Fin type heat dissipation integrated air-cooled semiconductor laser

Abstract

The invention discloses a fin-type heat dissipation integrated air-cooled semiconductor laser, and the laser comprises a structural member, one side of which is used for installing a chip module and an optical component; the heat dissipation part is arranged on the other side of the structural part, and the heat dissipation part is used for increasing the heat conduction area of the structural part; and the air blowing part acts on the heat dissipation part and is used for generating cold air to be in full contact with the heat dissipation part to complete heat transfer. According to the invention, the structural design that the chip module and the optical component are arranged on the structural component is provided, so that heat generated in the working process is transferred to the heat dissipation parts, cold air generated by the air blowing part acts on the heat dissipation parts to take away heat generated in the working process of the equipment, and in the heat dissipation process of the air blowing part, when the cold air is blown to the rear half sections of the heat dissipation parts, the heat is dissipated. Due to the fact that the part is blocked by the heat dissipation part of the front half section and is subjected to heat exchange of the front half section, heat at the part of the heat pipes and the fins is concentrated, and at the moment, the flow guide part can guide part of cold air to act on the heat concentration part of the heat dissipation part according to the change of the heat.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor laser structures, and particularly to a finned heat dissipation integrated air-cooled semiconductor laser. Background Art

[0002] The statements herein only provide background art related to the present invention and do not necessarily constitute prior art.

[0003] With the continuous increase in the demand for the power of semiconductor lasers in industrial production, good heat dissipation has become an important direction for the breakthrough of lasers. Although methods such as water cooling and refrigerant have excellent heat dissipation effects, they have many refrigeration accessories and occupy a large area, making it difficult to use in some application scenarios. Therefore, air-cooled lasers urgently need to improve the heat dissipation efficiency to fill the gap in application scenarios.

[0004] However, the air-cooled radiator has the following deficiencies in use: the traditional semiconductor pump source is installed on the metal tube shell base, and the heat exchange end of the radiator contacts the metal tube shell, so that the heat generating end does not directly contact the radiator, thus affecting the heat dissipation efficiency; the air flow direction is fixed. When the air flow blows to the second half of each heat conduction tube and fin, since this part is blocked by the heat conduction tubes and fins in the first half and has undergone heat exchange in the first half, the heat pipes and fins in the second half cannot maximize the heat exchange efficiency, and the heat is concentrated at this part of the heat pipes and fins. The traditional equipment cannot perform targeted heat dissipation at this part, and there is room for improvement. Therefore, a finned heat dissipation integrated air-cooled semiconductor laser is proposed to solve the above problems. Summary of the Invention

[0005] The purpose of the present invention is to provide a finned heat dissipation integrated air-cooled semiconductor laser aiming at the above deficiencies currently.

[0006] To solve the above technical problems, the present invention adopts the following technical solutions: A finned heat dissipation integrated air-cooled semiconductor laser, comprising:

[0007] A structural member, on one side of which is used to install a chip module and optical components;

[0008] A heat dissipation part, arranged on the other side of the structural member, and the heat dissipation part is used to increase the heat conduction area of the structural member;

[0009] A blowing part, acting on the heat dissipation part, and used to generate cold air to fully contact the heat dissipation part to complete heat transfer;

[0010] A flow guiding part, arranged at the bottom of the heat dissipation part, and used to guide part of the cold air to act on the heat concentration area of the heat dissipation part.

[0011] Further, the diversion part includes a partition board, on which a plurality of flow-through grooves are formed. A thermosensitive metal combination piece corresponding to each flow-through groove is arranged on the partition board, and the thermosensitive metal combination piece is arranged in the flow-through groove for blocking the flow-through groove.

[0012] It further includes a support plate, which is arranged on the side of the partition board away from the heat dissipation part to form an air duct corresponding to the flow-through groove at the bottom of the partition board.

[0013] A diversion piece is arranged at the inlet end of the air duct, and the diversion piece controls the on-off of the air duct to control the cold air flow direction.

[0014] It further includes a trigger unit, which is used to switch the state of the diversion piece according to the deformation of the thermosensitive metal combination piece.

[0015] Further, the trigger unit includes a contact point arranged in the flow-through groove, and

[0016] an electromagnetic part arranged at the inlet end of the air duct and corresponding to the diversion piece, and

[0017] a circuit arranged in the partition board for connecting the contact point and the electromagnetic part;

[0018] One end of the diversion piece is provided with a magnetic part corresponding to the electromagnetic part, and the other end of the diversion piece is provided with a reset hinge part.

[0019] Further, the on-off of the contact point switches the on-off of the current in the circuit to change the working state of the electromagnetic part.

[0020] Further, the on-off of the contact point switches the current flow direction in the circuit to change the magnetic pole direction of the electromagnetic part.

[0021] Further, the thermosensitive metal combination piece is formed by laminating two metals with different thermal expansion coefficients.

[0022] Further, the reset hinge part includes a hinge rod arranged on the support plate. A hinge ring is arranged at one end of the reset hinge part close to the hinge rod, and a reset torsion spring is arranged in the hinge ring.

[0023] Further, the heat dissipation part includes a heat pipe and heat dissipation fins evenly distributed;

[0024] An installation groove corresponding to the heat pipe is formed in the heat dissipation fin, and the heat pipe is arranged in the heat dissipation fin;

[0025] The distance between the heat dissipation fins corresponds to the cold air flow direction of the air blowing part.

[0026] The beneficial effects of the present invention are reflected in:

[0027] The present invention proposes a structural design in which chip modules and optical components are arranged on structural parts, so that the heat generated during operation is transferred to the heat dissipation part, and the cold air generated by the blowing part acts on the heat dissipation part to take away the heat generated by the equipment during operation. During the heat dissipation process of the blowing part, when the cold air blows to the rear half of each heat dissipation part, the heat is more concentrated at this part of the heat pipes and fins because it is blocked by the front half of the heat dissipation part and has undergone heat exchange in the front half. At this time, the guide part can guide part of the cold air to act on the heat concentrated part of the heat dissipation part according to the change of heat. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is an explosion schematic diagram of the present invention;

[0029] Figure 2 It is a schematic diagram of the structure of the guide part of the present invention;

[0030] Figure 3 It is a partial structural schematic diagram of the guide part of the present invention;

[0031] Figure 4 It is a top view of the guide structure of the present invention.

[0032] In the figure:

[0033] 01. Chip module;

[0034] 1. Structural parts;

[0035] 2. heat dissipation unit; 21. heat pipe; 22. heat dissipation fin;

[0036] 3. Blowing unit;

[0037] 4. guide part; 41. partition; 42. flow slot; 43. temperature-sensitive metal assembly sheet; 44. support plate; 45. guide plate; 451. magnetic attraction member; 452. reset hinge; 46. contact; 47. electromagnetic member. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. In the absence of conflict, the embodiments in this application and the features in the embodiments can be combined with each other. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0039] See also Figures 1-4 The present invention discloses a fin-type heat dissipation integrated air-cooled semiconductor laser, comprising:

[0040] Structural member 1, on one side of which is used to install chip module 01 and optical components. The structural member 1 is a metal plate with good heat conduction effect. Preferably, the chip module 01 and optical components are arranged on the metal plate according to the design layout. A simple pumping surface is more conducive to the arrangement of the chip module, optical components and power supply module;

[0041] Heat dissipation part 2, arranged on the other side of the structural member 1, and the heat dissipation part 2 is used to increase the heat conduction area of the structural member 1;

[0042] Air blowing part 3, acting on the heat dissipation part 2, is used to generate cold air to fully contact with the heat dissipation part 2 to complete heat transfer;

[0043] Flow guiding part 4, arranged at the bottom of the heat dissipation part 2, is used to guide part of the cold air to act on the heat concentration area of the heat dissipation part 2.

[0044] During use, the structural member 1 transfers the heat generated during the operation of the chip module 01 and optical components to the heat dissipation part 2, and the cold air generated by the air blowing part 3 acts on the heat dissipation part 2 to reduce the heat during the operation of the device;

[0045] During the heat dissipation process of the air blowing part 3, when the cold air blows to the second half of each heat dissipation part 2, since this part is blocked by the first half of the heat dissipation part 2 and has undergone heat exchange in the first half, the heat is more concentrated at the heat pipes and fins in this part. At this time, the flow guiding part 4 can guide part of the cold air to act on the heat concentration area of the heat dissipation part 2 according to the change of heat, solve the above problems, and achieve the purpose of uniform heat dissipation.

[0046] Furthermore, it should be noted that the flow guiding part 4 includes a partition plate 41, on which a plurality of flow channels 42 are opened. A thermosensitive metal combination piece 43 corresponding to the flow channels 42 one by one is arranged on the partition plate 41, and the thermosensitive metal combination piece 43 is arranged in the flow channels 42 to block the flow channels 42;

[0047] It also includes a support plate 44, which is arranged on the side of the partition plate 41 away from the heat dissipation part 2 to form an air duct corresponding to the flow channels 42 at the bottom of the partition plate 41;

[0048] A flow guiding piece 45 is arranged at the inlet end of the air duct. The flow guiding piece 45 controls the on-off of the air duct to control the flow direction of the cold air. It should be noted that when the flow guiding piece 45 is not triggered, it is in an inclined state to guide the cold air to flow directly above the partition plate 41 and act on the heat dissipation part 2;

[0049] It also includes a triggering unit, which is used to switch the state of the flow guiding piece 45 according to the deformation of the thermosensitive metal combination piece 43.

[0050] Specifically, in a preferred embodiment, the temperature-sensitive metal composite sheet 43 at the position corresponding to the heat concentration of the heat dissipation part 2 deforms and bends under the action of temperature, opening the flow channel 42. At this time, the triggering unit is triggered, so that the guide vane 45 guides the air duct, and the air duct guides part of the cold air to blow out from the flow channel 42, directly acting on the heat concentration of the heat dissipation part 2, achieving the purpose of uniform heat dissipation.

[0051] It should be further noted that the triggering unit includes a contact 46 arranged in the flow channel 42, and,

[0052] an electromagnetic part 47 arranged at the air duct inlet end and corresponding to the guide vane 45, and,

[0053] a circuit arranged in the partition 41 to connect the contact 46 and the electromagnetic part 47;

[0054] One end of the guide vane 45 is provided with a magnetic part 451 corresponding to the electromagnetic part 47. The magnetic part 451 is made of iron, and the other end of the guide vane 45 is provided with a reset hinge part 452.

[0055] In a preferred embodiment, the contact 46 is turned on and off to switch the on-off of the current in the circuit, so as to change the working state of the electromagnetic part 47.

[0056] The temperature-sensitive metal composite sheet 43 deforms and bends under the action of temperature, and the contact 46 is disconnected. At this time, the electromagnetic part 47 loses its magnetic force, and the magnetic part 451 is no longer adsorbed. Under the dual action of the negative pressure in the air duct and the air pressure of the air blowing part 3, the guide vane 45 overcomes the torsion of the reset hinge part 452, and the guide vane 45 rotates to guide the air duct, so that part of the cold air enters the air duct and is discharged from the flow channel 42, acting on the corresponding heat concentration. After the corresponding part is cooled, the temperature-sensitive metal composite sheet 43 resets. At this time, the negative pressure in the air duct disappears, and the electromagnetic part 47 regains its magnetic force to adsorb the guide vane 45 to block the corresponding air duct.

[0057] In another preferred embodiment, the contact 46 is turned on and off to switch the current flow direction in the circuit, so as to change the magnetic pole direction of the electromagnetic part 47.

[0058] The temperature-sensitive metal composite sheet 43 deforms and bends under the action of temperature and does not contact the contact 46. At this time, the internal current direction of the circuit is changed, and the electromagnetic component 47 generates an opposite magnetic force. In this embodiment, the magnetic attraction component 451 is a permanent magnet, and the magnetic attraction component 451 is repelled. Under the combined action of the negative pressure in the air duct, the wind pressure of the air blowing part 3 and the repulsive force, the diversion piece 45 overcomes the torsion force of the reset hinge part 452, and the diversion piece 45 rotates to guide the air duct, so that part of the cold air enters the air duct and is discharged from the flow groove 42, acting on the corresponding heat concentration point. After cooling at the corresponding point, the temperature-sensitive metal composite sheet 43 resets. At this time, the temperature-sensitive metal composite sheet 43 contacts the contact 46, the internal current direction of the circuit is restored, the negative pressure in the air duct disappears, and the electromagnetic component 47 regains magnetic force to adsorb the diversion piece 45 to block the corresponding air duct;

[0059] In this embodiment, the contact 46 is a double-pole double-throw switch. The specific connection method is to connect the positive pole of the power supply to the middle terminal of the switch, connect the negative pole of the power supply to another middle terminal of the switch, connect one end of the electromagnetic component 47 to one outer terminal of the switch, and connect the other end of the electromagnetic component 47 to the other outer terminal of the switch. When the switch is turned to one side, the current flows from the positive pole to one end of the electromagnetic component 47, forming a magnetic field direction. When the switch is turned to the other side, the current flows from the positive pole to the other end of the electromagnetic component 47, and the current direction is reversed, and the magnetic field direction is also reversed accordingly.

[0060] It should be further noted that the temperature-sensitive metal composite sheet 43 is formed by laminating two metals with different thermal expansion coefficients.

[0061] In this application, the reset hinge part 452 includes a hinge rod arranged on the support plate 44. An end of the reset hinge part 452 close to the hinge rod is provided with a hinge ring, and a reset torsion spring is arranged in the hinge ring. The torsion force of the reset torsion spring is equal to the wind pressure of the air blowing part 3, and the air duct can be guided when the diversion piece 45 is acted by an external force.

[0062] It should be noted that as Figure 1 shown, the heat dissipation part 2 includes a heat pipe 21 and heat dissipation fins 22 distributed at equal intervals;

[0063] An installation groove corresponding to the heat pipe 21 is formed in the heat dissipation fin 22, and the heat pipe 21 is arranged in the heat dissipation fin 22;

[0064] The distance between the heat dissipation fins 22 corresponds to the cold air flow direction of the air blowing part 3.

[0065] It is easy to think that the device also has a housing. The structural member 1, the heat dissipation part 2, and the flow guiding part 4 are arranged in the housing from top to bottom, while the air blowing part 3 is arranged on both sides of the housing. The cold air generated by it can act on the heat dissipation part 2 and partially act on the flow guiding part 4 according to the change of the internal temperature. Under the guidance of the flow guiding part 4, the cold air can act on the heat concentration part at the rear half of the heat dissipation part 2 to achieve the purpose of uniform heat dissipation.

[0066] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present invention, the directional indications are only used to explain the relative position relationship, movement conditions, etc. between components in a specific posture (as shown in the drawings). If the specific posture changes, the directional indications will also change accordingly.

[0067] In addition, if there are descriptions such as "first", "second", etc. involved in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first", "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions between various embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present invention.

[0068] In addition, "a plurality of" means two or more.

[0069] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A finned heat dissipation integrated air-cooled semiconductor laser, characterized in that, Comprising: A structural member (1), one side of the structural member (1) is used for installing a chip module (01) and optical components; A heat dissipation part (2), arranged on the other side of the structural member (1), the heat dissipation part (2) is used to increase the heat conduction area of the structural member (1); A blowing part (3), acting on the heat dissipation part (2), used to generate cold air to fully contact with the heat dissipation part (2) to complete heat transfer; A flow guiding part (4), arranged at the bottom of the heat dissipation part (2), used to guide part of the cold air to act on the heat concentration area of the heat dissipation part (2).

2. The finned heat dissipation integrated air-cooled semiconductor laser according to claim 1, wherein: The flow guiding part (4) includes a partition plate (41), a plurality of flow channels (42) are opened on the partition plate (41), and a thermosensitive metal combination piece (43) corresponding to the flow channels (42) one by one is arranged on the partition plate (41), the thermosensitive metal combination piece (43) is arranged in the flow channels (42) for blocking the flow channels (42); It further includes a support plate (44), the support plate (44) is arranged on the side of the partition plate (41) away from the heat dissipation part (2) to form an air duct corresponding to the flow channels (42) at the bottom of the partition plate (41); A flow guiding piece (45) is arranged at the inlet end of the air duct, and the flow guiding piece (45) controls the on-off of the air duct to control the cold air flow direction; It further includes a triggering unit, and the triggering unit is used to switch the state of the flow guiding piece (45) according to the deformation of the thermosensitive metal combination piece (43).

3. The finned heat dissipation integrated air-cooled semiconductor laser according to claim 2, characterized in that: The triggering unit includes a contact (46) arranged in the flow channel (42), and, An electromagnetic part (47) arranged at the inlet end of the air duct and corresponding to the flow guiding piece (45), and, A circuit arranged in the partition plate (41) to connect the contact (46) and the electromagnetic part (47); One end of the flow guiding piece (45) is provided with a magnetic attracting piece (451) corresponding to the electromagnetic part (47), and the other end of the flow guiding piece (45) is provided with a reset hinge part (452).

4. The finned heat dissipation integrated air-cooled semiconductor laser according to claim 3, characterized in that: The on-off of the contact (46) switches the on-off of the current in the circuit to change the working state of the electromagnetic part (47).

5. The finned heat dissipation integrated air-cooled semiconductor laser according to claim 3, wherein: The on-off of the contact (46) switches the current flow direction in the circuit to change the magnetic pole direction of the electromagnetic part (47).

6. The finned heat dissipation integrated air-cooled semiconductor laser according to claim 2, characterized in that: The thermosensitive metal combination piece (43) is composed of two metals with different thermal expansion coefficients laminated together.

7. The fin - type heat - dissipating integrated air - cooled semiconductor laser according to claim 3, wherein: The reset hinge part (452) includes a hinge rod arranged on the support plate (44), a hinge ring is arranged at one end of the reset hinge part (452) close to the hinge rod, and a reset torsion spring is arranged in the hinge ring.

8. The finned heat dissipation integrated air-cooled semiconductor laser according to claim 3, wherein: The heat dissipation part (2) includes a heat pipe (21) and equally spaced heat dissipation fins (22); An installation groove corresponding to the heat pipe (21) is opened in the heat dissipation fin (22), and the heat pipe (21) is arranged in the heat dissipation fin (22); The distance between the heat dissipation fins (22) corresponds to the cold air flow direction of the blowing part (3).

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