Heat dissipation assembly, power supply module and battery charging and discharging equipment

Abstract

The invention relates to the technical field of battery production equipment, and discloses a heat dissipation assembly, a power module and battery charging and discharging equipment, the heat dissipation assembly comprises at least one heat pipe, the heat pipe comprises a pipe body, the pipe body is provided with an evaporation section and a condensation section which are oppositely arranged along the extension direction of the pipe body and are in heat conduction connection, and the evaporation section is used for absorbing heat of a to-be-cooled part; and the cold plate is in heat conduction connection with the condensation section and is used for absorbing heat of the condensation section. Through the first heat dissipation fins, the contact area of the condensation section of the heat pipe and the cold plate can be increased, the heat dissipation efficiency of the heat pipe can be improved, through the gradually-increased height of the guide part, a guide effect can be provided for insertion matching of the first heat dissipation fins and the cold plate, insertion and extraction can be more convenient, and disassembly and assembly of the heat pipe are facilitated.

Description

Technical Field

[0001] The present application relates to the technical field of battery production equipment, and particularly to a heat dissipation component, a power module, and a battery charging and discharging device. Background Art

[0002] The technical field of battery production equipment is an important part of the battery industry, which covers the entire production process of batteries from raw material processing to finished battery assembly. In this process, there are multiple key technological processes such as grading and formation, and each process has extremely high requirements for the accuracy, efficiency, and automation of the equipment. With the rapid development of the battery industry, higher standards are put forward for the performance and reliability of manufacturing equipment, which promotes continuous technological innovation and process optimization in the industry.

[0003] The battery charging and discharging detection equipment energizes the probe assembly through the power module. The probe assembly can contact the battery and charge and discharge the battery. During the operation of the equipment, the power module requires charging modes such as constant current charging, constant voltage charging, and constant current and constant voltage charging, and the constant current discharge mode returns the electric energy to the power grid. A large amount of heat is released during the operation of the power module, increasing the surrounding temperature, and the increase in temperature will have a significant impact on the operation of the equipment. Summary of the Invention

[0004] An embodiment of the present application discloses a heat dissipation component. The heat generated by the circuit board can be quickly taken away through the heat pipe, providing cooling for the circuit board, reducing the temperature of the power module equipment, and the heat dissipation efficiency of the heat pipe can be improved through the first heat dissipation fins. The insertion and extraction of the heat pipe and the cold plate can be facilitated through the guiding part, so as to facilitate disassembly and assembly, which is beneficial for maintenance.

[0005] To achieve the above object, according to the first aspect disclosed in the present application, there is provided a heat dissipation component, including: at least one heat pipe, the heat pipe including a pipe body, the pipe body having an evaporation section and a condensation section that are oppositely arranged along its extending direction and are thermally connected, the evaporation section being used for absorbing the heat of the component to be cooled; a cold plate, the cold plate being thermally connected to the condensation section, the cold plate being used for absorbing the heat of the condensation section.

[0006] As an optional implementation manner, the cold plate includes: a housing, the housing having a through hole and a plugging groove that penetrate the housing along its thickness direction, one end of the plugging groove being communicated with the periphery of the through hole, the through hole being used for plugging and arranging the condensation section of the heat pipe;

[0007] The heat pipe further includes: a first heat dissipation fin, the first heat dissipation fin being arranged on the outer surface of the condensation section, and the first heat dissipation fin extending along the axial direction of the pipe body, the plugging groove being used for plugging and arranging the first heat dissipation fin.

[0008] As an alternative embodiment, the first heat dissipation fin includes a guiding portion, and the height of the guiding portion in the radial direction of the tube body gradually decreases from the condensation section towards the evaporation section.

[0009] As an alternative embodiment, the number of the first heat dissipation fins is multiple, and the multiple first heat dissipation fins are arranged around the outer surface of the condensation section.

[0010] According to an embodiment of the second aspect of the present application, a power module is provided, including: a mounting bracket; a circuit board, the circuit board is disposed on the mounting bracket, and the circuit board is a component to be cooled; the aforementioned heat dissipation assembly; wherein, the evaporation section of the heat pipe of the heat dissipation assembly is thermally connected to the circuit board, and the cold plate of the heat dissipation assembly is disposed on the mounting bracket.

[0011] As an alternative embodiment, the cold plate includes a housing and a heat exchange tube, the housing is thermally connected to the condensation section of the heat pipe, the heat exchange tube is disposed inside the housing and is thermally connected to the housing, one end of the heat exchange tube is used to connect a cooling working medium collection device, and the other end is used to connect a cooling working medium supply device.

[0012] As an alternative embodiment, the housing has a through hole and a plugging groove penetrating through the housing in the thickness direction thereof, one end of the plugging groove communicates with the circumferential side of the through hole, the through hole is used for being plugged and arranged with the condensation section of the heat pipe, and the plugging groove is used for being plugged and arranged with the first heat dissipation fin.

[0013] As an alternative embodiment, the number of the first heat dissipation fins of the heat pipe is multiple, and the multiple first heat dissipation fins are arranged around the outer surface of the condensation section;

[0014] The number of the plugging grooves corresponds to the number of the first heat dissipation fins, and the multiple first heat dissipation fins are plugged and arranged in each of the plugging grooves in one-to-one correspondence.

[0015] As an alternative embodiment, the power module further includes: a finned radiator, the finned radiator includes a heat conducting substrate, multiple second heat dissipation fins and a heat conducting tube, the heat conducting substrate has a first surface and a second surface arranged oppositely, the first surface is thermally connected to the circuit board, and the second surface is thermally connected to the multiple second heat dissipation fins; the multiple second heat dissipation fins are arranged at intervals along a first direction on the second surface; the heat conducting tube extends along the first direction and sequentially penetrates through each of the second heat dissipation fins, and the outer surface of the heat conducting tube is thermally connected to each of the second heat dissipation fins; wherein, the cold plate is disposed on one side of the circuit board along the first direction, and the evaporation section of the heat pipe is plugged and arranged inside the heat conducting tube.

[0016] As an alternative embodiment, the evaporation section of the heat pipe is in clearance fit with the heat conduction pipe.

[0017] As an alternative embodiment, a heat conduction layer is filled in the clearance between the evaporation section of the heat pipe and the heat conduction pipe.

[0018] According to an embodiment of the third aspect of the present application, a battery charging and discharging device is provided, including: the aforementioned power supply module.

[0019] Compared with the prior art, the beneficial effects of the present application are as follows:

[0020] The heat dissipation component provided by the embodiment of the present application cools the circuit board through the heat pipe and the cold plate. The heat pipe therein can quickly take away the heat generated by the circuit board. Compared with the traditional air-cooling, the heat dissipation efficiency can be improved. Moreover, the heat pipe and the cold plate cooperate with each other. The cold plate can quickly take away the heat in the heat pipe, that is, the heat absorbed from the heat pipe can be quickly discharged through the cold plate, which can further improve the cooling efficiency and prevent the circuit board from overheating and affecting the normal operation of the power supply module. Description of the Drawings

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0022] Figure 1 It is a schematic structural diagram of the heat pipe disclosed in the embodiment of the present application;

[0023] Figure 2 It is a schematic structural diagram of the power supply module disclosed in the embodiment of the present application;

[0024] Figure 3 Disclosed in the embodiment of the present application Figure 2 It is an enlarged schematic structural diagram of part A therein;

[0025] Figure 4 It is a schematic structural diagram of the cold plate disclosed in the embodiment of the present application.

[0026] Explanation of the Reference Numerals in the Drawings:

[0027] 100 - power supply module; 10 - heat pipe; 101 - evaporation section; 102 - condensation section; 11 - first heat dissipation fin; 111 - guiding portion; 112 - mating portion; 20 - mounting bracket; 30 - circuit board; 40 - cold plate; 41 - housing; 411 - through hole; 412 - insertion slot; 42 - heat exchange tube; 50 - finned radiator; 51 - heat conduction substrate; 52 - second heat dissipation fin; 53 - heat conduction pipe. Detailed implementation manners

[0028] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the protection scope of the present application.

[0029] In the present application, the orientation or positional relationship indicated by terms such as "upper", "lower", "top", "bottom", "inner", "vertical", "horizontal", etc. is based on the orientation or positional relationship shown in the accompanying drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit that the indicated devices, elements or components must have a specific orientation, or be constructed and operated in a specific orientation.

[0030] Moreover, in addition to being able to represent the orientation or positional relationship, some of the above terms may also be used to represent other meanings. For example, the term "upper" may also be used to represent a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in the present application can be understood according to specific situations.

[0031] In addition, the terms "arranged", "provided with", "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral structure; it may be a mechanical connection or an electrical connection; it may be directly connected, or indirectly connected through an intermediate medium, or there may be internal communication between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0032] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, the meaning of "a plurality of" is two or more.

[0033] The battery production technology field is an important part of the battery industry, which covers the entire production process of batteries from raw material processing to finished battery assembly. In this process, there are multiple key process links such as formation and forming, and each link has extremely high requirements for the accuracy, efficiency and automation level of the equipment. With the rapid development of the battery industry, higher standards are put forward for the performance and reliability of manufacturing equipment, which promotes the industry to continuously carry out technological innovation and process optimization.

[0034] Battery formation is the process where the positive and negative electrode materials inside the battery are charged and undergo an electrochemical reaction, enabling the chemical reaction system inside the battery to reach a stable state and form a SEI film (Solid Electrolyte Interphase). The SEI film can prevent the chemical reaction process inside the battery from getting out of control and protect the interface between the electrolyte and the electrode material, thereby improving the battery's cycle life and safety performance. First, the positive and negative electrode materials inside the battery are initially charged to quickly form a chemical reaction system, laying the foundation for subsequent cell formation. Then, the battery is charged with a constant current to better activate and stabilize the chemical reaction system inside it, thereby increasing the battery's capacity and cycle life. Secondly, the battery is charged with a constant voltage to better stabilize the chemical reaction system inside the battery, thereby improving the battery's performance stability and safety performance. After the cell formation is completed, the battery needs to be subjected to a discharge test to detect whether the battery's performance and safety performance meet the requirements.

[0035] Battery grading is a crucial component step in battery manufacturing and quality control. Grading refers to charging and discharging the battery for testing to accurately measure the actual capacity of the battery and ensure that each battery cell in the battery pack has similar performance. The battery first undergoes constant current charging until it reaches the preset charging cut-off voltage. After charging is completed, the battery is left to stand for a period of time to allow the temperature and pressure inside the battery to naturally balance. After standing, the battery undergoes constant current discharge until the discharge cut-off voltage. The discharge current is usually set according to the rated capacity of the battery. After discharge is completed, the battery stands again to simulate the rest state during actual use. After standing, the battery undergoes a second constant current charging until it reaches the charging cut-off voltage. After constant current charging, the battery enters the constant voltage charging stage, at which point the charging current gradually decreases until the charging current drops to a very low value, indicating that the battery is close to full charge. After constant voltage charging is completed, the battery undergoes a final constant current discharge to determine the actual capacity of the battery. During the entire grading process, parameters such as the battery's voltage, current, and temperature are monitored and recorded in real time. After grading is completed, these data are analyzed to evaluate the battery's performance, and the batteries are classified according to parameters such as capacity and internal resistance. Based on the results of the grading test, the batteries are divided into different grades for subsequent assembly and use.

[0036] The battery charge and discharge detection equipment energizes the probe assembly through the power supply module. The probe assembly can make contact with the battery and charge and discharge the battery. During the operation of the equipment, the power supply module requires charging modes such as constant current charging, constant voltage charging, and constant current and constant voltage charging. The constant current discharge mode feeds the electricity back to the power grid. A large amount of heat is released during the operation of the power supply module, increasing the surrounding temperature, and the increased temperature will have a significant impact on the operation of the equipment.

[0037] To solve the above problems, in conventional practices, generally, power module devices dissipate heat through aluminum fins and forced air cooling by a fan. The operation of the fan will generate certain noise and is also vulnerable to unstable factors such as environmental influence. In a normal temperature environment, the air cooling mode has a slow heat dissipation rate, is prone to heat accumulation, causing the power module device to overheat and affecting the normal operation of the power module device.

[0038] Based on this, an embodiment of the present application provides a heat pipe that can quickly take away the heat generated by a circuit board, provide cooling for the circuit board, reduce the temperature of the power module device, and can improve the heat dissipation efficiency of the heat pipe through the first heat dissipation fins. The guiding part can facilitate the insertion and extraction of the heat pipe from the cold plate, facilitating disassembly and assembly and being conducive to maintenance.

[0039] The technical solution of the present application will be further described below in conjunction with embodiments and drawings.

[0040] Please refer to Figure 1 , Figure 1 which is a schematic structural diagram of the heat pipe disclosed in the embodiment of the present application. The embodiment of the present application discloses a heat dissipation assembly, which includes a heat pipe 10. The heat pipe 10 includes: a pipe body and a first heat dissipation fin 11. The pipe body has an evaporation section 101 and a condensation section 102 that are oppositely arranged along its extending direction and are thermally connected. The evaporation section 101 is used to absorb the heat of the component to be cooled, and the condensation section 102 is used to discharge the heat of the pipe body. The first heat dissipation fin 11 is arranged on the outer surface of the pipe body located at the condensation section 102, and the first heat dissipation fin 11 extends along the axial direction of the pipe body. The first heat dissipation fin 11 includes a guiding part 111, and the height of the guiding part 111 in the radial direction of the pipe body gradually decreases from the direction of the condensation section 102 to the evaporation section 101.

[0041] Specifically, the heat pipe 10 generally includes three parts: a pipe body, a wick, and a working medium. The working medium in the heat pipe 10 can be water, alcohol, ammonia, etc. The metal pipe body can include an evaporation section 101 and a condensation section 102 that are oppositely arranged. When the evaporation section 101 of the heat pipe 10 is heated, the working medium evaporates and vaporizes in the wick, and the vapor flows to the condensation section 102 under a small pressure difference. The vapor releases heat and condenses into a liquid in the condensation section 102, and the liquid flows back to the evaporation section 101 along the porous material by the action of capillary force, and so on in a cycle. The heat is transferred from one end of the heat pipe 10 to the other end. The heat pipe 10 utilizes the phase change and flow of the working medium to achieve rapid heat transfer, has a very high thermal conductivity and a limit heat flux density, can quickly conduct heat from the heat source to the heat dissipation end, has good heat dissipation efficiency, and the wick of the heat pipe 10, that is, the corresponding working medium cooling solution, eliminates the loop auxiliary system and pump valve components, simplifies the system highly, has high reliability, and does not require pressurization, avoiding the decompression accidents that may occur in the high-pressure systems of reactors such as light water reactors and gas-cooled reactors, reducing the complexity of the system, and reducing the maintenance cost and potential failure points.

[0042] The first heat dissipation fin 11 can be made of metal materials with good thermal conductivity, light weight and corrosion resistance, specifically copper, aluminum, carbon steel, stainless steel, etc. The first heat dissipation fin 11 can be fixed to the tube body by welding, tube expansion and threaded connection, wherein the tube expansion is to put the first heat dissipation fin 11 on the condensing section 102, and then make the first heat dissipation fin 11 in close contact with the condensing section 102 by mechanical tube expansion. The first heat dissipation fin 11 can not only increase the heat dissipation area of ​​the condensing section 102, but also work in conjunction with other heat dissipation components to form a more efficient heat dissipation component.

[0043] The first heat dissipating fin 11 includes a guide portion 111, which can not only increase the heat dissipation area of ​​the condensing section 102 and improve the heat dissipation efficiency, but also, due to the gradual change in the height of the guide portion 111, can also achieve a certain guiding effect for the installation and coordination of the first heat dissipating fin 11 and other heat dissipating components, which can facilitate the installation and disassembly of the heat pipe 10 and facilitate maintenance.

[0044] According to the heat dissipation component of the embodiment of the present invention, the heat dissipation component includes a heat pipe 10, and the working fluid in the heat pipe 10 can evaporate and absorb heat in the evaporation section 101. After absorbing heat and vaporizing, the working fluid floats to the condensation section 102, and then releases heat and liquefies in the condensation section 102. The liquefied working fluid then flows back to the evaporation section 101, and in this cycle, the heat of the component to be cooled is quickly taken away to dissipate heat for the component to be cooled. Moreover, the heat pipe 10 can increase the contact area between the condensation section 102 of the heat pipe 10 and the cold plate through the first heat dissipation fins 11 on its outer surface, and can further improve the efficiency of heat release and liquefaction in the condensation section 102, and can improve the heat dissipation efficiency of the heat pipe 10. Furthermore, the first heat dissipation fin 11 includes a guide portion 111. The gradually increasing height of the guide portion 111 can provide a guide effect for the plug-in cooperation between the first heat dissipation fin 11 and the cold plate, and can be plugged and unplugged more conveniently, which is convenient for the installation and disassembly of the heat pipe 10 and is conducive to disassembly and maintenance.

[0045] The first heat dissipation fin 11 can directly contact the cold plate 40 for thermal connection, or a matching portion 112 can be provided. The matching portion 112 can be a fin of regular shape, or a rectangular shape, so that the first heat dissipation fin 11 can be more convenient to match with other heat dissipation components, so that the heat of the condensation section 102 can be released faster, thereby improving the heat dissipation efficiency of the heat pipe 10.

[0046] See also Figure 2 and Figure 3 , Figure 2 is a schematic diagram of the structure of the power module disclosed in the embodiment of the present application, Figure 3 For the embodiment of this application Figure 2Schematic diagram of the enlarged structure at A in the [original context]. An embodiment of the present application also discloses a heat dissipation component, including: at least one heat pipe 10 and a cold plate 40. The heat pipe 10 includes a pipe body, and the pipe body has an evaporation section 101 and a condensation section 102 that are oppositely arranged along its extending direction and are thermally connected. The evaporation section 101 is used to absorb the heat of the component to be cooled, and the cold plate 40 is thermally connected to the condensation section 102. The cold plate 40 is used to absorb the heat of the condensation section 102.

[0047] Specifically, the heat pipe 10 and the cold plate 40 jointly cool the component to be cooled. The heat pipe 10 therein can quickly take away the heat generated by the component to be cooled. Compared with traditional air-cooling, the heat dissipation efficiency can be improved. Moreover, the heat pipe 10 and the cold plate 40 cooperate with each other. The cold plate 40 can quickly take away the heat in the heat pipe 10, that is, the heat absorbed from the heat pipe 10 can be quickly discharged through the cold plate 40, which can further improve the cooling efficiency.

[0048] Wherein, the axis of the heat pipe 10 can be perpendicular to the plate surface of the cold plate 40, which is convenient for the disassembly and assembly of the heat pipe 10 and the cold plate.

[0049] In some embodiments, the first heat dissipation fin 11 includes a guiding portion 111, and the height of the guiding portion 111 in the radial direction of the pipe body gradually decreases in the direction from the condensation section 102 to the evaporation section 101.

[0050] In some embodiments, as Figure 4 shown, Figure 4 is the schematic diagram of the structure of the cold plate disclosed in the embodiment of the present application. The cold plate 40 includes: a housing 41. The housing 41 has a through hole 411 and a plug-in slot 412 that penetrate the housing 41 along its thickness direction. One end of the plug-in slot 412 communicates with the circumferential side of the through hole 411. The through hole 411 is used for plugging and setting with the condensation section 102 of the heat pipe 10. The heat pipe 10 further includes a first heat dissipation fin 11. The first heat dissipation fin 11 is arranged on the outer surface of the condensation section 102, and the first heat dissipation fin 11 extends along the axial direction of the pipe body. The plug-in slot 412 is used for plugging and setting with the first heat dissipation fin 11.

[0051] In some embodiments, the number of the first heat dissipation fins 11 is multiple, and the multiple first heat dissipation fins 11 are arranged around the outer surface of the condensation section 102.

[0052] Specifically, the multiple first heat dissipation fins 11 all extend along the axial direction of the heat pipe 10 and are arranged around the outer surface of the heat pipe 10, which can increase the heat exchange efficiency between the condensation section 102 and other heat exchange components as much as possible, and can also facilitate the plugging and unplugging disassembly of the heat pipe 10 and other heat exchange components, which is convenient for maintenance.

[0053] Please refer to Figure 2 and Figure 3 , an embodiment of the present application discloses a power module, including: a mounting bracket 20;

[0054] A circuit board 30 is disposed on a mounting bracket 20. The circuit board 30 is a component to be cooled and is used to supply power to the probe assembly.

[0055] The aforementioned heat pipe 10 has an evaporation section 101 thermally connected to the circuit board 30.

[0056] A cold plate 40 is disposed on the mounting bracket 20 and is thermally connected to the condensation section 102 of the heat pipe 10.

[0057] Specifically, the circuit board 30 is the main heat-generating component of the power module. The circuit board 30 is disposed on the mounting bracket 20. The mounting bracket 20 can be a multi-layer and multi-board structure, which can make the circuit boards 30 placed neatly, with a compact structure, saving space, and also facilitating the heat dissipation of each circuit board 30. The heat pipe 10 is thermally connected to the circuit board 30, and can quickly take away the heat on the circuit board 30. Compared with traditional air-cooled heat dissipation, it can improve the cooling effect on the circuit board 30. The cold plate 40 is further thermally connected to the heat pipe 10, and can take away the heat on the heat pipe 10, improving the heat exchange efficiency of the heat pipe 10, and can further improve the cooling effect on the circuit board 30. By effectively dissipating the heat of the circuit board 30, the power module can maintain stable performance during high-load operation and extend the service life of the power module.

[0058] In some embodiments, the cold plate 40 includes a housing 41 and a heat exchange tube 42. The housing 41 is thermally connected to the condensation section 102 of the heat pipe 10. The heat exchange tube 42 is disposed in the housing 41 and is thermally connected to the housing 41. One end of the heat exchange tube 42 is used to connect to a cooling medium collection device, and the other end is used to connect to a cooling medium supply device.

[0059] Specifically, the housing 41 and the heat exchange tube 42 of the cold plate 40 can be made of a heat-conducting material. A heat exchange medium is disposed in the heat exchange tube 42. The cooling medium in the heat exchange tube 42 can be water. The heat exchange tube 42 can be arranged in a spiral shape in the housing 41 to increase the contact area between the heat exchange tube 42 and the housing 41 as much as possible and improve the heat exchange efficiency of the cold plate 40. A double liquid-cooling structure can be formed by the cold plate 40 and the heat pipe 10. After the heat generated by the circuit board 30 is quickly taken away by the heat pipe 10, the heat taken away by the heat pipe 10 is then taken away by the cold plate 40, so that this double liquid-cooling structure can have better heat dissipation efficiency and improve the cooling effect on the circuit board 30.

[0060] In some embodiments, refer to Figure 4The shell 41 has a through hole 411 and a plug-in slot 412 that penetrate the shell 41 along its thickness direction. One end of the plug-in slot 412 is connected to the peripheral side of the through hole 411. The through hole 411 is used for plugging with the condensing section 102 of the heat pipe 10, and the plug-in slot 412 is used for plugging with the first heat dissipation fin 11.

[0061] Specifically, the cooperation between the heat pipe 10 and the cold plate 40 can be achieved through the through hole 411 and the plug-in slot 412. The tube body of the heat pipe 10 passes through the through hole 411. The plug-in slot 412 is arranged on the periphery of the through hole 411 to provide a passage for the first heat dissipation fin 11 and contact the first heat dissipation fin 11, which can increase the contact area between the heat pipe 10 and the shell 41 of the cold plate 40, and improve the heat exchange efficiency between the heat pipe 10 and the cold plate 40. Among them, the number of through holes 411 and plug-in slots 412 can be multiple. When it is necessary to add a heat pipe 10, the newly added heat pipe 10 can be directly inserted into the corresponding plug-in slot 412 and through hole 411, and the number of heat pipes 10 can be increased or decreased according to actual needs.

[0062] The first heat dissipation fins 11 can pass through the housing 41 and be exposed from a side of the housing 41 away from the circuit board 30 , so that the heat pipe 10 can still be in contact with the air, thereby achieving dual heat dissipation of air and liquid cooling.

[0063] In some embodiments, the heat pipe 10 has a plurality of first heat dissipating fins 11 , and the plurality of first heat dissipating fins 11 are arranged around the outer surface of the condensing section 102 . The number of plug-in slots 412 corresponds to the number of first heat dissipating fins 11 , and the plurality of first heat dissipating fins 11 are plugged in one by one in each plug-in slot 412 .

[0064] Specifically, the plug-in slots 412 are arranged around the circumference of the through hole 411, and the whole is formed into a "flower" shape, so that each plug-in slot 412 can correspond to each first heat dissipation fin 11, so that when the heat pipe 10 is plugged into the cold plate 40, each first heat dissipation fin 11 can be guided by the guide part 111 first, and then matched with the plug-in slot 412 through the matching part 112, which not only makes it more convenient for the heat pipe 10 to be plugged and matched with the cold plate 40, but also can greatly increase the contact area between the cold plate 40 and the heat pipe 10, thereby improving the cooling efficiency of the cold plate 40 on the heat pipe 10.

[0065] Among them, each first heat dissipation fin 11 can be loosely matched with each plug-in slot 412, and the spacing can be 0.1mm, so that the heat pipe 10 can be plugged in and out of the cold plate 40, and the heat pipe 10 can also be thermally connected to the cold plate 40, and heat is transferred through the contact between the first heat dissipation fin 11 and the shell 41 of the cold plate 40.

[0066] In some embodiments, see Figure 2 and Figure 3, the finned heat sink 50, the finned heat sink 50 includes a heat-conducting substrate 51, a plurality of second heat dissipation fins 52 and a heat-conducting tube 53. The heat-conducting substrate 51 has a first surface and a second surface arranged oppositely. The first surface is in heat-conducting connection with the circuit board 30, and the second surface is in heat-conducting connection with the plurality of second heat dissipation fins 52. The plurality of second heat dissipation fins 52 are arranged at intervals along a first direction on the second surface. The heat-conducting tube 53 extends along the first direction and sequentially passes through each of the second heat dissipation fins 52. The outer surface of the heat-conducting tube 53 is in heat-conducting connection with each of the second heat dissipation fins 52. Among them, the cold plate 40 is arranged on one side of the circuit board 30 along the first direction, and the evaporation section 101 of the heat pipe 10 is inserted into the heat-conducting tube 53.

[0067] Specifically, the material of the fin heat sink is usually selected as a metal material with good heat conductivity and mechanical strength, which can be copper, aluminum, steel, etc. The second heat dissipation fins 52 and the heat-conducting substrate 51 can be connected by welding. While realizing physical fixation, the two have good heat conductivity to achieve heat-conducting connection. The heat-conducting substrate 51 and the circuit board 30 can be connected by heat-conducting glue, so that the heat-conducting base contacts the circuit board 30 and realizes heat-conducting connection. Through the fin heat sink, the contact area between the circuit board 30 and the air can be increased. Combining with the above-mentioned heat pipe 10 and cold plate 40, a cooling method combining air cooling and liquid cooling can be realized, and the cooling efficiency of the circuit board 30 can be improved.

[0068] The heat-conducting tube 53 can be made of a metal material with good heat conductivity, which can be copper, aluminum, steel, etc. The outer surface of the heat-conducting tube 53 contacts each of the second heat dissipation fins 52, which can be fixed by welding to achieve heat-conducting connection. The inside of the heat-conducting tube 53 is inserted and matched with the evaporation section 101 of the heat pipe 10.

[0069] The first direction can be the length direction of the circuit board 30.

[0070] In some embodiments, the evaporation section 101 of the heat pipe 10 is in clearance fit with the heat-conducting tube 53.

[0071] Specifically, the evaporation section 101 and the heat-conducting tube 53 are connected by insertion through clearance fit. This can not only make it more convenient to insert and remove the heat pipe 10, facilitate the disassembly and assembly of the heat pipe 10 and the heat-conducting tube 53, and is beneficial to the disassembly, assembly and maintenance of the heat pipe 10, but also enable heat exchange between the heat-conducting tube 53 and the evaporation section 101 of the heat pipe 10, thereby transferring heat.

[0072] The power supply module cools the circuit board 30 through the heat pipe 10 and the cold plate 40 together. The heat pipe 10 can quickly take away the heat generated by the circuit board 30. Compared with the traditional air-cooling, the heat dissipation efficiency can be improved. Moreover, the heat pipe 10 and the cold plate 40 cooperate with each other. The cold plate 40 can quickly take away the heat in the heat pipe 10, that is, the heat absorbed from the heat pipe 10 can be quickly discharged through the cold plate 40, which can further improve the cooling efficiency and prevent the circuit board 30 from overheating and affecting the normal operation of the power supply module.

[0073] Moreover, the finned radiator 50 provided on the circuit board 30 can cooperate with the heat pipe 10 and the cold plate 40 to form a mixed cooling effect of air cooling and liquid cooling, further improving the cooling efficiency of the circuit board 30.

[0074] Among them, the heat pipe 10 and the finned radiator 50 are thermally connected through the heat conduction pipe 53, which can increase the contact area between the heat pipe 10 and the finned radiator 50. While improving the heat dissipation efficiency of the heat pipe 10, it can also enable the heat pipe 10 and the finned radiator 50 to achieve a pluggable connection method, making it more convenient for the heat pipe 10 to be disassembled and assembled with the finned radiator, facilitating the disassembly, assembly and maintenance of the heat pipe 10.

[0075] The above-mentioned heat pipe 10 is not only detachably connected to the cold plate 40, but also detachably connected to the finned radiator 50, and the heat pipes 10 operate independently of each other without affecting each other. When a heat pipe 10 fails, the faulty heat pipe 10 can be easily disassembled, maintained or replaced, which can make the maintenance operation extremely simple and convenient, greatly reducing the time required for the maintenance operation of the cooling structure of the circuit board 30 and having more practical value.

[0076] In some embodiments, a heat conduction layer is filled in the gap between the evaporation section 101 of the heat pipe 10 and the heat conduction pipe 53.

[0077] The heat conduction layer can be heat-conducting silicone grease. The heat-conducting silicone grease is in an oil state. Filling the heat-conducting silicone grease in the gap can increase the contact area between the evaporation section 101 and the heat conduction pipe 53 and improve the heat conduction efficiency.

[0078] The embodiment of the present application discloses a battery charging and discharging device, including:

[0079] The aforementioned power supply module.

[0080] Specifically, during the charging and discharging process of the battery, the heat generated by the power supply module 100 can be taken away by the heat pipe 10 and the cold plate 40 in a timely manner. If the performance of the power supply module 100 deteriorates due to overheating, it may lead to unstable output voltage and current, thereby affecting the reliability of the battery detection results. Through the highly efficient heat dissipation of the heat pipe 10 and the cold plate 40, it is ensured that the power supply module 100 always maintains a good performance state during long-term operation, thus ensuring the continuous and stable operation of the battery charging and discharging detection equipment and extending the service life of the entire battery charging and discharging detection equipment.

[0081] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat dissipation component, characterized in that, Comprising: At least one heat pipe (10), the heat pipe (10) comprising a pipe body having an evaporation section (101) and a condensation section (102) that are oppositely arranged along its extending direction and are thermally connected, the evaporation section (101) being configured to absorb heat from the component to be cooled; A cold plate (40), the cold plate (40) being thermally connected to the condensation section (102), the cold plate (40) being configured to absorb heat from the condensation section (102).

2. The heat dissipation assembly according to claim 1, wherein The cold plate (40) comprises: a housing (41), the housing (41) having a through hole (411) and a plug-in slot (412) that penetrate through the housing (41) along its thickness direction, one end of the plug-in slot (412) being in communication with the circumferential side of the through hole (411), the through hole (411) being configured to be plugged and arranged with the condensation section (102) of the heat pipe (10); The heat pipe (10) further comprises: a first heat dissipation fin (11), the first heat dissipation fin (11) being arranged on the outer surface of the condensation section (102), and the first heat dissipation fin (11) extending along the axial direction of the pipe body, the plug-in slot (412) being configured to be plugged and arranged with the first heat dissipation fin (11).

3. The heat dissipation assembly according to claim 2, wherein The first heat dissipation fin (11) comprises a guiding portion (111), and the height of the guiding portion (111) in the radial direction of the pipe body gradually decreases in the direction from the condensation section (102) towards the evaporation section (101).

4. The heat dissipation assembly according to any one of claims 1-3, wherein The number of the first heat dissipation fins (11) is multiple, and the multiple first heat dissipation fins (11) are arranged in a surrounding manner on the outer surface of the condensation section (102).

5. A power supply module, characterized in that, Comprising: A mounting bracket (20); A circuit board (30), the circuit board (30) being arranged on the mounting bracket (20), the circuit board (30) being the component to be cooled; The heat dissipation assembly according to any one of claims 1-4; Wherein, the evaporation section (101) of the heat pipe (10) of the heat dissipation assembly is thermally connected to the circuit board (30), and the cold plate (40) of the heat dissipation assembly is arranged on the mounting bracket (20).

6. The power module according to claim 5, wherein The cold plate (40) comprises a housing (41) and a heat exchange pipe (42), the housing (41) being thermally connected to the condensation section (102) of the heat pipe (10), the heat exchange pipe (42) being arranged in the housing (41) and being thermally connected to the housing (41), one end of the heat exchange pipe (42) being configured to be connected to a cooling working medium collection device, and the other end being configured to be connected to a cooling working medium supply device.

7. The power module according to claim 6, wherein The housing (41) has a through hole (411) and a socket groove (412) that penetrate the housing (41) in its thickness direction. One end of the socket groove (412) communicates with the circumferential side of the through hole (411). The through hole (411) is used for plugging and setting with the condensation section (102) of the heat pipe (10). The heat pipe (10) includes a first heat dissipation fin (11). The first heat dissipation fin (11) is arranged on the outer surface of the condensation section (102) of the heat pipe, and the first heat dissipation fin (11) extends along the axial direction of the pipe body of the heat pipe (10). The socket groove (412) is used for plugging and setting with the first heat dissipation fin (11).

8. The power module according to claim 7, wherein The number of the first heat dissipation fins (11) of the heat pipe (10) is multiple. The multiple first heat dissipation fins (11) are arranged around the outer surface of the condensation section (102). The number of the socket grooves (412) corresponds to the number of the first heat dissipation fins (11). The multiple first heat dissipation fins (11) are plugged and set in each of the socket grooves (412) one by one.

9. The power supply module according to claim 5, wherein The power module further includes: A finned radiator (50). The finned radiator (50) includes a heat conducting substrate (51), multiple second heat dissipation fins (52) and a heat conducting pipe (53). The heat conducting substrate (51) has a first surface and a second surface that are oppositely arranged. The first surface is thermally connected to the circuit board (30), and the second surface is thermally connected to the multiple second heat dissipation fins (52). The multiple second heat dissipation fins (52) are arranged at intervals along a first direction on the second surface. The heat conducting pipe (53) extends along the first direction and sequentially penetrates through each of the second heat dissipation fins (52). The outer surface of the heat conducting pipe (53) is thermally connected to each of the second heat dissipation fins (52). Wherein, the cold plate (40) is arranged on one side of the circuit board (30) along the first direction. The evaporation section (101) of the heat pipe (10) is plugged and set in the heat conducting pipe (53).

10. The power module according to claim 9, wherein The evaporation section (101) of the heat pipe (10) is in clearance fit with the heat conducting pipe (53).

11. The power module according to claim 10, wherein A heat conducting layer is filled in the clearance between the evaporation section (101) of the heat pipe (10) and the heat conducting pipe (53).

12. A battery charging and discharging device, characterized in that, including: The power module according to any one of claims 5 - 11.

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