Power supply module and heat dissipation system

Abstract

The invention provides a power supply module and a heat dissipation system. The power supply module comprises a bottom plate, a power unit and a heat dissipation assembly. The power unit is arranged on the bottom plate and comprises an intermediate plate and a power device. The middle plate is provided with a first surface and a second surface which are opposite in the first axial direction. The power device is arranged on the first surface and / or the second surface of the intermediate plate. A heat dissipation plate of the heat dissipation assembly is arranged corresponding to the first surface or the second surface of the middle plate. When the heat dissipation plate is arranged corresponding to the first surface of the middle plate, the heat dissipation plate is in thermal contact with the first surface, and the projection of the heat dissipation plate and the projection of the first surface in the first axial direction are at least partially overlapped. When the heat dissipation plate is arranged corresponding to the second surface of the middle plate, the heat dissipation plate is in thermal contact with the second surface, and the projection of the heat dissipation plate and the projection of the second surface in the first axial direction are at least partially overlapped.

Description

Technical Field

[0001] The present invention relates to a power module and a heat dissipation system, and particularly to a power module and a heat dissipation system capable of improving heat dissipation performance. Background Art

[0002] With the rapid development of electronic technology, power modules are increasingly widely used in various electronic devices, and their power density is continuously increasing. A large amount of heat is generated during the operation of the power module. If the generated heat cannot be dissipated in a timely and effective manner, it will cause the temperature of the power module to rise, thereby affecting its performance, reliability, and service life.

[0003] Traditional heat dissipation methods for power modules mainly include natural heat dissipation, air cooling, and liquid cooling, etc. The natural heat dissipation method is relatively simple, but its heat dissipation efficiency is low. Air cooling requires additional devices such as fans, resulting in increased costs and occupied volume, and the heat dissipation effect of air cooling is limited in the case of high power density. Although liquid cooling has a better heat dissipation effect, its system is complex, so the maintenance cost is high.

[0004] In addition, there is also a method of improving heat dissipation performance by adding a heat dissipation copper foil on the circuit board, but this method still has deficiencies in heat dissipation efficiency and structural optimization.

[0005] Therefore, how to invent a power module and a heat dissipation system that can improve the above-mentioned existing technologies is an urgent need at present. Summary of the Invention

[0006] An object of the present invention is to provide a power module, which improves the heat dissipation performance by improving the arrangement method and structure to meet the increasing heat dissipation requirements of the power module.

[0007] Another object of the present invention is to provide a heat dissipation system, which is provided with a relatively thick heat conduction layer on the surface of the circuit board and a cavity inside the circuit board to enhance the heat conduction and heat dissipation effects.

[0008] To achieve the above object, the present invention provides a power module located in a three-dimensional space including a first axis, a second axis, and a third axis, and including a bottom plate, a power unit, and a heat dissipation component. The power unit is disposed on the bottom plate and includes an intermediate plate and a plurality of power devices. The intermediate plate has opposite first and second surfaces in the first axis, and both the first and second surfaces extend along the second and third axes and are perpendicular to the first axis. The intermediate plate has opposite third and fourth surfaces in the third axis, and both the third and fourth surfaces extend along the first and second axes and are perpendicular to the third axis. The third surface of the intermediate plate is connected to the surface of the bottom plate. The plurality of power devices are disposed on the first surface and / or the second surface of the intermediate plate. The heat dissipation component includes a heat dissipation plate, wherein the heat dissipation plate is configured to dissipate the heat energy generated by the power unit and is disposed corresponding to the first surface or the second surface of the intermediate plate of the power unit. When the heat dissipation plate is disposed corresponding to the first surface of the intermediate plate, the heat dissipation plate is in thermal contact with the first surface, and the projection of the heat dissipation plate and the first surface in the first axis at least partially overlap. When the heat dissipation plate is disposed corresponding to the second surface of the intermediate plate, the heat dissipation plate is in thermal contact with the second surface, and the projection of the heat dissipation plate and the second surface in the first axis at least partially overlap.

[0009] To achieve the above object, the present invention further provides a heat dissipation system including a heat dissipation circuit board, wherein the heat dissipation circuit board includes a surface heat conduction layer, an internal cavity, a plurality of inner layers, and a plurality of through holes. The surface heat conduction layer is disposed on the surface of the heat dissipation circuit board and is configured to absorb and conduct heat energy, wherein the thickness of the surface heat conduction layer is greater than 100 microns. The internal cavity is disposed inside the heat dissipation circuit board and is connected to the surface heat conduction layer. The plurality of inner layers are disposed inside the heat dissipation circuit board and are all parallel to the surface of the heat dissipation circuit board. The plurality of through holes are electrically connected between the surface heat conduction layer and the plurality of inner layers. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1A Schematic perspective view of the power module according to the first embodiment of the present invention.

[0011] Figure 1B is Figure 1A exploded structural view of the power module.

[0012] Figure 1C is Figure 1A schematic perspective view of the power module from another perspective.

[0013] Figure 1D is Figure 1C exploded structural view of the power module.

[0014] Figure 1E is Figure 1A front view of the power module.

[0015] Figure 1F The front view of a variant of the power supply module according to the first embodiment of the present invention.

[0016] Figure 2A The perspective structure schematic diagram of the power supply module according to the second embodiment of the present invention.

[0017] Figure 2B For Figure 2A The exploded structure schematic diagram of the power supply module.

[0018] Figure 2C For Figure 2A The perspective structure schematic diagram of the power supply module from another perspective.

[0019] Figure 2D For Figure 2C The exploded structure schematic diagram of the power supply module.

[0020] Figure 2E For Figure 2A The front view of the power supply module

[0021] Figure 2F The front view of a variant of the power supply module according to the second embodiment of the present invention.

[0022] Figure 3A The perspective structure schematic diagram of the power supply module according to the third embodiment of the present invention.

[0023] Figure 3B For Figure 3A The exploded structure schematic diagram of the power supply module.

[0024] Figure 3C For Figure 3A The perspective structure schematic diagram of the power supply module from another perspective.

[0025] Figure 3D For Figure 3C The exploded structure schematic diagram of the power supply module.

[0026] Figure 3E For Figure 3A The front view of the power supply module.

[0027] Figure 3F 、 Figure 3G And Figure 3H The front views of variants of the power supply module according to the third embodiment of the present invention.

[0028] Figure 4A The perspective structure schematic diagram of the power supply module according to the fourth embodiment of the present invention.

[0029] Figure 4B For Figure 4A The exploded structure schematic diagram of the power supply module.

[0030] Figure 4C The Figure 4A three-dimensional structure schematic diagram of the power supply module from another perspective.

[0031] Figure 4D The Figure 4C exploded structure schematic diagram of the power supply module.

[0032] Figure 4E The Figure 4A front view of the power supply module.

[0033] Figure 4F front view of the variant of the power supply module according to the fourth embodiment of the present invention.

[0034] Figure 5A three-dimensional structure schematic diagram of the power supply module according to the fifth embodiment of the present invention.

[0035] Figure 5B The Figure 5A exploded structure schematic diagram of the power supply module.

[0036] Figure 5C The Figure 5A three-dimensional structure schematic diagram of the power supply module from another perspective.

[0037] Figure 5D The Figure 5C exploded structure schematic diagram of the power supply module.

[0038] Figure 5E The Figure 5A front view of the power supply module.

[0039] Figure 5F front view of the variant of the power supply module according to the fifth embodiment of the present invention.

[0040] Figure 6A three-dimensional structure schematic diagram of the power supply module according to the sixth embodiment of the present invention.

[0041] Figure 6B The Figure 6A exploded structure schematic diagram of the power supply module.

[0042] Figure 6C The Figure 6A three-dimensional structure schematic diagram of the power supply module from another perspective.

[0043] Figure 6D The Figure 6C exploded structure schematic diagram of the power supply module.

[0044] Figure 6E The Figure 6A front view of the power supply module.

[0045] Figure 6FThe front view of a variation of the power supply module according to the sixth embodiment of the present invention.

[0046] Figure 7 The cross-sectional structural schematic diagram of the heat dissipation circuit board of the heat dissipation system according to an embodiment of the present invention.

[0047] Figure 8 Illustrates applying Figure 7 of the heat dissipation circuit board to Figure 3A the third heat dissipation plate.

[0048] Figure 9 Illustrates applying Figure 7 of the heat dissipation circuit board to the multi-board structure.

[0049] Figure 10 Is Figure 9 the top view of the heat dissipation circuit board.

[0050] Figure 11 The circuit structural schematic diagram of the power unit of the power supply module according to an embodiment of the present invention.

[0051] Figure 12 Illustrates Figure 11 the working waveform of the power unit in

[0052] Figure 13A Illustrates Figure 11 the core structure and winding method of the magnetic component in

[0053] Figure 13B , Figure 13C and Figure 13D Illustrates Figure 13A various variations of the winding method of the magnetic component in

[0054] Figure 14A , Figure 14B , Figure 14C and Figure 14D Illustrate respectively Figure 13A , Figure 13B , Figure 13C and Figure 13D the variations of the illustrated embodiments when the magnetic component does not include a middle column.

[0055] The reference numerals are as follows:

[0056] 100a: Power supply module

[0057] X: First axial direction

[0058] Y: Second axial direction

[0059] Z: Third axial direction

[0060] 1: Power unit

[0061] 11: Middle plate

[0062] 111: First surface

[0063] 112: Second surface

[0064] 113: Third surface

[0065] 114: Fourth surface

[0066] 115: Fifth surface

[0067] 116: Sixth surface

[0068] 117: Connection terminal

[0069] 12: Power device

[0070] 13: Magnetic component

[0071] 2: Heat dissipation component

[0072] 21: First heat dissipation plate

[0073] 22: Second heat dissipation plate

[0074] 3: Bottom plate

[0075] 31: Capacitor

[0076] 4: Top plate

[0077] 41: First surface

[0078] 42: Second surface

[0079] 43: Connection part

[0080] 5: Control board

[0081] 51: First surface

[0082] 52: Second surface

[0083] 53: Third surface

[0084] 54: Fourth surface

[0085] 55: Control device

[0086] 100b: Power module

[0087] 23: Third heat dissipation plate

[0088] 231: First surface

[0089] 232: Second surface

[0090] 100c: Power module

[0091] 24: Fourth heat dissipation plate

[0092] 14: Conductive component

[0093] 100d: Power supply module

[0094] 100e: Power supply module

[0095] 211: First connecting component

[0096] 221: Second connecting component

[0097] 100f: Power supply module

[0098] 212: First connecting component

[0099] 222: Second connecting component

[0100] 6, 6a, 6b: Heat dissipation circuit board

[0101] 61: Surface heat conduction layer

[0102] 62: Internal cavity

[0103] 63: Cavity heat conduction layer

[0104] 64: Inner layer

[0105] 65: Through hole

[0106] 66: Heat dissipation device

[0107] 67: Connection area

[0108] 68: Heat generating device

[0109] 69: Heat conduction device

[0110] Vin: Input voltage

[0111] Vo: Output voltage

[0112] Co: Output capacitor

[0113] 15a, 15b: Primary side circuit

[0114] 16a, 16b: Secondary side circuit

[0115] La: Auxiliary inductor

[0116] Lin: Input inductor

[0117] Q1, Q2, Q3, Q4: Primary side switch

[0118] C1, C2, C3, C4: Capacitor

[0119] Np1, Np2: Primary side winding

[0120] Ns1, Ns2, Ns3, Ns4: secondary windings

[0121] Nc: auxiliary winding

[0122] SR1, SR2, SR3, SR4: secondary switches

[0123] A, B, C, D: nodes

[0124] V AB and V CD : voltage

[0125] DT: duty cycle of control signal

[0126] T: switching period

[0127] 131: lower magnetic cover

[0128] 132: side post

[0129] 133: middle post

[0130] 134: side post

[0131] 135a, 135b, 136a, 136b: winding posts

[0132] P1, P2, P3, P4: coupling segments

[0133] P5, P6, P7, P8: connection segments Detailed implementation manners

[0134] Some typical embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can have various variations in different ways, all of which do not depart from the scope of the present invention.

[0135] Figure 1A FIG. is a perspective structural view of a power module according to the first embodiment of the present invention. Figure 1B is Figure 1A a disassembled structural view of the power module. Figure 1C is Figure 1A a perspective structural view of the power module from another perspective. Figure 1D is Figure 1C a disassembled structural view of the power module. Figure 1E is Figure 1A a front view of the power module. As Figures 1A to 1EAs shown, in this embodiment, the power supply module 100a is located in a three-dimensional space including a first axis X, a second axis Y, and a third axis Z, and includes one or more power units 1 (two power units 1 are taken as an example in the figure), a heat dissipation component 2, a bottom plate 3, a top plate 4, and a control board 5. Among them, the power unit 1, the heat dissipation component 2, and the control board 5 are arranged between the bottom plate 3 and the top plate 4.

[0136] In the case where the power supply module 100a includes multiple power units 1, the multiple power units 1 are arranged along the first axis X. Among them, each power unit 1 includes an intermediate plate 11, multiple power devices 12, and a magnetic component 13. The intermediate plate 11 has opposite first surface 111 and second surface 112 in the first axis X. Specifically, both the first surface 111 and the second surface 112 extend along the second axis Y and the third axis Z, and are perpendicular to the first axis X. The multiple power devices 12 are fixed on the first surface 111 and / or the second surface 112, and the power device 12 can be, for example but not limited to, a MOSFET. In addition, the intermediate plate 11 is connected to the bottom plate 3 and the top plate 4, and has opposite third surface 113 and fourth surface 114 in the third axis Z. Specifically, both the third surface 113 and the fourth surface 114 extend along the first axis X and the second axis Y, and are perpendicular to the third axis Z. When the intermediate plate 11 is connected to the bottom plate 3, the third surface 113 of the intermediate plate 11 is connected to the surface of the bottom plate 3. The top plate 4 has opposite first surface 41 and second surface 42 in the third axis Z. Specifically, both the first surface 41 and the second surface 42 of the top plate 4 extend along the first axis X and the second axis Y, and are perpendicular to the third axis Z. When the intermediate plate 11 is connected to the top plate 4, the fourth surface 114 of the intermediate plate 11 is connected to the second surface 42 of the top plate 4. In some embodiments, welding surfaces are provided on the third surface 113 and the fourth surface 114 of the intermediate plate 11, so that the intermediate plate 11 can be connected to the bottom plate 3 and the top plate 4 by welding. However, it should be noted that the actually adoptable connection methods are not limited to this.

[0137] In some embodiments, the intermediate plate 11 is a printed circuit board having multiple inner layers, and the multiple inner layers are stacked in sequence to form a multi-layer circuit board. The inner layers are parallel to the first surface 111 and the second surface 112 of the intermediate plate 11. Further, the inner layers are perpendicular to the third surface 113 and the fourth surface 114 of the intermediate plate 11.

[0138] In some embodiments, the shape of the intermediate plate 11 is a cuboid, and the area of the first surface 111 is larger than the areas of the third surface 113 and the fourth surface 114. Similarly, the area of the second surface 112 is larger than the areas of the third surface 113 and the fourth surface 114.

[0139] The magnetic component 13 is disposed on the middle plate 11, and the specific setting manner thereof can be, for example but not limited to, buckling, fitting or being embedded in the middle plate. In this embodiment, the magnetic component 13 is buckled on the middle plate 11. Furthermore, in some embodiments, when the magnetic component 13 is buckled or fitted on the middle plate 11, the middle plate 11 may correspondingly have a recess for accommodating the magnetic component 13, so as to facilitate reducing the occupied volume. Further, the magnetic component 13 is sunken through the recess or groove, which is beneficial to reducing the height difference of the devices on the surface of the middle plate 11, and preferably, the surfaces of the magnetic component 13 and the power device 12 can be approximately coplanar. In addition, it should be noted that whether the power unit 1 includes the magnetic component 13 depends on the application manner. In other words, in some embodiments, the power unit 1 may also not include the magnetic component 13. The magnetic component 13 can be a magnetic core of a planar transformer or applied to a coupled inductor.

[0140] The heat dissipation component 2 includes a first heat dissipation plate 21 and a second heat dissipation plate 22. The number of the first heat dissipation plates 21 is the same as the number of the power units 1, and each first heat dissipation plate 21 is disposed corresponding to the first surface 111 of the middle plate 11 of the power unit 1, that is, the projection of each first heat dissipation plate 21 on the first surface 111 of the middle plate 11 of the corresponding power unit 1 in the first axial direction X at least partially overlaps. For example, the first heat dissipation plate 21 may be parallel to the middle plate 11 of the corresponding power unit 1, but is not limited thereto. In the power unit 1, the power device 12 disposed on the first surface 111 of the middle plate 11 is located between the middle plate 11 and the corresponding first heat dissipation plate 21 and is thermally connected to the corresponding first heat dissipation plate 21, wherein the power device 12 can be connected to the corresponding first heat dissipation plate 21 by, for example but not limited to, heat dissipation glue. The number of the second heat dissipation plates 22 is the same as the number of the power units 1, and each second heat dissipation plate 22 is disposed corresponding to the second surface 112 of the middle plate 11 of the power unit 1, that is, the projection of each second heat dissipation plate 22 on the second surface 112 of the middle plate 11 of the corresponding power unit 1 in the first axial direction X at least partially overlaps. For example, the second heat dissipation plate 22 may be parallel to the middle plate 11 of the corresponding power unit 1, but is not limited thereto. In the power unit 1, the power device 12 disposed on the second surface 112 of the middle plate 11 is located between the middle plate 11 and the corresponding second heat dissipation plate 22 and is thermally connected to the corresponding second heat dissipation plate 22, wherein the power device 12 can be connected to the corresponding second heat dissipation plate 22 by, for example but not limited to, heat dissipation glue.

[0141] The first heat sink 21 and the second heat sink 22 are connected to the second surface 42 of the top plate 4. In some embodiments, the first heat sink 21 and the second heat sink 22 may be made of a thermally conductive non-magnetic material (such as but not limited to copper or aluminum). On the one hand, through its thermal conductivity, the heat energy generated by the power unit 1 can be conducted to improve the heat dissipation effect, thereby improving the stability and reliability of the power module 100a during high-power operation. On the other hand, the non-magnetic material can shield the magnetic field, so the magnetic field leakage can be avoided to interfere with the surrounding electronic components. In some embodiments, the first heat sink 21 and the second heat sink 22 may be made of metal or ceramic materials.

[0142] The bottom plate 3 may be, for example but not limited to, a printed circuit board having a plurality of inner layers, wherein the inner layers of the bottom plate 3 are parallel to the surface of the bottom plate 3 and extend along the first axis X and the second axis Y and are perpendicular to the third axis Z. In addition, in addition to connecting the intermediate plate 11 and the control plate 5, the surface of the bottom plate 3 can also be used for device setting (such as the capacitor 31). The top plate 4 may be, for example but not limited to, a printed circuit board having a plurality of inner layers, wherein the inner layers of the top plate 4 are parallel to the first surface 41 and the second surface 42 of the top plate 4. In some embodiments, a connection portion 43 is provided on the first surface 41 of the top plate 4, wherein the connection portion 43 can be configured to connect to an external electrical signal, so that the power unit 1 is electrically connected to the external electrical signal via the top plate 4, and the connection portion 43 can also be configured to connect to an external heat dissipation device, so that the heat energy generated by the power unit 1 can be transferred to the external heat dissipation device via the heat dissipation component 2 and the top plate 4, thereby enhancing the heat dissipation effect.

[0143] The control board 5 is connected to the bottom plate 3 and the top plate 4, and is adjacent to the power unit 1. When the power supply module 100a includes a plurality of power units 1, the control board 5 is located between two adjacent power units 1. Further, among the control board 5 and the two adjacent power units 1, the control board 5 is located between a first heat dissipation plate 21 on the first surface 111 of the intermediate plate 11 provided on one of the power units 1 and a second heat dissipation plate 22 on the second surface 112 of the intermediate plate 11 provided on the other power unit 1. Thus, the heat energy generated by the control board 5 can also be dissipated through the heat dissipation assembly 2. The control board 5 has opposite first surface 51 and second surface 52 in the first axial direction X. Specifically, the first surface 51 and the second surface 52 of the control board 5 both extend along the second axial direction Y and the third axial direction Z, and are perpendicular to the first axial direction X. The first surface 51 of the control board 5 is adjacent to the second heat dissipation plate 22, and the second surface 52 of the control board 5 is adjacent to the first heat dissipation plate 21. In addition, the control board 5 has opposite third surface 53 and fourth surface 54 in the third axial direction Z. Specifically, the third surface 53 and the fourth surface 54 of the control board 5 both extend along the first axial direction X and the second axial direction Y, and are perpendicular to the third axial direction Z. The third surface 53 and the fourth surface 54 of the control board 5 are respectively connected to the surface of the bottom plate 3 and the second surface 42 of the top plate 4. In some embodiments, welding surfaces are provided on the third surface 53 and the fourth surface 54 of the control board 5, so that the control board 5 can be connected to the bottom plate 3 and the top plate 4 by welding. However, it should be noted that the actually adoptable connection methods are not limited to this.

[0144] In addition, control devices 55 can be provided on the first surface 51 and / or the second surface 52 of the control board 5. The control devices 55 can be, for example but not limited to, a microcontroller, a buck circuit, a voltage stabilizing circuit, a signal conditioning circuit, etc. The control devices 55 are configured to control the power devices 12 of the power unit 1, but are not limited to this. In addition, the control devices 55 can be in thermal contact with the first heat dissipation plate 21 and / or the second heat dissipation plate 22 for heat dissipation. In some embodiments, the control board 5 is a printed circuit board with a plurality of inner layers. The inner layers of the control board 5 are parallel to the first surface 51 and the second surface 52 of the control board 5, and the control signals can control the power unit 1 through the internal traces of the control board 5.

[0145] The heat generated by the power unit 1 can be conducted to the outside of the power unit 1 through the top plate 4, the heat dissipation plate and / or the bottom plate 3. This structure provides at least four heat dissipation paths, greatly improving the heat dissipation efficiency. Further, the smaller side surface is mounted on the bottom plate 3, increasing the effective mounting area of the bottom plate 3. One bottom plate 3 can mount a plurality of power units 1 at the same time. Adjacent power units 1 can share the control board 5, and the power unit 1 located in the middle and the electronic components located inside can all dissipate heat effectively, improving the power density of the power supply module 100a.

[0146] The first surface 111 and / or the second surface 112 of the power unit 1 are device mounting surfaces, and various electronic components can be arranged on the device mounting surfaces, including but not limited to power semiconductor devices, capacitors, magnetic components, etc. The third surface 113 and / or the fourth surface 114 of the power unit 1 are welding surfaces, and multiple sets of connection terminals can be arranged on the welding surfaces, including but not limited to output terminals, input terminals, and signal terminals, and various structures such as edge plating or gold fingers can be adopted.

[0147] Multiple sets of connection terminals can be arranged on the first surface 41 and the second surface 42 of the top plate 4, including but not limited to ground terminals, input terminals, and signal terminals, and various structures such as pads or gold fingers can be adopted. Electronic components such as input capacitors and filter inductors can also be arranged on the first surface 41 and / or the second surface 42 of the top plate 4.

[0148] In some embodiments, the top plate 4 receives input electrical energy and transfers it to the intermediate plate 11. After the electronic components on the intermediate plate 11 complete the electrical energy conversion, the electrical energy is output to the bottom plate 3, and the bottom plate 3 then transfers the electrical energy to the load.

[0149] In other embodiments, the bottom plate 3 receives input electrical energy and transfers it to the intermediate plate 11. After the electronic components on the intermediate plate 11 complete the electrical energy conversion, the electrical energy is output to the bottom plate 3, and the bottom plate 3 transfers the electrical energy to the load.

[0150] In some embodiments, the first heat dissipation plate 21 and / or the second heat dissipation plate 22 are set as ground terminals, which is convenient for realizing a closed electrical circuit and avoiding occupying the area of the intermediate plate 11. Since the heat dissipation plate provides a large-area ground terminal, it is beneficial for high-current applications. In other embodiments, the heat dissipation plate can have different potentials and be set as various electrical terminals.

[0151] In addition, in some embodiments, the present invention can use thermal conductive adhesive to fill the interior of the power module 100a (i.e., fill between the power unit 1, the heat dissipation component 2, the bottom plate 3, the top plate 4, and the control board 5). The thermal conductive adhesive has a high thermal conductivity coefficient, so that the heat generated by the components of the power module 100a can be quickly conducted to the heat dissipation component 2 through the thermal conductive adhesive, thereby enhancing the heat dissipation effect, and at the same time, the waterproof and dustproof performance of the power module 100a can be improved.

[0152] In addition, the intermediate plate 11 has opposite fifth surfaces 115 and sixth surfaces 116 in the second axial direction Z. Specifically, both the fifth surface 115 and the sixth surface 116 extend along the first axial direction X and the third axial direction Z and are perpendicular to the second axial direction Y. In some embodiments, multiple sets of connection terminals can be arranged on the fifth surface 115 and / or the sixth surface 116 of the intermediate plate 11, including but not limited to ground terminals, input terminals, and signal terminals, and various structures such as side plating or gold fingers can be adopted. For example,Figure 1F An embodiment is illustrated in which a plurality of sets of connection terminals 117 are provided on the fifth surface 115 of the intermediate plate 11 of the power module 100a.

[0153] Furthermore, the connection terminals on the fifth surface 115 and / or the sixth surface 116 of the intermediate plate 11 can be electrically connected to other structures through an interconnection structure or an adapter board. In some embodiments, the top plate 4 can be welded or assembled to the fifth surface 115 and / or the sixth surface 116 of the intermediate plate 11 and serve as the interconnection structure or the adapter board.

[0154] Figure 2A Schematic perspective view of the power module according to the second embodiment of the present invention, Figure 2B is Figure 2A exploded view of the power module, Figure 2C is Figure 2A schematic perspective view of the power module from another perspective, Figure 2D is Figure 2C exploded view of the power module, Figure 2E is Figure 2A front view of the power module, where elements with similar functions and structures as those in Figures 1A to 1E are denoted by the same reference numerals and will not be described herein again. Different from the first embodiment shown in Figures 1A to 1E , in the second embodiment, as shown in Figures 2A to 2E , the power module 100b does not include the top plate 4, and the heat dissipation assembly 2 further includes a third heat dissipation plate 23 (which can also be regarded as a heat dissipation cover plate), where the third heat dissipation plate 23 spatially replaces the top plate 4 in the first embodiment. The third heat dissipation plate 23 has opposite first surface 231 and second surface 232 in the third axial direction Z. Specifically, the first surface 231 and the second surface 232 of the third heat dissipation plate 23 both extend along the first axial direction X and the second axial direction Y and are perpendicular to the third axial direction Z. The second surface 232 of the third heat dissipation plate 23 is assembled to all the first heat dissipation plates 21 and the second heat dissipation plates 22. Thus, the heat generated by the power unit 1 and the control board 5 can be conducted to the third heat dissipation plate 23 through the first heat dissipation plates 21 and the second heat dissipation plates 22 and dissipated through the third heat dissipation plate 23. It is preferred that all the first heat dissipation plates 21 and the second heat dissipation plates 22 have the same potential, but this is not a limitation. In some embodiments, the first heat dissipation plate 21, the second heat dissipation plate 22, and the third heat dissipation plate 23 of the heat dissipation assembly 2 can be integrally formed. In addition, the third heat dissipation plate 23 can be made of, for example, a thermally conductive non-magnetic material, or a metal or ceramic material.

[0155] In addition, in some embodiments, the fourth surface 114 of the intermediate plate 11 of the power unit 1 can be thermally connected to the second surface 232 of the third heat dissipation plate 23 to enhance heat dissipation. Among them, the fourth surface 114 of the intermediate plate 11 can be connected to the second surface 232 of the third heat dissipation plate 23, for example but not limited to, through heat dissipation glue. In some embodiments, the fourth surface 114 of the intermediate plate 11 of the power unit 1 can also be directly connected to the second surface 232 of the third heat dissipation plate 23 to further enhance the heat dissipation effect.

[0156] In some embodiments, multiple sets of connection terminals can be arranged on the fifth surface 115 and / or the sixth surface 116 of the intermediate plate 11, including but not limited to ground terminals, input terminals, and signal terminals, and various structures such as side plating or gold fingers can be adopted. For example, Figure 2F An embodiment is illustrated in which multiple sets of connection terminals 117 are arranged on the fifth surface 115 of the intermediate plate 11 of the power supply module 100b.

[0157] Figure 3A Schematic perspective view of the power supply module according to the third embodiment of the present invention, Figure 3B is Figure 3A exploded structural view of the power supply module, Figure 3C is Figure 3A schematic perspective view of the power supply module from another perspective, Figure 3D is Figure 3C exploded structural view of the power supply module, Figure 3E is Figure 3A front view of the power supply module, in which elements with similar functions and structures as those in Figures 2A to 2E are denoted by the same reference numerals and will not be described in detail herein. Different from Figures 2A to 2E the second embodiment shown, in the third embodiment, as Figures 3A to 3EAs shown, the power module 100c does not include a control board 5, and the magnetic component 13 of the power unit 1 is embedded in the middle board 11 to reduce the occupied volume. In addition, the heat dissipation component 2 includes a fourth heat dissipation plate 24, where the fourth heat dissipation plate 24 is disposed between any two adjacent power units 1, so the number of the fourth heat dissipation plates 24 is one less than the number of the power units 1. In other words, in this embodiment, a fourth heat dissipation plate 24 is disposed between two adjacent power units 1, and a first heat dissipation plate 21 or a second heat dissipation plate 22 is correspondingly disposed on the outer surface (the first surface 111 or the second surface 112) of the middle board 11 of the first or the last power unit 1 in the first axial direction X. From another perspective, in the case of multiple power units 1, one of the adjacent first heat dissipation plates 21 and second heat dissipation plates 22 is replaced and used as the fourth heat dissipation plate 24. The fourth heat dissipation plate 24 can be made of, for example, a thermally conductive non-magnetic material, or a metal or ceramic material. In some embodiments, the first heat dissipation plate 21, the second heat dissipation plate 22, and the fourth heat dissipation plate 24 of the heat dissipation component 2 can be integrally formed. In addition, since the magnetic component 13 is embedded in the middle board 11, the available space on the first surface 111 and the second surface 112 of the middle board 11 is increased, so the components (such as the control device 55) originally disposed on the control board can be disposed on the first surface 111 and the second surface 112 of the middle board 11.

[0158] In addition, in the present invention, in addition to being used for heat dissipation, the heat dissipation plate can also be used to form a conduction path. Taking the change in the manner shown in the third embodiment of the present invention as an example, in some embodiments, as Figure 3F shown, the heat dissipation plates extending along the third axial direction Z (such as the first heat dissipation plate 21, the second heat dissipation plate 22, and the fourth heat dissipation plate 24) can be assembled to the surface of the bottom board 3, and the power unit 1 includes a conductive member 14, where the conductive member 14 is electrically connected between the middle board 11 of the power unit 1 and the adjacent heat dissipation plate (such as the first heat dissipation plate 21, the second heat dissipation plate 22, or the fourth heat dissipation plate 24). For example, the conductive member 14 electrically connects the ground terminal on the middle board 11 to the adjacent heat dissipation plate, so that the heat dissipation plate forms a closed electrical loop as the ground terminal. In some embodiments, as Figure 3G shown, the heat dissipation plates extending along the third axial direction Z (such as the first heat dissipation plate 21, the second heat dissipation plate 22, and the fourth heat dissipation plate 24) can be assembled to the surface of the bottom board 3 and directly connected to the adjacent power device 12. For example, the ground terminal on the surface of the power device 12 is welded to the adjacent heat dissipation plate, so that the heat dissipation plate forms a closed electrical loop as the ground terminal. In addition, in some embodiments, in the case where the heat dissipation plates extending along the third axial direction Z are assembled to the surface of the bottom board 3, only a part of the heat dissipation plate corresponding to the surface of the bottom board 3 can be assembled to the bottom board 3, and the remaining part is not assembled to the bottom board 3, so that there is still some space on the bottom board 3 for the capacitor 31 to be disposed. It should be noted that Figure 3F and Figure 3GThe illustrated embodiments are merely examples, and in fact, the embodiments in which the heat dissipation plate is used for both heat dissipation and conduction are not limited thereto.

[0159] In addition, in some embodiments, multiple sets of connection terminals may be provided on the fifth surface 115 and / or the sixth surface 116 of the intermediate plate 11, including but not limited to ground terminals, input terminals, and signal terminals, and various structures such as side plating or gold fingers may be adopted. For example, Figure 3H An embodiment is illustrated in which multiple sets of connection terminals 117 are provided on the fifth surface 115 of the intermediate plate 11 of the power module 100c.

[0160] Figure 4A FIG. is a perspective structural view of a power module according to a fourth embodiment of the present invention. Figure 4B is Figure 4A an exploded structural view of the power module. Figure 4C is Figure 4A a perspective structural view of the power module from another perspective. Figure 4D is Figure 4C an exploded structural view of the power module. Figure 4E is Figure 4A a front view of the power module, where elements having similar functions and structures to those in Figures 3A to 3E are denoted by the same reference numerals and will not be described in detail herein. Different from Figures 3A to 3E the third embodiment shown in Figures 4A to 4E in the fourth embodiment, as shown in

[0161] In some embodiments, multiple sets of connection terminals may be provided on the fifth surface 115 and / or the sixth surface 116 of the intermediate plate 11, including but not limited to ground terminals, input terminals, and signal terminals, and various structures such as side plating or gold fingers may be adopted. For example, Figure 4FAn embodiment is illustrated in which a plurality of sets of connection terminals 117 are provided on the fifth surface 115 of the intermediate plate 11 of the power module 100d.

[0162] Figure 5A FIG. is a schematic perspective view of the power module according to the fifth embodiment of the present invention. Figure 5B is Figure 5A a schematic exploded view of the power module. Figure 5C is Figure 5A a schematic perspective view of the power module from another perspective. Figure 5D is Figure 5C a schematic exploded view of the power module. Figure 5E is Figure 5A a front view of the power module, wherein elements having similar functions and structures as those in Figures 1A to 1E are denoted by the same reference numerals and will not be described herein again. In the foregoing embodiment, the fourth surface 114 of the intermediate plate 11 of the power unit 1 is connected to the top plate 4 or the third heat sink 23. However, in the fifth embodiment, as shown in Figures 5A to 5E , the fourth surface 114 of the intermediate plate 11 of the power unit 1 of the power module 100e is not connected to the top plate 4 or the third heat sink 23. The fourth surface 114 of the intermediate plate 11 can be connected to, for example but not limited to, an external electrical signal or an external heat dissipation device. In addition, in this embodiment, the heat dissipation assembly 2 includes a first heat sink 21 and a second heat sink. The first heat sink 21 and the second heat sink are respectively disposed corresponding to the first surface 111 and the second surface 112 of the intermediate plate 11 of the power unit 1. Furthermore, the heat dissipation assembly 2 further includes a first connecting member 211 and a second connecting member 221. The first connecting member 211 is connected between the first heat sink 21 and the first surface 111 of the intermediate plate 11, and the second connecting member 221 is connected between the second heat sink 22 and the second surface 112 of the intermediate plate 11. Thus, the first surface 111 and the second surface 112 of the intermediate plate 11 can be respectively connected to the first heat sink 21 and the second heat sink 22 through the first connecting member 211 and the second connecting member 221, thereby improving the heat dissipation effect. In addition, the first connecting member 211 and the second connecting member 221 can be connected to the intermediate plate 11 in a suitable manner, for example but not limited to the locking manner shown in the figure. In some embodiments, the first heat sink 21 and the first connecting member 211 can be integrally formed, and the second heat sink 22 and the second connecting member 221 can be integrally formed.

[0163] In addition, Figures 5A to 5E in

[0164] In some embodiments, multiple sets of connection terminals may be provided on the fifth surface 115 and / or the sixth surface 116 of the intermediate plate 11, including but not limited to ground terminals, input terminals, and signal terminals, and various structures such as side plating or gold fingers may be adopted. For example, Figure 5F An embodiment is illustrated in which multiple sets of connection terminals 117 are provided on the fifth surface 115 of the intermediate plate 11 of the power module 100e.

[0165] Figure 6A Schematic perspective view of the power module according to the sixth embodiment of the present invention, Figure 6B is Figure 6A exploded structural view of the power module, Figure 6C is Figure 6A schematic perspective view of the power module from another perspective, Figure 6D is Figure 6C exploded structural view of the power module, Figure 6E is Figure 6A front view of the power module, where elements with similar functions and structures to those in Figures 1A to 1E are denoted by the same reference numerals and will not be described in detail herein. Different from the first embodiment shown in Figures 1A to 1E , in the sixth embodiment, as shown in Figures 6A to 6E , the fourth surface 114 of the intermediate plate 11 of the power unit 1 of the power module 100f is further connected to the heat dissipation component 2. Specifically, the heat dissipation component 2 further includes a first connecting member 212 and a second connecting member 222, where the first connecting member 212 is assembled between the first heat dissipation plate 21 and the fourth surface 114 of the intermediate plate 11, and the second connecting member 222 is assembled between the second heat dissipation plate 22 and the fourth surface 114 of the intermediate plate 11. Thus, the fourth surface 114 of the intermediate plate 11 can be connected to the first heat dissipation plate 21 and the second heat dissipation plate 22 through the first connecting member 212 and the second connecting member 222 respectively, thereby improving the heat dissipation effect. In some embodiments, the first heat dissipation plate 21 and the first connecting member 212 may be integrally formed, and the second heat dissipation plate 22 and the second connecting member 222 may be integrally formed. In addition, the number and specific arrangement positions of the first connecting member 212 and the second connecting member 222 and the specific arrangement position of the top plate 4 are not limited and may be determined according to actual needs. For example, in some embodiments, two first connecting members 212 are respectively provided on both sides of the first heat dissipation plate 21 in the second axial direction Y, two second connecting members 222 are respectively provided on both sides of the second heat dissipation plate 22 in the second axial direction Y, and the top plate 4 is located between the multiple first connecting members 212 and the second connecting members 222.

[0166] In some embodiments, multiple sets of connection terminals may be provided on the fifth surface 115 and / or the sixth surface 116 of the middle plate 11, including but not limited to ground terminals, input terminals, and signal terminals, and various structures such as side plating or gold fingers may be adopted. For example, Figure 6F An embodiment is illustrated in which multiple sets of connection terminals 117 are provided on the fifth surface 115 of the middle plate 11 of the power supply module 100f.

[0167] As can be seen from the foregoing embodiments, in the power supply module of the present invention, the heat dissipation component 2 can be used to dissipate heat from the power unit 1, and the composition and installation position of the heat dissipation component 2 can be determined according to actual needs. For example, the heat dissipation plate of the heat dissipation component 2 can be provided on the first surface 111, the second surface 112, and / or the fourth surface 114 of the middle plate 11 of each power unit 1, or can also be provided between adjacent power units 1. In some embodiments, the installation position of the heat dissipation plate corresponds to the installation position of the power device 12. Furthermore, the heat dissipation plate and the middle plate 11 of the power unit 1 can be thermally connected, directly connected (in direct contact), or indirectly connected (through a connecting member). Furthermore, in addition to dissipating heat, the heat dissipation plate can also be used to provide a conduction path. In addition, in the power supply module, whether the top plate and the control board are provided can be determined according to actual needs.

[0168] Figure 7 It is a schematic cross-sectional structure diagram of a heat dissipation circuit board of a heat dissipation system according to an embodiment of the present invention. Figure 7 The shown heat dissipation circuit board is applicable to the middle plate 11, heat dissipation plates (such as the first heat dissipation plate 21, the second heat dissipation plate 22, the third heat dissipation plate 23, and the fourth heat dissipation plate 24), the bottom plate 3, the top plate 4, and the control board 5 in the power supply module of the present invention to form a heat dissipation system with a strong heat dissipation effect. As Figure 7 shown, the heat dissipation circuit board 6 includes a surface heat conduction layer 61, an internal cavity 62, a cavity heat conduction layer 63, a plurality of inner layers 64, and a plurality of through holes 65.

[0169] The surface heat conduction layer 61 is provided on the surface of the heat dissipation circuit board 6 and is configured to quickly absorb and conduct heat energy, and a material with a high thermal conductivity (such as but not limited to copper) is used. The thickness of the surface heat conduction layer 61 can be determined according to actual needs, for example, it can be greater than 100 microns or 150 microns. For example, the surface heat conduction layer 61 can directly dissipate heat to the external space, or can be connected to an external heat dissipation device to conduct the absorbed heat energy to the external heat dissipation device for heat dissipation.

[0170] The internal cavity 62 is disposed inside the heat dissipation circuit board 6 and connected to the surface heat conduction layer 61. Preferably, the thermal conductivity of the internal cavity 62 is greater than 100 W / m·K (watts per meter per kelvin), but it is not limited thereto. The internal cavity 62 serves as a strong heat conduction space and can be used to conduct the heat energy inside the heat dissipation circuit board 6 to the surface heat conduction layer 61, and can also be used to achieve the heat energy transfer between the two surface heat conduction layers 61 on the two opposite surfaces of the heat dissipation circuit board 6. The internal cavity 62 can be precisely hollowed out inside the heat dissipation circuit board 6 through processes such as numerical control machining, and the actual shape and size of the internal cavity 62 can be determined according to the structure and heat dissipation requirements of the heat dissipation circuit board 6. Through this internal cavity 62, not only can the heat dissipation effect be enhanced, but also the weight of the heat dissipation circuit board 6 can be reduced. Additionally, in some embodiments, the internal cavity 62 can be filled with a heat conductive filler, and the heat conductive filler is made of a material with a high thermal conductivity (such as but not limited to metal or ceramic).

[0171] The cavity heat conduction layer 63 is disposed on the inner wall of the internal cavity 62 and can be used to conduct heat energy and electrical signals. The thickness of the cavity heat conduction layer 63 can be determined according to actual needs, for example, it can be greater than 100 microns or 150 microns. In some embodiments, the cavity heat conduction layer 63 can be directly connected to the surface heat conduction layer 61 to enhance the heat dissipation effect. By providing the cavity heat conduction layer 63, the heat conduction area can be further increased, making the heat energy transfer faster.

[0172] A plurality of inner layers 64 are disposed inside the heat dissipation circuit board 6, and the inner layer 64 can be, for example but not limited to, a copper layer. A plurality of through holes 65 are connected between the plurality of inner layers 64 and the surface heat conduction layer 61 to achieve electrical connection between the plurality of inner layers 64 and the surface heat conduction layer 61.

[0173] Generally speaking, the thermal conductivity of the dielectric layer of a printed circuit board is about within 4 W / m·K. Therefore, in the present invention, by providing the internal cavity 62 (for example, having a thermal conductivity greater than 100 W / m·K), the heat conduction ability of the circuit board can be greatly improved.

[0174] Figure 8 Illustrates the Figure 7 heat dissipation circuit board applied to Figure 3A the third heat dissipation plate of. To make the drawing concise, Figure 8 only the power unit 1 and the heat dissipation component 2 are illustrated in Figure 8As shown, the setting position of the fourth heat dissipation plate 24 corresponds to the setting position of the internal cavity 62 in the heat dissipation circuit board 6. Thus, the heat energy generated by the power unit 1 (such as the heat energy generated by the power device 12 on the intermediate plate 11) can be quickly conducted to the surface heat conduction layer 61 of the heat dissipation circuit board 6 through the fourth heat dissipation plate 24, the internal cavity 62 of the heat dissipation circuit board 6, and the cavity heat conduction layer 63. The surface heat conduction layer 61 can directly dissipate heat to the external space or be connected to the heat dissipation device 66 to enhance heat dissipation. In some embodiments, the contact area between the heat dissipation device 66 and the surface heat conduction layer 61 is greater than or equal to 40% of the surface area of the surface heat conduction layer 61.

[0175] In addition, to improve the heat conduction effect, the heating devices and heat conduction devices on the surface of the heat dissipation circuit board 6 can be arranged corresponding to the position of the internal cavity 62. For example, in an application with a multi-board structure, the heat energy can be transferred between multiple heat dissipation circuit boards 6 through the heat conduction devices. Figure 9 Illustrates Figure 7 the implementation manner of applying the heat dissipation circuit board to the multi-board structure, Figure 10 is Figure 9 a top view of the heat dissipation circuit board 6a. As Figure 9 and Figure 10 shown, the surface of the heat dissipation circuit board 6a has a connection area 67, where the position of the connection area 67 corresponds to the position of the internal cavity 62 of the heat dissipation circuit board 6a. Furthermore, a heating device 68 and a heat conduction device 69 are arranged in the connection area 67, and the heat dissipation circuit board 6a is connected to another heat dissipation circuit board 6b through the heat conduction device 69. Thus, the heat energy generated inside the heat dissipation circuit board 6a (through the internal cavity 62 of the heat dissipation circuit board 6a) and the heat energy generated by the heating device 68 can be conducted to the surface heat conduction layer 61 of the heat dissipation circuit board 6b through the heat conduction device 69 and the internal cavity 62 of the heat dissipation circuit board 6b for heat dissipation. In some embodiments, the surface heat conduction layer 61 of the heat dissipation circuit board 6b can be connected to the heat dissipation device 66 to enhance heat dissipation. In some embodiments, the heat conduction device 69 can be made of metal or ceramic material.

[0176] Please refer to Figure 11 , Figure 11 which is a schematic circuit structure diagram of the power unit of the power module according to an embodiment of the present invention. This circuit topology can be applied to the power unit of the power module in any embodiment of the present invention. However, it should be noted that this circuit topology is only an example, and the possible circuit topologies of the power unit of the power module of the present invention are not limited thereto. As Figure 11As shown, the power unit 1 is configured to receive an input voltage Vin and provide an output voltage Vo (i.e., the voltage across the output capacitor Co). The power unit 1 includes two primary circuits 15a and 15b, a magnetic component 13, two secondary circuits 16a and 16b, and an auxiliary inductor La. In some embodiments, the power unit 1 further includes an input inductor Lin. The primary circuit 15a includes a switch leg and a capacitor leg connected in parallel, where the switch leg includes a primary switch Q1 and Q2 connected in series, and the capacitor leg includes a capacitor C1 and C2 connected in series. The primary circuit 15b includes a switch leg and a capacitor leg connected in parallel, where the switch leg includes a primary switch Q3 and Q4 connected in series, and the capacitor leg includes a capacitor C3 and C4 connected in series. The magnetic component 13 includes a primary winding Np1 and Np2, secondary windings Ns1, Ns2, Ns3, and Ns4, and an auxiliary winding Nc. In some embodiments, the primary winding, secondary windings, and auxiliary winding may be printed circuit board windings and are respectively formed in Figures 1A to 6E each inner layer of the intermediate plate 11 of the power unit 1. The secondary circuit 16a includes secondary switches SR1 and SR2, and the secondary circuit 16b includes secondary switches SR3 and SR4. The primary switches and secondary switches are, for example, the power devices 12 disposed on the intermediate plate 11 in the foregoing embodiments.

[0177] Both ends of the primary winding Np1 are electrically connected to the node A between the primary switches Q1 and Q2 and the node B between the capacitors C1 and C2, respectively. The primary winding Np1 is electromagnetically coupled to the secondary windings Ns1 and Ns2 and the auxiliary winding Nc. The first end of the secondary winding Ns1 is electrically connected to the first end of the secondary switch SR1, the second end of the secondary winding Ns1 is electrically connected to the first end of the secondary winding Ns2 and the output capacitor Co, the second end of the secondary winding Ns2 is electrically connected to the first end of the secondary switch SR2, and the second ends of the secondary switches SR1 and SR2 are grounded. Both ends of the primary winding Np2 are electrically connected to the node C between the primary switches Q3 and Q4 and the node D between the capacitors C3 and C4, respectively. The primary winding Np2 is electromagnetically coupled to the secondary windings Ns3 and Ns4 and the auxiliary winding Nc. The first end of the secondary winding Ns3 is electrically connected to the first end of the secondary switch SR3, the second end of the secondary winding Ns3 is electrically connected to the first end of the secondary winding Ns4 and the output capacitor Co, the second end of the secondary winding Ns4 is electrically connected to the first end of the secondary switch SR4, and the second ends of the secondary switches SR3 and SR4 are grounded. The auxiliary winding Nc and the auxiliary inductor La form a closed loop.

[0178] Please refer to Figure 12 and in conjunction with Figure 11 , Figure 12 illustrates Figure 11 the operating waveforms of the power unit in Figure 12Among them, Q1, Q2, Q3, Q4, SR1, SR2, SR3, and SR4 respectively represent the control signals of the primary switches Q1, Q2, Q3, and Q4 and the secondary switches SR1, SR2, SR3, and SR4, and V AB is the voltage between node A and node B, V CD is the voltage between node C and node D, DT is the duty cycle of the control signal, and T is the switching period. As Figure 11 and Figure 12 shown, the phase difference between the control signals of the primary switches Q1 and Q2 is 180 degrees, the phase difference between the control signals of the primary switches Q3 and Q4 is 180 degrees, the phase difference between the control signals of the primary switches Q1 and Q3 is 90 degrees, and the phase difference between the control signals of the primary switches Q2 and Q4 is 90 degrees. The control signals of the secondary switch SR1 and the primary switch Q1 are complementary, the control signals of the secondary switch SR2 and the primary switch Q2 are complementary, the control signals of the secondary switch SR3 and the primary switch Q3 are complementary, and the control signals of the secondary switch SR4 and the primary switch Q4 are complementary. The voltages V AB and V CD are three-level alternating voltages. It should be noted that the switching control method in the power unit 1 of the present invention is not limited thereto, and any switching control method that can make the voltages V AB and V CD be two-level or three-level alternating voltages can be adopted. In some embodiments, the capacitors in the primary circuits 15a and 15b can also be replaced by switches, so that the primary circuits 15a and 15b are full-bridge switch structures.

[0179] Figure 13A Illustrates Figure 11 the core structure and winding method of the magnetic component 13 in, in which a top view of the magnetic component 13 is shown (for example, along the Figure 1A viewpoint of the third axis Z in). As Figure 13A shown, the core in the magnetic component 13 includes an upper magnetic cover (not shown in the figure), a lower magnetic cover 131, side columns 132, a middle column 133, side columns 134, and winding columns 135a, 135b, 136a, and 136b. The side columns 132, the middle column 133, the side columns 134, and the winding columns 135a, 135b, 136a, and 136b are arranged between the upper magnetic cover and the lower magnetic cover 131. Among them, the side columns 132, the middle column 133, and the side columns 134 are arranged in sequence along the first direction, the winding columns 135a and 135b are arranged along the second direction and are located between the side column 132 and the middle column 133, the winding columns 136a and 136b are arranged along the second direction and are located between the side column 134 and the middle column 133, and the second direction is perpendicular to the first direction. In addition, in Figure 13AAmong them, the windings of the primary side windings Np1 and Np2 are represented by dashed lines, the windings of the secondary side windings Ns1, Ns2, Ns3 and Ns4 are represented by dotted chain lines, and the windings of the auxiliary winding Nc are represented by solid lines.

[0180] The winding of the primary side winding Np1 is wound around the winding columns 135a and 135b. The first end and the second end of the winding of the secondary side winding Ns1 are respectively connected to the secondary side switch SR1 and the positive end of the output capacitor Co. Among them, starting from the first end, the winding of the secondary side winding Ns1 winds around the winding column 135a counterclockwise, then passes between the winding columns 135a and 135b, and then winds around the winding column 135b clockwise, and finally is connected to the positive end of the output capacitor Co. The first end and the second end of the winding of the secondary side winding Ns2 are respectively connected to the secondary side switch SR2 and the positive end of the output capacitor Co. Among them, starting from the first end, the winding of the secondary side winding Ns2 winds around the winding column 135a clockwise, then passes between the winding columns 135a and 135b, and then winds around the winding column 135b counterclockwise, and finally is connected to the positive end of the output capacitor Co. The middle column 133 is used to provide an anti-coupling magnetic path for the secondary side windings Ns1 and Ns2 wound around the winding columns 135a and 135b.

[0181] The winding of the primary side winding Np2 is wound around the winding columns 135a and 135b. The first end and the second end of the winding of the secondary side winding Ns3 are respectively connected to the secondary side switch SR3 and the positive end of the output capacitor Co. Among them, starting from the first end, the winding of the secondary side winding Ns3 winds around the winding column 136a counterclockwise, then passes between the winding columns 136a and 136b, and then winds around the winding column 136b clockwise, and finally is connected to the positive end of the output capacitor Co. The first end and the second end of the winding of the secondary side winding Ns4 are respectively connected to the secondary side switch SR4 and the positive end of the output capacitor Co. Among them, starting from the first end, the winding of the secondary side winding Ns4 winds around the winding column 136a clockwise, then passes between the winding columns 136a and 136b, and then winds around the winding column 136b counterclockwise, and finally is connected to the positive end of the output capacitor Co. The middle column 133 is used to provide an anti-coupling magnetic path for the secondary side windings Ns3 and Ns4 wound around the winding columns 136a and 136b.

[0182] The winding of the auxiliary winding Nc can be divided into multiple sections, including coupling sections P1, P2, P3 and P4, and connection sections P5, P6, P7 and P8. Among them, the coupling section refers to the part of the auxiliary winding Nc wound inside the magnetic core, and the connection section refers to the part of the auxiliary winding Nc wound outside the magnetic core for connecting the coupling sections. In some embodiments, the coupling section P1 has a similar or identical winding trajectory to the secondary winding Ns1. Further, the coupling section P1 and the secondary winding Ns1 also have the same number of turns and winding direction, so they highly overlap in space, making the coupling section P1 and the secondary winding Ns1 tightly coupled to each other. In some embodiments, the conductive lines of the conductive layer in the printed circuit board form the coupling section P1 and the secondary winding Ns1, and the conductive layer where the coupling section P1 is located and the conductive layer where the secondary winding Ns1 is located are adjacent or spaced apart. The current flowing through the coupling section P1 is less than the current flowing through the secondary winding Ns1, the number of layers of the conductive layer corresponding to the coupling section P1 is less than the number of layers of the conductive layer corresponding to the secondary winding Ns1. The area of the conductive line corresponding to the coupling section P1 is not greater than the area of the conductive line corresponding to the secondary winding Ns1. Further, the projection of the conductive line corresponding to the coupling section P1 in the vertical direction and the projection of the conductive line corresponding to the secondary winding Ns1 in the vertical direction at least partially overlap, and the overlapping area is greater than 70% of the area of the conductive line corresponding to the coupling section P1, so as to achieve tight coupling and increase the coupling coefficient.

[0183] Similarly, the coupling section P2 has a similar or identical winding trajectory, the same number of turns and winding direction to the secondary winding Ns2, so they highly overlap in space, making the coupling section P2 and the secondary winding Ns2 tightly coupled to each other. The coupling section P3 has a similar or identical winding trajectory, the same number of turns and winding direction to the secondary winding Ns3, so they highly overlap in space, making the coupling section P3 and the secondary winding Ns3 tightly coupled to each other. The coupling section P4 has a similar or identical winding trajectory, the same number of turns and winding direction to the secondary winding Ns4, so they highly overlap in space, making the coupling section P4 and the secondary winding Ns4 tightly coupled to each other.

[0184] The coupling segments are connected through connection segments, and the winding trajectories from the first end to the second end of each coupling segment are approximately the same as those of the corresponding secondary windings. In this embodiment, the first end of the coupling segment P3 is connected to the first end of the auxiliary inductor La, the two ends of the connection segment P5 are respectively connected to the second end of the coupling segment P3 and the first end of the coupling segment P4, the two ends of the connection segment P6 are respectively connected to the second end of the coupling segment P4 and the first end of the coupling segment P2, the two ends of the connection segment P7 are respectively connected to the second end of the coupling segment P2 and the first end of the coupling segment P1, and the two ends of the connection segment P8 are respectively connected to the second end of the coupling segment P1 and the second end of the auxiliary inductor La. Thus, the winding of the auxiliary inductor La and the auxiliary winding Nc forms a closed loop in sequence of the auxiliary inductor La, the coupling segment P3, the connection segment P5, the coupling segment P4, the connection segment P6, the coupling segment P2, the connection segment P7, the coupling segment P1, the connection segment P8, and the auxiliary inductor La. It should be noted that in the figure, the demarcation points between each coupling segment and the connection segment are marked by dots for easy understanding of the connection relationship, but these demarcation points may not exist in actual applications. In addition, the connection segments in the figure surround the side columns 132 or 134, but in fact, the trajectory of the connection segments is not limited to this, and it only needs to connect the corresponding coupling segments at both ends.

[0185] Through the auxiliary winding Nc that is tightly coupled with the secondary windings Ns1, Ns2, Ns3, and Ns4, corresponding current changes can be generated when the load changes, thereby maintaining the stability of the output voltage Vo and improving the dynamic performance of the circuit. Taking the primary circuit 15a and its corresponding secondary circuit 16a as an example, when the load suddenly changes from heavy load to light load, the output voltage Vo overshoots. At this time, the controller acts to reduce the duty ratios of the control signals of the primary switches Q1 and Q2, and increase the duty ratios of the control signals of the secondary switches SR1 and SR2. At this time, the secondary windings Ns1 and Ns2 bear the output voltage Vo. Since the auxiliary winding Nc is tightly coupled with the secondary windings and has the same winding method, the AC voltage coupled by the auxiliary winding Nc on the winding column is proportional to the output voltage Vo and has a superimposed amplitude. This AC voltage is applied to the auxiliary inductor La, causing the current flowing through the auxiliary inductor La to decrease. Therefore, the currents flowing through the secondary windings Ns1 and Ns2 decrease significantly, reducing the output energy and effectively suppressing the overshoot of the output voltage Vo.

[0186] In addition, the connection order of the coupling segments P1, P2, P3, and P4 is not Figure 13A as shown and can be adjusted according to actual needs. The following takes Figure 13B and Figure 13C as examples to illustrate other possible implementation manners.

[0187] In some embodiments, such as Figure 13BAs shown, the first end of the coupling section P3 is connected to the first end of the auxiliary inductor La. The two ends of the connection section P5 are respectively connected to the second end of the coupling section P3 and the first end of the coupling section P4. The two ends of the connection section P6 are respectively connected to the second end of the coupling section P4 and the first end of the coupling section P1. The two ends of the connection section P7 are respectively connected to the second end of the coupling section P1 and the first end of the coupling section P2. The two ends of the connection section P8 are respectively connected to the second end of the coupling section P2 and the second end of the auxiliary inductor La. Thus, the winding of the auxiliary inductor La and the auxiliary winding Nc forms a closed loop in sequence of the auxiliary inductor La, the coupling section P3, the connection section P5, the coupling section P4, the connection section P6, the coupling section P1, the connection section P7, the coupling section P2, the connection section P8, and the auxiliary inductor La.

[0188] In some other embodiments, such as Figure 13C As shown, the first end of the coupling section P3 is connected to the first end of the auxiliary inductor La. The two ends of the connection section P5 are respectively connected to the second end of the coupling section P3 and the first end of the coupling section P1. The two ends of the connection section P6 are respectively connected to the second end of the coupling section P1 and the first end of the coupling section P2. The two ends of the connection section P7 are respectively connected to the second end of the coupling section P2 and the first end of the coupling section P4. The two ends of the connection section P8 are respectively connected to the second end of the coupling section P4 and the second end of the auxiliary inductor La. Thus, the winding of the auxiliary inductor La and the auxiliary winding Nc forms a closed loop in sequence of the auxiliary inductor La, the coupling section P3, the connection section P5, the coupling section P1, the connection section P6, the coupling section P2, the connection section P7, the coupling section P4, the connection section P8, and the auxiliary inductor La.

[0189] In addition, in Figure 13A , Figure 13B and Figure 13C In the shown embodiments, each coupling section of the winding of the auxiliary winding Nc has the same winding manner as the corresponding secondary winding. However, the present invention is not limited thereto. In some other embodiments, the auxiliary winding Nc may also adopt a winding manner different from that of the secondary winding.

[0190] For example, such as Figure 13DAs shown, starting from the first end of the coupling section P1, the coupling section P1 passes between the side post 132 and the winding post 135a, and is arranged in the second direction, and finally passes between the side post 132 and the winding post 135b. Similarly, starting from the first end of the coupling section P2, the coupling section P2 passes between the middle post 133 and the winding post 135a, and is arranged in the second direction, and finally passes between the middle post 133 and the winding post 135b. Starting from the first end of the coupling section P3, the coupling section P3 passes between the middle post 133 and the winding post 136a, and is arranged in the second direction, and finally passes between the middle post 133 and the winding post 136b. Starting from the first end of the coupling section P4, the coupling section P4 passes between the side post 134 and the winding post 136a, and is arranged in the second direction, and finally passes between the side post 134 and the winding post 136b.

[0191] In Figure 13D the illustrated embodiment, the first end of the coupling section P3 is connected to the first end of the auxiliary inductor La, both ends of the connection section P5 are respectively connected to the second end of the coupling section P3 and the first end of the coupling section P1, both ends of the connection section P6 are respectively connected to the second end of the coupling section P1 and the first end of the coupling section P2, both ends of the connection section P7 are respectively connected to the second end of the coupling section P2 and the first end of the coupling section P4, and both ends of the connection section P8 are respectively connected to the second end of the coupling section P4 and the second end of the auxiliary inductor La. Thus, the winding of the auxiliary inductor La and the auxiliary winding Nc forms a closed loop in sequence as the auxiliary inductor La, the coupling section P3, the connection section P5, the coupling section P1, the connection section P6, the coupling section P2, the connection section P7, the coupling section P4, the connection section P8, and the auxiliary inductor La.

[0192] In addition, in Figure 13A , Figure 13B , Figure 13C and Figure 13D the illustrated embodiments, the magnetic component 13 all includes the middle post 133. However, the present invention is not limited thereto. In some other embodiments, the magnetic component 13 may not include the middle post 133. For example, Figure 14A , Figure 14B , Figure 14C and Figure 14D respectively illustrate Figure 13A , Figure 13B , Figure 13C and Figure 13D the variations of the illustrated embodiments when the magnetic component 13 does not include the middle post 133.

[0193] It should be noted that the above are only the preferred embodiments proposed to illustrate the present invention. The present invention is not limited to the described embodiments. The scope of the present invention is determined by the appended claims. And the present invention can be variously modified by those skilled in the art, but all do not depart from what the appended claims are intended to protect.

Claims

1. A power module is located in a three-dimensional space including a first axis, a second axis, and a third axis, and includes: A bottom plate, A power unit is disposed on the bottom plate and includes: An intermediate plate, wherein the intermediate plate has opposite first and second surfaces in the first axial direction, and both the first surface and the second surface extend along the second axial direction and the third axial direction and are perpendicular to the first axial direction; the intermediate plate has opposite third and fourth surfaces in the third axial direction, and both the third surface and the fourth surface extend along the first axial direction and the second axial direction and are perpendicular to the third axial direction; the third surface of the intermediate plate is joined to the surface of the bottom plate; And A plurality of power devices are disposed on the first surface and / or the second surface of the intermediate plate; and A heat dissipation assembly includes a heat dissipation plate, wherein the heat dissipation plate is configured to dissipate heat generated by the power unit, and is disposed corresponding to the first surface or the second surface of the intermediate plate of the power unit; when the heat dissipation plate is disposed corresponding to the first surface of the intermediate plate, the heat dissipation plate is in thermal contact with the first surface, and the projection of the heat dissipation plate on the first surface in the first axis at least partially overlaps; When the heat dissipation plate is disposed corresponding to the second surface of the intermediate plate, the heat dissipation plate is in thermal contact with the second surface, and the projection of the heat dissipation plate on the second surface in the first axis at least partially overlaps.

2. The power module according to claim 1, wherein the heat dissipation plate of the heat dissipation assembly includes a first heat dissipation plate and a second heat dissipation plate, the first heat dissipation plate is disposed corresponding to the first surface of the intermediate plate, and the second heat dissipation plate is disposed corresponding to the second surface of the intermediate plate.

3. The power module according to claim 2, wherein the power module includes a plurality of the power units arranged along the first axis, and one of the adjacent first heat dissipation plate and the second heat dissipation plate is replaced.

4. The power module according to claim 2, wherein the first heat dissipation plate and the second heat dissipation plate have the same potential.

5. The power module according to claim 1, wherein the power module includes a plurality of the power units arranged along the first axis, and the heat dissipation plate of the heat dissipation assembly is disposed between two adjacent power units.

6. The power module according to claim 1, wherein the plurality of power devices of the power unit are disposed corresponding to the heat dissipation plate and are thermally connected to the heat dissipation plate.

7. The power module according to claim 1, further includes a top plate, wherein the top plate has opposite first and second surfaces in the third axis, the first surface and the second surface of the top plate both extend along the first axis and the second axis and are perpendicular to the third axis; the second surface of the top plate is assembled to the fourth surface of the intermediate plate and the heat dissipation plate of the heat dissipation assembly.

8. The power module according to claim 7, wherein the top plate includes a printed circuit board having a plurality of inner layers, and the plurality of inner layers are all parallel to the first surface and the second surface of the top plate.

9. The power module according to claim 1, wherein the heat dissipation assembly further includes a heat dissipation cover plate, the heat dissipation cover plate has opposite first and second surfaces in the third axis, the first surface and the second surface of the heat dissipation cover plate both extend along the first axis and the second axis and are perpendicular to the third axis; the second surface of the heat dissipation cover plate is assembled to the heat dissipation plate.

10. The power module according to claim 9, wherein the second surface of the heat dissipation cover plate is in thermal contact with or directly contacts the fourth surface of the intermediate plate.

11. The power module according to claim 1, wherein the heat dissipation component further includes a connecting member, and the connecting member is assembled between the intermediate plate and the heat dissipation plate.

12. The power module according to claim 1, wherein the heat dissipation component further includes a connecting member, and the connecting member is assembled between the heat dissipation plate and the fourth surface of the intermediate plate.

13. The power module according to claim 12, wherein the heat dissipation component includes a plurality of the heat dissipation plates and corresponding a plurality of the connecting members; the power module further includes a top plate having opposite first and second surfaces in the third axial direction, the first and second surfaces of the top plate extend along the first and second axial directions and are perpendicular to the third axial direction; the second surface of the top plate is assembled to the fourth surface of the intermediate plate and the heat dissipation component, and the top plate is located between the plurality of connecting members.

14. The power module according to claim 1, wherein the heat dissipation plate of the heat dissipation component is assembled to the surface of the bottom plate.

15. The power module according to claim 14, wherein the power unit further includes a conductive member, the conductive member is electrically connected between the intermediate plate of the power unit and the heat dissipation plate of the heat dissipation component, and the heat dissipation plate of the heat dissipation component is further configured to provide a conduction path.

16. The power module according to claim 1, wherein the heat dissipation component is formed of a thermally conductive non-magnetic material, metal or ceramic.

17. The power module according to claim 1, wherein the power unit further includes a magnetic component, and the magnetic component is snapped or fitted onto the intermediate plate.

18. The power module according to claim 17, wherein the intermediate plate has a recess configured to accommodate the magnetic component.

19. The power module according to claim 1, wherein the power unit further includes a magnetic component, and the magnetic component is embedded in the intermediate plate.

20. The power module according to claim 1, further including a control device, wherein the control device is disposed on the first surface and / or the second surface of the intermediate plate, and the control device is configured to control the power device.

21. The power module according to claim 1, further including a control board and a control device, wherein the control board has opposite first and second surfaces in the first axial direction, the first and second surfaces of the control board extend along the second and third axial directions and are perpendicular to the first axial direction; the control board has opposite third and fourth surfaces in the third axial direction, the third and fourth surfaces of the control board extend along the first and second axial directions and are perpendicular to the third axial direction; the third surface of the control board is assembled to the surface of the bottom plate, the control device is disposed on the first surface and / or the second surface of the control board, and the control device is configured to control the power device.

22. The power module according to claim 21, wherein the control board is adjacent to the heat dissipation plate, and the control device is in thermal contact with the heat dissipation plate.

23. The power module according to claim 21, wherein the control board includes a printed circuit board having a plurality of inner layers, and the plurality of inner layers are all parallel to the first and second surfaces of the control board.

24. The power module as claimed in claim 1 further comprises a thermal conductive adhesive, wherein the thermal conductive adhesive fills the space between the base plate, the power unit and the heat dissipation component of the power module.

25. The power module as claimed in claim 1, wherein the intermediate plate comprises a printed circuit board having a plurality of inner layers, and the plurality of inner layers are all parallel to the first surface and the second surface of the intermediate plate.

26. The power module as claimed in claim 1, wherein the base plate comprises a printed circuit board having a plurality of inner layers, the plurality of inner layers are all parallel to the surface of the base plate, and extend along the first axis and the second axis and are perpendicular to the third axis.

27. The power module as claimed in claim 1, wherein the plurality of power devices of the power unit comprise a plurality of primary switches and a plurality of secondary switches, the power unit further comprises a magnetic component, the magnetic component comprises a magnetic core, a plurality of primary windings, a plurality of secondary windings and an auxiliary winding, the plurality of primary windings and the plurality of secondary windings are respectively electrically connected to the plurality of primary switches and the plurality of secondary switches, and the plurality of primary windings, the plurality of secondary windings and the auxiliary winding are wound around the magnetic core.

28. The power module as claimed in claim 27, wherein the magnetic core of the magnetic component comprises an upper magnetic cover, a lower magnetic cover, a first side post, a second side post, a first winding post, a second winding post, a third winding post and a fourth winding post, the first side post, the second side post, the first winding post, the second winding post, the third winding post and the fourth winding post are disposed between the upper magnetic cover and the lower magnetic cover, the first side post and the second side post are arranged along a first direction, the first winding post and the second winding post are arranged along a second direction, the third winding post and the fourth winding post are arranged along the second direction, the second direction is perpendicular to the first direction, and the first winding post and the second winding post are located between the first side post, the third winding post and the fourth winding post, and the third winding post and the fourth winding post are located between the second side post, the first winding post and the second winding post.

29. The power module as claimed in claim 28, wherein the magnetic core of the magnetic component further comprises a middle post, the middle post is disposed between the upper magnetic cover and the lower magnetic cover, and the middle post is located between the first winding post, the second winding post, the third winding post and the fourth winding post.

30. The power module as claimed in claim 27, wherein the winding of the auxiliary winding comprises a plurality of coupled segments connected in series and a connection segment, the plurality of coupled segments respectively correspond to the plurality of secondary windings, and each of the coupled segments has the same winding trajectory as the winding of the corresponding secondary winding.

31. A heat dissipation system, comprising a heat dissipation circuit board, wherein the heat dissipation circuit board comprises: a surface heat conduction layer disposed on the surface of the heat dissipation circuit board and configured to absorb and conduct heat energy, wherein the thickness of the surface heat conduction layer is greater than 100 microns; an internal cavity disposed inside the heat dissipation circuit board and connected to the surface heat conduction layer; a plurality of inner layers disposed inside the heat dissipation circuit board and all parallel to the surface of the heat dissipation circuit board; and a plurality of through holes electrically connected between the surface heat conduction layer and the plurality of inner layers.

32. The heat dissipation system according to claim 31, wherein the heat dissipation circuit board further comprises a cavity heat conduction layer, wherein the cavity heat conduction layer is disposed on the inner wall of the internal cavity, connected to the surface heat conduction layer, and configured to conduct heat energy or electrical signals.

33. The heat dissipation system according to claim 32, wherein the thickness of the cavity heat conduction layer is greater than 100 microns.

34. The heat dissipation system according to claim 31, wherein the thickness of the surface heat conduction layer is greater than 150 microns.

35. The heat dissipation system according to claim 31, wherein the thermal conductivity of the internal cavity is greater than 100 W / m·K.

36. The heat dissipation system according to claim 31, wherein the internal cavity is filled with a heat conductive filler.

37. The heat dissipation system according to claim 36, wherein the heat conductive filler comprises metal or ceramic.

38. The heat dissipation system according to claim 31, wherein the surface of the heat dissipation circuit board has a connection area, the position of the connection area corresponding to the position of the internal cavity, and the heat generating device in the heat dissipation system is disposed in the connection area.

39. The heat dissipation system according to claim 38, wherein the heat dissipation system comprises a plurality of the heat dissipation circuit boards and heat conduction devices, and the heat conduction devices are connected between two connection areas of two adjacent heat dissipation circuit boards.

40. The heat dissipation system according to claim 31, further comprising a heat dissipation device for heat dissipation, wherein the heat dissipation device is connected to the surface heat conduction layer of the heat dissipation circuit board.

41. The heat dissipation system according to claim 40, wherein the contact area between the heat dissipation device and the surface heat conduction layer is greater than or equal to 40% of the surface area of the surface heat conduction layer.

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