Driving isolation circuit of wafer transmission system and application equipment thereof

Abstract

The embodiment of the invention provides a driving isolation circuit of a wafer transmission system and application equipment thereof, and the circuit comprises an optocoupler module and a switch module, the switch module is connected between the optocoupler module and a controller, and is used for receiving a first control signal of the controller, and enabling the optocoupler module to be switched on when the first control signal is a first high level; the optocoupler module is connected between the isolation power supply module and the motor driving board; the optocoupler module comprises a light emitting element and a light sensing element, one end of the light emitting element is connected to the isolated power supply module and used for receiving a second high level provided by the isolated power supply module, and the other end is connected to the switch module; when the optocoupler module is switched on, a second control signal is generated, and the second control signal is sent to the motor driving board, so that the motor driving board generates a motor driving signal according to the second control signal; wherein the voltage of the second high level is higher than that of the first high level. According to the embodiment of the invention, the driving interference to the motor can be reduced.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor production technology, and particularly to a drive isolation circuit for a wafer transfer system, a drive isolation circuit module for a wafer transfer system, a wafer transfer drive control system, a drive control circuit for a wafer transfer system, and a semiconductor processing apparatus. Background Art

[0002] In the field of semiconductor equipment, there are various types of equipment corresponding to different processes. Most of these equipment need to be provided with a wafer transfer system (WTS, Wafer Transfer System) to control the transfer of wafers between different process chambers through the wafer transfer system. The wafer transfer system is crucial, and its mechanical structure, control architecture, safety interlock, etc. all determine the stability, safety, and reliability of the whole machine equipment. Among them, the motor control drive part in the wafer transfer system has poor anti-interference ability, and it is easy for the mechanical structure, control architecture, safety interlock, etc. to operate abnormally due to interference in the motor control drive, resulting in control accuracy and accidental movement events. In severe cases, even chip accidents may occur, affecting the transfer reliability and safety of the wafer transfer system, and further affecting the processing stability of the entire semiconductor equipment.

[0003] In the prior art, since the layout position of the controller in the wafer transfer system is relatively long with respect to the terminal cable path of the drive board, the drive signal is relatively easy to be interfered during transmission. Various interferences cause current noise in the circuit at the command output end, resulting in fluctuations in the level, thus affecting the output of the control command and causing misoperation of the wafer transfer system. Summary of the Invention

[0004] In view of the above problems, embodiments of the present invention are proposed to provide a drive isolation circuit for a wafer transfer system, a drive isolation circuit module for a wafer transfer system, a wafer transfer drive control system, a drive control circuit for a wafer transfer system, and a semiconductor processing apparatus.

[0005] To solve the above problems, an embodiment of the present invention discloses a drive isolation circuit for a wafer transfer system. The drive isolation circuit is located among a controller, an isolated power supply module, and a motor drive board, and includes: an optocoupler module and a switch module.

[0006] The switch module is connected between the optocoupler module and the controller, and is configured to receive a first control signal from the controller, and when the first control signal is a first high level, turn on the optocoupler module.

[0007] The optocoupler module is connected between the isolated power supply module and the motor drive board; the optocoupler module includes a light emitting element and a light sensing element. One end of the light emitting element is connected to the isolated power supply module for receiving the second high level provided by the isolated power supply module, and the other end is connected to the switch module. When the optocoupler module is turned on, a second control signal is generated and sent to the motor drive board so that the motor drive board generates a motor drive signal according to the second control signal;

[0008] Wherein, the voltage of the second high level is higher than the voltage of the first high level.

[0009] Optionally, the light emitting element is a light emitting diode,

[0010] The cathode end of the light emitting diode is connected to the switch module, and the anode end of the light emitting diode is connected to the isolated power supply module; the light sensing element is connected to the motor drive board;

[0011] When the first control signal is the first high level, the switch module makes the cathode end of the light emitting diode at a low level, so that the light emitting diode is turned on to emit a light signal, and the light sensing element generates a second control signal based on the light signal.

[0012] Optionally, it further includes: a first current limiter,

[0013] The first current limiter is located between the isolated power supply module and the anode end of the light emitting diode of the optocoupler module for limiting the current between the isolated power supply module and the anode end of the light emitting diode of the optocoupler module.

[0014] Optionally, the first current limiter includes: a first current limiting resistor,

[0015] The first current limiting resistor is connected in series between the isolated power supply module and the anode end of the light emitting diode of the optocoupler module.

[0016] Optionally, the voltage of the second high level provided by the isolated power supply module is 24 volts, and the voltage of the first high level of the control signal is 5 volts.

[0017] Optionally, the switch module includes: a triode for receiving the control signal of the controller and adjusting the level of the cathode end of the light emitting diode based on the control signal;

[0018] The base of the triode is connected to the controller, the collector of the triode is connected to the cathode end of the light emitting diode of the optocoupler module, and the emitter of the triode is grounded;

[0019] When the control signal is at the first high level, the collector and the emitter are in the conducting state, and the level at the cathode terminal of the light-emitting diode is at a low level;

[0020] When the control signal is at a low level, the collector and the emitter are in the cut-off state, and the level at the cathode terminal of the light-emitting diode is at a high level.

[0021] Optionally, the switch module further includes: a second current limiter,

[0022] The second current limiter is located between the controller and the base and is used to limit the current between the controller and the base.

[0023] Optionally, the second current limiter includes:

[0024] A second current-limiting resistor, connected in series between the controller and the base; and / or,

[0025] A pull-down resistor, with one end connected to the base and the other end grounded.

[0026] A drive isolation circuit module for a wafer transfer system, comprising: a printed circuit board body, a drive board interface module, and a controller interface module;

[0027] At least one set of the drive isolation circuit for the wafer transfer system as described above is provided on the printed circuit board;

[0028] The controller interface module is provided on the printed circuit board body and is connected to the input end of the drive isolation circuit;

[0029] The drive board interface module is provided on the printed circuit board body and is connected to the output end of the drive isolation circuit.

[0030] Optionally, the drive isolation circuit is formed by double-sided wiring on the printed circuit board body.

[0031] Optionally, the controller interface module is a double-layer terminal block.

[0032] Optionally, it further includes:

[0033] A guide rail, connected to the printed circuit board body, and the printed circuit board body slides freely on the guide rail.

[0034] A wafer transfer drive control system, comprising the drive isolation circuit module for the wafer transfer system as described above, a controller, a motor drive board, an isolated power supply module, and a motor;

[0035] The controller is connected to the controller interface module of the drive isolation circuit module; the motor drive board is located between the drive board interface module of the drive isolation circuit module and the motor.

[0036] A drive control circuit of a wafer transfer system includes a control circuit provided in a controller, a motor drive circuit provided in a motor drive board, an isolation power supply circuit provided in an isolation power supply module, and the drive isolation circuit as described above;

[0037] The isolation power supply module includes a first isolation power supply, and the first isolation power supply is connected to the light emission module of the optocoupler module and provides a second high level for the optocoupler module;

[0038] The isolation power supply module further includes a second isolation power supply, and the second isolation power supply is connected to the motor drive circuit and provides a third high level for the motor drive circuit;

[0039] The voltage of the third high level is higher than the voltage of the first high level.

[0040] A drive control circuit of a wafer transfer system includes a control circuit provided in a controller, a motor drive circuit provided in a motor drive board, an isolation power supply circuit provided in an isolation power supply module, and the drive isolation circuit as described above;

[0041] The isolation power supply module includes a first isolation power supply, the first isolation power supply is connected to the light emission module of the optocoupler module and provides a second high level for the optocoupler module; the first isolation power supply is further connected to the motor drive circuit and provides a second high level for the motor drive circuit.

[0042] A semiconductor process equipment includes: the wafer transfer system as described above, or the drive control circuit as described above. Second high level Second high level

[0043] The embodiments of the present invention have the following advantages:

[0044] In the embodiment of the present invention, a switching module is connected between an optocoupler module and a controller, and is configured to receive a first control signal from the controller and turn on the optocoupler module when the first control signal is a first high level; the optocoupler module is connected between the isolated power supply module and the motor driver board; the optocoupler module includes a light emitting element and a light sensing element, one end of the light emitting element is connected to the isolated power supply module for receiving a second high level provided by the isolated power supply module, and the other end is connected to the switching module; when the optocoupler module is turned on, a second control signal is generated and sent to the motor driver board so that the motor driver board generates a motor drive signal according to the second control signal; wherein, the voltage of the second high level is higher than the voltage of the first high level by the second high level and the second high level. By adding an isolated power supply module for power supply and using a drive isolation circuit composed of optocoupler elements, the unstable factors of the power supply voltage and the unstable output voltage are isolated and eliminated between the output end and the terminal power supply by the optocoupler elements; by adopting an isolated power supply module for independent power supply, a stable voltage is output, avoiding interference caused by level fluctuations, thereby reducing electromagnetic interference in the drive control process, reducing interference affecting control commands, and achieving higher drive accuracy of the motor. Thus, the existing motor interference problem in the wafer transfer system is effectively solved, and the occurrence of potential motor interference problems is also avoided, preventing misoperations of the wafer transfer system, improving the transmission reliability and safety of the wafer transfer system, and further ensuring the processing stability of semiconductor equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 FIG. is a structural block diagram of an embodiment of a drive isolation circuit for a wafer transfer system according to the present invention;

[0046] Figure 2 FIG. is a schematic diagram of the principle of an embodiment of a drive isolation circuit for a wafer transfer system according to the present invention;

[0047] Figure 3 FIG. is a schematic diagram of the principle of an optocoupler module according to the present invention;

[0048] Figure 4 FIG. is a schematic diagram of the current transfer ratio curve of an optocoupler module according to the present invention;

[0049] Figure 5 FIG. is a schematic diagram of the connection of a triode according to the present invention;

[0050] Figure 6 FIG. is a schematic diagram of the principle of a triode according to the present invention;

[0051] Figure 7 FIG. is a structural block diagram of an embodiment of a drive isolation circuit module for a wafer transfer system according to the present invention;

[0052] Figure 8 It is a schematic diagram of the principle of an embodiment of a drive isolation circuit module of a wafer transfer system according to the present invention;

[0053] Figure 9 is a schematic diagram of the structure of an embodiment of a drive isolation circuit module of a wafer transfer system according to the present invention Figure 1 ;

[0054] Figure 10 is a schematic diagram of the structure of an embodiment of a drive isolation circuit module of a wafer transfer system according to the present invention Figure 2 ;

[0055] Figure 11 is a block diagram of the structure of a drive control system of a wafer transfer system according to the present invention;

[0056] Figure 12 is a block diagram of the structure of a drive control circuit of a wafer transfer system according to the present invention;

[0057] Figure 13 is a block diagram of the structure of a drive control circuit of another wafer transfer system according to the present invention;

[0058] Figure 14 is a block diagram of the structure of a semiconductor process equipment according to the present invention.

[0059] Description of reference numerals:

[0060] 100 - Controller, 200 - Motor drive board, 310 - Optocoupler module, 311 - Light emitting element, 312 - Light sensing element, 320 - Switch module, 321 - Triode, R1 - First current limiting resistor, R2 - Second current limiting resistor, R3 - Pull - down resistor, 400 - Isolated power supply module; 10 - Printed circuit board body, 20 - Drive board interface module, 30 - Controller interface module, 31 - Power supply interface, 32 - Controller interface 40 - Drive isolation circuit, 50 - Guide rail; 500 - Drive isolation circuit module, 600 - Motor; 700 - Second isolated power supply, 800 - First isolated power supply; 60 - Wafer transfer system, 70 - Drive control circuit. Detailed implementation manners

[0061] In order to make the above - mentioned objects, features and advantages of the present invention more obvious and understandable, the present invention will be further described in detail below with reference to the drawings and specific implementation manners.

[0062] Referring to Figure 1 , a block diagram of the structure of an embodiment of a drive isolation circuit of a wafer transfer system according to the present invention is shown; Referring to Figure 2, which shows a schematic diagram of the principle of an embodiment of the drive isolation circuit of a wafer transfer system according to the present invention; the drive isolation circuit is located among the controller 100, the isolated power supply module 400, and the motor drive board 200. The drive isolation circuit is used to receive the control instructions sent by the controller 100 and forward the control instructions to the motor drive board 200, and the motor drive board 200 drives the motor based on the control. The drive isolation circuit may specifically include: an optocoupler module 310 and a switch module 320.

[0063] The switch module 320 is connected between the optocoupler module 310 and the controller 100, and is used to receive the first control signal of the controller 100, and when the first control signal is the first high level, the optocoupler module 310 is turned on;

[0064] The optocoupler module 310 is connected between the isolated power supply module 400 and the motor drive board 200. The optocoupler module 310 includes a light emitting element 311 and a light sensing element 312. One end of the light emitting element 311 is connected to the isolated power supply module 400, and is used to receive the second high level provided by the isolated power supply module 400, and the other end is connected to the switch module 320; when the optocoupler module 310 is turned on, a second control signal is generated and the second control signal is sent to the motor drive board 200, so that the motor drive board 200 generates a motor drive signal according to the second control signal;

[0065] Among them, the voltage of the second high level is higher than the voltage of the first high level.

[0066] The input end of the switch module 320 is connected to the controller 100, and can receive the first control signal sent by the controller 100. The first control signal is the control signal for the controller 100 to control whether the motor moves. The controller 100 can set the first control signal to a high level or a low level. The output end of the switch module 320 is connected to the optocoupler module 310, and the on-off state of the optocoupler module 310 is determined based on different level states. When it is at a high level, that is, when the first control signal is the first high level, the optocoupler module 310 is turned on. The voltage magnitude of the first high level can be set according to requirements, and the embodiments of the present invention do not make specific limitations. In one example, the voltage of the first high level of the control signal is 5 volts.

[0067] The isolated power supply module 400 can provide the second high level for the optocoupler module 310; the voltage of the second high level is higher than the voltage of the first high level. The voltage of the second high level is the voltage signal for the optocoupler module 310 to drive the motor. In one example, the output voltage of the isolated power supply module 400 is 24 volts. That is, a voltage of 24 volts can be output to the optocoupler element, and the second high level can reach 24 volts.

[0068] The optocoupler module 310 is connected between the isolated power supply module 400 and the motor drive board 200. That is, the input end of the optocoupler module 310 is connected to the isolated power supply module 400, and the output end is connected to the motor drive board 200. Among them, one end of the light-emitting element 311 of the optocoupler module 310 is connected to the isolated power supply module 400, and the other end is connected to the switch module 320. When the switch module 320 controls the optocoupler module 310 to conduct, the light-emitting element 311 performs photoelectric conversion based on the second high level provided by the isolated power supply module 400, and the generated optical signal is received by the light-sensing element 312 to isolate and convert the signal and drive, generating a second control signal. The light-sensing element 312 is connected to the motor drive board 200 and sends the second control signal to the motor drive board 200 so that the motor drive board 200 generates a motor drive signal according to the second control signal.

[0069] The above drive isolation circuit realizes the functions of photoelectric isolation and level conversion, that is, the control command output by the controller 100 is isolated and converted by the drive isolation circuit to complete the triggering of the command for the motor drive board; the noise interference in the system is isolated through the optocoupler module; and through the setting of the isolated power supply, the control signal with a low voltage (such as 5V) output by the controller 100 is converted into a control signal with a higher voltage (such as 24V). Thereby improving the anti-interference ability of the entire wafer transfer system.

[0070] In an embodiment of the present invention, the light-emitting element 311 is a light-emitting diode, the cathode end of the light-emitting diode is connected to the switch module 320, and the anode end of the light-emitting diode is connected to the first isolated power supply; the light-sensing element 312 is connected to the motor drive board 200;

[0071] When the first control signal is the first high level, the switch module 320 makes the cathode end of the light-emitting diode at a low level, so that the light-emitting diode conducts and emits an optical signal, and the light-sensing element 312 generates a second control signal based on the optical signal.

[0072] It can be referred to Figure 3 As shown in, the optocoupler module 310 includes a light-emitting element 311 and a light-sensing element 312. The light-emitting element 311 can be a light-emitting diode, and the corresponding light-sensing element 312 can be a phototransistor (such as a photosensitive triode). That is, the optocoupler module 310 can include four pins, and the functions of these pins are as follows: Pin 1 is the anode end of the light-emitting diode, Pin 2 is the cathode end of the light-emitting diode, Pin 3 is the collector of the phototransistor, and Pin 4 is the emitter of the phototransistor. Among them, the emitter of the photosensitive triode can be grounded.

[0073] The cathode terminal of the light-emitting diode in the optocoupler module 310 is connected to the switch module 320. When the first control signal is at the first high level, the switch module 320 outputs a low level. The cathode terminal of the light-emitting diode is in the low-level state. The anode terminal of the light-emitting diode is connected to the isolated power supply module 400, and the anode terminal of the light-emitting diode is in the high-level state. At this time, it is equivalent to applying a voltage between the anode terminal and the cathode terminal of the light-emitting diode, causing the light-emitting diode to conduct and emit a light signal. The light-sensing element 312 generates a second control signal based on the light signal. The collector and emitter of the phototransistor are connected to the motor drive board 200 to send the second control signal to the motor drive board 200, so that the motor drive board 200 drives the motor based on the second control signal.

[0074] In an example of the present invention, the optocoupler module 310 can be integrated into an optocoupler element. Considering parameters such as the withstand voltage value, current-carrying value, turn-off performance, and circuit voltage design of the optocoupler element, the TLPx-GB model optocoupler can be selected. Several important parameters of this model of optocoupler element meet the requirements of this model: the forward voltage drop of the diode is 1.3V, the withstand voltage is 0-24VDC, the current is 0-50ma, the temperature is -25-80°C, the delay response time is 5μs, and the current transfer ratio CTR curve meets the circuit design requirements. The range values of other parameters can meet the design of the larger current calculation selection value width on the system.

[0075] CTR depends on the light-emitting intensity of the light source, operating temperature, continuous operation, and aging. The light-emitting intensity depends on the current in the diode. Therefore, in combination with the actual circuit and reliability requirements, it is necessary to determine the curve performance suitable for this design scheme. At T = 25°C (the actual working environment temperature of this device in the Fab), there is approximately 100% CTR from 1 to 15ma. However, too large a current affects its lifespan, and too small a current results in a relatively small CTR value. Therefore, in the figure, a position near 5ma can be found, where a relatively high CTR value can be reached, with high reliability and a lifespan of approximately 10 years. According to Figure 4 It is shown that the current value IF = 5ma is selected, and based on this value, the parameter values of the following components can be calculated.

[0076] In an embodiment of the present invention, the drive isolation circuit further includes: a first current limiter, which is located between the isolated power supply module 400 and the anode terminal of the light-emitting diode of the optocoupler module 310 and is used to limit the current between the isolated power supply module 400 and the anode terminal of the light-emitting diode of the optocoupler module 310.

[0077] A first current limiter may be provided between the isolated power supply module 400 and the anode terminal of the light-emitting diode of the optocoupler module 310. That is, the first current limiter is connected in series between the isolated power supply module 400 and the anode terminal of the light-emitting diode of the optocoupler module 310, and can limit the current between the isolated power supply module 400 and the anode terminal of the light-emitting diode of the optocoupler module 310. Even when the isolated power supply module 400 outputs a relatively high numerical voltage, the loop current between the isolated power supply module 400 and the anode terminal of the light-emitting diode of the optocoupler module 310 will not be too large, thus better improving the service life of the optocoupler module 310.

[0078] Specifically, the first current limiter includes: a first current-limiting resistor R1, and the first current-limiting resistor R1 is connected in series between the isolated power supply module 400 and the anode terminal of the light-emitting diode of the optocoupler module 310.

[0079] A first current-limiting resistor R1 is provided between the isolated power supply module 400 and the anode terminal of the light-emitting diode of the optocoupler module 310, and the first current-limiting resistor R1 is connected in series between the isolated power supply module 400 and the anode terminal of the light-emitting diode of the optocoupler module 310. For the resistance value of the first current-limiting resistor R1, it can be determined according to the voltage drop of the light-emitting diode in the optocoupler module 310 and the radio frequency current. For example, in a multi-circuit system, IF = 5 mA is more reasonable, and the voltage drop of the forward diode of the optocoupler module 310 is U2 = 1.3 V, Ur = 24 V

[0080]

[0081] It can be calculated that R1 = 4.46 kΩ, and 4.7 KΩ is selected as the first current-limiting resistor R1 according to the standard resistance value.

[0082] In an embodiment of the present invention, the switch module 320 includes: a triode 321, configured to receive the control signal of the controller 100 and adjust the level of the cathode terminal of the light-emitting diode based on the control signal;

[0083] The base of the triode 321 is connected to the controller 100, the collector of the triode 321 is connected to the cathode terminal of the light-emitting diode of the optocoupler module 310, and the emitter of the triode 321 is grounded;

[0084] When the control signal is a first high level, the collector and the emitter are in a conducting state, and the level of the cathode terminal of the light-emitting diode is a low level;

[0085] When the control signal is a low level, the collector and the emitter are in a cut-off state, and the level of the cathode terminal of the light-emitting diode is a high level.

[0086] It can be referred to Figure 5, the triode 321 can be an NPN triode 321. The base of the triode 321 is connected to the controller 100, the collector of the triode 321 is connected to the cathode terminal of the light-emitting diode of the optocoupler module 310, and the emitter of the triode 321 is grounded. By using the triode 321 as a switch, the light-emitting diode of the optocoupler module 310 is controlled based on the control signal of the controller 100. When the control signal is the first high level, the collector and the emitter of the triode 321 are in the conducting state, the level of the cathode terminal of the light-emitting diode is the low level, the light-emitting diode conducts and emits light, converting the electrical signal into an optical signal. The photodetector in the optocoupler element receives the light illumination and converts the optical signal back into an electrical signal for transmission to the motor drive board 200 to drive the motor. When the control signal is the low level, the collector and the emitter of the triode 321 are in the cut-off state, the level of the cathode terminal of the light-emitting diode is the high level, both ends of the light-emitting diode are at the high level, and the light-emitting diode is cut off and does not emit an optical signal.

[0087] The type of the triode 321 can be determined by the turn-off frequency of the triode 321. For example, the forward voltage drop of the diode of the optocoupler module 310 is U = 1.3V, and the power supply of the isolated power supply module 400 is 24V; then the minimum collector voltage of the triode 321 is Uf = 24V - U0 = 22.7V; IF = 5ma, then the collector current Ie > 5ma is sufficient; for the switching frequency parameter, the pulse command frequency f = 300, and the turn-off frequency f1 of the triode 321 > f is sufficient.

[0088] In an embodiment of the present invention, the switch module 320 further includes: a second current limiter,

[0089] The second current limiter is located between the controller 100 and the base, and is used to limit the current between the controller 100 and the base.

[0090] A second current limiter can be provided between the controller 100 and the base of the triode 321 to limit the current between the controller 100 and the base of the triode 321. Even when the output voltage of the controller 100 is too large, the current between the controller 100 and the base of the triode 321 will not be too large to cause damage to the triode 321, so as to protect the triode 321.

[0091] Specifically, the second current limiter includes:

[0092] A second current-limiting resistor R2, connected in series between the controller 100 and the base; and / or,

[0093] A pull-down resistor R3, one end of which is connected to the base and the other end is grounded.

[0094] It can refer to Figure 6, a second current-limiting resistor R2 is connected in series between the base of the triode 321 and the controller 100; a saturation path is formed through the second current-limiting resistor R2 and the triode 321. The critical saturation base current IB1 = IF / β (β = 100); to make the triode 321 deeply saturated, a current several times, 10 - 20 times, is taken; then the final base current IB = 20*IB1 ~ 10*IB1, IB = 1 / 5*IF ~ 1 / 10*IF; as known above, IF = 5ma, and by calculation, IB = 0.5 ~ 1ma; the conduction voltage drop of the triode 321 is 0.7V, R2 = (5V - 0.7V) / IB, R2 ∈ (4.3KΩ ~ 8.6KΩ); the resistance value R2 of the second current-limiting resistor R2 is calculated as the minimum R2 = (3.5 - 0.7) / IB, R2 ∈ (2.8KΩ, 5.6KΩ); in summary, R2 ∈ (4.3KΩ, 5.6KΩ), and here 4.7KΩ can be selected to achieve the saturation path.

[0095] Through the pull-down resistor R3, the state of the base of the triode 321 is determined when the controller 100 does not give an instruction, preventing accidental triggering of other signals. It can also improve the turn-off speed of the triode 321. In fact, there are capacitors between the triodes 321. When it is turned on, the capacitor is charged, and when it is turned off, the capacitor is discharged. The pull-down resistor R3 can provide a discharge path for the capacitor to avoid delaying the turn-off time. And it can increase the switching gate signal voltage, effectively avoiding interference here. The resistance value of the pull-down resistor R3 can be determined through the triode 321. For example, when the conduction voltage threshold of the known NPN triode is 0.6 - 0.7V, the voltage Ua at point Ua = (5V - 0.7v)*R3 / (R3 + R2); therefore, when the parallel pull-down resistor R3 is connected, at least ensure that Ua = (5V - 0.7)*R3 / (R3 + R2) > 0.7V, and by calculation, R3 > 0.8K; to make the Ua voltage in a stable value, the input voltage is 5V. Ua = 0.7V + 1.5V = 2.2V, and the maximum is close to Ua = 4.3V. Here, take 4.2V, at least take Ua = 2.2V ~ 4.2V; Ua = (5V - 0.7V)*R3 / (R3 + 4.7) = 2.2V, and the calculated minimum resistance value R3 = 4.92KΩ; Ua = (5V - 0.7V)*R3 / (R3 + 4.7) = 4.2V, and the calculated maximum resistance value R3 = 197.4KΩ; R3 ∈ (4.92KΩ, 197.4KΩ). Therefore, selecting the pull-down resistor R3 = 10K can meet the requirements.

[0096] In an embodiment of the present invention, a switch module is connected between an optocoupler module and a controller, and is configured to receive a first control signal from the controller and turn on the optocoupler module when the first control signal is a first high level; the optocoupler module is connected between the isolated power supply module and the motor drive board; the optocoupler module includes a light emitting element and a light sensing element, one end of the light emitting element is connected to the isolated power supply module for receiving a second high level provided by the isolated power supply module, and the other end is connected to the switch module; when the optocoupler module is turned on, a second control signal is generated and sent to the motor drive board so that the motor drive board generates a motor drive signal according to the second control signal; wherein, the voltage of the second high level is higher than the voltage of the first high level by a second high level. By adding an isolated power supply module for power supply and using a drive isolation circuit composed of optocoupler elements, the unstable factors of the power supply voltage and the unstable output voltage are isolated and eliminated by the optocoupler elements between the output end and the terminal power supply; by using an isolated power supply module for independent power supply to output a stable voltage and avoid interference caused by level fluctuations, electromagnetic interference in the drive control process is reduced, interference affecting control commands is reduced, the drive accuracy of the motor is higher, thus effectively solving the existing motor interference problem in the wafer transfer system and avoiding the occurrence of potential motor interference problems, avoiding misoperations of the wafer transfer system, improving the transmission reliability and safety of the wafer transfer system, and further ensuring the processing stability of semiconductor equipment

[0097] Referring to Figure 7 , a structural block diagram of an embodiment of a drive isolation circuit module of a wafer transfer system according to the present invention is shown; referring to Figure 8 , a schematic principle diagram of an embodiment of a drive isolation circuit module of a wafer transfer system according to the present invention is shown; the drive isolation circuit module includes: a printed circuit board body 10, a drive board interface module 20 and a controller interface module 30;

[0098] At least one set of the drive isolation circuit 40 of the wafer transfer system as described above is provided on the printed circuit board;

[0099] The controller interface module 30 is disposed on the printed circuit board body 10 and is connected to the input end of the drive isolation circuit 40;

[0100] The drive board interface module 20 is disposed on the printed circuit board body 10 and is connected to the output end of the drive isolation circuit 40.

[0101] In an embodiment of the present invention, the drive isolation circuit 40, the controller interface module 30, and the drive board interface module 20 of the wafer transfer system can be integrated on a printed circuit board. Based on the printed circuit, the drive isolation circuit 40, the controller interface module 30, and the drive board interface module 20 are connected to be integrated into a drive isolation circuit module. Among them, one end of the controller interface module 30 is connected to the input end of the drive isolation circuit 40, and the other end is connected to the controller 100, so that the drive isolation circuit 40 can be connected to the controller 100 through the controller interface module 30. One end of the drive board interface module 20 is connected to the output end of the drive isolation circuit 40, and the other end is connected to the drive board 200, so that the drive isolation circuit 40 can be connected to the drive board 200 through the drive board interface module 20. By using the signal isolation of the drive isolation circuit 40, the interference to the motor is reduced, the operation accuracy of the wafer transfer system is improved, and the stability of the process equipment is improved.

[0102] Furthermore, as Figure 8 shown, multiple drive isolation circuits 40 can form an integrated circuit, and the multiple drive isolation circuits 40 are connected in parallel in the integrated circuit; that is, different drive motors can be controlled by multiple different control circuits respectively.

[0103] In an embodiment of the present invention, the drive isolation circuit 40 is formed by double-sided wiring on the printed circuit board body 10. Using double-sided wiring reduces the volume occupied by the wiring and improves the degree of integration.

[0104] In an embodiment of the present invention, the controller interface module 30 is a double-layer terminal block. Referring to Figure 9 , the controller interface module 30 needs to meet the signal and power supply requirements of the controller 100, needs to be easy for circuit installation and maintenance, and has a large number of circuits. The controller interface module 30 can adopt a double-layer terminal block, with tubular terminal plug-in nuts for fastening. One row of the double-layer terminal block is the power supply interface 31, which is connected to the isolated power supply module 400 through the power supply interface 31 to meet the power supply requirements; the other row is the controller interface 32, which is connected to the controller 100 through the controller interface 32 to meet the signal transmission requirements.

[0105] In an embodiment of the present invention, the drive isolation circuit module further includes: a guide rail, which is connected to the printed circuit board body 10, and the printed circuit board body 10 slides freely on the guide rail.

[0106] Referring to Figure 10 , a guide rail 50 can be installed on the printed circuit board body. Through the guide rail 50, the drive isolation circuit module can be installed on the application device. The standard installation method is easy to disassemble and maintain, and is suitable for matching the whole machine system and other compatible models.

[0107] Referring to Figure 11, showing a structural block diagram of an embodiment of a wafer transfer drive control system according to the present invention; the wafer transfer drive control system includes: a drive isolation circuit module 500, a controller 100, a motor drive board 200, and a motor 600;

[0108] The controller 100 is connected to the controller interface module 30 of the drive isolation circuit module 500; the motor drive board 200 is located between the drive board interface module 20 of the drive isolation circuit module 500 and the motor 600.

[0109] In an embodiment of the present invention, the controller 100 is connected to the drive isolation circuit module 500 through the controller interface module 30. The drive board is connected to the drive isolation circuit module 500 through the drive board interface module 20. The motor drive board 200 is located between the drive board interface module 20 of the drive isolation circuit module 500 and the motor 600, and the drive isolation circuit module 500 is connected to the motor 600 through the drive board. The controller 100 sends a first control signal based on control requirements, and the drive isolation circuit module 500 is turned on or off under the control of the first control signal. When the drive isolation circuit module 500 is turned on, it sends a second control signal to the drive board. When the drive board receives the second control signal, it controls the movement of the motor 600 based on the second control signal.

[0110] Refer to Figure 12 , showing a structural block diagram of an embodiment of a drive control circuit of a wafer transfer system according to the present invention; the drive control circuit of the wafer transfer system includes a control circuit provided in the controller 100, a motor drive circuit provided in the motor drive board 200, an isolation power supply circuit provided in the isolation power supply module 400, and the drive isolation circuit as described above;

[0111] In one of the embodiments, the isolation power supply module 400 includes a first isolation power supply 800, and the first isolation power supply 800 is connected to the optocoupler module in the drive isolation circuit and provides a second high level for the optocoupler module;

[0112] The voltage of the second high level is higher than the voltage of the first high level.

[0113] In an embodiment of the present invention, the first isolation power supply 800 can be independently set, connected to the drive isolation circuit, and supply power to the drive isolation circuit alone. The first isolation power supply 800 can also supply power to the motor drive circuit at the same time and provide a second high level voltage for the motor drive circuit. Among them, the voltage of the second high level is higher than the voltage of the first high level, such as 24 volts, 12 volts, etc., and the embodiments of the present invention do not make specific limitations.

[0114] Refer to Figure 13, showing a structural block diagram of another embodiment of the drive control circuit of the wafer transfer system of the present invention; the drive control circuit of the wafer transfer system includes a control circuit provided in the controller 100, a motor drive circuit provided in the motor drive board 200, an isolated power supply circuit provided in the isolated power supply module 400, and the drive isolation circuit as described above;

[0115] The isolated power supply module 400 includes a first isolated power supply 800, and the first isolated power supply 800 is connected to the light emitting module of the optocoupler module 310 and provides a second high level for the optocoupler module;

[0116] The isolated power supply module 400 includes a second isolated power supply 700, and the second isolated power supply 700 is connected to the motor drive circuit and provides a third high level for the motor drive circuit.

[0117] In the embodiment of the present invention, the isolated power supply module 400 includes a first isolated power supply 800. The first isolated power supply 800 is connected to the light emitting module of the optocoupler module 310 and provides a second high level for the optocoupler module 310. The second isolated power supply 700 can be connected to the motor drive circuit to supply power to the motor drive circuit separately (that is, the isolated power supply module 400 includes the second isolated power supply 700 and the first isolated power supply 800 to supply power to the motor drive circuit and the optocoupler module respectively), and provides a third high level for the motor drive circuit under the control of the second control signal. The motor drive circuit performs corresponding operation control on the motor based on the third high level. Among them, the voltage of the third high level is higher than the voltage of the first high level, such as 24 volts, 12 volts, etc., and the embodiment of the present invention does not make specific limitations.

[0118] Referring to Figure 14 , showing a structural block diagram of an embodiment of a semiconductor process equipment of the present invention; the wafer transfer system 60 as described above, or the drive control circuit 70 as described above.

[0119] In the embodiment of the present invention, the semiconductor process equipment may include a wafer transfer system 60 or a drive control circuit 70. The motor is controlled by the drive control circuit 70 to perform corresponding processing. Alternatively, the wafer is transported by the wafer transfer system 60 so that the wafer can reach the corresponding processing chamber to perform corresponding processing processes, thereby generating corresponding products.

[0120] It should be noted that, for the method embodiments, for the sake of simple description, they are all expressed as a series of action combinations. However, those skilled in the art should know that the embodiments of the present invention are not limited by the described action sequences, because according to the embodiments of the present invention, certain steps can be performed in other sequences or simultaneously. Secondly, those skilled in the art should also know that the embodiments described in the specification are all preferred embodiments, and the actions involved are not necessarily essential for the embodiments of the present invention.

[0121] Each embodiment in this specification is described in a progressive manner. The key point of each embodiment is to illustrate the differences from other embodiments. For the same or similar parts among the embodiments, reference can be made to each other.

[0122] Those skilled in the art should understand that the embodiments of the present invention can be provided as a method, a device, or a computer program product. Therefore, the embodiments of the present invention can take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware aspects. Moreover, the embodiments of the present invention can take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk memories, CD-ROMs, optical memories, etc.) containing computer-usable program codes.

[0123] The embodiments of the present invention are described with reference to the flowcharts and / or block diagrams of the methods, terminal devices (systems), and computer program products according to the embodiments of the present invention. It should be understood that each flow and / or block in the flowchart and / or block diagram can be realized by computer program instructions, and the combination of the flows and / or blocks in the flowchart and / or block diagram can also be realized by computer program instructions. These computer program instructions can be provided to the processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing terminal devices to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing terminal devices generate a device for realizing the functions specified in Figure 1 one flow or multiple flows and / or blocks Figure 1 one block or multiple blocks.

[0124] These computer program instructions can also be stored in a computer-readable memory that can direct a computer or other programmable data processing terminal devices to work in a specific manner, so that the instructions stored in the computer-readable memory generate a manufactured product including an instruction device, and the instruction device realizes the functions specified in Figure 1 one flow or multiple flows and / or blocks Figure 1 one block or multiple blocks.

[0125] These computer program instructions can also be loaded onto a computer or other programmable data processing terminal device, so that a series of operation steps are executed on the computer or other programmable terminal device to generate a computer-implemented process. Thus, the instructions executed on the computer or other programmable terminal device provide steps for implementing the functions specified in one process Figure 1 one process or multiple processes and / or blocks Figure 1 steps for implementing the functions specified in one block or multiple blocks.

[0126] Although the preferred embodiments of the embodiments of the present invention have been described, those skilled in the art can make additional changes and modifications once they learn the basic creative concepts. Therefore, the appended claims are intended to be construed as including the preferred embodiments and all changes and modifications falling within the scope of the embodiments of the present invention.

[0127] Finally, it should also be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or terminal device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or terminal device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or terminal device comprising the element.

[0128] The above has introduced in detail a driving isolation circuit of a wafer transfer system, a driving isolation circuit module of a wafer transfer system, a driving control system of a wafer transfer, a driving control circuit of a wafer transfer system, and a semiconductor process equipment provided by the present invention. Specific examples are used in this article to elaborate on the principle and implementation manner of the present invention. The description of the above embodiments is only used to help understand the method and its core idea of the present invention; at the same time, for those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present invention.

Claims

1. A driving isolation circuit for a wafer transfer system, characterized in that, The driving isolation circuit is located among the controller, the isolated power supply module, and the motor drive board, and includes: an optocoupler module and a switch module. The switch module is connected between the optocoupler module and the controller, and is used to receive the first control signal from the controller, and when the first control signal is at the first high level, make the optocoupler module conduct. The optocoupler module is connected between the isolated power supply module and the motor drive board; the optocoupler module includes a light-emitting element and a light-sensing element. One end of the light-emitting element is connected to the isolated power supply module to receive the second high level provided by the isolated power supply module, and the other end is connected to the switch module; when the optocoupler module conducts, a second control signal is generated and sent to the motor drive board so that the motor drive board generates a motor drive signal according to the second control signal. Among them, the voltage of the second high level is higher than the voltage of the first high level.

2. The driving isolation circuit of the wafer transfer system according to claim 1, wherein The light-emitting element is a light-emitting diode. The cathode end of the light-emitting diode is connected to the switch module, and the anode end of the light-emitting diode is connected to the isolated power supply module; the light-sensing element is connected to the motor drive board. When the first control signal is at the first high level, the switch module makes the cathode end of the light-emitting diode at a low level, so that the light-emitting diode conducts and emits a light signal, and the light-sensing element generates a second control signal based on the light signal.

3. The drive isolation circuit of the wafer transfer system according to claim 2, wherein It further includes: A first current limiter. The first current limiter is located between the isolated power supply module and the anode end of the light-emitting diode of the optocoupler module, and is used to limit the current between the isolated power supply module and the anode end of the light-emitting diode of the optocoupler module.

4. The drive isolation circuit of the wafer transfer system according to claim 3, characterized in that, The first current limiter includes: a first current-limiting resistor. The first current-limiting resistor is connected in series between the isolated power supply module and the anode end of the light-emitting diode of the optocoupler module.

5. The drive isolation circuit of the wafer transfer system according to claim 1, characterized in that, The voltage of the second high level provided by the isolated power supply module is 24 volts, and the voltage of the first high level of the control signal is 5 volts.

6. The drive isolation circuit of the wafer transfer system according to claim 2, wherein The switch module includes: a triode, which is used to receive the control signal from the controller and adjust the level of the cathode end of the light-emitting diode based on the control signal. The base of the triode is connected to the controller, the collector of the triode is connected to the cathode end of the light-emitting diode of the optocoupler module, and the emitter of the triode is grounded. When the control signal is at the first high level, the collector and the emitter are in a conducting state, and the level of the cathode end of the light-emitting diode is at a low level. When the control signal is at a low level, the collector and the emitter are in a cut-off state, and the level of the cathode end of the light-emitting diode is at a high level.

7. The drive isolation circuit of the wafer transfer system according to claim 6, characterized in that, The switch module further includes: a second current limiter. The second current limiter is located between the controller and the base, and is used to limit the current between the controller and the base.

8. The driving isolation circuit of the wafer transfer system according to claim 7, characterized in that, The second current limiter includes: A second current-limiting resistor connected in series between the controller and the base; and / or, A pull-down resistor, one end of which is connected to the base and the other end is grounded.

9. A driving isolation circuit module of a wafer transfer system, characterized in that, It includes: A printed circuit board body, a drive board interface module, and a controller interface module. At least one set of drive isolation circuits of the wafer transfer system as described in any one of claims 1-8 is provided on the printed circuit board; The controller interface module is provided on the printed circuit board body and is connected to the input end of the drive isolation circuit; The drive board interface module is provided on the printed circuit board body and is connected to the output end of the drive isolation circuit.

10. The driving isolation circuit module of the wafer transfer system according to claim 9, wherein The drive isolation circuit is formed by double-sided wiring on the printed circuit board body.

11. The driving isolation circuit module of the wafer transfer system according to claim 9, characterized in that, The controller interface module is a double-layer terminal block.

12. The driving isolation circuit module of the wafer transfer system according to claim 9, characterized in that, Further included: A guide rail, connected to the printed circuit board body, and the printed circuit board body slides freely on the guide rail.

13. A wafer transfer drive control system, characterized in that, It includes a drive isolation circuit module, a controller, a motor drive board, an isolation power supply module, and a motor of the wafer transfer system as described in any one of claims 9-12; The controller is connected to the controller interface module of the drive isolation circuit module; the motor drive board is located between the drive board interface module of the drive isolation circuit module and the motor.

14. A drive control circuit of a wafer transfer system, characterized in that, It includes a control circuit provided in the controller, a motor drive circuit provided in the motor drive board, an isolation power supply circuit provided in the isolation power supply module, and a drive isolation circuit as described in any one of claims 1-8; The isolation power supply module includes a first isolation power supply, which is connected to the light emission module of the optocoupler module and provides a second high level for the optocoupler module; The isolation power supply module further includes a second isolation power supply, which is connected to the motor drive circuit and provides a third high level for the motor drive circuit; The voltage of the third high level is higher than the voltage of the first high level.

15. A drive control circuit for a wafer transfer system, characterized in that, It includes a control circuit provided in the controller, a motor drive circuit provided in the motor drive board, an isolation power supply circuit provided in the isolation power supply module, and a drive isolation circuit as described in any one of claims 1-8; The isolation power supply module includes a first isolation power supply, which is connected to the light emission module of the optocoupler module and provides a second high level for the optocoupler module; the first isolation power supply is also connected to the motor drive circuit and provides a second high level for the motor drive circuit.

16. A semiconductor processing apparatus, characterized in that, Included: The wafer transfer system as described in claim 13, or the drive control circuit as described in claim 14 or 15.

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