Wafer hot air blowing type heating device

Abstract

The invention relates to a wafer hot air blowing type heating device which comprises a heating rotating mechanism, a base connecting plate is connected to the heating rotating mechanism, and a left heating rotating connecting plate and a right heating rotating connecting plate are connected to the left side and the right side of the base connecting plate respectively. The left heating rotary connecting plate and the right heating rotary connecting plate are connected with a first heating mechanism and a second heating mechanism which are the same in structure respectively. The working efficiency can be improved.

Description

Technical Field

[0001] The present invention relates to a wafer hot air heating device. Background Art

[0002] With the development of the semiconductor industry, especially the miniaturization of chip sizes and the development of semiconductor packaging towards high integration and miniaturization, many high - requirement packaging processes start to use invisible cutting, and then the wafer or chip with a film attached is completely separated along a predetermined line to obtain independent individuals. Since it is necessary to avoid quality problems such as burrs during the cutting process and ensure that the chips in the wafer are separated by the required gap, after the wafer is expanded with a film, the film will bulge to a certain height. At this time, it is necessary to use heating to shrink the bulged film back so that the separated chips are fixed in the required positions and will not move due to the retraction of the film after blanking. To solve the above problems, a heating device for the expanded wafer is required. Summary of the Invention

[0003] To solve the above - mentioned technical problems, the object of the present invention is to provide a wafer hot air heating device.

[0004] To achieve the above object, the present invention adopts the following technical solutions:

[0005] A wafer hot air heating device includes a heating and rotating mechanism, a base connecting plate is connected to the heating and rotating mechanism, a left heating and rotating connecting plate and a right heating and rotating connecting plate are respectively connected to the left and right sides of the base connecting plate, and a first heating mechanism and a second heating mechanism with the same structure are respectively connected to the left heating and rotating connecting plate and the right heating and rotating connecting plate;

[0006] The first heating mechanism includes a heating substrate, a heat - expanding vertical plate is connected to one side of the heating substrate, a guide rail support plate is connected to the inner side of the heat - expanding vertical plate, a guide rail is connected to the guide rail support plate, a slider is connected to the guide rail, a movable heating component is connected to the slider, a heating window opposite to the heating component is opened on the bottom surface of the heating substrate, a vertical plate is connected to the other side of the heating substrate, a heating cylinder is connected to the inner side of the vertical plate, a driving shaft of the heating cylinder is connected to a heating push plate, a rotating connecting plate is rotatably connected to the heating substrate through a shoulder screw, one side of the rotating connecting plate is connected to a heating shutter for opening and / or closing the heating window, and the other end of the rotating connecting plate is connected to the heating push plate.

[0007] Preferably, in a wafer hot air heating device, a heating outer cover is sleeved on the heating substrate, and uniformly arranged ventilation holes are opened on each surface of the heating outer cover.

[0008] Preferably, for the described wafer hot air heating device, a limiting groove for limiting the movement of the heating baffle is provided on the bottom surface of the heating substrate, and the heating window is located within the limiting groove.

[0009] Preferably, for the described wafer hot air heating device, there are two heating windows, one of which is an 8-inch heating window and the other is a 12-inch heating window.

[0010] Preferably, for the described wafer hot air heating device, the heating assembly includes a heating moving plate. The heating moving plate has an L-shaped structure and one side of it is connected to a slider. The other side of the L-shaped heating moving plate is connected to a heat insulation plate with a square structure. A hot air gun is connected inside the square heat insulation plate. The upper end of the hot air gun is connected to a temperature sensor through a rotary joint. The heating end of the hot air gun faces the heating window. Heat dissipation fins are connected to the outside of the heat insulation plate. A indexing pin fixing plate is connected to the heating moving plate, and an indexing pin is connected to the indexing pin fixing plate. A moving window is provided on the heat expansion upright plate, and a fixed positioning piece connected to the indexing pin is connected to the moving window.

[0011] Preferably, for the described wafer hot air heating device, a sensor support plate is connected to the heat expansion upright plate, and two position sensors are connected to the sensor support plate for sensing the position of the heating moving plate. One of the position sensors is on the same axis as the 8-inch heating window, and the other position sensor is on the same axis as the 12-inch heating window.

[0012] Preferably, for the described wafer hot air heating device, there are two fixed positioning pieces. One of the fixed positioning pieces is on the same axis as the 8-inch heating window, and the other fixed positioning piece is on the same axis as the 12-inch heating window.

[0013] Preferably, for the described wafer hot air heating device, the heating rotation mechanism includes a rotation support plate. One side of the rotation support plate is connected to a bearing fixing seat. A bearing is connected inside the bearing fixing seat. A fixed rotating shaft is inserted through the bearing. The lower end of the fixed rotating shaft is connected to the rotating substrate through an axle clip. The upper end of the fixed rotating shaft is connected to a first synchronous pulley. The other side of the bearing fixing seat is connected to a motor fixing bracket. A speed reducer is connected to the motor fixing bracket. The speed reducer is connected to the motor. The rotating shaft of the speed reducer passes through the motor fixing bracket and is connected to a second synchronous pulley. A synchronous belt is connected between the second synchronous pulley and the first synchronous pulley. An angle limiting component is connected to the bearing fixing seat.

[0014] Preferably, in the wafer hot air heating device, the angle limit assembly comprises a first sensor fixing bracket and a second sensor fixing bracket, the first sensor fixing bracket and the second sensor fixing bracket are connected to the bearing fixing seat at an interval and relative to each other, the first sensor fixing bracket and the second sensor fixing bracket are both connected with sensors, the bearing fixing seat located between the first sensor fixing bracket and the second sensor fixing bracket is connected with a fixing screw, the fixing screw is rotatably connected with an induction sheet fixing plate, the induction sheet fixing plate is connected with an induction sheet that cooperates with the induction of the sensor, and the rotating base plate is connected with a limit block for driving the induction sheet fixing plate to rotate.

[0015] Preferably, in the wafer hot air blowing heating device, the fixing screw is connected to a reset torsion spring for resetting the sensor sheet fixing plate.

[0016] By means of the above scheme, the present invention has at least the following advantages:

[0017] 1. The present invention can provide a suitable heating temperature, which can reach 200-300 degrees. The air flow is blown down through the hot air gun, the heating area is large, the rotating mechanism can rotate quickly, and the heat shrinking efficiency is high.

[0018] 2. The present invention can be compatible with 8 / 12 inch wafers by adjusting the indexing pin, has strong applicability, and can effectively reduce the cost of use.

[0019] 3. The present invention monitors the angle through an angle limit assembly, which can prevent the problem of excessive angle rotation during the heating process and improve the quality of the product.

[0020] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 It is a schematic diagram of the structure of the present invention;

[0023] Figure 2 is a schematic diagram of the internal structure of the first heating mechanism of the present invention;

[0024] Figure 3 yesFigure 2 Structural schematic diagram from another perspective;

[0025] Figure 4 is Figure 2 Structural schematic diagram from the perspective of the other side;

[0026] Figure 5 It is the structural schematic diagram of the heating and rotating mechanism of the present invention. Detailed implementation manners

[0027] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. Usually, the components of the embodiments of the present application described and illustrated herein can be arranged and designed in various different configurations.

[0028] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the present application claimed, but merely represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts fall within the scope of protection of the present application.

[0029] As Figures 1 to 5 shown, a wafer hot air heating device includes a heating and rotating mechanism 2, a base connection plate 3 is connected to the heating and rotating mechanism 2, a left heating and rotating connection plate 4 and a right heating and rotating connection plate 5 are respectively connected to the left and right sides of the base connection plate 3, and a first heating mechanism 1 and a second heating mechanism 6 with the same structure are respectively connected to the left heating and rotating connection plate 4 and the right heating and rotating connection plate 5.

[0030] The structure for heating the product in the present invention is as follows, and it can achieve rapid heating of the product. The structure is as follows:

[0031] The first heating mechanism 1 includes a heating substrate 101. One side of the heating substrate 101 is connected with a heat expansion vertical plate 102. The inner side of the heat expansion vertical plate 102 is connected with a guide rail support plate 103. A guide rail 104 is connected to the guide rail support plate 103. A slider 105 is connected to the guide rail 104. A movable heating component 106 is connected to the slider 105. A heating window 107 opposite to the heating component 106 is formed on the bottom surface of the heating substrate 101. The other side of the heating substrate 101 is connected with a vertical plate 108. A heating cylinder 109 is connected to the inner side of the vertical plate 108. The driving shaft of the heating cylinder 109 is connected with a heating push plate 110. A rotating connecting plate 111 is rotatably connected to the heating substrate 101 by a shoulder screw. One side of the rotating connecting plate 111 is connected with a heating shutter 112 for opening and / or closing the heating window. The other end of the rotating connecting plate 111 is connected with the heating push plate 110;

[0032] Wherein, the heating component 106 includes a heating moving plate 10601. The heating moving plate 10601 is of an L-shaped structure and one side thereof is connected to the slider. The other side of the L-shaped heating moving plate 10601 is connected with a heat insulation plate 10602 of a square structure. A hot air gun 10603 is connected inside the square heat insulation plate 10602. The upper end of the hot air gun 10603 is connected with a temperature sensor 10604 through a connector 10607. The heating end of the hot air gun 10603 is opposite to the heating window. Heat dissipation fins 10605 are connected to the outside of the heat insulation plate 10602. A dividing pin fixing plate 10606 is connected to the heating moving plate 10601. A dividing pin 10608 is connected to the dividing pin fixing plate 10606. A moving window 10609 is formed on the heat expansion vertical plate 102. A fixed positioning piece 10610 connected to the dividing pin 10608 is connected to the moving window 10609.

[0033] Furthermore, a heating outer cover 113 is sleeved on the heating substrate 101. Uniformly arranged ventilation holes are formed on each surface of the heating outer cover 113, which can realize the temperature control of the hot air gun, so that it can provide a suitable heating temperature, which can reach 200 - 300 degrees.

[0034] Still further, a limiting groove for the limiting movement of the heating shutter is formed on the bottom surface of the heating substrate 101. At the same time, the heating window 107 is located in the limiting groove, and the heating shutter can move stably in the specified limiting groove during movement.

[0035] Even further, there are two heating windows in the heating window 107. One is an 8-inch heating window and the other is a 12-inch heating window. Different sizes of processing can be realized, so as to reduce the use cost.

[0036] For the mobile heating plate to stably and accurately move the heating gun to the corresponding size, the specific implementation of the positioning structure is as follows:

[0037] First

[0038] A sensor support plate 114 is connected to the thermal expansion vertical plate 102, and two position sensors 115 are connected to the sensor support plate 114 for sensing the position of the heating moving plate 10601. One of the position sensors 115 is on the same axis as the 8-inch heating window, and the other position sensor 115 is on the same axis as the 12-inch heating window.

[0039] Second

[0040] There are two fixed positioning pieces 10610. One of the fixed positioning pieces 10610 is on the same axis as the 8-inch heating window, and the other fixed positioning piece 10610 is on the same axis as the 12-inch heating window.

[0041] The position of the heating gun is achieved through the above two methods, and the above two simultaneous solutions can also be used to achieve the position of the heating gun.

[0042] It can drive the first heating mechanism 1 and the second heating mechanism 6 to rotate. The specific structure is as follows:

[0043] The heating rotation mechanism 2 includes a rotation support plate 201. One side of the rotation support plate 201 is connected with a bearing fixing seat 202. A bearing 203 is connected inside the bearing fixing seat 202. A fixed rotating shaft 204 is inserted through the bearing 203. The lower end of the fixed rotating shaft 204 is connected to the rotating substrate 205 through an axle clip. The upper end of the fixed rotating shaft 204 is connected with a first synchronous pulley 206. The other side of the bearing fixing seat 202 is connected with a motor fixing bracket 207. A speed reducer 208 is connected to the motor fixing bracket 207. The speed reducer 208 is connected with a motor 209. The rotating shaft of the speed reducer 208 passes through the motor fixing bracket 207 and is connected with a second synchronous pulley 210. A synchronous belt 211 is connected between the second synchronous pulley 210 and the first synchronous pulley 206. An angle limit component 212 is connected to the bearing fixing seat 202.

[0044] At the same time, angle monitoring can be achieved, and its structure is as follows: the angle limit assembly 212 includes a first sensor fixing bracket 213 and a second sensor fixing bracket 214, the first sensor fixing bracket 213 and the second sensor fixing bracket 214 are connected to the bearing fixing seat 202 at an interval and relative to each other, the first sensor fixing bracket 213 and the second sensor fixing bracket 214 are both connected with a sensor 215, and the bearing fixing seat 202 located between the first sensor fixing bracket 213 and the second sensor fixing bracket 214 is connected with a fixing screw 216, and a sensor sheet fixing plate 217 is rotatably connected to the fixing screw 216, and a sensor sheet 218 that cooperates with the sensor 215 is connected to the sensor sheet fixing plate 217, and a limit block 219 for driving the sensor sheet fixing plate 217 to rotate is connected to the rotating substrate 205, and a reset torsion spring 220 for resetting the sensor sheet fixing plate 217 is connected to the fixing screw 216.

[0045] Among them, there are two limit blocks 219, and their positions can match the sensor 215, that is, after the limit block rotates to contact the sensor sheet fixing plate, the sensor sheet 218 contacts the corresponding sensor, thereby realizing the control of the rotating substrate (stopping the rotation of the rotating substrate), and then the motor works in the reverse direction, causing the rotating substrate to rotate in the reverse direction, and driving the other limit block to move in the reverse direction, and touch the sensor sheet fixing plate, so that the sensor sheet 218 contacts with another sensor, realizing the reverse stop movement, and the product is heated by such repeated movements.

[0046] The working principle of the present invention is as follows:

[0047] Rotation:

[0048] The motor in the heating rotating shaft mechanism starts to work, driving the second synchronous wheel to rotate, the second synchronous wheel drives the first synchronous wheel to rotate through the synchronous belt, the first synchronous wheel drives the fixed rotating shaft to rotate, the fixed rotating shaft drives the rotating base plate connected to the shaft clamp to rotate, and the rotating base plate drives the first heating mechanism and the second heating mechanism thereon to rotate;

[0049] heating:

[0050] At the same time, the hot air guns in the first heating mechanism and the second heating mechanism are turned on. Prior to this, the cylinders in the first heating mechanism and the second heating mechanism will push the rotating connecting plate through the heating push plate. The rotation of the rotating connecting plate will drive the heating baffle to move away, so that the heating window leaks out, and the hot air gun is made to correspond to the heating window (i.e., 8-inch steel ring and / or 12-inch steel ring). At this time, the hot air gun heats the raised film to make it shrink.

[0051] During the above heating process, the indexing pin and the position sensor are used to confirm the different positions of the hot air gun so as to match different wafer sizes.

[0052] In the heating and rotating mechanism, the limiting block on the rotating substrate drives the contact between the limiting block and the fixed plate of the induction sheet through the rotation of the rotating substrate, so that the induction sheet repeatedly contacts the sensors on both sides, thereby judging the corresponding rotation angle and achieving precise angle control.

[0053] The present invention can provide a suitable heating temperature, which can reach 200-300 degrees. The air flow is blown down by a hot air gun, the heating area is large, the rotating mechanism can rotate quickly, and the heat shrinkage efficiency is high. It can be compatible with 8 / 12-inch wafers by adjusting the indexing pin, has strong applicability, and can effectively reduce the use cost. The angle is monitored through the angle limiting component, which can prevent the problem of excessive angle rotation during heating and improve the product quality.

[0054] It should be noted that similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0055] In the description of the present application, it should be noted that the orientation or positional relationship indicated by the terms "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of this application is usually placed during use. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present application. In addition, the terms "first", "second", etc. are only used for descriptive distinction and cannot be understood as indicating or implying relative importance.

[0056] In addition, the terms "horizontal", "vertical", etc. do not mean that the components are required to be absolutely horizontal or vertical, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0057] In the description of the present application, it should also be noted that unless otherwise clearly specified and limited, the terms "set", "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0058] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. It should be noted that for those of ordinary skill in the art, without departing from the technical principle of the present invention, several improvements and modifications can be made, and these improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A wafer hot air heating device, characterized in that: It includes a heating and rotating mechanism (2), a base connecting plate (3) is connected to the heating and rotating mechanism (2), a left heating and rotating connecting plate (4) and a right heating and rotating connecting plate (5) are respectively connected to the left and right sides of the base connecting plate (3), and first heating mechanisms (1) and second heating mechanisms (6) with the same structure are respectively connected to the left heating and rotating connecting plate (4) and the right heating and rotating connecting plate (5); The first heating mechanism (1) includes a heating substrate (101), a heat expansion vertical plate (102) is connected to one side of the heating substrate (101), a guide rail support plate (103) is connected to the inner side of the heat expansion vertical plate (102), a guide rail (104) is connected to the guide rail support plate (103), a slider (105) is connected to the guide rail (104), a movable heating component (106) is connected to the slider (105), a heating window (107) opposite to the heating component (106) is opened on the bottom surface of the heating substrate (101), a vertical plate (108) is connected to the other side of the heating substrate (101), a heating cylinder (109) is connected to the inner side of the vertical plate (108), the driving shaft of the heating cylinder (109) is connected to a heating push plate (110), a rotating connecting plate (111) is rotatably connected to the heating substrate (101) by a shoulder screw, one side of the rotating connecting plate (111) is connected to a heating shutter (112) for opening and / or closing the heating window, and the other end of the rotating connecting plate (111) is connected to the heating push plate (110).

2. The hot air blowing type heating device for a wafer according to claim 1, wherein: A heating outer cover (113) is sleeved on the heating substrate (101), and uniformly arranged ventilation holes are opened on each surface of the heating outer cover (113).

3. The wafer hot air heating device according to claim 1, wherein: A limiting groove for the limiting movement of the heating shutter is opened on the bottom surface of the heating substrate (101), and at the same time, the heating window (107) is located in the limiting groove.

4. The wafer hot air heating device according to claim 1, characterized in that: There are two heating windows in the heating window (107), one of which is an 8-inch heating window and the other is a 12-inch heating window.

5. The wafer hot air blowing type heating device according to claim 1, wherein: The heating component (106) includes a heating moving plate (10601). The heating moving plate (10601) has an L-shaped structure and one side thereof is connected to a slider. The other side of the L-shaped heating moving plate (10601) is connected to a heat insulation plate (10602) having a square structure. A hot air gun (10603) is connected inside the square-shaped heat insulation plate (10602). The upper end of the hot air gun (10603) is connected to a temperature sensor (10604) through a connector (10607). The heating end of the hot air gun (10603) faces the heating window. Heat dissipation fins (10605) are connected to the outside of the heat insulation plate (10602). A indexing pin fixing plate (10606) is connected to the heating moving plate (10601). An indexing pin (10608) is connected to the indexing pin fixing plate (10606). A moving window (10609) is formed on the heat expansion vertical plate (102). A fixed positioning piece (10610) connected to and fixed with the indexing pin (10608) is connected to the moving window (10609).

6. The wafer hot air blowing type heating device according to claim 1, characterized in that: A sensor support plate (114) is connected to the heat expansion vertical plate (102). Two position sensors (115) are connected to the sensor support plate (114) for sensing the position of the heating moving plate (10601). One of the position sensors (115) is on the same axis as the 8-inch heating window, and the other position sensor (115) is on the same axis as the 12-inch heating window.

7. The hot air blowing type heating device for wafers according to claim 5, wherein: There are two fixed positioning pieces (10610). One of the fixed positioning pieces (10610) is on the same axis as the 8-inch heating window, and the other fixed positioning piece (10610) is on the same axis as the 12-inch heating window.

8. The wafer hot air heating device according to claim 1, characterized in that: The heating rotation mechanism (2) includes a rotation support plate (201). One side of the rotation support plate (201) is connected to a bearing fixing seat (202). A bearing (203) is connected inside the bearing fixing seat (202). A fixed rotating shaft (204) is inserted through the bearing (203). The lower end of the fixed rotating shaft (204) is connected to a rotating substrate (205) through a shaft clamp. The upper end of the fixed rotating shaft (204) is connected to a first synchronous pulley (206). The other side of the bearing fixing seat (202) is connected to a motor fixing bracket (207). A speed reducer (208) is connected to the motor fixing bracket (207). The speed reducer (208) is connected to a motor (209). The rotating shaft of the speed reducer (208) passes through the motor fixing bracket (207) and is connected to a second synchronous pulley (210). A synchronous belt (211) is connected between the second synchronous pulley (210) and the first synchronous pulley (206). An angle limit component (212) is connected to the bearing fixing seat (202).

9. The wafer hot air blowing type heating device according to claim 8, wherein: The angle limiting assembly (212) comprises a first sensor fixing bracket (213) and a second sensor fixing bracket (214); the first sensor fixing bracket (213) and the second sensor fixing bracket (214) are connected to the bearing fixing seat (202) at an interval and relative to each other; the first sensor fixing bracket (213) and the second sensor fixing bracket (214) are both connected to sensors (215); a fixing screw (216) is connected to the bearing fixing seat (202) between the first sensor fixing bracket (213) and the second sensor fixing bracket (214); a sensor sheet fixing plate (217) is rotatably connected to the fixing screw (216); a sensor sheet (218) that is inductively matched with the sensor (215) is connected to the sensor sheet fixing plate (217); and a limiting block (219) for driving the sensor sheet fixing plate (217) to rotate is connected to the rotating base plate (205).

10. The wafer hot air heating device according to claim 9, wherein: The fixing screw (216) is connected to a reset torsion spring (220) for resetting the sensor sheet fixing plate (217).

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