Embedded multifunctional driving power supply module and packaging method

Abstract

The invention relates to the technical field of IPM modules, in particular to an embedded multifunctional driving power supply module and a packaging method. A flip-chip bonding technology is adopted, and a chip is welded on a substrate; a compact three-dimensional packaging structure is adopted, and an IPM half-bridge driving circuit, a power management circuit and a protection circuit are welded on a substrate; the welding assembly is placed in the vacuum cavity of the packaging body and welded; embedding a copper vapor chamber into the back surface of the substrate, and plating nickel on the surface of the copper vapor chamber; the back face of the substrate is connected with the copper vapor chamber through ultrasonic welding; the chip, the IPM half-bridge driving circuit, the power management circuit and the protection circuit are packaged in the packaging body, the integration level of the motor driving module is remarkably improved, the functions of the motor driving module are diversified, meanwhile, the heat dissipation effect is guaranteed by installing the vapor chamber, and therefore the hair drier can be developed in a miniaturized, efficient and intelligent mode.

Description

Technical Field

[0001] The present invention relates to the technical field of IPM modules, and particularly to an embedded multi-functional drive power module and a packaging method thereof. Background Art

[0002] When a hair dryer is in use, mainly an IPM module controls the on and off of power devices through its internal drive circuit, thereby realizing the control of the motor current; enabling the hair dryer to adjust the speed and power of the motor according to different needs, and further realizing different wind speeds and heat outputs. Therefore, as an important part of personal care appliances, the performance improvement of the hair dryer depends on an efficient motor drive system.

[0003] However, in the aforementioned prior art, traditional motor drive modules often have the problems of single function and low integration. Therefore, in order to meet the multi-functional requirements of the motor drive module, multiple modules are usually set up to enrich the functions, which occupies a large amount of space in the hair dryer and restricts the miniaturization, high efficiency and intelligent development of the hair dryer. Summary of the Invention

[0004] The purpose of the present invention is to provide an embedded multi-functional drive power module and a packaging method thereof, which solve the problems that traditional motor drive modules in the prior art often have single function and low integration. Therefore, in order to meet the multi-functional requirements of the motor drive module, multiple modules are usually set up to enrich the functions, which occupies a large amount of space in the hair dryer and restricts the miniaturization, high efficiency and intelligent development of the hair dryer.

[0005] To achieve the above purpose, the present invention provides an embedded multi-functional drive power module packaging method, including the following steps:

[0006] Adopt flip-chip bonding technology to weld the chip on the substrate;

[0007] Adopt a compact three-dimensional packaging structure to weld the IPM half-bridge drive circuit, power management circuit and protection circuit on the substrate;

[0008] Place the welded components inside the vacuum chamber of the package and weld them;

[0009] Embed a copper heat sink on the back of the substrate, and at the same time nickel-plate the surface of the copper heat sink;

[0010] Adopt ultrasonic welding to connect the back of the substrate with the copper heat sink.

[0011] Among them, the step of adopting flip-chip bonding technology to weld the chip on the substrate specifically includes:

[0012] Place the flip-chip substrate on the wafer stage;

[0013] Pick up the chip with bumps using a pick-up welding head, ensuring that the active surface with bumps faces downward towards the substrate;

[0014] Use an optical camera to perform alignment adjustment on the bump chip surface and the substrate welding area to ensure the parallelism between the chip and the substrate;

[0015] After the alignment adjustment meets the accuracy requirements, lower the pressure welding head for pressure welding;

[0016] Perform ultrasonic bonding on the connection between the chip pins and the substrate.

[0017] Among them, the steps of adopting a compact three-dimensional packaging structure and welding the IPM half-bridge drive circuit, power management circuit, and protection circuit on the substrate specifically include:

[0018] Set the circuit wiring structure and compact three-dimensional packaging structure required by the circuit on the substrate;

[0019] Assemble the electronic components required for the IPM half-bridge drive circuit, power management circuit, and protection circuit on the circuit wiring structure;

[0020] Connect the electronic components of the IPM half-bridge drive circuit, power management circuit, and protection circuit to the pins of the circuit wiring structure through laser welding.

[0021] Among them, the steps of placing the welding component into the vacuum chamber of the package and welding specifically include:

[0022] Select a metal matrix composite material with a high thermal conductivity coefficient to make the package;

[0023] Open the cover plate of the package and place the welding component into the vacuum chamber of the package;

[0024] Vacuum the vacuum chamber to below 10-3 Pa and inject nitrogen as a protective gas;

[0025] Adopt laser welding for packaging to firmly connect the substrate and the package cover plate.

[0026] The present invention also provides an embedded multi-functional drive power module, adopting the above-mentioned embedded multi-functional drive power module packaging method, including an IPM half-bridge drive circuit sub-module, a power management circuit sub-module, a protection circuit sub-module, and a heat dissipation structure, and the IPM half-bridge drive circuit sub-module, the power management circuit sub-module, the protection circuit sub-module, and the heat dissipation structure are connected in sequence;

[0027] The IPM half-bridge drive circuit sub-module is used to perform motor control at high speed and high precision to meet the requirements of different wind speeds and temperature settings of the hair dryer;

[0028] The power management circuit sub-module is used to achieve wide-voltage-range input, high-efficiency conversion, and stable output, improving the energy efficiency ratio of the hair dryer;

[0029] The protection circuit sub-module is used to monitor the temperature and operating current of the IPM half-bridge structure in real time;

[0030] The heat dissipation structure is used to quickly conduct the heat generated by the chip to the outside of the package, ensuring the stable operation of the module in a high-temperature environment.

[0031] Among them, the IPM half-bridge drive circuit sub-module includes a PWM control unit, a speed feedback unit, and an algorithm selection unit, and the PWM control unit, the speed feedback unit, and the algorithm selection unit are connected in sequence;

[0032] The PWM control unit is used to finely adjust the motor speed and temperature by adjusting the duty cycle and frequency of the PWM signal;

[0033] The speed feedback unit is used to use a Hall sensor to monitor the motor speed in real time, compare the speed signal with a preset value, and adjust the duty cycle of the PWM signal through the PID algorithm to achieve stable speed control;

[0034] The algorithm selection unit is used to select the PWM control unit to control the motor when the speed signal does not reach the preset value, and select the speed feedback unit to control after reaching the preset value.

[0035] Among them, the power management circuit sub-module includes a wide-voltage-range input unit, a high-efficiency conversion unit, and a stable output unit, and the wide-voltage-range input unit, the high-efficiency conversion unit, and the stable output unit are connected in sequence;

[0036] The wide-voltage-range input unit is used to use a linear voltage regulator with a wide input voltage range;

[0037] The high-efficiency conversion unit is used to use a DC-DC converter with high conversion efficiency, and at the same time select low-loss electronic components to reduce the heat generation of the circuit;

[0038] The stable output unit is used to set a preset range of voltage. When the input voltage deviates from the preset range, the output voltage is stabilized by adjusting the duty cycle or frequency of the PWM signal. If the adjustment is ineffective, the power supply is cut off emergently.

[0039] Among them, the protection circuit sub-module includes an overcurrent monitoring unit and an overheat monitoring unit, and the overcurrent monitoring unit and the overheat monitoring unit are connected;

[0040] The overcurrent monitoring unit is used to set the IGBT current sensor to detect the current. When the current exceeds the set safety threshold, the gate voltage of the IGBT is gradually reduced through soft turn-off technology, so that the conduction current of the IGBT gradually decreases, reducing the voltage impact during turn-off. At the same time, an overcurrent fault signal is output.

[0041] The overheat monitoring unit is used to set a temperature sensor for temperature monitoring. When the temperature exceeds the overheat disconnection threshold, the PWM control unit adjusts the temperature and outputs an overheat fault signal at the same time. When the temperature drops to the overheat reset threshold, the circuit automatically resumes normal operation.

[0042] Among them, the heat dissipation structure includes a heat pipe vapor chamber, a plurality of large heat sinks, a plurality of small heat sinks, a heat pipe connection plate and a plurality of heat pipes. The plurality of large heat sinks are fixedly connected to the heat pipe vapor chamber and are sequentially distributed on one side of the heat pipe vapor chamber. The plurality of small heat sinks are respectively fixedly connected to the corresponding large heat sinks and are sequentially distributed on both sides of the large heat sinks. The heat pipe connection plate is arranged on one side of the heat pipe vapor chamber and is located between the plurality of large heat sinks. One ends of the plurality of heat pipes are fixedly connected to the heat pipe connection plate, and the other ends of the plurality of heat pipes are respectively arranged between two adjacent large heat sinks.

[0043] An embedded multi-functional drive power module and packaging method of the present invention use flip-chip bonding technology to weld the chip on the substrate; adopt a compact three-dimensional packaging structure to weld the IPM half-bridge drive circuit, power management circuit and protection circuit on the substrate; place the welded components inside the vacuum cavity of the package and weld them; embed a copper heat pipe vapor chamber on the back of the substrate and nickel-plate the surface of the copper heat pipe vapor chamber at the same time; use ultrasonic welding to connect the back of the substrate and the copper heat pipe vapor chamber; thus, the chip, IPM half-bridge drive circuit, power management circuit and protection circuit are packaged in one package, significantly improving the integration of the motor drive module, making its functions diversified, and at the same time ensuring the heat dissipation effect by installing the heat pipe vapor chamber, thereby enabling the hair dryer to develop in the direction of miniaturization, high efficiency and intelligence. Description of the Drawings

[0044] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art.

[0045] Figure 1 It is a flowchart of the steps of the packaging method of the embedded multi-functional drive power module of the present invention.

[0046] Figure 2 It is a flowchart of the steps of welding the chip on the substrate by using flip-chip bonding technology of the present invention.

[0047] Figure 3It is a flow chart of the steps of the present invention adopting a compact three-dimensional packaging structure and soldering the IPM half-bridge drive circuit, power management circuit and protection circuit on a substrate.

[0048] Figure 4 It is a flow chart of the steps of the present invention for placing the soldered components inside the vacuum chamber of the package and soldering.

[0049] Figure 5 It is a schematic diagram of the embedded multi-functional drive power module of the present invention.

[0050] Figure 6 It is a schematic diagram of the IPM half-bridge drive circuit sub-module of the present invention.

[0051] Figure 7 It is a schematic diagram of the power management circuit sub-module of the present invention.

[0052] Figure 8 It is a schematic diagram of the protection circuit sub-module of the present invention.

[0053] Figure 9 It is a structural schematic diagram of the heat dissipation structure of the present invention.

[0054] Figure 10 It is a front view of the heat dissipation structure of the present invention.

[0055] 1 - IPM half-bridge drive circuit sub-module, 101 - PWM control unit, 102 - speed feedback unit, 103 - algorithm selection unit, 2 - power management circuit sub-module, 201 - wide voltage range input unit, 202 - high-efficiency conversion unit, 203 - stable output unit, 3 - protection circuit sub-module, 301 - overcurrent monitoring unit, 302 - overheat monitoring unit, 4 - heat dissipation structure, 401 - heat sink plate, 402 - large heat sink, 403 - small heat sink, 404 - heat pipe connecting plate, 405 - heat pipe. Specific Embodiments

[0056] The following details the embodiments of the present invention. The examples of the embodiments are shown in the drawings. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present invention, and should not be construed as a limitation to the present invention.

[0057] Please refer to Figures 1 to 4 , the present invention provides a method for packaging an embedded multi-functional drive power module, including the following steps:

[0058] Adopt the flip-chip bonding technology to solder the chips on the substrate;

[0059] Specifically include:

[0060] Place the flip-chip bonded substrate on the wafer stage;

[0061] Pick up the chip with bumps using a pick-up welding head, ensuring that the active surface with bumps faces downwards towards the substrate;

[0062] Use an optical camera to perform alignment adjustment on the bump chip surface and the substrate welding area to ensure the parallelism between the chip and the substrate;

[0063] After the alignment adjustment meets the accuracy requirements, lower the pressure welding head for pressure welding;

[0064] Perform ultrasonic bonding at the connection between the chip pins and the substrate.

[0065] Adopt a compact three-dimensional packaging structure and weld the IPM half-bridge drive circuit, power management circuit, and protection circuit on the substrate;

[0066] Specifically include:

[0067] Set the circuit wiring structure and compact three-dimensional packaging structure required for the circuit on the substrate;

[0068] Assemble the electronic components required for the IPM half-bridge drive circuit, power management circuit, and protection circuit on the circuit wiring structure;

[0069] Connect the electronic components of the IPM half-bridge drive circuit, power management circuit, and protection circuit to the pins of the circuit wiring structure through laser welding.

[0070] Place the welded component inside the vacuum cavity of the package and weld it;

[0071] Specifically include:

[0072] Select a metal matrix composite material with a high thermal conductivity coefficient to make the package;

[0073] Open the cover plate of the package and place the welded component into the vacuum cavity of the package;

[0074] Vacuum the vacuum cavity to below 10-3 Pa and inject nitrogen as the protective gas;

[0075] Adopt laser welding for packaging to firmly connect the substrate and the package cover plate.

[0076] Embed a copper heat sink 401 on the back of the substrate, and at the same time nickel-plate the surface of the copper heat sink 401;

[0077] Connect the back of the substrate and the copper heat sink 401 by ultrasonic welding.

[0078] Please refer to Figures 5 to 10 , the present invention also provides an embedded multi-functional drive power module, specifically including:

[0079] The IPM half-bridge drive circuit sub-module 1 is used to perform motor control at high speed and with high precision to meet the requirements of different wind speeds and temperature settings of the hair dryer;

[0080] Specifically, it includes:

[0081] The PWM control unit 101 is used to finely adjust the motor speed and temperature by adjusting the duty cycle and frequency of the PWM signal;

[0082] A PWM controller or microprocessor is used to generate the PWM signal, and the duty cycle of the PWM signal is changed by changing the count value of the counter or using a comparator. When the duty cycle increases, the effective voltage time received by the motor increases, and the average input power increases, thereby increasing the speed. When the duty cycle decreases, the effective voltage time received by the motor decreases, and the average input power decreases, thereby reducing the speed;

[0083] At the same time, the frequency of the PWM signal is set in the PWM controller or chip. When the PWM is high frequency: the speed response speed of the motor is relatively fast, but the speed fluctuation may increase. At the same time, high-frequency PWM helps to reduce the electromagnetic noise and mechanical noise of the motor. When the PWM is low frequency: the speed response speed of the motor is relatively slow, but the speed fluctuation is relatively small. Low-frequency PWM may cause relatively large electromagnetic noise and mechanical noise of the motor; thus, intelligent speed regulation can play a role in energy saving and noise reduction, maximizing energy consumption, and at the same time ensuring the service life of the motor.

[0084] The speed feedback unit 102 is used to use a Hall sensor to real-time monitor the speed of the motor, compare the speed signal with a preset value, and adjust the duty cycle of the PWM signal through the PID algorithm to achieve stable speed control;

[0085] After the Hall sensor converts the magnetic field change into an electrical signal, the speed signal is obtained through circuit processing, and the speed signal is collected into the control system for further processing and analysis; at the same time, the preset value (speed) of the motor is set in the control system, and then the actual speed signal collected by the Hall sensor is compared with the target speed, the deviation between the two is calculated, and the deviation is used as the input of the PID controller; thus, the PID controller calculates the adjustment amount according to the deviation, converts the adjustment amount into the duty cycle adjustment value of the PWM signal, and finally changes the input power of the motor by adjusting the duty cycle of the PWM signal, thereby achieving the control of the motor speed; thus, intelligent speed regulation can play a role in energy saving and noise reduction, maximizing energy consumption, and at the same time ensuring the service life of the motor.

[0086] The algorithm selection unit 103 is used to select the PWM control unit 101 to control the motor when the speed signal does not reach the preset value, and select the speed feedback unit 102 to control after reaching the preset value.

[0087] Through the dual cooperation of PWM and speed feedback, the precise control of the motor speed and temperature can be fully guaranteed, intelligent speed regulation can be carried out, which can play the role of energy saving, noise reduction and maximizing energy consumption, and at the same time, the service life of the motor can be guaranteed.

[0088] The power management circuit sub-module 2 is used to achieve wide voltage range input, high-efficiency conversion and stable output, and improve the energy efficiency ratio of the hair dryer;

[0089] Specifically include:

[0090] The wide voltage range input unit 201 is used to adopt a linear voltage regulator with a wide input voltage range;

[0091] The wide voltage range input enables the power management circuit to cope with different input voltage conditions, thus enhancing the adaptability and flexibility of the entire system. This means that no matter how the input power voltage fluctuates, the system can work stably and will not cause failures or performance degradation due to voltage mismatch.

[0092] The high-efficiency conversion unit 202 is used to adopt a DC-DC converter with high conversion efficiency and select low-loss electronic components to reduce the heat generation of the circuit;

[0093] The high-efficiency conversion unit 202 significantly reduces the heat generation and energy loss of the circuit by adopting a DC-DC converter with high conversion efficiency and selecting low-loss electronic components. This not only improves the energy efficiency ratio of the system but also extends the service life of the equipment because the risk of component damage caused by overheating is reduced.

[0094] The stable output unit 203 is used to set a preset range of voltage. When the input voltage deviates from the preset range, the output voltage is stabilized by adjusting the duty cycle or frequency of the PWM signal, and if the adjustment is ineffective, the power supply is cut off emergently.

[0095] The stable output unit 203 ensures the stability and reliability of the output voltage by setting a preset range of voltage and monitoring and adjusting the output voltage in real time. When the input voltage deviates from the preset range, the system can quickly respond and stabilize the output voltage by adjusting the duty cycle or frequency of the PWM signal. If the adjustment is ineffective, the system will cut off the power supply emergently to prevent equipment damage or safety accidents.

[0096] The protection circuit sub-module 3 is used to monitor the temperature and working current of the IPM half-bridge structure in real time;

[0097] Specifically include:

[0098] The overcurrent monitoring unit 301 is used to set the IGBT current sensor to detect the current. When the current exceeds the set safety threshold, the gate voltage of the IGBT is gradually reduced through the soft turn-off technology, so that the conduction current of the IGBT gradually decreases, reducing the voltage impact during turn-off. At the same time, an overcurrent fault signal is output.

[0099] The overheat monitoring unit 302 is used to set the temperature sensor for temperature monitoring. When the temperature exceeds the overheat disconnection threshold, the PWM control unit 101 adjusts the temperature and outputs an overheat fault signal at the same time. When the temperature drops to the overheat reset threshold, the circuit automatically resumes normal operation.

[0100] Through the above two protection circuit methods, the motor is monitored in real time for overcurrent and overheat. At the same time, corresponding countermeasures are taken when abnormalities are detected to ensure the safe shutdown of the hair dryer in case of abnormalities.

[0101] The heat dissipation structure 4 is used to quickly conduct the heat generated by the chip to the outside of the package to ensure the stable operation of the module in a high-temperature environment.

[0102] Specifically, it includes:

[0103] The heat dissipation structure 4 includes a heat pipe plate 401, a plurality of large heat sinks 402, a plurality of small heat sinks 403, a heat pipe connection plate 404 and a plurality of heat pipes 405. A plurality of the large heat sinks 402 are fixedly connected to the heat pipe plate 401 and are sequentially distributed on one side of the heat pipe plate 401. A plurality of the small heat sinks 403 are respectively fixedly connected to the corresponding large heat sinks 402 and are sequentially distributed on both sides of the large heat sinks 402. The heat pipe connection plate 404 is arranged on one side of the heat pipe plate 401 and is located between a plurality of the large heat sinks 402. One ends of a plurality of the heat pipes 405 are fixedly connected to the heat pipe connection plate 404, and the other ends of a plurality of the heat pipes 405 are respectively arranged between two adjacent large heat sinks 402.

[0104] Among them, the heat pipe plate 401 can absorb the temperature inside the package. At the same time, by using the method of combining large heat sinks 402 and small heat sinks 403, the heat of the heat pipe plate 401 can be quickly absorbed and dissipated. When the fan blows out cold air, it contacts the heat pipe connection plate 404, and then the air diffuses between a plurality of large heat sinks 402 with the heat pipe connection plate 404 as the center, and relies on the heat pipes 405 to absorb the heat of the heat pipe plate 401 again, thereby effectively improving the heat dissipation effect.

[0105] The above disclosure is only one or more preferred embodiments of the present application, and cannot be used to limit the scope of rights of the present application. Those of ordinary skill in the art can understand all or part of the processes of implementing the above embodiments, and the equivalent changes made according to the claims of the present application still fall within the scope covered by the present application.

Claims

1. An encapsulation method for an embedded multi-functional drive power module, characterized in that, It includes the following steps: Adopt flip-chip technology to weld the chip on the substrate; Adopt a compact three-dimensional packaging structure to weld the IPM half-bridge drive circuit, power management circuit, and protection circuit on the substrate; Place the welded component inside the vacuum cavity of the package and weld it; Embed a copper heat sink on the back of the substrate, and at the same time nickel-plate the surface of the copper heat sink; Adopt ultrasonic welding to connect the back of the substrate with the copper heat sink.

2. The embedded multi-functional drive power module packaging method according to claim 1, characterized in that The step of adopting flip-chip technology to weld the chip on the substrate specifically includes: Place the flip-chip substrate on the wafer stage; Pick up the chip with bumps using a pick-up soldering head, ensuring that the active surface with bumps faces downwards towards the substrate; Use an optical camera to perform alignment adjustment on the bump chip surface and the substrate welding area to ensure the parallelism between the chip and the substrate; After the alignment adjustment meets the accuracy requirements, lower the bonding head for bonding; Perform ultrasonic bonding on the connection between the chip pins and the substrate.

3. The embedded multi-functional drive power module packaging method according to claim 2, characterized in that The step of adopting a compact three-dimensional packaging structure to weld the IPM half-bridge drive circuit, power management circuit, and protection circuit on the substrate specifically includes: Set the circuit wiring structure and compact three-dimensional packaging structure required by the circuit on the substrate; Assemble the electronic components required for the IPM half-bridge drive circuit, power management circuit, and protection circuit on the circuit wiring structure; Connect the electronic components of the IPM half-bridge drive circuit, power management circuit, and protection circuit with the pins of the circuit wiring structure through laser welding.

4. The embedded multi-functional drive power module packaging method according to claim 3, characterized in that The step of placing the welded component inside the vacuum cavity of the package and welding it specifically includes: Select a metal matrix composite material with a high thermal conductivity coefficient to make the package; Open the cover of the package and place the welded component into the vacuum cavity of the package; Vacuum the vacuum cavity to below 10-3 Pa and inject nitrogen as the protective gas; Adopt laser welding for packaging to firmly connect the substrate and the package cover.

5. An embedded multi-functional drive power module, adopting the embedded multi-functional drive power module packaging method according to claim 4, characterized in that It includes an IPM half-bridge drive circuit sub-module, a power management circuit sub-module, a protection circuit sub-module, and a heat dissipation structure, and the IPM half-bridge drive circuit sub-module, the power management circuit sub-module, the protection circuit sub-module, and the heat dissipation structure are connected in sequence; The IPM half-bridge drive circuit sub-module is used to perform motor control at high speed and high precision to meet the requirements of different wind speeds and temperature settings of the hair dryer; The power management circuit sub-module is used to achieve wide voltage range input, high-efficiency conversion, and stable output, and improve the energy efficiency ratio of the hair dryer; The protection circuit sub-module is used to monitor the temperature and working current of the IPM half-bridge structure in real time; The heat dissipation structure is used to quickly conduct the heat generated by the chip to the outside of the package to ensure the stable operation of the module in a high-temperature environment.

6. The embedded multi-functional drive power module according to claim 5, wherein the IPM half-bridge drive circuit sub-module includes a PWM control unit, a speed feedback unit, and an algorithm selection unit, and the PWM control unit, the speed feedback unit, and the algorithm selection unit are connected in sequence; the PWM control unit is configured to finely adjust the motor speed and temperature by adjusting the duty cycle and frequency of the PWM signal; the speed feedback unit is configured to use a Hall sensor to monitor the motor speed in real time, compare the speed signal with a preset value, and adjust the duty cycle of the PWM signal through a PID algorithm to achieve stable speed control; the algorithm selection unit is configured to select the PWM control unit to control the motor when the speed signal does not reach the preset value, and select the speed feedback unit to control after reaching the preset value.

7. The embedded multi-functional drive power module according to claim 6, wherein the power management circuit sub-module includes a wide voltage range input unit, a high-efficiency conversion unit, and a stable output unit, and the wide voltage range input unit, the high-efficiency conversion unit, and the stable output unit are connected in sequence; the wide voltage range input unit is configured to use a linear voltage regulator with a wide input voltage range; the high-efficiency conversion unit is configured to use a DC-DC converter with high conversion efficiency, and at the same time select low-loss electronic components to reduce the heat generation of the circuit; the stable output unit is configured to set a preset range of the voltage. When the input voltage deviates from the preset range, the output voltage is stabilized by adjusting the duty cycle or frequency of the PWM signal. If the adjustment is ineffective, the power supply is cut off emergently.

8. The embedded multi-functional drive power module according to claim 7, wherein the protection circuit sub-module includes an overcurrent monitoring unit and an overheat monitoring unit, and the overcurrent monitoring unit and the overheat monitoring unit are connected; the overcurrent monitoring unit is configured to set an IGBT current sensor to detect the current. When the current exceeds the set safety threshold, the gate voltage of the IGBT is gradually reduced through soft turn-off technology, so that the conduction current of the IGBT gradually decreases, reducing the voltage impact during turn-off, and at the same time outputting an overcurrent fault signal; the overheat monitoring unit is configured to set a temperature sensor to monitor the temperature. When the temperature exceeds the overheat disconnection threshold, the PWM control unit adjusts the temperature, and at the same time outputs an overheat fault signal. When the temperature drops to the overheat reset threshold, the circuit automatically resumes normal operation.

9. The embedded multi-functional drive power module according to claim 8, wherein The heat dissipation structure includes a vapor chamber, a plurality of large heat sinks, a plurality of small heat sinks, a heat pipe connecting plate, and a plurality of heat pipes. A plurality of the large heat sinks are fixedly connected to the vapor chamber and are sequentially distributed on one side of the vapor chamber. A plurality of the small heat sinks are respectively fixedly connected to the corresponding large heat sinks and are sequentially distributed on both sides of the large heat sinks. The heat pipe connecting plate is disposed on one side of the vapor chamber and is located between a plurality of the large heat sinks. One ends of a plurality of the heat pipes are fixedly connected to the heat pipe connecting plate, and the other ends of a plurality of the heat pipes are respectively disposed between two adjacent large heat sinks.

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