Indium phosphide photoelectric chip packaging device

Abstract

The invention discloses an indium phosphide photoelectric chip packaging device, and relates to the technical field of chip packaging, the indium phosphide photoelectric chip packaging device structurally comprises a displacement unit, a packaging unit and a platform component, the displacement unit is responsible for driving the packaging unit to move in a three-dimensional space to realize accurate transfer and positioning of a chip among different stations, and the platform component is responsible for positioning the packaging unit; a driving element of the packaging unit can be a motor, an air cylinder or a hydraulic cylinder and the like, the packaging unit comprises a plate component with at least one plane and a plurality of packaging devices arranged on the plane of the plate component, each packaging device structurally comprises a shell component, a limiting component and a pressure component, the shell component is provided with a first cavity used for containing packaging materials in the packaging process, and the limiting component is provided with a second cavity used for containing the packaging materials. A discharging port is formed in the surface of one side of the shell component, and the limiting component is arranged at the discharging port of the shell component, provided with a first gap matched with the chip in size and used for grabbing and placing the chip. And the pressure component acts in the first cavity of the shell component and pushes the packaging material to flow out by applying pressure.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and particularly to an indium phosphide optoelectronic chip packaging device. Background Art

[0002] With the development of integrated circuits and the improvement of people's living standards, indium phosphide optoelectronic chips are increasingly widely used and have been widely applied in fields such as communication, data centers, artificial intelligence, and intelligent driving. Indium phosphide optoelectronic chips are mainly the core components of optical receiver assemblies (ROSA) and optical transmitter assemblies (TOSA). Indium phosphide optoelectronic chips need to directly mount the optoelectronic chips on a carrier and then package the chips (COC or TO package), and the related packaging process is relatively complex. Summary of the Invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art, and provide an indium phosphide optoelectronic chip packaging device. Compared with the prior art, the solution disclosed in the present invention can solve the above problems.

[0004] The present invention is achieved through the following technical solutions: The present invention discloses an indium phosphide optoelectronic chip packaging device, including: A displacement unit; A packaging unit, the displacement unit is connected to the packaging unit, and the displacement unit is configured to drive the position of the packaging unit to change; A platform member, the platform member is located below the packaging unit; Wherein, the packaging unit includes a plate member arranged with at least one plane and a plurality of packaging devices arranged on the plane of the plate member. The packaging devices include: A shell member, the shell member includes a first cavity, a discharge port is opened on the surface of the first cavity away from the plate member, and a pressure member is arranged to act on the first cavity; A limiting member, the limiting member is arranged at the position of the discharge port on the surface of the shell member, and the limiting member is arranged with a first gap, and the first gap is arranged opposite to the discharge port.

[0005] Preferably, the displacement unit includes a first displacement member and a second displacement member, and the second displacement member is configured to drive the first displacement member to displace along a first direction; Wherein, one end of the first displacement member close to the platform member is arranged to connect the packaging unit, and the first displacement member is configured to drive the packaging unit to displace along a second direction, and the first direction and the second direction are arranged crosswise.

[0006] Preferably, the platform member includes a first area and a second area, and a conveying and transferring device is arranged on one side of each of the first area and the second area; Wherein, a height difference is formed between the first area and the second area.

[0007] Preferably, the plate member includes: A first outer shell; A connecting member disposed on the outer surface of the first outer shell; The connecting member includes at least two track members disposed on the first outer shell, and each track member is detachably connected to at least two sliding members. The sliding member includes an electromagnet embedded in the track member and a cylinder connected to the electromagnet and extending to the outside of the track member at one end; The cylinder is embedded in the end of the displacement unit, and a clamping member is further disposed at the end of the displacement unit. The clamping member clamps the track member.

[0008] Preferably, the first outer shell is provided with a second cavity, the top of the shell member is provided with a first opening, the first opening is in communication with the second cavity, and the pressure member is disposed outside the second cavity and configured to act on the second cavity.

[0009] Preferably, the limiting member includes a first frame body, and a deformation member is disposed at at least one set of opposite side wall positions on the inner side wall of the first frame body; The deformation member is configured to undergo a reversible shape change in response to external environmental stimuli. The deformation member includes a first state and a second state: In the first state, the minimum distance between the relatively arranged deformation members is a first distance; In the second state, the minimum distance between the relatively arranged deformation members is a second distance; Wherein, the first distance is greater than the second distance, and the first distance is greater than the side dimension of the chip to be encapsulated.

[0010] Preferably, the limiting member includes a second frame body, one side of the second frame body is connected to the shell member, and a plurality of storage cavities are arranged on the surface of the second frame body away from the shell member. A plurality of through holes are arranged on the side of the storage cavity close to the platform member; Wherein, the storage cavity is filled with an adhesive material, and the peel strength of the adhesive material is not less than 8 N / cm.

[0011] Preferably, the adhesive material is a photocurable pressure-sensitive adhesive and / or nano-silicone.

[0012] Preferably, the limiting member is embedded with a micro VCSEL laser and a PIN photodetector, and the micro VCSEL laser and the PIN photodetector act on the indium phosphide chip.

[0013] Preferably, a hemispherical boss is provided at the end of the cylinder of the sliding member, and a V-shaped card slot is correspondingly provided on the clamping member; When the boss is embedded in the card slot, a pressure sensor is arranged on the contact surface between the track member and the clamping member. The pressure sensor is electrically connected to the driving circuit of the electromagnet to form a closed-loop clamping force control.

[0014] The present invention discloses an indium phosphide optoelectronic chip packaging device. Compared with the prior art: The structure of the packaging device includes a displacement unit, a packaging unit, and a platform component. The displacement unit is responsible for driving the packaging unit to move in three-dimensional space to achieve precise transfer and positioning of the chip between different workstations. Its driving element can be a motor, a cylinder, a hydraulic cylinder, etc. The packaging unit includes a plate component with at least one plane, and a plurality of packaging devices arranged on the plane of the plate component. The structure of the packaging device includes a shell component, a limiting component, and a pressure component. The shell component has a first cavity for accommodating packaging materials during the packaging process. An outlet is provided on one side surface of the shell component for the packaging materials to flow out. The limiting component is arranged at the outlet position of the shell component and is provided with a first gap matching the size of the chip for grasping and placing the chip. The pressure component acts in the first cavity of the shell component and pushes the packaging materials out by applying pressure. When grasping the chip, the limiting component restricts the chip at the position of the first gap. The limiting component can have two or more movable clamping arms that approach or separate from each other by mechanical or electromagnetic force to clamp or release the chip. In some other embodiments, the limiting component can also adsorb the chip by electrostatic force. After the chip is transferred to the surface of the carrier tape, the packaging materials are ejected through the outlet to form a packaging layer, completing the chip packaging process. Description of the Drawings

[0015] Figure 1 Schematic diagram of the structure of the packaged chip in one embodiment; Figure 2 Front view of the packaging device in one embodiment; Figure 3 Side view of the packaging device in one embodiment; Figure 4 Top view of the packaging unit in one embodiment; Figure 5 Schematic diagram of the structure of the packaging device in one embodiment; Figure 6 Schematic diagram of the chip packaging process in one embodiment; Figure 7 Schematic diagram of the structure of the plate component in one embodiment; Figure 8 Schematic diagram of the structure of the limiting component in one embodiment; Figure 9 Schematic diagram of the structure of the limiting component in another embodiment; Figure 10 For Figure 9 Schematic diagrams of the states of the limiting component adsorbing and detaching from the chip in the embodiment. Detailed Embodiments

[0016] The following description with reference to the accompanying drawings is provided to assist in a comprehensive understanding of various exemplary embodiments of the present disclosure as defined by the claims and their equivalents. This description includes various details to aid understanding, but these details are to be considered merely exemplary. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications can be made to the various embodiments described herein without departing from the scope and spirit of the present disclosure. In addition, descriptions of well-known functions and structures may be omitted for clarity and conciseness.

[0017] It will be understood that when an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, it can be directly on, directly connected or coupled to, the other element or layer, or there may also be one or more intervening elements or layers. When an element is referred to as being "directly on," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers.

[0018] It will be understood that although terms such as first, second, third, etc. may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or section from another element, component, region, layer, or section. Thus, without departing from the teachings of the exemplary embodiments, the first element, first component, first display region, first layer, or first section discussed below may be referred to as the second element, second component, second display region, second layer, or second section. In the drawings, for clarity of illustration, the dimensions of various elements, layers, etc. may be exaggerated.

[0019] Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0020] In one embodiment, the chip is formed by preparing an InP wafer, and then dicing is performed along the dicing groove of the InP wafer by a dicing device.

[0021] Please refer to Figure 1 , in one embodiment, a packaged chip structure is disclosed. The carrier tape a is a support structure, and a chip b is fixed on one side thereof through an adhesive material layer d. In order to protect the chip b from damage by the external environment, a packaging layer c is provided on the chip b. On the other side of the carrier tape a, a conductive layer is provided for signal transmission. Lead holes are arranged on the carrier tape a, and the lead 3 passes through these lead holes to conduct the chip b and the conductive layer, ensuring the transmission of electrical signals. When data is read, the reading device makes physical contact with the chip b through its contact block. This contact ensures the accurate transmission of electrical signals, and the reading device exchanges data with the chip b through the conductive layer.

[0022] In one embodiment, the chip is formed by preparing an InP wafer, and then dicing is performed along the dicing groove of the InP wafer through a dicing device to form independent chips. After dicing, the chips are grabbed onto a carrier tape for electrical signal connection, and then packaged.

[0023] Please refer to Figures 2 to 5 , in one embodiment, an indium phosphide optoelectronic chip packaging device is disclosed, including: a displacement unit 1; the displacement unit 1 is connected to the packaging unit, and the displacement unit 1 is configured to drive the position of the packaging unit to change; the platform member is located at the lower position of the packaging unit; please continue to refer to Figure 3 , at its position A is the platform member, wherein, the packaging unit includes a plate member 3 arranged with at least one plane and a plurality of packaging devices 4 arranged on the plane of the plate member 3. The packaging device 4 includes a shell member 41. The shell member 41 includes a first cavity. An outlet 43 is provided on the surface of the first cavity away from the plate member 3, and a pressure member is arranged to act on the first cavity; a limiting member 44 is arranged at the position of the outlet 43 on the surface of the shell member 41. The limiting member 44 is provided with a first gap, and the first gap is arranged opposite to the outlet 43. Please continue to refer to Figure 2 , wherein a display device 2 is also arranged, and the display device 2 is used to display the operation interface of the packaging device.

[0024] Specifically, the displacement unit 1 drives the packaging unit to move in a three-dimensional space to achieve precise transfer and positioning of the chip between different workstations. In one embodiment, the displacement unit may include driving elements such as motors, cylinders, and hydraulic cylinders. The packaging unit includes a plate member arranged with at least one plane and a plurality of packaging devices arranged on the plane of the plate member. Please refer to Figure 4 , in one embodiment, the packaging devices 4 are arranged in an array on the surface of the plate member; Please refer to Figure 5 , in one embodiment, the packaging device includes a shell member 41, a limiting member 44, and a pressure member. The shell member has a first cavity, which is used to accommodate the packaging material during the packaging process. An outlet 43 is provided on one side surface of the shell member for the outflow of the packaging material. The limiting member is arranged at the position of the outlet of the shell member and is provided with a first gap, which matches the size of the chip and is used for grasping and placing the chip. The pressure member acts on the first cavity of the shell member and pushes the packaging material out by applying pressure. When grasping the chip, the limiting member 44 restricts the chip at the position of the first gap. For the limiting member 44, in one embodiment, the limiting member 44 has two or more movable clamping arms, and the clamping arms approach or move away from each other by mechanical or electromagnetic force. In some other embodiments, the limiting member 44 adsorbs the chip by electrostatic force. After transferring the chip to the surface of the carrier tape, packaging is performed. During the packaging process, the packaging material is ejected from the outlet 43 to form a packaging layer.

[0025] Please refer toFigure 6 , the steps of the above chip packaging include: S100: Use a dicing device to dice along the dicing groove of the InP wafer, and cut the wafer into independent chips. Please refer to 6-1, which is the wafer with partially transferred chips; S200: The displacement unit 1 drives the packaging unit to move to the position of the cut wafer. The limiting member 44 of the packaging device 4 grabs the chip through its first gap. Please continue to refer to Figure 6-1 , which is the action of the displacement unit grabbing the wafer; S300: The displacement unit 1 drives the packaging unit to move to a position above the carrier tape a. The packaging device 4 accurately places the chip on the carrier tape a. One side of the carrier tape a fixes the chip b through the adhesive material layer d. The thickness of the adhesive material layer d is uniform, and the specific size can be determined according to actual needs. Generally, it is 5-30um to ensure the reliability of bonding and not affect the size of the final module. Please refer to Figure 6-2 , which is the chip b fixed to the carrier tape a through the adhesive material layer d; S500: After the chip is placed on the carrier tape a, the chip b is electrically connected to the conductive layer on the other side of the carrier tape through the lead 3; S600: The pressure member starts to act in the first cavity of the shell member 41, applying pressure to push the packaging material out of the discharge port 43. The packaging material covers the chip b to form a protective packaging layer c. In one embodiment, the material of the packaging layer c is ultraviolet curable epoxy resin glue. Please refer to Figure 6-3 ; S700: Cut the carrier tape forming the packaging layer c. Please refer to Figure 6-4 . The dotted area is the cutting schematic line, and the preparation of the indium phosphide optoelectronic chip is completed. In the embodiment, the indium phosphide optoelectronic chip is the packaged chip.

[0026] Please continue to refer to Figure 2 , in one embodiment, the displacement unit includes a first displacement member 11 and a second displacement member 12. The second displacement member 12 is configured to drive the first displacement member 11 to displace along a first direction; wherein, one end of the first displacement member 11 close to the platform member is arranged to connect the packaging unit, and the first displacement member 11 is configured to drive the packaging unit to displace along a second direction, and the first direction and the second direction are arranged crosswise.

[0027] Specifically, the movement of the displacement unit is decomposed into two independent directions: the first direction and the second direction. The first direction is driven by the second displacement member 12 and is the vertical direction perpendicular to the platform member, which is the Z-axis in one embodiment. The stroke range of the first direction is set to 50 - 100 cm to control the height of the encapsulation unit. For example, during wafer picking, the lowering and rising movements are achieved through the movement of the Z-axis. The encapsulation unit can accurately approach or move away from workstations such as wafers and carrier tapes to complete the grasping and placement of chips. The second direction is driven by the first displacement member 11 and is one of the orthogonal biaxes in the horizontal plane parallel to the platform, which is the X or Y-axis in one embodiment. The stroke range of the second direction reaches 100 cm and is used for positioning within the plane, such as translating the chip from the wafer workstation to the carrier tape workstation. The movement of the X / Y axis enables the encapsulation unit to move flexibly on the horizontal plane to achieve precise chip positioning. The Z-axis (first direction) is strictly orthogonal to the X / Y axis (second direction). In one embodiment, the second displacement member 12 adopts a combination of a pneumatic servo cylinder and a ball screw. The cylinder body is fixed to the frame, and the end of the piston rod is connected to the top of the first displacement member 11. The pneumatic servo control accuracy is as high as ±1 μm, and the air pressure is adjusted in real time through a proportional valve with a response time of less than 20 ms. The first displacement member 11 uses a gantry structure and is connected to the frame through linear guides at the bottom.

[0028] Please continue to refer to Figure 2 , the platform member includes a first area and a second area, and conveying and transfer devices are arranged on one side of both the first area and the second area; wherein, there is a height difference between the first area and the second area.

[0029] Specifically, the first area and the second area are used to place materials. The first area is used to place the chip wafers to be transferred, while the second area is used to place the carrier tapes to be packaged with the chips. There is a certain height difference between the first area and the second area, which can be connected by a height difference of 5 - 10 mm. In one embodiment, the material of the first area is granite (thermal expansion coefficient 7.3×10⁻ 6 / °C) or carbon fiber composite material. The bottom of the first area is integrated with a cooling water circulation pipeline to reduce the heat generated by cutting through water circulation. When the encapsulation device places the chip on the carrier tape, the displacement unit drives the encapsulation unit to quickly move to the curing position in the second area. At this time, the height difference isolates the temperature field of the curing position from other areas, and through preset gradient cooling, it ensures that the UV glue completes the curing reaction within the optimal temperature range. In one implementation, the conveying and transfer device is a robotic arm, which identifies the positions of the wafers and carrier tapes and completes the transfer of relevant materials with appropriate force and speed.

[0030] Please refer to Figure 7In one embodiment, the plate member 3 includes a first shell 31; the connecting member 32 is arranged on the outer surface of the first shell 31; the connecting member 32 includes at least two track members arranged on the first shell 31, each track member is detachably connected to at least two sliding members, and the sliding member includes an electromagnet embedded in the track member and a column connected to the electromagnet and one end extending to the outside of the track member; the column is embedded in the end of the displacement unit 1, and a clamping member is also arranged at the end of the displacement unit, and the clamping member clamps the track member.

[0031] Specifically, the plate member 3 includes a first housing 31 and a connecting member 32, the connecting member 32 is arranged on the outer surface of the first housing 31, and includes at least two track members arranged on the first housing 31, each track member is detachably connected to at least two sliding members, and the sliding member includes an electromagnet embedded in the track member and a column connected to the electromagnet and one end extending to the outside of the track member. When the electromagnet is energized, it can generate magnetic force, so that the sliding member can be tightly adsorbed on the track member, thereby ensuring the stability of the connection. The column connects the sliding member and the displacement unit 1, one end of which is embedded in the end of the displacement unit, and a clamping member is also arranged at the end of the displacement unit to prevent it from sliding or falling off when subjected to force. When the plate member 3 needs to be replaced, the power supply of the electromagnet is disconnected, and the clamping member is separated from the track member, and the sliding member can slide freely on the track member, so that the plate member 3 can be quickly replaced.

[0032] Further, the first housing 31 is provided with a second cavity, the top of the shell member 41 is provided with a first opening, the first opening is in communication with the second cavity, the pressure member is arranged outside the second cavity, and is configured to act on the second cavity, specifically, the pressure member can affect the environment in the second cavity or the components therein by applying pressure or changing its state. In one embodiment, the pressure member is an adjustable mechanical device, which applies pressure to the components in the second cavity or controls the flow of fluid or gas in the cavity by changing its position or shape.

[0033] Please refer to Figure 8 In one embodiment, the limiting member includes a first frame body 441, and a deformable member 442 is arranged at at least one group of relatively arranged side wall positions of the inner side wall of the first frame body 441; the deformable member 442 is configured to undergo a reversible shape change in response to external environmental stimulation, and the deformable member 442 includes a first state and a second state: in the first state, the minimum spacing between relatively arranged deformable members 442 is a first spacing; in the second state, the minimum spacing between relatively arranged deformable members 442 is a second spacing; wherein the first spacing is greater than the second spacing, and the first spacing is greater than the side dimension of the chip to be packaged.

[0034] Specifically, the limiting member stably holds the chip during the encapsulation process to ensure the accurate positioning of the chip in subsequent processing steps. The deformation member 442 can undergo reversible shape changes in response to external environmental stimuli.

[0035] The deformation member 442 has two states: the first state and the second state. In the first state, the minimum distance between the oppositely arranged deformation members 442 is the first distance, as shown by D1. The first distance is designed to be greater than the side dimension of the chip to be encapsulated. In the initial state, the deformation member 442 does not contact the chip. When the chip needs to be held, the deformation member 442 changes from the first state to the second state. In the second state, the minimum distance between the oppositely arranged deformation members 442 becomes the second distance, as shown by D2. The second distance is less than the first distance. In one embodiment, D1 is 0.2 mm and D2 is 0.1 mm. The change in distance is achieved by the deformation member 442 responding to external environmental stimuli. Specifically, the deformation member 442 may be made of reversible deformation materials such as shape memory alloy (SMA) and electrostrictive ceramics (PMN-PT). The shape memory alloy undergoes a phase change when heated by an electric current, changing from the martensite phase to the austenite phase, thereby restoring its original shape. During this process, the deformation member 442 shrinks, reducing the distance between them. The electrostrictive ceramics produce reversible deformation when a DC voltage is applied, finely adjusting the distance between the deformation members 442. By precisely controlling the magnitude of the current and voltage, a smooth transition of the deformation member 442 from the first state to the second state can be achieved, thus achieving the purpose of accurately holding the chip. In one embodiment, the end of the deformation member 442 is designed as an arc surface to reduce the pressure when contacting the chip and avoid damaging the brittle InP chip.

[0036] Please refer to Figure 9 and Figure 10 The limiting member includes a second frame 443. One side of the second frame 443 is connected to the shell member 41. A plurality of receiving cavities 444 are arranged on the surface of the second frame 443 away from the shell member 41. A plurality of through holes are arranged on the side of the receiving cavity 444 close to the platform member. Among them, the receiving cavity 444 is filled with an adhesive material, and the peel strength of the adhesive material is not less than 8 N / cm.

[0037] Specifically, for the second housing 443, one side of the limiting member is closely connected to the housing member 41. The choice of the connection method can be determined according to specific requirements, which can be threaded connection, snap connection, etc., or an appropriate adhesive. On the surface of the second housing 443 away from the housing member 41, a plurality of storage cavities 444 are arranged and distributed in an array. The adhesive material has a peel strength of not less than 8 N / cm after curing. During the chip fixing process, the chip is placed on the platform member, and the position of the second housing 443 is adjusted so that the storage cavities 444 are aligned with the chip, and the adhesive material is in close contact with the chip surface. At this time, the chip transfer work can be carried out. When the chip needs to be separated, the encapsulation material is ejected through the discharge port to apply pressure to the chip to separate the chip from the adhesive material. The encapsulation material acts between the chip and the adhesive layer when ejected, forming a shear stress for a non-destructive separation between the chip and the adhesive material. In one embodiment, the adhesive material is a photo-curable pressure-sensitive adhesive and / or nano-silica gel. After being filled into the storage cavities 444, the photo-curable pressure-sensitive adhesive can be quickly cured by UV light irradiation to form a stable adhesion structure. The filling and use method of nano-silica gel is similar to that of the photo-curable pressure-sensitive adhesive.

[0038] In one embodiment, the limiting member 44 is embedded with a micro-VCSEL laser and a PIN photodetector. The micro-VCSEL laser and the PIN photodetector act on the indium phosphide chip. The micro-VCSEL laser and the PIN photodetector in the limiting member 44 are integrated in a coaxial reflection layout. The micro-VCSEL laser is a kind of light source, and a wavelength of 940 nm is selected in one embodiment. The absorption rate of indium phosphide material in this wavelength band is extremely low, and the light beam emitted by the VCSEL laser can penetrate the chip for in-depth detection and analysis. The output power is selected to be 5-10 mW to avoid the risk of thermal damage to the chip due to too high power. The PIN photodetector receives the optical signal reflected back from the chip surface. The InGaAs material is used, which is highly sensitive to light with a wavelength of 800-1700 nm, and the photosensitive area is designed to be 0.1 mm². The micro-VCSEL laser and the PIN photodetector work together. When the light beam emitted by the VCSEL laser irradiates the chip surface, part of the light will be reflected back and received by the PIN photodetector. By processing these reflected optical signals, the system can accurately calculate the position information of the chip.

[0039] In one embodiment, a hemispherical boss is provided at the end of the column of the sliding member, and a V-shaped card slot is correspondingly provided on the clamping member; when the boss is embedded in the card slot, a pressure sensor is arranged on the contact surface between the track member and the clamping member. The pressure sensor is electrically connected to the drive circuit of the electromagnet to form a closed-loop clamping force control. The material of the hemispherical boss at the end of the column of the sliding member is silicon nitride ceramic, which can withstand a large clamping force. The V-shaped card slot design of the clamping member matches the hemispherical boss. When the boss is embedded, stable multi-point contact is formed with the card slot. When the boss is embedded in the card slot, a pressure sensor is arranged on the contact surface between the track member and the clamping member. In one embodiment, the pressure sensor uses thin-film piezoresistive technology to sense the pressure change during the clamping process in real time and convert these signals into electrical signals for output. These electrical signals are then transmitted to the drive circuit of the electromagnet to form a closed-loop clamping force control system. The electromagnet drive circuit adjusts dynamically according to the feedback signal of the pressure sensor. When the clamping force is too large, the drive circuit will reduce the current of the electromagnet to reduce the adsorption force, thereby reducing energy consumption; when the clamping force is too small, the drive circuit will increase the current of the electromagnet to enhance the adsorption force and increase the clamping force.

[0040] In summary, the present invention discloses an indium phosphide optoelectronic chip packaging device, the structure of which includes a displacement unit, a packaging unit and a platform member. The displacement unit is responsible for driving the packaging unit to move in three-dimensional space to achieve precise transfer and positioning of the chip between different workstations. Its driving elements can be motors, cylinders or hydraulic cylinders, etc. The packaging unit includes a plate member with at least one plane, and a plurality of packaging devices arranged on the plane of the plate member. The structure of the packaging device includes a shell member, a limiting member and a pressure member. The shell member has a first cavity for accommodating packaging materials during the packaging process, and a discharge port is opened on one side surface thereof for the packaging materials to flow out. The limiting member is arranged at the discharge port of the shell member and is provided with a first gap matching the size of the chip for grasping and placing the chip. The pressure member acts in the first cavity of the shell member and pushes the packaging materials out by applying pressure. When grasping the chip, the limiting member restricts the chip at the position of the first gap. The limiting member can have two or more movable clamping arms, which are close to or away from each other by mechanical or electromagnetic force to clamp or release the chip. In some other embodiments, the limiting member can also adsorb the chip by electrostatic force. After the chip is transferred to the surface of the carrier tape, the packaging materials are ejected through the discharge port to form a packaging layer, completing the packaging process of the chip.

[0041] The above is only the preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, makes equivalent substitutions or changes, and all should be covered by the protection scope of the present invention.

[0042] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising said element.

Claims

1. An indium phosphide optoelectronic chip packaging device, characterized in that, Comprising: Displacement unit; Encapsulation unit, the displacement unit is connected to the encapsulation unit, and the displacement unit is configured to drive the position of the encapsulation unit to change; Platform member, the platform member is located at a position below the encapsulation unit; Wherein, the encapsulation unit includes a plate member arranged with at least one plane and a plurality of encapsulation devices arranged on the plane of the plate member, and the encapsulation devices include: Shell member, the shell member includes a first cavity, a discharge port is formed on a surface of the first cavity away from the plate member, and a pressure member is arranged to act on the first cavity; Limiting member, the limiting member is arranged at the position of the discharge port on the surface of the shell member, the limiting member is arranged with a first gap, and the first gap is arranged opposite to the discharge port.

2. The indium phosphide optoelectronic chip packaging device according to claim 1, wherein The displacement unit includes a first displacement member and a second displacement member, and the second displacement member is configured to drive the first displacement member to displace along a first direction; Wherein, one end of the first displacement member close to the platform member is arranged to connect the encapsulation unit, and the first displacement member is configured to drive the encapsulation unit to displace along a second direction, and the first direction and the second direction are arranged crosswise.

3. The indium phosphide optoelectronic chip packaging device according to claim 1, characterized in that, The platform member includes a first area and a second area, and conveying and transferring devices are arranged on one side of both the first area and the second area; Wherein, a height difference is formed between the first area and the second area.

4. The indium phosphide optoelectronic chip packaging device according to claim 1, characterized in that, The plate member includes: First outer shell; Connecting member, the connecting member is arranged on the outer surface of the first outer shell; The connecting member includes at least two track members arranged on the first outer shell, and each track member is detachably connected to at least two sliding members. The sliding members include electromagnets embedded in the track members and columns connected to the electromagnets and extending to the outside of the track members at one end; The end of the column is embedded in the end of the displacement unit, and a clamping member is further arranged at the end of the displacement unit, and the clamping member clamps the track member.

5. The indium phosphide optoelectronic chip packaging device according to claim 4, characterized in that The first outer shell is provided with a second cavity, the top of the shell member is provided with a first opening, the first opening is in communication with the second cavity, the pressure member is arranged outside the second cavity and is configured to act on the second cavity.

6. The indium phosphide optoelectronic chip packaging device according to the claim, characterized in that, The limiting member includes a first frame body, and deformation members are arranged at least at a set of opposite side wall positions on the inner side wall of the first frame body; The deformation member is configured to undergo a reversible shape change in response to external environmental stimuli, and the deformation member includes a first state and a second state: In the first state, the minimum distance between the directly opposite deformation members is a first distance; In the second state, the minimum distance between the directly opposite deformation members is a second distance; Wherein, the first distance is greater than the second distance, and the first distance is greater than the side dimension of the chip to be encapsulated.

7. The indium phosphide optoelectronic chip packaging device according to claim 1, characterized in that, The limiting member includes a second frame body, one side of the second frame body is connected to the shell member, and a plurality of storage cavities are arranged on the surface of the second frame body away from the shell member, and a plurality of through holes are arranged on one side of the storage cavity close to the platform member; Wherein, the storage cavity is filled with an adhesive material, and the peel strength of the adhesive material is not less than N / cm.

8. The indium phosphide optoelectronic chip packaging device according to claim 7, wherein, The adhesive material is a photo-curable pressure-sensitive adhesive and / or nano-silica gel.

9. The indium phosphide optoelectronic chip packaging device according to claim 1, characterized in that, The limiting member is embedded with a micro VCSEL laser and a PIN photodetector, and the micro VCSEL laser and the PIN photodetector act on an indium phosphide chip.

10. The indium phosphide optoelectronic chip packaging device according to claim 6, characterized in that, The end of the cylinder of the sliding member is provided with a hemispherical boss, and the clamping member is correspondingly provided with a V-shaped card slot; When the boss is embedded in the card slot, a pressure sensor is arranged on the contact surface between the track member and the clamping member, and the pressure sensor is electrically connected to the drive circuit of the electromagnet to form a closed-loop clamping force control.

Images