 5182 in the vertical direction;

[0104] The adjusting micrometer head 5185 is located above the back plate 5182, and the adjusting micrometer head 5185 moves up and down relative to the support frame 5181, and the end of the adjusting micrometer head 5185 abuts against the top of the back plate 5182;

[0105] The compression spring is located below the back plate 5182, and the compression spring abuts between the back plate 5182 and the support frame 5181.

[0106] In a preferred embodiment of the present technical solution, the present solution realizes the adjustment of the level of the back plate 5182 by additionally providing an adjusting micrometer head 5185 and a compression spring (not shown in the figure) at the adjusting end of the back plate 5182, which is more conducive to further improving the detection accuracy of the laser detector 519.

[0107] Preferably, mounting counterbores 5186 are provided on the bottom of the adjusting end of the back plate 5182 and on the surface of the support frame 5181 opposite to the bottom, and the mounting counterbores 5186 are used to accommodate the compression spring.

[0108] In this way, the compression spring can be effectively prevented from detaching from the mounting bracket 518.

[0109] Preferably, the mounting bracket 518 further includes a slide rail 5187, the slide rail 5187 is prominently installed on the back of the back plate 5182, and the extending direction of the slide rail 5187 is parallel to the length direction of the back plate 5182;

[0110] The laser detector 519 is slidably mounted on the slide rail 5187.

[0111] Preferably, the mounting bracket 518 further includes an adjusting pressure block 5188, the adjusting pressure block 5188 is detachably mounted on the back of the back plate 5182, and the adjusting pressure block 5188 is located at the top of the slide rail 5187; the adjusting pressure block 5188 abuts against the slide rail 5187.

[0112] Since there may be tolerances in the production of the slide rail 5187, therefore, in order to further ensure the horizontal movement of the laser detector 519 to improve its detection accuracy, the present solution also additionally provides an adjusting pressure block 5188 on the back of the back plate 5182, and the adjusting pressure block 5188 abuts against the slide rail 5187 to finely adjust the local level of the slide rail 5187.

[0113] Preferably, a plurality of adjusting pressure blocks 5188 are provided.

[0114] Note that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly dictates otherwise, the singular forms are also intended to include the plural forms. In addition, it should be understood that when the terms "comprises" and / or "comprising" are used in this specification, they specify the presence of the stated features, steps, operations, devices, components, and / or combinations thereof.

[0115] Unless otherwise specifically stated, the relative arrangements of the components and steps, numerical expressions and values set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be understood that, for the sake of convenience of description, the dimensions of the various parts shown in the drawings are not drawn in actual proportional relationships. Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the said technologies, methods, and devices should be regarded as part of the authorized specification. In all the examples shown and discussed herein, any specific values should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, further discussion thereof is not required in subsequent drawings.

[0116] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, perpendicular, horizontal", and "top, bottom", etc. are generally based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description. Without contrary description, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and thus cannot be construed as limiting the protection scope of the present invention; the orientation words "inside, outside" refer to the inside and outside relative to the contour of each component itself.

[0117] For ease of description, spatial relative terms such as "above", "over", "on the upper surface", "upper", etc. can be used here to describe the spatial positional relationship of a device or feature shown in the figure with other devices or features. It should be understood that the spatial relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figure for the device. For example, if the device in the attached figure is inverted, the device described as "above" or "over" other devices or structures will then be positioned "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both the orientations of "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the corresponding interpretations of the spatial relative descriptions used here will be made accordingly.

[0118] In addition, it should be noted that the use of terms such as "first", "second", etc. to define components is only for the convenience of differentiating the corresponding components. Without additional statements, the above terms have no special meanings, so they should not be construed as limiting the protection scope of the present invention.

[0119] It should be noted that the terms "first", "second", etc. in the description of the specification, claims and the above-mentioned drawings of this application are used to distinguish similar objects, and do not necessarily have to be used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances so that the embodiments of this application described here can be implemented in an order other than those illustrated or described here.

[0120] The technical principles of the present invention have been described above in combination with specific embodiments. These descriptions are only for explaining the principles of the present invention and should not be construed as limiting the protection scope of the present invention in any way. Based on the explanations here, those skilled in the art can readily conceive of other specific embodiments of the present invention without creative efforts, and these embodiments will fall within the protection scope of the present invention.

Claims

1. A dipping mechanism for chip capacitors based on thick rubber plates, characterized in that: It includes a slurry dipping device, a transfer conveyor table, a transfer gripper, a pre-drying device, a pre-cooling device, a blanking conveyor table, and a feeding gripper; The transfer conveyor table, the pre-drying device, the pre-cooling device, and the blanking conveyor table are connected end to end in sequence, and the transfer conveyor table moves up and down relative to the pre-drying device, and the blanking conveyor table moves up and down relative to the pre-cooling device; At least two groups of the slurry dipping devices are provided, and the loading ends of all the slurry dipping devices and the blanking conveyor table are within the moving range of the feeding gripper. The feeding gripper is used to transfer the thick rubber plate between the loading end of the slurry dipping device and the blanking conveyor table; the discharging ends of all the slurry dipping devices and the transfer conveyor table are within the moving range of the transfer gripper. The transfer gripper is used to transfer the thick rubber plate between the discharging end of the slurry dipping device and the transfer conveyor table.

2. The dipping mechanism for chip capacitors based on thick rubber plates according to claim 1, wherein: The slurry dipping device includes a mounting frame, a slurry pan, a slurry spreading assembly, a dipping fixture, and a loading tray; The mounting frame includes a support base and a conveying bracket; The support base is erected above the slurry pan, and the slurry pan moves horizontally relative to the support base; the conveying bracket is horizontally extended and installed on the support base, and the extending direction of the conveying bracket is parallel to the moving direction of the slurry pan. The conveying bracket is located above the slurry pan; The slurry spreading assembly is installed on one side of the support base, and the slurry spreading assembly is located on the top of the slurry pan; the slurry spreading assembly moves up and down relative to the slurry pan, and the slurry spreading assembly is used to spread a slurry layer on the top of the slurry pan; The loading tray is horizontally movably installed on the conveying bracket; The dipping fixture is vertically movably installed on the support base, and the upper limit of the movement of the dipping fixture is above the conveying bracket, and the lower limit of the movement of the dipping fixture is above the slurry pan.

3. The dipping mechanism for chip capacitors based on thick rubber plates according to claim 2, characterized in that: The slurry dipping device further includes a defoaming assembly. The defoaming assembly includes a defoaming tray and a defoaming top cover, and a negative pressure pipe is connected to the cover body of the defoaming top cover; The defoaming tray is horizontally movably installed on the conveying bracket, and the loading tray is located at the loading end of the conveying bracket, and the defoaming tray is located at the discharging end of the conveying bracket; The defoaming top cover is installed on the top of the conveying bracket, and the defoaming top cover is located on one side of the support base; the defoaming top cover moves up and down relative to the conveying bracket, and the defoaming top cover is used to cover the defoaming tray.

4. A thick-plate-based dipping mechanism for chip capacitors according to claim 2, characterized in that: A plurality of negative pressure holes are further provided on the inner top surface of the dipping fixture, and the negative pressure holes are communicated with the negative pressure pipe.

5. A dipping mechanism for chip capacitors based on thick rubber plates according to claim 2, characterized in that: The slurry dipping device further includes a mounting bracket. The mounting bracket is erected above the slurry pan, and the slurry spreading assembly is installed on the front side of the mounting bracket; The slurry spreading assembly includes a slurry collecting knife, a slurry spreading knife, and a cleaning knife which are arranged in sequence from front to back along the moving direction of the slurry pan. The slurry collecting knife and the slurry spreading knife can move up and down relative to the mounting bracket respectively, and the slurry collecting knife is used to collect and pile up the slurry at one end of the slurry pan, and the slurry spreading knife is used to spread the piled-up slurry into a slurry layer; The cleaning knife is used to clean the back of the slurry spreading knife.

6. The dipping mechanism for chip capacitors based on thick rubber plates according to claim 5, wherein: The cleaning blade is an air knife.

7. A thick-plate-based dipping mechanism for chip capacitors according to claim 5, characterized in that: The cleaning blade is a scraping knife; The scraping knife moves up and down relative to the mounting bracket, and the end of the scraping knife abuts against the back of the sizing knife.

8. A thick-plate-based dipping mechanism for chip capacitors according to claim 5, characterized in that: The pulp pan includes a pulp dipping tank and a recovery tank arranged in sequence from front to back.

9. A dipping mechanism for chip capacitors based on thick rubber plates according to claim 5, characterized in that: The horizontal cross-sectional shape of the pulp receiving knife is U-shaped, and the opening of the pulp receiving knife faces the sizing knife.

10. A dipping mechanism for chip capacitors based on thick rubber plates according to claim 5, characterized in that: The pulp dipping device further includes a laser detector, and the laser detector is arranged at the rear side of the cleaning blade, and the laser detector is used for detecting the thickness of the pulp layer; The mounting bracket includes two support frames and a back plate. The two support frames are respectively protrudingly arranged on both sides of the pulp pan. The rotating end of the back plate is rotatably connected to one of the support frames through a bearing seat. The adjusting end of the back plate is detachably installed on the other support frame through a screw. The laser detector is movably installed on the back of the back plate along the length direction of the back plate.

Images