An integrated circuit board that is easy to solder

Abstract

This invention relates to the field of circuit board technology and discloses an integrated circuit board that is easy to solder. The board includes a main body with solder placement holes and stepped insertion holes inside. Mounting holes are also provided inside the main body, with limiting bends inside each mounting hole. A soldering mechanism is engaged inside the mounting hole, and a second soldering mechanism is engaged on the outer surface of the first soldering mechanism. A heat dissipation mechanism is slidably connected inside the first soldering mechanism. The solder placement holes precisely guide the solder, facilitating solder placement and soldering of through-hole components. The four corner limiting bends eliminate installation stress. Soldering mechanisms one and two can flexibly adapt to different circuit boards, precisely controlling the amount and position of solder placement. The heat dissipation mechanism works in conjunction, providing positioning heat dissipation and support, preventing localized overheating, and providing all-around assistance for soldering, greatly improving soldering efficiency and product stability.

Description

Technical Field

[0001] This invention relates to the field of circuit board technology, specifically to an integrated circuit board that is easy to solder. Background Technology

[0002] In the wave of the booming development of the modern electronics industry, integrated circuit boards, as a core component of electronic products, have seen their application fields continue to expand, from everyday consumer electronics to high-end industrial control, aerospace and other professional fields, they are ubiquitous; however, as the functions of electronic products continue to be enhanced and the integration level increases, more stringent requirements are being placed on the soldering process of integrated circuit boards.

[0003] Patent application CN202322878491.7 discloses an integrated circuit board that is easy to solder, including a limiting frame. The limiting frame has a circuit board body inside. A heat dissipation fan is fixedly connected through the middle of the left and right sides of the limiting frame. A movable plate is provided on the front and rear sides of the limiting frame. A movable component is fixedly connected to the front side of the movable plate. A limiting component is provided on the front side of the movable component. The movable component includes a sliding rod, which is fixedly connected to the movable plate. A limiting ring is slidably connected through the outer wall of the sliding rod, and the limiting ring is fixedly connected to the limiting frame.

[0004] However, this patent also has the following shortcomings: during the soldering and installation process of traditional integrated circuit boards, poor compatibility, lack of guidance, insufficient heat dissipation and inaccurate positioning lead to poor soldering quality and easy damage to components. In view of this situation, an integrated circuit board that is easy to solder is proposed. Summary of the Invention

[0005] The purpose of this invention is to provide an integrated circuit board that is easy to solder, so as to solve the problems mentioned in the background art.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution: an integrated circuit board that is easy to solder, comprising a circuit board body, wherein the circuit board body has a soldering hole and a stepped insertion hole inside, a mounting hole is provided inside the circuit board body, a limiting bend is provided inside the mounting hole, a soldering mechanism is engaged inside the mounting hole, a second soldering mechanism is engaged on the outer surface of the first soldering mechanism, a heat dissipation mechanism is slidably connected inside the first soldering mechanism, and the first soldering mechanism includes:

[0007] The base plate has two sliding grooves inside. A double-hole column is engaged inside the sliding groove. The bottom of the double-hole column is threaded with a fastening bolt, and the top of the double-hole column is threaded with a limit pin. The limit pin is used to limit the position of the circuit board body.

[0008] According to the above technical solution, the double-hole column is engaged with the limiting bend hole, the bending angle of the top of the limiting bend hole is greater than the bending angle of the bottom, the diameter of the first soldering hole is the same as the outer diameter of the insertion step hole, and the limiting bend hole is used to protect the main body of the circuit board.

[0009] According to the above technical solution, the upper surface of the fastening bolt is in contact with the lower surface of the base plate, the lower surface of the limiting pin is in contact with the upper surface of the double-hole column, the lower surface of the double-hole column is flush with the lower surface of the base plate, the lower surface of the limiting pin is in contact with the upper surface of the circuit board body, and the fastening bolt is used to fix the double-hole column.

[0010] According to the above technical solution, the welding mechanism two includes an annular column one, which is engaged with a limiting pin. The limiting pin has an annular column two attached to its outer surface. The annular column one is internally threaded with a rotating handle one. The outer surface of the rotating handle one is rotatably connected with a first locking block. The annular column two is internally threaded with a rotating handle two. The outer surface of the rotating handle two is rotatably connected with a second locking block. The outer surface of the first locking block is engaged with a solder pad. The solder pad has a soldering hole two inside. The limiting pin is used to limit the movement of the annular column one and the annular column two.

[0011] According to the above technical solution, the lower surface of the first annular column is in contact with the upper surface of the second annular column, the outer surface of the second locking block is engaged with the soldering tray, the upper surface of the soldering tray is flush with the upper surface of the first annular column, and the first and second rotating handles are used to adjust the position of the soldering tray.

[0012] According to the above technical solution, the lower surface of the second annular column is in contact with the upper surface of the circuit board body, the lower surface of the solder pad is in contact with the upper surface of the circuit board body, the second solder pad has the same diameter as the first solder pad and the insertion mounting hole, the second solder pad has the same spacing as the first solder pad and the insertion mounting hole, and the second solder pad is used to solder the first solder pad and the insertion step hole.

[0013] According to the above technical solution, the heat dissipation mechanism includes a third locking block. The bottom plate has a first locking slot and a second locking slot inside. The first locking slot engages with the third locking block. An arc-shaped plate is fixedly connected to the upper surface of the third locking block. A support shell is fixedly connected to the upper surface of the arc-shaped plate. A heat dissipation device is fixedly connected to the lower surface of the support shell. A heat sink is fixedly connected to the outer surface of the support shell. The heat sink is used to dissipate heat from the circuit board body.

[0014] According to the above technical solution, the second slot is engaged with the third block, the lower surface of the arc plate is in contact with the upper surface of the base plate, the upper surface of the heat sink is in contact with the lower surface of the circuit board body, the heat dissipation device is composed of a motor and a fan blade, and the heat dissipation device is used to dissipate heat from the heat sink.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] 1. This type of integrated circuit board, which is easy to solder, features a circuit board structure with soldering holes to facilitate the soldering of soldering and through-hole components. The soldering holes precisely guide the solder flow, ensuring a firm and uniform soldering. In addition, the four corners of the circuit board are specially designed with limiting bends. During installation, the limiting bends can accurately position the circuit board, keeping it stable in a horizontal position. This effectively avoids stress caused by positional deviations. The elimination of stress comprehensively protects the performance of the circuit board and improves its installation and soldering quality.

[0017] 2. This type of easy-to-solder integrated circuit board, through the setting of a soldering mechanism, has a highly flexible adjustment mechanism that can quickly adapt to circuit boards of different sizes and shapes. When working in conjunction with circuit boards with solder holes, the soldering mechanism is precisely positioned to assist in the soldering process of through-hole components, ensuring that the circuit board does not bear additional stress throughout the soldering process, greatly improving the soldering quality and stability of the circuit board.

[0018] 3. This type of easy-to-solder integrated circuit board, by setting a second soldering mechanism, can handle circuit boards of different sizes and shapes, and can accurately control the amount and position of soldering according to the differences in the size of electronic components, laying a solid foundation for subsequent soldering and ensuring that all kinds of electronic components can be firmly soldered on the circuit board.

[0019] 4. This type of easy-to-solder integrated circuit board, through the setting of a heat dissipation mechanism, works in conjunction with the first and second soldering mechanisms. During the soldering process of tin-mounted and through-hole components, it plays a dual role in positioning, heat dissipation and support, thereby avoiding local overheating of the circuit board. Its stable support structure ensures that the circuit board remains stable during soldering, providing a solid foundation for the soldering work. It provides all-round assistance to easy-to-solder circuit boards, improving soldering quality and efficiency. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the main structure of the present invention;

[0021] Figure 2 This is a cross-sectional view of the circuit board.

[0022] Figure 3 This is a structural cross-sectional view of the welding mechanism of the present invention;

[0023] Figure 4This is a partial structural schematic diagram of the welding mechanism of the present invention;

[0024] Figure 5 This is a cross-sectional view of the welding mechanism 2 of the present invention;

[0025] Figure 6 This is a partial structural schematic diagram of the welding mechanism II of the present invention;

[0026] Figure 7 This is a schematic diagram of the heat dissipation mechanism of the present invention;

[0027] Figure 8 This is a partial structural diagram of the heat dissipation mechanism of the present invention.

[0028] In the diagram: 1. Circuit board body; 2. Soldering hole 1;

[0029] 3. Welding Mechanism One;

[0030] 301. Base plate; 302. Sliding through groove one; 303. Sliding through groove two; 304. Double-hole column; 305. Fastening bolt; 306. Limiting pin;

[0031] 4. Insertion stepped holes; 5. Mounting holes;

[0032] 6. Welding Mechanism Two;

[0033] 601. Circular column one; 602. Circular column two; 603. Rotating handrail one; 604. Rotating handrail two; 605. First locking block; 606. Second locking block; 607. Solder tray; 608. Solder hole two;

[0034] 7. Heat dissipation mechanism;

[0035] 701. First slot; 702. Second slot; 703. Third block; 704. Arc-shaped plate; 705. Heat dissipation device; 706. Support housing; 707. Heat sink;

[0036] 8. Limiting bend. Detailed Implementation

[0037] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0038] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the invention, and should not be construed as limiting the invention.

[0039] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0040] Example 1: See Figures 1-4 The present invention provides a technical solution: an integrated circuit board that is easy to solder, comprising a circuit board body 1, wherein the circuit board body 1 has a soldering hole 2 and a through-hole 4, and a mounting hole 5 is provided inside the circuit board body 1. A limiting bend 8 is provided inside the mounting hole 5. A soldering mechanism 3 is engaged inside the mounting hole 5. A second soldering mechanism 6 is engaged on the outer surface of the soldering mechanism 3. A heat dissipation mechanism 7 is slidably connected inside the soldering mechanism 3. The soldering mechanism 3 includes:

[0041] The base plate 301 has a sliding through groove 302 and a sliding through groove 303 inside. A double-hole column 304 is engaged inside the sliding through groove 302. A fastening bolt 305 is threaded to the bottom of the double-hole column 304, and a limit pin 306 is threaded to the top of the double-hole column 304. The limit pin 306 is used to limit the circuit board body 1.

[0042] The double-hole post 304 engages with the limiting bend 8. The bending angle at the top of the limiting bend 8 is greater than that at the bottom. The diameter of the soldering hole 2 is the same as the outer diameter of the insertion step hole 4. The limiting bend 8 is used to protect the circuit board body 1. The upper surface of the fastening bolt 305 contacts the lower surface of the base plate 301. The lower surface of the limiting pin 306 contacts the upper surface of the double-hole post 304. The lower surface of the double-hole post 304 is flush with the lower surface of the base plate 301. The lower surface of the limiting pin 306 is flush with the circuit board body 1. The upper surface of the two holes is in contact with each other. The fastening bolt 305 is used to fix the double-hole column 304. The top of the limiting bend 8 has a large bending angle, which is used to fit the outer surface of the double-hole column 304 to achieve horizontal support for the circuit board body 1. The bottom of the limiting bend 8 has a small bending angle, which is used to ensure that the double-hole column 304 can be stably engaged with it. After the welding is completed, the circuit board body 1 can be disengaged from the double-hole column 304 with a small force, so that the circuit board body 1 will not be subjected to stress compression during contact.

[0043] The working principle of this embodiment is as follows: When using this type of easily solderable integrated circuit board, the double-hole post 304 slides inside the sliding through groove one 302 and the sliding through groove two 303 to adapt to the size of the circuit board body 1. When the double-hole post 304 and the mounting hole 5 are on the same axis, the double-hole post 304 is inserted into the mounting hole 5 and engaged with the limiting bend hole 8. At this time, the mounting hole 5, the limiting bend hole 8, and the double-hole post 304 are coordinated by the symmetrically arranged mounting hole 5 and the limiting bend hole 8. The position of the double-hole post 304 is fixed by the rotation of the fastening bolt 305. By rotating the four sets of symmetrically arranged fastening bolts 305 in sequence multiple times, the circuit board body 1 is kept horizontal, so that the circuit board body 1 will not be stressed. The circuit board body 1 is protected by threaded post limiting pins 306 on the upper surface of the double-hole post 304, and the lower surface of the limiting pins 306 contacts the upper surface of the circuit board body 1. At this time, it cooperates with the limiting bent hole 8 and the double-hole post 304 to fix the circuit board body 1. Electronic components are then inserted into the insertion stepped hole 4 of the circuit board body 1 and soldered. The outer diameter hole of the insertion stepped hole 4 accommodates the solder used for soldering. After contacting the outer diameter hole, the solder forms an arc surface to ensure that the solder does not flow out and to ensure the quality of the soldering. When soldering the soldering hole 2, the solder also forms an arc surface to ensure the quality of the soldering of the soldering hole 2, and the soldering of electronic components is performed on the soldering hole 2.

[0044] Example 2: Please refer to Figures 5-8 Based on Embodiment 1, the present invention provides a technical solution: Welding mechanism 2 6 includes an annular column 1 601, which is engaged with a limiting pin 306. The limiting pin 306 has an annular column 2 602 engaged on its outer surface. The annular column 1 601 is internally threaded with a rotating handle 1 603. The outer surface of the rotating handle 1 603 is rotatably connected with a first locking block 605. The annular column 2 602 is internally threaded with a rotating handle 2 604. The outer surface of the rotating handle 2 604 is rotatably connected with a second locking block 606. The outer surface of the first locking block 605 is engaged with a soldering tray 607. The soldering tray 607 has a soldering hole 2 608 inside. The limiting pin 306 is used to limit the annular column 1 601 and the annular column 2 602.

[0045] The lower surface of the first annular column 601 contacts the upper surface of the second annular column 602. The outer surface of the second locking block 606 engages with the solder pad 607. The upper surface of the solder pad 607 is flush with the upper surface of the first annular column 601. The first rotating handle 603 and the second rotating handle 604 are used to adjust the position of the solder pad 607. The lower surface of the second annular column 602 contacts the upper surface of the circuit board body 1. The lower surface of the solder pad 607 contacts the upper surface of the circuit board body 1. The second solder hole 608 is connected to the first solder hole 2. The diameter of the insertion mounting hole 5 is the same. The spacing between the second soldering hole 608 and the first soldering hole 2 and the insertion mounting hole 5 is the same. The second soldering hole 608 is used to solder the first soldering hole 2 and the plug-in stepped hole 4. The length of the first annular post 601 is the same as the length of the first sliding groove 302. The length of the second annular post 602 is the same as the length of the second sliding groove 303. This ensures that when the first welding mechanism 3 adapts to the circuit board body 1 of different sizes, the second welding mechanism 6 can perform the same adaptation, ensuring the convenience of welding the circuit board body 1.

[0046] The heat dissipation mechanism 7 includes a third locking block 703. The base plate 301 has a first locking slot 701 and a second locking slot 702 inside. The first locking slot 701 is engaged with the third locking block 703. An arc-shaped plate 704 is fixedly connected to the upper surface of the third locking block 703. A support housing 706 is fixedly connected to the upper surface of the arc-shaped plate 704. A heat dissipation device 705 is fixedly connected to the lower surface of the support housing 706. A heat sink 707 is fixedly connected to the outer surface of the support housing 706. The heat sink 707 is used to dissipate heat from the circuit board body 1.

[0047] The second slot 702 engages with the third block 703. The lower surface of the arc plate 704 contacts the upper surface of the base plate 301. The upper surface of the heat sink 707 contacts the lower surface of the circuit board body 1. The heat dissipation device 705 consists of a motor and fan blades. The heat dissipation device 705 is used to dissipate heat from the heat sink 707. The heat dissipation device 705 is driven by the motor to drive the fan blades, thereby dissipating heat from the heat sink 707 through the support housing 706. When soldering, the support housing 706 can provide auxiliary support for the soldering position, ensuring that the circuit board body 1 does not bear the stress of soldering and welding of electronic components, and ensuring the structural stability of the circuit board body 1.

[0048] The working principle of this embodiment is as follows: When using this type of easily solderable integrated circuit board, the corresponding solder pads 607 are engaged on the upper surfaces of the first locking block 605 and the second locking block 606. Then, when the limiting pin 306 is threaded and tightened, the annular pillar one 601 and the annular pillar two 602 are engaged with the limiting pin 306. The positions of the annular pillar one 601 and the annular pillar two 602 are adjusted so that they are located on the upper surface of the circuit board body 1, in a position that does not affect the soldering of the electronic components in the soldering hole one 2 and the insertion stepped hole 4. At this time, the annular pillar one 601 and the annular pillar two 602 are threaded and tightened by the limiting pin 306. At this time, the solder pads 607 and the circuit board body 1... The upper surface contacts the solder pad 607. By rotating the first armrest 603, the position of the solder pad 607 on the horizontal Y-axis is adjusted. By rotating the second armrest 604, the position of the solder pad 607 on the horizontal X-axis is adjusted, so that the axis of the second solder hole 608 coincides with that of the first solder hole 2. This pushes the support housing 706 to move along the first slot 701 and the second slot 702, so that the position of the heat sink 707 coincides with that of the solder pad 607. At this time, the heat sink 707 dissipates heat from the soldering position, and the heat dissipation device 705 dissipates heat from the heat sink 707, ensuring the heat dissipation performance of the heat sink 707. At this time, the solder pad 607 and the second solder hole 608 are used to solder the first solder hole 2 and to solder electronic components. At the same time, the heat sink 707 dissipates heat.

[0049] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0050] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An integrated circuit board that is easy to solder, comprising a circuit board body (1), wherein the circuit board body (1) has a soldering hole (2) and a through-hole (4) inside, a mounting hole (5) is provided inside the circuit board body (1), a limiting bend (8) is provided inside the mounting hole (5), a soldering mechanism (3) is engaged inside the mounting hole (5), a soldering mechanism (6) is engaged on the outer surface of the soldering mechanism (3), and a heat dissipation mechanism (7) is slidably connected inside the soldering mechanism (3), characterized in that, The welding mechanism one (3) includes: The base plate (301) has a sliding through groove one (302) and a sliding through groove two (303) inside. A double-hole column (304) is connected inside the sliding through groove one (302). A fastening bolt (305) is threaded to the bottom of the double-hole column (304). A limit pin (306) is threaded to the top of the double-hole column (304). The limit pin (306) is used to limit the circuit board body (1). The upper surface of the fastening bolt (305) is in contact with the lower surface of the base plate (301), the lower surface of the limiting pin (306) is in contact with the upper surface of the double-hole column (304), the lower surface of the double-hole column (304) is flush with the lower surface of the base plate (301), the lower surface of the limiting pin (306) is in contact with the upper surface of the circuit board body (1), and the fastening bolt (305) is used to fix the double-hole column (304); The welding mechanism two (6) includes an annular column one (601), which is engaged with a limiting pin (306). The outer surface of the limiting pin (306) is engaged with an annular column two (602). The annular column one (601) is internally threaded with a rotating armrest one (603). The outer surface of the rotating armrest one (603) is rotatably connected with a first locking block (605). The annular column two (602) is internally threaded with a rotating armrest two (604). The outer surface of the rotating armrest two (604) is rotatably connected with a second locking block (606). The outer surface of the first locking block (605) is engaged with a soldering tray (607). The soldering tray (607) has a soldering hole two (608) inside. The limiting pin (306) is used to limit the annular column one (601) and the annular column two (602). The heat dissipation mechanism (7) includes a third locking block (703). The base plate (301) is provided with a first locking slot (701) and a second locking slot (702). The first locking slot (701) is engaged with the third locking block (703). An arc plate (704) is fixedly connected to the upper surface of the third locking block (703). A support housing (706) is fixedly connected to the upper surface of the arc plate (704). A heat dissipation device (705) is fixedly connected to the lower surface of the support housing (706). A heat sink (707) is fixedly connected to the outer surface of the support housing (706). The heat sink (707) is used to dissipate heat from the circuit board body (1).

2. The integrated circuit board that is easy to solder according to claim 1, characterized in that: The double-hole column (304) is engaged with the limiting bend (8). The bending angle at the top of the limiting bend (8) is greater than the bending angle at the bottom. The diameter of the soldering hole (2) is the same as the outer diameter of the plug-in stepped hole (4). The limiting bend (8) is used to protect the circuit board body (1).

3. The integrated circuit board that is easy to solder according to claim 2, characterized in that: The lower surface of the first annular column (601) is in contact with the upper surface of the second annular column (602), the outer surface of the second locking block (606) is engaged with the soldering tray (607), the upper surface of the soldering tray (607) is flush with the upper surface of the first annular column (601), and the first rotating armrest (603) and the second rotating armrest (604) are used to adjust the position of the soldering tray (607).

4. The integrated circuit board that is easy to solder according to claim 3, characterized in that: The lower surface of the second annular column (602) is in contact with the upper surface of the circuit board body (1), the lower surface of the solder pad (607) is in contact with the upper surface of the circuit board body (1), the second solder hole (608) has the same diameter as the first solder hole (2) and the insertion mounting hole (5), the second solder hole (608) has the same spacing as the first solder hole (2) and the insertion mounting hole (5), and the second solder hole (608) is used to solder the first solder hole (2) and the insertion step hole (4).

5. The integrated circuit board that is easy to solder according to claim 4, characterized in that: The second slot (702) engages with the third block (703), the lower surface of the arc plate (704) contacts the upper surface of the base plate (301), the upper surface of the heat sink (707) contacts the lower surface of the circuit board body (1), the heat dissipation device (705) is composed of a motor and a fan blade, and the heat dissipation device (705) is used to dissipate heat from the heat sink (707).

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