Heat dissipation structure and domain controller

Abstract

The invention provides a heat dissipation structure and a domain controller, and relates to the technical field of domain controllers. The heat dissipation structure comprises a shell, a heat dissipation assembly and a heat expansion piece. The shell is provided with an installation cavity which is used for installing an electric control part. The heat dissipation assembly is arranged on the shell, the heat expansion piece is arranged in the installation cavity, the heat expansion piece and the heat dissipation assembly are correspondingly arranged, the heat expansion piece extends in the extending direction of the heat dissipation assembly, and part of the heat expansion piece is used for being connected with a chipset of the electric control piece in an abutting mode and transmitting heat generated by the chipset of the electric control piece to the heat dissipation assembly through the shell. By arranging the heat expansion piece, the contact area between the chip set and the heat dissipation assembly on the shell can be increased through the heat expansion piece, so that heat generated by the chip set is extended, diffused and transmitted to the shell through the heat expansion piece, and local heat accumulation is avoided. And heat dissipation and cooling are carried out through the heat dissipation assembly, so that the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This application relates to the technical field of domain controllers, and particularly to a heat dissipation structure and a domain controller. Background Art

[0002] With the rapid development of intelligent driving, the chip integration degree in the intelligent driving domain controller is getting higher and higher, and the resulting heat load has increased significantly. To ensure the stable operation of the intelligent driving domain controller, it is necessary to dissipate heat from it.

[0003] In the related art, the intelligent driving domain controller includes a housing, a PCBA (Printed Circuit Board Assembly), and a heat dissipation component. The PCBA is disposed in the housing, the PCBA has chips on it, and the heat dissipation component is disposed on the housing. The heat on the PCBA and the heat on the chips can be conducted to the housing, and the heat on the housing is taken away by the heat dissipation component. The heat dissipation component can be an air-cooled structure, a liquid-cooled structure, etc.

[0004] However, since the main heat source on the PCBA is high-power chips, this will cause the heat on the housing to accumulate at the positions of the chips, affecting the heat dissipation efficiency of the heat dissipation component. Summary of the Invention

[0005] Embodiments of this application provide a heat dissipation structure and a domain controller to solve the problem that the contact area between the chip and the housing is limited, which will cause local heat accumulation and low heat dissipation efficiency.

[0006] In a first aspect, the heat dissipation structure provided by the embodiments of this application includes:

[0007] A housing having an installation cavity for installing electrical control components;

[0008] A heat dissipation component disposed on the housing;

[0009] A heat spreading member disposed in the installation cavity, the heat spreading member is connected to the housing, the heat spreading member is disposed corresponding to the heat dissipation component and extends along the extension direction of the heat dissipation component, and part of the heat spreading member is used to abut against the chip set of the electrical control component, and the heat spreading member is used to transfer the heat generated by the chip set of the electrical control component to the heat dissipation component through the housing.

[0010] In a possible implementation manner, for the heat dissipation structure provided by the embodiments of this application, the heat spreading member is a metal plate.

[0011] In a possible implementation manner, for the heat dissipation structure provided by the embodiments of this application, the heat spreading member includes a support portion and a first extension portion. The support portion is used to abut against the chip set of the electrical control component and is used to cover the chip set of the electrical control component;

[0012] The first extension extends along the extension direction of the heat dissipation component.

[0013] In a possible implementation, the heat dissipation structure provided by the embodiments of the present application further includes at least one heat pipe. The heat pipe is disposed on the heat spreader and extends from the support portion to the first extension portion.

[0014] In a possible implementation, in the heat dissipation structure provided by the embodiments of the present application, at least one positioning portion is provided on the support portion, and the positioning portion is used to be correspondingly arranged with the chipset of the electrical control component.

[0015] In a possible implementation, in the heat dissipation structure provided by the embodiments of the present application, a heat conducting member is provided on the positioning portion, and the heat conducting member is used to connect with the chipset of the electrical control component.

[0016] In a possible implementation, in the heat dissipation structure provided by the embodiments of the present application, the heat dissipation component includes a fan and a plurality of heat sinks;

[0017] The plurality of heat sinks are arranged at intervals on the housing, and the plurality of heat sinks and the housing form a second installation groove, and the fan is disposed in the second installation groove;

[0018] A cover body is detachably connected to the housing, the cover body covers the fan, and an air outlet is provided on the cover body, and the air outlet is correspondingly arranged with the second installation groove.

[0019] In a possible implementation, in the heat dissipation structure provided by the embodiments of the present application, the cover body has a second extension portion, the second extension portion abuts against the heat sink, and the second extension portion, the heat sink and the housing enclose an air inlet channel, and the air inlet channel is communicated with the second installation groove.

[0020] In a possible implementation, in the heat dissipation structure provided by the embodiments of the present application, the housing includes a first housing portion and a second housing portion, the first housing portion and the second housing portion are detachably connected and form an installation cavity;

[0021] The heat dissipation component and the heat spreader are both disposed on the first housing portion, and the second housing portion is used to install the electrical control component.

[0022] In a second aspect, the domain controller provided by the embodiments of the present application includes an electrical control component and a heat dissipation structure as described above, and the electrical control component is disposed in the housing of the heat dissipation structure.

[0023] The present invention provides a heat dissipation structure and a domain controller. The heat dissipation structure includes a housing, a heat dissipation component, and a heat spreader. The housing has an installation cavity for installing electrical control components. The heat dissipation component is disposed on the housing, and the heat spreader is disposed in the installation cavity. The heat spreader is correspondingly arranged with the heat dissipation component and extends along the extension direction of the heat dissipation component. Part of the heat spreader is used to abut against the chipset of the electrical control component and transfer the heat generated by the chipset of the electrical control component to the heat dissipation component through the housing. By providing the heat spreader, the chipset can increase the contact area with the heat dissipation component on the housing through the heat spreader, so that the heat generated by the chipset is extended and diffused through the heat spreader and transferred to the housing, avoiding local heat accumulation. And the heat is dissipated and cooled by the heat dissipation component to improve the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings are incorporated herein and form a part of this specification, showing embodiments consistent with the present application and, together with the specification, are used to explain the principles of the present application.

[0025] Figure 1 is a schematic structural diagram of the heat dissipation structure provided by an embodiment of the present application;

[0026] Figure 2 is Figure 1 a schematic diagram of the air flow path in;

[0027] Figure 3 is Figure 1 an exploded view of the heat dissipation structure of;

[0028] Figure 4 is Figure 3 a schematic structural diagram of the heat spreader in;

[0029] Figure 5 is Figure 4 a schematic structural diagram of the heat spreader from another perspective in;

[0030] Figure 6 is Figure 1 a cross-sectional view taken along A-A of a partial structure of the heat dissipation structure in;

[0031] Figure 7 is Figure 3 a split view of the housing and the heat dissipation component in.

[0032] Description of the reference numerals:

[0033] 10. Heat dissipation structure;

[0034] 100. Housing; 110. First housing part; 111. Second installation groove; 112. First avoidance notch; 113. Enclosure part; 114. First installation part; 115. Second installation part; 120. Second housing part; 121. Second avoidance notch; 130. Second connecting part;

[0035] 200. Heat dissipation component; 210. Fan; 220. Heat sink;

[0036] 300. Heat spreading part; 301. Support part; 302. First extension part; 310. Positioning part; 320. Heat conducting part; 321. First heat conducting part; 322. Second heat conducting part; 330. First installation groove;

[0037] 400. Heat pipe;

[0038] 500. Cover body; 510. Air outlet; 520. Second extension part; 530. First connecting part;

[0039] 20. Electrical control component; 201. Chipset.

[0040] Through the above-mentioned drawings, specific embodiments of the present application have been shown, and there will be more detailed descriptions hereinafter. These drawings and textual descriptions are not intended to limit the scope of the concept of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. Detailed Embodiments

[0041] Here, the exemplary embodiments will be described in detail, and the examples are shown in the drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0042] The terms "first", "second", "third", "fourth", etc. (if any) in the specification, claims and above-mentioned drawings of the present invention are used to distinguish similar objects and do not necessarily have to be used to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these process, method, product or device.

[0043] As described in the background art, in the related art, an intelligent driving domain controller includes a housing, a PCBA (Printed Circuit Board Assembly), and a heat dissipation component. The PCBA is disposed within the housing, the PCBA has chips thereon, and the heat dissipation component is disposed on the housing. The heat on the PCBA and the heat on the chips can be conducted to the housing, and the heat on the housing is taken away by the heat dissipation component. The heat dissipation component can be an air-cooled structure, a liquid-cooled structure, etc.

[0044] However, since the main heat source on the PCBA is high-power chips, this will cause the heat on the housing to accumulate at the position of the chips, affecting the heat dissipation efficiency of the heat dissipation component.

[0045] In view of the above problems existing in the prior art, the present invention provides a heat dissipation structure and a domain controller. The heat dissipation structure includes a housing, a heat dissipation component, and a heat spreading member. The housing has an installation cavity for installing electrical control components. The heat dissipation component is disposed on the housing, the heat spreading member is disposed within the installation cavity, the heat spreading member is correspondingly disposed with the heat dissipation component, and the heat spreading member extends along the extending direction of the heat dissipation component. Part of the heat spreading member is used to abut against the chip set of the electrical control component and transfer the heat generated by the chip set of the electrical control component to the heat dissipation component through the housing. By providing the heat spreading member, the size of the heat spreading member is larger than the size of the chip set, so that the chip set can increase the contact area with the heat dissipation component on the housing through the heat spreading member, so that the heat generated by the chip set is extended and diffused through the heat spreading member and transferred to the housing, avoiding local heat accumulation. And the heat is dissipated and cooled by the heat dissipation component to improve the heat dissipation efficiency.

[0046] Hereinafter, an exemplary application scenario of the present invention will be introduced.

[0047] The heat dissipation structure provided by the present invention can be applied within a domain controller, such as an intelligent driving domain controller, a power domain controller, etc. Specifically, for the heat dissipation structure provided by the present invention, by providing a heat spreading member, the contact area between the chip set and the heat dissipation component on the housing is increased, avoiding local heat accumulation.

[0048] Hereinafter, specific embodiments will be used to describe in detail the technical solution of the present application and how the technical solution of the present application solves the above technical problems. These specific embodiments below can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below with reference to the drawings.

[0049] Referring to Figure 1 and Figure 3 As shown, the heat dissipation structure 10 provided by the embodiment of the present application includes a housing 100, a heat dissipation component 200, and a heat spreading member 300.

[0050] The housing 100 has an installation cavity for installing the electrical control component 20. The heat dissipation component 200 is disposed on the housing 100, and the heat spreading component 300 is disposed in the installation cavity. The heat spreading component 300 is connected to the housing 100, and the heat spreading component 300 is correspondingly disposed with the heat dissipation component 200 and extends along the extension direction of the heat dissipation component 200. Part of the heat spreading component 300 is used to abut against the chipset 201 of the electrical control component 20. The heat spreading component 300 is used to transfer the heat generated by the chipset 201 of the electrical control component 20 to the heat dissipation component 200 through the housing 100.

[0051] It can be understood that the installation cavity of the housing 100 can be used to install the electrical control component 20 of the intelligent driving domain controller. The electrical control component 20 can be a PCBA, on which a chipset 201 is soldered. The chipset 201 is the core control center of the intelligent driving domain controller and supports the high computing power operation of intelligent driving. At the same time, the chipset 201 is also the main heat source on the PCBA.

[0052] Among them, a heat spreading component 300 is disposed in the housing 100. The heat spreading component 300 extends along the extension direction of the heat dissipation component 200. Part of the heat spreading component 300 is used to abut against the chipset 201 of the electrical control component 20. In this way, the size of the heat spreading component 300 is larger than the size of the chipset 201. The chipset 201 can increase the contact area with the heat dissipation component 200 on the housing 100 through the heat spreading component 300, so that the heat generated by the relatively small-sized chipset 201 is extended and diffused through the relatively large-sized heat spreading component 300, thereby avoiding local heat accumulation.

[0053] Refer to Figure 1 and Figure 3 As shown, the heat dissipation component 200 is disposed on the housing 100, and the heat dissipation component 200 is correspondingly disposed with the heat spreading component 300. In this way, after the heat spreading component 300 diffuses and transfers the heat generated by the chipset 201 to the housing 100, it can be cooled by the heat dissipation component 200 to improve the heat dissipation efficiency and ensure the stable operation of the chipset 201.

[0054] Among them, the heat spreading component 300 can be made of a metal material with high thermal conductivity, such as aluminum, copper, etc., to improve the thermal conductivity and evenly diffuse the heat.

[0055] Exemplarily, the shape of the heat spreading component 300 can be rectangular, circular, oval, irregular polygon, etc., as long as the size of the heat spreading component 300 is larger than the size of the chipset 201. The embodiments of the present application do not impose too many restrictions on this.

[0056] In summary, for the heat dissipation structure 10 provided in the embodiments of the present application, by providing the heat spreading member 300 with a size larger than that of the chipset 201, the chipset 201 can increase the contact area with the heat dissipation component 200 on the housing 100 through the heat spreading member 300, so that the heat generated by the chipset 201 is diffused through the heat spreading member 300 and transferred to the housing 100, avoiding local heat accumulation. And the heat dissipation component 200 is used for heat dissipation and temperature reduction to improve the heat dissipation efficiency.

[0057] In some embodiments, the heat spreading member 300 is a metal plate.

[0058] In the above embodiments, through the high thermal conductivity of the metal plate, the heat conduction efficiency of the heat spreading member 300 is improved, and the heat is evenly diffused. The material of the metal plate can be aluminum, copper, etc.

[0059] Referring to Figure 3 、 Figure 4 and Figure 5 As shown in

[0060] In the above embodiments, the support portion 301 can be used to cover and abut against the chipset 201 on the electrical control component 20, so that the heat generated by the chipset 201 can be transferred to the support portion 301 and extended and diffused through the first extension portion 302, thus avoiding local heat concentration.

[0061] Among them, the first extension portion 302 extends along the extension direction of the heat dissipation component 200 to increase the contact area with the heat dissipation component 200 and improve the heat dissipation effect.

[0062] Referring to Figure 4 and Figure 5 As shown in

[0063] Among them, the heat pipe 400 is a heat transfer element with extremely high heat conduction performance. The heat pipe 400 has an evaporation end and a condensation end, and a working fluid is provided inside the heat pipe 400, and the heat is transferred through the evaporation and condensation of the working fluid inside the heat pipe 400.

[0064] In the above embodiments, the evaporation end of the heat pipe 400 can be disposed on the support portion 301, and the condensation end of the heat pipe 400 extends along the first extension portion 302 to form a directional heat transfer channel from the support portion 301 to the first extension portion 302, so that heat can be quickly diffused on the heat spreader 300, and further reduce the heat dissipation resistance of the heat spreader 300, improving the uniform temperature heat dissipation effect of the heat spreader 300.

[0065] It can be understood that there is at least one heat pipe 400, and the number of heat pipes 400 can be one, or can be multiple, such as 2, 3, 4, etc. The embodiments of the present application do not impose excessive restrictions on this.

[0066] Exemplarily, the heat pipe 400 is disposed along the extension direction of the heat spreader 300, and the shape of the heat pipe 400 can be linear, serpentine, bent, etc., as long as it corresponds to the shape of the heat spreader 300. The embodiments of the present application do not impose excessive restrictions on this.

[0067] Refer to Figure 3 and Figure 4 As shown in, in some embodiments, at least one first installation groove 330 is provided on the side of the heat spreader 300 facing the heat dissipation assembly 200, and the heat pipe 400 is correspondingly disposed in the first installation groove 330.

[0068] In the above embodiments, the first installation groove 330 is mainly used for positioning and installing the heat pipe 400 to improve the installation stability of the heat pipe 400 and the heat spreader 300, and prevent the heat pipe 400 from falling off.

[0069] Among them, the heat pipe 400 can be flattened and embedded in the first installation groove 330, and a thermally conductive sealant can be provided between the heat pipe 400 and the first installation groove 330 to fill the gap therebetween and increase the contact area between the heat pipe 400 and the heat spreader 300.

[0070] It can be understood that there is at least one first installation groove 330, and the number of first installation grooves 330 can be one, or can be multiple, such as 2, 3, 4, etc., as long as it corresponds to the number of heat pipes 400. The embodiments of the present application do not impose excessive restrictions on this.

[0071] Refer to Figure 3 、 Figure 4 and Figure 5 As shown in, in some embodiments, at least one positioning portion 310 is provided on the support portion 301, and the positioning portion 310 is used for corresponding setting with the chipset 201 of the electrical control member 20.

[0072] In the above embodiments, the support portion 301 can be correspondingly installed with the chipset 201 through the positioning portion 310 to prevent the heat spreader 300 and the chipset 201 from deviating during installation, which affects the heat dissipation effect.

[0073] Among them, with reference to Figure 5 as shown, the positioning portion 310 can be a groove structure or a protrusion structure, as long as it can be correspondingly installed with the chipset 201, and the embodiments of the present application do not impose too many restrictions on this.

[0074] Specifically, with reference to Figure 5 as shown, the positioning portion 310 is located on the side of the support portion 301 away from the housing 100 and the heat dissipation component 200.

[0075] With reference to Figure 5 and Figure 6 as shown, the number of the positioning portions 310 can be multiple, and the multiple positioning portions 310 are respectively arranged corresponding to various components in the chipset 201. The shapes of the multiple positioning portions 310 (such as the depth and contour of the groove structure; or the height and contour of the protrusion structure, etc.) can be adapted to the shapes of various components in the chipset 201 to ensure the stability of the overall installation.

[0076] With reference to Figure 5 and Figure 6 as shown, in some embodiments, a heat conducting member 320 is provided on the positioning portion 310, and the heat conducting member 320 is used to connect with the chipset 201 of the electric control member 20.

[0077] In the above embodiments, the heat conducting member 320 is mainly used to improve the heat conduction efficiency between the heat spreading member 300 and the chipset 201 and reduce the heat dissipation situation.

[0078] Among them, the heat conducting member 320 can be a thermal interface material (TIM, Thermal Interface Material), which is used to fill the gap between the chipset 201 and the positioning portion 310 of the heat spreading member 300 and improve the heat conduction efficiency. Exemplarily, the heat conducting member 320 can be thermal silicone, thermal gasket, thermal gel, etc., and the embodiments of the present application do not impose too many restrictions on this.

[0079] With reference to Figure 3 and Figure 6 as shown, the chipset 201 can be a SIP module (System in Package), and the SIP module can include an SOC (System On Chip) and an IC (Integrated Circuit), etc.

[0080] Among them, the heat conducting member 320 can include a first heat conducting portion 321 and a second heat conducting portion 322. The SOC can be directly connected to the heat spreading member 300 through the first heat conducting portion 321, and multiple ICs can be respectively connected to multiple positioning portions 310 of the heat spreading member 300 through the second heat conducting portion 322.

[0081] Exemplarily, the thickness of the first heat conducting portion 321 may be 0.1 mm to 0.5 mm, and the thickness of the second heat conducting portion 322 may be 0.5 mm to 1 mm.

[0082] Referring to Figure 3 and Figure 7 As shown, in some embodiments, the heat dissipation assembly 200 includes a fan 210 and a plurality of heat sinks 220. The plurality of heat sinks 220 are spaced apart on the housing 100, and the plurality of heat sinks 220 and the housing 100 form a second mounting groove 111, and the fan 210 is disposed in the second mounting groove 111.

[0083] Among them, referring to Figure 3 As shown, the heat spreading member 300 is correspondingly disposed with the heat sink 220, and the first extension portion 302 extends along the length direction of the heat sink 220.

[0084] In the above embodiments, the heat on the heat spreading member 300 is transferred to the plurality of heat sinks 220 through the housing 100, and the heat sinks 220 perform heat exchange by contacting the surrounding air. The fan 210 blows air on the heat sinks 220 to promote air flow and improve the heat dissipation efficiency.

[0085] Among them, the fan 210 is disposed in the second mounting groove 111 formed by the plurality of heat sinks 220 and the housing 100, so that the overall structure is more compact, thereby reducing the volume of the domain controller.

[0086] Referring to Figure 3 and Figure 7 As shown, in some embodiments, the heat dissipation assembly 200 further includes a cover body 500. The cover body 500 is detachably connected to the housing 100. The cover body 500 covers the fan 210, and an air outlet 510 is provided on the cover body 500. The air outlet 510 is correspondingly disposed with the second mounting groove 111.

[0087] In the above embodiments, the cover body 500 can play a role in protecting the fan 210 to prevent the blades of the fan 210 from colliding with other external devices and being damaged. The air outlet 510 provided on the cover body 500 communicates with the second mounting groove 111 for the fan 210 to discharge air.

[0088] Among them, the cover body 500 is detachably connected to the housing 100, so that when the fan 210 is damaged, the fan 210 can be conveniently removed from the second mounting groove 111 for replacement or repair.

[0089] Referring to Figure 3 and Figure 7As shown, the cover body 500 can be detachably connected to the housing 100 through at least one first connecting member 530. Among them, the first connecting member 530 can be structures such as bolts, locking buckles, locking pins, etc., and the embodiments of the present application do not limit this too much.

[0090] Further, referring to Figure 3 and Figure 7 As shown, the cover body 500 is detachably connected to the fan 210 through at least one first connecting member 530, which can improve the installation stability of the fan 210.

[0091] Referring to Figure 3 and Figure 7 As shown, in some embodiments, the cover body 500 has a second extension portion 520, the second extension portion 520 abuts against the heat sink 220, and the second extension portion 520, the heat sink 220 and the housing 100 enclose an air inlet channel, and the air inlet channel is communicated with the second installation groove 111.

[0092] In the above embodiment, the air inlet channel is enclosed by the second extension portion 520, the heat sink 220 and the housing 100. The fan 210 can suck air through the air inlet channel, and the air flows in the air inlet channel and takes away the heat on the heat sink 220 and the housing 100. In this way, a large contact area with the heat sink 220 can be ensured when the air flows, thereby improving the heat dissipation efficiency.

[0093] Among them, the heat dissipation member 300 is arranged corresponding to the air inlet channel and is arranged away from the fan 210 to avoid the heat on the heat dissipation member 300 affecting the operation of the fan 210.

[0094] Please refer to Figure 2 As shown, the direction indicated by the arrow is the path of air flow. When the fan 210 works, the air flows through the air inlet channel, the second installation groove 111 and the air outlet 510 in sequence.

[0095] Exemplarily, the fan 210 can be an axial-flow fan 210, which has a larger air volume and a higher air flow velocity driven compared with a centrifugal fan 210, and is more conducive to the convective heat transfer between the air and the heat sink 220. And the fan 210 can be installed horizontally.

[0096] Referring to Figure 7 As shown, at least one installation hole can be opened on the second extension portion 520, and at least one first installation portion 114 is correspondingly arranged on the housing 100, so that the second extension portion 520 can be fixed by passing the first connecting member 530 through the installation hole and connecting it to the first installation portion 114.

[0097] In some other embodiments, the heat dissipation component 200 may include a liquid cooling pipe disposed on the housing 100 and corresponding to the heat spreader 300. The liquid inlet and outlet of the liquid cooling pipe may be respectively connected to an external liquid cooling device.

[0098] In this way, the heat on the heat spreader 300 is taken away by the flow of the coolant in the liquid cooling pipe. Among them, the chipset 201 increases the contact area with the liquid cooling pipe on the housing 100 through the heat spreader 300 to improve the heat dissipation efficiency.

[0099] Referring to Figure 3 and Figure 7 As shown, in some embodiments, the housing 100 includes a first housing part 110 and a second housing part 120. The first housing part 110 and the second housing part 120 are detachably connected to form an installation cavity.

[0100] The heat dissipation component 200 and the heat spreader 300 are both disposed on the first housing part 110, and the second housing part 120 is used to install the electrical control component 20.

[0101] In the above embodiments, such a structural arrangement can facilitate the overall assembly with the domain controller. During installation, the heat dissipation component 200 and the heat spreader 300 can be respectively disposed on the first housing part 110 first, then the electrical control component 20 is installed on the second housing part 120, and finally the first housing part 110 and the second housing part 120 are correspondingly connected.

[0102] Among them, the heat dissipation component 200 and the heat spreader 300 are respectively disposed on opposite sides of the first housing part 110. The heat spreader 300 can be detachably connected to the first housing part 110 through structures such as bolts, locking buckles, and locking pins, or can be fixed to the first housing part 110 by welding. The embodiments of the present application do not impose too many restrictions on this. A thermal interface material can be provided between the heat spreader 300 and the first housing part 110 to improve the heat transfer efficiency.

[0103] Referring to Figure 3 and Figure 7 As shown, the first housing part 110 and the second housing part 120 can be detachably connected through at least one second connecting member 130. Among them, the second connecting member 130 can be structures such as bolts, locking buckles, and locking pins. The embodiments of the present application do not impose too many restrictions on this.

[0104] Referring to Figure 3 and Figure 7As shown, there is at least one first avoidance notch 112 on the first housing part 110, and at least one second avoidance notch 121 on the second housing part 120. The first avoidance notch 112 and the second avoidance notch 121 are correspondingly arranged to form an avoidance hole. The plug connector of the electrical control 20 can be exposed to the installation cavity through the avoidance hole, so as to facilitate the electrical connection between the domain controller and external electronic devices.

[0105] Further, referring to Figure 3 and Figure 7 As shown, one side of the first housing part 110 has a surrounding part 113. The surrounding part 113 is correspondingly arranged with the avoidance hole to protect the plug connector of the electrical control 20 and reduce damage.

[0106] Referring to Figure 3 and Figure 7 As shown, at least one second installation part 115 is arranged on the first housing part 110, and at least one through hole is arranged on the second installation part 115 for the installation of the domain controller.

[0107] Referring to Figure 1 and Figure 3 As shown, the domain controller provided by the embodiment of the present application includes an electrical control 20 and a heat dissipation structure 10 as described above. The electrical control 20 is arranged in the housing 100 of the heat dissipation structure 10.

[0108] Among them, since the domain controller adopts the heat dissipation structure 10 in the above embodiment, accordingly, it also has the advantages and benefits brought by the above heat dissipation structure 10, that is, high heat dissipation efficiency, strong heat dissipation evenness, and can avoid local heat accumulation of the chipset 201.

[0109] After considering the specification and the practice disclosed herein, those skilled in the art will easily think of other implementation schemes of the present application. The present application aims to cover any variations, uses or adaptation changes of the present application. These variations, uses or adaptation changes follow the general principles of the present application and include the common general knowledge or conventional technical means in the technical field not disclosed in the present application. The specification and the embodiments are only regarded as exemplary, and the true scope and spirit of the present application are pointed out by the following claims.

[0110] It should be understood that the present application is not limited to the exact structure already described and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present application is only limited by the appended claims.

Claims

1. A heat dissipation structure, characterized in that, Comprising: A housing (100) having an installation cavity for installing an electrical control component (20); A heat dissipation component (200) disposed on the housing (100); A heat spreading component (300) disposed in the installation cavity, the heat spreading component (300) being connected to the housing (100), the heat spreading component (300) being correspondingly disposed with the heat dissipation component (200) and extending along the extension direction of the heat dissipation component (200), a part of the heat spreading component (300) being used for abutting against a chipset (201) of the electrical control component (20), and the heat spreading component (300) being used for transferring the heat generated by the chipset (201) of the electrical control component (20) to the heat dissipation component (200) through the housing (100).

2. The heat dissipation structure according to claim 1, wherein, The heat spreading component (300) is a metal plate.

3. The heat dissipation structure according to claim 1, characterized in that, The heat spreading component (300) includes a support portion (301) and a first extension portion (302), the support portion (301) being used for abutting against the chipset (201) of the electrical control component (20), and the support portion (301) being used for covering the chipset (201) of the electrical control component (20); The first extension portion (302) extends along the extension direction of the heat dissipation component (200).

4. The heat dissipation structure according to claim 3, wherein It further includes at least one heat pipe (400) disposed on the heat spreading component (300) and extending from the support portion (301) to the first extension portion (302).

5. The heat dissipation structure according to claim 3, characterized in that, At least one positioning portion (310) is disposed on the support portion (301), and the positioning portion (310) is used for corresponding setting with the chipset (201) of the electrical control component (20).

6. The heat dissipation structure according to claim 5, characterized in that A heat conducting component (320) is disposed on the positioning portion (310), and the heat conducting component (320) is used for connecting with the chipset (201) of the electrical control component (20).

7. The heat dissipation structure according to claim 1, wherein The heat dissipation component (200) includes a fan (210) and a plurality of heat sinks (220); The plurality of heat sinks (220) are spaced apart and disposed on the housing (100), and the plurality of heat sinks (220) and the housing (100) form a second installation groove (111), and the fan (210) is disposed in the second installation groove (111); A cover body (500) is detachably connected to the housing (100), the cover body (500) covers the fan (210), an air outlet (510) is disposed on the cover body (500), and the air outlet (510) is correspondingly disposed with the second installation groove (111).

8. The heat dissipation structure according to claim 7, wherein, The cover body (500) has a second extension portion (520), the second extension portion (520) abuts against the heat sink (220), and the second extension portion (520), the heat sink (220) and the housing (100) enclose an air inlet channel, and the air inlet channel is communicated with the second installation groove (111).

9. The heat dissipation structure according to any one of claims 1 to 8, characterized in that, The housing (100) includes a first housing part (110) and a second housing part (120). The first housing part (110) is detachably connected to the second housing part (120) and forms the installation cavity. The heat dissipation component (200) and the heat spreading member (300) are both disposed on the first housing part (110), and the second housing part (120) is used for installing the electrical control component (20).

10. A domain controller, characterized in that, It includes an electrical control component (20) and the heat dissipation structure (10) according to any one of claims 1 to 9. The electrical control component (20) is disposed within the housing (100) of the heat dissipation structure (10).

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