Display module and preparation method

Abstract

The invention provides a display module and a preparation method, and relates to the technical field of display. According to the display module, the color resistance layer is arranged in the display panel to replace a polaroid needed by the display module, so that the display effect of the display module is guaranteed, the display module without the polaroid design is achieved, and the purpose of thinning the display module can be achieved; as the display module is not provided with a polaroid, no salient point is formed in the coating and leveling process of the packaging adhesive layer, that is, no salient point is formed at one end, far away from the main body part, of the first extension part, so that the purpose that the packaging adhesive layer does not climb upwards is achieved; in the process of arranging the optical adhesive layer, the appearance part of the first extension part can be well supplemented and filled through the fluidity of the optical adhesive layer, so that part of the first extension part is covered, the bubble-free effect is achieved, and the use reliability of the display module is improved.

Description

Technical Field

[0001] This application relates to the field of display technologies, and particularly to a display module and a preparation method thereof. Background Art

[0002] With the development of display technologies, display modules (such as mobile phones, tablets, wearable bracelets, or televisions, etc.) have been widely used. As shown in Figure 1 below, Figure 1 is a schematic cross-sectional structure diagram of a display module in the prior art. A polarizer 11, a display panel 12, a packaging adhesive layer 13, and an optical adhesive layer 14 are usually provided in the display module; before coating the packaging adhesive layer 13, a protective film is provided on the surface of the polarizer 11. During the coating and leveling process of the packaging adhesive layer 14, a siphon phenomenon will occur at the contact position between the packaging adhesive layer 14 and the polarizer 11. The upward climbing height of the packaging adhesive layer 14 will reach the position of the protective film. After the protective film is peeled off, a bump M higher than the upper surface of the polarizer 11 will be formed; then, after the optical adhesive layer 14 is formed, due to the existence of the bump M, the optical adhesive layer 14 and the polarizer 11 cannot be completely attached, thereby causing bubbles to be generated (where the mark P indicates the position where the bubbles are generated), affecting the use reliability of the display module.

[0003] Therefore, how to improve the use reliability of the display module is a technical problem that those skilled in the art need to solve urgently. Summary of the Invention

[0004] In view of the above problems, this application provides a display module and a preparation method thereof, which can improve the use reliability of the display module. The specific solutions are as follows:

[0005] In a first aspect of this application, a display module is provided. The display module includes a display panel, a packaging adhesive layer, and an optical adhesive layer;

[0006] The display panel includes a first planar portion on the light-emitting surface side, a second planar portion on the backlight surface side, and a bending portion between the first planar portion and the second planar portion; a color resist layer is provided on the side of the first planar portion facing away from the second planar portion;

[0007] The packaging adhesive layer includes a main body portion covering the bending portion and a first extension portion extending towards the region where the first planar portion is located; the first extension portion covers a part of the first planar portion;

[0008] The optical adhesive layer is located on the side of the first planar portion facing away from the second planar portion and covers a part of the first extension portion.

[0009] In a second aspect of this application, a preparation method of a display module is provided. The preparation method of the display module includes:

[0010] Form a display panel with a color resist layer;

[0011] Form a packaging adhesive layer on the display panel;

[0012] Form an optical adhesive layer on the display panel;

[0013] Perform a bending process on the display panel; after the bending process, the display panel includes a first flat portion on the light-emitting surface side, a second flat portion on the backlight surface side, and a bending portion between the first flat portion and the second flat portion; the color resist layer is disposed on the side of the first flat portion facing away from the second flat portion; the packaging adhesive layer includes a main body portion covering the bending portion and a first extending portion extending toward the region where the first flat portion is located; the first extending portion covers a part of the first flat portion; the optical adhesive layer is located on the side of the first flat portion facing away from the second flat portion and covers a part of the first extending portion.

[0014] By means of the above technical solution, the present application provides a display module and a manufacturing method. The display module replaces the polarizer required for the display module by disposing a color resist layer in the display panel, thereby ensuring the display effect of the display module, realizing a display module with a non-polarizer design, and also achieving the purpose of thinning the display module; since the display module does not have a polarizer disposed, no bumps will be formed during the coating and leveling process of the packaging adhesive layer, that is, no bumps will be formed at the end of the first extending portion away from the main body portion, achieving the purpose that the packaging adhesive layer does not climb upward; then during the process of disposing the optical adhesive layer, due to the fluidity of the optical adhesive layer, the outer shape portion of the first extending portion can be well supplemented and filled, so that it covers a part of the first extending portion, thereby achieving an air-free effect, and further improving the use reliability of the display module. Description of the Drawings

[0015] In combination with the drawings and with reference to the following specific embodiments, the above and other features, advantages and aspects of the various embodiments of the present disclosure will become more apparent. Throughout the drawings, the same or similar reference numerals represent the same or similar elements. It should be understood that the drawings are schematic and the original parts and elements are not necessarily drawn to scale.

[0016] Figure 1 It is a schematic cross-sectional structure diagram of a display module in the prior art;

[0017] Figure 2 It is a schematic cross-sectional structure diagram of a display module provided by an embodiment of the present invention;

[0018] Figure 3 It is a schematic cross-sectional structure diagram of another display module provided by an embodiment of the present invention;

[0019] Figure 4 A schematic cross-sectional structure diagram of another display module provided by an embodiment of the present invention;

[0020] Figure 5 A schematic cross-sectional structure diagram of another display module provided by an embodiment of the present invention;

[0021] Figure 6 A schematic cross-sectional structure diagram of another display module provided by an embodiment of the present invention;

[0022] Figure 7 A schematic cross-sectional structure diagram of another display module provided by an embodiment of the present invention;

[0023] Figure 8 A schematic cross-sectional structure diagram of another display module provided by an embodiment of the present invention;

[0024] Figure 9 A schematic flow chart of a method for manufacturing a display module provided by an embodiment of the present invention;

[0025] Figures 10 - 12 For Figure 9 Partial structure schematic diagrams corresponding to the shown manufacturing method. Detailed implementation manners

[0026] The embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application. The terms used in the implementation manners part of the present application are only used to explain the specific embodiments of the present application, rather than aiming to limit the present application. Those of ordinary skill in the art know that with the development of technology and the emergence of new scenarios, the technical solutions provided by the embodiments of the present application are also applicable to similar technical problems.

[0027] It should be noted that the orientation terms in the present invention are based on the relative positional relationship shown in the drawings and cannot be used as an absolute limitation to the present application.

[0028] To make the above objects, features, and advantages of the present invention more obvious and understandable, the present invention will be further described in detail below with reference to the drawings and specific implementation manners.

[0029] Refer to Figure 2 , Figure 2 A schematic cross-sectional structure diagram of a display module provided by an embodiment of the present invention. The display module 100 provided by the embodiment of the present invention includes: a display panel 12, a packaging adhesive layer 13, and an optical adhesive layer 14.

[0030] The display panel 12 includes a first planar portion 121 on the light-emitting surface side, a second planar portion 122 on the backlight surface side, and a bending portion 123 between the first planar portion 121 and the second planar portion 122; a color resist layer 15 is disposed on the side of the first planar portion 121 facing away from the second planar portion 122.

[0031] The encapsulation adhesive layer 13 includes a main body portion 131 covering the bending portion 123, and a first extension portion 132 extending towards the region where the first planar portion 121 is located; the first extension portion 132 covers a part of the first planar portion 121.

[0032] The optical adhesive layer 14 is located on the side of the first planar portion 121 facing away from the second planar portion 122, and covers a part of the first extension portion 132.

[0033] Specifically, in the embodiment of the present invention, the optical adhesive layer 14 is disposed on the side of the first planar portion 121 facing away from the second planar portion 122. For example, the optical adhesive layer 14 can be disposed on the light-emitting surface side of the display panel 12; in addition to playing an adhesive role, the optical adhesive layer 14 can also play roles such as improving the display effect and reducing reflection.

[0034] The display panel 12 is a functional component in the display module 100 for realizing the display effect. The display panel 12 at least includes a first planar portion 121 on the light-emitting surface side, and a light-emitting unit 16 capable of realizing the light-emitting function is disposed inside the first planar portion 121. Further, the first planar portion 121 may include a first region AA and a second region BB surrounding the periphery of the first region AA, and the light-emitting unit 16 is disposed in the first region AA. Optionally, a pixel circuit and a driving circuit are further disposed inside the first planar portion 121. The pixel circuit is disposed in the first region AA and is electrically connected to the light-emitting unit 16, and the driving circuit can be disposed in the second region BB or the first region AA. It can be understood that the first region AA is the display region of the display module 100, and the second region BB is the border region of the display module 100.

[0035] The first planar portion 121 may include a plurality of different film layers stacked. Regarding the specific composition manner of the film layer structure inside the first planar portion 121, the embodiment of the present invention does not make any restrictions. Exemplarily, the first planar portion 121 includes an array layer and a light-emitting layer stacked, etc. The pixel circuit and the driving circuit can be disposed in the array layer, and the light-emitting unit 16 can be disposed in the light-emitting layer. It should be noted that Figure 2 this does not show all the structures in the first planar portion 121, but only shows some of the structures in the first planar portion 121.

[0036] In the embodiment of the present invention, a color resist layer 15 is further disposed inside the first planar portion 121, and the color resist layer 15 is located on the light-emitting side of the light-emitting unit 16. Exemplarily, the first planar portion 121 is provided with a plurality of light-emitting units 16; the color resist layer 15 includes a plurality of color resist units 151; the light-emitting units 16 are disposed one-to-one with the color resist units 151, for example, a red light-emitting unit corresponds to a red color resist, a blue light-emitting unit corresponds to a blue color resist, and a green light-emitting unit corresponds to a green color resist. Exemplarily, R / G / B color resists are deposited on R / G / B sub-pixels to form a color resist layer 15, and the color resist layer 15 contains a transmittance spectrum, and the transmittance can be adjusted, so as to realize at least part of the function of the polarizer.

[0037] Furthermore, a light shielding component is disposed between two adjacent color-resistance units 151 to avoid light crosstalk and other problems, so as to improve the display effect of the display module 100. Exemplarily, two adjacent color-resistance units 151 are separated by a black matrix (BM). It should be noted that, Figure 2 The shading component is not shown in the figure.

[0038] Optionally, the thickness of the color resist layer 15 is in the range of 5 μm to 6 μm. Exemplarily, the thickness of the color resist layer 15 is 5 μm, 5.2 μm, 5.55 μm or 6 μm.

[0039] It should be noted that, in some feasible ways, the color resist layer 15 may also be disposed outside the display panel 12 .

[0040] Furthermore, the display panel 12 further includes a bending portion 123 connected to the first planar portion 121 , and a second planar portion 122 connected to the bending portion 123 . The second planar portion 122 is bent to a side of the first planar portion 121 away from the optical adhesive layer 14 through the bending portion 123 .

[0041] The encapsulation glue layer 13 includes a first extension portion 132 extending from the main body portion 131 toward the area where the first plane portion 121 is located, and the first extension portion 132 covers a portion of the first plane portion 121; it can be understood that the first extension portion 132 is also arranged on the side of the first plane portion 121 away from the second plane portion 122; the encapsulation glue layer 13 is mainly arranged at the frame position of the display module 100, and is used to prevent sweat, alkali, grease, etc. from invading the interior of the display module 100.

[0042] Furthermore, the packaging glue layer 13 further includes a main body 131 disposed on one side of the bending portion 123 and a second extension portion 133 disposed on the second plane portion 122 away from the first plane portion 121 . Both ends of the main body 131 are respectively connected to the first extension portion 132 and the second extension portion 133 .

[0043] It can be understood that the encapsulation glue layer 13 includes a main body portion 131 corresponding to the bending portion 123, a first extension portion 132 corresponding to the first flat portion 121, and a second extension portion 133 corresponding to the second flat portion 122. The first extension portion 132, the main body portion 131, and the second extension portion 133 are connected in sequence, and the three can respectively play an encapsulation and protection role for the first flat portion 121, the bending portion 123, and the second flat portion 122, thereby helping to improve the use reliability and service life of the display module 100.

[0044] Furthermore, in the embodiment of the present invention, the modulus range of the encapsulation glue layer 13 is 20 Mpa - 30 Mpa. Exemplarily, the modulus of the encapsulation glue layer 13 is 20 Mpa, 21 Mpa, 22.5 Mpa, 27 Mpa, or 30 Mpa, etc. The modulus range of the encapsulation glue layer 13 being in the range of 20 Mpa - 30 Mpa can be understood as the material of the encapsulation glue layer 13 being a low-modulus glue material, which is relatively soft as a whole. During the subsequent bonding process of the optical glue layer 14 and / or the cover plate, it will have better filling performance when subjected to pressure, so as to minimize the occurrence of bubbles and improve the use reliability of the display module 100.

[0045] In addition, in addition to the display panel 12, the optical glue layer 14, and the encapsulation glue layer 13, the display module 100 may further include other structures. The specific composition manner of the display module 100 is not limited in the embodiment of the present invention.

[0046] Optionally, referring to Figure 3 , Figure 3 is a schematic cross-sectional structure diagram of another display module provided by the embodiment of the present invention. The display module 100 may further include a support layer 17 and a buffer layer 18. The support layer 17 and the buffer layer 18 are located on the side of the first flat portion 121 away from the optical glue layer 14. The number of the support layers 17 may be one, or may also be multiple. For example, two support layers 17 are provided. At this time, the first support layer 171 and the second support layer 172 are respectively arranged on both sides of the buffer layer 18; that is, in an optional embodiment, the display module 100 may further include: a first support layer 171, a buffer layer 18, and a second support layer 172 that are located between the first flat portion 121 and the second flat portion 122 and are sequentially stacked.

[0047] Among them, the first support layer 171 can support and bear the first planar portion 121, reducing the risk of excessive deformation of the first planar portion 121 during subsequent use; the second support layer 172 can support and bear the second planar portion 122, reducing the risk of excessive deformation of the second planar portion 122 during subsequent use. Optionally, the support layer 17 can include a metal material, a PI material, or a PET material. For example, the support layer 17 can include a steel sheet or other structure with relatively high structural strength.

[0048] Among them, the buffer layer 18 mainly provides buffering performance for the entire display module 100, increasing the overall strength. The main material is a combined material of foam / glue material and metal.

[0049] From the above description, it can be seen that the display panel 12 can include a first planar portion 121, a bending portion 123, and a second planar portion 122. The light-emitting unit 16 is disposed in the first planar portion 121. The first planar portion 121 is the component of the display panel 12 that can achieve the display effect. Usually, the side of the first planar portion 121 facing away from the second planar portion 122 is the light-emitting side of the display panel 12, which is used to display a specific picture or video to the user.

[0050] The second planar portion 122 is disposed at a relatively spaced interval from the first planar portion 121, and the two are connected through the bending portion 123. On this basis, combined with Figure 3 it can be seen that the support layer 17, the buffer layer 18, etc. can be disposed between the first planar portion 121 and the second planar portion 122 to play a role in fixing and supporting the second planar portion 122 and the first planar portion 121.

[0051] Optionally, a driving chip can be disposed on the second planar portion 122, that is, the second planar portion 122 can also be understood as a bonding portion. The driving chip can include various types, such as a display driving chip and a touch driving chip. The display driving chip is used to store image data, generate driving voltage, and can also improve the image quality through a customized algorithm and other functions. The touch driving chip mainly realizes touch signal processing and is a necessary component of a display device with touch function. Of course, the display driving chip and the touch driving chip can also be integrated and disposed on the second planar portion 122.

[0052] In the conventional prior art, such as Figure 1As shown in the figure, a polarizer 11, a display panel 12, a packaging adhesive layer 13, and an optical adhesive layer 14 are usually provided in the display module; before the packaging adhesive layer 13 is coated, a protective film is provided on the surface of the polarizer 11. During the coating and leveling process of the packaging adhesive layer 14, a siphon phenomenon will occur at the contact position between the packaging adhesive layer 14 and the polarizer 11. The upward climbing height of the packaging adhesive layer 14 will reach the position of the protective film. After the protective film is peeled off, a bump M higher than the upper surface of the polarizer 11 will be formed; after the optical adhesive layer 14 is formed, due to the existence of the bump M, the optical adhesive layer 14 cannot be completely attached to the polarizer 11, thereby causing bubbles to be generated (where the mark P indicates the position where the bubbles are generated), affecting the use reliability of the display module.

[0053] Different from the conventional prior art, the display module 100 provided by the embodiment of the present invention replaces the polarizer 11 required by the display module 100 by providing a color resist layer 15 in the display panel 12, so as to ensure the display effect of the display module 100 and realize a display module 100 without a polarizer 11. Since the thickness of the color resist layer 15 is relatively low compared with that of the polarizer 11, the purpose of thinning the display module 100 can also be achieved; since the polarizer 11 is not provided in the display module 100, no bump M will be formed during the coating and leveling process of the packaging adhesive layer 13, that is, no bump M will be formed at one end of the first extension 132 away from the main body 131, achieving the purpose that the packaging adhesive layer 13 does not climb upward; after the optical adhesive layer 14 is provided, through the fluidity of the optical adhesive layer 14, the outer shape part of the first extension 132 can be well supplemented and filled, so that it covers part of the first extension 132, thereby achieving the effect of no bubbles, and further improving the use reliability of the display module 100.

[0054] In an optional embodiment of the present invention, a UV absorber is provided in the optical adhesive layer 14.

[0055] Specifically, in the embodiment of the present invention, considering the influence of ambient light on the display effect of the display module 100 after removing the polarizer 11, a UV absorber can be provided in the optical adhesive layer 14, such as triazine-based, benzotriazole-based UV absorbers, etc., to achieve the purpose of filtering light with a wavelength of 380 nm or less, so as to improve the display effect of the display module 100.

[0056] Optionally, the main material of the optical adhesive layer 14 includes but is not limited to acrylate monomers.

[0057] In other words, the optical adhesive layer 14 provided by the embodiment of the present invention can be understood as an optical adhesive layer with an attached UV-Cut function.

[0058] In an optional embodiment of the present invention, the creep value of the optical adhesive layer 14 is greater than 27%.

[0059] Specifically, in the embodiment of the present invention, an optical adhesive layer 14 with a creep value greater than 27% is adopted. Due to the high creep property of the optical adhesive layer 14, it will have better filling property when subjected to pressure, and can well supplement and level the outer shape part of the first extension part 132, so that it covers part of the first extension part 132, thereby achieving the effect of no bubbles, and further improving the use reliability of the display module 100.

[0060] In an alternative embodiment of the present invention, refer to Figure 4 , Figure 4 which is a schematic cross-sectional structure diagram of another display module provided by the embodiment of the present invention. In the embodiment of the present invention, the first extension part 132 includes a planar extension part 132A and a ramp extension part 132B.

[0061] The planar extension part 132A is located between the ramp extension part 132B and the main body part 131.

[0062] The thickness of the ramp extension part 132B gradually increases in the direction close to the planar extension part 132A.

[0063] Specifically, in the embodiment of the present invention, due to the absence of the polarizer 11, bumps M will not be formed during the coating and leveling process of the encapsulation adhesive layer 13, that is, bumps M will not be formed at the end of the first extension part 132 far from the main body part 131. Based on the fluidity of the adhesive material during the coating process of the encapsulation adhesive layer 13, at this time, the thickness of the ramp extension part 132B gradually increases in the direction close to the planar extension part 132A, that is, the ramp extension part 132B is a ramp structure with downward buffering, achieving the purpose that the encapsulation adhesive layer 13 does not climb upward.

[0064] In an alternative embodiment of the present invention, the slope of the ramp extension part 132B is less than 15°.

[0065] Specifically, in the embodiment of the present invention, by controlling the coating process of the encapsulation adhesive layer 13, the slope of the ramp extension part 132B is made less than 15°, so as to avoid bubbles being generated between the optical adhesive layer 14 and components such as the encapsulation adhesive layer 13 after the optical adhesive layer 14 is prepared due to the too large slope of the ramp extension part 132B. Further, it is avoided that air is generated along the glue break due to the subsequent pressing of the cover plate.

[0066] In an alternative embodiment of the present invention, as Figure 4 shown, the length of the ramp extension part 132B is L1; the thickness of the main body part 131 is H1.

[0067] Wherein, L1 > 5 × H1.

[0068] Specifically, in the embodiment of the present invention, the coating process of the encapsulation adhesive layer 13 is controlled to satisfy the relationship L1>5×H1, so as to avoid the slope of the climbing extension portion 132B being too large, which may cause bubbles to be generated between the optical adhesive layer 14 and components such as the encapsulation adhesive layer 13 after preparation. Further, it is also avoided that the subsequent cover plate is attached and squeezed to cause air to break along the adhesive to generate bubbles.

[0069] In general, the embodiments of the present invention can control the preparation of the encapsulation adhesive layer 13 from multiple angles to ensure that the climbing extension portion 132B is a relatively gentle downward ramp structure, thereby ensuring that no bubbles are generated between the optical adhesive layer 14 and components such as the encapsulation adhesive layer 13 after the preparation is completed, and that no bubbles are generated in the design of other components.

[0070] In an optional embodiment of the present invention, Figure 4 As shown, the optical adhesive layer 14 completely covers the slope extension portion 132B and at least covers a portion of the planar extension portion 132A.

[0071] Specifically, in the embodiment of the present invention, the optical adhesive layer 14 covers the packaging adhesive layer 13 as much as possible to improve the bonding stability between the two, thereby improving the reliability of the display module 100, and further avoiding the subsequent cover plate attachment and extrusion to cause air to break along the adhesive to generate bubbles.

[0072] In an optional embodiment of the present invention, referring to 5, Figure 5 The cross-sectional structure diagram of another display module provided by the embodiment of the present invention is as follows: The display module 100 provided by the embodiment of the present invention further includes: a cover plate 19 located on a side of the optical adhesive layer 14 away from the first planar portion 121 .

[0073] Specifically, in the embodiment of the present invention, the optical adhesive layer 14, the first extension portion 132 and the cover plate 19 are located on the same side of the first plane portion 121. The existence of the cover plate 19 can protect the optical adhesive layer 14, the first extension portion 132 and the first plane portion 121, etc., reduce the adverse effects of external impacts, scratches and fingerprints on the internal structure of the display module 100, and improve the reliability of the display module 100.

[0074] Optionally, in the direction from the first planar portion 121 to the optical adhesive layer 14, the maximum thickness of the first extension portion 132 is less than the thickness of the optical adhesive layer 14, that is, the first extension portion 132 will not extend beyond the optical adhesive layer 14, thereby reducing the risk of physical interference between the first extension portion 132 and the cover plate 19 and improving the manufacturing yield of the display module 100.

[0075] Optionally, in the direction from the first planar portion 121 towards the optical adhesive layer 14, the cover plate 19 is disposed to cover the encapsulation adhesive layer 13. The cover plate 19 is generally a rigid structure, and the encapsulation adhesive layer 13 is generally a flexible structure. To improve the structural reliability of the display module 100, in the embodiments of the present invention, the cover plate 19 is disposed to be able to cover the encapsulation adhesive layer 13, that is, the cover plate 19 also covers the most prominent area of the main body portion 131. In this way, the cover plate 19 can protect the encapsulation adhesive layer 13, thereby reducing the adverse effects of external impacts or scratches on the encapsulation adhesive layer 13 and improving the structural reliability of the encapsulation adhesive layer 13.

[0076] Further, in some alternative embodiments, in the direction from the first planar portion 121 towards the optical adhesive layer 14, the cover plate 19 is disposed to cover both the encapsulation adhesive layer 13 and the optical adhesive layer 14. In this way, the cover plate 19 can protect both the encapsulation adhesive layer 13 and the optical adhesive layer 14, further improving the reliability of the display module 100.

[0077] In an alternative embodiment of the present invention, refer to 6, Figure 6 This is a schematic cross-sectional structure diagram of another display module provided by the embodiments of the present invention. The display module 100 provided by the embodiments of the present invention further includes a conductive portion 20 disposed on the side of the second planar portion 122 facing away from the first planar portion 121. The second extension portion 133 includes a conductive material, and the conductive portion 20 is disposed in contact with the second extension portion 133.

[0078] Specifically, in the embodiments of the present invention, the conductive portion 20 is disposed on the second planar portion 122, and a conductive structure is disposed in the conductive portion 20 to meet the usage requirements of the display module 100. Exemplarily, the conductive portion 20 may include a metal trace structure and a circuit board structure, etc. The conductive portion 20 is located on the side of the second planar portion 122 facing away from the first planar portion 121. Combining Figure 6 it can be seen that the conductive portion 20 and the second extension portion 133 are on the same side of the second planar portion 122. On this basis, in the embodiments of the present invention, the conductive portion 20 is disposed in contact with the second extension portion 133, and the second extension portion 133 is disposed to include a conductive material, so that the second extension portion 133 can help the conductive portion 20 steal part of the static charge, thereby reducing the risk of abnormal charge accumulation at the conductive portion 20 and improving the usage reliability of the display module 100.

[0079] It should be noted that the second extension portion 133 includes a conductive material, and the main body portion 131 and the first extension portion 132 may include the same material as the second extension portion 133, or may also include different materials. The embodiments of the present invention do not limit this.

[0080] Optionally, the main body 131 , the first extension portion 132 and the second extension portion 133 are made of the same material and are integrally formed, which can simplify the difficulty of preparing the encapsulation adhesive layer 13 and further improve the conductivity of the encapsulation adhesive layer 13 .

[0081] In addition, the embodiment of the present invention does not limit the specific position relationship between the second extension portion 133 and the conductive portion 20, as long as the second extension portion 133 and the conductive portion 20 can be fitted together. Figure 6 As shown, the second extension portion 133 and the conductive portion 20 can be disposed in contact with each other on the same plane, or as shown in FIG. Figure 7 , Figure 7 FIG. 1 is a cross-sectional structural diagram of another display module provided by an embodiment of the present invention. The second extension portion 133 may be partially located on a side of the conductive portion 20 away from the second planar portion 122, or Figure 8 , Figure 8 This is a schematic cross-sectional structure diagram of another display module provided by an embodiment of the present invention. The second extension portion 133 may also be partially located on the side of the conductive portion 20 facing the second planar portion 122 .

[0082] In an optional embodiment of the present invention, Figure 7 As shown, the second extension portion 133 is partially located on the side of the conductive portion 20 away from the second planar portion 122; or as shown in FIG. Figure 8 As shown, the second extension portion 133 is partially located on a side of the conductive portion 20 facing the second planar portion 122 .

[0083] Specifically, in an embodiment of the present invention, by arranging the second extension portion 133 and the conductive portion 20 to at least partially overlap, it helps to increase the contact area between the second extension portion 133 and the conductive portion 20, thereby improving the charge transfer capability therebetween, thereby further reducing the risk of abnormal charge accumulation at the conductive portion 20, and improving the reliability of the display module 100.

[0084] Based on the above embodiment of the present invention, another embodiment of the present invention further provides a method for preparing a display module. Figure 9 , Figure 9 A schematic flow chart of a method for preparing a display module provided in an embodiment of the present invention. The method for preparing a display module provided in an embodiment of the present invention comprises:

[0085] S101: Figure 10 As shown, a display panel 12 having a color resist layer 15 is formed.

[0086] Specifically, in this step, a color resist layer 15 is disposed inside the first planar portion 121 of the display panel 12, and the color resist layer 15 is located on the light-emitting side of the light-emitting unit 16. Exemplarily, a plurality of light-emitting units 16 are disposed on the first planar portion 121; the color resist layer 15 includes a plurality of color resist units 151; the light-emitting units 16 and the color resist units 151 are disposed in one-to-one correspondence, for example, a red light-emitting unit corresponds to a red color resist, a blue light-emitting unit corresponds to a blue color resist, and a green light-emitting unit corresponds to a green color resist. Exemplarily, R / G / B color resists are deposited on the R / G / B sub-pixels to form the color resist layer 15. The color resist layer 15 has a transmittance spectrum, can adjust the transmittance, and can implement at least part of the functions of the polarizer.

[0087] The display panel 12 further includes a second planar portion 122 and a portion to be bent 124 connecting the first planar portion 121 and the second planar portion 122.

[0088] S102: As Figure 11 shown, a packaging glue layer 13 is formed on the display panel 12.

[0089] Specifically, before forming the packaging glue layer 13 in this step, a first support layer 171 and a second support layer 172 can be disposed corresponding to the first planar portion 121 and the second planar portion 122, and then a glue material of the packaging glue layer 13 is coated and leveled on one side of the display panel 12. Before the glue material of the packaging glue layer 13 is leveled to the barrier member 21, the purpose that the packaging glue layer 13 does not climb upward is achieved.

[0090] Among them, the packaging glue layer 13 includes a main body portion 131 corresponding to the portion to be bent 124, a first extension portion 132 corresponding to the first planar portion 121, and a second extension portion 133 corresponding to the second planar portion 122. The position where the barrier member 21 is located is on the side of the first extension portion 132 away from the main body portion 133.

[0091] S103: As Figure 12 shown, an optical glue layer 14 is formed on the display panel 12.

[0092] Specifically, in this step, the coating of the optical glue layer 14 starts from the side of the first extension portion 132 away from the main body portion 131. The rolling and attaching direction of the optical glue layer 14 is the direction from the first extension portion 132 to the main body portion 131, that is, Figure 12 the direction X shown in, and through the fluidity of the optical glue layer 14 with high creepability, the outer shape portion of the first extension portion 132 can be well supplemented and filled, so that it covers part of the first extension portion 132, thereby achieving the effect of no bubbles, and further improving the use reliability of the display module 100.

[0093] S104: Bend the display panel 12. After the bending process, the display panel 12 includes a first flat portion 121 on the light-emitting surface side, a second flat portion 122 on the backlight surface side, and a bent portion 123 between the first flat portion 121 and the second flat portion 122. The color resist layer 15 is disposed on the side of the first flat portion 121 facing away from the second flat portion 122. The encapsulation glue layer 13 includes a main body portion 131 covering the bent portion 123 and a first extension portion 132 extending toward the region where the first flat portion 121 is located. The first extension portion 132 covers a part of the first flat portion 121. The optical glue layer 14 is located on the side of the first flat portion 121 facing away from the second flat portion 122 and covers a part of the first extension portion 132.

[0094] Specifically, in the display module 100 prepared by this preparation method in the embodiments of the present invention, the color resist layer 15 is disposed in the display panel 12 to replace the polarizer 11 required by the display module 100, so as to ensure the display effect of the display module 100 and realize the display module 100 without a polarizer 11. Since the thickness of the color resist layer 15 is relatively low compared to the polarizer 11, the purpose of thinning the display module 100 can also be achieved. Then, the encapsulation glue layer 13 is coated first, and then the optical glue layer 14 is formed. Since the display module 100 does not have a polarizer 11, bumps M will not be formed during the coating and leveling process of the encapsulation glue layer 14, that is, bumps M will not be formed at the end of the first extension portion 132 away from the main body portion 131, achieving the purpose that the encapsulation glue layer 13 does not climb upward. Then, during the process of disposing the optical glue layer 14, due to the fluidity of the optical glue layer 14, the outer shape part of the first extension portion 132 can be well supplemented and filled, so that it covers a part of the first extension portion 132, thereby achieving the effect of no bubbles and further improving the use reliability of the display module 100.

[0095] The above has introduced in detail a display module and a preparation method provided by the present invention. Specific examples are used in this article to elaborate on the principle and implementation manner of the present invention. The description of the above embodiments is only used to help understand the method and its core idea of the present invention. At the same time, for those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present invention.

[0096] It should be noted that each embodiment in this specification focuses on the differences from other embodiments. The same or similar parts among the various embodiments can be referred to each other.

[0097] It should also be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that the elements inherent in a process, method, article or device comprising a series of elements, or those further comprising elements inherent in these process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the existence of additional identical elements in the process, method, article or device comprising the said element.

[0098] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to these embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A display module, characterized in that, The display module includes a display panel, a packaging adhesive layer, and an optical adhesive layer; The display panel includes a first planar portion on the light-emitting surface side, a second planar portion on the backlight surface side, and a bending portion between the first planar portion and the second planar portion; a color filter layer is provided on the side of the first planar portion facing away from the second planar portion; The packaging adhesive layer includes a main body portion covering the bending portion and a first extending portion extending toward the region where the first planar portion is located; the first extending portion covers a part of the first planar portion; The optical adhesive layer is located on the side of the first planar portion facing away from the second planar portion and covers a part of the first extending portion.

2. The display module according to claim 1, wherein A plurality of light-emitting units are provided on the first planar portion; the color filter layer includes a plurality of color filter units; The light-emitting units and the color filter units are arranged in one-to-one correspondence.

3. The display module according to claim 2, wherein A light-shielding component is provided between two adjacent color filter units.

4. The display module according to claim 1, wherein The thickness range of the color filter layer is 5μm - 6μm.

5. The display module according to claim 1, wherein The modulus range of the packaging adhesive layer is 20Mpa - 30Mpa.

6. The display module according to claim 1, wherein, A UV absorber is provided in the optical adhesive layer.

7. The display module according to claim 1, wherein The creep value of the optical adhesive layer is greater than 27%.

8. The display module according to any one of claims 1-7, characterized in that, The first extending portion includes a planar extending portion and a ramp extending portion; The planar extending portion is located between the ramp extending portion and the main body portion; The thickness of the ramp extending portion gradually increases in the direction close to the planar extending portion.

9. The display module according to claim 8, wherein The slope of the ramp extending portion is less than 15°.

10. The display module according to claim 8, wherein The length of the ramp extending portion is L1; the thickness of the main body portion is H1; Wherein, L1 > 5 × H1.

11. The display module according to claim 8, wherein The optical adhesive layer completely covers the ramp extending portion and at least covers a part of the planar extending portion.

12. The display module according to claim 1, wherein, The display module further includes: a first support layer, a buffer layer, and a second support layer that are located between the first planar portion and the second planar portion and are stacked in sequence.

13. A method for preparing a display module, characterized in that, The manufacturing method of the display module includes: Forming a display panel with a color filter layer; Forming a packaging adhesive layer on the display panel; Forming an optical adhesive layer on the display panel; Performing a bending process on the display panel; after the bending process, the display panel includes a first planar portion on the light-emitting surface side, a second planar portion on the backlight surface side, and a bending portion between the first planar portion and the second planar portion; a color filter layer is provided on the side of the first planar portion facing away from the second planar portion; the packaging adhesive layer includes a main body portion covering the bending portion and a first extending portion extending toward the region where the first planar portion is located; the first extending portion covers a part of the first planar portion; the optical adhesive layer is located on the side of the first planar portion facing away from the second planar portion and covers a part of the first extending portion.

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