Transfer platform, chip bonding equipment and production system of TCB process

Abstract

The invention provides a transfer platform for a TCB process, chip bonding equipment and a production system, the transfer platform for the TCB process is used for driving a substrate to move in the horizontal direction, the transfer platform for the TCB process comprises a base, two Y-axis assemblies are installed on the base, and first connecting pieces are arranged on the upper sides of the Y-axis assemblies; the cross beam is located above the base, a first guide rail is arranged on one side of the cross beam, the first connecting piece is connected to the first guide rail through a sliding block, and the sliding block can slide in the first guide rail in the X-axis direction; the two X-axis assemblies comprise second guide rails installed on the upper surface of the cross beam, and the first guide rails are parallel to the second guide rails and located between the second guide rails and the first connecting pieces; and the mounting base is mounted on the X-axis assembly, and the X-axis assembly is used for driving the mounting base to move above the cross beam in the X-axis direction. According to the technical scheme of the embodiment, the Y-axis assemblies can be prevented from being extruded by the cross beam to deform, so that the parallel precision between the two Y-axis assemblies is ensured, and the bonding success rate of the chip and the substrate is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of substrate transfer, and particularly relates to a transfer platform for a TCB process, a chip bonding device, and a production system. Background Art

[0002] In the production process of chips, a chip bonding device needs to achieve bonding between a chip and a substrate through high temperature and high pressure, and the alignment accuracy required for bonding between the chip and the substrate is extremely high. Currently, the bonding between the chip and the substrate is usually completed by using the Thermal Compression Bonding (TCB) process.

[0003] In the prior art, the substrate is installed on a mounting seat, the mounting seat is installed on a cross beam through an X-axis guide rail, the cross beam is installed on a base through two Y-axis guide rails, and the substrate moves horizontally through the X-axis guide rail and the Y-axis guide rail to achieve the alignment of the solder balls of the substrate and the solder balls of the chip; after the alignment is completed, the substrate and the chip are heated to 150°C to 200°C, the solder balls of the substrate and the solder balls of the chip are pressed together, and the temperature is quickly cooled below the melting point of the solder balls to complete the bonding between the chip and the substrate. However, the existing base and cross beam will deform due to thermal expansion and contraction under the temperature difference during chip bonding, squeezing the Y-axis guide rail, resulting in deformation of the Y-axis guide rail and a reduction in the movement direction accuracy of the substrate in the Y-axis direction, and a low bonding success rate between the chip and the substrate. Summary of the Invention

[0004] An embodiment of the present invention provides a transfer platform for a TCB process, a chip bonding device, and a production system, which can ensure the parallel accuracy between two Y-axis components and improve the bonding success rate between a chip and a substrate.

[0005] In a first aspect, an embodiment of the present invention provides a transfer platform for a TCB process, and the transfer platform for the TCB process is used to drive a substrate to move horizontally. The transfer platform for the TCB process includes: A base, two Y-axis components are installed on the base, and a first connecting member is arranged on the upper side of the Y-axis component; A cross beam, the cross beam is located above the base, a first guide rail is arranged on one side of the cross beam, and the first connecting member is connected to the first guide rail through a slider, and the slider can slide along the X-axis direction in the first guide rail; Two X-axis components, the X-axis component includes a second guide rail, the second guide rail is installed on the upper surface of the cross beam, and the first guide rail is parallel to the second guide rail, and the first guide rail is located between the second guide rail and the first connecting member; A mounting seat, the mounting seat is installed on the X-axis component, and the X-axis component is used to drive the mounting seat to move along the X-axis direction above the cross beam.

[0006] According to some embodiments of the present invention, the Y-axis assembly includes a Y-axis linear motor and a third guide rail. The Y-axis linear motor can drive the cross beam to slide along the Y-axis direction in the third guide rail through the first connecting member. The X-axis assembly includes an X-axis linear motor, and the X-axis linear motor is used to drive the mounting base to move along the X-axis direction.

[0007] According to some embodiments of the present invention, it further includes: a controller, and the controller is electrically connected to the Y-axis linear motor and the X-axis linear motor.

[0008] According to some embodiments of the present invention, it further includes: a first photoelectric switch, a second photoelectric switch, a first baffle, and a second baffle. The first photoelectric switch and the second photoelectric switch are fixed to the base, the first photoelectric switch and the second photoelectric switch are respectively electrically connected to the controller, the first baffle and the second baffle are fixed to the cross beam. When the cross beam is located at the first end of the Y-axis assembly, the first baffle is located inside the groove of the first photoelectric switch. When the cross beam is located at the second end of the Y-axis assembly, the second baffle is located inside the groove of the second photoelectric switch.

[0009] According to some embodiments of the present invention, the base is provided with a grating scale, the cross beam is provided with a grating reading head, and the grating reading head is electrically connected to the controller.

[0010] According to some embodiments of the present invention, it further includes: two anti-collision heads, and the anti-collision heads are respectively arranged at both ends of the cross beam along the X-axis direction, and the anti-collision heads can abut against the mounting base.

[0011] According to some embodiments of the present invention, when the number of the first guide rails is two, the first guide rails are respectively arranged at both ends of the same side of the cross beam.

[0012] According to some embodiments of the present invention, the material of the base is marble, and the material of the cross beam is marble.

[0013] In a second aspect, an embodiment of the present invention further provides a chip bonding device, including the transfer platform of the TCB process as described in the first aspect.

[0014] In a third aspect, an embodiment of the present invention further provides a production system, including at least one transfer platform of the TCB process as described in the first aspect, or including at least one chip bonding device as described in the second aspect.

[0015] The transfer platform of the TCB process provided by the embodiment of the present invention includes: a base, two Y-axis components are installed on the base, and a first connecting member is arranged on the upper side of the Y-axis component; a cross beam, the cross beam is located above the base, a first guide rail is arranged on one side of the cross beam, the first connecting member is connected to the first guide rail through a slider, and the slider can slide in the first guide rail along the X-axis direction; two X-axis components, the X-axis component includes a second guide rail, the second guide rail is installed on the upper surface of the cross beam, and the first guide rail is parallel to the second guide rail, and the first guide rail is located between the second guide rail and the first connecting member; a mounting seat, the mounting seat is installed on the X-axis component, and the X-axis component is used to drive the mounting seat to move along the X-axis direction above the cross beam. According to the technical solution of this embodiment, through the first guide rail and the slider of the present application, when the transfer platform is in a high-temperature environment, the first guide rail fixed to the cross beam moves along the X-axis direction towards the direction close to the first connecting member, and the slider fixed to the first connecting member moves along the X-axis direction towards the direction close to the cross beam, and a relative movement occurs between the first guide rail and the slider, preventing the Y-axis component from being deformed by the extrusion of the cross beam, thereby ensuring the parallelism accuracy between the two Y-axis components and improving the bonding success rate between the chip and the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic structural diagram of a transfer platform of the TCB process provided by an embodiment of the present invention; Figure 2 is a schematic structural diagram of a first guide rail and a slider provided by another embodiment of the present invention; Figure 3 is a partial schematic diagram of a transfer platform of the TCB process provided by another embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0017] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0018] It should be noted that although the functional modules are divided in the device schematic diagram and the logical order is shown in the flowchart, in some cases, the steps shown or described may be executed in a different order from the module division in the device or the flowchart in the flowchart. Terms such as "first" and "target" in the specification, claims or the above-mentioned drawings are used to distinguish similar objects and do not have to be used to describe a specific order or sequence.

[0019] The transfer platform of the TCB process provided by the embodiment of the present invention includes: a base, two Y-axis components are installed on the base, and a first connecting piece is arranged on the upper side of the Y-axis component; a cross beam, the cross beam is located above the base, a first guide rail is arranged on one side of the cross beam, the first connecting piece is connected to the first guide rail through a slider, and the slider can slide in the first guide rail along the X-axis direction; two X-axis components, the X-axis component includes a second guide rail, the second guide rail is installed on the upper surface of the cross beam, and the first guide rail is parallel to the second guide rail, and the first guide rail is located between the second guide rail and the first connecting piece; a mounting seat, the mounting seat is installed on the X-axis component, and the X-axis component is used to drive the mounting seat to move along the X-axis direction above the cross beam. According to the technical solution of this embodiment, through the first guide rail and the slider of the present application, when the transfer platform is in a high-temperature environment, the first guide rail fixed to the cross beam moves along the X-axis direction towards the direction close to the first connecting piece, and the slider fixed to the first connecting piece moves along the X-axis direction towards the direction close to the cross beam, and relative movement occurs between the first guide rail and the slider, preventing the Y-axis component from being deformed by the extrusion of the cross beam, thereby ensuring the parallelism accuracy between the two Y-axis components and improving the bonding success rate between the chip and the substrate.

[0020] Referring to Figures 1 to 3 , the embodiment of the present application provides a transfer platform for the TCB process. The transfer platform for the TCB process is used to drive the substrate to move in the horizontal direction. The transfer platform for the TCB process includes: A base 100, two Y-axis components are installed on the base 100, and a first connecting piece 300 is arranged on the upper side of the Y-axis component; A cross beam 400, the cross beam 400 is located above the base 100, a first guide rail 510 is arranged on one side of the cross beam 400, the first connecting piece 300 is connected to the first guide rail 510 through a slider 520, and the slider 520 can slide in the first guide rail 510 along the X-axis direction; Two X-axis components, the X-axis component includes a second guide rail 600, the second guide rail 600 is installed on the upper surface of the cross beam 400, and the first guide rail 510 is parallel to the second guide rail 600, and the first guide rail 510 is located between the second guide rail 600 and the first connecting piece; A mounting seat 700, the mounting seat 700 is installed on the X-axis component, and the X-axis component is used to drive the mounting seat 700 to move along the X-axis direction above the cross beam 400.

[0021] It should be noted that grooves are provided at both ends of the base 100, and the Y-axis components are arranged at the grooves of the base 100. The grooves can provide rough calibration for the parallel arrangement of the two Y-axis components, and can make the Y-axis components have a height difference from the X-axis components, reducing the height difference between the base 100 and the cross beam 400, thereby reducing the deformation amount of the cross beam 400 under the large vertical pressure in the high-temperature environment, so as to ensure the parallelism accuracy of the substrate during bonding.

[0022] It should be noted that in this embodiment, the first connecting member 300 is an L-shaped connecting plate, which realizes the connection between the Y-axis assembly and the cross beam 400 through a plate-like structure, so that the abutting area between the L-shaped connecting plate and the cross beam 400 is larger, providing a more stable support for the large pressure received by the cross beam 400 during bonding. Moreover, there is a certain distance between one side of the cross beam 400 close to the Y-axis assembly and the vertical plane of the L-shaped connecting plate close to the cross beam 400, so that there is a certain moving space between the first guide rail 510 and the slider 520, preventing the cross beam and the first connecting member from colliding after the relative movement of the first guide rail 510 and the slider 520.

[0023] It should be noted that in the TCB process, after the alignment of the chip and the substrate is completed, the chip and the substrate are heated, and then a large pressure is applied to the chip and the substrate to complete the bonding between the chip and the substrate; therefore, the mounting seat 700 needs to bear a large vertical pressure in a high-temperature environment. By providing the base 100 and the cross beam 400, vertical support is provided for the substrate, preventing the mounting seat 700 from deforming under high-temperature and large pressure, resulting in the substrate placed on the mounting seat 700 not being horizontally placed, which affects the bonding accuracy between the substrate and the chip.

[0024] It should be noted that the first guide rail 510 is parallel to the second guide rail 600. When setting the first guide rail 510, there is a certain distance between the first guide rail 510 and the second guide rail 600, or the first guide rail 510 and the second guide rail 600 are not on the same straight line, preventing the mounting seat 700 from colliding with the first connecting member 300 during the moving process.

[0025] It should be noted that the mounting seat 700 is used to place the substrate; the mounting seat 700 is provided with through holes, and the through holes are communicated with the vacuum adsorption device; in the TCB process, the substrate is placed on the mounting seat 700, and the substrate is adsorbed on the mounting seat 700 through the vacuum adsorption device to realize the fixation of the substrate on the mounting seat 700. Before the bonding between the substrate and the chip, the substrate is moved horizontally through the transfer platform.

[0026] It should be noted that in the prior art, the first connecting member 300 is fixed to the Y-axis assembly, and the cross beam 400 is fixed to the first connecting member 300. When the substrate is heated, the cross beam 400 will also be affected by the high temperature and expand and deform, thereby generating a thrust force on the first connecting member 300. The direction of the thrust force received by the first connecting member 300 is not fixed. The cross beam 400 exerts extrusion on the Y-axis assembly through the first connecting member 300, resulting in deformation of the guide rail of the Y-axis assembly. After the pressure bonding between the chip and the substrate is completed and the temperature is lowered below the melting point of the solder balls, the deformation of the deformed Y-axis assembly is fixed, and the parallelism accuracy of the two Y-axis assemblies decreases. When the cross beam 400 moves along the guide rail of the Y-axis assembly, there will be a displacement in the X-axis direction, that is, when the mounting base 700 moves according to the original Y-axis movement stroke, the solder balls on the substrate are misaligned with the solder balls on the chip, resulting in the bonding failure between the substrate and the chip.

[0027] It should be noted that in this application, during the alignment process of the solder balls on the substrate and the solder balls on the chip, the substrate is mounted on the mounting base 700, and the mounting base 700 is moved in the X-axis direction through the X-axis assembly, and the mounting base 700 is moved in the Y-axis direction through the Y-axis assembly and the cross beam 400. The first guide rail 510 is fixed to the cross beam 400, the slider 520 is fixed to the first connecting member 300, and the slider 520 can move along the X-axis direction on the first guide rail 510. The first connecting member 300 is fixed to the Y-axis assembly. When the transfer platform is in a high-temperature environment, the first guide rail 510 fixed to the cross beam 400 moves in the direction close to the first connecting member 300 due to the deformation of the cross beam 400, and the slider 520 fixed to the first connecting member 300 moves in the direction close to the cross beam 400 due to the deformation of the first connecting member 300. The Y-axis assembly fixed to the base 100 generates a horizontal displacement due to the deformation of the base 100. Both the first guide rail 510 and the slider 520 generate displacements in the X-axis direction, and the first guide rail 510 and the slider 520 generate relative displacements. When the transfer platform rapidly cools down from a high-temperature environment due to the TCB process, the first guide rail 510 fixed to the cross beam 400 moves in the direction away from the first connecting member 300 due to the deformation of the cross beam 400, and the slider 520 fixed to the first connecting member 300 moves in the direction away from the cross beam 400 due to the deformation of the first connecting member 300. The Y-axis assembly fixed to the base 100 generates a horizontal displacement due to the deformation of the base 100. Both the first guide rail 510 and the slider 520 generate displacements in the X-axis direction, and the first guide rail 510 and the slider 520 generate relative displacements. By setting the first guide rail 510 and the slider 520, the first connecting member 300 and the cross beam 400 are movably connected. When the transfer platform deforms due to the temperature difference generated by the TCB process, the first connecting member 300 and the Y-axis assembly only have displacements in the X-axis direction, thereby ensuring the parallelism accuracy between the two Y-axis assemblies and improving the bonding success rate between the chip and the substrate.

[0028] In addition, in one embodiment, refer to Figures 1 to 3, the Y-axis assembly includes a Y-axis linear motor and a third guide rail 200. The Y-axis linear motor can drive the crossbeam 400 to slide along the Y-axis direction in the third guide rail 200 through a first connecting piece 300. The X-axis assembly includes an X-axis linear motor, and the X-axis linear motor is used to drive the mounting base 700 to move along the X-axis direction.

[0029] It should be noted that the transfer platform drives the first connecting piece 300 to have a displacement in the Y-axis direction through the Y-axis linear motor, and the first connecting piece 300 drives the crossbeam 400 to make the mounting base 700 have a displacement in the Y-axis direction; the X-axis motor drives the crossbeam 400 to make the mounting base 700 have a displacement in the X-axis direction.

[0030] It should be noted that by driving the mounting base 700 to move in the X-axis and Y-axis directions through the linear motor, the horizontal movement of the mounting base 700 driven by the traditional motor through the transmission structure is reduced, and the movement accuracy of the mounting base 700 in the X-axis and Y-axis directions is higher.

[0031] In addition, in an embodiment, it further includes: A controller, which is electrically connected to the Y-axis linear motor and the X-axis linear motor.

[0032] It should be noted that in the TCB process, the alignment accuracy requirements for the substrate and the chip are extremely high. By controlling the start and stop of the Y-axis linear motor and the X-axis linear motor through the controller, it is convenient to control the horizontal position of the mounting base 700, so as to facilitate the control of the movement and horizontal position of the substrate in the horizontal direction.

[0033] In addition, in an embodiment, referring to Figure 1 and Figure 3 , it further includes: A first optoelectronic switch 11, a second optoelectronic switch 21, a first baffle 12 and a second baffle 22. The first optoelectronic switch 11 and the second optoelectronic switch 21 are fixed to the base 100, the first optoelectronic switch 11 and the second optoelectronic switch 21 are respectively electrically connected to the controller, the first baffle 12 and the second baffle 22 are fixed to the crossbeam 400. When the crossbeam 400 is located at the first end of the Y-axis assembly, the first baffle 12 is located inside the groove of the first optoelectronic switch 11. When the crossbeam 400 is located at the second end of the Y-axis assembly, the second baffle 22 is located inside the groove of the second optoelectronic switch 21.

[0034] It should be noted that the optoelectronic switch is used to limit the movement of the crossbeam 400 in the Y-axis direction. The optoelectronic switch of the present application is a groove-type optoelectronic switch. The groove-type optoelectronic switch includes a groove, a light emitter is arranged at one end inside the groove, and a receiver is arranged at the other end. When the baffle is located inside the groove of the groove-type optoelectronic switch, the receiver cannot receive the light signal emitted by the light emitter, and the receiver sends an electrical signal to the controller, and the controller turns off the Y-axis linear motor.

[0035] In addition, in one embodiment, referring to Figures 1 to 3 , a grating scale 31 is provided on the base 100, and a grating reading head 32 is provided on the cross beam 400. The grating reading head 32 is electrically connected to the controller.

[0036] It should be noted that the grating scale 31 and the grating reading head 32 are used to measure the displacement of the mounting base 700 in the Y-axis direction; due to the high alignment accuracy requirement for the solder balls of the substrate and the solder balls of the chip, therefore, the displacement of the mounting base 700 in the horizontal direction is controlled by the grating scale 31 and the grating reading head 32.

[0037] It should be noted that the grating reading head 32 sends a signal to the controller, and the controller controls the Y-axis linear motor based on the obtained displacement stroke. Adaptively, a grating scale 31 can be installed on one side of the third guide rail 200, the grating scale 31 is parallel to the third guide rail 200, and a grating reading head 32 is installed on the mounting base 700. The grating reading head 32 is electrically connected to the controller, so as to measure the displacements of the mounting base 700 in the X-axis direction and the Y-axis direction respectively through the two grating scales 31 and the two grating reading heads 32.

[0038] It should be noted that in order to reduce the influence of the temperature difference change under the TCB process on the grating scale 31, a grating scale 31 and a grating reading head 32 made of materials with little temperature influence are selected.

[0039] In addition, in one embodiment, referring to Figure 1 and Figure 2 , it further includes: Two anti-collision heads 800 are respectively arranged at both ends of the cross beam 400 along the X-axis direction, and the anti-collision heads 800 can abut against the mounting base 700.

[0040] It should be noted that the anti-collision heads 800 provide limit and buffering functions for the mounting base 700 in the X-axis direction. The anti-collision heads 800 are made of elastic materials such as rubber, and a trigger is arranged at the bottom of the anti-collision heads 800. The trigger is electrically connected to the controller; when the speed of the mounting base 700 is too fast, the mounting base 700 applies pressure to the anti-collision heads 800, the anti-collision heads 800 are deformed, so that the trigger located at the bottom of the anti-collision heads 800 is triggered, and the trigger sends an electrical signal to the controller, and the controller turns off the X-axis linear motor.

[0041] In addition, in one embodiment, referring to Figure 1 and Figure 2 , when the number of the first guide rails 510 is two, the first guide rails 510 are respectively arranged at both ends of the same side of the cross beam 400.

[0042] It should be noted that the first guide rails 510 are all arranged on the same side of the cross beam 400. The first guide rails 510 are arranged at both ends, so that the cross beam 400 is evenly stressed, and it is ensured that the first connecting piece 300 and the cross beam 400 are only subjected to forces in the X-axis direction, ensuring that the flatness accuracy of the two Y-axis components remains unchanged.

[0043] In addition, in one embodiment, the base 100 is made of marble, and the cross beam 400 is made of marble.

[0044] It should be noted that the flatness of the plane after marble processing is high, which can prevent the mounting seat 700 from shaking when moving along the X-axis direction on the third guide rail 200, thereby ensuring the moving accuracy of the substrate in the horizontal direction. Moreover, the marble material has a small deformation amount under the change of temperature difference and good anti-deformation performance, which is beneficial to maintaining the flatness of the plane under high temperature and high pressure, ensuring the horizontal placement of the substrate, and ensuring the parallel accuracy when the substrate is bonded to the chip.

[0045] In addition, the present invention also provides a chip bonding device, including the transfer platform of the TCB process as described above.

[0046] It should be noted that the chip bonding device can be the transfer platform itself of the TCB process, such as a substrate transfer platform, or other devices applying the transfer platform of the TCB process, such as a TCB process device. The specific type of the chip bonding device is not limited in this embodiment, as long as it can apply the above-mentioned transfer platform of the TCB process.

[0047] In addition, the embodiment of the present invention also provides a production system, referring to Figure 1 , including at least one transfer platform of the TCB process as described above, or including at least one chip bonding device as described above.

[0048] It should be noted that the production system can be the chip bonding device itself, or other production equipment applying the chip bonding device, such as a chip production system, etc. The specific type of the production system is not limited in this embodiment, as long as it can apply the above-mentioned transfer platform of the TCB process or the chip bonding device.

[0049] After considering the specification and practicing the disclosed embodiments here, those skilled in the art will easily think of other implementation schemes of the present application. The present application aims to cover any variations, uses or adaptive changes of the present application, and these variations, uses or adaptive changes follow the general principles of the present application and include the common general knowledge or conventional technical means in the technical field not disclosed in the present application.

[0050] It should be understood that the present application is not limited to the exact structures described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present application is only limited by the appended claims.

[0051] The above has specifically described the preferred embodiments of the present invention, but the present invention is not limited to the above-mentioned embodiments. Those skilled in the art can also make various equivalent deformations or substitutions without departing from the spirit of the present invention, and these equivalent deformations or substitutions are all included within the scope defined by the claims of the present invention.

Claims

1. A transfer platform for the TCB process, characterized in that, The transfer platform of the TCB process is used to drive the substrate to move in the horizontal direction. The transfer platform of the TCB process includes: A base, on which two Y-axis components are installed, and a first connecting piece is arranged on the upper side of the Y-axis components; A cross beam, which is located above the base. A first guide rail is arranged on one side of the cross beam. The first connecting piece is connected to the first guide rail through a slider, and the slider can slide in the first guide rail in the X-axis direction; Two X-axis components, the X-axis components include a second guide rail, the second guide rail is installed on the upper surface of the cross beam, and the first guide rail is parallel to the second guide rail. The first guide rail is located between the second guide rail and the first connecting piece; A mounting seat, which is installed on the X-axis component, and the X-axis component is used to drive the mounting seat to move in the X-axis direction above the cross beam.

2. The transfer platform of the TCB process according to claim 1, wherein: The Y-axis component includes a Y-axis linear motor and a third guide rail. The Y-axis linear motor can drive the cross beam to slide in the third guide rail in the Y-axis direction through the first connecting piece. The X-axis component includes an X-axis linear motor, and the X-axis linear motor is used to drive the mounting seat to move in the X-axis direction.

3. The transfer platform of the TCB process according to claim 2, wherein It further includes: A controller, which is electrically connected to the Y-axis linear motor and the X-axis linear motor.

4. The transfer platform of the TCB process according to claim 3, characterized in that, It further includes: A first photoelectric switch, a second photoelectric switch, a first baffle and a second baffle. The first photoelectric switch and the second photoelectric switch are fixed on the base, and the first photoelectric switch and the second photoelectric switch are respectively electrically connected to the controller. The first baffle and the second baffle are fixed on the cross beam. When the cross beam is located at the first end of the Y-axis component, the first baffle is located inside the groove of the first photoelectric switch. When the cross beam is located at the second end of the Y-axis component, the second baffle is located inside the groove of the second photoelectric switch.

5. The transfer platform of the TCB process according to claim 3, wherein: A grating scale is arranged on the base, and a grating reading head is arranged on the cross beam. The grating reading head is electrically connected to the controller.

6. The transfer platform of the TCB process according to claim 3, wherein, It further includes: Two anti-collision heads, which are respectively arranged at both ends of the cross beam in the X-axis direction, and the anti-collision heads can abut against the mounting seat.

7. The transfer platform of the TCB process according to claim 1, wherein: When the number of the first guide rails is two, the first guide rails are respectively arranged at both ends of the same side of the cross beam.

8. The transfer platform of the TCB process according to claim 1, wherein: The material of the base is marble, and the material of the cross beam is marble.

9. A chip bonding device, characterized in that, It includes the transfer platform of the TCB process according to any one of claims 1 to 8.

10. A production system, characterized in that, It includes at least one transfer platform of the TCB process according to any one of claims 1 to 8, or includes the chip bonding device according to claim 9.

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