Efficient heat dissipation assembly and electronic equipment

Abstract

The invention belongs to the technical field of heat dissipation of electronic equipment, and particularly discloses an efficient heat dissipation assembly and electronic equipment, the heat dissipation assembly comprises a heat dissipation substrate tightly attached to the surface of a heating element, a vapor chamber is tightly attached to the face, away from the heating element, of the heat dissipation substrate, and heat dissipation fins and a heat dissipation fan are sequentially connected to the face, away from the heat dissipation substrate, of the vapor chamber; the vapor chamber comprises a shell, a cover plate and a liquid absorbing core, the cover plate is sealed on the shell, a vacuum cavity is formed in the cover plate, the vacuum cavity is filled with a two-phase fluid working medium, the liquid absorbing core is arranged in the vacuum cavity, the upper surface and the lower surface of the liquid absorbing core are tightly attached to the cover plate and the shell respectively, and a plurality of hollow steam cavities are formed in the liquid absorbing core. The electronic equipment comprises the efficient heat dissipation assembly. Through the synergistic effect of the heat dissipation substrate tightly attached to the heating element, the vapor chamber containing the two-phase fluid working medium and the multiple layers of heat dissipation fins, the structure compactness is guaranteed, and meanwhile efficient heat conduction and rapid heat dissipation are achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of electronic equipment, and in particular to a high-efficiency heat dissipation component and electronic equipment. Background Art

[0002] With the rapid development of electronic technology, the performance of electronic devices is constantly improving, and the heat generated during operation is also increasing. However, excessively high temperatures can have a serious impact on the performance, stability, and service life of electronic device components. For example, in computers, servers and other devices, key components such as the central processing unit (CPU) and graphics card will generate a lot of heat when running at high load for a long time. If this heat cannot be dissipated in a timely and effective manner, the components may be overheated and frequency reduced, causing the device to run slower, or even serious problems such as freezing and hardware damage.

[0003] At present, the common heat dissipation methods are air cooling and liquid cooling. Air cooling usually uses a cooling fan and a heat sink to remove heat through air flow. However, the heat dissipation efficiency of air cooling is relatively low and it is difficult to meet the heat dissipation requirements of high-power components. Although liquid cooling has a higher heat dissipation efficiency, its system structure is complex, the size is large, the cost is high, and there are risks such as liquid leakage, which greatly limits its widespread application.

[0004] Therefore, it is of great practical significance to develop a heat dissipation component for electronic equipment with simple structure, small size, high heat dissipation efficiency and low cost. Summary of the invention

[0005] The present invention aims to provide an efficient heat dissipation component and electronic equipment to solve the problems of complex structure, large size, high cost and the like in the prior art, so as to improve the heat dissipation efficiency of the electronic equipment and ensure its performance and life under long-term high-load operation.

[0006] To achieve the above-mentioned purpose, in one aspect, the present invention provides a high-efficiency heat dissipation component, including a heat dissipation substrate tightly attached to the surface of a heating element, the heat dissipation substrate having a side facing away from the heating element tightly attached to a heat spreader, the side of the heat spreader facing away from the heat dissipation substrate being connected to heat dissipation fins and a heat dissipation fan in sequence; the heat spreader includes a shell, a cover plate, and a liquid wick, the cover plate is sealed on the shell to form a vacuum cavity inside, the vacuum cavity is filled with a two-phase fluid working medium, the liquid wick is arranged in the vacuum cavity, and the upper and lower surfaces of the liquid wick are respectively tightly attached to the cover plate and the shell, and the liquid wick has a plurality of hollow steam cavities inside.

[0007] Optionally, the wick includes a primary wick laid on the inner surface of the housing and a secondary wick attached to the inner surface of the cover plate. A number of supports are distributed in an array between the primary wick and the secondary wick. The supports have the same porous medium structure as the primary wick, and the primary wick has the same or different porous medium structure as the secondary wick.

[0008] Optionally, a number of bionic capillary wicks are scattered along the length and width directions of the heat pipe for the secondary wick.

[0009] Optionally, the two-phase fluid working medium is one of deionized water, acetone, and alcohol solutions.

[0010] Optionally, the heat dissipation fins have a number of fins made of a heat-conducting metal material, and the fins are arranged in a multi-layer staggered manner.

[0011] Optionally, the thickness of the fins is 0.5 - 1 mm, the height is 20 - 30 mm, and the spacing is 2 - 3 mm.

[0012] Optionally, the outer shape of the heat dissipation substrate is adapted to the outer shape of the heating element. The surface of the heat dissipation substrate in contact with the heating element is polished, and a heat-conducting silicone grease is applied to the contact surface between the heating element and the heat dissipation substrate.

[0013] Optionally, the heat dissipation substrate is a heat-conducting metal plate with a thickness of 3 - 5 mm.

[0014] Optionally, the heat dissipation substrate is a high-purity copper or aluminum alloy plate.

[0015] Optionally, the wick is one or more porous medium structures of sintered copper powder, wire mesh, and copper foam.

[0016] On the other hand, the present invention also provides an electronic device, including a device body, a heating element, and the high-efficiency heat dissipation component described in any one of the above. The high-efficiency heat dissipation component includes a heat dissipation substrate, a heat pipe, heat dissipation fins, and a heat dissipation fan; the heat dissipation substrate is connected to at least one side of the heating element, and the heat pipe covers the entire heat dissipation substrate.

[0017] Compared with the prior art, the present invention discloses at least the following beneficial effects:

[0018] A high-efficiency heat dissipation component and an electronic device provided by the present application, through the synergistic effect of the heat dissipation substrate in close contact with the heating element, the heat pipe containing the two-phase fluid working medium, and the multi-layer heat dissipation fins, achieve efficient heat conduction and rapid heat dissipation while ensuring structural compactness, solve the problems of low efficiency of traditional air cooling and complex liquid cooling systems, and have the advantages of simple structure, small size, high heat dissipation efficiency, and low cost. Description of the Drawings

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or in the prior art, the following will briefly introduce the accompanying drawings required for use in the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0020] Figure 1 It is a schematic structural diagram of the high-efficiency heat dissipation component of the present invention;

[0021] Figure 2 It is an exploded view of the heat dissipation fins and the heat pipe in the high-efficiency heat dissipation component of the present invention;

[0022] Figure 3 It is the internal heat dissipation principle diagram of the heat pipe in the high-efficiency heat dissipation component of the present invention.

[0023] In the figure: 1, heating element; 2, heat dissipation substrate; 3, heat pipe; 31, cover plate; 32, housing; 33, wick; 331, primary wick; 332, secondary wick; 333, support; 34, vapor chamber; 4, heat dissipation fins; 5, heat dissipation fan. Detailed implementation manners

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0025] In the prior art, high-performance components of electronic devices generate a large amount of heat during operation. Traditional air-cooled heat dissipation relies on air flow to carry away heat, with low efficiency; although liquid-cooled systems have strong heat dissipation capabilities, they have problems such as complex structures, large volumes, and leakage risks. For example, in high-power computing devices, long-term operation will cause heat accumulation, and traditional heat dissipation solutions are difficult to balance efficiency and reliability.

[0026] To solve the above problems, it is necessary to develop a solution that can balance high-efficiency heat dissipation and a compact structure. By analyzing existing heat dissipation methods, it is found that the phase change heat transfer of two-phase fluid working media has high thermal conductivity characteristics, but how to combine it with air cooling and simplify the structure becomes the key. Further consideration is given to using a multi-layer thermal conduction structure, using the heat pipe to quickly spread heat, and then strengthening convection through heat dissipation fins and fans, so as to improve the overall heat dissipation efficiency in a limited space.

[0027] To make the above objects, features, and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0028] Embodiment 1

[0029] Referring to Figures 1 to 3 As shown, Embodiment 1 of the present invention provides an efficient heat dissipation component, including a heat dissipation substrate 2, a heat pipe 3, heat dissipation fins 4, and a heat dissipation fan 5. Among them, the heat dissipation substrate 2 is closely attached to the surface of the heat generating element 1, which directly contacts the heat generating element 1, and can be specifically realized by using a high thermal conductivity metal plate, and is used to quickly conduct heat to the heat pipe 3. One side of the heat dissipation substrate 2 facing away from the heat generating element 1 is closely attached to the heat pipe 3. The heat pipe 3 is specifically a heat conduction structure with a sealed vacuum cavity inside, and can form a vacuum environment through the housing 32 and the cover plate 31, and utilize the phase change process of the two-phase fluid working medium to achieve efficient heat transfer. One side of the heat pipe 3 facing away from the heat dissipation substrate 2 is successively connected with heat dissipation fins 4 and a heat dissipation fan 5.

[0030] Specifically, the heat pipe 3 includes a housing 32, a cover plate 31, and a wick 33. The cover plate 31 is sealed on the housing 32 to form a vacuum cavity. The vacuum cavity is filled with a two-phase fluid working medium. The wick 33 is arranged in the vacuum cavity and its upper and lower surfaces are respectively closely attached to the cover plate 31 and the housing 32. The wick 33 has a number of hollow steam cavities 34 inside. The wick 33 is specifically a porous medium structure arranged in the vacuum cavity. In a specific embodiment, the wick 33 can be made of sintered copper powder or copper foam material, and its steam cavity 34 is used to accelerate the flow of the working medium steam and promote the reflux of the condensate.

[0031] From the above structure, it can be seen that the heat generated by the heat generating element 1 is transferred to the housing 32 of the heat pipe 3 through the heat dissipation substrate 2. The wick 33 absorbs heat to evaporate the two-phase fluid working medium into steam. The steam diffuses to the cover plate 31 area through the steam cavity 34 and condenses to release heat. The condensate returns to the housing 32 area through the capillary action of the wick 33. The heat dissipation fins 4 receive the heat transferred from the cover plate 31 of the heat pipe 3, and the heat dissipation fan 5 drives air to flow through the surface of the fins to enhance convective heat dissipation. Thus, a continuous heat conduction and heat dissipation cycle is formed to achieve rapid heat transfer under a compact structure.

[0032] Compared with the prior art, the traditional air-cooling scheme relies on a single heat sink and fan, and the heat diffusion speed is limited by the thermal conductivity of the material; the liquid-cooling system requires complex pipelines and pumps, with a large volume and high cost. This solution combines the heat pipe 3 with a two-phase fluid working medium and a multi-layer wick 33 structure to achieve efficient phase change heat transfer without external drive, and at the same time uses the heat dissipation fins 4 and the fan to strengthen convection, with a simple structure and significantly improved heat dissipation efficiency.

[0033] Through the above technical solution, the present application can effectively reduce the local high temperature of the heating element 1, avoid the performance degradation caused by heat accumulation, achieve rapid and uniform heat dissipation in a limited space, and at the same time reduce the risk of liquid leakage and system complexity, making it suitable for the long-term stable operation of high-power electronic devices.

[0034] In a further optimized solution, the wick 33 includes a primary wick 331 laid on the inner surface of the housing 32 and a secondary wick 332 attached to the inner surface of the cover plate 31. A number of support bodies 333 are distributed in an array between the primary wick 331 and the secondary wick 332. The support bodies 333 and the primary wick 331 adopt the same porous medium structure, and the primary wick 331 adopts the same or different porous medium structures as the secondary wick 332.

[0035] Among them, the primary wick 331 is used to absorb and transfer the liquid part in the two-phase fluid working medium. The primary wick 331 is in direct contact with the surface of the housing 32, absorbs the heat transferred by the housing 32 and evaporates the liquid working medium into steam, and the steam diffuses to the condensation area through the steam chamber 34. The secondary wick 332 is used to evenly distribute the liquid working medium to the evaporation area. The secondary wick 332 is arranged inside the cover plate 31, receives the condensed liquid working medium and returns it to the evaporation end through capillary action. The support body 333 is specifically a columnar structure connected between the primary and secondary wicks 332, and is distributed in an array between the primary wick 331 and the secondary wick 332. It not only provides mechanical support to prevent the structure from collapsing, but also promotes the longitudinal transmission of the working medium through its own porous characteristics. Specifically, it can be realized by using the same sintered copper powder or copper foam material as the primary wick 331, which is used to maintain the gap stability between the two layers of wicks 33 and assist the working medium transmission. The porous medium structure is specifically a material form with connected pores, which can be specifically formed by a sintering process or a weaving process, and realizes the directional flow of the working medium through capillary action.

[0036] In a specific embodiment, the primary wick 331 and the secondary wick 332 can adopt porous media with the same or different porosities. For example, the primary wick 331 adopts high-porosity copper foam to improve the liquid absorption capacity, and the secondary wick 332 adopts low-porosity wire mesh to enhance the distribution uniformity.

[0037] In the traditional single-layer wick structure, the liquid working medium return efficiency is limited and the structure is prone to deformation due to thermal stress. Through the collaborative design of the double-layer wick 33 and the support body 333 in this solution, on the one hand, the distribution area of the liquid working medium is expanded through the secondary wick 332, and on the other hand, the structural stability is enhanced and the working medium circulation is assisted through the support body 333 array. At the same time, it allows flexible adjustment of the pore parameters of the wick 33 according to the heat dissipation requirements.

[0038] Through the above technical solution, the present application effectively solves the problems of low internal working fluid circulation efficiency and easy structural deformation of the heat pipe 3. In the high-load operation scenario of electronic devices, the double-layer wick can accelerate the reflux speed of the liquid working fluid from the condensation end to the evaporation end, and the support 333 can prevent the wick 33 from warping or detaching due to temperature fluctuations, thereby maintaining a stable phase change heat transfer process and significantly improving the long-term reliability of the heat dissipation component.

[0039] In a further optimized solution, a number of bionic capillary cores are scattered along the length and width directions of the heat pipe 3 in the secondary wick 332.

[0040] Among them, the bionic capillary core is specifically a micron-level porous channel designed based on the principle of biological capillary blood vessel structure. Specifically, it can be realized by sintering metal powder or laser etching process to form a capillary network with a fractal topological structure, and the capillary force is enhanced by simulating the branching morphology of plant roots. The scattered distribution is specifically a layout method of asymmetric arrangement in multiple directions in a plane space, and can be specifically realized by adopting a random dispersion or gradient density arrangement strategy, so as to form a multi-path working fluid reflux channel.

[0041] Specifically, during the operation of the heat pipe 3, the liquid working fluid generates a multi-stage capillary pumping effect through the branching structure of the bionic capillary core, so that the working fluid forms a cycle between the evaporation end and the condensation end. The layout method of the scattered distribution maximizes the coverage area of the wick, and forms an interlaced and connected steam diffusion path between the housing 32 and the cover plate 31, thereby shortening the transmission distance during the phase change process of the working fluid. When the heat generated by the heating element 1 is conducted to the housing 32, the liquid working fluid quickly vaporizes in the heated area, and the steam diffuses to the condensation area along the gaps of the scattered bionic capillary cores, and re-condenses into a liquid under the action of the heat dissipation fins 4, and returns to the evaporation end through the multi-stage capillary network.

[0042] Compared with the prior art, the wicks of traditional heat pipes usually adopt straight-through grooves arranged in a single direction or sintered layers with uniform distribution. Such structures have problems such as a single working fluid reflux path and limited phase change efficiency. The scattered bionic capillary core designed through a fractal structure forms a capillary network with higher geometric complexity per unit area, enabling the working fluid to automatically select the optimal transmission path according to the temperature gradient during the phase change process, effectively avoiding the occurrence of local dry-out phenomena.

[0043] Through the above technical solution, the present application significantly enhances the capillary pumping ability of the wick 33, increases the circulation speed of the two-phase working fluid between the evaporation end and the condensation end by about 40%, and at the same time expands the effective evaporation area by about 25%. On the premise of maintaining the thin and light structure of the heat pipe 3, the junction temperature of high heat flux density electronic components can be reduced by 15 - 20 °C, meeting the heat dissipation requirements of devices such as 5G communication base station chips.

[0044] For a further optimized solution, the two-phase fluid working medium is one of deionized water, acetone, and alcohol solutions.

[0045] Among them, the two-phase fluid working medium is specifically a medium for realizing heat transfer through a phase change cycle in a vacuum chamber. Specifically, substances with different boiling points and heat conduction characteristics can be used to achieve this. For example, deionized water has a high heat capacity and stable phase change characteristics, acetone can achieve rapid evaporation in a low-temperature environment, and alcohol solutions have the advantages of low viscosity and high fluidity.

[0046] Specifically, the two-phase fluid working medium in the vacuum chamber absorbs heat in the heating area and then vaporizes. The vapor carries the heat and diffuses to the condensation area to release latent heat and re-liquefy. The liquid working medium returns to the heating area through the wick structure 33 to complete the cycle. When deionized water is selected as the working medium, its high heat capacity characteristic can improve the heat-bearing capacity of the heat sink 3 under high-temperature working conditions; when acetone is used, the low-temperature evaporation characteristic can meet the rapid heat dissipation requirements of local overheating areas in miniaturized devices; when alcohol solutions are used, the low-viscosity characteristic helps to enhance the capillary reflux speed of the liquid working medium in the wick 33, thereby optimizing the heat dissipation efficiency.

[0047] Compared with the prior art, the two-phase working medium of the existing heat dissipation components mostly uses a single component. For example, only deionized water is used, resulting in insufficient adaptability between the working medium selection and the heat dissipation scenario of the device. In this application, by defining the range of working medium types, an adjustable solution is provided for different temperature environments and heat dissipation requirements, while avoiding the problem of reduced heat dissipation efficiency caused by the physical property limitations of a single working medium.

[0048] Through the above technical solutions, this application can flexibly select a suitable working medium type according to the specific working temperature range and heat dissipation load of the electronic device, thereby improving the heat transfer efficiency of the heat sink 3, reducing the risk of heat dissipation delay caused by the mismatch of the phase change temperature of the working medium, and avoiding the use of high-cost or potentially dangerous working media.

[0049] For a further optimized solution, the heat dissipation fins 4 are provided with a plurality of fins made of a heat-conducting metal material, and the fins are arranged in a multi-layer staggered manner. Among them, the heat-conducting metal material is specifically a metal material with high heat conduction performance. Specifically, copper, aluminum alloy, or silver alloy can be used to achieve this. Its function is to quickly transfer heat from the heat dissipation substrate 2 to the fin surface through the high heat conduction characteristic of the metal material. The multi-layer staggered arrangement specifically means that the fins are distributed in layers in the vertical direction and the adjacent layers are arranged in a non-parallel staggered layout. Specifically, it can be achieved through stamping, welding, or casting processes. Its function is to increase the heat dissipation surface area and guide the air flow to form turbulence, thereby improving the heat dissipation efficiency.

[0050] When the heat dissipation substrate 2 and the heat pipe 3 conduct heat to the heat sink fins 4, the fins made of thermally conductive metal material quickly absorb heat through their material properties, and the multi-layer staggered arrangement structure enables the fins to form multi-stage heat dissipation channels in a limited space. The heat is exchanged with the flowing air through the surface of the fins, and the staggered layout forces the air flow to form eddies in the fin gaps, prolonging the contact time between the air and the fins, thereby enhancing the convective heat dissipation effect.

[0051] Compared with the prior art, traditional air-cooled heat sinks usually adopt a single-layer parallel fin structure, with limited heat dissipation area and a single air flow path. The heat dissipation efficiency is limited by the linear characteristics of the air flow between layers. In this solution, the multi-layer staggered fins increase the surface area and change the air flow movement trajectory, significantly improving the heat dissipation efficiency under the same volume while maintaining the structural compactness, and are suitable for electronic devices with limited space.

[0052] Through the above technical solution, this application solves the problem of insufficient heat dissipation efficiency caused by the single structure of the traditional air-cooled heat sink fins 4. By combining the multi-layer staggered layout with high thermal conductivity materials, efficient heat dissipation is achieved in a limited space, thus avoiding performance degradation or hardware damage of electronic devices due to excessive local temperature during high-load operation.

[0053] In a further optimized solution, the thickness of the fins is 0.5 - 1 mm, the height is 20 - 30 mm, and the spacing is 2 - 3 mm. Among them, the thickness of the fins is specifically the single-layer vertical dimension of the metal material heat sink fins 4, which can be specifically achieved by stamping or machining. This thickness range can reduce the material consumption and overall weight while ensuring the structural strength. The height of the fins is specifically the extension dimension of the heat sink fins 4 in the direction perpendicular to the heat dissipation substrate 2, which can be specifically achieved by gradient arrangement or segmented combination. This height range can increase the heat dissipation surface area to enhance the heat exchange efficiency with the air. The spacing of the fins is specifically the interval distance between adjacent fins, which can be specifically achieved by staggered arrangement or equidistant distribution. This spacing range can balance the air flow permeability and heat conduction area in a limited space.

[0054] On the basis of the heat conduction of the heat dissipation substrate 2 and the heat pipe 3, by defining the parameter ranges of the thickness, height, and spacing of the heat sink fins 4, the multi-layer staggered fins can form dense and evenly distributed heat dissipation channels in a limited volume. When the cooling fan 5 drives the air flow through, this parameter combination can avoid the air flow blockage phenomenon caused by too small spacing of traditional fins, and at the same time prevent the decline of heat exchange efficiency caused by insufficient height or too large thickness. After the two-phase fluid working medium in the vacuum chamber quickly conducts heat to the fin surface, this structure can form a continuous and stable forced convection heat dissipation path.

[0055] Compared with the prior art, the traditional heat dissipation fins 4 usually adopt a design with a fixed thickness and uniform spacing, without parameter matching and optimization for different heat dissipation requirements, and it is easy to have local heat accumulation or ineffective heat dissipation areas. Through the limitation of the key dimension range, this solution can achieve higher heat dissipation efficiency in the same space, while avoiding the problems of increased fan power consumption or increased noise caused by overly dense fins.

[0056] Through the above technical solution, when the electronic device is operating at a high load, this application can significantly improve the heat dissipation capacity per unit volume by optimizing the structural parameters of the heat dissipation fins 4. For example, when the heat-generating components 1 such as a graphics card or a processor continuously output heat, this structure can quickly conduct and disperse the heat, preventing performance degradation or hardware damage caused by excessive local temperature.

[0057] In a further optimized solution, the efficient heat dissipation component includes a heat dissipation substrate 2 closely attached to the surface of the heat-generating component 1. The outer shape of the heat dissipation substrate 2 is adapted to the outer shape of the heat-generating component 1. The surface of the heat dissipation substrate 2 in contact with the heat-generating component 1 is polished, and thermal conductive grease is applied on the contact surface between the heat-generating component 1 and the heat dissipation substrate 2.

[0058] Specifically, the outer shape of the heat dissipation substrate 2 being adapted means that the shape of the substrate completely matches the surface contour of the heat-generating component 1, which can be achieved through numerical control machining or stamping processes to ensure no gap between the contact surfaces of the two. Among them, the polishing treatment specifically means making the contact surface of the substrate reach a high flatness through mechanical grinding or chemical polishing means. Specifically, sandpaper grinding or electrolytic polishing processes can be used to reduce the surface roughness and reduce the contact thermal resistance. Among them, the thermal conductive grease is specifically a high-thermal-conductivity material filled between the contact surfaces of the heat-generating component 1 and the heat dissipation substrate 2. Specifically, an organosilicon compound containing alumina or boron nitride can be used to fill the microscopic gaps and enhance the heat transfer efficiency.

[0059] The heat dissipation substrate 2 realizes complete fitting with the surface of the heat-generating component 1 through the adapted outer shape, avoiding heat accumulation caused by shape mismatch. After the contact surface is polished, a smooth surface is formed, reducing air gaps and reducing the contact thermal resistance. After the thermal conductive grease is coated on the contact surface, it further fills the remaining microscopic uneven areas, forming a continuous and low-thermal-resistance heat transfer path, thereby quickly conducting the heat generated by the heat-generating component 1 to the heat dissipation substrate 2.

[0060] Compared with the prior art, traditional heat dissipation substrates usually adopt a standardized flat structure, which is difficult to adapt to the surfaces of heating elements 1 with different shapes, resulting in gaps at the contact surfaces. At the same time, the surface roughness of the unpolished substrate is relatively high, and the contact thermal resistance increases significantly. This solution effectively solves the problems of high contact thermal resistance and uneven heat conduction through customized shape design, surface polishing, and filling with heat-conducting media. It significantly increases the contact area and heat transfer efficiency between the heating element 1 and the heat dissipation substrate 2, reduces the risk of excessive local temperature, thereby improving the overall heat dissipation performance of the heat dissipation component and extending the service life of electronic components.

[0061] In a further optimized solution, the heat dissipation substrate 2 is a heat-conducting metal plate with a thickness of 3 - 5 mm. The heat-conducting metal plate is specifically a flat component made of a metal material with high heat conduction ability, which can be realized by using high-purity copper or aluminum alloy plates. This material can quickly conduct the heat generated by the heating element 1 to the heat spreader 3. The thickness of 3 - 5 mm specifically refers to the vertical dimension range of the plate, and the thickness can be controlled through rolling or forging processes. This range can ensure the structural strength while avoiding weight increase or thermal resistance increase caused by excessive thickness.

[0062] In practical applications, the heat dissipation substrate 2 quickly spreads the heat accumulated on the surface of the heating element 1 to the entire substrate plane through its high heat conduction characteristics of the metal material, and then realizes the secondary uniform distribution of heat through the heat spreader 3. The surface of the plate is in close contact with the heating element 1. Combining polishing treatment and the application of thermal grease further reduces the contact thermal resistance. The substrate can bear high heat loads at a thickness of 3 - 5 mm and avoid squeezing the internal space of the electronic device, especially suitable for heating elements 1 such as CPUs and graphics cards that require both heat dissipation performance and a compact layout.

[0063] In a further optimized solution, the heat dissipation substrate 2 is a high-purity copper or aluminum alloy plate. Among them, high-purity copper is specifically a metal copper material with a purity of more than 99.9%, which can be realized by using copper plates prepared by electrolytic refining process. It has few lattice defects and low impurity content at grain boundaries, which can significantly improve the thermal conductivity. The aluminum alloy plate is specifically a rolled plate with aluminum as the matrix and other alloying elements added. Specifically, aluminum alloys of grades 6063 or 5052 can be used. By adjusting the proportion of alloying elements, the thermal conductivity and mechanical strength are balanced, reducing the overall weight while ensuring the heat dissipation efficiency. The heat dissipation substrate 2 quickly conducts the heat generated by the heating element 1 to the heat spreader 3 by selecting high-purity copper or aluminum alloy as the base material. Due to the high integrity of the internal lattice of high-purity copper, the energy loss during heat conduction can be reduced; the aluminum alloy takes into account the requirements of heat conduction and lightweight by optimizing the alloy composition. Both materials can meet the close fitting requirements between the heat dissipation substrate 2 and the heating element 1, ensuring that there is no significant thermal resistance in the heat transfer path.

[0064] In some specific embodiments, the high-purity copper sheet can be annealed to eliminate work hardening and further improve the thermal conductivity uniformity; the aluminum alloy sheet can form a dense oxide layer on the surface through an anodizing process to enhance corrosion resistance and maintain long-term heat dissipation stability.

[0065] In a further optimized solution, the wick 33 of the high-efficiency heat dissipation component is a porous medium structure of one or more of sintered copper powder, wire mesh, and copper foam. Among them, the sintered copper powder is a porous structure formed by a high-temperature sintering process, which can be specifically sintered from copper powder particles of different particle sizes, and an interconnected pore structure is formed inside, thereby enhancing the capillary force and promoting the circulation of the two-phase fluid working medium. The wire mesh is specifically a mesh structure woven from metal wires, and pores can be formed in a specific form of multi-layer stacking or curling, and the liquid reflux is accelerated through the capillary effect. The copper foam is specifically a foamed metal material with a three-dimensional interconnected pore structure, which can be prepared by an electrodeposition or powder metallurgy process, and its high porosity and large surface area can improve the evaporation and condensation efficiency of the working medium. The porous medium structure drives the flow of the working medium through capillary force, solving the problem of low heat transfer efficiency caused by insufficient reflux speed of the working medium in the traditional heat dissipation component.

[0066] Specifically, the wick 33 adopts a single or combined porous medium structure, such as the superposition of sintered copper powder and wire mesh or the combination of copper foam and wire mesh, and the working medium distribution and flow path are optimized by using different pore characteristics. During the operation of the heat pipe 3, the heat generated by the heating element 1 is transferred to the housing 32 through the heat dissipation substrate 2, promoting the evaporation of the two-phase fluid working medium in the vacuum chamber. The evaporated steam diffuses to the condensation area through the pores of the wick 33, releases heat and condenses into a liquid, and the liquid returns to the evaporation area through the capillary action of the wick 33. The combination of different porous medium structures can adjust the pore size and distribution. For example, the wire mesh provides uniform liquid distribution, the copper foam enhances the steam diffusion ability, and the sintered copper powder improves the capillary pumping force, thereby achieving a faster working medium circulation speed and higher heat conduction efficiency.

[0067] Traditional wicks usually adopt a single porous material, such as only using sintered copper or a single-layer wire mesh, and there are limitations in their pore structure and capillary performance. For example, the porosity of a single sintered copper powder is fixed, and it is difficult to meet the requirements of high capillary force and low flow resistance at the same time; the uniformity of the pore distribution of a single-layer wire mesh is insufficient, which is likely to cause local dryness. However, in this application, by combining or selecting different porous medium structures, the performance of the wick 33 can be flexibly adjusted according to the heat dissipation requirements. For example, when using a composite structure of wire mesh and copper foam, the directional capillary effect of the wire mesh can be utilized, and the three-dimensional pores of the copper foam can be used to accelerate the steam diffusion, thereby overcoming the performance bottleneck of a single material.

[0068] Through the above technical solution, the present application can significantly improve the working fluid circulation efficiency of the wick 33 and avoid the local overheating problem caused by poor working fluid reflux. For example, when the electronic device is operating at a high load, the combined porous structure can ensure the rapid replenishment of liquid in the evaporation area and accelerate the diffusion of steam to the condensation area, thereby maintaining a stable phase change heat transfer process inside the heat pipe 3 and effectively reducing the working temperature of the heating element 1.

[0069] Embodiment 2

[0070] Embodiment 2 of the present invention further provides an electronic device, including a device body, a heating element 1, and the above-mentioned high-efficiency heat dissipation component; the high-efficiency heat dissipation component includes a heat dissipation substrate 2, a heat pipe 3, heat dissipation fins 4, and a heat dissipation fan 5; the heat dissipation substrate 2 is connected to at least one surface of the heating element 1, and the heat pipe 3 covers the entire heat dissipation substrate 2.

[0071] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0072] The above-described embodiments are only descriptions of the preferred embodiments of the present invention, and do not limit the scope of the present invention. Without departing from the design spirit of the present invention, various deformations and improvements made by those of ordinary skill in the art to the technical solutions of the present invention should fall within the protection scope determined by the claims of the present invention.

Claims

1. An efficient heat dissipation component, characterized in that, It includes a heat dissipation substrate (2) closely attached to the surface of a heating element (1). On the side of the heat dissipation substrate (2) facing away from the heating element (1), a heat pipe (3) is closely attached. On the side of the heat pipe (3) facing away from the heat dissipation substrate (2), a heat dissipation fin (4) and a heat dissipation fan (5) are sequentially connected; the heat pipe (3) includes a housing (32), a cover plate (31), and a wick (33). The cover plate (31) is sealed on the housing (32) to form a vacuum chamber inside. The vacuum chamber is filled with a two-phase fluid working medium. The wick (33) is arranged in the vacuum chamber, and the upper and lower surfaces of the wick (33) are respectively closely attached to the cover plate (31) and the housing (32). The inside of the wick (33) has a number of hollow steam chambers (34).

2. The high-efficiency heat dissipation component according to claim 1, characterized in that The wick (33) includes a primary wick (331) laid on the inner surface of the housing (32) and a secondary wick (332) attached to the inner surface of the cover plate (31). A number of support bodies (333) are arranged in an array between the primary wick (331) and the secondary wick (332). The support bodies (333) have the same porous medium structure as the primary wick (331). The primary wick (331) has the same or different porous medium structure as the secondary wick (332).

3. The high-efficiency heat dissipation component according to claim 2, wherein A number of bionic capillary cores are scattered along the length and width directions of the heat pipe (3) on the secondary wick (332).

4. The high-efficiency heat dissipation component according to claim 1, wherein The two-phase fluid working medium is one of deionized water, acetone, and alcohol solutions.

5. The high-efficiency heat dissipation component according to claim 1, characterized in that, The heat dissipation fin (4) has a number of fins made of a heat-conducting metal material, and the fins are arranged in a multi-layer staggered manner.

6. The high-efficiency heat dissipation component according to claim 5, wherein, The thickness of the fin is 0.5 - 1 mm, the height is 20 - 30 mm, and the spacing is 2 - 3 mm.

7. The high-efficiency heat dissipation component according to claim 1 or 5, characterized in that, The outer shape of the heat dissipation substrate (2) is adapted to the outer shape of the heating element (1). The surface of the heat dissipation substrate (2) in contact with the heating element (1) is polished, and thermal grease is applied on the contact surface between the heating element (1) and the heat dissipation substrate (2).

8. The highly efficient heat dissipation component according to claim 7, wherein, The heat dissipation substrate (2) is a heat-conducting metal plate with a thickness of 3 - 5 mm.

9. The high-efficiency heat dissipation component according to claim 8, wherein The heat dissipation substrate (2) is a high-purity copper or aluminum alloy plate.

10. An electronic device, characterized in that, It includes an equipment body, a heating element (1), and an efficient heat dissipation component as described in any one of claims 1 to 9; the efficient heat dissipation component includes a heat dissipation substrate (2), a heat pipe (3), a heat dissipation fin (4), and a heat dissipation fan (5); the heat dissipation substrate (2) is connected to at least one side of the heating element (1), and the heat pipe (3) covers the entire heat dissipation substrate (2).

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