A stamping die for a circuit board

Abstract

This invention relates to the technical field of printed circuit board manufacturing, and more particularly to a stamping die for circuit board production. It includes an upper die and a lower die. The lower die includes a fixed frame and positioning rods. Positioning rods are spaced apart on the top of the fixed frame. The upper die includes a mounting frame located directly above the fixed frame. Positioning holes are spaced apart on the bottom of the mounting frame. A sliding seat is slidably mounted on the fixed frame, and a support module is slidably mounted on the sliding seat. The support module is used to place the printed circuit board. A stamping module is slidably mounted inside the mounting frame, and the stamping module is used to stamp the printed circuit board. This invention, by integrating an electric cleaning brush and a vacuum cleaner system, can effectively remove dust and debris generated during the stamping process, preventing them from being pressed into the printed circuit board and causing physical damage or electrical instability. This not only improves the quality and reliability of the finished product but also allows workers to conveniently handle dust and debris centrally.

Description

Technical Field

[0001] This invention relates to the technical field of manufacturing printed circuits, and more particularly to a stamping die for circuit board production. Background Technology

[0002] Printed circuit boards (PCBs) are also known as printed circuit boards. With the rapid development of electronic devices towards miniaturization and multi-functional integration, the manufacturing precision and production efficiency of PCBs, which are the basic components for connecting and supporting electronic components, are facing increasingly higher requirements. Against this backdrop, stamping dies, as key tools for achieving precise cutting, forming, and drilling, play an indispensable role in ensuring the quality of PCB products.

[0003] In traditional stamping dies, dust or debris generated during the stamping process can easily remain on the die surface. This causes the die to press the dust or debris onto the surface of the next printed circuit board (PCB) during stamping, thus adversely affecting the quality of the finished product. This can lead to physical damage to the PCB, such as scratches or breaks, and may also cause instability in electrical performance. Worse still, if these residues are not cleaned in time, they tend to adhere more and more firmly to the die with each stamping cycle, making subsequent cleaning extremely difficult and affecting the continuity and efficiency of production. Summary of the Invention

[0004] In view of this, the present invention provides a stamping die for circuit board production, which can solve the problem that dust or debris generated during the stamping process of traditional stamping dies is easy to remain on the die surface, which not only easily causes physical damage to the printed circuit board, but also makes subsequent cleaning more troublesome.

[0005] The technical solution of this invention is as follows: A stamping die for circuit board production includes an upper die and a lower die. The lower die includes a fixed frame and positioning rods. Positioning rods are spaced apart on the top of the fixed frame. The upper die includes a mounting frame located directly above the fixed frame. Positioning holes are spaced apart on the bottom of the mounting frame. A sliding seat is slidably disposed on the fixed frame, and a support module is slidably disposed on the sliding seat. The support module is used to place the printed circuit board. A stamping module is slidably disposed inside the mounting frame. The stamping module is used to stamp the printed circuit board. All components are equipped with limit mechanisms to limit the movement of the sliding seat and the stamping module. The stamping module is equipped with a clamping mechanism for pressing the printed circuit board. An electric slide rail is installed on the side of the fixed frame, and a hollow frame is connected to the slider of the electric slide rail. An electric cleaning brush is symmetrically rotated on the hollow frame to clean foreign objects adhering to the support module and the clamping mechanism. A vacuum cleaner and a collection frame are installed on the side of the hollow frame. The vacuum cleaner is used to draw foreign objects through the hollow frame into the collection frame, and a collection mechanism for collecting foreign objects is installed in the collection frame.

[0006] In one embodiment, the limiting mechanism includes a first electric push rod, a first limiting block, a second electric push rod, and a second limiting block. The first electric push rod is symmetrically arranged on the fixed frame, and the first limiting block is connected to the telescopic rod of the first electric push rod. The first limiting block is used to limit the sliding seat. The second electric push rod is symmetrically arranged on the mounting frame, and the second limiting block is connected to the telescopic rod of the second electric push rod. The second limiting block is used to limit the stamping module.

[0007] In one embodiment, the pressing mechanism includes guide rods, a pressure plate, and a first spring. Guide rods are slidably arranged on the stamping module at intervals, and a pressure plate is connected between the bottoms of the guide rods. The pressure plate has through holes for the stamping module to pass through. The pressure plate is used to press the printed circuit board, and the first spring is connected between the pressure plate and the stamping module.

[0008] In one embodiment, the collection mechanism includes a filter cloth, a collection frame, and magnetic strips. The filter cloth is disposed inside the collection frame to filter out foreign objects in the air. A collection frame for collecting foreign objects is installed inside the collection frame. Magnetic strips are symmetrically disposed on the collection frame to attract and fix the collection frame.

[0009] In one embodiment, a guide block is also included. The guide blocks are symmetrically arranged on the fixed frame. Both guide blocks are set as inclined surfaces on opposite sides. The inclined surfaces on the guide blocks are used to guide the sliding seat and the support module.

[0010] In one embodiment, a positioning mechanism is also included, which includes a limit bar and a second spring. The limit bar is slidably disposed on the support module. The limit bar is used to position the printed circuit board. The second spring is connected between the limit bar and the support module.

[0011] In one embodiment, a centralizing mechanism is also included. The centralizing mechanism includes a connecting plate, a third electric push rod, and a movable frame. The connecting plate is provided at the bottom of the fixed frame, and the top of the connecting plate is used to collect the waste material falling after the printed circuit board is stamped. The third electric push rod is symmetrically installed on the fixed frame, and the movable frame is connected between the telescopic rods of the two third electric push rods. The bottom of the movable frame contacts the top of the connecting plate.

[0012] In one embodiment, a stabilizing mechanism is also included, which includes a sealing ring and an air pump. The sealing ring is provided on the top of the movable frame and contacts the bottom of the fixed frame. An air pump is installed on the side of the movable frame and the air inlet of the air pump is connected to the movable frame.

[0013] The beneficial effects of the present invention are as follows: 1. By integrating an electric cleaning brush and a vacuum cleaner system, the present invention can effectively remove dust and debris generated during the stamping process, and prevent them from being pressed into the printed circuit board, causing physical damage or unstable electrical performance. This not only improves the quality and reliability of the finished product, but also makes it convenient for workers to centrally process dust and debris.

[0014] 2. The present invention adopts a sliding seat, support module and stamping module that can be slidably set, as well as a design equipped with a limiting mechanism, which makes the installation and replacement of molds simpler and faster, so as to adapt to the processing of printed circuit boards of different specifications and requirements.

[0015] 3. By setting up a positioning mechanism, this invention can ensure the accurate positioning of the printed circuit board before stamping, preventing inaccurate stamping caused by positional deviation. Furthermore, by applying a stabilizing mechanism, a negative pressure environment is created before stamping to fix the printed circuit board and prevent it from warping, thus ensuring high precision and flatness during the stamping process. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0017] Figure 2 This is a three-dimensional structural diagram of the fixed frame, sliding seat, and support module of the present invention.

[0018] Figure 3 This is a structural separation diagram of the fixed frame, sliding seat, and support module of the present invention.

[0019] Figure 4 This is a three-dimensional structural diagram of the mounting frame, stamping module, and clamping mechanism of the present invention.

[0020] Figure 5 This is a structural separation diagram of the mounting frame and the stamping module of the present invention.

[0021] Figure 6 This is a three-dimensional structural diagram of the fixed frame, electric slide rail, and hollow frame of the present invention.

[0022] Figure 7 This is a three-dimensional structural diagram of the collecting mechanism of the present invention.

[0023] Figure 8 This is a diagram showing the separation of the collection mechanism of the present invention.

[0024] Figure 9 This is a three-dimensional structural diagram of the guide block, limiting strip, and connecting plate of the present invention.

[0025] Figure 10 This is a three-dimensional structural diagram of the positioning mechanism of the present invention.

[0026] Figure 11This is a structural separation diagram of the fixed frame, connecting plate, and third electric push rod of the present invention.

[0027] Reference numerals: 101, Fixed frame; 102, Positioning rod; 201, Mounting frame; 202, Positioning hole; 3, Sliding seat; 4, Support module; 5, Stamping module; 601, First electric push rod; 602, First limit block; 603, Second electric push rod; 604, Second limit block; 701, Guide rod; 702, Pressure plate; 703, First spring; 8, Electric slide rail; 9, Hollow frame; 10, Electric cleaning brush; 11, Vacuum cleaner; 12, Converging frame; 1301, Filter cloth; 1302, Collection frame; 1303, Magnetic strip; 14, Guide block; 15, Limiting strip; 16, Second spring; 17, Connecting plate; 18, Third electric push rod; 19, Movable frame; 20, Sealing ring; 21, Air pump. Detailed Implementation

[0028] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0029] Example: A stamping die for circuit board manufacturing, see below. Figures 1-8 As shown, it includes an upper mold and a lower mold; the lower mold includes a fixed frame 101 and positioning rods 102, the middle area of ​​the fixed frame 101 is a hollow structure, and four positioning rods 102 are installed at intervals on the top of the fixed frame 101; the upper mold includes a mounting frame 201, which is located directly above the fixed frame 101, and four positioning holes 202 are provided at intervals on the bottom of the mounting frame 201, the distribution of the four positioning holes 202 is consistent with the distribution of the four positioning rods 102;

[0030] It also includes a sliding seat 3, a support module 4, a stamping module 5, a limiting mechanism, a pressing mechanism, an electric slide rail 8, a hollow frame 9, an electric cleaning brush 10, a vacuum cleaner 11, a collection frame 12, and a separation and collection mechanism; the sliding seat 3 is slidably mounted on the fixed frame 101; the support module 4 is slidably mounted on the sliding seat 3, the top of the support module 4 is used to place the printed circuit board, and the support module 4 has a stamping hole for stamping the printed circuit board; the stamping module 5 is slidably mounted inside the mounting frame 201, and the stamping module 5 is used to stamp the printed circuit board; both the fixed frame 101 and the mounting frame 201 are provided with limiting mechanisms, which are used to limit the sliding seat 3 and the stamping module. 5. Limiting position; A clamping mechanism for pressing the printed circuit board is provided on the stamping module 5; An electric slide rail 8 is installed on the upper rear side of the fixed frame 101; A hollow frame 9 is connected to the front side of the slider of the electric slide rail 8; Four electric cleaning brushes 10 are symmetrically rotated and installed on the hollow frame 9, and the electric cleaning brushes 10 are used to clean the foreign objects adhering to the support module 4 and the clamping mechanism; A vacuum cleaner 11 is installed on the upper right side of the hollow frame 9, and a converging frame 12 is connected to the middle right side of the hollow frame 9. The suction tube of the vacuum cleaner 11 is connected to the converging frame 12, and the vacuum cleaner 11 is used to draw foreign objects into the converging frame 12 through the hollow frame 9; A collection mechanism for collecting foreign objects is provided inside the converging frame 12.

[0031] See Figures 2-5 As shown, the limiting mechanism includes a first electric push rod 601, a first limiting block 602, a second electric push rod 603, and a second limiting block 604; the first electric push rod 601 is symmetrically arranged on the left and right sides of the fixed frame 101; the first limiting block 602 is connected to the telescopic rod of the first electric push rod 601, and the first limiting block 602 is used to limit the sliding seat 3. Both first limiting blocks 602 are set with inclined surfaces on the opposite side; the second electric push rod 603 is symmetrically arranged on the left and right sides of the mounting frame 201; the second limiting block 604 is connected to the telescopic rod of the second electric push rod 603, and the second limiting block 604 is used to limit the stamping module 5. Both second limiting blocks 604 are set with inclined surfaces on the opposite side.

[0032] See Figure 4 and Figure 5 As shown, the clamping mechanism includes guide rods 701, pressure plate 702, and first springs 703; four guide rods 701 are slidably arranged on the stamping module 5 at intervals; a pressure plate 702 is connected between the bottoms of the four guide rods 701, and a through hole is opened on the pressure plate 702 for the stamping module 5 to pass through. The pressure plate 702 is used to clamp the printed circuit board; four first springs 703 are connected between the top of the pressure plate 702 and the bottom of the stamping module 5.

[0033] See Figure 7 and Figure 8As shown, the collection mechanism includes a filter cloth 1301, a collection frame 1302, and a magnetic strip 1303; the filter cloth 1301 is arranged inside the collection frame 12, and the filter cloth 1301 is used to filter out foreign objects in the air; the collection frame 1302 for collecting foreign objects is placed inside the collection frame 12, and the collection frame 1302 is located directly below the filter cloth 1301. The material of the collection frame 1302 is iron; the magnetic strips 1303 are symmetrically arranged at the front and back of the collection frame 12, and the magnetic strips 1303 are used to attract and fix the collection frame 1302.

[0034] In use, first, install the fixing frame 101 in the lower mold and the mounting frame 201 in the upper mold at their designated positions on the stamping device, so that the mounting frame 201 is directly above the fixing frame 101. Then, place the printed circuit board on top of the support module 4. Next, drive the upper mold downward through the stamping device, thereby moving the mounting frame 201, stamping module 5, guide rod 701, and pressure plate 702 downward until the positioning rod 102 on the fixing frame 101 is fully aligned with the positioning hole 202 on the mounting frame 201. During this process, when the pressure plate 702 contacts the printed circuit board, it will press the printed circuit board firmly against the top of the support module 4, thus fixing the printed circuit board. At the same time, the printed circuit board will block the pressure plate 702 and the guide rod. As the mounting frame 201 and the stamping module 5 continue to move downwards, the first spring 703 is compressed. When the stamping module 5 passes through the through hole in the pressure plate 702 and contacts the printed circuit board, the stamping module 5 will stamp the printed circuit board. The waste generated by the stamping of the printed circuit board will fall down through the stamping hole on the support module 4, causing the waste to fall out through the hollow structure in the middle of the fixed frame 101. After the printed circuit board is stamped, the upper mold is driven upwards and reset by the stamping device, thereby driving the mounting frame 201 and the stamping module 5 to move upwards and reset. During this period, the first spring 703 will gradually return to its original state. After the first spring 703 resets, the stamping module 5 will pull the guide rod 701 and the pressure plate 702 upwards through the first spring 703. The upper movement resets the pressure plate 702, releasing the stamped printed circuit board. The stamped printed circuit board is then removed from the top of the support module 4. The hollow frame 9 and electric cleaning brush 10 are then moved to the left via the electric slide rail 8, while the electric cleaning brush 10 rotates and the vacuum cleaner 11 is activated. When the electric cleaning brush 10 contacts the bottom of the pressure plate 702 and the top of the support module 4, it brushes off the dust or debris adhering to these surfaces, detaching them. The vacuum cleaner 11 then sucks the dust or debris into the hollow frame 9, allowing it to enter the collecting frame 12. This process completes the pressing of the pressure plate. Dust or debris adhering to the bottom of platen 702 and the top of support module 4 is cleaned to prepare for the next printing of the printed circuit board. After the dust or debris enters the collecting frame 12, the dust or debris in the collecting frame 12 is filtered by the filter cloth 1301, so that the dust or debris is blocked below the filter cloth 1301. After the dust or debris adhering to the bottom of platen 702 and the top of support module 4 is cleaned, the hollow frame 9 and the electric cleaning brush 10 are driven to move to the right and reset by the electric slide rail 8. At the same time, the electric cleaning brush 10 is stopped from rotating and the vacuum cleaner 11 is turned off, so that the dust or debris below the filter cloth 1301 falls down into the collection frame 1302 for collection. The above operation is repeated to repeatedly press the printed circuit board.Once a suitable amount of dust or debris has been collected in the collection frame 1302, it is pulled out to the right to separate it from the magnetic strip 1303. The dust or debris is then cleaned out, and the collection frame 1302 is pushed back to the left to bring it into contact with the magnetic strip 1303, causing the magnetic strip 1303 to attract and secure the collection frame 1302.

[0035] When it is necessary to replace the support module 4 and the stamping module 5, the first electric push rod 601 drives the first limiting block 602 to move to the opposite side, so that the first limiting block 602 releases the limiting position of the sliding seat 3. Then, the sliding seat 3 is pulled forward, and the support module 4 on the sliding seat 3 is pushed to the left, so that the support module 4 can be removed. Then, the replaced support module 4 is pushed back to the right onto the sliding seat 3, and then the sliding seat 3 is pushed back to the fixed frame 101. Then, the first electric push rod 601 drives the first limiting block 602 to move to the opposite side to reset. When the inclined surface of the first limiting block 602 contacts the sliding seat 3, the first limiting block 602 will squeeze the sliding seat 3 to move back to reset, thus ensuring that the position of the sliding seat 3 is completely reset. After the first limiting block 602 moves back to reset, the first limiting block 602 will limit the sliding seat 3. To prevent the sliding seat 3 from shifting, the second electric push rod 603 drives the second limiting block 604 to move to the opposite side, releasing the second limiting block 604 from limiting the stamping module 5. Then, the stamping module 5 is pulled forward, and the stamping module 5 and the pressing mechanism are replaced. The replaced stamping module 5 is then pushed back to its original position, and the second electric push rod 603 drives the second limiting block 604 to move to the opposite side to reset. When the inclined surface of the second limiting block 604 contacts the stamping module 5, the second limiting block 604 will squeeze the stamping module 5 to move backward to reset, thus ensuring that the position of the stamping module 5 is completely reset. After the second limiting block 604 moves to reset, it will limit the stamping module 5 to prevent it from shifting. In this way, the replacement of the support module 4 and the stamping module 5 can be completed.

[0036] See Figure 9 As shown, it also includes guide blocks 14; guide blocks 14 are symmetrically arranged on the upper front side of the fixed frame 101, and both guide blocks 14 are set as inclined surfaces on opposite sides. The inclined surfaces on the guide blocks 14 are used to guide the sliding seat 3 and the support module 4.

[0037] By setting the guide block 14, when the sliding seat 3 is pushed back onto the fixed frame 101, the inclined surface on the guide block 14 can guide the sliding seat 3 and the support module 4, thus facilitating the sliding seat 3 to return to the fixed frame 101. When the support module 4 contacts the inclined surface on the guide block 14, the inclined surface on the guide block 14 will squeeze the support module 4, so that the support module 4 returns completely to the sliding seat 3, avoiding the support module 4 from being misaligned on the sliding seat 3.

[0038] See Figure 9 and Figure 10 As shown, it also includes a positioning mechanism, which includes a limit bar 15 and a second spring 16; the limit bar 15 is slidably provided on the top of the support module 4, the limit bar 15 is L-shaped, the right side of the limit bar 15 is set as an inclined surface, and the limit bar 15 is used to position the printed circuit board; there are two second springs 16 connected between the bottom of the limit bar 15 and the support module 4.

[0039] By setting a positioning mechanism, when the printed circuit board is placed on top of the support module 4, the rear and left sides of the printed circuit board can contact the limiting strip 15, thereby using the limiting strip 15 to position the printed circuit board so that the worker can place the printed circuit board. When the pressure plate 702 is pressed down to contact the top of the limiting strip 15, or the hollow frame 9 moves to the left to contact the inclined surface of the limiting strip 15, the pressure plate 702 or the hollow frame 9 will squeeze the limiting strip 15 to move downward, and the second spring 16 will be compressed. When the pressure plate 702 moves up to separate from the limiting strip 15, or the hollow frame 9 moves to the right to separate from the limiting strip 15, the second spring 16 returns to its original state, and the second spring 16 drives the limiting strip 15 to move upward and reset.

[0040] See Figure 9 and Figure 11 As shown, it also includes a central mechanism, which includes a connecting plate 17, a third electric push rod 18, and a movable frame 19; the bottom of the fixed frame 101 is provided with the connecting plate 17, and the top of the connecting plate 17 is used to collect the waste material falling after the printed circuit board is stamped; the third electric push rod 18 is symmetrically installed on the lower side of the fixed frame 101; the movable frame 19 is connected between the telescopic rods of the two third electric push rods 18, and the bottom of the movable frame 19 contacts the top of the connecting plate 17.

[0041] By setting up a centralized mechanism, when waste falls out through the hollow structure in the middle of the fixed frame 101, the waste will fall onto the connecting plate 17 and accumulate in the movable frame 19. After a suitable amount of waste has accumulated on the connecting plate 17, the movable frame 19 is driven to move to the left by the third electric push rod 18, so that the movable frame 19 pushes the waste accumulated on the connecting plate 17 to the left. When the waste separates from the connecting plate 17, the waste will fall out from the left side of the connecting plate 17. In this way, it is convenient for workers to centrally process the waste. Then, the movable frame 19 can be driven to move to the right and reset by the third electric push rod 18.

[0042] See Figure 11 As shown, it also includes a stabilizing mechanism, which includes a sealing ring 20 and an air pump 21; the top of the movable frame 19 is provided with a sealing ring 20, which contacts the bottom of the fixed frame 101, and the sealing ring 20 is used to seal between the fixed frame 101 and the movable frame 19; an air pump 21 is installed on the left front side of the movable frame 19, and the air inlet of the air pump 21 is connected to the movable frame 19.

[0043] By setting up a stabilizing mechanism, after the printed circuit board is placed on top of the support module 4, the air pump 21 can be activated to extract the air from the movable frame 19 and the fixed frame 101, creating a negative pressure inside the movable frame 19 and the fixed frame 101. This causes the printed circuit board to be pressed tightly against the top of the support module 4 by the external pressure, thus preventing the printed circuit board from tilting up on top of the support module 4 and avoiding problems such as inaccurate positioning and hole displacement during subsequent stamping due to the printed circuit board tilting up. After the printed circuit board has been stamped, the air pump 21 can be turned off.

[0044] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.

Claims

1. A stamping die for circuit board production, comprising an upper die and a lower die, the lower die comprising a fixed frame (101) and positioning rods (102), the positioning rods (102) being spaced apart at the top of the fixed frame (101), the upper die comprising a mounting frame (201), the mounting frame (201) being located directly above the fixed frame (101), the mounting frame (201) having positioning holes (202) spaced apart at the bottom, characterized in that, A sliding seat (3) is slidably mounted on the fixed frame (101), and a support module (4) is slidably mounted on the sliding seat (3). The support module (4) is used to place the printed circuit board. A stamping module (5) is slidably mounted inside the mounting frame (201). The stamping module (5) is used to stamp the printed circuit board. Both the fixed frame (101) and the mounting frame (201) are provided with limit mechanisms. The limit mechanisms are used to limit the sliding seat (3) and the stamping module (5). The stamping module (5) is provided with a clamping mechanism for pressing the printed circuit board. An electric slide rail (8) is installed on the side of the fixed frame (101). A hollow frame (9) is connected to the slider of the electric slide rail (8). An electric cleaning brush (10) is symmetrically rotated on the hollow frame (9). The electric cleaning brush (10) is used to clean the foreign objects adhering to the support module (4) and the pressing mechanism. A vacuum cleaner (11) and a collection frame (12) are installed on the side of the hollow frame (9). The vacuum cleaner (11) is used to draw foreign objects through the hollow frame (9) into the collection frame (12). A collection mechanism for collecting foreign objects is provided in the collection frame (12). The limiting mechanism includes a first electric push rod (601), a first limiting block (602), a second electric push rod (603), and a second limiting block (604). The first electric push rod (601) is symmetrically arranged on the fixed frame (101). The first limiting block (602) is connected to the telescopic rod of the first electric push rod (601). The first limiting block (602) is used to limit the sliding seat (3). The second electric push rod (603) is symmetrically arranged on the mounting frame (201). The second limiting block (604) is connected to the telescopic rod of the second electric push rod (603). The second limiting block (604) is used to limit the stamping module (5). The clamping mechanism includes a guide rod (701), a pressure plate (702), and a first spring (703). The guide rod (701) is slidably arranged on the stamping module (5) at intervals. The pressure plate (702) is connected between the bottoms of the guide rod (701). The pressure plate (702) has a through hole for the stamping module (5) to pass through. The pressure plate (702) is used to clamp the printed circuit board. The first spring (703) is connected between the pressure plate (702) and the stamping module (5). The collection mechanism includes a filter cloth (1301), a collection frame (1302), and a magnetic strip (1303). The filter cloth (1301) is installed inside the collection frame (12) to filter out foreign objects in the air. The collection frame (1302) for collecting foreign objects is installed inside the collection frame (12). Magnetic strips (1303) are symmetrically arranged on the collection frame (12) to attract and fix the collection frame (1302). It also includes a central mechanism, which includes a connecting plate (17), a third electric push rod (18) and a movable frame (19). The bottom of the fixed frame (101) is provided with a connecting plate (17), and the top of the connecting plate (17) is used to collect the waste material that falls after the printed circuit board is stamped. The third electric push rod (18) is symmetrically installed on the fixed frame (101). The movable frame (19) is connected between the telescopic rods of the two third electric push rods (18). The bottom of the movable frame (19) is in contact with the top of the connecting plate (17). It also includes a stabilizing mechanism, which includes a sealing ring (20) and an air pump (21). The sealing ring (20) is provided on the top of the movable frame (19), and the sealing ring (20) contacts the bottom of the fixed frame (101). An air pump (21) is installed on the side of the movable frame (19), and the air inlet of the air pump (21) is connected to the movable frame (19).

2. The stamping die for circuit board production as described in claim 1, characterized in that, It also includes guide blocks (14). Guide blocks (14) are symmetrically arranged on the fixed frame (101). Both guide blocks (14) are set as inclined surfaces on opposite sides. The inclined surfaces on the guide blocks (14) are used to guide the sliding seat (3) and the support module (4).

3. The stamping die for circuit board production as described in claim 2, characterized in that, It also includes a positioning mechanism, which includes a limit bar (15) and a second spring (16). The limit bar (15) is slidably set on the support module (4). The limit bar (15) is used to position the printed circuit board. The second spring (16) is connected between the limit bar (15) and the support module (4).

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