Circuit board, circuit board assembly, electrical equipment and preparation method of circuit board

Abstract

The invention belongs to the technical field of circuit board assembly equipment, and particularly relates to a circuit board, a circuit board assembly, electrical equipment and a preparation method of the circuit board. The circuit board comprises a substrate which is provided with an opening area, the opening area is provided with a jack, the jack is used for plugging a pin, and the side surface of the pin abuts against the hole wall of the jack when the pin is inserted into the jack; and the plurality of ribs are arranged on the substrate, and an included angle is formed between the extension direction of the ribs and the force application direction of the insertion needle to the hole wall of the insertion hole. According to the technical scheme, the problems that the circuit board is bent and deformed due to the fact that the pins of the plug connector are inserted into the jacks of the circuit board, and the connection points between the electronic element and the wires are prone to breakage are solved.

Description

Technical Field

[0001] This application belongs to the technical field of circuit board component devices, and particularly relates to a circuit board, a circuit board component, an electrical device, and a preparation method of the circuit board. Background Art

[0002] A circuit board refers to a substrate on which electronic components are provided. The electronic components include, but are not limited to, resistor components, capacitor components, diodes, triodes, etc., and each electronic component is electrically connected by laying wiring on the substrate, so as to achieve the required electrical performance.

[0003] Currently, the circuit board has the characteristics of high wiring density, light weight, and thin thickness. The board thickness of the circuit board is generally between 2 mm and 3 mm. When the board area of the circuit board is large, due to the thin board thickness of the circuit board, when the pin of the plug-in component is inserted into the jack of the circuit board, there is mutual abutment and extrusion between the pin and the hole wall of the jack, generating mutual acting stress, and then causing the overall circuit board to bend and deform. The bending deformation of the circuit board easily causes the connection position between the electronic component and the wiring to break, resulting in poor electrical contact, and seriously, it will cause the electrical connection to fail and lead to the scrapping of the entire circuit board. Summary of the Invention

[0004] The purpose of this application is to provide a circuit board, a circuit board component, an electrical device, and a preparation method of the circuit board, aiming to solve the problem that the insertion of the pin of the plug-in component into the jack of the circuit board causes the circuit board to bend and deform, and easily causes the connection point between the electronic component and the wiring to break.

[0005] To achieve the above purpose, according to the first aspect of this application, the technical solution adopted is: A circuit board, comprising:

[0006] A substrate having an opening area, and jacks are provided in the opening area for inserting pins, and the side surface of the pin abuts against the hole wall of the jack when the pin is inserted into the jack;

[0007] A plurality of ribs are provided on the substrate, and the extending direction of the ribs is set at an angle with the force application direction of the pin against the hole wall of the jack.

[0008] In the circuit board provided by the embodiment design of this application, a plurality of ribs are provided on its substrate. The ribs improve the mechanical strength of the substrate, and since the extending direction of the ribs is set at an angle with the force application direction of the pin against the hole wall of the jack, the ribs can help the substrate offset at least a part of the force applied by the pin to the substrate, thereby reducing the deformation amount of the bending deformation generated when the plug-in component is inserted into the substrate or avoiding the bending deformation of the substrate, so that the connection position between the electronic component and the wiring on the circuit board can be kept intact and in good electrical connection, and the product yield of the circuit board is improved.

[0009] In some embodiments of the present application, at least one end of each rib extends beyond the opening area. In this way, the ribs not only enhance the mechanical strength of the opening area, but also enhance the mechanical strength outside the opening area, and the two ends of the ribs extending beyond the opening area can hold the opening area, thereby helping to offset at least a part of the force applied by the pin to the substrate, so as to reduce the deformation amount of the substrate bending during the insertion of the connector or to prevent the substrate from bending.

[0010] In some embodiments of the present application, two adjacent ribs are arranged at intervals.

[0011] In some embodiments of the present application, the substrate includes a plurality of base layers arranged in a stacked manner, and at least one of the outermost two outer sides of the plurality of base layers is provided with ribs. In this way, the ribs can first respond to and bear the acting stress applied by the pins of the connector, thereby reducing the deformation amount of the substrate bending or preventing the substrate from bending.

[0012] In some embodiments of the present application, the substrate includes a plurality of base layers arranged in a stacked manner, and the ribs are arranged between two adjacent base layers. The ribs can respond to and bear the acting stress, so that the deformation amount of the substrate bending is reduced or the substrate does not bend. Further, at least one of the outermost two outer sides of the plurality of base layers is provided with ribs.

[0013] In some embodiments of the present application, the distance between two adjacent ribs in the same plane is between 1.5 mm and 3.5 mm. In this way, the corresponding relationship between the distance between two adjacent ribs and the distance between two adjacent jacks enables the acting stress applied by each pin to be borne by the corresponding at least one (or two) ribs.

[0014] In some embodiments of the present application, any two ribs are arranged in parallel. In this way, the distribution mode of each rib on the substrate can be simplified, so that each rib can be quickly arranged on the substrate.

[0015] In some embodiments of the present application, the substrate includes a plurality of base layers arranged in a stacked manner, and at least one rib is arranged between any two adjacent base layers. When the connector is inserted onto the circuit board, the acting stress applied by the pins needs to be transmitted to the ribs through the corresponding base layer, and then the ribs respond to and bear the acting stress, so that the deformation amount of the substrate bending is reduced or the substrate does not bend. Further, at least one of the outermost two outer sides of the plurality of base layers is provided with ribs.

[0016] In some embodiments of the present application, the width of each rib is between 2 mm and 6 mm, preferably between 3 mm and 5 mm. On the basis that the ribs act together to enhance the mechanical strength of the substrate, the number of assembled ribs can be reduced, and the material cost of the circuit board can be lowered.

[0017] In some embodiments of the present application, the thickness of each rib is between 35 μm and 70 μm, meeting the manufacturing requirement that the thickness of the circuit board remains basically unchanged.

[0018] In some embodiments of the present application, each pin has two abutting positions that abut against the inner wall of the socket. The two abutting positions and the axis of the socket are in the same plane, and this plane is perpendicular to the extending direction of each rib. The rib can significantly withstand the component force causing the board to bend and deform, thereby reducing the deformation amount of the substrate due to board bending or even preventing the board from bending and deforming.

[0019] In some embodiments of the present application, at least part of the ribs are arranged as wirings electrically connected to the pins, thereby reasonably optimizing the wiring design of the circuit board, reducing the difficulty of laying the wirings, and improving the production efficiency of assembling and producing the circuit board.

[0020] In some embodiments of the present application, the base layer is provided with an inlay groove, and the rib is inlaid in the inlay groove.

[0021] In some embodiments of the present application, the material of the rib includes metal materials and / or non-metal materials. Among them, the metal materials include copper, steel, aluminum, or aluminum alloy materials.

[0022] According to the second aspect of the present application, a method for manufacturing a circuit board is provided for manufacturing the aforementioned circuit board. The method for manufacturing the circuit board includes the following steps:

[0023] Lay wirings on the base layer to form a substrate;

[0024] Drill sockets for inserting pins in the substrate to form an opening area, and after the pins are inserted into the sockets, they can be electrically connected to the corresponding wirings;

[0025] Lay ribs on the base layer, and the extending direction of the ribs is set at an angle to the direction of the force exerted by the pins on the inner wall of the sockets.

[0026] In some embodiments of the present application, the substrate is composed of a plurality of base layers stacked. Ribs are laid on at least one of the outermost two outer sides of the plurality of base layers, and wirings are laid between adjacent two base layers.

[0027] In some embodiments of the present application, the substrate is composed of a plurality of base layers stacked. After laying the wirings and ribs on one base layer, another base layer is stacked.

[0028] In some embodiments of the present application, after stacking a plurality of base layers, ribs are laid on at least one of the two outermost outer surfaces of the plurality of base layers.

[0029] According to the third aspect of the present application, a circuit board assembly is provided, including a plug-in component and the circuit board as described above, and the pins of the plug-in component are inserted into the jacks of the circuit board.

[0030] In some embodiments of the present application, the pins are plate-shaped, and the extending direction of the ribs is perpendicular to the plate plane of the pins.

[0031] According to the fourth aspect of the present application, an electrical device is provided, including the circuit board assembly as described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0033] Figure 1 It is an exploded view of the circuit board and the plug-in component of the present application;

[0034] Figure 2 For Figure 1 the enlarged view at A in

[0035] Figure 3 It is an exploded view of the circuit board in some embodiments of the present application Figure 1 ;

[0036] Figure 4 It is an exploded view of the circuit board in some embodiments of the present application Figure 2 ;

[0037] Figure 5 It is an exploded view of the circuit board in some embodiments of the present application Figure 3 ;

[0038] Figure 6 It is an exploded view of the circuit board in some embodiments of the present application Figure 4 ;

[0039] Figure 7 It is a schematic structural diagram of the plug-in component adopted by the circuit board assembly of the present application;

[0040] Figure 8 It is a schematic structural diagram of an electric vehicle.

[0041] Among them, the reference numerals in the drawings:

[0042] 100. Circuit board;

[0043] 10. Substrate; 101. Opening area; 11. Jack; 12. Inlay groove; 13. Base layer; 131. First base layer; 132. Second base layer; 133. Third base layer;

[0044] 20. Connector; 21. Pin; 22. Contact position; 221. First contact position; 222. Second contact position;

[0045] 30. Rib;

[0046] 200. Electric vehicle; 210. Electrical equipment. Detailed implementation manner

[0047] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present application, and should not be construed as limiting the present application.

[0048] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present application.

[0049] In addition, the terms "first", "second", etc. are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present application, the meaning of "a plurality" is two or more unless otherwise specifically defined.

[0050] In the present application, unless otherwise clearly specified and defined, the terms "mount", "connect", "couple", "fix", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral body; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0051] With the continuous improvement of people's material living quality, various electrical devices have emerged to meet the needs of people's daily life. Among different electrical devices, circuit board components with various electrical properties are inevitably used. In a circuit board component, the circuit board component includes a circuit board and a connector inserted on the circuit board. Specifically, the pins of the connector are inserted into the holes of the circuit board, so that the connector can be stably located on the circuit board, and electrical connection is achieved through the pins and the wiring of the circuit board. In order to achieve the required electrical properties, a circuit board with corresponding electrical properties needs to be applied. During the process of assembling and producing electrical devices, first, qualified and high-quality circuit boards need to be produced, then qualified and durable circuit board components need to be produced, and then these connections can be used to assemble and produce electrical devices with excellent quality. That is, producing qualified and high-quality circuit boards is one of the decisive factors for assembling and producing electrical devices with excellent quality.

[0052] In the related art, the board thickness of the circuit board is generally between 2 mm and 3 mm, that is, the substrate of the circuit board is a relatively thin sheet. When assembling and producing a circuit board component, during the process of inserting the pins of the circuit board component into the holes of the circuit board, the outer wall surface of the pin and the hole wall surface of the hole abut against each other to generate sliding friction, that is, the pin applies a stress to the circuit board. Since the substrate of the circuit board is a relatively thin sheet, therefore, the circuit board will undergo board bending deformation under this stress, which easily causes the connection position between the electronic components on the circuit board and the wiring of the circuit board to break, resulting in poor electrical contact, and seriously, the electrical connection fails, leading to the scrapping of the entire circuit board.

[0053] Based on the above considerations, in order to solve the problem that when the pins of the connector are inserted into the sockets of the circuit board, the circuit board is bent and deformed, which easily causes the connection points between the electronic components and the wiring to break. Therefore, the embodiments of the present application are designed to provide a circuit board, which can better solve the above technical defects, so that the substrate of the circuit board reduces the amount of bending deformation or avoids bending deformation when inserting the connector, and improves the product yield of the circuit board. In the circuit board provided by the embodiments of the present application, a plurality of ribs are additionally provided on the substrate of the circuit board. The ribs improve the mechanical strength of the substrate of the circuit board, and since the extending direction of the ribs is at an angle with the direction of the force exerted by the pin on the inner wall of the socket, the ribs can help the substrate offset at least a part of the force exerted by the pin on the substrate, thereby reducing the amount of bending deformation or avoiding bending deformation of the substrate of the circuit board when inserting the connector, so that the connection position between the electronic components on the circuit board and the wiring of the circuit board can be kept intact and electrically connected properly, and the product yield of the circuit board is improved. Moreover, the circuit board is applied to the assembly production of circuit board components, so as to assemble and produce qualified and durable circuit board components, and the assembled circuit board components are applied to the assembly production of electrical equipment, so as to assemble and produce high-quality electrical equipment.

[0054] As Figure 1 and Figure 2 shown, the circuit board 100 provided by the embodiments of the present application includes a substrate 10 and a plurality of ribs 30. Electronic components are provided on the substrate 10, and the respective electronic components are electrically connected by laying wiring on the substrate 10, so that the circuit board 100 can achieve the required electrical performance. The substrate 10 has an opening area 101, and sockets 11 are provided in the opening area 101. The sockets 11 are used for inserting pins 21, and the side surface of the pin 21 abuts against the inner wall of the socket 11 when the pin 21 is inserted into the socket 11. The plurality of ribs 30 are provided on the substrate 10, and the extending direction of the ribs 30 is at an angle with the direction of the force exerted by the pin 21 on the inner wall of the socket 11.

[0055] "The substrate 10" refers to: the basic material for manufacturing the circuit board 100, which is a plate member serving as a carrier, and all the electronic components and wiring of the circuit board 100 are provided on this plate member.

[0056] "The wiring of the circuit board 100" refers to: the conductive pattern on the substrate 10, which can be a copper-clad circuit, or a printed circuit, etc.

[0057] In the embodiments provided by the design of the present application, a plurality of ribs 30 are provided on the substrate 10 of the circuit board 100. The ribs 30 act together to improve the mechanical strength of the substrate 10. And since the extending direction of the ribs 30 forms an angle with the direction of the force exerted by the pin 21 on the hole wall of the jack 11, the ribs 30 can help the substrate 10 offset at least a part of the force exerted by the pin 21 on the substrate 10, thereby reducing the amount of bending deformation of the substrate 10 when the connector 20 is inserted or preventing the substrate 10 from bending and deforming, so that the connection position between the electronic components and the wiring on the circuit board 100 can be kept intact and in good electrical connection, and the product yield of the circuit board 100 is improved.

[0058] In some embodiments of the present application, two adjacent ribs 30 are spaced apart, and at least one end of each rib 30 extends beyond the opening area 101. Further, in the embodiments of the present application, both ends of each rib 30 extend beyond the opening area 101. In this way, the ribs 30 not only enhance the mechanical strength of the opening area 101, but also enhance the mechanical strength of the substrate 10 outside the opening area 101. Moreover, both ends of the ribs 30 extending beyond the opening area 101 can hold the opening area 101, thereby helping to offset at least a part of the force exerted by the pin 21 on the substrate 10, thereby reducing the amount of bending deformation of the substrate 10 when the connector 20 is inserted or preventing the substrate from bending and deforming.

[0059] "Both ends of each rib 30 extend beyond the opening area 101" means that a part of the plurality of ribs 30 passes through the opening area 101, and both ends of the ribs 30 passing through the opening area 101 in this part exceed the opening area 101; another part of the plurality of ribs 30 is arranged in the area outside the opening area 101 of the substrate 10 (that is, the "other part of the ribs 30" here does not pass through the opening area 101). In the projection in the top view direction of the circuit board 100, both ends of the ribs 30 that do not pass through the opening area 101 in this part extend beyond the opening area 101; moreover, both ends of all the ribs 30 can extend to the edge of the substrate 10 or extend close to but not reach the edge of the substrate 10.

[0060] In some other embodiments of the present application, among the two ends of each rib 30 extending through the opening area 101, one end extends beyond the opening area 101 and the other end is located within the opening area 101. The end of the rib 30 extending beyond the opening area can hold the opening area 101, thereby helping to offset the force exerted by the pin 21 on the substrate 10, thereby reducing the amount of bending deformation of the substrate 10 when the connector 20 is inserted or preventing the substrate 10 from bending and deforming.

[0061] In still other embodiments of the present application, both ends of each rib 30 within the opening area 101 may also be restricted within the opening area 101, so that only the mechanical strength of the opening area 101 is enhanced. Even so, the ribs 30 can still enhance the mechanical strength of the opening area 101 and help the opening area 101 offset a part of the force applied by the pin 21, thereby reducing the board bending deformation of the substrate 10.

[0062] In some embodiments of the present application, as Figures 3 to 6 shown, the substrate 10 includes a plurality of base layers 13 stacked, and the substrate 10 is formed by stacking in a multi-layer design manner. Wiring is laid on different base layers 13, simplifying the laying difficulty of the wiring of the circuit board 100. As Figure 4 shown, ribs 30 are provided on the outer side surfaces of the two outermost of the plurality of base layers 13. That is, the ribs 30 can be visually seen from the top view and bottom view appearances of the circuit board 100. In this way, no matter which side surface of the two side surfaces of the circuit board 100 is the front side of the circuit board for inserting the connector 20, the ribs 30 on the front side surface of the circuit board can first respond and bear the acting stress applied by the pins 21 of the connector 20, thereby reducing the amount of board bending deformation of the substrate 10 or preventing the substrate 10 from undergoing board bending deformation.

[0063] In some embodiments of the present application, as Figures 3 to 6 shown, the substrate 10 includes a plurality of base layers 13 stacked, and by means of a multi-layer design, wiring is laid on different base layers 13, simplifying the laying difficulty of the wiring of the circuit board 100. As Figure 3 shown, all the ribs 30 are fixedly arranged on the outer side surface of one of the two outermost of the plurality of base layers 13. That is, when the outer side surface provided with the ribs 30 is used as the front side of the circuit board (the other outer side surface without the ribs 30 is the back side of the circuit board), the ribs 30 can be visually seen from the appearance of the front side in the top view direction of the circuit board 100. When the connector 20 is inserted from the front side of the circuit board, the ribs 30 on the front side surface of the circuit board can first respond and bear the acting stress applied by the pins 21 of the connector 20, thereby reducing the amount of board bending deformation of the substrate 10. When the connector 20 is inserted from the back side of the circuit board, the acting stress applied by the pins 21 is transmitted by the substrate 10 to the ribs 30, and then the ribs 30 respond and bear the acting stress, so that the amount of board bending deformation of the substrate 10 is reduced or the substrate 10 does not undergo board bending deformation.

[0064] In some embodiments of the present application, as Figures 3 to 6 shown, the substrate 10 includes a plurality of base layers 13 stacked, and by means of a multi-layer design, wiring is laid on different base layers 13, simplifying the laying difficulty of the wiring of the circuit board 100. As Figure 5 andFigure 6 As shown, the rib 30 is disposed between two adjacent base layers 13. At this time, the rib 30 cannot be seen from the top and bottom views of the circuit board 100. Taking the substrate 10 including three base layers 13 as an example, as Figure 5 and Figure 6 shown, that is, the substrate 10 includes a first base layer 131, a second base layer 132, and a third base layer 133 stacked in sequence. All the ribs 30 are disposed between the first base layer 131 and the second base layer 132, or all the ribs 30 are disposed between the second base layer 132 and the third base layer 133. At this time, when the connector 20 is inserted onto the circuit board 100, the acting stress applied by the pin 21 needs to be transmitted to the rib 30 through the corresponding base layer 13, then the rib 30 responds and bears the acting stress, so that the deformation amount of the board bending of the substrate 10 is reduced or the substrate 10 does not undergo board bending deformation. For example, all the ribs 30 are disposed between the first base layer 131 and the second base layer 132, and the outer side surface of the first base layer 131 is used as the front side of the circuit board to insert the connector 20, then the acting force applied by the pin 21 is transmitted to the rib 30 through the first base layer 131; or, the outer side surface of the third base layer 133 is used as the front side of the circuit board to insert the connector 20, then the acting stress applied by the pin 21 is transmitted to the rib 30 in sequence through the third base layer 133 and the second base layer 132.

[0065] Moreover, on the basis that the rib 30 is disposed between two adjacent base layers 13, ribs 30 are also disposed on at least one of the outer side surfaces of the outermost two of the plurality of base layers 13.

[0066] In some embodiments of the present application, the distance between two adjacent ribs 30 in the same plane is between 1.5 mm and 3.5 mm. Generally, the interval between two adjacent pins 21 of the connector 20 in the first direction X is between 1.5 mm and 3.5 mm. Correspondingly, the distance between two adjacent jacks 11 in the first direction X within the opening area 101 is between 1.5 mm and 3.5 mm. In this way, in the first direction X, the corresponding relationship between the distance between two adjacent ribs 30 and the distance between two adjacent jacks 11 enables the acting stress applied by each pin 21 to be borne by the corresponding at least one (or two) ribs 30, so that the deformation amount of the board bending of the substrate 10 is reduced or the substrate 10 does not undergo board bending deformation.

[0067] In the embodiments of the present application, the distance between two adjacent ribs 30 in the same plane is preferably between 1.2 mm and 2.0 mm.

[0068] The first direction X is: when each pin 21 has two abutting positions 22 that abut against the inner wall of the jack 11, the extending direction of the line connecting these two abutting positions 22 is the first direction X. And, the extending direction of the rib 30 is defined as the second direction.

[0069] In some embodiments of the present application, as Figures 3 to 6 shown, the substrate 10 includes a plurality of base layers 13 arranged in a stacked manner. By means of a multi-layer design, wiring is laid on different base layers 13, simplifying the difficulty of laying the wiring of the circuit board 100. As Figure 6 shown, at least one rib 30 is provided between any two adjacent base layers 13. At this time, the rib 30 cannot be seen from the top and bottom views of the circuit board 100. Taking the substrate 10 including three base layers 13 as an example, as Figure 6 shown, that is, the substrate 10 includes a first base layer 131, a second base layer 132, and a third base layer 133 arranged in sequence. A rib 30 is provided between the first base layer 131 and the second base layer 132, and a rib 30 is also provided between the second base layer 132 and the third base layer 133. At this time, when the connector 20 is inserted onto the circuit board 100, the acting stress applied by the pin 21 needs to be transmitted to the rib 30 through the corresponding base layer 13, then the rib 30 responds and bears the acting stress, reducing the amount of bending deformation of the substrate 10 or preventing the substrate 10 from undergoing bending deformation. When inserting the connector 20 with the outer side of the first base layer 131 as the front side of the circuit board, the acting force applied by the pin 21 is transmitted to the rib 30 between the first base layer 131 and the second base layer 132 through the first base layer 131, and then the second base layer 132 continues to transmit the acting stress to the rib 30 between the second base layer 132 and the third base layer 133; or, when inserting the connector 20 with the outer side of the third base layer 133 as the front side of the circuit board, the acting stress applied by the pin 21 is transmitted from the third base layer 133 to the rib 30 between the second base layer 132 and the third base layer 133, and then the second base layer 132 continues to transmit the acting stress to the rib 30 between the second base layer 132 and the first base layer 131.

[0070] Moreover, on the basis that at least one rib 30 is provided between any two adjacent base layers 13, ribs 30 are also provided on at least one of the outer sides of the outermost two of the plurality of base layers 13.

[0071] In some embodiments of the present application, any two ribs 30 are arranged in parallel. This can simplify the distribution mode of each rib 30 on the substrate 10, enabling each rib 30 to be quickly arranged on the substrate 10, thereby efficiently completing the assembly production work of the circuit board 100.

[0072] In some other embodiments of the present application, any two ribs 30 may also be arranged in a crossed manner.

[0073] Referring to Figure 7 As shown, each pin 21 has two abutting positions 22 that abut against the hole wall of the jack 11, namely a first abutting position 221 and a second abutting position 222. The first abutting position 221, the second abutting position 222 and the hole axis of the jack 11 are located in the same plane. That is, the pin 21 is a strip-shaped sheet pin, and an oval through hole / shuttle-shaped through hole is formed on the pin 21. The two sides of the pin 21 corresponding to the oval through hole / shuttle-shaped through hole are formed into arc-shaped protrusions (that is, the pin 21 is small at both ends and large in the middle, and the end of the pin 21 inserted into the jack 11 is smaller than the other end). This pin 21 is also commonly referred to as an eagle-eye structure. When such a pin 21 is inserted into the jack 11, the arc-shaped protrusions on both sides of the pin 21 corresponding to the oval through hole / shuttle-shaped through hole abut against the hole wall of the jack 11, that is, the first abutting position 221 and the second abutting position 222 respectively abut against the hole wall of the jack 11. And during the process of the pin 21 being inserted into the jack 11, due to the existence of the oval through hole / shuttle-shaped through hole, the arc-shaped protrusions on both sides of the pin 21 can produce adaptive elastic deformation, so as to be smoothly inserted into the jack 11. Therefore, the arc-shaped protrusions on both sides are in line contact with the hole wall of the jack 11 respectively (that is, the first abutting position 221 is in line contact with the hole wall of the jack 11, and the second abutting position 222 is in line contact with the hole wall of the jack 11), then the first abutting position 221, the second abutting position 222 and the hole axis of the jack 11 are located in the same plane. In this circuit board 100, this plane intersects with the extending direction (i.e., the second direction) of each rib 30. During the process of the pin 21 being inserted into the jack 11, the acting stress applied by the pin 21 to the substrate 10 can be divided into a first component force along the extending direction of the pin 21 and a second component force perpendicular to the first component force. It is precisely because the first component force acts on the substrate 10 that the substrate 10 has a deformation like an arch with plate bending. Therefore, ribs 30 are provided on the substrate 10. The ribs 30 bear the first component force and guide the first component force to be dispersed into a direction force perpendicular to the plane where the two line-contact abutting positions 22 and the hole axis of the jack 11 are located. At this time, the extending direction of the ribs 30 is arranged at an angle with respect to the plane where the first abutting position 221, the second abutting position 222 and the hole axis of the jack 11 are located. Therefore, the ribs 30 can bear a part of the direction force after the first component force is dispersed, that is, the mechanical strength of the substrate 10 is enhanced, thereby reducing the deformation amount of the substrate 10 with plate bending deformation.

[0074] In some embodiments of the present application, the width of each rib 30 is between 2 mm and 6 mm. Selecting ribs 30 with appropriate widths for assembly can achieve the strengthening effect while satisfying the stress dispersion effect. On the basis of enabling the combined action of each rib 30 to enhance the mechanical strength of the substrate 10, the number of ribs 30 for assembly can also be reduced, and the material cost of the circuit board 100 can be lowered. In the embodiments of the present application, it is preferably that the width of each rib 30 is between 3 mm and 5 mm.

[0075] In some embodiments of the present application, at least part of the ribs 30 are arranged as wirings electrically connected to the pins 21. Generally, the interval between two adjacent pins 21 of the connector 20 along the first direction X is between 1.5 mm and 3.5 mm. Correspondingly, the distance between two adjacent jacks 11 in the opening area 101 along the first direction X is between 1.5 mm and 3.5 mm. In this way, when ribs 30 with a width between 2 mm and 6 mm are selected for assembly, when the rib 30 straddles the jack 11, since the width of the rib 30 is greater than the aperture of the jack 11, the rib 30 can be used as a wiring of the circuit board 100 to be electrically connected to the pin 21. Thus, the rib 30 not only realizes the combined action of each rib 30 to enhance the mechanical strength of the substrate 10, but also the rib 30 takes into account the conduction function of the circuit board wiring, thereby reasonably optimizing the wiring design of the circuit board 100, reducing the difficulty of wiring layout, and improving the production efficiency of assembling and producing the circuit board 100.

[0076] In some embodiments of the present application, the ribs 30 are formed by manufacturing using metal materials including but not limited to copper, steel, aluminum, and aluminum alloy. Alternatively, the ribs 30 can also be prepared and formed using non-metallic materials.

[0077] In some embodiments of the present application, the thickness of each rib 30 is between 35 μm and 70 μm. Generally, the thickness of the circuit board 100 is between 2 mm and 3 mm. In order to meet the manufacturing requirements regarding the thickness of the circuit board 100, the designed thickness of the rib 30 cannot be too thick. On the basis of being able to assist in bearing the acting stress applied by the pin 21, the thickness of the rib 30 is designed in consideration of the thickness of the substrate 10. In this circuit board 100, when the rib 30 is disposed on the outer side surfaces of the outermost two of the plurality of base layers, the rib 30 can be laid flat on the outer side surface. In this way, on the basis of realizing the combined action of each rib 30 to enhance the mechanical strength of the substrate 10, the amount of deformation of the circuit board 100 due to board bending during the insertion of the connector 20 is reduced or no board bending deformation occurs, and the overall thickness of the circuit board 100 is not significantly increased, meeting the industry requirements for the thickness of the circuit board. Alternatively, in this circuit board 100, the rib 30 is embedded in the embedding groove 12 of the corresponding base layer 13, and the surface of the rib 30 is flush with or higher than the surface of the corresponding base layer 13. It should be noted that the strength of the embedded rib 30 must be greater than the strength of the base layer 13. During design, the strength difference between the two can be achieved by selecting different materials for the rib 30, or by changing the thickness of the rib 30 and the height of the embedding groove 12. In this way, not only does each rib 30 act together to enhance the mechanical strength of the substrate 10, reducing the amount of deformation of the circuit board 100 due to board bending during the insertion of the connector 20 or preventing board bending deformation, but also the thickness of the circuit board 100 is not increased at all, and the substrate 10 can still maintain its original mechanical strength well after the embedding groove for placing the rib 30 is formed.

[0078] In some embodiments of the present application, with reference to Figure 7As shown, each pin 21 has two abutting positions 22 that abut against the hole wall of the jack 11, namely the first abutting position 221 and the second abutting position 222. The first abutting position 221, the second abutting position 222, and the hole axis of the jack 11 are all located in the same plane. That is to say, the pin 21 is a long strip-shaped sheet pin, and an oval through hole / fusiform through hole is formed on the pin 21. The two sides of the pin 21 corresponding to the oval through hole / fusiform through hole are formed into arc-shaped protrusions (that is, the pin 21 is small at both ends and large in the middle, and the end of the pin 21 inserted into the jack 11 is smaller than the other end). This pin 21 is also commonly referred to as an eagle-eye structure. When such a pin 21 is inserted into the jack 11, the arc-shaped protrusions on both sides of the pin 21 corresponding to the oval through hole / fusiform through hole both abut against the hole wall of the jack 11, that is, the first abutting position 221 and the second abutting position 222 respectively abut against the hole wall of the jack 11. And during the process of the pin 21 being inserted into the jack 11, due to the existence of the oval through hole / fusiform through hole, the arc-shaped protrusions on both sides of the pin 21 can produce adaptive elastic deformation, so as to be smoothly inserted into the jack 11. Therefore, the arc-shaped protrusions on both sides are in line contact with the hole wall of the jack 11 respectively (that is, the first abutting position 221 is in line contact with the hole wall of the jack 11, and the second abutting position 222 is in line contact with the hole wall of the jack 11), then the first abutting position 221, the second abutting position 222, and the hole axis of the jack 11 are all located in the same plane. And the plane where the two line-contact abutting positions 22 and the hole axis of the jack 11 are located is perpendicular to the extending direction of each rib 30 (that is, the second direction). During the process of the pin 21 being inserted into the jack 11, the acting stress applied by the pin 21 to the substrate 10 can be decomposed into a first component force along the extending direction of the pin 21 and a second component force perpendicular to the first component force. It is precisely because the first component force acts on the substrate 10 that the substrate 10 has a deformation like an arch. Therefore, ribs 30 are provided on the substrate 10. The ribs 30 bear the first component force and guide the first component force to be dispersed into a directional force perpendicular to the plane where the two line-contact abutting positions 22 and the hole axis of the jack 11 are located. At this time, since the plane where the first abutting position 221, the second abutting position 222, and the hole axis of the jack 11 are located is orthogonal to the extending direction of the rib 30, the dispersed directional force is the same as the extending direction of the rib 30. Therefore, the rib 30 can significantly bear the first component force, that is, enhance the mechanical strength of the substrate 10, thereby reducing the deformation amount of the substrate 10 undergoing plate bending deformation or even preventing the substrate 10 from undergoing plate bending deformation.

[0079] The design solution adopted for the circuit board 100 provided by the embodiments of the present application is as follows: All rib strips 30 are provided on the front side of the substrate 10 of the circuit board 100 (all the electronic components of the circuit board 100 are located on the front side of the substrate 10, such as capacitors, inductors, resistors, etc.). Both ends of each rib strip 30 extend beyond the opening area 101; any two rib strips 30 are arranged in parallel, the distance between adjacent two rib strips 30 is between 1.5 mm and 3.5 mm, the width of each rib strip 30 is between 2 mm and 6 mm, and the thickness of each rib strip 30 is between 35 μm and 70 μm; moreover, there are two abutting positions 22 between the hole wall of each jack 11 and the pin 21, and the two abutting positions 22 and the hole axis of the jack 11 are in the same plane, and this plane is orthogonal to the extending direction of the rib strip 30.

[0080] According to another aspect of the present application, a manufacturing method for manufacturing the above-mentioned circuit board 100 (simply referred to as a manufacturing method for a circuit board) is provided.

[0081] The manufacturing method for this circuit board includes the following steps:

[0082] Step S10: Lay wiring on the base layer 13 to form the substrate 10. The wiring can be manufactured by photolithography. Photolithography is a common method for manufacturing circuit boards and will not be elaborated here.

[0083] Step S20: Drill holes 11 for inserting pins 21 on the substrate 10 to form the opening area 101, and after the pins 21 are inserted into the holes 11, they can be electrically connected to the corresponding wiring. A micro drill bit is used for drilling, and the drilled holes 11 can be copper-coated, that is, the copper-coated holes 11 are formed into via holes.

[0084] Step S30: Lay rib strips 30 on the base layer 13, and the extending direction of the rib strips 30 is arranged at an angle with the force application direction of the pins 21 on the hole wall of the holes 11. The rib strips 30 can be attached to the base layer 13 or embedded in the embedding groove 12 of the base layer 13.

[0085] It should be noted that: The circuit board 100 can be manufactured by sequentially executing step S10, step S20, and step S30; it can also be manufactured by executing step S10, step S30, and step S20 in sequence; it can also be manufactured by executing step S30, step S10, and step S20 in sequence.

[0086] The circuit board 100 manufactured by using the method for manufacturing a circuit board of the present application has a plurality of ribs 30 provided on its substrate 10. The mechanical strength of the substrate 10 is improved by the combined action of the ribs 30. And since the extending direction of the ribs 30 is arranged at an angle with the direction of the force applied by the pin 21 of the plug-in connector 20 to the hole wall of the socket 11, the ribs 30 can help the substrate 10 offset at least a part of the force applied by the pin 21 to the substrate 10. Therefore, the amount of deformation of the board bending generated when the plug-in connector 20 is inserted into the substrate 10 is reduced or the substrate 10 is prevented from undergoing board bending deformation, so that the connection positions between the electronic components and the wiring on the circuit board 100 can be kept intact and in good electrical connection, and the product yield of the circuit board 100 is improved.

[0087] In some embodiments of the present application, the substrate 10 is composed of a plurality of base layers 13 stacked together. The ribs 30 are laid on at least one of the outermost two outer sides of the plurality of base layers 13, and wiring is laid between adjacent two base layers 13. When the pin 21 is inserted into the socket 11, the ribs 30 can all respond to and bear the acting stress applied by the pin 21 of the plug-in connector 20, thereby reducing the amount of deformation of the board bending of the substrate 10 or preventing the substrate 10 from undergoing board bending deformation.

[0088] In some embodiments of the present application, the substrate 10 is composed of a plurality of base layers 13 stacked together. Between adjacent two base layers 13, after the wiring and the ribs 30 are laid on one base layer 13, another base layer 13 is stacked. And after the plurality of base layers 13 are stacked, the ribs 30 are laid on at least one of the outermost two outer sides of the plurality of base layers 13. When the pin 21 is inserted into the socket 11, not only the ribs 30 located between adjacent two base layers 13 can respond to and bear the acting stress applied by the pin 21 of the plug-in connector 20, but also the ribs 30 located on the outermost outer side can respond to and bear the acting stress applied by the pin 21 of the plug-in connector 20. That is to say, all the ribs 30 jointly respond to and bear the acting stress applied by the pin 21 of the plug-in connector 20, thereby further reducing the amount of deformation of the board bending of the substrate 10 or preventing the substrate 10 from undergoing board bending deformation.

[0089] According to another aspect of the present application, a circuit board assembly (not shown) is provided. Wherein, the circuit board assembly includes a plug-in connector 20 and the circuit board 100 as described above, and the pin 21 of the plug-in connector 20 is inserted into the socket 11 of the circuit board 100.

[0090] In some embodiments of the present application, the pin 21 is plate-shaped, the plate planes of the plurality of pins 21 are arranged parallel to each other, and the extending direction of the ribs 30 intersects with the plate plane of the pin 21.

[0091] In some embodiments of the present application, the extending direction of the ribs 30 is perpendicular to the plate plane of the pin 21.

[0092] According to another aspect of the present application, a design provides an electrical device 210. Among them, the electrical device 210 includes the circuit board assembly as described above. And, the electrical device 210 provided by the embodiment design of the present application is applied to an electric vehicle 200, as Figure 8 shown. For example, the electrical device 210 includes but is not limited to a battery system, an audio system, an audio-visual multimedia system, etc. on the electric vehicle 200.

[0093] The foregoing are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A circuit board, characterized in that, Comprising: a substrate having an opening area provided with jacks for inserting pins, and the side surface of the pin abuts against the wall of the jack when the pin is inserted into the jack; a plurality of ribs disposed on the substrate, and the extending direction of the ribs is at an angle with the direction of the force applied by the pin against the wall of the jack.

2. The circuit board according to claim 1, wherein: at least one end of each rib extends beyond the opening area.

3. The circuit board according to claim 1, wherein: adjacent two ribs are spaced apart.

4. The circuit board according to any one of claims 1-3, wherein: the substrate comprises a plurality of base layers stacked, and at least one of the outermost two outer sides of the plurality of base layers is provided with the ribs.

5. The circuit board according to any one of claims 1-3, wherein: the substrate comprises a plurality of base layers stacked, and the ribs are disposed between two adjacent base layers.

6. The circuit board according to claim 5, wherein: at least one of the outermost two outer sides of the plurality of base layers is provided with the ribs.

7. The circuit board according to any one of claims 1-6, wherein: the distance between adjacent two ribs in the same plane is between 1.5 mm and 3.5 mm.

8. The circuit board according to any one of claims 1-7, wherein: any two ribs are arranged in parallel.

9. The circuit board according to any one of claims 1-3, wherein: the substrate comprises a plurality of base layers stacked, and at least one rib is disposed between any two adjacent base layers.

10. The circuit board according to claim 9, wherein: at least one of the outermost two outer sides of the plurality of base layers is provided with the ribs.

11. The circuit board according to any one of claims 1-10, wherein: the width of each rib is between 2 mm and 6 mm.

12. The circuit board according to any one of claims 1-10, wherein: the width of each rib is between 3 mm and 5 mm.

13. The circuit board according to any one of claims 1-12, wherein: the thickness of each rib is between 35 μm and 70 μm.

14. The circuit board according to any one of claims 1-13, wherein: each pin has two abutting positions that abut against the wall of the jack, and the two abutting positions and the axis of the jack are in the same plane, and this plane is perpendicular to the extending direction of each rib.

15. The circuit board according to any one of claims 1-14, wherein: at least part of the ribs are arranged as wirings electrically connected to the pins.

16. The circuit board according to any one of claims 1-15, wherein: the base layer is provided with an inlay groove, and the rib is inlaid in the inlay groove.

17. The circuit board according to any one of claims 1-16, wherein: The material of the rib includes metal material and / or non-metal material, wherein the metal material includes copper material, steel material, aluminum material or aluminum alloy material.

18. A method for preparing a circuit board, characterized in that, For preparing the circuit board according to any one of claims 1-17, the preparation method of the circuit board includes the following steps: Lay wiring on the base layer to form a substrate; Drill holes for inserting pins on the substrate to form an opening area, and after the pins are inserted into the holes, they can be electrically connected to the corresponding wiring; Lay ribs on the base layer, and the extending direction of the ribs is set at an angle with the force application direction of the pins on the hole wall of the holes.

19. The preparation method of the circuit board according to claim 18, characterized in that: The substrate is composed of a plurality of the base layers stacked, and the ribs are laid on at least one of the outermost two outer sides of the plurality of base layers, and the wiring is laid between adjacent two base layers.

20. The preparation method of the circuit board according to claim 18, characterized in that: The substrate is composed of a plurality of the base layers stacked. After the wiring and the ribs are laid on one of the base layers between adjacent two base layers, another base layer is stacked.

21. The preparation method of the circuit board according to claim 18, characterized in that: After stacking a plurality of the base layers, the ribs are laid on at least one of the outermost two outer sides of the plurality of base layers.

22. A circuit board assembly, characterized in that, It includes a plug-in component and the circuit board according to any one of claims 1-17, and the pins of the plug-in component are inserted into the holes of the circuit board.

23. The circuit board assembly according to claim 22, characterized in that: The pins are plate-shaped, and the extending direction of the ribs is perpendicular to the plate plane of the pins.

24. An electrical device, characterized in that, It includes the circuit board assembly according to any one of claims 22-23.

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